Laser profile measuring device

Abstract

This laser profile measuring device comprises: a reflecting and attenuating unit which allows a laser incident from a first direction to pass, thereby generating a laser to be measured traveling in the first direction, and which reflects the remaining components of the laser in a second direction to generate an attenuated laser; a capturing unit which is provided on one side of the reflecting and attenuating unit in the first direction and which captures the laser to be measured; a casing which extends in the first direction and which covers the reflecting and attenuating unit and the capturing unit from the outside; an attenuation cooling body which is provided in at least a portion of the casing in the circumferential direction when viewed from the first direction; and a rotation support unit which rotatably supports the casing and the attenuation cooling body so as to face the laser incident direction.

Description

Laser profile measurement device

[0001] The present disclosure relates to a laser profile measurement device.

[0002] A known 3D additive manufacturing method is called SLM (Selective Laser Melting), in which metal powder is spread inside a chamber and heated by a laser to melt and harden it, a process that is repeated multiple times for each layer to produce the desired object.

[0003] Here, in order to obtain a good molded object, it is necessary to precisely grasp and adjust the laser profile. The laser profile refers to the laser beam diameter and spatial intensity distribution. In an SLM molding device, it is essential to directly measure the profile of the laser itself used for actual processing. For this reason, a measurement device must be placed inside the chamber. One such measurement device is known as described in Patent Document 1 below. The measurement device disclosed in Patent Document 1 below mainly comprises a device for attenuating the laser and a measurement unit for measuring the profile of the attenuated laser.

[0004] Patent No. 6384589

[0005] In an SLM modeling apparatus, a rectangular processing area is set within a chamber. It is necessary to measure the laser profile not only in the center of the processing area, but also in the peripheral area. However, the measurement device disclosed in Patent Document 1 is not only large in size, but can only measure the laser in one predetermined direction. This poses a problem in that it is not possible to accurately measure the laser profile in the peripheral area, where the laser is irradiated from a direction and angle different from that in the central area.

[0006] The present disclosure provides a laser profile measurement device that is smaller and capable of measuring a laser profile more accurately.

[0007] The laser profile measuring device according to the present disclosure includes a reflection attenuation unit that transmits at least a portion of a laser beam incident from a first direction to generate a measurement target laser beam that travels in the first direction, and generates an attenuated laser beam by reflecting the remaining component of the laser beam in a second direction different from the first direction; a capturing unit that is provided on one side of the reflection attenuation unit in the first direction and captures the measurement target laser beam; a casing that extends in the first direction and covers the reflection attenuation unit and the capturing unit from the outside; an attenuation cooling body that is provided on at least a portion of the circumferential direction of the casing when viewed from the first direction; and a rotational support unit that rotatably supports the casing and the attenuation cooling body so that they face the direction of incidence of the laser beam.

[0008] According to the present disclosure, it is possible to provide a laser profile measurement device that is smaller in size and capable of measuring a laser profile more accurately.

[0009] FIG. 1 is a schematic diagram showing an example of the configuration of a laser processing device according to the first embodiment of the present disclosure; FIG. 2 is a plan view showing the configuration of a movement mechanism of the laser profile measurement device according to the first embodiment of the present disclosure; FIG. 3 is an explanatory view showing the configuration of a rotation support part of the laser profile measurement device according to the first embodiment of the present disclosure; FIG. 4 is a cross-sectional view showing the configuration of a damping cooling body according to the first embodiment of the present disclosure; FIG. 5 is a cross-sectional view showing the configuration of a damping cooling body according to the first embodiment of the present disclosure; FIG. 6 is a view of the division surface of the damping cooling body according to the first embodiment of the present disclosure, viewed from a second direction; FIG. 7 is a view of the division surface of the damping cooling body according to the first embodiment of the present disclosure, viewed from a third direction; FIG. 8 is a cross-sectional view showing a modified example of the damping cooling body according to the first embodiment of the present disclosure; and FIG. 9 is a cross-sectional view showing the configuration of a damping cooling body and a housing according to a second embodiment of the present disclosure.

[0010] First Embodiment A laser processing apparatus 1 and a laser profile measuring apparatus 2 according to a first embodiment of the present disclosure will be described below with reference to FIGS. 1 to 8. FIG.

