Antenna spring and electronic device

Abstract

Provided in the present application are an antenna spring and an electronic device. The mounting space for the antenna spring can be reduced, and the space utilization rate in the electronic device is improved, thereby facilitating miniaturization design of the electronic device. The electronic device comprises a frame, an antenna spring, a circuit board and an electrically conductive elastic piece, wherein the antenna spring, the circuit board and the electrically conductive elastic piece are all mounted on an inner side of the frame. The frame comprises a frame antenna; the antenna spring is located between the frame antenna and the circuit board; the antenna spring comprises a fixed portion, an abutting portion and a connecting portion, wherein the fixed portion and the abutting portion are both fixedly connected to the connecting portion, the fixed portion is fixedly connected to the frame antenna, and the projection of the abutting portion on the connecting portion and the fixed portion are spaced apart from each other; and the electrically conductive elastic piece is mounted on the side of the circuit board facing the antenna spring, and abuts against the abutting portion.

Description

Antenna reed and electronic devices

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on October 30, 2023, with application number 202311431181.9 and application name “Antenna Reed and Electronic Device”, and the Chinese patent application filed with the China Patent Office on February 8, 2024, with application number 202410178126.1 and application name “Antenna Reed and Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic equipment, and in particular to an antenna reed and an electronic device. Background Art

[0003] Antennas are crucial components for ensuring the reliability and stability of electronic devices, such as mobile phones. Currently, electrical connectivity between the antenna and the circuit board is achieved using antenna reeds. To accommodate the circuit board's mounting position within the device, existing antenna reeds typically have their spot welding surfaces tilted. However, this causes the antenna reed to occupy a significant amount of mounting space, reducing internal space utilization and hindering miniaturization.

[0004] Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide an antenna spring and an electronic device, which can reduce the installation space of the antenna spring and improve the space utilization inside the electronic device, thereby facilitating the miniaturization design of the electronic device.

[0006] In a first aspect, an embodiment of the present application provides an electronic device comprising a frame, an antenna spring, a circuit board, and a conductive spring, wherein the antenna spring, the circuit board, and the conductive spring are all mounted on the inner side of the frame, the frame includes a frame antenna, and the antenna spring is located between the frame antenna and the circuit board; the antenna spring comprises a fixing portion, an abutting portion, and a connecting portion, the fixing portion and the abutting portion are both fixedly connected to the connecting portion, the fixing portion is fixedly connected to the frame antenna, and the projection of the abutting portion on the connecting portion is spaced apart from the fixing portion; the conductive spring is mounted on a side of the circuit board facing the antenna spring and abuts the abutting portion. In the electronic device provided by the present application, by spacing the projection of the abutting portion of the antenna spring on the connecting portion from the fixing portion, the abutting portion and the fixing portion are decoupled, thereby reducing the distance between the junction of the abutting portion and the connecting portion and the frame antenna, thereby reducing the installation space of the antenna spring in the electronic device, improving the space utilization inside the electronic device, and promoting the miniaturization design of the electronic device.

[0007] In one possible embodiment, the abutting portion and the fixing portion are arranged to at least partially overlap along the thickness direction of the electronic device. In this arrangement, the mounting space of the abutting portion and the fixing portion in the thickness direction of the electronic device can be reused, thereby reducing the thickness of the electronic device and facilitating the miniaturization of the electronic device.

[0008] In one possible embodiment, the frame antenna includes a fixing surface, the fixing surface faces the inner side of the frame, the fixing portion is fixedly connected to the fixing surface, and the maximum distance between the connection between the abutting portion and the connecting portion and the fixing surface is less than 2 mm. The distance between the connection between the abutting portion and the connecting portion and the fixing surface is greater than or equal to 0.05 mm. Exemplarily, the distance between the connection between the abutting portion and the connecting portion and the fixing surface is equal to or greater than 0.1 mm and less than or equal to 0.5 mm. Under this setting, the distance between the connection between the abutting portion and the connecting portion and the fixing surface of the frame antenna can be compressed to a smaller value, thereby reducing the installation space occupied by the antenna spring in the electronic device.

[0009] In one possible embodiment, the fixing portion is provided with multiple soldering points, which are arranged sequentially along the length of the antenna spring. This arrangement can increase the length of the antenna spring, thereby helping to improve the structural strength of the antenna spring and further enhance the reliability of the soldering between the antenna spring and the frame antenna.

