Terminal, semiconductor device manufacturing system, and display method

Abstract

The purpose of the present invention is to provide a digital dashboard that can be used in a semiconductor device manufacturing apparatus and a semiconductor device manufacturing system.　One terminal according to the present invention is connected to a network provided with at least a first database in which recipe information that is used in a semiconductor manufacturing apparatus for processing a sample is stored, a second database in which an electron microscope image of the sample is stored, and a server that is capable of directly or indirectly communicating with the first database and the second database, wherein the terminal is characterized by comprising a processor for processing a communication protocol with the network, and a user interface (hereafter referred to as "UI") for displaying information that is stored in the first database or the second database, the terminal also being characterized in that, in accordance with a request inputted from the UI, a digital dashboard for displaying the recipe information or the electron microscope image is displayed on the UI.

Description

Terminal, semiconductor device manufacturing system and display method

[0001] The present invention relates to a terminal, a semiconductor device manufacturing system, and a display method.

[0002] Digital dashboards have traditionally been used as an information analysis tool to centralize and display data collected from multiple sources in real time, promoting the use of data. Digital dashboards are used in fields such as marketing and business analysis, as well as manufacturing.

[0003] For example, Patent Document 1 addresses the issue of "providing a control program and a control method for a multifunction device group for maintaining and optimizing a multifunction device group using a handheld device such as a smartphone or a tablet," and discloses the following content as a control program and a control method for a multifunction device group: "The control program for a multifunction device group of an embodiment is executed by a handheld device that accumulates data of a plurality of multifunction devices and receives proposals or recommendations from a data analysis server that generates the proposals or recommendations based on the accumulated data using a machine learning function, and causes the handheld device to execute the steps of displaying a dashboard of a plurality of selection items on a user interface of the handheld device, selecting one selection item from the dashboard, displaying the proposal or recommendation related to the selected selection item on the user interface, and applying the displayed proposal or recommendation to the multifunction device selected from the user interface."

[0004] Japanese Patent Application Laid-Open No. 2021-129295

[0005] While Patent Document 1 discloses the use of a digital dashboard in a document processing device, it does not anticipate its use in semiconductor device manufacturing equipment and semiconductor device manufacturing systems. Therefore, an object of the present invention is to provide technology that enables the use of a digital dashboard in semiconductor device manufacturing equipment and semiconductor device manufacturing systems.

[0006] In order to solve the above-mentioned problems, one representative terminal of the present invention is a terminal connected to a network that includes at least a first database storing recipe information used in a semiconductor manufacturing device for processing a sample, a second database storing electron microscope images of the sample, and a server that can communicate directly or indirectly with the first database and the second database, wherein the terminal includes a processor that processes a communication protocol with the network and a user interface (hereinafter referred to as "UI") that displays information stored in the first database or the second database, and the UI displays a digital dashboard that displays the recipe information or electron microscope images in response to a request input from the UI.

[0007] According to the present invention, a digital dashboard can be utilized in semiconductor device manufacturing equipment and a semiconductor device manufacturing system. Problems, configurations, and effects other than those described above will become apparent from the following description of the preferred embodiments of the present invention.

[0008] FIG. 1 is a diagram showing the configuration of a semiconductor device manufacturing system using a platform and an equipment group including semiconductor manufacturing equipment. FIG. 2 is a block diagram showing the configuration of a user's personal computer. FIG. 3 is a flowchart showing the procedure for creating a report in the semiconductor device manufacturing system. FIG. 4 is a diagram showing an example of recipe information input to an etching apparatus. FIG. 5 is a diagram showing a cross-sectional view of a device. FIG. 6 is a diagram showing a microscope image display including a microscope image. FIG. 7 is a diagram showing a foreign matter information display including information about foreign matter. FIG. 8 is a diagram showing an example of a selection list displayed on the output unit of the user's personal computer. FIG. 9 is a diagram showing an example of a selection list displayed on the output unit of the user's personal computer. FIG. 10 is a diagram showing the configuration of a semiconductor device manufacturing system using a network and an equipment group including semiconductor device manufacturing equipment.

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the present invention is not limited to this embodiment. In addition, in the description of the drawings, the same parts are denoted by the same reference numerals. When there are multiple components having the same or similar functions, they may be described by denoting the same reference numerals with different subscripts. Furthermore, when it is not necessary to distinguish between these multiple components, the subscripts may be omitted in the description.

[0010] In this disclosure, a "recipe" refers to a processing program that defines the procedure and control parameters of processing to be performed in an apparatus.

[0011] First Embodiment (System Configuration) The configuration of a semiconductor device manufacturing system according to a first embodiment will be described with reference to FIG. 1 . FIG. 1 illustrates the configuration of a semiconductor device manufacturing system 1 using a group of devices, including semiconductor manufacturing equipment, and a network 117 (hereinafter referred to as the "platform 117"). The platform 117 is a network including at least a first database storing recipe information used by the semiconductor manufacturing equipment for processing samples, a second database storing electron microscope images of the samples, and a server capable of communicating directly or indirectly with the first database and the second database. The semiconductor device manufacturing system 1 accumulates data related to manufacturing equipment and other equipment important in the manufacture of semiconductor devices, enabling analysis of the data for evaluating processes in the manufacture of semiconductor devices and maintaining and managing the manufacturing equipment and other equipment. In FIG. 1 , the environment to which the platform 117 is applied is divided into three areas: an equipment area network, an internal network, and an external network.

