Heat exchanger panel for controlling the temperature of building rooms

Abstract

The invention relates to a heat exchanger panel for controlling the temperature of building rooms. The heat exchanger panel comprises a heat exchanger, which has a medium line for conducting a heat exchanger medium and a heat exchanger wall which is in thermal contact with the medium line. The heat exchanger wall has a boundary surface facing the building room the temperature of which is to be controlled, said boundary surface being able to be brought to a temperature which is lower than a heat load or higher than a cold load. The heat exchanger panel furthermore comprises a layer of a polymer material, which is arranged on the boundary surface of the heat exchanger, wherein the layer has gas bubbles or gas chambers and is therefore at least partially permeable for heat radiation. The heat exchanger panel is characterised in that the layer of polymer material has a transparency with respect to the heat radiation of no more than 30%.

Description

[0001] Heat exchanger panel for tempering building rooms

[0002] The invention relates to a heat exchanger panel for tempering building rooms and a method for tempering the building rooms with such a heat exchanger panel.

[0003] It is known for the temperature control of buildings, i.e., for heating and cooling, to heat or cool a building component, e.g., using a heated or cooled pipe register. This allows the component to release heat to the room air and surrounding surfaces through radiation exchange, or to absorb heat from the room air and surrounding surfaces and heat loads within the room, thereby influencing the indoor climate. Ceiling panels, wall panels, or underfloor heating systems are often equipped with a water-based pipe register or electrically operated heating wire. This can be installed directly during construction or retrofitted to an existing building.

[0004] DE 10 2008 053 ​​192 A1, for example, relates to a solar collector with a cooling function, whereby the solar collector can, on the one hand, convert incoming solar radiation into heat and, on the other hand, dissipate heat energy, for example from a building. For this purpose, the solar collector comprises a device through which a first heat transfer fluid flows, which is in contact with an absorber. By means of the absorber, incoming solar radiation is converted into heat, and the heat is dissipated by the first heat transfer fluid. The solar collector also comprises a device through which a second heat transfer fluid flows, which leads to an outer surface. By means of the second heat transfer fluid, heat is conveyed to the outer surface, where it is dissipated into the environment.

[0005] Furthermore, DE 20 2008 014 419 U1 discloses a solar-powered collective collector for the simultaneous generation of electrical power and thermal heat, as well as a solar cooling unit. The collective collector comprises a light entry plate, at least one photovoltaic cell, at least one light absorber layer, and at least one pipe filled with a fluid, wherein the fluid is heated. Sunlight penetrates the light entry plate and passes through a passage in the photovoltaic cell to the light absorber layer, which absorbs the sunlight and is thus heated. The light absorber layer is in thermal contact with the pipe, whereby the fluid in the pipe is heated. The collective collector is particularly suitable for use with a refrigeration machine. CN 107606824 A shows an evaporator and an air conditioning refrigeration system.The evaporator comprises a heat exchanger element and a heat-resistant, permeable plate, wherein the heat-resistant, permeable plate is arranged on at least one side of the heat exchanger element, on its surface, and is in contact with the room air. The heat-resistant, permeable plate is heat-insulating and at least partially permeable to thermal radiation. The material of the heat-resistant, permeable plate can be polyethylene. The heat exchanger element further comprises a tube through which a cooling medium can be passed. The evaporator can thus dissipate heat from a room by absorbing the thermal radiation generated therein.

[0006] Based on the prior art, the present invention is therefore based on the object of providing a heat exchanger panel for tempering building rooms, which tempers the building rooms in an energy-efficient manner and, in particular, has a good cooling effect with a very low convection component.

[0007] A further object of the present invention is to provide a heat exchanger panel for tempering building rooms, which has a high heat radiation exchange in a wide temperature spectrum.

[0008] A further object of the present invention is to provide a heat exchanger panel for tempering building rooms, which virtually eliminates the formation of condensate on the heat exchanger panel.

[0009] Furthermore, it is an object of the present invention to provide a heat exchanger panel for tempering building rooms, which has a high mechanical stability, whereby the heat radiation exchange is hardly influenced thereby.

[0010] Furthermore, it is an object of the present invention to provide a heat exchanger panel for tempering building rooms, which is visually appealing without significantly influencing the heat radiation exchange.

[0011] One or more of these objects are achieved by the features of the independent patent claim. Advantageous embodiments are specified in the dependent subclaims.

[0012] According to a first aspect of the invention, a heat exchanger panel is provided for controlling the temperature of building spaces. The heat exchanger panel comprises a heat exchanger having a medium line for conducting a heat exchanger medium and a heat exchanger wall in thermal contact with the medium line. The heat exchanger wall has an interface facing the building space to be temperature-controlled, which interface can be brought to a lower temperature relative to a heat load or a higher temperature relative to a cold load. The heat exchanger panel further comprises a layer made of a polymer material arranged on the interface of the heat exchanger, wherein the layer has gas bubbles or gas chambers, such that it is at least partially permeable to thermal radiation.The heat exchanger panel is characterized by the fact that the layer of polymer material has a transparency of no more than 30% in a wavelength range of thermal radiation between 9 pm and 11 pm.

[0013] Thermal radiation is electromagnetic radiation in the infrared wavelength range that at least partially penetrates the layer of polymer material. The wavelength range of thermal radiation (infrared radiation) typically extends from 780 nm to 1 mm. The term room temperature radiation can also be used for the spectral range from 4 pm to 12 pm. This spectral range contains a large part of the energy of the thermal radiation from a blackbody radiator at approximately room temperature. If the heat exchanger panel is to be used for cooling in a warmer climate, this spectral range can be slightly shifted. Shorter wavelengths can also occur if the building space has special heat sources, such as electrical devices. The spectral range from approximately 2 pm to approximately 100 pm contains almost all of the energy of the thermal radiation from a blackbody radiator at approximately room temperature.

[0014] The wavelength range between 9 pm and 11 pm covers the maximum of room temperature radiation, which is why this range is also the most important for assessing transparency.

[0015] The layer made of polymer material has a transparency of no more than 30% in the thermal radiation wavelength range between 9 pm and 11 pm. Although this means that the layer has a transparency of no more than 30% in this wavelength range, the layer also has a certain degree of transparency in the remaining wavelength range between 780 nm and 1 mm, particularly in the range between 2 pm and 100 pm. This transparency can be higher than 30% for individual wavelengths, but on average the layer has a transparency of no more than 30% over the wavelength range from 780 nm to 1 mm, particularly between 2 pm and 100 pm. As a rule, the layer actually has a significantly higher absorption at certain specific wavelengths, so that the transparency is lower at certain specific wavelengths.

[0016] The layer made of polymer material has a transparency of no more than 30% with respect to thermal radiation in the wavelength range between 9 pm and 11 pm across the entire local average of the volume of the layer. For the other wavelengths of thermal radiation, the layer made of polymer material generally has the same properties. Such a layer is preferably a foam layer. A foam layer is not homogeneous, i.e. different amounts of material are present at different locations in the cross-section. A transparency of the layer made of polymer material of no more than 30% with respect to thermal radiation in a wavelength range between 9 pm and 11 pm means that, viewed across the entire volume of the layer, on a local average no more than 30% of the total thermal radiation between 9 pm and 11 pm striking a surface of the layer facing the building reaches the interface.At individual locations within the layer, a transparency of more than 30% can be present, but typically only slightly more than 30%. 70% of the thermal radiation is absorbed or partially reflected between 9 pm and 11 pm across the entire volume of the layer. Depending on the material selection and solid angle, a proportion of 1% to 15% of the thermal radiation is reflected between 9 pm and 11 pm. Polymers typically exhibit a physically unavoidable reflection in the range of 5% to 15%. For the remaining wavelengths of thermal radiation, the polymer layer can exhibit the same properties.

[0017] The transparency of the polymer material layer is determined using FTIR spectroscopy (Fourier transform infrared spectroscopy), which falls under the term infrared spectroscopy, in a suitable FTIR spectrometer. A sample of the layer is introduced into the spectrometer in the same shape as that used on the heat exchanger panel. The layer is placed into the spectrometer without any modification, such as would be caused by pressing the layer. In the spectrometer, the layer is irradiated with infrared radiation with a wavelength of 9 pm to 11 pm, perpendicular (at a 90° angle) to the surface of the foam layer. The intensity of the radiation (energy density) downstream of the layer is measured and compared with the intensity of the input radiation.A transparency of the polymer material layer of no more than 30% in the thermal radiation wavelength range between 9 pm and 11 pm means that the measured radiation intensity in the 9 pm and 11 pm range beyond the layer is no more than 30% of the input radiation intensity. This measurement method can be performed, for example, with the IN VEN IO® FTIR spectrometer from Bruker.

[0018] Unless otherwise stated, the term “thermal radiation” in the following covers the wavelength range between 2 pm and 100 pm.

