Optical sensor package

Abstract

An optical sensor package (10) comprises a substrate (20), an optical sensor device (30) mounted on the substrate (20), a resin frame (40) provided on the substrate (20) so as to surround the outer periphery of the optical sensor device (30), and a transparent plate (70) provided on the resin frame (40) so as to cover the optical sensor device (30) via a space. A plurality of recessed regions (50) are provided in a frame top surface (41) of the resin frame (40). When viewed from a direction perpendicular to the substrate (20), the transparent plate (70) is disposed such that the outer side (73) of the transparent plate (70) is positioned inside the outer side (43) of the resin frame (40), and the maximum distance (D1) between the outer side (73) of the transparent plate (70) and the outer side (43) of the resin frame (40), which are adjacent to each other, is equal to or less than the maximum length (L1) of the recessed regions (50).

Description

Optical Sensor Package

[0001] The present disclosure relates to optical sensor packages.

[0002] Conventionally, electronic component packages having an imaging element have been known. Patent Document 1 discloses an electronic component package including a substrate on which the imaging element is mounted, a cover glass, and a frame for sealing the surface of the substrate on which the imaging element is mounted together with the cover glass.

[0003] Japanese Patent Application Laid-Open No. 2022-3746

[0004] The electronic component package disclosed in Patent Document 1 has a problem in that the area of ​​the package becomes large.

[0005] The present disclosure provides an optical sensor package and the like that can reduce the area.

[0006] An optical sensor package according to one embodiment of the present disclosure comprises a substrate, an optical sensor device mounted on the substrate, a resin frame provided on the substrate so as to surround the outer periphery of the optical sensor device, and a transparent plate provided on the resin frame so as to cover the optical sensor device via a space, wherein the resin frame has a frame bottom surface facing the substrate and a frame top surface facing away from the frame bottom surface, and the frame top surface has a plurality of recessed areas, and when viewed from a direction perpendicular to the substrate, the transparent plate is positioned such that the outer edges of the transparent plate are located more inward than the outer edges of the resin frame, and the maximum distance between the outer edges of adjacent transparent plates and the outer edges of the resin frame is less than or equal to the maximum length of the recessed areas.

[0007] An optical sensor package according to one embodiment of the present disclosure comprises a substrate, an optical sensor device mounted on the substrate, a resin frame provided on the substrate so as to surround the outer periphery of the optical sensor device, and a transparent plate provided on the resin frame so as to cover the optical sensor device via a space, wherein the resin frame has a frame bottom surface facing the substrate and a frame top surface facing away from the frame bottom surface, and the frame top surface is provided with a plurality of recessed areas, and when viewed from a direction perpendicular to the substrate, the transparent plate is positioned such that its outer edges are located more inward than the outer edges of the resin frame, and the recessed areas are arch-shaped and have straight linear portions and curved bulge portions, and are positioned such that the straight portions overlap the outer edges of the resin frame.

[0008] An optical sensor package according to one embodiment of the present disclosure comprises a substrate, an optical sensor device mounted on the substrate, a resin frame provided on the substrate so as to surround the outer periphery of the optical sensor device, and a transparent plate provided on the resin frame so as to cover the optical sensor device via a space, wherein the resin frame has a frame bottom surface facing the substrate and a frame top surface facing away from the frame bottom surface, and the frame top surface has a plurality of recessed areas and one or more recesses different from the plurality of recessed areas, when viewed from a direction perpendicular to the substrate, the transparent plate is positioned such that an outer edge of the transparent plate is located more inward than an outer edge of the resin frame, the plurality of recessed areas and the one or more recesses are positioned between the outer edge of the transparent plate and the outer edge of the resin frame, and the area of ​​the recesses is smaller than the area of ​​the recessed areas.

[0009] An optical sensor package according to one embodiment of the present disclosure comprises a substrate, an optical sensor device mounted on the substrate, a resin frame provided on the substrate so as to surround the outer periphery of the optical sensor device, and a transparent plate provided on the resin frame so as to cover the optical sensor device across a space, wherein the resin frame has a frame bottom surface facing the substrate and a frame top surface facing away from the frame bottom surface, and the frame top surface has a plurality of recessed areas, and the transparent plate is arranged so as to cover all of the plurality of recessed areas when viewed from a direction perpendicular to the substrate, and the inner bottom surface of the recessed area has a tapered surface or a curved surface.

[0010] An optical sensor package according to one embodiment of the present disclosure comprises a substrate, an optical sensor device mounted on the substrate, a resin frame provided on the substrate so as to surround the outer periphery of the optical sensor device, and a transparent plate provided on the resin frame so as to cover the optical sensor device through a space, wherein the resin frame has a frame bottom surface facing the substrate and a frame top surface facing away from the frame bottom surface, and a plurality of recessed areas are provided on the frame top surface, and the transparent plate is arranged so as to overlap a portion of each of the plurality of recessed areas when viewed from a direction perpendicular to the substrate.

[0011] An optical sensor package according to one embodiment of the present disclosure comprises a substrate, an optical sensor device mounted on the substrate, a resin frame provided on the substrate so as to surround the periphery of the optical sensor device, and a transparent plate provided on the resin frame so as to cover the optical sensor device via a space, wherein the resin frame has a frame bottom surface facing the substrate and a frame top surface facing away from the frame bottom surface, and the frame top surface has a plurality of recessed areas, and when viewed from a direction perpendicular to the substrate, the recessed areas are provided at corners of the resin frame, which has a rectangular periphery, and the transparent plate is rectangular with its four corners chamfered or rounded, and is positioned so as not to overlap any of the plurality of recessed areas.

[0012] According to the present disclosure, the area of ​​the optical sensor package can be reduced.

[0013] FIG. 1 is a plan view of an optical sensor package of Comparative Example 1. FIG. 2 is a cross-sectional view of the optical sensor package of Comparative Example 1. FIG. 3A is a view showing a resin molding die for molding a resin frame. FIG. 3B is a view showing a state in which a resin material has been injected into the resin molding die. FIG. 3C is a view showing a state in which the die is opened after resin molding. FIG. 3D is a view showing a state in which the molded resin frame is pushed out with an ejector pin and removed from the resin molding die. FIG. 4 is a plan view of an optical sensor package according to Embodiment 1. FIG. 5 is a cross-sectional view of the optical sensor package according to Embodiment 1. FIG. 6A is a top view of the resin frame and transparent plate of the optical sensor package according to Embodiment 1. FIG. 6B is a cross-sectional view of a recessed region and the like of the resin frame. FIG. 7A is a top view of the resin frame and transparent plate of the optical sensor package according to Variation 1 of Embodiment 1. FIG. 7B is a cross-sectional view of a recessed region and the like of the resin frame. FIG. 8 is a schematic diagram showing an example of a resin molding die for molding a plurality of resin frames. FIG. 9 is a top view of the resin frame and transparent plate of the optical sensor package of Comparative Example 2. FIG. 10 is a plan view of an optical sensor package according to the second embodiment. FIG. 11 is a diagram showing a cross section of a resin frame of the optical sensor package according to the second embodiment. FIG. 12 is a diagram showing another example of a resin frame according to the second embodiment. FIG. 13 is a diagram showing another example of a resin frame according to the second embodiment. FIG. 14 is a diagram showing another example of a resin frame according to the second embodiment. FIG. 15 is a plan view of an optical sensor package according to the third embodiment. FIG. 16 is a diagram showing a cross section of an optical sensor package according to the third embodiment. FIG. 17 is an enlarged view of a portion of a resin frame and a transparent plate according to a third comparative example, viewed from above. FIG. 18 is an enlarged view showing a portion of a cross section of a resin frame and a transparent plate according to the third comparative example. FIG. 19 is an enlarged view showing an example of a portion of a cross section of a resin frame and a transparent plate according to the third embodiment. FIG. 20 is an enlarged view showing another example of a portion of a cross section of a resin frame and a transparent plate according to the third embodiment. FIG. 21 is a plan view of an optical sensor package according to a first modified example of the third embodiment. FIG. 22 is a diagram showing a cross section of an optical sensor package according to the first modified example of the third embodiment.FIG. 23 is a diagram showing a resin frame and a transparent plate according to Modification 1 of Embodiment 3. FIG. 24 is an enlarged view schematically showing a portion of the resin frame and the transparent plate according to Modification 1 of Embodiment 3 as viewed from above. FIG. 25 is an enlarged view showing an example of a cross section of a portion of the resin frame and the transparent plate according to Modification 1 of Embodiment 3. FIG. 26 is an enlarged view showing another example of a portion of the resin frame and the transparent plate according to Modification 1 of Embodiment 3. FIG. 27 is a diagram showing another example of a cross section of a portion of the resin frame and the transparent plate according to Modification 1 of Embodiment 3. FIG. 28 is a diagram showing an example of a resin frame and a transparent plate according to Modification 2 of Embodiment 3. FIG. 29 is a diagram showing an example of a resin frame and a transparent plate according to Modification 3 of Embodiment 3.

