Plating apparatus

Abstract

The present invention provides a technology with which it is possible to suppress splash of a plating solution.　This plating apparatus 1000 is provided with: a plating tank 10 which retains a plating solution Ps and in which an anode 11 is placed; a substrate holder 30 which holds a substrate Wf so as to face the anode, the substrate Wf serving as a cathode; a paddle 70 which is placed in a region that is above the anode and below the substrate within the plating tank, and which is configured so as to agitate the plating solution; a liquid splash suppression plate 60 which is placed in a region that is above the paddle and below the liquid surface Ls of the plating solution within the plating tank, and is placed in a region between an outer peripheral wall 10b of the plating tank and the substrate holder; and a support member 82 which is configured so as to support the liquid splash suppression plate in such a manner that the liquid splash suppression plate is movable in the vertical direction.

Description

Plating Equipment

[0001] The present invention relates to a plating apparatus.

[0002] Conventionally, plating apparatuses configured to perform plating processing on substrates have been known (see, for example, Patent Document 1). Such plating apparatuses include a plating tank that stores a plating solution and in which an anode is disposed, a substrate holder that holds the substrate as a cathode facing the anode, and a paddle that is disposed in a region inside the plating tank above the anode and below the substrate and configured to agitate the plating solution.

[0003] Patent No. 7079388

[0004] In the conventional plating apparatus described above, when the plating solution is agitated by the paddles, the plating solution in the plating tank may splash up (referred to as "plating solution splashing"). Conventional plating apparatuses have room for improvement in terms of suppressing plating solution splashing.

[0005] The present invention has been made in view of the above, and one of its objects is to provide a technique capable of suppressing splashing of plating solution.

[0006] (Aspect 1) In order to achieve the above object, a plating apparatus according to one aspect of the present invention includes a plating tank that stores plating solution and in which an anode is disposed, a substrate holder that holds a substrate as a cathode facing the anode, a paddle that is disposed in a region inside the plating tank above the anode and below the substrate and configured to agitate the plating solution, a splash suppression plate that is disposed in a region inside the plating tank above the paddle and below the level of the plating solution and is disposed in a region between the outer wall of the plating tank and the substrate holder, and a support member that is configured to support the splash suppression plate so that it can move in the vertical direction.

[0007] According to this aspect, when the plating solution is stirred by the paddles and flows, the splash suppression plate supported by the support member can provide resistance to the flow of the plating solution, thereby suppressing splashing of the plating solution.

[0008] (Aspect 2) In the above aspect 1, the splash suppression plate may include an elastic portion made of an elastic material that is elastically deformable when subjected to a force from the plating solution stirred by the paddle.

[0009] According to this aspect, when the plating solution is agitated by the paddle, the elastic portion of the splash suppression plate is elastically deformed, thereby reducing the kinetic energy of the plating solution, thereby effectively suppressing splashing of the plating solution.

[0010] (Aspect 3) In the above aspect 1 or aspect 2, the splash suppression plate may have a plurality of through holes.

[0011] (Aspect 4) Any one of Aspects 1 to 3 above may further include a plurality of protrusions provided on a portion of the outer peripheral wall of the plating tank facing the substrate holder, and on a portion of the substrate holder facing the outer peripheral wall.

[0012] According to this aspect, the plurality of protrusions can provide resistance to the flow of the plating solution, thereby effectively suppressing splashing of the plating solution.

[0013] FIG. 8A is a perspective view showing the overall configuration of a plating apparatus according to an embodiment; FIG. 8B is a plan view showing the overall configuration of a plating apparatus according to an embodiment; FIG. 8C is a schematic view showing the configuration of a plating module according to an embodiment; FIG. 8D is a schematic view showing a state in which a substrate according to an embodiment is immersed in a plating solution; FIG. 8E is a schematic view for explaining a paddle and a drive device according to an embodiment; FIG. 8F is a flow chart for explaining a series of operations from supplying a plating solution to starting a plating process according to an embodiment; FIG. 8G is a schematic enlarged cross-sectional view of a region near the liquid surface of a plating solution in a plating tank according to an embodiment; FIG. 8H is a schematic plan view of a splash suppression plate according to an embodiment; FIG. 8H is a schematic plan view of another example of a splash suppression plate according to an embodiment; FIG. 9A, FIG. 9B, and FIG. 9C are schematic plan views for explaining a splash suppression plate according to a first modification of the embodiment; FIG. 9I is a schematic cross-sectional view for explaining a splash suppression plate according to a second modification of the embodiment; FIG. 9I is a schematic cross-sectional view for explaining a splash suppression plate according to a third modification of the embodiment;

