Machining parameter testing method and apparatus, electronic device, and storage medium

By using processing parameter detection methods and devices in the manufacturing process of semiconductor components, the predicted processing marks and the qualified parameters are determined, and the scrapping of parts to be processed due to inappropriate processing parameters is solved, and higher processing efficiency and accuracy are achieved.

WO2025130717A1PCT designated stage expired Publication Date: 2025-06-26SHENZHEN MEGAROBO TECH CO LTD

Patent Information

Application Number
PCT/CN2024/138409
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-12-18
Filing Date
2024-12-11
Publication Date
2025-06-26

AI Technical Summary

Technical Problem

During the manufacturing process of semiconductor components, if the processing parameters are inappropriate, the equipment may not be aligned with the predetermined processing lines, resulting in the scrapping of the parts to be processed.

Method used

A processing parameter detection method and device are provided, by obtaining the image to be tested, determining the target feature point, determining the predicted processing mark based on the position information and preset parameters, and determining whether the preset parameters are qualified based on the position detection information.

Benefits of technology

Effectively avoid processing errors, prevent damage to the parts to be processed, improve processing efficiency, and ensure the accuracy of processing parameters.

✦ Generated by Eureka AI based on patent content.

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Abstract

Embodiments of the present application provide a machining parameter testing method and apparatus, an electronic device, and a storage medium. The method is applied to a machining device. The method comprises: obtaining a first image to be tested, the first image to be tested comprising a workpiece to be machined; determining that a first target feature point in said first image is at a first image position in said first image; on the basis of first position information and a preset machining parameter, determining at least one predicted machining identifier, the at least one predicted machining identifier comprising at least one predicted machining line and / or at least one first predicted feature point, and the preset machining parameter comprising a preset spacing between any two adjacent predetermined machining lines among at least two predetermined machining lines; and, on the basis of position testing information related to the at least one predicted machining identifier, determining whether the preset machining parameter meets standards. Said solution can avoid situations such as empty splitting or missed splitting during machining, thereby improving machining efficiency.
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Description

Processing parameter detection method and device, electronic device and storage medium

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 18, 2023, with application number 202311748588.4 and invention name “Processing parameter detection method and device, electronic device and storage medium”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of image processing technology, and more specifically to a processing parameter detection method, a processing parameter detection device, an electronic device, and a storage medium. Background Art

[0003] In the semiconductor industry, the manufacture of semiconductor components involves many processes. For example, if the workpiece is a wafer, the wafer manufacturing process involves multiple processes, including wafer cutting and subsequent chip splitting. Chipping is primarily accomplished by using a splitter (also known as a chip splitter) to split the wafer along the cutting path, separating the chip from the entire wafer. As the splitter acts on the wafer surface, a hammer strikes the back of the splitter. The combined action of the splitter, hammer, and splitting platform causes the wafer to break along the cleavage line, separating the chip from the wafer.

[0004] When processing a workpiece, improperly set processing parameters can cause the processing equipment to lose alignment with the intended processing line, resulting in the workpiece being scrapped. Taking wafers as an example, during the wafer splitting process, the splitter directly impacts the wafer surface. Therefore, if the splitter is not positioned on the wafer's dicing path, the chip may be damaged, resulting in the wafer being scrapped. Summary of the Invention

[0005] In view of the above problems, the present application is proposed. The present application provides a processing parameter detection method, a processing parameter detection device, an electronic device and a storage medium.

[0006] In a first aspect of the present application, a processing parameter detection method is provided, which can be applied to processing equipment, the method comprising: acquiring a first image to be measured, the first image to be measured containing a workpiece to be processed; determining a first image position of a first target feature point in the first image to be measured in the first image to be measured, wherein the workpiece to be processed includes at least two predetermined processing lines, and the first target feature point is a feature point on any predetermined processing line; determining at least one predicted processing mark based on first position information and preset processing parameters, wherein the first position information is a first image position or a first physical position of the first target feature point determined based on the first image position, the at least one predicted processing mark includes at least one predicted processing line and / or at least one first predicted feature point, and the preset processing parameters include a preset spacing between any two adjacent predetermined processing lines of the at least two predetermined processing lines; and determining whether the preset processing parameters are qualified based on position detection information associated with the at least one predicted processing mark, wherein the position detection information is used to indicate whether the position of the at least one predicted processing mark matches the position of the predetermined processing mark, and the predetermined processing mark includes at least one predetermined processing line and / or at least one feature point on the predetermined processing line.

[0007] In an optional implementation, the processing equipment includes a first image acquisition device and a second image acquisition device, the image acquisition range of the first image acquisition device is larger than the image acquisition range of the second image acquisition device, wherein the first image to be measured is the image acquired by the second image acquisition device; when at least one predicted processing identifier includes at least one predicted processing line, determining at least one predicted processing identifier based on the first position information and preset processing parameters, including: identifying the contour of the workpiece to be processed from the second image to be measured acquired by the first image acquisition device; determining at least one predicted line segment along the target direction based on the first position information and the preset processing parameters and the contour of the workpiece to be processed; wherein the at least one predicted processing line includes at least one predicted line segment, one of the at least one predicted line segments passes through the first target feature point, the distance between any two predicted line segments is equal to the preset spacing of the predetermined processing line in the direction perpendicular to the target direction, and the two endpoints of each predicted line segment are located within the contour of the workpiece to be processed.

[0008] In an optional implementation, at least one predicted line segment is determined along the target direction based on the first position information, preset processing parameters, and the contour of the workpiece to be processed, including: based on the first position information, making a target straight line along the target direction through the starting feature point until the target straight line and the contour of the workpiece to be processed have an intersection, wherein the starting feature point is the first target feature point or the second target feature point closest to the product center of the workpiece to be processed determined based on the first target feature point; translating the starting feature point in a direction perpendicular to the target direction by an integer multiple of a preset spacing to obtain one or more new feature points, and making a target straight line along the target direction through each new feature point until the target straight line and the contour of the workpiece to be processed have an intersection; or, translating the target straight line through the starting feature point in a direction perpendicular to the target direction by an integer multiple of a preset spacing to obtain one or more new target straight lines, wherein the portion of the target straight line located within the contour of the workpiece to be processed is a predicted line segment passing through the corresponding feature point.

[0009] In an optional implementation, after determining at least one predicted line segment along the target direction based on the first position information, preset processing parameters and the contour of the workpiece to be processed, the method further includes: displaying a third image to be measured with at least one predicted line segment, the third image to be measured being at least a portion of the image captured by the first image acquisition device; determining whether the preset processing parameters are qualified based on position detection information related to at least one predicted processing mark, including: determining that the preset processing parameters are qualified in response to qualified indication information input by the user; and / or determining that the preset processing parameters are unqualified in response to unqualified indication information input by the user; wherein the position detection information includes qualified indication information and / or unqualified indication information, the qualified indication information is used to indicate that the position of at least one predicted processing mark matches the position of the predetermined processing mark, and the unqualified indication information is used to indicate that the position of at least one predicted processing mark does not match the position of the predetermined processing mark.

[0010] In an optional implementation, when at least one predicted processing mark includes at least one first predicted feature point, at least one predicted processing mark is determined based on the first position information and preset processing parameters, including: based on the first position information and the preset processing parameters, determining a physical position whose distance from the first physical position or the second physical position determined based on the first position information meets a preset distance condition as the third physical position of the first predicted feature point; wherein the second physical position is the physical position corresponding to the second target feature point closest to the product center of the workpiece to be processed, the distance condition includes a first spacing in the second direction equal to a first number and a second spacing in the first direction equal to a second number, the first direction and the second direction are perpendicular to each other, and the preset spacing includes the first spacing and / or the second spacing.

[0011] In an optional implementation, the processing equipment includes a second image acquisition device, and the first image to be tested is an image acquired by the second image acquisition device; based on position detection information related to at least one predicted processing mark, determining whether the preset processing parameters are qualified includes: moving the center of the field of view of the second image acquisition device to a third physical position; obtaining a fourth image to be tested acquired by the second image acquisition device after the movement; identifying a third target feature point from the fourth image to be tested; determining the image position difference between the image positions of the third target feature point and the center of the field of view of the second image acquisition device in the fourth image to be tested, or the physical position difference between the corresponding physical positions; and judging whether the image position difference is less than or equal to a first preset error threshold. Or whether the physical position difference is less than or equal to the second preset error threshold to obtain a position judgment result, the position detection information includes the position judgment result; when the position judgment result indicates that the position of the predicted processing mark matches the position of the predetermined processing mark, it is determined that the preset processing parameters are qualified, otherwise it is determined that the preset processing parameters are unqualified; wherein, when the image position difference is less than or equal to the first preset error threshold or the physical position difference is less than or equal to the second preset error threshold, the position judgment result indicates that the position of the predicted processing mark matches the position of the predetermined processing mark; when the image position difference is greater than the first preset error threshold or the physical position difference is greater than the second preset error threshold, the position judgment result indicates that the position of the predicted processing mark does not match the position of the predetermined processing mark.

[0012] In an optional implementation, before moving the field of view center of the second image acquisition device to the third physical position, the method further includes: moving the field of view center of the second image acquisition device to the first physical position or the second physical position based on the first position information; moving the field of view center of the second image acquisition device to the third physical position includes: moving the field of view center of the second image acquisition device by a distance specified by a preset distance condition so that the field of view center of the second image acquisition device moves to the third physical position.

[0013] In an optional implementation, before determining the first image position of the first target feature point in the first image to be tested, the method also includes: performing feature point matching in the first image to be tested using a first template image containing template feature points; determining the feature points identified from the first image to be tested and matching the template feature points as the first target feature points; identifying the third target feature points from the fourth image to be tested, including: performing feature point matching in the fourth image to be tested using the first template image; and determining the feature points identified from the fourth image to be tested and matching the template feature points as the third target feature points.

[0014] In an optional implementation, the processing equipment includes a second image acquisition device, and the first image to be measured is an image acquired by the second image acquisition device; before determining the first image position of the first target feature point in the first image to be measured in the first image to be measured, the method further includes: a first operation; or, the first operation and a second operation performed after the first operation; or, the first operation, the second operation, and a third operation performed after the second operation; wherein the first operation includes: identifying a fourth target feature point from a fifth image to be measured acquired by the second image acquisition device; the second operation includes: correcting the target predetermined processing line where the fourth target feature point is located according to the first direction; after the correction is completed, moving the field of view center of the second image acquisition device to the physical position corresponding to when the second image acquisition device acquires the fifth image to be measured; obtaining a sixth image to be measured acquired after the second image acquisition device is moved; and obtaining a sixth image to be measured from the sixth image to be measured. Identify a fifth target feature point in the image; the third operation includes: determining a fourth physical position corresponding to a second target feature point closest to the product center of the workpiece to be processed based on the image position of the fifth target feature point in the sixth image to be tested; moving the field of view center of the second image acquisition device to the fourth physical position; acquiring a seventh image to be tested acquired after the second image acquisition device is moved; identifying a sixth target feature point from the seventh image to be tested; wherein, when the method includes the first operation but does not include the second operation, the fifth image to be tested is the first image to be tested, and the fourth target feature point is the first target feature point; when the method includes the first operation and the second operation but does not include the third operation, the sixth image to be tested is the first image to be tested, and the fifth target feature point is the first target feature point; when the method includes the first operation, the second operation and the third operation, the seventh image to be tested is the first image to be tested, and the sixth target feature point is the first target feature point.

[0015] In an optional implementation, the processing equipment further includes a first image acquisition device, and the image acquisition range of the first image acquisition device is larger than the image acquisition range of the second image acquisition device, wherein, before identifying the fourth target feature point from the fifth image to be measured acquired by the second image acquisition device, the method further includes: identifying the contour of the workpiece to be processed from the eighth image to be measured acquired by the first image acquisition device, wherein, when the first image acquisition device acquires the eighth image to be measured, the center of the field of view of the first image acquisition device coincides with the center of the carrying device for carrying the workpiece to be processed; determining the second image position of the product center of the workpiece to be processed in the eighth image to be measured based on the contour of the workpiece to be processed; and determining the second image position of the product center of the workpiece to be processed in the eighth image to be measured based on the contour of the workpiece to be processed. Determine the physical position difference corresponding to the image position difference based on the image position difference between the third image position and the second image position corresponding to the center of the field of view of the first image acquisition device, and the conversion relationship between the image position and the physical position; move the carrying device into the field of view of the second image acquisition device, wherein the center of the carrying device after the movement coincides with the center of the field of view of the second image acquisition device; adjust the position of the carrying device based on the physical position difference, so that the physical position corresponding to the product center of the workpiece to be processed on the adjusted carrying device coincides with the physical position corresponding to the center of the field of view of the second image acquisition device; and obtain a fifth image to be measured captured by the second image acquisition device after the adjustment is completed.

[0016] In an optional implementation, before determining the physical position difference corresponding to the image position difference based on the image position difference between the third image position and the second image position corresponding to the center of the field of view of the first image acquisition device and the conversion relationship between the image position and the physical position, the method further includes: acquiring a plurality of ninth images to be measured, the plurality of ninth images to be measured being images acquired by the second image acquisition device for the workpiece to be processed when the workpiece to be processed is respectively in a plurality of fifth physical positions, the number of the plurality of ninth images to be measured being greater than or equal to 3, and any two of the plurality of fifth physical positions being different; for each ninth image to be measured in the plurality of ninth images to be measured, determining the image position of the identification feature in the ninth image to be measured according to the second template image, the second template image including the identification feature on the workpiece to be processed; and determining the conversion relationship according to the image position of the identification feature in the plurality of ninth images to be measured and the plurality of fifth physical positions.

