Laser soldering apparatus having adjustable soldering position and soldering method comprising same

Abstract

The present invention provides a laser soldering apparatus having an adjustable soldering position and a method thereby, the laser soldering apparatus comprising: a controller; a holding block coupled to a circuit board, the holding block having multiple holding pins formed to extend in one direction and having multiple insertion holes formed such that the holding pins are inserted therein; an image module coupled to the circuit board through the holding block; a holding block provided to hold the image module on a substrate, the holding block having multiple insertion holes formed such that holding pins of the image module are inserted therein; a solder portion configured to operate to be able to move under the control of the controller such that insertion hole areas in which the holding pins are inserted are soldered multiple times at a predetermined time interval, the solder portion performing the soldering by means of laser beams, and the solder portion having at least one nozzle portion for containing solder balls irradiated by the laser beams; and a monitoring portion disposed on one side of the solder portion so as to monitor the range of distribution of the solder balls injected by irradiation of the laser beams. The positions in which the solder balls are injected from the solder portion to the holding pins and holding hole areas are adjusted according to the result of monitoring by the monitoring portion.

Description

Laser soldering device with adjustable soldering position and soldering method including the same

[0001] The present invention relates to a laser soldering device with an adjustable soldering position and a soldering method including the same, and more particularly, to a laser soldering device with an adjustable soldering position and a soldering method including the same, wherein the soldering position can be adjusted through a plurality of soldering processes.

[0002] Recently, electronic devices have been rapidly miniaturizing and thinning. Furthermore, electronic components, such as semiconductor devices, embedded in these devices are also being demanded to be smaller and thinner. Furthermore, electronic components are becoming more dense, increasing the number of connection terminals.

[0003] To meet these needs, methods for mounting electronic components have recently been applied, such as flip chip mounting, in which solder balls are surface-mounted as external connection terminals on mounting substrates such as printed circuits. This mounting method involves mounting solder balls on electrodes installed on the substrate of the electronic component and then directly bonding the solder balls to the electrodes of the mounting substrate.

[0004] Therefore, when a surface mounting method utilizing solder balls is applied, a method is generally used in which the solder balls are positioned on the electrodes of the substrate on which the solder balls are mounted on the substrate of the electronic component, and then the solder balls are heated and melted to bond them to the electrodes.

[0005] Among these soldering methods, a method that heats and melts solder balls by irradiating them with a laser beam has recently been adopted for high-precision, high-quality soldering. However, this method poses safety risks, such as damage to the joint area due to external impact or vibration.

[0006]

[0007] [Prior Art Literature]

[0008] [Patent Document]

[0009] (Patent Document 0001) Korean Patent Publication No. 2013-0064392

[0010] (Patent Document 0002) Korean Patent Publication No. 2015-0028511

[0011]

[0012] The problem to be solved by the present invention is to provide a laser soldering device with an adjustable soldering position, which can prevent damage to the soldering area even from external impact and greatly improve bonding reliability by injecting solder provided at the soldering position multiple times in a specific manner to perform the soldering process in order to fix an image module on a circuit board by soldering, and a soldering method including the same.

[0013] In addition, the present invention provides a laser soldering device and a soldering method including the same, which are capable of fixing an image module to a circuit board by soldering it, and allowing soldering to be performed at a predetermined angle relative to the soldering position, thereby improving the rigidity of the soldering portion and preventing damage to the device due to reflection of a laser beam.

[0014] In order to achieve the above task, a laser soldering device with an adjustable soldering position according to the present invention is provided.

[0015] Control unit;

[0016] A fixing block having a plurality of fixing pins that are coupled to a circuit board and extend in one direction and a plurality of insertion holes into which the fixing pins are inserted;

[0017] An image module coupled to the circuit board through the above fixed block;

[0018] A laser generating unit that generates a laser beam;

[0019] A soldering part that is movably operated by the control of the control part to solder the insertion hole portion into which the above-mentioned fixing pin is inserted multiple times at predetermined time intervals, and is formed with at least one nozzle part that receives solder and discharges the molten solder; and

[0020] A monitoring unit is disposed on one side of the solder portion and monitors the distribution range of the solder injected by irradiation of the laser beam;

[0021] The solder injection position of the solder injected from the solder portion to the fixing pin and fixing hole portion can be adjusted based on the monitoring result of the monitoring portion, and the soldering position can be adjusted.

[0022] In one embodiment of the present invention, the solder comprises:

[0023] It is included as a solder ball, and the laser beam is irradiated on the solder ball to melt and be discharged.

[0024] In one embodiment of the present invention, the nozzle portion is provided as a sleeve heated by a laser, and the solder can be melted by heat generated by the sleeve heated by the laser.

[0025] In one embodiment of the present invention, the solder ball may be structured to be inserted into the fixing pin and fixing hole area at least 3 to 7 times at predetermined time intervals.

[0026] In one embodiment of the present invention, the solder ball may be structured such that it is inserted and soldered from a position where the outer surface of the fixing pin and the inner surface of the fixing hole are in contact or closest to each other.

[0027] In one embodiment of the present invention, the solder portion may include a structure that is arranged at a predetermined angle with respect to the fixing pin and the fixing hole to discharge the solder ball.

[0028] In one embodiment of the present invention, the laser beam can be controlled to continue irradiating the melted and discharged solder ball for a predetermined period of time.

[0029] In one embodiment of the present invention, the fixing holes of the fixing block may include a structure in which three are radially arranged at the same angle based on the center point of the fixing block.

[0030] In one embodiment of the present invention, a structure may be formed on one side of the solder portion, in which a gas supply portion for providing an inert gas to the discharged solder ball is formed.

[0031] In one embodiment of the present invention, the solder ball supplied to the nozzle unit may include a structure in which the size of the solder ball is controlled by the control unit according to the distribution range of the solder ball detected during the soldering process.