[0014] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the drawings are diagrammatically illustrated to facilitate understanding of the characteristics of the components, and the dimensional ratios of the components may not be the same as those in reality. In addition, some of the drawings show an X-Y-Z Cartesian coordinate system for reference. In these Cartesian coordinate systems, the Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction (the direction in which gravity acts).

[0015] Fig. 1 is a perspective view showing the overall configuration of a plating apparatus 1000 according to this embodiment. Fig. 2 is a plan view (top view) showing the overall configuration of the plating apparatus 1000 according to this embodiment. As shown in Figs. 1 and 2, the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, a transfer device 700, and a control module 800.

[0016] The load port 100 is a module for loading substrates stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 and unloading substrates from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of the load ports 100 are optional. The transfer robot 110 is a robot for transporting substrates, and is configured to transfer substrates between the load port 100, the aligner 120, the pre-wet module 200, and the spin rinse dryer 600. When transferring substrates between the transfer robot 110 and the transfer device 700, the transfer robot 110 and the transfer device 700 can transfer the substrates via a temporary stage (not shown).

[0017] The aligner 120 is a module for aligning the positions of the substrate's orientation flat, notch, and the like in a predetermined direction. In this embodiment, two aligners 120 are arranged horizontally, but the number and arrangement of the aligners 120 are optional. The prewet module 200 wets the surface of the substrate to be plated with a treatment liquid such as pure water or degassed water before plating, thereby replacing air within a pattern formed on the substrate surface with the treatment liquid. The prewet module 200 is configured to perform a prewet process that replaces the treatment liquid within the pattern with a plating liquid during plating, thereby making it easier to supply the plating liquid within the pattern. In this embodiment, two prewet modules 200 are arranged vertically, but the number and arrangement of the prewet modules 200 are optional.

[0018] The presoak module 300 is configured to perform a presoak process, which involves etching away, for example, an oxide film with high electrical resistance present on the surface of a seed layer formed on the surface of a substrate to be plated before plating, using a treatment solution such as sulfuric acid or hydrochloric acid to clean or activate the surface of the substrate to be plated. In this embodiment, two presoak modules 300 are arranged vertically, but the number and arrangement of the presoak modules 300 are optional. The plating module 400 performs plating on the substrate. In this embodiment, two sets of 12 plating modules 400 are arranged vertically, three vertically and four horizontally, for a total of 24 plating modules 400, but the number and arrangement of the plating modules 400 are optional.

[0019] The cleaning module 500 is configured to perform a cleaning process on the substrate to remove plating solution and the like remaining on the substrate after plating. In this embodiment, two cleaning modules 500 are arranged vertically, but the number and arrangement of the cleaning modules 500 are optional. The spin rinse dryer 600 is a module for drying the substrate after cleaning by rotating it at high speed. In this embodiment, two spin rinse dryers 600 are arranged vertically, but the number and arrangement of the spin rinse dryers 600 are optional. The transport device 700 is a device for transporting substrates between multiple modules within the plating apparatus 1000. The control module 800 is configured to control the multiple modules of the plating apparatus 1000 and can be configured, for example, as a general computer or a dedicated computer equipped with an input / output interface with an operator.

[0020] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, a substrate stored in a cassette is loaded into the load port 100. Next, the transfer robot 110 removes the substrate from the cassette in the load port 100 and transfers the substrate to the aligner 120. The aligner 120 aligns the positions of the orientation flat, notch, and the like of the substrate to a predetermined direction. The transfer robot 110 delivers the substrate, whose direction has been aligned by the aligner 120, to the pre-wet module 200.

