Cooling apparatus for multi-chip / multi-module heat dissipation

Abstract

Embodiments of the present disclosure provide a cooling apparatus for multi-chip / multi-module heat dissipation. The cooling apparatus is disposed in a casing. The casing comprises a casing body, and multiple computing modules disposed in the casing body. The cooling apparatus comprises: multiple liquid cooling assemblies, each liquid cooling assembly comprising a heat exchange unit, a liquid inlet tube and a liquid outlet tube, the heat exchange unit covering a corresponding computing module, so as to perform heat exchange with the corresponding computing module, the liquid inlet pipe being connected to the heat exchange unit, so as to provide low-temperature cooling liquid to the heat exchange unit, and the liquid outlet pipe being connected to the heat exchange unit, so as to return a heated cooling liquid; a first liquid dispenser, disposed on the casing body and connected to the liquid inlet pipe of each liquid cooling assembly among the multiple liquid cooling assemblies, so as to provide the low-temperature cooling liquid; and a second liquid dispenser, disposed on the casing body and connected to the liquid outlet pipe of each liquid cooling assembly among the multiple liquid cooling assemblies, so as to gather the heated cooling liquid. On the basis of the embodiments, it is possible to implement maintenance of an individual chip or module, and the problem of cascading increases of chip temperature can be solved.

Description

Cooling device for multi-chip / multi-module heat dissipation

[0001] This application claims priority to the Chinese invention patent application entitled “Cooling device for multi-chip / multi-module heat dissipation” filed on December 4, 2023, with application number 202311649555.4, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] Embodiments of the present disclosure generally relate to the technical field of electronic device cooling, and more particularly, to a cooling device for multi-chip / multi-module heat dissipation and a chassis including such a cooling device. Background Art

[0003] As computing power demands continue to rise, the power consumption of computing chips (also known as computing modules) is increasing. Chips with power consumptions of 500W, 700W, and even kilowatts have already appeared. Furthermore, it's common for multiple chips or modules to be used simultaneously within a system, such as a GPU system with eight coexisting graphics processing unit (GPU) modules. Similar applications are also found in other chip types, such as central processing units (CPUs) and embedded neural network processors (NPUs).

[0004] In high-power systems with multiple chips or modules, cold plate liquid cooling is often used for heat dissipation. However, the large number of chips or modules results in numerous and complex liquid cooling pipes, making it difficult to maintain individual chips or modules independently. Often, maintaining a single chip or module requires removing the cold plates of all chips or modules. Furthermore, GPU modules have a high failure rate, requiring frequent maintenance operations, and some GPU chips are unpackaged bare chips, increasing the risk of chip or module damage during maintenance.

[0005] Furthermore, conventional cold plate liquid cooling solutions often employ a hybrid series-parallel approach, which can lead to chip temperature escalation. Given a certain main pipe diameter, the chip's heat dissipation capacity and flow resistance can become bottlenecks. Summary of the Invention

[0006] In a first aspect of the present disclosure, a cooling device for multi-chip / multi-module heat dissipation is provided, wherein the cooling device is placed in a chassis, the chassis including a chassis body and a plurality of computing modules arranged in the chassis, wherein the cooling device includes: a plurality of liquid cooling components, each liquid cooling component including a heat exchange unit, a liquid inlet pipe and a liquid outlet pipe, the heat exchange unit covers the corresponding computing module to perform heat exchange with the corresponding computing module, the liquid inlet pipe is connected to the heat exchange unit to provide low-temperature cooling liquid to the heat exchange unit, and the liquid outlet pipe is connected to the heat exchange unit to return the heated cooling liquid; a first liquid distributor, provided on the chassis body and connected to the liquid inlet pipe of each liquid cooling component of the plurality of liquid cooling components to provide the low-temperature cooling liquid; and a second liquid distributor, provided on the chassis body and connected to the liquid outlet pipe of each liquid cooling component of the plurality of liquid cooling components to collect the heated cooling liquid.

[0007] In a second aspect of the present disclosure, a chassis is provided, comprising the cooling device of the first aspect of the present disclosure; the chassis; and the plurality of computing modules, each computing module being covered by a corresponding heat exchange unit in the cooling device.

