Heat transfer device

The heat transfer device with a composite material structure addresses the safety and cooling efficiency issues in rechargeable battery systems by enabling early damage detection and enhanced cooling, thereby improving the operational reliability of these systems.

WO2025123070A1PCT designated stage expired Publication Date: 2025-06-19MIBA EMOBILITY GMBH
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Patent Information

Application Number
PCT/AT2024/060493
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-12-15
Filing Date
2024-12-13
Publication Date
2025-06-19

AI Technical Summary

Technical Problem

Existing rechargeable battery systems lack effective monitoring and rapid cooling mechanisms, which can lead to safety issues and inefficient temperature control.

Method used

A heat transfer device with a composite material structure, featuring multiple conductive and plastic layers, allows for improved electrical conductivity, thermal conductivity, and monitoring capabilities, enabling early detection of damage and enhanced cooling efficiency.

Benefits of technology

The solution provides improved safety through early damage detection and enhanced cooling efficiency, ensuring better temperature control and operational reliability of rechargeable battery systems.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to a heat transfer device (4) comprising an element body which has at least one fluid channel (9), said fluid channel (9) being at least partly formed by a first heat transfer element (6). The first heat transfer element (6) is made of a first composite material which has, one over the other in the specified order, a first plastic layer (13), a first conductive layer (14), and a second plastic layer (15), wherein the first conductive layer (14) has an electric conductivity of at least 1 S / m at 25 °C, measured in accordance with DIN EN 50994:2017-11, and / or a thermal conductivity of at least 0.1 W / mK at 25 °C, measured in accordance with ASTM E1530, and the first composite material has a second conductive layer (16) on the second plastic layer (15) and connected to the second plastic layer, said second conductive layer having an electric conductivity of at least 1 S / m at 25 °C, measured in accordance with DIN EN 50994:2017-11, and / or a thermal conductivity of at least 0.1 W / mK at 25 °C, measured in accordance with ASTM E1530.
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Description

[0001] HEAT TRANSFER DEVICE

[0002] The invention relates to a heat transfer device comprising an element body which has at least one fluid channel, wherein the fluid channel is at least partially formed by a first heat transfer element, wherein the first heat transfer element is formed from a first composite material which has a first plastic layer, a first conductive layer and a second plastic layer one above the other in the specified order, wherein the first conductive layer has an electrical conductivity at 25 °C according to DIN EN 50994:2017-11 of at least 1 S / m and / or a thermal conductivity at 25 °C according to ASTM E1530 of at least 0.1 W / mK.

[0003] Furthermore, the invention relates to an accumulator with at least one storage element for storing electrical energy and at least one heat transfer device for cooling or tempering the storage element.

[0004] The use of multilayer foils in accumulator coolers is already known from the prior art. For example, WO 03 / 071616 A2 describes an electrochemical storage unit with multiple electrochemical cells and a cooling bellows formed from a deformable, thermally conductive material, having an inlet port and an outlet port, and through which a heat transfer medium flows. The material used in the manufacture of the cooling bellows can be a multilayer material. A three-layer construction is described in which a metal layer is arranged between a first polymer layer and a second polymer layer. For example, a thin metal foil, such as aluminum foil, can be used to minimize water vapor permeability over the lifetime of the cooling bellows.A heat-sealable film, such as a polyethylene film, is applied to a first side of the metal foil. A protective film, such as a nylon or polypropylene film, is applied to a second side of the metal foil.

[0005] AT 520 018 A1 discloses an accumulator with at least one cell for storing electrical energy and at least one cooling device for cooling or temperature-regulating the cell. The cooling device comprises at least one multilayer film for forming a coolant channel. The film consists of a laminate comprising a first plastic film, a reinforcement layer connected thereto, a metal foil connected to the reinforcement layer, or a metallized further plastic film connected to the reinforcement layer.

[0006] The present invention is based on the object of improving the safety of a rechargeable battery.

