Evaporation unit structure

Abstract

The present invention provides an evaporation unit structure for promoting a phase change from a liquid phase to a gas phase in a refrigerant in which a heat generation source to be cooled is immersed. Provided is an evaporation unit structure including: a base plate having a first surface and a second surface, the base plate being such that a heat generation source immersed in a liquid-phase refrigerant is thermally connected to the second surface; and a metal mesh laminated member that is thermally connected to the first surface and / or the second surface of the base plate and has a plurality of metal meshes. The metal wire constituting the metal mesh has a flat part.

Description

Evaporation section structure

[0001] The present invention relates to an evaporation section structure for cooling heat sources (heat generating elements) such as electric and electronic components, and more particularly to an evaporation section structure having excellent evaporation characteristics of a refrigerant for cooling a heat generating element (heat generating element).

[0002] As electronic devices become more sophisticated, the amount of heat generated by heat-generating elements such as electric and electronic components mounted on the electronic devices increases. If the temperature of the heat-generating elements of the electric and electronic components rises above a predetermined allowable temperature, it can cause malfunctions of the electric and electronic components, so it is important to maintain the temperature of the heat-generating elements of the electric and electronic components below the allowable temperature.

[0003] Therefore, conventionally, cooling systems have been used that improve the cooling performance of a heat-generating object by air-cooling a heat distribution structure that is thermally connected to the heat-generating object. Specifically, a cooling system has been proposed that includes a heat distribution structure that is coupled to a heat source to distribute heat generated by the heat source, and at least one blower fan that has a main blowing direction, and that is positioned so that the main blowing direction faces the heat distribution structure (Patent Document 1). In Patent Document 1, air is blown toward the heat distribution structure that is thermally connected to the heat-generating object, thereby lowering the surface temperature of the steam chamber and improving the cooling efficiency, cooling capacity, and / or cooling speed of the heat distribution structure.

[0004] However, as mentioned above, the amount of heat generated by heat-generating elements such as electronic components is increasing year by year, and therefore the air-cooled cooling device of Patent Document 1, which blows air using a blower fan or the like, may not be able to sufficiently cool heat-generating elements such as electronic components.

[0005] Therefore, in order to cool a heat-generating body with an increased heat output, a liquid-cooling method has been proposed in which the heat-generating body is immersed in a liquid-phase refrigerant, because a liquid-phase refrigerant has a larger heat capacity and better heat transfer properties than a gas-phase refrigerant such as air. Specifically, a cooling system has been proposed that includes a cooling device having a container to which a heat-generating body is thermally connected, a liquid-phase primary refrigerant sealed within the container, and a condenser tube that penetrates a gas-phase portion within the container and through which a liquid-phase secondary refrigerant flows, wherein the heat-generating body is immersed in the liquid-phase primary refrigerant sealed within the container, and a secondary refrigerant cooling section to which the condenser tube extending from the cooling device is connected, and the liquid-phase secondary refrigerant flowing through the condenser tube circulates between the cooling device and the secondary refrigerant cooling section.

[0006] In the liquid-cooled cooling system, the liquid-phase primary refrigerant sealed inside the container changes phase from liquid to gas when it receives heat from a heat-generating element. The primary refrigerant that has changed to gas changes phase again from gas to liquid through a condenser tube that penetrates the gas phase inside the container and through which a liquid-phase secondary refrigerant flows. The latent heat released from the primary refrigerant during this phase change is transferred to the liquid-phase secondary refrigerant flowing through the condenser tube. The liquid-phase secondary refrigerant that has received the latent heat from the primary refrigerant flows through the condenser tube from inside to outside the cooling device, thereby transporting the latent heat to the outside of the cooling device. The secondary refrigerant that has received the latent heat is cooled by a secondary refrigerant cooling unit provided outside the cooling device.

[0007] However, in the conventional liquid-cooled cooling system described above, since the heat-generating element is cooled by the latent heat generated by the phase change of the primary refrigerant from the liquid phase to the gas phase, further improvement of the cooling performance was required. Therefore, in the conventional liquid-cooled cooling system, improvement was required in terms of promoting the phase change from the liquid phase to the gas phase of the refrigerant in which the heat-generating element to be cooled is immersed.

[0008] Special Publication No. 2023-512380

[0009] In view of the above circumstances, an object of the present invention is to provide an evaporation section structure that promotes the phase change from liquid to gas phase of a refrigerant in which a heat source, which is an object to be cooled, is immersed.

[0010] The gist of the configuration of the evaporator structure of the present invention is as follows. [1] An evaporator structure comprising: a base plate having a first surface and a second surface, the second surface of which is thermally connected to a heat source immersed in a liquid-phase refrigerant; and a metal mesh laminate member having multiple layers of metal mesh thermally connected to the first surface and / or the second surface of the base plate, wherein the metal wires constituting the metal mesh have flat portions. [2] The evaporator structure described in [1], wherein the flat portions of the metal wires are pressure-welded portions of the multiple layers of the metal mesh. [3] The evaporator structure described in [1] or [2], wherein the metal mesh is a screen mesh in which multiple first metal wires constituting warp threads and multiple second metal wires constituting weft threads alternately cross each other above and below, and the multiple first metal wires and the multiple second metal wires have the flat portions. [4] The evaporator structure described in [1] or [2], wherein the metal mesh laminate member is sintered and thermally connected to the base plate. [5] The evaporation section structure according to [1] or [2], wherein the first surface faces the second surface, and a metal mesh laminate member is thermally connected to the first surface. [6] The evaporation section structure according to [1] or [2], wherein the metal mesh laminate member is formed by stacking a plurality of the metal meshes. [7] The evaporation section structure according to [1] or [2], wherein the number of meshes of the metal meshes constituting the metal mesh laminate member is 200 / 2.54 cm or more. [8] The evaporation section structure according to [1] or [2], wherein the number of meshes of the metal meshes constituting the metal mesh laminate member is 300 / 2.54 cm or more. [9] The evaporation section structure according to [1] or [2], wherein the metal mesh laminate member is formed by two to ten layers of the metal mesh.

[10] The evaporation section structure according to [1] or [2], wherein one or more metal mesh laminate members are provided along the extending direction of the first surface.

[11] An evaporation section structure described in [1] or [2], in which one or more of the metal mesh laminated members are provided along the extending direction of the second surface.

[12] An evaporation section structure described in [1] or [2], wherein the base plate is a vapor chamber having a container with a hollow portion formed inside, a working fluid sealed in the hollow portion, and a vapor flow path provided in the hollow portion through which the gas-phase working fluid flows.

[0011] In the evaporation section structure of the above aspect [1], heat is transferred from a heat source immersed in a liquid refrigerant to the second surface of the base plate, and the heat transferred to the second surface of the base plate is transferred to a metal mesh laminate member thermally connected to the base plate. The heat transferred to the metal mesh laminate member is transferred to the liquid refrigerant in contact with the metal mesh laminate member, and the liquid refrigerant changes phase to a gas phase at the contact portion with the metal mesh laminate member. The phase change of the liquid refrigerant to a gas phase at the contact portion with the metal mesh laminate member cools the heat source immersed in the liquid refrigerant.

[0012] According to one aspect of the evaporator structure of the present invention, there is provided a base plate having a first surface and a second surface, the second surface of which is thermally connected to a heat source immersed in a liquid-phase refrigerant, and a metal mesh laminate member having multiple layers of metal mesh thermally connected to the first surface and / or the second surface of the base plate, wherein the metal wires constituting the metal mesh have flat portions, thereby increasing the contact area between the heat source and the refrigerant in the metal mesh laminate member, thereby increasing the heat dissipation area, and also providing numerous fine pores that are advantageous for generating bubbles of gas-phase refrigerant, thereby increasing the amount of bubble generation. Therefore, according to this aspect of the evaporator structure of the present invention, it is possible to promote the phase change from liquid to gas of the refrigerant in which the heat source to be cooled is immersed, thereby improving the cooling characteristics for the heat source immersed in the liquid-phase refrigerant.

[0013] According to an aspect of the evaporation section structure of the present invention, the flat portions of the metal wires constituting the metal mesh are pressure-welded portions of multiple layers of the metal mesh, thereby reliably joining the multiple layers of metal mesh while reliably forming fine pores in the metal mesh laminated member that are advantageous for generating bubbles consisting of gaseous refrigerant.

[0014] According to one aspect of the evaporation section structure of the present invention, the metal mesh is a screen mesh in which a plurality of first metal wires constituting the warp and a plurality of second metal wires constituting the weft alternately cross each other above and below, and since the plurality of first metal wires and the plurality of second metal wires have the flat portions, fine pores that are advantageous for generating bubbles consisting of gaseous refrigerant are reliably formed throughout the entire metal mesh laminated member.

[0015] According to this aspect of the evaporation portion structure of the present invention, the metal mesh laminated member is sintered and thermally connected to the base plate, thereby improving the thermal connectivity between the metal mesh laminated member and the base plate.

[0016] According to an aspect of the evaporation section structure of the present invention, the metal mesh laminated member is formed by stacking multiple metal meshes, which makes it easier to adjust the diameter and shape of the fine holes in the metal mesh laminated member and improves the manufacturing efficiency of the metal mesh laminated member.

[0017] According to an aspect of the evaporation section structure of the present invention, the number of meshes of the metal mesh constituting the metal mesh laminated member is 200 or more per 2.54 cm, thereby reliably forming fine pores that are advantageous for generating bubbles made of gaseous refrigerant.

[0018] According to an embodiment of the evaporation section structure of the present invention, the number of meshes of the metal mesh constituting the metal mesh laminated member is 300 meshes / 2.54 cm or more, thereby more reliably forming fine pores that are advantageous for generating bubbles made of gaseous refrigerant, and more of the fine pores are formed.

[0019] According to an aspect of the evaporation section structure of the present invention, the metal mesh laminated member is formed of two to ten layers of the metal mesh, thereby reliably forming fine pores that are advantageous for generating bubbles made of gaseous refrigerant, while allowing the bubbles made of gaseous refrigerant to smoothly separate from the metal mesh laminated member.

[0020] According to the aspect of the evaporation portion structure of the present invention, the base plate is a vapor chamber, so that the function of diffusing heat can be improved.

[0021] 1 is a side view illustrating an overview of an evaporation portion structure according to a first embodiment of the present invention; FIG. 2 is a perspective view illustrating an overview of an evaporation portion structure according to a first embodiment of the present invention; FIG. 3 is a plan view illustrating an overview of an evaporation portion structure according to a first embodiment of the present invention; FIG. 4 is an explanatory view illustrating an overview of a flat portion of the evaporation portion structure according to the first embodiment of the present invention; FIG. 5 is an explanatory view illustrating an overview of a metal mesh laminated member of the evaporation portion structure according to the first embodiment of the present invention; FIG. 6 is an explanatory view illustrating a method of using the evaporation portion structure according to the first embodiment of the present invention; FIG. 7 is an explanatory view illustrating an overview of positioning of a base plate and a metal mesh in a manufacturing method of the evaporation portion structure according to the first embodiment of the present invention; FIG. 8 is a plan view illustrating an overview of an evaporation portion structure according to a second embodiment of the present invention; FIG. 9 is a side view illustrating an overview of an evaporation portion structure according to a second embodiment of the present invention; FIG. 10 is a plan view illustrating an overview of an evaporation portion structure according to a third embodiment of the present invention; FIG. 11 is a side view illustrating an overview of an evaporation portion structure according to a third embodiment of the present invention; FIG. 12 is a plan view illustrating an overview of an evaporation portion structure according to a fourth embodiment of the present invention; FIG. 13 is a side view illustrating an overview of an evaporation portion structure according to a fourth embodiment of the present invention; FIG. 14 is a plan view illustrating an overview of an evaporation portion structure according to a fifth embodiment of the present invention; FIG. 15 is a side view illustrating an overview of an evaporation portion structure according to a fifth embodiment of the present invention; FIG. 16 is a plan view illustrating an overview of an evaporation portion structure according to a sixth embodiment of the present invention. FIG. 1 is a side view illustrating an overview of an evaporator structure according to a sixth embodiment of the present invention. FIG. 2 is an explanatory diagram illustrating another method of using the evaporator structure according to the first embodiment of the present invention. FIG. 3 is a plan view illustrating an overview of another method of using the evaporator structure according to another embodiment of the present invention. FIG. 4 is a side view illustrating an overview of an evaporator structure obtained by modifying the first embodiment of the present invention. FIG. 5 is a side view illustrating an overview of an evaporator structure obtained by modifying the fourth embodiment of the present invention. FIG. 6 is a side view illustrating an overview of an evaporator structure obtained by modifying the sixth embodiment of the present invention. FIG. 7 is a perspective view illustrating an overview of an evaporator structure according to the seventh embodiment of the present invention. FIG. 8 is a plan view illustrating an overview of an evaporator structure according to the seventh embodiment of the present invention. FIG. 9 is an explanatory diagram illustrating a method of using the evaporator structure according to the seventh embodiment of the present invention.FIG. 10 is a side view illustrating an overview of an evaporator structure according to an eighth embodiment of the present invention. FIG. 11 is a side view illustrating an overview of an evaporator structure according to a ninth embodiment of the present invention. FIG. 12 is a side view illustrating an overview of an evaporator structure according to a tenth embodiment of the present invention. FIG. 13 is an enlarged side view illustrating an overview of a boiling promotion section in an evaporator structure according to a tenth embodiment of the present invention. FIG. 14 is a side view illustrating an overview of an evaporator structure according to an eleventh embodiment of the present invention. FIG. 15 is a side view illustrating an overview of an evaporator structure according to a twelfth embodiment of the present invention. FIG. 16 is a side view illustrating an overview of an evaporator structure according to another embodiment of the present invention.