[0019] The layer made of a polymer material has gas bubbles or gas chambers. The gas filling of the gas bubbles or gas chambers is largely permeable to thermal radiation. The gas bubbles or gas chambers are preferably filled with air. The gas filling preferably equalizes the pressure conditions within the layer. The gas filling of the layer therefore preferably has a pressure level almost identical to that of the surrounding air. The layer is referred to below as the "foam layer." The foam layer can be viewed as a barrier against air and water vapor from the room, which cannot pass through the foam layer to the interface. As a result, no convective heat exchange can take place between the air and the interface.

[0020] The foam layer is connected to the heat exchanger at the interface on the one hand and has a free surface on the other side, which is referred to below as the “surface of the foam layer” or simply as the “surface”.

[0021] The term "building space" encompasses both closed and open spaces. A closed space is one that is enclosed on all sides. An open space encompasses all types of spaces that are open on at least one side. This could be, for example, a bus shelter or a covered outdoor area. All of these spaces are referred to below as "rooms."

[0022] The heat exchanger panel can be designed to cool a room (cooling case). In this case, a heat load is present in the room. In this case, the heat exchange medium in the medium line is a cooling medium. In the case of a heat load in the room (at a relative humidity of 60%), the room temperature is typically approximately 20°C to 30°C, and the temperature of the heat exchange medium is typically approximately 6°C to 20°C.

[0023] The heat exchanger panel can also be used to heat a room (heating mode). In this case, the room contains a cooling load. In this case, the heat exchange medium is a heating medium. The room temperature in the case of a cooling load in the room is typically around 10°C, and the temperature of the heat exchange medium is typically around 35°C to 50°C.

[0024] The foam layer is designed to have a transparency of no more than 30% in a wavelength range of thermal radiation between 9 pm and 11 pm.

[0025] Fundamentally, for the functional principle of the heat exchanger panel, transparency should be as high as possible so that thermal radiation can be absorbed as completely as possible at the temperature-controlled interface. However, high transparency of, for example, more than 60% requires very little polymer material to be applied to the interface. This requires a very thin or very sensitive foam layer. A thin foam layer provides only limited thermal insulation against heat conduction, so the surface of the foam layer quickly approaches the temperature of the interface.

[0026] The inventor has found that a maximum transparency of 10% is sufficient, since then about 10% of the thermal radiation hits the interface directly, but a further significant part of the thermal radiation in the area of ​​the interface is absorbed by the tempered foam layer via the material thickness itself and the heat is supplied to the interface by means of thermal conduction in the material.

[0027] In addition, lower transparency allows for the use of more polymer material or a thicker foam layer. A foam layer with a certain minimum thickness, for example, 0.5 cm to 1.5 cm, provides good thermal insulation, allowing the surface of the foam layer to be kept above the dew point while keeping the interface below the dew point.

[0028] It has been shown that such a foam layer with a maximum transparency of not more than 40% or not more than 30% or not more than 20% in a wavelength range between 9 pm and 11 pm is formed with sufficient thermal insulation to achieve the desired functions of dissipating the heat introduced by thermal radiation and insulating the surface of the foam layer so that the temperature of the surface is above the dew point.

[0029] In addition, with a thicker foam layer, more heat is drawn from the room into the foam layer, where it is also stored and dissipated. This heat input occurs on the one hand through heat conduction in the area of ​​the surface of the foam layer, with heat being transferred from the room air to the surface by convection. On the other hand, the heat input throughout the entire volume of the foam layer occurs through an increased absorption capacity of the foam layer (due to the low transparency of the overall layer thickness, but considerable transparency in the thermal radiation spectrum over part of the material thickness). The heat input into the foam layer exceeds the heat flow from the (constantly) cool interface to the surface and specifically prevents the surface from cooling below the dew point temperature of the room air up to a defined point. According to the principle, this point is close to the average room temperature of the room.

[0030] A foam layer surface with a temperature below average room temperature would lead to condensation on the surface once the dew point temperature of the room air is reached, which is something that must be avoided at all costs. This effect is also supported by heat gains from passing warm room air (in the typical application of a ceiling raft or wall panel). Warm room air rises and hits the slightly cooler surface. Consequently, the room air cools slightly, but simultaneously warms the surface and falls back down.

[0031] At the same time, a heat flux due to thermal radiation from the room surfaces visible from the surface acts on the interface, so that the interface tends to reach an equilibrium temperature corresponding to the mean radiation temperature. If the foam layer is too thin, the heat flux from the (constantly) cool interface to the surface of the foam layer exceeds the heat contained in the foam layer from the room, resulting in a cool surface and thus in the formation of condensate.

[0032] To achieve a foam layer transparency of 30% in a wavelength range between 9 pm and 11 pm, especially across the entire layer thickness, it must be very thin. With a constant density of gas bubbles or gas chambers in the foam layer, the thinner the layer, the higher the transparency. However, if the layer is made so thin that it has a transparency of over 30%, it becomes unstable.

[0033] On the other hand, the transparency of the foam layer can be increased to over 30%, especially over 50%, by providing larger gas bubbles or gas chambers in the foam layer while maintaining the same layer thickness and number of gas bubbles or gas chambers, or by making the walls of the gas bubbles very thin. However, this results in little material in the foam layer, making the foam layer very unstable. If there is little material in the layer to absorb heat from the room air in the form of thermal radiation and convection, the heat flow from the (constantly) cool interface again exceeds the heat present in the foam layer.

[0034] The inventor has recognized that for a foam layer with a transparency of no more than 30% in a wavelength range between 9 pm and 11 pm, an equilibrium is established that allows the most effective heat input of heat from the room to the interface (by means of thermal radiation and heat conduction through the foam layer), while at the same time sufficient heat is absorbed by the foam layer so that no (or only a very small) heat flow from the interface reaches the surface of the foam layer.

[0035] In the case of a cooling load in the room, a foam layer with a transparency of no more than 30% in a wavelength range between 9 pm and 11 pm will achieve an equilibrium in the same way, with heat being emitted from the interface into the room (by means of thermal radiation through the foam layer), while at the same time no heat flow from the interface reaches the surface of the foam layer, keeping the foam layer cool enough at the surface to minimize convection heat loss at the surface. This convection heat would be completely lost, especially when heating outdoor spaces, as it is carried away by moving air outside. Only a small amount of heat is lost through convection heat.This is the part of the thermal radiation from the interface that is absorbed by the foam layer in an area close to the surface of the foam layer and then reaches the surface by thermal conduction.

[0036] The radiant heat generated by the heat exchanger panel ensures relatively low-loss heating. This allows the temperature of the heat exchange medium to be relatively low, yet still effectively heat an outdoor space. Since the temperature level of the heat exchange medium can be relatively low, heat pumps can be used to heat the medium. The heat exchanger panel thus offers the possibility of energy-efficient heating even in outdoor areas.

[0037] Because the foam layer only allows limited heat conduction from the tempered interface to the surface of the foam layer and prevents convective heat exchange between the interface and the room air, a large temperature difference can develop between the interface and the surface. Thus, in the event of a heat load in the room, the interface can be cooled to a temperature below the dew point, while the surface maintains a temperature above the dew point of the room air, leading to effective cooling through the absorption of thermal radiation from room surfaces or heat sources. Furthermore, the insulating effect of the foam layer from the interface to the surface allows the interface to be cooled particularly quickly.

[0038] At the same time, preventing convective heat exchange between the interface and the room air means that no moisture from the room air can condense at the interface, even though the interface has a radiation temperature below the dew point.

[0039] When the heat exchanger panel is arranged over a large area in a room, it can be cooled very efficiently and quickly, while still preventing moisture from precipitating at the interface. This prevents the room or the surface of the foam layer or the heat exchanger panel from becoming contaminated, damaging equipment or furnishings, causing nuisance to people, causing structural damage, and / or negatively impacting the indoor climate.

[0040] In case of a cold load in the room, the interface can be heated to a high temperature and the interface can be heated quickly.

[0041] By arranging the foam layer permeable to thermal radiation on the cooled or heated interface, the actual surface temperature (essentially corresponding to the average room temperature) of the foam layer is decoupled from the radiation temperature at the surface of the foam layer. The radiation temperature at the surface of the foam layer can therefore be lower than the material temperature of the surface when cooling. The radiation temperature at the surface corresponds to a value that depends on the transparency, thermal conductivity and surface properties of the foam layer and approaches the radiation temperature of the interface more and more with increasing transparency. A higher thermal conductivity of the foam layer leads to the material surface temperature approaching that of the interface. Due to the surface properties, for exampleIncreasing the surface area through a rough surface can influence heat input due to convective and radiation effects. An example of this would be a deliberately grooved or uneven structure.