[0007] The object of the invention is achieved with the heat transfer device mentioned at the outset, in which the first composite material has a second conductive layer on the second plastic layer and connected thereto, which has an electrical conductivity at 25 °C according to DIN EN 50994:2017-11 of at least 1 S / m and / or a thermal conductivity at 25 °C according to ASTM E1530 of at least 0.1 W / mK.

[0008] Furthermore, the object is achieved with the accumulator mentioned at the outset, in which the heat transfer device is designed according to the invention.

[0009] The advantage here is that the second conductive layer, on the one hand, provides an improved monitoring system for the accumulator. The electrical contact between the two conductive layers makes it possible to detect damage to the heat transfer element even before the heat transfer device has developed a leak. For example, a foreign body penetrating the heat transfer element from the outside can be detected in this way. On the other hand, the second conductive layer also makes it possible, in addition to or as an alternative, to enable faster cooling or temperature control of the cell, since the second conductive layer enables a better distribution of thermal energy across the surface of the heat transfer element.

[0010] According to one embodiment of the invention, the composite material can have a third plastic layer on top of the second conductive layer. This protects the second conductive layer, allowing it to be made thinner. This not only makes it possible to change the electrical resistance of the layer, but also to modify the rigidity or flexural flexibility of the heat transfer element, allowing the heat transfer device to better adapt to the contours of a battery. It is also advantageous if, according to one embodiment, the third plastic layer is liquid-tight (waterproof) and / or has a water vapor permeability according to DIN 53122-1 / DIN 53122-A of a maximum of 200 g / m 2d. Due to this third plastic layer, fractures occurring inside the heat transfer element or heat transfer device can also be detected before a leak occurs, since fluid passing through inner layers from the fluid channel of the heat transfer device can be prevented from escaping by the third plastic layer.

[0011] According to another embodiment of the invention, the first and second conductive layers can be made of a metallic material, in particular of the same metallic material. This allows, on the one hand, an improvement in the aforementioned effects regarding electrical conductivity and thermal conductivity while simultaneously allowing a thinner design of the heat transfer element. On the other hand, the detector structure can be simplified by using the same metallic materials.

[0012] According to another embodiment of the invention, the second conductive layer can have a second layer thickness that is equal to or greater than the first layer thickness of the first conductive layer. In particular, with larger layer thicknesses, the thermal resistance of the heat transfer element can be increased, thus achieving a more uniform temperature distribution in the accumulator. This is particularly advantageous in cold outside temperatures when the storage elements need to be heated to achieve a better operating temperature.

[0013] Further embodiments of the invention can provide that the first conductive layer is arranged directly on the first plastic layer, the second plastic layer directly on the first conductive layer and the second conductive layer directly on the second plastic layer and that, if appropriate, the third plastic layer is arranged directly on the second conductive layer. This not only makes a simpler layer structure achievable, but it can also improve heat transport through the heat transfer element or improve the measurement of electrical quantities. To increase the performance of the heat transfer device, one embodiment of the invention can provide that the element body has a second heat transfer element which is of the same design as the first heat transfer element.This makes it easier to design the heat transfer device so that it can be attached to several storage elements.

[0014] According to a further embodiment of the invention, in order to protect the heat transfer device, it can also be provided that the element body has a protective element made of a material which has an elastic modulus according to ISO 527 of at least 100 MPa.

[0015] For a better understanding of the invention, it is explained in more detail using the following figures.

[0016] They show in a simplified, schematic representation:

[0017] Fig. 1 shows a motor vehicle with an electric motor and an accumulator;

[0018] Fig. 2 shows an accumulator in oblique view with a heat transfer element;

[0019] Fig. 3 shows the accumulator according to Fig. 1 in an oblique view without heat transfer element;

[0020] Fig. 4 shows a section of the heat transfer element;

[0021] Fig. 5 shows a section of the heat transfer element;

[0022] Fig. 6 shows a section of a further embodiment of a heat transfer element;

[0023] Fig. 7 A section of a variant of a heat transfer element.

