Silicon wafer water absorption plate insert cleaning mechanism
By setting up a transportation and drying mechanism in the silicon wafer water-absorbing plate insert cleaning mechanism, the problem of residual cleaning liquid on the surface of the silicon wafer is solved, automatic transportation and drying is realized, and processing efficiency is improved.
Patent Information
- Application Number
- PCT/CN2024/100245
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-11-22
- Filing Date
- 2024-06-20
- Publication Date
- 2025-05-30
AI Technical Summary
After the silicon wafer is cleaned, there is a cleaning liquid on the surface of the silicon wafer, resulting in a reduction in subsequent processing and storage efficiency.
Set up a transportation mechanism and a drying mechanism so that the material cleaning process can not only be automatically transported and cleaned, but also dry the cleaned materials to improve processing efficiency.
Through automatic transportation and drying, the efficiency of the silicon wafer cleaning process is improved, the residue of cleaning liquid is reduced, and the efficiency of subsequent processing and storage is improved.
Smart Images

Figure CN2024100245_30052025_PF_FP_ABST
Abstract
Description
A silicon wafer water absorption plate insert cleaning mechanism
[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 22, 2023, with application number 202323153963.9 and application name “A Silicon Wafer Water Absorbent Plate Insert Cleaning Mechanism”, the entire contents of which are incorporated by reference into this application. Technical Field
[0002] The embodiments of the present application relate to, but are not limited to, the technical field of cleaning a silicon wafer water absorption plate insert, and in particular to a silicon wafer water absorption plate insert cleaning mechanism. Background Art
[0003] As a green energy and a major energy source for sustainable human development, photovoltaic power generation is increasingly valued and developed by countries around the world.
[0004] In the silicon wafer water absorption plate insert cleaning mechanism, for example, a silicon wafer water absorption plate insert cleaning mechanism disclosed in the patent with publication number CN207086417U realizes the recycling of wastewater from the silicon wafer degumming machine, inserting machine and silicon wafer cleaning machine through a simple and easy water pipeline design. In particular, a water-saving unit is set on the water pipeline to ensure the recycling of water used in the degumming, inserting and cleaning processes; the water storage tank, circulation pump, flow control valve and filter device are arranged in sequence along the water circulation direction of the water-saving unit, which realizes multiple functions such as wastewater storage, drive, flow control and filtration; if the water-saving unit is cancelled on the water pipeline, fixed impurities in the silicon wafer degumming machine, inserting machine and silicon wafer cleaning machine, such as detached colloids, silicon wafer fragments, etc., may easily cause blockage of the water pipeline, and it is not conducive to the cleaning of the water pipeline, making it difficult to ensure the normal wastewater circulation of the silicon wafer degumming machine, inserting machine and silicon wafer cleaning machine; moreover, the setting of the water storage tank can maximize the utilization of recycled wastewater.
[0005] However, after the silicon wafer is cleaned, cleaning liquid remains on the surface of the silicon wafer, which reduces the efficiency of subsequent processing and storage. Summary of the Invention
[0006] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
[0007] The embodiment of the present application provides a silicon wafer absorbent plate insert cleaning mechanism that is equipped with a transport mechanism and a drying mechanism, so that during the material cleaning process, not only the material can be automatically transported and cleaned, but also the cleaned material can be dried, thereby improving processing efficiency.
[0008] A silicon wafer water absorption plate insert cleaning mechanism in an embodiment of the present application includes a transport mechanism; a lifting mechanism, a cleaning mechanism, a drying mechanism, and a water return mechanism, wherein the lifting mechanism is mounted at the left end of the transport mechanism, the cleaning mechanism is mounted at the lower end of the transport mechanism, the drying mechanism is mounted at the lower end of the cleaning mechanism, and the water return mechanism is mounted at the front end of the lifting mechanism;
[0009] The transport mechanism transports the material, the lifting mechanism lifts the material for transport, the cleaning mechanism cleans the material, the drying mechanism dries the material, and the return water mechanism reuses the waste water; the material is transported by opening the transport mechanism, and the cleaning mechanism is opened at the same time to clean the material, the waste water is filtered and reused by opening the return water mechanism, and the cleaning liquid is heated by opening the drying mechanism, the lifting mechanism is transmitted by the transport mechanism so that the lifting mechanism lifts and transports the material, and the drying mechanism is opened at the same time to dry the material, so that during the material cleaning process, not only can the material be automatically transported and cleaned, but the cleaned material can also be dried, thereby improving processing efficiency.