[0017] In an optional implementation, based on the image position of the fifth target feature point in the sixth image to be measured, the fourth physical position corresponding to the second target feature point closest to the product center of the workpiece to be processed is determined, including: according to the image position of the fifth target feature point in the sixth image to be measured and the preset spacing, determining at least one second predicted feature point closest to the product center, and at least one second preset feature point is distributed circumferentially relative to the product center; calculating the distance between each second predicted feature point of at least one second predicted feature point and the product center; determining the second predicted feature point of at least one second predicted feature point with the smallest distance to the product center as the second target feature point, and determining the physical position corresponding to the second target feature point as the fourth physical position.

[0018] In an optional implementation, the target predetermined processing line where the fourth target feature point is located is corrected according to the first direction, including: taking the fourth target feature point as a reference position point, sequentially determining multiple groups of position points, each group of position points including a first position point and a second position point, the first position point and the second position point being located on both sides of the reference position point, and along the first direction, the distance between the two position points included in each of the multiple groups of position points gradually increases, and different position points in the reference position point and the multiple groups of position points are position points corresponding to different feature points on the target predetermined processing line; after each group of position points is determined, calculating the distance between the first position point and the second position point in the group of position points. The method comprises the following steps: determining a line angle of the connecting line relative to the first direction, and performing the following correction operation: when the line angle is greater than a preset angle threshold, determining a corresponding adjustment angle according to the line angle, and adjusting the position of the workpiece to be processed based on the adjustment angle to correct the position of the target predetermined processing line on the workpiece to be processed; when the line angle is less than or equal to the preset angle threshold, stopping the correction; wherein, after each determination of a group of position points and the execution of the correction operation corresponding to the group of position points, performing the step of determining the next group of position points, wherein, along the first direction, the spacing between two position points included in the next group of position points is greater than the spacing between two position points included in the current group of position points.

[0019] According to a second aspect of the present application, a processing parameter detection device is provided. The device can be applied to processing equipment, and includes: an acquisition module for acquiring a first image to be measured, wherein the first image to be measured includes a workpiece to be processed; a first determination module for determining a first image position of a first target feature point in the first image to be measured, wherein the workpiece to be processed includes at least two predetermined processing lines, and the first target feature point is a feature point on any predetermined processing line; a second determination module for determining at least one predicted processing identifier based on first position information and preset processing parameters, wherein the first position information is a first image position or a first physical position of the first target feature point determined based on the first image position, the at least one predicted processing identifier includes at least one predicted processing line and / or at least one first predicted feature point, and the preset processing parameters include a preset spacing between any two adjacent predetermined processing lines of the at least two predetermined processing lines; and a third determination module for determining whether the preset processing parameters are qualified based on position detection information associated with the at least one predicted processing identifier, wherein the position detection information is used to indicate whether the position of the at least one predicted processing identifier matches the position of the predetermined processing identifier, and the predetermined processing identifier includes at least one predetermined processing line and / or at least one feature point on the predetermined processing line.

[0020] A third aspect of the present application provides an electronic device, including a processor and a memory, wherein the memory stores computer program instructions, and the computer program instructions are used by the processor to execute the processing parameter detection method introduced in the first aspect when the processor is running.

[0021] According to a fourth aspect of the present application, a storage medium is provided, which stores a computer program / instruction, and the computer program / instruction is used to execute the processing parameter detection method introduced in the first aspect when running.

[0022] According to the processing parameter detection method, processing parameter detection device, electronic device and storage medium of the embodiment of the present application, the second image acquisition device is moved based on the first physical position of the determined first target feature point so that the center of the field of view of the moved second image acquisition device coincides with the first physical position. According to the first physical position and the preset processing parameters, at least one predicted processing identifier can be determined. Then, based on the feedback information, it is determined whether the preset processing parameters are the target processing parameters. This solution can determine at least one predicted processing identifier through the first physical position and the preset processing parameters, so that by judging whether the predicted processing identifier matches the position of the predetermined processing identifier, it can be determined whether the position of the splitting knife is accurate, so as to avoid damaging the workpiece to be processed. At the same time, it can also avoid the occurrence of empty splitting or missed splitting during the processing process, thereby improving processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and other purposes, features, and advantages of the present application will become more apparent through a more detailed description of the embodiments of the present application in conjunction with the accompanying drawings. The accompanying drawings are intended to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0024] FIG1 shows a schematic flow chart of a processing parameter detection method according to an embodiment of the present application;

[0025] FIG2 is a schematic diagram showing an image coordinate system established for a first image to be measured according to an embodiment of the present application;

[0026] FIG3 shows a schematic diagram of a prediction processing line according to one embodiment of the present application;

[0027] FIG4 shows a schematic diagram of a processing device according to an embodiment of the present application;

[0028] FIG5 shows a schematic diagram of a second image to be measured according to an embodiment of the present application;

[0029] FIG6 shows a schematic diagram of a first template image according to an embodiment of the present application;

[0030] FIG7 is a schematic diagram showing a position of at least one second predicted feature point in a sixth image to be measured according to an embodiment of the present application;

[0031] FIG8 shows a schematic block diagram of a processing parameter detection device according to an embodiment of the present application; and

[0032] FIG9 shows a schematic block diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the present application more apparent, the following is a detailed description of example embodiments of the present application with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the example embodiments described herein. Based on the embodiments of the present application described in this application, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of protection of this application.

[0034] To at least partially address the aforementioned issues, embodiments of the present application provide a method for detecting processing parameters. This method can be applied to any processing equipment capable of processing a workpiece along a predetermined processing line, such as a splitter. Figure 1 shows a schematic flow chart of a processing parameter detection method 100 according to one embodiment of the present application. As shown in Figure 1 , method 100 may include the following steps: S110, S120, S130, and S140.

[0035] Step S110 , obtaining a first image to be measured, where the first image to be measured includes a workpiece to be processed.

[0036] In an optional implementation, the first image to be tested may be any type of image including a workpiece to be processed. The workpiece to be processed may be any product for processing, such as ceramics, wafers, etc. The first image to be tested may be a static image, or any video frame in a dynamic video. The first image to be tested may be an original image captured by an image acquisition device (such as an image sensor in a camera), or an image obtained after preprocessing the original image (such as digitization, normalization, smoothing, etc.). For ease of description and understanding, the following description will mainly take the case where the workpiece to be processed is a wafer as an example.

[0037] Step S120 , determining a first image position of a first target feature point in the first image to be measured, wherein the workpiece to be processed may include at least two predetermined processing lines, and the first target feature point is a feature point on any predetermined processing line.

[0038] In one optional implementation, the target feature points described herein (including the first target feature point, the second target feature point, the third target feature point, etc.) can be any identifiable feature point on the workpiece to be processed. In one embodiment, the target feature point can represent a feature point inherent to the workpiece to be processed, such as a feature point on a certain shape or structure. In another optional implementation, the target feature point can also be a feature point additionally marked on the workpiece to be processed, either manually or by processing equipment, such as a readily recognizable symbol or pattern. The target feature point can be of any shape, such as a circle, a cross, or a star. The workpiece to be processed can include at least two predetermined processing lines. A predetermined processing line is any feature line on the workpiece to be processed. The target feature point is a feature point on the predetermined processing line. In one example, the predetermined processing line can be a scribe line on a wafer. Preferably, the target feature point is the center point of the intersection of two perpendicular scribe lines (referred to as the "scribe line center"). In one embodiment of the present application, the first target feature point can be the feature point closest to the product center of the workpiece to be processed, or it can be a feature point elsewhere on the workpiece to be processed. In one embodiment of the present application, a template image (such as the first template image or the second template image described below) and a first image to be tested can be matched to determine the first image position of a first target feature point in the first image to be tested in the first image to be tested. The template image can include template feature points, and based on an image matching algorithm, first target feature points that match the template feature points can be identified from the first image to be tested. Once the first target feature points are identified, their corresponding first image positions can be determined. In an optional implementation, the template image can include a cutting path center (represented by a black dot), and the cutting path center can be used as a template feature point.

[0039] To facilitate understanding later in the text, the following describes how to measure the physical position and image position mentioned in this article.

[0040] The image position of any feature point described herein (for example, the first target feature point) can be represented by the pixel coordinates in the image coordinate system where the feature point is located. Figure 2 shows a schematic diagram of an image coordinate system established for the first image to be tested according to an embodiment of the present application. For example, the upper left corner vertex of the first image to be tested can be used as the origin o, the side passing through the origin o and parallel to the upper side of the first image to be tested can be used as the x-axis, and the side passing through the origin o and perpendicular to the x-axis and parallel to the left side of the first image to be tested can be used as the y-axis to establish an image coordinate system as shown in Figure 2, where point P is the first target feature point. For example, the first image to be tested contains a total of 1000×1000 pixels. The first target feature point P is located at the pixel in the 150th row and 300th column, so the first image position of the first target feature point P can be expressed as (150, 300).

[0041] The various physical positions described herein can be represented by coordinates in the same world coordinate system. This world coordinate system can also be referred to as a mechanism coordinate system. An example of establishing such a world coordinate system is described below. The workpiece to be processed can be placed on a movable carrier (e.g., a movable stage). The movable stage can translate within a plane (referred to as the "moving plane") or rotate about a fixed axis of rotation within the moving plane. The workpiece to be processed moves synchronously with the movable stage, so the physical position of the movable stage described herein can be considered the same as the physical position of the workpiece to be processed and can be expressed interchangeably. Two mutually perpendicular optical scales can be provided within the movable stage's range of motion. For example, when the movable stage rests at a predetermined initial physical position, the optical scale reading at that time can be set to 0, and this physical position can be determined as the origin O of the world coordinate system. A first optical scale can be provided along a first direction through the origin O, and the axis of the first optical scale can serve as the X-axis of the world coordinate system. A second optical scale is provided perpendicular to the X-axis and through the origin O. The axis of the second scale can serve as the Y-axis of the world coordinate system. Once this world coordinate system is established, each time the movable stage moves, i.e., the workpiece moves, the corresponding X-axis and Y-axis coordinates are read from the first and second scales. These (X, Y) coordinates represent the physical position of the workpiece. It is understood that (X, Y) can be coordinate data used to represent the displacement of the workpiece.

[0042] Step S130: Determine at least one predicted processing mark based on the first position information and preset processing parameters, wherein the first position information is the first image position or the first physical position of the first target feature point determined based on the first image position, the at least one predicted processing mark includes at least one predicted processing line and / or at least one first predicted feature point, and the preset processing parameters include a preset spacing between any two adjacent predetermined processing lines of the at least two predetermined processing lines.

[0043] In an optional implementation, the first position information may be the first image position or the first physical position of the first target feature point. There is a preset conversion relationship between the image position and the physical position, where the conversion relationship may be pre-stored in a storage device. The storage device may be a storage device included in the apparatus for executing the processing parameter detection method 100, or it may be an independent storage device, and the apparatus for executing the processing parameter detection method 100 may be communicatively connected to the independent storage device. The apparatus for executing the processing parameter detection method 100 is referred to herein as a processing parameter detection device, and may be, for example, the processing equipment itself or a control device included in the processing equipment. Based on the known image position or physical position, the position information of another position may be determined based on a preset conversion relationship. Based on the first position information and the preset processing parameters, at least one predicted processing identifier may be determined. The preset processing parameters may include a preset spacing between any two adjacent predetermined processing lines among at least two predetermined processing lines. In one embodiment, if the workpiece to be processed is a wafer, the preset spacing may represent a preset distance between any two adjacent cutting lanes, which may also be referred to as a preset die pitch. At least one predicted processing mark may include at least one predicted processing line and at least one first predicted feature point, or at least one predicted processing mark may include at least one predicted processing line or at least one first predicted feature point. When the preset spacing between two adjacent predetermined processing lines is known, the image position or physical position of other predetermined processing lines or feature points can be inferred based on the first image position or first physical position of the first target feature point. For the sake of convenience, this document refers to the inferred processing line (not the actual predetermined processing line on the workpiece to be processed) as the predicted processing line, and the inferred feature point (not the actual feature point on the workpiece to be processed) as the predicted feature point.

[0044] Optionally, the predicted processing line can be displayed on the display device as a preview line of the splitting position, so that the user can check whether the position of the predicted processing line matches the position of the predetermined processing mark, and then determine whether the preset processing parameters are qualified. Figure 3 shows a schematic diagram of the predicted processing line according to an embodiment of the present application. As shown in Figure 3, each white solid line contained therein can represent a predicted processing line. The area between two adjacent black dots can represent a cutting path. Optionally, the predicted processing line can also be not displayed, and the processing parameter detection device automatically matches the obtained predicted processing line with the predetermined processing line, and determines whether the preset processing parameters are qualified based on the matching results. Similarly, the predicted feature points can also be displayed for the user to determine whether the preset processing parameters are qualified, or the processing parameter detection device can automatically match the obtained predicted feature points with the feature points on the predetermined processing line, and determine whether the preset processing parameters are qualified based on the matching results.

[0045] Step S140, based on position detection information related to at least one predicted processing mark, determine whether the preset processing parameters are qualified, wherein the position detection information is used to indicate whether the position of the at least one predicted processing mark matches the position of the predetermined processing mark, and the predetermined processing mark includes at least one predetermined processing line and / or at least one feature point on the predetermined processing line.

[0046] In an optional implementation, whether preset processing parameters are qualified is determined based on position detection information associated with at least one predicted processing identifier. When the at least one predicted processing identifier includes at least one predicted processing line, the position detection information can be used to indicate whether the position of the at least one predicted processing line matches the position of at least some of the at least one predetermined processing line. When the at least one predicted processing identifier includes at least one first predicted feature point, the position detection information can be used to indicate whether the position of the at least one predicted feature point matches the position of at least some of the target feature points on the at least one predetermined processing line. Taking the example of at least one predicted processing identifier including at least one predicted processing line, if the position of the at least one predicted processing line matches the position of at least some of the at least one predetermined processing line, the preset processing parameters can be determined to be qualified; otherwise, the preset processing parameters are determined to be unqualified.

