Centering device and centering method

Abstract

Provided in the present application are a centering device and a centering method. The centering device comprises a fixed assembly, a plurality of movable assemblies and an adjustment assembly, wherein the fixed assembly is configured to replace a wafer-bearing device and is detachably fixed to a fixing reference face for the wafer-bearing device; the plurality of movable assemblies are spaced apart from each other on the fixed assembly in the circumferential direction of the fixing reference face and can move in the radial direction of the fixing reference face, and the plurality of movable assemblies jointly constitute a limiting face on the outer peripheries thereof, which limiting face is configured to make the axis of the inner peripheral contour of a process cavity sleeved at the outer peripheries of the plurality of movable assemblies coincide with the center of the fixing reference face; and the adjustment assembly is arranged on the fixed assembly, and is configured to drive the plurality of movable assemblies to synchronously move in the radial direction of the fixing reference face, so as to adjust the diameter of the limiting face. The present solution can accurately align the process cavity of a semiconductor cleaning apparatus with a wafer-bearing device.

Description

Centering devices and methods Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular, to a centering device and a centering method. Background Art

[0002] In the field of semiconductor cleaning equipment, especially single-wafer cleaning machines, the two most important components are the process chamber and the wafer carrier. Among them, the process chamber is annular and consists of multiple recovery layers and air guide blocks. The process chamber is fixed and stationary, and the wafer carrier can be raised and lowered in the space surrounded by the process chamber so as to reach the height position corresponding to any recovery layer. During the process, the wafer carrier drives the wafer to rotate, and at the same time, the nozzle located above the wafer begins to spray the liquid medicine onto the wafer. This requires a very high degree of alignment between the wafer carrier and the process chamber. If the alignment between the process chamber and the wafer carrier is not good, it will affect the recovery efficiency of the liquid medicine, increase the backsplash and lead to an increase in particle size, and produce poor process effects such as poor etching rate uniformity.

[0003] However, because the process chamber is a multi-layered structure consisting of multiple recovery layers and air guide blocks, and these components are generally made of resin and have large manufacturing tolerances, this causes significant movement between components in different layers after installation, making it difficult to ensure alignment between different layers using only visual inspection. Therefore, there is an urgent need for an alignment device that can align the inner perimeter of the process chamber of semiconductor cleaning equipment with the wafer carrier.

[0004] Summary of the Invention

[0005] The present application aims to solve at least one of the technical problems existing in the prior art, and proposes a centering device and a centering method, which can achieve precise centering of the inner peripheral contour of the process chamber of the semiconductor cleaning equipment with the wafer carrying device.

[0006] In order to achieve the purpose of the present application, a centering device is provided for aligning the inner periphery of a hollow process chamber of a semiconductor cleaning device with a wafer carrier. The centering device includes a fixed component, a plurality of moving components and an adjusting component, wherein:

[0007] The fixing assembly is used to replace the wafer carrying device and is detachably fixed to the fixed reference surface of the wafer carrying device;

[0008] The plurality of movable components are arranged on the fixed component at intervals along the circumference of the fixed reference surface and are capable of moving radially along the fixed reference surface. The plurality of movable components jointly form a limiting surface on the outer periphery, which is used to make the axis of the inner peripheral contour of the process chamber sleeved on the outer periphery of the plurality of movable components coincide with the center of the fixed reference surface;

[0009] The adjusting component is arranged on the fixing component, and is used to drive the plurality of moving components to move synchronously along the radial direction of the fixing reference surface, so as to adjust the diameter of the limiting surface.

[0010] In some embodiments, the adjustment assembly includes a lifting component, the lifting component is movably disposed on the fixing assembly, and the lifting component has a mating surface inclined relative to the vertical direction;

[0011] The plurality of moving components are configured to maintain contact with the mating surface when the lifting component is lifted or lowered, so as to move synchronously along the radial direction of the fixed reference surface under the drive of the mating surface.

[0012] In some embodiments, each of the moving components includes a moving part and an elastic part, wherein:

[0013] The movable component is provided on the fixed assembly and is capable of moving radially along the fixed reference plane;

[0014] The elastic component is connected to the movable component and the fixed component respectively, and is used to apply elastic force to the movable component so as to keep the movable component in contact with the matching surface.

[0015] In some embodiments, the elastic component includes a tension spring, one end of the tension spring is connected to the fixed component, and the other end of the tension spring is connected to the movable component.

[0016] In some embodiments, the movable component includes a movable plate and a limiting column vertically arranged on the movable plate, wherein the movable plate is arranged on the fixed assembly and can move radially along the fixed reference plane;

[0017] The limiting columns of the plurality of movable components together form the limiting surface at the outer periphery.

[0018] In some embodiments, a rolling fit structure is provided on the moving component, and the rolling fit structure is in rolling contact with the fitting surface.

[0019] In some embodiments, the rolling fit structure includes a support shaft and a bearing, the bearing is connected to the moving component via the support shaft, and the bearing is rotatable around the support shaft, and the outer peripheral surface of the bearing is in rolling contact with the fitting surface.

[0020] In some embodiments, the adjustment assembly further comprises a fixing component and an adjustment structure, wherein the fixing component is fixedly connected to the fixing assembly; the axis of the fixing component coincides with the axis of the fixing assembly; the axis of the fixing assembly coincides with the center of the fixed reference plane;

[0021] The lifting component is liftably connected to the fixed component via the adjustment structure, and the fixed component and the lifting component are matched with each other in a vertical limit position so that the axis of the matching surface coincides with the axis of the fixed component;

[0022] The adjusting structure is used to drive the lifting component to move up and down relative to the fixing component.

[0023] In some embodiments, the fixing component has a hollow portion, the lifting component is arranged in the hollow portion, and the inner peripheral wall of the hollow portion is limitedly matched with the outer peripheral wall of the lifting component so that the axis of the matching surface coincides with the axis of the fixing component.

[0024] In some embodiments, the adjustment structure includes an adjusting stud, a fixing screw, and a locking nut, wherein a first threaded hole is provided in the fixing component and located above the hollow portion, and two ends of the first threaded hole respectively penetrate the upper surface of the fixing component and the inner surface of the hollow portion in a vertical direction; the adjusting stud has an external thread and is threadedly engaged with the first threaded hole; the locking nut is threadedly engaged with the adjusting stud and can be tightened to the upper surface of the fixing component;

[0025] The adjusting stud has a central hole extending axially therethrough, and a second threaded hole is provided on the upper surface of the lifting component; the fixing screw passes through the central hole from above the adjusting stud and extends into the hollow portion, and is threadedly connected to the second threaded hole.

