Tray for sintering electronic components

Abstract

The present invention relates to a tray for sintering electronic components, in which the rigidity of the sintering tray used for sintering electronic components is improved to prevent cracks or delamination of a coating layer and ensure convenient maintenance. The tray for sintering electronic components comprises: a nickel sheet which has a flat surface and having formed therein a plurality of punched holes; a ceramic-based coating layer coated on the nickel sheet; and a plurality of stacking means which are independently detachably coupled to the edges of the sides of the nickel sheet so as to reinforce the bending strength of the nickel sheet, and which form, on the upper surface of the nickel sheet, a step for preventing the loss of electronic components, and which, when the sintering trays are stacked in multiple stages, separate the sintering trays.

Description

Tray for sintering electronic components

[0001] The present invention relates to a tray for firing electronic components, and more particularly, to an electronic component firing tray that improves the rigidity of a tray for firing electronic components to prevent cracking or peeling of a coating layer and ensures convenience of maintenance.

[0002] Typically, ceramic electronic products such as multilayer ceramic capacitors, ferrites, and piezoelectric elements are manufactured by molding ceramic raw materials into a predetermined shape and then going through a debinding process, a firing process, and a cooling process in a kiln to complete the production of a multilayer ceramic molded body.

[0003] The process for manufacturing a ceramic molded body of this type includes manufacturing a slurry by adding an organic component binder to raw material powders such as BaTiO3, CaCa3, MnO2, and Glass Frit, forming a ceramic sheet using the slurry as a dielectric sheet, pattern-printing an internal electrode, which is a metal component of Ag, Ni, Cu, Pd, or Pd / Ag, on the surface of the ceramic sheet, and laminating the ceramic sheets with printed internal electrodes into multiple layers to manufacture a laminated sheet, and then pressing the laminated sheet at a pressure of 1 to 100 tonf / ㎠ and then cutting the pressed laminated sheet to a predetermined length, thereby manufacturing a ceramic molded body.

[0004] In addition, the ceramic molded body is baked out in a kiln at a temperature of 230 to 450°C to remove the binder component, and is continuously subjected to a debinding process, a firing process of firing at a temperature of 800 to 1300°C for 10 to 24 hours, and a cooling process of cooling to a low temperature after firing is completed. The ceramic molded body fired in the kiln is completed as a ceramic product by plating by applying external electrodes and terminal electrodes to its outer surface.

[0005] Among electronic components, the multi-layered ceramic capacitor (MLCC) is a chip-shaped capacitor that is mounted on the printed circuit boards of various electronic products such as mobile communication terminals, laptops, computers, and personal digital assistants (PDAs) and plays an important role in charging or discharging electricity. It has various sizes and laminated forms depending on the intended use and capacity.

[0006] These MLCCs are required to be ultra-miniaturized and ultra-high capacitance due to the recent miniaturization of electronic products. Accordingly, products are being manufactured with thinner internal electrodes and dielectric layers to achieve ultra-miniaturization, and with a large number of dielectric layers stacked to achieve ultra-high capacitance.

[0007] Meanwhile, ceramic products such as MLCC are essential materials for modern industry and are being developed in various ways for use in electronic and aircraft parts. They are obtained by mixing powdered sintered materials such as zirconia and alumina, molding them into a desired shape, and then firing them. For firing, a ceramic support is required for the ceramic product to be placed on.

[0008] Conventional domestic patent registration No. 10-1603497 discloses an electronic component sintering mesh including a lattice-shaped metal mesh (10) that supports electronic components so that they can be mounted and sintered, and a coating layer (20) coated on the metal mesh (10), wherein the coating layer (20) includes boron nitride coated on the metal mesh (10) by plasma spraying, the electronic component is a ceramic series electronic component, the metal mesh (10) is made of an alloy of 70 to 90 wt% nickel and 10 to 30 wt% chromium, and the boron nitride is coated on the metal mesh (10) by plasma spraying at a temperature of 13,500 to 14,500°C.

[0009] However, since the above metal mesh is formed with a coating layer in the form of a mesh net woven with metal wires in a lattice shape, cracks may occur in the coating layer at the intersection of the metal wires as shown in Fig. 1 due to twisting or continuous vibration during transport, and dust generated by the shedding of the coating material may stick to the ceramic product (MLCC) during the firing process, causing a fatal problem of causing a defect.

