Wafer transfer device, wafer transfer method, and treatment apparatus therefor

Abstract

Disclosed are a wafer transfer device, a wafer transfer method, and a treatment apparatus. The wafer transfer device comprises: a plurality of wafer pickup apparatuses, used for receiving or sending out wafers, the wafers comprising wafers to be measured and wafers that have been measured; a measurement camera, used for acquiring measurement images of the wafers to be measured in the wafer pickup apparatuses; and a wafer bearing table, which is movably arranged below the plurality of wafer pickup apparatuses and is used for bearing a wafer to be measured that is ready for measurement. When several wafer pickup apparatuses among the plurality of wafer pickup apparatuses are receiving wafers to be measured or sending out wafers that have been measured, the wafer bearing table bearing the wafer to be measured that is ready for measurement is moved to a position below the measurement camera, so as to simultaneously perform measurement work on the wafer to be measured borne on the wafer bearing table. By means of the wafer transfer device, half of the wafer transfer time can be saved without changing the overall size of the device, thereby improving the productivity of the device.

Description

Wafer transmission equipment, wafer transmission method and processing device thereof Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a wafer transfer device, a wafer transfer method, a wafer transfer processing device, and a computer-readable storage medium. Background Art

[0002] In the semiconductor manufacturing process, bonded wafers are passed through metrology equipment to measure the alignment error between the upper and lower wafers. Therefore, wafer throughput is a key indicator of metrology equipment's market competitiveness.

[0003] Currently, traditional metrology equipment requires a robotic arm to transfer the wafer to a wafer handling device, which then transfers it to a wafer carrier before measurement can begin. This transfer process prevents measurement from occurring, limiting the metrology equipment's production capacity.

[0004] In order to solve the above problems existing in the prior art, this field urgently needs a wafer transfer technology that can save half of the wafer transfer time without changing the overall size of the equipment, thereby improving the equipment's production capacity.

[0005] Summary of the Invention

[0006] The following is a brief summary of one or more aspects to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceivable aspects and is neither intended to identify key or critical elements of all aspects nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that will be provided later.

[0007] In order to overcome the above-mentioned defects of the prior art, the present invention provides a wafer transfer device, a wafer transfer method, a wafer transfer processing device, and a computer-readable storage medium, which can save half of the wafer transfer time without changing the overall size of the equipment, thereby improving the equipment's production capacity.

[0008] Specifically, the wafer transfer equipment provided according to the first aspect of the present invention includes: a plurality of wafer picking devices for receiving or sending out wafers, wherein the wafers include wafers to be measured and wafers that have completed measurement; and a measurement camera for obtaining measurement images of the wafers to be measured in the wafer picking device; and a wafer carrier, movably arranged below the plurality of wafer picking devices, for carrying the wafers to be measured that are ready for measurement, wherein, when several of the plurality of wafer picking devices are receiving the wafers to be measured or sending out the wafers that have completed measurement, the wafer carrier carrying the wafers to be measured that are ready for measurement moves to the bottom of the measurement camera to simultaneously perform measurement on the wafers to be measured carried thereon.

[0009] Furthermore, in some embodiments of the present invention, the planar distance between the multiple wafer-picking devices is at least greater than the sum of the radii of the wafers picked up by each of them.

[0010] Furthermore, in some embodiments of the present invention, the film picking device is connected to a first lifting mechanism to move in the Z-axis direction, and a suction needle structure is provided on the surface of the film picking device, wherein the film picking device rises to receive the wafer to be measured, and the film picking device descends to place the wafer to be measured on the wafer carrier.

[0011] Furthermore, in some embodiments of the present invention, the wafer carrying platform moves in the XY plane to receive the wafer to be measured that is placed after the wafer picking device descends.

[0012] Furthermore, in some embodiments of the present invention, the measurement camera is connected to a second lifting mechanism. After the wafer carrier carrying the wafer to be measured moves to the bottom of the measurement camera, the second lifting mechanism is used to move the measurement camera in the Z-axis direction to adjust the focal length of the measurement camera.

[0013] Furthermore, in some embodiments of the present invention, the plurality of film-taking devices and the measurement camera are disposed on a vibration isolation table.

