Passive liquid cooling system, chip and electronic apparatus

Abstract

Provided in the embodiments of the present application are a passive liquid cooling system, a chip and an electronic apparatus. The provided new passive liquid cooling system falls under the broad technical category of liquid cooling technology; however, different from traditional cold plate liquid cooling solutions and immersion liquid cooling solutions, the passive liquid cooling system is a brand-new liquid cooling solution. The passive liquid cooling system is an indirect contact cooling solution not dependent on a circulating pump, and is also a solution of achieving cooling by means of two-layer (or two-stage) liquid phase change. Due to being not dependent on a circulating pump, various technical problems caused by the circulating pump can be solved; for example, the whole passive liquid cooling system is not limited by the service life of the circulating pump, does not require operation and maintenance for the circulating pump, and, in terms of deployment and implementation, does not rely on the overall planning of an IDC, thus facilitating implementation and allowing for wide deployment and implementation for various data centers. In addition, using the two-layer liquid phase change for cooling achieves higher cooling performance, thus meeting cooling requirements of high-power devices.

Description

[0001] Passive Liquid Cooling System, Chip, and Electronic Device Technical Field This application relates to the field of liquid cooling technology, and more particularly to a passive liquid cooling system, chip, and electronic device. Background Art: With the development of chip technology, chip functionality has become increasingly powerful, and this has led to increased power consumption. For example, a single 51.2T switch chip consumes nearly 800W (watts) of power, with a heat flux density of approximately 100W / cm 2(Watts / square centimeter). Chips typically use heat dissipation technologies to reduce their operating temperature. Currently, liquid cooling is a popular heat dissipation technology. However, current liquid cooling technologies either rely on circulating pumps to drive liquid through cold plates for heat dissipation, which is affected by the circulating pumps and depends on the overall planning of the Internet Data Center (IDC), resulting in high implementation and maintenance costs. Alternatively, they require immersing the chip in liquid to dissipate heat through phase change, which can interfere with some signals and is not widely applicable. Therefore, a new liquid cooling solution is needed. SUMMARY OF THE INVENTION Various aspects of this application provide a passive liquid cooling system, a chip, and an electronic device to provide a new liquid cooling solution. An embodiment of the present application provides a passive liquid cooling system, comprising: a first cavity filled with a first phase-changeable liquid; a heat sink disposed through the first cavity; the heat sink comprising: a second cavity, an evaporation end, and a condensation end in communication with the second cavity, the second cavity being filled with a second phase-changeable liquid; wherein the outer side of the evaporation end is configured to contact a heat-generating device and, upon absorbing heat, causes the second liquid to change phase into a second vapor; the outer side of the condensation end is in contact with the first liquid and, upon encountering the second vapor, is configured to diffuse heat into the first liquid, causing the liquid to change phase into the first vapor, and condense the second vapor and fall back into the second cavity; and a condensation device disposed in the first cavity and, upon encountering the first vapor, condenses the vapor and falls back into the first cavity. An embodiment of the present application also provides a board card, comprising a chip, with the passive liquid cooling system mounted on the board card and / or the chip. An embodiment of the present application also provides an electronic device, comprising a board card, comprising a chip, with the passive liquid cooling system mounted on the electronic device, the board card, and / or the chip. The present embodiments provide a new passive liquid cooling system. While broadly classified as liquid cooling technology, this passive liquid cooling system differs from traditional cold plate and immersion cooling solutions by offering a completely new liquid cooling solution. The passive liquid cooling system provided in the present embodiments is an indirect contact heat dissipation solution that does not rely on a circulating pump. Furthermore, it utilizes a two-layer (or two-stage) liquid phase change to dissipate heat.Because it doesn't rely on a circulation pump, it can address various technical issues associated with circulating pumps. For example, the entire passive liquid cooling system is not limited by the circulating pump's service life, eliminating the need for pump operation and maintenance. Its deployment and implementation are also independent of the overall IDC plan, making it easy to implement and deploy across various computer rooms. Furthermore, because it utilizes a two-layer liquid phase change for heat dissipation, it offers high heat dissipation performance and can meet the cooling requirements of high-power devices. For example, it is suitable for cooling various switching chips with large switching capacities, such as 51.2T. Furthermore, because it utilizes indirect contact heat dissipation, it eliminates the need to immerse the chip or device in liquid. While addressing the circulating pump issue and the cooling requirements of high-power devices, it also addresses the issue of liquid interference with electrical or optical signals, making it universally applicable. The passive liquid cooling system provided by the embodiments of this application can be used to dissipate heat for various chips containing optical signal modules, as well as future chips containing optical signal modules. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings described herein are intended to provide a further understanding of this application and constitute a part of this application. The exemplary embodiments of this application and their descriptions are intended to explain this application and do not constitute undue limitations of this application. In the accompanying drawings: Figure 1 is a schematic structural diagram of a traditional cold plate liquid cooling system; Figure 2 is a schematic structural diagram of a traditional single-phase liquid cooling system; Figure 3 is a schematic structural diagram of a traditional two-phase immersion liquid cooling system; Figure 4 is a schematic structural diagram of a passive liquid cooling system provided in an embodiment of this application; and Figure 5 is a diagram of an application scenario provided in an embodiment of this application. DETAILED DESCRIPTION To further clarify the objectives, technical solutions, and advantages of this application, the technical solutions of this application will be described clearly and completely below in conjunction with the specific embodiments of this application and the corresponding drawings. It should be understood that the described embodiments are only some of the embodiments of this application, and not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, storage, and display, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties. The collection, use, and processing of the relevant data must comply with the relevant laws, regulations, and standards of the relevant countries and regions, and corresponding operation portals are provided for the user to choose to authorize or reject. The embodiments of this application provide a passive liquid cooling system. In a broad technical context, it belongs to liquid cooling technology, but it is different from various existing liquid cooling solutions. Liquid cooling technology is a heat dissipation technology that uses liquid as a cooling medium (refrigerant) to transfer heat generated by a heat-generating device to the outside, thereby cooling the heat-generating device and ensuring the safe operation of the heat-generating device or the chip or IT equipment in which it is located. Currently, existing liquid cooling solutions include cold plate liquid cooling and immersion liquid cooling. Immersion liquid cooling is further divided into single-phase immersion liquid cooling and two-phase immersion liquid cooling. Cold plate liquid cooling is a heat dissipation technology that fixes a liquid cooling plate to the heat-generating device and uses a circulating pump to drive liquid through the cold plate to remove heat from the heat-generating device. Figure 1 is a schematic diagram of the structure of a traditional cold plate liquid cooling system. As shown in Figure 1, the cold plate liquid cooling system includes a heat sink, a liquid-cooled cold plate, piping, and a circulation pump. Liquid flowing from the circulation pump flows through the piping into the liquid-cooled cold plate. The liquid entering the liquid-cooled cold plate absorbs heat from the heat-generating components. The heat-absorbing liquid then flows out of the liquid-cooled cold plate and through the piping into the heat sink. The liquid, having dissipated heat from the heat sink, flows back into the circulation pump through the piping. Cold plate liquid cooling requires a pump and regular liquid replenishment, resulting in high O&M requirements and requiring advance IDC planning. Single-phase liquid cooling is a cooling technology that immerses the chip or device containing the heat-generating component in liquid, which absorbs the heat from the component. The coolant used in single-phase liquid cooling typically has a high boiling point. After absorbing heat, the coolant does not undergo a phase change and remains in a liquid state. Figure 2 is a schematic diagram of the structure of a traditional single-phase liquid cooling system. Referring to FIG2 , a single-phase liquid cooling system includes a container, a heat exchanger, and a cooling tower. The container contains liquid, the heating element is immersed in the liquid, and the liquid in the container absorbs heat from the heating element.The container and heat exchanger exchange heat through a liquid loop, where the liquid is pumped. The heat exchanger and cooling tower exchange heat through a water loop, where the water is pumped. However, this cooling solution requires direct immersion of the heat-generating component in the liquid, requiring a pump and regular refilling. Direct immersion can affect the performance of the heat-generating component. For example, if the heat-generating component is a switch