Dielectric window structure and plasma etching machine

Abstract

A dielectric window structure (200) and a plasma etching machine (300). The dielectric window structure (200) comprises: a dielectric window body (201); and a gas uniformizing assembly arranged on the dielectric window body (201), wherein the gas uniformizing assembly can convey cooling gas towards the surface of the dielectric window body (201) by means of rotational selection of regions. The air uniformizing assembly arranged on the dielectric window body (201) is configured such that the air uniformizing assembly can convey cooling gas towards the surface of the dielectric window body (201) by means of rotational selection of regions, thereby performing refined localized cooling on the dielectric window body (201), and effectively preventing a large temperature difference due to a local high temperature of the dielectric window body (201). In this way, a protection effect on the dielectric window structure (200) is achieved, the temperature distribution on the surface of the dielectric window body (201) is accurately controlled, and the uniform distribution of plasmas can be improved, thereby improving the uniform etching of the surface of a substrate and inhibiting polymer formation on the surface of the dielectric window body (201).

Description

Dielectric window structure and plasma etcher

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 23, 2023, with application number 202311579052.4 and invention name “Dielectric Window Structure and Plasma Etching Machine”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a dielectric window structure and a plasma etcher. Background Art

[0003] Plasma etchers, also known as plasma planar etchers, plasma etchers, plasma surface treatment equipment, and plasma cleaning systems, are used in the semiconductor industry. Inductively coupled plasma etching is the result of a combination of chemical and physical processes. Its basic principle is that under vacuum and low pressure, the radio frequency generated by the ICP radio frequency power supply is output to a ring-shaped coupling coil. A certain proportion of mixed etching gas is coupled through glow discharge to produce a high-density plasma. Under the action of the RF radio frequency of the lower electrode, this plasma bombards the substrate surface, breaking the chemical bonds of the semiconductor in the substrate pattern area, generating volatile substances with the etching gas, which then detach from the substrate in the form of gas and are extracted from the vacuum line.

[0004] However, there are still many problems with the dielectric window structure in the plasma etcher.

[0005] Summary of the Invention

[0006] The technical problem solved by the present invention is to provide a dielectric window structure and a plasma etcher to achieve refined regional heat dissipation of the dielectric window body.

[0007] To solve the above problems, the technical solution of the present invention provides a dielectric window structure, including: a dielectric window body; and a gas homogenizing component arranged on the dielectric window body, which can selectively transport heat dissipating gas toward the surface of the dielectric window body by rotating.

[0008] Optionally, the air uniforming component includes: a central ventilation cavity; and a plurality of peripheral ventilation cavities that sequentially surround the central ventilation cavity.

[0009] Optionally, the heat dissipation gas diffuses from the central ventilation cavity to each of the peripheral ventilation cavities in sequence.

[0010] Optionally, the air uniforming component can selectively open the connection between the central ventilation cavity and at least one of the peripheral ventilation cavities, or close the connection between the central ventilation cavity and the adjacent peripheral ventilation cavities, so as to achieve selective regionalized delivery of heat dissipation gas toward the surface of the dielectric window body through rotation.

[0011] Optionally, the air uniforming component includes: an air uniforming lower cover, the air uniforming lower cover includes a lower central ventilation area and several lower peripheral ventilation areas, and several of the lower peripheral ventilation areas surround the lower central ventilation area in sequence; several air outlet holes are opened on the air uniforming lower cover, and several of the air outlet holes are distributed in the lower central ventilation area and several of the lower peripheral ventilation areas; an air uniforming upper cover that is adaptively connected to the air uniforming lower cover, the air uniforming upper cover includes an upper central ventilation area and several upper peripheral ventilation areas, and several of the upper peripheral ventilation areas surround the upper central ventilation area in sequence; after the air uniforming lower cover and the air uniforming upper cover are assembled, the central ventilation cavity is formed by the lower central ventilation area and the upper central ventilation area; the peripheral ventilation cavity is formed by the lower peripheral ventilation area and the corresponding upper peripheral ventilation area.