[0042] In the case of a heat or cold load in the room, the additional potential temperature difference leads to a higher power density and fewer convective losses than with an exposed interface. An exposed interface refers to direct contact between the room air and the interface. Consequently, the foam layer increases the utilization rate of thermal radiation. In particular, the additional potential temperature difference between the average flow temperature ((flow temperature + return temperature) / 2) leads to a higher power density over a broad temperature range than with an exposed interface in direct contact with the room air.

[0043] While with dew point limitation of the interface the temperature difference and consequently the absorption capacity is limited, a dew point independent interface can be operated constantly with high temperature difference and low radiation temperatures.

[0044] The inventor has recognized, on the one hand, that a transparency of more than 30% in a wavelength range between 9 pm and 11 pm is not necessary for a foam layer to meet the desired thermal properties and, on the other hand, that a transparency of no more than 30% in a wavelength range between 9 pm and 11 pm allows a mechanically stable foam layer that allows for permanent operation.

[0045] The foam layer can be firmly bonded to the interface. The foam layer can also be a body that is applied to the interface and bonded to it. It is also possible for the foam layer to simply be placed on the interface and clamped to it. For this purpose, a circumferential seal can be provided by adhesive or a dry seal on the interface where the foam layer is applied. This allows the foam layer to be subsequently separated from the interface as needed.

[0046] The heat exchanger panel can be provided with surrounds on the sides. These can be firmly connected to the heat exchanger panel and / or to the foam layer. A firm connection to the heat exchanger panel and the foam layer can further secure the foam layer. The surrounds can therefore serve both aesthetic and / or structural purposes.

[0047] The foam layer can also be designed to completely surround the heat exchanger's medium lines. The medium lines run within the foam layer, ensuring better heat transfer. In this case, the foam layer is not arranged at the interface, but rather on a surface of the ceiling or wall panel. A heat-conducting layer can still be provided that connects the medium lines within the foam layer, thus creating a large surface area.

[0048] The layer of polymer material may have a transparency of not more than 25%, not more than 20%, not more than 15%, not more than 10%, or not more than 5% in the wavelength range of thermal radiation between 9 pm and 11 pm.

[0049] In a wavelength range of thermal radiation between about 2 pm and about 20 pm or between about 2 pm and about 100 pm, the layer of polymer material may have a transparency of not more than 30%, or not more than 25%, or not more than 20%, or not more than 15%, or not more than 10%, or not more than 5%, respectively.

[0050] The layer of polymer material can have a thickness of at least 2 mm, or at least 3 mm, or at least 4 mm, or at least 5 mm, or at least 6 mm, or at least 7 mm, or at least 8 mm and / or a thickness of at most 150 mm, or at most 75 mm, or at most 50 mm, or at most 28 mm, or at most 27 mm, or at most 26 mm, or at most 25 mm, or at most 24 mm, or at most 23 mm, or at most 22 mm. The layer can, in particular, have a thickness of 10 mm to 14 mm.

[0051] The thickness of the foam layer can be adjusted based on the individual requirements of the ambient climate and the operating temperature of the interface.

[0052] The polymer material of the layer may be formed from a polyolefin, preferably from polyethylene or polypropylene, or a mixture thereof.

[0053] The polymer material can be formed from any combination of polyolefins. Furthermore, the polymer material can be provided with various additives, such as flame retardants, inhibitors, UV protection, or special reflective or absorbing particles or heat transfer layers. The surface of the foam layer can be coated on the front and / or back. With a thickness between 2 mm, 10 mm, and 20 mm, the foam layer can have a transmission of 20% to 80% for radiation with a wavelength in the range of 4 pm to 12 pm. These materials are therefore suitable for forming the foam layer. Preferably, a flame-retardant, closed-cell polyethylene foam with a low density is used. Alternatively, polypropylene, a copolymer of both or more polymers, or a polyolefin foam is used.

[0054] The layer of polymer material can be a foam layer, particularly one with closed cells, or a bubble film or hollow-chamber film. The layer can completely cover the interface.

[0055] Foams and bubble wraps are suitable materials for the foam layer because they have gas-filled cells that give the foam layer a certain degree of transparency to thermal radiation. At the same time, the foam layer can be made relatively lightweight, thus barely increasing the overall weight of the heat exchanger panel. Since the gas in the cells is usually a good thermal insulator, the remaining material of the foam layer preferably has thermally conductive properties.

[0056] The foam layer material can be mixed with materials that exhibit high absorption of thermal radiation. This can improve the heat input from thermal radiation into the material. Additionally or alternatively, the foam layer material can be mixed with materials that exhibit high thermal conductivity. This can increase the heat input from convection heat from the room and the thermal conductivity of the foam layer.

[0057] The foam layer is preferably designed and positioned at the interface in such a way that moisture ingress is prevented. Nevertheless, capillary channels can be provided in the foam layer to conduct moisture toward the room. The capillary channels run as directly as possible from the interface toward the room and conduct the accumulating moisture back into the room. This ensures the long-term functionality of the heat exchanger panel.

[0058] The capillary channels can be made of the same material as the foam layer or of another capillary-active material.

[0059] It can be provided that the foam layer is additionally arranged laterally around the heat exchanger panel. The foam layer can have a different thickness in the side areas of the heat exchanger panel than on the side facing the room. The heat exchanger has medium lines through which a cold or hot heat exchange medium (preferably a fluid) can flow. The heat exchanger is a body that encloses these medium lines or in which these medium lines are embedded and in which the heat is distributed predominantly by thermal conduction. In extreme cases, the heat exchanger can consist only of the medium lines. As a rule, however, the heat exchanger has a body in which the medium lines are embedded and in which the heat is distributed predominantly by thermal conduction and not by thermal radiation.

[0060] In the simplest case, the heat exchanger can consist of just a pipe carrying a hot or cool medium and the connected foam layer. The supporting structure in the ceiling or wall area can then be provided, for example, by pipe clamps or a tensioning structure.

[0061] Thermal radiation is generally radiated from the interface both into the room and into the interior of the heat exchanger. However, thermal radiation can only propagate inside the heat exchanger if the heat exchanger is made of a material with low density or high transparency, particularly in the infrared spectrum. The higher the density, the lower the heat propagation via thermal radiation and the greater the heat transfer via conduction.

[0062] The heat exchanger may comprise at least one straight or meandering tube and / or be a plate heat exchanger.

[0063] The heat exchanger can also be a freely formed body with pipes that deviates geometrically from a flat plane, or it can be formed directly from a pipe.

[0064] In a preferred embodiment of the heat exchanger panel, the heat exchanger comprises at least two parallel, straight tubes connected to each other by several thinner, parallel tubes. The heat exchanger can also be a pipe system with capillary tubes or a capillary tube mat. The tubes are preferably integrated into a ceiling or wall panel, so that the material of the ceiling or wall panel fills the spaces between the tubes. However, the tubes can also be mounted exposed on the ceiling or wall panel.

[0065] The surface of the tubes is particularly relevant for the temperature control of the room. These surfaces can be smooth or rough to influence their absorption or reflection behavior. The surfaces can also contain or consist of a metal or an alloy. The performance of the device according to the invention can be increased by the high thermal conductivity and / or high heat capacity of the surfaces and high absorption in the thermal radiation range of 2 pm to 20 pm or 2 pm to 100 pm wavelength. However, the response behavior of the heat exchanger panel can be specifically influenced by a low or high heat capacity of the surfaces, or by additionally introducing or attaching latent storage materials (PCM).

[0066] The heat exchanger and / or the ceiling or wall panel can be made of or consist of the same material as the foam layer. This reduces material diversity and improves recyclability. For example, the heat exchanger can also be a capillary tube mat made entirely of a polymer material.

[0067] It may be possible to infuse the material of the heat exchanger and / or the ceiling or wall panel with highly radiation-absorbing particles, such as carbon particles. These particles absorb thermal radiation coming from the room as well as the radiation emanating from the heat exchanger itself. The particles absorb any thermal radiation very quickly, preventing it from penetrating deeply into the material. The absorbed thermal radiation is converted into heat and contributes to heating the heat exchanger through thermal conduction. It may also be possible to infuse the foam layer with such radiation-absorbing particles.

[0068] Any particles with good absorption capacity can be used as radiation-absorbing particles. These could be polymer or metal particles, for example. However, metals generally have a high reflectance for IR radiation. If the heat exchanger and / or the ceiling or wall panel, as well as the foam layer, are made of a polymer material, carbon particles or particles of a radiation-absorbing carbon compound are suitable. Thus, from a chemical perspective, polymer materials are also carbon compounds, which keeps the material diversity low and recyclability high.

[0069] An additional heat-conducting layer can be provided between the heat exchanger and the foam layer.