[0021] The pre-wet module 200 performs a pre-wet process on the substrate. The transport device 700 transports the substrate that has been subjected to the pre-wet process to the pre-soak module 300. The pre-soak module 300 performs a pre-soak process on the substrate. The transport device 700 transports the substrate that has been subjected to the pre-soak process to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0022] The transfer device 700 transfers the substrate after plating to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transfer device 700 transfers the substrate after cleaning to the spin rinse dryer 600. The spin rinse dryer 600 dries the substrate. The transfer robot 110 receives the substrate from the spin rinse dryer 600 and transfers the dried substrate to a cassette on the load port 100. Finally, the cassette containing the substrate is removed from the load port 100.

[0023] It should be noted that the configuration of the plating apparatus 1000 described in FIGS. 1 and 2 is merely an example, and the configuration of the plating apparatus 1000 is not limited to the configurations shown in FIGS.

[0024] Next, a description will be given of the plating module 400. Since the multiple plating modules 400 included in the plating apparatus 1000 according to this embodiment have the same configuration, only one plating module 400 will be described.

[0025] Fig. 3 is a schematic diagram showing the configuration of the plating module 400 in the plating apparatus 1000 according to this embodiment. Specifically, Fig. 3 shows the plating module 400 in a state before the substrate Wf is immersed in the plating solution Ps. Fig. 4 is a schematic diagram showing the state after the substrate Wf is immersed in the plating solution Ps.

[0026] The plating apparatus 1000 illustrated in Figures 3 and 4 is, for example, a plating apparatus of the type in which the substrate Wf is immersed in the plating solution Ps with its surface oriented horizontally (a so-called cup-type plating apparatus).

[0027] 3 and 4 includes a plating module 400, a plating tank 10, an overflow tank 20, a substrate holder 30, and a paddle 70. The plating module 400 may also include a rotation mechanism 40, a tilt mechanism 45, and a lifting mechanism 50, as shown in FIG.

[0028] The plating tank 10 according to this embodiment is a bottomed container with an opening at the top. Specifically, the plating tank 10 has a bottom wall 10a and an outer peripheral wall 10b extending upward from the outer periphery of the bottom wall 10a, with the upper portion of the outer peripheral wall 10b being open. The shape of the outer peripheral wall 10b of the plating tank 10 is not particularly limited, but the outer peripheral wall 10b according to this embodiment has a cylindrical shape, for example. A plating solution Ps is stored inside the plating tank 10.

[0029] The plating solution Ps may be any solution containing ions of the metal elements that make up the plating film, and specific examples thereof are not particularly limited. In this embodiment, copper plating is used as an example of plating, and a copper sulfate solution is used as an example of plating solution Ps. The plating solution Ps may also contain certain additives.

[0030] An anode 11 is disposed inside the plating tank 10. The specific type of the anode 11 is not particularly limited, and may be an insoluble anode or a soluble anode. In the present embodiment, an insoluble anode is used as an example of the anode 11. The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, or the like may be used.

[0031] As illustrated in Figures 3 and 4, an ion resistor 12 may be disposed above the anode 11 inside the plating tank 10. Specifically, as illustrated in the partially enlarged view of Figure 4, the ion resistor 12 is configured as a porous plate member having a plurality of holes 12a (pores). The holes 12a are provided so as to connect the lower surface and the upper surface of the ion resistor 12.

[0032] The ion resistor 12 is provided to homogenize the electric field formed between the anode 11 and the substrate Wf serving as the cathode. By disposing the ion resistor 12 in the plating tank 10 as in this embodiment, it is possible to easily homogenize the thickness of the plating film (plating layer) formed on the substrate Wf.

[0033] As illustrated in Figures 3 and 4, a membrane 16 may be disposed inside the plating tank 10 above the anode 11 and below the ionic resistor 12. In this case, the membrane 16 divides the interior of the plating tank 10 into an anode chamber 17a below the membrane 16 and a cathode chamber 17b above the membrane 16. The anode 11 is disposed in the anode chamber 17a, and the ionic resistor 12 and the substrate Wf are disposed in the cathode chamber 17b. The membrane 16 is configured to allow ionic species, including metal ions, contained in the plating solution Ps to pass through the membrane 16 while inhibiting non-ionic plating additives contained in the plating solution Ps from passing through the membrane 16. For example, an ion exchange membrane can be used as such a membrane 16.

