Throttling refrigeration infrared detector, intelligent mold, and injection compression molding method

Abstract

A throttling refrigeration infrared detector, an intelligent mold and an injection compression molding method. The throttling refrigeration infrared detector comprises a plurality of ultra-micro refrigerators and a detector chip; the ultra-micro refrigerators each comprise a bottom plate, and a high-pressure plate, a chip layer, a low-pressure plate and a cover plate which are sequentially arranged on the bottom plate; the chip layer is provided with an expansion cavity; the high-pressure plate is provided with a refrigeration air inlet and a high-pressure flow channel, and the high-pressure flow channel is communicated with the expansion cavity by means of a throttling element; the low-pressure plate is provided with a refrigeration air outlet and a low-pressure flow channel; the ultra-micro refrigerators are arranged in an array, so that the expansion cavities are communicated to form a chip cooling cavity; and the detector chip is arranged in the chip cooling cavity. The intelligent mold comprises the throttling refrigeration infrared detector, an upper mold and a lower mold. The injection compression molding method comprises mold closing, injection, pressure holding, cooling, mold opening and demolding. The thermal uniformity of a chip can be ensured, the performance of the chip is improved, the miniaturization of an infrared assembly is realized, the temperature measurement is more accurate, and the quality of a molded product is ensured.

Description

Throttling refrigeration infrared detector, intelligent mold and injection molding method Technical Field

[0001] The present invention relates to the field of infrared detection technology, in particular to a throttling refrigeration infrared detector, an intelligent mold and an injection molding method. Background Art

[0002] Infrared detectors are the core components of infrared technology and the forerunners of its development. They are widely used in civil and military fields such as missile guidance, space exploration, early warning satellites and reconnaissance.

[0003] Mechanical throttling coolers are widely used in infrared detection due to their small size, light weight, compact structure, and lack of moving parts at the low-temperature end. However, due to their large thermal mass, traditional mechanical throttling coolers consume most of their cooling capacity to cool the device itself. This results in high cooling capacity and gas consumption, a key factor limiting the ultra-miniaturization of throttling-cooled infrared detectors.

[0004] Summary of the Invention

[0005] The purpose of the present invention is to provide a throttling refrigeration infrared detector, an intelligent mold and an injection molding method to solve the problems existing in the above-mentioned prior art, ensure the temperature uniformity of the chip, improve the chip performance, realize the miniaturization of the infrared component, make temperature detection more accurate, and ensure the quality of the molded product.

[0006] To achieve the above object, the present invention provides the following solutions:

[0007] The present invention provides a throttling refrigeration infrared detector, comprising a plurality of ultra-micro refrigerators and a detector chip;

[0008] The ultra-micro refrigerator includes a base plate and a high-pressure plate, a chip layer, a low-pressure plate and a cover plate sequentially arranged on the base plate; the chip layer has an expansion cavity, the high-pressure plate has a cooling air inlet and a high-pressure flow channel connected to the cooling air inlet, and the high-pressure flow channel is connected to the expansion cavity through a throttling element; the low-pressure plate has a cooling air outlet and a low-pressure flow channel connected to the cooling air outlet, the low-pressure flow channel is connected to the expansion cavity, and the cooling air inlet and the cooling air outlet are connected to each other;

[0009] The ultra-micro refrigerators are arranged in an array so that the expansion chambers are interconnected to form a chip cooling chamber, and the detector chip is arranged in the chip cooling chamber.

[0010] Preferably, the cover plate and the bottom plate are both ceramic substrates; and the high-voltage plate and the low-voltage plate are both made of high borosilicate glass.

[0011] Preferably, the ultra-micro refrigerator is a square structure, and there are four ultra-micro refrigerators arranged in a T-shaped array; the expansion chamber is arranged at a corner of the chip layer close to the center of the T-shaped structure.

[0012] Preferably, it further comprises a packaging component, wherein the packaging component packages the ultra-micro cooler and the detector chip.

[0013] The present invention also provides an intelligent mold, including the throttling cooling infrared detector described above, and also including an upper mold, a lower mold and a mold controller, wherein a plurality of the throttling cooling infrared detectors are embedded in the lower mold, and a plurality of pressure detectors are embedded in the upper mold and / or the lower mold, and each of the throttling cooling infrared detectors and each of the pressure detectors are connected to the mold controller signal.

[0014] Preferably, a plurality of cooling water holes are provided in the upper mold and the lower mold.

[0015] Preferably, the space between the throttling cooling infrared detector and the lower mold is connected to the cooling water hole in the lower mold.