[0022] The evaporation section structure according to the first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side view illustrating an overview of the evaporation section structure according to the first embodiment of the present invention. FIG. 2 is a perspective view illustrating an overview of the evaporation section structure according to the first embodiment of the present invention. FIG. 3 is a plan view illustrating an overview of the evaporation section structure according to the first embodiment of the present invention. FIG. 4 is an explanatory diagram illustrating an overview of a flat portion of the evaporation section structure according to the first embodiment of the present invention. FIG. 5 is an explanatory diagram illustrating an overview of a metal mesh laminated member of the evaporation section structure according to the first embodiment of the present invention.

[0023] As shown in Figures 1, 2, and 3, an evaporation section structure 1 according to a first embodiment of the present invention includes a base plate 10 having a first surface 11 and a second surface 12, and a metal mesh laminate member 20 having multiple layers of metal mesh 21 thermally connected to the first surface 11 and / or the second surface 12 of the base plate 10. A heat source 100 immersed in a liquid-phase refrigerant (not shown in Figures 1 to 3) is thermally connected to the second surface 12 of the base plate 10. In the evaporation section structure 1, the metal mesh laminate member 20 is provided on the first surface 11 of the base plate 10. That is, in the evaporation section structure 1, the metal mesh laminate member 20 is thermally connected to the first surface 11 of the base plate 10.

[0024] In the base plate 10 of the evaporation section structure 1, the first surface 11 faces the second surface 12, and the metal mesh laminate member 20 is thermally connected to the first surface 11. As described above, the metal mesh laminate member 20 is disposed opposite the heat source 100 via the base plate 10. Note that in the evaporation section structure 1, the metal mesh laminate member 20 is not provided on the second surface 12 of the base plate 10, and therefore the metal mesh laminate member 20 is not thermally connected to the second surface 12 of the base plate 10.

[0025] The base plate 10 has a longitudinal direction and a width direction. The shape of the base plate 10 is not particularly limited, but in the evaporation portion structure 1, it is a plate-like member having a predetermined thickness and has a rectangular shape in a plan view. The first surface 11 forms a first main surface of the base plate 10, and the second surface 12 forms a second main surface of the base plate 10.

[0026] The base plate 10 is a member that thermally connects the heat source 100 to the evaporation section structure 1 and transfers heat from the heat source 100 to the metal mesh laminate member 20. From the viewpoint of heat transferability, the base plate 10 is preferably a solid plate-like member.

[0027] The material of the base plate 10 is not particularly limited, and examples thereof include metals such as copper, copper alloys, aluminum, aluminum alloys, nickel, nickel alloys, stainless steel, titanium, titanium alloys, etc. The dimensions of the base plate 10 can be appropriately selected depending on the conditions of use of the evaporation portion structure 1, and examples thereof include a plate-shaped member having a length of 40 mm to 120 mm in the longitudinal direction (X direction), a width of 40 mm to 120 mm in the width direction (Y direction), and a thickness of 4 mm to 5 mm in the thickness direction (Z direction).

[0028] The metal mesh laminated member 20 has a laminated structure in which a plurality of metal meshes 21, 21, 21... are laminated in the thickness direction of the base plate 10. The metal mesh laminated member 20 also has a structure in which a plurality of metal meshes 21, 21, 21... are laminated in the thickness direction of the metal meshes 21. The number of layers of the metal mesh 21 in the metal mesh laminated member 20 is not particularly limited as long as it is two or more layers, and the metal mesh laminated member 20 of the evaporation portion structure 1 has a laminated structure consisting of three layers of metal mesh 21.

[0029] Each metal mesh 21 constituting the metal mesh laminated member 20 has a longitudinal direction and a width direction. The shape of each metal mesh 21 is not particularly limited, but in the evaporation portion structure 1, it is a sheet-like member having a predetermined thickness and has a rectangular shape in a plan view.

[0030] As described above, the metal mesh laminate member 20 has a longitudinal direction and a width direction. The shape of the metal mesh laminate member 20 is not particularly limited, but in the evaporation portion structure 1, it is a plate-like member having a predetermined thickness and has a rectangular shape in a plan view. The metal mesh laminate member 20 has a structure in which a plurality of metal meshes 21, 21, 21... are stacked in the thickness direction of the metal meshes 21, and therefore is not a solid plate-like member but a plate-like member having a large number of fine holes.

[0031] 1, 2, and 3, the metal mesh laminated member 20 extends along the extension direction of the first surface 11 of the base plate 10. In addition, in the evaporation portion structure 1, one metal mesh laminated member 20 is provided along the extension direction of the first surface 11 of the base plate 10.

[0032] 4, in the metal mesh laminate member 20 of the evaporation portion structure 1, the metal wires 22 constituting the metal mesh 21 have flat portions 23. The flat portions 23 are portions of the metal wires 22 constituting the metal mesh 21 that have a flat shape along the extension direction of the metal mesh 21, i.e., along the planar direction of the metal mesh 21. The flat portions 23 also have a smooth surface along the extension direction of the metal mesh 21.

[0033] As shown in FIG. 5 , in the evaporation portion structure 1, the stacked metal meshes 21, 21, 21... are tightly stacked by being pressed together. In the evaporation portion structure 1, the stacked three metal meshes 21, 21, 21... are tightly stacked by being pressed together, resulting in a three-layer structure. As described above, the metal mesh laminated member 20 has a structure in which the multiple metal meshes 21, 21, 21... are tightly stacked by being pressed together. Also, as shown in FIGS. 4 and 5 , the flat portions 23 of the metal wires 22 constituting the metal mesh 21 are the pressed-together portions 24 of the multiple layers of metal mesh 21, 21, 21.... That is, the flat portions 23 of the metal mesh 21 are the pressed-together portions 24 of the other metal meshes 21 adjacent in the thickness direction of the metal mesh laminated member 20. Therefore, the flat portions 23 are formed in each of the multiple layers of metal mesh 21, 21, 21.... In particular, flat portions 23 are formed in areas where the stacked multiple metal meshes 21, 21, 21 are in contact with each other, in areas of the metal mesh laminated member 20 that are in contact with the base plate 10, and in areas of the outer surface of the metal mesh laminated member 20 where the metal wires 22 protrude in the thickness direction of the metal mesh 21.

[0034] The metal mesh 21 is a screen mesh in which a plurality of first metal wires 22-1, 22-1, 22-1... constituting the warp threads and a plurality of second metal wires 22-2, 22-2, 22-2... constituting the weft threads alternately cross one another. In the evaporation section structure 1, the plurality of first metal wires 22-1, 22-1, 22-1... and the plurality of second metal wires 22-2, 22-2, 22-2... each have a flat portion 23. Therefore, the metal mesh laminated member 20 has the flat portion 23 over its entire planar direction.

[0035] The distance between the metal wires 22 of the metal mesh 21 constituting the metal mesh laminated member 20 (the size of the mesh opening, i.e., the size of the gap between the metal wires 22) is, for example, 30 μm or more and 40 μm or less, and the wire diameter of the metal wires 22 of the metal mesh 21 constituting the metal mesh laminated member 20 is, for example, 30 μm or more and 50 μm or less. In addition, the void area of ​​the metal mesh laminated member 20 is, for example, 900 μm. ２ 1600 μm or more ２ The following is the result.

[0036] When the flat portion 23 is formed on the metal wire 22 as described above, the pitch between the metal wires 22 (the distance between the center lines of the metal wires 22) remains almost unchanged compared to the state before the formation (before pressure welding), while the wire diameter of the metal wires 22 increases and the distance between the metal wires 22 decreases. Here, the value obtained by dividing the wire diameter of the metal wire 22 by the pitch between the metal wires 22 is defined as α (<1). The value of α increases when the flat portion 23 is formed by pressure welding. Table 1 shows an example of the change in each dimension before and after pressure welding for a mesh count of #350.

[0037]

[0038] As described above, in the case of mesh number #350, for example, the value of α changes from 0.37 before compression to 0.39 to 0.41 after compression. In other words, the value of α increases by, for example, about 5 to 11% due to pressure welding.

[0039] 1, 2, and 3, in the evaporation portion structure 1, the metal mesh laminated member 20 is sintered to be integrated with the base plate 10 and thermally connected to the base plate 10. Also, in the evaporation portion structure 1, the metal mesh laminated member 20 is sintered to integrate the plurality of stacked metal meshes 21, 21, 21, ....

[0040] In the evaporation portion structure 1, the metal mesh laminate member 20 is formed by stacking multiple metal meshes 21, 21, 21.... That is, the multiple separate metal meshes 21, 21, 21... are pressed together in a stacked state, thereby closely stacking the multiple metal meshes 21, 21, 21.... Furthermore, the multiple separate metal meshes 21, 21, 21... are sintered in a stacked state, thereby integrating the multiple stacked metal meshes 21, 21, 21.... As described above, the metal mesh laminate member 20 of the evaporation portion structure 1 has a different structure from a laminate structure formed by folding a single metal mesh. Furthermore, since the metal mesh laminate member 20 is formed by closely stacking and integrating the multiple metal meshes 21, 21, 21..., the metal mesh laminate member 20 has excellent thermal conductivity even though it is formed by stacking multiple metal meshes 21, 21, 21....

[0041] The number of meshes of the metal mesh 21 constituting the metal mesh laminated member 20 is not particularly limited, but in the evaporation section structure 1, the number of meshes of the first metal wires 22-1, 22-1, 22-1... constituting the warp and the number of second metal wires 22-2, 22-2, 22-2... constituting the weft are all 200 / 2.54 cm or more, more specifically, 300 / 2.54 cm or more. From the above, the metal mesh laminated member 20 has a configuration in which many fine holes are present. The upper limit of the number of meshes of the metal mesh 21 constituting the metal mesh laminated member 20 is not particularly limited, but for example, the number of meshes of the first metal wires 22-1, 22-1, 22-1... constituting the warp and the number of second metal wires 22-2, 22-2, 22-2... constituting the weft can be 500 / 2.54 cm.

[0042] The number of meshes in each of the metal meshes 21 constituting the metal mesh laminate member 20 may be the same or different for each of the metal meshes 21. For ease of explanation, in the evaporation portion structure 1, the number of meshes in each of the metal meshes 21 is the same.

[0043] The material of the metal mesh 21 is not particularly limited, and examples thereof include copper, copper alloy, aluminum, aluminum alloy, nickel, nickel alloy, stainless steel, titanium, titanium alloy, etc. The dimensions of the metal mesh laminate member 20 can be appropriately selected depending on the conditions of use of the evaporation portion structure 1, and examples thereof include a plate-shaped member having a length of 30 mm to 110 mm in the longitudinal direction (X direction), a width of 30 mm to 110 mm in the width direction (Y direction), and a thickness of 0.06 mm to 0.6 mm in the thickness direction (Z direction).

[0044] Next, an example of how to use the evaporation portion structure 1 according to the first embodiment of the present invention will be described. Fig. 6 is an explanatory diagram showing how to use the evaporation portion structure according to the first embodiment of the present invention.

[0045] 6 , a cooling device 210 includes a container 200 to which a heat source 100 is thermally connected, a liquid-phase primary refrigerant 201 sealed and stored inside the container 200, and a condenser pipe 204 penetrating a gas phase portion 203 inside the container 200 and through which a liquid-phase secondary refrigerant 202 flows, and the cooling device 210 includes a secondary refrigerant cooling section 221 to which the condenser pipe 204 extending from the cooling device 210 is connected, and the cooling system 220 includes the heat source 100 immersed in the liquid-phase primary refrigerant 201 sealed inside the container 200, and the liquid-phase secondary refrigerant 202 circulating through the condenser pipe 204 circulates between the cooling device 210 and the secondary refrigerant cooling section 221. Specifically, the cooling system 220 may be used in a cooling system in which the evaporator structure 1 according to the first embodiment of the present invention is thermally connected to the heat source 100 immersed in the liquid-phase primary refrigerant 201 while being immersed in the liquid-phase primary refrigerant 201.

[0046] In the above-described example of a method for using the evaporation structure 1, the evaporation structure 1 receives heat from the heat source 100, and the liquid-phase primary refrigerant 201 sealed and stored inside the container 200 receives heat from the heat source 100 from the evaporation structure 1, causing the liquid-phase primary refrigerant 201 to change phase from liquid to gas at the contact portion with the evaporation structure 1. More specifically, the base plate 10 of the evaporation structure 1 transfers the heat of the heat source 100 from the heat source 100 to the metal mesh laminate member 20, and the heat transferred to the metal mesh laminate member 20 is transferred from the metal mesh laminate member 20 to the liquid-phase primary refrigerant 201 in contact with the metal mesh laminate member 20, causing the liquid-phase primary refrigerant 201 to change phase to gas at the contact portion with the metal mesh laminate member 20, and forming a large number of bubbles in the primary refrigerant 201. The liquid phase primary refrigerant 201 changes phase to gas phase at the contact point with the metal mesh laminate member 20, and bubbles of the primary refrigerant 201 are formed, thereby cooling the heat source 100 immersed in the liquid phase primary refrigerant 201.

[0047] Bubbles of the primary refrigerant 201 generated at the contact portion with the metal mesh lamination member 20 leave the metal mesh lamination member 20 and head toward the gas phase portion 203 inside the container 200. The primary refrigerant 201 changes phase from gas to liquid through a condenser tube 204, which penetrates the gas phase portion 203 inside the container 200 and through which a liquid-phase secondary refrigerant 202 flows. During this phase change, latent heat released from the primary refrigerant 201 is transferred to the liquid-phase secondary refrigerant 202 flowing through the condenser tube 204. The liquid-phase secondary refrigerant 202 that has received the latent heat from the primary refrigerant 201 flows through the condenser tube 204 from the inside to the outside of the cooling device 210, and the latent heat is transported to the outside of the cooling device 210. The secondary refrigerant 202 that has received the latent heat is cooled by a secondary refrigerant cooling unit 221 provided outside the cooling device 210. The primary refrigerant 201, which has changed phase from gas phase to liquid phase by the condenser pipe 204 through which the liquid phase secondary refrigerant 202 flows, drips from the condenser pipe 204 into the liquid phase primary refrigerant 201 stored inside the container 200.