[0010] In one possible embodiment, the fixing portion includes two sub-fixing portions, each fixedly connected to opposite sides of the connecting portion along the length of the antenna spring. Along the width of the antenna spring, the two sub-fixing portions are spaced apart from the projection of the abutting portion on the connecting portion, and each sub-fixing portion is provided with at least one soldering point. In this embodiment, both sub-fixing portions of the fixing portion can be soldered to the frame antenna, thereby enhancing the reliability of the soldering between the antenna spring and the frame antenna.

[0011] In one possible embodiment, each of the sub-fixing portions is provided with multiple solder points, with the multiple solder points arranged sequentially along the length of the antenna reed, or the multiple solder points arranged sequentially along the thickness of the electronic device, or some of the solder points arranged sequentially along the length of the antenna reed, and some of the solder points arranged sequentially along the thickness of the electronic device. With this arrangement, the antenna reed can be secured to the frame antenna in a relatively small installation space, thereby increasing the flexibility of the electrical connection design between the antenna reed and the frame antenna.

[0012] In one possible embodiment, the connecting portion includes two sub-connecting portions, each fixedly connected to opposite sides of the fixed portion along the length of the antenna spring. The abutting portion includes two sub-abutting portions, each fixedly connected to one of the sub-connecting portions, with the projection of each sub-abutting portion on one of the sub-connecting portions being spaced apart from the fixed portion. In this embodiment, there are two conductive springs, each of which abuts against one of the sub-abutting portions. One conductive spring is used to feed power to the mid-frame antenna, and the other is used to tune the signal in the mid-frame antenna. In this embodiment, by providing two sub-abutting portions on the antenna spring, both the conductive spring for power feeding and the conductive spring for signal tuning can be mounted on a single antenna spring, eliminating the need for separate antenna springs for power feeding and signal tuning within the electronic device. This reduces the installation space occupied by the antenna spring within the electronic device, improving internal space utilization and thereby facilitating miniaturization of the electronic device.

[0013] In one possible embodiment, the fixing portion has a first end and a second end, the first end and the second end being disposed opposite each other along the thickness direction of the electronic device, and the distance between the first end and the second end being equal to or greater than 0.6 mm. This arrangement ensures that the fixing portion has a sufficiently large welding area, thereby ensuring stable welding between the fixing portion and the frame antenna.

[0014] In a possible embodiment, the electronic device also includes a support plate, which is located on the inner side of the frame and fixedly connected to the frame, and the support plate is provided with a mounting groove and an avoidance groove, the opening of the mounting groove is located on the bottom surface of the support plate, and the opening of the avoidance groove is located on the bottom wall of the mounting groove; the antenna reed, the circuit board and the conductive spring are all installed in the mounting groove, and the fixing part extends into the avoidance groove to reduce the installation space of the antenna reed and improve the space utilization inside the electronic device.

[0015] In one possible embodiment, the antenna spring includes a first end face facing away from the bottom wall of the avoidance groove, and the first end face is lower than the edge of the fixing surface facing away from the bottom wall of the avoidance groove, or the first end face is flush with the edge of the fixing surface facing away from the bottom wall of the avoidance groove, so as to avoid the first end face of the antenna spring exceeding the edge of the fixing surface facing away from the bottom wall of the avoidance groove, thereby also helping to promote the miniaturization design of electronic equipment.

[0016] In one possible embodiment, the distance between the junction of the abutting portion and the connecting portion and the first end surface is equal to or greater than 0.2 mm. With this configuration, the distance between the junction of the abutting portion and the connecting portion and the first end surface can be reduced to a smaller value, thereby increasing the structural design freedom of the antenna spring.

[0017] In a second aspect, the present application further provides an antenna spring for use in an electronic device, the antenna spring comprising a fixing portion, an abutting portion, and a connecting portion, the fixing portion and the abutting portion being both fixedly connected to the connecting portion, the fixing portion being fixedly connected to the frame antenna, and the projection of the abutting portion on the connecting portion being spaced apart from the fixing portion. The antenna spring provided in the present application can decouple the abutting portion from the fixing portion by spacing the projection of the abutting portion on the connecting portion apart from the fixing portion, thereby reducing the distance between the connection between the abutting portion and the connecting portion and the frame antenna, thereby reducing the installation space of the antenna spring in the electronic device, improving the space utilization inside the electronic device, and promoting the miniaturization design of the electronic device.