[0014] (Background to the Invention of the Disclosure) The background to the invention of the disclosure will be described with reference to FIGS. 1 to 3D.

[0015] Fig. 1 is a plan view of an optical sensor package 110 of Comparative Example 1. Fig. 2 is a diagram showing a cross section of the optical sensor package 110 of Comparative Example 1. Fig. 2 shows a cross section of the optical sensor package 110 taken along line II-II in Fig. 1.

[0016] As shown in Figures 1 and 2, the optical sensor package 110 of Comparative Example 1 includes a substrate 20, an optical sensor device 30 mounted on the substrate 20, a frame-shaped resin frame 140 provided on the substrate 20, and a transparent plate 170 that is a cover glass provided on the resin frame 140.

[0017] The optical sensor device 30 is fixed to the surface of the substrate 20 with an adhesive 61. The resin frame 140 is fixed to the surface of the substrate 20 with an adhesive 62. The transparent plate 170 is fixed to the upper surface of the resin frame 140 with an adhesive 63.

[0018] When viewed from a direction perpendicular to the substrate 20 as shown in Figure 1, the square-frame-shaped resin frame 140 is positioned inside the outer periphery of the rectangular substrate 20, and the square-shaped transparent plate 170 is positioned inside the outer periphery of the resin frame 140. A recessed area 150 is provided at each of the four corners of the resin frame 140. The recessed areas 150 are pin marks left by ejector pins used to remove the resin frame 140 from a resin molding die. The process of forming the resin frame 140 and the recessed areas 150 will now be described.

[0019] Fig. 3A is a diagram showing a resin molding die 90 for molding the resin frame 140. An injection molding machine that injects resin material into the resin molding die 90 is not shown in Fig. 3A. Also, Fig. 3A shows a portion in cross section. The same applies to Figs. 3A to 3D.

[0020] 3A, the resin molding die 90 has a first die 91, a second die 92, and an eject pin 95. The first die 91 has a cavity 93 formed therein for forming the outer shape of the resin frame 140. The first die 91 also has an insertion hole formed therein for inserting the eject pin 95. The second die 92 has an injection passage (e.g., a sprue or gate) 94 formed therein for feeding the resin material into the cavity 93. The eject pin 95 is guided by the insertion hole of the first die 91 and is movable in the same direction as the opening and closing direction of the die.

[0021] Fig. 3B is a diagram showing a state in which a resin material has been injected into the resin molding die 90. Fig. 3C is a diagram showing a state in which the die is opened after resin molding. Fig. 3D is a diagram showing a state in which the molded resin frame 140 is pushed out by an ejector pin 95 and removed from the resin molding die 90.

[0022] First, as shown in Fig. 3B, with the first mold 91 and the second mold 92 closed, a resin material is injected into the cavity 93 through the injection passage 94. After the resin material hardens and forms a mold, the first mold 91 is separated from the second mold 92 to open the molds, as shown in Fig. 3C. Next, as shown in Fig. 3D, the resin frame 140 is pushed out of the cavity 93 using an ejector pin 95 and removed from the molds. Any excess resin material protruding from the resin frame 140 will be removed in a later process.

[0023] In the resin molding die 90, it is not easy to position the tip of the eject pin 95 flush with the surface of the cavity 93, so a margin of positioning accuracy is taken into account and the die is designed so that the tip of the eject pin 95 is recessed about 0.05 mm inward from the surface of the cavity 93. Therefore, a circular recessed area 150 is formed in the resin frame 140 as the pin mark of the eject pin 95.

[0024] For example, in the optical sensor package 110, if the recessed region 150 is formed at a position overlapping the transparent plate 170, problems may occur after the transparent plate 170 is bonded to the resin frame 140 with the adhesive 63. Therefore, in the resin frame 140 of the comparative example, a space is provided for forming the recessed region 150 so that the recessed region 150 does not overlap the transparent plate 170. Specifically, the distance D101 between the outer edge 173 of the transparent plate 170 and the outer edge 143 of the resin frame 140 adjacent to each other in the left-right direction (first direction x1) in FIG. 1 is increased, and the recessed region 150 is provided between the outer edge 173 and the outer edge 143. Therefore, the optical sensor package 110 of the comparative example has a problem in that the package area is large.

[0025] In contrast, the optical sensor package of the present disclosure has the following configuration in order to reduce the area of ​​the package.

[0026] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. Note that each embodiment described below represents a specific example of the present disclosure. The numerical values, shapes, materials, components, the arrangement and connection of the components, steps, the order of steps, and the like shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, each drawing is not necessarily an exact illustration. In each drawing, substantially identical components are assigned the same reference numerals, and duplicate explanations are omitted or simplified.

[0027] Furthermore, in this specification, terms indicating the relationship between elements, such as parallel, terms indicating the shape of elements, such as rectangular, and numerical ranges are not expressions that only express a strict meaning, but are expressions that also include a substantially equivalent range, for example, a difference of about a few percent.

[0028] In addition, some figures show x1 axis, x2 axis, and x3 axis, which represent three mutually orthogonal directions, and these axes and axial directions along these axes may be used for explanation as needed. Note that these axes are added for ease of understanding, and do not limit the direction or posture in which the optical sensor package is used.

[0029] First Embodiment [Configuration of Optical Sensor Package] The configuration of an optical sensor package according to a first embodiment will be described with reference to FIGS. 4 to 6B.

[0030] Fig. 4 is a plan view of the optical sensor package 10 according to embodiment 1. Fig. 5 is a diagram showing a cross section of the optical sensor package 10. Fig. 5 shows a cross section of the optical sensor package 10 taken along line VV in Fig. 4.

[0031] 4 and 5 , the optical sensor package 10 includes a substrate 20, an optical sensor device 30 mounted on the substrate 20, a frame-shaped resin frame 40 provided on the substrate 20, and a transparent plate 70 provided on the resin frame 40. The optical sensor package 10 also includes an external conductor 80 provided on the rear surface 22 of the substrate 20.

[0032] The substrate 20 is, for example, a ceramic substrate or a resin substrate, and has a plate-like shape. The front surface 21 and the back surface 22 of the substrate 20 are flat and parallel to each other. When viewed from a direction perpendicular to the substrate 20, the substrate 20 has a quadrilateral shape such as a rectangle or a square.

[0033] The substrate 20 also has a plurality of wirings 26 formed on the front surface 21, the back surface 22, and inside the substrate 20. The wirings 26 on the front surface 21 of the substrate 20 are connected to the optical sensor device 30, and the wirings (not shown) on the back surface 22 of the substrate 20 are connected to the external conductor 80. The wirings (not shown) inside the substrate 20 are formed to connect the wirings 26 on the front surface 21 and the wirings on the back surface 22.

[0034] The optical sensor device 30 is a sensor device that operates by receiving light. When viewed from a direction perpendicular to the substrate 20, the optical sensor device 30 has a quadrilateral shape such as a rectangle or a square.

[0035] The area of ​​the optical sensor device 30 is smaller than the areas of the substrate 20 and the transparent plate 70, and smaller than the inner periphery of the frame-shaped resin frame 40. The optical sensor device 30 is fixed to the substrate 20 by, for example, an adhesive 61.

[0036] A sensor element 31 is provided on the surface of the optical sensor device 30. The sensor element 31 is, for example, an imaging element, and is provided in the center of the optical sensor device 30. The optical sensor device 30 is electrically connected to the wiring 26 of the substrate 20 via bonding wires. Note that the optical sensor device 30 may also be electrically connected to the substrate 20 via bumps.

[0037] The external conductor 80 is provided on the rear surface 22 of the substrate 20. The external conductor 80 is a ball-shaped solder member (solder ball) and is electrically connected to the wiring on the rear surface 22 of the substrate 20. Note that the external conductor 80 is not limited to a solder member, and may be an external terminal formed by metal plating or the like.

[0038] The resin frame 40 and the transparent plate 70 are members for protecting the optical sensor device 30 from the external environment.

[0039] The resin frame 40 is provided on the surface 21 of the substrate 20 so as to surround the outer periphery of the optical sensor device 30. The resin frame 40 is frame-shaped and has an inner periphery and an outer periphery. The inner periphery of the resin frame 40 is positioned outside the outer periphery of the optical sensor device 30 and the wiring 26 on the surface 21 of the substrate 20. When viewed from a direction perpendicular to the substrate 20, the outer periphery of the resin frame 40 has a quadrilateral shape such as a rectangle or a square.

[0040] Hereinafter, the direction along the surface 21 of the substrate 20 and along a specific side of the substrate 20 may be referred to as the first direction x1, the direction along the surface 21 of the substrate 20 and perpendicular to the first direction x1 may be referred to as the second direction x2, and the direction perpendicular to the substrate 20 may be referred to as the third direction x3.