[0024] By way of introduction, it should be noted that in the variously described embodiments, identical parts are provided with identical reference symbols or identical component designations, whereby the disclosures contained in the entire description can be transferred mutatis mutandis to identical parts with identical reference symbols or identical component designations. Furthermore, the positional information chosen in the description, such as top, bottom, side, etc., refers to the directly described and illustrated figure, and if the position changes, these positional information must be transferred mutatis mutandis to the new position. References to standards always refer to the latest version of these standards valid on the filing date of the first application establishing priority, unless explicitly stated otherwise.

[0025] Fig. 1 shows a motor vehicle 1, for example a passenger car. The motor vehicle 1 has an electric motor 2 and a battery 3. Preferably, the electric motor 2 is the sole drive of the motor vehicle 1.

[0026] It should be noted that the invention can also be used in other motor vehicles, such as a truck, or in a boat or in other areas of application.

[0027] In Figs. 2 and 3, the accumulator 3, ie a rechargeable battery (secondary battery), is shown in an oblique view, wherein Fig. 2 shows the accumulator 3 with a heat transfer device 4 and Fig. 3 shows the accumulator 3 without this heat transfer device 4.

[0028] The accumulator 3 comprises a plurality of storage elements 5 or cells for storing electrical energy (hereinafter referred to simply as storage element 5). The storage elements 5 can be cuboid-shaped, cubic, cylindrical, etc.

[0029] Since the basic structure of such accumulators 3 (in particular for e-mobility) is known from the relevant state of the art, reference is made to it to avoid repetition.

[0030] As can be seen from a comparison of Figs. 2 and 3, the heat transfer device 4 is arranged on one side of the accumulator 3. However, it can also be provided that the heat transfer device 4 extends over at least two surfaces of the accumulator 1, for example, at the top and sides, and optionally at the bottom. Alternatively or additionally, the heat transfer device 4 can also be arranged between the storage elements 5, or only below the storage elements 5, or only in the region of the side walls of the storage elements 5.

[0031] The heat transfer device 4 can extend over all storage elements 5 (as can be seen in Fig. 1), so that all storage elements 5 can be cooled or tempered with just one heat transfer device 4. However, it is also possible to provide several heat transfer devices 4 in the accumulator 3 for the storage elements 5, for example, two, three, or four.

[0032] Preferably, the storage element(s) 5 are located directly (immediately) on the heat transfer device(s) 4.

[0033] It should be noted that the terms top, etc., refer to the installation position of the accumulator 3.

[0034] It should also be noted that the storage elements 5 can be designed in a modular manner, so that they can also be referred to as storage modules.

[0035] It should also be noted that in this description, the accumulator 3 is described as having multiple storage elements 5. However, the accumulator 3 may also have only one storage element 5. The statements in the description can therefore also be applied accordingly to this embodiment.

[0036] In all embodiments, the heat transfer device 4 comprises or consists of a first heat transfer element 6 and preferably also a second heat transfer element 7, as can be seen from Figs. 4 and 5. The first and second heat transfer elements 6, 7 can also be combined into a single element by bending (folding) the first heat transfer element 6 at one edge.

[0037] The first heat transfer element 6 and the second heat transfer element 7 are preferably of identical design, so that in the following, reference is only made to the first heat transfer element 6. The explanations in this regard can be transferred to the further heat transfer element 7. However, it is possible for the second heat transfer element 7 to have a different structure, for example, more or fewer layers than the first heat transfer element 6. The materials for this layer structure of the second heat transfer element 7 can be selected for these embodiments from the materials described for the first heat transfer element 6.

[0038] Furthermore, according to one embodiment variant, the first heat transfer element 6 is combined with a protective element 8 which has a higher flexural rigidity than the first heat transfer element 6, as will be described in more detail in relation to Fig. 7.