plate, direct transmission of optical signals from the optical modules on the switch plate, especially high-speed optical signals, poses technical risks. Single-phase immersion cooling also requires pumping and regular refilling. Like cold plate cooling, it has high O&M requirements and requires advance planning for the IDC. Dual-phase immersion cooling involves immersing the chip or device containing the heat-generating component in liquid. The liquid absorbs heat from the heat-generating component and undergoes a phase change (primarily vaporization), dissipating heat through this phase change. Figure 3 shows the structure of a traditional dual-phase immersion cooling system. As shown in Figure 3, the dual-phase immersion cooling system includes a housing and a condenser located within the housing. The heating element is immersed in liquid. The liquid absorbs heat from the heating element and undergoes a phase change, generating vapor. The vapor rises and encounters the condenser, where it condenses. The condensed water drips downward under the action of gravity. Compared to single-phase immersion cooling, dual-phase immersion cooling does not require a pump and can be sealed for extended periods without opening. Theoretically, this eliminates the need for regular liquid replenishment. However, like single-phase immersion cooling, it requires the heating element to be immersed in liquid. Direct immersion can affect its performance. For example, if the heating element is a switching plate, direct transmission of optical signals from optical modules on the switching plate, especially high-speed optical signals, poses technical risks. As can be seen from the above analysis, both cold plate liquid cooling and single-phase immersion cooling rely on circulating pumps. This is not only limited by the circulating pump's service life, but also by the overall planning of the IDC, resulting in high implementation and maintenance costs. While dual-phase immersion cooling eliminates the need for a circulating pump, it requires immersing the entire chip in liquid, which significantly interferes with electrical or optical signals, making it impractical for universal application. In particular, it's difficult to implement dual-phase immersion cooling in chips that include optical signal modules, as well as future chips that may include them.The inventors of the present invention have innovated liquid cooling technology to provide a new passive liquid cooling system. While broadly classified as liquid cooling, this system differs from traditional cold plate and immersion cooling solutions by offering a completely new liquid cooling solution. The passive liquid cooling system provided in the present embodiment is an indirect contact heat dissipation solution that doesn't rely on a circulating pump. Furthermore, it utilizes two layers (or two stages) of liquid phase change to dissipate heat. Because it doesn't rely on a circulating pump, it can address various technical issues associated with circulating pumps. For example, the entire passive liquid cooling system is not limited by the circulating pump's service life, eliminating the need for pump operation and maintenance. Its deployment and implementation are also independent of overall IDC planning, making it easy to implement and deploy across various computer rooms. Furthermore, because it utilizes two layers of liquid phase change to dissipate heat, it offers high heat dissipation performance and can meet the cooling requirements of high-power devices. For example, it is suitable for cooling various switching chips with large switching capacities, such as 51.2T. Furthermore, because heat dissipation is achieved through indirect contact, the chip or device is no longer immersed in liquid. This solves the circulation pump problem and the heat dissipation requirements of high-power devices while also addressing the issue of liquid interference with electrical or optical signals, making it universally applicable. The passive liquid cooling system provided in the embodiments of this application can be used to dissipate heat for various chips containing optical signal modules, as well as future chips containing optical signal modules. It should be noted that the embodiments of this application do not limit the communication technology used by the optical signal module. For example, 112G PAM4 technology and future 224G PAM4 technology can be used, but are not limited to them. PAM4 (Plus Amplitude Modulation 4-level) is a digital modulation technology that uses four different pulse amplitude levels to represent data within each symbol period. 