[0018] In a possible implementation manner, the fixing portion, the abutting portion, and the connecting portion are integrally formed to facilitate processing and forming of the antenna spring. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0020] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0021] FIG2 is a schematic diagram of a partial structure of the electronic device shown in FIG1 ;

[0022] FIG3 is a schematic structural diagram of the assembly of a circuit board and electronic components in the electronic device shown in FIG1 ;

[0023] FIG4 is a schematic cross-sectional view of the electronic device shown in FIG2 taken along line AA;

[0024] FIG5 is a schematic diagram of the exploded structure of the electronic device shown in FIG2 ;

[0025] FIG6 is an enlarged schematic diagram of area B in FIG5 ;

[0026] FIG7 is a schematic cross-sectional view of the structure taken along line BB in FIG6 ;

[0027] FIG8 is a schematic structural diagram of an antenna reed in a first embodiment of the electronic device shown in FIG2 ;

[0028] FIG9 is a schematic diagram of a partial structure of the electronic device shown in FIG2 in a second embodiment;

[0029] FIG10 is a schematic structural diagram of the antenna reed in the electronic device shown in FIG9;

[0030] FIG11 is a schematic diagram of a partial structure of the electronic device shown in FIG2 in a third embodiment;

[0031] FIG12 is a schematic structural diagram of the antenna reed in the electronic device shown in FIG11;

[0032] FIG13 is a schematic diagram of a partial structure of the electronic device shown in FIG2 in a fourth embodiment;

[0033] FIG14 is a schematic structural diagram of the antenna reed in the electronic device shown in FIG13;

[0034] FIG15 is a schematic diagram of a partial structure of the electronic device shown in FIG2 in a fifth embodiment;

[0035] FIG16 is a schematic structural diagram of the antenna reed in the electronic device shown in FIG15;

[0036] FIG17 is a schematic diagram of a partial structure of the electronic device shown in FIG2 in a sixth embodiment;

[0037] FIG18 is a schematic structural diagram of an antenna reed in the electronic device shown in FIG17 . DETAILED DESCRIPTION

[0038] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0039] Please refer to Figures 1 to 3 in combination. Figure 1 is a structural diagram of an electronic device 100 provided in an embodiment of the present application. Figure 2 is a partial structural diagram of the electronic device 100 shown in Figure 1. Figure 3 is a structural diagram of the assembly of the circuit board 120 and the electronic device 130 in the electronic device 100 shown in Figure 1.

[0040] The embodiment of the present application provides an electronic device 100, which includes but is not limited to mobile phones, tablet computers, laptop computers, wearable devices, and other devices equipped with antenna components. Among them, the wearable device can be a smart bracelet, a smart watch, augmented reality (AR) glasses, virtual reality (VR) glasses, etc. The embodiment of the present application is described by taking the electronic device 100 as a mobile phone as an example. For the convenience of description, the width direction of the electronic device 100 is defined as the X-axis direction, the length direction of the electronic device 100 is defined as the Y-axis direction, and the thickness direction of the electronic device is defined as the Z-axis direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other.

[0041] In this embodiment, the electronic device 100 may include a housing 110, a circuit board 120, an electronic device 130, a battery (not shown) and a display screen (not shown). The circuit board 120, the electronic device 130 and the battery (not shown) are all mounted on the inner side of the housing 110. Exemplarily, the circuit board 120 is a roughly circular plate-shaped structure. The circuit board 120 can serve as the main board of the electronic device 100. The electronic device 130 is mounted on the circuit board 120 and is electrically connected to the circuit board 120. Exemplarily, the electronic device 130 may be a radio frequency antenna device. The battery is electrically connected to the circuit board 120. The battery can serve as a power source for the electronic device 100 and provide electrical energy to the electronic device 130. The display screen is mounted on one side of the housing 110 and is electrically connected to the circuit board 120. The display screen can serve as a display device of the electronic device 100 and is used to display information such as pictures or text.

[0042] Please refer to Figures 4 to 6. Figure 4 is a schematic cross-sectional view of the electronic device 100 shown in Figure 2 taken along line AA. Figure 5 is a schematic exploded view of the electronic device 100 shown in Figure 2. Figure 6 is an enlarged view of area B in Figure 5.

[0043] In this embodiment, the shell 110 includes a frame 10, a support plate 60 and a back cover 20. The support plate 60 is located on the inner side of the frame 10 and is fixedly connected to the frame 10. The support plate 60 is provided with a mounting groove 61 and an avoidance groove 62. The opening of the mounting groove 61 is located on the bottom surface of the support plate 60, and the mounting groove 61 is recessed from the bottom surface of the support plate 60 to the top surface. The mounting groove 61 can accommodate the circuit board 120. In other words, the circuit board 120 is installed in the mounting groove 61. That is, the circuit board 120 is installed on the inner side of the frame 10. The opening of the avoidance groove 62 is located on the bottom wall of the mounting groove 61. The avoidance groove 62 is recessed from the bottom wall of the mounting groove 61 to the top surface of the support plate 60.