[0041] The resin frame 40 has four outer sides 43. Specifically, when viewed from the center of the resin frame 40, the resin frame 40 has a first outer side 43a located on the positive side of the first direction x1, a second outer side 43b located on the negative side of the first direction x1, a third outer side 43c located on the positive side of the second direction x2, and a fourth outer side 43d located on the negative side of the second direction x2. The first outer side 43a and the second outer side 43b are parallel to each other, and the third outer side 43c and the fourth outer side 43d are parallel to each other. Furthermore, the first outer side 43a or the second outer side 43b is arranged to form a right angle with the third outer side 43c or the fourth outer side 43d.

[0042] The height (thickness) of the resin frame 40 is greater than the height of the optical sensor device 30 and greater than the height of the bonding wires. The height of the resin frame 40 is, for example, 0.6 mm. The resin frame 40 is fixed to the substrate 20 by, for example, an adhesive 62.

[0043] The resin frame 40 has a frame bottom surface 42 facing the substrate 20 and a frame top surface 41 facing away from the frame bottom surface 42. The frame bottom surface 42 is connected to the front surface 21 of the substrate 20 via an adhesive 62. The frame top surface 41 has a plurality of recessed areas 50 formed therein.

[0044] Fig. 6A is a top view of the resin frame 40 and transparent plate 70 of the optical sensor package 10. Fig. 6B is a diagram showing a cross section of the recessed region 50 and other portions of the resin frame 40. Fig. 6B shows a cross section of the recessed region 50 and other portions taken along line VIB-VIB in Fig. 6A.

[0045] 6A and 6B are pin marks of an ejector pin 95 used to remove the resin frame 40 from the resin molding die 90. In this example, the recessed area 50 is a mark formed using part of the outer edge of the circular portion of the ejector pin 95. The recessed area 50 has a step that slopes down from the frame top surface 41 toward the frame bottom surface 42. The depth of the recessed area 50 is, for example, 0.1 mm or less.

[0046] The recessed areas 50 are formed on the outer periphery of the resin frame 40. In this example, the recessed areas 50 are provided at positions corresponding to the first outer side 43a and the second outer side 43b, which are parallel to each other. Note that the recessed areas 50 may also be provided at positions corresponding to the third outer side 43c and the fourth outer side 43d, which are parallel to each other.

[0047] The transparent plate 70 is a transparent plate that transmits light. Examples of the transparent plate 70 include a cover glass and a plastic cover. The transparent plate 70 is fixed to the frame top surface 41 of the resin frame 40 with an adhesive 63. The transparent plate 70 is provided on the resin frame 40 so as to cover the optical sensor device 30 via a space. In this example, the transparent plate 70 is formed so as not to cover the multiple recessed regions 50. In other words, the transparent plate 70 is positioned so as not to overlap any of the multiple recessed regions 50 when viewed from a direction perpendicular to the substrate 20.

[0048] When viewed from a direction perpendicular to the substrate 20, the transparent plate 70 has a quadrilateral shape such as a rectangle or a square.

[0049] The transparent plate 70 has four outer edges 73. Specifically, when viewed from the center of the transparent plate 70, the transparent plate 70 has a first outer edge 73a located on the positive side of the first direction x1, a second outer edge 73b located on the negative side of the first direction x1, a third outer edge 73c located on the positive side of the second direction x2, and a fourth outer edge 73d located on the negative side of the second direction x2. The first outer edge 73a and the second outer edge 73b are parallel to each other, and the third outer edge 73c and the fourth outer edge 73d are parallel to each other. Furthermore, the first outer edge 73a or the second outer edge 73b is arranged to form a right angle with the third outer edge 73c or the fourth outer edge 73d.

[0050] The transparent plate 70 is arranged so that an outer edge 73 of the transparent plate 70 is located more inward than the outer edge 43 of the resin frame 40. The outer edge 73 of the transparent plate 70 is arranged so as to follow the outer edge 43 of the resin frame 40, and the outer edge 73 of the transparent plate 70 and the outer edge 43 of the resin frame 40 are adjacent to each other. In this example, the transparent plate 70 is arranged so that the first outer edge 73a and the first outer edge 43a are adjacent to each other, the second outer edge 73b and the second outer edge 43b are adjacent to each other, the third outer edge 73c and the third outer edge 43c are adjacent to each other, and the fourth outer edge 73d and the fourth outer edge 43d are adjacent to each other.

[0051] The recessed areas 50 described above are provided between the outer edges 73 of the transparent plates 70 and the outer edges 43 of the resin frame 40, which are adjacent to each other. In this example, recessed areas 50 are provided between the outer edges 43 a and 73 a, and between the outer edges 43 b and 73 b. When viewed from a direction perpendicular to the substrate 20, a portion of the outer edge 55 of the recessed areas 50 overlaps with the outer edges 43 of the resin frame 40 (the first outer edge 43 a or the second outer edge 43 b in this example).

[0052] When viewed from a direction perpendicular to the substrate 20, the recessed region 50 is arch-shaped and has a straight line portion 51 that corresponds to a chord of a circle and a curved bulge portion 52 that corresponds to an arc. The recessed region 50 is an area surrounded by the straight line portion 51 and the bulge portion 52. When viewed from a direction perpendicular to the substrate 20, the recessed region 50 is arranged so that the straight line portion 51 overlaps the outer edge 43 of the resin frame 40. The bulge portion 52 is located between the outer edge 73 of the transparent plate 70 and the outer edge 43 of the resin frame 40, and connects one end of the straight line portion 51 to the other end by an arc-shaped curve.

[0053] In the optical sensor package 10 of this embodiment, the maximum distance D1 between the outer edge 73 of the adjacent transparent plate 70 and the outer edge 43 of the resin frame 40 is less than the maximum length L1 of the recessed area 50 (D1≦L1).

[0054] The maximum distance D1 is the distance between the outer edge 73 and the outer edge 43 of the resin frame 40 in the combination where the outer edges 73 and 43 are the furthest apart from each other, among multiple combinations of the outer edges 73 of the transparent plate 70 and the outer edges 43 of the resin frame 40. Note that the distance in this case means the shortest straight-line distance. The maximum distance D1 between the outer edges 73 and 43 is, for example, 0.8 mm or less. The maximum distance D1 may be 0.2 mm or more and 0.6 mm or less.

[0055] The maximum length L1 of recessed region 50 is the length at which the distance between both ends of a straight line drawn to intersect recessed region 50 when viewed from a direction perpendicular to substrate 20 is greatest. In this example, maximum length L1 of recessed region 50 is the length of straight line portion 51. Maximum length L1 is, for example, 3 mm, but is not limited to this and may be 1 mm or more and 5 mm or less.

[0056] Specifically, the optical sensor package 10 of this embodiment has four combinations of adjacent outer edges 73 of the transparent plate 70 and outer edges 43 of the resin frame 40, and in all four combinations, the distance D1 between the adjacent outer edges 73 and 43 is less than the maximum length L1 of the recessed area 50.

[0057] As described above, in the optical sensor package 10 of this embodiment, the maximum distance D1 between the outer edges 73 of adjacent transparent plates 70 and the outer edges 43 of the resin frame 40 is equal to or less than the maximum length L1 of the recessed areas 50. Therefore, the distance between the outer edges 73 and 43 can be shortened while providing the recessed areas 50 in the resin frame 40. This allows the area of ​​the optical sensor package 10 to be reduced. Furthermore, the transparent plate 70 is positioned so as not to overlap with the multiple recessed areas 50 and is bonded to the resin frame 40. This improves the connection reliability and sealing performance of the transparent plate 70 to the resin frame 40.

[0058] [First Modification of First Embodiment] A description will be given of an optical sensor package 10 according to a first modification of the first embodiment. In this first modification, an example in which recessed regions 50 are formed in the four corners of the resin frame 40 will be described.

[0059] Fig. 7A is a top view of the resin frame 40 and the transparent plate 70 of the optical sensor package 10 according to Modification 1. Fig. 7B is a diagram showing a cross section of the recessed region 50 and other parts of the resin frame 40. Fig. 7B shows a cross section of the recessed region 50 and other parts taken along line VIIB-VIIB in Fig. 7A.

[0060] 7A and 7B are pin marks of ejector pins 95 used to remove the resin frame 40 from the resin molding die 90. The recessed area 50 has a step that slopes down from the frame top surface 41 toward the frame bottom surface 42.

[0061] The recessed areas 50 are provided in the corners 48 of the resin frame 40. In this example, the recessed areas 50 are provided between the four corners of the transparent plate 70 and the four corners of the resin frame 40. When viewed from a direction perpendicular to the substrate 20, the recessed areas 50 do not overlap the transparent plate 70, and part of the outer edge 55 of the recessed areas 50 overlaps the outer side 43 of the resin frame 40.

