Semiconductor device with heat dissipation structure and electronic apparatus

Abstract

The present application relates to the technical field of semiconductors, and in particular to a semiconductor device with a heat dissipation structure and an electronic apparatus. The semiconductor device with a heat dissipation structure comprises: a semiconductor; a heat conduction assembly, wherein a first end of the heat conduction assembly is arranged close to a first end surface of the semiconductor and used for transferring heat of the semiconductor to the heat conduction assembly; and a heat dissipation assembly, wherein one end of the heat dissipation assembly is in heat conduction contact with a second end surface of the semiconductor, and a second end of the heat conduction assembly is in heat conduction contact with the heat dissipation assembly. In the present application, the heat of the semiconductor is transferred by means of the heat conduction assembly, heat dissipation is conducted by means of the heat dissipation assembly; thus, on the one hand, heat dissipation efficiency of the semiconductor is improved, and the requirement for heat dissipation during operation of the semiconductor is satisfied; on the other hand, there is no need to use air cooling for heat dissipation; moreover, the heat dissipation structure occupies a small space and is suitable for dissipating heat of the semiconductor in a closed environment or a compact-structured space.

Description

Semiconductor device and electronic device with heat dissipation structure

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 2023233784419, filed on December 12, 2023, entitled “Semiconductor device and electronic device with heat dissipation structure,” which is incorporated herein by reference in its entirety. Technical Field

[0003] The present application relates to the field of semiconductor technology, and in particular to a semiconductor device and electronic equipment with a heat dissipation structure. Background Art

[0004] Currently, with the increasing integration of integrated circuits, higher requirements are being placed on semiconductor device heat dissipation technology. When heat cannot be effectively dissipated, the chip temperature of the semiconductor device increases, thereby reducing the device's power output and RF performance.

[0005] Semiconductor device heat dissipation technology relies solely on one-way heat conduction through the die-bonding material on the device, resulting in poor heat removal performance. Alternatively, heat dissipation relies on air cooling. However, in sealed spaces or compact structures (where airflow is low), it's difficult to lower the temperature of the semiconductor. Operating the chip at high temperatures for extended periods shortens its lifespan and performance stability.

[0006] Summary of the Invention

[0007] The present application provides a semiconductor device and electronic device with a heat dissipation structure to solve the defects in the prior art of heat dissipation through heat conduction of solid crystal materials, which has poor heat dissipation performance, and the use of air cooling, which cannot be used in confined spaces and has poor heat dissipation effect.

[0008] The present application provides a semiconductor device with a heat dissipation structure, comprising:

[0009] semiconductor;

[0010] a heat conducting component, wherein a first end of the heat conducting component is disposed adjacent to a first end surface of the semiconductor and is used to transfer heat from the semiconductor to the heat conducting component;

[0011] A heat dissipation component, one end of the heat dissipation component is in thermal contact with the second end face of the semiconductor, and the second end of the heat conduction component is in thermal contact with the heat dissipation component.

[0012] According to a semiconductor device with a heat dissipation structure provided by the present application, the first end of the heat conduction component is in thermal contact with the first end surface of the semiconductor.

[0013] According to a semiconductor device with a heat dissipation structure provided by the present application, the heat-conducting component is a broken-line structure, and at least one end surface of the heat-conducting component is in contact with the first end surface of the semiconductor, and at least one end surface of the heat-conducting component is in contact with the first end of the heat dissipation component.

[0014] According to a semiconductor device with a heat dissipation structure provided in the present application, the heat dissipation component includes: a column-type heat sink or a fin-type heat sink.

[0015] According to a semiconductor device with a heat dissipation structure provided in the present application, a preset distance is provided between the first end of the heat-conducting component and the first end surface of the semiconductor, and the semiconductor transfers heat to the heat-conducting component by thermal radiation.

[0016] According to a semiconductor device with a heat dissipation structure provided by the present application, the heat dissipation component includes:

[0017] a first heat dissipation unit, wherein one end of the first heat dissipation unit is in thermal contact with the second end surface of the semiconductor;

[0018] A second heat dissipation unit, one end of which is in thermal contact with the second end of the heat conduction component.

[0019] According to a semiconductor device with a heat dissipation structure provided by the present application, the first heat dissipation unit includes: a fin-type heat sink or a column-type heat sink; the second heat dissipation unit includes: a fin-type heat sink or a column-type heat sink.

