Electrochemical device and electrical apparatus

Abstract

An electrochemical device and an electrical apparatus. The electrochemical device comprises a housing, an electrode assembly, and a bonding member. The housing comprises a first sidewall. The electrode assembly is arranged in the housing and comprises a first side surface adjacent to the first sidewall, and the first side surface comprises a second region, a first region and a third region that are sequentially arranged in a first direction. The bonding member is located between the housing and the electrode assembly; the bonding member comprises a first side and a second side that are opposite to each other; the first side comprises a first bonding region bonded to the first sidewall; the second side comprises a second bonding region bonded to the second region, a third bonding region bonded to the third region, and a first non-bonding region located between the second bonding region and the third bonding region. In a second direction, the projection of the first bonding region overlaps with the first non-bonding region, and the second direction is the direction in which the first sidewall is opposite to the first side surface. The first non-bonding region arranged on the bonding member is not bonded to the first side surface, thereby being conducive to reducing the risk of damage to the electrode assembly.

Description

Electrochemical devices and electrical equipment Technical Field

[0001] The present application relates to the field of energy storage technology, and in particular to an electrochemical device and electrical equipment. Background Art

[0002] In order to improve the failure problems of internal short circuit, breaking of top seal, etc. caused by the movement of internal electrode components when electrochemical devices such as batteries fall, a double-sided adhesive layer is usually provided between the electrode assembly and the shell of the electrochemical device, with one side bonded to the shell and the other side bonded to the electrode assembly to suppress the movement of the electrode assembly. This reduces the failure risk of the electrochemical device when it falls to a certain extent and improves the safety of the electrochemical device.

[0003] Summary of the Invention

[0004] However, the inventors of the present application have discovered that the existing structure of bonding the electrode assembly to the shell with double-sided tape can suppress the movement of the electrode assembly when the electrochemical device falls, but there is a risk of easily tearing the foil on the outer ring of the electrode assembly, causing an internal short circuit.

[0005] In view of this, the present application provides an electrochemical device and electrical equipment, which aim to suppress the movement of the electrode assembly relative to the shell while reducing the risk of damage to the outer foil of the electrode assembly, thereby improving the safety of the electrochemical device.

[0006] In a first aspect, the present application provides an electrochemical device comprising a housing, an electrode assembly, and an adhesive. The housing comprises a first sidewall, the electrode assembly being disposed within the housing. The electrode assembly comprises a first side surface adjacent to the first sidewall, the first side surface comprising a first region, a second region, and a third region. Along a first direction, the first region is located between the second and third regions. The adhesive is disposed between the housing and the electrode assembly, comprising opposing first and second sides, the first side adjacent to the housing and the second side facing away from the housing. The first side comprises a first adhesive layer comprising a first bonding region bonded to the first sidewall; the second side comprises a second adhesive layer and a third adhesive layer, the second adhesive layer comprising a second bonding region bonded to the second region, and the third adhesive layer comprising a third bonding region bonded to the third region. The surface of the second side comprises a first non-bonding region not bonded to the first region, the first non-bonding region being located between the second bonding region and the third bonding region. Along a second direction, the projection of the first adhesive layer overlaps with the first non-bonding region. The second direction is the direction from the first sidewall to the first side surface.

[0007] The present application arranges an adhesive between the first side surface and the first side wall, and the shell and the electrode assembly are fixed in relative position by the first adhesive layer, the second adhesive layer and the third adhesive layer of the adhesive, which is beneficial to reducing the risk of the electrode assembly moving when the electrochemical device is impacted. In addition, a first non-adhesive area that is not bonded to the first side surface is arranged on the adhesive, which is beneficial to reducing the impact force transmitted to the electrode assembly by the adhesive when the electrochemical device is impacted, thereby reducing the risk of damage to the outer ring electrode of the electrode assembly.

[0008] In some embodiments, the adhesive member further comprises a substrate layer, wherein a first adhesive layer is disposed on a surface of the substrate layer facing the housing, and a second adhesive layer and a third adhesive layer are disposed on a surface of the substrate layer facing the electrode assembly. This arrangement eliminates the need for multiple layers of adhesive tape to bond the housing and the electrode assembly, thereby reducing the overall thickness of the electrochemical device and increasing its energy density.

[0009] In some embodiments, the surface of the first side further includes a second non-adhesive region and a third non-adhesive region that are not bonded to the first sidewall. Along the first direction, the first adhesive region is located between the second and third non-adhesive regions. Along the second direction, the projection of the second non-adhesive region overlaps with the second adhesive region, and the projection of the third non-adhesive region overlaps with the third adhesive region. This arrangement reduces the pulling force of the adhesive on the first side surface when the electrochemical device is impacted, thereby reducing the risk of damage to the outer electrode sheet of the electrode assembly.

[0010] In some embodiments, along the second direction, the first non-adhesive area covers a projection of the first adhesive area, the projection of the second non-adhesive area covers the second adhesive area, and the projection of the third non-adhesive area covers the third adhesive area.

[0011] In some embodiments, along the first direction, the distance between the first bonding area and the second bonding area is greater than zero, and the distance between the first bonding area and the third bonding area is greater than zero. This arrangement allows the adhesive to have a portion that is neither bonded to the first sidewall nor to the first side surface. When the electrochemical device is impacted, the force from the housing is transmitted to the electrode assembly and absorbed through local deformation dissipation of the adhesive. This inhibits relative positional movement between the electrode assembly and the housing, further reducing the force transmitted from the adhesive to the first side surface, thereby reducing the risk of damage to the outer ring electrode sheet of the electrode assembly.

[0012] In some embodiments, along the second direction, the projection of the first bonding area overlaps the first non-bonding area, the projection of the first bonding area overlaps the second bonding area, and the projection of the first bonding area overlaps the third bonding area. This arrangement helps increase the bonding area between the adhesive and the housing, and also allows the adhesive to partially bond to both the first sidewall and the first side surface, thereby improving the bond strength between the electrode assembly and the housing, further reducing the risk of relative positional shifting between the electrode assembly and the housing, and effectively reducing the force transmitted by the adhesive to the first side surface.

[0013] In some embodiments, a portion of the substrate layer's surface facing the electrode assembly is exposed to form a first non-adhesive zone; a portion of the substrate layer's surface facing the housing is exposed to form a second non-adhesive zone and a third non-adhesive zone. This arrangement eliminates the need for multiple layers of adhesive tape to achieve partial non-adhesion between the adhesive member and the housing, and partial non-adhesion between the adhesive member and the first side surface, thereby reducing the overall thickness of the electrochemical device and improving its energy density.