[0034] The plating tank 10 is provided with a supply port for supplying the plating solution Ps to the plating tank 10. Specifically, the outer wall 10b of the plating tank 10 according to this embodiment is provided with a first supply port 13a for supplying the plating solution Ps to the anode chamber 17a and a second supply port 13b for supplying the plating solution Ps to the cathode chamber 17b.

[0035] The plating tank 10 is also provided with a first outlet 14a for discharging the plating solution Ps in the anode chamber 17a to the outside of the plating tank 10. The plating solution Ps discharged from the first outlet 14a is pressure-fed by a pump (not shown) and supplied again to the anode chamber 17a from the first supply port 13a.

[0036] The overflow tank 20 is a bottomed container disposed outside the plating tank 10. The overflow tank 20 is provided to temporarily store the plating solution Ps that has exceeded the upper end of the outer wall 10b of the plating tank 10 (i.e., the plating solution Ps that has overflowed from the plating tank 10). The plating solution Ps stored in the overflow tank 20 is discharged from the second outlet 14b, then pressure-fed by a pump (not shown), and supplied again to the cathode chamber 17b from the second supply port 13b.

[0037] The substrate holder 30 holds the substrate Wf as a cathode so that the surface Wfa to be plated of the substrate Wf faces the anode 11. In this embodiment, the surface Wfa to be plated of the substrate Wf is specifically provided on the surface (lower surface) facing downward of the substrate Wf.

[0038] The substrate holder 30 is connected to a rotation mechanism 40. The rotation mechanism 40 is a mechanism for rotating the substrate holder 30. "R1" illustrated in FIG. 3 is an example of the rotation direction of the substrate holder 30. A known rotation motor or the like can be used as the rotation mechanism 40. The tilt mechanism 45 is a mechanism for tilting the rotation mechanism 40 and the substrate holder 30. The lifting mechanism 50 is supported by a support shaft 51 extending in the vertical direction. The lifting mechanism 50 is a mechanism for raising and lowering the substrate holder 30, the rotation mechanism 40, and the tilting mechanism 45 in the vertical direction. A known lifting mechanism such as a linear actuator can be used as the lifting mechanism 50.

[0039] The control module 800 includes a microcomputer, which includes a processor 801, a storage device 802 as a non-transitory storage medium, etc. The control module 800 controls the operation of the plating module 400 by operating the processor 801 based on instructions from a program stored in the storage device 802.

[0040] 5 is a schematic diagram illustrating the paddle 70 and a driving device 90 (described later). Referring to FIGS. 4 and 5, the paddle 70 is disposed in a region above the anode 11 and below the substrate Wf inside the plating tank 10. Specifically, the paddle 70 according to this embodiment is disposed between the ion resistor 12, which is disposed above the anode 11, and the substrate Wf.

[0041] 5, the paddle 70 is an "agitation member" configured to be driven by a drive device 90 to agitate the plating solution Ps. As an example, the drive device 90 according to this embodiment receives instructions from a control module 800 and alternately drives the paddle 70 in a "first direction (1st)" parallel to the anode 11 (or the substrate Wf) and in a "second direction (2nd)" opposite to the first direction. That is, the paddle 70 according to this embodiment reciprocates in the first direction and the second direction.

[0042] It should be noted that known technology can be applied to the mechanical mechanism itself of such drive device 90. Specifically, drive device 90 according to this embodiment includes an electric motor 91 and a power conversion mechanism 92 that is connected to paddle 70 and is configured to convert the rotational motion of electric motor 91 into linear reciprocating motion and transmit the motion to paddle 70.

[0043] The first direction and the second direction are not limited to the above-mentioned directions. The direction perpendicular to the reciprocating direction of the paddle 70 is referred to as the "third direction (3rd)." Figure 5 also illustrates, as central axes of the paddle 70, a first central axis XL1 extending in the third direction and a second central axis XL2 extending in the reciprocating direction of the paddle 70.

[0044] The paddle 70 only needs to be located inside the plating tank 10 at least when stirring the plating solution Ps, and does not need to be located inside the plating tank 10 all the time. For example, when the driving of the paddle 70 is stopped and the plating solution Ps is not stirred by the paddle 70, the paddle 70 may be configured to be located outside the plating tank 10.