[0014] In addition, the above-mentioned wafer transfer method provided according to the second aspect of the present invention includes the following steps: receiving the first wafer to be measured or sending out the completed measurement through the first wafer picking device; and moving the wafer carrier carrying the second wafer to be measured to the bottom of the measurement camera to simultaneously perform measurement work on the second wafer to be measured.

[0015] Furthermore, in some embodiments of the present invention, after the step of moving the wafer carrier carrying the second wafer to be measured to the bottom of the measuring camera to simultaneously perform measurement work on the second wafer to be measured, the following steps are also included: in response to the completion of the measurement work of the second wafer, the wafer that has completed the measurement is obtained by the second wafer picking device and is transferred to the external robot; and the wafer carrier carrying the third wafer to be measured is moved to the bottom of the measuring camera to simultaneously perform measurement work on the third wafer to be measured, wherein the third wafer is obtained by the first wafer picking device, and is moved to the bottom of the first wafer picking device via the wafer carrier to receive the third wafer to be measured.

[0016] In addition, according to the third aspect of the present invention, a wafer transfer processing device is provided. The wafer transfer processing device includes a memory and a processor. The processor is connected to the memory and configured to implement the wafer transfer method provided by the second aspect of the present invention.

[0017] In addition, according to a fourth aspect of the present invention, there is also provided a computer-readable storage medium having computer instructions stored thereon, wherein when the computer instructions are executed by a processor, the above-mentioned wafer transfer method provided by the second aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above features and advantages of the present invention will be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or characteristics may have the same or similar reference numerals.

[0019] FIG1 shows a schematic structural diagram of a wafer transfer structure provided according to some embodiments of the present invention;

[0020] FIG2 is a top view of the wafer transfer structure shown in FIG1 ;

[0021] FIG3 is a schematic diagram showing a measurement image of a wafer to be measured according to some embodiments of the present invention;

[0022] FIG4 shows a flow chart of a wafer transfer method according to some embodiments of the present invention; and

[0023] FIG5 shows a structural block diagram of a wafer transfer processing device provided according to some embodiments of the present invention.

[0024] Figure numerals: 100 wafer transfer equipment; 110 first wafer picking device; 120 second wafer picking device; 130 measurement camera; 140 suction needle structure; 150 wafer carrier; 160 vibration isolation table; 210 first wafer; 220 second wafer; d planar distance between the wafer picking devices; 300 wafer to be measured; 310 wafer mark; steps S410 to S420; 500 wafer transfer processing device; 510 memory; and 520 processor. DETAILED DESCRIPTION

[0025] The following specific embodiments illustrate the embodiments of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this embodiment. On the contrary, the purpose of introducing the invention in conjunction with the embodiment is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0026] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0027] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood to refer to the orientations depicted in that section and the accompanying drawings. These relative terms are used solely for convenience of description and do not necessarily imply that the devices described herein must be manufactured or operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0028] It will be understood that although the terms "first," "second," "third," etc. may be used herein to describe various components, regions, layers, and / or portions, these components, regions, layers, and / or portions should not be limited by these terms, and these terms are merely used to distinguish different components, regions, layers, and / or portions. Thus, a first component, region, layer, and / or portion discussed below may be referred to as a second component, region, layer, and / or portion without departing from some embodiments of the present invention.

[0029] As mentioned above, conventional metrology equipment currently requires a wafer to be transferred from a robotic arm to a wafer removal device, which then transfers it to a wafer carrier before measurement can begin. This transfer process prevents measurement from occurring, thus limiting the metrology equipment's productivity.

[0030] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a wafer transfer equipment, a wafer transfer method, a wafer transfer processing device, and a computer-readable storage medium, which can save half of the wafer transfer time without changing the overall size of the equipment, thereby improving the equipment's production capacity.

[0031] In some non-limiting embodiments, the wafer transfer device provided by the first aspect of the present invention can be used to implement the wafer transfer method provided by the second aspect of the present invention.

[0032] The working principle of the above-mentioned wafer transfer equipment will be described below in conjunction with some embodiments of the wafer transfer method. Those skilled in the art will understand that these embodiments of the wafer transfer method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all working modes or all functions of the wafer transfer equipment. Similarly, the wafer transfer equipment is also only a non-limiting implementation method provided by the present invention and does not constitute a limitation on the implementation subject of each step in these wafer transfer methods.