[0014] In some embodiments, the adhesive member further includes a first non-adhesive layer, a second non-adhesive layer and a third non-adhesive layer, the first non-adhesive layer is bonded to the surface of the second adhesive layer and / or the third adhesive layer to form a first non-adhesive area; the second non-adhesive layer is bonded to the side surface of the first adhesive layer facing away from the second area to form a second non-adhesive area; the third non-adhesive layer is bonded to the side surface of the first adhesive layer facing away from the third area to form a third non-adhesive area. In this way, after the first adhesive layer, the second adhesive layer and the third adhesive layer are directly coated on the base material layer, the second non-adhesive area and the third non-adhesive area are formed by bonding the second non-adhesive layer and the third non-adhesive layer on the first adhesive layer, and the first non-adhesive area is formed by bonding the first non-adhesive layer on the second adhesive layer and / or the third adhesive layer. The area and position of the first non-adhesive area, the second non-adhesive area and the third non-adhesive area can be adjusted by adjusting the area and setting position of the first non-adhesive layer, the second non-adhesive layer and the third non-adhesive layer, so that the formation method and adjustment method of the non-adhesive area have the advantages of simple operation, high efficiency and low cost.

[0015] In some embodiments, the substrate layer includes a first substrate portion and a second substrate portion, the first substrate portion being provided with a second adhesive layer and a portion of the first adhesive layer, and the second substrate portion being provided with a third adhesive layer and a portion of the first adhesive layer. The first substrate portion and the second substrate portion are arranged along a first direction; alternatively, the first substrate portion and the second substrate portion are arranged along a third direction, the third direction being perpendicular to both the first and second directions.

[0016] In some embodiments, along the first direction, the width of the electrode assembly is W, and along the third direction, the length of the electrode assembly is L, and the third direction is perpendicular to the first direction and the second direction.

[0017] In some embodiments, along the first direction, the distance between the center of the first bonding area and the center of the first side surface is D1, satisfying: D1≤0.1W. This is conducive to promoting more uniform pulling of the shell on the electrode assembly, further suppressing the movement of the battery cell and reducing the risk of damage to the outer ring electrode of the electrode assembly.

[0018] In some embodiments, along the third direction, the distance between the center of the first bonding area and the center of the first side surface is D2, satisfying: D2≤0.1L. This is conducive to promoting more uniform pulling of the shell on the electrode assembly, further suppressing the movement of the battery cell and reducing the risk of damage to the outer ring electrode of the electrode assembly.

[0019] In some embodiments, along the first direction, the width of the first bonding area is W1, satisfying: 0.3W≤W1≤0.8W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reducing the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0020] In some embodiments, along the third direction, the length of the first bonding area is L1, satisfying: 0.4L≤L1≤0.8L. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0021] In some embodiments, along the first direction, the width of the second bonding area is w1, satisfying: 0.05W≤w1≤0.45W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reducing the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0022] In some embodiments, along the first direction, the width of the third bonding area is w2, satisfying: 0.05W≤w2≤0.45W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reducing the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0023] In some embodiments, along the third direction, the length of the first bonding area is L1, and the length of the second bonding area is l1, satisfying: l1≥0.4L1. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0024] In some embodiments, along the third direction, the length of the first bonding area is L1, and the length of the third bonding area is l2, satisfying: l2≥0.4L1. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0025] In some embodiments, the second bonding area includes a plurality of second sub-bonding areas spaced apart along the third direction, which is beneficial for further reducing the risk of the electrode assembly moving and the risk of damage to the outer ring electrode piece of the electrode assembly.

[0026] In some embodiments, the third bonding area includes a plurality of third sub-bonding areas spaced apart along the third direction, which is beneficial for further reducing the risk of the electrode assembly moving and the risk of damage to the outer ring electrode piece of the electrode assembly.

[0027] In some embodiments, along the first direction, the distance from the first bonding area to the edge of one side of the substrate layer is W2, satisfying: 0≤W2≤0.45W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0028] In some embodiments, along the first direction, the distance from the first bonding area to the edge of the other side of the substrate layer is W3, satisfying: 0≤W3≤0.45W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0029] In some embodiments, along the third direction, the distance from the first bonding area to the edge of one side of the substrate layer is L2, satisfying: 0≤L2≤0.4L1. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reducing the risk of movement of the electrode assembly and the risk of damage to the outer ring electrode of the electrode assembly.

[0030] In some embodiments, along the third direction, the distance from the first bonding area to the edge of the other side of the substrate layer is L3, satisfying: 0≤L3≤0.4L1. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reducing the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0031] In some embodiments, along the first direction, the distance between the second bonding area and the first bonding area is H1, satisfying: H1≤0.25W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0032] In some embodiments, along the first direction, the distance between the third bonding area and the first bonding area is H2, satisfying: H2≤0.25W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0033] In some embodiments, along the second direction, the projection of the first bonding area and the second bonding area have a first overlapping area, and the width of the first overlapping area along the first direction is q1, q1≤0.32W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0034] In some embodiments, along the second direction, the projection of the first bonding area has a second overlapping area with the third bonding area, and the width of the second overlapping area along the first direction is q2, q2≤0.32W. When this condition is met, the pass rate of the battery drop test is better, which is beneficial to reduce the risk of electrode assembly movement and the risk of damage to the outer ring electrode of the electrode assembly.

[0035] In some embodiments, the electrode assembly further includes a second side, a third side, and a fourth side. The second side is arranged opposite to the first side along the second direction, and the third side is arranged opposite to the fourth side along the first direction. The second adhesive layer is bonded to both the second region and the third side. This arrangement enables the adhesive to transfer the force of the shell to the third side of the electrode assembly. When the electrode assembly is a winding structure, the electrode sheet located on the arc-shaped third side is more likely to disperse the force transferred by the adhesive, thereby helping to reduce the risk of damage to the outer ring electrode sheet of the electrode assembly; when the electrode assembly is a stacked structure, the adhesive is bonded to the edge of the diaphragm, positive electrode sheet or negative electrode sheet on the third side, which is not easy to cause damage to the electrode sheet of the electrode assembly, and helps to inhibit the relative sliding between the diaphragm and the positive electrode sheet or the negative electrode sheet.

[0036] In some embodiments, the third adhesive layer is bonded to both the third region and the fourth side. This arrangement enables the adhesive to transfer the force of the shell to the fourth side of the electrode assembly. When the electrode assembly is a wound structure, the pole piece located on the arc-shaped fourth side is more likely to disperse the force transferred by the adhesive, which is beneficial to reducing the risk of damage to the outer ring pole piece of the electrode assembly; when the electrode assembly is a stacked structure, the adhesive is bonded to the edge of the diaphragm, positive pole piece or negative pole piece on the fourth side, which is not easy to cause damage to the pole piece of the electrode assembly, and helps to inhibit the relative sliding between the diaphragm and the positive pole piece or the negative pole piece.

[0037] In some embodiments, the second adhesive layer is bonded to the second side surface, thereby increasing the bonding area between the adhesive and the electrode assembly, thereby facilitating improved firmness of the connection between the adhesive and the electrode assembly.

[0038] In some embodiments, the third adhesive layer is bonded to the second side surface, thereby increasing the bonding area between the adhesive and the electrode assembly, thereby facilitating improved firmness of the connection between the adhesive and the electrode assembly.

[0039] In some embodiments, the first side further includes a fourth region and a fifth region, and along a third direction, the first region is located between the fourth and fifth regions. The second side further includes a fourth adhesive layer and a fifth adhesive layer, wherein the fourth adhesive layer includes a fourth adhesive region bonded to the fourth region; the fifth adhesive layer includes a fifth adhesive region bonded to the fifth region; and along the third direction, the first non-adhesive region is located between the fourth and fifth adhesive regions, with the third direction being perpendicular to both the first and second directions. This helps further reduce the risk of the electrode assembly moving when the electrochemical device is impacted and the risk of damage to the outer electrode sheet of the electrode assembly.

