Antenna module and method for manufacturing same

Abstract

This antenna module comprises an antenna substrate provided with at least one radiation electrode, and a high-frequency circuit module mounted on the antenna substrate. The high-frequency circuit module has a rectangular shape having two long sides and two short sides in a plan view, and has a first side surface and a second side surface corresponding to the two long sides, and a third side surface and a fourth side surface corresponding to the two short sides. The antenna substrate has a first substrate side surface, a second substrate side surface, a third substrate side surface, and a fourth substrate side surface. In the plan view, the first substrate side surface of the antenna substrate is positioned in the same plane as the first side surface of the high-frequency circuit module, or is positioned inward of the first side surface while overlapping the high-frequency circuit module. At least one of the second substrate side surface, the third substrate side surface, and the fourth substrate side surface of the antenna substrate is positioned in a region that does not overlap the high-frequency circuit module in the plan view.

Description

Antenna module and manufacturing method thereof

[0001] The present invention relates to an antenna module and a method for manufacturing the same.

[0002] Patent Documents 1 and 2 describe an antenna module (referred to as an electronic element module in Patent Document 1 and as an electronic device package in Patent Document 2) having an antenna substrate, a plurality of electronic components mounted on the antenna substrate, and a resin molded portion covering the electronic components. Patent Document 3 describes an antenna module (referred to as a receiver in Patent Document 3) in which an antenna substrate is stacked on a drive circuit substrate. Patent Document 4 describes an antenna module (referred to as a wireless module in Patent Document 4) in which an antenna package and a semiconductor package are stacked.

[0003] JP 2020-174172 A U.S. Patent Application Publication No. 2022 / 0037271 A U.S. Patent Application Publication No. 2020-36311 A U.S. Patent Application Publication No. 2019 / 0035749 A

[0004] In the antenna modules of Patent Documents 1 and 2, the outer shape of the antenna module is determined by cutting the outer periphery of the antenna substrate, so there is a possibility that the dimensional accuracy of the outer shape will decrease due to misalignment in the cutting process. Also, in Patent Documents 3 and 4, a drive circuit board or semiconductor package that has a larger area (width) than the antenna substrate in a plan view is mounted, making it difficult to reduce the size.

[0005] An object of the present invention is to provide an antenna module that can be made smaller and has improved dimensional accuracy in its outer shape, and a method for manufacturing the same.

[0006] An antenna module according to one aspect includes an antenna substrate having at least one radiation electrode and a high-frequency circuit module mounted on the antenna substrate, wherein the high-frequency circuit module is rectangular in shape having two long sides and two short sides in a planar view, and has first and second side faces corresponding to the two long sides, and third and fourth side faces corresponding to the two short sides, the antenna substrate having a first board side face, a second board side face opposite the first board side face, and a third and fourth board side face located between the first board side face and the second board side face, the first board side face of the antenna substrate being located on the same plane as the first side face of the high-frequency circuit module in the planar view, or overlapping with the high-frequency circuit module and located more inward than the first side face, and at least one of the second board side face, the third board side face, and the fourth board side face of the antenna substrate being located in an area that does not overlap with the high-frequency circuit module in the planar view.

[0007] A manufacturing method of an antenna module according to one embodiment includes an antenna substrate having at least one radiation electrode, a first substrate side surface, a second substrate side surface opposite the first substrate side surface, and a third substrate side surface and a fourth substrate side surface located between the first substrate side surface and the second substrate side surface, and a high-frequency circuit module mounted on the antenna substrate and having a rectangular shape with two long sides and two short sides in a planar view, the method comprising the steps of: cutting the antenna substrate along the first substrate side surface; and mounting the high-frequency circuit module on the antenna substrate so that the first substrate side surface after cutting is located in the same plane as a first side surface corresponding to the long sides of the high-frequency circuit module in a planar view, or overlaps the high-frequency circuit module and is located more inward than the first side surfaces.

[0008] According to the antenna module and the method of manufacturing the same of the present invention, it is possible to achieve miniaturization and improve the dimensional accuracy of the outer shape.

[0009] FIG. 1 is a perspective view showing an antenna module according to a first embodiment. FIG. 2 is a perspective view of the second main surface side of the antenna module according to the first embodiment. FIG. 3 is a plan view showing the antenna module according to the first embodiment. FIG. 4 is a cross-sectional view taken along line IV-IV′ of FIG. 3. FIG. 5 is an explanatory view for explaining a manufacturing method of the antenna module according to the first embodiment. FIG. 6 is a plan view showing an antenna module according to a first modified example. FIG. 7 is a cross-sectional view showing an antenna module according to a second modified example. FIG. 8 is a cross-sectional view showing an antenna module according to a third modified example. FIG. 9 is a cross-sectional view showing an antenna module according to a fourth modified example. FIG. 10 is a plan view showing an antenna module according to the second embodiment. FIG. 11 is a plan view showing an antenna module according to a fifth modified example. FIG. 12 is a cross-sectional view showing an antenna module according to the third embodiment. FIG. 13 is a cross-sectional view showing an antenna module according to a sixth modified example. FIG. 14 is a cross-sectional view showing an antenna module according to a seventh modified example. FIG. 15 is a cross-sectional view showing an antenna module according to an eighth modified example. FIG. 16 is a cross-sectional view showing an antenna module according to the fourth embodiment. FIG. 17 is a cross-sectional view showing an antenna module according to the fifth embodiment. Fig. 18 is a cross-sectional view showing an antenna module according to a ninth modified example. Fig. 19 is a cross-sectional view showing an antenna module according to a tenth modified example. Fig. 20 is a cross-sectional view showing an antenna module according to an eleventh modified example. Fig. 21 is a cross-sectional view showing an antenna module according to the sixth embodiment. Fig. 22 is a cross-sectional view showing an antenna module according to a twelfth modified example. Fig. 23 is a cross-sectional view showing an antenna module according to the seventh embodiment. Fig. 24 is a cross-sectional view of the antenna module according to the seventh embodiment when cut along the Y direction. Fig. 25 is a cross-sectional view of the antenna module according to a thirteenth modified example when cut along the Y direction. Fig. 26 is a cross-sectional view of the antenna module according to a fourteenth modified example when cut along the Y direction. Fig. 27 is a cross-sectional view of the antenna module according to a fifteenth modified example when cut along the Y direction.

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. Note that the present disclosure is not limited to these embodiments. Note that each embodiment described in the present disclosure is illustrative, and partial substitution or combination of configurations between different embodiments is possible. In modified examples and the second and subsequent embodiments, descriptions of matters common to the first embodiment will be omitted, and only differences will be described. In particular, similar effects resulting from similar configurations will not be mentioned in each embodiment.

[0011] (First embodiment) Fig. 1 is a perspective view showing an antenna module according to a first embodiment. Fig. 2 is a perspective view of the second main surface side of the antenna module according to the first embodiment. Fig. 3 is a plan view showing the antenna module according to the first embodiment. Fig. 4 is a cross-sectional view taken along line IV-IV' in Fig. 3.

[0012] 1 to 4 , the antenna module 10 includes an antenna substrate 20, a high-frequency circuit module 30, and a connector 40. The antenna module 10 is mounted on electronic devices such as mobile phones, smartphones, tablet devices, and other portable terminals, and personal computers with communication functions. The antenna module 10 is configured to be compatible with, for example, the 4G (fourth generation mobile communication) standard, the 5G (fifth generation mobile communication) standard, and the like. However, the antenna module 10 is not limited to this, and may be configured to be compatible with other communication standards.

[0013] In the following description, the direction perpendicular to the first main surface 20a of the antenna substrate 20 is referred to as the Z direction, the direction perpendicular to the Z direction is referred to as the X direction, and the direction perpendicular to the Z direction and the X direction is referred to as the Y direction. The X direction and the Y direction are both directions parallel to the first main surface 20a of the antenna substrate 20. In the following description, a plan view refers to the positional relationship when viewed from the direction perpendicular to the first main surface 20a of the antenna substrate 20 (the Z direction).