[0008] It should be understood that the content described in this content section is not intended to limit the key features or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, wherein:

[0010] FIG1 shows a perspective schematic diagram of a chassis according to some embodiments of the present disclosure;

[0011] FIG2 is a schematic structural diagram of the chassis shown in FIG1 viewed along the height direction;

[0012] FIG3 shows a perspective schematic diagram of the chassis shown in FIG1 viewed along the width direction;

[0013] FIG4 shows a perspective schematic diagram of the cooling device in the chassis shown in FIG1 ;

[0014] FIG5 shows a schematic diagram of the pipe connection of the cooling device shown in FIG4 ;

[0015] FIG6 is a schematic diagram showing a partial structure of a liquid cooling assembly in the cooling device shown in FIG4 ;

[0016] FIG7 shows a perspective schematic diagram of a chassis according to some embodiments of the present disclosure; and

[0017] 8 to 11 illustrate an example process of maintaining a single computing module according to some embodiments of the present disclosure.

[0018] Explanation of the accompanying reference numerals: 100 chassis; 200 cooling device; 211 liquid supply pipe; 212 liquid return pipe; 221 first liquid distributor; 222 second liquid distributor; 24 liquid cooling assembly; 240 pipeline; 2401 liquid inlet pipe; 2402 liquid outlet pipe; 2403 bending portion; 241 heat exchange unit; 242 handle; 243 pipe clamp; 2431 first clamping position; 2432 second clamping position; 300 housing; 400 crossbeam; 500 computing module; 600 exchange module; 700 motherboard; 800 additional cooling unit. DETAILED DESCRIPTION

[0019] The preferred embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although preferred embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to make the present disclosure more thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art.

[0020] As used herein, the term "including" and its variations represent open inclusion, i.e., "including but not limited to." Unless otherwise stated, the term "or" means "and / or." The term "based on" means "based at least in part on." The terms "one example embodiment" and "an embodiment" mean "at least one example embodiment." The term "another embodiment" means "at least one additional embodiment." The terms "first," "second," etc. may refer to different or identical objects.

[0021] As mentioned above, in conventional high-power systems with multiple chips or modules, it is impossible to independently maintain a single chip or module. Often, maintaining a single chip or module requires removing the cold plates of all chips or modules. In addition, in conventional cold plate liquid cooling solutions, there is a situation where the chip temperature rises and rises. Under the condition of a certain main pipe diameter size, the chip's heat dissipation capacity and flow resistance have bottlenecks.

[0022] The embodiments of the present disclosure propose a cooling device for multi-chip / multi-module heat dissipation and a chassis including such a cooling device. For each computing module in the chassis, a corresponding liquid cooling component is separately provided, and the heat exchange unit of each liquid cooling component is directly connected to the liquid distributor via a liquid inlet pipe and a liquid outlet pipe, thereby solving the problem that the chip or module cannot be maintained individually, realizing individual maintenance of the chip or module, reducing the risk of chip or module damage caused by maintenance, and realizing rapid maintenance of the individual chip; in addition, the solution can also solve the problem of chip temperature escalation, improve the heat dissipation capacity of the chip under the condition of a certain main pipe diameter size, and reduce the flow resistance of the system. The principle of the present disclosure will be described in detail below with reference to Figures 1 to 11.

[0023] First, refer to Figures 1 to 6. Figure 1 shows a three-dimensional schematic diagram of the chassis 100 according to some embodiments of the present disclosure, Figure 2 shows a structural schematic diagram of the chassis 100 shown in Figure 1 viewed along the height direction Z, Figure 3 shows a perspective schematic diagram of the chassis 100 shown in Figure 1 viewed along the width direction Y, Figure 4 shows a three-dimensional schematic diagram of the cooling device 200 in the chassis 100 shown in Figure 1, Figure 5 shows a pipeline connection schematic diagram of the cooling device 200 shown in Figure 4, and Figure 6 shows a partial structural schematic diagram of the liquid cooling component 24 in the cooling device 200 shown in Figure 4.

[0024] As shown in Figures 1 to 6, the chassis 100 described herein includes a housing 300, a motherboard 700, a plurality of computing modules 500, and a cooling device 200. The housing 300 has an internal space for accommodating and / or supporting various components of the chassis 100, such as the motherboard 700, the computing modules 500, the cooling device 200, and other components. The chassis 100 may also be referred to herein as a node. In one embodiment, as shown in Figures 1 to 3, the housing 300 may have a length direction X, a width direction Y, and a height direction Z.

[0025] In the embodiments of the present disclosure, the length direction X, width direction Y, and height direction Z are used to more clearly describe the structure of the chassis 100 and the relative positional relationships between the various components. It should be understood that when the chassis 100 is placed in other orientations, the length direction X, width direction Y, and height direction Z may change accordingly. In addition, the chassis 100 described herein may be a standalone chassis or an integrated chassis within an entire cabinet, and the embodiments of the present disclosure are not limited thereto.

