Adsorption cooling device, cooling system, and adsorption cooling method

Abstract

Provided is a novel adsorption cooling device using the adsorption of a gas by means of an adsorbent and the release of the adsorbed gas. The adsorption cooling device comprises: an adsorbent that adsorbs an adsorption gas while releasing heat and releases the adsorption gas while absorbing heat; an adsorption gas supply part that supplies the adsorption gas to the adsorbent; a liquefied gas supply part that supplies a liquefied gas; and a heat exchange part for heat exchange between the adsorbent and the liquefied gas. The adsorbent adsorbs the adsorption gas while cooled by the liquefied gas, and cools a to-be-cooled object by absorbing the heat when releasing the adsorption gas.

Description

Adsorption cooling device, cooling system, and adsorption cooling method

[0001] The present disclosure relates to sorption cooling devices, cooling systems and sorption cooling methods.

[0002] Techniques for adsorbing gases using adsorbents such as activated carbon are known, and one such technique is described in Patent Document 1 below. Patent Document 1 discloses that an adsorbent layer is disposed on the inner wall of an insulated container containing liquefied gas, and the boil-off gas generated from the liquefied gas is adsorbed and recovered by the adsorbent layer. The lower the temperature, the better the adsorption capacity of the adsorbent. When the temperature is raised while the gas is adsorbed (i.e., the adsorbent absorbs heat), the adsorbed gas is released from the adsorbent. By disposing the adsorbent layer in an insulated container for low-temperature liquefied gas, the adsorbent layer is cooled without the need for a separate cooling means, and adsorbs the boil-off gas generated from the liquefied gas. Gas adsorption suppresses a pressure increase in the insulated container due to the boil-off gas.

[0003] In Patent Document 1, after the liquefied gas in the insulated container is transported out, the insulated container is released from the insulation, and the temperature of the adsorbent layer is increased by external heat input or a heating means such as a heater, thereby desorbing the boil-off gas adsorbed in the adsorbent layer, and the desorbed boil-off gas is pressurized and transported out. This reduces the loss associated with gas transportation by the amount of the desorbed boil-off gas.

[0004] Japanese Patent Application Laid-Open No. 2006-242350

[0005] As described above, Patent Document 1 proposes suppressing pressure increases and reducing losses inside a container due to boil-off gas that accompanies the transportation and storage of liquefied gas by utilizing gas adsorption and gas release by an adsorbent.

[0006] In response to this, the inventors of the present application conducted extensive research and came up with the idea that adsorbents generate heat when they adsorb gas, but have the property of decreasing in temperature (absorbing heat) when they release gas, and that this heat-absorbing property can be utilized to perform cooling.

[0007] An object of the present disclosure is to provide a new adsorption cooling device, cooling system, and adsorption cooling method that utilizes the adsorption of gas by an adsorbent and the release of the adsorbed gas.

[0008] In order to achieve the above-mentioned object, the adsorption cooling device of the present disclosure comprises an adsorbent that adsorbs an adsorption gas with heat generation and releases the adsorbed adsorption gas with endothermic heat generation, an adsorption gas supply unit that supplies the adsorption gas to the adsorbent, a liquefied gas supply unit that supplies liquefied gas, and a heat exchange unit that exchanges heat between the adsorbent and the liquefied gas, and the adsorbent is configured to adsorb the adsorption gas in a state cooled by the liquefied gas and cool an object to be cooled by absorbing heat when releasing the adsorption gas.

[0009] The cooling system of the present disclosure also comprises a first flow path through which a first fluid circulates, a second flow path through which a second fluid circulates that cools the first fluid, a heat exchanger connected to the first flow path and the second flow path, and an adsorption cooling device, wherein the adsorption cooling device comprises an adsorbent that is thermally coupled to the first flow path and adsorbs an adsorption gas with heat generation and releases the adsorbed adsorption gas with endothermic heat generation, an adsorption gas supply unit that supplies the adsorption gas to the adsorbent, and a heat exchange unit connected to the second flow path and exchanges heat between the adsorbent and the second fluid, wherein the adsorbent adsorbs the adsorption gas while being cooled by the second fluid and cools the first fluid by absorbing heat when releasing the adsorption gas.

[0010] The adsorption cooling method disclosed herein is an adsorption cooling method for cooling an object to be cooled by absorbing heat when an adsorption gas adsorbed into an adsorbent is released, and includes the steps of: adsorbing the adsorption gas into the adsorbent in a state in which the adsorbent is cooled by liquefied gas; and releasing the adsorption gas by causing the adsorbent in a state in which the adsorption gas has been adsorbed to absorb heat; and cooling the object to be cooled by the adsorbent absorbing heat when the adsorption gas is released.

[0011] According to the present disclosure, it is possible to provide a new adsorption cooling device, cooling system, and adsorption cooling method that utilizes the adsorption of gas by an adsorbent and the release of the adsorbed gas.

[0012] FIG. 1 is a schematic configuration diagram showing an adsorption cooling apparatus of a first embodiment. FIG. 2 is an explanatory diagram for explaining an adsorption cooling method. FIG. 3 is a schematic configuration diagram showing an adsorption cooling apparatus of a second embodiment. FIG. 4 is a schematic configuration diagram showing an adsorption cooling apparatus of a third embodiment. FIG. 5 is a schematic configuration diagram showing an adsorption cooling apparatus of a fourth embodiment. FIG. 6 is a schematic configuration diagram showing an adsorption cooling apparatus of a fifth embodiment. FIG. 7 is a schematic configuration diagram showing a cooling system of a sixth embodiment. FIG. 8 is a schematic configuration diagram showing an adsorption cooling apparatus of the sixth embodiment. FIG. 9 is a schematic configuration diagram showing a cooling system of a seventh embodiment. FIG. 10 is a schematic configuration diagram showing an adsorption cooling apparatus of the seventh embodiment.

[0013] Preferred embodiments of the present disclosure will be described in detail below with reference to the drawings. Note that the present disclosure is not limited to these embodiments, and when there are multiple embodiments, the present disclosure also includes configurations that combine the embodiments. Furthermore, the components in the embodiments include those that can be easily imagined by a person skilled in the art, those that are substantially identical, and those that are within the so-called equivalent range.

[0014] First Embodiment FIG. 1 is a schematic diagram showing the configuration of an adsorption cooling device according to a first embodiment.

[0015] The first embodiment shows an example in which the adsorption cooling device 10 is configured as a liquefied gas tank that stores low-temperature liquefied gas 90. The adsorption cooling device 10 suppresses the generation of boil-off gas 91 from the liquefied gas 90 stored in the liquefied gas tank by cooling a partition wall (insulating layer) that stores the liquefied gas 90.

[0016] The adsorption cooling device 10 includes a liquefied gas supply unit 20 that supplies liquefied gas 90, an adsorbent 30, an adsorption gas supply unit 40, and a heat exchange unit 50. The liquefied gas supply unit 20 is configured as a liquefied gas tank that stores the liquefied gas 90.

[0017] <Liquefied gas storage structure> First, a description will be given of the structure for storing liquefied gas 90. The liquefied gas supply unit 20 has a multi-layer structure surrounded by a first insulating layer 21 and a second insulating layer 22 outside the first insulating layer 21. The liquefied gas supply unit 20 also includes an inlet portion 23, an outlet portion 24, and flow paths 25 and 26.

[0018] The liquefied gas supply unit 20 stores liquefied gas 90 in a space surrounded by the first insulating layer 21 .