[0032] In one embodiment of the present invention, the beam control unit further comprises a beam control unit for controlling the irradiation position of the laser beam, wherein the beam control unit is

[0033] A beam focusing unit for adjusting the focal position of the laser beam; and

[0034] It may include a laser irradiation unit that obtains information on the position and alignment status at which the laser is to be irradiated, adjusted from the beam focusing unit, and irradiates the laser beam to the object to be processed.

[0035] In one embodiment of the present invention, the solder portion may further include at least one beam converter device for controlling the output area of ​​the laser beam.

[0036] In one embodiment of the present invention, the laser beam emitted from the solder portion is a laser beam including a plurality of wavelengths, and each wavelength can be transmitted to a processing target of different or similar types to perform bonding.

[0037] In one embodiment of the present invention, the transmission of the laser may include an optical fiber laser transmitted to the head through an optical fiber.

[0038] In one embodiment of the present invention, the core of the optical fiber includes a structure formed in a circular or polygonal shape, and the laser irradiation position can be aligned.

[0039] In one embodiment of the present invention, the fixed block is bonded and transferred by a transfer unit so that the laser irradiation position and the solder discharge position can be aligned.

[0040] In one embodiment of the present invention, the soldering unit may further include an imaging unit that processes an image of a processing target, i.e., a soldering position, a solder distribution range, etc.

[0041] In one embodiment of the present invention, the laser may have a structure in which the laser irradiation position is aligned and the laser is irradiated with a flat-top type output.

[0042]

[0043] In addition, the laser soldering device with adjustable soldering position according to the present invention,

[0044] Control unit;

[0045] A video module coupled to a circuit board;

[0046] A first fixing block formed on one side of the above image module and having a plurality of fixing pins extending in one direction;

[0047] A second fixing block provided to fix the image module on a substrate, and having a plurality of insertion holes formed so as to be in surface contact with the first fixing block of the image module and into which the fixing pins are inserted;

[0048] A laser generating unit that generates a laser beam;

[0049] A soldering part that is movably operated by the control of the control part to solder the insertion hole portion into which the above fixed pin is inserted multiple times at predetermined time intervals, and is formed with at least one nozzle part that receives solder and discharges the molten solder; and

[0050] A monitoring unit is disposed on one side of the solder portion and monitors the distribution range of the solder balls injected by irradiation of the laser beam;

[0051] The insertion position of the solder ball inserted from the solder portion into the fixing pin and fixing hole portion may be structured to be controlled according to the monitoring result of the monitoring portion.

[0052]

[0053] In addition, the laser soldering device with adjustable soldering position according to the present invention,

[0054] Control unit;

[0055] An image module coupled to a circuit board in which an insertion hole is formed, and in which a plurality of fixing pins extending in one direction are formed so as to be inserted into the insertion hole;

[0056] A laser generating unit that generates a laser beam;

[0057] A soldering part that is movably operated by the control of the control part to solder the insertion hole portion into which the above fixed pin is inserted multiple times at predetermined time intervals, and is formed with at least one nozzle part that receives solder and discharges the molten solder; and

[0058] A monitoring unit is disposed on one side of the solder portion and monitors the distribution range of the solder balls injected by irradiation of the laser beam;

[0059] The insertion position of the solder ball inserted from the solder portion into the fixing pin and fixing hole portion may be structured to be controlled according to the monitoring result of the monitoring portion.

[0060]

[0061] Meanwhile, the present invention provides a soldering method using a laser soldering device in which the soldering position described above is controlled.

[0062] A step of placing a video module on which a circuit board is mounted;

[0063] A fixing step of placing the fixing pin of the above video module into the insertion hole of the fixing block;

[0064] A monitoring step of recognizing x, y, and z coordinates of the center point of the fixed pin and monitoring the center point position of the fixed pin within the insertion hole;

[0065] A control step for aligning the nozzle section of the solder portion where the solder ball is provided based on the monitoring results;

[0066] A step of continuously or intermittently providing the solder ball to the nozzle section at predetermined time intervals to solder the insertion hole portion where the fixed pin is inserted multiple times; and

[0067] It may include a discharging step of irradiating the solder ball with a laser beam to melt it and inserting the solder ball into the fixing pin and insertion hole area.

[0068] In one embodiment of the present invention, in the step of ejecting the solder ball, the laser beam may be maintained to be irradiated for a predetermined period of time after the solder ball is ejected.

[0069] Here, in one embodiment of the present invention, the step of discharging the solder ball is:

[0070] The first soldering process in which the solder ball is inserted into a position where the outer surface of the fixing pin and the inner surface of the fixing hole are in contact or in close proximity to each other;

[0071] A secondary soldering process in which the first soldering portion is introduced in a shape that overlaps at least a portion of the first soldering portion; and

[0072] It may include at least one third soldering process of discharging the solder ball to at least a portion of the overlapping portion.

[0073] In one embodiment of the present invention, after the second soldering process, a three-dimensional shape X for the overlapping portion θ , Y θ , Z θ , may include a process in which the solder portion is adjusted to a predetermined angle according to the coordinates.

[0074] In one embodiment of the present invention, in the step of providing the solder ball to the nozzle unit, the step of selectively adjusting the size of the supplied solder ball according to the distribution range of the solder ball detected during the soldering process may be further included.

[0075] In one embodiment of the present invention, in the second soldering process and the third soldering process, a post-heating process may be included in which the laser beam irradiation process is maintained for a preset time at the overlapping portion.

[0076] In one embodiment of the present invention, the step of providing the solder ball to the nozzle unit may be performed at least 2 to 7 times.