[0039] The first heat transfer element 6 is formed as a first multi-layered foil material.

[0040] The multilayer foil material of the first heat transfer element 6 of the heat transfer device 4 rests against the storage elements 5, particularly directly. Since the multilayer foil material is flexible, i.e., not rigid, it can adapt to unevenness in the storage elements 5 or between the storage elements 5. A leveling compound between the heat transfer device 4 and the storage elements 5 is not required.

[0041] The heat transfer device 4 further comprises at least one fluid channel 9, which extends from at least one connection element 10 for the supply of a working fluid to at least one connection element 11 for the discharge of the working fluid. The at least one fluid channel 9 is formed between the first and second heat transfer elements 6, 7 or between two layers of the first heat transfer element 6 or between the first heat transfer element 6 and the protective element 8 by only partially connecting the first heat transfer element 6 to the second heat transfer element 7 or the protective element 8 or the two layers of the first heat transfer element 6. For example, the at least one fluid channel 9 can be produced by gluing or welding the film materials or elements to form connecting regions 12, such as webs (see Fig. 5).The at least one fluid channel 9 is created in the unconnected areas adjacent to the connecting areas 12. The at least one fluid channel 9 is therefore not formed by a separate component. In general, the connection techniques are preferably selected such that no additional measures are required to achieve a liquid-tight connection.

[0042] The fluid channel 9 can be arranged in a meandering shape in the heat transfer device 4, as can be seen from Fig. 4. The concrete representation of the course of the at least one fluid channel 9 in Fig. 4 is to be understood only as an example. The optimized course of the at least one fluid channel 9 depends, among other things, on the amount of heat to be dissipated, the geometry of the accumulator 3, etc. It can also be provided that more than one fluid channel 9 is formed or arranged in the heat transfer device 4. In this case, it is advantageous if the plurality of fluid channels 9 have common connection elements 10, 11, which each open into a collecting channel from which the fluid channels 9 branch off or into which they open. However, it is also possible for each fluid channel 9 to have its own connection elements 10, 11.

[0043] The working fluid flowing through the heat transfer device 4 is in particular a liquid, for example a water-glycol mixture, but can also be a gas.

[0044] The first heat transfer element 6 is a composite material. In a first embodiment, it comprises, in the specified order from inside to outside, a first plastic layer 13, a first conductive layer 14, a second plastic layer 15, and a second conductive layer 16.

[0045] The first conductive layer 14 has an electrical conductivity at 25 °C according to DIN EN 50994:2017-11 of at least 1 S / m, in particular between 1 x 10 2 S / m (1 x 10 exponent 2 S / m) and 1 x 10 8S / m (1 x 10 exponent 8 S / m), and / or a thermal conductivity at 25 °C according to ASTM E1530 of at least 0.1 W / mK, in particular between 20 W / mK and 450 W / mK. Although metallic first conductive layers 14 with correspondingly higher values ​​for electrical conductivity or thermal conductivity are preferred, materials with low values ​​of down to at least 1 S / m or 0.1 W / mK can also be used for thin first conductive layers 14 (see information on layer thickness below).

[0046] However, it should be noted that the layer thickness specifications are not limited to materials with low electrical conductivity or low thermal conductivity.

[0047] The second conductive layer 16 has an electrical conductivity at 25 °C according to DIN EN 50994:2017-11 of at least 1 S / m, in particular between 1 x 10 2 S / m (1 x 10 exponent 2 S / m) and 1 x 10 8S / m (1 x 10 exponent 8 S / m), and / or a thermal conductivity at 25 °C according to ASTM E1530 of at least 0.1 W / mK, in particular between 20 W / mK and 450 W / mK. The same applies to the second conductive layer 16: although metallic second conductive layers 14 with correspondingly higher values ​​for electrical conductivity or thermal conductivity are preferred, materials with low values ​​of down to at least 1 S / m or 0.1 W / mK can also be used for thin first conductive layers 14 (see information on layer thickness below).