[0011] (Configuration of Laser Processing Apparatus) The laser processing apparatus 1 according to this embodiment is a modeling apparatus that uses a three-dimensional additive manufacturing method called SLM (Selective Laser Melting). In this method, a metal powder spread in a chamber 10 is heated by a laser to melt and harden the powder, and this process is repeated for each layer to obtain a desired object.

[0012] As shown in FIG. 1 , the laser processing apparatus 1 includes a chamber 10 and a laser irradiation unit 11. The chamber 10 is box-shaped with a rectangular processing area 12 on its internal bottom surface. The laser irradiation unit 11 irradiates and scans a laser L from an irradiation point 13 provided above toward the processing area 12. With metal powder supplied from a powder supply device (not shown), the laser L is irradiated and scanned along a predetermined path, melting and hardening the metal powder to form one layer of a shaped object. This operation is repeated for multiple layers to form a shaped object.

[0013] (Configuration of laser profile measuring device) In order to obtain a good object using the above-described laser processing device 1, it is necessary to precisely grasp and adjust the profile of the laser L. The profile of the laser L refers to the beam diameter and spatial intensity distribution of the laser L. The laser profile measuring device 2 according to this embodiment is used to measure such a profile of the laser L at the center 14 and peripheral portion 15 of the processing area 12. Note that the peripheral portion 15 here refers to the corners and portions along the sides of the rectangular processing area 12.

[0014] As shown in FIG. 2 , the laser profile measurement device 2 can freely change its position in the X-axis and Y-axis directions within the plane of the processing area 12. Specifically, an X-axis rail 91, a Y-axis rail 92, and a θ-axis rotation unit 93 are provided in the processing area 12. The X-axis rail 91 moves the laser profile measurement device 2 along the X-axis. The Y-axis rail 92 extends in a direction perpendicular to the X-axis, and is movable in the X-axis direction on the X-axis rail 91. The laser profile measurement device 2 is also movable in the Y-axis direction on the Y-axis rail 92. The θ-axis rotation unit 93 supports the laser profile measurement device 2 rotatably around a rotation axis X extending in the vertical direction. It is desirable that the operations of the X-axis rail 91, the Y-axis rail 92, and the θ-axis rotation unit 93 be autonomously controlled using an actuator and an encoder (not shown).

[0015] 3 , the laser profile measurement device 2 is supported from below by a rotation support part 24. The rotation support part 24 supports the laser profile measurement device 2 in a state where it can rotate so as to face the incident direction of the laser beam L. In particular, the attitude of the laser profile measurement device 2 is changed so that a capturing part 21 (described later) of the laser profile measurement device 2 that captures the laser beam L faces the incident direction of the laser beam L.

[0016] The rotation support unit 24 has a stage 61 on which the laser profile measurement device 2 is placed, and a support base 62 that supports the stage 61 from below. The lower surface of the stage 61 protrudes in the shape of an arc. The upper surface of the support base 62 is recessed in the shape of an arc corresponding to the lower surface of the stage 61. By rotating the stage 61 along this arc, the stage 61 rotates around a rotation axis X that extends in the horizontal direction. Specifically, a goniostage is preferably used as the rotation support unit 24. The center of rotation of this rotation support unit 24 is set to coincide with the irradiation point 13 of the laser L.

[0017] As described above, the X-axis rail 91, Y-axis rail 92, θ-axis rotating unit 93, and rotation support unit 24 make it possible to change the position and attitude of the laser profile measuring device 2 three-dimensionally. Note that movement in the Z-axis direction, which is orthogonal to the X-axis and Y-axis, is complemented by a function that moves the processing area 12 of the laser processing device 1 itself up and down. In other words, the position and attitude of this laser profile measuring device 2 can be changed in five axes 10 directions.

[0018] As shown in FIG. 4, the laser profile measuring device 2 has a reflection attenuation unit 20, a capturing unit 21, a casing 22, an attenuation cooling body 23, and the above-mentioned rotation support unit 24.

[0019] The reflection attenuation unit 20 reflects at least a portion of the incident laser beam L in a direction different from the incident direction and attenuates the remaining component that is not reflected, thereby generating a measurement target laser beam L3. Here, the incident direction of the laser beam L is referred to as a first direction D1.