[0012] Optionally, the air uniforming component also includes: a lower center stop block arranged on the air uniforming lower cover and located between the lower center ventilation area and the adjacent lower peripheral ventilation area, and a plurality of lower center ventilation gaps are provided on the lower center stop block; a lower peripheral stop block arranged on the air uniforming lower cover and located between the adjacent lower peripheral ventilation areas, and a plurality of lower peripheral ventilation gaps are provided on the lower peripheral stop block; an upper center stop block arranged on the air uniforming upper cover and located between the upper center ventilation area and the adjacent upper peripheral ventilation areas, and a plurality of upper center ventilation gaps are provided on the upper center stop block; an upper peripheral stop block arranged on the air uniforming upper cover and located between the adjacent upper peripheral ventilation areas, and a plurality of upper peripheral ventilation gaps are provided on the upper peripheral stop block; after the air uniforming lower cover and the air uniforming upper cover are assembled, the lower center stop block and the upper center stop block are staggered and fitted; the lower peripheral stop block and the corresponding upper peripheral stop block are staggered and fitted.

[0013] Optionally, the air uniforming component also includes: an air supply device; a pipeline structure connected to the air uniforming cover, wherein the pipeline structure is provided with an air intake pipeline and an air distribution pipeline connected to the air intake pipeline, the air distribution pipeline is connected to the central ventilation cavity, and the air supply device is connected to the air intake pipeline.

[0014] Optionally, the air uniforming component further includes: a refrigeration device connected to the air supply device.

[0015] Optionally, the gas uniformity upper cover can rotate relative to the gas uniformity lower cover.

[0016] Optionally, the rotation of the air uniforming cover can selectively open the connection between the central ventilation cavity and at least one of the peripheral ventilation cavities, or close the connection between the central ventilation cavity and the adjacent peripheral ventilation cavities, so as to achieve selective regionalized delivery of heat dissipation gas toward the surface of the dielectric window body through rotation.

[0017] Optionally, when the air uniforming cover rotates to the point where the upper center stopper does not block the lower center ventilation gap and the lower center stopper does not block the upper center ventilation gap, the central ventilation cavity and at least one of the peripheral ventilation cavities are opened for communication.

[0018] Optionally, when the air uniforming cover rotates until the upper center stopper blocks the lower center ventilation gap, and the lower center stopper blocks the upper center ventilation gap, the connection between the central ventilation cavity and the adjacent peripheral ventilation cavity is closed.

[0019] Optionally, the gas leveling assembly further includes: a rotation drive device connected to the gas leveling upper cover, for driving the gas leveling upper cover to rotate relative to the gas leveling lower cover.

[0020] Correspondingly, the technical solution of the present invention further provides a plasma etcher, comprising: a plasma reaction chamber; and a dielectric window structure as described in any one of the above technical solutions arranged in the plasma reaction chamber.

[0021] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0022] In the dielectric window structure of the technical solution of the present invention, a gas homogenizing component is arranged on the dielectric window body. The gas homogenizing component can transport heat dissipation gas toward the surface of the dielectric window body in a selective and regional manner through rotation, thereby being able to perform refined regional heat dissipation on the dielectric window body, and effectively preventing the problem of large temperature differences caused by excessive local problems of the dielectric window body, thereby achieving a protective effect on the dielectric window structure, and at the same time accurately controlling the temperature distribution on the surface of the dielectric window body, which can also be beneficial to improving the uniform distribution of plasma, thereby enhancing the uniform etching of the substrate surface, and inhibiting the tendency of polymer formation on the surface of the dielectric window body.

[0023] Furthermore, the air uniforming assembly further comprises a refrigeration device connected to the air supply device, and the refrigeration device can improve the heat dissipation efficiency of the dielectric window body.

[0024] Furthermore, the gas leveling assembly further comprises: a rotation drive device connected to the gas leveling upper cover, for driving the gas leveling upper cover to rotate relative to the gas leveling lower cover. The rotation drive device can realize the automation and precision of the rotation of the gas leveling upper cover.