[0070] The heat-conducting layer can be inserted between the heat exchanger and the foam layer in such a way that the surfaces of the individual pipes of the heat exchanger are additionally connected to one another in a heat-conducting manner. The heat-conducting layer can be, for example, a layer made of a metal. In particular, the heat-conducting layer can be an optically functional layer applied by a printing process or other coating method. This creates a large overall surface area of ​​the heat exchanger with an even temperature distribution. In the case of a heating load in the room, this creates a large cooling surface that absorbs heat radiation across its entire area and conducts it to the pipes. In the case of a cooling load in the room, however, a large heating surface is created that emits heat radiation across a large area into the room.A moisture-wicking layer, such as a capillary-active fleece, can be provided between the heat exchanger and the foam layer.

[0071] Instead of or in addition to the capillary channels in the foam layer, a moisture-wicking layer can be provided at the interface. This moisture-wicking layer is preferably a capillary-active nonwoven. The nonwoven is preferably made of highly absorbent, bioresistant synthetic fibers. The nonwoven is intended to buffer any moisture that may occur and divert it to a part of the nonwoven that can, for example, dry in the room air.

[0072] Electronic components such as sensors, semiconductors, LEDs and / or other active or passive components or thermal storage materials can be arranged between the heat exchanger and the foam layer.

[0073] The components can also be electrothermal components, such as Peltier elements. In certain versions, a PCM material can also be incorporated for thermal buffering.

[0074] Electronic components such as LEDs can be used for decorative and technical purposes. For example, the heat exchanger panel can not only serve to regulate the temperature of a room, but can also contribute to the visual design and workplace lighting with lighting elements. In warehouses or laboratories, where constant temperature and / or humidity are very important, sensors can be installed to continuously monitor these values.

[0075] The foam layer may be applied to a portion of the interface so that part of the interface is exposed for moisture to condense on.

[0076] In this embodiment, the heat exchanger panel not only cools a room but also dehumidifies it. Since the interface for cooling the room is cooled to a temperature below the dew point according to the invention, strong condensation of moisture from the room air occurs in the exposed partial areas. This condensate is preferably drained by a capillary-active fleece applied to the interface into an outer edge area of ​​the heat exchanger panel and collected there. A collecting channel is preferably provided in the edge area to collect and drain away the moisture. Dehumidification of the room can thus be achieved in a simple manner. This also occurs with a lower air flow than with typical air conditioning units, but at the same time offers the advantage of the system combination.A heat-insulating and / or sound-absorbing layer and / or a layer that is diffusion-tight against water vapor can be provided on a side of the heat exchanger facing away from the building space to be tempered.

[0077] The heat-insulating layer can, for example, reduce energy losses from the room to the outside or into volumes and areas that are not to be heated.

[0078] The sound-absorbing layer reduces the sound level in the room by absorbing sound waves. This improves speech intelligibility, among other things. The sound-absorbing layer is, for example, an acoustic foam and is preferably made of the same material as the diffusion-tight thermal insulation material. Compared to the thermal insulation material, the acoustic foam has a more open-pored surface.

[0079] The water vapor diffusion-tight layer prevents moisture from entering the ceiling and / or walls of the room or the surface of the heat exchanger.

[0080] The heat exchanger panel can be an integral part of a building, such as a solid ceiling or wall. If the heat exchanger panel is integrated into a ceiling panel, a ceiling sail, or a wall panel, it can also be retrofitted into an existing building together with the panels. Installing such panels creates a large surface area for the exchange of thermal radiation, which is used to regulate the temperature of a room. This enables rapid cooling or heating, while also maintaining a comfortable temperature in the room, as no air currents are generated, as is the case with a conventional air conditioning system. The material used for the panels is preferably a water vapor-impermeable thermal insulation material.

[0081] When the heat exchanger panel is in operation, the interface facing the room is brought to a lower temperature than a heat load (cooling mode) or a higher temperature than a cold load (heating mode). This can be achieved, for example, by a coolant or a heating medium. The coolant or heating medium can be water, for example, which is cooled or heated by a heat pump. This allows either the temperature of the interface to be lowered to remove heat from the heat load, or the temperature of the interface to be increased to add heat to the cold load. Using the foam layer, these effects can be achieved in a simple and particularly cost-effective manner.

[0082] The heat load can be, for example, solar radiation or electrical devices or people in the room. Typically, the warm room surfaces radiate more heat radiation than the cooling surface of the heat exchanger panel, resulting in energy transfer from the warm room surfaces to the cooled interface. The (infrared) heat radiation emanating from the heat load is absorbed by the cold interface and the foam layer and removed from the room by the refrigerant.

[0083] The cooling load is typically caused by cool room surfaces, cool surfaces of objects in the room, or people who have a lower radiant temperature than the radiant temperature of the heat exchanger panel's surface. Conversely, the room surfaces absorb more heat from the warm interface than they emit. The heating medium heats the interface through thermal conduction, from which the (infrared) thermal radiation is then released into the room. The heat is also transferred to the room via the foam layer, which conducts it to the surface.

[0084] According to a second aspect of the invention, a heat exchanger panel is provided for controlling the temperature of building spaces. The heat exchanger panel comprises a heat exchanger having a medium line for conducting a heat exchanger medium and a heat exchanger wall that is in thermal contact with the medium line. The heat exchanger wall has an interface facing the building space to be temperature-controlled, which interface can be brought to a lower temperature compared to a heat load or a higher temperature compared to a cold load. The heat exchanger panel further comprises a layer made of a polymer material arranged on the interface of the heat exchanger, wherein the layer has gas bubbles or gas chambers, such that it is at least partially permeable to thermal radiation. In addition, the heat exchanger panel has a cover layer arranged on the layer made of polymer material and is at least partially permeable to thermal radiation.

[0085] The heat exchanger panel of the first aspect of the invention corresponds to the heat exchanger panel of the second aspect of the invention except for the cover layer.

[0086] In the second aspect of the invention, the layer of a polymer material is also referred to as the “foam layer”, the free surface of the foam layer is referred to as the “surface” and the building space is referred to as the “space”.

[0087] The cover layer may be a hole support structure having a plurality of through holes so that it is almost permeable to thermal radiation.

[0088] The hole support structure can be a substantially plate-shaped body with a plurality of through holes. The hole support structure is open to air. The air can pass through the through holes of the hole support structure to the foam layer almost unhindered. The same applies to thermal radiation. The number and size of the through holes can be selected so that the hole support structure as a whole has the largest possible opening, allowing the majority of thermal radiation to pass through.

[0089] The perforated support structure provides mechanical stability to the heat exchanger. At the same time, the perforated support structure protects the heat exchanger on the side facing the room. This could include impacts against the heat exchanger, for example. Such impacts would quickly lead to damage if they directly impacted the foam layer. By maximizing the opening width of the perforated support structure, it can be lightweight yet highly stable.

[0090] Due to the mechanical stability provided by the hole support structure, the other structures of the heat exchanger can be designed to be less stable and thus to save weight or material and be cost-effective.

[0091] In addition to providing mechanical stability, the perforated support structure can also enhance the appearance of the heat exchanger. This allows the perforated support structure to provide a fully functional heat exchanger that, depending on the design of the perforated support structure, can be discreet or visually enhance a room.

[0092] Thus, the hole support structure enables the provision of a lightweight, functional, yet mechanically stable heat exchanger in which the heat exchanger properties are hardly influenced by the hole support structure and which, at the same time, can have a visually appealing design thanks to the hole support structure.

[0093] The perforated support structure can be connected to the foam layer by means of a surface-mounted connection. The perforated support structure can be glued to the foam layer or connected to an edge seal running along the side of the heat exchanger panel.

[0094] It can also be provided that the hole support structure is arranged at a distance from the foam layer. In this case, edge elements can be provided, each of which engages laterally on the heat exchanger panel and on the hole support structure, thus coupling the hole support structure to the heat exchanger panel.

[0095] In the case of the hole support structure arranged at a distance from the foam layer, a film transparent to thermal radiation can additionally be provided between the foam layer and the hole support structure. The film can, in turn, rest on the foam layer and be connected to it, in particular glued. The film can further improve the diffusion tightness towards the interface without excessively affecting the thermal conduction properties.

[0096] The hole support structure can have a distance of 5 mm, 50 mm, 100 mm, 200 mm, or 300 mm from the foam layer.

[0097] The perforated support structure can be retrofitted to the heat exchanger panel or to the foam layer. This allows for subsequent visual modification of the heat exchanger panel, makes the components more easily recyclable and easy to separate, and allows for easier and more cost-effective repair of damage.

[0098] The perforated support structure can be designed to absorb sound. For this purpose, the perforated support structure can feature microperforations and / or specifically sized holes. This serves to reduce reverberation times in the room and improve thermal comfort and the overall feeling of the room.

[0099] An edge of each through-hole can have a distance from the edges of the adjacent through-holes of a maximum of 3 mm, a maximum of 2 mm, a maximum of 1 mm, a maximum of 0.5 mm, or a maximum of 0.2 mm.

