Process for machining saw teeth by means of circular-arc light path

Abstract

A process for machining saw teeth by means of a circular-arc light path. The process comprises: adjusting scanning patterns (9) of a laser galvanometer (13) to be long-channel-shaped structures with circular arcs (901) at two ends, and adjusting the positions and the sizes of the scanning patterns (9) on the basis of a blank allowance (7) of a saw tooth surface to be machined, such that the scanning patterns (9) can cover a grinding width A of the blank allowance (7), thereby ensuring that, during grinding, each layer of the scanning patterns (9) can grind off the entire grinding width A included in the blank allowance (7) in one go. The long-channel-shaped structures with the circular arcs (901) at the two ends are used as the scanning patterns (9), the two circular arcs of the long-channel-shaped structures are connected by means of a connecting line (902), the connecting line can be a straight line or arc shaped, the long-channel-shaped structures can be suitable for machining saw tooth clearance faces (2) of various structures by means of the circular arcs at the two ends, and the machining process can be configured to machine the saw tooth clearance faces (2) having inner corners, and can also machine saw tooth flank faces (3) and perform saw tooth finishing operations, and thus has high universality.

Description

Arc light path sawtooth processing technology Technical Field

[0001] The invention belongs to the field of diamond circular saw blade saw tooth processing, and in particular relates to a circular arc light path saw tooth processing technology. Background Art

[0002] Existing diamond circular saw blades are primarily manufactured using electro-spark grinding (EDG). However, the resulting diamond teeth have poor profiles and cannot meet the requirements for high-precision saw blades. Furthermore, the PCD layer of the teeth has poor or even no conductivity, resulting in low EDM efficiency.

[0003] In order to improve the processing efficiency and processing accuracy of diamond circular saw blade teeth, the applicant in this case has applied for an invention patent with the authorization announcement number CN115647478B, and the name is Method for Processing PCD Saw Blades Using Laser Grinding. In this method, the teeth of the diamond saw blade are processed in three separate steps. Among them, the sawtooth back angle surface and the sawtooth side surface can be processed simultaneously by two laser processing equipment, or the sawtooth back angle surface and the sawtooth side surface can be processed separately in no particular order by one laser processing equipment. Finally, the sawtooth cutting edge is finely processed, and the sawtooth blank is completely ground off, and at the same time, the sawtooth cutting edge with an arc structure is ground into a sharp pointed structure.

[0004] The above patent improves the processing efficiency and precision of saw teeth by laser processing. However, the following defects still exist in the actual processing process:

[0005] 1. As shown in Figures 8 and 9, when using laser to process the side of the sawtooth and reverse finishing, the laser needs to move back and forth along the corresponding scanning pattern until the entire area where the scanning pattern is located is scanned. As shown in Figure 2, when the laser moves from point P1 to point P2, the laser speed gradually accelerates from 0. When it approaches point P2, the laser speed drops to 0, and then the laser changes direction and moves toward point P3. Similarly, the laser speed gradually accelerates from 0 to P33 and then decelerates to 0, and so on. In this process, the laser focus stays at points P2 and P3 for a short time, which can easily cause burns to the sawtooth head, greatly reducing the saw blade processing accuracy and product quality;

[0006] 2. Due to the diversity of sawtooth clearance angle shapes, the scanned graphics cannot be accurately projected onto the sawtooth clearance angle, resulting in the above processing method being unable to process the sawtooth clearance angle, affecting the overall sawtooth processing efficiency;

[0007] 3. In the existing technology, lasers use circular apertures to process products, but there are many types of sawtooth back angle shapes, such as the tooth structures with authorization announcement numbers CN218657117U and CN218873977U, which have many inflection points. The circular aperture cannot grind off the width of the sawtooth blank at one time and ensure the accurate processing of the sawtooth inflection points. Summary of the Invention

[0008] The technical problem to be solved by the present invention is: to overcome the shortcomings of the existing technology and provide an arc light path sawtooth processing technology, which can realize the processing of various sawtooth back angle tooth shapes, and is suitable for laser rough processing and laser finishing processing of the sawtooth back angle surface and two side surfaces, and realizes the one-time grinding away of the sawtooth blank width while ensuring its processing accuracy, thereby greatly improving the processing efficiency.