[0014] The antenna substrate 20 is a multilayer substrate in which multiple dielectric layers are stacked, and has a rectangular shape in a plan view. The antenna substrate 20 is a flat plate having a first main surface 20 a and a second main surface 20 b opposite to the first main surface 20 a.

[0015] The material for the dielectric layer of the antenna substrate 20 may be, for example, one or more of low temperature co-fired ceramics (LTCC), glass epoxy resin, liquid crystal polymer (LCP), fluororesin, polyimide resin, etc. Among these materials, LTCC has the highest dielectric constant, followed by glass epoxy resin, liquid crystal polymer, and fluororesin in that order. The antenna substrate 20 may be a rigid substrate or a flexible substrate having flexibility.

[0016] As shown in Fig. 4, the antenna substrate 20 is provided with a radiation electrode 21, a ground electrode 22, and wiring 23. The ground electrode 22 and wiring 23 are provided on an inner layer of the antenna substrate 20. As shown in Fig. 2, a plurality of radiation electrodes 21 are provided on the second main surface 20b of the antenna substrate 20 and are arranged in the Y direction. The plurality of radiation electrodes 21 are configured as an array antenna. Each of the plurality of radiation electrodes 21 has a rectangular shape.

[0017] The electrodes (radiating electrode 21, ground electrode 22, and wiring 23) provided on the surface layer and inner layer of the antenna substrate 20 are located inside the substrate side surfaces (first substrate side surface 20s1 and second substrate side surface 20s2) of the antenna substrate 20. In other words, the end surface 21e of the radiating electrode 21, the end surface 22e of the ground electrode 22, and the end surface 23e of the wiring 23 are covered with the dielectric layer of the antenna substrate 20. This makes it possible to suppress oxidation of at least the ground electrode 22 and the wiring 23, and to increase the adhesive strength between the layers of the antenna substrate 20.

[0018] The radiating electrode 21, the ground electrode 22, and the wiring 23 are made of a conductive metal material such as aluminum (Al), copper (Cu), gold (Au), or silver (Ag), or an alloy containing at least one of these materials.

[0019] The radiation electrode 21 is connected to an RFIC (Radio Frequency Integrated Circuit) 31 included in the high-frequency circuit module 30 through wiring and vias (not shown) provided on an inner layer of the antenna substrate 20. This allows a high-frequency signal to be supplied from the RFIC 31 to the feeding point of the radiation electrode 21, causing the radiation electrode 21 to emit radio waves.

[0020] 1 and 3, the high-frequency circuit module 30 and the connector 40 are provided on the first main surface 20a of the antenna substrate 20. The high-frequency circuit module 30 and the connector 40 are disposed adjacent to each other in the Y direction.

[0021] As shown in FIG. 4 , the radio-frequency circuit module 30 includes an RFIC 31 (radio-frequency circuit), a molded resin 32, and a circuit board 33. The radio-frequency circuit module 30 is a SiP (System In Package) module. The circuit board 33 is a multilayer board in which multiple dielectric layers are stacked. The dielectric layers of the circuit board 33 may be made of the same material as the antenna substrate 20 described above, or may be made of a different material from the antenna substrate 20. The circuit board 33 is mounted on the first main surface 20a of the antenna substrate 20 via connection terminals 33a (bumps). The circuit board 33 also has wiring 33b provided on an inner layer. Further wiring (not shown) may be provided on the surface layer of the circuit board 33.

[0022] The RFIC 31 is mounted on the circuit board 33 by connection terminals 31 a (bumps). A molded resin 32 is provided on the circuit board 33, covering the RFIC 31. Although the configuration of the high-frequency circuit module 30 is schematically shown in FIGS. 1 to 4 , the high-frequency circuit module 30 may include, in addition to the RFIC 31, other ICs such as a power supply IC 35 and a plurality of chip components 36 (see FIG. 8 ) such as resistors, capacitors, and inductors required for the operation of the RFIC 31 as a high-frequency circuit. The high-frequency circuit module 30 is mounted on the antenna substrate 20 after the circuit board 33, the high-frequency circuit including the RFIC 31, and the molded resin 32 are integrally packaged.

[0023] The connector 40 is, for example, a multi-pole connector, and is connected to an external electronic device that mounts the antenna module 10. The connector 40 is not limited to a multi-pole connector, and may be of another type, such as a coaxial connector.

[0024] In this embodiment, the connector 40 is provided on the same first main surface 20a as the high-frequency circuit module 30. In other words, the high-frequency circuit module 30 and the connector 40 are provided on the opposite side to the second main surface 20b on which the radiating electrode 21 is provided, so that the electrode size of the radiating electrode 21 can be ensured.

[0025] Next, the positional relationship between the antenna substrate 20 and the high-frequency circuit module 30 will be described. As shown in Fig. 3, the high-frequency circuit module 30 has a rectangular shape with two long sides and two short sides in a plan view. The width of the high-frequency circuit module 30 in the X direction is smaller than its length in the Y direction. The high-frequency circuit module 30 has a first side surface 30s1 and a second side surface 30s2 corresponding to the two long sides, and a third side surface 30s3 and a fourth side surface 30s4 corresponding to the two short sides.

[0026] The first side surface 30s1 of the high-frequency circuit module 30 extends in the Y direction. The second side surface 30s2 extends in the Y direction and is located on the opposite side of the first side surface 30s1 in the X direction. The third side surface 30s3 and the fourth side surface 30s4 are located between the first side surface 30s1 and the second side surface 30s2. The third side surface 30s3 extends in the X direction. The fourth side surface 30s4 extends in the X direction and is located on the opposite side of the third side surface 30s3 in the Y direction.

[0027] The antenna substrate 20 has a rectangular shape with two long sides and two short sides in a plan view. The width of the antenna substrate 20 in the X direction is smaller than the length in the Y direction. The antenna substrate 20 has a first substrate side surface 20s1 and a second substrate side surface 20s2 corresponding to the two long sides, and a third substrate side surface 20s3 and a fourth substrate side surface 20s4 corresponding to the two short sides.

[0028] The first substrate side surface 20s1 of the antenna substrate 20 extends in the Y direction. The second substrate side surface 20s2 extends in the Y direction and is located on the opposite side of the first substrate side surface 20s1 in the X direction. The third substrate side surface 20s3 and the fourth substrate side surface 20s4 are disposed between the first substrate side surface 20s1 and the second substrate side surface 20s2. The third substrate side surface 20s3 extends in the X direction. The fourth substrate side surface 20s4 extends in the X direction and is located on the opposite side of the third substrate side surface 20s3 in the Y direction.

[0029] The first and second substrate side surfaces 20s1 and 20s2 of the antenna substrate 20 are respectively provided along two long sides (the first and second side surfaces 30s1 and 30s2) of the high-frequency circuit module 30. The third and fourth substrate side surfaces 20s3 and 20s4 of the antenna substrate 20 are respectively provided along two short sides (the third and fourth side surfaces 30s3 and 30s4) of the high-frequency circuit module 30.

[0030] In the following description, when it is not necessary to distinguish between the first substrate side surface 20s1, the second substrate side surface 20s2, the third substrate side surface 20s3, and the fourth substrate side surface 20s4 of the antenna substrate 20, they will simply be referred to as the substrate side surfaces of the antenna substrate 20. Furthermore, when it is not necessary to distinguish between the first side surface 30s1, the second side surface 30s2, the third side surface 30s3, and the fourth side surface 30s4 of the high-frequency circuit module 30, they will simply be referred to as the side surfaces of the high-frequency circuit module 30.

[0031] 3 and 4 , the first substrate side surface 20s1 of the antenna substrate 20 is located on the same plane as the first side surface 30s1 of the high-frequency circuit module 30 in a plan view. The second substrate side surface 20s2 on the opposite side of the first substrate side surface 20s1 of the antenna substrate 20 is provided in an area that does not overlap with the high-frequency circuit module 30, and is located outside the second side surface 30s2 of the high-frequency circuit module 30 in the X direction.