[0012] The equipment area network is a network connecting a semiconductor manufacturing equipment control device (hereinafter referred to as a "semiconductor manufacturing equipment PC") 101, a semiconductor inspection equipment control device (hereinafter referred to as a "semiconductor inspection equipment PC") 102, a semiconductor analysis equipment control device (hereinafter referred to as a "semiconductor analysis equipment PC") 103, a semiconductor analysis equipment control device (hereinafter referred to as a "semiconductor analysis equipment PC") 104, and a relay device (hereinafter referred to as a "relay PC") 105. The semiconductor manufacturing equipment PC 101, the semiconductor inspection equipment PC 102, the semiconductor analysis equipment PC 103, and the semiconductor analysis equipment PC 104 are also referred to simply as "equipment PCs 101-104." The semiconductor manufacturing equipment and the like controlled by the equipment PCs are also simply referred to as an "equipment group 100." In other words, the equipment group 100 is a collection of processing devices that process samples. The processing devices are devices that perform manufacturing (etching, etc.), inspection, analysis, and analytical processes. The processing devices can also be referred to as semiconductor device manufacturing equipment.

[0013] The internal network is a network that connects a conversion connection device (hereinafter referred to as a "gateway PC") 108, a user's personal computer 114, a user's portable terminal personal computer 115, and a route setting device (hereinafter referred to as a "route setting PC") 118.

[0014] The external network is a network that connects the database server 106, application server 109, web server 110, GPU server 111, and remote monitor PC 116. The internal network and the external network are connected via the Internet 113. The database server 106, application server 109, web server 110, and GPU server 111 are also simply referred to as the "server group 106 and 109-111."

[0015] The platform 117 includes an application server 109, a GPU server 111, and a web server 110. The application server 109 or the GPU server 111 is connected to the web server 110 via a communication means. The platform 117 enables remote access to the equipment PCs 101-104 in the equipment area network from a user PC 114 and a user portable terminal PC 115 on the internal network or a remote monitor PC 116 on the external network. The platform 117 also includes a network of equipment groups 100 including semiconductor manufacturing equipment, a relay PC 105 that performs security checks, a gateway PC 108 and a route setting PC 118 that have a data acquisition program, and various databases. Note that the configuration of the platform 117 is merely an example and is not limited to this configuration. For example, the platform may include the application server 109 and the GPU server 111, and data output from each of the equipment groups 100 may be downloaded by the application server 109 or the GPU server 111, as described below.

[0016] (Classification by Security Measures) Equipment area networks, internal networks, and external networks have different security measures in place for each area. An equipment area network is a network to which at least semiconductor manufacturing equipment is connected. An equipment area network is a network composed of manufacturing equipment and the like that make up a production line in a semiconductor manufacturing factory, for example. An equipment area network may include, for example, a network of equipment that automatically transports components and finished products, and equipment that automatically stores and retrieves components. An internal network is a network to which, for example, servers that manage production are connected. In addition to managing production plans, servers that monitor production status and acquire equipment information may also be connected to the internal network. A server that places orders for components and collects information to formulate production plans may also be connected. An internal network may include, for example, a management department at a headquarters. An external network is a network connected to the equipment area network and internal network via the Internet. An external network is a network that is not managed by the semiconductor manufacturing factory or the headquarters, and may be connected to, for example, an equipment vendor for remote maintenance.

[0017] Next, security measures will be described. Security measures such as preventing intrusion into the communication network, preventing unauthorized intrusion into the area, account management, monitoring of communication logs and operation logs, and monitoring alerts for PCs and terminals are set for each of the three areas. For example, in the equipment area network, security measures including the network composed of equipment within a semiconductor manufacturing factory include preventing unauthorized intrusion into the premises and restricting the use of terminal devices such as PCs. Here, for example, among security measures, attention will be focused on software updates (particularly OS updates). In this case, OS updates are expected to eliminate vulnerabilities and prevent unauthorized access from outside. While OS updates are performed in the internal network and external network, there may be cases in which devices and equipment in the equipment area network have not undergone OS updates.

[0018] (Configuration of Each Region) In the first embodiment, an etching apparatus will be described as an example of a processing apparatus. An etching apparatus can also be called a semiconductor manufacturing apparatus that processes semiconductor wafers (hereinafter simply referred to as "wafers") as samples. Note that the present disclosure is not limited to etching apparatuses, but can also be applied to other processing apparatuses. Furthermore, although the following description will be given of a semiconductor wafer, the present disclosure can also be applied to samples other than semiconductor wafers.

[0019] (Equipment Area Network) The semiconductor manufacturing equipment PC 101 is a device that manages the control of, for example, a wet etching equipment and a plasma etching equipment (hereinafter simply referred to as "etching equipment"). The semiconductor inspection equipment PC 102 is a device that controls, for example, a visual inspection equipment such as a camera or a microscope, and an electrical inspection equipment that uses a probe. The semiconductor analysis equipment PC 103 is a device that controls an analysis equipment such as a transmission electron microscope or an atomic force microscope. For example, the semiconductor analysis equipment PC 104 is a device that controls an analysis equipment that performs, for example, a TCT gas chromatograph / mass spectrometry and a time-of-flight secondary ion mass spectrometry. The semiconductor analysis equipment PC 104 can also control a particle measuring device such as a laser measuring device that measures particles on etched wafers. Note that although the control devices are categorized by inspection, analysis, and analytical functions, the classification is not limited thereto. A single control device may perform multiple functions, or the functions may be appropriately configured based on the manufacturing process performed in the semiconductor device manufacturing system 1 to which the platform 117 is applied.

[0020] When a process recipe for etching is input to the semiconductor manufacturing equipment PC 101, the semiconductor manufacturing equipment PC 101 executes the process recipe. The semiconductor manufacturing equipment PC 101 transmits instruction values ​​according to the contents of the process recipe to each device in the etching equipment, and the etching is performed in the etching equipment. The executed process recipe is saved in the semiconductor manufacturing equipment PC 101.