[0025] In the plasma etcher of the technical solution of the present invention, through the gas homogenizing component arranged on the dielectric window body in the dielectric window structure, the gas homogenizing component can transport heat dissipation gas toward the surface of the dielectric window body in a selective and regional manner through rotation, thereby being able to perform refined regional heat dissipation on the dielectric window body, and effectively preventing the problem of large temperature differences caused by excessive local problems of the dielectric window body, thereby achieving the protection of the dielectric window structure, and at the same time accurately controlling the temperature distribution on the surface of the dielectric window body, which can also be beneficial to improving the uniform distribution of plasma, thereby enhancing the uniform etching of the substrate surface, and inhibiting the tendency of polymer formation on the surface of the dielectric window body. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG1 is a schematic structural diagram of a plasma etching machine;

[0027] FIG2 is a schematic structural diagram of a dielectric window structure according to an embodiment of the present invention;

[0028] 3 is a bottom view of the structure of the uniform air lower cover in the dielectric window structure according to an embodiment of the present invention;

[0029] 4 is a bottom view of the structure of the uniform air cover in the dielectric window structure according to an embodiment of the present invention;

[0030] 5 is a schematic top view of the structure of the uniform air lower cover in the dielectric window structure according to an embodiment of the present invention;

[0031] 6 is a schematic structural diagram of a first state of the rotating upper and lower gas distribution covers in the dielectric window structure according to an embodiment of the present invention;

[0032] 7 is a schematic structural diagram of a second state of the uniform gas upper cover and the uniform gas lower cover after rotation in the dielectric window structure according to an embodiment of the present invention;

[0033] 8 is a schematic structural diagram of the third state of the rotated gas uniformity upper cover and gas uniformity lower cover in the dielectric window structure according to an embodiment of the present invention;

[0034] FIG9 is a schematic structural diagram of a plasma etcher according to an embodiment of the present invention. DETAILED DESCRIPTION

[0035] As described in the background art, the performance of the dielectric window structure formed by the prior art needs to be improved, which will be described in detail below with reference to the accompanying drawings.

[0036] FIG1 is a schematic structural diagram of a plasma etching machine.

[0037] Please refer to Figure 1. The main components of the plasma etcher include: a plasma reaction chamber 100, a plasma coupling coil 101, a dielectric window structure 102, a cooling fan 103, an excitation source RF power supply 104, an excitation source matching network 105, a shielding cover 106, a gas source 107, an air nozzle 108, a bias electrode 109, a bias RF power supply 110, a bias matching network 111, a pressure control valve 112 and a vacuum pump 113.

[0038] Among them, the gas source 107 provides process gas to enter the plasma reaction chamber 100, and plasma 114 is generated under the action of the plasma coupling coil 101. The bias electrode 109 provides a bias to accelerate the plasma 114 to bombard the substrate sheet 115. Currently, in the inductively coupled plasma reaction chamber 100, the heating and temperature control of the dielectric window structure 102 made of ceramic insulating material will sensitively affect the etching uniformity and particle contamination control of the plasma etching process. Therefore, accurately controlling the temperature distribution on the surface of the dielectric window structure 102 is conducive to improving the uniform distribution of the plasma 114, which is very helpful in achieving uniform etching of the surface of the substrate sheet 115 and suppressing the tendency of polymer formation on the surface of the dielectric window structure 102. In addition, the ceramic properties of the dielectric window structure 102 determine that its temperature difference should not be too large, otherwise there will be a risk of explosion.

[0039] However, the cooling fan 103 has a very large diffusion range, the wind is easily dispersed, and can only blow in a fixed direction. It is impossible to concentrate the wind or control its size and position, resulting in an unsatisfactory heat dissipation effect on the dielectric window structure 102, which easily causes a temperature difference in the dielectric window structure 102.

[0040] On this basis, the present invention provides a dielectric window structure and a plasma etcher. Through a gas homogenizing component arranged on the dielectric window body, the gas homogenizing component can deliver heat dissipation gas toward the surface of the dielectric window body in a selective and regional manner through rotation, thereby being able to perform refined regional heat dissipation on the dielectric window body, and effectively preventing the problem of large temperature differences caused by excessive local problems of the dielectric window body, thereby achieving a protective effect on the dielectric window structure, and at the same time accurately controlling the temperature distribution on the surface of the dielectric window body, which can also be beneficial to improving the uniform distribution of plasma, thereby enhancing the uniform etching of the substrate surface, and inhibiting the tendency of polymer formation on the surface of the dielectric window body.