[0010] The transport mechanism includes a bracket, three sets of sprocket shafts, two sets of sprockets, two sets of guide shafts, four sets of guide wheels, two sets of chains, multiple sets of stretchers and a motor. The three sets of sprocket shafts are rotatably mounted on the bracket, and the input end of one set of sprocket shafts extends to the rear side of the bracket, and the output end of the other set of sprocket shafts extends to the front side of the bracket. The two sets of sprockets are rotatably mounted on the bracket, the two sets of guide shafts are rotatably mounted on the bracket, and the four sets of guide wheels are rotatably mounted on the bracket. The two sets of chains are covered and mounted on the three sets of sprocket shafts, the two sets of sprockets, the two sets of guide shafts and the four sets of guide wheels. Multiple sets of stretchers are mounted on each set of chains. The motor is mounted at the rear end of the bracket, and the output end of the motor is connected to the input end of a set of sprocket shafts. The motor is turned on to cooperate with the sprocket shaft to drive the chain to rotate. While the chain rotates, the stretcher is driven to transport the material.
[0011] The lifting mechanism includes two sets of wheel axles, a conveyor belt, multiple sets of stretcher 2, multiple sets of baffles, two sets of sprocket 2 and chain 2. The two sets of wheel axles are rotatably installed on the bracket, and the input end of one set of wheel axles extends to the front side of the bracket. The conveyor belt is covered and installed on the two sets of wheel axles. Multiple sets of stretcher 2 are installed on the conveyor belt. Multiple sets of baffles are installed on the conveyor belt. Two sets of sprocket 2 are respectively installed on the output end of one set of sprocket shaft and the input end of one set of wheel axle. Chain 2 is covered and installed on the two sets of sprocket 2. The sprocket shaft is rotated to transmit the power to the sprocket 2 so that the sprocket 2 rotates. When the sprocket 2 rotates, the chain 2 cooperates with the wheel axle to rotate the wheel axle. When the wheel axle rotates, the conveyor belt is driven to rotate. When the conveyor belt rotates, the stretcher 2 and the baffle are driven to transport the material.
[0012] The cleaning mechanism includes a cleaning chamber and an ultrasonic cleaning machine. The cleaning chamber is installed at the lower end of the bracket, and the ultrasonic cleaning machine is installed in the cleaning chamber. The material is cleaned by turning on the ultrasonic cleaning machine.
[0013] The drying mechanism includes a heating chamber, an air outlet, a heating wire and a fan. The heating chamber is installed at the lower end of the cleaning chamber, the air outlet is installed at the left end of the heating chamber, the heating wire is installed in the heating chamber, the fan is installed at the right end of the heating chamber, and the fan output end extends to the inside of the heating chamber; by energizing the heating wire, the heating wire heats the cleaning liquid in the cleaning chamber, and by turning on the fan, the hot air in the heating chamber is ejected through the air outlet to dry the material.
[0014] The return water mechanism includes a debris box, a filter, a slag discharge port, a water pump, a water outlet and a water pipe. The debris box is installed at the front end of the cleaning bin, the filter is installed in the debris box, the slag discharge port is installed at the left end of the debris box, the water pump is installed at the front end of the debris box, the water outlet is installed on the bracket, and the water outlet input end extends to the front side of the bracket, and the water outlet input end is connected to the water pump output end through a water pipe; by turning on the water pump, the cleaning liquid filtered out of the filter is sprayed out through the water pipe and the water outlet for reuse.