[0047] The position detection information may be user input, i.e., user feedback information regarding whether the position of the at least one predicted process marker matches the position of the predetermined process marker. The position detection information may also be automatically determined by the process parameter detection device based on the at least one predicted process marker.

[0048] According to the processing parameter detection method of the embodiment of the present application, at least one predicted processing mark is determined based on the first position information of the first target feature point and the preset processing parameters. Then, based on the position detection information indicating whether the predicted processing mark matches the position of the predetermined processing mark, it is determined whether the preset processing parameters are qualified. This solution determines whether the preset processing parameters are qualified, that is, whether they are accurate, by judging whether the position of the predicted processing mark inferred based on the preset processing parameters matches the position of the predetermined processing mark. This can effectively avoid the problem of processing errors caused by incorrect processing parameter settings and damage to the workpiece to be processed. For example, when the workpiece to be processed is a wafer, this solution can effectively avoid the wafer being damaged by the splitting knife, resulting in the scrapping of the wafer, and can avoid the occurrence of empty splitting or missed splitting during the processing process, thereby improving processing efficiency.

[0049] In an optional implementation, the processing equipment includes a first image acquisition device and a second image acquisition device, the image acquisition range of the first image acquisition device is larger than the image acquisition range of the second image acquisition device, wherein the first image to be measured is the image acquired by the second image acquisition device; when at least one predicted processing identifier includes at least one predicted processing line, determining at least one predicted processing identifier based on the first position information and preset processing parameters, including: identifying the contour of the workpiece to be processed from the second image to be measured acquired by the first image acquisition device; determining at least one predicted line segment along the target direction based on the first position information and the preset processing parameters and the contour of the workpiece to be processed; wherein the at least one predicted processing line includes at least one predicted line segment, one of the at least one predicted line segments passes through the first target feature point, the distance between any two predicted line segments is equal to the preset spacing of the predetermined processing line in the direction perpendicular to the target direction, and the two endpoints of each predicted line segment are located within the contour of the workpiece to be processed.

[0050] The target direction may include a first direction and / or a second direction, that is, a predicted line segment may be made along the first direction and / or the second direction as a predicted processing line. The first direction and the second direction are perpendicular to each other. In an optional implementation, the processing equipment may include a first image acquisition device and a second image acquisition device, the image acquisition range of the first image acquisition device is larger than the image acquisition range of the second image acquisition device, wherein the first image to be measured is an image acquired by the second image acquisition device; when at least one predicted processing identifier includes at least one predicted processing line, determining at least one predicted processing identifier according to the first position information and the preset processing parameters, including: identifying the contour of the workpiece to be processed from the second image to be measured acquired by the first image acquisition device; determining at least one first predicted line segment along the first direction, and / or, determining at least one second predicted line segment along the second direction according to the first position information and the preset processing parameters and the contour of the workpiece to be processed, to obtain at least one predicted processing identifier. wherein, at least one predicted processing line includes at least one first predicted line segment and / or at least one second predicted line segment, the first direction and the second direction are perpendicular to each other, one of the at least one first predicted line segments passes through the first target feature point, and one of the at least one second predicted line segments passes through the first target feature point, the distance between any two first predicted line segments is equal to the first spacing of the predetermined processing lines in the second direction, the distance between any two second predicted line segments is equal to the second spacing of the predetermined processing lines in the first direction, the preset spacing includes the first spacing and / or the second spacing, the two endpoints of each first predicted line segment are located within the contour of the workpiece to be processed, and the two endpoints of each second predicted line segment are located within the contour of the workpiece to be processed.

[0051] In one embodiment, a processing device may include a first image acquisition device and a second image acquisition device, wherein the image acquisition range of the first image acquisition device is greater than the image acquisition range of the second image acquisition device. Figure 4 shows a schematic diagram of a processing device according to one embodiment of the present application. As shown in Figure 4, the processing device 400 may include a first image acquisition device 410, a second image acquisition device 420, and a carrier device 430. The first image acquisition device 410 may be used to capture an image of a workpiece to be processed and, based on the image, determine the location of the product center of the workpiece and the outer contour of the workpiece. The second image acquisition device 420 is used to determine the processing position of the workpiece to be processed. For example, if the processing device is a splitter and the workpiece to be processed is a wafer, the second image acquisition device 420 may be used to determine the cleavage position during wafer cleavage. The second image acquisition device 420 is positioned in the positive semi-axis direction of the Z axis (not shown). The Z axis is an axis perpendicular to the X and Y axes in the world coordinate system in which the workpiece to be processed is located. The carrier device 430 may be the movable stage described above. The carrying device 430 can move along the X-axis to move the carried workpiece to be processed within the field of view of the first image acquisition device or the field of view of the second image acquisition device. The structure of the processing equipment shown in Figure 4 is merely exemplary and does not impose any limitations on the present application. For example, the processing equipment may also include a third image acquisition device. The third image acquisition device can be arranged on the side opposite to the second image acquisition device 420, that is, in the negative direction of the Z-axis. When the workpiece to be processed is a wafer, the third image acquisition device can be used to determine the cleavage position during back cleavage of the wafer. The second image acquisition device 420 and the third image acquisition device can also be used to perform horizontal correction and cleavage preview on the workpiece to be processed.

[0052] In an optional implementation, the above-mentioned first image to be tested is an image captured by the second image acquisition device. In addition, the outline of the workpiece to be processed can be identified from the second image to be tested obtained by the first image acquisition device. Figure 5 shows a schematic diagram of the second image to be tested according to an embodiment of the present application. As shown in Figure 5, the black circular area can represent a wafer. The outline of the black circular area is the outline of the wafer. For the second image to be tested, a grayscale value threshold can be set, and each pixel value in the second image to be tested can be compared with the grayscale value threshold to determine the location of the outline of the wafer. The grayscale value threshold can be any value, for example, the grayscale value threshold is 50, 100, 150, etc. Referring to Figure 5, the darker area can represent the area corresponding to pixels with a grayscale value less than 50. In this way, the area occupied by the wafer and the outline of the wafer can be obtained.

[0053] One or more first predicted line segments can be determined along a first direction. The first direction can be any direction, such as the horizontal direction. The first direction can be defined as needed. For ease of description, this document defines the first direction as the horizontal direction, which is also the X-axis direction, while the Y-axis direction, which is perpendicular to the X-axis direction, is defined as the vertical direction. When at least one first predicted line segment is determined along the first direction, the distance between any two first predicted line segments is equal to the spacing between the predetermined processing lines in the second direction. The first and second directions are perpendicular to each other. If the first direction is horizontal, the second direction is vertical (i.e., the Y-axis direction). In an optional implementation, a first first predicted line segment can be first drawn along the first direction through the first target feature point. A second first predicted line segment can then be drawn along the horizontal direction at a position separated from the first first predicted line segment by a first spacing. A third first predicted line segment can then be drawn along the horizontal direction at a position separated from the second first predicted line segment by a first spacing. And so on. The first spacing is the spacing between two predetermined processing lines extending along the first direction in the second direction. The two endpoints of each first predicted line segment are located within the contour of the workpiece to be processed. In an optional implementation, the two endpoints of each first predicted line segment may optionally be located on the contour of the workpiece to be processed.

[0054] In addition, at least one second predicted line segment can be determined along the second direction. In the case of determining at least one second predicted line segment along the second direction, the distance between every two second predicted line segments is equal to the spacing of the predetermined processing lines in the first direction. In an optional implementation, a first second predicted line segment can be first made along the second direction through the first target feature point, and then a second second predicted line segment can be made along the horizontal direction at a position spaced a second spacing from the first second predicted line segment. Then, a third second predicted line segment can be made along the horizontal direction at a position spaced a second spacing from the second second predicted line segment. And so on. The second spacing is the distance between any two second predicted line segments, which is equal to the spacing of the predetermined processing lines in the first direction. The two endpoints of each second predicted line segment are located within the contour of the workpiece to be processed. In an optional implementation, the two endpoints of each second predicted line segment can optionally be located on the contour of the workpiece to be processed.

[0055] The number of the at least one first predicted line segment and the number of the at least one second predicted line segment may be the same or different. As described above, in each of the at least one first predicted line segment and the at least one second predicted line segment, there is one first predicted line segment and one second predicted line segment that pass through the first target feature point. Based on the at least one first predicted line segment and / or the at least one second predicted line segment and the wafer contour, the physical location corresponding to each of the at least one predicted processing lines can be determined.

[0056] According to the above technical solution, at least one predicted processing line can be determined by combining at least one first predicted line segment determined along a first direction and / or at least one second predicted line segment determined along a second direction with the contour of the workpiece to be processed. This method can automatically, simply, and quickly determine the position of at least one predicted processing line.

[0057] In an optional implementation, at least one predicted line segment is determined along the target direction based on the first position information, preset processing parameters, and the contour of the workpiece to be processed, including: based on the first position information, making a target straight line along the target direction through the starting feature point until the target straight line and the contour of the workpiece to be processed have an intersection, wherein the starting feature point is the first target feature point or the second target feature point closest to the product center of the workpiece to be processed determined based on the first target feature point; translating the starting feature point in a direction perpendicular to the target direction by an integer multiple of a preset spacing to obtain one or more new feature points, and making a target straight line along the target direction through each new feature point until the target straight line and the contour of the workpiece to be processed have an intersection; or, translating the target straight line through the starting feature point in a direction perpendicular to the target direction by an integer multiple of a preset spacing to obtain one or more new target straight lines, wherein the portion of the target straight line located within the contour of the workpiece to be processed is a predicted line segment passing through the corresponding feature point.

[0058] In an optional implementation, according to the first position information, preset processing parameters and the contour of the workpiece to be processed, determining at least one first predicted line segment along the first direction may include: according to the first position information, making a first straight line along the first direction through the starting feature point until the first straight line and the contour of the workpiece to be processed intersect, wherein the starting feature point is the first target feature point or the second target feature point closest to the product center of the workpiece to be processed determined based on the first target feature point; translating the starting feature point along the second direction by an integer multiple of the first spacing to obtain one or more new feature points, and making a first straight line along the first direction through each new feature point until the first straight line and the contour of the workpiece to be processed intersect; or, translating the first straight line through the starting feature point along the second direction by an integer multiple of the first spacing to obtain one or more new first straight lines, wherein the first The portion of a straight line located within the contour of the workpiece to be processed is a first predicted line segment passing through the corresponding feature point; based on the first position information, preset processing parameters, and the contour of the workpiece to be processed, at least one second predicted line segment is determined along the second direction, including: based on the first position information, a second straight line is drawn along the second direction through the starting feature point until the drawn second straight line intersects with the contour of the workpiece to be processed; the starting feature point is translated along the first direction by an integer multiple of the second spacing to obtain one or more new feature points, and a second straight line is drawn along the second direction through each new feature point until the drawn second straight line intersects with the contour of the workpiece to be processed; or, the second straight line passing through the starting feature point is translated along the first direction by an integer multiple of the second spacing to obtain one or more new second straight lines, wherein the portion of the second straight line located within the contour of the workpiece to be processed is the second predicted line segment passing through the corresponding feature point.

[0059] In an optional implementation, at least one first predicted line segment can be determined in the following manner. According to the first position information, the line segment is extended to both sides along the first direction (for example, the horizontal direction) through the starting feature point to determine the first straight line. When the first straight line intersects with the contour of the workpiece to be processed, the extension is stopped, and the currently obtained line segment is used as the first predicted line segment. In one embodiment, the first target feature point in the previous embodiment can be directly determined as the starting feature point, and a straight line is drawn from the starting feature point. In another embodiment, the second target feature point P0 closest to the product center of the workpiece to be processed can be further determined based on the first target feature point, and the second target feature point P0 can be determined as the starting feature point, and a straight line is drawn from the starting feature point.

[0060] In one embodiment, the starting feature point can be translated along the second direction (e.g., the vertical direction) by an integer multiple of the first spacing to obtain one or more new feature points. For example, if the size of the first spacing L1 is 1.5 millimeters (mm), and the physical position of the starting feature point is the first physical position (1.5, 1.5), then after translating upward by 7.5 mm (i.e., 5 times L1) in the vertical direction, the first new feature point can be obtained, and the physical position of the first new feature point can be expressed as (1.5, 9). Similarly, after translating downward by 7.5 mm (i.e., 5 times L1) in the vertical direction, the second new feature point can be obtained, and the physical position of the second new feature point can be expressed as (1.5, -6). In a similar manner, one or more new feature points can be obtained. In one embodiment, for each new feature point, a first straight line is made through the new feature point along the first direction until the first straight line made intersects with the contour of the workpiece to be processed. For example, given the preset grain pitch in the first direction of the wafer, the starting feature point is used as the starting point, and the distance of the preset grain pitch is moved upward and downward along the first direction respectively. With the two new feature points after the movement as the reference, two straight lines H1 and H2 parallel to the second direction are drawn respectively. The intersection of the straight line H1 and the contour can be recorded as points U1 and U2. The intersection of the straight line H2 and the contour can be recorded as points D1 and D2. Based on the positions of U1 and U2 and the positions of D1 and D2, the first predicted line segments corresponding to the two new feature points in the first direction can be determined respectively. In a similar manner, the first predicted line segments H1, H2, H3, ..., Hn, etc. corresponding to each new feature point in the first direction can be determined.

[0061] In another embodiment, the first straight line passing through the starting feature point can be directly translated in the second direction by an integer multiple of the first spacing, for example, by a vertical upward translation of 7.5 mm, to obtain a new first straight line and a corresponding new first predicted line segment. The first predicted line segment described in the above embodiment can represent a portion of the first straight line that is within the contour of the workpiece to be processed.

[0062] One or more new second lines can be determined along the second direction in a manner similar to the aforementioned method for obtaining at least one new feature point or at least one new first line. For the sake of brevity, this description is omitted here. The second predicted line segment described in the preceding embodiments may represent a portion of the second line that lies within the contour of the workpiece to be processed.