[0041] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0042] Figure 2 is a structural schematic diagram of the dielectric window structure of an embodiment of the present invention; Figure 3 is an upward structural schematic diagram of the uniform gas lower cover in the dielectric window structure of an embodiment of the present invention; Figure 4 is an upward structural schematic diagram of the uniform gas upper cover in the dielectric window structure of an embodiment of the present invention; Figure 5 is a top structural schematic diagram of the uniform gas lower cover in the dielectric window structure of an embodiment of the present invention; Figure 6 is a first-state structural schematic diagram of the uniform gas upper cover and the uniform gas lower cover after rotation in the dielectric window structure of an embodiment of the present invention; Figure 7 is a second-state structural schematic diagram of the uniform gas upper cover and the uniform gas lower cover after rotation in the dielectric window structure of an embodiment of the present invention; Figure 8 is a third-state structural schematic diagram of the uniform gas upper cover and the uniform gas lower cover after rotation in the dielectric window structure of an embodiment of the present invention.

[0043] Please refer to FIG. 2 , a dielectric window structure 200 includes: a dielectric window body 201 ; and a gas homogenizing assembly disposed on the dielectric window body 201 , wherein the gas homogenizing assembly can selectively and regionally deliver heat dissipating gas toward the surface of the dielectric window body 201 by rotating.

[0044] By setting up a uniform gas component on the dielectric window body 201, the uniform gas component can deliver heat dissipation gas toward the surface of the dielectric window body 201 in a selective and regional manner through rotation, thereby being able to perform refined regional heat dissipation on the dielectric window body 201, and effectively preventing the problem of large temperature differences caused by excessive local problems of the dielectric window body 201, thereby achieving the protection of the dielectric window structure 200, and at the same time accurately controlling the temperature distribution on the surface of the dielectric window body 201, which can also help improve the uniform distribution of plasma, thereby enhancing the uniform etching of the substrate surface and suppressing the tendency of polymer formation on the surface of the dielectric window body 201.

[0045] The dielectric window body 201 is made of non-metallic insulating ceramic material, the purpose of which is to prevent shielding of the magnetic field generated by the plasma coupling coil in the plasma etcher.

[0046] Please refer to FIG. 4 to FIG. 6 , the air uniforming assembly includes: a central ventilation cavity 229 ; and a plurality of peripheral ventilation cavities surrounding the central ventilation cavity 229 in sequence.

[0047] Please continue to refer to Figures 4 to 6. In this embodiment, taking two of the peripheral ventilation cavities as an example, namely the first peripheral ventilation cavity 230 and the second peripheral ventilation cavity 231, the first peripheral ventilation cavity 230 surrounds the central ventilation cavity 229, and the second peripheral ventilation cavity 231 surrounds the first peripheral ventilation cavity 230.

[0048] In other embodiments, the number of the peripheral ventilation cavities may be 1 or greater than 2.

[0049] The heat dissipation gas is diffused from the central ventilation cavity 229 to each of the peripheral ventilation cavities in sequence.

[0050] In this embodiment, the heat dissipation gas diffuses from the central ventilation cavity 229 to the first peripheral ventilation cavity 230 and the second peripheral ventilation cavity 231 in sequence.

[0051] The air distribution component can selectively open the connection between the central ventilation cavity 229 and at least one of the peripheral ventilation cavities by rotation, or close the connection between the central ventilation cavity 229 and the adjacent peripheral ventilation cavities, so as to realize the selective regionalized delivery of heat dissipation gas toward the surface of the dielectric window body 201 by rotation.

[0052] In this embodiment, the air uniforming component can selectively open the connection between the central ventilation cavity 229 and the first peripheral ventilation cavity 230 by rotation, or open the connection between the central ventilation cavity 229, the first peripheral ventilation cavity 230 and the second peripheral ventilation cavity 231, or close the connection between the central ventilation cavity 229 and the adjacent first peripheral ventilation cavity 230.