[0010] Specifically, this is because twisting or continuous vibration causes a flow in the up, down, left, and right directions at the intersection of the metal wires as shown by the arrows in Fig. 1, thereby causing cracks in the coating layer at the intersection.

[0011] In addition, since a coating layer is formed on a metal mesh whose main component is nickel and the difference in thermal expansion coefficient between the metal mesh and the coating layer is large, there is also a problem of the coating layer being peeled off due to thermal expansion caused by repeated firing processes.

[0012] Moreover, because of the softness of nickel itself, there is a limit to firmly holding the intersections together, which leads to a problem of reduced support capacity.

[0013] In addition, a conventional domestic patent publication No. 10-2013-0102232 discloses a breathable multi-hole functional ceramic setter characterized in that the setter has breathable multi-holes formed in a plate, the size of the breathable holes is a hole size of 0.1 to 10 mm in diameter, 100 to 10,000 breathable holes are formed per 100 mm x 100 mm square plate, and the shape of the breathable holes is any one shape selected from a circle, a triangle, a square, a hexagon, an octagon, an oval, a slit shape, a groove shape, and a line width shape.

[0014] However, the above technology has a problem in that, since the border formed at the edge of the plate is formed integrally with the plate, if the plate or border is damaged, it is difficult to separate it, and the setter itself must be discarded.

[0015] The present invention has been devised to solve the above problems and technical biases, and the purpose of the present invention is to provide a tray for firing electronic components, which prevents cracks or peeling of a coating layer applied to a tray by reinforcing the rigidity of the edges of a tray used for firing electronic components to prevent the occurrence of twisting or bending, and allows selective maintenance of sheets or each edge.

[0016] In order to achieve the above object, the electronic component sintering tray of the present invention comprises: a nickel sheet having a flat plate surface and having a plurality of perforated holes formed therein; a ceramic-based coating layer coated on the nickel sheet; and a plurality of stacking means that are independently and detachably connected to the edges of each side of the nickel sheet to form a step that reinforces the bending strength of the nickel sheet while preventing the electronic component from being lost to the upper surface of the nickel sheet, and that space the sintering trays apart when the sintering trays are stacked in multiple stages.

[0017] At this time, it is preferable that the stacking means is composed of an upper support bar arranged along the upper edge of the nickel sheet and having a plurality of through holes formed in the longitudinal direction; a lower support bar arranged along the lower edge of the nickel sheet to face the upper support bar and having a plurality of fastening grooves formed corresponding to the through holes in the longitudinal direction; and a fastening bolt that penetrates the through holes of the upper support bar and is fastened to the fastening grooves of the lower support bar.

[0018] In addition, it is preferable that a plurality of position setting holes for determining the positions of the stacking means be further formed on the edge of each side of the nickel sheet.

[0019] In addition, it is preferable that the upper support bar and the lower support bar of each of the above-mentioned stacking means are connected so that they can support each other by being adjacent to the longitudinal ends of the upper support bar and the lower support bar that are connected to the other longitudinal end when they are connected to each edge of the nickel sheet.

[0020] Meanwhile, it is preferable that a receiving groove be formed on the vertical line of each fastening groove of the lower support bar so that a part of the head of the fastening bolt is received when nickel sheets are stacked in multiple stages, thereby forming a spaced slot along the circumference of the sintering tray when the sintering tray is stacked.

[0021] Here, among the plurality of receiving grooves, it is preferable that the receiving groove located at the corner of the nickel sheet is a close receiving groove having a shape that is in close contact with the head of the received fastening bolt, and the other receiving grooves are fluid receiving grooves formed with a predetermined space that does not come into contact with the head of the received fastening bolt.

[0022] In addition, it is desirable to set the height of the step formed by the above-mentioned stacking means in various ways through the height of the upper support bar depending on the type of electronic component to be fired.

[0023] Meanwhile, it is preferable that an inclined surface be formed on one surface of the upper support bar and the lower support bar facing the inner plate surface of the nickel sheet.

[0024] In addition, it is preferable that the coating layer is a ceramic series including zirconia.

[0025] In addition, it is preferable that the above-mentioned layering means is further coated with a ceramic series including zirconia.