[0026] As shown in Figure 3, the motherboard 700 is arranged in the case 300 to support various electronic components of the chassis 100, such as the computing module 500. The computing module 500 is arranged on the motherboard 700 to implement corresponding computing functions. The motherboard 700 may include a printed circuit board or various conventional or future available substrates. In one embodiment, the computing module 500 may include at least one of a GPU, a CPU, and an NPU. In other embodiments, the computing module 500 may include other electronic components that will generate a large amount of heat during operation, and these implementations also fall within the scope of the present disclosure.

[0027] In an embodiment of the present disclosure, as shown in Figures 1 to 5, the cooling device 200 includes multiple liquid cooling components 24. Each liquid cooling component 24 includes a heat exchange unit 241, a liquid inlet pipe 2401, and a liquid outlet pipe 2402. The liquid inlet pipe 2401 and the liquid outlet pipe 2402 are used to circulate coolant and may also be collectively referred to as pipes 240 herein. The heat exchange unit 241 covers the corresponding computing module 500 to exchange heat with the corresponding computing module 500. As an example, the heat exchange unit 241 can be formed as a cold plate that is directly connected to the corresponding computing module 500 via a thermally conductive material. It should be understood that the heat exchange unit 241 may also include other forms of heat exchange components, and such implementations also fall within the scope of the present disclosure. The liquid inlet pipe 2401 is connected to the corresponding heat exchange unit 241 to provide low-temperature coolant to the heat exchange unit 241. The coolant mentioned herein may include water or various conventional or future available coolants, and such implementations also fall within the scope of the present disclosure. The liquid outlet pipe 2402 is connected to the corresponding heat exchange unit 241 to return the heated coolant. The heat exchange unit 241 can use the low-temperature coolant to exchange heat with the corresponding computing module 500, thereby absorbing the heat generated by the computing module 500 during operation. After absorbing the heat, the low-temperature coolant will increase in temperature, becoming heated coolant. The heat exchange unit 241 can return the heated coolant through the liquid outlet pipe 2402.

[0028] In an embodiment of the present disclosure, as shown in Figures 3 to 5, the cooling device 200 further includes a first liquid separator 221 and a second liquid separator 222. The first liquid separator 221 is disposed on the housing 300 and is connected to the liquid inlet pipe 2401 of each of the plurality of liquid-cooling components 24 to provide low-temperature coolant to the liquid inlet pipe 2401. In other words, the liquid inlet pipes 2401 of all the liquid-cooling components 24 can be connected in parallel to the first liquid separator 221 to receive the low-temperature coolant from the first liquid separator 221 and provide the low-temperature coolant to the heat exchange unit 241. In one embodiment, as shown in Figures 1 to 4, the cooling device 200 further includes a liquid supply pipe 211. The liquid supply pipe 211 can be connected to an external cold source to receive the low-temperature coolant from the external cold source and provide the low-temperature coolant to the first liquid separator 221. The second liquid distributor 222 is disposed on the housing 300 and is connected to the liquid outlet pipe 2402 of each of the plurality of liquid cooling assemblies 24 to collect the heated coolant returned from the liquid outlet pipe 2402. In other words, the liquid outlet pipes 2402 of all liquid cooling assemblies 24 can be connected in parallel to the second liquid distributor 222 to return the heated coolant received from the heat exchange unit 241 to the second liquid distributor 222. In one embodiment, as shown in Figures 1 to 4, the cooling device 200 further includes a liquid return pipe 212. The liquid return pipe 212 can be connected to an external cooling source to return the heated coolant to the external cooling source for cooling, thereby achieving cooling liquid circulation.

[0029] In the embodiment of the present disclosure, a corresponding liquid cooling assembly 24 is provided for each computing module 500 in the chassis 100. The heat exchange unit 241 of each liquid cooling assembly 24 is directly connected to the liquid distributor via a liquid inlet pipe 2401 and a liquid outlet pipe 2402. This solves the problem of the computing module 500 being unable to be maintained individually, enabling individual maintenance of the computing module 500 and reducing the risk of damage to the computing module 500 caused by maintenance. Furthermore, this solution can also solve the problem of temperature escalation in the computing module 500, improve the heat dissipation capacity of the computing module 500 under certain main pipe diameter conditions, and reduce system flow resistance.

[0030] In some embodiments, as shown in Figures 3 to 5 , the first liquid distributor 221 and the second liquid distributor 222 are arranged side by side at the first end of the housing 300 along the length direction X, and adjacent to the top side of the housing 300 along the height direction Z. This arrangement supports a redundant design for the piping 240 of the liquid cooling assembly 24 and a flip-over design for the heat exchange unit 241. This will be described in further detail below in conjunction with Figures 8 to 11 .

