Electronic device comprising circuit board

Abstract

The present disclosure relates to a circuit board. The circuit board according to an embodiment of the present disclosure may comprise: a first circuit board; and a second circuit board coupled to the first circuit board, wherein: the first circuit board includes a first body connected to a port and a first extension portion extending from the first body in a first direction; the second circuit board includes a second body spaced apart from the first body in the first direction and a second extension portion extending from the second body toward the first body; and the first extension portion and the second extension portion are stacked in a second direction orthogonal to the first direction between the first body and the second body.

Description

Electronic devices including circuit boards

[0001] Various embodiments disclosed in this document relate to electronic devices, for example, electronic devices including circuit boards.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portability and communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, or various functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.

[0004] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] A circuit board according to one embodiment of the present disclosure includes a first circuit board; and a second circuit board coupled to the first circuit board, wherein the first circuit board includes a first body connected to a port; and a first extension portion extending in a first direction from the first body, and the second circuit board includes a second body spaced apart from the first body in the first direction; and a second extension portion extending from the second body toward the first body, wherein the first extension portion and the second extension portion can be laminated in a second direction orthogonal to the first direction between the first body and the second body.

[0006] A circuit board according to one embodiment of the present disclosure includes a first circuit board; and a second circuit board coupled to the first circuit board, wherein the first circuit board includes a first body connected to a port and including a first step surface facing the second circuit board; and a first extension portion extending from the first step surface toward the second circuit board, and the second circuit board may include a second body connected to a control circuit and including a second step surface facing the first extension portion; and a second extension portion extending from the second step surface toward the first body.

[0007] An electronic device according to one embodiment of the present disclosure includes a housing; and a circuit board disposed inside the housing, the circuit board including: a first circuit board; and a second circuit board coupled to the first circuit board, the first circuit board including: a first body connected to a port; and a first extension portion extending in a first direction from the first body, the second circuit board including: a second body spaced apart from the first body in the first direction; and a second extension portion extending from the second body toward the first body, wherein the first extension portion and the second extension portion can be stacked in a second direction orthogonal to the first direction between the first body and the second body.

[0008] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0010] FIG. 2 is a perspective view of an electronic device in a folded state according to one embodiment of the present disclosure.

[0011] FIG. 3 is a perspective view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0012] FIG. 4 is a plan view showing the interior of a housing of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5 is a part of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 6 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 7 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 8 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 9 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

[0018] FIG. 10 is a part of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 11 is a part of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 12 is a part of an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 13 is a manufacturing tool for a portion of an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 14 is a manufacturing tool for a portion of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 15 is a diagram illustrating a method for manufacturing a part of an electronic device according to one embodiment of the present disclosure.

[0024] FIG. 16 is a diagram illustrating a method for manufacturing a part of an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 17 is a diagram illustrating a method for manufacturing a part of an electronic device according to one embodiment of the present disclosure.

[0026] FIG. 18 is a diagram illustrating a method for manufacturing a part of an electronic device according to one embodiment of the present disclosure.

[0027] FIG. 19 is a diagram illustrating a method for manufacturing a part of an electronic device according to one embodiment of the present disclosure.

[0028] FIG. 20 is a diagram illustrating a method for manufacturing a part of an electronic device according to one embodiment of the present disclosure.

[0029] FIG. 21 is a diagram illustrating a method for manufacturing a part of an electronic device according to one embodiment of the present disclosure.

[0030] FIG. 22 is a diagram illustrating a method for manufacturing a part of an electronic device according to one embodiment of the present disclosure.

[0031] FIG. 23 is a diagram illustrating a method for manufacturing a part of an electronic device according to one embodiment of the present disclosure.

[0032] FIG. 24 is a diagram illustrating a method for manufacturing a part of an electronic device according to one embodiment of the present disclosure.

[0033] FIG. 25 is a diagram illustrating a method for manufacturing a part of an electronic device according to one embodiment of the present disclosure.

[0034] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0035] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0036] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0037] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0038] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0039] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0040] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0041] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0042] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0043] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0044] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0045] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0046] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0047] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0048] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0049] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0050] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0051] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0052] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0053] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0054] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0055] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0056] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0057] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0058] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0059] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0060] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0061] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0062] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0063] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0064] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0065] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0066] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0067] FIG. 2 is a perspective view of an electronic device in a folded state according to one embodiment of the present disclosure.

[0068] FIG. 3 is a perspective view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0069] The embodiments of FIGS. 2 to 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 3 to 25.

[0070] Referring to FIGS. 2 and 3, the electronic device (101) may include a housing (202), a display (204), and a touchpad module (240). According to one embodiment, the electronic device (101) may be a laptop computer, a notebook computer, or a portable terminal. The configuration of the electronic device (101) of FIGS. 2 and 3 may be partially or entirely identical to the configuration of the electronic device (101) of FIG. 1.

[0071] According to one embodiment, the housing (202) may form at least a portion of the exterior of the electronic device (101) or support a component of the electronic device (101), such as a touch pad module (240). For example, the housing (202) may accommodate at least one of a display (204), an input device (206), or a touch pad module (240).

[0072] According to one embodiment, the electronic device (101) can be open (e.g., FIG. 3) or closed (e.g., FIG. 2). For example, the housing (202) can include a first housing (210) and a second housing (220) rotatably connected with respect to the first housing (210). According to one embodiment, the electronic device (101) can include a hinge module (230) connected with the housing (202). For example, the hinge module (230) can be connected to the first housing (210) and the second housing (220). According to one embodiment, the first housing (210) can be configured to rotate with respect to the second housing (220) at a specified angle (e.g., 0 to 180 degrees, or 0 to 360 degrees). According to one embodiment, the second housing (220) may be defined and / or interpreted as rotating at a specified angle with respect to the first housing (210). For example, when the electronic device (101) is in a closed state (e.g., FIG. 2), the first front surface (210a) of the first housing (210) may face the second front surface (220a) of the second housing (220).

[0073] According to one embodiment, the housing (202) may be formed of a metallic or non-metallic material having a selected amount of rigidity. According to one embodiment, at least a portion of the electronic device (101) formed of the metallic material may provide a ground plane and may be electrically connected to a ground line formed on a printed circuit board (e.g., the first circuit board (310) of FIG. 4). For example, the housing (202) may be electrically connected to the printed circuit board through a capacitive component.

[0074] In one embodiment, at least a portion of the display (204) may be disposed within the second housing (220). For example, at least a portion of the display (204) may be visually exposed to the exterior of the electronic device (101) through the second housing (220). The display (204) may form at least a portion of the second front surface (220a) of the second housing (220). In one embodiment, the display (204) may be a flexible display in which at least a portion of the display (204) may be deformable into a flat surface and / or a curved surface. For example, the display (204) may be a foldable or rollable display. The configuration of the display (204) may be all or partly the same as the configuration of the display module (160) of FIG. 1.

[0075] According to one embodiment, the display (204) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer configured to detect a magnetic stylus pen.

[0076] In one embodiment, the input device (206) can detect user input (e.g., pressure). In one embodiment, the input device (206) can be positioned or accommodated on the first housing (210). In one embodiment, when the electronic device (101) is closed, the input device (206) can face the display (204). The configuration of the input device (206) of FIG. 2 may be all or part of the same as the configuration of the input module (150) of FIG. 1. For example, the input device (206) may be a keyboard.

[0077] In one embodiment, the touch pad module (240) may be configured to detect or receive a user input. In one embodiment, the touch pad module (240) may include a capacitive touch sensor, a resistive touch sensor, an optical touch sensor, or a surface acoustic wave touch sensor. For example, the touch pad module (240) may detect current, pressure, light, and / or vibration caused by an input applied by a user to the touch pad module (240), and a processor (e.g., the processor (120) of FIG. 1) and / or the touch pad module (240) may determine the user input based on the detected change in current, pressure, light, and / or vibration. In one embodiment, the touch pad module (240) may be referred to as a touch pad, a touch pad device, or a touch pad structure.