112G PAM4 refers to a standard that uses PAM4 technology for data communication at a data rate of 112Gbps (1000 megabits per second); correspondingly, 224G PAM4 refers to a standard that uses PAM4 technology for data communication at a data rate of 224Gbps.These communication standards are commonly used in high-speed data centers and communication networks to provide higher data transmission rates and greater bandwidth. The following, in conjunction with the accompanying drawings, details the technical solutions provided by various embodiments of the present application. Figure 4 is a schematic structural diagram of a passive liquid cooling system provided by an embodiment of the present application. As shown in Figure 4, the system 100 comprises a first cavity 10, a heat sink 20, and a condenser 30. In this embodiment, the first cavity 10 is filled with a first liquid that can undergo a phase change. Specifically, the first cavity 10 can be of any shape, such as a cube, a rectangular parallelepiped, or a hexahedron. The first cavity 10 has a storage space that allows it to be filled with a liquid. The phase changeable liquid filled in the first cavity 10 is referred to herein as the first liquid. Phase changeable first liquid means that the first liquid transforms into vapor after absorbing a certain amount of heat. The first liquid can be any low-boiling-point liquid, which refers to a liquid with a boiling point below a preset temperature. The preset temperature can be flexibly set as needed, for example, 30°C, 40°C, or 50°C. The first liquid includes, but is not limited to, a mixture of water and ethylene glycol, a mixture of water and propylene glycol, silicone oil, and fluorocarbons. Optionally, the first cavity may also be provided with a first liquid inlet, configured to inject the first liquid into the first cavity. This allows for replenishment of the first liquid as the first liquid in the first cavity decreases over time, making the passive liquid cooling system more reliable. In this embodiment of the present application, the first cavity provides a relatively sealed environment for the first liquid therein, thereby reducing leakage of the first liquid or the first liquid in a vaporized state, thereby extending the service life of the entire passive liquid cooling system. Optionally, the first cavity may be a fully sealed structure. Of course, the first cavity may also have necessary openings, such as the liquid inlet described in subsequent embodiments. These openings are sealed during normal use. In this embodiment, a heat sink 20 is disposed throughout the first cavity. It is understandable that part of the heat sink 20 passes through the first cavity and extends out of the first cavity, so that the heating device can contact the heat sink 20 for heat dissipation without being immersed in liquid.The installation location of the heat sink 20 within the first cavity is not limited. Optionally, the heat sink can be installed on a sidewall or at the bottom of the first cavity. This allows the portion of the heat sink located within the first cavity to be fully or partially submerged in the liquid, improving the heat dissipation performance of the heat sink. Optionally, the heat sink can be installed in the middle or lower region of the sidewall to further improve the heat dissipation performance of the heat sink. Furthermore, optionally, the installation location of the heat sink 20 within the first cavity can be determined based on the liquid level of the first liquid within the first cavity, ensuring that the portion of the heat sink located within the first cavity is fully submerged in the first liquid, thereby improving the heat dissipation performance of the heat sink. Furthermore, optionally, the distance between the liquid level of the first liquid within the first cavity and the top of the first cavity is controlled to ensure that the air pressure within the first cavity meets a safety pressure condition. The safety pressure condition can be flexibly set as needed. For example, if the air pressure within the first cavity is less than a flexibly set safety pressure value, the safety pressure condition is met. It is understandable that after the first liquid absorbs heat and vaporizes into steam, if the distance between the liquid level of the first liquid in the first cavity and the top of the first cavity is short, the air pressure within the first cavity may be excessive, which may easily affect the service life of the first cavity. Therefore, when injecting the first liquid into the first cavity, it is necessary to control the distance between the liquid level of the first liquid in the first cavity and the top of the first cavity. Furthermore, optionally, the volume of the first cavity and the volume of the first liquid are pre-determined based on the type, application scenario, and / or power of the heat-generating device to be used in the passive liquid cooling system. For example, the ratio between the volume of the first cavity and the volume of the first liquid may vary depending on the type of heat-generating device, such as a switch chip, a CPU (Central Processing Unit) chip, or a power supply chip. For example, in different scenarios such as e-commerce, short video, or big data computing, the heat generated by the heat-generating device varies, and the ratio between the volume of the first cavity and the volume of the first liquid may also vary accordingly.For example, the power of a 25.6T switch chip and a 51.2T switch chip differ, generating different amounts of heat. Consequently, the ratio between the volume of the first cavity and the volume of the first liquid also differs. In this embodiment, the heat dissipation device 20 may include a second cavity 21, an evaporation end 22, and a condensation end 23 connected to the second cavity 21. The second cavity 21 is filled with a phase-changeable second liquid. The outer side of the evaporation end 22 is configured to contact a heat-generating device and, upon absorbing heat, causes the second liquid to phase-change into a second vapor. The outer side of the condensation end 23 contacts the first