[0031] In one embodiment, as shown in Figures 3 to 5, the heat exchange units 241 of the multiple liquid cooling assemblies 24 are arranged in two rows, with each row of heat exchange units 241 including four heat exchange units 241, corresponding to four computing modules 500. The heat exchange units 241 in each row are arranged side by side in the housing 300 along the width direction Y of the housing 300. This arrangement will be used herein as an example to describe the principles of the present disclosure. However, it should be understood that the heat exchange units 241 of the multiple liquid cooling assemblies 24 can be arranged in more or fewer rows, such as one or three rows. Similarly, the heat exchange units 241 in each row are arranged side by side in the housing 300 along the width direction Y of the housing 300. Furthermore, each row of heat exchange units 241 can include more or fewer heat exchange units 241, such as three or five.

[0032] It should be noted that the numbers, values, etc. mentioned above and elsewhere in this disclosure are exemplary and are not intended to limit the scope of this disclosure in any way. Any other appropriate numbers and values ​​are possible.

[0033] It should be understood that, according to the actual requirements of different cold plate systems, the installation positions of the first liquid distributor 221 and the second liquid distributor 222 on the housing 300 can be adaptively adjusted. In some embodiments, the first liquid distributor 221 and the second liquid distributor 222 can be set at other positions of the first end of the chassis 100, for example, adjacent to the middle or even the bottom of the housing 300 in the height direction Z. In other embodiments, one of the first liquid distributor 221 and the second liquid distributor 222 can be adjacent to the top of the housing 300 in the height direction Z, while the other liquid distributor can be adjacent to the middle or bottom of the housing 300 in the height direction Z. In still other embodiments, the first liquid distributor 221 and the second liquid distributor 222 can be connected to the housing 300 via additional supports. These example implementations of the installation positions of the first liquid distributor 221 and the second liquid distributor 222 all fall within the scope of the present disclosure.

[0034] In some embodiments, as shown in Figures 3, 4, and 6, each liquid cooling assembly 24 further includes at least one handle 242 disposed on the side of the heat exchange unit 241 facing away from the corresponding computing module 500 for lifting and placing the heat exchange unit 241. When maintenance is required on a particular computing module 500, the heat exchange unit 241 corresponding to that computing module 500 can be lifted using the handle 242 and removed from the computing module 500. The heat exchange unit 241 can then be inverted onto a support member (e.g., the beam 400 described below in conjunction with Figure 7) to facilitate replacement of the computing module 500.

[0035] In one embodiment, as shown in FIG6 , the heat exchange unit 241 is provided with two handles 242, located near adjacent ends of the heat exchange unit 241. To maintain a computing module 500, the heat exchange unit 241 can be lifted using one of the handles 242 and removed. The heat exchange unit 241 can then be inverted onto a support member using the sloped surface of the other handle 242 or other securing mechanism to facilitate replacement of the computing module 500.

[0036] It should be understood that the heat exchange unit 241 may be provided with more or fewer handles 242, such as one or three, etc. In addition, according to design requirements, the handle 242 may also be provided at other positions on the heat exchange unit 241, and these implementations all fall within the scope of the present disclosure.

[0037] In some embodiments, as shown in Figures 3, 4, and 6, at least one handle 242 is provided with a pipe clamp 243 for supporting the liquid inlet pipe 2401 and / or the liquid outlet pipe 2402. The pipe clamp 243 can not only be used to secure the pipes 240 of the corresponding heat exchange unit 241, but also, when maintenance is required on a particular computing module 500, the pipe clamp 243 of an adjacent heat exchange unit 241 in the same row can be used to secure the pipes 240 of other heat exchange units 241, thereby facilitating the disassembly and assembly of the heat exchange module 500 requiring maintenance. This will be described in detail below in conjunction with Figures 8 to 11.

[0038] In some embodiments, as shown in FIG6 , the tube clamp 243 includes a first clamping position 2431 and a second clamping position 2432 that communicate with each other, with the first clamping position 2431 being closer to the heat exchange unit 241 than the second clamping position 2432. When maintenance is required on a particular computing module 500, the first clamping position 2431 of the tube clamp 243 of an adjacent heat exchange unit 241 in the same row can be used to secure its own pipe 240, while the second clamping position 2432 of the tube clamp 243 of the adjacent heat exchange unit 241 can be used to secure the pipe 240 of another heat exchange unit 241, thereby facilitating the assembly and disassembly of the heat exchange module 500 requiring maintenance. This will be described in detail below in conjunction with FIG8 to FIG11 .