[0063] According to the above technical solution, based on the first position information, a first straight line can be made along the first direction through the starting feature point until the made first straight line intersects with the contour of the workpiece to be processed. Then the starting feature point is translated along the second direction by an integer multiple of the first spacing to obtain one or more new feature points. A corresponding new first straight line is determined by each new feature point. Alternatively, the first straight line passing through the starting feature point is directly translated along the second direction by an integer multiple of the first spacing to obtain one or more new first straight lines. In addition, one or more new second straight lines can also be obtained along the second direction in a similar manner. This solution can simply and quickly determine at least one new first predicted line segment and / or second predicted line segment, and is highly efficient.

[0064] In an optional implementation, after determining at least one predicted line segment along the target direction based on the first position information, preset processing parameters and the contour of the workpiece to be processed, the method may further include: displaying a third image to be measured with at least one predicted line segment, the third image to be measured being at least a portion of the image captured by the first image acquisition device; determining whether the preset processing parameters are qualified based on position detection information related to at least one predicted processing mark, including: determining that the preset processing parameters are qualified in response to qualified indication information input by the user; and / or determining that the preset processing parameters are unqualified in response to unqualified indication information input by the user; wherein the position detection information includes qualified indication information and / or unqualified indication information, the qualified indication information is used to indicate that the position of at least one predicted processing mark matches the position of the predetermined processing mark, and the unqualified indication information is used to indicate that the position of at least one predicted processing mark does not match the position of the predetermined processing mark.

[0065] When at least one first predicted line segment is determined along the first direction and / or at least one second predicted line segment is determined along the second direction, the third image to be measured may include at least one first predicted line segment and / or at least one second predicted line segment.

[0066] In one embodiment, the processing equipment may further include an input device and / or an output device. The input device and / or the output device may be communicatively connected to the processing parameter detection device or included in the processing parameter detection device. The input device may include, but is not limited to, one or more of a mouse, a keyboard, a microphone, a touch screen, etc. The output device may include, but is not limited to, one or more of a display device, a speaker, etc. If at least one first predicted line segment and at least one second predicted line segment are determined, a third image to be measured containing at least one first predicted line segment and at least one second predicted line segment may be displayed on the display interface of the display device. If only at least one first predicted line segment or at least one second predicted line segment are determined, a third image to be measured containing at least one first predicted line segment or at least one second predicted line segment may be displayed on the display interface of the display device. The third image to be measured may be the image captured by the first image capture device. The third image to be measured may be the same image as the second image to be measured or a new image. The third image to be measured may contain the entire workpiece to be processed or a portion of the workpiece to be processed. In one embodiment of the present application, the third image to be measured may be the same image as the second image to be measured shown in FIG. 2 .

[0067] In the aforementioned embodiments, the position detection information may include pass indication information and / or fail indication information. The pass indication information is used to indicate that at least one predicted processing position matches at least some of the at least one predetermined processing line. The fail indication information is used to indicate that at least one predicted processing position does not match at least some of the at least one predetermined processing line.

[0068] In one embodiment, the user may also use an input device to input qualification indication information. Based on the qualification indication information, it can be determined that the preset processing parameters are qualified. For example, the user may use a keyboard or mouse to input characters such as "Processing parameters qualified" to indicate that the preset processing parameters are qualified. For another example, the user may use a keyboard or mouse to click a "Confirm" control to indicate that the preset processing parameters are qualified. If the user does not input qualification indication information, for example, if the input device does not receive the user-input qualification indication information within a preset time period, it can be determined that the current preset processing parameters are unqualified.

[0069] In another embodiment, the failure of the preset processing parameters can be determined by user input of a failure indication. For example, the user can input characters such as "Processing parameters failed" via a keyboard or mouse to indicate that the preset processing parameters failed. In another example, the user can also click an "error" control via a keyboard or mouse to indicate that the preset processing parameters failed. If the input device does not receive the failure indication input by the user within a preset time period, the preset processing parameters are considered qualified.

[0070] In yet another embodiment, a user may input both pass and fail indication information using an input device. Upon receiving the pass indication information input by the user, the processing parameter detection device may determine that the preset processing parameters are pass. Conversely, upon receiving the fail indication information input by the user, the processing parameter detection device may determine that the preset processing parameters are fail.

[0071] According to the above technical solution, the qualified status of the preset processing parameters can be determined based on the qualified indication information input by the user, and / or the unqualified status of the preset processing parameters can be determined based on the unqualified indication information input by the user. This method has strong interactivity and can accurately determine whether the preset processing parameters are qualified based on the qualified indication information or unqualified indication information input by the user, thereby achieving high efficiency.

[0072] In an optional implementation, when at least one predicted processing mark includes at least one first predicted feature point, at least one predicted processing mark is determined based on the first position information and preset processing parameters, including: based on the first position information and the preset processing parameters, determining a physical position whose distance from the first physical position or the second physical position determined based on the first position information meets a preset distance condition as the third physical position of the first predicted feature point; wherein the second physical position is the physical position corresponding to the second target feature point closest to the product center of the workpiece to be processed, the distance condition includes a first spacing in the second direction equal to a first number and a second spacing in the first direction equal to a second number, the first direction and the second direction are perpendicular to each other, and the preset spacing includes the first spacing and / or the second spacing.

[0073] In one embodiment, when at least one predicted processing mark includes at least one first predicted feature point, a physical location whose distance from the first physical location meets a preset distance condition based on the first position information and preset processing parameters can be used as the third physical location of the first predicted feature point. The preset distance condition can include a first spacing in the second direction equal to a first quantity and a second spacing in the first direction equal to a second quantity. The first spacing and the second spacing described herein can be equal or different. The first quantity and the second quantity can both be equal to any value, such as 0, 1, 2, or 3. Furthermore, the first quantity and the second quantity can be equal or different. The first quantity and the second quantity cannot both be equal to 0. Assuming that the first spacing and the second spacing are both 1.5, if the first physical location is (1.5, 1.5), then the third physical location of the first predicted feature point can be any physical location that meets the preset distance condition, such as (3, 1.5), (1.5, 3), (3, 3), or the like. In one embodiment of the present application, the coordinates of the third physical location can be expressed as (3, 3). It can be understood that the actual inference based on the first position information and the preset processing parameters is a physical location, namely, the third physical location. After obtaining the third physical location, it is assumed that there should be a feature point at that location, namely the first predicted feature point. Therefore, the first predicted feature point is a theoretical feature point or a virtual feature point, not an actually detected feature point.

[0074] In another embodiment, based on the first position information and preset processing parameters, a physical location whose distance from the second physical location meets a preset distance condition can be used as the third physical location of the first predicted feature point. The second physical location can be the physical location corresponding to the second target feature point P0 that is closest to the product center of the workpiece to be processed.

[0075] According to the above technical solution, a third physical location of a first predicted feature point whose distance from the first physical location or the second physical location meets a preset distance condition can be determined based on the first location information and preset processing parameters. This solution eliminates the need to set complex parameters and can determine the third physical location of the first predicted feature point based on the first location information and preset processing parameters, thereby improving the efficiency of determining whether the preset processing parameters meet the requirements.

[0076] In an optional implementation, the processing equipment may include a second image acquisition device, the first image to be tested is an image acquired by the second image acquisition device; based on position detection information related to at least one predicted processing mark, determining whether the preset processing parameters are qualified, including: moving the center of the field of view of the second image acquisition device to a third physical position; acquiring a fourth image to be tested acquired by the second image acquisition device after the movement; identifying a third target feature point from the fourth image to be tested; determining an image position difference between the image positions of the third target feature point and the center of the field of view of the second image acquisition device in the fourth image to be tested, or a physical position difference between the physical positions corresponding to the third target feature point and the center of the field of view of the second image acquisition device; and determining whether the image position difference is less than or equal to a first preset error threshold. The position detection information includes the position judgment result; when the position judgment result indicates that the position of the predicted processing mark matches the position of the predetermined processing mark, the preset processing parameters are determined to be qualified; otherwise, the preset processing parameters are determined to be unqualified; wherein, when the image position difference is less than or equal to the first preset error threshold or the physical position difference is less than or equal to the second preset error threshold, the position judgment result indicates that the position of the predicted processing mark matches the position of the predetermined processing mark; when the image position difference is greater than the first preset error threshold or the physical position difference is greater than the second preset error threshold, the position judgment result indicates that the position of the predicted processing mark does not match the position of the predetermined processing mark.

[0077] In one embodiment, the processing equipment may include a second image acquisition device. The first image to be measured is an image captured by the second image acquisition device. After the center of the field of view of the second image acquisition device is moved to a third physical position, for example, (3, 3), a fourth image to be measured, captured by the second image acquisition device at the current moment, can be obtained. At this point, the image coordinates corresponding to the center of the field of view of the second image acquisition device and the first predicted feature point in the image coordinate system coincide, i.e., their image positions coincide, and accordingly, their physical positions also coincide. A template image can be used to identify a third target feature point from the fourth image to be measured. Based on the determined third target feature point, an image position difference between the third target feature point and the image position of the center of the field of view of the second image acquisition device in the fourth image to be measured can be determined. For example, if the image position of the center of the field of view of the second image acquisition device in the fourth image to be measured is (400, 550), and the image position of the third target feature point in the fourth image to be measured is (405, 551), then the image position difference (Δx1, Δy1) can be determined to be (5, 1). In another embodiment, the physical position difference between the third target feature point and the physical position of the center of the field of view of the second image acquisition device can also be determined. For example, if the physical position of the field of view of the second image acquisition device is (3, 3), and the physical position of the third target feature point is (2.97, 2.93), then the physical position difference (ΔX1, ΔY1) can be determined to be (-0.03, -0.07). The negative sign "-" indicates the negative direction of the X and Y axes, respectively. Theoretically, if the preset processing parameters are set correctly, the position of the third target feature point should coincide with or substantially coincide with the position of the first predicted feature point. If there is a significant error between the two, it can be determined that the preset processing parameters are unqualified. After the field of view of the second image acquisition device is moved to the third physical position, the position of the field of view of the second image acquisition device represents the position of the first predicted feature point. The position of the field of view of the second image acquisition device can be directly compared with the position of the third target feature point. The position determination result can be obtained by determining whether the image position difference is less than or equal to a first preset error threshold or whether the physical position difference is less than or equal to a second preset error threshold. The first preset error threshold can be any numerical value, and its numerical value can represent the distance error in the image coordinate system. For example, the distance of 2 pixels, the distance of 3 pixels, etc. In one embodiment of the present application, the first preset error threshold can be equal to the distance of 3 pixels. The second preset error threshold can be any numerical value, and its numerical value can represent the distance error in the physical coordinate system. For example, the second preset error threshold can be equal to 0.01mm, 0.02mm, etc. In one embodiment of the present application, the second preset error threshold can be equal to 0.02mm. The position detection information may include the position judgment result.When the position judgment result indicates that the position of the predicted processing mark matches the position of the predetermined processing mark, that is, the image position difference is less than or equal to the first preset error threshold or the physical position difference is less than or equal to the second preset error threshold, it can be determined that the preset processing parameters are qualified; otherwise, the preset processing parameters are determined to be unqualified.

[0078] According to the above technical solution, after the center of the field of view of the second image acquisition device is moved to a third physical position, a fourth image to be tested, captured by the second image acquisition device after the movement, can be obtained. A third target feature point is identified from the fourth image to be tested, and the image position difference between the third target feature point and the center of the field of view of the second image acquisition device in the fourth image to be tested, or the physical position difference between the corresponding physical positions, is determined. Whether the preset processing parameters are qualified is determined by determining whether the image position difference is less than or equal to a first preset error threshold or whether the physical position difference is less than or equal to a second preset error threshold. This solution does not require complex judgment logic and can determine whether the preset processing parameters are qualified by determining the position difference between the third target feature point and the center of the field of view of the second image acquisition device in the fourth image to be tested, which is captured after the second image acquisition device is moved. This solution is highly efficient and reliable.

[0079] In an optional implementation, before moving the field of view center of the second image acquisition device to the third physical position, the method further includes: moving the field of view center of the second image acquisition device to the first physical position or the second physical position based on the first position information; moving the field of view center of the second image acquisition device to the third physical position includes: moving the field of view center of the second image acquisition device by a distance specified by a preset distance condition so that the field of view center of the second image acquisition device moves to the third physical position.

[0080] In one embodiment, before moving the center of the field of view of the second image capture device to the third physical position, the center of the field of view of the second image capture device may be moved to the first physical position or the second physical position based on the first position information. The second image capture device is then moved again according to a preset distance condition, such as a horizontal movement of five preset die pitches. The physical position corresponding to the center of the field of view of the second image capture device after the movement is the third physical position.

[0081] According to the above technical solution, after the center of the field of view of the second image acquisition device is moved to the first physical position or the second physical position, the physical position of the center of the field of view of the second image acquisition device matches the physical position corresponding to a specific processing mark. The center of the field of view of the second image acquisition device is then moved a distance specified by a preset distance condition to determine the third physical position. This solution can effectively assist in determining whether the preset distance condition is met, and thus determine whether the preset processing parameters are qualified.

[0082] In an optional implementation, before determining the first image position of the first target feature point in the first image to be tested, the method may further include: performing feature point matching in the first image to be tested using a first template image containing template feature points; determining the feature points identified from the first image to be tested and matching the template feature points as the first target feature points; identifying the third target feature points from the fourth image to be tested, including: performing feature point matching in the fourth image to be tested using the first template image; and determining the feature points identified from the fourth image to be tested and matching the template feature points as the third target feature points.