[0044] It should be noted that the directional terms such as "top" and "bottom" involved in this application are described with reference to the orientation shown in Figure 1, with the direction facing the positive Z-axis as "top" and the direction facing the negative Z-axis as "bottom". It does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0045] The back cover 20 is mounted on the bottom side of the support plate 60 and connected to the frame 10. Along the thickness direction of the electronic device 100 (the Z-axis in the figure), the back cover 20 and the display screen are located on opposite sides of the frame 10. When the user is using the electronic device 100, the display screen is positioned toward the user, and the back cover 20 is positioned away from the user.

[0046] The frame 10 includes a frame antenna 11 and an insulating portion 12. There may be multiple frame antennas 11. Multiple frame antennas 11 are spaced apart along the X-axis. Each frame antenna 11 includes a fixing surface 111, which faces the inside of the frame 10. The frame antenna 11 is used to ensure normal communication of the electronic device 100. The insulating portion 12 is fixedly connected between two adjacent frame antennas 11.

[0047] In addition, the electronic device 100 further includes a connector 160, which is fixedly connected between the back cover 20 and the support plate 60 to secure the back cover 20 to the support plate 60. In this embodiment, the connector 160 may be adhesive. For example, along the Z-axis, the length of the orthographic projection of the connector 160 on the support plate 60 is 1.6 mm.

[0048] 6 to 8 , FIG. 7 is a schematic cross-sectional view taken along line BB in FIG. 6 , and FIG. 8 is a schematic structural view of the antenna reed 140 in the electronic device 100 shown in FIG. 2 in a first embodiment.

[0049] The electronic device 100 also includes an antenna spring 140 and a conductive spring 150. Both the antenna spring 140 and the conductive spring 150 are mounted in the mounting slot 61 and are located inside the frame 10. The antenna spring 140 is fixedly mounted inside the frame antenna 11 and electrically connected to the frame antenna 11. It is spaced apart from the circuit board 120. The conductive spring 150 is electrically connected between the antenna spring 140 and the circuit board 120.

[0050] In this embodiment, the antenna reed 140 is made of a metal material. The antenna reed 140 includes a first end face 140a that faces away from the bottom wall of the avoidance groove 62. The first end face 140a is lower than the edge of the bottom wall of the fixing surface 111 of the frame antenna 11 that faces away from the avoidance groove 62, or the first end face 140a is flush with the edge of the bottom wall of the fixing surface 111 that faces away from the avoidance groove 62. The antenna reed 140 also includes a fixing portion 30, an abutting portion 40 and a connecting portion 50. The fixing portion 30 and the abutting portion 40 are both fixedly connected to the connecting portion 50. Exemplarily, the fixing portion 30, the abutting portion 40 and the connecting portion 50 can be integrally formed. For example, one or more processing techniques such as cutting, bending and stamping can be used to achieve integral molding of the fixing portion 30, the abutting portion 40 and the connecting portion 50.

[0051] In this embodiment, the fixing portion 30 and the connecting portion 50 are located on the same plane. Specifically, the fixing portion 30 is fixedly mounted on the fixing surface 111 of the frame antenna 11 and extends into the avoidance groove 62 to fix the antenna reed 140 to the inner side of the frame antenna 11, thereby electrically connecting the antenna reed 140 to the frame antenna 11. For example, the fixing portion 30 can be fixed to the fixing surface 111 of the frame antenna 11 by welding.

[0052] The fixing portion 30 has a first end 31 and a second end 32, and the first end 31 and the second end 32 are arranged opposite to each other along the thickness direction of the electronic device 100 (Z-axis direction in the figure). The distance d2 between the first end 31 and the second end 32 is equal to or greater than 0.6 mm. The fixing portion 30 is also provided with a plurality of soldering points 33. Exemplarily, there are four soldering points 33, and they are all circular. The four soldering points 33 are arranged in two rows and two columns. The diameter D1 of each soldering point 33 is equal to or greater than 0.6 mm. Under this setting, it can be ensured that the fixing portion 30 has a sufficiently large welding area, thereby ensuring the welding stability between the fixing portion 30 and the border antenna 11.