[0062] The recessed region 50 has a fan-like shape, which is a quarter of a circle. The recessed region 50 is an area surrounded by two straight line portions 51 forming a right angle and a curved bulge portion 52. When viewed perpendicularly to the substrate 20, the two straight line portions 51, one 51a and the other 51b, overlap a portion of the outer edge 43 of the resin frame 40. The bulge portion 52 is located between a corner of the transparent plate 70 and a corner of the resin frame 40. The bulge portion 52 connects the end of the one straight line portion 51a and the end of the other straight line portion 51b, which are located opposite the intersection of the two straight line portions 51, by an arc-shaped curve. The linear distance between both ends of the bulge portion 52 (or the linear distance between the end of one straight line portion and the end of the other straight line portion) is the maximum length L1 within the length of the recessed region 50.

[0063] In the optical sensor package 10 of the first modification, the maximum distance D1 between the outer edges 73 of the transparent plates 70 and the outer edges 43 of the resin frame 40, which are adjacent to each other, is also equal to or less than the maximum length L1 of the recessed region 50 (D1≦L1). Specifically, the optical sensor package 10 has four combinations of the outer edges 73 of the transparent plates 70 and the outer edges 43 of the resin frame 40, which are adjacent to each other, and in all four combinations, the distance D1 between the outer edges 73 of the transparent plates 70 and the outer edges 43 of the resin frame 40, which are adjacent to each other, is equal to or less than the maximum length L1 of the recessed region 50. The distance D1 between the outer edges 73 of the transparent plates 70 and the outer edges 43 of the resin frame 40 is, for example, 0.8 mm or less, and the maximum length L1 of the recessed region 50 is, for example, (0.8×√2) mm.

[0064] As described above, in the optical sensor package 10 of the first modification, the maximum distance D1 between the outer edges 73 of the transparent plates 70 and the outer edges 43 of the resin frame 40, which are adjacent to each other, is less than the maximum length L1 of the recessed areas 50. Therefore, the distance between the outer edges 73 and 43 can be shortened while providing the recessed areas 50 in the resin frame 40. This allows the area of ​​the optical sensor package 10 to be reduced. Furthermore, the transparent plate 70 is positioned so as not to overlap with the multiple recessed areas 50 and is adhered to the resin frame 40. This improves the connection reliability and sealing performance of the transparent plate 70 to the resin frame 40.

[0065] (Embodiment 2) [Background to the development of embodiment 2] The background to the development of embodiment 2 will be described with reference to Figures 8 and 9. In embodiment 2, a configuration for ensuring the traceability of the resin frame 40 will be described.

[0066] FIG. 8 is a schematic diagram showing an example of a resin molding die 90 for molding a plurality of resin frames 40. As shown in FIG.

[0067] 8 shows a resin molding die 90 having an injection passage 94 and six cavities 93. In the second embodiment, six resin frames 40 are molded simultaneously using the resin molding die 90. Recently, there has been a demand for traceability indicating which of the multiple cavities 93 a resin frame 40 was molded in. One possible solution to this is to use ejector pins 95 corresponding to the multiple cavities 93 to attach different marks to each of the multiple resin frames 40.

[0068] FIG. 9 is a top view of the resin frame 140 and the transparent plate 170 of the optical sensor package 110A of the second comparative example.

[0069] 9, the number "1" is engraved in a recessed area 150 located at a corner of the resin frame 140. Following this example, by engraving a different number for each eject pin 95 corresponding to a plurality of cavities 93, it is possible to engrave different characters for each of the plurality of resin frames 140. This makes it possible to identify the plurality of resin frames 140 by tracing the cavities 93 that are the original molds for the resin frames 140. However, engraving a number on the eject pin 95 increases the area required for the eject pin 95, which increases the area of ​​the resin frame 140 and the optical sensor package.

[0070] In contrast, the optical sensor package of the second embodiment has the following configuration in order to reduce the area of ​​the package.

[0071] [Configuration of Optical Sensor Package] The configuration of an optical sensor package 10A according to the second embodiment will be described with reference to FIGS. 10 and 11. FIG.

[0072] Fig. 10 is a plan view of the optical sensor package 10A according to embodiment 2. Fig. 11 is a diagram showing a cross section of the resin frame 40 of the optical sensor package 10A. Fig. 11 shows the cross section of the resin frame 40 taken along line XI-XI in Fig. 10.

[0073] As shown in Figure 10, the optical sensor package 10A includes a substrate 20, an optical sensor device 30 mounted on the substrate 20, a frame-shaped resin frame 40 provided on the substrate 20, and a transparent plate 70 provided on the resin frame 40.

[0074] The configurations of the substrate 20, the optical sensor device 30, and the transparent plate 70 are the same as those in the first embodiment. The configuration of the recessed region 50 of the resin frame 40 is the same as that in the first embodiment.

[0075] The optical sensor package 10A of the second embodiment has recesses 46 for identifying multiple resin frames 40 by tracing the cavities 93 that are the manufacturer's mold for the resin frame 40. For example, if four regions for forming the recesses 46 are provided in the resin frame 40, there are 15 possible combinations of whether or not the recesses 46 are formed, and it is possible to identify the resin frames 40 formed in each of the 15 cavities 93. If the case where no recesses 46 are formed is included, there are 16 possible combinations of whether or not the recesses 46 are formed.

[0076] 10 and 11, one or more recesses 46 different from the plurality of recessed areas 50 are formed in the frame top surface 41. Note that Fig. 10 also shows a gate relief portion 47 connected to an injection passage 94 for the resin material.

[0077] The recess 46 is formed, for example, by a convex portion provided on the surface of the cavity 93 of the resin molding die 90. The area of ​​the recess 46 is smaller than the area of ​​the recessed region 50. The depth of the recess 46 is greater than the depth of the recessed region 50. The depth of the recess 46 is, for example, 0.2 mm.

[0078] The recesses 46 are formed on the outer periphery of the resin frame 40. The recesses 46 are provided between the outer edges 73 of the transparent plates 70 and the outer edges 43 of the resin frame 40, which are adjacent to each other. In this example, two recesses 46 are provided between the outer edges 43c and 73c. ​​When viewed from a direction perpendicular to the substrate 20, the recesses 46 do not overlap the transparent plates 70, and part of the outer edge of the recesses 46 overlaps the outer edge 43 of the resin frame 40 (the third outer edge 43c in this example).

[0079] When viewed from a direction perpendicular to the substrate 20, the recess 46 is arch-shaped and has a straight line portion 46a that corresponds to a chord of a circle and a curved bulge portion 46b that corresponds to an arc. The recess 46 is an area surrounded by the straight line portion 46a and the bulge portion 46b. When viewed from a direction perpendicular to the substrate 20, the recess 46 is arranged so that the straight line portion 46a overlaps the outer edge 43 of the resin frame 40. The bulge portion 46b is located between the outer edge 73 of the transparent plate 70 and the outer edge 43 of the resin frame 40, and connects one end of the straight line portion 46a to the other end by an arc-shaped curve.

[0080] Although the recess 46 is provided at a position corresponding to the third outer side 43 c in the above example, the present invention is not limited thereto. The recess 46 may be provided at a position corresponding to each of the first outer side 43 a, the second outer side 43 b, and the fourth outer side 43 d. Although the recess 46 is arcuate in the above example, the present invention is not limited thereto, and the recess 46 may be a rounded rectangular shape.

[0081] 12, 13, and 14 are diagrams showing other examples of the resin frame 40. Note that these figures also show a transparent plate 70.

[0082] 12, two recessed areas 50 and one recess 46 are formed between the first outer side 43a and the first outer side 73a, two recessed areas 50 and one recess 46 are formed between the second outer side 43b and the second outer side 73b, and one recessed area 50 and two recesses 46 are formed between the third outer side 43c and the third outer side 73c. ​​A gate relief 47 is formed between the fourth outer side 43d and the fourth outer side 73d.

[0083] 13, one recessed area 50 and two recesses 46 are formed between the first outer side 43a and the first outer side 73a, one recessed area 50 and two recesses 46 are formed between the second outer side 43b and the second outer side 73b, and one recessed area 50 is formed between the third outer side 43c and the third outer side 73c. ​​A gate relief 47 and a recessed area 50 are formed between the fourth outer side 43d and the fourth outer side 73d.

[0084] Figure 14 shows an example in which the position of the gate relief portion 47 in the resin frame 40 shown in Figure 13 is shifted horizontally (in the first direction x1) and the size of the recessed area portion 50 is made larger than the recessed area portion 50 in Figure 13.

[0085] According to the optical sensor package 10A of the second embodiment, the area of ​​the package can be reduced, and a plurality of resin frames 40 can be identified by tracing the cavity 93 which is the manufacturer's mold of the resin frame 40.

[0086] Third Embodiment [Configuration of Optical Sensor Package] The configuration of an optical sensor package 10B according to a third embodiment will be described with reference to Figures 15 to 20. In the third embodiment, an example will be described in which the transparent plate 70 covers the entire recessed region 50.