[0020] According to a semiconductor device with a heat dissipation structure provided by the present application, the heat conduction component includes: a heat conducting sheet.

[0021] A semiconductor device with a heat dissipation structure provided by the present application also includes:

[0022] The semiconductor and the heat-conducting component are both arranged inside the box, and the heat dissipation end of the heat dissipation component is arranged outside the box.

[0023] The present application also provides an electronic device, including: a semiconductor device with a heat dissipation structure provided in an embodiment of the present application.

[0024] The present application provides a semiconductor device with a heat dissipation structure, comprising: a semiconductor, a heat-conducting component, and a heat dissipation component. The first end of the heat-conducting component is disposed adjacent to a first end face of the semiconductor and is used to transfer heat from the semiconductor to the heat-conducting component. One end of the heat dissipation component is in thermal contact with a second end face of the semiconductor, and the second end of the heat-conducting component is in thermal contact with the heat dissipation component. The present application transfers heat from the semiconductor via the heat-conducting component and dissipates heat using the heat dissipation component. This improves the heat dissipation efficiency of the semiconductor, meeting the semiconductor's heat dissipation needs during operation. Furthermore, it eliminates the need for air cooling and occupies a small space, making it suitable for semiconductor heat dissipation in enclosed environments or compact spaces.

[0025] Furthermore, the electronic device provided by the present application has the same advantages as above because it includes the semiconductor device with the heat dissipation structure in the embodiment of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the present application or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0027] FIG1 is a schematic structural diagram of a semiconductor device with a heat dissipation structure provided in one embodiment of the present application;

[0028] FIG2 is a schematic structural diagram of a semiconductor device with a heat dissipation structure provided in one embodiment of the present application.

[0029] Reference numerals: 1: semiconductor; 2: heat-conducting component; 3: heat-dissipating component; 31: first heat-dissipating unit; 32: second heat-dissipating unit; 4: housing. DETAILED DESCRIPTION

[0030] To make the objectives, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0031] In the description of the embodiments of this application, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on the specific circumstances.

[0032] In the embodiments of the present application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0033] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.

[0034] A semiconductor device with a heat dissipation structure of the present application is described below with reference to Figures 1 and 2. The semiconductor device with a heat dissipation structure comprises: a semiconductor 1, a heat conducting component 2, and a heat dissipation component 3.

[0035] Among them, the first end of the thermal conductive component 2 is arranged adjacent to the first end surface of the semiconductor 1, and is used to transfer the heat of the semiconductor 1 to the thermal conductive component 2; one end of the heat dissipation component 3 is in thermal contact with the second end surface of the semiconductor 1, and the second end of the thermal conductive component 2 is in thermal contact with the heat dissipation component 3.

[0036] Specifically, semiconductor 1 is a heat-generating element, and heat is dissipated from semiconductor 1 by a heat-conducting assembly 2 and a heat-dissipating assembly 3 serving as a heat dissipation structure. Heat is dissipated from the second end face of semiconductor 1 by heat conduction through heat-dissipating assembly 3. Heat-conducting assembly 2 is in contact with or positioned adjacent to the first end face of semiconductor 1. When in contact, heat is transferred via conduction. When the heat-conducting assembly 2 and semiconductor 1 are positioned adjacent, heat is transferred via radiation by adjusting the distance between them. Heat from semiconductor 1 is transferred to heat-conducting assembly 2, which then dissipates it through heat-dissipating assembly 3.

[0037] Preferably, the first end face and the second end face of the semiconductor 1 in this embodiment are different end faces to be dissipated. As shown in Figure 1, the first end face and the second end face are the upper surface and the lower surface of the semiconductor 1, respectively. By utilizing the thermal conductive component 2, the heat from the upper surface of the semiconductor 1 is transferred to the heat dissipation component 3 for heat dissipation.

[0038] In this embodiment, the heat of the semiconductor 1 is transferred by the heat conducting component 2 and the heat dissipation component 3 is used for heat dissipation. On the one hand, the heat dissipation efficiency of the semiconductor 1 is improved to meet the heat dissipation needs of the semiconductor 1 when it is working; on the other hand, there is no need to use air cooling, which is suitable for scenarios where the semiconductor 1 needs to be cooled in a closed environment or a compact space.