[0048] Next, a description will be given of an example of a manufacturing method of the evaporation portion structure 1 according to the first embodiment of the present invention. Fig. 7 is an explanatory diagram showing an outline of the positioning of the base plate and the metal mesh in the manufacturing method of the evaporation portion structure according to the first embodiment of the present invention.

[0049] First, three metal meshes 21 are pressed together in an overlapping state. By pressing the three metal meshes 21 together, the three layers of metal mesh 21 are tightly stacked, and flat portions 23 are formed on the metal wires 22 that make up the metal meshes 21. Furthermore, by pressing the three metal meshes 21 together, their thickness (Z direction) dimensions are reduced compared to before pressing. Examples of pressure applied during pressing include 10 MPa or more and 60 MPa or less. Next, as shown in FIG. 7 , the three metal meshes 21 pressed onto the base plate 10 are placed in an overlapping state on a recessed positioning portion 302 provided on a flat positioning jig 301. A flat pin jig 303 with pins 304 is attached below the positioning jig 301, and the three metal meshes 21 pressed onto the base plate 10 are fixed onto the positioning portion 302 by the pins 304. The three metal meshes 21 pressed onto the base plate 10 are positioned using the above method. At this time, the base plate 10 is positioned upward in the direction of gravity, and the three pressed-contact metal meshes 21 are positioned downward in the direction of gravity. Next, a flat weight 305 is placed on the three pressed-contact metal meshes 21 to the base plate 10, thereby sandwiching the base plate 10 and the three pressed-contact metal meshes 21 between the weight 305 and the positioning jig 301. At this time, the stress from the weight 305 in the direction of the positioning jig 301 improves the fixing stability of the three pressed-contact metal meshes 21 to the base plate 10 on the positioning portion 302.

[0050] Next, the three metal meshes 21 pressed against the base plate 10 while sandwiched between the weight 305 and the positioning jig 301 are flipped upside down so that the base plate 10 is facing downward in the direction of gravity and the three pressed metal meshes 21 are facing upward in the direction of gravity. Next, the positioning jig 301 and the pin jig 303 are removed, and the three metal meshes 21 pressed against the base plate 10 are placed on the weight 305. Next, a sintering weight is placed on the three metal meshes 21 pressed against the base plate 10 placed on the weight 305, and a sintering process is performed on the three metal meshes 21 pressed against the base plate 10 while the three metal meshes 21 pressed against the base plate 10 are sandwiched between the weight 305 and the sintering weight. By sintering the three metal meshes 21 pressed against the base plate 10, the three stacked metal meshes 21 are integrated to form the metal mesh laminated member 20. Furthermore, by sintering the three metal meshes 21 pressed against the base plate 10, the metal mesh laminate member 20 is integrated with the base plate 10, and an evaporation portion structure 1 can be manufactured in which the metal mesh laminate member 20 is thermally connected to the base plate 10. The temperature for the sintering process can be, for example, 900°C or higher and 950°C or lower.

[0051] In one embodiment of the evaporation section structure 1, there is provided a base plate 10 having a first surface 11 and a second surface 12, to which a heat generation source 100 immersed in a liquid-phase refrigerant (e.g., the primary refrigerant 201 of the cooling device 210) is thermally connected, and a metal mesh laminate member 20 having multiple layers of metal mesh 21 thermally connected to the first surface 11 of the base plate 10, wherein the metal wires 22 constituting the metal mesh 21 have flat portions 23, thereby increasing the contact area of ​​the metal mesh laminate member 20 with the refrigerant in which the heat generation source 100 is immersed (the primary refrigerant 201 of the cooling device 210), thereby increasing the heat dissipation area of ​​the metal mesh laminate member 20, and the metal mesh laminate member 20 has many fine pores that are advantageous for generating bubbles made of the gas-phase refrigerant (the primary refrigerant 201 of the cooling device 210), thereby increasing the amount of bubbles generated. Therefore, the evaporation section structure 1 can promote the phase change from liquid to gas phase of the liquid phase refrigerant (primary refrigerant 201 of the cooling device 210) in which the heat source 100 to be cooled is immersed, thereby improving the cooling characteristics of the heat source 100 immersed in the liquid phase refrigerant (primary refrigerant 201 of the cooling device 210).

[0052] Furthermore, in the evaporation section structure 1, the flat portion 23 of the metal wire 22 constituting the metal mesh 21 is the pressure-welded portion 24 of the multiple layers of metal mesh 21, 21, 21..., so that the multiple layers of metal mesh 21, 21, 21... are reliably joined, while fine pores that are advantageous for generating bubbles consisting of gas-phase refrigerant (primary refrigerant 201 of the cooling device 210) are reliably formed in the metal mesh laminated member 20.

[0053] In addition, in the embodiment of the evaporation section structure 1, the metal mesh 21 is a screen mesh in which a plurality of first metal wires 22-1, 22-1, 22-1... constituting the warp threads and a plurality of second metal wires 22-2, 22-2, 22-2... constituting the weft threads alternately cross each other above and below, and the plurality of first metal wires 22-1, 22-1, 22-1... and the plurality of second metal wires 22-2, 22-2, 22-2... have flat portions 23, so that fine pores that are advantageous for generating bubbles made of gaseous refrigerant (primary refrigerant 201 of the cooling device 210) are reliably formed throughout the entire metal mesh laminated member 20.

[0054] Furthermore, in the embodiment of the evaporation portion structure 1, the metal mesh laminated member 20 is sintered and thermally connected to the base plate 10, so that the thermal connectivity between the metal mesh laminated member 20 and the base plate 10 is improved.

[0055] Furthermore, in the embodiment of the evaporation section structure 1, the metal mesh laminate member 20 is formed by stacking multiple metal meshes 21, 21, 21..., which makes it easier to adjust the diameter and shape of the fine holes in the metal mesh laminate member 20, and also improves the manufacturing efficiency of the metal mesh laminate member 20 and, ultimately, the evaporation section structure 1.

[0056] Furthermore, in the embodiment of the evaporation section structure 1, the number of meshes of the metal mesh 21 constituting the metal mesh laminated member 20 is 200 / 2.54 cm or more, so that fine pores that are advantageous for generating bubbles consisting of gas phase refrigerant (primary refrigerant 201 of the cooling device 210) are reliably formed.

[0057] Furthermore, in the embodiment of the evaporation section structure 1, the number of meshes of the metal mesh 21 constituting the metal mesh laminated member 20 is 300 / 2.54 cm or more, so that fine pores that are advantageous for generating bubbles consisting of the gas phase refrigerant (primary refrigerant 201 of the cooling device 210) are more reliably formed, and more of the fine pores are formed.

[0058] Furthermore, in the evaporation portion structure 1, the flat portions 23 formed on the metal wires 22 increase the area (proportion) of the flat regions on the surface of the metal mesh 21 compared to when no flat portions are formed. By stacking such metal meshes 21, the contact area between overlapping metal meshes 21 increases, thereby reducing contact thermal resistance. Furthermore, the contact area between the surface of the base plate 10 (the first surface 11 in this embodiment) and the surface of the metal mesh laminate member 20 (the surface of the metal mesh 21 closest to the first surface 11) also increases, thereby reducing contact thermal resistance.

[0059] Next, an evaporator structure according to a second embodiment of the present invention will be described with reference to the drawings. The evaporator structure according to the second embodiment shares major components with the evaporator structure according to the first embodiment, and therefore the same components as those in the evaporator structure according to the first embodiment will be described using the same reference numerals. Note that FIG. 8 is a plan view illustrating an overview of the evaporator structure according to the second embodiment of the present invention. FIG. 9 is a side view illustrating an overview of the evaporator structure according to the second embodiment of the present invention.

[0060] While the metal mesh laminate member 20 of the evaporation portion structure 1 according to the first embodiment had a laminate structure consisting of three layers of metal mesh 21, as shown in Figures 8 and 9, the metal mesh laminate member 20 of the evaporation portion structure 2 according to the second embodiment has a laminate structure consisting of six layers of metal mesh 21. That is, in the evaporation portion structure 2, the number of layers of metal mesh 21 constituting the metal mesh laminate member 20 is greater than the number of layers of metal mesh 21 constituting the metal mesh laminate member 20 of the evaporation portion structure 1. As such, the number of layers of metal mesh 21 constituting the metal mesh laminate member 20 is not particularly limited as long as it is two or more layers, and can be appropriately selected depending on the conditions of use of the evaporation portion structure of the present invention.

[0061] As described above, the number of layers of metal mesh 21 constituting the metal mesh laminate member 20 is not particularly limited, but is preferably two or more layers, and more preferably three or more layers, in order to ensure the formation of fine pores that are advantageous for the generation of bubbles of gaseous refrigerant. On the other hand, the number of layers of metal mesh 21 constituting the metal mesh laminate member 20 is preferably 15 or less layers, and more preferably 10 or less layers, in order to ensure that bubbles of gaseous refrigerant can smoothly separate from the metal mesh laminate member 20 and to ensure adhesion between the multiple metal meshes 21, 21, 21... constituting the metal mesh laminate member 20 and prevent a decrease in the thermal conductivity of the metal mesh laminate member 20 as a whole. Based on the above, the metal mesh laminate member 20 is preferably formed of two to 15 metal mesh 21 layers. The preferred upper limit of the number of layers of metal mesh 21 may vary depending on the heat density of the heat source thermally connected to the evaporation section structure of the present invention.

[0062] In the evaporation portion structure 2, the metal mesh laminate member 20 is also formed by laminating six metal meshes 21, 21, 21.... In other words, the six separate metal meshes 21, 21, 21... are pressed together in a stacked state, so that the six metal meshes 21, 21, 21... are closely stacked.

[0063] The evaporation section structure 2 also includes a base plate 10 having a first surface 11 and a second surface 12, to which a heat generation source 100 immersed in a liquid-phase refrigerant (e.g., the primary refrigerant 201 of the cooling device 210) is thermally connected, and a metal mesh laminate member 20 having multiple layers (six layers) of metal mesh 21 thermally connected to the first surface 11 of the base plate 10, wherein the metal wires 22 constituting the metal mesh 21 have flat portions 23, thereby increasing the contact area of ​​the metal mesh laminate member 20 with the liquid-phase refrigerant in which the heat generation source 100 is immersed (the primary refrigerant 201 of the cooling device 210), thereby increasing the heat dissipation area of ​​the metal mesh laminate member 20, and furthermore, the metal mesh laminate member 20 has a large number of fine pores that are advantageous for generating bubbles made of the gas-phase refrigerant (the primary refrigerant 201 of the cooling device 210), thereby increasing the amount of bubbles generated. Therefore, the evaporation section structure 2 can also promote the phase change from liquid to gas phase of the liquid phase refrigerant (primary refrigerant 201 of the cooling device 210) in which the heat source 100 to be cooled is immersed, thereby improving the cooling characteristics of the heat source 100 immersed in the liquid phase refrigerant (primary refrigerant 201 of the cooling device 210).

[0064] Next, an evaporator structure according to a third embodiment of the present invention will be described with reference to the drawings. The evaporator structure according to the third embodiment shares major components with the evaporator structures according to the first and second embodiments, and therefore the same components as those in the evaporator structures according to the first and second embodiments will be described using the same reference numerals. FIG. 10 is a plan view illustrating an overview of the evaporator structure according to the third embodiment of the present invention. FIG. 11 is a side view illustrating an overview of the evaporator structure according to the third embodiment of the present invention.

[0065] In the evaporation section structure 1 according to the first embodiment, one metal mesh laminate member 20 is provided along the extension direction of the first surface 11 of the base plate 10, but instead, as shown in Figures 10 and 11, in the evaporation section structure 3 according to the third embodiment, a plurality of metal mesh laminate members 20 are provided along the extension direction of the first surface 11 of the base plate 10. In this way, the number of metal mesh laminate members 20 to be installed can be selected appropriately depending on the conditions of use of the evaporation section structure of the present invention, etc.

[0066] In the evaporation section structure 3, four metal mesh laminate members 20 are provided at predetermined intervals on the first surface 11 of the base plate 10. The number of layers of metal mesh 21 in each of the multiple metal mesh laminate members 20, 20, 20... may be the same or different. For ease of explanation, in the evaporation section structure 3, the number of layers of metal mesh 21 in each of the multiple metal mesh laminate members 20, 20, 20... is the same.

[0067] In the evaporation section structure 3, positioning portions 13 are provided on the first surface 11 of the base plate 10 for positioning the multiple metal mesh laminate members 20, 20, 20... on the first surface 11 of the base plate 10. The positioning portions 13 extend along the boundaries formed between the multiple metal mesh laminate members 20, 20, 20.... Examples of the positioning portions 13 include protrusions formed on the first surface 11 of the base plate 10 and protruding in the thickness direction (Z direction) of the base plate 10. The provision of the positioning portions 13 on the first surface 11 of the base plate 10 prevents the multiple metal mesh laminate members 20, 20, 20... from overlapping on the first surface 11 of the base plate 10. Note that the positioning portions 13 are provided as needed, and an embodiment in which the positioning portions 13 are not provided is also possible.

[0068] Furthermore, in the evaporation portion structure 3, protrusions 14 are provided on the peripheral portion on the first surface 11 of the base plate 10, protruding in the thickness direction (Z direction) of the base plate 10. In the evaporation portion structure 3, the protrusions 14 are provided around the entire peripheral portion of the base plate 10. By providing the protrusions 14 on the peripheral portion on the first surface 11 of the base plate 10, it is possible to prevent a joining material such as solder from penetrating into the metal mesh laminate member 20 via the base plate 10 when the evaporation portion structure 3 is thermally connected to the heat source 100. In other words, the protrusions 14 function as a portion that prevents a joining material from penetrating into the metal mesh laminate member 20. Note that the protrusions 14 are provided as necessary, and an embodiment in which the protrusions 14 are not provided is also possible.