[0019] The liquefied gas 90 is a liquid with a low boiling point. Examples of the liquefied gas 90 include, but are not limited to, liquefied hydrogen (boiling point at standard pressure: approximately −253°C), liquid oxygen (boiling point: approximately −183°C), liquid nitrogen (boiling point: approximately −196°C), and LNG (liquefied natural gas, boiling point: approximately −160°C). The liquefied gas 90 with a low boiling point has a boiling point sufficiently lower than the atmospheric temperature of the transport and storage environment, and therefore is easily vaporized by heat entering from outside the liquefied gas supply unit 20, generating boil-off gas 91. The boil-off gas 91 is a gas (vapor) obtained by vaporizing the liquefied gas 90. In the first embodiment, the liquefied gas 90 is liquid hydrogen, and the boil-off gas 91 is hydrogen gas.

[0020] The first insulating layer 21 is a hollow partition (insulating layer) that separates the liquefied gas supply section 20. The first insulating layer 21 is a layer formed between an inner wall 21a and an outer wall 21b. The inner wall 21a forms a storage space for the liquefied gas 90. The outer wall 21b forms the outer surface of the first insulating layer 21. The first insulating layer 21 has a radiation shield on at least the outer wall 21b to block (reflect) radiant heat from the outside. The radiation shield is made of, for example, aluminum. The first insulating layer 21 has a sealed structure. The first insulating layer 21 is a low-pressure space due to reduced pressure. Due to the low heat transfer coefficient of the low-pressure space, the first insulating layer 21 blocks heat input from the outside. The first insulating layer 21 can be reduced in pressure, for example, to a near vacuum, but it need not be a vacuum as long as it is reduced in pressure until the desired insulation performance is obtained.

[0021] The flow path 25 penetrates the first insulating layer 21 and is connected to the storage space, and the other end is connected to the inlet 23. The flow path 26 has one end connected to the interior (storage space) of the liquefied gas supply unit 20 and the other end connected to the outlet 24. The flow path 26 connects the liquefied gas supply unit 20 and the outlet 24 via the heat exchange unit 50.

[0022] The second insulating layer 22 is a hollow partition wall (insulating layer) that surrounds the outer periphery of the first insulating layer 21. The second insulating layer 22 is a layer formed between an inner wall 22a and an outer wall 22b. The inner wall 22a surrounds the first insulating layer 21. The outer wall 22b forms the outer shell of the second insulating layer 22, and the outer wall 22b forms the outer surface of the liquefied gas supply unit 20. The second insulating layer 22 has a sealed structure. The interior of the second insulating layer 22 is a low-pressure space due to reduced pressure. Due to the low heat transfer coefficient of the low-pressure space, the second insulating layer 22 blocks heat input from the outside. The second insulating layer 22 can be reduced in pressure, for example, to a near vacuum, but it need not be a vacuum as long as it is reduced in pressure until the desired insulating performance is obtained.

[0023] The liquefied gas supply unit 20 can supply the stored liquefied gas 90 to a supply destination from the outlet 24. The supply destination can be, for example, a hydrogen supply facility (such as a hydrogen station) that vaporizes liquid hydrogen and supplies it to hydrogen-using equipment (such as a hydrogen vehicle). The adsorption cooling device 10 (liquefied gas tank) can be mounted on a mobile object, in which case the supply destination can be, for example, a gas engine, a fuel cell, or the like. The supply destination can also be, for example, a fuel supply facility for a liquid-fuel rocket.

[0024] <Cooling Structure of Adsorption Cooling Device> The adsorbent 30 adsorbs the adsorption gas 41 while generating heat and releases the adsorbed adsorption gas 41 while absorbing heat. The adsorbent 30 reversibly adsorbs gas, for example, by physical adsorption. The adsorbent 30 is made of, for example, a porous material. The material constituting the adsorbent 30 may be, for example, activated carbon, carbon fiber, charcoal, zeolite, a metal complex, or a metal-organic framework (MOF).

[0025] The adsorbent 30 is thermally coupled to the first insulating layer 21 and disposed between the first insulating layer 21 and the second insulating layer 22. In the example shown in FIG. 1 , the adsorbent 30 is disposed so as to be in close contact with the outer surface (outer wall 21b) of the first insulating layer 21. Thermal coupling refers to a bonded state that allows thermal conduction, and the adsorbent 30 and the first insulating layer 21 may be bonded via a thermally conductive member without direct contact. For convenience, the adsorbent 30 is disposed only on one side of the first insulating layer 21 (the right side in FIG. 1 ). However, the adsorbent 30 may be disposed so as to surround the entire periphery of the first insulating layer 21. Also, in FIG. 1 , the adsorbent 30 is disposed so as to be in close contact with the inner surface of the second insulating layer 22. The adsorbent 30 may be spaced from the inner surface of the second insulating layer 22. The adsorbent 30 is filled, for example, in the space between the first insulating layer 21 (outer wall 21b) and the second insulating layer 22 (inner wall 22a).

[0026] The adsorption gas supply unit 40 is configured to supply the adsorption gas 41 to the adsorbent 30. The adsorption gas supply unit 40 is a gas container that accommodates the adsorption gas 41 in a releasable manner, and stores the adsorption gas 41. In the example of Fig. 1 , the adsorption gas supply unit 40 is provided outside the second insulating layer 22, and is connected to the adsorbent 30 via a gas pipe 42. One end of the gas pipe 42 is connected to the adsorption gas supply unit 40, and the other end is connected to the adsorbent 30.

[0027] The adsorption gas 41 is a gas to be adsorbed by the adsorbent 30. There are no particular limitations on the type of adsorption gas 41, but it is preferable that the adsorption gas 41 has physical properties (particularly thermal properties) similar to those of the gas vaporized from the liquefied gas 90. The adsorption gas 41 is, for example, a gas with the same elements (composition) as the liquefied gas 90. For example, if the liquefied gas 90 is liquid hydrogen, the adsorption gas 41 may be hydrogen gas.

[0028] The adsorption gas supply unit 40 is a pressure-resistant vessel having a predetermined volume. When the adsorbent 30 adsorbs the adsorption gas 41, the internal pressure of the adsorption gas supply unit 40 decreases, and when the adsorbent 30 releases the adsorption gas 41, the internal pressure of the adsorption gas supply unit 40 increases. For example, the adsorption gas supply unit 40 is depressurized to about 0.1 MPa by gas adsorption, and is pressurized to about 1 MPa by gas release.

[0029] The heat exchange unit 50 exchanges heat between the adsorbent 30 and the liquefied gas 90. The heat exchange unit 50 is thermally coupled to the adsorbent 30. In the example of Fig. 1 , the heat exchange unit 50 is a heat exchanger provided in the area where the adsorbent 30 is arranged. The heat exchange unit 50 has a flow path therein through which the liquefied gas 90 flows, and transfers heat between the liquefied gas 90 inside and the adsorbent 30 outside.

[0030] The heat exchanger 50 is provided in the flow path 26 between the liquefied gas supply unit 20 (storage space) and the outlet 24. As a result, the adsorbent 30 on the outer surface side of the heat exchanger 50 is cooled by the cold heat of the liquefied gas 90 flowing inside the heat exchanger 50.

[0031] 1 , the adsorption cooling device 10 includes a second heat exchange unit 11 that exchanges heat between the liquefied gas 90 and the adsorption gas 41. The second heat exchange unit 11 is provided inside the second insulating layer 22 (outside the first insulating layer 21) and before the outlet unit 24. The second heat exchange unit 11 is connected to the flow paths 25, 26, and gas piping 42, respectively. The second heat exchange unit 11 pre-cools the adsorption gas 41 by the low-temperature liquefied gas 90 passing through the flow paths 25 and 26 before the adsorption gas 41 is supplied to the adsorbent 30.

