Gas injection structure and plasma etcher

Abstract

A gas injection structure and a plasma etcher. The gas injection structure comprises: a gas intake pipe sleeve (100) capable of being in communication with a gas source; a gas injection member (200) detachably connected to the gas intake pipe sleeve (100), an accommodating space being formed after the gas injection member (200) is connected to the gas intake pipe sleeve (100); and a gas path switching member (300) movably arranged in the accommodating space. The gas path switching member (300) is provided with a gas through-hole group (3021, 3022, 3023), and the gas injection member (200) is provided with a gas injection hole group (201, 202, 203); a plurality of gas through-hole groups (3021, 3022, 3023) and a plurality of gas injection hole groups (201, 202, 203) are provided, and each of the gas injection hole groups (201, 202, 203) corresponds to one of the gas through-hole groups (3021, 3022, 3023); and the gas injection hole groups (201, 202, 203) have different injection directions. On the basis of the movable arrangement of the gas path switching member (300), the communication between one of the gas injection hole groups (201, 202, 203) and the gas through-hole group (3021, 3022, 3023) corresponding thereto can be switched to the communication between another gas injection hole group (201, 202, 203) and another gas through-hole group (3021, 3022, 3023). The gas injection structure can achieve gas injection in multiple directions, and with the continuous movement of the gas path switching member (300), the gas injection structure can also achieve periodic gas injection in multiple directions, enhancing the uniformity of plasma concentration, and thus improving the uniformity of plasma etching.

Description

A jet structure and plasma etching machine

[0001] This application claims priority from the following Chinese patent applications, the entire contents of which are incorporated herein by reference.

[0002] Application number: 202311324190.8

[0003] Application date: October 12, 2023

[0004] Application for creation of a name: a jet structure and plasma etching machine Technical Field

[0005] The present application relates to the technical field of jet structures, and in particular to a jet structure and a plasma etcher. Background Art

[0006] Plasma etchers, also known as plasma planar etchers, plasma etchers, or plasma surface treatment equipment, are used in the semiconductor industry. Inductively coupled plasma etching is the result of a combination of chemical and physical processes. The basic principle is that under vacuum and low pressure, an ICP radio frequency power supply (ICP stands for Inductively Coupled Plasma, representing inductively coupled plasma) generates radio frequency output to a toroidal coupling coil. A certain proportion of mixed etching gas is coupled through glow discharge to produce a high-density plasma. Under the influence of the RF radio frequency (RF stands for Radio Frequency, indicating electromagnetic frequencies that can be radiated into space) at the lower electrode, this plasma bombards the substrate surface, breaking the chemical bonds of the semiconductor in the substrate's patterned area. Volatile substances are generated by reacting with the etching gas, leaving the substrate in gaseous form and being pumped out of the vacuum line.

[0007] The air injection structure used in the existing plasma etcher can only achieve air intake in a single direction, has a relatively simple function, and has poor plasma concentration uniformity in the chamber and poor etching uniformity.

[0008] Therefore, how to broaden the function of the gas jet structure and improve the uniformity of plasma etching is a technical problem that those skilled in the art currently need to solve.

[0009] Application Contents

[0010] In view of this, the object of the present application is to provide a gas injection structure to broaden the function of the gas injection structure and improve the plasma etching uniformity.

[0011] In order to achieve the above objectives, this application provides the following technical solutions:

[0012] An air jet structure, comprising:

[0013] An air inlet sleeve capable of communicating with an air source;

[0014] An air injection component is detachably connected to the air intake sleeve, and an accommodating space is formed after the air injection component and the air intake sleeve are connected;

[0015] An air path switching component is movably disposed in the accommodation space;

[0016] The gas circuit switching component is provided with a gas through-hole group, and the jet component is provided with a jet hole group. The number of the gas through-hole groups and the jet hole groups is multiple, and each group of the jet hole groups corresponds to a group of the gas through-hole groups. The jet directions of each group of the jet hole groups are different. Based on the movable setting of the gas circuit switching component, the conduction between the jet hole group and the corresponding gas through-hole group can be switched to the conduction between another jet hole group and another gas through-hole group.

[0017] Optionally, in the above-mentioned jet structure, the air path switching component is rotatably disposed in the accommodating space.

[0018] Optionally, in the above-mentioned jet structure, the air path switching component includes a switching shaft and an airway switching disk, the axis of the switching shaft is arranged perpendicular to the airway switching disk, and the gas through hole group is arranged on the airway switching disk.

[0019] Optionally, in the above-mentioned jet structure, the number of the jet hole groups is three, namely a first jet hole group, a second jet hole group and a third jet hole group;

[0020] There are three gas through hole groups, namely a first gas through hole group, a second gas through hole group and a third gas through hole group, wherein the first gas through hole group, the second gas through hole group and the third gas through hole group correspond to the first gas injection hole group, the second gas injection hole group and the third gas injection hole group respectively;

[0021] When the gas circuit switching component rotates to a first preset position, the first gas through hole group and the first injection hole group are connected; when the gas circuit switching component rotates to a second preset position, the second gas through hole group and the second injection hole group are connected; when the gas circuit switching component rotates to a third preset position, the third gas through hole group and the third injection hole group are connected.

[0022] Optionally, in the above-mentioned jet structure, the jet direction of the first jet hole group is vertically downward, the jet direction of the second jet hole group is inclined downward relative to the vertical direction, and the jet direction of the third jet hole group is perpendicular to the vertical direction.

[0023] Optionally, in the above-mentioned jet structure, the first jet hole group is arranged on a side of the second jet hole group close to the center of the jet element, and the third jet hole group is arranged on a side of the second jet hole group away from the center of the jet element;

[0024] The first gas through hole group is arranged on a side of the second gas through hole group close to the center of the gas channel switching disk, and the third gas through hole group is arranged on a side of the second gas through hole group away from the center of the gas channel switching disk.