liquid and, upon encountering the second vapor, is configured to diffuse heat into the first liquid, causing it to phase-change into the first vapor, and condense the second vapor, returning it to the second cavity. In this embodiment, the second cavity 21 may have any shape, such as a cube, a rectangular parallelepiped, or a hexahedron. Optionally, when the heat dissipation device is disposed on a sidewall, the second cavity may have a U-shaped cavity structure. This improves heat dissipation. The second cavity 21 has a storage space that allows it to be filled with liquid. The phase-changeable liquid filled within the second cavity 21 is referred to herein as the second liquid. Phase-changeable second liquid means that the second liquid will transform into vapor after absorbing a certain amount of heat. The second liquid can be any low-boiling-point liquid, including, but not limited to, a mixture of water and ethylene glycol, a mixture of water and propylene glycol, silicone oil, and fluorocarbons. Similarly, in the embodiments of the present application, the second cavity provides a relatively sealed environment for the second liquid therein, thereby reducing leakage of the second liquid or the second liquid in a vaporized state, thereby extending the service life of the entire passive liquid cooling system. Optionally, the second cavity can be a fully sealed structure. Of course, the second cavity can also have necessary openings, such as the liquid inlet described in subsequent embodiments. These openings are sealed during normal use. In this embodiment, the shape of the evaporation end 22 is not limited, and may be, for example, a plate-like or columnar structure.The evaporation end 22 has a heat conduction function. When the outer side of the evaporation end 22 contacts the heating element, heat from the heating element is absorbed by the evaporation end 22. The heat absorbed by the evaporation end 22 is then transferred to the second liquid in the second cavity 21. After absorbing the heat, the second liquid undergoes a phase change and transforms into vapor. This vapor is referred to herein as second vapor. Furthermore, the surface area of ​​the evaporation end 22 in contact with the heating element is smaller than the surface area of ​​the evaporation end 22 in contact with the second cavity 21. This allows the evaporation end 22 to relatively quickly absorb heat from the heating element, ensuring the service life of the heating element. Furthermore, it can quickly transfer the absorbed heat from the heating element to the second liquid in the second cavity 21, accelerating heat dissipation. In this embodiment, the shape of the condensation end 23 is not limited, and can be, for example, a plate-like or columnar structure. Furthermore, the condensation end 23 can be a curved plate-like structure to increase the contact area between the condensation end 23 and the first liquid, thereby improving overall heat dissipation. The condensation end 23 has a heat conduction function. When the second vapor encounters the condensation end 23, it absorbs the heat from the second vapor. The absorbed second vapor condenses into liquid and falls back into the second cavity. The heat absorbed by the second vapor at the condensation end 23 is then transferred to the first liquid, causing the heat-absorbing first liquid to undergo a phase change and transform into vapor. This vapor is referred to herein as the first vapor. Furthermore, the surface area of ​​the condensation end 23 in contact with the second cavity 21 is smaller than the surface area of ​​the condensation end 23 in contact with the first liquid. This allows the condensation end 23 to relatively quickly absorb the heat from the second vapor and also quickly transfer the absorbed heat to the first liquid, accelerating heat dissipation. Optionally, the heat dissipation device further includes a second liquid inlet, which is connected to the second cavity and configured to inject the second liquid into the second cavity. This allows the second liquid in the second cavity to be replenished and replaced at any time, making the passive liquid cooling system more reliable. In this embodiment, there are no restrictions on the boiling points of the first and second liquids. Further optionally, the boiling point of the first liquid is lower than the boiling point of the second liquid.In practical applications, heat loss occurs during transfer through the second liquid. The first liquid has a lower boiling point, making it easier to conduct heat away, thereby improving overall heat dissipation. In this embodiment, the condenser 30 is disposed on the first cavity and is configured to condense the first vapor upon encountering it, causing it to fall back into the first cavity. Specifically, the condenser 30 can be any device with a condensing function, and its implementation structure is not limited. Furthermore, optionally, the inner side of the condensation end may employ a finned structure, and / or the condenser may employ a finned structure. The finned structure includes multiple condensation channels extending vertically downward, with the inner side of the condensation end referring to the side facing the interior of the first cavity. The finned structure comprises multiple fins, with pairs of fins forming a condensation channel. This finned structure increases the heat exchange