[0015] Still other aspects will become apparent upon reading and understanding the accompanying drawings and detailed description. Beneficial effects
[0016] The embodiments of the present application have at least the following beneficial effects: materials are transported by opening the transport mechanism, and the materials are cleaned by opening the cleaning mechanism at the same time; waste water is filtered and reused by opening the return water mechanism, and the cleaning liquid is heated by opening the drying mechanism at the same time; the lifting mechanism is transmitted through the transport mechanism so that the lifting mechanism lifts and transports the materials, and the drying mechanism is opened at the same time to dry the materials, so that during the material cleaning process, not only can the materials be automatically transported and cleaned, but the cleaned materials can also be dried, thereby improving processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] FIG1 is a schematic diagram of an axonometric structure provided in an embodiment of the present application;
[0018] FIG2 is a schematic diagram of a front view of the structure provided in an embodiment of the present application;
[0019] FIG3 is a left-side structural diagram provided in an embodiment of the present application;
[0020] FIG4 is a schematic diagram of a front cross-sectional isometric structure provided in an embodiment of the present application;
[0021] FIG5 is a schematic diagram of a left-side sectional isometric structure provided in an embodiment of the present application;
[0022] Markings in the accompanying drawings: 1. Transport mechanism; 11. Bracket; 12. Sprocket shaft; 13. Sprocket 1; 14. Guide shaft; 15. Guide wheel; 16. Chain 1; 17. Stretcher 1; 18. Motor; 2. Lifting mechanism; 21. Axle; 22. Conveyor belt; 23. Stretcher 2; 24. Baffle; 25. Sprocket 2; 26. Chain 2; 3. Cleaning mechanism; 31. Cleaning chamber; 32. Ultrasonic cleaning machine; 4. Drying mechanism; 41. Heating chamber; 42. Air outlet; 43. Heating wire; 44. Fan; 5. Return water mechanism; 51. Miscellaneous box; 52. Filter; 53. Slag discharge port; 54. Water pump; 55. Water outlet; 56. Water pipe. Modes for Carrying Out the Invention
[0023] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.
[0024] Example 1
[0025] As shown in Figures 1 to 5, the embodiments of the present application relate to a silicon wafer water absorption plate insert cleaning mechanism, comprising a transport mechanism 1, a lifting mechanism 2, a cleaning mechanism 3, a drying mechanism 4, and a water return mechanism 5. The lifting mechanism 2 is mounted on the left end of the transport mechanism 1, the cleaning mechanism 3 is mounted on the lower end of the transport mechanism 1, the drying mechanism 4 is mounted on the lower end of the cleaning mechanism 3, and the water return mechanism 5 is mounted on the front end of the lifting mechanism 2.
[0026] The transport mechanism 1 transports the materials, the lifting mechanism 2 lifts and transports the materials, the cleaning mechanism 3 cleans the materials, the drying mechanism 4 dries the materials, and the return water mechanism 5 reuses the wastewater;
[0027] The transport mechanism 1 includes a bracket 11, three groups of sprocket shafts 12, two groups of sprockets 13, two groups of guide shafts 14, four groups of guide wheels 15, two groups of chains 16, multiple groups of stretchers 17 and a motor 18. The three groups of sprocket shafts 12 are rotatably mounted on the bracket 11, and the input end of one group of sprocket shafts 12 extends to the rear side of the bracket 11, and the output end of the other group of sprocket shafts 12 extends to the front side of the bracket 11. The two groups of sprockets 13 are rotatably mounted on the bracket 11, the two groups of guide shafts 14 are rotatably mounted on the bracket 11, and the four groups of guide wheels 15 are rotatably mounted on the bracket 11. The two groups of chains 16 are covered and mounted on the three groups of sprocket shafts 12, the two groups of sprockets 13, the two groups of guide shafts 14 and the four groups of guide wheels 15. Multiple groups of stretchers 17 are installed on each group of chains 16. The motor 18 is mounted on the rear end of the bracket 11, and the output end of the motor 18 is connected to the input end of one group of sprocket shafts 12.
[0028] The lifting mechanism 2 includes two sets of axles 21, a conveyor belt 22, multiple sets of stretchers 23, multiple sets of baffles 24, two sets of sprockets 25, and a chain 26. The two sets of axles 21 are rotatably mounted on the bracket 11, and the input end of one set of axles 21 extends to the front side of the bracket 11. The conveyor belt 22 is mounted on the two sets of axles 21. Multiple sets of stretchers 23 are mounted on the conveyor belt 22. Multiple sets of baffles 24 are mounted on the conveyor belt 22. Two sets of sprockets 25 are respectively mounted on the output end of one set of sprocket shafts 12 and the input end of one set of axles 21. The chain 26 is mounted on the two sets of sprockets 25.