[0026] In some embodiments, the outer periphery of the lifting component is provided with a plurality of protrusions at intervals, and the plurality of protrusions all have inclined surfaces and together constitute the mating surface; each of the moving components maintains contact with each of the inclined surfaces in a one-to-one correspondence;

[0027] A plurality of limiting channels are provided on the fixing component extending in the vertical direction, each of the protrusions is provided in a one-to-one correspondence in each of the limiting channels, and each of the protrusions moves along the corresponding limiting channel when the lifting component is lifted or lowered.

[0028] In some embodiments, the fixing assembly includes a base plate, the base plate is detachably fixed to a fixed reference surface of the wafer carrier, and the axis of the base plate coincides with the center of the fixed reference surface;

[0029] A central groove is provided on the upper surface of the base plate, a portion of the fixing component is provided in the central groove, and the outer circumference of the fixing component matches the inner circumference of the central groove so that the axis of the fixing component coincides with the axis of the base plate.

[0030] In some embodiments, the fixed reference surface includes a bearing surface and a positioning annular surface surrounding the bearing surface; a center positioning boss is provided on the lower surface of the base plate, and the bottom surface of the center positioning boss is used to overlap the bearing surface; the outer peripheral surface of the center positioning boss is used to cooperate with the positioning annular surface so that the axis of the base plate coincides with the center of the fixed reference surface.

[0031] As another technical solution, the present application also provides a centering method, using the above-mentioned centering device provided in the present application to align the inner circumference contour of the hollow process chamber of the semiconductor cleaning equipment with the wafer carrier; the method comprises:

[0032] Removably fixing the fixing assembly to the fixed reference surface of the wafer carrying device instead of the wafer carrying device;

[0033] The diameter of the limiting surface is adjusted to a value that matches the size of the inner circumference of the process chamber by the adjusting component;

[0034] The process chamber is sleeved on the outer periphery of the plurality of movable components, and the process chamber is fixed after the axis of the inner periphery of the process chamber coincides with the center of the fixed reference plane;

[0035] The diameter of the limiting surface is adjusted to a value suitable for removing the centering device by the adjusting component, and the centering device is removed from the space enclosed by the process chamber;

[0036] The wafer carrying device is fixed on the fixed reference surface.

[0037] As another technical solution, the present application also provides a centering method, using the centering device provided in the present application to align the inner periphery of the hollow process chamber of the semiconductor cleaning equipment with the wafer carrier; the method comprises:

[0038] Removably fixing the fixing assembly to the fixed reference surface of the wafer carrying device instead of the wafer carrying device;

[0039] The diameter of the limiting surface is adjusted to a preset value by the adjusting component; the preset value is smaller than the diameter of the limiting surface adapted to the size of the inner circumference of the process chamber;

[0040] The process chamber is sleeved on the outer periphery of the plurality of movable components;

[0041] The adjusting component is used to adjust the diameter of the limiting surface to a value that matches the size of the inner circumference of the process chamber, so that the axis of the inner circumference of the process chamber coincides with the center of the fixed reference surface;

[0042] fixing the process cavity;

[0043] The diameter of the limiting surface is adjusted to a value suitable for removing the centering device by the adjusting component, and the centering device is removed from the space enclosed by the process chamber;

[0044] The wafer carrying device is fixed on the fixed reference surface.

[0045] This application has the following beneficial effects:

[0046] In the technical solution of the centering device and centering method provided by the present application, first, a fixed component is used to replace the wafer carrier device and is detachably fixed to the fixed reference surface of the wafer carrier device. Then, when the process chamber is sleeved on the periphery of multiple movable components, the limiting surface jointly formed by the multiple movable components on the periphery can be used to automatically center the process chamber, that is, the axis of the inner circumference of the process chamber coincides with the center of the fixed reference surface, that is, the process chamber of the semiconductor cleaning equipment and the wafer carrier device are accurately aligned. On this basis, the adjustment component is used to drive the multiple movable components to move synchronously along the radial direction of the fixed reference surface to adjust the diameter of the limiting surface. Not only can the centering device be applied to process chambers with different inner circumference dimensions, but the centering device can also be switched between a centered state and a detachable state by adjusting the diameter of the limiting surface, so as to facilitate the installation and disassembly of the centering device. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] FIG1 is an overall structural diagram of a semiconductor cleaning device according to an embodiment of the present application;

[0048] FIG2 is an exploded view of the structure of the process chamber and the frame assembly at the connection position in an embodiment of the present application;

[0049] FIG3 is an installation diagram of the frame assembly and the rotary lifting mechanism in an embodiment of the present application;

[0050] FIG4 is an exploded view of the structure of the wafer carrying device and the rotary lifting mechanism in an embodiment of the present application;

[0051] FIG5 is a partial cross-sectional view of the wafer carrying device and the rotary lifting mechanism at the connection position in an embodiment of the present application;

[0052] FIG6 is a cross-sectional view of a process chamber in an embodiment of the present application;

[0053] FIG7 is a cross-sectional view of the structure of the process chamber in an embodiment of the present application;

[0054] FIG8 is a cross-sectional view of the positional relationship between the process chamber and the wafer carrier in an embodiment of the present application;

[0055] FIG9 is an overall structural diagram of a centering device provided in an embodiment of the present application;

[0056] FIG10 is an exploded view of the overall structure of the centering device provided in an embodiment of the present application;

[0057] FIG11 is a cross-sectional view of the overall structure of the centering device provided in an embodiment of the present application;

[0058] FIG12 is a top view of the overall structure of the centering device provided in an embodiment of the present application;

[0059] FIG13 is a structural diagram of a mobile component in an embodiment of the present application;

[0060] FIG14 is an exploded view of the structure of a mobile assembly in an embodiment of the present application;

[0061] FIG15 is a structural diagram of an adjustment component in an embodiment of the present application;

[0062] FIG16 is a cross-sectional view of an adjustment assembly in an embodiment of the present application;

[0063] FIG17 is an exploded view of the structure of the adjustment assembly in an embodiment of the present application;

[0064] FIG18 is a partial cross-sectional view of the connection position of the centering device and the rotary lifting mechanism provided in an embodiment of the present application;

[0065] FIG19 is an exploded cross-sectional view of the structure of the centering device and the rotary lifting mechanism at the connection position provided in an embodiment of the present application;

[0066] FIG20 is a structural diagram of the adapter in an embodiment of the present application;

[0067] FIG21 is a flow chart of a centering method provided in an embodiment of the present application;

[0068] FIG22 is a cross-sectional view of a process chamber sleeved on a centering device according to an embodiment of the present application;

[0069] FIG23 is a flow chart of another centering method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0070] In order to enable those skilled in the art to better understand the technical solution of the present application, the centering device and centering method provided in the present application are described in detail below with reference to the accompanying drawings.