[0069] The evaporation section structure 3 also includes a base plate 10 having a first surface 11 and a second surface 12, to which a heat source 100 immersed in a liquid-phase refrigerant (e.g., the primary refrigerant 201 of the cooling device 210) is thermally connected, and a plurality of metal mesh laminate members 20 having multiple layers of metal mesh 21 are thermally connected to the first surface 11 of the base plate 10. Since the metal wires 22 constituting the metal mesh 21 have flat portions 23, the contact area of ​​the metal mesh laminate member 20 with the liquid-phase refrigerant in which the heat source 100 is immersed (the primary refrigerant 201 of the cooling device 210) is increased, thereby increasing the heat dissipation area of ​​the metal mesh laminate member 20. Furthermore, the metal mesh laminate member 20 has a large number of fine pores that are advantageous for generating bubbles made of the gas-phase refrigerant (the primary refrigerant 201 of the cooling device 210), thereby increasing the amount of bubbles generated. Therefore, the evaporation section structure 3 can also promote the phase change from liquid to gas phase of the liquid phase refrigerant (primary refrigerant 201 of the cooling device 210) in which the heat source 100 to be cooled is immersed, thereby improving the cooling characteristics of the heat source 100 immersed in the liquid phase refrigerant (primary refrigerant 201 of the cooling device 210).

[0070] Next, an evaporator structure according to a fourth embodiment of the present invention will be described with reference to the drawings. The evaporator structure according to the fourth embodiment shares major components with the evaporator structures according to the first to third embodiments, and therefore the same components as those in the evaporator structures according to the first to third embodiments will be described using the same reference numerals. Note that FIG. 12 is a plan view illustrating an overview of the evaporator structure according to the fourth embodiment of the present invention. FIG. 13 is a side view illustrating an overview of the evaporator structure according to the fourth embodiment of the present invention.

[0071] In the evaporation section structures 1, 2, and 3 according to the first to third embodiment examples, the metal mesh laminate member 20 is provided on the first surface 11 of the base plate 10, and no metal mesh laminate member 20 is provided on the second surface 12 of the base plate 10. Instead, as shown in Figures 12 and 13, in the evaporation section structure 4 according to the fourth embodiment example, not only is the metal mesh laminate member 20 provided on the first surface 11 of the base plate 10, but a metal mesh laminate member, i.e., another metal mesh laminate member 30, is also provided on the second surface 12 of the base plate 10.

[0072] From the above, in the evaporation section structure 4, the metal mesh laminate member 20 is thermally connected to the first surface 11 of the base plate 10 to which the heat source 100 is not thermally connected, and another metal mesh laminate member 30 is thermally connected to the second surface 12 of the base plate 10 to which the heat source 100 is thermally connected. In this way, the installation position of the metal mesh laminate member 20 on the base plate 10 is not particularly limited and can be selected appropriately depending on the conditions of use of the evaporation section structure of the present invention, etc.

[0073] In the evaporation section structure 4, one metal mesh laminate member 20 is provided on the first surface 11 of the base plate 10, and multiple other metal mesh laminate members 30 are provided at predetermined intervals on the second surface 12 of the base plate 10. In the evaporation section structure 4, the other metal mesh laminate members 30 are provided on both sides of the heat source 100. In addition, the area of ​​the other metal mesh laminate members 30 in a plan view is smaller than the area of ​​the metal mesh laminate member 20 in a plan view.

[0074] The other metal mesh laminated member 30 has the same structure as the metal mesh laminated member 20. That is, the other metal mesh laminated member 30 has a laminated structure in which a plurality of metal meshes 31, 31, 31... are laminated in the thickness direction of the base plate 10. The other metal mesh laminated member 30 also has a structure in which a plurality of metal meshes 31, 31, 31... are laminated in the thickness direction of the metal mesh 31. The metal wires that make up the metal mesh 31 have flat portions.

[0075] The number of layers of the metal mesh 31 in the other metal mesh laminate member 30 is not particularly limited as long as it is two or more layers, and the other metal mesh laminate member 30 of the evaporation portion structure 4 has a laminate structure consisting of three layers of metal mesh 31, similar to the metal mesh laminate member 20. Note that the number of layers of the metal mesh 31 in the other metal mesh laminate member 30 may be different from the number of layers of the metal mesh 21 in the metal mesh laminate member 20.

[0076] Note that the other metal mesh laminated members 30 are also formed by stacking a plurality of metal meshes 31, 31, 31.... In other words, the plurality of separate metal meshes 31, 31, 31... are pressed together in a stacked state, so that the plurality of metal meshes 31, 31, 31... are closely stacked.

[0077] In the embodiment of the evaporation section structure 4 in which a metal mesh laminate member 20 is provided on the first surface 11 of the base plate 10 and another metal mesh laminate member 30 is provided on the second surface 12 of the base plate 10, the base plate 10 has a first surface 11 and a second surface 12, and a heat source 100 immersed in a liquid-phase refrigerant (e.g., a primary refrigerant 201 of a cooling device 210) is thermally connected to the second surface 12 of the base plate 10; a metal mesh laminate member 20 having a plurality of layers of metal mesh 21 thermally connected to the first surface 11 of the base plate 10; and another metal mesh laminate member 30 having multiple layers of metal mesh 31 connected thereto, and the metal wires 22 constituting the metal meshes 21, 31 have flat portions 23, so that the contact area between the metal mesh laminate member 20 and the other metal mesh laminate member 30 and the liquid-phase refrigerant (the primary refrigerant 201 of the cooling device 210) in which the heat source 100 is immersed is increased, thereby increasing the heat dissipation area of ​​the metal mesh laminate member. Furthermore, the metal mesh laminate member has many fine pores that are advantageous for generating bubbles of the gas-phase refrigerant (the primary refrigerant 201 of the cooling device 210), increasing the amount of bubbles generated. Therefore, the evaporation section structure 4 can also promote the phase change from liquid to gas of the liquid-phase refrigerant (the primary refrigerant 201 of the cooling device 210) in which the heat source 100 to be cooled is immersed, thereby improving the cooling characteristics of the heat source 100 immersed in the liquid-phase refrigerant (the primary refrigerant 201 of the cooling device 210).

[0078] Next, an evaporator structure according to a fifth embodiment of the present invention will be described with reference to the drawings. The evaporator structure according to the fifth embodiment shares major components with the evaporator structures according to the first to fourth embodiments, and therefore the same components as those in the evaporator structures according to the first to fourth embodiments will be described using the same reference numerals. Note that FIG. 14 is a plan view illustrating an overview of the evaporator structure according to the fifth embodiment of the present invention. FIG. 15 is a side view illustrating an overview of the evaporator structure according to the fifth embodiment of the present invention.

[0079] 14 and 15 , the evaporation section structure 5 according to the fifth embodiment is configured such that the evaporation section structure 1 according to the first embodiment further includes a support member 40 for preventing the metal mesh laminate member 20 from falling off the base plate 10. That is, the support member 40 functions as a metal mesh laminate member fall-off prevention portion that prevents the metal mesh laminate member 20 from falling off the first surface 11 of the base plate 10. The support member 40 includes a planar support portion 41 that covers a portion of the surface of the metal mesh laminate member 20 and is in contact with the portion of the surface of the metal mesh laminate member 20, and legs 42 provided at both ends of the support portion 41 for fixing the support portion 41 to the first surface 11 of the base plate 10. The legs 42 are fixed to the peripheral portion of the first surface 11 of the base plate 10, which is an area where the metal mesh laminate member 20 is not thermally connected to the first surface 11 of the base plate 10.

[0080] The support member 40 is fixed to the first surface 11 of the base plate 10, and the support portion 41 of the support member 40 is in contact (surface contact) with the surface of the metal mesh laminate member 20, so that the support member 40 prevents the metal mesh laminate member 20 from falling off the base plate 10. In the evaporation section structure 5, the support portion 41 of the support member 40 covers a portion of the widthwise area of ​​the metal mesh laminate member 20.

[0081] The material of the support member 40 is not particularly limited, and examples thereof include metals such as copper, copper alloys, aluminum, aluminum alloys, stainless steel, nickel, nickel alloys, titanium, and titanium alloys.

[0082] Furthermore, even in the embodiment of the evaporation section structure 5 in which the support member 40 is provided, there is provided a base plate 10 having a first surface 11 and a second surface 12, to which a heat generation source 100 immersed in a liquid-phase refrigerant (for example, the primary refrigerant 201 of the cooling device 210) is thermally connected, and a plurality of metal mesh laminate members 20 having a plurality of layers of metal mesh 21 are thermally connected to the first surface 11 of the base plate 10, and since the metal wires 22 constituting the metal mesh 21 have flat portions 23, the contact area of ​​the metal mesh laminate member 20 with the liquid-phase refrigerant in which the heat generation source 100 is immersed (the primary refrigerant 201 of the cooling device 210) is increased, thereby increasing the heat dissipation area of ​​the metal mesh laminate member 20, and further, the metal mesh laminate member 20 has a large number of fine pores that are advantageous for generating bubbles made of the gas-phase refrigerant (the primary refrigerant 201 of the cooling device 210), thereby increasing the amount of bubbles generated. Therefore, the evaporation section structure 5 can also promote the phase change from liquid to gas phase of the liquid phase refrigerant (primary refrigerant 201 of the cooling device 210) in which the heat source 100 to be cooled is immersed, thereby improving the cooling characteristics of the heat source 100 immersed in the liquid phase refrigerant (primary refrigerant 201 of the cooling device 210).

[0083] Next, an evaporator structure according to a sixth embodiment of the present invention will be described with reference to the drawings. The evaporator structure according to the sixth embodiment shares major components with the evaporator structures according to the first to fifth embodiments, and therefore the same components as those in the evaporator structures according to the first to fifth embodiments will be described using the same reference numerals. Note that FIG. 16 is a plan view illustrating an overview of the evaporator structure according to the sixth embodiment of the present invention. FIG. 17 is a side view illustrating an overview of the evaporator structure according to the sixth embodiment of the present invention.

[0084] In the evaporation portion structures 1, 2, 3, 4, and 5 according to the first to fifth embodiments, the first surface 11 of the base plate 10 was a flat surface. However, instead, as shown in Figures 16 and 17, in the evaporation portion structure 6 according to the sixth embodiment, the first surface 11 of the base plate 10 has convex portions 15 that protrude in the thickness direction (Z direction) of the base plate 10. Therefore, in the evaporation portion structure 6, the first surface 11 of the base plate 10 is an uneven surface having flat surface portions 16 and convex portions 15. From the above, in the evaporation portion structure 6, the surface area of ​​the first surface 11 of the base plate 10 is larger than the surface area of ​​the first surface 11 of the base plate 10 of the evaporation portion structures 1, 2, 3, 4, and 5.

[0085] In the evaporation portion structure 6, the metal mesh laminate member 20 is thermally connected to the flat surface portion 16. In addition, in the evaporation portion structure 6, the metal mesh laminate member 20 is thermally connected to the protrusion portion 15. Specifically, the metal mesh laminate member 20 is thermally connected to the top surface and side surface of the protrusion portion 15.

[0086] In the evaporation section structure 6, the metal mesh laminate member 20 is thermally connected not only to the flat surface portion 16 but also to the protrusions 15, thereby increasing the surface area of ​​the metal mesh laminate member 20. Therefore, in the evaporation section structure 6, the contact area between the liquid-phase refrigerant (primary refrigerant 201 of the cooling device 210) in which the heat source 100 is immersed and the metal mesh laminate member 20 is further increased, further increasing the heat dissipation area of ​​the metal mesh laminate member 20, and as a result, the cooling characteristics for the heat source 100 immersed in the liquid-phase refrigerant (primary refrigerant 201 of the cooling device 210) are further improved.

[0087] Next, other embodiments of the evaporation section structure of the present invention will be described. In the evaporation section structures of the first to third embodiments and the evaporation section structures of the fifth and sixth embodiments, a metal mesh laminate member is thermally connected to the first surface of the base plate. In the evaporation section structure of the fourth embodiment, metal mesh laminate members are thermally connected to the first and second surfaces of the base plate. However, instead of this, a metal mesh laminate member may be thermally connected to the second surface of the base plate, and no metal mesh laminate member may be thermally connected to the first surface of the base plate. Furthermore, in the evaporation section structure of the fourth embodiment, multiple other metal mesh laminate members are provided on the second surface of the base plate. Alternatively, a single other metal mesh laminate member may be provided on the second surface of the base plate.

[0088] In the evaporation portion structures according to the above-described embodiments, the shape of the base block in a plan view is rectangular, but instead of this, it may be triangular, a polygonal shape with pentagons or more sides, circular, a shape with straight portions and curved portions, etc. Also, in the evaporation portion structures according to the above-described embodiments, the shape of the metal mesh laminate member in a plan view is rectangular, but instead of this, it may be triangular, a polygonal shape with pentagons or more sides, circular, a shape with straight portions and curved portions, etc.

[0089] Next, another example of how to use the evaporation portion structure of the present invention will be described. Note that Fig. 18 is an explanatory diagram showing another example of how to use the evaporation portion structure according to the first embodiment of the present invention.

[0090] As shown in Figure 18, the evaporation section structure of the present invention (in Figure 18, the evaporation section structure 1 relating to the first embodiment) may thermally connect a vapor chamber 250, which is a heat transport member, to the second surface 12 of the base plate 10 instead of the heat source 100.

[0091] The vapor chamber 250 is a flat heat pipe. Specifically, the vapor chamber 250 includes a container 260 having a cavity formed therein by stacking two opposing plates, i.e., one plate and the other plate facing the first plate, and a working fluid sealed in the cavity and a vapor flow path provided in the cavity through which the gas-phase working fluid flows. The cavity is an enclosed space and is depressurized by a degassing process.

[0092] The vapor chamber 250, which is thermally connected to the heat source 100, is immersed in a liquid-phase refrigerant (e.g., the primary refrigerant 201 of the cooling device 210) together with the heat source 100, and an example of a usage method is to thermally connect the evaporation section structure (evaporation section structure 1) of the present invention to the vapor chamber 250 immersed in this liquid-phase refrigerant while immersed in the liquid-phase refrigerant.