[0032] It should be noted that even if the adsorption gas 41 is not pre-cooled, the adsorbent 30 can adsorb the adsorption gas 41 by being cooled by the liquefied gas 90. When the adsorption gas 41 is pre-cooled, the temperature of the adsorbent 30 is prevented from rising due to contact with the adsorption gas 41, which makes it easier for the adsorption gas 41 to be adsorbed by the adsorbent 30.

[0033] With this configuration, the adsorbent 30 is configured to adsorb the adsorption gas 41 while being cooled by the liquefied gas 90, and cool the object to be cooled by absorbing heat when releasing the adsorption gas 41. In the first embodiment, the object to be cooled is the first insulating layer 21.

[0034] <Adsorption cooling method> An adsorption cooling method according to the first embodiment will be described. The adsorption cooling method is a cooling method for cooling an object to be cooled by absorbing heat when the adsorption gas 41 adsorbed in the adsorbent 30 is released. The adsorption cooling method according to the first embodiment is performed by an adsorption cooling apparatus 10.

[0035] Fig. 2 is a schematic diagram for explaining the adsorption cooling method according to the first embodiment. As shown in Fig. 2, the adsorption cooling method according to the first embodiment includes a step S1 of adsorbing an adsorbing gas 41 into the adsorbent 30 in a state in which the adsorbent 30 is cooled by a liquefied gas 90, and a step S2 of releasing the adsorbing gas 41 by causing the adsorbent 30 in a state in which the adsorbing gas 41 has been adsorbed to absorb heat.

[0036] In step S1, the adsorption cooling device 10 cools the adsorbent 30 with the liquefied gas 90. The adsorption cooling device 10 performs step S1 when the liquefied gas 90 is supplied to the outside. When the liquefied gas 90 is sent to the outlet 24 via the flow path 26, the liquefied gas 90 passes through the heat exchanger 50, thereby cooling the adsorbent 30. The adsorbent 30 adsorbs the adsorption gas 41 by being cooled to an extremely low temperature by the liquefied gas 90. At this time, the second heat exchanger 11 (see FIG. 1 ) exchanges heat between the liquefied gas 90 that has passed through the heat exchanger 50 and the adsorption gas 41, thereby precooling the adsorption gas 41 before supplying it to the adsorbent 30. The adsorbent 30 adsorbs the low-temperature adsorption gas 41 precooled by the second heat exchanger 11. The adsorption gas 41 is stored at high pressure in the adsorption gas supply unit 40, and is therefore naturally discharged from the adsorption gas supply unit 40 as the gas is adsorbed in the adsorbent 30. Therefore, no driving source such as a pump for supplying the adsorption gas 41 is particularly required.

[0037] The liquefied gas 90 supplied to the outside is heated by the heat exchanger 50 and the second heat exchanger 11. The second heat exchanger 11 supplies the liquefied gas 90 to the outlet 24 as a vaporized gas 90A (see FIG. 1) or in a gas-liquid mixed phase state. The liquefied gas 90 can be preheated before being supplied to an external vaporizer, etc., thereby reducing the energy required for the vaporization process in the vaporizer. Depending on the intended use of the destination of the liquefied gas 90, the liquefied gas 90 may be sent out from the outlet 24 in the liquid phase (liquefied gas 90) without being vaporized.

[0038] After the adsorption cooling device 10 has supplied a desired amount of liquefied gas 90 to the outside, in step S2, the supply of liquefied gas 90 is stopped. In step S2 in Figure 2, the flow path 26 indicated by the dashed line represents a state in which the liquefied gas 90 is not flowing. This stops the flow of liquefied gas 90 through the flow path 26, and therefore the cooling of the adsorbent 30 by the liquefied gas 90 is stopped.

[0039] Here, even if the liquefied gas supply unit 20 has a multi-layer heat insulation structure, heat still penetrates from the outside. In step S2, the adsorbent 30 is heated by absorbing (endothermic) the heat that penetrated from the outside, and releases the adsorption gas 41 adsorbed in step S1. The adsorption gas 41 released from the adsorbent 30 is re-stored in the adsorption gas supply unit 40 through the gas pipe 42.

[0040] Because the adsorbent 30 is thermally coupled to the first insulating layer 21 (radiation shield), it absorbs the heat HE applied to the first insulating layer 21 and cools the first insulating layer 21. In this way, the adsorbent 30 cools the object to be cooled (first insulating layer 21) by absorbing heat when releasing the adsorption gas 41. Cooling the first insulating layer 21 suppresses the penetration of heat HE into the liquefied gas 90 in the liquefied gas supply unit 20, thereby suppressing the generation of boil-off gas 91 in the liquefied gas supply unit 20.

[0041] The cooling capacity of the adsorbent 30 decreases as it releases the adsorbed adsorption gas 41. Thereafter, when step S1 is executed again at the timing when the liquefied gas 90 is supplied to the outside, the adsorbent 30 adsorbs the adsorption gas 41 again by cooling and regains its cooling capacity. The adsorption cooling device 10 can continuously (repeatedly) cool the object to be cooled (first insulating layer 21) by alternately repeating step S1 and step S2.

[0042] Second Embodiment Fig. 3 is a schematic diagram showing the configuration of an adsorption cooling device according to a second embodiment. Note that components having the same functions as those in the first embodiment described above are given the same reference numerals, and detailed descriptions thereof will be omitted.

[0043] In the first embodiment described above, an example was shown in which the first insulating layer 21 of a liquefied gas tank was cooled by the adsorption cooling device 10, but in this second embodiment, an example is shown in which the re-liquefaction device 122 of a liquefied gas tank 121 is cooled by the adsorption cooling device 10A.

[0044] The liquefied gas supply unit 20 of the adsorption cooling system 10A according to the second embodiment includes a liquefied gas tank 121 , a reliquefaction system 122 , and a flow path 123 .

[0045] The liquefied gas tank 121 stores the liquefied gas 90. The liquefied gas 90 generates boil-off gas 91 due to heat entering the liquefied gas tank 121 from the outside.

[0046] The reliquefaction device 122 cools and reliquefies the boil-off gas 91 in the liquefied gas tank 121. The reliquefaction device 122 is a refrigerator that cools the boil-off gas 91 using a heat absorption part 122a provided in the gas phase space in the liquefied gas tank 121 and dissipates heat from a heat dissipation part 122b provided outside the liquefied gas tank 121. The reliquefaction device 122 may be configured such that the heat absorption part 122a is provided outside the liquefied gas tank 121 and is connected to the liquefied gas tank 121 by piping.

[0047] The flow path 123 connects the liquefied gas tank 121 and the heat exchanger 50. As the liquefied gas 90 passes through the heat exchanger 50, the liquefied gas 90 exchanges heat with the adsorbent 30, thereby cooling the adsorbent 30. The heat exchanger 50 can be configured to vaporize the liquefied gas 90 through heat exchange and discharge it as gas 90A.

[0048] The adsorbent 30 is thermally coupled to the heat exhaust portion 122b of the reliquefaction device 122. The adsorbent 30 cools the heat exhaust portion 122b of the reliquefaction device 122 as an object to be cooled.

[0049] The adsorption cooling apparatus 10A cools the adsorbent 30 with the liquefied gas 90 (step S1 in FIG. 2 ). That is, when the liquefied gas 90 is supplied, the adsorption cooling apparatus 10A supplies the liquefied gas 90 from the liquefied gas tank 121 through the flow path 123. The heat exchange unit 50 exchanges heat between the liquefied gas 90 passing through the flow path 123 and the adsorbent 30, thereby cooling the adsorbent 30. The cooled adsorbent 30 adsorbs the adsorption gas 41 from the adsorption gas supply unit 40.