[0083] In one embodiment, the workpiece to be processed is a wafer, and the first template image may include the intersection area of ​​two mutually perpendicular cutting lanes on the wafer and an area within a preset range around the intersection area, and the matching feature point may be the center point of the intersection area. Figure 6 shows a schematic diagram of a first template image according to an embodiment of the present application. As shown in Figure 6, the first template image includes the center of the cutting lane (represented by a black dot), and the center of the cutting lane can be used as a reference point. In addition, Figure 6 also shows a cross-shaped white area, which is a part of the two mutually perpendicular cutting lanes. The intersection area is the area where the rectangular box shown by the middle dotted line is located. At the same time, the first template image may also include an area within a preset range around the intersection area (which can be called a preset area), such as the four gray sub-areas shown in Figure 6 and the area where the two cutting lanes are located outside the intersection area. Among them, the preset range is set so that the image features contained in the intersection area and the preset area enable the image processing algorithm to identify the location of the intersection area and the preset area from the image captured by the image acquisition device based on the image features. As shown in Figure 6, the image features contained in the intersection area are not obvious and difficult to distinguish. Therefore, it can be combined with the surrounding preset area to form a sufficiently distinguishable image feature to help identify the location of the intersection area and the preset area. The main purpose is to identify the location of the intersection area and then determine the location of the matching feature point. Similarly, the first template image can also be used to identify the third target feature point corresponding to the template feature point in the fourth image to be tested.

[0084] According to the above technical solution, by matching the first template image with the first image to be tested and / or the fourth image to be tested, target feature points in the corresponding images to be tested can be determined. This method, without requiring complex operations and calculations, can accurately and efficiently obtain the first target feature points in the first image to be tested and / or the third target feature points in the fourth image to be tested.

[0085] In an optional implementation, the processing equipment includes a second image acquisition device, and the first image to be measured is an image acquired by the second image acquisition device; before determining the first image position of the first target feature point in the first image to be measured in the first image to be measured, the method may further include: a first operation; or, the first operation and a second operation performed after the first operation; or, the first operation, the second operation and a third operation performed after the second operation; wherein the first operation includes: identifying a fourth target feature point from a fifth image to be measured acquired by the second image acquisition device; the second operation includes: correcting the target predetermined processing line where the fourth target feature point is located according to the first direction; after the correction is completed, moving the field of view center of the second image acquisition device to the physical position corresponding to when the second image acquisition device acquires the fifth image to be measured; obtaining a sixth image to be measured acquired after the second image acquisition device is moved; and obtaining a sixth image to be measured from the sixth image to be measured. The method further comprises the steps of: identifying a fifth target feature point in the sixth image to be measured; the third operation comprising: determining a fourth physical position corresponding to the second target feature point closest to the product center of the workpiece to be processed based on the image position of the fifth target feature point in the sixth image to be measured; moving the field of view center of the second image acquisition device to the fourth physical position; acquiring a seventh image to be measured acquired after the second image acquisition device has moved; and identifying a sixth target feature point from the seventh image to be measured; wherein, when the method comprises the first operation but does not include the second operation, the fifth image to be measured is the first image to be measured, and the fourth target feature point is the first target feature point; when the method comprises the first operation and the second operation but does not include the third operation, the sixth image to be measured is the first image to be measured, and the fifth target feature point is the first target feature point; when the method comprises the first operation, the second operation and the third operation, the seventh image to be measured is the first image to be measured, and the sixth target feature point is the first target feature point.

[0086] In one embodiment, the processing equipment may include a second image acquisition device. The first image to be measured is an image acquired by the second image acquisition device. The processing parameter detection method may further include: a first operation; or the first operation and a second operation performed after the first operation; or the first operation, the second operation, and a third operation performed after the second operation.

[0087] In one embodiment of the present application, a first operation can be performed to determine the fifth image to be tested obtained by the first operation as the above-mentioned first image to be tested, and the fourth target feature point obtained by the first operation as the first target feature point. In an optional implementation, the first operation may include: identifying the fourth target feature point from the fifth image to be tested acquired by the second image acquisition device. The fifth image to be tested may be the same image as the second image to be tested or a portion of the second image to be tested, or it may be a new image acquired by the second image acquisition device. Template matching is performed on the fifth image to be tested using a template image (such as the first template image in the above-mentioned embodiment) to obtain the fourth target feature point in the fifth image to be tested.

[0088] In another embodiment of the present application, after performing the first operation, a second operation may be performed, whereby the sixth target image obtained through the second operation is determined as the first target image, and the fifth target feature point obtained through the second operation is determined as the first target feature point. In an optional implementation, the second operation may include: correcting the target predetermined processing line where the fourth target feature point is located according to a first direction; after the correction is completed, moving the center of the field of view of the second image acquisition device to the physical position corresponding to when the second image acquisition device captured the fifth target image; acquiring a sixth target image captured after the second image acquisition device has been moved; and identifying the fifth target feature point from the sixth target image. The first direction may be, for example, horizontal. Specifically, based on the angle between the target predetermined processing line where the fourth target feature point is located and the first direction, for example, if the angle between the target predetermined processing line and the first direction is +2° in a clockwise direction, the target predetermined processing line may be rotated 2° counterclockwise to correct the target predetermined processing line. After the correction is completed, moving the center of the field of view of the second image acquisition device to the physical position corresponding to when the second image acquisition device captured the fifth target image. The sixth target image is then captured using the moved second image acquisition device. Based on the collected sixth image to be measured and the template image (eg, the first template image in the above embodiment), a fifth target feature point can be identified from the sixth image to be measured.

[0089] In one embodiment of the present application, after performing the first and second operations, a third operation may be performed, whereby the seventh image to be measured obtained by the third operation is determined as the first image to be measured, and the sixth target feature point obtained by the third operation is determined as the first target feature point. In an optional implementation, the third operation may include: determining the fourth physical position corresponding to the second target feature point P0 closest to the product center of the workpiece to be processed based on the image position of the fifth target feature point in the sixth image to be measured; moving the center of the field of view of the second image acquisition device to the fourth physical position; acquiring the seventh image to be measured acquired after the second image acquisition device has moved; and identifying the sixth target feature point from the seventh image to be measured. Specifically, the physical position of the product center of the workpiece to be processed may be used as the origin (0, 0) of the world coordinate system. Based on the image position of the fifth target feature point in the sixth image to be measured and the conversion relationship between the physical coordinate system and the image coordinate system, the physical position of the fifth target feature point may be determined. Then, based on the distance difference between the physical position of the fifth target feature point and the physical position of the product center and a preset spacing, the coordinates of the fourth physical position corresponding to the second target feature point P0 are determined. For example, if the physical position of the fifth target feature point is (5.5, 5.5), and the first and second spacings in the preset spacing are equal to 1.5 mm, then it can be determined that the fifth target feature point is separated from the product center by a full three preset spacings in the first and second directions. By moving the fifth target feature point downward by 4.5 mm and then to the left by 4.5 mm, it can be determined that the fourth physical position corresponding to the second predicted feature point closest to the product center of the workpiece to be processed is A1 (1, 1).

[0090] According to the above technical solution, by performing the first operation, a fourth target feature point can be quickly identified from the fifth image to be tested. By performing the second operation, the target predetermined processing line where the fourth target feature point is located can be corrected according to the first direction. After the correction is completed, the center of the field of view of the second image acquisition device is moved to the physical position corresponding to when the second image acquisition device captured the fifth image to be tested, and a sixth image to be tested is acquired. The fifth target feature point is then identified from the sixth image to be tested. By correcting the target predetermined processing line, this method can achieve high-precision positioning of the target predetermined processing line, thereby ensuring the accuracy of the obtained fifth target feature point. By performing the third operation, based on the fourth physical position corresponding to the second target feature point closest to the center of the workpiece to be processed, the center of the field of view of the second image acquisition device is moved to the fourth physical position, and the sixth target feature point is identified from the seventh image to be tested, acquired after the second image acquisition device has moved. This ensures that the identified sixth target feature point is located as close to the center of the image as possible, facilitating subsequent determination of whether the preset processing parameters meet the requirements based on one or more preset processing identifiers.

[0091] In an optional implementation, the processing equipment may further include a first image acquisition device, wherein the image acquisition range of the first image acquisition device is larger than the image acquisition range of the second image acquisition device, wherein, before identifying the fourth target feature point from the fifth image to be measured acquired by the second image acquisition device, the method further includes: identifying the contour of the workpiece to be processed from the eighth image to be measured acquired by the first image acquisition device, wherein, when the first image acquisition device acquires the eighth image to be measured, the center of the field of view of the first image acquisition device coincides with the center of the carrying device for carrying the workpiece to be processed; determining the second image position of the product center of the workpiece to be processed in the eighth image to be measured based on the contour of the workpiece to be processed; and determining the second image position of the product center of the workpiece to be processed in the eighth image to be measured based on the contour of the workpiece to be processed. Determine the physical position difference corresponding to the image position difference based on the image position difference between the third image position and the second image position corresponding to the center of the field of view of the first image acquisition device and the conversion relationship between the image position and the physical position; move the carrying device into the field of view of the second image acquisition device, wherein the center of the carrying device after the movement coincides with the center of the field of view of the second image acquisition device; adjust the position of the carrying device based on the physical position difference so that the physical position corresponding to the product center of the workpiece to be processed on the adjusted carrying device coincides with the physical position corresponding to the center of the field of view of the second image acquisition device; and obtain a fifth image to be measured captured by the second image acquisition device after the adjustment is completed.

[0092] In one embodiment of the present application, the processing equipment may further include a first image acquisition device having an image acquisition range greater than that of a second image acquisition device. The contour of the workpiece to be processed is identified from an eighth image to be tested captured by the first image acquisition device. The eighth image to be tested may be the same as the second image to be tested in the previous embodiment, or it may be a portion of the second image to be tested. Furthermore, the eighth image to be tested may be a new image captured by the second image acquisition device. The method for identifying the contour of the workpiece to be processed from the eighth image to be tested captured by the first image acquisition device can be referenced to the description of identifying the contour of the workpiece to be processed from the second image to be tested in the previous embodiment; for the sake of brevity, further description is omitted here. When the first image acquisition device captures the eighth image to be tested, the center of the field of view of the first image acquisition device coincides with the center of the support device used to support the workpiece to be processed. In one embodiment of the present application, when the workpiece to be processed is a wafer, it is typically attached to an iron ring. Due to the possibility of misalignment or incomplete wafers, the center of the wafer product may not coincide with the center of the iron ring. Due to the hardware limitations of the processing equipment, when the iron ring is placed on the carrier, it is assumed that the center of the iron ring coincides with the center of the carrier. Therefore, the product center of the wafer and the center of the carrier do not necessarily coincide. The image position of the center of the field of view of the first image acquisition device can be expressed as (x M ,y MBased on the outline of the workpiece to be processed, the second image position of the product center in the eighth image to be measured can be determined by calculating the first mean of the sum of the pixel values ​​of each row of pixels within the outline of the workpiece to be processed and the second mean of the sum of the pixel values ​​of each column of pixels. The second image position can be expressed as (x C1 ,y C1 ). According to the second image position (x C1 ,y C1 ) and the third image position (x M ,y M ), the image position (x C1 ,y C1 ) and (x M ,y M ) between the image positions. Wherein, the difference between the horizontal coordinates Δx2=x C1 -x M , the difference between the vertical coordinates Δy2=y C1 -y M . There is a one-to-one conversion relationship between the image position of any object described herein and the physical position of the object in the world coordinate system. For example, for the image position (x', y'), the physical position (X', Y') corresponding to the image position in the world coordinate system can be obtained based on the conversion relationship. Based on the obtained image position differences Δx2 and Δy2, the physical position differences δX2 and δY2 corresponding to the image position differences Δx2 and Δy2 can also be obtained based on the above conversion relationship. The carrier is moved into the field of view of the second image acquisition device so that the center of the carrier after the movement coincides with the field of view center of the second image acquisition device. According to the calculated physical position differences δX2 and δY2, the position of the carrier is adjusted. The operation of moving the carrier can be performed manually by the user or automatically by the processing control system, for example, by controlling the carrier to move the carrier by a robotic arm, or by directly controlling the movement of the carrier. The processing control system can be a processing device for processing the workpiece to be processed or other control systems that can be communicatively connected to the processing device, such as a host computer system. The physical position corresponding to the product center of the workpiece to be processed on the adjusted carrier coincides with the physical position corresponding to the field of view center of the second image acquisition device. Based on the adjusted second image acquisition device, a fifth image to be measured can be acquired.

[0093] According to the above technical solution, based on the image position difference between the second image position and the third image position corresponding to the center of the field of view of the first image capture device, as well as the conversion relationship between image position and physical position, the physical position difference corresponding to the image position difference can be determined. Then, after the carrier device is moved into the field of view of the second image capture device, the second image capture device is adjusted according to the physical position difference so that the physical position corresponding to the product center of the workpiece to be processed coincides with the center of the field of view of the second image capture device. The adjusted second image capture device then captures a fifth image to be measured. This method can quickly determine the physical position at which the physical position corresponding to the product center of the workpiece to be processed coincides with the center of the field of view of the second image capture device based on the conversion relationship and in conjunction with the movement of the carrier device. This solution has a relatively simple algorithm and relatively accurate results in determining the coincident physical position.

[0094] In an optional implementation, before determining the physical position difference corresponding to the image position difference based on the image position difference between the third image position and the second image position corresponding to the center of the field of view of the first image acquisition device and the conversion relationship between the image position and the physical position, the method further includes: acquiring a plurality of ninth images to be measured, the plurality of ninth images to be measured being images acquired by the second image acquisition device for the workpiece to be processed when the workpiece to be processed is respectively in a plurality of fifth physical positions, the number of the plurality of ninth images to be measured being greater than or equal to 3, and any two of the plurality of fifth physical positions being different; for each ninth image to be measured in the plurality of ninth images to be measured, determining the image position of the identification feature in the ninth image to be measured according to the second template image, the second template image including the identification feature on the workpiece to be processed; and determining the conversion relationship according to the image position of the identification feature in the plurality of ninth images to be measured and the plurality of fifth physical positions.