[0053] In this embodiment, the projection of the abutting portion 40 on the connecting portion 50 is spaced apart from the fixing portion 30. Exemplarily, along the length direction of the electronic device 100 (the Y-axis direction in the figure), the projection of the abutting portion 40 on the connecting portion 50 is spaced apart from the fixing portion 30. The distance between the projection of the abutting portion 40 on the connecting portion 50 and the fixing portion 30 is equal to or greater than 0.25 mm. Exemplarily, the abutting portion 40 and the connecting portion 50 are perpendicular to each other. In other embodiments, the abutting portion 40 and the connecting portion 50 may also be arranged at an angle. In this embodiment, along the thickness direction of the connecting portion 50 (the Y-axis direction in the figure), the abutting portion 40 extends away from the frame antenna 11. Exemplarily, along the Y-axis direction, the length of the abutting portion 40 is 1.5 mm. The end of the abutting portion 40 away from the connecting portion 50 is spaced apart from the circuit board 120. The distance l between the junction of the abutting portion 40 and the connecting portion 50 and the first end surface 140a is equal to or greater than 0.2 mm.

[0054] In this embodiment, the distance d1 between the connection point of the abutting portion 40 and the connecting portion 50 and the fixing surface 111 of the frame antenna 11 is greater than or equal to 0.05 mm, and the maximum distance between the connection point of the abutting portion 40 and the connecting portion 50 and the fixing surface 111 of the frame antenna 11 is less than 2 mm. In particular, along the length direction of the electronic device 100 (the Y-axis direction in the figure), the distance d1 between the connection point of the abutting portion 40 and the connecting portion 50 and the fixing surface 111 of the frame antenna 11 is greater than or equal to 0.09 mm, and the maximum distance between the connection point of the abutting portion 40 and the connecting portion 50 and the fixing surface 111 of the frame antenna 11 is less than 1.03 mm. Exemplarily, the distance d1 between the connection point of the abutting portion 40 and the connecting portion 50 and the fixing surface 111 is equal to or greater than 0.1 mm and less than or equal to 0.5 mm. In particular, along the length direction of the electronic device 100 (the Y-axis direction in the figure), the distance d1 between the connection point between the abutting portion 40 and the connecting portion 50 and the fixing surface 111 is equal to or greater than 0.1 mm and less than or equal to 0.3 mm. In addition, along the thickness direction of the electronic device 100 (the Z-axis direction in the figure), the abutting portion 40 and the fixing portion 30 are at least partially overlapped. With this arrangement, the installation space of the abutting portion 40 and the fixing portion 30 in the thickness direction of the electronic device 100 can be reused, thereby reducing the thickness of the electronic device 100 and facilitating a miniaturized design of the electronic device 100.

[0055] In this embodiment, the abutting portion 40 is provided with a spring point 41. Exemplarily, the spring point 41 is circular. The diameter D2 of the spring point 41 is equal to or greater than 0.8 mm. It is understood that by spacing the projection of the abutting portion 40 on the connecting portion 50 from the fixing portion 30, the spring point 41 of the abutting portion 40 is decoupled from the solder point 33 of the fixing portion 30. This allows the distance between the connection point of the abutting portion 40 and the connecting portion 50 and the first end surface 140 a to be reduced, without being constrained by the diameter of the solder point 33. This arrangement reduces the distance between the connection point of the abutting portion 40 and the connecting portion 50 and the first end surface 140 a, thereby reducing the distance between the connection point of the abutting portion 40 and the connecting portion 50 and the fixing surface 111 of the frame antenna 11. This, in turn, reduces the installation space occupied by the antenna reed 140 in the electronic device 100, improving space utilization within the electronic device 100 and promoting a more compact design of the electronic device 100. On the other hand, the space reserved for the frame antenna 11 in the electronic device 100 can also be increased, thereby increasing the antenna clearance of the frame antenna 11 and helping to improve the performance of the frame antenna 11. At the same time, the degree of freedom in the structural design of the antenna spring 140 can also be increased. In addition, the antenna spring provided in this application does not occupy the surface of the support plate 60 used for bonding the connector 160, which can ensure that the area of ​​the support plate 60 used for bonding the connector 160 remains unchanged, thereby ensuring a better connection reliability between the support plate 60 and the back cover 20.

[0056] Please refer again to Figures 4 and 6. The conductive spring 150 is mounted on the side of the circuit board 120 facing the antenna spring 140 and abuts the abutting portion 40 of the antenna spring 140. Specifically, one end of the conductive spring 150 elastically abuts against the elastic point 41 of the abutting portion 40 of the antenna spring 140, thereby electrically connecting the conductive spring 150 to the antenna spring 140. The other end of the conductive spring 150 is electrically connected to the circuit board 120, thereby enabling electrical conduction between the antenna spring 140 and the circuit board 120. The conductive spring 150 can be used to feed power to the frame antenna 11 or to tune the signal in the frame antenna 11.

[0057] Please refer to FIG. 9 and FIG. 10 . FIG. 9 is a partial structural diagram of the electronic device 100 shown in FIG. 2 in a second embodiment. FIG. 10 is a structural diagram of the antenna reed 140 in the electronic device 100 shown in FIG. 9 .