[0078] According to one embodiment, the processor (e.g., processor (120) of FIG. 1) and / or the touch pad module (240) can determine a user's input location (e.g., XY coordinates). According to one embodiment, the touch pad module (240) can detect pressure on the touch pad module (240). For example, the touch pad module (240) can detect force in a thickness direction (e.g., Z-axis direction) using a switch and at least one force sensor. According to one embodiment, the touch pad module (240) can detect an external object (e.g., a user's finger or stylus) when the external object directly contacts or is in proximity to a surface of the touch pad module (240).

[0079] According to one embodiment, the touch pad module (240) may be accommodated in the housing (202). For example, the touch pad module (240) may be connected to the first housing (210) and at least a portion thereof may be exposed to the outside of the first housing (210). According to one embodiment, the touch pad module (240) may be adjacent to the input device (206). According to one embodiment, when the electronic device (101) is closed, at least a portion of the touch pad module (240) may face the display (204). The configuration of the touch pad module (240) may be all or part of the same as the configuration of the input module (150) of FIG. 1.

[0080] FIG. 4 is a plan view showing the interior of a housing of an electronic device according to one embodiment of the present disclosure.

[0081] The embodiment of FIG. 4 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 4 to 25.

[0082] Referring to FIG. 4, an electronic device (101) (e.g., the electronic device (101) of FIGS. 1 to 3) may include a housing (302), a first circuit board (310), a second circuit board (320), a conductive connection member (330), at least one fan module (360), a heat dissipation member (380), or at least one buffer member (390).

[0083] According to one embodiment, the electronic device (101) may include a housing (302) (e.g., the housing (202) of FIGS. 2 to 3). According to the illustrated embodiment, the housing (302) may be, but is not limited to, the first housing (210) of FIGS. 2 to 3, and may be, for example, the second housing (220) of FIGS. 2 to 3.

[0084] According to one embodiment, at least a portion of an edge of the housing (302) (e.g., at least a portion of an edge facing the +Y direction of FIG. 4) may be formed with a recessed step (319) that is recessed further inwardly of the housing (302) than other portions. A hinge module of the electronic device (101) (e.g., the hinge module (230) of FIG. 2) may be disposed in the step (319).

[0085] In one embodiment, a hinge module (e.g., hinge module (230) of FIG. 2) may be rotatably coupled to a housing (302) (e.g., first housing (210) of FIG. 2).

[0086] According to one embodiment, an input device (e.g., input device (206) of FIG. 2) or a touch pad module (e.g., touch pad module (240) of FIG. 2) of the electronic device (101) may be disposed in the housing (302).

[0087] According to one embodiment, the housing (302) may include an internal space. The internal space of the housing (302) may be a space separated from the external space of the electronic device (101). In the internal space, a first circuit board (310), a second circuit board (320), a conductive connecting member (330), at least one fan module (360), a heat dissipation member (380), at least one buffer member (390), or at least one electrical component (e.g., a processor (120), a memory (130), or a communication module (190) of FIG. 1) may be disposed.

[0088] According to one embodiment, the first circuit board (310) may be disposed inside a housing (302) (e.g., the first housing (210) of FIG. 2). The first circuit board (310) may include at least one of a printed circuit board (PCB), a flexible printed circuit board (flexible PCB), or a rigid-flexible printed circuit board (RF-PCB).

[0089] According to one embodiment, the second circuit board (320) may be disposed inside the housing (302) (e.g., the first housing (210) of FIG. 2). The second circuit board (320) may include at least one of a printed circuit board (PCB), a flexible printed circuit board (flexible PCB), or a rigid-flexible printed circuit board (RF-PCB).

[0090] According to one embodiment, the first circuit board (310) may be defined and / or referred to as a main circuit board, and the second circuit board (320) may be defined and / or referred to as a sub circuit board.

[0091] According to one embodiment, the first circuit board (310) and the second circuit board (320) may be spaced apart from each other.

[0092] According to one embodiment, at least one electrical component (e.g., a processor (120), a memory (130), or a communication module (190) of FIG. 1) may be placed or mounted on the first circuit board (310).

[0093] According to one embodiment, the second circuit board (320) may be electrically connected to the speaker, the SIM socket, and / or the first circuit board (310).

[0094] According to one embodiment, a conductive connection member (330) may be disposed inside the housing (302). The conductive connection member (330) may be electrically connected to the first circuit board (310) and the second circuit board (320). For example, the conductive connection member (330) may be configured to transmit a signal from the first circuit board (310) to the second circuit board (320). In addition, the conductive connection member (330) may be configured to transmit a signal from the second circuit board (320) to the first circuit board (310). According to one embodiment, the conductive connection member (330) may include at least one of a flexible printed circuit board (FPCB), a printed circuit board (PCB), or a cable.

[0095] According to one embodiment, the heat dissipation member (380) may be disposed inside the housing (302) (e.g., the first housing (210) of FIG. 2). According to one embodiment, the heat dissipation member (380) may be disposed on at least a portion of the first circuit board (310). For example, the heat dissipation member (380) may be disposed on one surface of the first circuit board (310) (e.g., the surface facing the -Z direction of FIGS. 2 to 4).

[0096] According to one embodiment, the heat dissipation member (380) may include a vapor chamber, a heat pipe, a heat spreader, or a heat sink.

[0097] According to one embodiment, the heat dissipation member (380) may form a heat transfer path to discharge heat generated from the first circuit board (310), heat generated from at least one electrical component disposed on the first circuit board (310), or heat generated from an electrical component disposed inside the housing (302) (e.g., the first housing (210) of FIG. 2)) to the outside of the housing (302).

[0098] According to one embodiment, at least a portion of the heat sink member (380) may be positioned between at least one fan module (360) and the step portion (319) of the housing (302).

[0099] According to one embodiment, at least one fan module (360) may be disposed inside a housing (302) (e.g., the first housing (210) of FIG. 2). According to one embodiment, at least one fan module (360) may include a fan that causes airflow.

[0100] According to one embodiment, at least one fan module (360) can provide airflow to at least a portion of the heat dissipation member (380). For example, the airflow provided from at least one fan module (360) can be discharged to the outside of the housing (302) after passing through at least a portion of the heat dissipation member (380). The airflow provided from at least one fan module (360) can be discharged to the outside of the housing (302) after exchanging heat with the heat dissipation member (380). For example, heat accumulated inside the housing (302) can be discharged to the outside of the housing (302) through the heat dissipation member (380) and the airflow.

[0101] According to one embodiment, at least one fan module (360) may include a first fan module (361) and a second fan module (362) spaced apart from the first fan module (361).

[0102] According to one embodiment, the first fan module (361) may face at least a portion of the heat dissipation member (380), and the second fan module (362) may face a portion of the heat dissipation member (380) that is different from the at least a portion thereof.

[0103] According to one embodiment, the electronic device (101) may further include at least one buffer member (390). The at least one buffer member (390) may be disposed on one surface of the heat dissipation member (380) (e.g., the surface facing the -Z direction of FIGS. 2 to 4 ).

[0104] According to one embodiment, the at least one buffer member (390) may include at least one of a sponge or rubber.

[0105] According to one embodiment, the at least one buffer member (390) can limit or reduce the direct transmission of an external shock applied to the electronic device (101) to the heat dissipation member (380).

[0106] According to one embodiment, the at least one buffer member (390) may include a first buffer member (391) and a second buffer member (392). The first buffer member (391) may be disposed adjacent to the first fan module (361), and the second buffer member (392) may be disposed adjacent to the second fan module (362).