[0016] Preferably, the throttling cooling infrared detector is embedded in the lower mold and is located outside the cooling water hole in the lower mold.

[0017] The present invention also provides an injection molding method, which uses the above-mentioned smart mold and includes the following steps:

[0018] Clamping the upper mold and the lower mold to obtain an injection cavity;

[0019] Injecting molding material into the injection mold cavity, maintaining pressure, cooling, and then opening the upper mold and the lower mold to demould the injection molded product;

[0020] During the entire process from mold closing to demolding, the temperature of the upper mold and the lower mold, the melt temperature, the melt flow front temperature, the flow front temperature at the weld line, the coolant temperature of each runner, the coolant flow front temperature, and the product temperature difference are scanned and detected in real time by the throttling cooling infrared detector, and the scanning detection results are fed back to the mold controller; the holding pressure, the pressure distribution during speed / pressure conversion, and the maximum pressure in the injection cavity are detected in real time by the pressure detector, and the detection results are fed back to the mold controller; the maximum clamping force is detected by the pressure sensor between the upper and lower molds, and the detection results are fed back to the mold controller; the mold controller controls the compression molding process in real time according to the detected data, including filling / holding conversion control and filling percentage control during conversion, coolant temperature setting, holding time control, coolant flow rate control, cooling time control, and filling time control, and calculates the water channel cooling efficiency according to the detected temperature data, and outputs the holding curve according to the detected holding pressure data.

[0021] Compared with the prior art, the present invention has achieved the following technical effects:

[0022] The present invention provides a throttling cooling infrared detector, an intelligent mold and an injection molding method. By replacing a traditional mechanical throttling cooler with an ultra-micro cooler, the structural size is reduced, the miniaturization of the infrared component can be achieved, and the cooling needs of optical elements, microelectronic elements and superconducting elements can be met. A plurality of ultra-micro coolers are arranged in an array to form a chip cooling cavity, so that the refrigerant can wrap the detector chip, thereby ensuring the temperature uniformity of the chip and improving the chip performance. During the injection molding process using the intelligent mold, the temperature of the mold, injection fluid, coolant, etc. can be accurately and in real time detected by the throttling cooling infrared detector, and the holding pressure, the pressure distribution during speed / pressure conversion, the maximum pressure in the injection molding cavity, etc. can be detected in real time by the pressure detector. Then, the molding process is controlled and adjusted in real time by the mold controller, and relevant parameters are output to facilitate the adjustment of molding parameters according to the detection results and the product molding situation, thereby ultimately ensuring the quality of the molded product. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] FIG1 is a schematic structural diagram of a throttling cooling infrared detector in Example 1;

[0025] FIG2 is a schematic diagram of the array arrangement of the ultra-micro coolers in Example 1;

[0026] FIG3 is a schematic diagram of a top view of the structure of the array of ultra-micro coolers in Example 1;

[0027] FIG4 is a schematic diagram of a top view of the structure after the low-pressure plate and the cover plate are hidden in FIG3 ;

[0028] FIG5 is a schematic structural diagram of the intelligent mold in the second embodiment.

[0029] In the figure: 100-throttling cooling infrared detector, 1-ultra-micro refrigerator, 2-detector chip, 3-base plate, 4-high-pressure plate, 5-chip layer, 6-low-pressure plate, 7-cover plate, 8-expansion cavity, 9-chip cooling cavity, 10-packaging component, 11-upper mold, 12-lower mold, 13-cooling water hole. DETAILED DESCRIPTION

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] The purpose of the present invention is to provide a throttling refrigeration infrared detector, an intelligent mold and an injection molding method to solve the problems existing in the prior art, ensure the temperature uniformity of the chip, improve the chip performance, realize the miniaturization of the infrared component, make temperature detection more accurate, and ensure the quality of the molded product.

[0032] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0033] Example 1

[0034] As shown in FIG1 to FIG4 , this embodiment provides a throttling cooling infrared detector 100 , comprising a plurality of ultra-micro coolers 1 and a detector chip 2 ;

[0035] The ultra-micro refrigerator 1 includes a base plate 3 and a high-pressure plate 4, a chip layer 5, a low-pressure plate 6, and a cover plate 7 sequentially arranged on the base plate 3; the chip layer 5 has an expansion cavity 8, the high-pressure plate 4 has a cooling air inlet and a high-pressure flow channel connected to the cooling air inlet, and the high-pressure flow channel is connected to the expansion cavity 8 through a throttling element; the low-pressure plate 6 has a cooling air outlet and a low-pressure flow channel connected to the cooling air outlet, and the low-pressure flow channel is connected to the expansion cavity 8, and the cooling air inlet and the cooling air outlet are connected to each other;

[0036] The ultra-micro refrigerators 1 are arranged in an array so that the expansion chambers 8 are interconnected to form a chip cooling chamber 9 , and the detector chip 2 is disposed in the chip cooling chamber 9 .