[0025] Optionally, in the above-mentioned jet structure, the first jet hole group includes a plurality of downward jet holes, the second jet hole group includes a plurality of oblique jet holes, and the third jet hole group includes a plurality of lateral jet holes, wherein the number of the downward jet holes, the oblique jet holes, and the lateral jet holes are equal, and the plurality of downward jet holes, the plurality of oblique jet holes, and the plurality of lateral jet holes are all distributed in a circular array with the center of the jet element as the array center;

[0026] The first gas hole group includes a plurality of downward gas holes, the second gas hole group includes a plurality of downward oblique gas holes, and the third gas hole group includes a plurality of side gas holes, wherein the number of the downward gas holes, the downward oblique gas holes and the side gas holes are equal, and the plurality of downward gas holes, the downward oblique gas holes and the side gas holes are distributed in a circular array with the center of the airway switching disk as the array center.

[0027] Optionally, in the above-mentioned jet structure, the centers of the corresponding downward jet holes, oblique downward jet holes and lateral jet holes are all located on the same radial straight line of the jet component, and on the circumference of the airway switching disk, the corresponding downward gas holes, oblique downward gas holes and lateral gas holes are all offset from each other.

[0028] Optionally, in the above-mentioned jet structure, in the circumferential direction of the jet component, the corresponding downward jet holes, oblique downward jet holes and lateral jet holes are offset from each other, and the centers of the corresponding downward gas holes, oblique downward gas holes and lateral gas holes are all located on the same radial straight line of the airway switching disk.

[0029] Optionally, in the above-mentioned jet structure, the axis of the downward jet hole is parallel to the vertical direction, the axis of the oblique downward jet hole is inclined to the vertical direction, and the axis of the lateral jet hole includes a first axis portion parallel to the vertical direction and a second axis portion perpendicular to the first axis portion.

[0030] Optionally, in the above-mentioned jet structure, the airway switching disk is provided with a combined airway groove, the combined airway groove is formed by extending radially along the airway switching disk, and each downward jet hole has an oblique downward jet hole and a lateral jet hole arranged on the same radial straight line with its center;

[0031] Wherein, when the air path switching component moves to the fourth preset position, the combined air path groove is simultaneously connected to the first jet hole group and the second jet hole group; or, when the air path switching component moves to the fourth preset position, the combined air path groove is simultaneously connected to the first jet hole group, the second jet hole group and the third jet hole group; or, when the air path switching component moves to the fourth preset position, the combined air path groove is simultaneously connected to the second jet hole group and the third jet hole group; or, when the air path switching component moves to the fourth preset position, the combined air path groove is simultaneously connected to the first jet hole group and the third jet hole group.

[0032] Optionally, in the above-mentioned jet structure, the length of the combined air channel groove is greater than the radial distance between the downward jet hole and the downward oblique jet hole;

[0033] Alternatively, the length of the combined airway groove is greater than the distance between the downward air jet hole and the lateral air jet hole;

[0034] Alternatively, the length of the combined airway groove is greater than the distance between the oblique downward air jet hole and the lateral air jet hole;

[0035] Alternatively, in the circumferential direction of the jet element, the corresponding downward jet holes, oblique downward jet holes, and lateral jet holes are offset from each other, the length of the combined air duct groove is greater than the radial distance between the downward jet hole and the lateral jet hole, and the combined air duct groove extends on a line connecting the centers of the downward jet hole and the lateral jet hole.

[0036] Optionally, in the above-mentioned air injection structure, the air path switching component further comprises an air uniforming disk provided on the switching shaft, and a plurality of air uniforming holes are evenly distributed on the air uniforming disk, and the shapes and sizes of the plurality of air uniforming holes are equal.

[0037] Optionally, in the above-mentioned jet structure, the jet structure further includes a rotary driving member for driving the gas path switching member to rotate, and the gas path switching member is connected to the rotary output shaft of the rotary driving member through a coupling.

[0038] Optionally, in the above-mentioned air injection structure, the air intake pipe sleeve is provided with an air intake pipeline that can be communicated with an air source.

[0039] Optionally, the above-mentioned jet structure further comprises a controller electrically connected to the rotary drive member, so as to control the jet hole group to perform periodic pulse jet in multiple directions through the controller.

[0040] Optionally, in the above-mentioned jet structure, a magnetic fluid seal or a sealing ring seal is used between the air path switching component and the air intake pipe sleeve.

[0041] A plasma etching machine comprises the above-mentioned jet injection structure.

[0042] Optionally, in the above plasma etcher, it further includes a plasma reaction chamber, a vacuum pump, a pressure control valve, an excitation radio frequency power supply, a plasma coupling coil, a bias radio frequency power supply and a bias electrode;

[0043] The vacuum pump is connected to the plasma reaction chamber, the pressure control valve is arranged on the connecting pipe between the plasma reaction chamber and the vacuum pump, the plasma coupling coil is electrically connected to the excitation RF power supply, the bias RF power supply is electrically connected to the bias electrode, and the plasma coupling coil and the bias electrode are located in the plasma reaction chamber.

[0044] Optionally, in the above plasma etcher, a ceramic dielectric window and a shielding cover are further included;

[0045] The ceramic dielectric window is arranged in the plasma reaction chamber, the gas injection structure is arranged in the ceramic dielectric window, and the shielding cover is arranged outside the plasma reaction chamber.

[0046] Optionally, in the above plasma etcher, a magnetic fluid seal or a sealing ring seal is used between the jet structure and the ceramic dielectric window.