[0087] Fig. 15 is a plan view of the optical sensor package 10B according to the third embodiment. Fig. 16 is a diagram showing a cross section of the optical sensor package 10B. Fig. 16 shows a cross section of the optical sensor package 10B taken along line XVI-XVI in Fig. 15.

[0088] As shown in Figures 15 and 16, the optical sensor package 10B includes a substrate 20, an optical sensor device 30 mounted on the substrate 20, a frame-shaped resin frame 40 provided on the substrate 20, and a transparent plate 70 provided on the resin frame 40.

[0089] The configurations of the substrate 20 and the optical sensor device 30 are the same as those in embodiment 1. The configuration of the resin frame 40 is the same as that in embodiment 1, except for the recessed region 50. The configuration of the transparent plate 70 is the same as that in embodiment 1, except for the size of the transparent plate 70.

[0090] The outer periphery of the resin frame 40 is rectangular. The recessed region 50 is formed on the outer periphery of the resin frame 40 at a corner portion 48 of the resin frame 40. The recessed region 50 in the third embodiment is a circular region, and the maximum length L1 of the recessed region 50 is the diameter of the circular region.

[0091] The transparent plate 70 is arranged to cover all of the recessed areas 50 when viewed from a direction perpendicular to the substrate 20. By arranging the transparent plate 70 to cover all of the recessed areas 50, it is possible to reduce the area of ​​the optical sensor package 10B.

[0092] However, if recessed region 50 is formed in a position overlapping transparent plate 70, problems may occur after transparent plate 70 is bonded to resin frame 40 using adhesive 63. Here, a case in which a problem occurs will be described using Comparative Example 3.

[0093] Fig. 17 is an enlarged top view of a portion of the resin frame 140 and the transparent plate 170 of Comparative Example 3. Fig. 18 is an enlarged cross-sectional view of a portion of the resin frame 140 and the transparent plate 170 of Comparative Example 3.

[0094] Figure 17 shows a state in which transparent plate 170 is arranged to cover the entire area of ​​recessed area 150. Figure 18 shows a state in which part of adhesive 63 has penetrated into recessed area 150.

[0095] For example, if too much adhesive 63 is applied to resin frame 140, the adhesive 63 will spill out of resin frame 140, causing quality problems, so the amount of adhesive 63 cannot be made greater than necessary. Therefore, as shown in Figure 18, the adhesive 63 cannot be sufficiently embedded inside recessed region 150, resulting in a state in which air g remains inside recessed region 150. For example, if an optical sensor package in this state is reflowed in a later process, the air g inside recessed region 150 will suddenly expand, causing problems such as damage to transparent plate 170 or resin frame 140.

[0096] To prevent such a problem from occurring, the optical sensor package of the third embodiment has the following configuration.

[0097] Fig. 19 is an enlarged view showing an example of a cross section of a portion of the resin frame 40 and the transparent plate 70 according to embodiment 3. Fig. 20 is an enlarged view showing another example of a cross section of a portion of the resin frame 40 and the transparent plate 70 according to embodiment 3.

[0098] The recessed area 50 is a pin mark of an ejector pin 95 used to remove the resin frame 40 from the resin molding die 90. The depth of the recessed area 50 is, for example, 0.1 mm or less, similar to that of the first embodiment.

[0099] In the third embodiment, the inner bottom surface 53 of the recessed region 50 has a tapered surface.

[0100] The recessed region 50 shown in Figure 19 has a concave tapered surface in which the depth of the side portions 54 is shallower than the depth of the center of the inner bottom surface 53. The recessed region 50 shown in Figure 20 has a diagonally linear tapered surface in which one side portion 54 is shallower than the opposite side portion 54. While the above example shows the inner bottom surface 53 of the recessed region 50 having a tapered surface, this is not limiting. For example, the inner bottom surface 53 of the recessed region 50 may have a curved surface.

[0101] According to the above configuration, the maximum depth of the recessed area 50 is set to the same as in the first embodiment, ensuring the extrusion amount of the ejector pin 95, and the internal volume of the recessed area 50 can be reduced. Therefore, the entire interior of the recessed area 50 can be filled with the adhesive 63, and air can be prevented from remaining inside the recessed area 50. This can prevent damage to the transparent plate 70 or the resin frame 40, for example, when the optical sensor package 10B is reflowed in a later process.

[0102] Also in the third embodiment, the maximum distance D1 between the outer side 73 of the transparent plate 70 and the outer side 43 of the resin frame 40, which are adjacent to each other, is equal to or less than the maximum length L1 of the recessed area 50. Therefore, the distance between the outer side 73 and the outer side 43 can be shortened while providing the recessed area 50 in the resin frame 40. This allows the area of ​​the optical sensor package 10B to be reduced.

[0103] [Variation 1 of Embodiment 3] An optical sensor package 10B according to Variation 1 of Embodiment 3 will be described with reference to Figures 21 to 27. In this variation 1, an example will be described in which the transparent plate 70 covers a portion of the recessed region 50.

[0104] Fig. 21 is a plan view of an optical sensor package 10B according to a first modification of the embodiment 3. Fig. 22 is a diagram showing a cross section of the optical sensor package 10B according to the first modification of the embodiment 3. Fig. 22 shows a cross section of the optical sensor package 10B taken along line XXII-XXII in Fig. 21 .

[0105] As shown in Figures 21 and 22, the optical sensor package 10B comprises a substrate 20, an optical sensor device 30 mounted on the substrate 20, a frame-shaped resin frame 40 provided on the substrate 20, and a transparent plate 70 provided on the resin frame 40.

[0106] The configurations of the substrate 20, the optical sensor device 30, and the resin frame 40 are the same as those in the third embodiment. The configuration of the transparent plate 70 is the same as that in the third embodiment, except for the size of the transparent plate 70.

[0107] FIG. 23 is a diagram showing the resin frame 40 and the transparent plate 70 of the first modification.

[0108] 23 , the transparent plate 70 is arranged so as to overlap a portion of each of the plurality of recessed areas 50 when viewed from a direction perpendicular to the substrate 20. In this example, the transparent plate 70 is arranged so that the corners of the transparent plate 70 are located within the circular recessed areas 50.

[0109] Fig. 24 is an enlarged view schematically illustrating a portion of the resin frame 40 and the transparent plate 70 according to Modification 1 of Embodiment 3, as viewed from above. Fig. 25 is an enlarged view showing an example of a cross section of a portion of the resin frame 40 and the transparent plate 70.

[0110] 24 shows an example in which transparent plate 70 is arranged so that part of the side of transparent plate 70 is located within circular recessed area 50 when viewed from a direction perpendicular to substrate 20. FIG. 25 shows an example in which part of the interior of recessed area 50 is filled with adhesive 63.

[0111] In the optical sensor package 10B of the first modification of the third embodiment, the transparent plate 70 covers only a portion of the recessed region 50, and a portion of the space above the recessed region 50 is open. Therefore, for example, when the optical sensor package 10B is reflowed in a later process, the air g inside the recessed region 50 can be released, and damage to the transparent plate 70 or the resin frame 40 can be suppressed.

[0112] Also in the first modification of the third embodiment, the maximum distance D1 between the outer side 73 of the transparent plate 70 and the outer side 43 of the resin frame 40, which are adjacent to each other, is equal to or less than the maximum length L1 of the recessed area 50. Therefore, the distance between the outer side 73 and the outer side 43 can be shortened while providing the recessed area 50 in the resin frame 40. This allows the area of ​​the optical sensor package 10B to be reduced.

[0113] FIG. 26 is an enlarged view showing another example of a part of the resin frame 40 and the transparent plate 70 according to the first modification of the third embodiment.

[0114] As shown in Figure 26, the transparent plate 70 has a rectangular shape with its four corners chamfered or rounded. The transparent plate 70 is arranged so as to overlap a portion of each of the recessed areas 50. This configuration can achieve the same effects as the first variation of the third embodiment shown in Figure 23. It also makes it possible to reduce the area of ​​the package while ensuring the adhesive area.

[0115] FIG. 27 is a diagram showing another example of a cross section of a portion of the resin frame 40 and the transparent plate 70 according to the first modification of the third embodiment.

[0116] 27 shows an example in which a tapered surface is provided on the inner bottom surface 53 of the recessed area 50, and the transparent plate 70 is positioned so that part of the side of the transparent plate 70 is located within the circular recessed area 50. With this configuration, it is possible to achieve the effects of both the third embodiment and the first modification.

[0117] [Second Modification of Third Embodiment] A description will be given of an optical sensor package 10B according to a second modification of the third embodiment. In this second modification, an example will be described in which the transparent plate 70 is arranged so as not to overlap all of the recessed regions 50.

[0118] FIG. 28 is a diagram showing an example of a resin frame 40 and a transparent plate 70 according to the second modification of the third embodiment.

[0119] The optical sensor package 10B according to variant example 2 of embodiment 3 includes a substrate 20, an optical sensor device 30 mounted on the substrate 20, a frame-shaped resin frame 40 provided on the substrate 20, and a transparent plate 70 provided on the resin frame 40.