[0093] The evaporation section structure (evaporation section structure 1) of the present invention can promote the phase change from liquid to gas phase of the refrigerant in which the heat source 100, which is the object to be cooled, and the vapor chamber 250 thermally connected to the heat source 100 are immersed.Therefore, the heat transport characteristics of the vapor chamber 250 immersed in the liquid phase refrigerant are improved, and as a result, the cooling characteristics for the heat source 100 are improved.

[0094] Next, another example of a method of using the evaporation portion structure according to another embodiment of the present invention will be described. Fig. 19 is a plan view illustrating an outline of another method of using the evaporation portion structure according to another embodiment of the present invention. Fig. 20 is a side view illustrating an outline of another method of using the evaporation portion structure according to another embodiment of the present invention.

[0095] 19 and 20, in the evaporation portion structure 7 according to the other embodiment of the present invention, a protrusion 74 is further provided on the peripheral portion of the first surface 11 of the base plate 10 in addition to the evaporation portion structure 1 according to the first embodiment.

[0096] The evaporation portion structure 7 is provided with protrusions 74 that protrude in the thickness direction (Z direction) of the base plate 10 around the entire periphery of the peripheral portion of the base plate 10. By providing the protrusions 74 on the peripheral portion on the first surface 11 of the base plate 10, it is possible to prevent a joining member 71 such as solder from penetrating into the metal mesh laminate member 20 via the base plate 10 when the evaporation portion structure 7 is thermally connected to the heat source 100. In other words, the protrusions 74 function as a joining member penetration prevention portion into the metal mesh laminate member 20.

[0097] 19 and 20 , in the evaporation section structure 7, as another method of using the evaporation section structure, a vapor chamber 250, which is a heat transfer member, is thermally connected to the second surface 12 of the base plate 10 instead of the heat source 100. The vapor chamber 250 is thermally connected to the heat source 100. The vapor chamber 250, which is thermally connected to the heat source 100, is thermally connected to the second surface 12 of the base plate 10 by a joining member 71 such as solder.

[0098] In Figures 19 and 20, for the sake of convenience of explanation, the evaporation section structure 7 has the vapor chamber 250 thermally connected to the base plate 10 by a joining member 71 such as solder, but instead of the vapor chamber 250, a thermally conductive plate such as a metal plate or other structure may be thermally connected to the base plate 10.

[0099] The vapor chamber 250, which is thermally connected to the heat source 100, is immersed in a liquid phase refrigerant (e.g., the primary refrigerant 201 of the cooling device 210) together with the heat source 100. Another method of using the evaporation structure is to thermally connect the evaporation structure 7 to the vapor chamber 250, which is immersed in this liquid phase refrigerant, while the evaporation structure 7 is immersed in the liquid phase refrigerant.

[0100] The evaporation section structure 7 can promote the phase change from liquid to gas phase of the refrigerant in which the heat source 100, which is the object to be cooled, and the vapor chamber 250 thermally connected to the heat source 100 are immersed. This improves the heat transport characteristics of the vapor chamber 250 immersed in the liquid phase refrigerant, and as a result, improves the cooling characteristics for the heat source 100.

[0101] In the first embodiment, the base plate 10 is a solid plate-like member. However, the base plate may be a hollow plate-like member and function as a vapor chamber. An example of such a base plate is shown in FIG. 21 . The base plate 10 shown in FIG. 21 includes a container 10-1 having a cavity 17 formed therein by stacking two opposing plates, namely, one plate 11-1 forming the first surface 11 and the other plate 12-1 opposing the one plate 11-1 and forming the second surface 12, and a working fluid (not shown) sealed in the cavity 17 and a vapor flow path 18 provided in the cavity 17 through which the gas-phase working fluid flows. The container 10-1 having the cavity 17 formed therein, the working fluid, and the vapor flow path 18 function as a vapor chamber, which is a planar heat pipe. At this time, the container 10-1 is a thin, plate-shaped container, and the cavity 17, which is an enclosed space, is decompressed by a degassing process.

[0102] When the base plate 10 is a vapor chamber in this way, the heat diffusion function can be improved. The plate-like bodies 11-1 and 12-1 that make up such a hollow base plate may be made of, for example, copper, aluminum, stainless steel, titanium, or an alloy thereof, and their inner surfaces (the portions indicated by dashed lines in the figure) may be provided with a capillary structure made of mesh or sintered metal.

[0103] Furthermore, the second to sixth embodiments can also employ a base plate that functions as a vapor chamber as described above. For example, as shown in FIG. 22 , the base plate 10 in the fourth embodiment can be changed to a vapor chamber. In the example shown in FIG. 22 , similar to the example shown in FIG. 21 , the base plate 10 serving as a vapor chamber includes a container 10-1 having a cavity 17 formed therein by stacking two opposing plates (one plate 11-1 and the other plate 12-1), and a working fluid (not shown) sealed in the cavity 17 and a vapor flow path 18 provided in the cavity 17 through which the gas-phase working fluid flows.

[0104] 21 and 22, the base plate 10 in the sixth embodiment may be changed to a vapor chamber. In the example shown in FIG. 23, similar to the examples shown in FIGS. 21 and 22, the base plate 10 serving as a vapor chamber includes a container 10-1 having a cavity 17 formed therein by stacking two opposing plate-like bodies (one plate-like body 11-1 and the other plate-like body 12-1), a working fluid (not shown) sealed in the cavity 17, and a vapor flow path 18 provided in the cavity 17 through which the gas-phase working fluid flows. In this case, the cavity 17 is formed to extend to the inside of the protrusion 15, and the inside of the protrusion 15 and the inside of the flat surface portion 16 are connected to each other.

[0105] Improving the thermal conductivity of the base plate can improve the performance of the evaporation section structure. While the above describes an example in which the base plate of each embodiment is replaced with a vapor chamber, the thermal conductivity of the base plate may be improved by adopting other configurations. For example, to improve the thermal conductivity of the base plate, a heat pipe may be installed in the base plate, or other components such as a graphite sheet or clad material may be combined with the base plate.

[0106] The evaporation section structure according to the seventh embodiment of the present invention will be described below with reference to the drawings. Fig. 24 is a side view illustrating the outline of the evaporation section structure according to the seventh embodiment of the present invention. Fig. 25 is a perspective view illustrating the outline of the evaporation section structure according to the seventh embodiment of the present invention. Fig. 26 is a plan view illustrating the outline of the evaporation section structure according to the seventh embodiment of the present invention.

[0107] As shown in Figures 24, 25, and 26, the evaporation section structure 1 according to the seventh embodiment of the present invention includes a vapor chamber 1010 having a first surface 1011 and a second surface 1012, and a boiling promotion section 1020 formed of a metal material and provided on the first surface 1011 and / or the second surface 1012 of the vapor chamber 1010, which is in contact with a liquid-phase refrigerant (not shown in Figures 24 to 26). A heat source 1100 immersed in the liquid-phase refrigerant is thermally connected to the first surface 1011 of the vapor chamber 1010. In the evaporation section structure 1001, the boiling promotion section 1020 is provided on the first surface 1011 and the second surface 1012 of the vapor chamber 1010. That is, in the evaporation section structure 1001, the boiling promotion section 1020 is thermally connected to the first surface 1011 and the second surface 1012 of the vapor chamber 1010.

[0108] In the vapor chamber 1010 of the evaporation section structure 1001, the first surface 1011 faces the second surface 1012, and the boiling promotion section 1020 is thermally connected to the second surface 1012. As described above, the boiling promotion section 1020 provided on the second surface 1012 is disposed opposite the heat source 1100 via the vapor chamber 1010. Furthermore, in the evaporation section structure 1001, the boiling promotion section 1020 is also provided on the first surface 1011 of the vapor chamber 1010. Therefore, the boiling promotion section 1020 is also thermally connected to the first surface 1011 of the vapor chamber 1010.

[0109] The vapor chamber 1010 includes a container 1010-1 having a cavity 1013 formed therein by stacking two opposing plate-like bodies, namely, one plate-like body 1011-1 forming a first surface 1011 and the other plate-like body 1012-1 opposing the one plate-like body 1011-1 and forming a second surface 1012, and a working fluid (not shown) sealed in the cavity 1013 and a vapor flow path 1015 provided in the cavity 1013 through which the gas-phase working fluid flows. The container 1010-1 having the cavity 1013 formed therein, the working fluid, and the vapor flow path 1015 form the vapor chamber 1010, which is a flat heat pipe. The container 1010-1 is a thin, plate-like container.

[0110] The first surface 1011 has a flat, planar portion 1032 and a convex portion 1031 that protrudes outward from the planar portion 1032. In the vapor chamber 1010, one convex portion 1031 is provided in the center of the first surface 1011. The side surface of the convex portion 1031 protrudes vertically from the planar portion 1032. On the other hand, the second surface 1012 does not have a convex portion, and the entire second surface 1012 is a flat, planar portion. Because the first surface 1011 has the planar portion 1032 and the convex portion 1031 that protrudes outward from the planar portion 1032, the container 1010-1 has a planar portion 1017 and a convex portion 1016 that protrudes outward from the planar portion 1017. Therefore, the vapor chamber 1010 has one convex portion 1016 provided in the center of the first surface 1011, and no convex portion provided on the second surface 1012. As described above, the flat surface 1017 and the convex portion 1016 of the container 1010-1 are integrally molded. In addition, the side surface of the convex portion 1016 protrudes vertically from the flat surface 1017.

[0111] The hollow portion 1013 is an enclosed space, and is decompressed by a degassing process. The internal space of the convex portion 1016 of the container 1010-1 is connected to the internal space of the flat portion 1017, and the internal space of the convex portion 1016 and the internal space of the flat portion 1017 form the hollow portion 1013 of the container 1010-1. Therefore, the working fluid can flow between the internal space of the convex portion 1016 and the internal space of the flat portion 1017.

[0112] The shape of container 1010-1 is not particularly limited, but in the vapor chamber 1010, examples include polygonal shapes such as a square, a circle, an ellipse, and shapes having straight and curved portions when viewed from a plane (viewed from a direction perpendicular to the plane portion 1017 of container 1010-1).

[0113] The convex portion 1016 provided on the first surface 1011 of the container 1010-1 is a portion to which the heat source 1100, which is the object to be cooled, is thermally connected, and functions as a heat receiving portion of the vapor chamber 1010. The heat source 1100 is thermally connected to the tip of the convex portion 1016. As described above, the convex portion 1016 has a heat receiving portion to which the heat source 1100 is thermally connected, and no boiling promotion portion 1020 is provided at the tip of the convex portion 1016 to which the heat source 1100 is thermally connected. The heat source 1100 may be, for example, an electronic component such as a central processing unit mounted on a wiring board (not shown).

[0114] On the other hand, a boiling promotion portion 1020 is provided over almost the entire outer surface of the flat portion 1017 provided on the first surface 1011 of the container 1010-1, and the boiling promotion portion 1020 is thermally connected to the first surface 1011 of the vapor chamber 1010.

[0115] The second surface 1012 of the vapor chamber 1010 is entirely flat, with no protruding portions. A boiling promotion portion 1020 is provided over substantially the entire outer surface of the second surface 1012, and the boiling promotion portion 1020 is thermally connected to the second surface 1012 of the vapor chamber 1010.

[0116] A wick structure (not shown) that generates capillary force is provided in the cavity 1013 of the container 1010-1. The wick structure is provided, for example, throughout the entire container 1010-1. Due to the capillary force of the wick structure, the working fluid that has undergone a phase change from gas to liquid in a portion of the vapor chamber 1010 other than the heat receiving portion (heat dissipation portion) returns from the heat dissipation portion of the vapor chamber 1010 to the heat receiving portion. The wick structure is not particularly limited, but examples thereof include a sintered body of metal powder such as copper powder, a metal mesh made of metal wire, a nonwoven fabric, grooves (multiple fine grooves) formed on the inner surface of the container 1010-1, and combinations thereof.

[0117] Furthermore, by providing a first wick structure having a large capillary force as a wick structure at the heat-receiving portion of the convex portion 1016 to which the heat source 1100 is connected, i.e., at the bottom of the convex portion 1016, it is possible to prevent dryout of the vapor chamber 1010. On the other hand, by providing a second wick structure having a smaller capillary force than the first wick structure as a wick structure at a portion other than the bottom of the convex portion 1016, for example, at the side of the convex portion 1016 of the container 1010-1 and the flat portion 1017 and side of the container 1010-1, it is possible to reduce the flow path resistance when the liquid-phase working fluid circulates.

[0118] The vapor flow path 1015 is an internal space of the container 1010-1 and extends throughout the container 1010-1. Therefore, the vapor-phase working fluid can circulate throughout the container 1010-1 via the vapor flow path 1015. Furthermore, the vapor flow path 1015 may be provided with pillars (columnar members) to maintain the internal space of the container 1010-1, as necessary. The pillars are not particularly limited, but examples thereof include composite pillars in which a wick structure is coated around a columnar metal member (e.g., a copper member), and columnar sintered bodies of metal powder such as copper powder, in order to reduce flow path resistance when the liquid-phase working fluid circulates.

[0119] Examples of materials for the container 1010-1 include stainless steel, copper, copper alloys, aluminum, aluminum alloys, tin, tin alloys, titanium, titanium alloys, nickel, and nickel alloys.

[0120] The working fluid to be sealed in the hollow portion 1013 can be selected appropriately depending on its compatibility with the material of the container 1010-1, and examples thereof include water, fluorocarbons, cyclopentane, ethylene glycol, and mixtures thereof.

[0121] The vapor chamber 1010 is a component that, using its heat transport function, diffuses the heat from the heat source 1100 thermally connected to the convex portion 1016 of the first surface 1011 throughout the vapor chamber 1010, and transfers the heat diffused throughout the vapor chamber 1010 to the boiling promotion portion 1020.