[0033] First, please refer to FIG. 1 and FIG. 2 . FIG. 1 shows a schematic structural diagram of a wafer transfer structure provided according to some embodiments of the present invention, and FIG. 2 is a top view of the wafer transfer structure shown in FIG. 1 .

[0034] As shown in Figures 1 and 2, in some embodiments of the present invention, the wafer transfer device 100 may include multiple wafer picking devices, such as a first wafer picking device 110 and a second wafer picking device 120, which can be used to receive or send out wafers, wherein the wafers may include wafers to be measured and wafers that have completed measurement. The wafer transfer device 100 may also include a measurement camera 130 for acquiring measurement images of the wafers to be measured in the wafer picking devices (e.g., the first wafer picking device 110 and the second wafer picking device 120).

[0035] The wafer transfer apparatus 100 may further include a wafer carrier 150. The wafer carrier 150 is movably disposed below the plurality of wafer retrieval devices and is used to carry wafers to be measured. When several of the plurality of wafer retrieval devices are receiving wafers to be measured or delivering wafers that have been measured, the wafer carrier 150 carrying the wafers to be measured can be moved below the measurement camera 130 to simultaneously perform measurement operations on the wafers to be measured.

[0036] Furthermore, the planar distance d between the multiple wafer-picking devices can be at least greater than the sum of the diameters of the wafers they each retrieve. Specifically, as shown in FIG1 , the first wafer-picking device 110 is receiving a first wafer 210 to be measured, and the second wafer-picking device 120 is delivering a second wafer 220 that has been measured. When the first wafer 210 and the second wafer 220 have the same wafer size, their wafer diameters are also the same. In this case, the planar distance d between the first wafer-picking device 110 and the second wafer-picking device 120 can be at least greater than the diameter of the first wafer 210 or the second wafer 220.

[0037] Optionally, in other embodiments, when the wafer sizes of the first wafer 210 and the second wafer 220 are different, the wafer diameters thereof are also different. In this case, the planar distance d between the first wafer 110 and the second wafer 120 can be at least greater than the sum of the radii of the first wafer 210 and the second wafer 220.

[0038] Those skilled in the art will understand that the wafer transfer equipment 100 shown in FIG1 only includes a dual wafer picking device solution of a first wafer picking device 110 and a second wafer picking device 120, which is only a non-limiting implementation method provided by the present invention, and is intended to clearly demonstrate the main concept of the present invention and provide a specific solution that is easy for the public to implement, rather than to limit the scope of protection of the present invention.

[0039] Specifically, optionally, in some other embodiments, the wafer transfer equipment 100 may include a plurality of film picking devices, and these plurality of film picking devices may be arranged in a single row or in a dispersed configuration. For example, the wafer transfer equipment 100 may include four film picking devices, and these four film picking devices may be arranged in a row, or in pairs, in two rows, or in an irregularly dispersed configuration. The planar distance d between these four film picking devices may be at least greater than the sum of the radii of the wafers obtained by each, so as to avoid collisions between the fixed wafers of two adjacent film picking devices when receiving wafers to be measured or sending out wafers that have been measured. It can be understood that the positions of the multiple film picking devices in the wafer transfer equipment 100 are arranged based on the principle that two adjacent wafers exist at the same time and do not interfere with each other in space.

[0040] Furthermore, as shown in FIG1 , in some optional embodiments, the first wafer picking device 110 and the second wafer picking device 120 can be respectively connected to a first lifting mechanism (not shown in the drawings) to move in the Z-axis direction. The surfaces of the first wafer picking device 110 and the second wafer picking device 120 can be provided with a suction pin structure 140. Specifically, the suction pin structure 140 of the first wafer picking device 110 and the second wafer picking device 120 can include at least three suction pins, each of which has a suction cup at the front end for adsorbing the wafer through negative pressure.

[0041] Taking the first film picking device 110 as an example, the working principle of the first film picking device 110 for film picking may include: the first film picking device 110 is raised in the Z-axis direction by the first lifting mechanism, and after rising to the first preset height, the first wafer 210 to be measured is received from the external robot through the suction needle structure 140, and the first wafer 210 to be measured is completed with the robot. When the suction needle structure 140 on the first film picking device 110 contacts the first wafer 210, the negative pressure mode can be turned on to adsorb the first wafer 210, thereby realizing the film picking function. The working principle of the first film picking device 110 for placing the film may include: the first film picking device 110 is lowered in the Z-axis direction by the first lifting mechanism, and after descending to the second preset height, the first wafer 210 that has been measured is delivered to the external robot through the suction needle structure 140, and the first wafer 210 that has been measured is completed with the robot. When the first wafer 210 on the first wafer picking device 110 contacts the wafer carrier 150, the suction needle structure 140 on the first wafer picking device 110 can turn off the negative pressure mode, and the first wafer 210 falls from the suction needle structure 140 into the wafer carrier 150, thereby realizing the wafer placement function.