[0053] Please refer to Figures 3 to 6, the gas uniforming component includes: a gas uniforming lower cover 202, the gas uniforming lower cover 202 includes a lower central ventilation area 203 and a plurality of lower peripheral ventilation areas, and the plurality of lower peripheral ventilation areas sequentially surround the lower central ventilation area 203; a plurality of air outlet holes 204 opened on the gas uniforming lower cover 202, and the plurality of air outlet holes 204 are distributed in the lower central ventilation area 203 and the plurality of lower peripheral ventilation areas; and is adapted to connect with the gas uniforming lower cover 202. The uniform air upper cover 205 includes an upper central ventilation area 206 and several upper peripheral ventilation areas, and the several upper peripheral ventilation areas surround the upper central ventilation area 206 in sequence; after the uniform air lower cover 202 is assembled with the uniform air upper cover 205, the lower central ventilation area 203 and the upper central ventilation area 206 constitute the central ventilation cavity 229; the lower peripheral ventilation area and the corresponding upper peripheral ventilation area constitute the peripheral ventilation cavity.

[0054] 3 and 5 , in this embodiment, since there are two peripheral ventilation cavities, there are also two corresponding lower peripheral ventilation areas, namely, a first lower peripheral ventilation area 207 and a second lower peripheral ventilation area 208. A plurality of air outlet holes 204 are distributed in the lower central ventilation area 203, the first lower peripheral ventilation area 207, and the second lower peripheral ventilation area 208.

[0055] Please refer to FIG. 4 . In this embodiment, since the number of the peripheral ventilation cavities is two, the number of the corresponding upper peripheral ventilation areas is also two, namely, a first upper peripheral ventilation area 209 and a second upper peripheral ventilation area 210 .

[0056] Please refer to Figure 6. In this embodiment, after the uniform air lower cover 202 and the uniform air upper cover 205 are assembled, the lower central ventilation area 203 and the upper central ventilation area 206 constitute the central ventilation cavity 229; the first lower peripheral ventilation area 207 and the first upper peripheral ventilation area 209 constitute the first peripheral ventilation cavity 230; and the second lower peripheral ventilation area 208 and the second upper peripheral ventilation area 210 constitute the second peripheral ventilation cavity 231.

[0057] Please continue to refer to Figures 4 and 5. The air-leveling assembly further includes: a lower center stopper 211 provided on the air-leveling lower cover 202 and located between the lower center ventilation area 203 and the adjacent lower peripheral ventilation area, and a plurality of lower center ventilation gaps 212 are provided on the lower center stopper 211; a lower peripheral stopper 213 provided on the air-leveling lower cover 202 and located between the adjacent lower peripheral ventilation areas, and a plurality of lower peripheral ventilation gaps 214 are provided on the lower peripheral stopper 213; a lower center stopper 214 provided on the air-leveling upper cover 205 and located between the upper center ventilation area 206 and the adjacent lower peripheral ventilation areas. The upper center stopper 215 between adjacent upper peripheral ventilation areas has a plurality of upper center ventilation gaps 216 formed on the upper center stopper 215; the upper peripheral stopper 217 provided on the air uniforming upper cover 205 and located between adjacent upper peripheral ventilation areas has a plurality of upper peripheral ventilation gaps 218 formed on the upper peripheral stopper 217; after the air uniforming lower cover 202 and the air uniforming upper cover 205 are assembled, the lower center stopper 211 is staggered and fitted with the upper center stopper 215; the lower peripheral stopper 213 is staggered and fitted with the corresponding upper peripheral stopper 217.

[0058] Please continue to refer to FIG. 5 . In this embodiment, the lower central stopper 211 is disposed between the lower central ventilation area 203 and the first lower peripheral ventilation area 207 .

[0059] Please continue to refer to Figure 5. In this embodiment, since the number of the lower peripheral ventilation areas is 2, the corresponding number of the lower peripheral stopper 213 is 1, that is, the lower peripheral stopper 213 is arranged between the first lower peripheral ventilation area 207 and the second lower peripheral ventilation area 208.

[0060] Please continue to refer to FIG. 4 . In this embodiment, the upper central stopper 215 is disposed between the upper central ventilation area 206 and the first upper peripheral ventilation area 209 .