[0047] When the jet structure provided by the present application is used, since the jet component is detachably connected to the intake pipe sleeve, and a receiving space is formed after the jet component and the intake pipe sleeve are connected, the gas circuit switching component is movably arranged in the receiving space, the gas circuit switching component is provided with a gas through-hole group, and the jet component is provided with a jet hole group. Based on the movable arrangement of the gas circuit switching component, the conduction between the jet hole group and its corresponding gas through-hole group can be switched to the conduction between another jet hole group and another gas through-hole group. Therefore, the intake pipe sleeve is connected to the gas source, and the air flow flows through the receiving space, the gas through-hole group and the jet hole group in sequence, and the air intake is achieved through the jet hole group. Since the number of the gas through-hole group and the jet hole group is multiple, and each jet hole group corresponds to a gas through-hole group, The injection direction of each jet hole group is different. Based on the movable setting of the gas path switching member, the conduction between the jet hole group and the corresponding gas through hole group can be switched to the conduction between another jet hole group and another gas through hole group. Therefore, the jet structure can realize jetting in multiple directions and realize switching of multiple injection directions based on the movable setting of the gas path switching member. For example, in a specific embodiment of the present application, the jet hole groups are set to three groups, and the three jet hole groups are respectively the first jet hole group, the second jet hole group and the third jet hole group. The injection directions of the first jet hole group, the second jet hole group and the third jet hole group are respectively vertically downward, obliquely downward and perpendicular to the vertical direction. The gas through hole groups are set to three groups, and the three gas through hole groups are respectively The hole groups are respectively a first gas through hole group, a second gas through hole group and a third gas through hole group, and the first gas through hole group, the second gas through hole group and the third gas through hole group correspond to the first jet hole group, the second jet hole group and the third jet hole group respectively. Based on the movable setting of the gas path switching member, when the gas path switching member is able to move to the first preset position, the first gas through hole group and the first jet hole group are connected, and the airflow injection direction of the injection structure is vertically downward. When the gas path switching member moves to the second preset position, the second gas through hole group and the second jet hole group are connected, and the airflow injection direction of the injection structure is inclined downward. When the gas path switching member moves to the third preset position, the third gas through hole group and the third jet hole group are connected. The airflow jet direction of the jet structure is perpendicular to the vertical direction. Therefore, the application of the jet structure to the plasma etcher can not only meet the downward jetting requirements of the etching process, but also meet the lateral air intake or inclined downward air intake during plasma cleaning of the chamber, thereby broadening the function of the jet structure. At the same time, based on the movable setting of the gas path switching member, the conduction between the jet hole group and its corresponding gas through hole group can be switched to the conduction between another jet hole group and another gas through hole group. Therefore, with the continuous movement of the gas path switching member, the jet structure can also realize periodic jetting in multiple directions, thereby improving the uniformity of plasma concentration in the chamber and improving the uniformity of plasma etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0049] FIG1 is a schematic cross-sectional view of a first gas injection hole group and a first gas through hole group provided in an embodiment of the present application when they are aligned and connected;

[0050] FIG2 is a schematic cross-sectional view of a second gas injection hole group and a second gas through hole group provided in an embodiment of the present application when they are aligned and connected;

[0051] FIG3 is a schematic cross-sectional view of a third gas injection hole group and a third gas through hole group provided in an embodiment of the present application when they are aligned and connected;

[0052] FIG4 is a schematic cross-sectional view of a combined airway groove provided in an embodiment of the present application when the combined airway groove is connected to the first air jet hole group and the second air jet hole group at the same time;

[0053] FIG5 is a schematic diagram of a top view of the structure of an air injection component provided in an embodiment of the present application;

[0054] FIG6 is a schematic structural diagram of a gas path switching component provided in an embodiment of the present application;

[0055] FIG7 is a schematic diagram of a hole layout on an air injection component provided in an embodiment of the present application;

[0056] FIG8 is a schematic diagram of a hole layout on an airway switching disk provided in an embodiment of the present application;

[0057] FIG9 is a schematic top view of a structure in which a first gas injection hole group and a first gas through hole group are aligned and connected, provided by an embodiment of the present application;

[0058] FIG10 is a schematic top view of a second gas injection hole group and a second gas through hole group provided in an embodiment of the present application when they are aligned and connected;

[0059] FIG11 is a schematic top view of a structure in which a third gas injection hole group and a third gas through hole group are aligned and connected to each other, provided by an embodiment of the present application;

[0060] FIG12 is a schematic top view of the structure of a combined airway groove provided by an embodiment of the present application when the combined airway groove is connected to the first air jet hole group and the second air jet hole group at the same time;

[0061] FIG13 is a schematic diagram of a periodic pulse jet flow rate of an jet structure provided by an embodiment of the present application switching between a first jet hole group and a second jet hole group;

[0062] FIG14 is a schematic diagram of periodic pulse jet flow rate when an jet structure provided by an embodiment of the present application switches between a first jet hole group, a second jet hole group, and a third jet hole group;

[0063] FIG15 is a schematic diagram of periodic jet flow rates of an jet structure provided by an embodiment of the present application, wherein jets are sequentially switched between jets from the first jet hole group, jets from the second jet hole group, and jets from the third jet hole group, and jets are simultaneously jetted from the first jet hole group and the second jet hole group;

[0064] FIG16 is a schematic diagram of a working process of an air injection structure provided in an embodiment of the present application;

[0065] FIG17 is a schematic structural diagram of an air jet structure provided in an embodiment of the present application applied to a plasma etcher.

[0066] Among them, 100 is the air inlet sleeve, 101 is the first sealing ring, 102 is the air inlet pipeline, 200 is the jet component, 201 is the first jet hole group, 202 is the second jet hole group, 203 is the third jet hole group, 300 is the air path switching component, 301 is the switching shaft, 302 is the air path switching disk, 3021 is the first gas through hole group, 3022 is the second gas through hole group, 3023 is the third gas through hole group, 3024 is the combined air path groove, 303 is the gas uniforming disk, 400 is the rotary drive component, 401 is the coupling, 500 is the plasma reaction chamber, 501 is the plasma coupling coil, 502 is the bias electrode, 503 is the ceramic dielectric window, 5031 is the second sealing ring, 504 is the shielding cover, 600 is the vacuum pump, 700 is the pressure control valve, 800 is the excitation RF power supply, and 900 is the bias RF power supply. DETAILED DESCRIPTION

[0067] In view of this, the core of the present application is to provide a jet structure to broaden the function of the jet structure and improve the plasma etching uniformity.