[0026] Lastly, it is preferable that the perforations are arranged in a grid so as to be able to respond to the torsional stress of the nickel sheet.

[0027] According to the electronic component sintering tray of the present invention having the above-described configuration, a ceramic-based coating layer is formed on a nickel sheet on a plate having a plurality of perforated holes formed therein, and the rigidity of the nickel sheet is reinforced by bonding a laminating means to the edge of the nickel sheet, thereby fundamentally blocking cracks or peeling of the coating layer due to occurrence of twisting or bending, and at the same time, a step is formed on the edge to form a seating space where the electronic component is seated, thereby stably seating the electronic component and preventing loss of the electronic component during movement during the sintering process, thereby having an excellent effect.

[0028] In addition, it has the feature of increasing the efficiency of electronic component production because multiple firing trays can be loaded into a firing furnace in multiple layers through a stacking means.

[0029] In addition, since multiple laminating means are independently and detachably bonded to each side of the nickel sheet, there is a feature that individual maintenance is possible depending on the degree of damage to the nickel sheet or the laminating means bonded to each side.

[0030] In addition, since the punched holes are formed on the nickel sheet surface, there is no area where the upper and lower crossing parts of the metal wires move as in the past, so the structural effect of preventing cracks or peeling of the coating layer around the punched holes is also excellent.

[0031] In addition, since the nickel sheet and the laminating means are made of pure nickel and pure titanium, the physical properties of the sintering tray, such as durability, tensile strength and hardness, reduce the detachment of the coating layer, thereby preventing the generation of iron oxide or chromium carbide when repeatedly used at high temperatures of about 1400°C.

[0032] Figure 1 is a reference drawing showing a conventional metal mesh structure.

[0033] Figures 2 and 3 are a plan view and a perspective view showing a sintering tray according to the present invention.

[0034] Figure 4 is a bottom perspective view of Figure 3,

[0035] Figure 5 is an exploded perspective view showing the structure of the stacking means among the configurations of the sintering tray according to the present invention.

[0036] Figure 6 is an enlarged cross-sectional view of the II line of Figure 2,

[0037] Fig. 7 is a cross-sectional view taken along line II-II of Fig. 2,

[0038] Figure 8 is a cross-sectional view showing a state in which the trays for firing according to the present invention are stacked.

[0039] FIG. 2 and FIG. 3 are a plan view and a perspective view showing a firing tray according to the present invention, FIG. 4 is a bottom perspective view of FIG. 3, FIG. 5 is an exploded perspective view showing the structure of a stacking means among the components of a firing tray according to the present invention, FIG. 6 is an enlarged cross-sectional view of a main part taken along line II of FIG. 2, FIG. 7 is a cross-sectional view of a main part taken along line II-II of FIG. 2, and FIG. 8 is a cross-sectional view of a main part showing a stacked state of a firing tray according to the present invention.

[0040] As shown in FIGS. 2 to 8, the electronic component sintering tray (100) of the present invention comprises: a nickel sheet (110) having a flat plate surface and a plurality of perforated holes (110a) formed therein; a ceramic-based coating layer (120) coated on the nickel sheet (110); and a plurality of stacking means (130) that are independently and detachably coupled to the edges of each side of the nickel sheet (110) to form a step (T) that reinforces the bending strength of the nickel sheet (110) while preventing the electronic component from being lost to the upper surface of the nickel sheet (110), and that space the sintering trays (100) apart when the sintering trays (100) are stacked in multiple stages.

[0041] Before the explanation, the characteristic of the firing tray (100) of the present invention is that, instead of applying a weaving method using a metal wire as in the prior art, a plurality of perforated holes (110a) are formed on the plate surface of a nickel sheet (110) having a single body, and a ceramic-based coating layer (120) is applied, and an independent laminating means (130) is combined with each edge of the nickel sheet (110) to reinforce the rigidity of the nickel sheet (110) and at the same time, lamination and selective maintenance of the firing tray (100) are possible.

[0042] The sintering tray (100) of the present invention is loaded with a plurality of electronic components (multilayer ceramic capacitors, ferrite, piezoelectric elements, etc., hereinafter referred to as 'MLCC') on the upper surface of the plate, and passes through a sintering furnace heated to a high temperature of about 1400°C via a conveyor (not shown).