[0042] As shown in Figure 1, in some embodiments, a wafer carrier 150 is movably disposed below the first wafer removal device 110 and the second wafer removal device 120 to receive the first wafer 210 or the second wafer 220 that has been measured and placed thereafter by the first wafer removal device 110 or the second wafer removal device 120. Specifically, the wafer carrier 150 can move within the XY plane below the first wafer removal device 110 and the second wafer removal device 120. Afterwards, the wafer that has been measured and received by the wafer carrier 150 can be removed by a robotic arm.

[0043] Furthermore, as shown in FIG1 , in some optional embodiments, the measurement camera 130 may be connected to a second lifting mechanism (not shown in the drawings). After the wafer carrier 150 carrying the wafer to be measured is moved below the measurement camera 130, the second lifting mechanism can be used to move the measurement camera 130 in the Z-axis direction to adjust the focal length of the measurement camera 130, thereby facilitating the measurement camera 130 to capture a clear measurement image of the wafer to be measured.

[0044] Please refer to FIG. 3 , which shows a schematic diagram of a measurement image of a wafer to be measured according to some embodiments of the present invention.

[0045] As shown in Figure 3, in some embodiments of the present invention, a plurality of wafer marks 310 are provided on the wafer 300 to be bonded. By completely aligning the plurality of wafer marks 310 on the surfaces of the two wafers 300 to be bonded, accurate bonding of the two wafers can be ensured.

[0046] Specifically, the measurement process involves the wafer stage 150 receiving the wafer 300 to be measured and moving it below the measurement camera 130. The measurement camera 130 then moves in the Z-axis direction, focuses, and takes a picture of a wafer mark 310 on the wafer 300 to be measured, thereby capturing a measurement image of that wafer mark 310. The wafer stage 150 then continues to move, adjusting the position of the next wafer mark 310 so that it is below the measurement camera 130. The measurement camera 130 is then adjusted in the Z-axis direction to focus and take pictures again, until all wafer marks 310 on the wafer 300 to be measured have been measured.

[0047] Continuing with FIG. 1 or FIG. 2 , in some embodiments, the above-mentioned multiple film picking devices, such as the first film picking device 110 and the second film picking device 120, and the measurement camera 130 can all be configured on a vibration isolation table 160. The vibration isolation table 160 can eliminate destructive low-frequency vibration noise that affects the measurement, thereby facilitating the measurement camera 130 to capture accurate wafer measurement images. Furthermore, optionally, the vibration isolation table 160 can also adopt a low-profile modular design, thereby eliminating the need for additional lifting equipment for the installation of most instruments, which can simplify the installation process. On the vibration isolation table 160, the wafer carrier 150 can generate relative motion with the measurement camera 130, thereby enabling measurement of multiple wafer marks 310 on the wafer 300 to be measured.

[0048] So far, the structure of the wafer transfer equipment 100 provided in the first aspect of the present invention has been basically introduced. In order to further introduce the wafer transfer equipment 100, please refer to Figure 4, which shows a flow chart of a wafer transfer method provided according to some embodiments of the present invention.

[0049] As shown in FIG. 4 , in some embodiments of the present invention, the wafer transfer method may include the following step S410 : receiving a first wafer to be measured or a first wafer that has been measured by a first wafer removal device.

[0050] Specifically, as shown in FIG1 , in some embodiments, during wafer measurement, the first wafer pickup device 110 is raised in the Z-axis direction by a first lifting mechanism. After rising to a first preset height, the first wafer 210 to be measured is received from an external robot by a suction needle structure 140, and the first wafer 210 to be measured is transferred to the robot. When the suction needle structure 140 on the first wafer pickup device 110 contacts the first wafer 210, a negative pressure mode can be activated to suck the first wafer 210, thereby achieving the wafer pickup function.