[0050] The adsorption cooling system 10A supplies a desired amount of liquefied gas 90 to the outside, causing the adsorbing gas 41 to be adsorbed by the adsorbent 30, and then stops supplying the liquefied gas 90. Next, the adsorption cooling system 10A discharges heat HE generated by the reliquefaction process of the boil-off gas 91 from the heat exhaust section 122b of the reliquefaction device 122. The adsorbent 30 absorbs (endotherms) the heat HE from the heat exhaust section 122b, thereby releasing the adsorbing gas 41 adsorbed in step S1 (step S2 in FIG. 2 ). As a result, the adsorbent 30 cools the heat exhaust section 122b of the reliquefaction device 122.

[0051] Thereafter, when step S1 is executed again at the timing when the liquefied gas 90 is supplied to the outside, the adsorbent 30 adsorbs the adsorption gas 41 again by cooling, and the cooling capacity is restored. The adsorption cooling device 10A can continuously (repeatedly) cool the object to be cooled (the heat exhaust section 122b) by alternately repeating steps S1 and S2.

[0052] 4 is a schematic diagram showing the configuration of an adsorption cooling device according to a third embodiment. Note that components having the same functions as those in the first embodiment described above are given the same reference numerals, and detailed descriptions thereof will be omitted.

[0053] In the third embodiment, the liquefied gas tank 121 includes a first tank 121-1 that stores a first liquefied gas 90-1 and a second tank 121-2 that stores a second liquefied gas 90-2. The first tank 121-1 is equipped with a reliquefaction device 122. Note that the reliquefaction device on the second tank 121-2 side is not shown or described.

[0054] The second liquefied gas 90-2 is a liquefied gas with a lower temperature than the first liquefied gas 90-1. In the third embodiment, for example, the first liquefied gas 90-1 is liquid oxygen (boiling point: approximately −183° C.), and the second liquefied gas 90-2 is liquid hydrogen (boiling point: approximately −253° C.).

[0055] The adsorption cooling system 10B includes a cooling section 12-1 including an adsorbent 30-1, an adsorption gas supply section 40-1, and a heat exchange section 50-1, and a cooling section 12-2 including an adsorbent 30-2, an adsorption gas supply section 40-2, and a heat exchange section 50-2. The cooling section 12-1 corresponds to a first tank 121-1. The heat exchange section 50-1 is connected to the first tank 121-1 via a flow path 123-1. The cooling section 12-2 corresponds to a second tank 121-2. The heat exchange section 50-2 is connected to the second tank 121-2 via a flow path 123-2.

[0056] The adsorbent 30-2 is provided to cool the heat exhaust section 122b of the reliquefaction device 122 of the first tank 121-1 as a cooling object. That is, the adsorbent 30-2 of the cooling section 12-2 is thermally coupled to the heat exhaust section 122b of the reliquefaction device 122 of the first tank 121-1.

[0057] The adsorption cooling device 10B cools the adsorbent 30-2 in the cooling unit 12-2 by supplying the second liquefied gas 90-2 from the second tank 121-2 to the flow path 123-2. The heat exchange unit 50-2 uses the second liquefied gas 90-2, which has a lower temperature than the first liquefied gas 90-1, as a cooling medium to cool the adsorbent 30-2 in the cooling unit 12-2. The adsorbent 30-2 adsorbs the adsorption gas 41 from the adsorption gas supply unit 40-2 by cooling (step S1).

[0058] After stopping the supply of the second liquefied gas 90-2 to the outside, the adsorption cooling device 10B discharges the heat HE generated by the reliquefaction process of the boil-off gas 91 in the first tank 121-1 from the heat exhaust section 122b of the reliquefaction device 122-1. The adsorbent 30-2 absorbs the heat HE from the heat exhaust section 122b and releases the adsorption gas 41 adsorbed in step S1 (step S2). As a result, the adsorbent 30-2 cools the heat exhaust section 122b of the reliquefaction device 122-1.

[0059] The adsorbent 30-2 is cooled by the second liquefied gas 90-2, which has a lower temperature than the first liquefied gas 90-1 or the second liquefied gas 90-2, and therefore has a higher adsorption performance than when cooled by the first liquefied gas 90-1. As a result, the amount of gas released increases, and the amount of heat that can be cooled also increases.

[0060] The adsorbent 30-1 of the cooling unit 12-1 may be thermally coupled to the heat exhaust unit 122b of the reliquefaction device 122. In this case, both the adsorbent 30-1 and the adsorbent 30-2 cool the heat exhaust unit 122b of the reliquefaction device 122. The adsorbent 30-1 may be thermally coupled to an object to be cooled other than the heat exhaust unit 122b.

[0061] 5 is a schematic diagram showing the configuration of an adsorption cooling device according to a fourth embodiment. Note that components having the same functions as those in the first embodiment described above are given the same reference numerals, and detailed descriptions thereof will be omitted.

[0062] The configuration of the adsorption cooling apparatus 10C according to the fourth embodiment is the same as that of the third embodiment. The fourth embodiment differs from the third embodiment in that the object to be cooled by the adsorption cooling apparatus 10C is the radiation shield 124 of the liquefied gas tank 121.

[0063] The liquefied gas tank 121 (first tank 121-1) has a radiation shield 124 that blocks radiant heat. The radiation shield 124 may be the outer wall of a heat insulating layer. The radiation shield of the second tank 121-2 is not shown. The adsorbent 30-2 of the cooling unit 12-2 is thermally coupled to the radiation shield 124 of the first tank 121-1. The adsorbent 30-2 is provided to cool the radiation shield 124 of the first tank 121-1 as a cooling target.

[0064] The other configurations of the fourth embodiment are similar to those of the third embodiment.

[0065] The adsorbent 30-2 is cooled by the second liquefied gas 90-2, which has a lower temperature than the first liquefied gas 90-1 or the second liquefied gas 90-2, and therefore the adsorption performance of the adsorption gas 41 is increased compared to cooling by the first liquefied gas 90-1. The adsorbent 30-2 cools the radiation shield 124 of the first tank 121-1, which has a higher temperature than the first tank 121-1 or the second tank 121-2, and therefore can absorb more heat HE. This increases the amount of heat that can be cooled by the adsorption cooling device 10C.

[0066] The adsorbent 30-1 of the cooling unit 12-1 may be thermally coupled to the radiation shield 124. In this case, both the adsorbent 30-1 and the adsorbent 30-2 cool the radiation shield 124. The adsorbent 30-1 may be thermally coupled to an object to be cooled other than the radiation shield 124.

[0067] 6 is a schematic diagram showing the configuration of an adsorption cooling device according to a fifth embodiment. Note that components having the same functions as those in the first embodiment described above are given the same reference numerals, and detailed descriptions thereof will be omitted.

[0068] In the above fourth embodiment, an example is shown in which the radiation shield 124 of the first tank 121-1 is cooled by the adsorbent 30-2 of the cooling section 12-2 provided corresponding to the second tank 121-2, but in the fifth embodiment, an example is shown in which the radiation shield 124 of the liquefied gas tank 121 is cooled by the adsorbent 30 corresponding to that liquefied gas tank 121.

[0069] The adsorption cooling device 10D includes a liquefied gas tank 121 and a flow path 123 that connects the liquefied gas tank 121 and the heat exchange unit 50.

[0070] The flow path 123 connects the liquefied gas tank 121 and the heat exchanger 50. As the liquefied gas 90 passes through the heat exchanger 50, heat is exchanged between the liquefied gas 90 and the adsorbent 30, thereby cooling the adsorbent 30. The adsorbent 30 is thermally coupled to the radiation shield 124 and is provided as an object to be cooled.