[0039] The present application provides a semiconductor device with a heat dissipation structure, comprising: a semiconductor 1, a heat-conducting component 2, and a heat dissipation component 3. The first end of the heat-conducting component 2 is disposed adjacent to the first end face of the semiconductor 1 and is used to transfer heat from the semiconductor 1 to the heat-conducting component 2; one end of the heat dissipation component 3 is in thermal contact with the second end face of the semiconductor 1, and the second end of the heat-conducting component 2 is in thermal contact with the heat dissipation component 3. The present application transfers heat from the semiconductor 1 via the heat-conducting component 2 and dissipates heat via the heat dissipation component 3. This improves the heat dissipation efficiency of the semiconductor 1, meeting the heat dissipation needs of the semiconductor 1 during operation; and also eliminates the need for air cooling. The heat dissipation structure occupies a small space and is suitable for dissipating heat from the semiconductor 1 in a closed environment or a compact space.

[0040] In one embodiment of the present application, a first end of the thermally conductive component 2 is in thermal contact with a first end surface of the semiconductor 1. In this embodiment, heat is transferred between the thermally conductive component 2 and the semiconductor 1 by heat conduction. To ensure heat conduction efficiency, one end surface of the thermally conductive component 2 is in contact with the first end surface of the semiconductor 1.

[0041] On the basis of the above embodiment, the heat-conducting component 2 is a zigzag structure, and at least one end face of the heat-conducting component 2 is in contact with the first end face of the semiconductor 1, and at least one end face of the heat-conducting component 2 is in contact with the first end of the heat-dissipating component 3. Specifically, as shown in Figure 1, the heat-conducting component 2 adopts a heat-conducting plate with a zigzag structure, which has two upper and lower end faces and a vertical section. The upper and lower end faces are parallel and connected by the vertical section. The upper end face is in contact with the upper end face of the semiconductor 1 to achieve heat conduction; the lower end face is in contact with the heat-dissipating component 3 to achieve heat conduction. In this embodiment, the heat-conducting component 2 adopts a heat conduction method. On the one hand, it can cooperate with the heat-dissipating component 3 to dissipate heat from at least two end faces of the semiconductor 1, thereby enhancing the heat dissipation effect of the semiconductor 1; on the other hand, the heat-conducting component 2 adopting the zigzag structure can reduce the space occupied by the heat dissipation structure, which is suitable for semiconductor 1 heat dissipation scenarios in closed or narrow spaces.

[0042] In one embodiment of the present application, the heat dissipation component 3 includes: a column-type heat sink or a fin-type heat sink. It should be understood that, depending on actual conditions, the heat dissipation component 3 may also adopt other forms of heat sinks, and the present application is not limited thereto.

[0043] In one embodiment of the present application, a preset distance is set between the first end of the heat-conducting component 2 and the first end face of the semiconductor 1, and the semiconductor 1 transfers heat to the heat-conducting component 2 by thermal radiation. In this embodiment, the heat-conducting component 2 and the semiconductor 1 transfer heat by non-contact thermal radiation. This arrangement can ensure that the two are within the range of a safe insulation distance, thereby achieving heat dissipation of the semiconductor 1. The heat-conducting component 2 using thermal radiation can, on the one hand, cooperate with the heat dissipation component 3 to dissipate heat from at least two end faces of the semiconductor 1, thereby enhancing the heat dissipation effect of the semiconductor 1; on the other hand, the use of a non-contact heat dissipation method will not affect the normal operation of the semiconductor 1; on the other hand, instead of the air-cooled heat dissipation method, it can reduce the space occupied by the heat dissipation structure, which is suitable for semiconductor 1 heat dissipation scenarios in enclosed or narrow spaces.

[0044] Based on the above embodiment, the heat dissipation component 3 includes: a first heat dissipation unit 31 and a second heat dissipation unit 32. One end of the first heat dissipation unit 31 is in thermal contact with the second end surface of the semiconductor 1; one end of the second heat dissipation unit 32 is in thermal contact with the second end of the thermal conductive component 2. In this embodiment, the heat dissipation component 3 can be composed of two parts, namely the first heat dissipation unit 31 and the second heat dissipation unit 32. The first heat dissipation unit 31 is in direct contact with the second end surface of the semiconductor 1 and dissipates heat by heat conduction; the second heat dissipation unit 32 dissipates heat from the first end surface of the semiconductor 1 by heat radiation through the thermal conductive component 2. In this embodiment, two independent heat dissipation units are used to dissipate heat from the two surfaces of the semiconductor 1 respectively to improve its heat dissipation effect.