[0107] According to one embodiment, the first buffer member (391) may be disposed on at least a portion of the heat dissipation member (380) disposed between the first fan module (361) and the step (319). The second buffer member (392) may be disposed on another portion of the heat dissipation member (380) disposed between the second fan module (362) and the step (319).

[0108] FIG. 5 is a diagram of a circuit board (400) according to one embodiment of the present disclosure. The components described with reference to FIG. 5 may be partially or entirely identical to the components described with reference to FIGS. 1 to 4. The components described with reference to FIG. 5 may be partially or entirely identical to the components described with reference to FIGS. 6 to 25.

[0109] According to one embodiment, the electronic device (101) may include a circuit board (400). The circuit board (400) may be placed inside a housing (e.g., housing (302) of FIG. 4). The circuit board (400) may be connected to electronic components (e.g., processor (120), memory (130), communication module (190) of FIG. 1). The circuit board (400) may be connected to ports (491, 493) that are connected to other components (not shown) outside the housing (302).

[0110] According to one embodiment, the circuit board (400) may include a first substrate portion (401), a second substrate portion (402), and a third substrate portion (403). The first substrate portion (401) may be disposed between the second substrate portion (402) and the third substrate portion (403). The first substrate portion (401) may be located inside a housing (e.g., the housing (302) of FIG. 4) relative to the second and third substrate portions (402, 403). The first substrate portion (401) may connect the second substrate portion (402) and the third substrate portion (403). The electronic device (101) may include a processor (4011) disposed on the first substrate portion (401). The second substrate portion (402) may extend from the first substrate portion (401) in a direction toward the outside of the housing (302). The second substrate portion (402) can be connected to a first port (491) that is connected to a component (not shown) outside the housing (302). The third substrate portion (403) can extend from the first substrate portion (401) in a direction toward the outside of the housing (302). The third substrate portion (403) can be connected to a second port (493) that is connected to a component (not shown) outside the housing (302). The first port (491) and the second port (493) can be connected to a component (e.g., an HDMI port, a USB port, etc.) outside the housing (302).

[0111] In one embodiment, the circuit board (400) may include a connecting portion (404). The connecting portion (404) may connect the first substrate portion (401) and the second substrate portion (402). The connecting portion (404) may be a part of the circuit board (400). The connecting portion (404) may be positioned between the first substrate portion (401) and the second substrate portion (402). The electronic device (101) may include a control circuit (492) connected to the connecting portion (404). The control circuit (492) may be located in the first substrate portion (401).

[0112] Fig. 6 is a part of a cross-sectional view taken along the line A-A' illustrated in Fig. 5. Fig. 7 is a part of another cross-sectional view taken along the line A-A' illustrated in Fig. 5. Fig. 8 is a cross-sectional view taken along the line A-A' illustrated in Fig. 5. The components described with reference to Figs. 6 to 8 may be partly or entirely the same as the components described with reference to Figs. 1 to 5. The components described with reference to Figs. 6 to 8 may be partly or entirely the same as the components described with reference to Figs. 9 to 25.

[0113] In one embodiment, a circuit board (e.g., circuit board (400) of FIG. 5) may include a first circuit board (410). The first circuit board (410) may be a portion of the circuit board (400). The first circuit board (410) may be a portion of a second substrate portion (e.g., second substrate portion (402) of FIG. 5). At least a portion of the first circuit board (410) may be positioned at a connecting portion (e.g., connecting portion (404) of FIG. 5). The first circuit board (410) may be coupled to the first substrate portion (e.g., first substrate portion (401) of FIG. 5). The first circuit board (410) may be connected to a first port (491).

[0114] According to one embodiment, the first circuit board (410) may include a first body (411). The first body (411) may be connected to a first port (491). The first body (411) may be located on a second substrate portion (e.g., the second substrate portion (402) of FIG. 5). The first body (411) may be a part of the second substrate portion (402).

[0115] In one embodiment, the first circuit board (410) may include a first extension portion (412). The first extension portion (412) may extend from the first body (411). The first extension portion (412) may extend from the first body (411) toward the second circuit board (420). The first extension portion (412) may be located at a connecting portion (e.g., connecting portion (404) of FIG. 5). The first extension portion (412) may be a part of the connecting portion (404).

[0116] According to one embodiment, the first body (411) and the first extension portion (412) may form a step. The step formed by the first body (411) and the first extension portion (412) may be defined as a “first step.” The first step may include a first step surface (4113) of the first body (411) and a first edge (4123) of the first extension portion (412). The thickness (h11) of the first body (411) may be greater than the thickness (h12) of the first extension portion (412). The first step may have a thickness equal to the difference between the thickness (h11) of the first body (411) and the thickness (h12) of the first extension portion (412). The width (w11) of the first body (411) may be greater than the width (w12) of the first extension portion (412).

[0117] According to one embodiment, the first body (411) may include a first-first surface (4111). The first port (491) may be connected to the first-first surface (4111). The first body (411) may include a first-second surface (4114). The first-second surface (4114) may be a surface of the first body (411) opposite the first-first surface (4111). The first body (411) may include a first side surface (4112). The first side surface (4112) may connect the first-first surface (4111) and the first-second surface (4114). The first body (411) may include a first step surface (4113). The first step surface (4113) can connect the 1-1 surface (4111) and the 1-1 extension surface (4121). The first step surface (4113) can connect the 1-1 surface (4111) and the first edge (4123).

[0118] According to one embodiment, the first extension portion (412) may include a first-first extension surface (4121). The first-first extension surface (4121) may form a first step with the first-first surface (4111). The first step surface (4113) may connect the first-first surface (4111) and the first-first extension surface (4121). The first circuit board (410) may include a first edge (4123) connecting the first step surface (4113) and the first-first extension surface (4121). The first extension portion (412) may include a first-second extension surface (4124). The first-second extension surface (4124) may be a surface of the first extension portion (412) that is opposite the first-first extension surface (4121). The first circuit board (410) may include a first surface portion (4101) including a first-second surface (4114) and a first-second extension surface (4124). The first-second surface (4114) and the first-second extension surface (4124) may be aligned in a direction in which the first circuit board (410) and the second circuit board (420) are arranged. The first-second surface (4114) and the first-second extension surface (4124) may be aligned in a direction in which the first body (411) and the second body (421) are spaced apart from each other. The first extension portion (412) may include a first extension side surface (4122). The first extension side surface (4122) may connect the first-first extension side surface (4121) and the first-second extension side surface (4124).

[0119] According to one embodiment, the first circuit board (410) may include a first-first terminal (413) and a first-second terminal (414). The first circuit board (410) may include first terminals (413, 414). The first terminals (413, 414) may include a first-first terminal (413) and a first-second terminal (414). The first terminals (413, 414) may be disposed in the first extension portion (412). The first terminals (413, 414) may be disposed in the first-first extension surface (4121). The first-first terminal (413) and the first-second terminal (414) may be spaced apart from each other in a direction in which the first-first extension surface (4121) extends. At least a portion of the first-first terminal (413) may be located on the first step surface (4113). At least a portion of the first-first terminal (413) may be located on the first edge (4123). At least a portion of the first-second terminal (414) may be located on the first extension side (4122).

[0120] In one embodiment, a circuit board (e.g., circuit board (400) of FIG. 5) may include a second circuit board (420). The second circuit board (420) may be a portion of the circuit board (400). The second circuit board (420) may be a portion of a connecting portion (e.g., connecting portion (404) of FIG. 5). At least a portion of the second circuit board (420) may be positioned on a first substrate portion (e.g., first substrate portion (401) of FIG. 5). The second circuit board (420) may be a portion of the first substrate portion (e.g., first substrate portion (401) of FIG. 5). The second circuit board (420) may be coupled to the first circuit board (410).