[0043] The sintering tray (100) maintains an overall square shape as shown in FIGS. 2 to 4, and includes a nickel sheet (110), a coating layer (120), and a plurality of stacking means (130).

[0044] The nickel sheet (110) has a square shape with a flat plate surface, and a plurality of perforated holes (110a) penetrating the plate surface are formed on the plate surface as shown in Fig. 2 (see enlarged view).

[0045] The punching hole (110a) is used to allow convection by allowing heat inside the firing furnace to pass through the nickel sheet (110) surface for firing the MLCC placed on the tray. It maintains a square shape and can be processed into various shapes such as circle, oval, and square.

[0046] At this time, it is preferable that the perforations (110a) be arranged in a grid shape so as to be able to respond to the torsional stress of the nickel sheet (110) on the plate, and this arrangement maintains the shape of the perforations (110a) as it is because the support surfaces (110b) forming the perforations (110a) absorb the torsional stress even if the nickel sheet (110) is twisted or bent due to vibration.

[0047] Maintaining the shape of the perforation hole (110a) prevents peeling or cracking of the ceramic coating layer (120) described later, thereby fundamentally preventing dust, etc. from sticking to the MLCC that is being fired through the firing tray (100) due to cracks.

[0048] In addition, the nickel sheet (110) is preferably made of pure nickel (Ni) having a thickness of 0.1 mm to 1.0 mm and a purity of 95.0% to 99.9% so that the rigidity can be reinforced against distortion or bending due to continuous vibration occurring during external force or plastic processing along with the rigidity reinforcement of the punching hole (110a), and further, it has a low coefficient of thermal expansion compared to the ceramic series coating layer (120) described below along with the rigidity, thereby reducing detachment of the coating layer (120).

[0049] Meanwhile, as shown in FIGS. 5 and 6, a plurality of position setting holes (114) are formed along the edge of each side of the nickel sheet (110) so that the positions of the stacking means (130) arranged along the edge can be constantly aligned by the fastening bolts (135) of the stacking means (130) passing through them.

[0050] The coating layer (120) is a ceramic series and is coated on each surface of the upper and lower surfaces of the nickel sheet (110). By stabilizing the heat resistance of the coated nickel sheet (110), uniform heat conduction is achieved to the MLCCs mounted in the mounting space (113) formed by the laminating means (130) described later of the nickel sheet (110) during the firing process, thereby enabling stable firing of the MLCCs.

[0051] At this time, the coating layer (120) is preferably zirconia (ZrO2), which is one of the ceramic series, and one of the ceramic series types may be selected depending on the purpose.

[0052] This zirconia is coated with a thickness of 50 to 100 μm by plasma spraying zirconia ceramic powder containing yttria onto the upper and lower surfaces and perforations (110a) of a nickel sheet (110), and fusing the sprayed nickel sheet (110) at a high temperature of 2500 to 3000 degrees (see Fig. 6).

[0053] The zirconia coating layer (120) has a thermal expansion coefficient of 10.0 to 11.0 (㎛ / (mk)) when the firing temperature rises to, for example, 1000 degrees, and based on the nickel sheet (110), it is 13.0 to 13.4 (㎛ / (mk)), so the safety of the nickel sheet (110) and the coating layer (120) against material movement is guaranteed until the temperature at which material movement occurs is reached, thereby preventing the coating layer (120) from peeling or cracking.

[0054] The stacking means (130) is composed of a plurality of pieces and is independently and detachably connected to the edges of each side of a nickel sheet (110) having a square shape to reinforce the bending strength of each edge of the nickel sheet (110), thereby preventing the overall twisting or diagonal bending of the nickel sheet (110).

[0055] That is, a total of four stacking means (130) are each bonded to the four edges of the nickel sheet (110) as shown in FIGS. 2 to 4.

[0056] In addition, the stacking means (130) is fixed to each edge, thereby surrounding the entire edge of the nickel sheet (110) and forming a step (T) along the edge, and by this step (T), a mounting space (113) having a predetermined area in which a plurality of MLCCs (electronic components) can be mounted on the upper surface of the nickel sheet (110) is formed (see FIG. 6).