[0037] The working process is as follows: the high-pressure gas working medium enters the high-pressure flow channel from the refrigeration air inlet, and then enters the throttling element to produce a throttling refrigeration effect. The working medium then enters the expansion chamber 8, that is, the chip cooling chamber 9. At this time, the working medium is in a low-pressure and low-temperature state, and then enters the low-pressure flow channel, and pre-cools the normal-temperature and high-pressure working medium in the high-pressure flow channel. This cycle is repeated until the gas working medium produces a gas-liquid two-phase state in the chip cooling chamber 9 and reaches a thermodynamic equilibrium state. By using ultra-micro refrigerators to replace traditional mechanical throttling refrigerators, the structural size is reduced, the miniaturization of infrared components can be achieved, and the cooling needs of optical components, microelectronic components and superconducting components can be met; by arranging multiple ultra-micro refrigerators in the form of an array, a chip cooling chamber 9 is formed, so that the refrigerant can wrap around the detector chip 2, thereby ensuring the temperature uniformity of the chip and improving chip performance.

[0038] In this embodiment, both the cover plate 7 and the bottom plate 3 are ceramic substrates; the high-voltage plate 4 and the low-voltage plate 6 are made of borosilicate glass using a photolithography etching process. The ceramic substrates can isolate the external temperature and further ensure the uniform temperature of the chip.

[0039] In this embodiment, the ultramicro coolers 1 are square in structure, with four of them arranged in a "T-shaped" configuration. Expansion chamber 8 is located in a corner of chip layer 5, near the center of the "T-shaped" configuration. By arranging the ultramicro coolers 1 in an array and connecting their expansion chambers 8 to form a chip cooling chamber 9, the overall cooling capacity can be increased, making it suitable for use with large-array infrared detectors.

[0040] In this embodiment, a packaging component 10 is further included. The packaging component 10 packages the ultra-micro cooler 1 and the detector chip 2 therein to protect the ultra-micro cooler 1 and the detector chip 2 therein.

[0041] Example 2

[0042] As shown in Figure 5, this embodiment provides an intelligent mold, including the throttling cooling infrared detector described in Example 1, and also including an upper mold 11, a lower mold 12 and a mold controller. A plurality of throttling cooling infrared detectors 100 are embedded in the lower mold 12, and a plurality of pressure detectors (not shown in the figure) are embedded in the upper mold 11 and / or the lower mold 12. Each throttling cooling infrared detector 100 and each pressure detector are connected to the mold controller signal.

[0043] In this embodiment, a plurality of cooling water holes 13 are provided in the upper mold 11 and the lower mold 12. Cooling liquid is circulated through the cooling water holes 13 to cool the mold.

[0044] In this embodiment, the throttling and cooling infrared detector is embedded in the lower mold 12 and located outside the cooling water hole 13 in the lower mold 12. In other embodiments, the space between the throttling and cooling infrared detector and the lower mold 12 is connected to the cooling water hole 13 in the lower mold 12. While the coolant cools the mold, it also cools the throttling and cooling infrared detector, preventing excessive temperatures from affecting the throttling and cooling infrared detector's detection results and extending its service life.

[0045] Example 3

[0046] This embodiment provides an injection molding method, using the smart mold described in the second embodiment, including the following steps:

[0047] The upper mold 11 and the lower mold 12 are combined to obtain an injection cavity;

[0048] Inject the molding material into the injection cavity, maintain the pressure, and cool it. Then, open the upper mold 11 and the lower mold 12 to demould the injection molded product.

[0049] Throughout the entire process from mold closing to demolding, a throttling refrigeration infrared detector performs real-time scanning and detection of the upper mold 11 and lower mold 12 temperatures, melt temperature, melt flow front temperature, flow front temperature at the weld line, coolant temperature in each runner, coolant flow front temperature, and product temperature difference, and feeds the scanning and detection results back to the mold controller. A pressure detector performs real-time detection of the holding pressure, pressure distribution during speed / pressure conversion, and maximum pressure in the injection cavity, and feeds the detection results back to the mold controller. A pressure sensor between the upper and lower molds detects the maximum clamping force and feeds the detection results back to the mold controller. The mold controller controls the compression molding process in real time based on the detected data, including filling / holding conversion control and fill percentage control during conversion, coolant temperature setting, holding time control, coolant flow rate control, cooling time control, and filling time control. The water channel cooling efficiency is calculated based on the detected temperature data, and a holding curve is output based on the detected holding pressure data. Molding parameters are adjusted according to the detection results and product molding conditions (warpage values ​​in the X, Y, and Z directions, etc.), ultimately ensuring the quality of the molded product.