[0032] 3 , among the substrate side surfaces of the antenna substrate 20, the third substrate side surface 20s3 and the fourth substrate side surface 20s4 are provided in an area that does not overlap with the high-frequency circuit module 30 in a plan view, and are located outside in the Y direction the third side surface 30s3 and the fourth side surface 30s4 of the high-frequency circuit module 30. In other words, the second side surface 30s2, the third side surface 30s3, and the fourth side surface 30s4 of the high-frequency circuit module 30 are located in an area that overlaps with the antenna substrate 20 in a plan view.

[0033] As described above, the first substrate side surface 20s1 of the antenna substrate 20 is located on the same plane as the first side surface 30s1 of the high-frequency circuit module 30. As a result, in the external shape in a plan view, the dimensional accuracy of one long side of the antenna module 10 is determined by the first side surface 30s1 of the high-frequency circuit module 30. Furthermore, the dimensional accuracy of the other sides of the antenna module 10 is determined by the second substrate side surface 20s2, the third substrate side surface 20s3, and the fourth substrate side surface 20s4 of the antenna substrate 20. As a result, even if the first substrate side surface 20s1 is misaligned when the external shape of the antenna substrate 20 is cut, this will not be reflected in the external shape of the antenna module 10, and the dimensional accuracy of at least one long side of the antenna module 10 can be improved.

[0034] Therefore, the antenna module 10 can improve the dimensional accuracy in the width direction (X direction) compared to when the first side surface 30s1 and the second side surface 30s2 of the high-frequency circuit module 30 are positioned inside the substrate side surfaces of the antenna substrate 20.

[0035] Furthermore, among the board side surfaces of the antenna substrate 20, the second board side surface 20s2, the third board side surface 20s3, and the fourth board side surface 20s4 are located outside the high-frequency circuit module 30, so that space for arranging the connector 40 can be secured on the first main surface 20a of the antenna substrate 20. As a result, the area of ​​the radiating electrode 21 can be made larger than when the connector 40 is provided on the second main surface 20b. Therefore, the antenna module 10 can improve the antenna frequency characteristics while miniaturizing the antenna substrate 20. Furthermore, in the antenna module 10, the external shape (area) of the high-frequency circuit module 30 is smaller than that of the antenna substrate 20. Therefore, the antenna module 10 can be made more compact than a configuration in which the external shape (area) of the high-frequency circuit module 30 is larger than that of the antenna substrate 20, i.e., a configuration in which the first side surface 30s1 and the second side surface 30s2 of the high-frequency circuit module 30 are located outside the board side surfaces of the antenna substrate 20.

[0036] As described above, the antenna module 10 can be made smaller and the dimensional accuracy of the outer shape can be improved.

[0037] 1 to 4 are merely examples and can be modified as appropriate. For example, the long side of the antenna substrate 20 is approximately four to five times longer than the short side, but the ratio of the long side to the short side can be modified as appropriate. The ratio of the long side to the short side of the high-frequency circuit module 30 can also be modified as appropriate.

[0038] (Method of Manufacturing Antenna Module) Figure 5 is an explanatory diagram for explaining a method of manufacturing the antenna module according to the first embodiment. As shown in Figure 5, the antenna substrate 20 is prepared, and the antenna substrate 20 is cut along a first substrate side surface 20s1 of its substrate side surfaces (step ST1). Specifically, one of the two long sides of the antenna substrate 20 is cut along a cutting line CL1 by laser processing or mechanical processing using a dicer or the like. Note that, although not shown in Figure 5, the radiating electrode 21, the ground electrode 22, and the wiring 23 (see Figure 4) are formed in advance on the surface and inner layers of the antenna substrate 20.

[0039] Next, the radio-frequency circuit module 30 is mounted on the antenna substrate 20 so that the first substrate side surface 20s1 after cutting of the antenna substrate 20 is located on the same plane as the first side surface 30s1 corresponding to the long side of the radio-frequency circuit module 30 in a plan view (step ST2). Furthermore, the unprocessed substrate side surfaces of the antenna substrate 20 (the second substrate side surface 20s2, the third substrate side surface 20s3, and the fourth substrate side surface 20s4) do not overlap with the radio-frequency circuit module 30 and are located outside the second side surface 30s2, the third side surface 30s3, and the fourth side surface 30s4 of the radio-frequency circuit module 30.

[0040] In step ST2, the connector 40 is mounted on the first main surface 20a of the antenna substrate 20. That is, the connector 40 is mounted on the same surface of the antenna substrate 20 as the high-frequency circuit module 30.

[0041] Next, the antenna substrate 20 on which the high-frequency circuit module 30 is mounted is cut along the second substrate side surface 20s2, the third substrate side surface 20s3, and the fourth substrate side surface 20s4 (step ST3). Specifically, three sides (one long side and two short sides) of the antenna substrate 20 are cut along the cutting line CL2 by laser processing or mechanical processing using a dicer or the like.

[0042] In step ST3, cutting is performed along three sides of the antenna substrate 20, but this is not limiting. Depending on the dimensional accuracy required for the antenna module 10, cutting may be performed along at least one of the second substrate side surface 20s2, the third substrate side surface 20s3, and the fourth substrate side surface 20s4.

[0043] Through the above steps, the antenna module 10 can be manufactured, in which the outer shape of the antenna substrate 20 has been cut (step ST4). According to the manufacturing method for the antenna module 10 of this embodiment, one of the long sides of the antenna substrate 20 (the first substrate side surface 20s1) is cut before the step of mounting the high-frequency circuit module 30. After the first substrate side surface 20s1 has been cut, the high-frequency circuit module 30 is mounted. As a result, the outer shape corresponding to at least one long side of the antenna module 10 is defined by the first side surface 30s1 of the high-frequency circuit module 30. This allows for improved dimensional accuracy of the antenna module 10, even if misalignment occurs during the cutting of the first substrate side surface 20s1.

[0044] 5 is merely a schematic representation and can be modified as appropriate. For example, in step ST2, the first substrate side surface 20s1 after cutting the antenna substrate 20 does not necessarily have to be flush with the first side surface 30s1 of the high-frequency circuit module 30, and may be located more inward than the first side surface 30s1.

[0045] 6 is a plan view showing an antenna module according to a first modification. As shown in Fig. 6, the antenna module 10A according to the first modification is different from the first embodiment described above in that the first substrate side surface 20s1 of the antenna substrate 20 overlaps with the high-frequency circuit module 30 and is positioned more inward than the first side surface 30s1 in plan view.

[0046] In other words, the high-frequency circuit module 30 is mounted on the antenna substrate 20 so that the first side surface 30s1 of the high-frequency circuit module 30 does not overlap the antenna substrate 20 and protrudes outward beyond the first substrate side surface 20s1.

[0047] In this modification, in the external shape in a plan view, the dimensional accuracy of one long side of the antenna module 10A is determined only by the first side surface 30s1 of the high-frequency circuit module 30. Therefore, even if there is a large dimensional error in cutting the first substrate side surface 20s1 of the antenna substrate 20, the dimensional accuracy of the antenna module 10A on which the high-frequency circuit module 30 is mounted can be improved.

[0048] 7 is a cross-sectional view showing an antenna module according to a second modification. As shown in Fig. 7, the antenna module 10B according to the second modification is different from the first embodiment and the first modification in that the high-frequency circuit module 30A includes a shield 34.

[0049] The high-frequency circuit module 30A includes a circuit board 33, an RFIC 31 (high-frequency circuit) provided on the circuit board 33, a molded resin 32 that covers the RFIC 31, and a shield 34 that covers the top and side surfaces of the molded resin 32. The shield 34 is formed of a conductive material, such as a metal material such as aluminum (Al), copper (Cu), gold (Au), or silver (Ag), or an alloy containing these materials.

[0050] The shield 34 is provided on the top and side surfaces of the high-frequency circuit module 30. More specifically, the shield 34 is provided to cover the top and side surfaces of the molded resin 32 and also the side surfaces of the circuit board 33. The shield 34 is not provided on the antenna substrate 20. In this modification, the side surfaces of the shield 34 form the side surfaces (first side surface 30s1, second side surface 30s2, third side surface 30s3, and fourth side surface 30s4) of the high-frequency circuit module 30A. The shield 34 is also provided on the third side surface 30s3 and the fourth side surface 30s4, which are not shown in FIG. 7 .