[0071] The embodiment of the present application provides a centering device for centering the process chamber of a semiconductor cleaning device with a wafer carrier. Specifically, in some embodiments, please refer to Figures 1 to 4 together. The semiconductor cleaning equipment mainly includes a process chamber 100, a frame assembly 200, a rotary lifting mechanism 300 and a wafer carrier 400, wherein the process chamber 100 is hollow, and the positive projection shape of its inner circumference on its radial cross section is, for example, a circle. However, the embodiment of the present application is not limited to this. In actual applications, the positive projection shape of the inner circumference of the process chamber 100 on its radial cross section can also be a regular polygon with an inscribed circle such as a square, a regular hexagon, etc. That is, the centering device provided in the embodiment of the present application can be applicable to a process chamber whose positive projection shape of the inner circumference on its radial cross section is a circle, or a regular polygon with an inscribed circle such as a square, a regular hexagon, etc., to achieve centering of the process chamber with the wafer carrier. The following describes in detail the structure and function of the centering device provided in the embodiments of the present application by taking a process chamber whose inner circumference contour on its radial cross section is a circular orthographic projection as an example.

[0072] Specifically, the process chamber 100 includes a chamber shell, which is fixedly connected to the frame assembly 200, and the frame assembly 200 includes, for example, a frame fixing plate 201 and a frame connecting plate 202, which are spliced ​​to form a center hole 203. The wafer carrier 400 is fixedly connected to the driving shaft (such as a motor rotor) of the rotating lifting mechanism 300 through the center hole 203. The rotating lifting mechanism 300 is fixed as a whole to the bottom of the frame assembly 200, and is used to drive the wafer carrier 400 to rise and fall and rotate relative to the process chamber 100.

[0073] The bottom of the chamber shell of the process chamber 100 is provided with a plurality of threaded holes 101, such as the three threaded holes 101 shown in FIG2, and the plurality of threaded holes 101 are symmetrically distributed along the circumference of the chamber shell. In addition, a plurality of mounting holes 204 are provided on the frame assembly 200 (i.e., the frame fixing plate 201 and the frame connecting plate 202), each mounting hole 204 corresponds to each threaded hole 101, and the chamber shell and the frame assembly 200 can be fixedly connected by using a plurality of screws 205 that pass through the plurality of mounting holes 204 and the corresponding threaded holes 101 in a one-to-one correspondence. On this basis, the diameter of the mounting hole 204 is larger than the diameter of the threaded hole 101 (for example, the difference is about 4mm), so that before the screw 205 is tightened, the position of the chamber shell and its internal components in the plane freedom direction can be adjusted (for example, the adjustment amount in any direction is about 2mm), thereby reserving adjustment space for the inner peripheral contour of the process chamber 100 and the centering of the wafer carrier 400.

[0074] A drive connector 301 is mounted on the upper end of the drive shaft (e.g., a motor rotor) of the rotary lifting mechanism 300. The drive connector 301 is positioned with the drive shaft via a locating pin to achieve centering between the two. An adapter 302 is also mounted on the drive connector 301. The adapter 302 is positioned with the drive connector 301 via a locating pin to achieve centering between the two. Referring to Figures 4 and 5 , a wafer carrier 400 is mounted on the adapter 302. A positioning cylinder 401 is provided at the bottom of the wafer carrier 400. The adapter 302 is provided with a positioning groove. The outer circumference of the positioning cylinder 401 cooperates with the inner circumference of the positioning groove to achieve centering between the wafer carrier 400 and the adapter 302, thereby indirectly achieving centering between the wafer carrier 400 and the drive shaft (e.g., a motor rotor) of the rotary lifting mechanism 300.

[0075] Please refer to Figures 6 to 8 together. The process chamber 100 also includes a plurality of annular recovery troughs, a plurality of annular air guide blocks, an annular baffle, and an annular chamber cover arranged in the chamber housing 102. It should be noted that the annular ring refers to a hollow closed loop extending in the circumferential direction. The closed loop can be a circular ring or a regular polygonal ring with an inscribed circle such as a square ring or a regular hexagonal ring. The number of recovery troughs is the same as the number of air guide blocks. For example, if there are three recovery troughs, the three recovery troughs are the first recovery trough 103a, the second recovery trough 103b, and the third recovery trough 103c; the three air guide blocks are the first air guide block 104a, the second air guide block 104b, and the third air guide block 104c. The first recovery trough 103a is placed at the bottom of the interior space of the cavity shell 102. An annular step structure is provided at the bottom of the first recovery trough 103a, comprising a plurality of bosses 102a evenly distributed along its circumference. Correspondingly, an annular recess 102b is provided at the bottom of the interior space of the cavity shell 102. The bosses 102a and recesses 102b are positioned and matched with each other circumferentially to achieve centering of the first recovery trough 103a with the cavity shell 102. A baffle 105 is placed on the inner circumferential wall of the first recovery trough 103a. An annular step is provided at the inner circumferential edge of the baffle 105 for positioning and matching with the upper end surface and outer circumferential surface of the inner circumferential wall of the first recovery trough 103a to achieve centering of the baffle 105 with the first recovery trough 103a. The first air guide block 104a is placed on the outer peripheral wall of the first recovery trough 103a and is positioned in the center of the first recovery trough 103a using a similar positioning method as the baffle 105. Similarly, the second recovery trough 103b, the second air guide block 104b, the third recovery trough 103c, and the third air guide block 104b are sequentially stacked on the first air guide block 104a and positioned in the center of adjacent components using a similar positioning method as the baffle 105. The cavity top cover 106 is stacked on the third air guide block 104c, located at the top layer, and is fixedly connected to the cavity housing 102 to compress and secure the various components located below it.

[0076] Driven by the rotary lifting mechanism 300, the wafer carrier 400 can be raised and lowered in the space enclosed by the process chamber 100 to reach a height position corresponding to any recovery tank body. For example, as shown in FIG8 , the wafer carrier 400 is currently at a height position corresponding to the first recovery tank body 103a. In order to ensure process effects such as the recovery efficiency, backsplash, and etching rate uniformity of the chemical solution, the axis of the wafer carrier 400 at the current height position should coincide with the axis of the first recovery tank body 103a, the first air guide block 104a, and the baffle 105. Similarly, when the wafer carrier 400 is at a height position corresponding to other recovery tank bodies, it is also necessary to align with the recovery tank body and air guide block at the corresponding height.

[0077] However, since the above-mentioned process chamber is a multi-layer structure consisting of multiple recovery layers and air guide blocks, and these components are generally resin parts with large processing tolerances, this causes the components between different layers to shake greatly after installation, making it difficult to ensure the alignment between different layers by visual observation alone.