surface area and improves overall heat dissipation. It will be understood that when the first vapor rises and contacts the condenser 30, the condenser 30 condenses the first vapor, and the resulting condensed liquid falls back into the first cavity. The falling condensed liquid exchanges heat with the first liquid in the first cavity, further reducing the heat of the first liquid in the first cavity and ensuring reliable heat dissipation from the heat-generating device. In the embodiments of the present application, the location and arrangement of the condensing device in the first cavity are not limited. In an alternative embodiment, the condensing device may be disposed throughout the top region of the first cavity, i.e., a portion of the condensing device is located within the first cavity and extends from the interior of the first cavity through the top region of the first cavity to the exterior of the first cavity. Figures 4 and 5 illustrate the condensing device disposed throughout the top region of the first cavity as an example. In another alternative embodiment, the condensing device may be disposed within the first cavity, i.e., the entire condensing device is located within the first cavity, for example, disposed below the top region of the first cavity and secured to the top region. In yet another alternative embodiment, the condensing device may be implemented as the top region of the first cavity, i.e., the top region of the first cavity is made of a condensing material and directly serves as the condensing device. In another optional embodiment, the condensing device may include a first part and a second part, the first part is arranged on the first cavity, and the second part is arranged outside the first cavity and connected to the first part.For example, the condensing device is implemented as an I-shaped structure, wherein one "I" portion of the I-shape is located at the top area of ​​the first cavity, the other "I" portion is located outside the first cavity, and the two "I" portions are connected by a central "vertical" portion. Furthermore, optionally, the first and second portions of the condensing device can be integrally formed, without limitation. Referring to FIG. 4 , further optionally, the first cavity of the passive liquid cooling system is further provided with an exhaust device 40, configured to discharge the first vapor when the pressure within the first cavity exceeds a safety pressure value. Specifically, the exhaust device 40 can be any device with an exhaust function, such as an exhaust valve. The exhaust valve can include an air inlet and an air outlet. The air inlet communicates with the first cavity and is configured to admit the first vapor, while the air outlet communicates with the outside air and is configured to discharge the first vapor. The installation location of the exhaust device is not limited. Preferably, the exhaust device is installed at the top of the first cavity or at a first location on the sidewall of the first cavity, where the first location is higher than the liquid level of the first liquid. To better understand the new passive liquid cooling system provided by the embodiments of this application, the application scenario diagram shown in Figure 5 is used for illustration. First, the heat generating device contacts the evaporation end of the heat sink in the passive liquid cooling system. The evaporation end absorbs heat from the heat generating device. The heat absorbed by the evaporation end is transferred to the second liquid in the second cavity. The second liquid in the second cavity undergoes a phase change and transforms into a second vapor. The second vapor encounters the condensation end of the heat sink, cools, and becomes condensed liquid, which then falls back into the second cavity. Since the condensation end is immersed in the first liquid, the heat absorbed by the condensation end is transferred to the first liquid in the first cavity. After absorbing the heat, the first liquid undergoes a phase change and transforms into a first vapor. The first vapor rises to the condensation end, cools, and becomes condensed liquid, which then falls back into the first cavity. In actual use, the air pressure in the first cavity may be somewhat high. In this case, the exhaust device can exhaust air to the outside to reduce the air pressure in the first cavity, thereby ensuring the service life and reliability of the passive liquid cooling system. The embodiments of the present application provide a new passive liquid cooling system. This passive liquid cooling system belongs to liquid cooling technology in a broad technical scope, but is different from traditional cold plate liquid cooling solutions and immersion liquid cooling solutions. It is a completely new liquid cooling solution.The passive liquid cooling system provided in the embodiments of the present application is an indirect contact heat dissipation solution that does not rely on a circulation pump. Furthermore, it also utilizes a two-layer (or two-stage) liquid phase change for heat dissipation. Because it does not rely on a circulation pump, it can address various technical issues associated with the circulation pump. For example, the entire passive liquid cooling system is not limited by the circulation pump's service life, eliminating the need for pump operation and maintenance. Its deployment