[0077] In one embodiment of the present invention, after the step of discharging the solder ball, the solder portion is arranged to be inclined at a predetermined angle (θ) with respect to the fixing pin and the fixing hole, so that X is formed with respect to the center point of the fixing pin. θ , Y θ , Z θ , which may include a process by which coordinates are recognized.

[0078] In one embodiment of the present invention, in the step of providing the solder ball to the nozzle portion, the discharged solder ball may be provided with an inert gas discharged from a gas supply portion formed on one side of the solder portion.

[0079] In one embodiment of the present invention, the process of providing the inert gas may be performed simultaneously or alternatively with the process of irradiating the laser beam for melting the solder ball.

[0080] In one embodiment of the present invention, the post-heating process may include a correction alignment step of correcting the alignment of the circuit board and the image module by remelting the solder and setting offsets in the x-axis direction, y-axis direction, z-axis direction, x-axis Theta direction, y-axis Theta direction, and z-axis Theta direction according to the shrinkage amount of the solder.

[0081]

[0082] Specific details of other embodiments are included in the detailed description and drawings.

[0083]

[0084] According to the laser soldering device with adjustable soldering position according to the present invention and the soldering method including the same, in order to fix an image module on a circuit board by soldering, solder balls provided at the soldering position are injected multiple times in a specific manner to allow the soldering process to proceed, thereby preventing damage to the soldering area even from external impact, thereby greatly improving the reliability of the bonding.

[0085] According to the present invention, a laser soldering device with an adjustable soldering position and a soldering method including the same, the present invention fixes an image module to a circuit board by soldering it, and enables soldering while adjusting the soldering position at a predetermined angle, thereby improving the rigidity of the soldering area and preventing damage to the device due to reflection of a laser beam.

[0086] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0087] Figure 1 is a schematic diagram of a laser soldering device in which a soldering position is controlled according to one embodiment of the present invention.

[0088] Figure 2 is an exemplary diagram showing a soldering shape of a laser soldering device according to one embodiment of the present invention.

[0089] FIG. 3 and FIG. 4 are drawings showing examples of how the soldering processing position is adjusted according to one embodiment of the present invention.

[0090] FIG. 5 and FIG. 6 are drawings showing a state in which soldering is performed by a laser soldering device according to one embodiment of the present invention.

[0091] FIG. 7 and FIG. 9 are flowcharts showing a soldering process using a laser soldering device according to one embodiment of the present invention.

[0092] FIG. 10 is a drawing showing a state of preheating and heating using a laser according to one embodiment of the present invention.

[0093] FIG. 11 is a drawing showing the configuration of an optical fiber that transmits laser according to one embodiment of the present invention.

[0094] Hereinafter, an embodiment of the present invention will be described in detail with reference to the attached drawings. When assigning reference numerals to components in each drawing, it should be noted that, where possible, identical components are assigned the same numerals even if they are shown in different drawings. Furthermore, when describing an embodiment of the present invention, if a detailed description of a related known structure or function is judged to hinder understanding of the embodiment of the present invention, the detailed description thereof will be omitted.

[0095] In describing components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this application.

[0096]

[0097] According to an embodiment of the present invention, a soldering device and method capable of controlling a soldering position can be used to perform laser processing processes such as joining, welding, bonding, and soldering of an image module on a circuit board. Hereinafter, the laser soldering device and method of the present invention will be described as an example of performing soldering. That is, a laser processing device can be employed as a soldering device to perform only the soldering process. In this case, the laser processing device can be described as a soldering device.

[0098] Furthermore, the soldering device with adjustable soldering position according to an embodiment of the present invention can be included in various processes such as welding, soldering, bonding, joining, etc., and of course, the material on which each process is performed can be applied to various materials such as polymer, metal, dielectric, semiconductor, glass, etc.

[0099]

[0100] As mentioned above, in the case of the soldering structure of a conventional image module, there was a problem with the reliability of the joint, such as the joint being damaged due to impact or external vibration from the external environment.

[0101] Accordingly, in the present invention, as described below, in order to fix an image module on a circuit board by soldering, solder is continuously supplied to a soldering position of a processing object in a specific manner multiple times to allow the soldering process to proceed, thereby preventing damage to the soldering portion even from external impact.

[0102]

[0103] FIG. 1 is a schematic diagram of a laser soldering device in which a soldering position is adjusted according to an embodiment of the present invention, FIG. 2 is an exemplary diagram showing a soldering shape of a laser soldering device in which a soldering position is adjusted according to an embodiment of the present invention, FIG. 3 and FIG. 4 are drawings showing examples of how a soldering processing position is adjusted according to an embodiment of the present invention, and FIG. 5 and FIG. 6 are drawings showing a state in which soldering is performed by a laser soldering device in which a soldering process is performed according to an embodiment of the present invention.

[0104] Referring to these drawings, the laser soldering device (100) according to the present invention comprises a control unit (10), a fixing block (200) coupled to a circuit board (not shown) and having a plurality of fixing pins (221) extending in one direction and a plurality of insertion holes (211) into which the fixing pins (211) are inserted, an image module (300) coupled to the circuit board through the fixing block (200), a soldering unit (110) in which a nozzle unit (111) is formed to receive solder balls (S) irradiated with the laser beam while performing soldering by a laser beam, and a soldering unit (110) disposed on one side of the solder unit (110) to monitor the distribution range of solder balls (S) injected by the irradiation of the laser beam, i.e., solder bumps (2). The monitoring unit (350) may include a structure in which the insertion position of the solder ball (S) inserted from the solder unit (110) into the fixing pin (221) and fixing hole (211) area is controlled according to the monitoring result of the monitoring unit (350).