[0071] The adsorption cooling device 10D cools the adsorbent 30 using the liquefied gas 90 stored in the liquefied gas tank 121, causing the adsorbing gas 41 to be adsorbed into the adsorbent 30. After the supply of the liquefied gas 90 is stopped, heat HE applied to the radiation shield 124 from outside the liquefied gas tank 121 is transferred to the adsorbent 30. The adsorbent 30 absorbs the heat HE and releases the adsorbed adsorbing gas 41, thereby cooling the radiation shield 124 of the liquefied gas tank 121.

[0072] In the fifth embodiment, when a first tank 121-1 and a second tank 121-2 are provided as in the fourth embodiment (see Figure 4), the cooling units 12-1 and 12-2 cool the radiation shields 124 of the corresponding first tank 121-1 and second tank 121-2, respectively.

[0073] Sixth Embodiment Fig. 7 is a schematic diagram showing a cooling system according to a sixth embodiment. Fig. 8 is a schematic diagram showing an adsorption cooling device 10E included in the cooling system. Note that components having the same functions as those in the first embodiment described above are given the same reference numerals, and detailed descriptions thereof will be omitted.

[0074] The cooling system 200 of the sixth embodiment is configured as a liquefaction system that cools and liquefies a raw material gas.

[0075] <Configuration of Cooling System> The cooling system 200 includes a first flow path 210 through which a first fluid 201 flows, a second flow path 220 through which a second fluid 202 that cools the first flow path 210 flows, heat exchangers 231 and 232 connected to the first flow path 210 and the second flow path 220, and the adsorption cooling device 10E. The cooling system 200 also includes a refrigerator 240 that uses a third fluid 203 as a refrigerant, a heat exchanger 233, and an expansion valve 250.

[0076] The first fluid 201 is a fluid to be cooled by the adsorption cooling device 10E. In the example of FIG. 7 , the first fluid 201 is a raw material gas before liquefaction. The first fluid 201 is, for example, hydrogen. The second fluid 202 and the third fluid 203 are each a cooling medium for cooling the first fluid 201. The second fluid 202 is, for example, nitrogen (liquid nitrogen, nitrogen gas), and the third fluid 203 is, for example, hydrogen (liquid hydrogen, hydrogen gas).

[0077] The first flow path 210 passes through, in order from the inlet side, the adsorption cooling device 10E, the heat exchanger 231, the heat exchanger 232, the heat exchanger 233, and the expansion valve 250, and extends to the outlet. The inlet of the first flow path 210 is connected to a supply source of the raw material gas, and the outlet of the first flow path 210 is connected to a supply destination of the liquefied gas. The first flow path 210 receives the first fluid 201 in a gas phase (hydrogen gas) and outputs the first fluid 201 in a liquid phase (liquid hydrogen).

[0078] The second flow path 220 passes through the storage tank 260, the heat exchanger 231, and the adsorption cooling device 10E in that order from the inlet side, and extends to the outlet. The inlet of the second flow path 220 is connected to a supply source of the second fluid 202. The outlet of the second flow path 220 is connected to a recovery device for the second fluid 202 or is open to the atmosphere. The second flow path 220 receives the second fluid 202 in a liquid phase (liquid nitrogen) and outputs the second fluid 202 in a gas phase (nitrogen gas).

[0079] The refrigerator 240 is configured with a gas refrigeration cycle using a third fluid 203 (hydrogen) as a refrigerant. The refrigerator 240 includes a compressor 241, a condenser 242, an expansion valve 243, an expansion turbine 244, and a circulation flow path 245 connecting these components. The circulation flow path 245 also passes through heat exchangers 231, 232, and 233. The refrigerator 240 liquefies the third fluid 203 (refrigerant hydrogen gas) in a low-temperature, high-pressure gas phase by expanding the third fluid 203 using the expansion turbine 244 and the expansion valve 243, respectively. The refrigerator 240 exchanges heat between the liquid-phase third fluid 203 (refrigerant liquid hydrogen) and the first fluid 201 in the heat exchangers 231-233, thereby cooling the first fluid 201 (raw material hydrogen gas).

[0080] The heat exchanger 231 cools the first fluid 201 by heat exchange among the first fluid 201 (raw hydrogen gas), the second fluid 202 (nitrogen refrigerant), and the third fluid 203 (hydrogen refrigerant).

[0081] The heat exchanger 232 is provided in a storage tank 260 for the liquid-phase second fluid 202 (liquid nitrogen refrigerant), and is immersed in the liquid-phase second fluid 202. A catalyst section 234 for promoting ortho-para conversion of the feed hydrogen is provided in a passage portion of the heat exchanger 232 through which the first fluid 201 flows.

[0082] The heat exchanger 233 cools the first fluid 201 (raw material hydrogen gas) by heat exchange between the first fluid 201 and the third fluid 203 (refrigerant hydrogen). A catalyst section 234 for promoting ortho-para conversion of the raw material hydrogen is provided in a passage portion of the heat exchanger 233 through which the first fluid 201 flows.

[0083] The expansion valve 250 expands the first fluid 201 (raw material hydrogen gas). The expansion valve 250 is, for example, a Joule-Thomson valve. The expansion valve 250 expands the first fluid 201 to cool it and liquefy the first fluid 201 from its gas phase.

[0084] <Sorption cooling device> The sorption cooling device 10E is disposed upstream of the heat exchanger 231 in the first flow path 210. The sorption cooling device 10E cools the first fluid 201 (raw material hydrogen gas) before it is supplied to the heat exchanger 231. The sorption cooling device 10E is disposed downstream of the heat exchanger 231 in the second flow path 220. The sorption cooling device 10E cools the adsorbent 30 using the second fluid 202 (refrigerant nitrogen) after it has been used for cooling in the heat exchanger 231. That is, the sorption cooling device 10E has a function of recovering cold energy from the second fluid 202 after heat exchange in the cooling system 200, and pre-cooling the first fluid 201 (raw material hydrogen gas) before it is sent to the heat exchangers 231 to 233.

[0085] As shown in Fig. 8, the adsorption cooling system 10E includes a plurality of cooling sections 12 (12-1, 12-2) each including an adsorbent 30, an adsorption gas supply section 40, and a heat exchange section 50. While Fig. 8 shows an example in which two cooling sections 12-1, 12-2 are provided, three or more cooling sections 12 may be provided.

[0086] The cooling unit 12-1 includes an adsorbent 30-1, an adsorption gas supply unit 40-1, and a heat exchange unit 50-1. The cooling unit 12-2 includes an adsorbent 30-2, an adsorption gas supply unit 40-2, and a heat exchange unit 50-2. Each heat exchange unit 50-1, 50-2 is connected to the second flow path 220 and causes the adsorbents 30-1, 30-2 to exchange heat with the second fluid 202. Each adsorbent 30-1, 30-2 adsorbs the adsorption gas 41 while being cooled by the second fluid 202, and cools the first fluid 201 by absorbing heat when releasing the adsorption gas 41.

[0087] The adsorption cooling apparatus 10E also includes a flow path switching unit 13. The flow path switching unit 13 includes a switching valve 13a and a switching valve 13b.

[0088] The switching valve 13a is a three-way valve that is connected to the first flow path 210 and is also connected in parallel to the cooling units 12-1 and 12-2. As a result, the switching valve 13a switches the flow path so as to selectively connect one of the cooling units 12-1 and 12-2 to the first flow path 210. The first fluid outlet of the adsorption cooling device 10E is connected to the heat exchanger 231 via the first flow path 210.