and implementation also do not rely on the overall IDC planning, making it easier to implement and deploy across various computer rooms. Furthermore, because it utilizes two layers of liquid phase change for heat dissipation, it offers high heat dissipation performance and can meet the heat dissipation requirements of high-power devices. For example, it is suitable for cooling various switching chips with large switching capacities, such as 51.2T switching chips. Furthermore, because it utilizes indirect contact heat dissipation, the chip or device is no longer immersed in liquid. While addressing the circulation pump issue and the heat dissipation requirements of high-power devices, it also addresses the issue of liquid interference with electrical or optical signals, making it universally applicable. The passive liquid cooling system provided in the embodiments of the present application can be used to dissipate heat for various chips containing optical signal modules, as well as future chips containing optical signal modules. The present invention also provides a board, comprising a chip, with the passive liquid cooling system provided by the present invention installed on the board and / or the chip. The board can be an embedded board with a different chip architecture, a different central processing unit (CPU), or a different board hardware configuration, without limitation. The board may include, but is not limited to, a CPU chip, a memory chip, a graphics processing unit (GPU) chip, a switching chip, and the like. A switching chip is a chip with switching and control functions and can be implemented using a field programmable gate array (FPGA). Optionally, the board and / or chip can be removably connected to the passive liquid cooling system, increasing the flexibility of installing and removing the passive liquid cooling system. Depending on the application requirements, the passive liquid cooling system can be installed directly on the board or on the chip on the board that requires cooling. Alternatively, the passive liquid cooling system can be installed simultaneously on the board and a specific chip to achieve dual cooling and further enhance the cooling effect.In the embodiments of the present application, the mounting method between the board or chip and the passive liquid cooling system is not limited; for example, screws, nuts, or clips may be used for fixed mounting. The embodiments of the present application also provide an electronic device comprising a board, which in turn comprises a chip, and the passive liquid cooling system provided by the embodiments of the present application is installed on the electronic device, board, and / or chip. Heat dissipation of the switch chip is a critical task in the daily operation and maintenance of a data center. The new passive liquid cooling system dissipates heat from the switch chip. Because it utilizes indirect contact liquid cooling and phase-change heat transfer with a low-boiling-point refrigerant, it eliminates the need for a circulation pump or liquid replenishment, making liquid cooling operation and maintenance more convenient and simple, and reducing operational complexity. Furthermore, the switch chip does not need to be immersed in liquid, which does not affect the optical signal transmission of the optical module on the switch chip. The liquid is sealed to prevent leakage, thereby improving data center safety. In practical applications, data centers experience peak and low loads throughout the year. When the data center is at peak load, i.e., the data center's load pressure is high, the switching chips in each computer room within the data center consume high power and generate a lot of heat. In this case, a passive liquid cooling system is detachably connected to the switching chips in the data center to efficiently dissipate heat from the switching chips and ensure safe operation of the data center. When the data center is at low load, i.e., the data center's load pressure is low, the switching chips in each computer room within the data center consume low power and generate little heat. In this case, the passive liquid cooling system can be detached from the switching chips in the data center to reduce the data center's energy consumption. It should be noted that in the above-described embodiments of this application, the heat dissipation device is a liquid-phase structure, but this is not limited to this. In some embodiments, the heat dissipation device can also be implemented as a physical heat dissipation structure, such as a solid metal block structure, such as a copper block, aluminum block, or other metal block with good heat dissipation properties. It should also be noted that the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, commodity, or apparatus.In the absence of further limitations, elements defined by the phrase "comprising a..." do not preclude the presence of other identical elements in the process, method, product, or device comprising the elements. The above are merely examples of the present application and are not intended to limit the present application. Persons skilled in the art will readily appreciate that various modifications and variations of the present application are possible. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application are intended to be encompassed by the claims of the present application.