[0100] The through holes can have a center-to-center distance of maximum 10 mm, maximum 8 mm, maximum 6 mm, maximum 4 mm, or maximum 2 mm from each other.

[0101] The through holes can each have a round shape or a polygonal, preferably a hexagonal, shape.

[0102] A hexagonal shape for the through holes is preferred, as this allows them to be positioned directly adjacent to each neighboring through hole. The through holes can be arranged so close to each other that only a thin web remains between them. This allows the hole support structure to have a very large opening width.

[0103] In a plan view, the through holes may each have an area of ​​not more than 1.5*10 3 mm 2 or not more than 750 mm 2 or not more than 100 mm 2 or not more than 10 mm 2 or not more than 1 mm 2or not more than 0.1 mm 2 or not more than 0.01 mm 2 or not more than 1 * 10 3 pm 2 or not more than 100 pm 2 have.

[0104] The larger the area of ​​the through-holes in a plan view, the larger the opening width. If large through-holes are selected, particularly those with a hexagonal shape, the opening width can be maximized. The through-holes can have a depth running essentially perpendicular to the interface of at least 1 cm, at least 2 cm, at least 4 cm, at least 6 cm, at least 8 cm, or at least 10 cm.

[0105] The hole support structure can in particular be a structure in the form of an expanded metal.

[0106] Surface sections of the hole support structure running substantially perpendicular to the interface can have an absorption of at least 50% or at least 60% or at least 70% or at least 80% or at least 90% or an absorption of a maximum of 50% or a maximum of 40% or a maximum of 30% or a maximum of 20% or a maximum of 10% with respect to thermal radiation.

[0107] The surface sections of the hole support structure that run perpendicular to the interface refer to all those sections that form the side walls of the through holes.

[0108] The hole support structure may be a punched or perforated metal foil or ceramic foil or foil made of a carbon fiber composite material, wherein the holes or perforations form the through holes.

[0109] The film can have a thickness of at least 10 pm or at least 100 pm or at least 200 pm or at least 300 pm or at least 400 pm or at least 500 pm and / or a thickness of at most 1000 pm or at most 900 pm or at most 800 pm or at most 700 pm or at most 600 pm.

[0110] The hole support structure may be a metal grid with grid openings, wherein the grid openings form the through holes.

[0111] The metal grid may have a thickness of at least 0.01 mm or at least 0.1 mm or at least 0.5 mm or at least 1 mm and / or a thickness of a maximum of 5 mm or a maximum of 4 mm or a maximum of 3 mm or a maximum of 2 mm.

[0112] The hole support structure can be a grid made of a fiber-reinforced polymer composite material or formed from fibers made of a fiber composite material or from fibers made of an inorganic material, with grid openings in the grid forming the through-holes. The grid can have a thickness of at least 10 μm, or at least 100 μm, or at least 500 μm, or at least 1000 μm, or at least 2500 μm, and / or a thickness of at most 10 mm, or at most 8 mm, or at most 6 mm, or at most 4 mm.

[0113] The covering layer can be a surface element, in particular a film, which is at least partially permeable to thermal radiation.

[0114] The film can be flexible or designed as a rigid plate-shaped body.

[0115] The film can rest on the foam layer and be firmly connected to it, in particular glued.

[0116] By applying a film to the foam layer, it can be given a smooth surface. Such a smooth surface is easier to clean than the typically rough surface of such a foam layer. The film can also serve as a mechanical protective layer to prevent or at least mitigate direct physical impact on the foam layer. The film can also ensure that the combination of foam layer and film is completely airtight, preventing any air from the room from reaching the interface. The film can also make the heat exchanger panel more visually appealing.

[0117] It is also possible for the foam layer to have a foil-like layer firmly bonded to it on the front and / or back. Multiple layers of polymer material and foil-like layers can also be provided in any desired layering configuration, whether for decorative purposes using a printing process or for physical reasons to adjust specific radiation or surface properties.

[0118] The surface element can have a thickness of at least 2 mm or at least 4 mm or at least 6 mm and a thickness of a maximum of 20 mm or a maximum of 15 mm or a maximum of 10 mm.

[0119] The surface element can have a transmission of more than about 50% or more than about 70% or more than about 90% at a wavelength between about 2 pm and about 20 pm or between about 2 pm and about 100 pm, at least in a partial region.

[0120] The advantages described above with reference to the first aspect of the invention apply analogously to the second aspect of the invention. The different features of the aspects can be combined as desired, provided they are not technically mutually exclusive. Furthermore, a method according to the invention is provided for producing a heat exchanger panel as described above with reference to the first aspect of the invention. The method comprises the following steps:

[0121] - Providing a layer of a polymer material and a heat exchanger with at least one metal surface,

[0122] - Heating a hot melt adhesive film made of polyurethane,

[0123] - Pressing the hot melt adhesive film made of polyurethane onto a surface of the layer made of a polymer material,

[0124] - Cooling of the polyurethane hot melt adhesive film on the surface of the layer of a polymer material,

[0125] - applying an adhesive to the cooled polyurethane hot melt adhesive film on the surface of the layer of a polymer material, and

[0126] - Bonding the layer of a polymer material to the at least one metal surface of the heat exchanger by means of the adhesive.

[0127] The method can also be used to produce a heat exchanger panel according to the second aspect of the invention, apart from the covering layer.

[0128] By means of the method according to the invention, a method is provided for bonding or producing a firm connection between a layer of a polymer material and a heat-conducting metal surface.

[0129] The coating process is chosen to create a permanent bond between a generally low-energy polyolefin surface and a metal surface (heat exchanger). Other processes are only possible for small surfaces, are expensive to implement, or do not form a long-lasting bond. For example, a bond made using cyanoacrylate adhesives and primers decomposes and dissolves over time due to exposure to moisture. The material composite according to the invention creates a permanently strong bond.

[0130] The layer of polymer material (foam layer) can be a thin, essentially plate-shaped solid. The polymer material can be an IR-transparent, foamable polymer. The polymer material is preferably a polyolefin, such as polyethylene or polypropylene.

[0131] It is technically difficult to firmly bond such a foam layer to a smooth metal surface. One reason is that polyethylene and polypropylene are low-energy (non-polar) materials to which conventional adhesives adhere poorly or not at all at room temperature. In addition, such a foam layer typically has a rough and uneven surface, meaning it cannot be applied across its entire surface to a smooth surface. A cost-effective and reliable surface bond is therefore hardly possible using conventional methods. Other methods such as thermal pressing or direct hot melt bonding or thermal welding are also hardly feasible due to the typical design of a heat exchanger with individual tubes that offer only a small surface area on one side.

[0132] Therefore, a method is provided by which a permanent bond can be achieved between a layer of low-energy polyethylene or polypropylene and a metal surface.

[0133] A polyurethane hot-melt adhesive film is provided. The polyurethane of the hot-melt adhesive film exhibits high-energy (highly polar) properties when heated, which allows it to bond very well with the low-energy (non-polar) polyethylene of the foam layer. The polyurethane hot-melt adhesive film can thus be used to create a surface on the foam layer to which another adhesive can be easily applied. This allows the foam layer to be bonded securely to at least one metal surface of the heat exchanger in a subsequent step.

[0134] Since both polymers have a matched melting point, the low-energy surface of the polyolefin of the foam layer and the high-energy polyurethane of the hot melt adhesive film bond together at the molecular level in the molten interface.

[0135] The polyurethane hot melt adhesive film can be applied to the surface of the foam layer like a film. The polyurethane hot melt adhesive film can have a maximum thickness of 250 μm, 150 μm, 50 μm, or 5 μm.

[0136] Metal particles can be incorporated into the polyurethane hot melt adhesive film. These highly heat-conducting metal particles allow the hot melt adhesive film to heat quickly and evenly, as the metal particles distribute the heat throughout the adhesive material (inductive heat bonding).

[0137] Using this process, it is possible to bond the IR-transparent foam layer to the metal heat exchanger surface in large quantities in a cost-effective, highly adhesive and large-area manner.

[0138] The adhesive that is applied to the cooled polyurethane hot melt adhesive film is, in particular, a liquid adhesive.

[0139] The heat exchanger can be designed directly, for example, in a concrete ceiling, in particular a diffusion-tight concrete ceiling. The medium line can be a pipe system that is applied directly to the (raw concrete ceiling). The pipe system can be designed as a capillary mat. The transparent layer made of polymer material, in particular a foam layer, is applied or glued to the pipe system. This results in the same principle with the advantage of saving on construction height and material and taking individual circumstances into account. On-site production is a disadvantage. Optionally, a diffusion-tight insulation layer, e.g. in the form of a paint or water vapor diffusion-tight insulation layer, can be applied to the concrete ceiling in order to strengthen the existing construction for the assembly. The "panel" is thus formed directly as a surface on the ceiling / wall. The panel can therefore also be firmly connected to the building structure, orcan be applied as a structure directly to a ceiling and wall construction.