[0048] The first plastic layer 13 is arranged directly adjacent to the at least one fluid channel 9 and delimits it, so that the working fluid flowing through the fluid channel 9 during operation of the heat transfer device 4 is in direct contact with the first plastic layer 13. In this embodiment, the second conductive layer 16 forms the outermost layer, the layer of the composite material furthest from the fluid channel 9.

[0049] According to one embodiment variant, it can be provided that the first conductive layer 14 is arranged directly on the first plastic layer 13, the second plastic layer 15 is arranged directly on the first conductive layer 14 and the second conductive layer 16 is arranged directly on the second plastic layer 15.

[0050] The first conductive layer 14 can be formed by a foil or by vapor deposition of the first plastic layer 13, e.g., a PVD layer. The second conductive layer 16 can be formed by a foil or by vapor deposition of the second plastic layer 15, e.g., a PVD layer.

[0051] The first plastic layer 13 and / or the second plastic layer 15 preferably consists / consists of at least 80% to 100% by weight of a thermoplastic plastic or an elastomer, i.e. of a polymer. The thermoplastic plastic can be selected from a group comprising or consisting of polyethylene (PE), polyoxymethylene (POM), polyamide (PA), in particular PA 6, PA 66, PA 11, PA 12, PA 610, PA 612, polyphenylene sulfide (PPS), polyethylene terephthalate (PET), cross-linked polyolefins, preferably polypropylene (PP), polytetrafluoroethylene (PTFE). The elastomer can be selected from a group comprising or consisting of thermoplastic elastomers such as thermoplastic vulcanizates, olefin-, amine-, ester-based thermoplastic polyurethanes, in particular ether / ester-based thermoplastic elastomers, styrene block copolymers, silicone elastomers.

[0052] It should be noted at this point that a polymer, within the meaning of the invention, is understood to be a synthetic or natural polymer made from corresponding monomers. Preferably, the first plastic layer 13 consists of a so-called sealing film. This has the advantage that, for example, the first heat transfer element 5 can be directly bonded to the second heat transfer element 6 or the protective element 8.

[0053] The second plastic layer 15 can be made of PA or PET, in particular. It is also possible for the second plastic layer 15 to consist of several sublayers, for example, a combination of PA and PET, in which case the PET sublayer is preferably arranged farther away from the fluid channel 9 than the PA sublayer.

[0054] However, it is also possible to use other plastics, such as thermosetting plastics or thermosetting materials, which are then bonded together with an adhesive, for example. Two-component adhesive systems based on polyurethane or silicone, or even hot-melt adhesive systems, are particularly suitable for this.

[0055] In general, an adhesive layer can be arranged between two layers of the first heat transfer element 6, in particular over the entire surface. For example, the first plastic layer 13 can be connected to the first conductive layer 14 and / or the first conductive layer 14 to the second plastic layer 15 and / or the second plastic layer 15 to the second conductive layer 16 via an adhesive layer (not shown).

[0056] The first conductive layer 14 and / or the second conductive layer 16 is / are preferably (a) metal layer(s). In particular, the first conductive layer 14 and / or the second conductive layer 15 is / are an aluminum layer or consists of the same metallic material. However, other metals can also be used, such as copper or silver or metallic alloys. The first conductive layer 14 and / or the second conductive layer 16 can also be formed from a different material, such as a conductive polymer, e.g., polymers containing graphite or carbon black or metal particles or metal fibers, such as PE, PP, PA, PET, or polypyrrole or polyethene.