[0045] The specific configuration of the paddle 70 is not particularly limited as long as it can agitate the plating solution Ps. As an example, the paddle 70 shown in FIG. 5 includes a honeycomb structure portion 71 having a honeycomb structure and a pair of outer frames (a first outer frame 72a and a second outer frame 72b) connected to the third direction ends of the honeycomb structure portion 71. As an example, the first outer frame 72a and the second outer frame 72b according to this embodiment are made of flat plate-like members. At least one of the first outer frame 72a and the second outer frame 72b is connected to a driving device 90.

[0046] The honeycomb structure section 71 has a plurality of polygonal holes 74 partitioned by beam members 73. The holes 74 according to this embodiment penetrate in the vertical direction so as to connect the upper and lower surfaces of the honeycomb structure section 71. The honeycomb structure section 71 also has a first peripheral wall 75 facing in a first direction and a second peripheral wall 76 facing in a second direction. The first peripheral wall 75 and the second peripheral wall 76 are formed by the beam members 73.

[0047] The specific polygonal shape of the hole 74 is not particularly limited, and various N-sided shapes (N is a natural number equal to or greater than 3) such as a triangle, a square, a pentagon, a hexagon, a heptagon, an octagon, etc. can be used. In this modification, a hexagon is used as an example of a polygon.

[0048] As an example, the paddle 70 illustrated in Fig. 5 has a portion in which the "paddle width D1 (the length in the reciprocating movement direction of the paddle 70)" of the honeycomb structure portion 71 changes along the third direction in plan view. Specifically, the paddle 70 has a shape in which the paddle width D1 at the center in the third direction is wider than the paddle width D1 at the end in the third direction. In other words, the paddle 70 has a shape in which the portion closer to the center than the end in the third direction protrudes in the first and second directions more than the end.

[0049] With this configuration, the area in which the paddle 70 can stir when the paddle 70 moves a certain distance can be made wider, for example, compared to when the paddle width D1 at the center of the paddle 70 is the same as the paddle width D1 at the end.

[0050] Moreover, the paddle 70 according to the present embodiment has, as an example, a shape that is line-symmetric (bilaterally symmetric) with respect to the second central axis line XL2.

[0051] The honeycomb structure portion 71 of the paddle 70 according to this embodiment includes a first outer peripheral wall 75 facing a first direction and a second outer peripheral wall 76 facing a second direction. The first outer peripheral wall 75 and the second outer peripheral wall 76 are formed by beam members 73.

[0052] The specific manufacturing method of the paddle 70 is not particularly limited, but as an example, the paddle 70 according to this embodiment can be manufactured using a known three-dimensional printing machine such as a 3D printer.

[0053] The configuration of the paddle 70 is not limited to the above-described configuration, and may be any other known configuration (e.g., various configurations such as those exemplified in Patent Document 1) as long as it is capable of stirring the plating solution Ps. As another example, the paddle 70 may include, instead of the honeycomb structure portion 71, a plurality of beam members extending linearly in the third direction.

[0054] 6 is a flow diagram illustrating a series of operations from supplying the plating solution to starting the plating process according to this embodiment. First, the plating solution Ps is supplied to the plating tank 10 (step S10). Specifically, the plating solution Ps is supplied to the plating tank 10 so that the anode 11 and the ion resistor 12 are immersed in the plating solution Ps. More specifically, in this embodiment, the plating solution Ps is supplied to the plating tank 10 through the first supply port 13a and the second supply port 13b.

[0055] Next, the substrate Wf is immersed in the plating solution Ps (step S20). Specifically, in this embodiment, the lifting mechanism 50 lowers the substrate holder 30, thereby immersing at least the plating surface Wfa of the substrate Wf in the plating solution Ps.

[0056] Next, the driving device 90 starts driving the paddle 70, thereby causing the paddle 70 to start stirring the plating solution Ps (step S30).

[0057] Next, a current is applied between the anode 11 and the substrate Wf by a current applying device (not shown), thereby starting the plating process on the substrate Wf (step S40). This starts the formation of a plating film on the plating surface Wfa of the substrate Wf. Specifically, in this embodiment, even during the plating process on the substrate Wf in step S40, the plating solution Ps is being agitated by the paddle 70 in step S30 (i.e., the plating solution Ps is being agitated while the plating film is being formed on the plating surface Wfa).