[0040] In some embodiments, the fourth bonding area includes a plurality of fourth sub-bonding areas spaced apart along the first direction, which is beneficial for further reducing the risk of the electrode assembly moving and the risk of damage to the outer ring electrode piece of the electrode assembly.

[0041] In some embodiments, the fifth bonding area includes a plurality of fifth sub-bonding areas spaced apart along the first direction, which is beneficial for further reducing the risk of the electrode assembly moving and the risk of damage to the outer ring electrode piece of the electrode assembly.

[0042] In some embodiments, the electrode assembly further includes a fifth side surface and a sixth side surface disposed opposite to each other along the third direction, and the fourth adhesive layer is further bonded to the fifth side surface, thereby further reducing the risk of movement of the electrode assembly and the risk of damage to the outer ring electrode sheet of the electrode assembly.

[0043] In some embodiments, the fourth adhesive layer is further bonded to the second side surface, thereby increasing the bonding area between the adhesive and the electrode assembly, thereby facilitating improved firmness of the connection between the adhesive and the electrode assembly.

[0044] In some embodiments, the fifth adhesive layer is further bonded to the sixth side surface, which is beneficial for further reducing the risk of the electrode assembly moving and the risk of damage to the outer ring electrode piece of the electrode assembly.

[0045] In some embodiments, the fifth adhesive layer is further bonded to the second side surface, thereby increasing the bonding area between the adhesive and the electrode assembly, thereby facilitating improved firmness of the connection between the adhesive and the electrode assembly.

[0046] In a second aspect of the present application, an electrical device is provided, comprising the electrochemical device of any one of the above embodiments. The risk of the electrochemical device vibrating during a drop test and the risk of damage to the electrode assembly are reduced, thereby improving the reliability of the electrical device. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] FIG1 is a schematic structural diagram of an electrochemical device provided in one embodiment of the present application.

[0048] FIG2 is an exploded schematic diagram of the electrochemical device in FIG1 .

[0049] FIG3 is a cross-sectional view of an electrochemical device provided in one embodiment of the present application.

[0050] FIG4 is a cross-sectional view of an adhesive member and an electrode assembly provided in one embodiment of the present application.

[0051] FIG5 is a cross-sectional view of an adhesive and an electrode assembly provided in another embodiment of the present application.

[0052] FIG6 is a side view of an adhesive member provided in an embodiment of the present application.

[0053] FIG7 is a side view of an adhesive member provided in another embodiment of the present application.

[0054] FIG8 is a side view of an adhesive member provided in another embodiment of the present application.

[0055] FIG9 is a side view of an adhesive member provided in yet another embodiment of the present application.

[0056] FIG10 is a side view of an adhesive member provided in yet another embodiment of the present application.

[0057] FIG11 is a top view of an adhesive and an electrode assembly provided in one embodiment of the present application.

[0058] FIG12 is a top view of an adhesive and an electrode assembly provided in another embodiment of the present application.

[0059] FIG13 is a schematic diagram of an electrical device provided in an embodiment of the present application.

[0060] DESCRIPTION OF KEY EMBODIMENTS Electrochemical device 100 Housing 10 First sidewall 11 Second sidewall 12 Third sidewall 13 Fourth sidewall 14 Fifth sidewall 15 Sixth sidewall 16 Electrode assembly 20 First side 21 First region 211 Second region 212 Third region 213 Second side 22 Third side 23 Fourth side 24 Fifth side 25 Sixth side 26 Adhesive 30 First side 31 First adhesive layer 311 First adhesive area 3111 Second non-adhesive area 312 Third non-adhesive area 313 Second side 32 First non-adhesive area 321 Second adhesive layer 322 Second adhesive area 3221 Third adhesive layer 323 Third adhesive area 3231 First non-adhesive layer 33 Second non-adhesive layer 34 Third non-adhesive layer 35First overlapping region 36 Second overlapping region 37 Base material layer 301 First base material portion 3011 Second base material portion 3012 Tab 50 Device body 200 Electrical device 1000 First direction X Second direction Y Third direction Z DETAILED DESCRIPTION

[0061] The technical solutions in the embodiments of the present application will be described below. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0062] It should be noted that, in this application, the center of a region refers to the center of gravity of the planar shape of the region when the region is a continuous entity. It is understood that the center of gravity of a planar shape can be determined by the hanging method: suspend the planar shape with a thin wire, draw a straight line vertically from the starting point of the thin wire, suspend the planar shape again with a different endpoint from the first, and draw another straight line using the same method. The intersection of the two straight lines is the center of gravity of the planar shape. When the region is composed of multiple discrete regions, the center of the region is the center of the minimum circumscribed circle containing the multiple discrete regions. It is understood that the minimum circumscribed circle is the circle with the smallest radius that contains the multiple discrete regions.

[0063] It will be understood that when a component is referred to as being "connected to" another component, it may be directly connected to the other component or there may be an intervening component. When a component is referred to as being "disposed on" another component, it may be directly disposed on the other component or there may be an intervening component. The terms "top," "bottom," and similar expressions used herein are for illustrative purposes only.

[0064] The terms "first", "second", etc. are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implying the quantity, specific order or primary and secondary relationship of the technical features indicated.

[0065] The term "perpendicular" is used to describe an ideal relationship between two components. In actual production or use, two components can be approximately perpendicular to each other. The two components described as "perpendicular" do not necessarily need to be absolutely straight lines or planes; they can be roughly straight lines or planes. From a macroscopic perspective, a component is considered "straight" or "planar" if its overall extension is a straight line or plane.

[0066] It should be understood that the sizes and thicknesses of the components shown in the drawings are for better understanding and more convenient description, and the present application is not limited to the sizes and thicknesses shown in the drawings.

[0067] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0068] The following will describe some embodiments of the present application in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0069] Referring to Figures 1 and 2 , an embodiment of the present application provides an electrochemical device 100 , which includes a housing 10 , an electrode assembly 20 , and an adhesive 30 . The electrode assembly 20 is disposed within the housing 10 . The adhesive 30 is disposed within the housing 10 and positioned between the housing 10 and the electrode assembly 20 . The adhesive 30 bonds the housing 10 and the electrode assembly 20 .

[0070] In some embodiments, referring to FIG. 1 and FIG. 2 , the housing 10 includes a first side wall 11 and a second side wall 12 that are opposite to each other, and the electrode assembly 20 is located between the first side wall 11 and the second side wall 12 .

[0071] In some embodiments, referring to Figures 1 and 2 , the housing 10 further includes a third sidewall 13, a fourth sidewall 14, a fifth sidewall 15, and a sixth sidewall 16. The third sidewall 13 and the fourth sidewall 14 are disposed opposite each other along a first direction X, the first sidewall 11 and the second sidewall 12 are disposed opposite each other along a second direction Y, and the fifth sidewall 15 and the sixth sidewall 16 are disposed opposite each other along a third direction Z. The first direction X is perpendicular to both the second direction Y and the third direction Z. The first sidewall 11, the second sidewall 12, the third sidewall 13, the fourth sidewall 14, the fifth sidewall 15, and the sixth sidewall 16 enclose a space for accommodating the electrode assembly 20.