[0105] The laser soldering device (100) may include a laser generating unit (20), a beam converter (30), and a beam adjusting unit (50). The cross-sectional area of ​​the beam generated from the laser generating unit (20) may be adjusted while passing through the beam converter (30). At this time, the cross-sectional area of ​​the adjusted beam may be the cross-sectional area of ​​the laser to be irradiated toward the soldering position. The laser passing through the beam converter (30) may be transmitted to the head unit (Fig. 10: 51) of the beam adjusting unit (50), and solder balls (S) melted by the laser transmitted from the head unit (Fig. 10: 51) may be ejected from the nozzle unit at a predetermined time interval.

[0106] The laser transmitted from the head portion (Fig. 10:51) can be transmitted not only to the solder ball (S) placed in the nozzle portion (111), but also to the solder ball (S) arranged in the insertion hole with a predetermined size or larger according to the selection of a person skilled in the art.

[0107] According to another embodiment, the nozzle portion (111) may be provided as a sleeve. The laser beam emitted from the laser generating portion (20) may be transmitted to the head portion (Fig. 10: 51) and irradiated to the nozzle portion (111) to heat it. Solder may be injected into the nozzle portion (111) and the solder may be melted by the heat emitted from the heated nozzle portion (111), thereby performing soldering.

[0108] The beam control unit (50) may be configured to include a beam focusing unit (not shown) that controls the focal position of the laser beam, and a laser irradiation unit (not shown) that obtains information on the position and alignment status at which the laser adjusted by the beam focusing unit is to be irradiated and irradiates the laser beam. In addition, depending on the case, it may be configured to include a heat distribution measurement unit (310: Pyrometer) that measures the surface temperature or melting temperature of the soldering processing point. The monitoring unit (350) may be, for example, a dynamic focusing module or a camera module, but is not limited thereto.

[0109] The control unit (10) can perform a soldering process at the soldering point of the image module (300) by controlling the movement and laser irradiation of the solder unit (110). The transport unit (30) can transport the image module (300) coupled to the circuit board and position it at the soldering position, i.e., the fixing pin (221) and insertion hole (211) area.

[0110] The laser soldering device (100) can be adjusted so that the center point of the nozzle part (111) is positionally corrected to the soldering point where the solder (S) melted by the irradiation of the laser beam is ejected.

[0111] The fixed block (200) may be provided in a configuration in which the circuit board is coupled, or may be provided in a form in which the circuit board is secured to one side of the fixed block (200). In one example according to the present invention, the fixed block (200) may be configured to include a first fixed block (220) having a fixed pin (221) formed on one side of the image module (300) and protruding upward, and a second fixed block (210) having an insertion hole (211) formed in surface contact with the first fixed block (220) of the image module (300) to fix the image module (300) on the circuit board, into which the fixed pin (221) is inserted. According to the present invention, the fixing pin (221) of the first fixing block (220) is formed to protrude from the uppermost end of the insertion hole (211) by a predetermined length, so that the space between the fixing pin (221) and the insertion hole (211) is filled by flowing in, thereby further improving the mutual bonding strength through soldering.

[0112]

[0113] Specifically, the laser soldering device (100) according to the present invention can be corrected to move the center point of the nozzle unit (111) to the soldering point where the solder (S) is discharged through an image acquired from the monitoring unit (350) before, during, or after discharge of the supplied solder (S). At this time, the solder (S) can be supplied to the nozzle unit (111) of the solder unit (110) intermittently or continuously at preset time intervals.

[0114] The movement of the center point of the above nozzle unit (111) can be controlled through the control unit (10). The control unit (10) can determine the x, y, z coordinates of the position where the solder (S) is ejected using the detection values ​​input and measured from the monitoring unit (350). These coordinates can be adjusted so that the z-axis focus position of the laser beam passing through the beam conversion device (30) is adjusted by the dynamic focusing module (not shown) and the x-axis and y-axis positions are positioned at the soldering position by the scan head (not shown). In the present invention, by adjusting the position coordinates (x, y, z) where the solder (S) melted by the laser beam is ejected, it is possible to adjust the ideal soldering position.

[0115] In some cases, these focus coordinates can be adjusted using a precision stage consisting of at least three axes, and may include a tilt stage to adjust the angle at which the laser beam is irradiated. Here, the tilt stage may include one or more of X theta, Y theta, and Z theta.

[0116] The laser soldering device (100) according to the present invention can continuously solder by discharging solder (S) to a soldering point at preset time intervals. That is, the solder (S) melted by the laser beam can be discharging at predetermined time intervals, intermittently or continuously, approximately at least 2 to 7 times, at position coordinates (x, y, z) at which the solder (S) is discharged, as shown in FIGS. 3 and 4. For example, the laser soldering device (100) can sequentially discharge the molten solder (S) to a soldering position, that is, a space between a fixing pin (211) and an insertion hole (211). At the soldering position, the first soldering (P1), the second soldering (P2), the third soldering (P3), and the nth soldering (P3) can be soldered at a boundary surface (B) portion where at least a portion of the soldering position overlaps with each other.

[0117] Preferably, the first soldering (P1) of the solder (S) melted by the laser beam is preferably performed preferentially at a location where the outer surface of the fixing pin (211) and the inner surface of the insertion hole (211) are closest to each other. At this time, the soldering position and the size of the solder (S) can be adjusted and discharged according to the size and shape of the solder bump (2) formed by overlapping the solder (S) melted by the laser beam. In addition, according to the present invention, the solder (S) that is continuously discharged can improve wettability and enhance or improve bonding strength by maintaining the laser beam to be continuously irradiated for a predetermined period of time.

[0118] The process of ejecting solder balls (S) multiple times to these soldering positions is described in more detail below with reference to the drawings.