[0021] The etched wafer is transported to one of a semiconductor inspection device, a semiconductor analysis device, and a semiconductor analysis device. When semiconductor inspection device PC 102 receives the measurement recipe for inspection, it controls the semiconductor inspection device in accordance with the measurement recipe. The measurement results are saved in semiconductor inspection device PC 102. Similarly, semiconductor analysis device PC 103 receives the measurement recipe for analysis and controls the semiconductor analysis device in accordance with the measurement recipe. The measurement results are saved in semiconductor analysis device PC 103. Semiconductor analysis device PC 104 receives the measurement recipe for analysis and controls the semiconductor analysis device in accordance with the measurement recipe. The measurement results are saved in semiconductor analysis device PC 104.

[0022] The equipment group 100 and the equipment PCs 101-104 can acquire data relating to, for example, the state inside the etching equipment during etching (e.g., pressure, temperature, number of particles, gas type, plasma density, etc.). Also, data relating to microscopic images of the etched wafer and the results of length measurements performed on the microscopic images can be acquired. Data relating to the number of particles on the wafer measured by a particle measuring instrument after etching can also be acquired.

[0023] (Data Communication Between Areas) To explain the first embodiment, reference will be made again to FIG. 1 . An equipment area network includes an equipment group 100 including semiconductor manufacturing equipment such as the etching equipment. A relay PC 105 is network-connected to each of the equipment groups 100. The relay PC 105 has a means for bidirectional data communication between the relay PC 105 and the control devices of each device in the equipment group 100, and includes a program for security checking data and a memory unit for storing data that has passed the security check. Specifically, the relay PC 105 is equipped with a communication means so that the relay PC 105 can collect data obtained from the equipment group 100 or the equipment PCs 101-104. The relay PC 105 has a memory unit that stores data indicating results received from the equipment group 100 and master data, etc., described below, and whose access rights are limited to the relay PC 105. For example, a folder in which the results of each of the equipment groups are stored is created as a shared folder 105a using SMB (Server Message Block) communication, a communication protocol, and access rights are granted to the relay PC 105. This allows the relay PC 105 to collect output data output from each device in the device group 100. The relay PC 105 can also transfer (transmit) data to the device group 100. For example, the relay PC 105 receives a recipe from the gateway PC 108 and inputs it to each device in the device group 100. Note that although the shared folder 105a is used as an example in the above description, the form of the storage unit is not limited to this. A storage unit within the relay PC 105 may be used as the storage unit, or an external storage unit such as a hard disk that is separate from the relay PC 105 and can be connected to the relay PC 105 may be used.

[0024] The relay PC 105 is configured to allow OS updates via an external network. The relay PC 105 also has a built-in program for performing security checks on data, such as virus software, and is capable of executing the program, ensuring that the latest virus definitions are always reflected. The shared folder 105a is set as the target for constant security monitoring within the virus software, and data stored in the shared folder is constantly security checked. Only this shared folder can be accessed from both the internal network and the external network, and is also used as a storage location for data such as recipes to be transferred to the device group 100.

[0025] The shared folder 105a manages a device master MA that includes at least a device ID assigned to each device in the device group 100. The device master MA is also stored in a database server 106 located on an external network.

[0026] Although an example of one shared folder has been shown, there may be multiple shared folders. For example, a shared folder in which data that the device PCs 101-104 want to extract and utilize on an external network is stored is created between the relay PC 105 and each of the device PCs 101-104 using, for example, the SMB protocol. Also, although the device master MA is stored in the database server 106, it may be stored in another server included in the external network.

[0027] (Internal Network) An internal network is formed outside the relay PC 105. A gateway PC 108 is disposed within the internal network. The gateway PC 108 has a built-in program and executes it to access the device master MA based on authentication information for the external network or authentication information for the platform 117, and to obtain output data permitted by the device master MA from a storage unit. Specifically, the gateway PC 108 can access the shared folder 105a via the relay PC 105, and can collect output data from the device group 100 by referring to the device master MA.

[0028] The route setting PC 118 has a built-in program that allows the gateway PC 108 to access the storage unit and transfer the acquired output data to the internal network, or the output data stored in the storage unit to the device group 100, and blocks spontaneous data outflow from each device in the device group 100. This allows the gateway PC 108 to access the storage unit of the relay PC 105, but prohibits the transfer of data from the device area network side to the internal network.

[0029] Furthermore, user personal computer 114 and user portable terminal computer 115 are operated by a user who uses platform 117. Semiconductor device manufacturing system 1 is connected to platform 117, user personal computer 114, and user portable terminal computer 115 via communication means.

[0030] (External Network) The database server 106 stores authentication information for the equipment master MA and users. The database server 106 also stores output data output from each device in the equipment group (e.g., data indicating results obtained by the equipment group 100, manufacturing data output from each device in the equipment group 100, and microscope images obtained by microscope devices included in the equipment group 100). The database server 106 may be configured with multiple database servers, and includes, for example, at least a first database storing recipe information used by semiconductor manufacturing equipment for processing samples and a second database storing electron microscope images of semiconductor wafers.

[0031] The application server 109 receives user requests transferred from the web server 110, executes application programs, and responds to the web server 110. When data retrieval and updating are required, the application server 109 makes a request to the database server 106, processes the data, and then responds with dynamic content to the web server 110. The application server 109 is a server that can communicate directly or indirectly with the first database and the second database. Direct or indirect communication refers to communication in which wired or wireless communication modes and communication protocols can be selected as appropriate. The application server 109 also has an editing function for creating reports based on the display of the digital dashboard.

[0032] The web server 110 responds to user requests with static web content (HTML pages, files, images, videos, etc.), and if dynamic processing is required, it requests the application server 109 to perform the processing and receives the dynamic content response from the application server 109. The database server 106 performs processing in accordance with the request from the application server 109 and transfers the results to the application server 109. If one of the user requests has a heavy load, the GPU server 111 generates content on behalf of the application server 109.

[0033] (Configuration for Acquiring Data Used in the Digital Dashboard) In the present disclosure, the web server 110 shares the digital dashboard with the user's personal computer 114. The application server 109 stores application programs required for creating the digital dashboard and executes calculation logic in these application programs. The database server 106 acquires data such as manufacturing environment data and device characteristics acquired for each recipe. This will be described in detail below.