[0078] In order to solve the above problems, please refer to Figure 9. The centering device 500 provided in the embodiment of the present application includes a fixed component 1, a plurality of moving components 2 and an adjustment component 3, wherein the fixed component 1 is used to replace the wafer carrier 400 and is detachably fixed to the fixed reference surface of the wafer carrier 400. The wafer carrier 400 is, for example, a chuck. Specifically, the wafer carrier 400 is, for example, fixedly connected to the drive shaft (e.g., motor rotor) of the rotary lifting mechanism 300, specifically, the above-mentioned adapter 302 and the drive connector 301 are fixedly connected to the drive shaft (e.g., motor rotor) of the rotary lifting mechanism 300. In this case, as shown in Figure 5, the above-mentioned fixed reference surface includes the bottom surface of the positioning groove provided on the adapter 302, and the wafer carrier 400 is detachably fixed to the bottom surface, for example, fixedly connected to the adapter 302 by screws, and the axis of the wafer carrier 400 is coincident with the center of the fixed reference surface. Of course, in actual applications, the wafer carrier 400 can also be detachably fixed to other components. For example, for a wafer carrier 400 that does not need to be lifted and / or rotated, it can also be fixed to the bottom of the process chamber 100. In this case, the fixed reference surface of the wafer carrier 400 is the area at the bottom of the process chamber 100 for fixing the wafer carrier 400. It should be noted that the embodiment of the present application does not have any special restrictions on the shape and size of the fixed reference surface of the wafer carrier 400, which is determined according to the specific fixed surface of the wafer carrier 400.

[0079] The wafer carrier 400, fixed to the fixed reference plane, has its axis aligned with the center of the fixed reference plane, thereby achieving centering of the wafer carrier 400 and the adapter 302, thereby indirectly achieving centering of the wafer carrier 400 and the drive shaft (e.g., the motor rotor) of the rotary lifting mechanism 300. In this case, the fixed component 1, as a support structure for the multiple moving components 2 and the adjustment component 3, can replace the wafer carrier 400 and be removably fixed to the fixed reference plane, so that the position of the centering device 500 is the same as the position of the wafer carrier 400. Therefore, by aligning the process chamber 100 with the centering device 500, that is, aligning the axis of the process chamber 100 with the center of the fixed reference plane, the process chamber 100 and the wafer carrier 400 can be indirectly aligned.

[0080] A plurality of movable components 2 are arranged at intervals along the circumference of the fixed reference plane on the fixed component 1, and can move radially along the fixed reference plane, where the radial direction of the fixed reference plane refers to the extension direction of any straight line that intersects with the center of the fixed reference plane within the fixed reference plane. The plurality of movable components 2 together constitute a limiting surface at the periphery, which is used to coincide the axis of the inner circumference of the process chamber 100 that is sleeved on the periphery of the plurality of movable components 2 with the center of the fixed reference plane. When the process chamber 100 (such as each recovery tank body, each air guide block, baffle, etc.) is sleeved on the periphery of the plurality of movable components 2, the process chamber 100 can be automatically centered under the limiting action of the above-mentioned limiting surface, that is, the process chamber 100 can adaptively coincide the axis of its inner circumference with the center of the fixed reference plane. The process chamber 100 can be fixed in the position after the centering is completed, and the centering device 500 can be removed, and then the wafer carrier 400 can be fixed to the above-mentioned fixed reference surface, thereby achieving precise alignment of the process chamber 100 and the wafer carrier 400. On this basis, the adjustment component 3 is arranged on the fixed component 1, which is used to drive the multiple moving components 2 to move synchronously along the radial direction of the fixed reference surface to adjust the diameter of the limiting surface. By adjusting the diameter of the above-mentioned limiting surface with the help of the adjustment component 3, not only can the centering device 500 be applied to process chambers 100 with different inner peripheral contour sizes, but the centering device 500 can also be switched between a centered state and a detachable state by adjusting the diameter of the limiting surface, so as to facilitate the installation and disassembly of the centering device 500. For example, in the centered state, the diameter of the limiting surface is adapted to the size of the inner circumference of the process chamber 100 to be centered (e.g., the diameter of the inner circumference of a circle, or the diameter of the inscribed circle of the inner circumference of a regular polygon). For example, the diameter of the limiting surface is slightly smaller than the size of the inner circumference of the process chamber 100, so that the process chamber 100 sleeved on the outer periphery of the plurality of movable components 2 can be automatically centered. In the detachable state, the diameter of the limiting surface is, for example, a value adapted for removing the centering device 500 (the value is, for example, smaller than the diameter of the limiting surface, and the difference is, for example, 7 mm), so that the centering device 500 can be removed from the space enclosed by the process chamber 100. It is easy to understand that the plurality of movable components 2 are driven by the adjustment component 3 to move synchronously along the radial direction of the fixed reference plane, and when the process chamber 100 is sleeved on the outer periphery of the plurality of movable components 2 and automatically adjusts its own position, the plurality of movable components 2 are fixed, that is, the diameter of the limiting surface remains unchanged.

[0081] In some embodiments, the adjustment assembly 3 for driving the multiple moving assemblies 2 to move synchronously along the radial direction of the fixed reference plane can have various structures. For example, referring to Figures 10 and 11, the adjustment assembly 3 includes a lifting component 31, which is arranged to be lifted and lowered on the fixed assembly 1, and the lifting component 31 has a mating surface 311 inclined relative to the vertical direction; the multiple moving assemblies 2 are configured to maintain contact with the mating surface 311 when the lifting component 31 is lifted and lowered, so as to move synchronously along the radial direction of the fixed reference plane under the drive of the mating surface 311. Specifically, the diameter of the circumference of the mating surface 311 decreases from top to bottom. In this case, if the lifting component 31 rises, the mating surface 311 rises accordingly, and the position where the moving assembly 2 contacts the mating surface 311 moves downward, that is, moves to a position with a smaller diameter, thereby enabling the multiple moving assemblies 2 to move radially along the fixed reference plane toward the center of the mating surface 311. If the lifting member 31 descends, the mating surface 311 descends accordingly. At this point, the position where the moving assembly 2 contacts the mating surface 311 shifts upward, i.e., to a position with a larger diameter. This allows the multiple moving assemblies 2 to move radially from the fixed reference plane toward the center of the mating surface 311. Of course, the embodiments of the present application are not limited thereto. For example, the diameter of the circle on which the mating surface 311 resides may also increase from top to bottom. In this case, if the lifting member 31 ascends, the mating surface 311 ascends accordingly. At this point, the position where the moving assembly 2 contacts the mating surface 311 shifts downward, i.e., to a position with a larger diameter. This allows the multiple moving assemblies 2 to move radially from the fixed reference plane toward the center of the mating surface 311. If the lifting member 31 descends, the mating surface 311 descends accordingly. At this point, the position where the moving assembly 2 contacts the mating surface 311 shifts upward, i.e., to a position with a smaller diameter. This allows the multiple moving assemblies 2 to move radially from the fixed reference plane toward the center of the mating surface 311.