[0020] The reflection attenuation unit 20 has a reflection attenuation element 31 and a near-field coupling element 32. The reflection attenuation element 31 is a plate-shaped optical element that is arranged on the path of the laser beam L at an angle of approximately 45° with respect to the first direction D1. The reflection attenuation element 31 reflects at least a portion of the incident laser beam L in a direction (hereinafter sometimes referred to as a second direction D2) that intersects the first direction D1 by 90°, thereby generating a first reflected light beam L1 (attenuated laser beam). Of all components of the laser beam L, the remaining components excluding the first reflected light beam L1 travel in the first direction D1.

[0021] A near-field coupling element 32 is provided on one side (below) of the reflection attenuating element 31 in the first direction D1. The near-field coupling element 32 is a known optical element, as shown in, for example, WO 2017 / 209277. The near-field coupling element 32 is configured by two prisms arranged opposite each other with a gap therebetween. The generation and coupling of near-field light between the opposing surfaces makes it possible to change the ratio of light emitted from the prism to the reflected optical output.

[0022] In this embodiment, when the laser L described above is incident on the near-field coupling element 32, some components of the laser L are reflected and travel in a direction different from the first direction D1 (second reflected light L2). The remaining components of the laser L, excluding the second reflected light L2, pass through the near-field coupling element 32 and travel in the first direction D1. The light that passes through the reflection attenuating element 31 and the near-field coupling element 32 and travels in the first direction D1 in this manner is referred to as the measurement target laser L3. While the output of the measurement target laser L3 is reduced compared to the laser L before it is incident on the reflection attenuating element 31, the beam diameter and spatial intensity distribution are similar to those of the laser L before it is incident on the reflection attenuating element 31.

[0023] A capturing unit 21 is provided below the reflection attenuation unit 20 (on one side in the first direction D1). The capturing unit 21 is, for example, a CCD camera. The capturing unit 21 captures the measurement target laser L3 and transmits it as image data to an external computing device or the like. A laser profile of the measurement target laser L3 is obtained through calculations in the computing device.

[0024] The reflection attenuation unit 20 and the capture unit 21 are covered from the outside by a casing 22. The casing 22 is a cylindrical body having a rectangular, polygonal, or circular shape when viewed from the first direction D1. An opening is provided at the top of the casing 22 to allow the laser L to enter. An opening 25 is formed in a portion of the casing 22 in the circumferential direction to allow the first reflected light L1 to pass through. That is, the opening 25 is formed at a position overlapping with the reflection attenuation unit 20 in the first direction D1. The opening 25 is also formed at a position that coincides with the irradiation direction of the first reflected light L1 in the circumferential direction relative to the first direction D1. The opening 25 penetrates the casing 22 in the radial direction relative to the first direction D1.

[0025] The attenuating cooling body 23 is provided to attenuate the first reflected light L1 and dissipate its thermal energy to the outside. As shown in FIG. 5 , the attenuating cooling body 23 is provided on only a portion of the circumferential direction of the first direction D1 on the outer circumferential surface of the casing 22 as viewed from the first direction D1. In other words, if the casing 22 has a rectangular or polygonal shape, the attenuating cooling body 23 is attached to only one specific surface. For simplicity of illustration, the example in FIG. 5 shows an example in which the casing 22 has a rectangular cross section. Note that it is sufficient that the attenuating cooling body 23 is provided on at least a portion of the circumferential direction of the casing 22 in the first direction D1.

[0026] The attenuation cooling body 23 includes a cooling body main body 40 and a plurality of fins 41. The fins 41 extend in the first direction D1 and are arranged at intervals in the second direction D2 on the outer surface of the cooling body main body 40. As shown in FIG. 6 , a first attenuation passage 51 and a second attenuation space 52 for attenuating the first reflected light L1 are formed inside the cooling body main body 40. An inlet end 53 of the first attenuation passage 51 communicates with the opening 25 of the casing 22. Desirably, the first attenuation passage 51 extends in a direction intersecting the second direction D2, which is the traveling direction of the first reflected light L1, at an angle between 45° and 70°. Note that the extension direction of the first attenuation passage 51 can be changed as appropriate depending on the design and specifications. Although not shown in detail, the inner wall of a portion of the first attenuation passage 51, including the inlet end 53, is mirror-finished. The remaining portion of the inner wall is painted black.