[0120] The configurations of the substrate 20, the optical sensor device 30, and the resin frame 40 are the same as those in the third embodiment. The configuration of the transparent plate 70 is the same as that in the third embodiment, except for the shape and size of the transparent plate 70.

[0121] The recessed areas 50 are provided in the corners 48 of the resin frame 40, which has a rectangular periphery. The transparent plate 70 is rectangular and has four chamfered or rounded corners. In the second modification, the transparent plate 70 is arranged so as not to overlap any of the recessed areas 50.

[0122] In the optical sensor package 10B of the second modification of the third embodiment, the transparent plate 70 does not cover the recessed region 50, and the entire space above the recessed region 50 is open. Therefore, for example, when the optical sensor package 10B is subjected to reflow soldering in a later process, the air inside the recessed region 50 can escape, and damage to the transparent plate 70 or the resin frame 40 can be prevented.

[0123] Also in the second modification of the third embodiment, the maximum distance D1 between the outer side 73 of the transparent plate 70 and the outer side 43 of the resin frame 40, which are adjacent to each other, is equal to or less than the maximum length L1 of the recessed area 50. Therefore, the distance between the outer side 73 and the outer side 43 can be shortened while providing the recessed area 50 in the resin frame 40. This allows the area of ​​the optical sensor package 10B to be reduced.

[0124] [Third Modification of Third Embodiment] A description will be given of an optical sensor package 10B according to a third modification of the third embodiment. In this third modification, an example will be described in which the transparent plate 70 is arranged so as not to overlap all of the recessed regions 50.

[0125] FIG. 29 is a diagram showing an example of a resin frame 40 and a transparent plate 70 according to a third modification of the third embodiment.

[0126] The optical sensor package 10B according to the third variant of the third embodiment includes a substrate 20, an optical sensor device 30 mounted on the substrate 20, a frame-shaped resin frame 40 provided on the substrate 20, and a transparent plate 70 provided on the resin frame 40.

[0127] The configurations of the substrate 20 and the optical sensor device 30 are the same as those in the third embodiment. The configurations of the transparent plate 70 and the resin frame 40 are the same as those in the third embodiment except for the shape and size.

[0128] The resin frame 40 has a plurality of ears 49 that protrude outward from corners or outer edges 43 of the resin frame 40. The recessed areas 50 are provided in the ears 49. In the third modification, the transparent plate 70 is arranged so as not to overlap any of the recessed areas 50.

[0129] In the optical sensor package 10B of the third modification of the third embodiment, the transparent plate 70 does not cover the recessed region 50, and the entire space above the recessed region 50 is open. Therefore, for example, when the optical sensor package 10B is subjected to reflow soldering in a later process, the air inside the recessed region 50 can escape, and damage to the transparent plate 70 or the resin frame 40 can be prevented.

[0130] Furthermore, in the third modification of the third embodiment, the maximum distance D1 between the outer side 73 of the transparent plate 70 and the outer side 43 of the resin frame 40, which are adjacent to each other, is equal to or less than the maximum length L1 of the recessed area 50. Therefore, the distance between the outer side 73 and the outer side 43 can be shortened while providing the recessed area 50 in the resin frame 40.

[0131] (Summary) An optical sensor package (10, 10A or 10B) according to one embodiment of the present disclosure will be illustrated.

[0132] The optical sensor package of Example 1 includes a substrate 20, an optical sensor device 30 mounted on the substrate 20, a resin frame 40 provided on the substrate 20 so as to surround the outer periphery of the optical sensor device 30, and a transparent plate 70 provided on the resin frame 40 so as to cover the optical sensor device 30 with a space in between. The resin frame 40 has a frame bottom surface 42 facing the substrate 20 and a frame top surface 41 facing away from the frame bottom surface 42. A plurality of recessed areas 50 are provided on the frame top surface 41. When viewed from a direction perpendicular to the substrate 20, the transparent plate 70 is arranged such that an outer edge 73 of the transparent plate 70 is located inside the outer edge 43 of the resin frame 40, and the maximum distance D1 between the outer edges 73 of adjacent transparent plates 70 and the outer edge 43 of the resin frame 40 is less than the maximum length L1 of the recessed areas 50.

[0133] In this way, the maximum distance D1 between the outer side 73 of the adjacent transparent plates 70 and the outer side 43 of the resin frame 40 is equal to or less than the maximum length L1 of the recessed area 50, so that the distance between the outer side 73 and the outer side 43 can be shortened while providing the recessed area 50 in the resin frame 40. This allows the area of ​​the optical sensor package to be reduced.

[0134] The optical sensor package of Example 2 is the optical sensor package described in Example 1, and the maximum distance D1 may be 0.8 mm or less.

[0135] In this way, by setting the maximum distance D1 to 0.8 mm or less, it is possible to shorten the distance between the outer side 73 and the outer side 43. This makes it possible to reduce the area of ​​the optical sensor package.

[0136] The optical sensor package of Example 3 is the optical sensor package described in Example 1 or 2, and the recessed area 50 may be a pin mark of an ejector pin 95 for removing the resin frame 40 from the resin molding die 90.

[0137] This allows the distance between the outer side 73 and the outer side 43 to be shortened while providing the recessed area 50, which is the pin mark of the eject pin 95, in the resin frame 40. This allows the area of ​​the optical sensor package to be reduced.

[0138] The optical sensor package of Example 4 is the optical sensor package according to any one of Examples 1 to 3, in which, when viewed from a direction perpendicular to the substrate 20, the outer periphery of the resin frame 40 is rectangular, and the outer periphery of the transparent plate 70 is rectangular and smaller than the outer periphery of the resin frame 40. The optical sensor package has four combinations of adjacent outer edges 73 of the transparent plate 70 and outer edges 43 of the resin frame 40, and in all four combinations, the distance D1 between the adjacent outer edges 73 of the transparent plate 70 and outer edges 43 of the resin frame 40 may be less than or equal to the maximum length L1 of the recessed region 50.

[0139] In this way, in all four combinations of adjacent outer sides 73 and 43, distance D1 is equal to or less than maximum length L1 of recessed area 50, which makes it possible to shorten the distance between outer side 73 and outer side 43 while providing recessed area 50 in resin frame 40. This makes it possible to reduce the area of ​​the optical sensor package.

[0140] The optical sensor package of Example 5 is an optical sensor package described in any one of Examples 1 to 4, and a portion of the outer edge 55 of the recessed area 50 may overlap the outer edge 43 of the resin frame 40 when viewed from a direction perpendicular to the substrate 20.

[0141] In this way, part of the outer edge 55 of the recessed area 50 overlaps with the outer side 43 of the resin frame 40, which makes it possible to narrow the width of the recessed area 50 in the direction in which the outer side 73 and the outer side 43 are adjacent to each other. This makes it possible to shorten the distance between the outer side 73 and the outer side 43. This makes it possible to reduce the area of ​​the optical sensor package.

[0142] The optical sensor package of Example 6 is the optical sensor package described in any one of Examples 1 to 5, in which the recessed area 50 is an area surrounded by a straight line portion 51 that overlaps the outer edge 43 of the resin frame 40 when viewed from a direction perpendicular to the substrate 20, and a curved bulge portion 52 that is located between the outer edge 73 of the transparent plate 70 and the outer edge 43 of the resin frame 40, and the maximum length L1 of the recessed area 50 may be the length of the straight line portion 51.

[0143] This makes it possible to shorten the distance between the outer side 73 and the outer side 43 while ensuring the area of ​​the recessed region 50. This makes it possible to reduce the area of ​​the optical sensor package.

[0144] The optical sensor package of Example 7 is an optical sensor package described in any one of Examples 1 to 6, in which the recessed area 50 has a step that slopes down from the frame top surface 41 toward the frame bottom surface 42, and the depth of the recessed area 50 may be 0.1 mm or less.

[0145] This allows the depth of the recessed region 50 to be minimized while shortening the distance between the outer side 73 and the outer side 43. This allows the area of ​​the optical sensor package to be reduced.

[0146] The optical sensor package of Example 8 is an optical sensor package described in any one of Examples 1 to 7, and further includes one or more recesses 46 formed on the frame top surface 41 that are different from the multiple recessed area portions 50, and the area of ​​the recesses 46 may be smaller than the area of ​​the recessed area portions 50.

[0147] This allows the resin frame 40 to be identified by tracing the cavity 93 that is the mold used to manufacture the resin frame 40, for example.

[0148] The optical sensor package of Example 9 is the optical sensor package described in any one of Examples 1 to 4, in which the recessed area 50 is a circular area located at a corner portion 48 of the resin frame 40 having a square outer periphery, and the maximum length L1 of the recessed area 50 may be the length of the diameter of the circular area.