[0034] The database server 106 functions as a data warehouse (DWH) and stores data used in the digital dashboard. The application server 109 processes data acquired from the processing device, the first database, and the second database based on templates used in the digital dashboard. Specifically, the application server 109 has an extract, transform, and load (ETL) tool, which extracts, transforms, and writes data used in the digital dashboard to the database server 106. Data stored in the database server 106 includes, for example, recipe information related to the etching process, the status of the etching equipment during the etching process, the number of foreign particles on the wafer during the etching process, and microscopic images and measurement data of the wafer after the etching process. The application server 109 also has a VER application for calculating the etch rate, which can calculate the etch rate based on measurement data acquired over time. This data is organized chronologically in the database server 106, and new data is stored as needed. In addition, because the data has a multidimensional array arranged along axes such as "time," "environmental conditions," and "recipe," it is possible to analyze changes in recipes and trends over a certain period of time within a processing process, as well as to analyze the causes of changes when they occur. The data combination and visualization method can be set in advance, and the user can select a combination of data and display format from templates.

[0035] In addition, it is generally assumed that the digital dashboard service provider is different from the administrator of the device area network and the internal network. In terms of security measures, etc., the digital dashboard service provider may be subject to unnecessary restrictions on handling data in the device area network and the internal network. In the present disclosure, the database server 106, the application server 109, and the web server 110 are provided on an external network. Therefore, even when a digital dashboard service provider is provided, data processing can be performed without being subject to security measures restrictions. This is also advantageous in terms of service operation, such as facility improvement and maintenance.

[0036] Although the embodiment will be described with a database server 106, an application server 109, and a web server 110, the present disclosure is not limited to this. For example, it is also possible to set a combination of an application server and a database server for each application program. Furthermore, the embodiment will be described with a server configuration of a web server 110, an application server 109, and a database server 106, but the present disclosure is not limited to this. For example, a configuration of a front-end server and a back-end server may also be used. Furthermore, the servers are not limited to a hardware configuration, and servers provided by a cloud service may also be used.

[0037] (Configuration of the Terminal) An example of the configuration of the user's personal computer 114 will be described with reference to Fig. 2. Fig. 2 is a block diagram showing the configuration of the user's personal computer 114. The user's personal computer 114 (hereinafter also referred to as the "terminal") is connected to the platform 117 and includes a processor that processes a communication protocol with the platform 117 and a user interface (hereinafter referred to as the "UI") that displays information stored in the first database or the second database, and the UI displays a digital dashboard that displays recipe information or electron microscope images in response to a request input from the UI. A specific description will be given below.

[0038] The user's personal computer 114 comprises a processor 201 , a memory 202 , a storage unit 203 , an input unit 204 , an output unit 205 , and a communication unit 207 , each of which is connected to the processor 201 via a bus 200 .

[0039] The processor 201 controls each component of the user's personal computer 114. The processor 201 is, for example, a central processing unit (CPU), a digital signal processor (DSP), a graphics processing unit (GPU), a field-programmable gate array (FPGA), etc. The processor 201 performs processing to enable the functions of the user's personal computer 114, and for example, processes a communication protocol with the platform 117 in relation to communication.

[0040] The memory 202 stores programs that are executed by the processor 201 to realize various functions. The memory 202 is a read-only memory (ROM), a random access memory (RAM), etc. The storage unit 203 stores data processed by the processor 201, data input from the input unit 204, etc. The storage unit 203 is a hard disk drive (HDD), a solid state drive (SSD), etc.

[0041] The input unit 204 receives user requests and data to be processed from the user's personal computer 114. The input unit 204 is a mouse, a keyboard, or the like. The output unit 205 outputs the results of processing by the processor 201 to the user. The output unit 205 is, for example, a liquid crystal display or an organic electroluminescence (EL) display. Note that the input unit 204 and the output unit 205 share the same function of acting as an intermediary between the user's personal computer 114 and the user, and therefore the input unit 204 and the output unit 205 are collectively referred to as an interface (UI). As will be described later, a digital dashboard that displays recipe information or electron microscope images in response to a request input from the UI (particularly the input unit 204) is displayed on the UI (particularly the output unit 205).

[0042] The communication unit 207 transmits and receives data to and from other devices via a network. The communication unit 207 is, for example, a network interface card (NIC), a wireless communication module, a universal serial interface (USB) module, or a serial communication module. The above description shows an example of the configuration of the user's personal computer 114, and the present invention is not limited to this example.

[0043] Note that the user portable terminal PC 115 has a touch panel display that integrates the input unit 204 and output unit 205 of the user personal computer 114 described above. The user portable terminal PC 115 and the user personal computer 114 have similar configurations in other respects. The remote monitor PC 116 also has a similar configuration to the user personal computer 114. While the following description will be given of the case where the user personal computer 114 is used, the present disclosure can also be applied to the case where the user portable terminal PC 115 and the remote monitor PC 116 are used. However, the operation method and display format of the digital dashboard do not necessarily need to be the same for the user personal computer 114, the user portable terminal PC 115, and the remote monitor PC 116. The operation method and display format may change depending on the configuration of the PCs and the user authentication.

[0044] In the following description, a case will be described in which a digital dashboard generated mainly in the application server 109 of the platform 117 is displayed on the output unit 205 of the user's personal computer 114, but the present disclosure is not limited to this case. For example, in the user's personal computer 114, the memory 202 may store an application program that is executed by the processor 201 to create a digital dashboard.

[0045] (Operation Method) When a user uses the semiconductor device manufacturing system 1, the user registers authentication information to log in to the platform 117 from the user's personal computer 114. The user's authentication information is stored in the database server 106. When the user's authentication information, such as a user ID and password, is entered from the user's personal computer 114, the entered information is compared with the authentication information stored in the database server 106, and the user is authenticated. When logging in to the platform 117, the user's authentication information is also applied to the database server 106, the application server 109, the web server 110, and the GPU server 111.