[0122] 24, 25, and 26, in the evaporation portion structure 1001 according to the seventh embodiment of the present invention, the boiling promotion portion 1020 is a metal powder sintered body layer 1021. Because the boiling promotion portion 1020 is a metal powder sintered body layer 1021, the boiling promotion portion 1020 provided on the first surface 1011 and the second surface 1012 of the vapor chamber 1010 has a structure having a plurality of narrow spaces, and the first surface 1011 and the second surface 1012 have a roughened surface portion. In the evaporation portion structure 1001, the metal powder sintered body layer 1021 functions as the plurality of narrow spaces and the roughened surface portion. The narrow spaces are relatively narrow spaces formed by two or more members that serve as starting points for nucleate boiling, and are open to the side where the refrigerant is present, allowing the refrigerant to enter.

[0123] In the evaporation portion structure 1001, the thickness of the metal powder sintered body layer 1021 can be appropriately selected depending on the conditions of use of the evaporation portion structure 1001 and the physical properties of the liquid-phase refrigerant in which the heat source 1100 is immersed. The thickness of the metal powder sintered body layer 1021 depends on the heat input conditions when the sintered body is formed, but is preferably 0.2 mm or more in order to reliably obtain a fine structure advantageous for generating boiling nuclei and to reliably facilitate the generation of boiling nuclei, and is preferably 0.8 mm or less in order to easily release the generated boiling nuclei from the boiling promotion portion 1020 and to reduce the flow path resistance of the liquid-phase refrigerant and facilitate the supply of the liquid-phase refrigerant to the lower part of the metal powder sintered body layer 1021.

[0124] The average particle size of the metal powder forming the sintered layer 1021 can be selected appropriately depending on the conditions of use of the evaporation section structure 1001 and the physical properties of the liquid-phase refrigerant in which the heat source 1100 is immersed. The average particle size of the metal powder forming the sintered layer 1021 depends on the heat input conditions during formation of the sintered body, but is preferably 20 μm or more in order to reliably obtain a fine structure advantageous for generating boiling nuclei, and is preferably 0.8 μm or less in order to reliably obtain a boiling promotion section 1020 having a large number of fine structures advantageous for generating boiling nuclei. The average particle size of the metal powder in the sintered layer 1021 is constant regardless of the distance from the vapor chamber 1010.

[0125] Examples of metal species for the metal powder include copper, copper alloys, aluminum, aluminum alloys, and stainless steel.

[0126] The sintered metal powder layer 1021 is sintered onto the outer surface of the container 1010-1 of the vapor chamber 1010, thereby being integrated with the vapor chamber 1010 and thermally connected to the outer surface of the vapor chamber 1010.

[0127] The metal powder sintered layer 1021 is formed by applying a paste containing metal powder to the first surface 1011 and the second surface 1012 of the vapor chamber 1010 and then heating it at a predetermined temperature, and the formed metal powder sintered layer 1021 is sintered to the first surface 1011 and the second surface 1012 of the vapor chamber 1010.

[0128] Next, an example of how to use the evaporation portion structure 1001 according to the seventh embodiment of the present invention will be described. Note that Fig. 27 is an explanatory diagram showing how to use the evaporation portion structure according to the seventh embodiment of the present invention.

[0129] As shown in Figure 27, a cooling device 1210 has a container 1200 to which a heat source 1100 is thermally connected, a liquid-phase primary refrigerant 1201 sealed and stored inside the container 1200, and a condenser pipe 1204 that penetrates a gas phase portion 1203 inside the container 1200 and through which a liquid-phase secondary refrigerant 1202 flows, and the cooling device 1210 has a heat source 1100 immersed in the liquid-phase primary refrigerant 1201 sealed inside the container 1200, and a secondary refrigerant cooling section 1221 to which the condenser pipe 1204 extending from the cooling device 1210 is connected, and the cooling system 1220 can be used in a cooling system 1220 in which the liquid-phase secondary refrigerant 1202 flowing through the condenser pipe 1204 circulates between the cooling device 1210 and the secondary refrigerant cooling section 1221. Specifically, one example of a usage method is to thermally connect the evaporation section structure 1001 relating to the seventh embodiment of the present invention to a heat source 1100 immersed in a liquid phase primary refrigerant 1201 while immersed in the liquid phase primary refrigerant 1201.

[0130] In the above-mentioned example of a method for using the evaporation section structure 1001, the evaporation section structure 1001 receives heat from the heat source 1100, and the liquid-phase primary refrigerant 1201 sealed and stored inside the container 1200 receives heat from the heat source 1100 from the evaporation section structure 1001, causing the liquid-phase primary refrigerant 1201 to change phase from liquid to gas at the contact point with the evaporation section structure 1001. More specifically, the heat received by the vapor chamber 1010 of the evaporation section structure 1001 from the heat source 1100 is diffused throughout the vapor chamber 1010 by the heat transport function of the vapor chamber 1010, and the heat diffused throughout the vapor chamber 1010 is transferred from the vapor chamber 1010 to the boiling promotion section 1020 (in the evaporation section structure 1001, the metal powder sintered layer 1021), and the heat transferred to the boiling promotion section 1020 is transferred from the boiling promotion section 1020 to the liquid phase primary refrigerant 1201 in contact with the boiling promotion section 1020, and the liquid phase primary refrigerant 1201 changes phase to gas phase at the contact point with the boiling promotion section 1020, and a large number of bubbles are formed in the primary refrigerant 1201. The liquid phase primary refrigerant 1201 changes phase to gas phase at the contact point with the boiling promotion section 1020, and bubbles of the primary refrigerant 1201 are formed, thereby cooling the heat source 1100 immersed in the liquid phase primary refrigerant 1201.

[0131] Bubbles of primary refrigerant 1201 generated at the contact portion with boiling promotion portion 1020 leave boiling promotion portion 1020 and head toward gas phase portion 1203 inside container 1200, and primary refrigerant 1201 changes phase from gas phase to liquid phase through condenser tube 1204, through which liquid phase secondary refrigerant 1202 flows, which penetrates gas phase portion 1203 inside container 1200. During this phase change, latent heat released from primary refrigerant 1201 is transferred to liquid phase secondary refrigerant 1202 flowing through condenser tube 1204.

[0132] The liquid-phase secondary refrigerant 1202 that has received latent heat from the primary refrigerant 1201 flows through the condenser pipe 1204 from the inside to the outside of the cooling device 1210, thereby transporting the latent heat to the outside of the cooling device 1210. The secondary refrigerant 1202 that has received the latent heat is cooled by a secondary refrigerant cooling unit 1221 provided outside the cooling device 1210. The primary refrigerant 1201 that has changed phase from gas phase to liquid phase by the condenser pipe 1204 through which the liquid-phase secondary refrigerant 1202 flows drips from the condenser pipe 1204 into the liquid-phase primary refrigerant 1201 stored inside the container 1200.

[0133] In one embodiment of the evaporation section structure 1001, there is provided a vapor chamber 1010 having a first surface 1011 to which a heat source 1100 immersed in a liquid phase refrigerant (e.g., a primary refrigerant 1201 of a cooling device 1210) is thermally connected, and a second surface 1012 opposite the first surface 1011, and a boiling promotion section 1020 which is a sintered layer 1021 of metal powder provided on the first surface 1011 and the second surface 1012 of the vapor chamber 1010 and which comes into contact with the liquid phase refrigerant.As a result, in the boiling promotion section 1020 which is the sintered layer 1021 of metal powder, there are numerous fine structures which are advantageous for generating boiling nuclei consisting of a gas phase refrigerant, facilitating the generation of boiling nuclei. Therefore, in the embodiment of the evaporation section structure 1, the phase change from liquid to gas phase of the refrigerant in which the heat source 1100 to be cooled is immersed can be promoted, and as a result, the cooling characteristics for the heat source 1100 immersed in the liquid phase refrigerant are improved.

[0134] Furthermore, in the embodiment of the evaporation section structure 1001, the boiling promotion section 1020, which is a sintered layer 1021 of metal powder, has a plurality of narrow spaces through which the refrigerant can penetrate, so that the plurality of narrow spaces reliably function as a fine structure that is advantageous for generating boiling nuclei, further facilitating the generation of boiling nuclei.

[0135] Furthermore, in the embodiment of the evaporation section structure 1001, the boiling promotion section 1020, which is a sintered layer 1021 of metal powder, has roughened sections in which the first surface 1011 and the second surface 1012 are roughened, so that the roughened sections function reliably as a fine structure that is advantageous for generating boiling nuclei, further facilitating the generation of boiling nuclei.

[0136] Furthermore, in the embodiment of the evaporation section structure 1001, the boiling promotion section 1020 is a sintered layer 1021 of metal powder, so that the sintered layer 1021 of metal powder reliably functions as a plurality of narrow spaces and roughened sections, further facilitating the generation of boiling nuclei.

[0137] Next, an evaporator structure according to an eighth embodiment of the present invention will be described with reference to the drawings. The evaporator structure according to the eighth embodiment shares major components with the evaporator structure according to the seventh embodiment, and therefore the same components as those in the evaporator structure according to the seventh embodiment will be described using the same reference numerals. Note that Fig. 28 is a side view illustrating the outline of the evaporator structure according to the eighth embodiment of the present invention.

[0138] In the evaporation portion structure 1001 according to the seventh embodiment, the boiling promotion portion 1020 is a sintered layer 1021 of metal powder. However, instead, as shown in Fig. 28, in the evaporation portion structure 1002 according to the eighth embodiment, the boiling promotion portion 1020 is a metal mesh 1022. Because the boiling promotion portion 1020 is the metal mesh 1022, the boiling promotion portion 1020 provided on the first surface 1011 and the second surface 1012 of the vapor chamber 1010 has a structure having a plurality of narrow spaces, and the first surface 1011 and the second surface 1012 have a structure having roughened surfaces. In the evaporation portion structure 1002, the metal mesh 1022 functions as the plurality of narrow spaces and the roughened surface.

[0139] In the evaporation portion structure 1002, the metal mesh 1022 is a single layer. The metal mesh 1022 has a longitudinal direction and a width direction. The shape of the metal mesh 1022 is not particularly limited, but in the evaporation portion structure 1002, it is a sheet-like member having a predetermined thickness and has a rectangular shape in a plan view.

[0140] The metal mesh 1022 is a screen mesh in which a plurality of first metal wires constituting the warp and a plurality of second metal wires constituting the weft alternately cross each other above and below. The wire diameter of the metal mesh 1022 is preferably, for example, 20 to 100 μm.

[0141] The thickness of the metal mesh 1022 is determined based on the number of mesh layers and the wire diameter of the metal wire. In the eighth embodiment, since the metal mesh 1022 is a single layer, the thickness of the metal mesh 1022 depends on the wire diameter of the metal wire.

[0142] The mesh number of the metal mesh 1022 can be appropriately selected depending on the conditions of use of the evaporation portion structure 1002 and the physical properties of the liquid-phase refrigerant in which the heat generation source 1100 is immersed, and is preferably #200 or less, for example, in order to reliably obtain a fine structure that is advantageous for generating boiling nuclei. On the other hand, the mesh number of the metal mesh 1022 is preferably #50 or more in order to reliably obtain a boiling promotion portion 1020 that has a large number of fine structures that are advantageous for generating boiling nuclei.

[0143] In the evaporation section structure 1002 , the metal mesh 1022 is sintered to be integrated with the vapor chamber 1010 and thermally connected to the vapor chamber 1010 .

[0144] The material of the metal mesh 1022 is not particularly limited, and examples thereof include copper, copper alloy, aluminum, aluminum alloy, nickel, nickel alloy, stainless steel, titanium, and titanium alloy.

[0145] Even in the form of the evaporation section structure 1002, there is provided a vapor chamber 1010 having a first surface 1011 to which a heat source 1100 immersed in a liquid phase refrigerant (e.g., a primary refrigerant 1201 of a cooling device 1210) is thermally connected, and a second surface 1012 opposite the first surface 1011, and a boiling promotion section 1020 which is a single-layer metal mesh 1022 provided on the first surface 1011 and the second surface 1012 of the vapor chamber 1010 and which comes into contact with the liquid phase refrigerant.As a result, the boiling promotion section 1020 which is the single-layer metal mesh 1022 has a large number of fine structures which are advantageous for generating boiling nuclei consisting of a gas phase refrigerant, facilitating the generation of boiling nuclei. Therefore, even in the form of the evaporation section structure 1002, the phase change from liquid to gas phase of the refrigerant in which the heat source 1100 to be cooled is immersed can be promoted, resulting in improved cooling characteristics for the heat source 1100 immersed in the liquid phase refrigerant.

[0146] Furthermore, in the embodiment of the evaporation section structure 1002, the boiling promotion section 1020, which is a single-layer metal mesh 1022, has multiple narrow spaces, so that the multiple narrow spaces function reliably as a fine structure that is advantageous for generating boiling nuclei, further facilitating the generation of boiling nuclei.

[0147] Furthermore, in the embodiment of the evaporation section structure 1002, the boiling promotion section 1020, which is a single-layer metal mesh 1022, has roughened sections in which the first surface 1011 and the second surface 1012 are roughened, so that the roughened sections function reliably as a fine structure that is advantageous for generating boiling nuclei, further facilitating the generation of boiling nuclei.

[0148] Furthermore, in the embodiment of the evaporation portion structure 1002, the boiling promotion portion 1020 is the metal mesh 1022, so the metal mesh 1022 reliably functions as a plurality of narrow spaces and roughened portions, further facilitating the generation of boiling nuclei.

[0149] Next, an evaporator structure according to a ninth embodiment of the present invention will be described with reference to the drawings. The evaporator structure according to the ninth embodiment shares major components with the evaporator structures according to the seventh and eighth embodiments, and therefore the same components as those of the evaporator structures according to the seventh and eighth embodiments will be described using the same reference numerals. Note that Fig. 29 is a side view illustrating the outline of the evaporator structure according to the ninth embodiment of the present invention.