[0082] In order to ensure that the plurality of movable components 2 maintain contact with the mating surface 311 when the lifting component 31 is lifted or lowered, the structure of each movable component 2 can be various. For example, please refer to Figures 10 and 11. Each movable component 2 includes a movable component 21 and an elastic component 22, wherein the movable component 21 is arranged on the fixed component 1 and can move radially along the fixed reference plane. The movable component 21, for example, includes a movable plate, which is arranged on the fixed component 1 and can move radially along the fixed reference plane. For example, the movable plate and the fixed component 1 are movably connected by providing a guide rail slider structure therebetween. Specifically, the fixed component 1, for example, includes a base plate 11, which is detachably fixed to the fixed reference plane of the wafer carrier 400, and the axis of the base plate 11 coincides with the center of the fixed reference plane. In addition, a guide rail 41 extending radially along the fixed reference plane is provided on the base plate 11, and a slider 42 is connected to the guide rail 41 and can slide along the guide rail 41. The elastic member 22 is connected to the movable member 21 and the fixed assembly 1 (e.g., the base plate 11), respectively, and is used to apply an elastic force to the movable member 21 to maintain contact between the movable member 21 and the mating surface 311. Under the action of this elastic force, the movable member 21 can always maintain contact with the mating surface 311, thereby allowing it to move radially along the fixed reference plane as the mating surface 311 rises and falls.

[0083] In some embodiments, the elastic component 22 includes a tension spring, one end of which is connected to the fixed component 1 (such as the base plate 11), and the other end of which is connected to the movable component 21. The tension spring applies an elastic force to the movable component 21. Specifically, as shown in Figure 12, a fixed end screw 231 is fixed on the upper surface of the base plate 11, and a movable end screw 232 is fixed on the upper surface of the movable plate, and the two ends of the tension spring are fixedly connected to the fixed end screw 231 and the movable end screw 232 respectively. When the movable component 21 (i.e., the movable plate) is at the position closest to the axis of the base plate 11, the tension spring is in an unstretched state or in a stretched state. When the lifting component 31 descends, driven by the mating surface 311, the movable plate moves along the radial direction of the fixed reference surface toward the direction away from the axis of the base plate 11. At this time, the tensile deformation generated by the tension spring gradually increases, applying an elastic force to the movable component 21 that enables the movable component 21 to maintain contact with the mating surface 311. In a specific embodiment, the above-mentioned fixed end screw 231 is located on one side of the moving part 21 (i.e., the moving plate) to avoid interfering with the movement of the moving plate. Moreover, the fixed end screw 231 is closer to the center of the base plate 11 relative to the moving end screw 232, so as to generate sufficient elastic force when the moving plate moves in a direction radially away from the axis of the base plate 11 along the fixed reference plane.

[0084] In some embodiments, each movable component 21 further includes a limiting column 24 vertically arranged on the movable component 21 (i.e., the movable plate), and the limiting columns 24 of the plurality of movable components 21 together constitute the above-mentioned limiting surface at the periphery. By adopting the limiting columns 24 to jointly constitute the limiting surface at the periphery, there can be sufficient height so that the components of the process chamber 100, such as the various recovery tanks, the various air guide blocks, the baffles, etc., can be sleeved on the periphery of the plurality of limiting columns 24 and automatically centered. Furthermore, in some embodiments, a rolling fit structure is provided on the movable component 21, and the rolling fit structure is in rolling contact with the mating surface 311. In this way, the sliding friction between the movable component 21 and the mating surface 311 can be converted into rolling friction, thereby improving the smoothness of the movement of the rolling fit structure and the mating surface 311. The rolling fit structure for achieving the above-mentioned function can have a variety of structures. For example, please refer to Figures 13 and 14 together. The rolling fit structure includes a support shaft 252 and a bearing 251. The bearing 251 is connected to the movable part 21 through the support shaft 252, and the bearing 251 can rotate around the support shaft 252. The outer peripheral surface of the bearing 251 is in rolling contact with the fitting surface 311. In order to limit the relative positions of the support shaft 252, the bearing 251 and the movable plate, bearing blocks 253 are further provided on both sides of the bearing 251. In addition, in a specific embodiment, two support shaft mounting portions 211 are provided at one end of the movable part 21 near the fitting surface 311. One end of the support shaft 252 is inserted into the mounting hole 211b of one of the support shaft mounting portions 211, and the other end of the support shaft 252 is threadedly connected to the threaded hole 211a of the other support shaft mounting portion 211 to achieve fixation of the support shaft 252. The bearing 251 is sleeved on the support shaft 252 and is located between the two support shaft mounting portions 211. The bearing 251 protrudes relative to the two support shaft mounting portions 211 toward the mating surface 311 so as to be in rolling contact with the mating surface 311. Of course, in actual applications, the rolling contact structure can also be other structures such as rollers that can be in rolling contact with the mating surface 311.

[0085] In some embodiments, in order to achieve the coincidence of the axis of the inner circumference of the process chamber 100 with the center of the fixed reference plane, please refer to Figures 11, 15, 16 and 17. The adjustment component 3 also includes a fixing component 32 and an adjustment structure 33, wherein the fixing component 32 is fixedly connected to the fixing component 1 (such as the base plate 11), for example, by a screw; the axis of the fixing component 32 coincides with the axis of the fixing component 1 (such as the base plate 11); the axis of the fixing component 1 (such as the base plate 11) coincides with the center of the fixed reference plane; the lifting component 31 is connected to the fixing component 32 by the adjustment structure 33 so that the fixing component 32 and the lifting component 31 are matched in the vertical direction so that the axis of the mating surface 311 coincides with the axis of the fixing component 32; the adjustment structure 33 is used to drive the lifting component 31 to rise and fall relative to the fixing component 32.

[0086] Specifically, there are many ways in which the axis of the fixed component 1 (such as the base plate 11) can coincide with the center of the fixed reference surface. For example, please refer to Figures 18 to 20. The above-mentioned fixed reference surface includes the bottom surface 302a1 of the positioning groove 302a set on the adapter 302. On this basis, a center positioning boss 111 is provided on the lower surface of the base plate 11, and the bottom surface of the center positioning boss 111 is used to be set on the bottom surface 302a1 of the positioning groove 302a; the outer peripheral surface of the center positioning boss 111 is used to cooperate with the inner peripheral surface 302a2 of the positioning groove 302a so that the axis of the base plate 11 coincides with the center of the fixed reference surface.