[0058] The electronic device 100 provided in this embodiment differs from the electronic device 100 provided in the first embodiment described above in that the plurality of solder joints 33 are arranged sequentially along the length of the fixing portion 30. For example, the length of the fixing portion 30 is parallel to the width of the electronic device 100 (the X-axis in the figure). This arrangement increases the length of the antenna reed 140 along the X-axis, thereby improving the structural strength of the antenna reed 140 and, in turn, enhancing the reliability of the soldering between the antenna reed 140 and the frame antenna 11.

[0059] Please refer to FIG. 11 and FIG. 12 . FIG. 11 is a partial structural diagram of the electronic device 100 shown in FIG. 2 in the third embodiment. FIG. 12 is a structural diagram of the antenna reed 140 in the electronic device 100 shown in FIG. 11 .

[0060] The electronic device 100 provided in this embodiment differs from the electronic device 100 provided in the first embodiment described above in that the fixing portion 30 of the antenna reed 140 in the electronic device 100 includes two sub-fixing portions 34. Along the length of the antenna reed 140, the two sub-fixing portions 34 are fixedly connected to opposite sides of the connecting portion 50 and extend away from the connecting portion 50. The two sub-fixing portions 34 extend in opposite directions. Exemplarily, the length of the antenna reed 140 is parallel to the width of the electronic device 100 (the X-axis in the figure). Along the width of the antenna reed 140, each sub-fixing portion 34 is spaced apart from the projection of the abutting portion 40 on the connecting portion 50. Furthermore, each sub-fixing portion 34 is provided with at least one soldering point 33. Exemplarily, the width of the antenna reed 140 is parallel to the length of the electronic device 100 (the Y-axis in the figure).

[0061] In this embodiment, each sub-fixing portion 34 is provided with a plurality of soldering points 33, which are arranged sequentially along the length of the antenna reed 140. For example, the length of the antenna reed 140 is parallel to the width of the electronic device 100 (the X-axis in the figure). With this arrangement, both sub-fixing portions 34 of the fixing portion 30 can be soldered to the frame antenna 11, thereby enhancing the reliability of the soldering between the antenna reed 140 and the frame antenna 11.

[0062] Please refer to FIG. 13 and FIG. 14 . FIG. 13 is a schematic diagram of a partial structure of the electronic device 100 shown in FIG. 2 in the fourth embodiment. FIG. 14 is a schematic diagram of the structure of the antenna reed 140 in the electronic device 100 shown in FIG. 13 .

[0063] The electronic device 100 provided in this embodiment differs from the electronic device 100 provided in the third embodiment described above in that the plurality of solder joints 33 are arranged sequentially along the thickness direction (Z-axis direction in the figure) of the electronic device 100. That is, along the Z-axis direction, both sub-fixing portions 34 extend from the connecting portion 50 toward the bottom wall of the avoidance groove 62. The two sub-fixing portions 34 extend in the same direction.

[0064] Under this setting, the length dimension of each sub-fixing portion 34 along the X-axis direction can be reduced, so that the antenna spring 140 can still be fixed to the border antenna 11 in a smaller installation space, thereby helping to improve the connection flexibility between the antenna spring 140 and the border antenna 11, as well as the flexibility of the electrical connection design between other components in the electronic device 100.

[0065] Please refer to FIG. 15 and FIG. 16 . FIG. 15 is a schematic diagram of a partial structure of the electronic device 100 shown in FIG. 2 in the fifth embodiment. FIG. 16 is a schematic diagram of the structure of the antenna reed 140 in the electronic device 100 shown in FIG. 15 .

[0066] The electronic device 100 provided in this embodiment differs from the electronic device 100 provided in the third embodiment described above in that some of the solder joints 33 are arranged sequentially along the length direction of the antenna reed 140 (the X-axis direction in the figure), and some of the solder joints 33 are arranged sequentially along the thickness direction of the electronic device 100 (the Z-axis direction in the figure). That is, one sub-fixing portion 34 extends from the connecting portion 50 in the X-axis direction toward a direction away from the connecting portion 50, and another sub-fixing portion 34 extends from the connecting portion 50 in the Z-axis direction toward the bottom wall of the avoidance groove 62. This arrangement allows the antenna reed 140 to be fixed to the frame antenna 11 even in a smaller installation space, thereby increasing the flexibility of the electrical connection design between the antenna reed 140 and the frame antenna 11.

[0067] Please refer to FIG. 17 and FIG. 18 . FIG. 17 is a partial structural diagram of the electronic device 100 shown in FIG. 2 in the sixth embodiment. FIG. 18 is a structural diagram of the antenna reed 140 in the electronic device 100 shown in FIG. 17 .