[0072] In some embodiments, the housing 10 is an aluminum-plastic film, but the housing 10 is not limited to the aluminum-plastic film.

[0073] In some embodiments, the electrode assembly 20 includes a positive electrode sheet, a negative electrode sheet and a separator. The positive electrode sheet, the negative electrode sheet and the separator can be stacked to form a laminated structure, or the positive electrode sheet, the negative electrode sheet and the separator can be stacked and wound to form a wound structure.

[0074] In some embodiments, the positive electrode sheet includes a positive electrode current collector and a positive electrode active material layer disposed on the positive electrode current collector; the negative electrode sheet includes a negative electrode current collector and a negative electrode active material layer disposed on the negative electrode current collector.

[0075] In some embodiments, a portion of the positive electrode collector is provided with a positive electrode active material layer, and a portion of the positive electrode collector is not provided with a positive electrode active material layer; a portion of the negative electrode collector is provided with a negative electrode active material layer, and a portion of the negative electrode collector is not provided with a negative electrode active material layer.

[0076] Among them, the positive electrode current collector and the negative electrode current collector can be a metal layer. As an illustrative example, the positive electrode current collector can be a metal layer including at least one of aluminum, nickel, tantalum, and titanium, such as aluminum foil. The positive electrode active material layer includes a positive electrode active material, and the positive electrode active material can include at least one of lithium cobalt oxide, lithium nickel cobalt manganese oxide, lithium nickel cobalt aluminum oxide, lithium iron phosphate, lithium manganese iron phosphate, or lithium manganese oxide. The negative electrode current collector can be a metal layer including at least one of copper, nickel, tantalum, and titanium, such as copper foil. The negative electrode active material layer includes a negative electrode active material, and the negative electrode active material can include at least one of graphite, hard carbon, soft carbon, silicon, silicon-oxygen material, and silicon-carbon material.

[0077] In some embodiments, the outermost ring of the electrode assembly 20 has a positive electrode current collector layer without a positive electrode active material layer, and the positive electrode current collector is aluminum foil.

[0078] In some embodiments, referring to FIG. 3 , the electrode assembly 20 includes a first side surface 21 adjacent to the first side wall 11 , the first side surface 21 includes a first region 211 , a second region 212 , and a third region 213 , and along the first direction X, the first region 211 is located between the second region 212 and the third region 213 .

[0079] In some embodiments, referring to FIG. 3 , the electrode assembly 20 further includes a second side surface 22, a third side surface 23, and a fourth side surface 24. The first side surface 21 and the second side surface 22 are disposed opposite each other along the second direction Y. The first side surface 21 is adjacent to the first sidewall 11 relative to the second side surface 22. The first side surface 21 and the first sidewall 11 are disposed opposite each other, while the second side surface 22 faces away from the first sidewall 11. The third side surface 23 and the fourth side surface 24 are disposed opposite each other along the first direction X. When the electrode assembly 20 is in a wound structure, the third side surface 23 and the fourth side surface 24 are arcuate side surfaces.

[0080] In some embodiments, referring to FIG. 2 , the electrode assembly 20 further includes a fifth side surface 25 and a sixth side surface 26 , and the fifth side surface 25 and the sixth side surface 26 are disposed opposite to each other along the third direction Z.

[0081] In some embodiments, referring to Figures 1 and 2 , the electrochemical device 100 further includes a tab 50 , which is connected to the electrode assembly 20 . The tab 50 extends out of the housing 10 along the third direction Z, from the fifth side surface 25 or the sixth side surface 26 of the electrode assembly 20 , to direct the polarity of the electrode assembly 20 . When the tab 50 is connected to the positive electrode tab of the electrode assembly 20 , it is a positive electrode tab 50 ; when the tab 50 is connected to the negative electrode tab of the electrode assembly 20 , it is a negative electrode tab 50 . The tab 50 can be made of copper or aluminum, without specific limitation herein.

[0082] In some embodiments, referring to FIG. 3 , the adhesive member 30 includes a first side 31 and a second side 32 disposed opposite each other. The first side 31 is adjacent to the housing 10 relative to the second side 32, while the second side 32 faces away from the housing 10. The first side 31 includes a first adhesive layer 311, which includes a first adhesive region 3111 bonded to the first sidewall 11. The second side 32 includes a second adhesive layer 322 and a third adhesive layer 323. The second adhesive layer 322 includes a second adhesive region 3221 bonded to the second region 212, and the third adhesive layer 323 includes a third adhesive region 3231 bonded to the third region 213. The surface of the second side 32 includes a first non-adhesive region 321 not bonded to the first region 211. The first non-adhesive region 321 is located between the second adhesive region 3221 and the third adhesive region 3231. Along the second direction Y, the projection of the first adhesive region 3111 overlaps with the first non-adhesive region 321. The second direction Y is the direction in which the first side wall 11 and the first side surface 21 are opposite to each other.

[0083] In the present application, an adhesive member 30 is provided between the first side surface 21 and the first side wall 11, and the shell 10 and the electrode assembly 20 are fixed in relative position by the first adhesive layer 311, the second adhesive layer 322 and the third adhesive layer 323 of the adhesive member 30, which is beneficial to reducing the risk of the electrode assembly 20 moving when the electrochemical device 100 is impacted, and a first non-adhesive area 321 that is not bonded to the first side surface 21 is provided on the adhesive member 30, which is beneficial to reducing the impact force transmitted to the electrode assembly 20 by the adhesive member 30 when the electrochemical device 100 is impacted, thereby reducing the risk of damage to the outer ring electrode sheet of the electrode assembly 20.

[0084] In some embodiments, the first adhesive layer 311, the second adhesive layer 322 and the third adhesive layer 323 can be adhesive materials that are adhesive at room temperature without activation; the first adhesive layer 311, the second adhesive layer 322 and the third adhesive layer 323 can also be adhesive materials that are not adhesive at room temperature but are activated after a hot pressing process.

[0085] In some embodiments, the second bonding area 3221 includes multiple second sub-bonding areas spaced apart along the third direction Z. In some embodiments, the third bonding area 3231 includes multiple third sub-bonding areas spaced apart along the third direction Z. This helps further reduce the risk of movement of the electrode assembly 20 and the risk of damage to the outer ring electrode pieces of the electrode assembly 20.

[0086] In some embodiments, referring to FIG4 , the second adhesive layer 322 is bonded to both the second region 212 and the third side surface 23. This configuration allows the adhesive 30 to transfer the force of the housing 10 to the third side surface 23 of the electrode assembly 20. When the electrode assembly 20 is a wound structure, the electrode sheets located on the curved third side surface 23 are more likely to disperse the force transferred by the adhesive 30, thereby reducing the risk of damage to the outer electrode sheets of the electrode assembly 20. When the electrode assembly 20 is a laminated structure, the adhesive 30 is bonded to the edges of the separator, positive electrode sheet, or negative electrode sheet on the third side surface 23, which is less likely to damage the electrode sheets of the electrode assembly 20 and helps to inhibit relative sliding of the separator relative to the positive electrode sheet or negative electrode sheet.