[0039] In some embodiments, as shown in Figures 3 and 4, at least one bend 2403 is provided on the liquid inlet pipe 2401 and the liquid outlet pipe 2402, respectively. By providing at least one bend 2403, the pipeline 240 between the heat exchange unit 241 and the liquid distributor can have a redundancy of appropriate length, which is used for avoiding the pipeline 240 and flipping the heat exchange unit 241 during maintenance of the single computing module 500. As an example, a single bend 2403 can be provided adjacent to the first liquid distributor 221 and the second liquid distributor 222, and bend toward the bottom of the housing 300. It should be understood that the bend 2403 can be provided at other positions on the pipeline 240, can be of other numbers, and can be bent in other forms, and these implementations all fall within the scope of the present disclosure.

[0040] In some embodiments, the housing 300 may also be provided with a pipe clamp 243 for supporting the liquid inlet pipe 2401 and / or the liquid outlet pipe 2402. If maintenance is required on a computing module 500, the pipe clamp 243 on the housing 300 may be used to secure the pipe 240 that needs to be cleared, thereby facilitating disassembly and assembly of the heat exchange module 500 that requires maintenance.

[0041] In some embodiments, as shown in Figures 3 to 5, the chassis 100 further includes multiple switch modules 600, and the cooling device 200 further includes multiple additional cooling units 800. The multiple switch modules 600 are disposed on the mainboard 700 and are closer to the first end of the chassis 300 than the multiple computing modules 500. The multiple additional cooling units 800 each cover a corresponding switch module 600 to perform heat exchange with the corresponding switch module 600. The multiple switch modules 600 are primarily responsible for transmitting and exchanging data and / or signals required by the computing module 500, and generate relatively little heat during operation. Therefore, the multiple additional cooling units 800 can be connected in series between the first liquid distributor 221 and the second liquid distributor 222 via pipelines to cool each switch module 600 in a cascade manner.

[0042] Figure 8 shows a three-dimensional schematic diagram of a chassis according to some embodiments of the present disclosure. In some embodiments, as shown in Figure 8, the chassis 100 further includes at least one crossbeam 400. At least one crossbeam 400 is detachably connected to the top side of the box body 300 in the height direction Z to enhance the strength of the box body 300. Each crossbeam 400 extends along the width direction Y of the box body 300. The crossbeam 400 can be connected to the box body 300 by snap-fitting or any appropriate detachable connection method. In addition, when a certain computing module 500 needs to be maintained, the crossbeam 400 can also serve to support the computing module 500 to be maintained and the corresponding heat exchange unit 241, which will be further explained below.

[0043] In some embodiments, to more stably support the computing module 500 to be maintained and the corresponding heat exchange unit 241 on the crossbeam 400, a stopper (not shown) for locking the liquid cooling assembly 24 corresponding to the computing module 500 to be maintained can be provided on the crossbeam 400. When the heat exchange unit 241 is inverted on the crossbeam 400, the heat exchange unit 241 can be locked into the stopper, thereby providing more stable and reliable support for the liquid cooling assembly 24.

[0044] In some embodiments, at least one crossbeam 400 may be provided with a pipe clamp 243 for supporting the liquid inlet pipe 2401 and / or the liquid outlet pipe 2402. If maintenance is required on a computing module 500, the pipe clamp 243 on the crossbeam 400 may be used to secure the pipe 240 that needs to be moved out of the way, facilitating disassembly and assembly of the heat exchange module 500 that requires maintenance.

[0045] Below, an example process for maintaining a single computing module 500 will be described in conjunction with Figures 8 to 11. In the example described herein, the pipes 240 in the chassis 100 are designed into three layers, wherein the first layer comprises the pipes 240 for the heat exchange units 241 corresponding to the computing modules 500 in the rear row, the second layer comprises the pipes 240 for the heat exchange units 241 corresponding to the computing modules 500 in the front row, and the third layer comprises the pipes 240 for the additional cooling units 800 corresponding to the exchange modules 600. Figures 8 to 11 illustrate an example process for maintaining a single computing module 500 in the front row of computing modules 500. The maintenance process will be described using the computing module 500 in the front row of computing modules 500 that is located near the top side as shown in Figure 8 (for ease of understanding, this may also be referred to as the first computing module). It should be understood that other computing modules 500 in the front row of computing modules 500 can be maintained using a similar process.

[0046] As shown in Figures 8 and 9 , the crossbeam 400 on the housing 300 is first removed to access the heat exchange unit 241 and the computing module 500. To more clearly illustrate the maintenance process for a single computing module 500 in the front row, some pipes 240 are omitted in Figures 8 and 9 .