[0119]

[0120] Meanwhile, the laser soldering device (100) according to the present invention can sequentially move the solder (S) from an external transport means (not shown) by gravity or a transport assist gas and supply it to the nozzle unit (111). In this case, the solder (S) can also be supplied to the nozzle unit (111) at an appropriate speed by the transport assist gas. The solder (S) is formed in a roughly spherical shape and is made of a metal alloy, so that it can be melted by laser irradiation, etc. The solder (S) can be used to attach electronic components and electrical components to a substrate (not shown). Here, the solder can be composed of a single material such as a polymer, glass, metal, or a mixed material.

[0121]

[0122] The soldering process using the laser soldering device (100) capable of adjusting the soldering position described above will be described with reference to FIGS. 7 to 9.

[0123] The laser soldering method according to the present invention using a laser soldering device (100) is a process of preparing a circuit board (S10) and arranging an image module (300) on which the circuit board is mounted, a fixing step (S20) of inserting the fixing pin (221) of the second fixing block (220) into the insertion hole (211) of the first fixing block (210) to couple the image module (300), a control step (S30) of recognizing the x, y, and z coordinates for the center point of the fixing pin (221) of the second fixing block (220) and monitoring the position of the center point of the fixing pin (221) within the insertion hole (211), and then aligning the nozzle part (111) of the solder part (110) where the solder (S) is provided according to the monitoring result, and soldering the portion of the insertion hole (211) of the first fixing block (210) into which the fixing pin (221) of the second fixing block (220) is inserted multiple times. For this purpose, the method may include a step (S50) in which solder (S) is continuously or intermittently provided at predetermined time intervals to the nozzle section (111), and a soldering step (S60) in which the laser beam is irradiated to the solder (S) to melt it and the solder (S) is discharged to the fixing pin (221) and the insertion hole (211) to perform soldering.

[0124]

[0125] Specifically, referring to FIGS. 8 and 9, first, the image module (300) is transferred to the relevant area for processing in order to be coupled to the circuit board (S100). At this time, the image module (300) may be coupled to the circuit board with the fixing block (200) formed thereon, or the circuit board may be provided in an integrated form in which the image module (300) is secured.

[0126] Next, the video module (300) is arranged in such a way that the fixing pins (221) of the second fixing block (220) are inserted into the insertion holes (211) of the first fixing block (210) (S200). At this time, three insertion holes (211) of the first fixing block (210) are formed radially in the first fixing block (210), and three fixing pins (221) formed in the second fixing block (220) are inserted into the insertion holes (211), respectively, so that the video module (300) can be stably fixed.

[0127] Next, in order to confirm the exact soldering position of the fixing pin (221) of the second fixing block (220) inserted into the insertion hole (211) of the first fixing block (210), the x, y, and z coordinates for the center point of the fixing pin (221) are recognized and the center point position of the fixing pin (221) within the insertion hole (211) is monitored (S300).

[0128] Here, the soldering position can be determined based on the distance from the center point of the insertion hole (211) based on the center point of the fixing pin (221) inserted into the insertion hole (211) of the first fixing block (210) on a plane. That is, the position where the inner surface of the insertion hole (211) of the first fixing block (210) and the outer surface of the fixing pin (221) are closest to each other is preferentially set as the soldering position, and the area where at least a portion overlaps can be set as an additional soldering position.

[0129] After this, the nozzle part (111) of the solder part (110) can be aligned according to the above coordinate values ​​while the insertion hole (211) and the fixing pin (221) are inserted (S400). When the processing point is primarily set according to the above coordinate values, the solder (S) can be continuously supplied to the nozzle part (111) of the solder part (110).

[0130] Preferably, as illustrated in Fig. 9, when the coordinate values ​​are set, the first soldering (P1) is performed (S500-1), the second soldering (P2) is performed (S500-2) in a shape that overlaps at least a portion of the first soldering (P1), and then the third soldering (P3) including the overlapping boundary surface (B) of the first soldering (P1) and the second soldering (P2) is performed (S500-3). The number of times (n) of soldering is not particularly limited as long as the fixing pin (221) can be stably fixed without moving in the insertion hole (211), and may be performed in the range of, for example, 2 to 7 times. In addition, a process of detecting three-dimensional coordinates (x, y, z) according to the area, size, shape, etc. of the processing point may be performed before and after the first soldering (P1), before and after the second soldering (P2), and before and after the third soldering (P3) (S500-4, S500-5, S500-6).

[0131] At this time, according to the shape of the solder bump (2) formed when the solder (S) is discharged, the solder portion (110) is arranged to be inclined at a predetermined angle (θ) with respect to the fixing pin (221) and the fixing hole (211), so that X is oriented relative to the center point of the fixing pin (221). θ , Y θ , Z θ A process in which coordinates are recognized and adjusted can proceed (S600). Solder (S) is provided intermittently or continuously at predetermined time intervals, and the size of the solder (S) is adjusted and provided according to the shape and size of the solder bump (2) formed by soldering at the processing point, thereby enabling an effective soldering process to proceed (S700, S800).

[0132] Finally, after the secondary soldering (P2), a post-heating process may be performed (S900) in which the laser beam irradiation process is maintained for a preset time to improve the wettability and processing efficiency of the overlapping area.

[0133]

[0134] The post-heating process may include a correction alignment step for correcting the alignment of the circuit board and the image module. Through the post-heating process, the solder is remelted, and an offset in the x-axis direction, y-axis direction, z-axis direction, x-axis Theta direction, y-axis Theta direction, and z-axis Theta direction is set according to the shrinkage amount of the solder, thereby correcting the alignment of the circuit board and the image module.