[0149] This allows the maximum distance D1 between the outer side 73 of the transparent plate 70 and the outer side 43 of the resin frame 40, which are adjacent to each other, to be equal to or less than the diameter of the recessed area 50. This allows the distance between the outer side 73 and the outer side 43 to be shortened, thereby reducing the area of ​​the optical sensor package.

[0150] The optical sensor package of Example 10 is the optical sensor package described in any one of Examples 1 to 4, in which the transparent plate 70 is arranged so as to cover all areas of the multiple recessed area portions 50 when viewed from a direction perpendicular to the substrate 20, and the inner bottom surface 53 of the recessed area portion 50 may have a tapered surface or a curved surface.

[0151] This reduces the internal volume of the recessed region 50 and prevents air from accumulating in the recessed region 50. This prevents damage to the transparent plate 70 or the resin frame 40, for example, when the optical sensor package is reflowed in a later process. Furthermore, by arranging the transparent plate 70 so as to cover all of the recessed regions 50, the area of ​​the optical sensor package can be reduced.

[0152] The optical sensor package of Example 11 is the optical sensor package described in Example 10, in which the transparent plate 70 is connected to the frame top surface 41 by adhesive 63, and the entire inside of the recessed area portion 50 may be filled with adhesive 63.

[0153] In this way, by filling the entire interior of the recessed region 50 with the adhesive 63, it is possible to prevent air from accumulating in the recessed region 50. This makes it possible to prevent damage to the transparent plate 70 or the resin frame 40, for example, when the optical sensor package is reflowed in a later process.

[0154] The optical sensor package of Example 12 is an optical sensor package described in any one of Examples 1 to 4, and the transparent plate 70 may be arranged so as to overlap a portion of each of the multiple recessed area portions 50 when viewed from a direction perpendicular to the substrate 20.

[0155] In this way, by arranging the transparent plate 70 so that it overlaps a portion of each of the plurality of recessed regions 50, it is possible to open up a portion of the space above the recessed regions 50. Therefore, for example, when the optical sensor package is reflowed in a later process, the air inside the recessed regions 50 can escape, and damage to the transparent plate 70 or the resin frame 40 can be suppressed.

[0156] The optical sensor package of Example 13 is the optical sensor package described in Example 12, in which the transparent plate 70 is connected to the frame top surface 41 by adhesive 63, and a portion of the interior of the recessed area portion 50 may be embedded with adhesive 63.

[0157] With this optical sensor package, even if part of the interior of the recessed region 50 is filled with the adhesive 63, part of the space above the recessed region 50 can be opened. Therefore, for example, when the optical sensor package is reflowed in a later process, the air inside the recessed region 50 can be released. This makes it possible to prevent damage to the transparent plate 70 or the resin frame 40.

[0158] The optical sensor package of Example 14 is an optical sensor package described in any one of Examples 1 to 4, and the transparent plate 70 may be arranged so as not to overlap all of the areas of the multiple recessed area portions 50 when viewed from a direction perpendicular to the substrate 20.

[0159] This allows the space above the recessed region 50 to be opened. Therefore, for example, when the optical sensor package is reflowed in a later process, the air inside the recessed region 50 can be released. This makes it possible to prevent damage to the transparent plate 70 or the resin frame 40.

[0160] The optical sensor package of Example 15 is the optical sensor package described in Example 14, and when viewed from a direction perpendicular to the substrate 20, the recessed area 50 is provided in a corner portion 48 of the resin frame 40 having a square outer periphery, and the transparent plate 70 may be square and have chamfered or rounded corners.

[0161] This allows the space above the recessed region 50 to be opened with a simple structure. Therefore, for example, when the optical sensor package is reflowed in a later process, the air inside the recessed region 50 can be released. This makes it possible to prevent damage to the transparent plate 70 or the resin frame 40.

[0162] The optical sensor package 10 (and 10A) of Example 16 includes a substrate 20, an optical sensor device 30 mounted on the substrate 20, a resin frame 40 provided on the substrate 20 so as to surround the outer periphery of the optical sensor device 30, and a transparent plate 70 provided on the resin frame 40 so as to cover the optical sensor device 30 via a space. The resin frame 40 has a frame bottom surface 42 facing the substrate 20 and a frame top surface 41 facing away from the frame bottom surface 42. A plurality of recessed areas 50 are provided on the frame top surface 41. When viewed from a direction perpendicular to the substrate 20, the transparent plate 70 is arranged such that an outer edge 73 of the transparent plate 70 is located inside the outer edge 43 of the resin frame 40. The recessed area 50 is arch-shaped and has a linear portion 51 and a curved bulge portion 52, and is arranged such that the linear portion 51 overlaps the outer edge 43 of the resin frame 40.

[0163] In this way, by having the recessed area 50 be bow-shaped and the linear portion 51 being disposed so as to overlap the outer side 43 of the resin frame 40, the width of the recessed area 50 can be narrowed in the direction in which the outer side 73 and the outer side 43 are adjacent to each other. This makes it possible to shorten the distance between the outer side 73 and the outer side 43. This allows the area of ​​the optical sensor package 10 (and 10A) to be reduced.

[0164] The optical sensor package 10A of Example 17 includes a substrate 20, an optical sensor device 30 mounted on the substrate 20, a resin frame 40 provided on the substrate 20 so as to surround the outer periphery of the optical sensor device 30, and a transparent plate 70 provided on the resin frame 40 so as to cover the optical sensor device 30 via a space. The resin frame 40 has a frame bottom surface 42 facing the substrate 20 and a frame top surface 41 facing away from the frame bottom surface 42. The frame top surface 41 has multiple recessed areas 50 and one or more recesses 46 different from the multiple recessed areas 50. When viewed from a direction perpendicular to the substrate 20, the transparent plate 70 is arranged such that an outer edge 73 of the transparent plate 70 is located inside the outer edge 43 of the resin frame 40, and the multiple recessed areas 50 and the one or more recesses 46 are arranged between the outer edge 73 of the transparent plate 70 and the outer edge 43 of the resin frame 40. The area of ​​the recessed areas 46 is smaller than the area of ​​the recessed areas 50.

[0165] According to this configuration, the area of ​​the package can be reduced, and the resin frame 40 can be identified by tracing the cavity 93, which is the mold of the manufacturer of the resin frame 40, for example.

[0166] The optical sensor package 10B of Example 18 includes a substrate 20, an optical sensor device 30 mounted on the substrate 20, a resin frame 40 provided on the substrate 20 so as to surround the outer periphery of the optical sensor device 30, and a transparent plate 70 provided on the resin frame 40 so as to cover the optical sensor device 30 via a space. The resin frame 40 has a frame bottom surface 42 facing the substrate 20 and a frame top surface 41 facing away from the frame bottom surface 42. A plurality of recessed areas 50 are provided on the frame top surface 41. The transparent plate 70 is arranged so as to cover all of the plurality of recessed areas 50 when viewed from a direction perpendicular to the substrate 20. An inner bottom surface 53 of the recessed area 50 has a tapered surface or a curved surface.

[0167] This configuration reduces the internal volume of the recessed region 50 and prevents air from accumulating in the recessed region 50. This prevents damage to the transparent plate 70 or the resin frame 40, for example, when the optical sensor package 10B is reflowed in a later process. Furthermore, by arranging the transparent plate 70 so as to cover all of the recessed regions 50, the area of ​​the optical sensor package 10B can be reduced.

[0168] The optical sensor package 10B of Example 19 includes a substrate 20, an optical sensor device 30 mounted on the substrate 20, a resin frame 40 provided on the substrate 20 so as to surround the outer periphery of the optical sensor device 30, and a transparent plate 70 provided on the resin frame 40 so as to cover the optical sensor device 30 via a space. The resin frame 40 has a frame bottom surface 42 facing the substrate 20 and a frame top surface 41 facing away from the frame bottom surface 42. A plurality of recessed areas 50 are provided on the frame top surface 41. The transparent plate 70 is arranged so as to overlap a portion of each of the plurality of recessed areas 50 when viewed from a direction perpendicular to the substrate 20.

[0169] In this way, by arranging the transparent plate 70 so as to overlap a portion of each of the plurality of recessed regions 50, it is possible to open a portion of the space above the recessed regions 50. Therefore, for example, when the optical sensor package 10B is reflowed in a later process, the air inside the recessed regions 50 can escape, and damage to the transparent plate 70 or the resin frame 40 can be suppressed.

[0170] The optical sensor package 10B of Example 20 includes a substrate 20, an optical sensor device 30 mounted on the substrate 20, a resin frame 40 provided on the substrate 20 so as to surround the outer periphery of the optical sensor device 30, and a transparent plate 70 provided on the resin frame 40 so as to cover the optical sensor device 30 via a space. The resin frame 40 has a frame bottom surface 42 facing the substrate 20 and a frame top surface 41 facing away from the frame bottom surface 42. A plurality of recessed areas 50 are provided on the frame top surface 41. When viewed from a direction perpendicular to the substrate 20, the recessed areas 50 are provided in corner portions 48 of the resin frame 40, which has a rectangular outer periphery. The transparent plate 70 is rectangular with its four corners chamfered or rounded, and is positioned so as not to overlap any of the plurality of recessed areas 50.