[0087] In some embodiments, there are various ways to achieve the alignment of the axis of the fixing component 32 with the axis of the fixing assembly 1 (e.g., the base plate 11). For example, as shown in FIG10 , a central groove 112 is provided on the upper surface of the base plate 11, a portion of the fixing component 32 is disposed in the central groove 112, and the outer circumference of the fixing component 32 cooperates with the inner circumference of the central groove 112 so that the axis of the fixing component 32 coincides with the axis of the base plate 11. In this case, by engaging the fixing component 32 with the lifting component 31 in a vertically limited position, the axis of the mating surface 311 can be aligned with the axis of the fixing component 32, thereby indirectly aligning the axis of the mating surface 311 with the axis of the fixing assembly 1 (e.g., the base plate 11), and further aligning with the center of the fixed reference surface. Furthermore, the fixed component 32 and the lifting component 31 can be positioned vertically in a variety of ways. For example, as shown in Figures 15 to 17, the fixed component 32 has a hollow portion, the lifting component 31 is disposed within the hollow portion, and the inner circumferential wall of the hollow portion (i.e., the inner circumferential wall of the hollow portion enclosed by the fixed component 32) is positioned to mate with the outer circumferential wall of the lifting component 31 so that the axis of the mating surface 311 coincides with the axis of the fixed component 32. Specifically, the fixed component 32 is, for example, a cylindrical body having a hollow portion, the top of which has a top wall and the bottom of which has an opening. The lifting component 31 is also a cylindrical body, and the outer circumferential surface of the cylindrical body is positioned to mate with the inner circumferential surface of the hollow portion so that the axis of the mating surface 311 coincides with the axis of the fixed component 32. Furthermore, the lifting component 31 can be raised and lowered within the hollow portion. Specifically, a certain lifting space can be reserved above and below the lifting component 31 in the hollow portion, such as the space A above the lifting component 31 shown in Figure 16.

[0088] In order to achieve the goal of driving the lifting component 31 to rise and fall relative to the fixing component 32, the adjustment structure 33 can have a variety of structures. For example, as shown in Figures 15 to 17, the adjustment structure 33 includes an adjusting stud 331, a fixing screw 332 and a locking nut 333. As shown in Figure 17, a first threaded hole 322 is provided in the fixing component 32 and above the hollow portion. The two ends of the first threaded hole 322 pass through the upper surface of the fixing component 32 and the inner surface of the hollow portion (that is, the inner surface of the top wall of the hollow portion) in the vertical direction respectively; the adjusting stud 331 has an external thread and is threadedly engaged with the first threaded hole 322. By rotating the adjusting stud 331, the adjusting stud 331 can be raised and lowered relative to the fixing component 32; the locking nut 333 is threadedly engaged with the adjusting stud 331 and can be tightened on the upper surface of the fixing component 32 to lock the position of the adjusting stud 331. The adjusting stud 331 has a center hole 331a extending axially therethrough (as shown in FIG. 16 ). The upper surface of the lifting component 31 is provided with a second threaded hole 313 (as shown in FIG. 17 ). A fixing screw 332 passes through the center hole 331a from above the adjusting stud 331 and extends into the hollow portion, where it is threadedly connected to the second threaded hole 313. The screw head of the fixing screw 332 overlaps the upper end surface of the adjusting stud 331. When the adjusting stud 331 is raised or lowered relative to the fixed component 32, it can drive the fixing screw 332 to rise or fall, thereby driving the lifting component 31 connected to the fixing screw 332 to rise or fall. In a specific embodiment, the first threaded hole 322 is coaxially arranged with the fixed component 32, and the center hole 331a and the second threaded hole 313 are both coaxially arranged with the first threaded hole 322. In addition, the center hole 331a is, for example, a light hole.

[0089] In some embodiments, as shown in Figures 15 to 17, a plurality of protrusions 312 are provided at intervals on the outer periphery of the lifting component 31. For example, the lifting component 31 is a cylinder, and the plurality of protrusions 312 are provided on the outer periphery of the cylinder. The plurality of protrusions 312 all have an inclined surface 311a, and together they constitute a mating surface 311; each movable component 2 maintains contact with each inclined surface 311a in a one-to-one correspondence; a plurality of limiting channels 321 are provided on the fixed component 32 extending in the vertical direction, and each protrusion 312 is provided in each limiting channel 321 in a one-to-one correspondence, and moves along the corresponding limiting channel 321 when each lifting component 31 is raised or lowered. By causing each protrusion 312 to rise and fall along the corresponding limiting channel 321, the relative rotation of the lifting component 31 and the fixed component 32 can be limited.

[0090] As another technical solution, referring to FIG. 21 , an embodiment of the present application further provides a centering method, using the centering device 500 provided in the embodiment of the present application to align the inner circumference of the hollow process chamber 100 of the semiconductor cleaning equipment with the wafer carrier 400. The method includes:

[0091] S101 , replacing the wafer carrying device 400 with the fixing component 1 and detachably fixing it to the fixed reference surface of the wafer carrying device 400 , such as the position shown in FIG. 18 .

[0092] The fixed component 1 serves as a supporting structure for multiple moving components 2 and adjustment components 3, and can be detachably fixed to the above-mentioned fixed reference plane instead of the wafer carrier 400, so that the position of the centering device 500 is the same as the position of the wafer carrier 400. The process chamber 100 and the wafer carrier 400 can be indirectly aligned by aligning the process chamber 100 with the centering device 500, that is, by aligning the axis of the inner circumference of the process chamber 100 with the center of the fixed reference plane.

[0093] The fixing assembly 1, for example, includes a base plate 11, which is removably fixed to a fixed reference surface of the wafer carrier 400, with the axis of the base plate 11 coinciding with the center of the fixed reference surface. This coincidence can be achieved in a variety of ways. For example, the fixed reference surface may comprise the bottom surface of a positioning groove provided on the adapter 302. On this basis, a center positioning boss is provided on the lower surface of the base plate 11, the bottom surface of which is adapted to be positioned on the bottom surface of the positioning groove; the outer circumference of the center positioning boss is adapted to cooperate with the inner circumference of the positioning groove to ensure that the axis of the base plate 11 coincides with the center of the fixed reference surface.

[0094] S102, adjusting the diameter of the limiting surface to a value that matches the size of the inner circumference of the process chamber 100 (e.g., the diameter of the inner circumference of a circle, or the diameter of the inscribed circle of a regular polygon) by adjusting the component 3;

[0095] The diameter of the limiting surface is, for example, slightly smaller than the inner circumference of the process chamber 100. This allows the process chamber 100 to be more easily positioned around the outer circumferences of the plurality of movable components 2 while aligning the axis of the inner circumference of the process chamber 100 with the center of the fixed reference surface. Preferably, the difference between the inner circumference of the process chamber 100 (e.g., the diameter of a circular inner circumference or the diameter of the inscribed circle of a regular polygon) and the diameter of the limiting surface is greater than or equal to 0.2 mm and less than or equal to 0.4 mm.