[0047] As shown in Figures 8 and 9, after the crossbeam 240 is removed, the pipes 240 of the heat exchange unit 241 corresponding to the rear-row computing module 500 (for ease of understanding, also referred to as the second computing module) adjacent to the front-row computing module 500 to be maintained (i.e., the first computing module) along the length direction X of the housing 300 are spread apart and secured to the pipe clamps 243 on the housing 300 and to the pipe clamps 243 of the heat exchange unit 241 corresponding to the computing module 500 (for ease of understanding, also referred to as the third computing module) adjacent to the front-row computing module 500 to be maintained (i.e., the first computing module) along the width direction Y of the housing 300. For example, the liquid inlet pipe 2401 of the pipe 240 can be secured to the pipe clamp 243 on the housing 300, while the liquid outlet pipe 2402 of the pipe 240 can be secured to the pipe clamp 243 of the heat exchange unit 241 corresponding to the third computing module. Before securing pipe 240 to pipe clamp 243, pipe 240 of heat exchange unit 241 corresponding to the third computing module has been pressed into first clamping position 2431 of its pipe clamp 243, allowing liquid outlet pipe 2402 of the first computing module's pipe to be pressed into second clamping position 2432 of pipe clamp 243 of heat exchange unit 241 corresponding to the third computing module. At this point, pipe 240 is no longer obstructing the heat exchange unit 241 corresponding to the front-row computing module 500 (i.e., the first computing module) to be maintained.

[0048] Then, remove the screws securing the front computing module 500 (i.e., the first computing module) to be maintained and the motherboard 700, thereby disconnecting the front computing module 500 from the motherboard 700. Lift the heat exchange unit 241 and computing module 500 using the handle 242 and separate them.

[0049] Then, as shown in Figures 10 and 11, a crossbeam 400 is installed above the computing module 500 to be maintained. The heat exchange unit 241 is flipped over and placed upside down on the crossbeam 400 using the inclined surface of the handle 242 or other fixing mechanism. At this point, the surface of the heat exchange unit 241 that contacts the computing module 500 faces upward, and the pipes 240 of the heat exchange unit 241 are in a naturally curved state.

[0050] Then, the new computing module 500 is mounted on the mainboard 700 by screws, and a heat-conducting material is coated on the computing module 500. Then, the heat exchange unit 241 is lifted by the handle 242 and mounted on the new computing module 500.

[0051] Subsequently, the pipe 240 of the heat exchange unit 241 corresponding to the rear row computing module 500 (i.e., the second computing module) adjacent to the front row computing module 500 (i.e., the first computing module) to be maintained is reset, and the crossbeam 400 is reset. At this point, the maintenance process of the single computing module 500 in the front row is completed.

[0052] Next, the maintenance process for a single computing module in the rear row of computing modules 500 will be described. Because there are no pipes 240 blocking the rear row of computing modules 500, the maintenance process for the rear row of computing modules 500 does not require securing the pipes 240 of the heat exchange unit 241 corresponding to the computing module 500 to be maintained to the pipe clamps 243 of the adjacent heat exchange unit 241. An example maintenance process for a single computing module in the rear row of computing modules 500 is as follows.

[0053] First, the crossbeam 400 on the box body 300 is removed to facilitate access to the heat exchange unit 241 and the computing module 500 .

[0054] After the crossbeam 240 is removed, the pipe 240 of the heat exchange unit 241 corresponding to the rear-row computing module 500 to be maintained is fixed in the pipe clamp 243 .

[0055] Then, remove the screws fixing the rear computing module 500 to be maintained and the mainboard 700 to separate the rear computing module 500 from the mainboard 700. Lift the heat exchange unit 241 and the computing module 500 with the handle 242 and separate them.

[0056] Next, install the crossbeam 400 above the computing module 500 to be maintained, flip the heat exchange unit 241 over, and use the inclined surface of the handle 242 or other fixing mechanism to place the heat exchange unit 241 upside down on the crossbeam 400. At this point, the side of the heat exchange unit 241 that contacts the computing module 500 faces upward, and the pipes 240 of the heat exchange unit 241 are in a naturally curved state.

[0057] Then, the new computing module 500 is mounted on the mainboard 700 by screws, and a heat-conducting material is coated on the computing module 500. Then, the heat exchange unit 241 is lifted by the handle 242 and mounted on the new computing module 500.

[0058] Then, the pipe 240 of the heat exchange unit 241 corresponding to the rear row computing module 500 to be maintained is reset, and the crossbeam 400 is reset. At this point, the maintenance process of the single computing module 500 in the rear row is completed.