[0058] Preferably, the control module 800 starts the rotation of the substrate holder 30 when performing step S20, step S30, or step S40, so that the substrate holder 30 can be rotated at least during the plating process in step S40.

[0059] The timing at which the paddle 70 stirs the plating solution Ps is not limited to the above-mentioned timing. For example, the plating solution Ps may be stirred by the paddle 70 between steps S10 and S20 (i.e., after the plating solution Ps is supplied to the plating tank 10 and before the substrate Wf is immersed in the plating solution Ps).

[0060] 7 is a schematic enlarged cross-sectional view of a region (portion A1 in FIG. 4) near the liquid level Ls of the plating solution Ps in the plating tank 10. As illustrated in FIG. 7, the plating apparatus 1000 according to this embodiment further includes a splash suppression plate 60 and a support member 82.

[0061] The splash suppression plate 60 is disposed in a region inside the plating tank 10 above the paddle 70 and below the liquid level Ls of the plating solution Ps, and is also disposed in the region (gap) between the outer peripheral wall 10b of the plating tank 10 and the substrate holder 30. Specifically, the splash suppression plate 60 is supported so as to be suspended from above by a spring member 80 of a support member 82, which will be described later. The splash suppression plate 60 is a plate member configured to suppress splashing of the plating solution Ps by providing resistance to the flow of the agitated plating solution Ps when the plating solution Ps is agitated by the paddle 70.

[0062] Fig. 8(A) is a schematic plan view of the splash suppression plate 60. Fig. 8(B) is a schematic plan view showing another example of the splash suppression plate 60. As shown in Fig. 8(A), the splash suppression plate 60 may be formed of an annular member. In this case, the splash suppression plate 60 is entirely disposed in an annular gap provided between the substrate holder 30 and the outer peripheral wall 10b of the plating tank 10 in a plan view.

[0063] Alternatively, as illustrated in Fig. 8(B), the splash suppression plates 60 may be arranged partially inside the plating tank 10. In this case, the plating apparatus 1000 may have a plurality of splash suppression plates 60. Specifically, the two splash suppression plates 60 illustrated in Fig. 8(B) have an arc shape in a plan view and are arranged partially in the region between the outer wall 10b of the plating tank 10 and the substrate holder 30.

[0064] In this embodiment, the splash suppression plate 60 does not have a through hole 61, which will be described later.

[0065] 7, the support member 82 is configured to support the splash suppression plate 60 so as to be movable in the vertical direction. Specifically, the support member 82 according to this embodiment includes a spring member 80 and a support plate 85.

[0066] The spring member 80 has a lower end connected to the upper surface of the splash suppression plate 60 and an upper end connected to a support plate 85, which will be described later. The number of spring members 80 may be one or more. As an example, the number of spring members 80 according to this embodiment is more than one. Furthermore, as an example, the spring member 80 according to this embodiment is configured by a coil-shaped spring member (i.e., a coil spring). However, the specific type of the spring member 80 is not limited to a coil spring, and may be, for example, a plate-shaped spring (leaf spring).

[0067] The support plate 85 is a member for supporting the spring member 80. Specifically, the support plate 85 according to this embodiment is connected to a predetermined location of the plating tank 10 (in this embodiment, the outer peripheral wall 10b as an example), and supports the spring member 80 from above.

[0068] When the plating solution Ps is stirred by the paddle 70 and flows, the splash suppression plate 60 receives a force from the plating solution Ps and moves in the vertical direction (in FIG. 7 , the direction of movement of the splash suppression plate 60 is illustrated by the arrow (mv)). The spring member 80 according to this embodiment is provided mainly to damp the vertical movement of the splash suppression plate 60.

[0069] Although the specific arrangement of the support member 82 is not particularly limited, as an example, it is preferable that the support member 82 is arranged so that the splash suppression plate 60 supported by the support member 82 is horizontal when the paddle 70 is not stirring the plating solution Ps. In fact, the splash suppression plate 60 illustrated in Fig. 7 is supported by the support member 82 so that the surface direction of the lower surface of the splash suppression plate 60 extends horizontally.