[0046] (Control Flowchart) The process of creating a report will be described with reference to Figure 3. The report is a compilation of information such as indices monitored during the manufacturing stage and device status, and is created mainly when the specifications of devices manufactured using the tool group 100 are satisfied. In the present disclosure, it is possible to check the status of the tool group 100 during the manufacturing stage and the status of semiconductor wafers using a digital dashboard, and it is possible to manufacture devices so that they meet specifications while performing various controls such as run-to-run control.

[0047] 3 is a flowchart showing the procedure for creating a report in semiconductor device manufacturing system 1. Fig. 3(a) shows processing that is performed mainly based on a user request input from user personal computer 114, and Fig. 3(b) and Fig. 3(c) show processing that is mainly performed in application server 109 included in platform 117.

[0048] First, referring to FIG. 3A, a process performed based on a user request input primarily from the user's personal computer 114 will be described. First, in step S1, specifications are set. The specifications indicate the structure and characteristics of a device to be realized by processing performed in the equipment group 100. For example, when processing is performed using an etching equipment among the equipment group 100, the specifications are the device shape, such as the physical width, etching rate, and width depth, of the device formed on the wafer. The specifications can also be the pattern shape after etching, or the etching target and dimensions after etching. The specifications are not limited to numerical values ​​that physically define the structure, but also include processing conditions in the manufacturing equipment and the electrical characteristics of the device. In the case of an etching equipment, the specifications are input to the semiconductor device manufacturing system 1 via the input unit 204 of the user's personal computer 114. The equipment group 100 processes semiconductor wafers based on the specifications and a recipe set based on the specifications.

[0049] Subsequently, in step S2, a first evaluation is performed. The first evaluation is an initial evaluation performed on a wafer after processing in the tool group 100. The first evaluation is an evaluation performed before a digital dashboard and a report, which will be described later, are created.

[0050] Next, in step S3, a report format (display format) is selected. The selection of the report format involves selecting the display format of the information to be included in the report. For example, if an abnormality in particles (foreign matter) is confirmed at the time of the first evaluation in step S2, a display format suitable for particle analysis (for example, a line graph of the number of foreign matter in the manufacturing process) is selected. Report formats will be described later.

[0051] Subsequently, in step S4, a second evaluation is performed. A digital dashboard is created according to the type of report selected in step S3, and at the time of the second evaluation, data analysis is performed using the digital dashboard and specifications. The user can perform data analysis while checking the digital dashboard displayed on the output unit 205 of the user's personal computer 114.

[0052] Next, in step S5, the type of data is selected. For example, in addition to the particles focused on in the first evaluation, the etching rate may also need to be analyzed in the second evaluation. In such a case, the etching rate is selected in addition to the particles as data to be displayed on the digital dashboard. In the second evaluation stage, in addition to the data obtained in the first evaluation stage, information on the environmental conditions in which processing is performed, such as the pressure and temperature in the chamber in the case of an etching system, and analytical information on the device after processing, such as microscopic images, are also collected. The type of data can be selected from among the data related to this information.

[0053] Subsequently, in step S6, it is determined whether or not the report is complete. A report is created when results that satisfy the specifications are obtained in semiconductor device manufacturing system 1, so when it is confirmed that the specifications are satisfied in the digital dashboard or the acquired data, a report is created (Y (Yes) in step S6).

[0054] On the other hand, if it is not confirmed that the specifications are satisfied (N (No) in step S6), it is determined in step S7 whether or not to add a page to the report. Information regarding the additional processing is entered on the added page. If a page is to be added (Y in step S7), the process returns to step S3, and a report regarding the additional processing performed by the device group 100 is created. The processing is performed again by the device group 100 so that the specifications are satisfied.

[0055] Furthermore, if no page is added (N in step S7), comparison data is added (step S8). If adding comparison data is selected, the process returns to step S5 and data obtained in the course of another process is referenced for the data obtained in the current process. After that, a provisional report can be created (Y in step S6), or the procedure can be repeated until the specifications are satisfied.

[0056] The application server 109 has the function of saving the created reports and reading and searching the saved reports. The application server 109 also has the function of assigning a document number (TS-No.) to the report and saving it, and searching the saved report using the TS-No. as an ID. The reports created by the application server 109 are saved in the database server 106, for example, with the TS-No. When a report is searched for from the user's personal computer 114, the report is searched for based on the TS-No. and displayed on the output unit 205 of the user's personal computer 114.

[0057] (Selection of Report Type) The selection of the report type in step S3 will be described with reference to FIG. 3(b). First, in step S31, the user's authentication information is confirmed. To confirm the user's authentication information, in step S31, the user is prompted to input the authentication information via the input unit 204 of the user's personal computer 114. The application server 109 verifies the authentication information stored in the database server 106. Alternatively, the application server 109 may verify the authentication information using the user ID and password entered when the user logged in to the platform 117.

[0058] Next, in step S32, a selection list is displayed. The web server 110 displays the selection list on the output unit 205 of the user's personal computer 114. The selection list includes display formats (templates) of reports to be displayed on the digital dashboard. Report display formats include, for example, a microscope report showing information related to microscope images, a particle (PA) report including information on the number of particles in the etching equipment and particles on the wafer, and the like.

[0059] Next, in step S33, the report format is determined. When the user's selection is accepted by the input unit 204 of the user's personal computer 114, the web server 110 receives the user's selection.

[0060] Next, in step S34, a database query is made. The WEB server 110 queries the database server 106 for a report according to the determined report type.

[0061] Subsequently, in step S35, the report is displayed. The WEB server 110 displays the selected type of report on the output unit 205 of the user's personal computer 114.