[0057] This settling space (113) enables stable transport of MLCCs settling on a nickel sheet (100) during transport of the sintering tray (100), and at the same time, the step (T) prevents loss of MLCCs during transport of the nickel sheet (100).

[0058] In addition, the stacking means (130) enables multi-stage stacking of the firing trays (100) while spacing out the stacked firing trays (100) to form a spacing slot (L) along the circumference, which will be described later, thereby enabling convection to occur through the circumference between the stacked firing trays (100) (see FIG. 8). This stacking structure of the firing trays (100) enables the firing of more MLCCs through a single firing furnace.

[0059] The above-described stacking means (130) may include an upper support bar (131), a lower support bar (133), and a fastening bolt (135), and the material of the stacking means (130) may be selected from among metals, non-metals, or ceramics that can ensure chemical stability within a range of 1000 to 1500 degrees.

[0060] In this embodiment, it is preferable that the upper support bar (131), the lower support bar (133), and the fastening bolt (135) be made of 99.3% to 99.5% pure titanium (Ti) material that does not contain impurities. This is because titanium is a light metal, and thus the weight of the sintering tray (100) is sought to be reduced, and further, when the sintering tray (100) is stacked in multiple pieces and placed on the conveyor of the sintering furnace, the placement weight can be reduced to the maximum, thereby reducing damage to the conveyor.

[0061] Hereinafter, in explaining the laminating means (130), a single laminating means (130) structure combined with any edge of a nickel sheet (110) will be described.

[0062] The upper support bar (131) maintains a predetermined height and length as shown in FIGS. 2 to 6, is arranged along the upper edge of the nickel sheet (110), and has through holes (131a) formed in the longitudinal direction corresponding to the position setting holes (114) formed in the nickel sheet (110) through which the fastening bolts (135) described later penetrate.

[0063] The lower support bar (133) is positioned along the lower edge of the nickel sheet (110) to face the upper support bar (131) with a height and length corresponding to those of the upper support bar (131), and in the longitudinal direction, fastening grooves (133a) are formed to penetrate corresponding to the through holes (131a) of the upper support bar (131) at positions corresponding to the position setting holes (114) formed in the nickel sheet (110).

[0064] Each fastening groove (133a) has a screw thread formed so that a fastening bolt (135) described later can be screwed into it.

[0065] The fastening bolt (135) sequentially passes through the through hole (131a) of the upper support bar (131) and the position setting hole (114) of the nickel sheet (110) and is fastened to the fastening groove (133a) of the lower support bar (133), thereby allowing the upper support bar (131), the nickel sheet (110), and the lower support bar (133) to form a single body and be coupled to one edge of the nickel sheet (110).

[0066] That is, the stacking means (130) is independently connected to each side of the nickel sheet (110) through a mechanical connection structure using a fastening bolt (135).

[0067] At this time, when the upper support bar (131) and the lower support bar (133) of each stacking means (130) are joined to the upper and lower surfaces of each edge of the nickel sheet (110), it is preferable that the longitudinal ends of the upper support bar (131) and the lower support bar (133) be adjacent to each other so as to be mutually supportive, as shown in FIGS. 2 to 5.

[0068] This is to ensure that the upper support bars (131) of the adjacent stacking means (130) are in close contact with each other, so that the four stacking means (130) are closely connected to form a single body, so that even if twisting or bending occurs in the direction of the arrow shown in Fig. 3, the stress or rigidity can be maintained.

[0069] In this way, since the overall twisting or bending of the nickel sheet (110) is prevented, the occurrence of peeling or cracking of the coating layer (120) coated on the nickel sheet (110) is fundamentally blocked.

[0070] Meanwhile, when nickel sheets (110) are stacked in multiple stages as shown in FIGS. 4, 7, and 8, a portion of the head of a fastening bolt (135) is accommodated on the vertical lower surface of each fastening groove (133a) of the lower support bar (133), thereby forming a spaced slot (L) along the periphery of the sintering tray (100) when the sintering tray (100) is stacked as shown in FIG. 8.

[0071] To this end, the receiving grooves of each lower support bar (133) located at each corner of the nickel sheet (110) among the plurality of receiving grooves are formed as close-fitting receiving grooves (134-1) having a curved shape that is in close contact with a portion of the outer surface of the head of the received fastening bolt (135), as shown in FIG. 4 (see enlarged view).