[0029] The cleaning mechanism 3 includes a cleaning chamber 31 and an ultrasonic cleaning machine 32. The cleaning chamber 31 is mounted at the lower end of the bracket 11, and the ultrasonic cleaning machine 32 is mounted in the cleaning chamber 31.
[0030] The return water mechanism 5 includes a dust box 51, a filter screen 52, a slag discharge port 53, a water pump 54, a water outlet 55 and a water pipe 56. The dust box 51 is installed at the front end of the cleaning chamber 31, the filter screen 52 is installed in the dust box 51, the slag discharge port 53 is installed at the left end of the dust box 51, the water pump 54 is installed at the front end of the dust box 51, and the water outlet 55 is installed on the bracket 11. The input end of the water outlet 55 extends to the front side of the bracket 11, and the input end of the water outlet 55 is connected to the output end of the water pump 54 through a water pipe 56.
[0031] By turning on the motor 18 and cooperating with the sprocket shaft 12 to drive the chain 16 to rotate the chain 16, and while the chain 16 rotates, the stretcher 17 is driven so that the stretcher 17 drives the material to be transported, and at the same time, the material is cleaned by turning on the ultrasonic cleaning machine 32, and the cleaning liquid filtered out of the filter 52 is sprayed out through the water pipe 56 and the water outlet 55 by turning on the water pump 54 for reuse, and the sprocket shaft 12 rotates to drive the sprocket 2 25 to rotate, and while the sprocket 2 25 rotates, the chain 2 26 drives the wheel axle 21 to rotate, and while the wheel axle 21 rotates, the conveyor belt 22 is driven so that the conveyor belt 22 rotates, and while the conveyor belt 22 rotates, the stretcher 2 23 and the baffle 24 are driven to transport the material, so that the material can be automatically transported and cleaned during the material cleaning process, thereby improving the processing efficiency.
[0032] Example 2
[0033] As shown in Figures 1 to 5, the embodiments of the present application relate to a silicon wafer water absorption plate insert cleaning mechanism, comprising a transport mechanism 1, a lifting mechanism 2, a cleaning mechanism 3, a drying mechanism 4, and a water return mechanism 5. The lifting mechanism 2 is mounted on the left end of the transport mechanism 1, the cleaning mechanism 3 is mounted on the lower end of the transport mechanism 1, the drying mechanism 4 is mounted on the lower end of the cleaning mechanism 3, and the water return mechanism 5 is mounted on the front end of the lifting mechanism 2.
[0034] The transport mechanism 1 transports the materials, the lifting mechanism 2 lifts and transports the materials, the cleaning mechanism 3 cleans the materials, the drying mechanism 4 dries the materials, and the return water mechanism 5 reuses the wastewater;
[0035] The transport mechanism 1 includes a bracket 11, three groups of sprocket shafts 12, two groups of sprockets 13, two groups of guide shafts 14, four groups of guide wheels 15, two groups of chains 16, multiple groups of stretchers 17 and a motor 18. The three groups of sprocket shafts 12 are rotatably mounted on the bracket 11, and the input end of one group of sprocket shafts 12 extends to the rear side of the bracket 11, and the output end of the other group of sprocket shafts 12 extends to the front side of the bracket 11. The two groups of sprockets 13 are rotatably mounted on the bracket 11, the two groups of guide shafts 14 are rotatably mounted on the bracket 11, and the four groups of guide wheels 15 are rotatably mounted on the bracket 11. The two groups of chains 16 are covered and mounted on the three groups of sprocket shafts 12, the two groups of sprockets 13, the two groups of guide shafts 14 and the four groups of guide wheels 15. Multiple groups of stretchers 17 are installed on each group of chains 16. The motor 18 is mounted on the rear end of the bracket 11, and the output end of the motor 18 is connected to the input end of one group of sprocket shafts 12.
[0036] The lifting mechanism 2 includes two sets of axles 21, a conveyor belt 22, multiple sets of stretchers 23, multiple sets of baffles 24, two sets of sprockets 25, and a chain 26. The two sets of axles 21 are rotatably mounted on the bracket 11, and the input end of one set of axles 21 extends to the front side of the bracket 11. The conveyor belt 22 is mounted on the two sets of axles 21. Multiple sets of stretchers 23 are mounted on the conveyor belt 22. Multiple sets of baffles 24 are mounted on the conveyor belt 22. Two sets of sprockets 25 are respectively mounted on the output end of one set of sprocket shafts 12 and the input end of one set of axles 21. The chain 26 is mounted on the two sets of sprockets 25.