[0140] The heat exchanger can also be manufactured directly as a media-carrying pipe with a foam layer. This eliminates the need for a separate heat exchanger, allowing the product to be manufactured as a continuous pipe. The pipe is then suspended from the ceiling, for example, with clamps or attached to it. A cladding can be made, for example, from a perforated metal sheet, such as expanded metal, which is transparent to thermal radiation.

[0141] Thus, the term "panel" can also refer to bodies with non-flat surfaces, although a panel is generally a roughly flat, plate-shaped component. A non-flat panel can be, for example, a tube or a curved surface. Regardless of the shape, a panel according to the invention comprises a heat exchanger layer and a polymer layer, which is usually foamed.

[0142] Instead of the polyurethane hot melt adhesive film, a polyurethane hot melt adhesive compound can also be used. This compound is heated, then applied to the surface of the polymer layer and smoothed. The compound is then cooled, and an adhesive is applied to the cooled compound. The polyurethane hot melt adhesive compound has the same properties as the polyurethane hot melt adhesive film mentioned above.

[0143] The above descriptions of the features of the heat exchanger panel and the associated advantages also apply equally to the heat exchanger panel manufactured by the method described above.

[0144] Further objects, features, and advantages of the present invention will become apparent from the description and the exemplary embodiment illustrated in the accompanying figures. These show:

[0145] Figure 1 is a schematic sectional view of a heat exchanger panel according to the invention, integrated into a ceiling or wall panel, according to a first embodiment of the invention, in

[0146] Figure 2 is a schematic sectional view of the heat exchanger panel according to the invention, integrated into a ceiling or wall panel, according to the first embodiment of the invention with arrow representations for the heat exchange, in Figure 3 is a schematic sectional view of the heat exchanger panel according to the invention, integrated into a ceiling or wall panel, according to a preferred embodiment of the first embodiment of the invention, in

[0147] Figure 4 is a schematic sectional view of the heat exchanger panel according to the invention, integrated into a ceiling or wall panel, according to a further preferred embodiment of the first embodiment of the invention, in

[0148] Figure 5 is a schematic sectional view of the heat exchanger panel according to the invention, integrated into a ceiling or wall panel, according to a further embodiment of the first embodiment of the invention, in

[0149] Figure 6 is a schematic sectional view of the heat exchanger panel according to the invention, integrated into a ceiling or wall panel, according to a further embodiment of the first embodiment of the invention, in

[0150] Figure 7 is a schematic sectional view of the heat exchanger panel according to the invention, integrated into a ceiling or wall panel, according to a further embodiment of the first embodiment of the invention, in

[0151] Figure 8 is a schematic sectional view of the heat exchanger panel according to the invention, integrated into a ceiling or wall panel, according to a further embodiment of the first embodiment of the invention, in

[0152] Figure 9 is a schematic sectional view of the heat exchanger panel according to the invention, integrated into a ceiling or wall panel, according to a first embodiment of a second embodiment of the invention, in

[0153] Figure 10 is a schematic sectional view of the heat exchanger panel according to the invention, integrated into a ceiling or wall panel, according to a further embodiment of the second embodiment of the invention, in

[0154] Figure 11 is a schematic sectional view of the heat exchanger panel according to the invention, integrated into a ceiling or wall panel, according to a second embodiment of the second embodiment of the invention, in

[0155] Figure 12 shows a schematic sectional view of the heat exchanger panel according to the invention, integrated into a ceiling or wall panel, according to a third embodiment of the invention, in Figure 13 an exemplary graph for the cooling performance of a cooling surface in the room with and without dew point limitation at 60% relative humidity, and in

[0156] Figure 14 shows some (additional) numerical values ​​for the graph shown in Figure 13.

[0157] In the following, a heat exchanger panel 1 according to the invention for controlling the temperature of building rooms 2 is described in more detail using a first exemplary embodiment (first aspect of the invention) (Figs. 1 to 9). The building rooms 2 are referred to below as "rooms." The room 2 has either a heat load (cooling mode) or a cold load (heating mode).

[0158] The heat exchanger panel 1 comprises a heat exchanger 3. The heat exchanger 3 is integrated into a ceiling or wall panel 4.

[0159] The heat exchanger 3 has at least two parallel, straight tubes, which are connected to each other by several thinner, parallel tubes. The heat exchanger s can also be a pipe system with capillary tubes or a capillary tube mat, or at least have a meandering tube. The tubes can be made of metal or plastic and are designed to conduct a heat exchange medium.

[0160] The heat exchange medium can be a coolant (cooling case) or a heating medium (heating case) in the form of a fluid that serves to absorb or release heat. The coolant or heating medium can be, for example, cooled or heated water.

[0161] The heat exchanger 3 can be made of the same material as the ceiling or wall panel 4. A refrigerant, e.g., R32 or R290, can also flow directly through the heat exchanger 3, but preferably water or a water-glycol mixture.

[0162] A heat pump (not shown) is provided to supply cooled or heated water to the heat exchanger 3 via a pipeline (not shown). The water is fed from the pipeline directly into at least one tube of the heat exchanger 3. The heat pump and the heat exchanger 3 form a circuit.

[0163] For example, a single heat pump can be provided in a building, which is connected to a plurality of heat exchanger panels 1 on different floors via multiple pipes and provides the cooled or heated water to the heat exchangers 3 of the heat exchanger panels 1. Alternatively, any cold or heat sink can be integrated into the circuit. Systems with solar cooling, geothermal probes, or groundwater cooling, and thus regenerative cooling sources, are also possible. The tubes of the heat exchanger 3 are inserted into the ceiling or wall panel 4 in such a way that a material of the ceiling or wall panel 4 fills the spaces between the tubes of the heat exchanger 3. The material is preferably a diffusion-tight thermal insulation material.

[0164] The heat exchanger 3 has an interface 5. The interface 5 is the surface of the heat exchanger 3 that faces the space 2.

[0165] At the interface 5, the temperature exchange between the space 2 and the heat exchange medium flowing through the tubes of the heat exchanger 3 essentially takes place.

[0166] From the interface 5, thermal radiation 8 is generally radiated both into the room 2 and into the interior of the heat exchanger 3. However, thermal radiation 8 can only propagate inside the heat exchanger 3 if the heat exchanger 3 is made of a low-density material. The higher the density, the lower the heat propagation via thermal radiation 8 and the stronger the transfer via heat conduction 9.

[0167] On the side of the interface 5 facing the space 2, a layer 6 made of a polymer material is arranged over the entire surface. The layer 6 made of a polymer material is referred to below as the "foam layer."

[0168] The foam layer 6 is bonded to the interface 5. The adhesive is thermally conductive and at least partially permeable to thermal radiation 8.

[0169] On the one hand, the foam layer 6 is connected to the heat exchanger 3 at the interface 5 and, on the other hand, has a free surface 7 facing the space 2, which is referred to below as “surface of the foam layer” or simply as “surface”.

[0170] The foam layer 6 is made of a polyolefin, such as polyethylene or polypropylene, and has gas bubbles or gas chambers so that it is at least partially permeable to the heat radiation 8.

[0171] Compared to the thermal radiation 8, the foam layer 6 has a transparency of no more than 30% in a wavelength range between 9 pm and 11 pm.

[0172] The foam layer 6 has a thickness in the range of 2 mm to 25 mm.

[0173] The density of gas bubbles or gas chambers in the foam layer 6 and the thickness of the foam layer 6 are selected such that a transparency of the foam layer 6 of no more than 30% is achieved at a wavelength between 9 pm and 11 pm. ZI

[0174] A foam layer 6 made of a polyolefin with such transparency has a relatively high material density.

[0175] Considering the cooling case, despite the relatively low transparency, sufficient heat from the room 2 passes through the foam layer 6 to the interface 5 to achieve efficient cooling of the room 2. The heat reaches the interface 5 through a combination of the permeability of the foam layer 6 to thermal radiation 8 and heat conduction 9 in the area of ​​the interface 5.

[0176] At the same time, the foam layer 6, with a transparency of no more than 30% in a wavelength range between 9 pm and 11 pm, absorbs sufficient heat from the room 2 so that no heat flow occurs from the interface 5 to the surface 7, which reaches the surface 7 and cools it below an average room temperature of the room 2. This would lead to condensation by the room air on the surface 7.

[0177] On the one hand, the heat is transferred from the room air at the surface 7 to the surface by convection 10 (convective heat exchange) and then introduced into the material of the foam layer 6 in a region of the surface 7 by means of heat conduction 9. On the other hand, due to the increased absorption capacity of the foam layer 6 (due to the low transparency), heat is introduced into the volume of the foam layer 6 by means of thermal radiation 8.