Claims

Claims 1. A passive liquid cooling system, comprising: A first cavity, the interior of which is filled with a first liquid that can change phase; a heat dissipation device, which is arranged through the first cavity; the heat dissipation device includes: a second cavity, and an evaporation end and a condensation end connected to the second cavity, the second cavity is filled with a second liquid that can change phase; wherein the outer side of the evaporation end is arranged to contact the heating device, and causes the second liquid to change phase into a second vapor when absorbing heat; the outer side of the condensation end is in contact with the first liquid, and is arranged to diffuse heat into the first liquid when encountering the second vapor so that it changes phase into the first vapor, and causes the second vapor to condense and fall back into the second cavity; a condensation device, which is arranged on the first cavity, and is arranged to cause it to condense and fall back into the first cavity when encountering the first vapor.

2. The system according to claim 1, wherein: The heat dissipation device is arranged on the side wall of the first cavity, or is arranged on the bottom of the first cavity.

3. The system according to claim 2, wherein: The heat dissipation device is arranged in the middle area or the lower area of ​​the side wall.

4. The system according to claim 2, wherein: When the heat dissipation device is arranged on the side wall, the second cavity is a U-shaped cavity structure.

5. The system according to claim 1, wherein: The first cavity is also provided with an exhaust device, which is configured to discharge the first steam to the outside when the air pressure in the first cavity is greater than a safety pressure value.

6. The system according to claim 5, wherein: The exhaust device is arranged at the top of the first cavity, or at a first position on the side wall of the first cavity, and the first position is higher than the liquid level of the first liquid.

7. The system according to claim 1, wherein: The first cavity is also provided with a first liquid injection port, which is configured to inject a first liquid into the first cavity; And / or the heat dissipation device further includes a second liquid injection port, which is connected to the second cavity and is configured to inject a second liquid into the second cavity.

8. The system according to claim 1, wherein: The inner side of the condensation end adopts a fin structure, and / or the condensation device adopts a fin structure; wherein the fin structure includes a plurality of condensation channels extending vertically downward.

9. The system according to claim 1, wherein: The boiling point of the first liquid is lower than the boiling point of the second liquid.

10. The system according to any one of claims 1 to 9, wherein: The volume of the first cavity and the volume of the first liquid are determined in advance according to the type, application scenario and / or power of the heat generating device of the passive liquid cooling system to be used.

11. The system according to any one of claims 1 to 9, wherein: The condensing device is arranged throughout the top area of ​​the first cavity; or, the condensing device is arranged inside the first cavity; or, the condensing device is implemented as the top area of ​​the first cavity; or, the condensing device includes a first part and a second part, the first part is arranged on the first cavity, and the second part is arranged outside the first cavity and connected to the first part.

12. A board, comprising a chip, wherein the passive liquid cooling system according to any one of claims 1 to 11 is installed on the board and / or the chip.

13. An electronic device, wherein the electronic device comprises a board, the board comprises a chip, and the passive liquid cooling system according to any one of claims 1 to 11 is installed on the electronic device, the board and / or the chip.

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