[0037] The cleaning mechanism 3 includes a cleaning chamber 31 and an ultrasonic cleaning machine 32. The cleaning chamber 31 is mounted at the lower end of the bracket 11, and the ultrasonic cleaning machine 32 is mounted in the cleaning chamber 31.
[0038] The drying mechanism 4 includes a heating chamber 41, an air outlet 42, a heating wire 43 and a fan 44. The heating chamber 41 is installed at the lower end of the cleaning chamber 31, the air outlet 42 is installed at the left end of the heating chamber 41, the heating wire 43 is installed in the heating chamber 41, and the fan 44 is installed at the right end of the heating chamber 41, and the output end of the fan 44 extends to the inside of the heating chamber 41;
[0039] The return water mechanism 5 includes a dust box 51, a filter screen 52, a slag discharge port 53, a water pump 54, a water outlet 55 and a water pipe 56. The dust box 51 is installed at the front end of the cleaning chamber 31, the filter screen 52 is installed in the dust box 51, the slag discharge port 53 is installed at the left end of the dust box 51, the water pump 54 is installed at the front end of the dust box 51, and the water outlet 55 is installed on the bracket 11. The input end of the water outlet 55 extends to the front side of the bracket 11, and the input end of the water outlet 55 is connected to the output end of the water pump 54 through a water pipe 56.
[0040] By turning on the motor 18 and cooperating with the sprocket shaft 12 to drive the chain 16 so that the chain 16 rotates, the stretcher 17 is driven while the chain 16 rotates so that the stretcher 17 drives the material to be transported, and at the same time, the material is cleaned by turning on the ultrasonic cleaning machine 32, and the cleaning liquid filtered out of the filter 52 is sprayed out through the water pipe 56 and the water outlet 55 by turning on the water pump 54 for reuse. At the same time, the heating wire 43 is energized to heat the cleaning liquid in the cleaning chamber 31, and the sprocket shaft 12 rotates to drive the sprocket 22. 5 is driven to rotate the sprocket 25. The sprocket 25 rotates and cooperates with the chain 26 to drive the axle 21 to rotate. The axle 21 rotates and drives the conveyor belt 22 to rotate. The conveyor belt 22 rotates and drives the stretcher 23 and the baffle 24 to transport the materials. At the same time, the fan 44 is turned on to make the hot air in the heating chamber 41 spray out through the air outlet 42 to dry the materials. In this way, the cleaned materials can be dried during the material cleaning process, thereby improving the processing efficiency.
[0041] As shown in Figures 1 to 5, a silicon wafer absorbent plate insert cleaning mechanism in the embodiment of the present application, when working, by turning on the motor 18 to cooperate with the sprocket shaft 12 to drive the chain 16 to rotate the chain 16, while the chain 16 rotates, it drives the stretcher 17 so that the stretcher 17 drives the material to be transported, and at the same time, the material is cleaned by turning on the ultrasonic cleaning machine 32, and the cleaning liquid filtered out of the filter 52 is sprayed out through the water pipe 56 and the water outlet 55 by turning on the water pump 54 for reuse, and at the same time, the heating wire 43 is energized. The heating wire 43 heats the cleaning liquid in the cleaning chamber 31, and the sprocket shaft 12 rotates to drive the sprocket 2 25 to rotate. While the sprocket 2 25 rotates, the chain 2 26 drives the axle 21 to rotate. While the axle 21 rotates, the conveyor belt 22 is driven to rotate. While the conveyor belt 22 rotates, the stretcher 23 and the baffle 24 are driven to transport the material. At the same time, the fan 44 is turned on to allow the hot air in the heating chamber 41 to be ejected through the air outlet 42 to dry the material.
[0042] The motor 18, ultrasonic cleaning machine 32, fan 44 and water pump 54 in the embodiment of the present application are purchased on the market. Technicians in this industry only need to install and operate them according to the accompanying instruction manuals, without the need for technical personnel in this field to make creative efforts.
[0043] The main functions realized in the embodiments of the present application are: during the cleaning process of the silicon wafer absorbent plate insert, by setting up a transportation mechanism and a drying mechanism, the material cleaning process can not only be automatically transported and cleaned, but also the cleaned material can be dried, thereby improving processing efficiency.