[0178] Considering the heating case, with a foam layer 6 having a transparency of not more than 30% in a wavelength range between 9 pm and 11 pm, heat is emitted from the interface 5 into the space 2, while at the same time no heat flow from the interface 5 reaches the surface 7, whereby the foam layer 6 remains cool enough at the surface 7, so that the loss of convection heat at the surface 7 is kept low.

[0179] In a preferred embodiment (Fig. 3), an additional heat-conducting layer 11 is applied between the heat exchanger 3 and the foam layer 6. The heat-conducting layer 11 connects the surfaces of the tubes of the heat exchanger 3 in a heat-conducting manner. This creates a large overall surface area with a uniform temperature distribution.

[0180] In a further preferred embodiment (Fig. 4), the material of the heat exchanger 3 and / or the ceiling or wall panel 4 is mixed with highly radiation-absorbing particles 12, such as carbon particles. The particles 12 absorb thermal radiation 8 coming from the room 2 and also the thermal radiation 8 emanating from the heat exchanger 2 itself. Any thermal radiation 8 is absorbed very quickly by the particles 11, without being able to penetrate deeply into the material. The absorbed thermal radiation 8 is converted into heat and, through thermal conduction 9, contributes to heating the heat exchanger 3. Any particles with good absorption capacity can be provided as radiation-absorbing particles 12. These can also be metal particles, for example.If the heat exchanger 3 and / or the ceiling or wall panel 4, as well as the foam layer 6, are made of a polymer material, carbon particles or particles of a radiation-absorbing carbon compound are suitable. Thus, from a chemical perspective, polymer materials are also carbon compounds, which keeps the material diversity low and recyclability high.

[0181] According to a further embodiment (Fig. 5), a sound-absorbing layer 13 is incorporated into the material of the ceiling or wall panel 4. The sound-absorbing layer 13 is preferably an acoustic foam and preferably made of the same material as the diffusion-tight thermal insulation material of the ceiling or wall panel 4. The acoustic foam has a more open-pored surface than the thermal insulation material. The sound-absorbing layer 13 reduces the sound level and reverberation time in room 2.

[0182] According to a further embodiment (Fig. 6), a moisture-wicking layer 14 is provided between the interface 5 and the foam layer 6. The moisture-wicking layer 14 is significantly thinner than the foam layer 6 and lies both directly on the interface 5 and against the foam layer 6. The moisture-wicking layer 14 is, for example, a capillary-active fleece with which any moisture that may occur can be wicked away. It extends into an edge region of the heat exchanger panel 1 in such a way that it protrudes at the interface 5, allowing the wicked moisture to dry in the ambient air.

[0183] According to a further embodiment (Fig. 7), a selective coating 15 is provided on the surface 7 of the foam layer 6. The selective coating 15 is a polymer membrane made of polyethylene or polypropylene that is transparent to thermal radiation 13. It is preferably provided for decorative reasons, but can also serve technical purposes.

[0184] According to a further embodiment (Fig. 8), lighting elements 16 are provided between the interface 5 and the foam layer 6. The lighting elements 16 can, for example, be LEDs mounted at a distance from one another on the interface 5. Thus, a ceiling or wall panel 4 can not only serve to regulate the temperature of the room 2, but simultaneously contribute to the optical and technical design of the room 2 with lighting elements 16.

[0185] A method for controlling the temperature of a building space (room) 2 with a heat exchanger panel 1 according to the invention is explained below.

[0186] In the cooling case, a boundary surface 5 of the heat exchanger panel 1 facing the room 2 is brought to a temperature lower than a heat load or the room temperature. For this purpose, a refrigerant is used as the heat exchange medium, which contains at least one tube of a heat exchanger.

[0187] 3 of the heat exchanger panel 1.

[0188] The coolant, for example in the form of cooled water, is provided to the heat exchanger 3 by means of a heat pump (not shown) and fed to the tube of the heat exchanger 3 via a pipeline (not shown).

[0189] A layer 6 made of a polymer material (foam layer) is arranged on the interface 5.

[0190] The foam layer 6 ensures, on the one hand, that no room air can reach the cool interface 5 directly, whereby no condensation of moisture from the room air of the room 2 can occur at the interface 5.

[0191] On the other hand, the foam layer 6 ensures that no heat flow occurs from the cool interface 5 to a warm surface 7 of the foam layer 6. This also prevents condensate from forming on the surface 7 of the foam layer 6.

[0192] Thus, the interface 5 can be brought to a temperature below the dew point and the surface 7 of the foam layer 6 facing the room 2 still remains at a surface temperature above the dew point (average room temperature).

[0193] By means of the interface 5, heat can be extracted from the heat load in the room 2. The heat extraction takes place by means of thermal radiation 8, which can be emitted at least partially through the foam layer 6 to the interface 5 and is absorbed by the foam layer 6 in a region of the interface 5 and then reaches the interface 5 by means of heat conduction 9.

[0194] At the same time, the foam layer 6 absorbs sufficient heat from the space 2 (by means of heat conduction 9 from convection heat 10 in a region of the surface 7 and by means of heat radiation 8 in the entire volume of the foam layer 6) so that this heat exceeds the heat flow from the interface 5 to the surface 7, whereby the heat cannot reach the surface 7 in order to cool it down.

[0195] In heating mode, however, the interface 5 of the heat exchanger panel 1 facing the room 2 is brought to a higher temperature than the cooling load. A heating medium is used as the heat exchange medium.

[0196] The heating medium, for example in the form of heated water, is provided to the heat exchanger 3 by the heat pump and fed to the tube of the heat exchanger 3 via the pipeline. The foam layer 6 ensures that no heat flow occurs from the warm interface 5 to the cool surface 7 of the foam layer 6. This prevents the loss of convection heat at the surface 7.

[0197] Heat can thus be supplied to the cold load via the interface 5. Since the foam layer 6 is at least partially transparent to thermal radiation 13, the room 2 is heated by thermal radiation 13.

[0198] A second embodiment (second aspect of the invention) is explained below (Figs. 9 to 11). Identical parts have the same reference numerals as in the previous embodiment. Furthermore, the above explanations apply equally to the corresponding parts of the second embodiment. The second embodiment differs from the first embodiment in that a cover layer 17 is arranged on the surface 7 of the layer 6 made of a polymer material. The cover layer 17 is designed to be at least partially permeable to thermal radiation 8.

[0199] In a first embodiment of the second embodiment (Fig. 9), the cover layer 17 is a hole support structure 18.

[0200] The hole support structure 18 is glued to the foam layer 6.

[0201] The hole support structure 18 has a plurality of through holes 19 arranged substantially perpendicular to the surface 7 of the foam layer 6. The through holes 19 thus extend from a surface of the hole support structure 18 facing the space 2 to the foam layer 6.

[0202] The through holes 19 have a depth of 1 cm to 10 cm running perpendicular to the interface.

[0203] The perforated support structure 18 provides increased stability to the heat exchanger panel 1. At the same time, the perforated support structure 18 is intended to provide a visually appealing appearance to the side of the heat exchanger panel 1 facing the room 2.

[0204] The distance between the through-holes 19 and the area of ​​the through-holes 19 in a plan view are selected such that the hole support structure 18 has the largest possible opening width. Thus, the hole support structure 18 is almost permeable to thermal radiation 8.

[0205] The hole support structure 18 is made of metal, so it is a good thermal conductor. It conducts heat from the space 2 to the surface 7. The through-holes 19 each have surface sections 20 running perpendicular to the interface 5. These surface sections 20 form the walls of the through-holes 19.

[0206] The surface sections 20 are preferably designed or provided with a coating that has a high degree of reflection for thermal radiation 8. Thus, the thermal radiation 8 is reflected through them with as little loss as possible.

[0207] Due to the through holes 19 and the large opening width of the through holes 19, air from the space 2 can reach the foam layer 6 almost unhindered. The hole support structure 18 thus provides additional stability to the heat exchanger panel 1 without significantly impairing the properties of the heat exchanger panel 1 mentioned in the first embodiment.

[0208] In a further embodiment (Fig. 10), the hole support structure 18 can also be arranged at a distance from the foam layer 6. In this case, at least one edge element 24 can be provided, which engages laterally on the heat exchanger panel 1 and on the hole support structure 18, thus coupling the hole support structure 18 to the heat exchanger panel 1.

[0209] According to a second embodiment of the second exemplary embodiment (Fig. 11), the cover layer 17 is a surface element in the form of a film 21.

[0210] The film 21 is glued to the foam layer 6. The adhesive is heat-conductive and at least partially permeable to thermal radiation.

[0211] The film 21 is made of a polymer material, in particular the same material as the foam layer 6. The film 21 is thus at least partially permeable to thermal radiation 8.

[0212] The film 21 has a thickness between 2 mm and 20 mm. At a wavelength between approximately 2 pm and approximately 20 pm or between approximately 2 pm and approximately 100 pm, the film 21 has a transmission of more than approximately 50%, or more than approximately 70%, or more than approximately 90%, at least in a partial range.