[0068] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0069] As shown in FIG. 1 to FIG. 17 , an embodiment of the present application discloses an air injection structure, which is characterized by including an air intake sleeve 100 , an air injection component 200 and an air path switching component 300 .

[0070] Among them, the intake pipe sleeve 100 can be connected to the air source; the jet component 200 is detachably connected to the intake pipe sleeve 100, and the jet component 200 and the intake pipe sleeve 100 are connected to form an accommodating space; the air circuit switching component 300 is movably arranged in the accommodating space; among them, the air circuit switching component 300 is provided with a gas through hole group, and the jet component 200 is provided with an air jet hole group. The number of gas through hole groups and air jet hole groups is multiple, and each group of air jet hole groups corresponds to a group of gas through hole groups. The injection direction of each group of air jet hole groups is different. Based on the movable setting of the air circuit switching component 300, the conduction between the air jet hole group and its corresponding gas through hole group can be switched to the conduction between another air jet hole group and another gas through hole group.

[0071] When the jet structure provided by the present application is used, since the jet component 200 is detachably connected to the air intake sleeve 100, and a receiving space is formed after the jet component 200 and the air intake sleeve 100 are connected, the gas path switching component 300 is movably arranged in the receiving space, the gas path switching component 300 is provided with a gas through hole group, and the jet component 200 is provided with a jet hole group. Based on the movable arrangement of the gas path switching component 300, the conduction between the jet hole group and its corresponding gas through hole group can be switched to the conduction between another jet hole group and another gas through hole group. Therefore, the air intake sleeve 100 is connected to the air source, and the air flow flows through the receiving space, the gas through hole group and the jet hole group in sequence, and the air intake is achieved through the jet hole group. The number of air hole groups is multiple, and each group of air jet groups corresponds to a group of gas through-hole groups. The injection direction of each air jet group is different. Based on the movable setting of the air path switching member 300, the conduction between the air jet group and the corresponding gas through-hole group can be switched to the conduction between another air jet group and another gas through-hole group. Therefore, the jet structure can realize jetting in multiple directions and realize switching of multiple injection directions based on the movable setting of the air path switching member 300. For example, in a specific embodiment of the present application, the air jet groups are set to three groups, and the three air jet groups are respectively the first air jet group 201, the second air jet group 202 and the third air jet group 203. The first air jet group 201, the second air jet group 202 and the third air jet group 203 are respectively the first air jet group 201 and the second air jet group 203. The spraying directions of the group 202 and the third gas hole group 203 are vertically downward, obliquely downward and perpendicular to the vertical direction respectively. The gas through hole groups are set to three groups, and the three gas through hole groups are respectively the first gas through hole group 3021, the second gas through hole group 3022 and the third gas through hole group 3023. The first gas through hole group 3021, the second gas through hole group 3022 and the third gas through hole group 3023 correspond to the first gas hole group 201, the second gas hole group 202 and the third gas hole group 203 respectively. Based on the movable setting of the gas path switching member 300, when the gas path switching member 300 can move to the first preset position, the first gas through hole group 3021 and the first gas hole group 201 guide The airflow injection direction of the jet structure is vertically downward. When the gas path switching member 300 moves to the second preset position, the second gas through hole group 3022 and the second jet hole group 202 are connected. The airflow injection direction of the jet structure is obliquely downward. When the gas path switching member 300 moves to the third preset position, the third gas through hole group 3023 and the third jet hole group 203 are connected. The airflow injection direction of the jet structure is perpendicular to the vertical direction. Therefore, the application of this jet structure to a plasma etcher can not only meet the downward air injection requirements of the etching process, but also meet the lateral air intake or oblique downward air intake during plasma cleaning of the chamber, thereby broadening the function of the jet structure.At the same time, due to the movable arrangement of the gas path switching member 300, the connection between the gas injection hole group and its corresponding gas through hole group can be switched to the connection between another gas injection hole group and another gas through hole group. Therefore, with the continuous movement of the gas path switching member 300, the gas injection structure can also achieve periodic gas injection in multiple directions, improving the uniformity of the plasma concentration in the chamber and thus improving the uniformity of plasma etching.

[0072] It should be noted that the above-mentioned gas circuit switching component 300 can perform reciprocating linear motion or rotation and other types of motion. As long as the type of motion can meet the use requirements, it falls within the protection scope of this application; optionally, in a specific embodiment of the present application, the gas circuit switching component 300 is rotatably arranged in the accommodating space, so that the gas circuit switching component 300 can realize the switching of multiple gas injection directions through rotation.

[0073] As shown in Figure 6, the air path switching component 300 includes a switching shaft 301 and an airway switching disk 302. The axis of the switching shaft 301 is arranged perpendicular to the airway switching disk 302, and the gas hole group is arranged on the airway switching disk 302 so that the airway switching disk 302 rotates with the switching shaft 301. Based on the rotation of the airway switching disk 302, the gas hole group on the airway switching disk 302 also rotates accordingly, thereby realizing the switching of multiple gas injection directions.

[0074] This application does not impose any specific restrictions on the number and arrangement of the above-mentioned jet hole groups and gas through hole groups. As long as the number and arrangement can meet the use requirements, they are within the protection scope of this application.

[0075] Optionally, the embodiment of the present application provides three groups of jet hole groups, namely, a first jet hole group 201, a second jet hole group 202, and a third jet hole group 203. The number of gas through hole groups is three groups, namely, a first gas through hole group 3021, a second gas through hole group 3022, and a third gas through hole group 3023. The first gas through hole group 3021, the second gas through hole group 3022, and the third gas through hole group 3023 correspond to the first jet hole group 201, the second jet hole group 202, and the third jet hole group 203, respectively. When the gas path switching component 300 rotates to the first preset position, the first gas through hole group 3021 and the first jet hole group 201 are connected; when the gas path switching component 300 rotates to the second preset position, the second gas through hole group 3022 and the second jet hole group 202 are connected; when the gas path switching component 300 rotates to the third preset position, the third gas through hole group 3023 and the third jet hole group 203 are connected. Based on the continuous rotation of the gas path switching component 300, the jet structure can switch among jetting from the first jet hole group 201, jetting from the second jet hole group 202 and jetting from the third jet hole group 203.