[0009] The arc light path sawtooth processing process includes the following steps:

[0010] S1. Install the diamond saw blade into the laser processing equipment and fix it;

[0011] S2. Adjust the relative position of the laser galvanometer and the diamond saw blade so that the laser beam emitted by the laser galvanometer falls on the upper end of the sawtooth surface to be processed;

[0012] S3. Adjust the angle of the laser galvanometer so that the angle a between the laser beam emitted by the laser galvanometer and the sawtooth surface to be processed is controlled within 5°-20°;

[0013] S4. Adjust the scanning pattern of the laser galvanometer into a long groove structure with arcs at both ends, and adjust the position and size of the scanning pattern according to the amount of blank on the sawtooth surface to be processed, so that the scanning pattern can cover the grinding width A of the blank, thereby ensuring that during grinding, each layer of the scanning pattern can grind away the entire grinding width included in the blank at one time;

[0014] S5. Processing of the first layer: adjust the relative position of the laser beam and the surface of the sawtooth to be processed so that the front end of the scanning pattern falls on the innermost side of the blank. Determine the scanning path according to the shape of the sawtooth surface to be processed, start the laser, and control the laser beam to always scan in a circle according to the scanning pattern. At the same time, the laser processing equipment adjusts the relative position of the laser galvanometer and the diamond saw blade in real time so that the laser beam grinds from one end of the sawtooth surface to be processed along the scanning path to the other end. The grinding depth is recorded as B. The moving speed of the laser beam along the scanning path is 0.3-5mm. When the laser beam finishes grinding the other end of the sawtooth surface to be processed, the processing of the first layer of the sawtooth surface to be processed is completed.

[0015] Preferably, in S1, the diamond saw blade is installed in the laser processing equipment in reverse, that is, the direction of the saw tooth front angle surface close to the laser beam is the same as the emission direction of the laser beam.

[0016] Preferably, in S1, the diamond saw blade is installed in the laser processing equipment in a forward direction, that is, the direction of the saw tooth front angle surface close to the laser beam is opposite to the emission direction of the laser beam.

[0017] Preferably, the method further comprises the following steps:

[0018] S6, processing of the second layer: adjust the laser galvanometer to move down by a distance B, and at the same time control the angle a between the laser beam and the saw tooth surface to always meet the requirements of S3, adjust the relative position of the laser galvanometer and the diamond saw blade, so that the laser beam grinds from the other end of the saw tooth surface to be processed along the scanning path toward the direction of the initial end until the processing of the second layer of the saw tooth surface to be processed is completed;

[0019] S7, repeat the actions of S5 and S6 until the entire sawtooth surface to be processed is processed.

[0020] Preferably, the method further comprises the following steps:

[0021] S6, turn off the laser, and the laser processing equipment controls the laser galvanometer to return to the starting end of the laser beam processing in step 5 by the shortest distance. At the same time, adjust the laser galvanometer to move down by distance B, and the angle a between the laser beam and the sawtooth surface to be processed always meets the requirements of S3. Repeat the action of S5 until the second layer of the sawtooth surface to be processed is completed;

[0022] S7, repeat the action of S6 until the processing of the entire sawtooth surface to be processed is completed.

[0023] Preferably, after the scanning pattern is confirmed by the laser galvanometer in S4, the laser beam emitted by the laser galvanometer scans along the scanning pattern for one circle, and then continues to scan along the internal equidistant line of the previous scanning pattern for one circle, and repeats the scanning cycle multiple times.

[0024] Preferably, in said S4, the laser beam is cyclically scanned twice.

[0025] Preferably, the amount of movement of each circle of laser beam toward the inside of the scanning pattern in S4 is 0.01-0.04 mm.

[0026] Preferably, in S1, the laser processing equipment is a vertical laser processing machine or a horizontal laser processing machine.

[0027] Preferably, the moving speed of the beam focus is 400-1600 mm / s, the laser frequency is 40-200 KHz, and the pulse width is 30-500 ns.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] 1. The present invention adopts a long trough structure with circular arcs at both ends as the scanning pattern. The two arcs of the long trough structure are connected by a connecting line, and the connecting line can be a straight line or an arc. The long trough structure can be suitable for the processing of sawtooth back angle surfaces of various structures through the circular arcs at both ends, so that the processing technology can be used to process sawtooth back angle surfaces with inner corners, as well as sawtooth side surfaces and sawtooth finishing operations, with greater versatility.