[0051] As a result, in the second modified example, the shield 34 can suppress noise radiated from the RFIC 31, the wiring 33b, etc. inside the high-frequency circuit module 30A. Alternatively, in the second modified example, the shield 34 can suppress noise interference between the high-frequency circuit module 30A and the radiation electrode 21 of the antenna substrate 20.

[0052] 8 is a cross-sectional view showing an antenna module according to a third modification. As shown in Fig. 8, the antenna module 10C according to the third modification is different from the first embodiment and the modifications described above in that the high-frequency circuit module 30B has a power supply IC 35 and chip components 36 in addition to the RFIC 31.

[0053] The power supply system IC 35 includes, for example, a power amplifier and supplies a power supply voltage to the RFIC 31. The chip components 36 include, for example, resistors, capacitors, inductors, and the like. While one power supply system IC 35 and one chip component 36 are illustrated in FIG. 8 , a plurality of other ICs and a plurality of chip components may be provided. Alternatively, the high-frequency circuit module 30B is not limited to a configuration including both the power supply system IC 35 and the chip component 36, and may include, in addition to the RFIC 31, at least one of another IC different from the RFIC 31 and the chip component 36.

[0054] The power supply IC 35 and the chip components 36 are mounted via connection terminals 35a and 36a, respectively, on a common circuit board 33 together with the RFIC 31. A mold resin 32 and a shield 34 are provided to cover the RFIC 31, the power supply IC 35, and the chip components 36.

[0055] In this modification, a plurality of components including the RFIC 31, the power supply IC 35, and the chip components 36 are integrally packaged and mounted on the antenna substrate 20. Therefore, compared to a configuration in which the RFIC 31, the power supply IC 35, and the chip components 36 are individually mounted on the antenna substrate 20, the antenna module 10C can be made smaller.

[0056] 9 is a cross-sectional view showing an antenna module according to a fourth modification. As shown in FIG. 9, the antenna module 10D according to the fourth modification is different from the first embodiment and the modifications described above in that the high-frequency circuit module 30C does not have a circuit board 33.

[0057] The high-frequency circuit module 30C includes a high-frequency circuit including an RFIC 31, a power supply IC 35, and chip components 36, a molded resin 32, and a shield 34. The molded resin 32 covers the high-frequency circuit (the RFIC 31, the power supply IC 35, and the chip components 36). The shield 34 covers the top and side surfaces of the molded resin 32.

[0058] The high-frequency circuit module 30C is a so-called interposerless module. In the high-frequency circuit module 30C, the high-frequency circuit (RFIC 31, power supply IC 35, and chip components 36), molded resin 32, and shield 34 are integrally packaged and mounted on the antenna substrate 20. That is, the RFIC 31, power supply IC 35, and chip components 36 are directly mounted on the first main surface 20a of the antenna substrate 20 via connection terminals 31a, 35a, and 36a, respectively. Although not shown in FIG. 9 , connection electrodes corresponding to the positions (arrangement pitch) of the connection terminals 31a, 35a, and 36a are provided on the first main surface 20a of the antenna substrate 20.

[0059] In the fourth modification, the high-frequency circuit module 30C does not have the circuit board 33, so that the high-frequency circuit module 30C can be made smaller and thinner than in the first embodiment and the modifications described above.

[0060] In the first to fourth modified examples described above, various modified examples of the high-frequency circuit modules 30, 30A, 30B, and 30C have been described. These configurations can be combined as appropriate. For example, the high-frequency circuit modules 30B and 30C (see FIGS. 8 and 9 ) may be configured without the shield 34. Furthermore, in the embodiment and each modified example described below, any one of the high-frequency circuit modules 30, 30A, 30B, and 30C is illustrated as an example, but the present invention is not limited to this, and high-frequency circuit modules 30, 30A, 30B, and 30C with other configurations may also be applied.

[0061] Second Embodiment Fig. 10 is a plan view showing an antenna module according to a second embodiment. As shown in Fig. 10, the antenna module 10E according to the second embodiment differs from the first embodiment and the modifications described above in that it has an antenna element 41 in addition to the radiation electrode 21.

[0062] The antenna element 41 is a radiation electrode different from the radiation electrode 21 (see FIG. 2 ), and is provided on the first main surface 20a of the antenna substrate 20, opposite the radiation electrode 21. The antenna element 41 has a radiation pattern with directivity in a direction parallel to the first main surface 20a of the antenna substrate 20. The antenna element 41 is, for example, a dipole antenna. However, the antenna element 41 is not limited to this, and may have another structure as long as it has directivity in the horizontal direction.

[0063] The antenna substrate 20 has a larger width in the X direction than the first embodiment and each of the modified examples described above. The multiple antenna elements 41 are provided in an area of ​​the antenna substrate 20 that does not overlap with the high-frequency circuit module 30 and the connector 40. The multiple antenna elements 41 are arranged on the first main surface 20a of the antenna substrate 20 in areas along the second substrate side surface 20s2, the third substrate side surface 20s3, and the fourth substrate side surface 20s4, respectively.

[0064] The antenna module 10E of this embodiment has a radiation electrode 21 and an antenna element 41, and therefore forms a radiation pattern in the horizontal direction. As a result, this embodiment can increase the coverage of the radiation pattern of the radiation electrode 21 and the antenna element 41 compared to the first embodiment and each of the modified examples described above.

[0065] The number and arrangement pattern of the multiple antenna elements 41 are merely examples, and can be changed as appropriate depending on the radiation pattern required for the antenna module 10E.

[0066] 11 is a plan view showing an antenna module according to a fifth modification. As shown in Fig. 11, the antenna module 10F according to the fifth modification is different from the second embodiment in that the plurality of antenna elements 41 are arranged in a region along the second substrate side surface 20s2 on the first main surface 20a of the antenna substrate 20, and are not provided in the regions along the third substrate side surface 20s3 and the fourth substrate side surface 20s4.

[0067] In the fifth modified example, the width of the antenna substrate 20 in the X direction is smaller than that of the second embodiment described above. Furthermore, the first substrate side surface 20s1 of the antenna substrate 20 is provided so as to overlap with the high-frequency circuit module 30A in a plan view, and is located more inward than the first substrate side surface 30s1 of the high-frequency circuit module 30A. In other words, the first side surface 30s1 of the high-frequency circuit module 30A does not overlap with the antenna substrate 20 in a plan view, and is located more outward than the first substrate side surface 20s1 of the antenna substrate 20. The multiple antenna elements 41 are disposed in the region between the second side surface 30s2 of the high-frequency circuit module 30A and the second substrate side surface 20s2 of the antenna substrate 20.

[0068] As a result, in this modification, it is possible to ensure an area on the first main surface 20a of the antenna substrate 20 for arranging a plurality of antenna elements 41 while also achieving miniaturization of the antenna module 10F.

[0069] 12 is a cross-sectional view showing an antenna module according to a third embodiment. As shown in Fig. 12, the antenna module 10G according to the third embodiment is different from the above-described embodiments and modifications in that the electrodes (the radiation electrode 21, the ground electrode 22, and the wiring 23) provided on the surface and inner layers of the antenna substrate 20 are exposed from the side surface of the antenna substrate 20.

[0070] More specifically, the end face 21 e of the radiation electrode 21 , the end face 22 e of the ground electrode 22 , and the end face 23 e of the wiring 23 are located on the same plane as the first substrate side face 20 s 1 and the second substrate side face 20 s 2 of the antenna substrate 20 .

[0071] In this modification, it is possible to ensure the areas of the radiation electrode 21 and the ground electrode 22 while miniaturizing the antenna substrate 20. Therefore, the antenna module 10G according to the third embodiment can improve the antenna gain, frequency characteristics, and bandwidth.

[0072] (Sixth Modification) Fig. 13 is a cross-sectional view showing an antenna module according to a sixth modification. As shown in Fig. 13, the antenna module 10H according to the sixth modification is different from the third embodiment in that the ground electrode 22 provided on the inner layer of the antenna substrate 20 is exposed from the side surface of the antenna substrate 20, and the radiation electrode 21 and the wiring 23 are located inside the side surface of the antenna substrate 20.