[0057] The first conductive layer 14 and / or the second conductive layer 16 can, for example, have a layer thickness between 5 μm and 100 μm. According to one embodiment, it can be provided that the second conductive layer 16 has a second layer thickness that is equal to or greater than a first layer thickness of the first conductive layer 14. Conversely, however, the first conductive layer 14 can also have a greater layer thickness than the second conductive layer 16. However, embodiments with a layer thickness of less than 5 μm are also possible, for example by vapor-depositing a metal, in particular aluminum, onto one of the plastic layers 13, 14 or depositing it using a PVD process. In this case, the first conductive layer 14 and / or the second conductive layer 16 can also have a layer thickness of only a few atomic layers (for example, between 2 and 10 atomic layers).

[0058] The second conductive layer 16 can also consist of a conductive print on the plastic layer 15. For example, the second conductive layer 16 can be made of a carbon paste, a lacquer, or a printable material mixed with conductive particles, such as a metal, graphite, or carbon black.

[0059] The first plastic layer 13 and / or the second plastic layer 15 can have a layer thickness between 10 pm and 200 pm.

[0060] In addition to bonding the individual layers of the first film material with adhesives, coextrusion and extrusion coating can also be used as joining options. Of course, a combination is also possible, with several polymers coextruded and adhesively laminated to an extrusion-coated metal layer. In general, all known processes for producing composite films or film laminates can be used.

[0061] The second plastic layer 16 can consist of or comprise the same polymer as the first plastic layer 13. However, the second plastic layer 16 can also consist of or comprise a different polymer. For example, the first plastic layer 13 can consist of PP, and the further plastic layer 15 can consist of PA, PET, or PTFE, or comprise these polymers.

[0062] It should be noted again that the first and second heat transfer elements 6, 7 can be of identical design. Thus, Fig. 5 also shows the four-layer structure of the first heat transfer element 6 for the second heat transfer element 7, wherein the first plastic layer 13 is arranged to delimit the fluid channel 9, in particular directly delimiting it, and the second conductive layer 16 forms the outer layer. The first conductive layer 14 and the second conductive layer 16 can be arranged in the first heat transfer element 6 so as to be electrically insulated from the fluid channel 9. This can be achieved most easily with the first plastic layer 13.However, other / additional layers can also be provided for this purpose in the first heat transfer element 6, so that the first conductive layer 14 and the second conductive layer 16 are not in contact with the fluid channel 9 during normal operation of the heat transfer device 4.

[0063] All layers of the first and / or second heat transfer element 6, 7 preferably have the same surface area, i.e., they are preferably the same size. Furthermore, all layers preferably extend continuously over at least 80%, in particular 90%, particularly preferably 100%, of the total area of ​​the layer with the largest surface area. In other words, the two conductive layers 14, 16, in particular, are not layers composed of individual conductor tracks.

[0064] In addition, all layers are preferably continuously bonded to the immediately adjacent layer over at least 80%, in particular 90%, particularly preferably 100%, of their respective surfaces facing another layer. Particularly preferably, the layers are bonded to one another over their entire surface.

[0065] The first heat transfer element 6 can, for example, have a layer structure comprising a first plastic layer 13 (e.g., made of PP) / first adhesive layer / first conductive layer 14 (e.g., made of Al) / second adhesive layer / second plastic layer 15 (e.g., made of PTFE) / third adhesive layer / second conductive layer 16 (e.g., made of Al). However, the first heat transfer element 6 can also have a layer structure comprising a first plastic layer 13 (e.g., made of PP) / first conductive layer 14 (e.g., made of Al) / second plastic layer 15 (e.g., made of PET) / second conductive layer 16 (e.g., made of Al). Mixed variants of these

[0066] The first conductive layer 14 and / or the second conductive layer 16 can be used for a variety of purposes. For example, they can be used to improve the liquid-tightness of the heat transfer device 4 or to increase vapor permeability. On the other hand, they can also be used for measurement methods, for example to detect a corner in the heat transfer device 4, for which purpose the electrical resistance between the conductive layers 14, 16 is monitored. The electrical conductivity can also be used for other purposes, for example to heat the working fluid. On the other hand, the thermal conductivity of the conductive layers 14, 16 can be used for heat distribution or heat transport. It is also possible to use the electrical conductivity in one of the two conductive layers 14, 16 and the thermal conductivity in the other of the two conductive layers 14, 16.