[0030] 2. The laser focus scans in circles along the scanning pattern of the long groove structure. During the entire scanning process, the laser focus is always in a uniform speed state without acceleration, deceleration, or waiting time, which avoids the possibility of saw teeth being burned and improves product quality. Secondly, the cutting edge can be processed at any part of the scanning pattern of the long groove structure. Compared with the original processing technology that can only use the middle part of the scanning pattern for cutting edge refinement, the present invention has higher operational flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] FIG1 is a schematic structural diagram of a diamond saw blade in the prior art;

[0032] FIG2 is a partial enlarged view of portion A in FIG2 ;

[0033] Figure 3 is a schematic diagram of the overall structure of the sawtooth;

[0034] FIG4 is a schematic diagram of the left-side structure of the sawtooth;

[0035] FIG5 is a schematic diagram of the top view of the sawtooth structure;

[0036] FIG6 is a partial enlarged view of portion B in FIG5 ;

[0037] FIG7 is a schematic diagram of the main structure of the sawtooth;

[0038] FIG8 is a schematic diagram showing the principle of tooth finishing after a diamond saw blade is reversely installed in the prior art;

[0039] FIG9 is a partial enlarged view of portion C in FIG8 ;

[0040] FIG10 is a schematic structural diagram of a four-axis laser processing device in the prior art;

[0041] FIG11 is a schematic structural diagram of a five-axis laser processing device in the prior art;

[0042] FIG12 is a process flow chart of the present invention.

[0043] In the figure, 1. Saw tooth front angle surface; 2. Saw tooth back angle surface; 3. Saw tooth side surface; 4. Cutting edge; 5. PCD layer; 6. Alloy layer; 7. Blank amount; 8. Laser beam; 9. Scanning pattern; 901. Arc; 902. Connecting line; 10. Lifting mechanism; 11. Translation mechanism 1; 12. Saw blade rotation mechanism; 13. Laser galvanometer; 14. Saw blade clamping cylinder; 15. Translation mechanism 2; 16. Diamond saw blade. DETAILED DESCRIPTION

[0044] The present invention will be further described below in conjunction with the accompanying drawings:

[0045] The directional terms used in the detailed description are intended solely to facilitate understanding of the technical solutions described herein by those skilled in the art based on the visual orientation shown in the accompanying drawings. Unless otherwise specified or limited, the terms "dispose," "install," and "connect" are to be interpreted broadly, and those skilled in the art will understand their specific meanings within the present invention based on the specific circumstances.

[0046] As shown in Figures 1 and 2, a plurality of saw teeth for cutting are fixed on the outer periphery of the diamond saw blade 16. The saw teeth mainly rely on the cutting edge 4 formed between the saw tooth front angle surface 1, the saw tooth back angle surface 2 and the two saw tooth side surfaces 3 when cutting. The saw teeth include an alloy layer 6 and a PCD layer 5 mainly used for cutting. The alloy layer 6 is welded and fixed to the diamond saw blade 16. As shown in Figures 3 and 4, the dotted line portion is the blank amount 7. During processing, the blank amount 7 needs to be ground off by laser. Therefore, when processing the saw teeth, the processing includes the processing of the saw tooth back angle surface 2, the processing of the two saw tooth side surfaces 3 and the finishing of the saw teeth. That is, after the diamond saw blade 16 is installed in reverse, the cutting edge 4 is processed by laser to change the cutting edge 4 from a circular arc structure to a sharp pointed structure.

[0047] Example 1: This embodiment is mainly used to process the serrated back angle surface 2 with an asymmetrical structure in the authorization announcement numbers CN218657117U and CN218873977U.

[0048] As shown in FIG4 to FIG7 and FIG12, the arc light path sawtooth processing process includes the following steps:

[0049] S1. Install the diamond saw blade 16 in the laser processing equipment in the forward direction and fix it, that is, the direction of the sawtooth front angle surface 1 close to the laser beam 8 is opposite to the emission direction of the laser beam 8; the laser processing equipment can be a vertical laser processing machine or a horizontal laser processing machine; in this embodiment, a four-axis or five-axis laser processing equipment as shown in Figures 10 and 11 is used. During installation, after the diamond saw blade 16 is hung, it is clamped and fixed by the saw blade clamping cylinder 14. At this time, it is necessary to ensure that the sawtooth front angle surface 1 is opposite to the emission direction of the laser beam 8 emitted by the laser galvanometer 13.