[0045] Based on the above embodiment, the first heat dissipation unit 31 includes a fin-type heat sink or a column-type heat sink, and the second heat dissipation unit 32 includes a fin-type heat sink or a column-type heat sink. It should be understood that, depending on actual conditions, the first heat dissipation unit 31 and the second heat dissipation unit 32 may also use other forms of heat sinks, and the present application is not limited thereto.

[0046] In one embodiment of the present application, the heat conducting component 2 includes a heat conducting sheet. It should be understood that, depending on the actual situation, the heat conducting component 2 may also adopt other forms of heat conducting parts, and the present application is not limited thereto.

[0047] In one embodiment of the present application, the semiconductor device 1 further includes a housing 4, wherein the semiconductor 1 and the thermally conductive component 2 are both disposed within the housing 4, and the heat dissipation end of the heat dissipation component 3 is disposed outside the housing 4. In this embodiment, the housing 4 serves as the outer shell of the semiconductor device 1, wherein the semiconductor 1 and the thermally conductive component 2 are both disposed within the housing 4, and the heat dissipation end of the heat dissipation component 3 is disposed outside the housing 4. Heat from the semiconductor 1 is dissipated outside the housing 4 through heat transfer between the thermally conductive component 2 and the heat dissipation component 3.

[0048] The present application also provides an electronic device, which includes: a semiconductor device with a heat dissipation structure according to an embodiment of the present application.

[0049] Furthermore, the electronic device provided by the present application has the same advantages as above because it includes the semiconductor device with the heat dissipation structure in the embodiment of the present application.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A semiconductor device with a heat dissipation structure, comprising: semiconductor; A heat-conducting component, wherein a first end of the heat-conducting component is disposed adjacent to a first end surface of the semiconductor and is used to transfer heat from the semiconductor to the heat-conducting component; A heat dissipation component, one end of the heat dissipation component is in thermal contact with the second end surface of the semiconductor, and the second end of the heat conductive component is in thermal contact with the heat dissipation component.

2. The semiconductor device with a heat dissipation structure according to claim 1, wherein: The first end of the heat conducting component is in thermal contact with the first end surface of the semiconductor.

3. The semiconductor device with a heat dissipation structure according to claim 2, wherein: The heat-conducting component is a zigzag structure, and at least one end surface of the heat-conducting component is in contact with the first end surface of the semiconductor, and at least one end surface of the heat-conducting component is in contact with the first end of the heat-dissipating component.

4. The semiconductor device with a heat dissipation structure according to claim 2, wherein: The heat dissipation component includes: a column type heat sink or a fin type heat sink.

5. The semiconductor device with a heat dissipation structure according to claim 1, wherein: The first end of the heat-conducting component and the first end surface of the semiconductor are arranged at a preset distance, and the semiconductor transfers heat to the heat-conducting component in a thermal radiation manner.

6. The semiconductor device with a heat dissipation structure according to claim 5, wherein: The heat dissipation component comprises: a first heat dissipation unit, wherein one end of the first heat dissipation unit is in thermal contact with the second end surface of the semiconductor; A second heat dissipation unit, one end of which is in thermal contact with the second end of the heat conduction component.

7. The semiconductor device with a heat dissipation structure according to claim 6, wherein: The first heat dissipation unit includes: a fin-type heat sink or a column-type heat sink; the second heat dissipation unit includes: a fin-type heat sink or a column-type heat sink.

8. The semiconductor device with a heat dissipation structure according to any one of claims 1 to 7, wherein: The heat conduction component comprises: a heat conduction sheet.

9. The semiconductor device with a heat dissipation structure according to any one of claims 1 to 7, further comprising: The semiconductor and the heat-conducting component are both arranged inside the box, and the heat dissipation end of the heat dissipation component is arranged outside the box.

10. An electronic device, comprising: A semiconductor device with a heat dissipation structure as claimed in any one of claims 1 to 9.

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