[0062] The process of step S31 is performed to store the user and the result of the report type selection made by the user in association with each other. If a report identical to the completed report is to be created, the report type can be efficiently selected by referring to the information on the user and the report type selection.

[0063] (Data Type Selection) The data type selection in step S5 will be described with reference to Fig. 3(c). First, in step S51, the user's authentication information is confirmed. The process of confirming the user's authentication information is the same as step S31. If the authentication information has an expiration date, and the expiration date in step S31 is still valid at the time of step S51, the process of step S51 can be omitted.

[0064] Next, in step S52, a selection list is displayed. The web server 110 displays the selection list on the output unit 205 of the user's personal computer 114. The selection list lists the types of data to be used in the report. The data types include, for example, data acquired during processing of each wafer or batch, the state of the processing chamber (e.g., degree of vacuum, temperature, or plasma generation state in the case of a plasma device), and in the case of microscope image data, the coordinates at which the image was captured.

[0065] Subsequently, in step S53, the data type is determined. When the user's selection is accepted by the input unit 204 of the user's personal computer 114, the WEB server 110 receives the user's selection.

[0066] Next, in step S54, a database query is made. The web server 110 queries the database server 106 about the selected data type.

[0067] Subsequently, in step S35, the data is displayed. The WEB server 110 displays the digital dashboard including the selected data type on the output unit 205 of the user's personal computer 114.

[0068] In the case of data type selection, the user and the result of the data type selection made by the user are associated and stored, which allows for efficient data type selection in subsequent report creation.

[0069] (Recipe Information) Recipe information input to the equipment PCs 101 to 104 will be described with reference to Fig. 4. Fig. 4 is a diagram showing an example of recipe information input to the etching equipment. The recipe includes the following items: "Step No.", "Processing Time", "Pressure", "Gas Type / Flow Rate", "Microwave Output", "Bias Output", "Temperature", and "Step Name".

[0070] The "Step No." item indicates the steps included in the plasma processing. When plasma processing is performed in an etching apparatus, the plasma environment generated within the etching apparatus is achieved according to the set conditions established for each step No. "Processing Time" indicates the period during which the set conditions are maintained. "Pressure" indicates the pressure within the etching apparatus where the wafer is placed. "Gas Type / Flow Rate" indicates the type of gas supplied to the etching apparatus and its flow rate. The example in Figure 4 shows a case in which three types of gas are used. "Microwave Output" indicates the output value of the microwave applied within the etching apparatus. "Bias Output" indicates the voltage applied to the wafer. "Temperature" indicates the set temperature at the location where the wafer is placed. "Step Name" is a search key for the step No. As shown in Figure 4, predetermined set values ​​are input for each item.

[0071] The recipe information is displayed on the digital dashboard in response to a user request input from the UI of the user's personal computer 114. For example, as will be described later, when the contents of the digital dashboard are generated by specifying a Run number, recipe information executed by the Run number is displayed on the digital dashboard. Also, when the contents of the digital dashboard are generated by specifying the internal state of the etching apparatus, the operating conditions of the apparatus related to the internal state of the apparatus are extracted from the recipe information and displayed on the digital dashboard.

[0072] (Specifications) Next, specifications will be described with reference to FIG. 5. FIG. 5 is a diagram showing a cross-section of a device. FIG. 5(a) schematically shows a device 120 etched from the z-axis direction. A resist layer 122 having a predetermined pattern shape is formed on a wafer 121, and portions of the wafer 121 where the resist layer 122 is not formed are etched to form a trench shape. When specifying the trench shape, the width A of the groove portion 121a of the wafer 121, the width B of the protrusion portion 121b of the wafer 121, the height C of the protrusion portion 121b, and the thickness D of the resist layer can be used as characteristics of the trench shape. As shown in FIG. 5(b), the specifications associate predetermined set values ​​with each of the width A to thickness D.

[0073] (Example of Report Format) Next, an example of a report format (display format of information included in the report) will be described with reference to Figures 6 and 7. Figures 6 and 7 show the display format of information included in the final report, and are part of the information displayed on the digital dashboard in the output unit 205 of the user's personal computer 114 while wafer processing is being performed. Figures 6 and 7 show display formats selected from a selection list (corresponding to the selection list in step S32 in Figure 2(b)) displayed on the output unit 205 of the user's personal computer 114. The digital dashboard includes a microscope report including a microscope image or a particle report including foreign substance information. A specific description will be given below.

[0074] 6 is a diagram showing a microscope image display including a microscope image. The microscope image display (microscope report) 300 includes microscope images (SEM / ER data) 302 and 308. The microscope image 302 corresponds to data selected from a data selection unit 304. The length measurement table 306 is a measurement value of a portion defined in, for example, specifications (corresponding to step S1 in FIG. 2A) for the device from which the microscope image 302 was acquired. While the length measurement table 306 includes items 1 and 2, the number of items may be any number other than two.

[0075] The microscope image 308 is a microscope image selected as a comparison target when, for example, comparison data is added (corresponding to step S8 in FIG. 2A). The microscope image 308 corresponds to the data selected by the data selection unit 310, and is associated with a length measurement table 312 in the same way as the microscope image 302.

[0076] A comparison graph (trend graph) 314 shows the values ​​at the time of the microscope image 302 and the values ​​at the time of the microscope image 308 for the length measurement items 1 and 2.

[0077] The microscope image display 300 is set in advance as a template, and a microscope image, a length measurement table, and a comparison graph are displayed in accordance with the data selected from the data selection section 304 and the data selection section 310 .

[0078] Although the above description has been given of a case in which two microscopic images are included, the present disclosure is not limited to this case. For example, it is also possible to set a template that includes three microscopic images.

[0079] 7 is a diagram showing a particle information display including information about particle particles. The particle information display (particle (PA) report) 400 includes a particle count scatter plot (PA data) 402 showing the change in particle count over time and a particle distribution map (PA map) 406 showing the measurement results of particle counts on the wafer. The particle count scatter plot 402 corresponds to data selected from a data selection section 404. The particle count scatter plot 402 has the elapsed time of the etching process on the horizontal axis and the particle count on the vertical axis. The particle information display 400 is updated each time a particle count measurement is performed, and the measurement results are displayed in real time.