[0050] S2. Adjust the relative positions of the laser galvanometer 13 and the diamond saw blade 16 by controlling the lifting mechanism 10, translation mechanism 1 11 and translation mechanism 2 15 of the laser processing equipment so that the laser beam 8 emitted by the laser galvanometer 13 falls on the upper end of the sawtooth surface to be processed.

[0051] S3. Adjust the angle of the laser galvanometer 13 by controlling the laser processing equipment so that the angle a between the laser beam 8 emitted by the laser galvanometer 13 and the sawtooth surface to be processed is controlled to be 5°-20°; specifically, as shown in Figure 7, the angle a between the laser beam 8 and the sawtooth back angle surface 2 is controlled to be 5°-20°.

[0052] S4. As shown in Figures 5 and 6, the scanning pattern 9 of the laser galvanometer 13 is adjusted to a long slot-shaped structure with arcs 901 at both ends. The two arcs 901 of the long slot-shaped structure are connected by a connecting line 902, which can be a straight line or an arc. The position and size of the scanning pattern 9 are adjusted according to the blank amount 7 of the sawtooth surface to be processed. For the tooth-shaped structures in the authorization publications CN218657117U and CN218873977U, since the sawtooth back angle surface 2 has multiple points similar to M6 (inward turning points), the position of the scanning pattern 9 can be adjusted so that the arc 901 contacts the sawtooth back angle surface 2 and the scanning pattern 9 can cover the grinding width A of the blank amount 7. The size of the arc in the scanning pattern 9 is adjusted according to the processing accuracy of the M6 ​​point, thereby ensuring that during grinding, each layer of the scanning pattern 9 can grind away the entire grinding width A included in the blank amount 7 at one time; the smaller the arc radius, the higher the processing accuracy of the M6 ​​point.

[0053] The circular laser aperture in the existing technology cannot complete the high-precision processing of the M6 ​​point at one time. The reason is that if you want to complete the grinding of the blank amount 7 at one time, the radius of the circular aperture needs to be adjusted to a larger value. The aperture with a larger radius can only process large arc structures and cannot complete the high-precision processing of the M6 ​​point.

[0054] S5. Processing of the first layer: adjust the relative position of the laser beam 8 and the sawtooth back angle surface 2 so that the arc 901 of the scanning pattern 9 falls on the innermost side of the blank 7. Determine the scanning path according to the shape of the sawtooth surface to be processed, start the laser, and the laser galvanometer 13 controls the laser beam 8 to always scan in a circle according to the scanning pattern 9. The moving speed of the laser beam 8 along the scanning path is 0.3-5mm. At the same time, the laser processing equipment adjusts the relative position of the laser galvanometer 13 and the diamond saw blade 16 in real time so that the laser beam 8 grinds from one end of the sawtooth surface to be processed along the scanning path to the other end, as shown in Figure 4. The grinding depth is recorded as B.

[0055] As shown in FIG5 , the sawtooth back angle surface 2 has an asymmetric structure. The laser beam 8 moves from point M2 or M3 at either end to the other end for grinding, thereby completing the processing of the first layer of the sawtooth back angle surface 2 .

[0056] S6: Turn off the laser. The laser processing equipment controls the laser galvanometer 13 to return to the starting point of the laser beam 8 in step 5 by the shortest distance. The laser galvanometer 13 is adjusted to move downward by distance B, and the steps in S5 are repeated until the second layer of the sawtooth relief surface 2 is processed. During this process, the angle between the laser beam 8 and the sawtooth surface to be processed always meets the requirements of S3. The one-way, non-returning processing method achieves higher processing accuracy than the back-and-forth loop processing.

[0057] S7. Repeat S6 until the entire sawtooth surface is machined. During this process, the beam focus moves at a speed of 400-1600 mm / s. The pulse width of laser beam 8 for grinding PCD layer 5 is 30-350 ns, and the frequency is 50-200 kHz. The pulse width of laser beam 8 for grinding alloy layer 6 is 350-500 ns, and the frequency is 40-60 kHz.