[0096] S103, the process chamber 100 is sleeved on the outer periphery of the plurality of movable components 2, and after the axis of the inner periphery of the process chamber 100 coincides with the center of the fixed reference plane, the process chamber 100 is fixed; the position of the process chamber 100 sleeved on the outer periphery of the plurality of movable components 2 is shown in FIG. 22 .

[0097] In some embodiments, the bottom of the chamber housing of the process chamber 100 is provided with a plurality of threaded holes, and the frame assembly 200 (i.e., the fixing plate and the frame connecting plate 202) is provided with a plurality of mounting holes, each of which corresponds to a threaded hole. The chamber housing and the frame assembly 200 can be fixedly connected using a plurality of screws that pass through the plurality of mounting holes and the corresponding threaded holes in a one-to-one correspondence. Furthermore, the diameter of the mounting holes is larger than the diameter of the threaded holes (e.g., the difference is approximately 4 mm). Thus, before tightening the screws, the position of the chamber housing and its internal components in the plane of freedom can be adjusted (e.g., the adjustment amount in any direction is approximately 2 mm), thereby reserving adjustment space for the alignment of the process chamber 100 and the wafer carrier 400.

[0098] On this basis, in the above step S103, when the process chamber 100 (such as each recovery tank, each air guide block, baffle, etc.) is sleeved on the periphery of the plurality of movable components 2, under the limiting action of the above-mentioned limiting surface, the process chamber 100 can be automatically centered, that is, the process chamber 100 can adaptively make the axis of its inner peripheral contour coincide with the center of the fixed reference surface. Then, tighten the screws installed in the above-mentioned mounting holes and the corresponding threaded holes to lock the position of the cavity shell. In addition, the cavity top cover is superimposed on the air guide block located on the top layer and fixedly connected to the cavity shell to press and fix the various components located thereunder.

[0099] S104, adjusting the diameter of the limiting surface to a value suitable for removing the centering device 500 through the adjusting component 3, and removing the centering device 500 from the space enclosed by the process chamber 100;

[0100] Preferably, in order to facilitate removal of the centering device 500 from the space enclosed by the process chamber 100 , the difference between the size of the inner circumference of the process chamber 100 and the value adapted for removal of the centering device 500 is approximately equal to 7 mm.

[0101] S105 , fixing the wafer carrying device 400 on a fixed reference surface.

[0102] In some embodiments, the wafer carrier 400 is, for example, a chuck. Specifically, the wafer carrier 400 is, for example, fixedly connected to the drive shaft (e.g., motor rotor) of the rotary lifting mechanism 300, specifically, the adapter 302 and the drive connector 301 are fixedly connected to the drive shaft (e.g., motor rotor) of the rotary lifting mechanism 300. In this case, the fixed reference plane includes the bottom surface of the positioning groove provided on the adapter 302, and the wafer carrier 400 is detachably fixed to the bottom surface, for example, fixedly connected to the adapter 302 by screws, and the axis of the wafer carrier 400 is coincident with the center of the fixed reference plane. Of course, in actual applications, the wafer carrier 400 can also be detachably fixed to other components. For example, for a wafer carrier 400 that does not need to be lifted and / or rotated, it can also be fixed to the bottom of the process chamber 100.

[0103] As another technical solution, referring to FIG. 23 , an embodiment of the present application further provides a centering method, using the centering device 500 provided in the embodiment of the present application to align the inner circumference of the hollow process chamber 100 of the semiconductor cleaning equipment with the wafer carrier 400. The method includes:

[0104] S201, replacing the wafer carrying device 400 with the fixing component 1 and detachably fixing it to the fixed reference surface of the wafer carrying device 400;

[0105] S202 , adjusting the diameter of the limiting surface to a preset value through the adjusting component 3 ; the preset value is smaller than the diameter of the limiting surface that matches the size of the inner circumference of the process chamber 100 .

[0106] That is, the difference between the size of the inner periphery of the process chamber 100 and the above-mentioned preset value satisfies: enabling the process chamber 100 to be more easily mounted on the outer periphery of the plurality of movable components 2, preferably about 3 mm.

[0107] S203, sleeve the process chamber 100 on the outer periphery of the plurality of moving components 2;

[0108] S204, adjusting the diameter of the limiting surface to a value that matches the size of the inner circumference of the process chamber 100 through the adjusting component 3, so that the axis of the inner circumference of the process chamber 100 coincides with the center of the fixed reference surface;

[0109] S205, fixing the process chamber 100;

[0110] S206 , adjusting the diameter of the limiting surface to a value suitable for removing the centering device 500 through the adjusting component 3 , and removing the centering device 500 from the space enclosed by the process chamber 100 ;

[0111] Preferably, in order to facilitate removal of the centering device 500 from the space enclosed by the process chamber 100 , the difference between the size of the inner circumference of the process chamber 100 and the value adapted for removal of the centering device 500 is approximately equal to 7 mm.

[0112] S207 , fixing the wafer carrying device 400 on a fixed reference surface.

[0113] The centering method provided in this embodiment is similar to the centering method provided in the previous embodiment. Since it has been described in detail in the previous embodiment, it will not be repeated here.

[0114] In the technical solution of the centering device 500 and the centering method provided in the embodiment of the present application, first, a fixed component 1 is used to replace the wafer carrier 400 and is detachably fixed to the fixed reference surface of the wafer carrier 400. Then, when the process chamber 100 is sleeved on the outer periphery of the multiple movable components 2, the limiting surface formed by the multiple movable components 2 on the outer periphery can be used to automatically center the process chamber 100, that is, the axis of the inner periphery of the process chamber 100 coincides with the center of the fixed reference surface, that is, the process chamber 100 of the semiconductor cleaning equipment and the wafer carrier 400 are accurately aligned. On this basis, the adjustment component 3 is used to drive the multiple movable components 2 to move synchronously along the radial direction of the fixed reference surface to adjust the diameter of the limiting surface. Not only can the centering device 500 be applied to process chambers 100 with different inner periphery dimensions, but the centering device 500 can also be switched between a centered state and a detachable state by adjusting the diameter of the limiting surface, so as to facilitate the installation and removal of the centering device 500.

[0115] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present application, and the present application is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present application, and such modifications and improvements are also considered to be within the scope of protection of the present application.

Claims

1. A centering device, characterized in that: It is used to align the inner periphery of the hollow process chamber of the semiconductor cleaning equipment with the wafer carrying device, and the centering device includes a fixed component, a plurality of moving components and an adjusting component, wherein: The fixing assembly is used to replace the wafer carrying device and is detachably fixed to the fixed reference surface of the wafer carrying device; A plurality of movable components are arranged on the fixed component at intervals along the circumference of the fixed reference surface, and can move radially along the fixed reference surface. The plurality of movable components together form a limiting surface at the outer periphery, which is used to make the axis of the inner peripheral contour of the process chamber sleeved on the outer periphery of the plurality of movable components coincide with the center of the fixed reference surface; The adjusting component is arranged on the fixing component, and is used for driving the plurality of moving components to move synchronously along the radial direction of the fixing reference surface, so as to adjust the diameter of the limiting surface.