[0095] In one embodiment, the number of the plurality of ninth images to be measured is greater than or equal to three. By way of example and not limitation, the number of the plurality of ninth images to be measured is greater than or equal to three and less than or equal to nine. For example, there are nine ninth images to be measured. The nine ninth images to be measured may be images captured by the image acquisition device of the workpiece when the workpiece is in nine different fifth physical positions. The nine different fifth physical positions are represented as K1, K2, ..., K9, respectively, and these nine fifth physical positions may be arbitrary.

[0096] For each of the 9 ninth images to be tested, the image position of the identification feature in the ninth image to be tested can be determined based on the acquired second template image. The identification feature can be any identifiable feature on the workpiece to be processed, which can be a feature point on the predetermined processing line described in this article, or a feature in other forms. In one embodiment, the identification feature can be a feature inherent in the workpiece to be processed, such as a feature on a certain shape or structure. In an optional implementation, the identification feature can also be a feature that is additionally marked on the workpiece to be processed by manual labor or processing equipment, such as a certain easily recognizable symbol, pattern, etc. The identification feature can be of any shape, such as a circle, a cross, or a star. Determining the image position of the identification feature in the ninth image to be tested based on the second template image can be achieved in the following manner: identifying a second identification feature that matches the identification feature in the second template image from the ninth image to be tested, and determining the image position of the second identification feature in the ninth image to be tested as the image position of the identification feature in the ninth image to be tested.

[0097] According to the image positions F1, F2, ..., F9 of the nine ninth images to be tested and the corresponding nine fifth physical positions K1, K2, ..., K9 of the identification feature, a mapping relationship (X) between the coordinates corresponding to the image positions and the coordinates corresponding to the physical positions can be established. K , Y K )=f(w)(x F ,y F ). (X K , Y K ) represents each fifth physical location, (x F ,y F ) represents each image position. The f(w) matrix can be calculated using the determined nine coordinate points, and the conversion relationship between each image position and the corresponding fifth physical position can be determined. Based on this conversion relationship, the conversion relationship between any image position and its corresponding physical position can be determined.

[0098] According to the above technical solution, a conversion relationship can be determined based on the image positions of the identification features in the plurality of ninth images to be tested and the plurality of fifth physical positions of the identification features. This method of determining the conversion relationship based on the plurality of image positions and the plurality of fifth physical positions has a simple algorithm and is easy to implement.

[0099] In an optional implementation, based on the image position of the fifth target feature point in the sixth image to be measured, the fourth physical position corresponding to the second target feature point closest to the product center of the workpiece to be processed is determined, including: according to the image position of the fifth target feature point in the sixth image to be measured and the preset spacing, determining at least one second predicted feature point closest to the product center, and at least one second preset feature point is distributed circumferentially relative to the product center; calculating the distance between each second predicted feature point of at least one second predicted feature point and the product center; determining the second predicted feature point of at least one second predicted feature point with the smallest distance to the product center as the second target feature point, and determining the physical position corresponding to the second target feature point as the fourth physical position.

[0100] In one embodiment, the physical position of the fifth target feature point can be determined based on the image position and transformation relationship of the fifth target feature point in the sixth image to be tested. Based on the physical position of the fifth target feature point and the preset spacing, at least one second predicted feature point closest to the product center can be determined. The at least one second preset feature point is circumferentially distributed relative to the product center. Figure 7 shows a schematic diagram of the position of at least one second predicted feature point in the sixth image to be tested according to one embodiment of the present application. As shown in Figure 7, the "+" symbol indicated by the arrow represents the position of the predicted feature point in the sixth image to be tested, and A1, A2, A3, and A4 each represent a second predicted feature point. For example, if the physical position of the fifth target feature point is (5.5, 5.5), and the first and second spacings of the preset spacings are equal to 1.5 mm, then it can be determined that the fifth target feature point is separated from the product center by a full three preset spacings in the first and second directions. By moving the fifth target feature point downward by 4.5 mm and then to the left by 4.5 mm, the fourth physical position corresponding to the second predicted feature point closest to the product center of the workpiece can be determined to be A1 (1, 1). Around the product center, the coordinates of the other second predicted feature points around the product center can be calculated as A2 (-0.5, 1), A3 (-0.5, -0.5), and A4 (1, -0.5). Based on the physical coordinates of each second predicted feature point, the distance between each second predicted feature point and the product center is calculated. Among them, the second predicted feature point with the smallest distance from the product center among the four second predicted feature points is A3, so A3 can be determined as the second target feature point P0, and the physical position corresponding to A3 is determined as the fourth physical position.

[0101] The above technical solution can determine a second target feature point and a fourth physical location corresponding to the second target feature point based on the distance between each of at least one second predicted feature point and the product center. This method calculates the distances between multiple second predicted feature points distributed circumferentially along the product center and the product center, ensuring that the determined second target feature point is the feature point closest to the product center.

[0102] In an optional implementation, the target predetermined processing line where the fourth target feature point is located is corrected according to the first direction, including: taking the fourth target feature point as a reference position point, sequentially determining multiple groups of position points, each group of position points including a first position point and a second position point, the first position point and the second position point being located on both sides of the reference position point, and along the first direction, the distance between the two position points included in each of the multiple groups of position points gradually increases, and different position points in the reference position point and the multiple groups of position points are position points corresponding to different feature points on the target predetermined processing line; after each group of position points is determined, calculating the distance between the first position point and the second position point in the group of position points. The method comprises the following steps: determining a line angle of the connecting line relative to the first direction, and performing the following correction operation: when the line angle is greater than a preset angle threshold, determining a corresponding adjustment angle according to the line angle, and adjusting the position of the workpiece to be processed based on the adjustment angle to correct the position of the target predetermined processing line on the workpiece to be processed; when the line angle is less than or equal to the preset angle threshold, stopping the correction; wherein, after each determination of a group of position points and the execution of the correction operation corresponding to the group of position points, performing the step of determining the next group of position points, wherein, along the first direction, the spacing between two position points included in the next group of position points is greater than the spacing between two position points included in the current group of position points.

[0103] In one embodiment, the fourth target feature point can be used as a reference position point, and multiple groups of position points can be sequentially determined based on the reference position point. In the reference position point and the multiple groups of position points, different position points correspond to different feature points on the target predetermined processing line. The position point corresponding to any feature point can be the image position point corresponding to the feature point in the image coordinate system, or the physical position point corresponding to the feature point in the world coordinate system.

[0104] In an optional implementation, multiple groups of position points can be determined based on the fourth target feature point as the reference position point. For example, for the first group of position points B1B2, it may include the first position point B1 and the second position point B2. The first position point B1 and the second position point B2 may be located on both sides of the reference position point. In a similar manner, multiple groups of position points C1C2, D1D2, etc. can be determined in sequence, and each group of position points may include the first position point and the second position point. Along the first direction (horizontal direction), the distance between the two position points contained in each of the multiple groups of position points gradually increases. That is, the distance between D1D2 is greater than the distance between C1C2. In the reference position point and the multiple groups of position points, different position points are position points corresponding to different feature points on the target predetermined processing line.

[0105] After each set of position points is determined, the following operations can be performed to correct the position of the target predetermined processing line. The user can pre-set a preset angle threshold to determine whether the target predetermined processing line needs to be corrected. The preset angle threshold can be any angle greater than 0. By way of example and not limitation, the preset angle threshold can be in the range of [0.001, 0.2] degrees, such as 0.1 degrees, 0.03 degrees, 0.006 degrees or 0.002 degrees, etc. Correcting the position of the target predetermined processing line may include the following correction operations. If the angle of the line between the first position point B1 and the second position point B2 is 0.7 degrees, which is greater than the preset angle threshold of 0.002 degrees. At this time, the wafer needs to be rotated at an angle opposite to the tilt direction of the line between the first position point B1 and the second position point B2 so that the line coincides with the horizontal direction. Then, for the second group of position points C1C2, for the first position point C1 and the second position point C2 in the second group of position points C1C2, a determination is made in a manner similar to the above description as to whether the angle between the first position point C1 and the second position point C2 is greater than the preset angle threshold of 0.002. If so, a correction operation is performed. After performing the above correction operations in sequence, the correction is stopped until the angle between the first position point and the second position point in the position points is less than or equal to the preset angle threshold of 0.002. It should be noted that the distance between the two position points included in the next group of position points (for example, C1C2) is greater than the distance between the two position points included in the current group of position points (for example, B1B2).

[0106] According to the above technical solution, multiple sets of position points are determined. The position of the workpiece to be processed is adjusted by the angle between two points in each set relative to a preset reference direction, thereby correcting the position of the target predetermined processing line. By setting multiple sets of position points, high-precision positioning of the target predetermined processing line on the workpiece to be processed can be achieved over a wide range.

[0107] According to another aspect of the present application, a processing parameter detection device is also provided. This processing parameter detection device can be applied to processing equipment. Figure 8 shows a schematic block diagram of a processing parameter detection device 800 according to one embodiment of the present application. As shown in Figure 8, the processing parameter detection device 800 may include an acquisition module 810, a first determination module 820, a second determination module 830, and a third determination module 840.

[0108] The acquisition module 810 is configured to acquire a first image to be measured, where the first image to be measured includes a workpiece to be processed.

[0109] The first determination module 820 is configured to determine a first image position of a first target feature point in a first image to be measured, wherein the workpiece to be processed includes at least two predetermined processing lines, and the first target feature point is a feature point on any of the predetermined processing lines.

[0110] The second determination module 830 is used to determine at least one predicted processing mark based on the first position information and preset processing parameters, wherein the first position information is the first image position or the first physical position of the first target feature point determined based on the first image position, the at least one predicted processing mark includes at least one predicted processing line and / or at least one first predicted feature point, and the preset processing parameters include a preset spacing between any two adjacent predetermined processing lines of the at least two predetermined processing lines.

[0111] The third determination module 840 is used to determine whether the preset processing parameters are qualified based on position detection information related to at least one predicted processing mark, wherein the position detection information is used to indicate whether the position of the at least one predicted processing mark matches the position of the predetermined processing mark, and the predetermined processing mark includes at least one predetermined processing line and / or at least one feature point on the predetermined processing line.

[0112] A person skilled in the art can understand the specific implementation scheme and technical effects of the above-mentioned processing parameter detection device by reading the above-mentioned description of the processing parameter detection method 100. For the sake of brevity, they will not be repeated here.

[0113] According to another aspect of the present application, an electronic device is also provided. FIG9 shows a schematic block diagram of an electronic device according to an embodiment of the present application. As shown in FIG9 , the electronic device 900 includes a processor 910 and a memory 920 . The memory 920 stores a computer program. When the computer program instructions are executed by the processor 910 , they are used to execute the above-mentioned processing parameter detection method.

[0114] According to another aspect of the present application, a storage medium is provided, storing a computer program / instructions. The storage medium may include, for example, a storage component of a tablet computer, a hard disk of a personal computer, an erasable programmable read-only memory (EPROM), a compact disc read-only memory (CD-ROM), a USB memory, or any combination thereof. The storage medium may be any combination of one or more computer-readable storage media. The computer program / instructions are used by a processor to execute the above-described processing parameter detection method when executed.

[0115] A person skilled in the art can understand the specific implementation scheme of the above-mentioned electronic device and storage medium by reading the above description of the processing parameter detection method. For the sake of brevity, it will not be repeated here.

[0116] Example:

[0117] Example 1: A processing parameter detection method is applied to a processing device, wherein the method comprises:

[0118] Acquire a first image to be measured, where the first image to be measured includes a workpiece to be processed;

[0119] Determining a first image position of a first target feature point in the first image to be measured, wherein the workpiece to be processed includes at least two predetermined processing lines, and the first target feature point is a feature point on any of the predetermined processing lines;

[0120] determining at least one predicted processing mark based on first position information and preset processing parameters, wherein the first position information is the first image position or a first physical position of the first target feature point determined based on the first image position, the at least one predicted processing mark includes at least one predicted processing line and / or at least one first predicted feature point, and the preset processing parameters include a preset spacing between any two adjacent predetermined processing lines of the at least two predetermined processing lines;

[0121] Based on position detection information related to the at least one predicted processing mark, determining whether the preset processing parameters are qualified, wherein the position detection information is used to indicate whether the position of the at least one predicted processing mark matches the position of a predetermined processing mark, and the predetermined processing mark includes at least one predetermined processing line and / or at least one feature point on the predetermined processing line.

[0122] Embodiment 2: The method according to embodiment 1, wherein the processing equipment includes a first image acquisition device and a second image acquisition device, the image acquisition range of the first image acquisition device is larger than the image acquisition range of the second image acquisition device, and the first image to be measured is an image acquired by the second image acquisition device;

[0123] When the at least one predicted processing identifier includes the at least one predicted processing line, determining the at least one predicted processing identifier according to the first position information and the preset processing parameters includes:

[0124] Identifying the contour of the workpiece to be processed from the second image to be measured acquired by the first image acquisition device;

[0125] Determining at least one predicted line segment along a target direction according to the first position information, the preset processing parameters, and the contour of the workpiece to be processed;

[0126] The at least one predicted processing line includes the at least one predicted line segment, one of the at least one predicted line segments passes through the first target feature point, the distance between any two predicted line segments is equal to the preset spacing of the predetermined processing line in the direction perpendicular to the target direction, and the two endpoints of each predicted line segment are located within the contour of the workpiece to be processed.

[0127] Embodiment 3: The method according to embodiment 1 or 2, wherein

[0128] The step of determining at least one predicted line segment along a target direction based on the first position information, the preset processing parameters, and the contour of the workpiece to be processed includes:

[0129] According to the first position information, a target straight line is drawn along the target direction through the starting feature point until the drawn target straight line intersects with the contour of the workpiece to be processed, wherein the starting feature point is the first target feature point or a second target feature point closest to the product center of the workpiece to be processed and determined based on the first target feature point;

[0130] The starting feature point is translated in a direction perpendicular to the target direction by an integer multiple of the preset spacing to obtain one or more new feature points, and a target straight line is made along the target direction through each new feature point until the target straight line made intersects with the contour of the workpiece to be processed; or, the target straight line passing through the starting feature point is translated in a direction perpendicular to the target direction by an integer multiple of the preset spacing to obtain one or more new target straight lines, wherein the portion of the target straight line located within the contour of the workpiece to be processed is a predicted line segment passing through the corresponding feature point.