[0027] The second damping space 52 communicates with the first damping passage 51 and extends in a direction intersecting the first damping passage 51. More preferably, the second damping space 52 extends in a direction perpendicular to the first damping passage 51. When viewed from a third direction D3 perpendicular to the first direction D1 and the second direction D2, the second damping space 52 has a trapezoidal cross-sectional shape. This is due to machining reasons. Therefore, as long as the machining method allows, the second damping space 52 may have a rectangular cross-sectional shape. The first reflected light L1 incident on the first damping passage 51 and the second damping space 52 is attenuated by repeated multiple reflections between the inner wall surfaces. Furthermore, the thermal energy of the first reflected light L1 is absorbed by the cooling body main body 40. The absorbed heat is dissipated to the outside through the fins 41 and the outer surface of the cooling body main body 40.

[0028] Next, the detailed configuration of the cooling body main body 40 will be described with reference to Figures 7 and 8. The cooling body main body 40 is composed of a pair of division bodies 80. These division bodies 80 are partitioned by a first division surface 81, a second division surface 82, and a connecting division surface 83. As shown in Figure 7, the first division surface 81 passes through a different plane from the inlet end portion 53 of the first damping passage 51 when viewed from the second direction D2. In other words, in the region including the inlet end portion 53, the first damping passage 51 is formed as a tubular passage with a continuous inner wall surface.

[0029] On the other hand, the second dividing surface 82 divides the second damping space 52 into two when viewed from the second direction D2. That is, when viewed from the second direction D2, the first dividing surface 81 and the second dividing surface 82 are at different positions in the third direction D3. The connecting dividing surface 83 connects the first dividing surface 81 and the second dividing surface 82 in the third direction D3. Therefore, as shown in FIG. 8 , in one of the divided bodies 80, the first damping passage 51 except for the inlet end 53 side and the recess forming the second damping space 52 are exposed. The black paint described above is applied to this exposed portion.

[0030] (Operation and Effect) When using the laser profile measuring device 2, first, the laser profile measuring device 2 is placed in the processing area 12 of the laser processing device 1. At this time, the above-mentioned X-axis rail 91, Y-axis rail 92, and θ-axis rotation unit 93 are installed in advance, and then the laser profile measuring device 2 is placed on the Y-axis rail 92. Thereafter, the position and attitude of the laser profile measuring device 2 are automatically changed in various ways, and the laser profile is measured at various locations in the processing area 12.

[0031] Incidentally, in an SLM modeling apparatus, it is necessary to measure the laser profile not only in the central portion 14 of the processing area 12, but also in the peripheral portion 15 in a similar manner. However, conventional measurement devices are not only large in size, but can only measure the laser in one predetermined direction. This poses the problem that accurate measurement of the laser profile cannot be performed in the peripheral portion 15, where the laser is irradiated from a direction and angle different from that of the central portion 14. Therefore, this embodiment employs the above-described configurations.

[0032] According to the above configuration, the damping cooling portion is provided only on a portion of the casing 22 in the circumferential direction. By changing the orientation of the damping cooling portion at the peripheral edge 15 of the machining area 12 so that it is positioned on the opposite side of the inner wall of the machining area 12, interference between the inner wall and the damping cooling body 23 is eliminated. This allows the laser profile measurement device 2 (the casing 22 itself) to be brought close to the inner wall. As a result, it becomes possible to accurately measure the laser profile over a wider range, including the peripheral edge 15. This ultimately makes it possible to improve the machining accuracy of the product.

[0033] Furthermore, with the above configuration, the laser is attenuated by multiple reflections within the first attenuation passage 51 and the second attenuation space 52. In particular, because the first attenuation passage 51 extends in a direction intersecting the second direction D2, when the laser enters the first attenuation passage 51, the laser (first reflected light L1) is incident within a range that allows it to be reflected by the inner wall of the first attenuation passage 51. This makes it possible to easily form multiple reflection paths without using any other device to change the path of the first reflected light L1. As a result, it is possible to reduce the manufacturing and operating costs of the device. It is also possible to reduce the number of parts of the device and to achieve a more compact size.