[0059] The above description of flipping the heat exchange unit 241 forward and backward along the length direction X of the housing 300 during maintenance of the computing module 500 is merely an example implementation of the present disclosure. In some embodiments, the heat exchange unit 241 may also be flipped left and right along the width direction Y of the housing 300 during maintenance, i.e., flipped sideways.

[0060] According to the embodiments of the present disclosure, single-unit maintenance of computing module 500 is achieved, reducing the risk of damage to computing module 500 caused by maintenance. Rapid single-unit maintenance also improves maintenance efficiency. Furthermore, the fully parallel piping topology eliminates temperature escalation during computing module cooling, improving the chip's heat dissipation capacity within a given main pipe diameter and reducing system flow resistance.

[0061] Embodiments of the present disclosure are also embodied in the following examples.

[0062] Example 1. A cooling device for dissipating heat from multiple chips or modules, the cooling device being placed in a chassis, the chassis comprising a housing and a plurality of computing modules disposed in the housing, wherein the cooling device comprises:

[0063] Multiple liquid cooling assemblies, each comprising a heat exchange unit, a liquid inlet pipe, and a liquid outlet pipe. The heat exchange unit covers the corresponding computing module to exchange heat with the corresponding computing module. The liquid inlet pipe is connected to the heat exchange unit to provide low-temperature coolant to the heat exchange unit. The liquid outlet pipe is connected to the heat exchange unit to return the heated coolant.

[0064] a first liquid distributor, provided on the housing and connected to a liquid inlet pipe of each of the plurality of liquid cooling assemblies to provide the low-temperature coolant; and

[0065] The second liquid distributor is provided on the box body and is connected to the liquid outlet pipe of each liquid cooling assembly in the plurality of liquid cooling assemblies to collect the heated cooling liquid.

[0066] Example 2. A cooling device according to Example 1, wherein the first liquid distributor and the second liquid distributor are arranged at the first end of the box body along the length direction, the heat exchange units of the multiple liquid cooling components are arranged in one or more rows, and the heat exchange units in each row are arranged side by side in the box body along the width direction of the box body.

[0067] Example 3. The cooling device according to Example 2, wherein the first liquid distributor and the second liquid distributor are arranged side by side at the first end of the chassis adjacent to the top side of the box body in the height direction, and extend respectively along the width direction of the box body.

[0068] Example 4. A cooling device according to any one of Examples 1 to 3, wherein each liquid cooling assembly further comprises at least one handle provided on a side of the heat exchange unit facing away from the corresponding computing module for lifting and placing the heat exchange unit.

[0069] Example 5. The cooling device according to Example 4, wherein the at least one handle is provided with a tube clamp for supporting the liquid inlet tube and / or the liquid outlet tube.

[0070] Example 6. A cooling device according to Example 5, wherein the heat exchange units of the multiple liquid cooling components are arranged in two rows, and the tube clamp includes a first clamp position and a second clamp position connected to each other, the first clamp position being closer to the heat exchange unit than the second clamp position.

[0071] Example 7. A cooling device according to Example 2, wherein the chassis further includes a plurality of exchange modules, and the cooling device further includes a plurality of additional cooling units, the plurality of exchange modules are arranged in the box body and are closer to the first end of the box body than the plurality of computing modules, the plurality of additional cooling units respectively cover the corresponding exchange modules to perform heat exchange with the corresponding exchange modules, and the plurality of additional cooling units are connected in series between the first liquid distributor and the second liquid distributor via pipelines.

[0072] Example 8. The cooling device according to any one of Examples 1 to 3 and 5 to 7, wherein the liquid inlet pipe and the liquid outlet pipe are respectively provided with at least one bending portion.

[0073] Example 9. A chassis comprising:

[0074] The cooling device according to any one of examples 1 to 8;

[0075] the housing; and

[0076] The multiple computing modules, each computing module is covered by a corresponding heat exchange unit in the cooling device.

[0077] Example 10. The chassis according to Example 9 further includes at least one crossbeam, which is detachably connected to the top side of the chassis in the height direction and is capable of supporting the liquid cooling assembly corresponding to the computing module to be maintained.

[0078] Example 11. The chassis according to Example 10, wherein the at least one crossbeam is provided with a limiter for a liquid cooling assembly corresponding to a computing module to be maintained by the card.

[0079] Example 12. The chassis according to Example 10, wherein a pipe clamp for supporting the liquid inlet pipe and / or the liquid outlet pipe is provided on the at least one crossbeam.

[0080] Example 13. The chassis according to Example 9, wherein a pipe clamp for supporting the liquid inlet pipe and / or the liquid outlet pipe is provided on the chassis body.