[0068] The electronic device 100 provided in this embodiment differs from the electronic device 100 provided in the first embodiment described above in that the connection portion 50 of the antenna reed 140 in the electronic device 100 includes two sub-connection portions 51. Along the length of the antenna reed 140, the two sub-connection portions 51 are fixedly connected to opposite sides of the fixing portion 30 and extend away from the fixing portion 30. The two sub-connection portions 51 extend in opposite directions. For example, the length of the antenna reed 140 is parallel to the width of the electronic device 100 (the X-axis in the figure).

[0069] In this embodiment, the abutting portion 40 of the antenna reed 140 includes two sub-abutting portions 42. Along the length of the antenna reed 140, the two sub-abutting portions 42 are located on opposite sides of the fixing portion 30. Exemplarily, the length of the antenna reed 140 is parallel to the width of the electronic device 100 (the X-axis in the figure). The minimum distance s between the two sub-abutting portions 42 is between 2 mm and 10 mm. Exemplarily, the minimum distance s between the two sub-abutting portions 42 is 2.1 mm.

[0070] Each sub-abutment portion 42 is fixedly connected to a sub-connection portion 51. The projection of each sub-abutment portion 42 on a sub-connection portion 51 is spaced apart from the fixing portion 30. Exemplarily, along the width direction of the antenna spring 140, the projection of each sub-abutment portion 42 on a sub-connection portion 51 is spaced apart from the fixing portion 30. The width direction of the antenna spring 140 is parallel to the length direction of the electronic device 100 (the Y-axis direction in the figure). Each sub-abutment portion 42 extends along the thickness direction of the sub-connection portion 51 (the Y-axis direction in the figure) in a direction away from the frame antenna 11. The end of each sub-abutment portion 42 away from the sub-connection portion 51 is spaced apart from the circuit board 120. Each sub-abutment portion 42 is provided with a spring point 41. Exemplarily, each sub-abutment portion 42 is perpendicular to a sub-connection portion 51. In other embodiments, each sub-abutment portion 42 may also be obliquely perpendicular to a sub-connection portion 51.

[0071] In this embodiment, two conductive springs 150 are provided. Both conductive springs 150 are mounted on the side of the circuit board 120 facing the antenna reed 140. Each conductive spring 150 abuts against a sub-abutting portion 42 of the antenna reed 140. Specifically, one end of each conductive spring 150 elastically abuts against a spring point 41 of a sub-abutting portion 42, thereby electrically connecting the conductive spring 150 to the antenna reed 140. The other end of each conductive spring 150 is electrically connected to the circuit board 120, thereby achieving electrical continuity between the antenna reed 140 and the circuit board 120.

[0072] In this embodiment, one conductive spring 150 is used to feed power to the frame antenna 11, and the other conductive spring 150 is used to tune the signal in the frame antenna 11. It is understandable that by providing two sub-abutment portions 42 on the antenna spring 140, the conductive spring 150 for feeding power and the conductive spring 150 for signal tuning can be installed on one antenna spring 140, without the need to separately install the antenna spring 140 for feeding power and the antenna spring 140 for signal tuning inside the electronic device 100. This can reduce the installation space occupied by the antenna spring 140 in the electronic device 100, improve the space utilization inside the electronic device 100, and further contribute to the miniaturization design of the electronic device 100.

[0073] The antenna reed 140 provided in the embodiments of the present application decouples the spring point 41 of the abutting portion 40 from the solder point 33 of the fixing portion 30 by spacing the projection of the abutting portion 40 on the connecting portion 50 from the fixing portion 30. This reduces the distance between the connection point between the abutting portion 40 and the connecting portion 50 and the fixing surface 111 of the frame antenna 11. This, in turn, reduces the installation space required for the antenna reed 140 within the electronic device 100, improving space utilization within the electronic device 100 and promoting the miniaturization of the electronic device 100. This also reduces the layout complexity of other components within the electronic device 100. Furthermore, by changing the arrangement of the solder point 33 in the fixing portion 30, the structural design of the antenna reed 140 is further flexible, thereby increasing the flexibility of the electrical connection design between the antenna reed 140 and the frame antenna 11 and facilitating the fixing of the antenna reed 140 to the frame antenna 11.