[0070] Furthermore, when the plating apparatus 1000 has a plurality of spring members 80, the spring constants (N / mm) of the plurality of spring members 80 may be the same. Alternatively, some of the plurality of spring members 80 may include spring members having a spring constant different from the other spring members 80. That is, in this case, the plurality of spring members 80 may include at least one spring member 80 having a first spring constant and at least one spring member 80 having a second spring constant.

[0071] Furthermore, if there is a location in the region between the substrate holder 30 and the outer wall 10b of the plating tank 10 where splashing is particularly likely to occur, the spring constant of the spring member 80 arranged in this location may be smaller than the spring constant of the spring members 80 arranged in other locations. This configuration makes it possible to increase the amount of vertical movement of the splash suppression plate 60 in the location where splashing is particularly likely to occur, thereby effectively suppressing splashing.

[0072] 7, the plating apparatus 1000 may further include a plurality of protrusions 130. Specifically, as illustrated in Fig. 7, the plurality of protrusions 130 may be provided on a portion of the outer peripheral wall 10b of the plating tank 10 facing the substrate holder 30, and on a portion of the substrate holder 30 facing the outer peripheral wall 10b.

[0073] More specifically, the plurality of protrusions 130 according to this embodiment are provided so as to provide resistance to the flow of the plating solution Ps when the plating solution Ps is stirred by the paddle 70 and flows. As a result, the plurality of protrusions 130 form a so-called "labyrinth flow path." Specifically, the plurality of protrusions 130 according to this embodiment form a labyrinth flow path, for example, by being arranged in staggered steps in the vertical direction.

[0074] Furthermore, each of the plurality of protrusions 130 may be configured as a "plate-like protrusion" extending a predetermined distance in the circumferential direction of the substrate holder 30 or the outer peripheral wall 10b. Specifically, in this case, the plurality of protrusions 130 (plate-like protrusions) may be provided around the entire circumference of the substrate holder 30 and the outer peripheral wall 10b (i.e., may be provided in an annular shape), or may be provided only on a portion of the substrate holder 30 and the outer peripheral wall 10b (i.e., partially).

[0075] According to the present embodiment as described above, since the splash suppression plate 60 and the support member 82 are provided as described above, when the plating solution Ps is stirred by the paddle 70 and flows, the splash suppression plate 60 supported by the support member 82 can provide resistance to the flow of the plating solution Ps. This makes it possible to suppress splashing of the plating solution Ps. This makes it possible to prevent malfunctions in the plating apparatus 1000 caused by splashing of the plating solution Ps.

[0076] Furthermore, according to this embodiment, splashing of the plating solution Ps can be suppressed as described above, so that splashing of the plating solution Ps can be suppressed without increasing the height of the outer peripheral wall 10b of the plating tank 10 (i.e., even if the height of the outer peripheral wall 10b of the plating tank 10 is low). This makes it possible to suppress splashing of the plating solution Ps while reducing the size of the plating apparatus 1000.

[0077] Furthermore, according to this embodiment, since the plurality of protrusions 130 as described above are provided, the plurality of protrusions 130 can also act as a resistance to the flow of the plating solution Ps, thereby effectively suppressing splashing of the plating solution Ps.

[0078] The plating apparatus 1000 may be configured without the plurality of protrusions 130 described above.

[0079] 9A to 9C are schematic plan views illustrating a splash suppression plate 60 according to a first modification of the embodiment. Specifically, the splash suppression plate 60 according to this modification illustrated in FIGS. 9A to 9C is a schematic enlarged view of the A2 portion illustrated in FIG. 8A.

[0080] 9(A) to 9(C), the splash suppression plate 60 may have a plurality of through holes 61. Specifically, the plurality of through holes 61 are configured to penetrate the splash suppression plate 60 in the vertical direction.

[0081] The specific configuration of the through-hole 61 is not particularly limited, but may be, for example, a circular hole as shown in Fig. 9(A) . Specifically, the through-hole 61 of the splash suppression plate 60 shown in Fig. 9(A) may be formed as a punched hole manufactured by a so-called punching process.

[0082] Alternatively, as shown in FIG. 9B, the through-hole 61 may be a slit-shaped hole.