[0061] Please continue to refer to Figure 4. In this embodiment, since the number of the upper peripheral ventilation areas is 2, the corresponding number of the upper peripheral stopper 217 is 1, that is, the upper peripheral stopper 217 is arranged between the first upper peripheral ventilation area 209 and the second upper peripheral ventilation area 210.

[0062] Please continue to refer to Figures 4 to 6. It should be noted that, in this embodiment, the air uniforming component also includes: a lower inner ring stopper 219, the lower central ventilation area 203 is located between the lower inner ring stopper 219 and the lower central stopper 211; a lower outer ring stopper 220, the second lower peripheral ventilation area 208 is located between the lower outer ring stopper 220 and the lower peripheral stopper 213; an upper inner ring stopper 221, the upper central ventilation area 206 is located between the upper inner ring stopper 221 and the upper central stopper 215; an upper outer ring stopper 222, the second upper peripheral ventilation area 210 is located between the upper outer ring stopper 222 and the upper peripheral stopper 217; after the air uniforming lower cover 202 is assembled with the air uniforming upper cover 205, the lower inner ring stopper 219 and the upper inner ring stopper 221 are staggered and fitted; the lower outer ring stopper 220 and the upper outer ring stopper 222 are staggered and fitted.

[0063] Please continue to refer to Figure 2. The air uniforming component also includes: an air supply device 223; a pipeline structure connected to the air uniforming cover 205, wherein the pipeline structure is provided with an air intake pipeline 224 and an air distribution pipeline 225 connected to the air intake pipeline 224, the air distribution pipeline 225 is connected to the central ventilation cavity 229, and the air supply device 223 is connected to the air intake pipeline 224.

[0064] In this embodiment, the air supply device 223 may be an air compressor.

[0065] 2 and 4 , in this embodiment, the upper inner ring block 221 is provided with a plurality of air inlet openings 226 , which correspond to the air distribution pipelines 225 . The cooling gas is input through the air inlet pipeline 224 , passes through the air distribution pipeline 225 , and finally enters the central ventilation cavity 229 through the plurality of air inlet openings 226 .

[0066] 2 , in this embodiment, the air uniforming assembly further includes a cooling device 227 connected to the air supply device 223 . The cooling device 227 can improve the heat dissipation efficiency of the dielectric window body 201 .

[0067] In other embodiments, the refrigeration device may not be provided.

[0068] The air uniforming upper cover 205 can be rotated relative to the air uniforming lower cover 202. The rotation of the air uniforming upper cover 205 can selectively open the central ventilation cavity 229 and at least one of the peripheral ventilation cavities to communicate, or close the central ventilation cavity 229 and the adjacent peripheral ventilation cavities to communicate, so as to achieve selective regionalized delivery of heat dissipation gas toward the surface of the dielectric window body 201 through rotation.

[0069] When the air uniforming cover 205 rotates until the upper center stopper 215 does not block the lower center ventilation gap 212, and the lower center stopper 211 does not block the upper center ventilation gap 216, the central ventilation cavity 229 is opened and connected to at least one of the peripheral ventilation cavities.

[0070] Continuing with FIG6 , in this embodiment, when the air distribution cover 205 rotates until the upper central stopper 215 does not block the lower central ventilation gap 212, the lower central stopper 211 does not block the upper central ventilation gap 216, the upper peripheral stopper 217 does not block the lower peripheral ventilation gap 214, and the corresponding lower peripheral stopper 213 does not block the upper peripheral ventilation gap 218, the central ventilation cavity 229, the first peripheral ventilation cavity 230, and the second peripheral ventilation cavity 231 are connected. This state is suitable for when the temperature difference between the inner and outer circles of the dielectric window body 201 is small, and the three areas can be ventilated simultaneously to blow air to the inner and outer circles of the dielectric window to dissipate heat.