[0051] Alternatively, during wafer measurement, the first wafer removal device 110 is lowered in the Z-axis direction via the first lifting mechanism. After descending to a second preset height, the needle suction structure 140 delivers the measured first wafer 210 to an external robot arm, completing the transfer of the measured first wafer 210 to the robot arm. When the first wafer 210 on the first wafer removal device 110 contacts the wafer carrier 150, the needle suction structure 140 on the first wafer removal device 110 can deactivate the negative pressure mode, and the first wafer 210 falls from the needle suction structure 140 into the wafer carrier 150, thereby achieving the wafer placement function.

[0052] 4 , the wafer transfer method provided by the present invention may further include step S420 : moving the wafer carrier carrying the second wafer to be measured to below the measurement camera to simultaneously measure the second wafer to be measured.

[0053] Continuing with FIG. 1 , in some embodiments, while the first wafer retrieval device 110 is receiving or delivering a first wafer 210 to be measured, the second wafer retrieval device 120 can retrieve a second wafer 220 to be measured. The wafer carrier 150 moves within the XY plane to below the second wafer retrieval device 120, receiving the second wafer 220 to be measured. After receiving the second wafer 220 to be measured, the wafer carrier 150 continues to move within the XY plane until it is positioned below the measurement camera 130, thereby simultaneously capturing a measurement image of the second wafer 220 to be measured. The second wafer 220 may include multiple wafer markings. By moving the wafer carrier 150, the position of the second wafer 220 can be adjusted so that each wafer marking on the second wafer 220 can be captured by the measurement camera 130, thereby obtaining a measurement image of the second wafer 220. The measurement camera 130 can measure each wafer mark on the second wafer 220 to perform measurement on the second wafer 220. In other words, the wafer transfer method in the above embodiment of the present invention can synchronize the wafer transfer (including both transfer in and transfer out) and measurement steps, thereby reducing the handover time by half and improving production capacity.

[0054] Furthermore, in some preferred embodiments, after completing the above-mentioned step S420, in response to completing the measurement of the second wafer 220 carried on the wafer carrier 150, the wafer transfer equipment 100 can also obtain the second wafer 220 that has been measured through the second wafer picking device 120. After receiving the second wafer 220 that has been measured, the second wafer picking device 120 rises in the Z-axis direction to transfer it to an external manipulator. At the same time, the third wafer to be measured can be received by the first wafer picking device 110, and then the wafer carrier 150 is moved to the bottom of the first wafer picking device 110 to receive the third wafer to be measured. Then, the wafer carrier carrying the third wafer to be measured is moved to the bottom of the measuring camera 130 to simultaneously perform measurement on the third wafer to be measured.

[0055] In the above-mentioned embodiment of the present invention, the structural arrangement of the multiple wafer picking devices in the wafer transfer equipment 100 can carry out the wafer handover action between the wafer picking device and the robot arm simultaneously with the measurement action of other wafers, thereby saving half of the wafer handover time, namely the time for the robot arm to obtain the wafer that has completed measurement from the wafer picking device, and the time for the robot arm to hand over the wafer to be measured to the wafer picking device. For example, the measurement time of the wafer transfer equipment is 48s, the traditional wafer transfer time is 12s, and the equipment capacity is 60 wafers per hour, that is, 60 / WPH (wafer per hour). If the wafer transfer method of the present invention is adopted, the wafer transfer time can be compressed to 6s, and the capacity is increased to 66.7 / WPH. In other words, in comparison, the wafer transfer equipment with a single wafer picking device of the traditional layout cannot realize the above-mentioned process flow of parallel wafer transfer and measurement.

[0056] Those skilled in the art will understand that the above-mentioned solution of wafer transfer using the wafer transfer device 100 including the first wafer picking device 110 and the second wafer picking device 120 is only a non-limiting embodiment provided by the present invention, which is intended to clearly demonstrate the main concept of the present invention and provide a specific solution that is convenient for the public to implement, rather than to limit the scope of protection of the present invention. Optionally, in some other embodiments, those skilled in the art may also configure different numbers of wafer picking devices and / or wafer carriers and / or measurement cameras based on the concept of the present invention and the actual equipment production capacity requirements to achieve the same technical effect.