[0171] This configuration allows the space above the recessed region 50 to be opened. Therefore, for example, when the optical sensor package 10B is reflowed in a later process, the air inside the recessed region 50 can be released. This makes it possible to prevent damage to the transparent plate 70 or the resin frame 40.

[0172] While the optical sensor package of the present disclosure has been described above based on the embodiments and modifications, the present disclosure is not limited to these embodiments and modifications. As long as they do not deviate from the gist of the present disclosure, various modifications that would occur to a person skilled in the art to the present embodiments and modifications, and other forms constructed by combining some of the components of the embodiments and modifications, are also included within the scope of the present disclosure.

[0173] The optical sensor package according to the present disclosure can be used, for example, as a sensor package that packages an optical sensor device that operates by receiving light.

[0174] 10, 10A, 10B Optical sensor package 20 Substrate 21 Front surface 22 Back surface 26 Wiring 30 Optical sensor device 31 Sensor element 40 Resin frame 41 Frame top surface 42 Frame bottom surface 43, 43a, 43b, 43c, 43d Outer edge 46 Recess 46a Straight portion 46b Bulging portion 47 Gate relief portion 48 Corner portion 49 Ear portion 50 Depression area portion 51, 51a, 51b Straight portion 52 Bulging portion 53 Inner bottom surface 54 Side portion 55 Outer edge 61, 62, 63 Adhesive 70 Transparent plate 73, 73a, 73b, 73c, 73d Outer edge 80 External conductor 90 Resin molding mold 91 First mold 92 Second mold 93 Cavity 94 Injection passage 95 Eject pin D1 Distance L1 Maximum length x1 First direction x2 Second direction x3 Third direction

Claims

1. An optical sensor package comprising: a substrate; an optical sensor device mounted on the substrate; a resin frame provided on the substrate so as to surround an outer periphery of the optical sensor device; and a transparent plate provided on the resin frame so as to cover the optical sensor device via a space, wherein the resin frame has a frame bottom surface facing the substrate and a frame top surface facing away from the frame bottom surface, and a plurality of recessed areas are provided on the frame top surface, and when viewed from a direction perpendicular to the substrate, the transparent plate is positioned such that an outer edge of the transparent plate is located more inward than an outer edge of the resin frame, and the maximum distance between adjacent outer edges of the transparent plate and the outer edge of the resin frame is equal to or less than the maximum length of the recessed areas.

2. The optical sensor package according to claim 1, wherein the maximum distance is 0.8 mm or less.

3. The optical sensor package according to claim 1, wherein the recessed area is a pin mark of an ejector pin for removing the resin frame from a resin molding die.

4. The optical sensor package of claim 1, wherein, when viewed from a direction perpendicular to the substrate, the outer periphery of the resin frame is rectangular, the outer periphery of the transparent plate is rectangular and smaller than the outer periphery of the resin frame, the optical sensor package has four combinations of adjacent outer edges of the transparent plate and the outer edges of the resin frame, and in all four combinations, the distance between adjacent outer edges of the transparent plate and the outer edges of the resin frame is less than or equal to the maximum length of the recessed area.

5. An optical sensor package according to any one of claims 1 to 4, wherein a portion of the outer edge of the recessed area overlaps with the outer side of the resin frame when viewed in a direction perpendicular to the substrate.

6. An optical sensor package as described in any one of claims 1 to 4, wherein the recessed area is an area surrounded by a straight line portion that overlaps with the outer edge of the resin frame when viewed from a direction perpendicular to the substrate, and a curved bulge portion that is located between the outer edge of the transparent plate and the outer edge of the resin frame, and the maximum length of the recessed area is the length of the straight line portion.

7. An optical sensor package as set forth in any one of claims 1 to 4, wherein the recessed area has a step that drops from the top surface of the frame toward the bottom surface of the frame, and the depth of the recessed area is 0.1 mm or less.

8. An optical sensor package as described in any one of claims 1 to 4, further comprising one or more recesses formed on the top surface of the frame that are different from the plurality of recessed areas, and an area of ​​the recesses being smaller than an area of ​​the recessed areas.

9. An optical sensor package as described in any one of claims 1 to 4, wherein the recessed area is a circular area located at a corner of the resin frame having a rectangular outer periphery, and the maximum length of the recessed area is the diameter of the circular area.

10. An optical sensor package as described in any one of claims 1 to 4, wherein the transparent plate is arranged so as to cover all of the areas of the plurality of recessed areas when viewed from a direction perpendicular to the substrate, and the inner bottom surface of the recessed area has a tapered surface or a curved surface.

11. The optical sensor package according to claim 10, wherein the transparent plate is connected to the top surface of the frame by an adhesive, and the entire inside of the recessed area is filled with the adhesive.

12. An optical sensor package according to any one of claims 1 to 4, wherein the transparent plate is arranged so as to overlap a portion of each of the plurality of recessed areas when viewed from a direction perpendicular to the substrate.

13. The optical sensor package according to claim 12, wherein the transparent plate is connected to the top surface of the frame by an adhesive, and a portion of the inside of the recessed area is filled with the adhesive.

14. An optical sensor package according to any one of claims 1 to 4, wherein the transparent plate is arranged so as not to overlap any of the multiple recessed area portions when viewed from a direction perpendicular to the substrate.

15. The optical sensor package of claim 14, wherein, when viewed from a direction perpendicular to the substrate, the recessed area is provided in a corner portion of the resin frame having a rectangular outer periphery, and the transparent plate is rectangular in shape with the four corners being chamfered or rounded.

16. An optical sensor package comprising: a substrate; an optical sensor device mounted on the substrate; a resin frame provided on the substrate so as to surround an outer periphery of the optical sensor device; and a transparent plate provided on the resin frame so as to cover the optical sensor device via a space, wherein the resin frame has a frame bottom surface facing the substrate and a frame top surface facing away from the frame bottom surface, and the frame top surface is provided with a plurality of recessed areas, and when viewed from a direction perpendicular to the substrate, the transparent plate is positioned such that an outer edge of the transparent plate is located more inward than an outer edge of the resin frame, and the recessed area is arch-shaped, having a straight linear portion and a curved bulge portion, and is positioned such that the straight portion overlaps the outer edge of the resin frame.

17. An optical sensor package comprising: a substrate; an optical sensor device mounted on the substrate; a resin frame provided on the substrate so as to surround the outer periphery of the optical sensor device; and a transparent plate provided on the resin frame so as to cover the optical sensor device via a space, wherein the resin frame has a frame bottom surface facing the substrate and a frame top surface facing away from the frame bottom surface, and a plurality of recessed areas and one or more recesses different from the plurality of recessed areas are formed on the frame top surface, and when viewed from a direction perpendicular to the substrate, the transparent plate is positioned such that an outer edge of the transparent plate is positioned more inward than an outer edge of the resin frame, the plurality of recessed areas and the one or more recesses are positioned between the outer edge of the transparent plate and the outer edge of the resin frame, and an area of ​​the recesses is smaller than an area of ​​the recessed areas.

18. An optical sensor package comprising: a substrate; an optical sensor device mounted on the substrate; a resin frame provided on the substrate so as to surround the outer periphery of the optical sensor device; and a transparent plate provided on the resin frame so as to cover the optical sensor device via a space, wherein the resin frame has a frame bottom surface facing the substrate and a frame top surface facing away from the frame bottom surface, a plurality of recessed areas are provided on the frame top surface, the transparent plate is arranged so as to cover all of the plurality of recessed areas when viewed from a direction perpendicular to the substrate, and the inner bottom surface of the recessed area has a tapered surface or a curved surface.

19. An optical sensor package comprising: a substrate; an optical sensor device mounted on the substrate; a resin frame provided on the substrate so as to surround the outer periphery of the optical sensor device; and a transparent plate provided on the resin frame so as to cover the optical sensor device via a space, wherein the resin frame has a frame bottom surface facing the substrate and a frame top surface facing away from the frame bottom surface, a plurality of recessed areas are provided on the frame top surface, and the transparent plate is positioned so as to overlap a portion of each of the plurality of recessed areas when viewed from a direction perpendicular to the substrate.

20. An optical sensor package comprising: a substrate; an optical sensor device mounted on the substrate; a resin frame provided on the substrate so as to surround an outer periphery of the optical sensor device; and a transparent plate provided on the resin frame so as to cover the optical sensor device via a space, wherein the resin frame has a frame bottom surface facing the substrate and a frame top surface facing away from the frame bottom surface, and a plurality of recessed areas are provided on the frame top surface, and when viewed from a direction perpendicular to the substrate, the recessed areas are provided in corners of the resin frame which has a rectangular periphery, and the transparent plate is rectangular with its four corners chamfered or rounded, and is positioned so as not to overlap any of the plurality of recessed areas.

Images