[0058] The diamond saw blade 16 is moved or rotated by a distance of one saw tooth by the laser processing equipment and the diamond saw blade 16 is fixed again. The actions of S2 to S7 are repeated until all the saw tooth back angle surfaces 2 on the diamond saw blade 16 are processed, and then the diamond saw blade 16 is removed.

[0059] In this embodiment, after the scanning pattern is confirmed by the laser galvanometer 13 in S4, the laser beam 8 emitted by the laser galvanometer 13 scans along the scanning pattern 9 for one circle, and then continues to scan along the internal equidistant line of the previous scanning pattern for one circle. This cycle of scanning can be repeated multiple times, preferably twice, and the amount of movement of the laser beam into the scanning pattern in each circle is 0.01-0.04mm.

[0060] Example 2: This embodiment is mainly used to process the sawtooth back angle surface 2 with a symmetrical structure in the authorization announcement numbers CN218657117U and CN218873977U.

[0061] In this embodiment, the sawtooth back angle surface 2 is a symmetrical structure, and the symmetrical structures on both sides are processed separately. The specific steps are as follows:

[0062] Processing of the symmetrical structure on one side: the laser beam 8 moves from point M5 in the middle of the sawtooth back angle to point M2 or M3 at either end for grinding. After the first layer of grinding is completed, the laser is turned off, and the laser processing equipment controls the laser galvanometer 13 to return to the initial end point M5 processed by the laser beam 8 in step 5 at the shortest distance, and adjusts the laser galvanometer 13 to move downward by distance B. Repeat the above actions until all the symmetrical structures on this side of the sawtooth back angle surface 2 are ground.

[0063] To process the symmetrical structure on the other side: Turn off the laser again, control the laser galvanometer 13 to return to point M5 at the shortest distance, and then turn on the laser again, moving the laser beam 8 toward the other end for grinding. Repeat this process until the laser beam 8 completes the processing of the symmetrical structure on the other side layer by layer. Other steps are the same as in Example 1.

[0064] Embodiment 3: This embodiment is mainly used for processing the sawtooth side surface 3.

[0065] The processing technology of the serrated side surface 3 is the same as that of the serrated relief surface 2, with the following differences:

[0066] S5. Processing of the first layer: As shown in FIG4, the relative position of the laser beam 8 and the sawtooth side surface 3 on either side is adjusted so that the front end of the connection line 902 of the scanning pattern 9 falls on the innermost side of the blank 7. The scanning path is determined according to the shape of the sawtooth surface to be processed, and the laser is started. The laser galvanometer 13 controls the laser beam 8 to always scan in a circle according to the scanning pattern 9. At the same time, the laser processing equipment adjusts the relative position of the laser galvanometer 13 and the diamond saw blade 16 in real time, as shown in FIG5, so that the laser beam 8 is moved from the front end M3 of the sawtooth side surface 3 to the innermost side of the blank 7. The end is ground along the scanning path toward the other end M4, as shown in Figure 4. The grinding depth is recorded as B. The moving speed of the laser beam 8 along the scanning path is 0.3-5mm. After grinding the M4 end, the laser is turned off, and the laser galvanometer 13 is controlled to return to the M3 end at the shortest distance. The laser galvanometer 13 is adjusted to move downward by a distance B, and then the laser galvanometer 13 is adjusted to swing through the laser processing equipment so that the angle between the laser beam 8 and the sawtooth side surface 3 on this side always meets the requirement of S3. The above steps are repeated until the processing of all the sawtooth side surfaces 3 on this side is completed.

[0067] After the processing of the serrated side surface 3 on one side is completed, the processing of the serrated side surface 3 on the other side is completed using the same steps.

[0068] Embodiment 4: This embodiment is mainly used for processing the sawtooth side surface 3 and the sawtooth back angle surface 2.

[0069] S6, processing of the second layer: adjust the laser galvanometer 13 to move downward by a distance B, and at the same time control the angle a between the laser beam 8 and the sawtooth surface to be processed to always meet the requirements of S3, adjust the relative position of the laser galvanometer 13 and the diamond saw blade 16, so that the laser beam 8 grinds from the other end of the sawtooth surface to be processed along the scanning path toward the direction of the initial end until the processing of the second layer of the sawtooth surface to be processed is completed;

[0070] S7, repeat the actions of S5 and S6 until the entire sawtooth surface to be processed is processed.