[0087] In some embodiments, referring to FIG. 5 , the second adhesive layer 322 is bonded to the second side surface 22 . This configuration increases the bonding area between the adhesive 30 and the electrode assembly 20 , thereby facilitating improved connection firmness of the adhesive 30 to the electrode assembly 20 .

[0088] In some embodiments, referring to FIG4 , the third adhesive layer 323 is bonded to both the third region 213 and the fourth side 24. This configuration allows the adhesive 30 to transfer the force of the housing 10 to the fourth side 24 of the electrode assembly 20. When the electrode assembly 20 is a wound structure, the electrode sheets located on the curved fourth side 24 are more likely to disperse the force transferred by the adhesive 30, thereby reducing the risk of damage to the outer electrode sheets of the electrode assembly 20. When the electrode assembly 20 is a laminated structure, the adhesive 30 is bonded to the edges of the separator, positive electrode sheet, or negative electrode sheet on the fourth side 24, which is less likely to damage the electrode sheets of the electrode assembly 20 and helps to inhibit relative sliding of the separator relative to the positive electrode sheet or negative electrode sheet.

[0089] In some embodiments, referring to FIG. 5 , the third adhesive layer 323 is bonded to the second side surface 22 . This configuration increases the bonding area between the adhesive 30 and the electrode assembly 20 , thereby facilitating improved connection firmness of the adhesive 30 to the electrode assembly 20 .

[0090] In an embodiment where the second adhesive layer 322 is bonded to both the second region 212 and the third side 23, and the third adhesive layer 323 is bonded to both the third region 213 and the fourth side 24, the adhesive 30 transfers the force of the shell 10 to both sides of the electrode assembly 20 in the first direction X, which is beneficial to improving the uniformity of the force applied to the electrode assembly 20.

[0091] In some embodiments, the first side 21 further includes a fourth region and a fifth region. The first region 211 is located between the fourth and fifth regions along the third direction Z. The second side 32 further includes a fourth adhesive layer and a fifth adhesive layer. The fourth adhesive layer includes a fourth adhesive region bonded to the fourth region; the fifth adhesive layer includes a fifth adhesive region bonded to the fifth region. Along the third direction Z, the first non-adhesive region 321 is located between the fourth and fifth adhesive regions. The third direction Z is perpendicular to both the first and second directions X and Y. This helps further reduce the risk of the electrode assembly 20 moving when the electrochemical device is impacted and the risk of damage to the outer electrode plates of the electrode assembly 20.

[0092] In some embodiments, the fourth bonding area includes a plurality of fourth sub-bonding areas spaced apart along the first direction X. In some embodiments, the fifth bonding area includes a plurality of fifth sub-bonding areas spaced apart along the first direction X. This helps further reduce the risk of movement of the electrode assembly 20 and the risk of damage to the outer electrode plates of the electrode assembly 20.

[0093] In some embodiments, the electrode assembly further includes a fifth side surface and a sixth side surface disposed opposite each other along the third direction, and the fourth adhesive layer is further bonded to the fifth side surface. In some embodiments, the fifth adhesive layer is further bonded to the sixth side surface. This helps further reduce the risk of movement of the electrode assembly 20 and the risk of damage to the outer electrode plates of the electrode assembly 20.

[0094] In some embodiments, the fourth adhesive layer is further bonded to the second side surface 22. In some embodiments, the fifth adhesive layer is further bonded to the second side surface 22. This configuration increases the bonding area between the adhesive member 30 and the electrode assembly 20, thereby improving the secure connection between the adhesive member 30 and the electrode assembly 20.

[0095] In some embodiments, referring to Figures 3 and 6 , the first side 31 further includes a second non-bonding area 312 and a third non-bonding area 313 that are not bonded to the first sidewall 11. Along the first direction X, the first bonding area 3111 is located between the second non-bonding area 312 and the third non-bonding area 313. Along the second direction Y, the projection of the second non-bonding area 312 overlaps with the second bonding area 3221, and the projection of the third non-bonding area 313 overlaps with the third bonding area 3231. This arrangement reduces the pulling force of the adhesive 30 on the first side surface 21 when the electrochemical device 100 is impacted, thereby reducing the risk of damage to the outer electrode plates of the electrode assembly 20.

[0096] In some embodiments, referring to Figures 3 and 6, along the second direction Y, the first non-adhesive area 321 covers the projection of the first adhesive area 3111, the projection of the second non-adhesive area 312 covers the second adhesive area 3221, and the projection of the third non-adhesive area 313 covers the third adhesive area 3231.

[0097] In some embodiments, referring to Figures 3 and 6 , along the first direction X, the distance between the first bonding area 3111 and the second bonding area 3221 is greater than zero, and the distance between the first bonding area 3111 and the third bonding area 3231 is greater than zero. This configuration allows the adhesive 30 to have a portion that is neither bonded to the first sidewall 11 nor to the first side surface 21. When the electrochemical device 100 is impacted, the force transmitted from the housing 10 to the electrode assembly 20 is dissipated and absorbed through the local deformation of the adhesive 30. This suppresses relative positional movement between the electrode assembly 20 and the housing 10 while further reducing the force transmitted from the adhesive 30 to the first side surface 21, thereby reducing the risk of damage to the outer electrode sheet of the electrode assembly 20.

[0098] In other embodiments, referring to Figures 7 and 8 , along the second direction Y, the projection of the first bonding area 3111 covers the first non-bonding area 321, the projection of the first bonding area 3111 overlaps the second bonding area 3221, and the projection of the first bonding area 3111 overlaps the third bonding area 3231. This arrangement helps increase the bonding area between the adhesive 30 and the housing 10 and also allows the adhesive 30 to be partially bonded to both the first sidewall 11 and the first side surface 21, thereby enhancing the bond strength between the electrode assembly 20 and the housing 10, further reducing the risk of relative positional shifting between the electrode assembly 20 and the housing 10, and effectively reducing the force transmitted from the adhesive 30 to the first side surface 21. It is understood that in this embodiment, the second non-bonding area 312 and the third non-bonding area 313 may or may not be present.

[0099] In some embodiments, referring to Figures 3, 6, and 8, the adhesive member 30 further includes a substrate layer 301. A first adhesive layer 311 is disposed on the surface of the substrate layer 301 facing the housing 10, and a second adhesive layer 322 and a third adhesive layer 323 are disposed on the surface of the substrate layer 301 facing the electrode assembly 20. This arrangement allows the housing 10 and the electrode assembly 20 to be bonded without the need for multiple layers of adhesive tape, thereby reducing the overall thickness of the electrochemical device 100 and improving its energy density.

[0100] It is understandable that the first adhesive layer 311, the second adhesive layer 322 and the third adhesive layer 323 can be formed by coating an adhesive on a preset area of ​​the substrate layer 301; or the first adhesive layer 311, the second adhesive layer 322 and the third adhesive layer 323 can be formed by coating an adhesive on both sides of the substrate layer 301 and then removing the adhesive locally.