[0081] While various embodiments of the present disclosure have been described above, the above descriptions are illustrative, non-exhaustive, and not intended to be limiting of the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles of the embodiments, their practical applications, or technological improvements in the marketplace, or to enable other persons skilled in the art to understand the embodiments disclosed herein.

Claims

1. A cooling device (200) for multi-chip / multi-module heat dissipation, the cooling device (200) being placed in a chassis (100), the chassis (100) comprising a box body (300) and a plurality of computing modules (500) arranged in the box body (300), wherein the cooling device (200) comprises: A plurality of liquid cooling components (24), each liquid cooling component (24) comprising a heat exchange unit (241), a liquid inlet pipe (2401) and a liquid outlet pipe (2402), the heat exchange unit (241) covers the corresponding computing module (500) to perform heat exchange with the corresponding computing module (500), the liquid inlet pipe (2401) is connected to the heat exchange unit (241) to provide low-temperature cooling liquid to the heat exchange unit (241), and the liquid outlet pipe (2402) is connected to the heat exchange unit (241) to return the heated cooling liquid; A first liquid distributor (221), arranged on the housing (300) and connected to a liquid inlet pipe (2401) of each liquid cooling component (24) of the plurality of liquid cooling components (24) to provide the low-temperature cooling liquid; as well as The second liquid distributor (222) is arranged on the housing (300) and is connected to the liquid outlet pipe (2402) of each liquid cooling component (24) in the plurality of liquid cooling components (24) to collect the heated cooling liquid.

2. The cooling device (200) according to claim 1, wherein the first liquid distributor (221) and the second liquid distributor (222) are arranged at a first end of the box body (300) along the length direction (X), and the heat exchange units (241) of the multiple liquid cooling components (24) are arranged in one or more rows, and each row of heat exchange units (241) is arranged side by side in the box body (300) along the width direction (Y) of the box body (300).

3. The cooling device (200) according to claim 2, wherein the first liquid distributor (221) and the second liquid distributor (222) are arranged side by side at the first end of the chassis (100) adjacent to the top side of the box body (300) in the height direction (Z), and extend respectively along the width direction (Y) of the box body (300).

4. A cooling device (200) according to any one of claims 1 to 3, wherein each liquid cooling component (24) further comprises at least one handle (242) arranged on a side of the heat exchange unit (241) facing away from the corresponding computing module (500) for lifting and placing the heat exchange unit (241).

5. The cooling device (200) according to claim 4, wherein a tube clamp (243) for supporting the liquid inlet tube (2401) and / or the liquid outlet tube (2402) is provided on the at least one handle (242).

6. The cooling device (200) according to claim 5, wherein the heat exchange units (241) of the plurality of liquid cooling components (24) are arranged in two rows, and the tube clamp (243) comprises a first clamp position (2431) and a second clamp position (2432) which are connected to each other, and the first clamp position (2431) is closer to the heat exchange unit (241) than the second clamp position (2432).

7. The cooling device (200) according to claim 2, wherein the chassis (100) further comprises a plurality of exchange modules (600), and the cooling device (200) further comprises a plurality of additional cooling units (800), the plurality of exchange modules (600) being arranged in the case (300) and being closer to the first end of the case (300) than the plurality of computing modules (500), the plurality of additional cooling units (800) respectively covering corresponding exchange modules (600) to perform heat exchange with corresponding exchange modules (600), and the plurality of additional cooling units (800) being connected in series between the first liquid distributor (221) and the second liquid distributor (222) via pipelines.

8. The cooling device (200) according to any one of claims 1 to 3 and 5 to 7, wherein at least one bending portion (2403) is respectively provided on the liquid inlet pipe (2401) and the liquid outlet pipe (2402).

9. A chassis (100), comprising: The cooling device (200) according to any one of claims 1 to 8; The box (300); as well as The multiple computing modules (500), each computing module (500) is covered by a corresponding heat exchange unit (241) in the cooling device (200).

10. The chassis (100) according to claim 9 further includes at least one beam (400), which is detachably connected to the top side of the box body (300) in the height direction (Z) and can support the liquid cooling assembly (24) corresponding to the computing module (500) to be maintained.

11. The chassis (100) according to claim 10, wherein the at least one crossbeam (400) is provided with a stopper for a liquid cooling assembly (24) corresponding to a computing module (500) for card reception and maintenance.

12. The chassis (100) according to claim 10, wherein a pipe clamp (243) for supporting the liquid inlet pipe (2401) and / or the liquid outlet pipe (2402) is provided on the at least one crossbeam (400).

13. The chassis (100) according to claim 9, wherein a pipe clamp (243) for supporting the liquid inlet pipe (2401) and / or the liquid outlet pipe (2402) is provided on the box body (300).

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