[0083] 9(C), the splash suppression plate 60 may be formed of a member in which a plurality of wire members 62 are woven into a mesh. In this case, through holes 61 are provided in the area surrounded by the adjacent wire members 62 (i.e., the mesh).

[0084] 10 is a schematic cross-sectional view illustrating a splash suppression plate 60 according to a second modification of the embodiment. Specifically, FIG. 10 illustrates an example of an elastically deformed splash suppression plate 60. The splash suppression plate 60 may include an elastic portion 63 made of an elastic material that is elastically deformable when subjected to a force from the plating solution Ps stirred by the paddle 70.

[0085] Specifically, the splash suppression plate 60 may be entirely formed by the elastic portion 63, or may include only a part of the elastic portion 63. As an example, the splash suppression plate 60 according to this modification is entirely formed by the elastic portion 63.

[0086] According to this modification, when the plating solution Ps is agitated by the paddle 70, the splash suppression plate 60, particularly the elastic portion 63, is elastically deformed, thereby reducing the kinetic energy of the plating solution Ps, thereby effectively suppressing splashing of the plating solution Ps.

[0087] (Modification 3) Fig. 11 is a schematic cross-sectional view illustrating a splash suppression plate 60 according to Modification 3 of the embodiment. In the above-described embodiment (see, for example, Fig. 7), the outer peripheral side surface of the splash suppression plate 60 contacts the outer peripheral wall 10b of the plating tank 10, but this configuration is not limited to this. As in this modification illustrated in Fig. 11, the outer peripheral side surface 65 of the splash suppression plate 60 (this is the side surface of the splash suppression plate 60 that faces the outer peripheral wall 10b of the plating tank 10) may be configured not to contact the outer peripheral wall 10b of the plating tank 10.

[0088] Specifically, the splash suppression plate 60 according to this modified example illustrated in FIG. 11 has a gap Gp between the outer peripheral side surface 65 of the splash suppression plate 60 and the outer peripheral wall 10 b of the plating tank 10 .

[0089] The gap Gp may be provided over the entire circumferential direction of the splash suppression plate 60 (i.e., continuously), or may be provided partially (i.e., intermittently).

[0090] This modification can also achieve the same effects as those of the above-described embodiment. Furthermore, this modification can easily increase the degree of freedom of the operating range of the splash suppression plate 60. That is, the splash suppression plate 60 can easily move more freely. This makes it possible to effectively suppress splashing of the plating solution Ps.

[0091] In addition, the splash suppression plate 60 according to the above-mentioned variant 1 (Figures 9(A) to 9(C)) and variant 2 (Figure 10) may also have a gap Gp between the outer side surface of the splash suppression plate 60 and the outer wall 10b of the plating tank 10, as in this variant.

[0092] Although the embodiments and modifications of the present invention have been described in detail above, the present invention is not limited to such specific embodiments and modifications, and various further modifications and changes are possible within the scope of the gist of the present invention.

[0093] REFERENCE SIGNS LIST 10 Plating tank 10b Outer peripheral wall 11 Anode 30 Substrate holder 60 Splash suppression plate 61 Through hole 63 Elastic portion 70 Paddle 82 Support member 130 Protrusion 1000 Plating device Ls Liquid surface of plating solution Ps Plating solution Wf Substrate

Claims

1. A plating apparatus comprising: a plating tank that stores a plating solution and in which an anode is disposed; a substrate holder that holds a substrate as a cathode so as to face the anode; a paddle disposed in a region above the anode and below the substrate inside the plating tank and configured to stir the plating solution; a splash suppression plate disposed in a region above the paddle and below the liquid surface of the plating solution inside the plating tank and in a region between the outer peripheral wall of the plating tank and the substrate holder; and a support member configured to support the splash suppression plate so as to be movable in the vertical direction.

2. The plating apparatus according to claim 1, wherein the splash suppression plate includes an elastic portion made of an elastic material that is elastically deformable when receiving a force from the plating solution stirred by the paddle.

3. The plating apparatus according to claim 1, wherein the splash suppression plate has a plurality of through holes.

4. The plating apparatus according to claim 1, further comprising a plurality of protrusions provided at a portion of the outer peripheral wall of the plating tank facing the substrate holder and at a portion of the substrate holder facing the outer peripheral wall.

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