[0089] The switching valve 13b is a three-way valve that is connected to the heat exchanger 231 by the second flow path 220 and is connected in parallel to the cooling units 12-1 and 12-2. As a result, the switching valve 13b switches the flow path so as to selectively connect the other of the cooling units 12-1 and 12-2 to the second flow path 220 (heat exchanger 231). The second fluid outlet of the adsorption cooling device 10E is connected to the downstream side of the second flow path 220.

[0090] The flow path switching unit 13 switches the connection between the multiple cooling units (12-1, 12-2) and the first flow path 210 and the second flow path 220 so as to connect at least one of the multiple cooling units (12-1, 12-2) to the second flow path 220 and connect at least one other cooling unit (12-1, 12-2) to the first flow path 210.

[0091] In this example, since there are two cooling units (12-1, 12-2), the flow path switching unit 13 switches between two states: a state (1) in which the cooling unit 12-1 is connected to the first flow path 210 and the cooling unit 12-2 is connected to the second flow path 220, and a state (2) in which the cooling unit 12-2 is connected to the first flow path 210 and the cooling unit 12-1 is connected to the second flow path 220. When there are three or more cooling units 12, the flow path switching unit 13 may connect only one of the cooling units 12 to the first flow path 210 or the second flow path 220, or may connect two or more cooling units 12 to the first flow path 210 or the second flow path 220 simultaneously.

[0092] With this configuration, the adsorption cooling apparatus 10E adsorbs the adsorption gas 41 in one of the cooling sections 12-1, 12-2, while discharging the adsorption gas 41 in the other cooling section 12-1, 12-2, thereby cooling (pre-cooling) the first fluid 201. The adsorption cooling apparatus 10E alternates between adsorption of the adsorption gas 41 and discharging the adsorption gas 41 in each cooling section (12-1, 12-2) by switching the connection state of the flow path switching section 13.

[0093] That is, in state (1), the cooling unit 12-1 is connected to the first flow path 210 and is not connected to the second flow path 220. Therefore, the second fluid 202 is not supplied to the adsorbent 30-1, and the adsorbent 30-1 absorbs heat from the first fluid 201 flowing through the first flow path 210 and releases the adsorbing gas 41 that has already been adsorbed to the adsorbing gas supply unit 40-1. As a result, the first fluid 201 is cooled.

[0094] At this time, the cooling unit 12-2 is connected to the second flow path 220 and is not connected to the first flow path 210. Therefore, the heat exchange unit 50-2 cools the adsorbent 30-2 by heat exchange with the second fluid 202. The cooled adsorbent 30-2 adsorbs the adsorption gas 41 from the adsorption gas supply unit 40-2. As a result, the adsorbent 30-2 becomes able to release the adsorption gas 41.

[0095] In state (2), the cooling unit 12-1 is connected to the second flow path 220 and is not connected to the first flow path 210. Therefore, the heat exchange unit 50-1 cools the adsorbent 30-1 by heat exchange with the second fluid 202. The cooled adsorbent 30-1 adsorbs the adsorption gas 41 from the adsorption gas supply unit 40-1. As a result, the adsorbent 30-1 becomes able to release the adsorption gas 41.

[0096] At this time, the cooling unit 12-2 is connected to the first flow path 210 and is not connected to the second flow path 220. Therefore, the second fluid 202 is not supplied to the adsorbent 30-2, and the adsorbent 30-2 absorbs heat from the first fluid 201 flowing through the first flow path 210 and releases the adsorbing gas 41 that has already been adsorbed to the adsorbing gas supply unit 40-2. As a result, the first fluid 201 is cooled.

[0097] Therefore, by alternately switching between state (1) and state (2), the cooling section 12-1 and the cooling section 12-2 alternately release the adsorption gas 41. As a result, the first fluid 201 is continuously cooled (pre-cooled).

[0098] In the sixth embodiment, the adsorption cooling device 10E recovers cold energy from the second fluid 202 that has absorbed heat in the heat exchangers 231 and 232 to adsorb the adsorption gas 41, and then cools the first fluid 201 by releasing the adsorption gas 41, thereby improving the efficiency of the cooling system 200.

[0099] Seventh Embodiment Fig. 9 is a schematic diagram showing a cooling system according to a seventh embodiment. Fig. 10 is a schematic diagram showing an adsorption cooling device 10E included in the cooling system. Note that components having the same functions as those in the first embodiment described above are given the same reference numerals, and detailed descriptions thereof will be omitted.

[0100] The seventh embodiment illustrates an example in which the position of the adsorption cooling device 10E is different from that of the sixth embodiment. In the seventh embodiment, the configuration other than the position of the adsorption cooling device 10E is the same as that of the sixth embodiment, and therefore a description thereof will be omitted.

[0101] The adsorption cooling apparatus 10E of the cooling system 200A of the seventh embodiment is disposed between the heat exchanger 231 and the heat exchanger 232 (storage tank 260). The adsorption cooling apparatus 10E cools the first fluid 201 (raw material hydrogen gas) that has been cooled in the heat exchanger 231 and before being supplied to the heat exchanger 232. The adsorption cooling apparatus 10E cools the adsorbent 30 using the second fluid 202 (refrigerant nitrogen) that has been used for cooling in the heat exchanger 232 and before being used in the heat exchanger 231. Therefore, the adsorption cooling apparatus 10E of the seventh embodiment is configured to recover cold energy from the second fluid 202, which has a lower temperature than that of the sixth embodiment, and cool the first fluid 201 (raw material hydrogen gas) that has been primarily cooled by the heat exchanger 231.

[0102] The adsorption cooling apparatus 10E is connected to the heat exchangers 231 and 232 by a first flow path 210. The adsorption cooling apparatus 10E receives the first fluid 201 that has passed through the heat exchanger 231 and supplies it to the heat exchanger 232. The adsorption cooling apparatus 10E is connected to the storage tank 260 and the heat exchanger 231 by a second flow path 220. The adsorption cooling apparatus 10E receives the second fluid 202 that has passed through the storage tank 260 and supplies it to the heat exchanger 231.

[0103] 10, the switching valve 13a is connected to the outlet of the heat exchanger 231 and is connected in parallel to the cooling units 12-1 and 12-2. The switching valve 13b is connected to the outlet of the storage tank 260 and is connected in parallel to the cooling units 12-1 and 12-2.

[0104] The flow path switching unit 13 switches the switching valves 13a and 13b to establish a state (1) in which the cooling unit 12-1 is connected to the first flow path 210 and the cooling unit 12-2 is connected to the second flow path 220. In state (1), the cooling unit 12-1 absorbs heat from the first fluid 201 that has passed through the heat exchanger 231 and sends it to the heat exchanger 232. At this time, the adsorbent 30-1 releases the adsorption gas 41 that has already been adsorbed to the adsorption gas supply unit 40-1. This cools the first fluid 201.

[0105] At this time, the cooling unit 12-2 cools the adsorbent 30-2 by heat exchange with the gas-phase second fluid 202 that has flowed in from the storage tank 260, and sends the second fluid 202 to the heat exchanger 231. The cooled adsorbent 30-2 adsorbs the adsorption gas 41 from the adsorption gas supply unit 40-2. As a result, the adsorbent 30-2 becomes able to release the adsorption gas 41.

[0106] The flow path switching unit 13 switches the switching valves 13a and 13b to establish a state (2) in which the cooling unit 12-2 is connected to the first flow path 210 and the cooling unit 12-1 is connected to the second flow path 220. In state (2), the cooling unit 12-1 cools the adsorbent 30-1 by heat exchange with the gas-phase second fluid 202 that has flowed in from the heat exchanger 232, and sends the second fluid 202 to the heat exchanger 231. The cooled adsorbent 30-1 adsorbs the adsorption gas 41 from the adsorption gas supply unit 40-1.