[0074] The above are only some of the embodiments and implementations of this application. The scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that: It includes a frame, an antenna spring, a circuit board and a conductive spring, wherein the antenna spring, the circuit board and the conductive spring are all installed on the inner side of the frame, the frame includes a frame antenna, and the antenna spring is located between the frame antenna and the circuit board; The antenna spring sheet comprises a fixing portion, an abutting portion and a connecting portion, wherein the fixing portion and the abutting portion are both fixedly connected to the connecting portion, the fixing portion is fixedly connected to the frame antenna, and a projection of the abutting portion on the connecting portion is spaced apart from the fixing portion; The conductive spring sheet is installed on a side of the circuit board facing the antenna spring sheet and abuts against the abutting portion.

2. The electronic device according to claim 1, characterized in that: Along the thickness direction of the electronic device, the contact portion and the fixing portion are at least partially overlapped.

3. The electronic device according to claim 1 or 2, characterized in that: The frame antenna includes a fixing surface, the fixing surface faces the inner side of the frame, the fixing portion is fixedly connected to the fixing surface, and the maximum distance between the connection point between the abutting portion and the connecting portion and the fixing surface is less than 2 mm.

4. The electronic device according to claim 3, characterized in that: The distance between the connection point between the abutting portion and the connecting portion and the fixing surface is greater than or equal to 0.05 mm.

5. The electronic device according to claim 4, characterized in that: The distance between the connection point between the abutting portion and the connecting portion and the fixing surface is equal to or greater than 0.1 mm and less than or equal to 0.5 mm.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The fixing portion is provided with a plurality of welding points, and the plurality of welding points are arranged in sequence along the length direction of the antenna spring piece.

7. The electronic device according to any one of claims 1 to 5, characterized in that: The fixing portion includes two sub-fixing portions. Along the length direction of the antenna spring piece, the two sub-fixing portions are fixedly connected to the opposite sides of the connecting portion respectively. Along the width direction of the antenna spring piece, the two sub-fixing portions are spaced apart from the projection of the abutting portion on the connecting portion, and each of the sub-fixing portions is provided with at least one welding point.

8. The electronic device according to claim 7, characterized in that: Each of the sub-fixing parts is provided with a plurality of welding points, and the plurality of welding points are arranged in sequence along the length direction of the antenna spring piece, or the plurality of welding points are arranged in sequence along the thickness direction of the electronic device, or some of the welding points are arranged in sequence along the length direction of the antenna spring piece, and some of the welding points are arranged in sequence along the thickness direction of the electronic device.

9. The electronic device according to any one of claims 1 to 5, characterized in that: The connecting portion includes two sub-connecting portions, and along the length direction of the antenna spring piece, the two sub-connecting portions are respectively fixedly connected to opposite sides of the fixing portion; The abutting portion includes two sub-abutting portions, each of the sub-abutting portions is fixedly connected to one of the sub-connecting portions, and a projection of each of the sub-abutting portions on one of the sub-connecting portions is spaced apart from the fixing portion.

10. The electronic device according to claim 9, characterized in that: There are two conductive spring sheets, and each conductive spring sheet abuts against one of the sub-abutting portions.

11. The electronic device according to any one of claims 1 to 10, characterized in that: The fixing portion has a first end and a second end, the first end and the second end are arranged opposite to each other along the thickness direction of the electronic device, and a distance between the first end and the second end is equal to or greater than 0.6 mm.

12. The electronic device according to any one of claims 1 to 10, characterized in that: The electronic device further comprises a support plate, the support plate is located on the inner side of the frame and is fixedly connected to the frame, the support plate is provided with a mounting groove and an avoidance groove, the opening of the mounting groove is located on the bottom surface of the support plate, and the opening of the avoidance groove is located on the bottom wall surface of the mounting groove; The antenna spring sheet, the circuit board and the conductive spring sheet are all installed in the installation groove, and the fixing portion extends into the avoidance groove.

13. The electronic device according to claim 12, characterized in that: The antenna spring piece includes a first end face facing away from the bottom wall of the avoidance groove, the first end face is lower than the edge of the fixing surface facing away from the bottom wall of the avoidance groove, or the first end face is flush with the edge of the fixing surface facing away from the bottom wall of the avoidance groove.

14. The electronic device according to claim 13, characterized in that: A distance between a connection point between the abutting portion and the connecting portion and the first end surface is equal to or greater than 0.2 mm.

15. An antenna reed for use in electronic equipment, characterized in that: The antenna spring piece includes a fixing portion, an abutting portion and a connecting portion, wherein the fixing portion and the abutting portion are both fixedly connected to the connecting portion, the fixing portion is fixedly connected to the frame antenna, and a projection of the abutting portion on the connecting portion is spaced apart from the fixing portion.

16. The antenna spring according to claim 15, characterized in that: The fixing portion, the abutting portion and the connecting portion are integrally formed.

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