[0080] The particle distribution map 406 shows the distribution of particles on the wafer over the elapsed time of the etching process, for example, selected from the data selection unit 408. By setting coordinates of the particle distribution map 406 via the data selection units 410, 414, and 418, the particle shape and particle components at the set coordinates are displayed in display fields 412, 416, and 420, respectively.

[0081] (Example of Data Type) Next, an example of data type will be described with reference to Figures 8 and 9. Figures 8 and 9 are diagrams showing an example of a selection list displayed on the output unit 205 of the user's personal computer 114. The selection list corresponds to the selection list in step S52 in Figure 2(c).

[0082] FIG. 8A shows a selection list 500 displayed when the data selection section 304 of the microscope image 302 is selected in the microscope image display 300. The selection list 500 includes run numbers (Run No.) 001 to 005. The run number is an index corresponding to the processed wafer, and is a number that is incremented each time a wafer is processed (or each run if the etching process is performed in batch processing). The selection list 500 is displayed on the output section 205 of the user's personal computer 114, and the run number is selected via the input section 204 of the user's personal computer 114. The application server 109 has the function of accessing data using a run number specified from the UI of the user's personal computer 114. The application server 109 extracts a microscope image based on the run number from the database server 106. The microscope image 302 displays a microscope image of a wafer etched using the run number selected by the user.

[0083] 8B shows a selection list 502 that is displayed when the data selection section 404 of the particle count scatter diagram 402 is selected in the particle information display 400. The selection list 502 includes Condition 001 to Condition 005, which are conditions within the etching apparatus. The selection list 502 is displayed on the output section 205 of the user's personal computer 114, and a condition is selected via the input section 204 of the user's personal computer 114. The particle count scatter diagram 402 displays the elapsed time of the etching process during a period in which a predetermined condition is established as time on the horizontal axis, and the number of particles within the etching process during that period as the vertical axis.

[0084] 9A shows a selection list 504 that is displayed when the data selection section 408 of the particle distribution chart 406 is selected in the particle information display 400. The selection list 502 includes discharge times t1 to t5, which indicate the elapsed time during discharge in a certain etching process. The selection list 504 is displayed on the output section 205 of the user's personal computer 114, and the discharge time is selected via the input section 204 of the user's personal computer 114. The particle distribution chart 406 displays the distribution of particles on the wafer measured at the discharge time selected by the user.

[0085] 9(b) shows a selection list 506 that is displayed when the data selection section 410 is selected in the foreign substance information display 400. The selection list 506 includes coordinates 001 to 005 in the foreign substance distribution map 406. The selection list 506 is displayed on the output section 205 of the user's personal computer 114, and coordinates are selected via the input section 204 of the user's personal computer 114. The display field 412 displays the foreign substance shape and foreign substance components at the coordinates selected by the user.

[0086] (Actions and Effects) According to the present invention, it is possible to utilize a digital dashboard in semiconductor device manufacturing equipment and semiconductor device manufacturing systems. In particular, recipe information and microscope images are information specific to semiconductor device manufacturing systems, and this information can be viewed as a list along with information that changes in real time. Furthermore, because reports can be created by operating the digital dashboard using templates, the burden on users in creating reports is reduced, and the efficiency of evaluating semiconductor device manufacturing systems can be improved.

[0087] [Second Embodiment] The second embodiment differs from the first embodiment in that data utilized in the digital dashboard is stored in a cache. Fig. 10 is a diagram showing the configuration of a semiconductor device manufacturing system 1a using a group of devices including semiconductor manufacturing devices and a network 117a (hereinafter referred to as "platform 117a"). In the following description, components that are the same as or equivalent to those in the first embodiment described above are designated by the same reference numerals, and their description will be simplified or omitted.

[0088] The platform 117a includes a cache server 130. The cache server 130 stores data used in the digital dashboard. The cache server 130 may also be configured with multiple cache servers, and may include, for example, a first database storing recipe information used by a processing device for processing samples and a second database storing electron microscope images of the samples. The application server 109 communicates directly or indirectly with the first database and the second database, and processes data obtained from the processing device and the first and second databases based on templates used in the digital dashboard.

[0089] Like the database server 106, data is also accumulated in the cache server 130, but the cache server 130 deletes older data from the accumulated data. For example, data can be deleted by setting a storage period for each type of data and deleting data whose storage time exceeds the storage period. In addition to this, the data deletion method can be set appropriately according to the user's request.

[0090] Although the case where the cache server 130 is used has been described, the present disclosure is not limited to this case. Other configurations may be adopted as long as they are capable of storing data used in the digital dashboard in a cache.

[0091] (Actions and Effects) Generally, data related to wafer processing increases over time, requiring sufficient storage capacity. In contrast, in the second embodiment, the cache server 130 deletes past data, making it possible to secure the data necessary for creating a digital dashboard while minimizing storage capacity. Furthermore, when requesting data, reading data from the cache server 130 is faster and reduces the load compared to reading data from a database. Therefore, when creating a digital dashboard and report, it is possible to improve the overall performance of the semiconductor device manufacturing system 1a.

[0092] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the gist of the present invention.