[0071] Continuing with FIG7 , in this embodiment, when the air distribution cover 205 rotates until the upper central stopper 215 does not block the lower central ventilation gap 212, the lower central stopper 211 does not block the upper central ventilation gap 216, the upper peripheral stopper 217 blocks the lower peripheral ventilation gap 214, and the corresponding lower peripheral stopper 213 blocks the upper peripheral ventilation gap 218, the central ventilation cavity 229 is opened to communicate with the first peripheral ventilation cavity 230. This state is suitable for situations where the temperature difference between the inner and outer rings of the dielectric window body 201 is slightly large. Air can be blown simultaneously to the middle area and the adjacent inner ring area of ​​the dielectric window body 201 to dissipate heat and control the temperature difference between the inner and outer rings.

[0072] Continuing with Figure 8 , when the air distribution cover 205 rotates until the upper center stopper 215 blocks the lower center ventilation gap 212, and the lower center stopper 211 blocks the upper center ventilation gap 216, the central ventilation cavity 229 is closed to the adjacent peripheral ventilation cavities. This state is suitable for situations where the temperature difference between the inner and outer regions of the dielectric window body 201 is large. This allows concentrated wind to blow air to the central region of the dielectric window body 201 to dissipate heat and control the temperature difference between the inner and outer regions.

[0073] 2 , the gas leveling assembly further comprises a rotation drive device 228 connected to the gas leveling upper cover 205 for driving the gas leveling upper cover 205 to rotate relative to the gas leveling lower cover 202. The rotation drive device 228 can achieve automation and precision in the rotation of the gas leveling upper cover 205.

[0074] FIG9 is a schematic structural diagram of a plasma etcher according to an embodiment of the present invention.

[0075] Accordingly, a plasma etcher 300 is also provided in an embodiment of the present invention. Please refer to FIG9 and continue to combine with FIG2 to FIG8 , including: a plasma reaction chamber 301; and a dielectric window structure 200 as described in any of the above embodiments arranged in the plasma reaction chamber 301.

[0076] Through the gas homogenizing component arranged on the dielectric window body 201 in the dielectric window structure 200, the gas homogenizing component can transport heat dissipation gas toward the surface of the dielectric window body 201 in a selective and regional manner by rotation, thereby being able to perform refined regional heat dissipation on the dielectric window body 201, and effectively preventing the problem of large temperature differences caused by excessive local problems of the dielectric window body 201, thereby achieving the protection of the dielectric window structure 200, and at the same time accurately controlling the temperature distribution on the surface of the dielectric window body 201, which can also help improve the uniform distribution of the plasma 314, thereby enhancing the uniform etching of the surface of the substrate sheet 303, and inhibiting the tendency of polymer formation on the surface of the dielectric window body 201.

[0077] 9 , the plasma etcher further includes: a plasma coupling coil 302 , an excitation source RF power supply 304 , an excitation source matching network 305 , a shielding cover 306 , a gas source 307 , an air nozzle 308 , a bias electrode 309 , a bias RF power supply 310 , a bias matching network 311 , a pressure control valve 312 , and a vacuum pump 313 , etc.

[0078] The gas source 307 provides process gas to enter the plasma reaction chamber 301 , and plasma 314 is generated under the action of the plasma coupling coil 302 . The bias electrode 309 provides bias to accelerate the plasma 314 to bombard the substrate 303 .

[0079] In this embodiment, the rotation driving device 228 is disposed outside the plasma reaction chamber 301 .

[0080] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the scope defined by the claims.

Claims

1. A dielectric window structure, characterized in that, it includes: a dielectric window body; a gas - equalizing component disposed on the dielectric window body, and the gas - equalizing component can selectively and regionally transport cooling gas towards the surface of the dielectric window body by rotation.

2. The dielectric window structure according to claim 1, characterized in that, the gas - equalizing component includes: a central ventilation cavity; a plurality of peripheral ventilation cavities successively surrounding the central ventilation cavity.

3. The dielectric window structure according to claim 2, characterized in that, the cooling gas diffuses from the central ventilation cavity to each of the peripheral ventilation cavities in sequence.

4. The dielectric window structure according to claim 3, characterized in that, the gas - equalizing component can selectively open the connection between the central ventilation cavity and at least one of the peripheral ventilation cavities or close the connection between the central ventilation cavity and the adjacent peripheral ventilation cavity by rotation, so as to selectively and regionally transport cooling gas towards the surface of the dielectric window body by rotation.