[0107] At this time, the cooling section 12-2 absorbs heat from the first fluid 201 that has passed through the heat exchanger 231 and sends it to the heat exchanger 232. The adsorbent 30-2 releases the adsorption gas 41 that has already been adsorbed to the adsorption gas supply section 40-2. As a result, the first fluid 201 is cooled.

[0108] The adsorption cooling device 10E alternately switches between state (1) and state (2) using the flow path switching unit 13, and the cooling units 12-1 and 12-2 alternately release the adsorption gas 41, thereby continuously cooling the first fluid 201.

[0109] In the seventh embodiment, the adsorption gas 41 can be adsorbed into the adsorbents 30-1 and 30-2 in a state where the adsorbents 30-1 and 30-2 are cooled to a lower temperature than in the sixth embodiment, thereby improving the adsorption efficiency of the adsorption gas 41. As a result, the cooling effect of the first fluid 201 due to the release of the adsorption gas 41 is improved.

[0110] [Effects of this embodiment] The adsorption cooling device of the first aspect comprises an adsorbent 30 that adsorbs an adsorption gas 41 with heat generation and releases the adsorbed adsorption gas 41 with endothermic heat generation, an adsorption gas supply unit 40 that supplies the adsorption gas 41 to the adsorbent 30, a liquefied gas supply unit 20 that supplies liquefied gas 90, and a heat exchange unit 50 that exchanges heat between the adsorbent 30 and the liquefied gas 90, and the adsorbent 30 is configured to adsorb the adsorption gas 41 in a state cooled by the liquefied gas 90 and cool the object to be cooled by absorbing heat when releasing the adsorption gas 41.

[0111] The adsorption cooling system according to the first aspect utilizes the property of the adsorbent 30, which releases the adsorbed adsorption gas 41 with heat absorption, to cool an object to be cooled by the heat absorbed when the adsorption gas 41 is released. This provides a new adsorption cooling system 10 that utilizes the adsorption of gas by the adsorbent 30 and the release of the adsorbed gas. Furthermore, because the adsorbent 30 for adsorbing the adsorption gas 41 is cooled by the liquefied gas 90 from the liquefied gas supply unit 20, no external energy is consumed to cool the adsorbent 30. This improves the energy efficiency of the entire system that stores and supplies the liquefied gas 90.

[0112] The adsorption cooling device of the second aspect is the adsorption cooling device of the first aspect, wherein the liquefied gas supply unit 20 has a multi-layer structure surrounded by a first insulating layer 21 and a second insulating layer 22 outside the first insulating layer 21, and is a liquefied gas tank that stores liquefied gas 90 in the space surrounded by the first insulating layer 21, and the adsorbent 30 is disposed between the first insulating layer 21 and the second insulating layer 22 while being thermally coupled to the first insulating layer 21, and cools the first insulating layer 21 as an object to be cooled. This allows the adsorbent 30 to cool the first insulating layer 21 by absorbing heat when releasing the adsorption gas 41. As a result, heat input to the liquefied gas 90 in the first insulating layer 21 can be suppressed, thereby reducing the amount of boil-off gas 91 generated in the liquefied gas 90.

[0113] The adsorption cooling apparatus according to the third aspect is the adsorption cooling apparatus according to the first or second aspect, wherein the liquefied gas supply unit 20 includes a liquefied gas tank 121 that stores the liquefied gas 90, a reliquefaction unit 122 that cools and reliquefies the boil-off gas 91 in the liquefied gas tank 121, and a flow path 123 that connects the liquefied gas tank 121 and the heat exchange unit 50, and the adsorbent 30 is thermally coupled to a heat exhaust unit 122b of the reliquefaction unit 122 and is cooled as an object to be cooled. As a result, the adsorbent 30 absorbs heat when releasing the adsorption gas 41, thereby effectively exhausting heat from the reliquefaction unit 122 associated with the reliquefaction (cooling) of the boil-off gas 91.

[0114] The adsorption cooling system according to the fourth aspect is the adsorption cooling system according to the third aspect, further comprising: a liquefied gas tank 121 including a first tank 121-1 for storing a first liquefied gas 90-1 and a second tank 121-2 for storing a second liquefied gas 90-2 at a lower temperature than the first liquefied gas 90-1; a heat exchanger 50-2 connected to the second tank 121-2 via a flow path 123-2; and an adsorbent 30-2 thermally coupled to a heat exhaust section 122b of a reliquefaction device 122-1 of the first tank 121-1, thereby cooling the adsorbent 30-2 as a cooling target. This allows the adsorbent 30-2 to be effectively cooled by the second liquefied gas 90-2, which is at a lower temperature than the first liquefied gas 90-1, thereby improving the adsorption performance of the adsorbent 30-2. As a result, the amount of heat absorbed when releasing the adsorption gas 41 can be increased, thereby more effectively exhausting heat from the reliquefaction device 122.

[0115] An adsorption cooling apparatus according to a fifth aspect is the adsorption cooling apparatus according to any one of the first to fourth aspects, wherein the liquefied gas supply unit 20 has a radiation shield 124 that blocks radiant heat, and includes a liquefied gas tank 121 that stores liquefied gas 90, and a flow path 123 that connects the liquefied gas tank 121 and the heat exchange unit 50, and the adsorbent 30 is thermally coupled to the radiation shield 124 and is cooled as an object to be cooled. As a result, the radiation shield 124 of the liquefied gas tank 121 can be cooled by the heat absorption when the adsorption gas 41 is released, and the amount of boil-off gas 91 generated in the liquefied gas 90 can be effectively reduced.

[0116] An adsorption cooling apparatus according to a sixth aspect is the adsorption cooling apparatus according to the fifth aspect, further comprising: a liquefied gas tank (121) including a first tank (121-1) for storing a first liquefied gas (90-1) and a second tank (121-2) for storing a second liquefied gas (90-2) having a lower temperature than the first liquefied gas (90-1); a heat exchange unit (50-2) connected to the second tank (121-2) via a flow path (123-2); and an adsorbent (30-2) thermally coupled to a radiation shield (124) of the first tank (121-1) and cooled as an object to be cooled. This allows the adsorbent (30-2) to be effectively cooled by the second liquefied gas (90-2) having a lower temperature than the first liquefied gas (90-1), thereby improving the adsorption performance of the adsorbent (30-2). Furthermore, the heat absorbed when the adsorption gas 41 is released cools the radiation shield 124 of the first tank 121-1, which is hotter than the second tank 121-2, so the amount of boil-off gas 91 generated in the first tank 121-1 can be reduced even more effectively.

[0117] The cooling system of the seventh aspect comprises a first flow path 210 through which a first fluid 201 circulates, a second flow path 220 through which a second fluid 202 circulates to cool the first fluid 201, heat exchangers 231, 232 connected to the first flow path 210 and the second flow path 220, and an adsorption cooling device 10E. The adsorption cooling device 10E comprises an adsorbent 30 that is thermally coupled to the first flow path 210 and adsorbs an adsorption gas 41 with heat generation and releases the adsorbed adsorption gas 41 with endothermic heat generation, an adsorption gas supply unit 40 that supplies the adsorption gas 41 to the adsorbent 30, and a heat exchange unit 50 connected to the second flow path 220 and exchanges heat between the adsorbent 30 and the second fluid 202. The adsorbent 30 adsorbs the adsorption gas 41 in a state cooled by the second fluid 202, and cools the first fluid 201 by absorbing heat when releasing the adsorption gas 41.