[0050] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. At the same time, those skilled in the art will find that the specific implementation methods and application scopes may vary based on the concept of the present invention. In summary, the contents of this specification should not be construed as limiting the present invention.

Claims

1. A throttling refrigeration infrared detector, characterized in that: Comprising a plurality of ultra - miniature coolers and detector chips; The ultra - miniature cooler includes a bottom plate, and a high - pressure plate, a chip layer, a low - pressure plate, and a cover plate sequentially arranged on the bottom plate; the chip layer has an expansion cavity, the high - pressure plate has a refrigeration air inlet and a high - pressure flow channel communicating with the refrigeration air inlet, and the high - pressure flow channel communicates with the expansion cavity through a throttling element; the low - pressure plate has a refrigeration air outlet and a low - pressure flow channel communicating with the refrigeration air outlet, the low - pressure flow channel communicates with the expansion cavity, and the refrigeration air inlet and the refrigeration air outlet communicate with each other; Each of the ultra - miniature coolers is arranged in an array, so that the expansion cavities communicate with each other to form a chip cooling cavity, and the detector chips are arranged in the chip cooling cavity.

2. The throttling refrigeration infrared detector according to claim 1, characterized in that: Both the cover plate and the bottom plate are ceramic substrates; both the high - pressure plate and the low - pressure plate are made of borosilicate glass.

3. The throttling refrigeration infrared detector according to claim 1, characterized in that: The ultra - miniature cooler is of a square structure, and four ultra - miniature coolers are provided. The four ultra - miniature coolers are arranged in a cross - shaped array; the expansion cavity is arranged at a corner position of the chip layer close to the center of the cross - shaped structure.

4. The throttling refrigeration infrared detector according to claim 1, characterized in that: Further comprising a packaging component, which packages the ultra - miniature cooler and the detector chips therein.

5. An intelligent mold, characterized in that: Comprising the throttling refrigeration infrared detector according to any one of claims 1 - 4, further comprising an upper mold, a lower mold, and a mold controller. A plurality of the throttling refrigeration infrared detectors are embedded in the lower mold, and a plurality of pressure detectors are embedded in the upper mold and / or the lower mold. Each of the throttling refrigeration infrared detectors and each of the pressure detectors are signal - connected to the mold controller.

6. The intelligent mold according to claim 5, characterized in that: Both the upper mold and the lower mold are provided with a plurality of cooling water holes.

7. The intelligent mold according to claim 6, characterized in that: The space between the throttling refrigeration infrared detector and the lower mold communicates with the cooling water holes in the lower mold.

8. The intelligent mold according to claim 6, characterized in that: The throttling refrigeration infrared detector is embedded in the lower mold and located outside the cooling water holes in the lower mold.

9. An injection molding and pressing forming method, characterized in that: Using the intelligent mold according to any one of claims 5 - 8, comprising the following steps: Closing the upper mold and the lower mold to obtain an injection molding cavity; Injecting a molding raw material into the injection molding cavity, holding pressure and cooling, and then opening the upper mold and the lower mold to demold the injection - molded product; During the entire process from mold closing to mold opening, the throttling refrigeration infrared detector is used to perform real-time scanning detection on the temperatures of the upper mold and the lower mold, the melt temperature, the melt flow front temperature, the flow front temperature at the weld line, the coolant temperature of each runner, the coolant flow front temperature, and the product temperature difference, and feed the scanning detection results back to the mold controller; the pressure detector is used to perform real-time detection on the holding pressure, the pressure distribution during speed / pressure conversion, and the maximum pressure in the injection mold cavity, and feed the detection results back to the mold controller; the pressure sensor between the upper and lower molds is used to detect the maximum clamping force and feed the detection results back to the mold controller; the mold controller performs real-time control on the compression molding process according to the detected data, including filling / holding pressure conversion control and filling percentage control during conversion, coolant temperature setting, holding pressure time control, coolant flow rate control, cooling time control, filling time control, calculates the waterway cooling efficiency based on the detected temperature data, and outputs a holding pressure curve according to the detected holding pressure data.

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