[0073] More specifically, the end face 22e of the ground electrode 22 is located on the same plane as the first substrate side face 20s1 and the second substrate side face 20s2 of the antenna substrate 20. In addition, the end face 21e of the radiation electrode 21 and the end face 23e of the wiring 23 are located inside the first substrate side face 20s1 and the second substrate side face 20s2 of the antenna substrate 20.

[0074] In this modification, compared to the third embodiment described above, it is possible to ensure a larger area for the ground electrode 22 relative to the radiation electrode 21. A fringe electric field is generated from the end surface 21e of the radiation electrode 21 toward the end surface 22e of the ground electrode 22, and this fringe electric field radiates radio waves in the normal direction of the radiation electrode 21. Therefore, the antenna module 10H according to the sixth modification can improve the antenna gain.

[0075] 14 is a cross-sectional view showing an antenna module according to a seventh modification. As shown in Fig. 14, the antenna module 10I according to the seventh modification is different from the third embodiment and the sixth modification in that the radiation electrode 21 and the wiring 23 are exposed from the side surface of the antenna substrate 20, and the ground electrode 22 provided on the inner layer of the antenna substrate 20 is located more inward than the side surface of the antenna substrate 20.

[0076] More specifically, the end face 21e of the radiation electrode 21 and the end face 23e of the wiring 23 are located on the same plane as the first substrate side face 20s1 and the second substrate side face 20s2 of the antenna substrate 20. In addition, the end face 22e of the ground electrode 22 is located inside the first substrate side face 20s1 and the second substrate side face 20s2 of the antenna substrate 20.

[0077] In this modification, compared to the third embodiment and the sixth modification described above, the area of ​​the radiation electrode 21 can be secured to be larger relative to the ground electrode 22. Therefore, the antenna module 10I according to the seventh modification can improve the antenna frequency characteristics while miniaturizing the antenna substrate 20. In particular, the larger area of ​​the radiation electrode 21 can improve the antenna frequency characteristics on the low frequency side.

[0078] (Eighth Modification) Fig. 15 is a cross-sectional view showing an antenna module according to an eighth modification. As shown in Fig. 14, the antenna module 10J according to the eighth modification is different from the third embodiment, the sixth modification, and the seventh modification in that the wiring 23 provided on the inner layer of the antenna substrate 20 is connected to the ground electrode 22 through a via 24. In addition, in the eighth modification, the ground electrode 22 and the wiring 23 provided on the inner layer of the antenna substrate 20 are exposed from the substrate side surface of the antenna substrate 20, and the radiating electrode 21 is located inside the substrate side surface of the antenna substrate 20.

[0079] More specifically, the end face 22e of the ground electrode 22 and the end face 23e of the wiring 23 are located on the same plane as the first substrate side face 20s1 and the second substrate side face 20s2 of the antenna substrate 20. In addition, the end face 21e of the radiation electrode 21 is located inside the first substrate side face 20s1 and the second substrate side face 20s2 of the antenna substrate 20.

[0080] In this modification, the wiring 23 is connected to the ground electrode 22, unlike the third embodiment, the sixth modification, and the seventh modification. Furthermore, the wiring 23 is located in a layer between the radiation electrode 21 and the ground electrode 22 in the Z direction. Therefore, the distance between the radiation electrode 21 and the ground potential (the wiring 23) is shorter than the distance between the radiation electrode 21 and the ground potential (the ground electrode 22) in a configuration in which the wiring 23 is not connected to the ground electrode 22. This allows an electric field to be preferentially generated between the radiation electrode 21 and the wiring 23, reducing the occurrence of a fringe electric field that wraps around the side surface of the antenna substrate 20 from the end surface 21 e of the radiation electrode 21 toward the end surface 22 e of the ground electrode 22. This allows the antenna module 10J according to the eighth modification to achieve an improved antenna bandwidth while miniaturizing the antenna substrate 20.

[0081] 16 is a cross-sectional view showing an antenna module according to a fourth embodiment. As shown in Fig. 16, the antenna module 10K according to the fourth embodiment is different from the above-described embodiments and modifications in that the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20 are located on the same plane as the first side surface 30s1 and the second side surface 30s2 of the high-frequency circuit module 30A, respectively, in a plan view.

[0082] Although not shown in Figure 16, the third substrate side surface 20s3 and the fourth substrate side surface 20s4 of the antenna substrate 20 are located outside the third side surface 30s3 and the fourth side surface 30s4 (see Figure 3) of the high-frequency circuit module 30A in a planar view.

[0083] In this embodiment, the dimensional accuracy of the two long sides of the outer shape of the antenna module 10K in a planar view is determined by the first side surface 30s1 and the second side surface 30s2 of the high-frequency circuit module 30A. As a result, even if misalignment occurs between the first substrate side surface 20s1 and the second substrate side surface 20s2 when the outer shape of the antenna substrate 20 is cut and processed, this is not reflected in the outer shape of the two long sides of the antenna module 10K. Therefore, the antenna module 10K can be made smaller in the X direction and have improved dimensional accuracy.

[0084] In the fourth embodiment, the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20 may be located inside the first side surface 30s1 and the second side surface 30s2 of the high-frequency circuit module 30A in a plan view.

[0085] 17 is a cross-sectional view showing an antenna module according to a fifth embodiment. As shown in Fig. 17, the antenna module 10L according to the fifth embodiment is different from the above-described embodiments and modifications in that it has a resin layer 50 provided between the antenna substrate 20 and the high-frequency circuit module 30A.

[0086] More specifically, the resin layer 50 is provided by filling the space between the first main surface 20a of the antenna substrate 20 and the lower surface (the surface facing the first main surface 20a) of the circuit board 33. The resin layer 50 can improve the connection strength between the antenna substrate 20 and the high-frequency circuit module 30A.

[0087] The antenna substrate 20 and the high-frequency circuit module 30A of this embodiment have the same configuration as those of the fourth embodiment. That is, the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20 are located on the same plane as the first substrate side surface 30s1 and the second substrate side surface 30s2 of the high-frequency circuit module 30A, respectively, in a plan view. Therefore, a so-called fillet is not formed in the resin layer 50. That is, the end faces of the resin layer 50 are located on the same plane as the first substrate side surface 20s1 and the second substrate side surface 20s2, and are formed without protruding beyond the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20. This allows the connection strength to be improved without increasing the external shape of the antenna module 10L, even when the resin layer 50 is provided.

[0088] The resin layer 50 of this embodiment can be applied to the first to third embodiments and their modifications described above.

[0089] 18 is a cross-sectional view showing an antenna module according to a ninth modification. As shown in Fig. 18, the antenna module 10M according to the ninth modification is different from the fifth embodiment in that a resin layer 50A is provided between the antenna substrate 20 and the high-frequency circuit module 30A and covers the substrate side surface of the antenna substrate 20.

[0090] More specifically, the resin layer 50A fills the space between the first main surface 20a of the antenna substrate 20 and the lower surface (the surface facing the first main surface 20a) of the circuit board 33, and is provided so as to cover the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20. The resin layer 50A may also cover the third substrate side surface 20s3 and the fourth substrate side surface 20s4 of the antenna substrate 20, which are not shown in FIG.

[0091] The resin layer 50A can improve the connection strength between the antenna substrate 20 and the high-frequency circuit module 30A. Furthermore, the end face 21e of the radiating electrode 21, the end face 22e of the ground electrode 22, and the end face 23e of the wiring 23, which are exposed from the side surface of the antenna substrate 20, are covered with the resin layer 50A. In this modification, the resin layer 50A can suppress oxidation of the radiating electrode 21, the ground electrode 22, and the wiring 23, which are exposed from the side surface of the antenna substrate 20.

[0092] The resin layer 50A of this modified example can be applied to the first to third embodiments and the modified examples described above.

[0093] (Tenth Modification) Fig. 19 is a cross-sectional view showing an antenna module according to Modification 10. As shown in Fig. 19, the antenna module 10N according to Modification 10 differs from the above-described embodiments and modifications in that it has an insulating layer 51 provided on the substrate side of the antenna substrate 20 and made of a material different from that of the antenna substrate 20.