[0071] The rest is the same as that of the first, second and third embodiments.

[0072] Embodiment 5: This embodiment is mainly used for finishing processing of the cutting edge 4.

[0073] S1. Install the diamond saw blade 16 in the laser processing equipment in reverse and fix it by the saw blade clamping cylinder 14, that is, the direction of the saw tooth front angle surface 1 close to the laser beam 8 is the same as the emission direction of the laser beam 8.

[0074] S2. Adjust the relative positions of the laser galvanometer 13 and the diamond saw blade 16 by controlling the lifting mechanism 10, translation mechanism 1 11 and translation mechanism 2 15 of the laser processing equipment so that the laser beam 8 emitted by the laser galvanometer 13 falls on one end of the cutting edge 4.

[0075] S3. Adjust the angle of the laser galvanometer 13 by controlling the laser processing equipment so that the angle a between the laser beam 8 emitted by the laser galvanometer 13 and the cutting edge 4 is controlled to be 5°-20°.

[0076] S4. Adjust the scanning pattern 9 of the laser galvanometer 13 to a long slot-shaped structure with arcs 901 at both ends. The two arcs 901 of the long slot-shaped structure are connected by a connecting line 902, which can be a straight line or an arc. During processing, the laser focus scans in a circle along the scanning pattern 9. The laser focus maintains a constant speed throughout the scanning process, eliminating waiting time and preventing sawtooth burns. Therefore, any part of the scanning pattern 9 can be used to process the cutting edge 4.

[0077] S5. Processing of the first layer: adjust the relative position of the laser beam 8 and the cutting edge 4 so that the scanning pattern 9 falls on the cutting edge 4, determine the scanning path according to the shape of the cutting edge 4, start the laser, and control the laser beam 8 to scan the cutting edge 4 once to complete the finishing processing of the cutting edge 4. During this process, the moving speed of the beam focus is 400-1600 mm / s, the pulse width of the laser beam 8 is 30-350 ns, and the frequency is 50-200 kHz.

[0078] The diamond saw blade 16 is moved or rotated by a distance of one saw tooth by the laser processing equipment and the diamond saw blade 16 is fixed again. The actions of S2 to S7 are repeated until all the saw tooth back angle surfaces 2 on the diamond saw blade 16 are processed, and then the diamond saw blade 16 is removed.

[0079] The present invention can be processed using the four-axis vertical laser processing machine shown in Figure 10, and its working principle is referred to CN218016487U. At this time, the plane where the diamond saw blade 16 is located is set vertically, and the diamond saw blade 16 is installed on a translation mechanism 11 that can move along the Y axis. The laser galvanometer 13 is installed on a translation mechanism 2 15. The laser galvanometer 13 is tilted downward to the side of the diamond saw blade 16, so that the angle between the laser galvanometer 13 and the vertical plane is controlled at 10-20°. The translation mechanism 2 15 is installed on a lifting mechanism 10 that can move up and down. The lifting mechanism 10 and the translation mechanism 2 15 are synchronously adjusted to control the position of the laser galvanometer 13. At the same time, the translation mechanism 1 11 is adjusted to control the position of the diamond saw blade 16, so as to adjust the relative positions of the laser galvanometer 13 and the diamond saw blade 16.

[0080] The present invention can also employ a five-axis vertical laser processing machine, as shown in FIG11 . The operating principle of the machine is similar to that of CN116038154A. This machine, based on a four-axis vertical laser processing machine, adds a saw blade rotation mechanism 12 capable of driving the rotation of a diamond saw blade 16. In addition to controlling the lifting mechanism 10 and the translation mechanism 15, the relative position of the laser galvanometer 13 and the diamond saw blade 16 can be adjusted by adjusting the saw blade rotation mechanism 12.

[0081] The present invention can also adopt a horizontal laser processing machine, in which the diamond saw blade 16 is placed horizontally, and the rest is the same as that of the vertical laser processing machine.