[0034] Furthermore, with the above configuration, when manufacturing the damping cooling body 23, recesses are formed in each of the segments 80 separated by the second dividing surface 82, and then the segments 80 are combined to easily form the second damping space 52. Meanwhile, the first dividing surface 81 is located on a different plane from the first damping passage 51. This results in a seamless, continuous tubular section including the inlet end 53 of the first damping passage 51. In other words, no discontinuous dividing line is created on the inner wall surface of the first damping passage 51. This prevents the high-intensity laser beam from diffusing or being reflected along an unexpected path at the inlet end 53, where it enters immediately after reflection. As a result, the laser profile measurement device 2 can be operated more stably.

[0035] Furthermore, with the above configuration, the laser light that has passed through the first attenuation passage 51 is further attenuated when it enters the second attenuation space 52 that intersects with the first attenuation passage 51. This shortens the path length for attenuating the laser light. As a result, the dimensions and size of the attenuation cooling body 23 can be further reduced. On the other hand, if only the first attenuation passage 51 is provided, the laser light must be attenuated along a linear path, which increases the path length and could result in an increased device size. With the above configuration, this possibility can be avoided.

[0036] Furthermore, with the above configuration, since the cooling body main body 40 is provided with the fins 41, it is possible to increase the contact area with the outside by the surface area of ​​the fins 41. This makes it easier to dissipate heat from the cooling body main body 40 to the outside. Therefore, it is possible to continue to operate the laser profile measurement device 2 more stably for a long period of time.

[0037] The first embodiment of the present disclosure has been described above. Note that various changes and modifications can be made to the above configuration without departing from the gist of the present disclosure.

[0038] For example, as a modified example, the cross-sectional shape of the second attenuation space 152 can be changed as shown in FIG. 9 . In the example shown in FIG. 9 , the second attenuation space 152 has a right-angled triangular shape when viewed from the third direction D3. The end of the first attenuation passage 51 is located on the hypotenuse of the second attenuation space 152. The base extends in the second direction D2. With this configuration, the laser beam passing through the first attenuation passage 51 undergoes multiple reflections within the right-angled triangular second attenuation space 152, ultimately resulting in a state where it is further attenuated. This allows the measurement target laser beam L3 to be extracted accurately and stably. As a result, the laser profile can be measured stably.

[0039] Second Embodiment Next, a second embodiment of the present disclosure will be described with reference to Fig. 10. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. As shown in Fig. 10, the laser profile measurement device 2 according to this embodiment further includes a housing 70 that covers the damping cooling body 23 from the outside, and a gas supply unit 71 that supplies refrigerant gas into the housing 70.

[0040] The housing 70 accommodates the damping cooling body 23 and has an opening formed at the top. Covering the housing 70 from the outside, a plurality of refrigerant flow paths 72 extending in the first direction D1 are formed between the fins 41. A space 73 is formed between the lower surface of the damping cooling body 23 and the bottom surface of the housing 70. A sintered metal plate 74 is attached to the upper surface of this space 73. A gas supply unit 71 supplies refrigerant gas to the refrigerant flow paths 72 through this space 73. Argon, which is supplied as atmospheric gas into the processing region 12 of the laser processing apparatus 1, is preferably used as the refrigerant gas. That is, the gas supply unit 71 is connected to an argon supply source.

[0041] With this configuration, the refrigerant gas flowing through the refrigerant flow path can cool the damping cooling body 23 more efficiently and stably. Furthermore, since the argon used in laser processing is used as the refrigerant gas, there is no need to provide an additional gas supply source. This also significantly reduces operating costs.

[0042] The second embodiment of the present disclosure has been described above. Note that various changes and modifications can be made to the above configuration without departing from the gist of the present disclosure.

[0043] <Additional Notes> The laser profile measuring device 2 described in each embodiment can be understood, for example, as follows.