[0135]

[0136] Furthermore, as described above, in addition to multiple soldering, a preheating process may be further included to improve the wettability. The preheating process may be performed before and after the first soldering (P1), before and after the second soldering (P2), and after the nth soldering (P n ) can be performed at one or more points before or after the first soldering (P1). For example, after the solder (S) is discharged toward the soldering point through the first soldering (P1), the second soldering (P2) to the nth soldering (P n ) before performing the soldering, the solder bump (2) may have poor spreadability due to a region that is maintained at a relatively low temperature, which may lead to soldering defects such as cold soldering, cracking, and poor bonding. Here, “spreadability” means the degree to which the solder bump (2) is distributed so that a wider area can be contacted by settling on the soldering point. Therefore, a preheating process may be additionally performed to prevent a decrease in spreadability due to the temperature of the soldering region that is maintained at a relatively low temperature compared to the solder bump.

[0137] This preheating process, as illustrated in Fig. 10, may be performed by adjusting the height of the head (51) to form a distance between the laser focus and the soldering point by moving away from the laser focus, in addition to the method of additional laser irradiation of the laser generating unit (20). As a drawing showing a state in which preheating and heating can be performed using a laser, the head (51) can selectively adjust the focal distance (F; Focusing) and the non-focal distance (DF; Defocusing) from the soldering point.

[0138] When the soldering point is located at the focal distance (F), the output of the laser is concentrated, so the soldering point of the metal may melt or be damaged by heat. Therefore, when the laser is irradiated by concentrating it at the focal distance (F), it may be irradiated to the solder bump (2) in order to melt the solder bump (2).

[0139] In addition, when the soldering point is located at the non-focal distance (DF), the laser output is dispersed and the laser irradiation area increases, so that the soldering point can be located at the non-focal distance (DF) when heating a wide area. Accordingly, when the laser is irradiated by concentrating it at the non-focal distance (DF), the temperature difference between the solder bump (2) and the soldering point can be minimized, thereby increasing wettability and increasing the bonding area.

[0140] The soldering point located at the aforementioned non-focal distance (DF) can be preheated. A solder bump (2) can be positioned within the area of ​​the preheated area. More precisely, the solder bump (2), i.e., the periphery of the point to be bonded, including the point to be bonded, can be a preheated area (not shown).

[0141]

[0142] FIG. 11 is a drawing showing the configuration of an optical fiber (610) that transmits laser according to one embodiment of the present invention.

[0143] Referring to FIG. 11, a multi-laser soldering device (100) according to the present invention may be a fiber laser (FL) or diode laser transmitted through an optical fiber to the head (230), and the optical fiber (610) may be composed of a core (611) through which the laser beam is transmitted and a covering (612, 613, 614, 615, 616). Specifically, the core (611) is configured to transmit a laser through total reflection, etc., and the covering (612, 613, 614, 615, 616) is configured to protect the core (611) from impact without exposing it to the outside, and may include one or more of them. For example, the plurality of covers (612, 613, 614, 615, 616) may include materials such as polyvinyl chloride for shock absorption, aramid yarn for increased durability, polyimide, silicone, etc.

[0144] Additionally, the shape of the core (611) located within the above-described covering (612, 613, 614, 615, 616) may be formed in various ways. The various shapes of the core may be various shapes such as square, polygonal, circular, etc. Depending on the size and shape of the core, the size and quality of the laser may vary.

[0145]

[0146] Furthermore, the device or method according to an embodiment of the present invention may include the following configuration. The inspection described below may include a first inspection (pre-inspection) and a second inspection (post-inspection) performed by an inspection unit. In the case of the first inspection (pre-inspection), the alignment state and the soldering position are detected before soldering is performed, and in the case of the second inspection (post-inspection), the inspection may be performed to detect one or more of the following types of defects: open, short, crack and void, excessive solder, contamination with bridge, poor solder, cold solder, poor wetting, overheating, corrosion, erosion, misalignment of component positions, gaps between components, and non-soldering of the solder unit (110) after soldering is performed. As described below, an object that does not satisfy the quality standard as a result of the second inspection may be classified into an object that satisfies the quality standard, and an object that does not satisfy the quality standard may be subject to reworking (resoldering, rework).

[0147] First, the laser supplied from the laser supply device can have a wavelength with high laser absorption, depending on the solder material. It can also be a solid-state laser, such as a fiber laser or diode laser. The laser beam generated from the laser generator can be delivered to the laser soldering head via an optical fiber without the use of a separate optical mirror. This allows for a stable laser supply and precise manipulation during soldering using laser irradiation.

[0148] Second, the laser processing device may include a pick-and-place soldering head or a jet soldering head including a laser soldering nozzle. The laser soldering head may include a laser beam focusing optical head, a solder (S) supply device, and the nozzle. Here, the laser soldering head, meaning the head unit, may be configured as a single head or a dual head including two heads. Furthermore, it is obvious that the head unit may include three or more heads. Including two or more laser soldering heads in this way can increase the productivity of the device.

[0149] Third, it may include a vision inspection module (Vision Inspection Module / unit) or a vision inspection step. By including such a vision inspection module or step, it is possible to inspect the position of the camera module to be soldered, inspect the alignment status, inspect the position to be soldered, etc. (PreInspection), and if necessary, inspect the soldering quality after soldering (PostInspection). Therefore, 1) by mounting a vision inspection module consisting of low-magnification and high-magnification lenses, or 2) by mounting a motorized variable zoom lens (Motorized Variable Zoom Lens, 1X ~ x18: the maximum magnification can be higher depending on the design of the zoom lens), it is possible to automatically inspect from low-magnification to high-magnification, from a wide area to a narrow area. Pre-Inspection and Post-Inspection can be done in one vision inspection module, but for greater productivity, they can be configured as separate vision inspection modules (e.g., one for the Pre-Inspection function and one for the Post-Inspection function).