[0094] The insulating layer 51 is provided to cover the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20. Note that the insulating layer 51 may also cover the third substrate side surface 20s3 and the fourth substrate side surface 20s4 of the antenna substrate 20, which are not shown in FIG.

[0095] The end face 21 e of the radiating electrode 21, the end face 22 e of the ground electrode 22, and the end face 23 e of the wiring 23 that are exposed from the substrate side face of the antenna substrate 20 are covered with the insulating layer 51. Therefore, in this modification, the insulating layer 51 can suppress oxidation of the radiating electrode 21, the ground electrode 22, and the wiring 23 that are exposed from the substrate side face of the antenna substrate 20.

[0096] The insulating layer 51 of this modification can be applied to the first to third embodiments and their modifications described above. The insulating layer 51 of this modification can also be combined with the resin layers 50 and 50A of the fifth embodiment and the ninth modification.

[0097] 20 is a cross-sectional view showing an antenna module according to Modification 11. As shown in Fig. 20, the antenna module 10O according to Modification 11 differs from the above-described embodiments and modifications in that it has a plating layer 52 that covers the electrodes (the radiation electrode 21, the ground electrode 22, and the wiring 23) exposed from the side surface of the antenna substrate 20.

[0098] The plating layer 52 is provided to cover the end face 21 e of the radiation electrode 21, the end face 22 e of the ground electrode 22, and the end face 23 e of the wiring 23, which are exposed from the side surface of the antenna substrate 20. In this modification, the plating layer 52 can suppress oxidation of the radiation electrode 21, the ground electrode 22, and the wiring 23, which are exposed from the side surface of the antenna substrate 20.

[0099] The plated layer 52 of this modification can be combined with the third embodiment (see FIG. 12 ) and the sixth to eighth modifications (see FIG. 15 ). In this case, the plated layer 52 is formed on the end surfaces of the electrodes (the radiation electrode 21, the ground electrode 22, and the wiring 23) provided on the antenna substrate 20, the electrodes being exposed from the side surfaces of the antenna substrate 20. The plated layer 52 of this modification can also be combined with one or more of the resin layers 50, 50A, and insulating layers 51 shown in the fifth embodiment, the ninth modification, and the tenth modification.

[0100] Sixth Embodiment Fig. 21 is a cross-sectional view showing an antenna module according to a sixth embodiment. As shown in Fig. 21, the antenna module 10P according to the sixth embodiment is different from the above-described embodiments and modifications in that the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20 are tapered.

[0101] In the sixth embodiment, the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20 are tapered in a forward direction, i.e., the width of the first main surface 20a of the antenna substrate 20 in the X direction is smaller than the width of the second main surface 20b in the X direction.

[0102] The radiation electrode 21, the ground electrode 22, and the wiring 23 provided on the antenna substrate 20 are exposed from the side surface of the antenna substrate 20. As a result, in this embodiment, it is possible to ensure a large area for the radiation electrode 21 while miniaturizing the antenna substrate 20. Therefore, the antenna module 10P can improve the antenna characteristics on the low frequency side.

[0103] The configuration of the antenna substrate 20 of this embodiment can be combined with the above-described first to fifth embodiments and their respective modifications.

[0104] (Twelfth Modification) Fig. 22 is a cross-sectional view showing an antenna module according to a twelfth modification. As shown in Fig. 22, the antenna module 10Q according to the twelfth modification is different from the sixth embodiment described above in that the first substrate side surface 20s1 and the second substrate side surface 20s2 of the antenna substrate 20 are inclined in an inverse tapered shape. That is, the width in the X direction of the first main surface 20a of the antenna substrate 20 is greater than the width in the X direction of the second main surface 20b.

[0105] In this modification, the radiating electrode 21, the ground electrode 22, and the wiring 23 provided on the antenna substrate 20 are also exposed from the side surface of the antenna substrate 20. As a result, in this modification, the area of ​​the ground electrode 22 can be ensured to be larger than that of the radiating electrode 21, while the antenna substrate 20 can be made smaller. Therefore, the antenna module 10Q can achieve high gain in antenna characteristics.

[0106] The configuration of the antenna substrate 20 of this modified example can be combined with the above-described first to fifth embodiments and each modified example.

[0107] Seventh Embodiment Fig. 23 is a cross-sectional view showing an antenna module according to a seventh embodiment. Fig. 24 is a cross-sectional view of the antenna module according to the seventh embodiment when cut along the Y direction. As shown in Figs. 23 and 24, the antenna module 10R according to the seventh embodiment is different from the above-described embodiments and modifications in that the antenna substrate 20A has a first antenna substrate 25 and a second antenna substrate 26.

[0108] In the antenna module 10R of this embodiment, the second antenna substrate 26, the first antenna substrate 25, and the high-frequency circuit module 30D are stacked in this order in the Z direction. In other words, the first antenna substrate 25 is disposed between the second antenna substrate 26 and the high-frequency circuit module 30D in the Z direction. The first antenna substrate 25 is a so-called interposer substrate.

[0109] The high-frequency circuit module 30D includes a circuit board 33, an RFIC 31 (high-frequency circuit) provided on the circuit board 33, chip components 36, a molded resin 32 that covers the RFIC 31 and the chip components 36, and a shield 34 that covers the top and side surfaces of the molded resin 32. The chip components 36 are elements such as resistors, capacitors, and inductors that are necessary for the operation of the RFIC 31. The high-frequency circuit module 30D is mounted on the first antenna substrate 25 of the antenna substrate 20A, with the circuit board 33, the high-frequency circuit including the RFIC 31, the chip components 36, the molded resin 32, and the shield 34 integrally packaged.

[0110] The circuit board 33 of the high-frequency circuit module 30D is mounted on one main surface of the first antenna substrate 25 via connection terminals 33a (bumps). The second antenna substrate 26 is connected to the other main surface of the first antenna substrate 25 via connection terminals 26a (bumps). The high-frequency circuit module 30D is electrically connected to the radiation electrode 21A provided on the second antenna substrate 26 through wiring and vias (not shown) provided on the first antenna substrate 25.

[0111] The first antenna substrate 25 is provided with a ground electrode 27 and wiring 28. The ground electrode 27 and wiring 28 are provided on an inner layer of the first antenna substrate 25. The thickness of the first antenna substrate 25 is also formed to be thinner than that of the second antenna substrate 26.

[0112] The dielectric layer of the first antenna substrate 25 is made of one or more materials such as low-temperature co-fired ceramics (LTCC), glass epoxy resin, liquid crystal polymer (LCP), fluororesin, polyimide resin, etc. For example, a liquid crystal polymer is used for the first antenna substrate 25. The ground electrode 27 and the wiring 28 are similar to the ground electrode 22 and the wiring 23 of the antenna substrate 20 described above, and are made of a conductive metal material.

[0113] A radiation electrode 21A is provided on the second antenna substrate 26. The radiation electrode 21A is provided on the lower surface (the surface opposite to the first antenna substrate 25) of the second antenna substrate 26. The material of the dielectric layer of the second antenna substrate 26 can be the same as that of the antenna substrate 20 described above. The material of the radiation electrode 21A can be the same as that of the radiation electrode 21 of the antenna substrate 20 described above.

[0114] 24, the antenna module 10R has a plurality of second antenna substrates 26-1, 26-2, 26-3, 26-4, and 26-5. The plurality of second antenna substrates 26-1, 26-2, 26-3, 26-4, and 26-5 are arranged along the Y direction on the other main surface of the first antenna substrate 25. Furthermore, one radiation electrode 21A is provided on each of the plurality of second antenna substrates 26-1, 26-2, 26-3, 26-4, and 26-5.

[0115] In the following description, when there is no need to distinguish between the multiple second antenna boards 26-1, 26-2, 26-3, 26-4, and 26-5, they will simply be referred to as the second antenna board 26.

[0116] In the antenna module 10R of this embodiment, the first substrate side surface 25s1, the second substrate side surface 25s2, the third substrate side surface 25s3, and the fourth substrate side surface 25s4 of the first antenna substrate 25 correspond to the first substrate side surface 20s1, the second substrate side surface 20s2, the third substrate side surface 20s3, and the fourth substrate side surface 20s4 of the antenna substrate 20 described above.