[0121] According to one embodiment, the second circuit board (420) may include a second body (421). The second body (421) may be connected to a control circuit (492). The second body (421) may be located on a first substrate portion (e.g., the first substrate portion (401) of FIG. 5). The second body (421) may be a part of the first substrate portion (401).

[0122] In one embodiment, the second circuit board (420) may include a second extension portion (422). The second extension portion (422) may extend from the second body (421). The second extension portion (422) may extend from the second body (421) toward the first circuit board (410). The second extension portion (422) may be located at a connecting portion (e.g., connecting portion (404) of FIG. 5). The second extension portion (422) may be a part of the connecting portion (404).

[0123] According to one embodiment, the second body (421) and the second extension portion (422) may form a step. The step formed by the second body (421) and the second extension portion (422) may be defined as a “second step.” The second step may include a second step surface (4213) of the second body (421) and a second edge (4223) of the second extension portion (422). The thickness (h21) of the second body (421) may be greater than the thickness (h22) of the second extension portion (422). The second step may have a thickness equal to the difference between the thickness (h21) of the second body (421) and the thickness (h22) of the second extension portion (422). The width (w21) of the second body (421) may be greater than the width (w22) of the second extension portion (422).

[0124] According to one embodiment, the second body (421) may include a second-first surface (4211). A control circuit (492) may be connected to the second-first surface (4211). The second body (421) may include a second-second surface (4214). The second-second surface (4214) may be a surface of the second body (421) opposite to the second-first surface (4211). The second body (421) may include a second side surface (4212). The second side surface (4212) may connect the second-first surface (4211) and the second-second surface (4214). The second body (421) may include a second step surface (4213). The second step surface (4213) can connect the second-2 surface (4214) and the second-2 extension surface (4224). The second step surface (4213) can connect the second-2 surface (4214) and the second edge (4223).

[0125] In one embodiment, the second extension portion (422) may include a second-second extension surface (4224). The second-second extension surface (4224) may form a second step with the second-second surface (4214). The second step surface (4213) may connect the second-second surface (4214) and the second-second extension surface (4224). The second circuit board (420) may include a second edge (4223) connecting the second step surface (4213) and the second-second extension surface (4224). The second extension portion (422) may include a second-first extension surface (4221). The second-first extension surface (4221) may be a surface of the second extension portion (422) that is opposite to the second-second extension surface (4224). The second circuit board (420) may include a second surface portion (4201) including a 2-1 surface (4211) and a 2-1 extension surface (4221). The 2-1 surface (4211) and the 2-1 extension surface (4221) may be aligned in a direction in which the first circuit board (410) and the second circuit board (420) are arranged. The 2-1 surface (4211) and the 2-1 extension surface (4221) may be aligned in a direction in which the first body (411) and the second body (421) are spaced apart from each other. The second extension portion (422) may include a second extension side surface (4222). The second extension side surface (4222) may connect the 2-1 extension surface (4221) and the 2-2 extension surface (4224).

[0126] According to one embodiment, the second circuit board (420) may include a second-first terminal (423) and a second-second terminal (424). The second circuit board (420) may include second terminals (423, 424). The second terminals (423, 424) may include a second-first terminal (423) and a second-second terminal (424). The second terminals (423, 424) may be disposed in the second extension portion (422). The second terminals (423, 424) may be disposed in the second-second extension surface (4224). The second-first terminal (423) and the second-second terminal (424) may be spaced apart from each other in a direction in which the second-second extension surface (4224) extends. At least a portion of the second-first terminal (423) may be located on the second step surface (4213). At least a portion of the second-first terminal (423) may be located on the second edge (4223). At least a portion of the second-second terminal (424) may be located on the second extension side surface (4222).

[0127] In one embodiment, the first-first extension surface (4121) may be named a “first extension surface.” The second-second extension surface (4224) may be named a “second extension surface.”

[0128] According to one embodiment, a circuit board (e.g., circuit board (400) of FIG. 5) may include a board assembly (430). The board assembly (430) may include a first circuit board (410) and a second circuit board (420). The first circuit board (410) and the second circuit board (420) may be coupled to each other.

[0129] According to one embodiment, the substrate assembly (430) may include a first portion (431). The first portion (431) may be a portion of a first circuit board (410). The first portion (431) may include a first body (411). A first port (491) may be connected to the first portion (431).

[0130] According to one embodiment, the substrate assembly (430) may include a second portion (432). The second portion (432) may be a portion of a second circuit board (420). The second portion (432) may include a second body (421). A control circuit (492) may be connected to the second portion (432).

[0131] In one embodiment, the substrate assembly (430) may include a third portion (433). The third portion (433) may connect the first portion (431) and the second portion (432). The third portion (433) may be a part of a connecting portion (e.g., connecting portion (404) of FIG. 5).

[0132] According to one embodiment, the first extension portion (412) and the second extension portion (422) may be laminated with each other. The first extension portion (412) and the second extension portion (422) may be positioned between the first portion (431) and the second portion (432). The first extension portion (412) and the second extension portion (422) may be positioned between the first body (411) and the second body (421). Each of the first extension portion (412) and the second extension portion (422) may be a part of the third portion (433). The first extension portion (412) and the second extension portion (422) may be laminated in the thickness direction of the substrate assembly (430). The above thickness direction may be defined as a second direction (e.g., +Z direction) orthogonal to a first direction (e.g., +X direction) in which the first part (431) and the second part (432) are spaced apart. The first extension part (412) and the second extension part (422) may extend in the width direction of the substrate assembly (430). The width direction may be defined as a first direction (e.g., +X direction) in which the first part (431) and the second part (432) are spaced apart.

[0133] According to one embodiment, the substrate assembly (430) may include a first surface (4301). A first port (491) and a control circuit (492) may be connected to the first surface (4301). The first surface (4301) may include a first-first surface (4111), a second-first surface (4211), and a second-first extension surface (4221). The first-first surface (4111), the second-first surface (4211), and the second-first extension surface (4221) may be aligned in a first direction (e.g., +X direction) of the substrate assembly (430). The expression "aligned" may include not only a structure in which each surface (4111, 4211, 4221) is completely parallel, but also a concept in which the surfaces are positioned substantially on the same plane. For example, a step may be formed between each face (4111, 4211, 4221), or a curved connecting portion may be formed.

[0134] According to one embodiment, the substrate assembly (430) can include a second surface (4302). The second surface (4302) can be a surface of the substrate assembly (430) opposite the first surface (4301). The second surface (4302) can include a first-second surface (4114), a second-second surface (4214), and a first-second extension surface (4124). The first-second surface (4114), the second-second surface (4214), and the first-second extension surface (4124) can be aligned in a first direction (e.g., +X direction) of the substrate assembly (430). The expression “aligned” may include not only a structure in which each surface (4114, 4214, 4124) is completely parallel, but also a concept in which the surfaces are positioned substantially on the same plane. For example, a step may be formed between each face (4114, 4214, 4124), or a curved connecting portion may be formed.

[0135] According to one embodiment, the substrate assembly (430) may include a first substrate side (4303) and a second substrate side (4304). The first substrate side (4303) may be identical to the first side (4112) of the first circuit board (410). The second substrate side (4304) may be identical to the second side (4212) of the second circuit board (420).

[0136] According to one embodiment, the width (w31) of the first portion (431) may be greater than the width (w33) of the third portion (433). The width (w32) of the second portion (432) may be greater than the width (w33) of the third portion (433). The thickness (h30) of the first portion (431) may be formed to be constant in the longitudinal direction of the substrate assembly (430) (e.g., +X direction (first direction)).