2. The centering device according to claim 1, characterized in that: The adjusting assembly includes a lifting component, the lifting component is escalably disposed on the fixing assembly, and the lifting component has a matching surface inclined relative to the vertical direction; The plurality of moving components are arranged to keep in contact with the matching surface when the lifting component is lifted or lowered, so as to move synchronously along the radial direction of the fixed reference surface driven by the matching surface.

3. The centering device according to claim 2, characterized in that: Each of the moving components comprises a moving part and an elastic part, wherein: The moving component is arranged on the fixed component and can move radially along the fixed reference plane; The elastic component is connected to the moving component and the fixed component respectively, and is used to apply an elastic force to the moving component so as to keep the moving component in contact with the matching surface.

4. The centering device according to claim 3, characterized in that: The elastic component comprises a tension spring, one end of which is connected to the fixed component, and the other end of which is connected to the moving component.

5. The centering device according to claim 3, characterized in that: The moving component comprises a moving plate and a limiting column vertically arranged on the moving plate, wherein the moving plate is arranged on the fixed component and can move radially along the fixed reference plane; The limiting posts of the plurality of movable components together form the limiting surface at the outer periphery.

6. The centering device according to claim 3, characterized in that: The moving component is provided with a rolling matching structure, and the rolling matching structure is in rolling contact with the matching surface.

7. The centering device according to claim 6, characterized in that: The rolling matching structure includes a support shaft and a bearing. The bearing is connected to the moving component through the support shaft and can rotate around the support shaft. The outer peripheral surface of the bearing is in rolling contact with the matching surface.

8. The centering device according to claim 2, characterized in that: The adjustment assembly further comprises a fixing component and an adjustment structure, wherein the fixing component is fixedly connected to the fixing assembly; the axis of the fixing component coincides with the axis of the fixing assembly; the axis of the fixing assembly coincides with the center of the fixing reference plane; The lifting component is liftably connected to the fixed component through the adjusting structure, and the fixed component and the lifting component are matched with each other in the vertical limit position so that the axis of the matching surface coincides with the axis of the fixed component; The adjusting structure is used to drive the lifting component to move up and down relative to the fixing component.

9. The centering device according to claim 8, characterized in that: The fixing component has a hollow portion, the lifting component is arranged in the hollow portion, and the inner peripheral wall of the hollow portion is limitedly matched with the outer peripheral wall of the lifting component so that the axis of the matching surface coincides with the axis of the fixing component.

10. The centering device according to claim 9, characterized in that: The adjustment structure includes an adjustment stud, a fixing screw and a locking nut, wherein a first threaded hole is provided in the fixing component and located above the hollow portion, and two ends of the first threaded hole respectively penetrate the upper surface of the fixing component and the inner surface of the hollow portion in a vertical direction; the adjustment stud has an external thread and is threadedly matched with the first threaded hole; the locking nut is threadedly matched with the adjustment stud and can be tightened on the upper surface of the fixing component; The adjusting stud has a central hole extending axially therethrough, and a second threaded hole is provided on the upper surface of the lifting component; the fixing screw passes through the central hole from above the adjusting stud, extends into the hollow portion, and is threadedly connected with the second threaded hole.

11. The centering device according to claim 8, characterized in that: The outer periphery of the lifting component is provided with a plurality of convex parts at intervals, and the plurality of convex parts all have inclined surfaces, and together constitute the matching surface; each of the moving components keeps contact with each of the inclined surfaces in a one-to-one correspondence; A plurality of limiting channels are extended along the vertical direction on the fixing component, each of the convex parts is arranged in each of the limiting channels in a one-to-one correspondence, and each of the convex parts moves along the corresponding limiting channel when the lifting component is lifted or lowered.

12. The centering device according to claim 8, characterized in that: The fixing assembly comprises a bottom plate, the bottom plate is detachably fixed to a fixed reference plane of the wafer carrying device, and the axis of the bottom plate coincides with the center of the fixed reference plane; A central groove is arranged on the upper surface of the base plate, a part of the fixing component is arranged in the central groove, and the outer circumference of the fixing component matches the inner circumference of the central groove so that the axis of the fixing component coincides with the axis of the base plate.

13. The centering device according to claim 12, characterized in that: The fixed reference surface includes a bearing surface and a positioning annular surface surrounding the bearing surface; a center positioning boss is provided on the lower surface of the base plate, and the bottom surface of the center positioning boss is used to overlap the bearing surface; the outer peripheral surface of the center positioning boss is used to cooperate with the positioning annular surface so that the axis of the base plate coincides with the center of the fixed reference surface.

14. A centering method, characterized in that: Using the centering device described in any one of claims 1 to 13, the inner peripheral contour of the hollow process chamber of the semiconductor cleaning equipment is aligned with the wafer carrying device; the method comprises: The fixing assembly is detachably fixed to the fixed reference surface of the wafer carrying device instead of the wafer carrying device; The diameter of the limiting surface is adjusted to a value matching the size of the inner peripheral contour of the process chamber by the adjusting component; The process chamber is sleeved on the outer periphery of the plurality of movable components, and after the axis of the inner periphery of the process chamber coincides with the center of the fixed reference plane, the process chamber is fixed; The diameter of the limiting surface is adjusted to a value suitable for removing the centering device by the adjusting component, and the centering device is removed from the space enclosed by the process chamber; The wafer carrying device is fixed to the fixed reference plane.

15. A centering method, characterized in that: Using the centering device described in any one of claims 1 to 13, the inner peripheral contour of the hollow process chamber of the semiconductor cleaning equipment is aligned with the wafer carrying device; the method comprises: The fixing assembly is detachably fixed to the fixed reference surface of the wafer carrying device instead of the wafer carrying device; The diameter of the limiting surface is adjusted to a preset value by the adjusting component; the preset value is smaller than the diameter of the limiting surface that matches the size of the inner peripheral contour of the process chamber; The process chamber is sleeved on the outer periphery of the plurality of moving components; The diameter of the limiting surface is adjusted to a value matching the size of the inner circumference of the process chamber by the adjusting component, so that the axis of the inner circumference of the process chamber coincides with the center of the fixed reference surface; fixing the process cavity; The diameter of the limiting surface is adjusted to a value suitable for removing the centering device by the adjusting component, and the centering device is removed from the space enclosed by the process chamber; The wafer carrying device is fixed to the fixed reference plane.

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