[0072] In this way, as the close-fitting receiving grooves (134-1) of each lower support bar (133) are arranged at each corner of the nickel sheet (110), only a part of the head of the fastening bolt (135) of the lower firing tray (100) is received in the close-fitting receiving grooves (134-1) of the upper stacked firing tray (100) as shown in the enlarged view of Fig. 8, thereby forming a gap slot (L) equal to the height of the head that is not received between the stacked firing trays (100).

[0073] These separation slots (L) are formed along the perimeter of the firing tray (100) by supporting the four corners of the firing tray (100), and when the stacked firing trays (100) pass through the firing furnace, convection of heat can be stably achieved through the separation slots (L).

[0074] In addition, it is preferable that the other receiving grooves except for the close receiving groove (134-1) be formed as a fluid receiving groove (134-2) formed with a predetermined space larger than the head so as not to come into contact with the head of the received fastening bolt (135) as shown in FIGS. 4 and 8.

[0075] The fluidity receiving grooves (134-2) enable stable acceptance of the head of the fastening bolt (135) even when the position of the fluidity receiving grooves (134-2) is slightly changed when the firing tray (100) is slightly deformed due to frequent thermal expansion of the firing tray (100).

[0076] That is, the fluidity receiving groove (134-2) secures a space in which the head of the fastening bolt (135) is constantly received even when slight thermal expansion of the sintering tray (100) occurs, thereby enabling positional compensation for the stacking of the sintering tray (100) to be constantly performed.

[0077] For this purpose, it is preferable that the fluidity receiving groove (134-2) have a cross-section in the shape of the letter 'ㄷ' as shown in FIGS. 6 and 8, which receives the head of the fastening bolt (135) but does not make contact with the head.

[0078] This is to ensure that the space of the fluidity receiving groove (134-2) is continuously secured by ensuring that only the periphery of the head is in linear contact even when the head of the fastening bolt (135) comes into contact with the load when stacking the tray (100) for firing.

[0079] In addition, the height of the step (T) formed by the upper support bar (131) of the stacking means (130) can be set in various ways through the height of the upper support bar depending on the type of electronic component to be fired, as shown in FIG. 6.

[0080] That is, it is possible to apply it by manufacturing the step (T) of the upper support bar (131) at a height that matches the size of the electronic component.

[0081] In this way, the height of the settling space (311) formed by the step (T) of the upper support bar (131) also changes.

[0082] In addition, an inclined surface (S) may be formed on one surface of the upper support bar (131) and the lower support bar (133) facing the inner plate surface of the nickel sheet (110), as shown in FIG. 6.

[0083] The inclined surface (S) has a predetermined incline, and when the upper support bar (131) and the lower support bar (133) are joined to the nickel sheet (110), a portion perpendicular to the plate surface of the nickel sheet (110) is prevented from being formed, thereby preventing multiple MLCCs from being installed in a perpendicular portion when installed in the installation space (311) of the nickel sheet (110).

[0084] Meanwhile, the upper support bar (131), lower support bar (133) and fastening bolt (135) constituting the stacking means (130) may be coated with zirconia (ZrO2), one of the ceramic series, to ensure stability against thermal expansion.

[0085] Here, the zirconia coating of the laminating means (130) can be selectively performed depending on the size of the nickel sheet (110) or the shape and type of the electronic component (MLCC) to be fired, so the presence or absence of the coating is not limited.

[0086] In this embodiment, it is described that the fastening bolt (135) of the stacking means (130) is installed by penetrating the position setting hole (114) of the nickel sheet (110). However, if the position setting hole (114) is not formed, the upper support bar (131) and the lower support bar (133) can be connected through the fastening bolt (135) by inserting the edge portion of the nickel sheet (110) between the upper support bar (131) and the lower support bar (133), so the connection method of the stacking means (130) is not limited.

[0087] As described so far, the firing tray of the present invention forms a ceramic-based coating layer on a nickel sheet on a plate having a plurality of perforated holes formed therein, and reinforces the rigidity of the nickel sheet by bonding a laminating means to the edge of the nickel sheet, thereby fundamentally blocking cracks or peeling of the coating layer due to twisting or bending, and at the same time forming a step on the edge to form a mounting space for electronic components, thereby stably mounting the electronic components and preventing loss of the electronic components during movement during the firing process.