[0137] According to one embodiment, the first side surface (4122) of the first extension portion (412) may correspond to the second step surface (4213) of the second circuit board (420). The second extension side surface (4222) of the second extension portion (422) may correspond to the first step surface (4113) of the first circuit board (410). The first-first extension surface (4121) of the first extension portion (412) may correspond to the second-second extension surface (4224) of the second extension portion (422). The expression “corresponds to” may be replaced with the expressions “facing each other”, “in contact with each other”, or “spaced apart from each other in the first direction of the board assembly (430)”.

[0138] According to one embodiment, the substrate assembly (430) may include a first terminal assembly (434) and a second terminal assembly (435). The first terminal assembly (434) may be a structure in which a first-first terminal (413) and a second-second terminal (424) are coupled. The second terminal assembly (435) may be a structure in which a first-second terminal (414) and a second-first terminal (423) are coupled. At least a portion of the first terminal assembly (434) may be positioned between the first body (411) and the second extension portion (422). At least a portion of the first terminal assembly (434) may be positioned between the first extension portion (412) and the second extension portion (422). At least a portion of the second terminal assembly (435) may be positioned between the second body (421) and the first extension portion (412). At least a portion of the second terminal assembly (435) may be positioned between the first extension portion (412) and the second extension portion (422).

[0139] FIG. 9 is a conceptual diagram illustrating a first circuit board (410) and a second circuit board (420) according to one embodiment of the present disclosure. The components described with reference to FIG. 9 may be partially or entirely identical to the components described with reference to FIGS. 1 to 8. The components described with reference to FIG. 9 may be partially or entirely identical to the components described with reference to FIGS. 10 to 25.

[0140] According to one embodiment, the first circuit board (410) may include a plurality of first signal layers (411a, 411b, 411c, 411d, 411e, 411f, 412a, 412b, 412c). The plurality of first signal layers (411a, 411b, 411c, 411d, 411e, 411f, 412a, 412b, 412c) may include a 1-1 signal layer (411a, 411b, 411c, 411d, 411e, 411f) located in the first body (411) and a 1-2 signal layer (412a, 412b, 412c) located in the first extension portion (412). A plurality of first signal layers (411a, 411b, 411c, 411d, 411e, 411f, 412a, 412b, 412c) may be located on a second substrate portion (e.g., the second substrate portion (402) of FIG. 5).

[0141] According to one embodiment, the second circuit board (420) may include a plurality of second signal layers (421a, 421b, 421c, 421d, 421e, 421f, 421g, 421h, 421i, 421j, 422a, 422b, 422c, 422d, 422e, 422f). The plurality of second signal layers (421a, 421b, 421c, 421d, 421e, 421f, 421g, 421h, 421i, 421j, 422a, 422b, 422c, 422d, 422e, 422f) may include a 2-1 signal layer (421a, 421b, 421c, 421d, 421e, 421f, 421g, 421h, 421i, 421j) located in the second body (421) and a 2-2 signal layer (422a, 422b, 422c, 422d, 422e, 422f) located in the second extension portion (422). A plurality of second signal layers (421a, 421b, 421c, 421d, 421e, 421f, 421g, 421h, 421i, 421j, 422a, 422b, 422c, 422d, 422e, 422f) may be located on the first substrate portion (e.g., the first substrate portion (401) of FIG. 5).

[0142] According to one embodiment, the number of 2-1 signal layers (421a, 421b, 421c, 421d, 421e, 421f, 421g, 421h, 421i, 421j) may be greater than the number of 1-1 signal layers (411a, 411b, 411c, 411d, 411e, 411f). The number of 2-2 signal layers (422a, 422b, 422c, 422d, 422e, 422f) may be greater than the number of 1-2 signal layers (412a, 412b, 412c). A plurality of second signal layers (421a, 421b, 421c, 421d, 421e, 421f, 421g, 421h, 421i, 421j, 422a, 422b, 422c, 422d, 422e, 422f) can transmit and receive signals to and from a processor (4011) disposed on a first substrate portion (e.g., the first substrate portion (401) of FIG. 5). The processor (4011) may be a CPU or a memory. Due to the above-described structure, signal transmission between the processor (4011) and the second circuit board (420) can be improved.

[0143] Fig. 10 is a drawing of a portion of a first circuit board (410). Fig. 11 is a drawing of the first circuit board (410) viewed from one side. Fig. 12 is a perspective view of a pattern member (440). The components described with reference to Figs. 10 to 12 may be partially or entirely the same as the components described with reference to Figs. 1 to 9. The components described with reference to Figs. 10 to 12 may be partially or entirely the same as the components described with reference to Figs. 13 to 25.

[0144] According to one embodiment, a circuit board (e.g., circuit board (400) of FIG. 5) may include a pattern member (440). The pattern member (440) may be disposed on a first circuit board (410). The pattern member (440) may have a shape formed on the first circuit board (410), or may be formed as a separate component and attached to the first circuit board (410). The pattern member (440) may be disposed on the first extension portion (412). The pattern member (440) may include a thin film.

[0145] According to one embodiment, the pattern member (440) may include a plurality of patterns (441). The plurality of patterns (441) may be arranged on the first extension portion (412). The plurality of patterns (441) may be arranged along the periphery of the first extension portion (412). Each of the plurality of patterns (441) may be spaced apart from each other in the circumferential direction of the first extension portion (412). The plurality of patterns (441) may be arranged on the first-first extension surface (4121).

[0146] According to one embodiment, the first extension portion (412) may include peripheral portions (4125, 4126, 4127, 4128). The peripheral portions (4125, 4126, 4127, 4128) may be a portion of the first-first extension surface (4121). The peripheral portions (4125, 4126, 4127, 4128) may include a first peripheral portion (4125), a second peripheral portion (4126), a third peripheral portion (4127), and a fourth peripheral portion (4128). The first peripheral portion (4125) may be connected to the first edge (4123).

[0147] According to one embodiment, a plurality of patterns (441) can be formed on the peripheral portions (4125, 4126, 4127, 4128). The peripheral portions (4125, 4126, 4127, 4128) can have a square closed loop shape, and the plurality of patterns (441) can be arranged along the peripheral portions (4125, 4126, 4127, 4128).

[0148] According to one embodiment, the plurality of patterns (441) may include a first pattern (4411), a second pattern (4412), a third pattern (4413), and a fourth pattern (4414). The first pattern (4411) may be disposed on the first peripheral portion (4125). The second pattern (4412) may be disposed on the second peripheral portion (4126). The third pattern (4413) may be disposed on the third peripheral portion (4127). The fourth pattern (4414) may be disposed on the fourth peripheral portion (4128). The first pattern (4411) may include a first-first pattern portion (4411a) formed on the first step surface (4113) and a first-second pattern portion (4411b) formed on the first-first extension surface (4121). The first-first pattern portion (4411a) and the first-second pattern portion (4411b) may extend in directions intersecting each other. The second pattern (4412) may include a second-first pattern portion (4412a) formed on the first extension side (4122) and a second-second pattern portion (4412b) formed on the first-first extension side (4121). The second-first pattern portion (4412a) and the second-second pattern portion (4412b) may extend in directions intersecting each other.

[0149] Fig. 13 is a perspective view of a cover member (450). Fig. 14 is a side view of the cover member (450). Fig. 15 is a drawing of a first circuit board (410) on which the cover member (450) is arranged. Fig. 16 is a view of the structure illustrated in Fig. 15 as viewed from above. Fig. 17 is a cross-sectional view of the structure illustrated in Fig. 15. The components described with reference to Figs. 13 to 17 may be partly or entirely the same as the components described with reference to Figs. 1 to 12. The components described with reference to Figs. 13 to 17 may be partly or entirely the same as the components described with reference to Figs. 18 to 25.

[0150] According to one embodiment, the cover member (450) can be mounted on the first circuit board (410). The cover member (450) can be removed from the first circuit board (410) after an adhesive member (e.g., the adhesive member (460) of FIG. 20) is attached to the first circuit board (410).