[0076] It should be understood that the present application does not limit the specific injection direction of each of the above-mentioned jet hole groups. In actual applications, the injection direction of the jet hole group can be adaptively adjusted according to actual injection requirements. As long as the injection direction can meet the use requirements, it falls within the scope of protection of this application.

[0077] Optionally, the injection direction of the first jet hole group 201 provided in the embodiment of the present application is vertically downward, the injection direction of the second jet hole group 202 is inclined downward to the vertical direction, and the injection direction of the third jet hole group 203 is perpendicular to the vertical direction, so as to facilitate the application of the jet structure to the plasma etcher to realize the switching of three air intake modes: downward air intake, oblique downward air intake and lateral air intake. Based on the continuous rotation of the gas path switching component 300, the jet structure realizes pulse jet that switches in sequence in the three directions of downward, oblique downward and lateral directions as shown in Figure 14.

[0078] In addition, the above-mentioned first jet hole group 201 is arranged on the side of the second jet hole group 202 close to the center of the jet element 200, and the third jet hole group 203 is arranged on the side of the second jet hole group 202 away from the center of the jet element 200; the first gas through hole group 3021 is arranged on the side of the second gas through hole group 3022 close to the center of the gas channel switching disk 302, and the third gas through hole group 3023 is arranged on the side of the second gas through hole group 3022 away from the center of the gas channel switching disk 302, that is, the first jet hole group 201 is arranged on the inner side of the second jet hole group 202, and the third jet hole group 203 is arranged on the outer side of the second jet hole group 202, so that the first jet hole group 201 can spray in a vertical downward direction, the second jet hole group 202 can spray in an oblique downward direction, and the third jet hole group 203 can spray laterally. Even if the three gases are sprayed at the same time, there will be no interference between the various injection gas paths.

[0079] The first jet hole group 201 includes a plurality of downward jet holes, the second jet hole group 202 includes a plurality of downward oblique jet holes, and the third jet hole group 203 includes a plurality of lateral jet holes, wherein the number of downward jet holes, downward oblique jet holes, and lateral jet holes is equal; the first gas through hole group 3021 includes a plurality of downward gas through holes, the second gas through hole group 3022 includes a plurality of downward oblique gas through holes, and the third gas through hole group 3023 includes a plurality of lateral gas through holes, wherein the number of downward gas through holes, downward oblique gas through holes, and lateral gas through holes is equal, so that each downward jet hole corresponds to one downward gas through hole, each downward oblique jet hole corresponds to one downward oblique gas through hole, and each lateral jet hole corresponds to one lateral gas through hole.

[0080] It should be understood that the above-mentioned multiple downward jet holes, multiple oblique downward jet holes and multiple lateral jet holes can be evenly distributed in the circumferential direction of the jet component 200 or distributed in an arithmetic progression distance, and the above-mentioned multiple downward gas through holes, oblique downward gas through holes and lateral gas through holes can be evenly distributed in the circumferential direction of the airway switching disk 302 or distributed in an arithmetic progression distance, etc. In actual applications, the number and distribution of the downward jet holes, oblique downward jet holes and lateral jet holes, as well as the number and distribution of the downward gas through holes, oblique downward gas through holes and lateral gas through holes can be adaptively adjusted according to actual needs.

[0081] Optionally, the multiple downward jet holes, multiple oblique downward jet holes and multiple lateral jet holes provided in the embodiment of the present application are all distributed in a circular array with the center of the jet component 200 as the array center; the multiple downward gas holes, oblique downward gas holes and lateral gas holes are all distributed in a circular array with the center of the airway switching disk 302 as the array center, so that the jet structure can perform periodic airflow direction switching based on the rotation of the airway switching component 300.

[0082] For example, in a specific embodiment of the present application, the number of the downward air jet holes, the oblique downward air jet holes, and the lateral air jet holes are all six, and the angles between adjacent downward air jet holes, adjacent oblique downward air jet holes, and adjacent lateral air jet holes are all 60°; the number of the downward gas through holes, the oblique downward gas through holes, and the lateral gas through holes are also six, and the angles between adjacent downward gas through holes, adjacent oblique downward gas through holes, and adjacent lateral gas through holes are all 60°.

[0083] In addition, the centers of the corresponding downward jet holes, oblique downward jet holes and lateral jet holes are all located on the same radial straight line of the jet component 200. In the circumferential direction of the airway switching disk 302, the corresponding downward gas through holes, oblique downward gas through holes and lateral gas through holes are all offset from each other, so that when the downward gas through hole and the downward jet hole are aligned and connected, the oblique downward jet hole and its corresponding downward oblique gas through hole will not be connected, and the lateral jet hole and its corresponding lateral gas through hole will not be connected, and the jet structure only sprays airflow in the downward direction; when the oblique downward gas through hole and the oblique downward gas through hole are aligned and connected, the oblique downward gas through hole and its corresponding downward oblique gas through hole will not be connected, and the jet structure only sprays airflow in the downward direction; when the oblique downward gas through hole and the oblique downward gas through hole are aligned and connected, the oblique downward gas through hole and its corresponding downward oblique gas through hole will not be connected. When the jet holes are aligned and connected, the downward jet hole and its corresponding downward gas through hole will not be connected, and the side jet hole and its corresponding side gas through hole will not be connected. The jet structure only sprays airflow in the oblique downward direction; when the downward gas through hole and the downward jet hole are aligned and connected, the oblique downward jet hole and its corresponding oblique downward gas through hole will not be connected, and the side jet hole and its corresponding side gas through hole will not be connected. The jet structure only sprays airflow in the oblique downward direction, thereby enabling the jet structure to achieve jet switching in three directions based on the rotation of the gas path switching component 300.