[0067] Regardless of the number of plastic layers 13, 15 in the layered structure of the first heat transfer element 6, all plastic layers 13, 15 are preferably formed from a polymer selected from the polymers mentioned above. Several or all plastic layers 13, 15 can be formed from the same polymer, or several or all plastic layers 13, 15 can be formed from different polymers.

[0068] This also applies to another embodiment of the heat transfer element 6, shown in detail in Fig. 6. Reference is also made to the above explanations.

[0069] In the embodiment shown in Fig. 6, the composite material of the first heat transfer element 6 has a third plastic layer 17, which is arranged on the second conductive layer 16. According to one embodiment, the first heat transfer element 6 can have the layer structure of first plastic layer 13 (e.g. made of PP) / first adhesive layer / first conductive layer 14 (e.g. made of Al) / second adhesive layer / second plastic layer 15 (e.g. made of PTFE) / third adhesive layer / second conductive layer 16 (e.g. made of Al), fourth adhesive layer / third plastic layer 17 (e.g. made of PA or PET). However, the first heat transfer element 6 can also have a layer structure of first plastic layer 13 (e.g. made of PP) / first conductive layer 14 (e.g. made of Al) / second plastic layer 15 (e.g. made of PET and / or PA) / second conductive layer 16 (e.g. made of Al) / third plastic layer 17 (e.g.made of PET), so that the layers are arranged directly on top of one another. Mixed variants of these design variants are also possible here. Likewise, the third plastic layer 17, as well as the second plastic layer 15, can consist of several sublayers, as explained above for the second plastic layer 15.

[0070] In this embodiment, it is also possible for the second conductive layer 16 to be printed or vapor-deposited onto the third plastic layer 17. Reference is made to the above explanations regarding the printing or vapor-depositing of the second conductive layer 16 onto the second plastic layer 15. The third plastic layer 17 can consist of a polymer (= 100 wt.%) or comprise at least 80 wt.% of the polymer mentioned above for the first and second plastic layers 13, 15.

[0071] The third plastic layer 17 can have a layer thickness between 10 μm and 200 μm.

[0072] All plastic layers 13, 15, 17 can have the same or different thicknesses. For example, the first plastic layer 13 can have a thickness between 40 μm and 150 μm. The second and third plastic layers 15, 17 can each have a thickness between 10 μm and 50 μm. The first plastic layer 13 can have the greatest thickness compared to the second and third plastic layers 15, 17.

[0073] According to a variant, the third plastic layer 17 can be a liquid-tight (waterproof) layer and / or have a water vapor permeability according to DIN 53122-1 / DIN 53122-A of maximum 200 g / m 2 d, especially between 100 g / m 2 d and 180 g / m 2 d, have.

[0074] As already explained above, according to a variant embodiment, which is partially shown in Fig. 7, it can be provided that the element body of the heat transfer device 4 comprises the protective element 8 made of a material having an elastic modulus according to ISO 527 of at least 100 MPa, in particular between 3000 MPa and 15000 MPa. The material can be, for example, a fiber-reinforced plastic, such as a glass fiber or generally (mineral) fiber-reinforced polymer, such as PP, PA6.

[0075] The connection of the first heat transfer element 6 to the protective element 8 can be made, for example, directly with the first plastic layer 13 or via an adhesive (for example one of those mentioned above).

[0076] The protective element 8 can have a layer thickness between 1 mm and 10 mm.