[0101] In some embodiments, the material of the substrate layer 301 may include any one of PET (polyethylene terephthalate), PVC (polyvinyl chloride) or PI (polyimide).

[0102] In some embodiments, referring to Figures 3, 6, and 8, a portion of the surface of the substrate layer 301 facing the electrode assembly 20 is exposed to form a first non-adhesive region 321. A portion of the surface of the substrate layer 301 facing the housing 10 is exposed to form a second non-adhesive region 312 and a third non-adhesive region 313. This arrangement eliminates the need for multiple layers of adhesive tape to achieve a portion of the adhesive member 30 not being bonded to the housing 10 and a portion of the adhesive member 30 not being bonded to the first side surface 21. This helps reduce the overall thickness of the electrochemical device 100 and improves its energy density.

[0103] It is understandable that a covering material can be applied to the preset surface of the substrate layer 301 in advance, and then an adhesive material can be applied to the substrate layer 301 to form the first non-adhesive area 321, the second non-adhesive area 312 and the third non-adhesive area 313 on the surface of the covering material that are not coated with the adhesive material. Alternatively, the first non-adhesive area 321, the second non-adhesive area 312 and the third non-adhesive area 313 can be formed by coating the entire surface of the substrate layer 301 with the adhesive material and then removing the adhesive material from the local surface, so that the surface of the substrate layer 301 from which the adhesive material is removed is exposed.

[0104] In some embodiments, referring to FIG. 9 , the adhesive member 30 further includes a first non-adhesive layer 33, a second non-adhesive layer 34, and a third non-adhesive layer 35. The first non-adhesive layer 33 is bonded to the surface of the second adhesive layer 322 and / or the third adhesive layer 323 to form a first non-adhesive region 321. The second non-adhesive layer 34 is bonded to the surface of the first adhesive layer 311 facing away from the second region 212 to form a second non-adhesive region 312. The third non-adhesive layer 35 is bonded to the surface of the first adhesive layer 311 facing away from the third region 213 to form a third non-adhesive region 313. In this way, after the first adhesive layer 311, the second adhesive layer 322 and the third adhesive layer 323 are directly coated on the base material layer 301, the first non-adhesive area 321, the second non-adhesive area 312 and the third non-adhesive area 313 are formed by bonding the first non-adhesive layer 33, the second non-adhesive layer 34 and the third non-adhesive layer 35. The area and position of the first non-adhesive area 321, the second non-adhesive area 312 and the third non-adhesive area 313 can be adjusted by adjusting the area and setting position of the first non-adhesive layer 33, the second non-adhesive layer 34 and the third non-adhesive layer 35, so that the formation method and adjustment method of the non-adhesive area have the advantages of simple operation, high efficiency and low cost.

[0105] It is understood that the first non-adhesive layer 33, the second non-adhesive layer 34, and the third non-adhesive layer 35 may be layers without adhesive on both sides. The first non-adhesive layer 33, the second non-adhesive layer 34, and the third non-adhesive layer 35 may also be layers with adhesive on one side and no adhesive on the other side. For example, the first non-adhesive layer 33 may have adhesive on the side facing the first adhesive layer 311, and no adhesive on the side facing away from the first adhesive layer 311.

[0106] In some embodiments, referring to FIG. 10 , the substrate layer 301 includes a first substrate portion 3011 and a second substrate portion 3012 . The first substrate portion 3011 and the second substrate portion 3012 are independent parts. The first substrate portion 3011 is provided with a second adhesive layer 322 and a portion of the first adhesive layer 311 . The second substrate portion 3012 is provided with a third adhesive layer 323 and a portion of the first adhesive layer 311 . The first substrate portion 3011 and the second substrate portion 3012 are arranged along a first direction. This helps reduce the risk of damage to the outer electrode plates of the electrode assembly 20 .

[0107] In some other embodiments, the first substrate portion 3011 and the second substrate portion 3012 are arranged along the third direction Z. This helps reduce the risk of damage to the outer ring electrode piece of the electrode assembly 20 .

[0108] It can be understood that the surface of the first substrate portion 3011 facing the first region 211 and the surface of the second substrate portion 3012 facing the first region 211 jointly form the first non-adhesive area 321 .

[0109] In some embodiments, referring to FIG11 , along the first direction X, the width of the electrode assembly 20 is W, along the third direction Z, the length of the electrode assembly 20 is L, and along the first direction X, the distance between the center of the first bonding area 3111 and the center of the first side surface 21 is D1, satisfying: D1≤0.1W, which is beneficial for the adhesive 30 to suppress the movement of the battery cell and reduce the risk of damage to the outer ring electrode of the electrode assembly 20.

[0110] In some embodiments, referring to FIG. 11 , along the third direction Z, the distance between the center of the first bonding area 3111 and the center of the first side surface 21 is D2, satisfying: D2≤0.1L. This is beneficial for the adhesive 30 to suppress the movement of the battery cell and reduce the risk of damage to the outer ring electrode of the electrode assembly 20.

[0111] In order to verify the effects of the adhesive and non-adhesive areas of the adhesive member 30 on the electrochemical device 100, the following tests were conducted:

[0112] A lithium-ion soft-pack battery with a rectangular maximum projection surface is selected, wherein the wound electrode assembly 20 inside the lithium-ion soft-pack battery has a length L of 87 mm, a width W of 64 mm, and a thickness of 4.8 mm.

[0113] In Examples 1 to 20, the adhesive member 30 includes a first adhesive layer 311, a second adhesive layer 322, a third adhesive layer 323, and a first adhesive region 3111, a second adhesive region 3221, and a third adhesive region 3231. The first adhesive region 3111 coincides with the center of the first side surface 21. Along the first direction X, the distance from the first adhesive region 3111 to one edge of the substrate layer 301 is W2, and the distance from the first adhesive region 3111 to the other edge of the substrate layer 301 is W3. The distance between the second adhesive region 3221 and the first adhesive region 3111 is H1, and the distance between the third adhesive region 3231 and the first adhesive region 3111 is H2. Along the third direction Z, the distance from the first adhesive region 3111 to one edge of the substrate layer 301 is L2, and the distance from the first adhesive region 3111 to the other edge of the substrate layer 301 is L3.

[0114] In Example 17, the second bonding area 3221 includes two second sub-bonding areas spaced apart along the third direction Z, and the interval between the two second sub-bonding areas is 4 mm; the third bonding area 3231 includes two third sub-bonding areas spaced apart along the third direction Z, and the interval between the two third sub-bonding areas is 4 mm.

[0115] In Example 18, referring to FIG. 12 , the bonding area between the adhesive member 30 and the electrode assembly 20 is in the shape of a U.S. character. The second side 32 includes a fourth bonding area and a fifth bonding area bonded to the first side surface 21. Along the third direction Z, the first non-bonding area 321 is located between the fourth and fifth bonding areas. The third direction Z is perpendicular to both the first and second directions X and Y. The widths of the fourth and fifth bonding areas are equal to the width w1 of the second bonding area 322 or the width w2 of the third bonding area 3231.

[0116] In Example 19 and Example 20, along the second direction Y, the projection of the first bonding area 3111 and the second bonding area 3221 have a first overlapping area 36, ​​and the width of the first overlapping area 36 along the first direction X is q1. The projection of the first bonding area 3111 and the third bonding area 3221 have a second overlapping area 37, and the width of the second overlapping area 37 along the first direction X is q2.