[0044] (1) A laser profile measuring device 2 according to a first aspect includes a reflection attenuation unit 20 that transmits at least a portion of a laser beam incident from a first direction D1 to generate a measurement target laser beam traveling in the first direction D1, and that generates an attenuated laser beam by reflecting the remaining component of the laser beam in a second direction D2 different from the first direction D1; a capturing unit 21 that is provided on one side of the reflection attenuation unit 20 in the first direction D1 and captures the measurement target laser beam; a casing 22 that extends in the first direction D1 and covers the reflection attenuation unit 20 and the capturing unit 21 from the outside; an attenuation cooling body 23 that is provided on at least a portion of the circumferential direction of the casing 22 when viewed from the first direction D1; and a rotational support unit 24 that rotatably supports the casing 22 and the attenuation cooling body 23 so that they are oriented in the direction of incidence of the laser beam.

[0045] According to the above configuration, the damping cooling unit is provided on at least a portion of the circumferential direction of the casing 22. As a result, at the peripheral portion 15 of the processing region 12 of the SLM modeling device, by changing the orientation of the damping cooling unit so that it is positioned on the opposite side from the inner wall of the processing region 12, it is possible to bring the laser profile measurement device 2 close to the inner wall. This makes it possible to accurately measure the laser profile over a wider range.

[0046] (2) The laser profile measuring device 2 according to the second aspect is the laser profile measuring device 2 of (1), wherein the attenuation cooling body 23 has a first attenuation passage 51 extending in a direction intersecting the second direction D2 and multiple-reflecting the attenuated laser, and a second attenuation space 52 communicating with the first attenuation passage 51.

[0047] According to the above configuration, the laser is attenuated by multiple reflections in the first attenuation passage 51 and the second attenuation space 52. In particular, since the first attenuation passage 51 extends in a direction intersecting the second direction D2, multiple reflection paths can be easily formed by the laser entering the first attenuation passage 51.

[0048] (3) A laser profile measuring device 2 according to a third aspect is the laser profile measuring device 2 of (2), wherein the damping cooling body 23 has a divided body 80 divided by a first dividing surface 81 that passes through a plane different from the inlet end 53 of the first damping passage 51 when viewed from the second direction D2, a second dividing surface 82 that divides the second damping space 52 when viewed from the second direction D2, and a connecting dividing surface 83 that connects the first dividing surface 81 and the second dividing surface 82.

[0049] According to the above configuration, when manufacturing the damping cooling body 23, a recess is formed in each of the segments 80 separated by the second dividing surface 82, and then the segments 80 are combined to easily form the second damping space 52. On the other hand, the first dividing surface 81 is located on a different plane from the first damping passage 51. This prevents a discontinuous dividing line from occurring on the inner wall surface of the first damping passage 51. This prevents the high-intensity laser beam from diffusing in the first damping passage 51 immediately after reflection, and from being reflected along unexpected paths.

[0050] (4) The laser profile measuring device 2 according to the fourth aspect is the laser profile measuring device 2 of (2) or (3), in which the second damping space 52 extends in a direction intersecting the first damping passage 51.

[0051] According to the above configuration, the laser light that has passed through the first attenuation passage 51 is further attenuated when it enters the second attenuation space 52 that intersects with the first attenuation passage 51. This allows the path length to be shortened, and the size and size of the attenuation cooling body 23 to be kept small.

[0052] (5) The laser profile measuring device 2 according to the fifth aspect is the laser profile measuring device 2 of (2) or (3), wherein the second damping space 52 has a triangular cross-sectional shape, when viewed from a direction perpendicular to the first direction D1 and the second direction D2, with a hypotenuse perpendicular to the direction in which the first damping passage 51 extends and a base extending in the second direction D2.

[0053] According to the above configuration, the laser beam passing through the first attenuation passage 51 is repeatedly reflected multiple times within the triangular second attenuation space 52, and ultimately becomes significantly attenuated. This allows the laser beam to be accurately and stably extracted as a measurement target. As a result, the laser profile can be stably measured.

[0054] (6) The laser profile measuring device 2 according to the sixth aspect is a laser profile measuring device 2 according to any one of aspects (2) to (5), wherein the attenuation cooling body 23 has a cooling body main body 40 having the first attenuation passage 51 and the second attenuation space 52, and a plurality of fins 41 provided on the outer surface of the cooling body main body 40.