[0093] The following are some examples of aspects that may be included in the present invention, but the present invention is not limited to these. (Aspect 1) A terminal connected to a network includes at least a first database storing recipe information used in a semiconductor device for processing a sample, a second database storing electron microscope images of the sample, and a server capable of directly or indirectly communicating with the first database and the second database, the terminal including: a processor for processing a communication protocol with the network; and a user interface (hereinafter referred to as "UI") for displaying information stored in the first database or the second database, wherein a digital dashboard displaying the recipe information or the electron microscope image is displayed on the UI in response to a request input from the UI. (Aspect 2) The terminal according to Aspect 1, wherein the digital dashboard includes a microscope report including a microscope image or a particle report including foreign substance information. (Aspect 3) The terminal according to Aspect 1 or Aspect 2, wherein the server has an editing function for creating a report based on the display of the digital dashboard. (Aspect 4) The terminal according to any one of Aspects 1 to 3, wherein the server has a VER application for calculating an etch rate. (Aspect 5) The terminal according to any one of Aspects 1 to 4, wherein the server has a function of accessing data using a Run number specified from the UI of the terminal. (Aspect 6) The terminal according to any one of Aspects 1 to 5, wherein the server has a function of saving the report and reading and searching the saved report. (Aspect 7) The terminal according to any one of Aspects 1 to 6, wherein the server has a function of assigning a document number to the report and saving it, and searching the saved report using the document number as an ID. (Aspect 8) The terminal according to any one of Aspects 1 to 7, wherein the server processes data acquired from the semiconductor manufacturing equipment, the first database, and the second database based on a template used in the digital dashboard.(Aspect 9) The terminal according to claim 1, wherein the terminal has a memory, and the memory stores an application program that creates the digital dashboard when executed by the processor. (Aspect 10) A semiconductor device manufacturing system comprising: a network including at least a semiconductor manufacturing apparatus that processes samples, a first database that stores recipe information used by the semiconductor manufacturing apparatus, a second database that stores electron microscope images of the samples, and a server that can communicate directly or indirectly with the first database and the second database; and a terminal that is directly or indirectly connected to the network and to the server, wherein a digital dashboard that displays the recipe information or the electron microscope images is displayed on a user interface provided in the terminal in response to a request from the terminal. (Aspect 11) A display method for displaying a digital dashboard on a user interface (hereinafter also referred to as "UI") in a semiconductor device manufacturing system comprising: a network including at least a semiconductor manufacturing apparatus for processing samples, a first database storing recipe information used in the semiconductor manufacturing apparatus, a second database storing electron microscope images of the semiconductor wafers, and a server capable of communicating directly or indirectly with the first database and the second database; and a terminal having a user interface (hereinafter also referred to as "UI") and connected directly or indirectly to the server on the network, the display method comprising: processing data obtained from the semiconductor manufacturing and the first and second databases based on a template used in the digital dashboard; and displaying the digital dashboard displaying the recipe information or electron microscope images on the UI in response to a request via the UI of the terminal.

[0094] DESCRIPTION OF SYMBOLS 1, 1a...Semiconductor device manufacturing system, 101...PC for semiconductor manufacturing equipment, 102...PC for semiconductor inspection equipment, 103...PC for semiconductor analysis equipment, 104...PC for semiconductor analysis equipment, 105...Relay PC, 106...Database server, 108...Gateway PC, 109...Application server, 110...WEB server, 111...GPU server, 113...Internet, 114...User's personal computer, 115...User's portable terminal personal computer, 116...Remote monitor personal computer, 117, 117a...Platform (network), 118...Route setting PC, 120...Device, 121...Wafer, 122...Resist layer, 130...Cache server, 300...Microscope image display, 400...Foreign substance information display

Claims

1. A terminal connected to a network comprising at least a first database storing recipe information used in a semiconductor manufacturing apparatus for processing a sample, a second database storing an electron microscope image of the sample, and a server capable of communicating directly or indirectly with the first database and the second database, the terminal comprising: a processor for processing a communication protocol with the network; and a user interface (hereinafter referred to as "UI") for displaying information stored in the first database or the second database, wherein a digital dashboard for displaying the recipe information or the electron microscope image in response to a request input from the UI is displayed on the UI.

2. The terminal according to claim 1, wherein the digital dashboard includes a microscope report including a microscope image or a particle report including foreign matter information.

3. The terminal according to claim 1, wherein the server has an editing function for creating a report based on the display of the digital dashboard.

4. The terminal according to claim 1, wherein the server has a VER application for calculating an etch rate.

5. The terminal according to claim 1, wherein the server has a function of accessing data by a Run number specified from the UI of the terminal.

6. The terminal according to claim 3, wherein the server has functions of saving the report, reading out and searching the saved report.

7. The terminal according to claim 6, wherein the server has a function of attaching a document number to the report for saving and searching the saved report using the document number as an ID.

8. The terminal according to claim 1, wherein the server processes data obtained from the semiconductor manufacturing apparatus, the first database, and the second database based on a template used for the digital dashboard.

9. The terminal according to claim 1, wherein the terminal has a memory, and an application program for creating the digital dashboard by execution of the processor is stored in the memory.

10. A semiconductor manufacturing system comprising at least: a semiconductor manufacturing apparatus for processing a sample; a first database storing recipe information used in the semiconductor manufacturing apparatus; a second database storing an electron microscope image of the sample; a network comprising a server capable of communicating directly or indirectly with the first database and the second database; and a terminal directly or indirectly connected to the server in the network. A digital dashboard is displayed on a user interface provided in the terminal to display the recipe information or the electron microscope image in response to a request from the terminal.

11. A semiconductor manufacturing system comprising at least: a semiconductor manufacturing apparatus for processing a sample; a first database storing recipe information used in the semiconductor manufacturing apparatus; a second database storing an electron microscope image of the sample; a network comprising a server capable of communicating directly or indirectly with the first database and the second database; and a terminal having a user interface (hereinafter also referred to as "UI"). A display method for displaying a digital dashboard on the UI in a semiconductor device manufacturing system comprising: the terminal directly or indirectly connected to the server in the network, the method comprising: processing data obtained from the semiconductor manufacturing apparatus, the first database, and the second database based on a template used in the digital dashboard; and displaying the digital dashboard for displaying the recipe information or the electron microscope image on the UI in response to a request via the UI of the terminal.

Images