[0150] When pre-inspection (Pre-Inpsection) and post-inspection (PostInpsection) are provided as a single vision inspection module, an object that has undergone pre-inspection (PreInpsection) can be moved to a position for soldering, soldered, and then returned to its previous position to be post-inspected (PostInpsection). When two vision inspection modules are provided, one for the pre-inspection (Pre-Inpsection) function and one for the post-inspection (PostInpsection) function, an object can be sequentially moved in the order in which the pre-inspection (Pre-Inpsection) module, the laser soldering module, and the post-inspection (PostInpsection) module are positioned, and inspected and soldered.

[0151] Furthermore, it may further include an infrared inspection device or a 3D inspection device for post-inspection, such as monitoring soldering quality in real time to control parameters or detecting open, short, crack and void in soldered area, over-soldering, contamination with bridge, soldering, cold soldering, poor wetting, overheating, corrosion, erosion, misalignment of components, gaps between components, and non-soldering.

[0152] Fourth, it may further include a sorting device capable of sorting out objects that do not meet the soldering quality standards required after the above post-inspection.

[0153] Fifth, the device may further include a repair device capable of repairing objects that do not meet the required soldering quality standards after post-inspection. Such a repair device can re-irradiate the solder with a laser to remelt the solder joint, improving solder wettability, or remove and rework the solder. When removing solder, a mechanical tool such as a pin can be used to automatically remove the solder, or a laser can be used to remelt and suction the solder for automatic removal.

[0154] Sixth, a cleaning device including a dust collector for removing dust and foreign substances for quality control after soldering may be further included. The cleaning device may further include one or more of a dry air blowing device, a carbon dioxide snow cleaning device, a plasma cleaning device, a laser cleaning device, and an inert gas blowing device.

[0155] Seventh, depending on the type of materials to be soldered, additional soldering pre-deposit sections can be included. Furthermore, a laser soldering head can be additionally included to maximize soldering quality and productivity.

[0156]

[0157] Those skilled in the art will appreciate that the present invention can be implemented in other specific forms without altering the technical concept or essential characteristics thereof. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims that follow rather than the detailed description above, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

[0158]

[0159] [Explanation of symbols]

[0160] 1: Transfer section 2: Solder bump

[0161] 10: Control unit 20: Laser generation unit

[0162] 30: Beam converter 50: Beam control unit

[0163] 100: Laser soldering device 110: Solder part

[0164] 111: Nozzle part 200: Fixed block

[0165] 210: First fixed block 211: Insertion hole

[0166] 220: Second fixed block 221: Fixed pin

[0167] 300: Image module 310: Heat distribution measurement unit

[0168] 350: Monitoring section C: Nozzle section center line

[0169] P1: 1st soldering spot P2: 2nd soldering spot

[0170] P3: 3rd soldering spot P n : nth soldering spot

[0171] S: solder, solder ball W: optical fiber

Claims

1. Control unit; A fixing block having a plurality of fixing pins that are coupled to a circuit board and extend in one direction and a plurality of insertion holes into which the fixing pins are inserted; An image module coupled to the circuit board through the above fixed block; A laser generating unit that generates a laser beam; A soldering part that is movably operated by the control of the control part to solder the insertion hole portion into which the above-mentioned fixing pin is inserted multiple times at predetermined time intervals, and is formed with at least one nozzle part that receives solder and discharges the molten solder; and A monitoring unit is disposed on one side of the solder portion and monitors the distribution range of the solder injected by irradiation of the laser beam; A laser soldering device in which the solder injection position from the solder portion to the fixing pin and fixing hole portion is controlled according to the monitoring result of the monitoring portion.

2. In paragraph 1, The above solder, A laser soldering device, which includes a solder ball, and is irradiated with a laser beam to melt and discharge the solder ball.

3. In paragraph 1, A laser soldering device in which the nozzle portion is provided as a sleeve heated by a laser, and the solder is melted by heat generated by the sleeve heated by the laser.

4. In paragraph 2, A laser soldering device with an adjustable soldering position, wherein the solder ball is injected into the fixing pin and fixing hole area at least 2 to 7 times at predetermined time intervals.

5. In paragraph 1, The above solder, A laser soldering device with an adjustable soldering position, which is controlled so that soldering is performed starting from a position where the outer surface of the above-mentioned fixed pin and the inner surface of the fixed hole are in contact or closest to each other.

6. In paragraph 2, A laser soldering device with an adjustable soldering position, wherein the solder portion includes a structure that discharges the solder ball by being inclined at a predetermined angle with respect to the fixing pin and the fixing hole.

7. In paragraph 1, A laser soldering device with an adjustable soldering position, wherein the laser beam is controlled to continuously irradiate the melted and discharged solder for a predetermined period of time.

8. In paragraph 1, A laser soldering device with an adjustable soldering position, wherein the fixing holes of the above-mentioned fixing block include a structure in which three or more fixing holes are arranged.

9. In paragraph 2, A laser soldering device with an adjustable soldering position, comprising a structure in which a gas supply section for providing an inert gas to the discharged solder ball is formed on one side of the solder section.

10. In paragraph 2, The solder supplied to the nozzle section is A laser soldering device having an adjustable soldering position, comprising a structure in which the size of the solder is adjusted by the control unit according to the distribution range of the solder detected during the soldering process.

11. In paragraph 1, The beam control unit further comprises the beam control unit for controlling the irradiation position of the laser beam, and the beam control unit is A beam focusing unit for adjusting the focal position of the laser beam; and A laser soldering device having an adjustable soldering position, comprising a laser irradiation unit that obtains information on the position and alignment status at which the laser is to be irradiated, adjusted from the beam focusing unit, and irradiates the laser beam to a processing target.

12. In paragraph 1, The above solder part, A laser soldering device with an adjustable soldering position, further comprising at least one beam converter for adjusting the output area of ​​the laser beam.