[0150] In the evaporation portion structure 1002 according to the eighth embodiment, the boiling promotion portion 1020 was a single layer of metal mesh 1022. However, instead, as shown in Fig. 29, in the evaporation portion structure 1003 according to the ninth embodiment, the boiling promotion portion 1020 is formed of a metal mesh laminated member 1023 having multiple layers of metal mesh 1022. Because the boiling promotion portion 1020 is the metal mesh laminated member 1023, the boiling promotion portion 1020 provided on the first surface 1011 and the second surface 1012 of the vapor chamber 1010 has a structure having multiple narrow spaces, and the first surface 1011 and the second surface 1012 have a roughened surface. In the evaporation portion structure 1003, the metal mesh laminated member 1023 functions as the multiple narrow spaces and the roughened surface.

[0151] The metal mesh laminated member 1023 has a longitudinal direction and a width direction. The shape of the metal mesh laminated member 1023 is not particularly limited, but in the evaporation portion structure 1003, it is a sheet-like member having a predetermined thickness and has a rectangular shape in a plan view.

[0152] The metal mesh laminated member 1023 has a laminated structure in which a plurality of metal meshes 1022, 1022, 1022... are laminated in the thickness direction of the vapor chamber 1010. The metal mesh laminated member 1023 also has a structure in which a plurality of metal meshes 1022, 1022, 1022... are laminated in the thickness direction of the metal meshes 1022. The number of laminated metal meshes 1022 in the metal mesh laminated member 1023 is not particularly limited as long as it is two or more layers, and for convenience of explanation, the metal mesh laminated member 1023 of the evaporation portion structure 1003 has a laminated structure consisting of three layers of metal mesh 1022.

[0153] In the evaporation portion structure 1003, the metal mesh laminated member 1023 is sintered to be integrated with the vapor chamber 1010 and thermally connected to the vapor chamber 1010. In addition, in the evaporation portion structure 1003, the metal mesh laminated member 1023 is sintered to integrate the plurality of laminated metal meshes 1022, 1022, 1022, ....

[0154] In the evaporation portion structure 1003, the metal mesh laminated member 1023 is formed by laminating a plurality of metal meshes 1022, 1022, 1022.... That is, the plurality of separate metal meshes 1022, 1022, 1022... are sintered in a stacked state, and the stacked plurality of metal meshes 1022, 1022, 1022... are integrated. Furthermore, since the metal mesh laminated member 1023 is formed by closely stacking the plurality of metal meshes 1022, 1022, 1022... and integrating them, the metal mesh laminated member 1023 has excellent thermal conductivity even though it is formed by laminating a plurality of metal meshes 1022, 1022, 1022....

[0155] The number of meshes and wire diameter of each metal mesh 1022 constituting the metal mesh laminate member 1023 may be the same or different for each metal mesh 1022. In the evaporation portion structure 1003, the multiple metal meshes 1022, 1022, 1022... have the same number of meshes and wire diameter.

[0156] The thickness of the metal mesh laminated member 1023 is determined based on the number of mesh layers and the wire diameter of the metal wire, and can be appropriately selected depending on the conditions of use of the evaporation section structure 1003 and the physical properties of the liquid-phase refrigerant in which the heat source 1100 is immersed. For example, when the wire diameter is 20 to 100 μm, the number of mesh layers is preferably two or more to ensure a fine structure advantageous for the generation of boiling nuclei and ensure smooth generation of boiling nuclei. The number of mesh layers is preferably eight or less to facilitate the escape of generated boiling nuclei from the boiling promotion section 1020 and to reduce the flow resistance of the liquid-phase refrigerant and facilitate the supply of the liquid-phase refrigerant to the lower part of the metal mesh laminated member 1023 (i.e., the metal mesh 1022 located on the vapor chamber 1010 side). The number of meshes (number of wires per inch) in the metal mesh laminated member 1023 is preferably #50 to #200, as in the eighth embodiment.

[0157] Even in the form of the evaporation section structure 1003, there is provided a vapor chamber 1010 having a first surface 1011 to which a heat source 1100 immersed in a liquid phase refrigerant (e.g., a primary refrigerant 1201 of a cooling device 1210) is thermally connected, and a second surface 1012 opposite the first surface 1011, and a boiling promotion section 1020 which is a metal mesh laminated member 1023 provided on the first surface 1011 and the second surface 1012 of the vapor chamber 1010 and which comes into contact with the liquid phase refrigerant.As a result, the boiling promotion section 1020 which is the metal mesh laminated member 1023 has a large number of fine structures which are advantageous for generating boiling nuclei consisting of a gas phase refrigerant, facilitating the generation of boiling nuclei. Therefore, even in the form of the evaporation section structure 1003, the phase change from liquid to gas phase of the refrigerant in which the heat source 1100 to be cooled is immersed can be promoted, resulting in improved cooling characteristics for the heat source 1100 immersed in the liquid phase refrigerant.

[0158] Furthermore, in the embodiment of the evaporation section structure 1003, the metal mesh forms a metal mesh laminated member 1023 having multiple layers of metal mesh 1022, which makes the boiling promotion section 1020 thicker and allows it to function more reliably as a fine structure that is advantageous for generating boiling nuclei, thereby more reliably facilitating the generation of boiling nuclei.

[0159] Next, an evaporator structure according to a tenth embodiment of the present invention will be described with reference to the drawings. The evaporator structure according to the tenth embodiment shares major components with the evaporator structures according to the seventh to ninth embodiments, and therefore the same components as those in the evaporator structures according to the seventh to ninth embodiments will be described using the same reference numerals. FIG. 30 is a side view illustrating an overview of the evaporator structure according to the tenth embodiment of the present invention. FIG. 31 is an enlarged side view illustrating an overview of the boiling promotion section in the evaporator structure according to the tenth embodiment of the present invention.

[0160] In the evaporation portion structure 1001 according to the seventh embodiment, the average particle diameter of the metal powder in the sintered body layer 1021 of metal powder was constant regardless of the distance from the vapor chamber 1010. However, as shown in Figures 30 and 31, in the evaporation portion structure 1004 according to the tenth embodiment, the average particle diameter of the metal powder in the sintered body layer 1021 of metal powder becomes smaller the farther from the vapor chamber 1010. Because the boiling promotion portion 1020 is the sintered body layer 1021, the boiling promotion portion 1020 provided on the first surface 1011 and the second surface 1012 of the vapor chamber 1010 has a structure having a plurality of narrow spaces, and the first surface 1011 and the second surface 1012 have a structure having roughened surfaces. In the evaporation portion structure 1004, the sintered body layer 1021 functions as the plurality of narrow spaces and the roughened surface.

[0161] The sintered body layer 1021 has a first region 1021-1 located on the vapor chamber 1010 side and formed from a first metal powder, and a second region 1021-2 located further outward from the vapor chamber 1010 than the first region 1021-1 and formed from a second metal powder. For convenience, the first region 1021-1 and the second region 1021-2 are shown as clearly separated in Figures 30 and 31, but they do not need to be clearly separated as layers. Note that three or more regions formed from different metal powders may be provided.

[0162] In the evaporation portion structure 1004 , the sintered body layer 1021 is sintered to be integrated with the vapor chamber 1010 and thermally connected to the vapor chamber 1010 .

[0163] The average particle diameter of the first metal powder forming the first region 1021-1 and the average particle diameter of the second metal powder forming the second region 1021-2 may be the same or different. In the evaporation portion structure 1004, the average particle diameter of the first metal powder is smaller than the average particle diameter of the second metal powder, and in the sintered body layer 1021 of the metal powder, the average particle diameter of the metal powder becomes smaller the farther from the vapor chamber 1010.

[0164] The average particle size of the first metal powder forming the first region 1021-1 can be appropriately selected depending on the conditions of use of the evaporation portion structure 1004 and the physical properties of the liquid-phase refrigerant in which the heat generation source 1100 is immersed, and for example, the lower limit thereof is preferably 10 μm in order to reliably obtain a fine structure that is advantageous for generating boiling nuclei. On the other hand, the upper limit of the average particle size of the first metal powder forming the first region 1021-1 is preferably 200 μm in order to reliably obtain a boiling promotion portion 1020 that has a large number of fine structures that are advantageous for generating boiling nuclei.

[0165] The average particle size of the second metal powder forming the second region 1021-2 can be appropriately selected depending on the conditions of use of the evaporation portion structure 1004 and the physical properties of the liquid-phase refrigerant in which the heat generation source 1100 is immersed, and for example, the lower limit is preferably 100 μm, from the viewpoints that the generated boiling nuclei can easily escape from the boiling promotion portion 1020 and that the flow resistance of the liquid-phase refrigerant can be reduced, thereby facilitating the supply of the liquid-phase refrigerant to the lower part of the sintered body layer 1021 (i.e., the first region 1021-1). On the other hand, the upper limit of the average particle size of the second metal powder forming the second region 1021-2 is preferably 400 μm, from the viewpoint of obtaining a boiling promotion portion 1020 having a large number of fine structures that are advantageous for generating boiling nuclei.

[0166] The thickness of the sintered body layer 1021 can be appropriately selected depending on the conditions of use of the evaporation section structure 1004 and the physical properties of the liquid-phase refrigerant in which the heat source 1100 is immersed. For example, the lower limit is preferably 0.2 mm, from the viewpoint of reliably obtaining a fine structure advantageous for the generation of boiling nuclei and reliably facilitating the generation of boiling nuclei. On the other hand, the upper limit of the thickness of the sintered body layer 1021 is preferably 0.8 mm, from the viewpoints of easily releasing the generated boiling nuclei from the boiling promotion section 1020 and reducing the flow resistance of the liquid-phase refrigerant, thereby facilitating the supply of the liquid-phase refrigerant to the lower part of the sintered body layer 1021 of the metal powder. The thickness of the sintered body layer 1021 may also be determined according to the particle diameter of the metal powder.

[0167] Even in the form of evaporation section structure 1004, there is provided a vapor chamber 1010 having a first surface 1011 to which a heat source 1100 immersed in a liquid phase refrigerant (e.g., primary refrigerant 1201 of cooling device 1210) is thermally connected, and a second surface 1012 opposite the first surface 1011, and a boiling promotion section 1020 which is a sintered layer 1021 of metal powder provided on the first surface 1011 and the second surface 1012 of the vapor chamber 1010 and comes into contact with the liquid phase refrigerant.As a result, in the boiling promotion section 1020 which is the sintered layer 1021 of metal powder, there are many fine structures which are advantageous for generating boiling nuclei consisting of gas phase refrigerant, facilitating the generation of boiling nuclei. Therefore, even in the form of the evaporation section structure 1004, the phase change from liquid to gas phase of the refrigerant in which the heat source 1100 to be cooled is immersed can be promoted, resulting in improved cooling characteristics for the heat source 1100 immersed in the liquid phase refrigerant.

[0168] Furthermore, in the form of the evaporation section structure 1004, a sintered layer 1021 is formed having multiple regions formed from different metal powders, which makes the boiling promotion section 1020 thicker and allows it to function more reliably as a fine structure that is advantageous for generating boiling nuclei, thereby more reliably facilitating the generation of boiling nuclei.

[0169] In addition, in the embodiment of the evaporation section structure 1004, the metal powder sintered body layer 1021 has a first region 1021-1 located on the vapor chamber 1010 side and formed from a first metal powder, and a second region 1021-2 located outward of the vapor chamber 1010 from the first region 1021-1 and formed from a second metal powder, where the average particle diameter of the first metal powder is smaller than the average particle diameter of the second metal powder, and the average particle diameter of the metal powder becomes smaller the further away from the vapor chamber 1010 in the metal powder sintered body layer 1021. Therefore, the first region 1021-1 functions more reliably as a fine structure advantageous for generating boiling nuclei. Furthermore, the second region 1021-2 contributes to the generation of boiling nuclei while having a structure that makes it easy for the generated boiling nuclei to escape from the boiling promotion section 1020, and reduces the flow resistance of the liquid phase refrigerant, thereby facilitating the supply of the liquid phase refrigerant to the first region 1021-1. From the above, the configuration of the evaporation section structure 1004 can further facilitate the generation of boiling nuclei and further promote the phase change from liquid to gas phase of the refrigerant in contact with the boiling promotion section 1020.

[0170] Next, an evaporator structure according to an eleventh embodiment of the present invention will be described with reference to the drawings. The evaporator structure according to the eleventh embodiment shares major components with the evaporator structures according to the seventh to tenth embodiments, and therefore the same components as those in the evaporator structures according to the seventh to tenth embodiments will be described using the same reference numerals. Note that FIG. 32 is a side view illustrating the outline of the evaporator structure according to the eleventh embodiment of the present invention.

[0171] In the evaporation portion structure 1003 according to the eleventh embodiment, the plurality of metal meshes 1022, 1022, 1022... constituting the metal mesh laminate member 1023 all have the same number of meshes. However, as shown in FIG. 32 , in the evaporation portion structure 1005 according to the eleventh embodiment, the plurality of metal meshes 1022, 1022, 1022... constituting the metal mesh laminate member 1025 that is the boiling promotion portion 1020 have different numbers of meshes. Because the boiling promotion portion 1020 is the metal mesh laminate member 1025, the boiling promotion portion 1020 provided on the first surface 1011 and the second surface 1012 of the vapor chamber 1010 has a structure having a plurality of narrow spaces, and the first surface 1011 and the second surface 1012 have a roughened portion. In the evaporation portion structure 1005, the metal mesh laminate member 1025 functions as the plurality of narrow spaces and the roughened portion.