[0131] Embodiment 4: According to the method described in any one of Embodiments 1-3, after determining at least one predicted line segment along the target direction based on the first position information, the preset processing parameters, and the contour of the workpiece to be processed, the method further includes:

[0132] displaying a third image to be measured with the at least one predicted line segment, where the third image to be measured is at least a portion of the image captured by the first image capture device;

[0133] The determining whether the preset processing parameters are qualified based on the position detection information related to the at least one predicted processing mark includes:

[0134] In response to the qualified indication information input by the user, determining that the preset processing parameters are qualified; and / or, in response to the unqualified indication information input by the user, determining that the preset processing parameters are unqualified;

[0135] In which, the position detection information includes the qualified indication information and / or the unqualified indication information, the qualified indication information is used to indicate that the position of the at least one predicted processing mark matches the position of the predetermined processing mark, and the unqualified indication information is used to indicate that the position of the at least one predicted processing mark does not match the position of the predetermined processing mark.

[0136] Embodiment 5: According to the method described in any one of Embodiments 1-4, when the at least one predicted processing mark includes the at least one first predicted feature point, determining the at least one predicted processing mark based on the first position information and the preset processing parameters includes:

[0137] Determine, based on the first position information and preset processing parameters, a physical position whose distance from the first physical position or the second physical position determined based on the first position information meets a preset distance condition as a third physical position of the first predicted feature point;

[0138] In which, the second physical position is the physical position corresponding to the second target feature point closest to the product center of the workpiece to be processed, the distance condition includes a first spacing in which the distance in the second direction is equal to the first quantity and a second spacing in which the distance in the first direction is equal to the second quantity, the first direction and the second direction are perpendicular to each other, and the preset spacing includes the first spacing and / or the second spacing.

[0139] Embodiment 6: The method according to any one of embodiments 1-5, wherein the processing equipment includes a second image acquisition device, and the first image to be measured is an image acquired by the second image acquisition device;

[0140] The determining whether the preset processing parameters are qualified based on the position detection information related to the at least one predicted processing mark includes:

[0141] moving the center of the field of view of the second image acquisition device to the third physical position;

[0142] Acquire a fourth image to be measured captured by the second image capturing device after the movement;

[0143] Identifying a third target feature point from the fourth image to be measured;

[0144] Determining an image position difference between the image positions of the third target feature point and the center of the field of view of the second image acquisition device in the fourth image to be measured, or a physical position difference between the physical positions corresponding to the third target feature point and the center of the field of view of the second image acquisition device;

[0145] determining whether the image position difference is less than or equal to a first preset error threshold or whether the physical position difference is less than or equal to a second preset error threshold to obtain a position determination result, wherein the position detection information includes the position determination result;

[0146] When the position judgment result indicates that the position of the predicted processing mark matches the position of the predetermined processing mark, determining that the preset processing parameters are qualified; otherwise, determining that the preset processing parameters are unqualified;

[0147] Among them, when the image position difference is less than or equal to the first preset error threshold or the physical position difference is less than or equal to the second preset error threshold, the position judgment result indicates that the position of the predicted processing mark matches the position of the predetermined processing mark; when the image position difference is greater than the first preset error threshold or the physical position difference is greater than the second preset error threshold, the position judgment result indicates that the position of the predicted processing mark does not match the position of the predetermined processing mark.

[0148] Embodiment 7: The method according to any one of embodiments 1-6, wherein:

[0149] Before moving the field of view center of the second image acquisition device to the third physical position, the method further includes:

[0150] moving the field of view center of the second image acquisition device to the first physical position or the second physical position according to the first position information;

[0151] Moving the field of view center of the second image acquisition device to the third physical position includes:

[0152] The field of view center of the second image acquisition device is moved by a distance specified by the preset distance condition, so that the field of view center of the second image acquisition device moves to the third physical position.

[0153] Embodiment 8: The method according to any one of embodiments 1-7, wherein:

[0154] Before determining the first image position of the first target feature point in the first image to be measured, the method further includes:

[0155] Performing feature point matching in the first image to be measured using a first template image containing template feature points;

[0156] determining a feature point identified from the first image to be tested and matching the template feature point as the first target feature point;

[0157] The identifying a third target feature point from the fourth image to be measured includes:

[0158] Performing feature point matching in the fourth image to be measured using the first template image;

[0159] A feature point identified from the fourth image to be tested and matching the template feature point is determined as the third target feature point.

[0160] Embodiment 9: The method according to any one of embodiments 1-8, wherein the processing equipment includes a second image acquisition device, and the first image to be measured is an image acquired by the second image acquisition device;

[0161] Before determining the first image position of the first target feature point in the first image to be measured, the method further includes: a first operation; or, the first operation and a second operation performed after the first operation; or, the first operation, the second operation, and a third operation performed after the second operation; wherein,

[0162] The first operation includes: identifying a fourth target feature point from a fifth image to be measured acquired by the second image acquisition device;

[0163] The second operation includes: correcting the target predetermined processing line where the fourth target feature point is located according to the first direction; after the correction is completed, moving the center of the field of view of the second image acquisition device to the physical position corresponding to when the second image acquisition device captured the fifth image to be tested; obtaining a sixth image to be tested captured after the second image acquisition device is moved; and identifying the fifth target feature point from the sixth image to be tested;

[0164] The third operation includes: determining a fourth physical position corresponding to a second target feature point closest to the product center of the workpiece to be processed based on the image position of the fifth target feature point in the sixth image to be measured; moving the field of view center of the second image acquisition device to the fourth physical position; acquiring a seventh image to be measured acquired after the second image acquisition device has moved; and identifying a sixth target feature point from the seventh image to be measured.

[0165] Among them, when the method includes the first operation but does not include the second operation, the fifth image to be tested is the first image to be tested, and the fourth target feature point is the first target feature point; when the method includes the first operation and the second operation but does not include the third operation, the sixth image to be tested is the first image to be tested, and the fifth target feature point is the first target feature point; when the method includes the first operation, the second operation and the third operation, the seventh image to be tested is the first image to be tested, and the sixth target feature point is the first target feature point.

[0166] Embodiment 10: The method according to any one of Embodiments 1-9, wherein the processing equipment further comprises a first image acquisition device, the image acquisition range of the first image acquisition device being larger than the image acquisition range of the second image acquisition device, and wherein, before identifying the fourth target feature point from the fifth image to be measured acquired by the second image acquisition device, the method further comprises:

[0167] identifying a contour of the workpiece to be processed from an eighth image to be measured captured by the first image acquisition device, wherein when the first image acquisition device acquires the eighth image to be measured, a center of a field of view of the first image acquisition device coincides with a center of a carrying device for carrying the workpiece to be processed;

[0168] Determining a second image position of a product center of the workpiece to be processed in the eighth image to be measured based on a contour of the workpiece to be processed;

[0169] Determining a physical position difference corresponding to a third image position difference based on an image position difference between a third image position corresponding to a center of a field of view of the first image acquisition device and the second image position and a conversion relationship between image positions and physical positions;

[0170] Moving the carrying device to within the field of view of the second image acquisition device, wherein the center of the carrying device after the movement coincides with the center of the field of view of the second image acquisition device;

[0171] Based on the physical position difference, adjusting the position of the carrying device so that the physical position corresponding to the product center of the workpiece to be processed on the adjusted carrying device coincides with the physical position corresponding to the field of view center of the second image acquisition device;

[0172] The fifth image to be measured acquired by the second image acquisition device after the adjustment is completed is acquired.

[0173] Embodiment 11: The method according to any one of Embodiments 1-10, wherein before determining the physical position difference corresponding to the image position difference between the third image position corresponding to the field of view center of the first image acquisition device and the second image position and the conversion relationship between the image position and the physical position, the method further comprises:

[0174] Acquire a plurality of ninth images to be measured, the plurality of ninth images to be measured being images acquired by the second image acquisition device of the workpiece to be processed when the workpiece is respectively at a plurality of fifth physical positions, the number of the plurality of ninth images to be measured being greater than or equal to three, and any two of the plurality of fifth physical positions being different;

[0175] For each ninth image to be measured in the plurality of ninth images to be measured, determining an image position of the identification feature in the ninth image to be measured according to a second template image, wherein the second template image includes the identification feature on the workpiece to be processed;

[0176] The conversion relationship is determined according to the image position of the identification feature in the plurality of ninth images to be tested and the plurality of fifth physical positions.

[0177] Embodiment 12: According to the method described in any one of Embodiments 1-11, wherein determining the fourth physical position corresponding to the second target feature point closest to the product center of the workpiece to be processed based on the image position of the fifth target feature point in the sixth image to be measured includes:

[0178] Determining, based on the image position of the fifth target feature point in the sixth image to be measured and the preset spacing, at least one second predicted feature point closest to the product center, wherein the at least one second preset feature point is distributed circumferentially relative to the product center;

[0179] Calculating a distance between each of the at least one second prediction feature point and the product center;

[0180] The second predicted feature point with the smallest distance from the product center among the at least one second predicted feature point is determined as the second target feature point, and the physical location corresponding to the second target feature point is determined as the fourth physical location.

[0181] Embodiment 13: According to the method described in any one of embodiments 1-12, wherein the correcting the target predetermined processing line where the fourth target feature point is located according to the first direction comprises:

[0182] Using the fourth target feature point as a reference position point, sequentially determining multiple groups of position points, each group of position points including a first position point and a second position point, the first position point and the second position point being located on either side of the reference position point, and along the first direction, a distance between two position points included in each of the multiple groups of position points gradually increases, and different position points in the reference position point and the multiple groups of position points are position points corresponding to different feature points on the target predetermined processing line;

[0183] After each set of position points is determined, the angle of the line between the first position point and the second position point in the set of position points relative to the first direction is calculated, and the following correction operation is performed:

[0184] When the connecting line angle is greater than a preset angle threshold, determining a corresponding adjustment angle according to the connecting line angle, and adjusting the position of the workpiece to be processed based on the adjustment angle to correct the position of the target predetermined processing line on the workpiece to be processed;

[0185] When the connecting line angle is less than or equal to the preset angle threshold, stopping the correction;

[0186] In which, after each time a group of position points is determined and the correction operation corresponding to the group of position points is completed, the step of determining the next group of position points is performed, wherein along the first direction, the distance between two position points included in the next group of position points is greater than the distance between two position points included in the current group of position points.

[0187] Example 14: A processing parameter detection device, which is applied to processing equipment, wherein the device comprises:

[0188] An acquisition module, configured to acquire a first image to be measured, wherein the first image to be measured includes a workpiece to be processed;

[0189] a first determining module, configured to determine a first image position of a first target feature point in the first image to be measured, wherein the workpiece to be processed includes at least two predetermined processing lines, and the first target feature point is a feature point on any of the predetermined processing lines;

[0190] a second determining module, configured to determine at least one predicted processing mark based on first position information and preset processing parameters, wherein the first position information is the first image position or a first physical position of the first target feature point determined based on the first image position, the at least one predicted processing mark includes at least one predicted processing line and / or at least one first predicted feature point, and the preset processing parameters include a preset spacing between any two adjacent predetermined processing lines among the at least two predetermined processing lines;

[0191] A third determination module is used to determine whether the preset processing parameters are qualified based on position detection information related to the at least one predicted processing mark, wherein the position detection information is used to indicate whether the position of the at least one predicted processing mark matches the position of the predetermined processing mark, and the predetermined processing mark includes at least one predetermined processing line and / or at least one feature point on the predetermined processing line.

[0192] Example 15: An electronic device comprises a processor and a memory, wherein the memory stores computer program instructions, and the computer program instructions are used by the processor to execute the processing parameter detection method described in any one of Examples 1-13 when the processor is running.

[0193] Example 16: A storage medium storing a computer program / instruction, wherein the computer program / instruction is used to execute the processing parameter detection method described in any one of Examples 1-13 when running.

[0194] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely illustrative and are not intended to limit the scope of the present application. Various changes and modifications may be made therein by those skilled in the art without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0195] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0196] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units described is merely a logical function division. In actual implementation, other division methods may be used, such as combining or integrating multiple units or components into another device, or ignoring or not performing some features.

[0197] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0198] Similarly, it should be understood that in order to streamline the present application and aid in understanding one or more of the various inventive aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, this approach of the present application should not be interpreted as reflecting the intention that the application claimed for protection requires more features than those explicitly recited in each claim. More precisely, as reflected in the corresponding claims, the inventive point is that the corresponding technical problem can be solved with fewer features than all the features of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into the detailed description, with each claim itself serving as a separate embodiment of the present application.

[0199] It will be understood by those skilled in the art that, except where mutually exclusive, all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or apparatus disclosed herein may be combined in any combination. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature providing the same, equivalent, or similar purpose.

[0200] Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of this application and to form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

[0201] The various component embodiments of the present application can be implemented in hardware, or implemented in a software module running on one or more processors, or implemented in a combination thereof. Those skilled in the art will appreciate that a microprocessor or digital signal processor (DSP) can be used in practice to implement some or all of the functions of some modules in the processing parameter detection device according to an embodiment of the present application. The application can also be implemented as a part or all of a device program (such as, a computer program and a computer program product) for performing the method described herein. Such a program realizing the present application can be stored on a computer-readable medium, or can have the form of one or more signals. Such a signal can be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.

[0202] It should be noted that the above embodiments illustrate rather than limit the present application, and that a person skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbols placed between brackets should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present application may be implemented by means of hardware comprising several different elements and by means of appropriately programmed computers. In a unit claim enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third etc. does not indicate any order. These words may be interpreted as names.