[0088] In addition, it has the feature of increasing the efficiency of electronic component production because multiple firing trays can be loaded into a firing furnace in multiple layers through a stacking means.

[0089] In addition, since multiple laminating means are independently and detachably bonded to each side of the nickel sheet, there is a feature that individual maintenance is possible depending on the degree of damage to the nickel sheet or the laminating means bonded to each side.

[0090] In addition, since the punched holes are formed on the nickel sheet surface, there is no area where the upper and lower crossing parts of the metal wires move as in the past, so the structural effect of preventing cracks or peeling of the coating layer around the punched holes is also excellent.

[0091] In addition, since the nickel sheet and the laminating means are made of pure nickel and pure titanium, the physical properties of the sintering tray, such as durability, tensile strength and hardness, reduce the detachment of the coating layer, thereby preventing the generation of iron oxide or chromium carbide when repeatedly used at high temperatures of about 1400°C.

Claims

1. In the electronic component firing tray (100) that passes through the firing furnace while loaded with electronic components, A nickel sheet (110) having a flat surface and having a plurality of perforated holes (110a) formed therein; A ceramic series coating layer (120) coated on the above nickel sheet (110); and It includes a plurality of stacking means (130) that are independently and detachably connected to the edges of each side of the nickel sheet (110) to reinforce the bending strength of the nickel sheet (110) and prevent the loss of the electronic component to the upper surface of the nickel sheet (110), and that separate the nickel sheets (110) when the sintering tray (100) is stacked in multiple stages; The above-mentioned stacking means (130) is composed of an upper support bar (131) arranged along the upper edge of the nickel sheet (110) and having a plurality of through holes (131a) formed in the longitudinal direction; a lower support bar (133) arranged along the lower edge of the nickel sheet (110) to face the upper support bar (131) and having a plurality of fastening grooves (133a) formed corresponding to the through holes (131a) in the longitudinal direction; and a fastening bolt (135) that penetrates the through holes (131a) of the upper support bar (131) and is fastened to the fastening grooves (133a) of the lower support bar (133). An electronic component sintering tray characterized in that a receiving groove is formed on the vertical lower surface of each fastening groove (133a) of the lower support bar (133) to receive a portion of the head of the fastening bolt (135) when the sintering trays (100) are stacked in multiple stages, thereby forming a spacing slot (L) between the sintering trays (100).

2. In paragraph 1, A tray for sintering electronic components, characterized in that a plurality of position setting holes (114) for determining the positions of the stacking means (130) are further formed on the edges of each side of the nickel sheet (110).

3. In paragraph 1, An electronic component sintering tray characterized in that, when the upper support bar (131) and the lower support bar (133) of each of the above-mentioned stacking means (130) are joined to each edge of the nickel sheet (110), the longitudinal ends of the upper support bar (131) and the lower support bar (133) are connected adjacent to each other so as to be mutually supportive.

4. In paragraph 1, Among the above multiple receiving grooves, the receiving groove located at the corner of the nickel sheet (110) is a close receiving groove (134-1) having a shape that is in close contact with the head of the received fastening bolt (135). A tray for sintering electronic components, characterized in that the other receiving grooves are fluid receiving grooves (134-2) formed with a predetermined space that does not come into contact with the head of the receiving fastening bolt (135).

5. In paragraph 1, A tray for firing electronic components, characterized in that the height of the step (T) formed by the above-mentioned stacking means (130) is set in various ways through the height of the upper support bar (131) depending on the type of electronic component to be fired.

6. In paragraph 1, A tray for sintering electronic components, characterized in that an inclined surface (S) is formed on one surface of the upper support bar (131) and the lower support bar (133) facing the inner plate surface of the nickel sheet (110).

7. In paragraph 1, A tray for firing electronic components, characterized in that the above coating layer (120) is a ceramic series including zirconia (ZrO2).

8. In paragraph 1, A tray for firing electronic components, characterized in that the above-mentioned stacking means (130) is further coated with a ceramic series including zirconia (ZrO2).

9. In paragraph 1, A tray for sintering electronic components, characterized in that the above perforations (110a) are arranged in a grid so as to respond to the torsional stress of the nickel sheet (110).

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