[0117] The dimensional parameters of the adhesive member 30 in the above embodiments are shown in Table 1 below.

[0118] In the comparative example, a double-sided tape with a length of 60.9 mm and a width of 38 mm is used to bond the first side wall 11 to the first side surface 21.

[0119] Each group took 20 batteries to conduct a drop pass rate comparison experiment. The batteries were set up to be tested in a six-sided and four-corner drop order, with a drop height of 1.8m. After the drop, the shell 10 was observed to see if it was broken or leaking, and the number of batteries with broken or leaking shells 10 was counted. If the shell 10 was not broken or leaking, the lithium-ion soft-pack battery was disassembled and the outer ring of the electrode assembly 20 was observed to see if there were any tears or damage to the pole pieces, and the number of batteries with torn or damaged outer ring pole pieces was counted. Among them, if the shell 10 was not broken or leaking, and the outer ring pole pieces were not torn or damaged, it was judged to have passed the test; otherwise, it was judged to have failed the test. Pass rate = number of passes / 20 × 100%.

[0120] Table 1: Test results of dimensional changes of each adhesive layer in adhesive component 30

[0121] In some embodiments, referring to FIG. 12 and Table 1, the width of the first bonding area 3111 along the first direction X is W1, satisfying the following conditions: 0.3W ≤ W1 ≤ 0.8W. As can be seen from Table 1, when the condition of 0.3W ≤ W1 ≤ 0.8W is met, the battery drop test pass rate is improved, which helps reduce the risk of the electrode assembly 20 moving and the risk of damage to the outer electrode piece of the electrode assembly 20.

[0122] In some embodiments, referring to FIG. 12 and Table 1, along the third direction Z, the length of the first bonding area 3111 is L1, satisfying the following conditions: 0.4L ≤ L1 ≤ 0.8L. As can be seen from Table 1, when the condition of 0.4L ≤ L1 ≤ 0.8L is met, the battery drop test pass rate is improved, which helps reduce the risk of the electrode assembly 20 moving and the risk of damage to the outer electrode sheet of the electrode assembly 20.

[0123] In some embodiments, referring to Figure 12 and Table 1, along the third direction Z, the length of the first bonding area 3111 is L1, the length of the second bonding area 3221 is l1, and the length of the third bonding area 3231 is l2, satisfying the following conditions: l1 ≥ 0.4L1 and / or l2 ≥ 0.4L1. Meeting these conditions improves the pass rate of the battery drop test, helping to reduce the risk of movement of the electrode assembly 20 and the risk of damage to the outer electrode sheet of the electrode assembly 20. In Examples 1 to 16 and Examples 19 and 20, l1 = l2 = L1. In Example 17, l1 = l2 = 56 mm. The length of l1 does not include the 4 mm gap between the two second sub-bonding areas, and the length of l2 does not include the 4 mm gap between the two third sub-bonding areas. Along the third direction Z, the length of each second sub-bonding area and the length of each third sub-bonding area are both 28 mm. In Example 18, l1 = l2 = L1 + L2 + L3.

[0124] In some embodiments, referring to FIG. 12 and Table 1, 0≤L2≤0.4L1 and / or 0≤L3≤0.4L1 are satisfied. When the above conditions are met, it can be seen from Table 1 that the pass rate of the battery drop test is better, which is beneficial to reducing the risk of the electrode assembly 20 moving when the electrochemical device is impacted and the risk of damage to the outer ring electrode of the electrode assembly 20.

[0125] In some embodiments, referring to FIG. 12 and Table 1, along the first direction X, the width of the second bonding area 3221 is w1, and the width of the third bonding area 3231 is w2, satisfying the following conditions: 0.05W ≤ w1 ≤ 0.45W and / or 0.05W ≤ w2 ≤ 0.45W. This configuration improves the pass rate of the battery drop test, helps reduce the risk of movement of the electrode assembly 20 and the risk of damage to the outer electrode sheet of the electrode assembly 20. In Examples 10 to 15, the second bonding layer 322 is bonded to the second region 212, the third side 23, and / or the second side 22, and the third bonding layer 323 is bonded to the third region 213, the fourth side 24, and / or the second side 22.

[0126] In some embodiments, referring to FIG3 , FIG12 and Table 1 , the following conditions are satisfied: W2 ≤ 0.45W and / or W3 ≤ 0.45W. When this condition is met, it can be seen from Table 1 that the pass rate of the battery drop test is better, which is beneficial to reducing the risk of movement of the electrode assembly 20 and the risk of damage to the outer ring electrode of the electrode assembly 20 .

[0127] In some embodiments, referring to FIG. 12 and Table 1, the following conditions are satisfied: H1≤0.25W and / or H2≤0.25W. When this condition is met, it can be seen from Table 1 that the pass rate of the battery drop test is better, which is beneficial to reducing the risk of movement of the electrode assembly 20 and the risk of damage to the outer ring electrode of the electrode assembly 20.

[0128] In some embodiments, referring to Figures 8 and 12 and Table 1, the following conditions are met: q1 ≤ 0.32 W and / or q2 ≤ 0.32 W. When this condition is met, as can be seen from Table 1, the battery drop test pass rate is improved, which helps reduce the risk of the electrode assembly 20 moving and the risk of damage to the outer ring electrode piece of the electrode assembly 20.

[0129] Please refer to FIG. 13 . An embodiment of the present application further provides an electrical device 1000 . The electrical device 1000 includes the electrochemical device 100 described above.

[0130] In some embodiments, referring to FIG. 13 , the power-consuming device 1000 further includes a device body 200 , and the electrochemical device 100 is installed in the device body 200 to supply power to the device body 200 .

[0131] In some embodiments, the power-consuming device 1000 may be a Bluetooth headset, a Bluetooth speaker, a mobile phone, a laptop computer, a tablet computer, an e-book player, an electric toy, a game console, a video recorder, a portable recorder, a radio, a smart watch, a lighting lamp, or a calculator, etc., which are not listed here one by one.

[0132] Since the electrical equipment 1000 adopts the technical solution of any embodiment of the electrochemical device 100, it at least has the beneficial effects brought by the technical solution of any embodiment of the electrochemical device 100, which will not be described in detail here.

[0133] In addition, those skilled in the art should recognize that the above embodiments are only used to illustrate the present application and are not used to limit the present application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. An electrochemical device, It is characterized in that include: a housing, the housing comprising a first side wall; an electrode assembly, the electrode assembly being disposed in the housing, the electrode assembly comprising a first side surface adjacent to the first side wall, the first side surface comprising a first region, a second region and a third region, and along a first direction, the first region is located between the second region and the third region; an adhesive member, the adhesive member being located between the shell and the electrode assembly, the adhesive member comprising a first side and a second side opposite to each other, the first side being adjacent to the shell, the second side being away from the shell, the first side comprising a first adhesive layer, the first adhesive layer comprising a first adhesive region bonded to the first sidewall; the second side comprising a second adhesive layer and a third adhesive layer, the second adhesive layer comprising a second adhesive region bonded to the second region, the third adhesive layer comprising a third adhesive region bonded to the third region, the surface of the second side comprising a first non-adhesive region not bonded to the first region, the first non-adhesive region being located between the second adhesive region and the third adhesive region; Along a second direction, a projection of the first bonding area overlaps with the first non-bonding area, and the second direction is a direction in which the first side wall is opposite to the first side surface.