[0044] The above is only a preferred embodiment of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.
Claims
1. A silicon wafer water absorption plate insert cleaning mechanism, comprising a transport mechanism; further comprising a lifting mechanism, a cleaning mechanism, a drying mechanism and a water return mechanism, wherein the lifting mechanism is mounted at the left end of the transport mechanism, the cleaning mechanism is mounted at the lower end of the transport mechanism, the drying mechanism is mounted at the lower end of the cleaning mechanism, and the water return mechanism is mounted at the front end of the lifting mechanism; The transport mechanism transports the materials, the lifting mechanism lifts the materials for transport, the cleaning mechanism cleans the materials, the drying mechanism dries the materials, and the water return mechanism reuses the waste water.
2. A silicon wafer water absorption plate insert cleaning mechanism as claimed in claim 1, wherein: The transport mechanism comprises a bracket, three groups of sprocket shafts, two groups of sprockets one, two groups of guide shafts, four groups of guide wheels, two groups of chains one, multiple groups of stretchers one and a motor, the three groups of sprocket shafts are rotatably mounted on the bracket, and the input end of one group of sprocket shafts extends to the rear side of the bracket, and the output end of the other group of sprocket shafts extends to the front side of the bracket, the two groups of sprockets one are rotatably mounted on the bracket, the two groups of guide shafts are rotatably mounted on the bracket, the four groups of guide wheels are rotatably mounted on the bracket, the two groups of chains one are covered and mounted on the three groups of sprocket shafts, the two groups of sprockets one, the two groups of guide shafts and the four groups of guide wheels, multiple groups of stretchers one are mounted on each group of chains one, the motor is mounted on the rear end of the bracket, and the output end of the motor is connected to the input end of one group of sprocket shafts.
3. A silicon wafer water absorption plate insert cleaning mechanism as claimed in claim 2, wherein: The lifting mechanism includes two groups of wheel axles, a conveyor belt, multiple groups of stretchers II, multiple groups of baffles, two groups of sprockets II and two chains. The two groups of wheel axles are rotatably mounted on the bracket, and the input end of one group of wheel axles extends to the front side of the bracket. The conveyor belt is covered and mounted on the two groups of wheel axles. Multiple groups of stretchers II are mounted on the conveyor belt. Multiple groups of baffles are mounted on the conveyor belt. The two groups of sprockets II are respectively mounted on the output end of one group of sprocket shafts and the input end of one group of wheel axles. The chain II is covered and mounted on the two groups of sprockets II.
4. A silicon wafer water absorption plate insert cleaning mechanism as claimed in claim 2, wherein: The cleaning mechanism comprises a cleaning chamber and an ultrasonic cleaning machine. The cleaning chamber is installed at the lower end of the bracket, and the ultrasonic cleaning machine is installed in the cleaning chamber.
5. A silicon wafer water absorption plate insert cleaning mechanism as claimed in claim 4, wherein: The drying mechanism includes a heating chamber, an air outlet, a heating wire and a fan. The heating chamber is installed at the lower end of the cleaning chamber, the air outlet is installed at the left end of the heating chamber, the heating wire is installed in the heating chamber, the fan is installed at the right end of the heating chamber, and the fan output end extends to the inner side of the heating chamber.
6. A silicon wafer water absorption plate insert cleaning mechanism as claimed in claim 4, wherein: The water return mechanism includes a debris box, a filter, a slag discharge port, a water pump, a water outlet and a water pipe. The debris box is installed at the front end of the cleaning bin, the filter is installed in the debris box, the slag discharge port is installed at the left end of the debris box, the water pump is installed at the front end of the debris box, the water outlet is installed on the bracket, and the water outlet input end extends to the front side of the bracket, and the water outlet input end is connected to the water pump output end through the water pipe.
Citation Information
Patent Citations
Inserting full-automatic and cleaning device and cleaning technological process for silicon wafers
CN105529290A
Full-automatic silicon wafer cleaning device
CN110328166A
Solar silicon wafer ultrasonic cleaning machine
CN116967205A
Silicon wafer cleaning machine table
CN218975405U
Water-saving reciprocating cleaning device
JP2020198863A