[0057] For example, the wafer transport equipment 100 includes multiple wafer pick-up devices to simultaneously transport and measure multiple wafers. For example, when the wafer transport equipment 100 includes four wafer pick-up devices, two measurement cameras 130 and two wafer carriers 150 can be configured to simultaneously perform synchronous wafer transport and measurement on four wafers in pairs.

[0058] Although the above methods are illustrated and described as a series of acts for simplicity of explanation, it is to be understood and appreciated that these methods are not limited by the order of the acts, as some acts may occur in a different order and / or concurrently with other acts from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art according to one or more embodiments.

[0059] So far, the wafer transfer method provided by the second aspect of the present invention has been introduced. Next, please refer to Figure 5, which shows a structural block diagram of a wafer transfer processing device provided according to some embodiments of the present invention.

[0060] As shown in Figure 5 , a wafer transfer processing device 500 may be configured with a memory 510 and a processor 520. The memory 510 includes, but is not limited to, the computer-readable storage medium provided in the fourth aspect of the present invention, on which computer instructions are stored. The processor 520 is connected to the memory 510 and is configured to execute the computer instructions stored in the memory 510 to implement the wafer transfer method provided in the second aspect of the present invention.

[0061] In summary, the present invention provides a wafer transfer device, a wafer transfer method, a wafer transfer processing device, and a computer-readable storage medium, which can save half of the wafer transfer time without changing the overall size of the equipment, thereby improving the equipment's production capacity.

[0062] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer transfer device, characterized in that: include: A plurality of wafer taking devices, used for receiving or sending out wafers, wherein the wafers include wafers to be measured and wafers after measurement; and a measurement camera, used for acquiring a measurement image of the wafer to be measured in the wafer picking device; and A wafer carrier is movably disposed below the multiple wafer picking devices, and is used to carry the wafers to be measured. When several of the multiple wafer picking devices are receiving the wafers to be measured, or sending out the wafers that have completed measurement, the wafer carrier carrying the wafers to be measured is moved to the bottom of the measurement camera to simultaneously measure the wafers to be measured carried thereon.

2. The wafer transfer device according to claim 1, characterized in that: The planar distance between the multiple wafer picking devices is at least greater than the sum of the radii of the wafers picked up by each of them.

3. The wafer transfer device according to claim 1, characterized in that: The film picking device is connected to the first lifting mechanism to move in the Z-axis direction, and a suction needle structure is provided on the surface of the film picking device, wherein the film picking device rises to receive the wafer to be measured, and the film picking device descends to place the wafer to be measured on the wafer carrier.

4. The wafer transfer device according to claim 3, characterized in that: The wafer carrying platform moves in the XY plane, and is used to receive the wafer to be measured which is placed after the wafer taking device descends.

5. The wafer transfer device according to claim 1, characterized in that: The measuring camera is connected to a second lifting mechanism. After a wafer carrier carrying the wafer to be measured moves to the bottom of the measuring camera, the measuring camera is moved in a Z-axis direction by the second lifting mechanism to adjust the focal length of the measuring camera.

6. The wafer transfer device according to claim 1, characterized in that: The plurality of film taking devices and the measuring camera are arranged on a vibration isolation table.

7. A wafer transmission method, characterized in that: The following steps are involved: Receiving a first wafer to be measured or sending out a first wafer having been measured by a first wafer picking device; as well as The wafer carrying table carrying the second wafer to be measured is moved to below the measuring camera, so as to simultaneously measure the second wafer to be measured.

8. The wafer transfer method according to claim 7, characterized in that: After the step of moving the wafer carrier carrying the second wafer to be measured to the bottom of the measurement camera to simultaneously measure the second wafer to be measured, the following steps are also included: In response to the second wafer completing the measurement work, obtaining the wafer that has completed the measurement through a second wafer picking device and transferring it to an external robot; and The wafer carrier carrying the third wafer to be measured is moved to the bottom of the measuring camera to simultaneously measure the third wafer to be measured, wherein the third wafer is obtained by the first wafer picking device, and is moved to the bottom of the first wafer picking device via the wafer carrier to receive the third wafer to be measured.

9. A wafer transfer processing device, characterized in that: include: Memory; as well as A processor is connected to the memory and is configured to implement the wafer transfer method according to any one of claims 7 to 8.

10. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the wafer transfer method according to any one of claims 7 to 8 is implemented.

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