[0084] Of course, the corresponding downward jet holes, oblique downward jet holes and lateral jet holes can also be offset from each other in the circumferential direction of the jet component 200, and the centers of the corresponding downward gas holes, oblique downward gas holes and lateral gas holes are all located on the same radial straight line of the airway switching disk 302, which can also enable the jet structure to achieve jet switching in three directions based on the rotation of the airway switching component 300.

[0085] The axis of the downward jet hole provided in the present application can be a straight line or a combination of a curve and a straight line, as long as it is a structure that can eject air vertically downward. Optionally, the axis of the downward jet hole provided in the embodiment of the present application is parallel to the vertical direction, that is, the downward jet hole is a straight hole, so as to reduce airflow resistance and facilitate jetting in the downward direction; similarly, the axes of the oblique jet hole and the side jet hole can both be straight lines or a combination of curved and straight lines, as long as the jet direction of the oblique jet hole is inclined to the vertical direction and the jet direction of the side jet hole is perpendicular to the vertical direction. Optionally, the axis of the oblique jet hole is inclined to the vertical direction, that is, the oblique jet hole is a straight hole inclined to the vertical direction, and the axis of the side jet hole includes a first axis portion parallel to the vertical direction and a second axis portion perpendicular to the first axis portion, that is, the axis of the side jet hole is L-shaped, so as to reduce airflow loss and facilitate gas injection.

[0086] In addition, the airway switching disk 302 is provided with a combined airway groove 3024, which is formed by extending radially along the airway switching disk 302. Each directly below the jet hole has an oblique jet hole and a lateral jet hole arranged on the same radial straight line with its center. That is to say, the centers of the corresponding directly below the jet hole, the oblique jet hole and the lateral jet hole are all arranged along a radial straight line of the jet element 200, and the extension trajectory of the combined airway groove 3024 is also along the radial direction of the airway switching disk 302. The jet element 200 and the airway switching disk 302 are coaxially arranged. Alternatively, the length of the combined air duct groove 3024 is long enough, and when the air path switching member 300 moves to the fourth preset position, the combined air duct groove 3024 is simultaneously connected to the first air jet group 201 and the second air jet group 202, thereby realizing combined air jetting in the downward direction and the oblique downward direction; or, when the air path switching member 300 moves to the fourth preset position, the combined air duct groove 3024 is simultaneously connected to the first air jet group 201, the second air jet group 202 and the third air jet group 203, thereby realizing combined air jetting in the downward direction, the oblique downward direction and the combined direction.

[0087] Specifically, the length of the combined air duct groove 3024 is greater than the radial distance between the downward jet hole and the oblique downward jet hole, so that the combined air duct groove 3024 can be simultaneously connected to the first jet hole group 201 and the second jet hole group 202, thereby realizing combined air jetting in the downward and oblique downward directions; alternatively, the length of the combined air duct groove 3024 is greater than the distance between the downward jet hole and the lateral jet hole, so that the combined air duct groove 3024 can be simultaneously connected to the first jet hole group 201, the second jet hole group 202, and the third jet hole group 203, thereby realizing combined air jetting in the downward, oblique downward, and combined directions.

[0088] It should be noted that the combined air duct groove 3024 is not limited to the above two forms. The combined air duct groove 3024 can also be moved radially toward the side away from the center of the circle, so that the length of the combined air duct groove 3024 is greater than the radial distance between the oblique jet hole and the lateral jet hole, and the combined air duct groove 3024 is simultaneously connected to the second jet hole group 202 and the third jet hole group 203, so that the second jet hole group 202 and the third jet hole group 203 can simultaneously eject air. Alternatively, in the circumferential direction of the jet element, the corresponding downward jet hole, oblique jet hole, and lateral jet hole are offset from each other, the length of the combined air duct groove is greater than the radial distance between the downward jet hole and the lateral jet hole, and the combined air duct groove extends on the line connecting the centers of the downward jet hole and the lateral jet hole, so that the combined air duct groove 3024 connects the first jet hole group 201 and the third jet hole group 203, so that the first jet hole group 201 and the third jet hole group 203 can simultaneously eject air.

[0089] Furthermore, the above-mentioned gas path switching component 300 also includes a gas uniforming disk 303 arranged on the switching shaft 301, and multiple gas uniforming holes are evenly distributed on the gas uniforming disk 303. The shapes and sizes of the multiple gas uniforming holes are equal, so that the air flow can pass through the gas uniforming disk 303 evenly, thereby improving the uniformity of the plasma concentration in the plasma etcher chamber, and further improving the uniformity of plasma etching.

[0090] In addition, the above-mentioned jet structure also includes a rotary drive member 400 for driving the gas path switching member 300 to rotate. The gas path switching member 300 is connected to the rotating output shaft of the rotary drive member 400 through a coupling 401 to drive the gas path switching member 300 to rotate through the rotary drive member 400.

[0091] When the rotary drive member 400 drives the gas path switching member 300 to swing slightly in the angle range between the directly downward gas through hole and the obliquely downward gas through hole, and the combined gas channel groove 3024 is arranged outside the angle range, the jet structure can realize periodic pulse jets in the directly downward direction and the obliquely downward direction as shown in Figure 13; when the rotary drive member 400 drives the gas path switching member 300 to swing in the maximum angle range formed by the directly downward gas through hole, the obliquely downward gas through hole and the lateral gas through hole, and the combined gas channel groove 3024 is arranged outside the maximum angle range, the jet structure can realize periodic pulse jets in the directly downward direction, the obliquely downward direction and the lateral direction as shown in Figure 14; of course, it is also possible to only operate on the gas path switching disk 302 A downward gas through hole, an oblique downward gas through hole and a lateral gas through hole are provided, but a combined airway groove 3024 is not provided. When the rotating driving member 400 drives the airway switching member 300 to rotate continuously, the jet structure can also realize periodic pulse jets in which the downward direction, the oblique downward direction and the lateral direction are switched in sequence as shown in FIG14 ; in addition, when the downward gas through hole, the oblique downward gas through hole, the lateral gas through hole and the combined airway groove 3024 are provided on the airway switching disk 302 at the same time, as the rotating driving member 400 drives the airway switching member 300 to rotate continuously, the jet structure can realize periodic pulse jets in which the downward direction, the oblique downward direction, the lateral direction and the downward direction are jetted simultaneously and switched in sequence as shown in FIG15 .