5. The dielectric window structure according to claim 2, characterized in that, the gas - equalizing component includes: a gas - equalizing lower cover, the gas - equalizing lower cover includes a lower central ventilation area and a plurality of lower peripheral ventilation areas, and the plurality of lower peripheral ventilation areas successively surround the lower central ventilation area; a plurality of air outlet holes opened on the gas - equalizing lower cover, and the plurality of air outlet holes are distributed in the lower central ventilation area and the plurality of lower peripheral ventilation areas; a gas - equalizing upper cover adaptively connected to the gas - equalizing lower cover, the gas - equalizing upper cover includes an upper central ventilation area and a plurality of upper peripheral ventilation areas, and the plurality of upper peripheral ventilation areas successively surround the upper central ventilation area; after the gas - equalizing lower cover and the gas - equalizing upper cover are assembled, the central ventilation cavity is formed by the lower central ventilation area and the upper central ventilation area; the peripheral ventilation cavity is formed by the lower peripheral ventilation area and the corresponding upper peripheral ventilation area.

6. The dielectric window structure according to claim 5, characterized in that, the gas - equalizing component further includes: a lower central stop block disposed on the gas - equalizing lower cover and located between the lower central ventilation area and the adjacent lower peripheral ventilation area, and a plurality of lower central ventilation gaps are opened on the lower central stop block; a lower peripheral stop block disposed on the gas - equalizing lower cover and located between the adjacent lower peripheral ventilation areas, and a plurality of lower peripheral ventilation gaps are opened on the lower peripheral stop block; an upper central stop block disposed on the gas - equalizing upper cover and located between the upper central ventilation area and the adjacent upper peripheral ventilation area, and a plurality of upper central ventilation gaps are opened on the upper central stop block; an upper peripheral stop block disposed on the gas - equalizing upper cover and located between the adjacent upper peripheral ventilation areas, and a plurality of upper peripheral ventilation gaps are opened on the upper peripheral stop block; after the gas - equalizing lower cover and the gas - equalizing upper cover are assembled, the lower central stop block and the upper central stop block are misaligned and fitted; the lower peripheral stop block and the corresponding upper peripheral stop block are misaligned and fitted.

7. The dielectric window structure according to claim 6, characterized in that, the gas - equalizing component further includes: a gas supply device; ​ A pipeline structure connected to the air - equalizing upper cover. An air inlet pipeline and a branch air pipeline communicating with the air inlet pipeline are arranged in the pipeline structure. The branch air pipeline communicates with the central ventilation cavity, and the gas supply device communicates with the air inlet pipeline.

8. The dielectric window structure according to claim 7, wherein, the air - equalizing assembly further includes: a refrigeration device connected to the gas supply device.

9. The dielectric window structure according to claim 6 or 7, wherein, the air - equalizing upper cover is rotatable relative to the air - equalizing lower cover.

10. The dielectric window structure according to claim 9, wherein, by rotating the air - equalizing upper cover, the central ventilation cavity and at least one of the peripheral ventilation cavities can be selectively opened to communicate, or the communication between the central ventilation cavity and the adjacent peripheral ventilation cavity can be closed, so as to realize selectively regional delivery of cooling gas towards the surface of the dielectric window body by rotation.

11. The dielectric window structure according to claim 10, wherein, when the air - equalizing upper cover rotates to a position where the upper central stop block does not block the lower central ventilation gap and the lower central stop block does not block the upper central ventilation gap, the communication between the central ventilation cavity and at least one of the peripheral ventilation cavities is opened.

12. The dielectric window structure according to claim 10, wherein, when the air - equalizing upper cover rotates to a position where the upper central stop block blocks the lower central ventilation gap and the lower central stop block blocks the upper central ventilation gap, the communication between the central ventilation cavity and the adjacent peripheral ventilation cavity is closed.

13. The dielectric window structure according to claim 9, wherein, the air - equalizing assembly further includes: a rotary drive device connected to the air - equalizing upper cover for driving the air - equalizing upper cover to rotate relative to the air - equalizing lower cover.

14. A plasma etching machine, wherein, it includes: a plasma reaction chamber; the dielectric window structure according to any one of claims 1 to 13 arranged in the plasma reaction chamber.

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