[0151] According to one embodiment, the cover member (450) may include a first plate (451), a second plate (452), and a third plate (453). The cover member (450) may include a first wall (454) and a second wall (455). The first wall (454) may connect the first plate (451) and the second plate (452). The second wall (455) may connect the first plate (451) and the third plate (453). The cover member (450) may include a step shape. The first plate (451) and the second plate (452) may be spaced apart from each other in the thickness direction of the first circuit board (410), and the first wall (454) may connect the first plate (451) and the second plate (452). The first plate (451) and the third plate (453) may be spaced apart in the thickness direction of the first circuit board (410), and the second wall (455) may connect the first plate (451) and the third plate (453). A height difference (h52) may be formed between the first plate (451) and the second plate (452). A height difference (h53) may be formed between the first plate (451) and the third plate (453).

[0152] According to one embodiment, the cover member (450) may include a plurality of penetration holes (4501). The plurality of penetration holes (4501) may be arranged in the circumferential direction of the first plate (451). The plurality of penetration holes (4501) may be opened in the first plate (451). The plurality of penetration holes (4501) may include a first penetration hole (456), a second penetration hole (457), a third penetration hole (458), and a fourth penetration hole (459).

[0153] According to one embodiment, the first penetration hole (456) may include a first-first penetration hole portion (4561) opened in the first plate (451) and a first-second penetration hole portion (4562) opened in the first wall (454). The second penetration hole (457) may include a second-first penetration hole portion (4571) opened in the first plate (451) and a second-second penetration hole portion (4572) opened in the second wall (455).

[0154] According to one embodiment, the cover member (450) may be mounted on the first circuit board (410). The first plate (451) may be mounted on the first extension portion (412). The second plate (452) may be mounted on the first body (411). The third plate (453) may be located on the outside of the first extension portion (412).

[0155] According to one embodiment, a plurality of penetration holes (4501) may correspond to a pattern member (440). The plurality of penetration holes (4501) may face a plurality of patterns (441). The plurality of patterns (441) may be exposed to the outside of the cover member (450) through each of the plurality of penetration holes (4501). The first penetration hole (456) may correspond to the first pattern (4411). The first pattern (4411) may be exposed to the outside of the cover member (450) through the first penetration hole (456). The second penetration hole (457) may correspond to the second pattern (4412). The second pattern (4412) may be exposed to the outside of the cover member (450) through the second penetration hole (457). The third penetration hole (458) may correspond to the third pattern (4413). The third pattern (4413) may be exposed to the outside of the cover member (450) through the third penetration hole (458). The fourth penetration hole (459) may correspond to the fourth pattern (4414). The fourth pattern (4414) may be exposed to the outside of the cover member (450) through the fourth penetration hole (459).

[0156] According to one embodiment, the first-first penetration hole portion (4561) may be opened toward the first-first extension surface (4121). The first-second penetration hole portion (4562) may be opened toward the first step surface (4113). The second-first penetration hole portion (4571) may be opened toward the first-first extension surface (4121). The second-second penetration hole portion (4572) may be opened toward the first extension side surface (4122).

[0157] Fig. 18 is a drawing explaining the application process of the adhesive member (460). Fig. 19 is a cross-sectional view of the structure illustrated in Fig. 18. Fig. 20 is a drawing of the first circuit board (410) after the adhesive member (460) is created. Fig. 21 is an enlarged view of the M1 area of ​​Fig. 20. Fig. 22 is an enlarged view of the M2 area of ​​Fig. 20. The components described with reference to Figs. 18 to 22 may be partly or entirely the same as the components described with reference to Figs. 1 to 17. The components described with reference to Figs. 18 to 22 may be partly or entirely the same as the components described with reference to Figs. 23 to 25.

[0158] According to one embodiment, an adhesive member (460) may be applied to a first circuit board (410). The adhesive member (460) may be adhered to the first circuit board (410). An adhesive material discharged from a squeeze (SQ) may be disposed on an upper side of a cover member (450). The adhesive material may be a liquid material. The adhesive material may solidify to form the adhesive member (460). The adhesive material may permeate into a penetration hole (e.g., a penetration hole (4501) of FIG. 16). For example, the adhesive material may permeate into the first penetration hole (456) and the second penetration hole (457). The adhesive material that has permeated into the first penetration hole (456) can solidify inside the first-first penetration hole portion (4561) and the first-second penetration hole portion (4562) to form a first adhesive member (461). The adhesive material that has permeated into the second penetration hole (457) can solidify inside the second-first penetration hole portion (4571) and the second-second penetration hole portion (4572) to form a second adhesive member (462).

[0159] According to one embodiment, the first circuit board (410) may include an adhesive member (460). The adhesive member (460) may be disposed on the first extension portion (412). The adhesive member (460) may be disposed along the perimeter of the first extension portion (412). A plurality of adhesive members (460) may be disposed to correspond to each of a plurality of patterns (e.g., the pattern (441) of FIGS. 10 to 12). The plurality of adhesive members (460) may be arranged along the perimeter of the first extension portion (412). The plurality of adhesive members (460) may include a first adhesive member (461), a second adhesive member (462), a third adhesive member (463), and a fourth adhesive member (464). The first adhesive member (461) may correspond to the first pattern (e.g., the first pattern (4411) of FIGS. 10 to 12). The second adhesive member (462) may correspond to the second pattern (e.g., the second pattern (4412) of FIGS. 10 to 12). The third adhesive member (463) may correspond to the third pattern (e.g., the third pattern (4413) of FIGS. 10 to 12). The fourth adhesive member (464) may correspond to the fourth pattern (e.g., the fourth pattern (4414) of FIGS. 10 to 12).

[0160] According to one embodiment, the first adhesive member (461) can be adhered to the first-first extension surface (4121), the first edge (4123), and the first step surface (4113). The first adhesive member (461) can include a first-first adhesive portion (4611) adhered to the first-first extension surface (4121) and a first-second adhesive portion (4612) adhered to the first step surface (4113).

[0161] According to one embodiment, the second adhesive member (462) can be adhered to the first-first extension surface (4121) and the first extension side surface (4122). The second adhesive member (462) can include a second-first adhesive portion (4621) adhered to the first-first extension surface (4121) and a second-second adhesive portion (4622) adhered to the first extension side surface (4122).

[0162] According to one embodiment, the third adhesive member (463) and the fourth adhesive member (464) can be adhered to the first-first extension surface (4121).

[0163] Fig. 23 is a drawing illustrating the combination of a first circuit board (410) and a second circuit board (420). Fig. 24 is a drawing illustrating the combination of the first circuit board (410) and the second circuit board (420). Fig. 25 is a drawing illustrating the combination of the first circuit board (510) and the second circuit board (520) according to an embodiment of the present disclosure. Some or all of the components described with reference to Figs. 23 to 25 may be identical to the components described with reference to Figs. 1 to 22.

[0164] According to one embodiment, a second circuit board (420) may be coupled to a first circuit board (410). A second extension portion (422) may be positioned on an upper side of the first extension portion (412). An adhesive member (460) may be positioned between the first extension portion (412) and the second extension portion (422). The adhesive member (460) may adhere the first extension portion (412) and the second extension portion (422). The first circuit board (410) and the second circuit board (420) may be coupled to form a substrate assembly (430).