[0117] The first substrate side surface 25s1 of the first antenna substrate 25 is located on the same plane as the first side surface 30s1 of the high-frequency circuit module 30D in a plan view, or overlaps with the high-frequency circuit module 30D and is located more inward than the first side surface 30s1. Of the substrate side surfaces of the first antenna substrate 25, at least the second substrate side surface 25s2 and the third substrate side surface 25s3 are provided in an area that does not overlap with the high-frequency circuit module 30D in a plan view. The second substrate side surface 25s2 is located outward in the X direction from the second side surface 30s2 of the high-frequency circuit module 30D. The third substrate side surface 25s3 is located outward in the Y direction from the third side surface 30s3 of the high-frequency circuit module 30D.

[0118] Therefore, in the antenna module 10R of this embodiment, as in the above-described embodiments, the dimensional accuracy can be improved.

[0119] The antenna module 10R of this embodiment also includes a second antenna substrate 26 provided with the radiation electrode 21 and a first antenna substrate 25 that relays the high-frequency circuit module 30D. This allows for greater flexibility in the material and size of the second antenna substrate 26 and the size of the radiation electrode 21. This allows for improved performance and broader bandwidth of the antenna module 10R.

[0120] For example, the material of the second antenna substrate 26 may be different from that of the first antenna substrate 25, and it is also easy to mount multiple second antenna substrates 26 on a single first antenna substrate 25. Even if the number, arrangement pitch, etc. of the second antenna substrates 26 (radiating electrodes 21) differ, the first antenna substrate 25 can satisfactorily connect the high-frequency circuit module 30D to the multiple second antenna substrates 26. Furthermore, even if the number and arrangement pitch of the connection terminals 33a (bumps) of the high-frequency circuit module 30D differ from the number and arrangement pitch of the connection terminals 26a (bumps) of the second antenna substrate 26, the first antenna substrate 25 can satisfactorily connect the high-frequency circuit module 30D to the second antenna substrate 26.

[0121] The first antenna substrate 25 is a thin, flexible substrate made of, for example, a liquid crystal polymer. Therefore, even if stress is applied to the antenna module 10R, the concentration of stress on the first antenna substrate 25 can be suppressed, and damage such as breakage of the first antenna substrate 25 can be suppressed.

[0122] The configuration of the antenna module 10R of this embodiment is merely an example and can be modified as appropriate. For example, the configuration of the high-frequency circuit module 30D is not limited to the example shown in Figures 23 and 24 and may be any of the high-frequency circuit modules 30, 30A, 30B, and 30C described above. Furthermore, the configurations of the first antenna substrate 25 and the second antenna substrate 26 shown in Figures 23 and 24 are merely examples and can be modified as appropriate.

[0123] (Thirteenth Modification) Figure 25 is a cross-sectional view of an antenna module according to a thirteenth modification when cut along the Y direction. As shown in Figure 25, the antenna module 10S according to the thirteenth modification differs from the seventh embodiment described above in that the multiple wirings 28 of the first antenna substrate 25 are arranged along the Y direction. That is, the multiple wirings 28 are provided corresponding to the multiple second antenna substrates 26-1, 26-2, 26-3, 26-4, and 26-5 arranged along the Y direction. The wiring, electrode patterns, number, etc. provided on the first antenna substrate 25 can be changed as appropriate.

[0124] (14th Modification) Figure 26 is a cross-sectional view of an antenna module according to a 14th modification when cut along the Y direction. As shown in Figure 26, the antenna module 10T according to the 14th modification is different from the seventh embodiment described above in that three second antenna substrates 26-1, 26-2, and 26-3 are arranged along the Y direction. Two radiation electrodes 21A are provided side by side along the Y direction on each of the second antenna substrates 26-1 and 26-2. One radiation electrode 21A is provided on the second antenna substrate 26-3.

[0125] (Fifteenth Modification) Fig. 27 is a cross-sectional view of an antenna module according to a fifteenth modification taken along the Y direction. As shown in Fig. 27, the antenna module 10U according to the fifteenth modification is different from the seventh embodiment in that it has one second antenna substrate 26. That is, in the fifteenth modification, one second antenna substrate 26 is connected to the other main surface of one first antenna substrate 25. Furthermore, on one second antenna substrate 26, a plurality of radiation electrodes 21A are arranged along the Y direction.

[0126] As shown in the fourteenth and fifteenth modifications, the number of second antenna substrates 26 connected to a first antenna substrate 25 and the number of radiating electrodes 21A provided on the second antenna substrate 26 can be changed as appropriate depending on the characteristics required of the antenna module. The number of second antenna substrates 26 connected to one first antenna substrate 25 may be, for example, two, four, or six or more. Furthermore, the total number of radiating electrodes 21A may be four or less, or six or more.

[0127] The above-described embodiment is intended to facilitate understanding of the present invention, and is not intended to limit the present invention. The present invention may be modified or improved without departing from the spirit and scope of the present invention, and equivalents thereof are also included in the present invention.

[0128] The present disclosure may also have the following configurations.

[0129] (1) An antenna module including: an antenna substrate provided with at least one radiation electrode; and a high-frequency circuit module mounted on the antenna substrate, wherein the high-frequency circuit module is rectangular in shape having two long sides and two short sides in a plan view, and has first and second side faces corresponding to the two long sides, and third and fourth side faces corresponding to the two short sides; the antenna substrate has a first board side face, a second board side face opposite to the first board side face, and a third and fourth board side face located between the first board side face and the second board side face; the first board side face of the antenna substrate is located on the same plane as the first side face of the high-frequency circuit module in the plan view, or overlaps with the high-frequency circuit module and is located more inward than the first side face; and at least one of the second board side face, the third board side face, and the fourth board side face of the antenna substrate is located in an area not overlapping with the high-frequency circuit module in the plan view. (2) The antenna module according to (1), wherein the high-frequency circuit module includes: a circuit board; a high-frequency circuit including an RFIC and provided on the circuit board; a molded resin covering the high-frequency circuit; and a shield covering the upper and side surfaces of the molded resin. (3) The antenna module according to (1), wherein the high-frequency circuit module includes: a high-frequency circuit including an RFIC; a molded resin covering the high-frequency circuit; and a shield covering the upper and side surfaces of the molded resin. (4) The antenna module according to (2) or (3), wherein the high-frequency circuit further includes at least one of another IC different from the RFIC and a chip component. (5) The antenna module according to any one of (1) to (4), wherein the antenna substrate has an antenna element different from the radiation electrode, and the antenna element has a radiation pattern having directivity in a direction parallel to the surface of the antenna substrate. (6) The antenna substrate has an electrode on at least one of the surface layer and the inner layer, and the electrode provided on at least one of the surface layer and the inner layer is exposed from the substrate side surface of the antenna substrate. An antenna module described in any one of (1) to (5).(7) The antenna module according to any one of (1) to (6), wherein the antenna substrate has a ground electrode provided on an inner layer, and the ground electrode is exposed from a substrate side surface of the antenna substrate. (8) The antenna module according to any one of (1) to (7), wherein an end face of the radiation electrode provided on the antenna substrate is located on the same plane as the substrate side surface of the antenna substrate. (9) The antenna module according to (7), wherein the antenna substrate has wiring provided on an inner layer and connected to the ground electrode, and the wiring is exposed from the substrate side surface of the antenna substrate. (10) The antenna module according to any one of (1) to (5), wherein the antenna substrate has electrodes on a surface layer and an inner layer, and the electrodes provided on the surface layer and the inner layer are each located more inward than the substrate side surface of the antenna substrate. (11) The antenna module according to any one of (1) to (10), wherein the first substrate side surface and the second substrate side surface of the antenna substrate are located on the same plane as the first side surface and the second side surface of the high-frequency circuit module, respectively, in the plan view, or are located more inward than the first side surface and the second side surface. (12) The antenna module according to any one of (1) to (11), wherein a resin layer is provided between the antenna substrate and the high-frequency circuit module. (13) The antenna module according to (12), wherein the resin layer is provided between the antenna substrate and the high-frequency circuit module and covers the substrate side surface of the antenna substrate. (14) The antenna module according to any one of (1) to (12), wherein an insulating layer is provided on the substrate side surface of the antenna substrate and is made of a material different from that of the antenna substrate. (15) The antenna module according to (6), wherein a plating layer is provided to cover the electrode exposed from the substrate side surface of the antenna substrate. (16) The antenna module according to any one of (1) to (15), wherein the first substrate side surface and the second substrate side surface of the antenna substrate are inclined in a tapered shape.(17) A method for manufacturing an antenna module including an antenna substrate having at least one radiation electrode and having a first substrate side surface, a second substrate side surface opposite the first substrate side surface, and a third substrate side surface and a fourth substrate side surface located between the first substrate side surface and the second substrate side surface, and a high-frequency circuit module mounted on the antenna substrate and having a rectangular shape with two long sides and two short sides in a plan view, the method comprising: cutting the antenna substrate along the first substrate side surface; and mounting the high-frequency circuit module on the antenna substrate so that the first substrate side surface after cutting is located in the same plane as a first side surface corresponding to the long sides of the high-frequency circuit module in a plan view, or overlaps the high-frequency circuit module and is located more inward than the first side surface. (18) The method for manufacturing the antenna module according to (17), further comprising: cutting the antenna substrate on which the high-frequency circuit module is mounted along at least one of the second substrate side surface, the third substrate side surface, and the fourth substrate side surface. (19) The antenna module according to (1), wherein the antenna substrate includes a first antenna substrate on which the high-frequency circuit module is mounted and a second antenna substrate on which the radiation electrode is provided, the first antenna substrate having the first substrate side surface, the second substrate side surface, the third substrate side surface, and the fourth substrate side surface. (20) The antenna module according to (19), wherein a plurality of the second antenna substrates are connected to the first antenna substrate, and at least one of the radiation electrodes is disposed on each of the plurality of second antenna substrates.