[0092] The air intake pipe sleeve 100 provided in the present application is provided with an air intake pipeline 102 that can be communicated with an air source, so that the air source is introduced into the air injection structure through the air intake pipeline 102 to realize air injection.

[0093] In addition, the above-mentioned jet structure also includes a controller electrically connected to the rotating drive member 400, so as to control the jet hole group to perform periodic pulse jet in multiple directions through the controller, and select a suitable jet mode according to the relationship between the rotation angle and the jet type pre-entered in the controller.

[0094] The above-mentioned air circuit switching component 300 and the intake pipe sleeve 100 are sealed by magnetic fluid sealing or sealing ring sealing. As long as the sealing method can meet the sealing requirements, it falls within the protection scope of this application; optionally, a first sealing ring 101 is provided between the air circuit switching component 300 and the intake pipe sleeve 100 provided in the embodiment of the present application for sealing.

[0095] In addition, the present application also discloses a plasma etcher, including the jet structure as described above, and thus has all the technical effects of the jet structure described above, which will not be described in detail herein.

[0096] Furthermore, the plasma etcher further comprises a plasma reaction chamber 500, a vacuum pump 600, a pressure control valve 700, an excitation RF power supply 800, a plasma coupling coil 501, a bias RF power supply 900 and a bias electrode 502; wherein the vacuum pump 600 is in communication with the plasma reaction chamber 500, the pressure control valve 700 is arranged on the connecting pipe between the plasma reaction chamber 500 and the vacuum pump 600, the plasma coupling coil 501 is electrically connected to the excitation RF power supply 800, the bias RF power supply 900 is electrically connected to the bias electrode 502, and the plasma coupling coil and the bias electrode 501 are electrically connected. 2 is located in the plasma reaction chamber, and the plasma reaction chamber 500 is evacuated by a vacuum pump 600. Process gas is injected into the plasma reaction chamber 500 through the jet structure. Under the vacuum low pressure, the radio frequency generated by the bias radio frequency power supply 900 is output to the annular plasma coupling coil 501. Under the action of the plasma coupling coil 501, plasma is generated. The bias electrode 502 provides a bias voltage to accelerate the plasma to bombard the substrate, so that the chemical bonds of the semiconductor in the pattern area of ​​the substrate are broken, and volatile substances are generated by reacting with the etching gas. The volatile substances are separated from the substrate in the form of gas and are extracted from the vacuum pipeline.

[0097] In addition, the above-mentioned plasma etcher also includes a ceramic dielectric window 503 and a shielding cover 504; wherein, the ceramic dielectric window 503 is arranged in the plasma reaction chamber, and the jet structure is arranged on the ceramic dielectric window 503, so that the ceramic dielectric window 503 is reused to support the jet structure, and there is no need to set up additional supporting parts, thereby reducing the number of parts and reducing costs; the shielding cover 504 is arranged on the outside of the plasma reaction chamber to play a shielding role.

[0098] The above-mentioned jet structure and the ceramic dielectric window 503 can also be sealed with magnetic fluid or a sealing ring. As long as the sealing method can meet the use requirements, it falls within the protection scope of this application; optionally, a second sealing ring 5031 is provided between the jet structure provided in the embodiment of the present application and the ceramic dielectric window 503 for sealing.

[0099] The terms "first," "second," and so on in the specification, claims, and drawings of this application are used to distinguish between different items, not to describe a specific order. Furthermore, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements and may include steps or elements that are not listed.

[0100] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A jet structure, characterized in that: include: An air inlet sleeve capable of being connected to an air source; An injection member is detachably connected to the air intake sleeve, and a receiving space is formed after the injection member and the air intake sleeve are connected; An air path switching component is movably disposed in the accommodation space; Wherein, the gas circuit switching component is provided with a gas through hole group, and the jet component is provided with a jet hole group, the number of the gas through hole groups and the jet hole groups are both multiple groups, and each group of the jet hole groups corresponds to a group of the gas through hole groups, and the jet direction of each group of the jet hole groups is different. Based on the movable setting of the gas circuit switching component, the conduction between the jet hole group and the corresponding gas through hole group can be switched to the conduction between another jet hole group and another gas through hole group.

2. The jet structure according to claim 1, characterized in that: The gas path switching component is rotatably disposed in the accommodating space.

3. The jet structure according to claim 2, characterized in that: The gas path switching component includes a switching shaft and an airway switching disk. The axis of the switching shaft is arranged perpendicular to the airway switching disk, and the gas through hole group is arranged on the airway switching disk.

4. The jet structure according to claim 3, characterized in that: The number of the jet hole groups is three, namely a first jet hole group, a second jet hole group and a third jet hole group; The number of the gas through hole groups is three, namely a first gas through hole group, a second gas through hole group and a third gas through hole group, wherein the first gas through hole group, the second gas through hole group and the third gas through hole group correspond to the first gas injection hole group, the second gas injection hole group and the third gas injection hole group respectively; Wherein, when the gas circuit switching component rotates to the first preset position, the first gas through hole group and the first injection hole group are connected; when the gas circuit switching component rotates to the second preset position, the second gas through hole group and the second injection hole group are connected; when the gas circuit switching component rotates to the third preset position, the third gas through hole group and the third injection hole group are connected.

5. The jet structure according to claim 4, characterized in that: The jet direction of the first jet hole group is vertically downward, the jet direction of the second jet hole group is inclined downward to the vertical direction, and the jet direction of the third jet hole group is perpendicular to the vertical direction.