[0165] According to one embodiment, the substrate assembly (530) may include a first circuit board (510), a second circuit board (520), and an adhesive member (560). The description of the first circuit board (510), the second circuit board (520), the substrate assembly (530), and the adhesive member (560) may be identical to the description of the components described with reference to FIGS. 1 to 24 (e.g., the first circuit board (410), the second circuit board (420), the substrate assembly (430), and the adhesive member (460)). The adhesive member (560) may be disposed between the first extension portion (512) and the second extension portion (522), and may bond the first extension portion (512) and the second extension portion (522). The first extension portion (512) may include a first through hole (519), and the second extension portion (522) may include a second through hole (529). The first through hole (519) and the second through hole (529) may face each other. The substrate assembly (530) may include a through hole (539). The through hole (539) may include the first through hole (519) and the second through hole (529). The substrate assembly (530) may include a fastening member (570). The fastening member (570) may include a screw. The fastening member (570) may be inserted into the through hole (539) to couple the first circuit board (510) and the second circuit board (520).

[0166] An electronic device includes a housing and a circuit board disposed within the housing. The circuit board can transmit electrical signals to ports to which electronic components (e.g., USB and HDMI ports) external to the electronic device are connected. The circuit board includes a main circuit board on which a CPU is disposed, a sub circuit board connected to the ports, and a flexible circuit board connecting the main circuit board and the sub circuit board. When connecting the main circuit board and the sub circuit board via the flexible circuit board, high-speed signals generated from the CPU may not be transmitted to the sub circuit board.

[0167] The problem to be solved in the present disclosure may be to provide a circuit board that allows smooth transmission of high-speed signals.

[0168] A problem to be solved in the present disclosure may be to provide a circuit board that is easy to assemble.

[0169] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0170] An electronic device according to various embodiments of the present disclosure can transmit a high-speed signal at a connection portion between the first circuit board and the second circuit board by overlapping at least a portion of the first circuit board and the second circuit board.

[0171] According to various embodiments of the present disclosure, an electronic device can facilitate assembly of a first circuit board and a second circuit board by stacking and joining a first extension portion and a second extension portion.

[0172] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0173] A circuit board according to one embodiment of the present disclosure (e.g., 400 of FIGS. 1 to 25) may include a first circuit board (e.g., 410 of FIGS. 1 to 25).

[0174] A circuit board (e.g., 400 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a second circuit board (e.g., 420 of FIGS. 1 to 25) coupled with the first circuit board (e.g., 410 of FIGS. 1 to 25).

[0175] According to one embodiment of the present disclosure, the first circuit board (e.g., 410 of FIGS. 1 to 25) may include a first body (e.g., 411 of FIGS. 1 to 25) connected to a port (e.g., 491 of FIGS. 1 to 25).

[0176] The first circuit board (e.g., 410 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a first extension portion (e.g., 412 of FIGS. 1 to 25) extending in a first direction from the first body (e.g., 411 of FIGS. 1 to 25).

[0177] The second circuit board (e.g., 420 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include the first body (e.g., 411 of FIGS. 1 to 25) and a second body (e.g., 421 of FIGS. 1 to 25) spaced apart in the first direction.

[0178] The second circuit board (e.g., 420 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a second extension portion (e.g., 422 of FIGS. 1 to 25) extending from the second body (e.g., 421 of FIGS. 1 to 25) toward the first body (e.g., 411 of FIGS. 1 to 25).

[0179] According to one embodiment of the present disclosure, the first extension portion (e.g., 412 of FIGS. 1 to 25) and the second extension portion (e.g., 422 of FIGS. 1 to 25) may be laminated in a second direction orthogonal to the first direction between the first body (e.g., 411 of FIGS. 1 to 25) and the second body (e.g., 421 of FIGS. 1 to 25).

[0180] According to one embodiment of the present disclosure, the first body (e.g., 411 of FIGS. 1 to 25) may include a first step surface (e.g., 4113 of FIGS. 1 to 25) coupled with the second extension portion (e.g., 422 of FIGS. 1 to 25), and the second body (e.g., 421 of FIGS. 1 to 25) may include a second step surface (e.g., 4213 of FIGS. 1 to 25) coupled with the first extension portion (e.g., 412 of FIGS. 1 to 25).

[0181] According to one embodiment of the present disclosure, the first extension portion (e.g., 412 of FIGS. 1 to 25) may include a first extension surface (e.g., 4121 of FIGS. 1 to 25) coupled with the second extension portion (e.g., 422 of FIGS. 1 to 25), and the second extension portion (e.g., 422 of FIGS. 1 to 25) may include a second extension surface (e.g., 4221 of FIGS. 1 to 25) coupled with the first extension surface (e.g., 4121 of FIGS. 1 to 25).

[0182] The first circuit board (e.g., 410 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a first edge (e.g., 4123 of FIGS. 1 to 25) formed at a portion where the first body (e.g., 411 of FIGS. 1 to 25) and the first extension portion (e.g., 412 of FIGS. 1 to 25) are connected.

[0183] The second circuit board (e.g., 420 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a second edge (e.g., 4223 of FIGS. 1 to 25) formed at a portion where the second body (e.g., 421 of FIGS. 1 to 25) and the second extension portion (e.g., 422 of FIGS. 1 to 25) are connected.

[0184] A circuit board (e.g., 400 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a terminal (e.g., 434, 435 of FIGS. 1 to 25) disposed between the first extension portion (e.g., 412 of FIGS. 1 to 25) and the second extension portion (e.g., 422 of FIGS. 1 to 25).

[0185] A circuit board (e.g., 400 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include an adhesive member (e.g., 460 of FIGS. 1 to 25) disposed between the first extension portion (e.g., 412 of FIGS. 1 to 25) and the second extension portion (e.g., 422 of FIGS. 1 to 25).

[0186] The adhesive member (e.g., 460 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a first-first adhesive portion (e.g., 4611 of FIGS. 1 to 25) disposed on the first extension portion (e.g., 412 of FIGS. 1 to 25).

[0187] The adhesive member (e.g., 460 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a first-second adhesive portion (e.g., 4612 of FIGS. 1 to 25) disposed on the first body (e.g., 411 of FIGS. 1 to 25).

[0188] A circuit board (e.g., 400 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a pattern member (e.g., 440 of FIGS. 1 to 25) disposed between the first extension portion (e.g., 412 of FIGS. 1 to 25) and the second extension portion (e.g., 422 of FIGS. 1 to 25) and including a plurality of patterns (e.g., 441 of FIGS. 1 to 25) formed on the first extension portion (e.g., 412 of FIGS. 1 to 25).

[0189] A circuit board (e.g., 400 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include an adhesive member (e.g., 460 of FIGS. 1 to 25) disposed between the pattern member (e.g., 440 of FIGS. 1 to 25) and the second extension portion (e.g., 422 of FIGS. 1 to 25).

[0190] According to one embodiment of the present disclosure, the plurality of patterns (e.g., 441 of FIGS. 1 to 25) may be arranged along the circumferential direction of the first extension portion (e.g., 412 of FIGS. 1 to 25).

[0191] A circuit board (e.g., 400 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a substrate assembly (e.g., 430 of FIGS. 1 to 25) including a first circuit board (e.g., 410 of FIGS. 1 to 25) and a second circuit board (e.g., 420 of FIGS. 1 to 25) that are coupled to each other.

[0192] The substrate assembly (e.g., 430 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a first portion (e.g., 431 of FIGS. 1 to 25) in which the first body (e.g., 411 of FIGS. 1 to 25) is positioned.

[0193] The substrate assembly (e.g., 430 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a second portion (e.g., 432 of FIGS. 1 to 25) in which the second body (e.g., 421 of FIGS. 1 to 25) is positioned.

[0194] The substrate assembly (e.g., 430 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a third portion (e.g., 433 of FIGS. 1 to 25) that connects the first portion (e.g., 431 of FIGS. 1 to 25) and the second portion (e.g., 432 of FIGS. 1 to 25) and where the first and second extension portions (e.g., 412 and 422 of FIGS. 1 to 25) are located.