[0118] According to the cooling system of the seventh aspect, by utilizing the property of the adsorbent 30 that releases the adsorbed adsorption gas 41 accompanied by endothermic heat, the first fluid 201 can be cooled by the heat absorbed when the adsorption gas 41 is released. This makes it possible to provide a new cooling system 200 that utilizes the adsorption of gas by the adsorbent 30 and the release of the adsorbed gas. Furthermore, because the adsorbent 30 for adsorbing the adsorption gas 41 is cooled by the second fluid 202 that cools the first fluid 201, there is no need to separately provide a cooling medium or cooling device for cooling the adsorbent 30. This makes it possible to improve the energy efficiency of the entire system that cools the first fluid 201, such as a raw gas liquefaction system.

[0119] A cooling system according to an eighth aspect is the cooling system according to the seventh aspect, in which the adsorption cooling apparatus 10E includes a plurality of cooling sections 12 (12-1, 12-2) each including an adsorbent 30 (30-1, 30-2), an adsorption gas supply section 40 (40-1, 40-2), and a heat exchange section 50 (50-1, 50-2), and further includes a flow path switching section 13 that switches the connection between the plurality of cooling sections 12 and the first flow path 210 and the second flow path 220 so as to connect at least one of the plurality of cooling sections 12 to the second flow path 220 and connect at least one other cooling section 12 to the first flow path 210. As a result, while one of the plurality of cooling sections 12, each equipped with an adsorbent 30, is adsorbing the adsorption gas 41 (i.e., regenerating the cooling capacity), the other of the plurality of cooling sections 12 can release the adsorption gas 41 (i.e., cooling the first fluid 201). Therefore, by using the flow path switching unit 13 to switch the connection so that each of the multiple cooling units 12 alternately adsorbs and releases the adsorption gas 41, the first fluid 201 can be continuously cooled by the multiple cooling units 12.

[0120] The adsorption cooling method according to the ninth aspect is an adsorption cooling method for cooling an object to be cooled by heat absorption when an adsorption gas 41 adsorbed in an adsorbent 30 is released, and includes the steps of: adsorbing the adsorption gas 41 into the adsorbent 30 in a state in which the adsorbent 30 is cooled by a liquefied gas 90; and releasing the adsorption gas 41 by causing the adsorbent 30 in a state in which the adsorption gas 41 has been adsorbed to absorb heat, thereby cooling the object to be cooled by the heat absorption of the adsorbent 30 when releasing the adsorption gas 41. This provides a new cooling method that utilizes the adsorption of gas by the adsorbent 30 and the release of the adsorbed gas. Furthermore, it is possible to improve the energy efficiency of the entire system that stores and supplies the liquefied gas 90.

[0121] 10, 10A, 10B, 10C, 10D, 10E Adsorption cooling device 12, 12-1, 12-2 Cooling section 13 Flow path switching section 20 Liquefied gas supply section 21 First insulating layer 22 Second insulating layer 26, 123, 123-1, 123-2 Flow path 30, 30-1, 30-2 Adsorbent 40, 40-1, 40-2 Adsorption gas supply section 41 Adsorption gas 50, 50-1, 50-2 Heat exchange section 90 Liquefied gas 90-1 First liquefied gas 90-2 Second liquefied gas 91 Boil-off gas 121 Liquefied gas tank 121-1 First tank 121-2 Second tank 122, 122-1 Reliquefaction device 122b Heat exhaust section 124 Radiation shield 200, 200A Cooling system 201 First fluid 202 Second fluid 210 First flow path 220 Second flow path 231, 232, 233 Heat exchanger

Claims

1. An adsorption cooling device comprising: an adsorbent which adsorbs an adsorption gas with the generation of heat and releases the adsorbed adsorption gas with the endothermic heat; an adsorption gas supply unit which supplies the adsorption gas to the adsorbent; a liquefied gas supply unit which supplies liquefied gas; and a heat exchange unit which exchanges heat between the adsorbent and the liquefied gas, wherein the adsorbent adsorbs the adsorption gas in a state cooled by the liquefied gas, and is configured to cool an object to be cooled by the absorption of heat when the adsorption gas is released.

2. The adsorption cooling device described in claim 1, wherein the liquefied gas supply unit has a multi-layer structure surrounded by a first insulation layer and a second insulation layer outside the first insulation layer, and is a liquefied gas tank that stores the liquefied gas in the space surrounded by the first insulation layer, and the adsorbent is disposed between the first insulation layer and the second insulation layer while being thermally bonded to the first insulation layer, and cools the first insulation layer as the cooling object.

3. The adsorption cooling device of claim 1, wherein the liquefied gas supply unit includes a liquefied gas tank for storing the liquefied gas, a re-liquefaction device for cooling and re-liquefying the boil-off gas in the liquefied gas tank, and a flow path connecting the liquefied gas tank and the heat exchange unit, and the adsorbent is thermally coupled to a heat exhaust section of the re-liquefaction device and is cooled as the object to be cooled.

4. The adsorption cooling device described in claim 3, wherein the liquefied gas tank includes a first tank for storing a first liquefied gas and a second tank for storing a second liquefied gas having a lower temperature than the first liquefied gas, the heat exchange section is connected to the second tank via the flow path, and the adsorbent is thermally coupled to the heat exhaust section of the reliquefaction device of the first tank and is cooled as the object to be cooled.

5. The adsorption cooling device described in claim 1, wherein the liquefied gas supply unit has a radiation shield that blocks radiant heat and includes a liquefied gas tank that stores the liquefied gas and a flow path that connects the liquefied gas tank and the heat exchange unit, and the adsorbent is thermally coupled to the radiation shield and is cooled as the object to be cooled.

6. The adsorption cooling device described in claim 5, wherein the liquefied gas tank includes a first tank for storing a first liquefied gas and a second tank for storing a second liquefied gas having a lower temperature than the first liquefied gas, the heat exchange unit is connected to the second tank via the flow path, and the adsorbent is thermally coupled to the radiation shield of the first tank and is cooled as the object to be cooled.

7. A cooling system comprising: a first flow path through which a first fluid flows; a second flow path through which a second fluid that cools the first fluid flows; a heat exchanger connected to the first and second flow paths; and an adsorption cooling device, wherein the adsorption cooling device comprises an adsorbent that is thermally coupled to the first flow path, adsorbs an adsorption gas with heat generation and releases the adsorbed adsorption gas with endothermic heat, an adsorption gas supply unit that supplies the adsorption gas to the adsorbent, and a heat exchange unit connected to the second flow path and exchanges heat between the adsorbent and the second fluid, wherein the adsorbent adsorbs the adsorption gas in a state cooled by the second fluid, and cools the first fluid by absorbing heat when releasing the adsorption gas.

8. The cooling system described in claim 7, wherein the adsorption cooling device comprises a plurality of cooling sections each including the adsorbent, the adsorption gas supply section, and the heat exchange section, and further comprises a flow path switching section which switches the connection between the plurality of cooling sections and the first flow path and the second flow path so as to connect at least one of the plurality of cooling sections to the second flow path and connect at least one other of the cooling sections to the first flow path.

9. An adsorption cooling method for cooling an object to be cooled by the absorption of heat generated when an adsorption gas adsorbed into an adsorbent is released, comprising the steps of: adsorbing the adsorption gas into the adsorbent in a state in which the adsorbent is cooled by liquefied gas; and releasing the adsorption gas by causing the adsorbent to absorb heat while the adsorbent has adsorbed the adsorption gas; and the adsorption cooling method cools the object to be cooled by the absorption of heat generated by the adsorbent when the adsorption gas is released.

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