[0077] In the embodiment shown in Fig. 7, the protective element 8 forms part of the at least one fluid channel 9. However, the protective element 8 can also be arranged to cover the first or second heat transfer element 6, 7. In the event that one or more of the conductive layer(s) 14, 16 is or are applied directly to one of the plastic layers 12, 15, 17, this can also be done, for example, using a printing process (e.g., screen printing, roller printing, inkjet printing, gravure printing, intaglio printing, planographic printing, stamp printing), by spraying, vapor deposition, plasma coating, sputtering, powder coating, etc.

[0078] The embodiments show or describe possible embodiments, whereby it should be noted at this point that combinations of the individual embodiments are also possible.

[0079] For the sake of clarity, it should finally be pointed out that for a better understanding of the structure of the heat transfer device 4, it is not necessarily shown to scale.

[0080] Reference symbol list

[0081] Motor vehicle

[0082] electric motor

[0083] accumulator

[0084] Heat transfer device

[0085] Storage elements

[0086] Heat transfer element

[0087] Heat transfer element

[0088] protective element

[0089] Fluid channel

[0090] connecting element

[0091] connecting element

[0092] Connection area

[0093] Plastic layer

[0094] layer

[0095] Plastic layer

[0096] layer

[0097] Plastic layer

Claims

P a t e n t a n s p r ü c h e 1. A heat transfer device (4) comprising an element body having at least one fluid channel (9), wherein the fluid channel (9) is at least partially formed by a first heat transfer element (6), wherein the first heat transfer element (6) is formed from a first composite material comprising, one above the other in the specified order, a first plastic layer (13), a first conductive layer (14), and a second plastic layer (15), wherein the first conductive layer (14) has an electrical conductivity at 25°C according to DIN EN 50994:2017-11 of at least 1 S / m and / or a thermal conductivity at 25°C according to ASTM E1530 of at least 0.1 W / mK, characterized in that the first composite material has a second conductive layer (16) on the second plastic layer (15) and connected thereto,which has an electrical conductivity at 25 °C according to DIN EN 50994:2017-11 of at least 1 S / m and / or a thermal conductivity at 25 °C according to ASTM E1530 of at least 0.1 W / mK.

2. Heat transfer device (4) according to claim 1, characterized in that the composite material has a third plastic layer (17) on the second conductive layer (16).

3. Heat transfer device (4) according to claim 2, characterized in that the third plastic layer (17) is liquid-tight and / or has a water vapor permeability according to DIN 53122-1 / DIN 53122-A of maximum 200 g / m 2 d.

4. Heat transfer device (4) according to one of claims 1 to 3, characterized in that the first and the second conductive layer (14, 16) consist of a metallic material, in particular of the same metallic material.

5. Heat transfer device (4) according to one of claims 1 to 4, characterized in that the second conductive layer (16) has a second layer thickness which is equal to or greater than a first layer thickness of the first conductive layer (14).

6. Heat transfer device (4) according to one of claims 1 to 5, characterized in that the first conductive layer (14) is directly on the first Plastic layer (13), the second plastic layer (15) is arranged directly on the first conductive layer (14) and the second conductive layer (16) is arranged directly on the second plastic layer (15).

7. Heat transfer device (4) according to one of claims 2 to 5, characterized in that the first conductive layer (14) is arranged directly on the first plastic layer (13), the second plastic layer (15) is arranged directly on the first conductive layer (14), the second conductive layer (16) is arranged directly on the second plastic layer (15) and the third plastic layer (17) is arranged directly on the second conductive layer (16).

8. Heat transfer device (4) according to one of claims 1 to 7, characterized in that the element body has a second heat transfer element (7) which is designed in the same way as the first heat transfer element (6).

9. Heat transfer device (4) according to one of claims 1 to 8, characterized in that the element body has a protective element (8) made of a material which has an E-modulus according to ISO 527 of at least 100 MPa.

10. Accumulator (3) with at least one storage element (5) for storing electrical energy and at least one heat transfer device (4) for cooling or tempering the storage element (5), characterized in that the heat transfer device (4) is designed according to one of claims 1 to 9.

Citation Information

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