[0130] 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H, 10I, 10J, 10K, 10L, 10M, 10N, 10O, 10P, 10Q, 10R, 10S, 10T, 10U Antenna module 20, 20A Antenna substrate 20a First main surface 20b Second main surface 20s1, 25s1 First substrate side surface 20s2, 25s2 Second substrate side surface 20s3, 25s3 Third substrate side surface 20s4, 25s4 Fourth substrate side surface 21, 21A Radiation electrode 21e, 22e, 23e End surface 22 Ground electrode 23 Wiring 24 Via 25 First antenna substrate 26 Second antenna substrate 30, 30A, 30B, 30C, 30D High frequency circuit module 30s1 First side surface 30s2 Second side surface 30s3 Third side surface 30s4 Fourth side surface 31 RFIC 32 Molded resin 33 Circuit board 34 Shield 35 Power supply IC 36 Chip component 40 Connector 41 Antenna element 50, 50A Resin layer 51 Insulating layer 52 Plating layer

Claims

1. An antenna module comprising: an antenna substrate having at least one radiating electrode; and a radio frequency circuit module mounted on the antenna substrate, wherein the radio frequency circuit module is rectangular in shape having two long sides and two short sides in a plan view, and has a first side surface and a second side surface corresponding to the two long sides, and a third side surface and a fourth side surface corresponding to the two short sides, the antenna substrate has a first substrate side surface, a second substrate side surface opposite to the first substrate side surface, and a third substrate side surface and a fourth substrate side surface located between the first substrate side surface and the second substrate side surface, wherein the first substrate side surface of the antenna substrate is located on the same plane as the first substrate side surface of the radio frequency circuit module in the plan view, or overlaps with the radio frequency circuit module and is located more inward than the first substrate side surface, and at least one of the second substrate side surface, the third substrate side surface, and the fourth substrate side surface of the antenna substrate is located in an area not overlapping with the radio frequency circuit module in the plan view.

2. The antenna module according to claim 1, wherein the high-frequency circuit module comprises: a circuit board; a high-frequency circuit including an RFIC and provided on the circuit board; a molded resin covering the high-frequency circuit; and a shield covering an upper surface and side surfaces of the molded resin.

3. The antenna module according to claim 1, wherein the high-frequency circuit module comprises: a high-frequency circuit including an RFIC; a molded resin covering the high-frequency circuit; and a shield covering an upper surface and sides of the molded resin.

4. The antenna module according to claim 2 or 3, wherein the high frequency circuit further includes at least one of an IC different from the RFIC and a chip component.

5. An antenna module as claimed in any one of claims 1 to 4, wherein the antenna substrate has an antenna element different from the radiation electrode, and the antenna element has a radiation pattern having directivity in a direction parallel to the surface of the antenna substrate.

6. An antenna module as claimed in any one of claims 1 to 5, wherein the antenna substrate has an electrode on at least one of the surface layer and the inner layer, and the electrode provided on at least one of the surface layer and the inner layer is exposed from a substrate side surface of the antenna substrate.

7. The antenna module according to any one of claims 1 to 6, wherein the antenna substrate has a ground electrode provided on an inner layer, the ground electrode being exposed from a substrate side surface of the antenna substrate.

8. The antenna module according to any one of claims 1 to 7, wherein an end face of the radiation electrode provided on the antenna substrate is located on the same plane as a side surface of the antenna substrate.

9. The antenna module according to claim 7, wherein the antenna substrate has wiring provided on an inner layer and connected to the ground electrode, the wiring being exposed from a substrate side surface of the antenna substrate.

10. An antenna module as claimed in any one of claims 1 to 5, wherein the antenna substrate has electrodes on a surface layer and an inner layer, and the electrodes on the surface layer and the inner layer are each located inside the substrate side surface of the antenna substrate.

11. An antenna module as described in any one of claims 1 to 10, wherein the first substrate side surface and the second substrate side surface of the antenna substrate are located on the same plane as the first substrate side surface and the second substrate side surface of the high-frequency circuit module, respectively, when viewed in the plane, or are located more inward than the first substrate side surface and the second substrate side surface.

12. The antenna module according to any one of claims 1 to 11, further comprising a resin layer provided between the antenna substrate and the high-frequency circuit module.

13. The antenna module according to claim 12, wherein the resin layer is provided between the antenna substrate and the high-frequency circuit module, and covers the substrate side surface of the antenna substrate.

14. The antenna module according to any one of claims 1 to 12, further comprising an insulating layer provided on a side surface of the antenna substrate and made of a material different from that of the antenna substrate.

15. The antenna module according to claim 6, further comprising a plating layer that covers the electrodes exposed from the side surface of the antenna substrate.

16. The antenna module according to any one of claims 1 to 15, wherein the first substrate side surface and the second substrate side surface of the antenna substrate are inclined in a tapered shape.

17. A method for manufacturing an antenna module including an antenna substrate having at least one radiation electrode, a first substrate side surface, a second substrate side surface opposite the first substrate side surface, and a third substrate side surface and a fourth substrate side surface located between the first substrate side surface and the second substrate side surface, and a radio-frequency circuit module mounted on the antenna substrate and having a rectangular shape having two long sides and two short sides in a planar view, the method comprising the steps of: cutting the antenna substrate along the first substrate side surface; and mounting the radio-frequency circuit module on the antenna substrate so that the first substrate side surface after cutting is located in the same plane as a first side surface corresponding to the long sides of the radio-frequency circuit module in a planar view, or overlaps the radio-frequency circuit module and is located more inward than the first side surfaces.

18. A method for manufacturing an antenna module as described in claim 17, comprising a step of cutting the antenna substrate on which the high-frequency circuit module is mounted along at least one of the second substrate side surface, the third substrate side surface, and the fourth substrate side surface.

19. The antenna module described in claim 1, wherein the antenna substrate includes a first antenna substrate carrying the high-frequency circuit module and a second antenna substrate having the radiating electrode, and the first antenna substrate has the first substrate side surface, the second substrate side surface, the third substrate side surface and the fourth substrate side surface.

20. The antenna module according to claim 19, wherein a plurality of second antenna substrates are connected to the first antenna substrate, and at least one of the radiation electrodes is disposed on each of the plurality of second antenna substrates.

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