[0082] Finally, although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A circular arc light path sawtooth processing technology, characterized in that: The following steps are involved: S1. Install the diamond saw blade into the laser processing equipment and fix it; S2. Adjust the relative positions of the laser galvanometer and the diamond saw blade so that the laser beam emitted by the laser galvanometer falls on the upper end of the sawtooth surface to be processed; S3, adjusting the angle of the laser galvanometer so that the angle a between the laser beam emitted by the laser galvanometer and the sawtooth surface to be processed is controlled at 5°-20°; S4, adjusting the scanning pattern of the laser galvanometer to a long groove structure with arcs at both ends, and adjusting the position and size of the scanning pattern according to the blank amount of the sawtooth surface to be processed, so that the scanning pattern can cover the grinding width A of the blank amount, thereby ensuring that during grinding, each layer of the scanning pattern can grind away all the grinding width included in the blank amount at one time; S5. Processing of the first layer: adjust the relative position of the laser beam and the surface of the sawtooth to be processed so that the front end of the scanning pattern falls on the innermost side of the blank, determine the scanning path according to the shape of the surface of the sawtooth to be processed, start the laser, and the laser galvanometer controls the laser beam to always scan in a circle according to the scanning pattern. At the same time, the laser processing equipment adjusts the relative position of the laser galvanometer and the diamond saw blade in real time so that the laser beam grinds from one end of the surface of the sawtooth to be processed along the scanning path to the other end. The grinding depth is recorded as B. The moving speed of the laser beam along the scanning path is 0.3-5mm. When the laser beam grinds the other end of the surface of the sawtooth to be processed, the processing of the first layer of the surface of the sawtooth to be processed is completed.

2. The arc light path sawtooth processing process according to claim 1, characterized in that: In S1, the diamond saw blade is reversely installed in the laser processing equipment, that is, the direction of the saw tooth front angle surface close to the laser beam is the same as the emission direction of the laser beam.

3. The arc light path sawtooth processing process according to claim 1, characterized in that: In S1, the diamond saw blade is installed in the laser processing equipment in a forward direction, that is, the direction of the saw tooth front angle surface close to the laser beam is opposite to the emission direction of the laser beam.

4. The arc light path sawtooth processing process according to claim 3, characterized in that: The following steps are also included: S6, processing of the second layer: adjust the laser galvanometer to move downward by a distance B, and at the same time control the angle a between the laser beam and the sawtooth surface to be processed to always meet the requirements of S3, adjust the relative position of the laser galvanometer and the diamond saw blade, so that the laser beam grinds from the other end of the sawtooth surface to be processed along the scanning path toward the direction of the initial end, until the processing of the second layer of the sawtooth surface to be processed is completed; S7, repeat the actions of S5 and S6 until the processing of the entire sawtooth surface to be processed is completed.

5. The arc light path sawtooth processing process according to claim 3, characterized in that: The following steps are also included: S6, turn off the laser, and the laser processing equipment controls the laser galvanometer to return to the initial end of the laser beam processing in step 5 by the shortest distance, and at the same time adjusts the laser galvanometer to move down by a distance B, and the angle a between the laser beam and the sawtooth surface to be processed always meets the requirements of S3, and repeats the action of S5 until the processing of the second layer of the sawtooth surface to be processed is completed; S7, repeat the action of S6 until the processing of the entire sawtooth surface to be processed is completed.

6. The arc light path sawtooth processing technology according to claim 1, characterized in that: After the scanning pattern is confirmed by the laser galvanometer in S4, the laser beam emitted by the laser galvanometer scans along the scanning pattern for one circle, and then continues to scan along the internal equidistant line of the previous scanning pattern for one circle, and repeats the scanning process for multiple times.

7. The arc light path sawtooth processing process according to claim 6, characterized in that: In the S4, the laser beam is cyclically scanned twice.

8. The arc light path sawtooth processing process according to claim 6, characterized in that: The movement amount of each circle of laser beam in S4 toward the inside of the scanning pattern is 0.01-0.04 mm.

9. The arc light path sawtooth processing process according to claim 1, characterized in that: In S1, the laser processing equipment is a vertical laser processing machine or a horizontal laser processing machine.

10. The arc light path sawtooth processing process according to any one of claims 1 to 9, characterized in that: The moving speed of the beam focus is 400-1600 mm / s, the laser frequency is 40-200 KHz, and the pulse width is 30-500 ns.

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