[0203] The above description is merely a specific embodiment or illustration of a specific embodiment of the present application, and the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. The scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A processing parameter detection method, applied to processing equipment, characterized in that: The method comprises: Acquire a first image to be measured, wherein the first image to be measured includes a workpiece to be processed; Determine a first image position of a first target feature point in the first image to be measured in the first image to be measured, wherein the workpiece to be processed includes at least two predetermined processing lines, and the first target feature point is a feature point on any predetermined processing line; Determine at least one predicted processing mark according to the first position information and the preset processing parameters, wherein the first position information is the first image position or the first physical position of the first target feature point determined based on the first image position, the at least one predicted processing mark includes at least one predicted processing line and / or at least one first predicted feature point, and the preset processing parameters include a preset spacing between any two adjacent predetermined processing lines of the at least two predetermined processing lines; Based on position detection information related to the at least one predicted processing mark, it is determined whether the preset processing parameters are qualified, wherein the position detection information is used to indicate whether the position of the at least one predicted processing mark matches the position of a predetermined processing mark, and the predetermined processing mark includes at least one predetermined processing line and / or at least one feature point on the predetermined processing line.

2. The method according to claim 1, characterized in that The processing equipment comprises a first image acquisition device and a second image acquisition device, the image acquisition range of the first image acquisition device is larger than the image acquisition range of the second image acquisition device, wherein the first image to be measured is an image acquired by the second image acquisition device; When the at least one predicted processing mark includes the at least one predicted processing line, determining the at least one predicted processing mark according to the first position information and the preset processing parameters includes: Identifying the contour of the workpiece to be processed from the second image to be measured acquired by the first image acquisition device; Determine at least one predicted line segment along a target direction according to the first position information, the preset processing parameters, and the contour of the workpiece to be processed; Among them, the at least one predicted processing line includes the at least one predicted line segment, there is a predicted line segment among the at least one predicted line segment passing through the first target feature point, the distance between any two predicted line segments is equal to the preset spacing of the predetermined processing line in the direction perpendicular to the target direction, and the two endpoints of each predicted line segment are located within the contour of the workpiece to be processed.

3. The method according to claim 2, characterized in that The step of determining at least one predicted line segment along a target direction according to the first position information, the preset processing parameters, and the contour of the workpiece to be processed includes: According to the first position information, a target straight line is made along the target direction through the starting feature point until the target straight line intersects with the contour of the workpiece to be processed, wherein the starting feature point is the first target feature point or a second target feature point determined based on the first target feature point and closest to the product center of the workpiece to be processed; The starting feature point is translated in a direction perpendicular to the target direction by an integer multiple of the preset spacing to obtain one or more new feature points, and a target straight line is made along the target direction through each new feature point until the made target straight line intersects with the contour of the workpiece to be processed; or, the target straight line passing through the starting feature point is translated in a direction perpendicular to the target direction by an integer multiple of the preset spacing to obtain one or more new target straight lines, wherein the portion of the target straight line located within the contour of the workpiece to be processed is a predicted line segment passing through the corresponding feature point.

4. The method according to claim 2, characterized in that After determining at least one predicted line segment along a target direction according to the first position information, the preset processing parameters and the contour of the workpiece to be processed, the method further includes: Displaying a third image to be tested with the at least one predicted line segment, wherein the third image to be tested is at least a portion of the image captured by the first image capture device; The determining whether the preset processing parameters are qualified based on the position detection information related to the at least one predicted processing mark includes: In response to qualified indication information input by a user, determining that the preset processing parameters are qualified; and / or, in response to unqualified indication information input by a user, determining that the preset processing parameters are unqualified; Wherein, the position detection information includes the qualified indication information and / or the unqualified indication information, the qualified indication information is used to indicate that the position of the at least one predicted processing mark matches the position of the predetermined processing mark, and the unqualified indication information is used to indicate that the position of the at least one predicted processing mark does not match the position of the predetermined processing mark.

5. The method according to claim 1, characterized in that When the at least one predicted processing mark includes the at least one first predicted feature point, determining the at least one predicted processing mark according to the first position information and the preset processing parameters includes: According to the first position information and the preset processing parameters, a physical position whose distance from the first physical position or the second physical position determined based on the first position information meets a preset distance condition is determined as a third physical position of the first predicted feature point; Among them, the second physical position is the physical position corresponding to the second target feature point closest to the product center of the workpiece to be processed, the distance condition includes a first spacing in the second direction equal to a first quantity and a second spacing in the first direction equal to a second quantity, the first direction and the second direction are perpendicular to each other, and the preset spacing includes the first spacing and / or the second spacing.

6. The method according to claim 5, characterized in that The processing equipment includes a second image acquisition device, and the first image to be measured is an image acquired by the second image acquisition device; The determining whether the preset processing parameters are qualified based on the position detection information related to the at least one predicted processing mark includes: moving the center of the field of view of the second image acquisition device to the third physical position; Acquire a fourth image to be measured captured by the second image acquisition device after the movement; Identifying a third target feature point from the fourth image to be tested; Determine an image position difference between the image positions of the third target feature point and the center of the field of view of the second image acquisition device in the fourth image to be measured or a physical position difference between the physical positions corresponding to the third target feature point and the center of the field of view of the second image acquisition device; Determine whether the image position difference is less than or equal to a first preset error threshold or whether the physical position difference is less than or equal to a second preset error threshold to obtain a position determination result, wherein the position detection information includes the position determination result; When the position judgment result indicates that the position of the predicted processing mark matches the position of the predetermined processing mark, determining that the preset processing parameters are qualified, otherwise determining that the preset processing parameters are unqualified; Among them, when the image position difference is less than or equal to the first preset error threshold or the physical position difference is less than or equal to the second preset error threshold, the position judgment result indicates that the position of the predicted processing mark matches the position of the predetermined processing mark; when the image position difference is greater than the first preset error threshold or the physical position difference is greater than the second preset error threshold, the position judgment result indicates that the position of the predicted processing mark does not match the position of the predetermined processing mark.

7. The method according to claim 6, characterized in that Before moving the field of view center of the second image acquisition device to the third physical position, the method further includes: According to the first position information, moving the field of view center of the second image acquisition device to the first physical position or the second physical position; The step of moving the field of view center of the second image acquisition device to the third physical position comprises: The field of view center of the second image acquisition device is moved by a distance specified by the preset distance condition, so that the field of view center of the second image acquisition device moves to the third physical position.

8. The method according to claim 6, characterized in that Before determining the first image position of the first target feature point in the first image to be tested, the method further includes: Using a first template image containing template feature points to perform feature point matching in the first image to be tested; Determining a feature point matched with the template feature point identified from the first image to be tested as the first target feature point; The step of identifying a third target feature point from the fourth image to be tested includes: Performing feature point matching in the fourth image to be tested using the first template image; A feature point identified from the fourth image to be tested and matching the template feature point is determined as the third target feature point.

9. The method according to any one of claims 1 to 8, characterized in that The processing equipment includes a second image acquisition device, and the first image to be measured is an image acquired by the second image acquisition device; Before determining the first image position of the first target feature point in the first image to be tested in the first image to be tested, the method further includes: a first operation; or, the first operation and a second operation performed after the first operation; or, the first operation, the second operation and a third operation performed after the second operation; wherein, The first operation includes: identifying a fourth target feature point from a fifth image to be measured acquired by the second image acquisition device; The second operation includes: correcting the target predetermined processing line where the fourth target feature point is located according to the first direction; after the correction is completed, moving the field of view center of the second image acquisition device to the physical position corresponding to when the second image acquisition device acquires the fifth image to be tested; acquiring the sixth image to be tested acquired after the second image acquisition device moves; and identifying the fifth target feature point from the sixth image to be tested; The third operation includes: determining a fourth physical position corresponding to a second target feature point closest to the product center of the workpiece to be processed based on the image position of the fifth target feature point in the sixth image to be tested; moving the field of view center of the second image acquisition device to the fourth physical position; acquiring a seventh image to be tested acquired after the second image acquisition device is moved; and identifying a sixth target feature point from the seventh image to be tested; Among them, when the method includes the first operation but does not include the second operation, the fifth image to be tested is the first image to be tested, and the fourth target feature point is the first target feature point; when the method includes the first operation and the second operation but does not include the third operation, the sixth image to be tested is the first image to be tested, and the fifth target feature point is the first target feature point; when the method includes the first operation, the second operation and the third operation, the seventh image to be tested is the first image to be tested, and the sixth target feature point is the first target feature point.

10. The method according to claim 9, characterized in that The processing equipment further includes a first image acquisition device, the image acquisition range of the first image acquisition device is larger than the image acquisition range of the second image acquisition device, wherein before identifying the fourth target feature point from the fifth image to be measured acquired by the second image acquisition device, the method further includes: Identify the contour of the workpiece to be processed from the eighth image to be measured acquired by the first image acquisition device, wherein when the first image acquisition device acquires the eighth image to be measured, the center of the field of view of the first image acquisition device coincides with the center of the carrying device for carrying the workpiece to be processed; Based on the contour of the workpiece to be processed, determining a second image position of a product center of the workpiece to be processed in the eighth image to be measured; Determine a physical position difference corresponding to the image position difference based on an image position difference between a third image position corresponding to the center of the field of view of the first image acquisition device and the second image position and a conversion relationship between the image position and the physical position; Move the carrying device to within the field of view of the second image acquisition device, wherein the center of the carrying device after the movement coincides with the center of the field of view of the second image acquisition device; Based on the physical position difference, adjusting the position of the carrying device so that the physical position corresponding to the product center of the workpiece to be processed on the adjusted carrying device coincides with the physical position corresponding to the field of view center of the second image acquisition device; The fifth image to be measured acquired by the second image acquisition device after the adjustment is completed is acquired.

11. The method according to claim 10, characterized in that Before determining the physical position difference corresponding to the image position difference between the third image position corresponding to the field of view center of the first image acquisition device and the second image position and the conversion relationship between the image position and the physical position, the method further includes: Acquire a plurality of ninth images to be measured, wherein the plurality of ninth images to be measured are images acquired by the second image acquisition device for the workpiece to be processed when the workpiece to be processed is respectively in a plurality of fifth physical positions, the number of the plurality of ninth images to be measured is greater than or equal to 3, and any two of the plurality of fifth physical positions are different; For each ninth image to be tested among the plurality of ninth images to be tested, determining an image position of the identification feature in the ninth image to be tested according to a second template image, wherein the second template image includes the identification feature on the workpiece to be processed; The conversion relationship is determined according to the image position of the identification feature in the plurality of ninth images to be tested and the plurality of fifth physical positions.

12. The method according to claim 9, characterized in that The determining, based on the image position of the fifth target feature point in the sixth image to be measured, a fourth physical position corresponding to the second target feature point closest to the product center of the workpiece to be processed includes: Determine, according to the image position of the fifth target feature point in the sixth image to be tested and the preset spacing, at least one second predicted feature point closest to the product center, wherein the at least one second preset feature point is distributed circumferentially relative to the product center; Calculating the distance between each of the at least one second prediction feature point and the product center; The second predicted feature point with the smallest distance from the product center among the at least one second predicted feature point is determined as the second target feature point, and the physical position corresponding to the second target feature point is determined as the fourth physical position.

13. The method according to claim 9, characterized in that The correcting the target predetermined processing line where the fourth target feature point is located according to the first direction includes: Taking the fourth target feature point as a reference position point, a plurality of groups of position points are determined in sequence, each group of position points includes a first position point and a second position point, the first position point and the second position point are located on both sides of the reference position point, and along the first direction, the distance between two position points included in each of the plurality of groups of position points gradually increases, and different position points in the reference position point and the plurality of groups of position points are position points corresponding to different feature points on the target predetermined processing line; After a group of position points is determined each time, the angle of the line between the first position point and the second position point in the group of position points relative to the first direction is calculated, and the following correction operation is performed: In the case where the connecting line angle is greater than a preset angle threshold, determining a corresponding adjustment angle according to the connecting line angle, and adjusting the position of the workpiece to be processed based on the adjustment angle to correct the position of the target predetermined processing line on the workpiece to be processed; When the connection angle is less than or equal to the preset angle threshold, stopping the correction; Wherein, after each determination of a group of position points and the completion of the correction operation corresponding to the group of position points, the step of determining the next group of position points is performed, wherein, along the first direction, the spacing between two position points included in the next group of position points is greater than the spacing between two position points included in the current group of position points.

14. A processing parameter detection device, applied to processing equipment, characterized in that: The device comprises: An acquisition module, used for acquiring a first image to be measured, wherein the first image to be measured contains a workpiece to be processed; A first determination module is used to determine a first image position of a first target feature point in the first image to be measured in the first image to be measured, wherein the workpiece to be processed includes at least two predetermined processing lines, and the first target feature point is a feature point on any predetermined processing line; a second determination module, configured to determine at least one predicted processing mark according to first position information and preset processing parameters, wherein the first position information is the first image position or a first physical position of the first target feature point determined based on the first image position, the at least one predicted processing mark includes at least one predicted processing line and / or at least one first predicted feature point, and the preset processing parameters include a preset spacing between any two adjacent predetermined processing lines of the at least two predetermined processing lines; A third determination module is used to determine whether the preset processing parameters are qualified based on position detection information related to the at least one predicted processing mark, wherein the position detection information is used to indicate whether the position of the at least one predicted processing mark matches the position of the predetermined processing mark, and the predetermined processing mark includes at least one predetermined processing line and / or at least one feature point on the predetermined processing line.

15. An electronic device comprising a processor and a memory, characterized in that: The memory stores computer program instructions, which are used by the processor to execute the processing parameter detection method according to any one of claims 1 to 13 when the processor is running the computer program instructions.

16. A storage medium storing a computer program / instruction, characterized in that: The computer program / instructions are used to execute the processing parameter detection method according to any one of claims 1 to 13 when running.

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