[0055] According to the above configuration, the fins 41 are provided on the cooling body main body 40, so that it is possible to increase the contact area with the outside, thereby making it easier to dissipate heat from the cooling body main body 40 to the outside.

[0056] (7) The laser profile measuring device 2 according to the seventh aspect is a laser profile measuring device 2 according to any one of aspects (1) to (6), and further includes a housing 70 that accommodates the damping cooling body 23 and forms a refrigerant flow path 72 therein, and a gas supply unit 71 that supplies refrigerant gas to the refrigerant flow path 72.

[0057] With the above configuration, the damping cooling body 23 can be cooled more efficiently and stably by the refrigerant gas flowing through the refrigerant flow path 72. Furthermore, the cooling mechanism can be completed within the chamber 10, eliminating the need for wiring such as hoses to the outside of the chamber 10, thereby simplifying the configuration of the entire device.

[0058] According to the present disclosure, it is possible to provide a laser profile measurement device that is smaller in size and capable of measuring a laser profile more accurately.

[0059] DESCRIPTION OF SYMBOLS 1...Laser processing device 2...Laser profile measuring device 10...Chamber 11...Laser irradiation section 12...Processing area 13...Irradiation point 14...Central section 15...Peripheral edge section 20...Reflection attenuation section 21...Capturing section 22...Casing 23...Attenuation cooling body 24...Pivot support section 25...Opening 31...Reflection attenuation element 32...Near-field coupling element 40...Cooling body main body 41...Fin 51...First attenuation passage 52...Second attenuation space 53...Inlet side end 61...Stage 62...Support base 70...Housing 71...Gas supply section 72...Refrigerant flow path 73...Space 74...Plate material 80...Divided body 81...First divided surface 82...Second divided surface 83...Connecting divided surface 91...X-axis rail 92...Y-axis rail 93...θ-axis rotating section 152...Second attenuation space D1...First direction D2...Second direction D3...Third direction L...Laser L1...First reflected light L2...Second reflected light L3...Measurement target laser X...Rotation axis

Claims

1. A laser profile measurement device comprising: a reflection attenuation unit that transmits at least a portion of a laser incident from a first direction to generate a measurement target laser traveling in the first direction, and generates an attenuated laser by reflecting the remaining component of the laser in a second direction different from the first direction; a capture unit that is provided on one side of the reflection attenuation unit in the first direction and captures the measurement target laser; a casing that extends in the first direction and covers the reflection attenuation unit and the capture unit from the outside; an attenuation cooling body that is provided on at least a portion of the circumferential direction of the casing when viewed from the first direction; and a rotational support unit that rotatably supports the casing and the attenuation cooling body so that they are oriented in the incident direction of the laser.

2. A laser profile measuring device as described in claim 1, wherein the attenuation cooling body has a first attenuation passage extending in a direction intersecting the second direction and multiple-reflecting the attenuated laser, and a second attenuation space communicating with the first attenuation passage.

3. The laser profile measuring device of claim 2, wherein the damping cooling body has a divided body divided by a first dividing surface passing through a plane different from the inlet end of the first damping passage when viewed from the second direction, a second dividing surface dividing the second damping space when viewed from the second direction, and a connecting dividing surface connecting the first dividing surface and the second dividing surface.

4. A laser profile measuring device according to claim 2 or 3, wherein the second attenuation space extends in a direction intersecting the first attenuation passage.

5. A laser profile measuring device as described in claim 2 or 3, wherein the second damping space has a triangular cross-sectional shape when viewed from a direction perpendicular to the first direction and the second direction, the triangular cross-sectional shape having a hypotenuse perpendicular to the extension direction of the first damping passage and a base extending in the second direction.

6. A laser profile measuring device as described in claim 2, wherein the attenuation cooling body comprises: a cooling body main body having the first attenuation passage and the second attenuation space; and a plurality of fins provided on the outer surface of the cooling body main body.

7. The laser profile measurement device according to claim 1, further comprising: a housing that accommodates the attenuation cooling body and defines a refrigerant flow path therein; and a gas supply unit that supplies refrigerant gas to the refrigerant flow path.

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