[0195] The substrate assembly (e.g., 430 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a first surface (e.g., 4301 of FIGS. 1 to 25) formed by aligning the first circuit board (e.g., 410 of FIGS. 1 to 25), the second extension portion (e.g., 422 of FIGS. 1 to 25), and the second body (e.g., 421 of FIGS. 1 to 25) in the first direction.

[0196] According to one embodiment of the present disclosure, the width of the first body (e.g., 411 of FIGS. 1 to 25) in the first direction may be greater than the width of the first extension portion (e.g., 412 of FIGS. 1 to 25) in the first direction.

[0197] A circuit board (e.g., 400 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a first substrate portion (e.g., 401 of FIGS. 1 to 25) on which a processor (e.g., 4011 of FIGS. 1 to 25) is disposed.

[0198] A circuit board (e.g., 400 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a second substrate portion (e.g., 402 of FIGS. 1 to 25) disposed between the first substrate portion (e.g., 401 of FIGS. 1 to 25) and the port (e.g., 491 of FIGS. 1 to 25).

[0199] A circuit board (e.g., 400 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a connecting portion (e.g., 404 of FIGS. 1 to 25) that connects the first substrate portion (e.g., 401 of FIGS. 1 to 25) and the second substrate portion (e.g., 402 of FIGS. 1 to 25) and where the first and second extension portions (e.g., 412 and 422 of FIGS. 1 to 25) are located.

[0200] The first circuit board (e.g., 410 of FIGS. 1 to 25) according to one embodiment of the present disclosure may be positioned on the second substrate portion (e.g., 402 of FIGS. 1 to 25) and include a plurality of first signal layers.

[0201] The second circuit board (e.g., 420 of FIGS. 1 to 25) according to one embodiment of the present disclosure may be positioned on the first substrate portion (e.g., 401 of FIGS. 1 to 25) and include a plurality of second signal layers greater than the number of the plurality of first signal layers.

[0202] According to one embodiment of the present disclosure, the first circuit board (e.g., 410 of FIGS. 1 to 25) may include a first body (e.g., 411 of FIGS. 1 to 25) connected to a port (e.g., 491 of FIGS. 1 to 25) and including a first step surface (e.g., 4113 of FIGS. 1 to 25) facing the second circuit board (e.g., 420 of FIGS. 1 to 25).

[0203] According to one embodiment of the present disclosure, the first circuit board (e.g., 410 of FIGS. 1 to 25) may include a first extension portion (e.g., 412 of FIGS. 1 to 25) extending from the first step surface (e.g., 4113 of FIGS. 1 to 25) toward the second circuit board (e.g., 420 of FIGS. 1 to 25).

[0204] The second circuit board (e.g., 420 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a second body (e.g., 421 of FIGS. 1 to 25) connected to a control circuit (e.g., 492 of FIGS. 1 to 25) and including a second step surface (e.g., 4213 of FIGS. 1 to 25) facing the first extension portion (e.g., 412 of FIGS. 1 to 25).

[0205] The second circuit board (e.g., 420 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a second extension portion (e.g., 422 of FIGS. 1 to 25) extending from the second step surface (e.g., 4213 of FIGS. 1 to 25) toward the first body (e.g., 411 of FIGS. 1 to 25).

[0206] An electronic device (e.g., 101 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a housing (e.g., 302 of FIGS. 1 to 25).

[0207] An electronic device (e.g., 101 of FIGS. 1 to 25) according to one embodiment of the present disclosure may include a circuit board (e.g., 400 of FIGS. 1 to 25) disposed inside the housing (e.g., 302 of FIGS. 1 to 25).

[0208] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

[0209] While this disclosure has been described by way of example and example, it should be understood that the specific embodiment is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. In the circuit board (400), First circuit board (410); and It includes a second circuit board (420) coupled with the first circuit board (410), The above first circuit board (410) is A first body (411) connected to a port (491); and It includes a first extension portion (412) extending in a first direction from the first body (411), The above second circuit board (420) is A second body (421) spaced apart from the first body (411) in the first direction; and It includes a second extension portion (422) extending from the second body (421) toward the first body (411), A circuit board (400) in which the first extension portion (412) and the second extension portion (422) are laminated in a second direction orthogonal to the first direction between the first body (411) and the second body (421).

2. In paragraph 1, A circuit board in which the first body (411) includes a first step surface (4113) coupled with the second extension portion (422), and the second body (421) includes a second step surface (4213) coupled with the first extension portion (412).

3. In paragraph 1 or 2, A circuit board in which the first extension portion (412) includes a first extension surface (4121) coupled with the second extension portion (422), and the second extension portion (422) includes a second extension surface (4221) coupled with the first extension surface (4121).

4. In any one of paragraphs 1 to 3, The first circuit board (410) includes a first edge (4123) formed at a portion where the first body (411) and the first extension portion (412) are connected, The second circuit board (420) is a circuit board including a second edge (4223) formed at a portion where the second body (421) and the second extension portion (422) are connected.

5. In any one of paragraphs 1 to 4, A circuit board further comprising a terminal (434, 435) arranged between the first extension portion (412) and the second extension portion (422).

6. In any one of paragraphs 1 to 5, A circuit board further comprising an adhesive member (460) positioned between the first extension portion (412) and the second extension portion (422).

7. In paragraph 6, The above adhesive member (460) is A first-first adhesive portion (4611) arranged on the first extension portion (412); and A circuit board including a first-second adhesive portion (4612) arranged on the first body (411).

8. In any one of paragraphs 1 to 7, A pattern member (440) disposed between the first extension portion (412) and the second extension portion (422), and including a plurality of patterns (441) formed on the first extension portion (412) and arranged along the circumferential direction of the first extension portion (412); and A circuit board further comprising an adhesive member (460) positioned between the pattern member (440) and the second extension portion (422).

9. In any one of paragraphs 1 to 8, A circuit board further comprising a substrate assembly (430) including the first circuit board (410) and the second circuit board (420) in a coupled state.

10. In paragraph 9, The above substrate assembly (430) is A first part (431) where the first body (411) is located; A second part (432) where the second body (421) is located; and A circuit board including a third part (433) connecting the first part (431) and the second part (432) and where the first and second extension parts (412, 422) are located.

11. In clause 9 or 10, The above substrate assembly (430) is A circuit board including a first surface (4301) formed by the first circuit board (410), the second extension portion (422), and the second body (421) being aligned in the first direction.

12. In any one of paragraphs 1 to 11, A circuit board in which the width of the first body (411) in the first direction is greater than the width of the first extension portion (412) in the first direction.

13. In any one of paragraphs 1 to 12, A first substrate portion (401) on which a processor (4011) is arranged; A second substrate portion (402) arranged between the first substrate portion (401) and the port (491); and A circuit board further comprising a connecting portion (404) connecting the first substrate portion (401) and the second substrate portion (402) and where the first and second extension portions (412, 422) are located.

14. In paragraph 13, The above first circuit board (410) is Located on the second substrate portion (402) and including a plurality of first signal layers, The above second circuit board (420) is A circuit board positioned on the first substrate portion (401) and including a plurality of second signal layers greater than the number of the plurality of first signal layers.

15. In an electronic device (101), Housing (302); and It includes a circuit board (400) placed inside the above housing (302), The above circuit board (400) is First circuit board (410); and It includes a second circuit board (420) coupled with the first circuit board (410), The above first circuit board (410) is A first body (411) connected to a port (491); and It includes a first extension portion (412) extending in a first direction from the first body (411), The above second circuit board (420) is A second body (421) spaced apart from the first body (411) in the first direction; and It includes a second extension portion (422) extending from the second body (421) toward the first body (411), An electronic device (101) in which the first extension portion (412) and the second extension portion (422) are laminated in a second direction orthogonal to the first direction between the first body (411) and the second body (421).

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