[0172] In the evaporation section structure 1005, the metal mesh laminate member 1025 has a first metal mesh 1022-1 located on the vapor chamber 1010 side and in contact with the vapor chamber 1010, and a second metal mesh 1022-2 located further outward from the vapor chamber 1010 than the first metal mesh 1022-1 and forming the outermost layer of the boiling promotion section 1020, and the number of meshes in the first metal mesh 1022-1 is greater than the number of meshes in the second metal mesh 1022-2 (i.e., the mesh opening of the first metal mesh 1022-1 is smaller than the mesh opening of the second metal mesh 1022-2). In addition, in the evaporation section structure 1005, the number of meshes of the metal mesh 1022 located between the first metal mesh 1022-1 and the second metal mesh 1022-2 is less than the number of meshes of the first metal mesh 1022-1 and more than the number of meshes of the second metal mesh 1022-2.

[0173] The mesh number of the first metal mesh 1022-1 can be appropriately selected depending on the conditions of use of the evaporation portion structure 1005 and the physical properties of the liquid-phase refrigerant in which the heat generation source 1100 is immersed, and is preferably #200 or less, for example, in order to reliably obtain a fine structure that is advantageous for generating boiling nuclei. On the other hand, the mesh number of the first metal mesh 1022-1 is preferably #50 or more in order to reliably obtain a boiling promotion portion 1020 that has a large number of fine structures that are advantageous for generating boiling nuclei.

[0174] The mesh number of the second metal mesh 1022-2 can be appropriately selected depending on the conditions of use of the evaporation section structure 1005 and the physical properties of the liquid-phase refrigerant in which the heat generation source 1100 is immersed, and is preferably #200 or less, for example, so that the generated boiling nuclei can easily escape from the boiling promotion section 1020 and the flow resistance of the liquid-phase refrigerant can be reduced, facilitating the supply of the liquid-phase refrigerant to the lower part of the metal mesh laminate member 1025 (i.e., the first metal mesh 1022-1). On the other hand, the mesh number of the second metal mesh 1022-2 is preferably #50 or more, so that the boiling promotion section 1020 has a large number of fine structures that are advantageous for generating boiling nuclei.

[0175] The thickness of the metal mesh laminate member 1025 is determined based on the number of mesh layers and the wire diameter of the metal wire, and can be appropriately selected depending on the conditions of use of the evaporation portion structure 1005 and the physical properties of the liquid-phase refrigerant in which the heat source 1100 is immersed. For example, when the wire diameter is 20 to 100 μm, the number of mesh layers is preferably two or more in order to ensure a fine structure advantageous for the generation of boiling nuclei and to ensure smooth generation of boiling nuclei. On the other hand, when the wire diameter is 20 to 100 μm, the number of mesh layers is preferably eight or less in order to facilitate the release of generated boiling nuclei from the boiling promotion portion 1020 and to reduce the flow resistance of the liquid-phase refrigerant and smooth the supply of the liquid-phase refrigerant to the lower part of the metal mesh laminate member 1025 (i.e., the first metal mesh 1022-1).

[0176] Even in the form of the evaporation section structure 1005, there is provided a vapor chamber 1010 having a first surface 1011 to which a heat source 1100 immersed in a liquid phase refrigerant (e.g., a primary refrigerant 1201 of a cooling device 1210) is thermally connected, and a second surface 1012 opposite the first surface 1011, and a boiling promotion section 1020 which is a metal mesh laminated member 1025 provided on the first surface 1011 and the second surface 1012 of the vapor chamber 1010 and comes into contact with the liquid phase refrigerant.As a result, the boiling promotion section 1020 which is the metal mesh laminated member 1025 has a large number of fine structures which are advantageous for generating boiling nuclei consisting of a gas phase refrigerant, facilitating the generation of boiling nuclei. Therefore, even in the form of the evaporation section structure 1005, the phase change from liquid to gas phase of the refrigerant in which the heat source 1100 to be cooled is immersed can be promoted, resulting in improved cooling characteristics for the heat source 1100 immersed in the liquid phase refrigerant.

[0177] In addition, in the embodiment of the evaporation portion structure 1005, the metal mesh laminate member 1025 has a first metal mesh 1022-1 located on the vapor chamber 1010 side and a second metal mesh 1022-2 located outward of the vapor chamber 1010 from the first metal mesh 1022-1, and since the number of meshes in the first metal mesh 1022-1 is greater than the number of meshes in the second metal mesh 1022-2, the first metal mesh 1022-1 has a finer structure than the second metal mesh 1022-2. Therefore, the first metal mesh 1022-1 functions more reliably as a fine structure advantageous for generating boiling nuclei. Furthermore, the second metal mesh 1022-2 contributes to the generation of boiling nuclei, has a structure that allows the generated boiling nuclei to easily escape from the boiling promotion portion 1020, and reduces the flow path resistance of the liquid phase refrigerant, thereby facilitating the supply of the liquid phase refrigerant to the first metal mesh 1022-1. From the above, the aspect of the evaporation portion structure 1005 can further facilitate the generation of boiling nuclei and further accelerate the phase change from liquid phase to gas phase of the refrigerant in contact with the boiling promotion portion 1020.

[0178] Next, an evaporator structure according to a twelfth embodiment of the present invention will be described with reference to the drawings. The evaporator structure according to the twelfth embodiment shares major components with the evaporator structures according to the seventh to eleventh embodiments, and therefore the same components as those in the evaporator structures according to the seventh to eleventh embodiments will be described using the same reference numerals. Note that FIG. 33 is a side view illustrating the outline of the evaporator structure according to the twelfth embodiment of the present invention.

[0179] In the evaporation portion structures according to the seventh to eleventh embodiments, the boiling promotion portion 1020 is composed of a sintered layer 1021 of metal powder or a metal mesh 1022. However, as shown in FIG. 33 , in the evaporation portion structure 1006 according to the twelfth embodiment, the boiling promotion portion 1020 has a structure including a plurality of protrusions 1026, 1026, 1026.... Since the boiling promotion portion 1020 has a plurality of protrusions 1026, 1026, 1026..., the boiling promotion portion 1020 provided on the first surface 1011 and the second surface 1012 of the vapor chamber 1010 has a structure including a plurality of narrow spaces, and the first surface 1011 and the second surface 1012 have a structure including roughened surfaces. In the evaporation portion structure 1006, the gaps between the plurality of protrusions 1026, 1026, 1026... function as the plurality of narrow spaces and the roughened surfaces.

[0180] The shape of the protrusion 1026 is not particularly limited as long as it protrudes from a plane, but examples thereof include a columnar shape such as a cylindrical or regular polygonal prism, or an upright plate shape (a shape extending in one direction perpendicular to the protruding direction). The protrusion 1026 may also protrude perpendicular to a reference plane, or the protruding direction may vary slightly. Thus, the protrusion 1026 also includes a Skype fin in which a plate-like portion protrudes while curving. It is also possible to form multiple grooves on a predetermined plane, and define the portions between adjacent grooves as protrusions.

[0181] Furthermore, in the evaporation portion structure 1006, the surface of the convex portion 1026 further has a roughened portion 1027. The roughened portion 1027 may be, for example, a sintered body of metal powder. That is, an embodiment of the boiling promotion portion 1020 is one in which the surfaces of the plurality of convex portions 1026, 1026, 1026, ... are coated with a sintered body of metal powder.

[0182] Even in the form of evaporation section structure 1006, there is provided a vapor chamber 1010 having a first surface 1011 to which a heat source 1100 immersed in a liquid phase refrigerant (e.g., primary refrigerant 1201 of cooling device 1210) is thermally connected, and a second surface 1012 opposite to the first surface 1011, and a boiling promotion section 1020 consisting of a plurality of convex portions 1026, 1026, 1026... provided on the first surface 1011 and the second surface 1012 of the vapor chamber 1010 and in contact with the liquid phase refrigerant.By this, in the boiling promotion section 1020 consisting of the plurality of convex portions 1026, 1026, 1026..., there are many fine structures that are advantageous for generating boiling nuclei consisting of gas phase refrigerant, facilitating the generation of boiling nuclei. Therefore, even in the form of the evaporation section structure 1006, the phase change from liquid to gas phase of the refrigerant in which the heat source 1100 to be cooled is immersed can be promoted, resulting in improved cooling characteristics for the heat source 1100 immersed in the liquid phase refrigerant.

[0183] Furthermore, in the embodiment of the evaporation section structure 1006, the boiling promotion section 1020 has a plurality of protrusions 1026, 1026, 1026..., so that the gaps between the plurality of protrusions 1026, 1026, 1026... function reliably as a fine structure that is advantageous for generating boiling nuclei, thereby further facilitating the generation of boiling nuclei.

[0184] Furthermore, in the embodiment of the evaporation portion structure 1006, the surface of the convex portion 1026 further has a roughened portion 1027, so that not only the gaps between the multiple convex portions 1026, 1026, 1026, ... but also the roughened portion 1027 reliably function as a fine structure that is advantageous for generating boiling nuclei, thereby further facilitating the generation of boiling nuclei.

[0185] Next, other embodiments of the evaporation section structure of the present invention will be described. In the evaporation section structures according to the above-described embodiments, the boiling promotion section 1020 is provided on the first surface 1011 and the second surface 1012 of the vapor chamber 1010. However, instead, the boiling promotion section 1020 may be provided on the first surface 1011 or the second surface 1012 of the vapor chamber 1010.

[0186] Furthermore, in the evaporation portion structures according to the seventh to twelfth embodiments, one heat source 1100 is thermally connected to one evaporation portion structure 1001, but multiple heat sources may be thermally connected to one evaporation structure. In this case, the multiple heat sources may be thermally connected to one surface of the vapor chamber, or may be thermally connected to different surfaces. Furthermore, when a heat source is thermally connected to each of a pair of opposing surfaces of the vapor chamber, if one of the pair of surfaces is designated as a first surface, the other is designated as a second surface.

[0187] In addition, in the evaporation portion structures according to the seventh to twelfth embodiments, the convex portion 1016 is provided on the first surface 1011 to which the heat source 1100 is thermally connected, but the convex portion may be provided on both the first surface and the second surface, or the convex portion may be provided only on the second surface, or the convex portion may not be provided on either the first surface or the second surface. Figure 24 illustrates a structure in which the convex portion 1018 is provided only on the second surface 1012 as another embodiment of the evaporation portion structure of the present invention.

[0188] 24, no protrusions are formed on the first surface 1011, and the entire first surface 1011 is a flat surface 1017, with the heat source 1100 contacting and thermally connected to the flat surface 1017. A plurality of protrusions 1018 (three in the illustrated example) are formed on the second surface 1012. Unlike the protrusions 1016 in the seventh to twelfth embodiments, these protrusions 1018 do not contact the heat source 1100. Furthermore, the internal space of the protrusions 1018 constitutes a part of the vapor flow path 1015 through which the gas-phase working fluid flows, allowing the working fluid to flow.

[0189] 24 , the first surface 1011 is not provided with a boiling promotion portion 1020, and the second surface 1012 is provided with a boiling promotion portion 1020 covering the protrusions 1018. As described above, the protrusions 1018 allow the working fluid to flow therethrough. Even when protrusions are formed on the boiling promotion portion 1020 (e.g., the twelfth embodiment), the protrusions 1018 are clearly distinguishable from the protrusions of the boiling promotion portion 1020. By providing the protrusions 1018 on the second surface 1012 in this manner, the surface area of ​​the second surface 1012 can be increased, thereby increasing the area of ​​the region where the boiling promotion portion 1020 is provided, thereby improving the cooling characteristics for the heat source 1100. Furthermore, since the working fluid can flow through the protrusions 1018, the heat transfer efficiency between the working fluid and the boiling promotion portion 1020 in the protrusions 1018 is improved.

[0190] The evaporation section structure of the present invention can promote the phase change from liquid to gas phase of the refrigerant in which the heat source to be cooled is immersed, and is therefore particularly useful in fields where the heat generation of heat-generating elements such as electronic components used in data centers is increasing.

[0191] 1, 2, 3, 4 Evaporation section structure 10 Base plate 11 First surface 12 Second surface 20, 30 Metal mesh laminated member 21, 31 Metal mesh 22 Metal wire 23 Flat section

Claims

1. An evaporation section structure comprising: a base plate having a first surface and a second surface, the second surface being thermally connected to a heat source immersed in a liquid-phase refrigerant; and a metal mesh laminate member having multiple layers of metal mesh thermally connected to the first surface and / or the second surface of the base plate, wherein the metal wires constituting the metal mesh have flat portions.

2. The evaporation section structure according to claim 1, wherein the flat portion of the metal wire is a pressure-welded portion of a plurality of layers of the metal mesh.

3. The evaporation section structure described in claim 1 or 2, wherein the metal mesh is a screen mesh in which a plurality of first metal wires constituting the warp and a plurality of second metal wires constituting the weft alternately cross one above the other, and the plurality of first metal wires and the plurality of second metal wires have the flat portion.

4. The evaporation section structure according to claim 1 or 2, wherein the metal mesh laminated member is sintered and thermally connected to the base plate.

5. An evaporation section structure as described in claim 1 or 2, wherein the first surface faces the second surface, and a metal mesh laminate member is thermally connected to the first surface.

6. An evaporation section structure according to claim 1 or 2, wherein the metal mesh laminated member is formed by laminating a plurality of the metal meshes.

7. An evaporation section structure as described in claim 1 or 2, wherein the number of meshes of the metal mesh constituting the metal mesh laminated member is 200 meshes / 2.54 cm or more.

8. An evaporation section structure according to claim 1 or 2, wherein the number of meshes of the metal mesh constituting the metal mesh laminated member is 300 meshes / 2.54 cm or more.

9. The evaporation section structure according to claim 1 or 2, wherein the metal mesh laminate member is formed of 2 to 10 layers of the metal mesh.

10. An evaporation section structure as described in claim 1 or 2, wherein one or more of the metal mesh laminated members are provided along the extending direction of the first surface.

11. The evaporation section structure according to claim 1 or 2, wherein one or more of the metal mesh laminated members are provided along the extending direction of the second surface.

12. An evaporation section structure as described in claim 1 or 2, wherein the base plate is a vapor chamber having a container having a hollow portion formed therein, a working fluid sealed in the hollow portion, and a vapor flow path provided in the hollow portion through which the gas-phase working fluid flows.

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