13. In paragraph 1, A laser soldering device with an adjustable soldering position, wherein a laser beam emitted from the solder portion is a laser beam including a plurality of wavelengths, and each wavelength is transmitted to a processing target of different or similar types to perform bonding.

14. In paragraph 1, A laser soldering device in which the laser beam is transmitted to the head section via an optical fiber, the laser irradiation position is aligned, and the soldering position is controlled.

15. In paragraph 14, A laser soldering device in which the core of the optical fiber is formed into a circular or polygonal structure, the laser irradiation position is aligned, and the soldering position is controlled.

16. In paragraph 1, A laser soldering device in which the above-mentioned fixed block is bonded and transferred by a transfer unit so that the laser irradiation position and the solder discharge position are aligned, and the soldering position is controlled.

17. In paragraph 16, A laser soldering device in which the soldering position is controlled, wherein the soldering part further includes an imaging part for processing an image of the soldering position.

18. In paragraph 1, The above laser is a laser soldering device in which the laser irradiation position is aligned and the soldering position is adjusted, with the output being in the form of a flat top.

19. Control unit; A video module coupled to a circuit board; A first fixing block formed on one side of the above image module and having a plurality of fixing pins extending in one direction; A second fixing block provided to fix the image module on a substrate, and having a plurality of insertion holes formed so as to be in surface contact with the first fixing block of the image module and into which the fixing pins are inserted; A laser generating unit that generates a laser beam; A soldering part that is movably operated by the control of the control part to solder the insertion hole portion into which the above-mentioned fixing pin is inserted multiple times at predetermined time intervals, and is formed with at least one nozzle part that receives solder and discharges the molten solder; and A monitoring unit is disposed on one side of the solder portion and monitors the distribution range of the solder balls injected by irradiation of the laser beam; A laser soldering device in which the insertion position of the solder ball inserted from the solder portion into the fixing pin and fixing hole area is controlled according to the monitoring result of the monitoring portion.

20. Control unit; An image module coupled to a circuit board in which an insertion hole is formed, and in which a plurality of fixing pins extending in one direction are formed so as to be inserted into the insertion hole; A laser generating unit that generates a laser beam; A soldering part that is movably operated by the control of the control part to solder the insertion hole portion into which the above-mentioned fixing pin is inserted multiple times at predetermined time intervals, and is formed with at least one nozzle part that receives solder and discharges the molten solder; and A monitoring unit is disposed on one side of the solder portion and monitors the distribution range of the solder balls injected by irradiation of the laser beam; A laser soldering device in which the insertion position of the solder ball inserted from the solder portion into the fixing pin and fixing hole area is controlled according to the monitoring result of the monitoring portion.

21. Step of placing the video module with the circuit board mounted; A fixing step of placing the fixing pin of the above video module into the insertion hole of the fixing block; A monitoring step of recognizing x, y, and z coordinates of the center point of the fixed pin and monitoring the center point position of the fixed pin within the insertion hole; A control step for aligning the nozzle section of the solder portion where solder is supplied, based on the results of monitoring; A step of continuously or intermittently providing solder to the solder nozzle section at predetermined time intervals to solder the insertion hole portion where the fixed pin is inserted multiple times; and A laser soldering method in which a soldering position is controlled, comprising a discharging step of irradiating the solder with a laser beam to melt it and injecting the solder into the fixing pin and insertion hole area.

22. In paragraph 21, In the above discharge step, A laser soldering method in which the soldering position is controlled, wherein the laser beam is maintained to be irradiated for a predetermined period of time after the solder is discharged.

23. In paragraph 21, The above discharge step is, The first soldering process in which the solder is injected into a position where the outer surface of the fixing pin and the inner surface of the fixing hole are in contact or in close proximity to each other; A secondary soldering process in which the first soldering portion is introduced in a shape that overlaps at least partly with the first soldering portion; A laser soldering method with controlled soldering position, comprising a third soldering process of discharging the solder to at least a portion of the overlapping portion.

24. In paragraph 23, After the above second soldering process, X according to the 3D shape of the above overlapping area θ , Y θ , Z θ A laser soldering method in which a soldering position is controlled, comprising a process in which the solder portion is controlled at a predetermined angle according to coordinates.

25. In paragraph 21, In the step where the above solder is provided to the nozzle section, A laser soldering method in which a soldering position is controlled, further comprising a step of selectively adjusting the size of the supplied solder according to a distribution range of the solder detected during the soldering process.

26. In paragraph 21, A laser soldering method in which the soldering position is controlled, wherein, in the second soldering process or the third soldering process, a post-heating process is included in which the laser beam irradiation process is maintained for a preset time at the overlapping portion.

27. In paragraph 21, A laser soldering method in which the solder is provided to the nozzle section at least twice to seven times, wherein the soldering position is controlled.

28. In paragraph 21, After the above discharge step, For the above fixed pin and fixed hole, the solder part is arranged to be inclined at a predetermined angle (θ) so that X is formed with respect to the center point of the fixed pin. θ , Y θ , Z θ A laser soldering method in which a soldering position is controlled, comprising a process in which coordinates are recognized.

29. In paragraph 21, In the step where the above solder is provided to the nozzle section, A laser soldering method in which the soldering position is controlled, wherein an inert gas discharged from a gas supply unit formed on one side of the solder portion is provided to the discharged solder.

30. In paragraph 29, A laser soldering method in which the soldering position is controlled, wherein the process of providing the above inert gas is performed simultaneously or alternatively with the process of irradiating the laser beam for melting the solder.

31. In paragraph 26, The above post-process is, An optical axis alignment method, comprising a correction alignment step for correcting the alignment of the circuit board and the image module by remelting the solder and setting offsets in the x-axis direction, y-axis direction, z-axis direction, x-axis Theta direction, y-axis Theta direction, and z-axis Theta direction according to the shrinkage amount of the solder.

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