2. The electrochemical device according to claim 1, It is characterized in that The adhesive member further includes a substrate layer. The first adhesive layer is disposed on a surface of the substrate layer facing the housing. The second adhesive layer and the third adhesive layer are disposed on a surface of the substrate layer facing the electrode assembly.

3. The electrochemical device according to claim 2, It is characterized in that The surface of the first side also includes a second non-bonding area and a third non-bonding area that are not bonded to the first side wall. Along the first direction, the first bonding area is located between the second non-bonding area and the third non-bonding area; along the second direction, the projection of the second non-bonding area overlaps with the second bonding area, and the projection of the third non-bonding area overlaps with the third bonding area.

4. The electrochemical device according to claim 3, It is characterized in that Along the second direction, the first non-adhesive area covers the projection of the first adhesive area, the projection of the second non-adhesive area covers the second adhesive area, and the projection of the third non-adhesive area covers the third adhesive area; Along the first direction, a distance between the first bonding area and the second bonding area is greater than 0, and a distance between the first bonding area and the third bonding area is greater than 0.

5. The electrochemical device according to claim 2, It is characterized in that Along the second direction, the projection of the first bonding area covers the first non-bonding area, the projection of the first bonding area overlaps with the second bonding area, and the projection of the first bonding area overlaps with the third bonding area.

6. The electrochemical device according to claim 3, It is characterized in that The adhesive meets any of the following conditions: (1) A portion of the surface of the substrate layer is exposed toward the electrode assembly to form the first non-adhesive area; a portion of the surface of the substrate layer is exposed toward the shell to form the second non-adhesive area and the third non-adhesive area; (2) The adhesive member further comprises a first non-adhesive layer, a second non-adhesive layer and a third non-adhesive layer, wherein the first non-adhesive layer is bonded to the surface of the second adhesive layer and / or the third adhesive layer to form the first non-adhesive area; The second non-adhesive layer is bonded to a surface of the first adhesive layer that is away from the second region to form the second non-adhesive region; The third non-adhesive layer is bonded to a surface of the first adhesive layer that is away from the third region to form the third non-adhesive area.

7. The electrochemical device according to claim 2, It is characterized in that The substrate layer includes a first substrate portion and a second substrate portion, the second adhesive layer and a portion of the first adhesive layer are provided on the first substrate portion, and the third adhesive layer and a portion of the first adhesive layer are provided on the second substrate portion; the substrate layer satisfies any one of the following conditions: (1) The first substrate portion and the second substrate portion are arranged along the first direction; (2) The first substrate portion and the second substrate portion are arranged along a third direction, and the third direction is perpendicular to the first direction and the second direction in pairs.

8. The electrochemical device according to claim 1, It is characterized in that The width of the electrode assembly along the first direction is W, and the length of the electrode assembly along the third direction is L, and the third direction is perpendicular to the first direction and the second direction in pairs; the electrochemical device satisfies at least one of the following conditions: (1) Along the first direction, the distance between the center of the first bonding area and the center of the first side surface is D 1 , satisfied: D 1 ≤0.1W; (2) Along the third direction, the distance between the center of the first bonding area and the center of the first side surface is D 2 , satisfied: D 2 ≤0.1L; (3) Along the first direction, the width of the first bonding area is W 1 , satisfying: 0.3W≤W 1 ≤0.8W; (4) Along the third direction, the length of the first bonding area is L 1 , satisfying: 0.4L≤L 1 ≤0.8L; (5) Along the first direction, the width of the second bonding area is w 1 , meet: 0.05W≤w 1 ≤0.45W; (6) Along the first direction, the width of the third bonding area is w 2 , meet: 0.05W≤w 2 ≤0.45W; (7) Along the third direction, the length of the first bonding area is L 1 , the length of the second bonding area is l 1 , satisfying: l 1 ≥ 0.4 L 1 ; (8) Along the third direction, the length of the first bonding area is L 1 , the length of the third bonding area is l 2 , satisfying: l 2 ≥ 0.4 L 1 ; (9) the second bonding area includes a plurality of second sub-bonding areas spaced apart along the third direction; (10) The third bonding area includes a plurality of third sub-bonding areas spaced apart from each other along the third direction.

9. The electrochemical device according to claim 8, It is characterized in that The adhesive member further comprises a substrate layer, the first adhesive layer is disposed on a surface of the substrate layer facing the housing, and the second adhesive layer and the third adhesive layer are disposed on a surface of the substrate layer facing the electrode assembly; Along the first direction, the distance from the first bonding area to the edge of one side of the substrate layer is W 2 , the distance from the first bonding area to the other side edge of the substrate layer is W 3 , the distance between the second bonding area and the first bonding area is H 1 , the distance between the third bonding area and the first bonding area is H 2 , along the third direction, the distance from the first bonding area to the edge of one side of the substrate layer is L 2 , the distance from the first bonding area to the other side edge of the substrate layer is L 3 ; The adhesive member satisfies at least one of the following conditions: (1)In 2 ≤0.45W; (2)In 3 ≤0.45W; <h2 style=";text-align:left;direction:ltr">(3)L<h2 style=";text-align:left;direction:ltr"> 2 <h2 style=";text-align:left;direction:ltr"> ≤0.4L<h2 style=";text-align:left;direction:ltr"> 1 <h2 style=";text-align:left;direction:ltr"> : <h2 style=";text-align:left;direction:ltr">(4)L<h2 style=";text-align:left;direction:ltr"> 3 <h2 style=";text-align:left;direction:ltr"> ≤0.4L<h2 style=";text-align:left;direction:ltr"> 1 <h2 style=";text-align:left;direction:ltr"> ; (5)H 1 ≤0.25W; (6)H 2 ≤0.25W; (7) Along the second direction, the projection of the first bonding area and the second bonding area have a first overlapping area, and the width of the first overlapping area along the first direction is q 1 ,q 1 ≤0.32W; (8) Along the second direction, the projection of the first bonding area and the third bonding area have a second overlapping area, and the width of the second overlapping area along the first direction is q 2 ,q 2 ≤0.32W.

10. The electrochemical device according to claim 1, It is characterized in that The electrode assembly further includes a second side surface, a third side surface, and a fourth side surface, the second side surface and the first side surface are arranged opposite to each other along the second direction, the third side surface and the fourth side surface are arranged opposite to each other along the first direction, and at least one of the following conditions is satisfied: (1) The second adhesive layer is bonded to both the second region and the third side surface; (2) The third adhesive layer is bonded to both the third region and the fourth side surface.

11. The electrochemical device according to claim 10, It is characterized in that At least one of the following conditions is met: (1) The second adhesive layer is bonded to the second side surface; (2) The third adhesive layer is bonded to the second side surface.

12. An electrical device, It is characterized in that An electrochemical device comprising any one of claims 1 to 11.

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