6. The jet structure according to claim 5, characterized in that: The first jet hole group is arranged on a side of the second jet hole group close to the center of the jet element, and the third jet hole group is arranged on a side of the second jet hole group away from the center of the jet element; The first gas through hole group is arranged on a side of the second gas through hole group close to the center of the gas channel switching disk, and the third gas through hole group is arranged on a side of the second gas through hole group away from the center of the gas channel switching disk.

7. The jet structure according to claim 5, characterized in that: The first jet hole group includes a plurality of directly downward jet holes, the second jet hole group includes a plurality of obliquely downward jet holes, and the third jet hole group includes a plurality of lateral jet holes, wherein the number of the directly downward jet holes, the obliquely downward jet holes, and the lateral jet holes are all equal, and the plurality of directly downward jet holes, the plurality of obliquely downward jet holes, and the plurality of lateral jet holes are all distributed in a circular array with the center of the jet element as the array center; The first gas hole group includes a plurality of downward gas holes, the second gas hole group includes a plurality of downward slanting gas holes, and the third gas hole group includes a plurality of lateral gas holes, wherein the number of the downward gas holes, the downward slanting gas holes and the lateral gas holes are equal, and the plurality of downward gas holes, the downward slanting gas holes and the lateral gas holes are distributed in a circular array with the center of the airway switching disk as the array center.

8. The jetting structure according to claim 7, characterized in that: The centers of the corresponding downward jet holes, oblique downward jet holes and lateral jet holes are all located on the same radial straight line of the jet component, and on the circumference of the airway switching disk, the corresponding downward gas through holes, oblique downward gas through holes and lateral gas through holes are offset from each other.

9. The jet structure according to claim 7, characterized in that: On the circumference of the jet component, the corresponding downward jet holes, oblique downward jet holes and lateral jet holes are all offset from each other, and the centers of the corresponding downward gas through holes, oblique downward gas through holes and lateral gas through holes are all located on the same radial straight line of the airway switching disk.

10. The jetting structure according to claim 7, characterized in that: The axis of the downward jet hole is parallel to the vertical direction, the axis of the oblique jet hole is inclined to the vertical direction, and the axis of the lateral jet hole includes a first axis portion parallel to the vertical direction and a second axis portion perpendicular to the first axis portion.

11. The jetting structure according to claim 7, characterized in that: The airway switching disk is provided with a combined airway groove, which is formed by extending radially along the airway switching disk, and each downward jet hole has an oblique downward jet hole and a lateral jet hole arranged on the same radial straight line with its center; Wherein, when the gas circuit switching component moves to the fourth preset position, the combined gas channel groove is simultaneously connected to the first jet hole group and the second jet hole group; or, when the gas circuit switching component moves to the fourth preset position, the combined gas channel groove is simultaneously connected to the first jet hole group, the second jet hole group and the third jet hole group; or, when the gas circuit switching component moves to the fourth preset position, the combined gas channel groove is simultaneously connected to the second jet hole group and the third jet hole group; or, when the gas circuit switching component moves to the fourth preset position, the combined gas channel groove is simultaneously connected to the first jet hole group and the third jet hole group.

12. The jetting structure according to claim 11, characterized in that: The length of the combined airway groove is greater than the radial distance between the downward jet hole and the downward oblique jet hole; Alternatively, the length of the combined airway groove is greater than the distance between the downward jet hole and the lateral jet hole; Alternatively, the length of the combined airway groove is greater than the distance between the oblique downward air jet hole and the lateral air jet hole; Alternatively, in the circumferential direction of the jet component, the corresponding downward jet hole, the oblique downward jet hole and the lateral jet hole are all offset from each other, the length of the combined air duct groove is greater than the radial distance between the downward jet hole and the lateral jet hole, and the combined air duct groove extends on the line connecting the centers of the downward jet hole and the lateral jet hole.

13. The jetting structure according to claim 4, characterized in that: The gas path switching component further comprises an air uniforming disk arranged on the switching shaft, and a plurality of air uniforming holes are evenly distributed on the air uniforming disk, and the shapes and sizes of the plurality of air uniforming holes are equal.

14. The jetting structure according to claim 1, characterized in that: The jet structure further comprises a rotary drive member for driving the gas circuit switching member to rotate, and the gas circuit switching member is connected to a rotary output shaft of the rotary drive member via a coupling.

15. The jetting structure according to claim 1, characterized in that: The air intake pipe sleeve is provided with an air intake pipeline which can be communicated with an air source.

16. The jetting structure according to claim 1, characterized in that: The device also includes a controller electrically connected to the rotary drive member, so as to control the jet hole group to perform periodic pulse jetting in multiple directions through the controller.

17. The jetting structure according to claim 1, characterized in that: A magnetic fluid seal or a sealing ring seal is used between the gas path switching component and the air intake pipe sleeve.

18. A plasma etcher, characterized in that: Comprising the jet structure according to any one of claims 1 to 17.

19. The plasma etcher according to claim 18, characterized in that: It also includes a plasma reaction chamber, a vacuum pump, a pressure control valve, an excitation radio frequency power supply, a plasma coupling coil, a bias radio frequency power supply and a bias electrode; The vacuum pump is connected to the plasma reaction chamber, the pressure control valve is arranged on the connecting pipeline between the plasma reaction chamber and the vacuum pump, the plasma coupling coil is electrically connected to the excitation RF power supply, the bias RF power supply is electrically connected to the bias electrode, and the plasma coupling coil and the bias electrode are located in the plasma reaction chamber.

20. The plasma etcher according to claim 18, characterized in that: Also included are ceramic dielectric windows and shielding covers; The ceramic dielectric window is arranged in the plasma reaction chamber, the gas injection structure is arranged in the ceramic dielectric window, and the shielding cover is arranged outside the plasma reaction chamber.

21. The plasma etcher according to claim 20, characterized in that: The jet structure and the ceramic medium window are sealed by magnetic fluid sealing or sealing ring sealing.

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