[0213] The thickness and transmission of the film 21 are selected so that sufficient heat radiation 8 can be emitted through it and sufficient heat reaches the foam layer 6 by means of heat conduction 9 so that the foam layer 6 retains the properties mentioned in the first embodiment.

[0214] The film 21 on the foam layer 6 imparts a smooth surface. Such a smooth surface is easier to clean than the typically rough surface of such a foam layer 6. The film 21 also serves as a mechanical protective layer to prevent or at least mitigate direct physical impacts on the foam layer 6.

[0215] The film 21 additionally ensures that the combination of foam layer 6 and film 21 is completely airtight, whereby no air can reach the interface 5 from the space 2.

[0216] The elements mentioned in the first embodiment with reference to the further embodiments (heat-conducting layer 11, radiation-absorbing particles 12, sound-absorbing layer 13, moisture-dissipating layer 14, selective coating 15 and lighting element 16) can also be provided for the second embodiment.

[0217] A method for producing a heat exchanger panel 1 explained above with reference to the first embodiment is provided below.

[0218] The method can also be used to produce a heat exchanger panel 1 according to the second embodiment, apart from the cover layer 17.

[0219] A layer 6 of a polymer material (foam layer) and a heat exchanger 3 with a metal tube are provided.

[0220] The metal tube of the heat exchanger 3 is arranged such that several parallel metal tube surfaces are present on one side of the heat exchanger 3. The foam layer 6 is intended to be firmly bonded to these metal tube surfaces.

[0221] The foam layer 6 is a thin, essentially plate-shaped solid made of an IR-transparent, foamable polymer material. The polymer material is a polyolefin, such as polyethylene or polypropylene.

[0222] A polyurethane hot-melt adhesive film is heated. The heated hot-melt adhesive film is then hot-pressed onto a surface of foam layer 6.

[0223] After the polyurethane hot melt adhesive film on the surface of the foam layer 6 has cooled, an adhesive, in particular a liquid adhesive, is applied to the cooled mass.

[0224] The foam layer 6 is pressed onto the surfaces of the heat exchanger 3 and adhesively bonded to the surfaces by means of the adhesive.

[0225] This process creates a permanent bond between a layer of low-energy polyethylene or polypropylene and a metal surface. The polyurethane hot-melt adhesive film exhibits high-energy (highly polar) properties when heated, which allows it to bond very well with the low-energy (non-polar) polyethylene of foam layer 6. The bond is then formed by the melting of both polymers, which bond together at the molecular level, thus forming a strong bond. Their melting points are adjusted so that they are close to each other.

[0226] The hot-melt adhesive film creates a surface on the foam layer 6 to which another adhesive can be easily applied. This allows the foam layer 6 to be bonded securely to the metal surfaces of the heat exchanger 3 in a subsequent step.

[0227] A third embodiment is explained below (Fig. 12). Identical parts have the same reference numerals as in the previous embodiments. Furthermore, the above explanations apply equally to the corresponding parts of the third embodiment.

[0228] The heat exchanger panel 1 comprising the heat exchanger s is provided. The heat exchanger 3 has the interface 5.

[0229] A surface element 23 is provided between the interface 5 and the space 2, so that an intermediate space 22 is enclosed between the interface 5 and the surface element 23. The surface element 23 is arranged substantially parallel to the interface 5.

[0230] The intermediate space 22 is laterally delimited by a completely circumferential edge element 24. The edge element 24 is firmly connected to the heat exchanger panel 1 and protrudes beyond the boundary surface 5 into the space 2.

[0231] The surface element 23 is a film and is designed to be at least partially permeable to thermal radiation 8. The film is flexible and is connected to the edge element 24 in a diffusion-tight manner and stretched. The surface element 23 can also be a rigid plate-shaped body that is connected to the edge element 24 at the edge. The surface element 23 can be glued to the edge element 24.

[0232] The surface element 23 is made of a polymer material.

[0233] The surface element 23 has a thickness of at least 2 mm or at least 4 mm or at least 6 mm and a thickness of a maximum of 20 mm or a maximum of 15 mm or a maximum of 10 mm.

[0234] At a wavelength between approximately 2 pm and approximately 20 pm or between approximately 2 pm and approximately 100 pm, the surface element 23 has, at least in a partial region, a transmission of more than approximately 50%, or more than approximately 70%, or more than approximately 90%. The intermediate space 22 is filled with air. Thus, the surface element 23 can be particularly thin. If there were a vacuum in the intermediate space 22, a surface element 23 that is too thin would be sucked into the intermediate space 22. A protective gas can also be provided in the intermediate space 22.

[0235] The intermediate space 22 can also be almost empty of air if the surface element 23 has a corresponding thickness.

[0236] Due to the gap 22 and the surface element 23, no room air can reach the interface 5 and condense there. The temperature exchange between interface 5 and room 2 occurs almost exclusively via thermal radiation 8.

[0237] A hole support structure 14 is arranged on a side 25 of the surface element 23 facing the space 2.

[0238] The hole support structure 14 is firmly connected laterally to the edge element 24. The hole support structure 14 can be adhesively connected to the edge element 24.

[0239] The hole support structure 14 can be arranged adjacent to the surface element 23 or slightly spaced from the surface element 23.

[0240] It can also be provided that the surface element 23 is not connected to the edge element 24, but is only connected, in particular glued, to the hole support structure 14. Diffusion tightness towards the edge element 24 is important in this case.

[0241] The perforated support structure 14 also provides increased stability to the structure of the heat exchanger panel 1 according to the third exemplary embodiment. Since the perforated support structure 14 ensures the stability of the heat exchanger panel 1 and protects the surface element 23 from the room 2, the surface element 23 can be made particularly thin. This makes it particularly transparent to thermal radiation 8, making the heat exchange of the heat exchanger panel 1 very effective.

[0242] List of reference symbols

[0243] 1 heat exchanger panel

[0244] 2 building space

[0245] 3 heat exchangers

[0246] 4 Ceiling or wall panel

[0247] 5 Interface

[0248] 6 layer of polymer material

[0249] 7 Surface of the layer

[0250] 8 Thermal radiation

[0251] 9 Heat conduction

[0252] 10 convective heat exchange

[0253] 11 heat-conducting layer

[0254] 12 radiation-absorbing particles

[0255] 13 sound-absorbing layer

[0256] 14 moisture-wicking layer

[0257] 15 selective coating

[0258] 16 lighting element

[0259] 17 Cover layer (hole support structure / film)

[0260] 18 hole support structure

[0261] 19 through hole

[0262] 20 surface section

[0263] 21 Slide

[0264] 22 space

[0265] 23 Surface element

[0266] 24 edge element

[0267] 25 room-facing side

Claims

Claims 1 . Heat exchanger panel for tempering building rooms comprising - a heat exchanger which has a medium line for conducting a heat exchange medium and a heat exchanger wall which is in thermal contact with the medium line, wherein the heat exchanger wall has a boundary surface facing the building space to be tempered, which boundary surface can be brought to a lower temperature than a heat load or a higher temperature than a cold load, and - a layer of a polymer material which is arranged on the interface of the heat exchanger, wherein the layer has a plurality of gas bubbles or a plurality of gas chambers so that it is at least partially permeable to thermal radiation, characterized in that the layer of polymer material has a transparency of not more than 30% in a wavelength range of thermal radiation between 9 pm and 11 pm.

2. Heat exchanger panel according to claim 1, characterized in that the layer of polymer material has a transparency of not more than 25% or not more than 20% or not more than 15% or not more than 10% or not more than 5% in the wavelength range of thermal radiation between 9 pm and 11 pm.

3. Heat exchanger panel according to claim 1 or 2, characterized in that the layer of polymer material has a transparency of not more than 30% or not more than 25% or not more than 20% or not more than 15% or not more than 10% or not more than 5% in a wavelength range of thermal radiation between about 2 pm and about 20 pm or between about 2 pm and about 100 pm.

4. Heat exchanger panel according to one of claims 1 to 3, characterized in that the layer of polymer material has a thickness of at least 2 mm or at least 3 mm or at least 4 mm or at least 5 mm or at least 6 mm or at least 7 mm or at least 8 mm and / or a thickness of at most 28 mm or of at most 27 mm or. maximum 26 mm or maximum 25 mm or maximum 24 mm or maximum 23 mm or maximum 22 mm respectively.

5. Heat exchanger panel according to one of claims 1 to 4, characterized in that the polymer material of the layer is formed from a polyolefin, preferably from polyethylene or polypropylene, or a mixture thereof.

6. Heat exchanger panel according to one of claims 1 to 5, characterized in that the layer of polymer material is a layer of a foam, in particular with closed cells, or a bubble film or hollow chamber film and / or the layer completely covers the interface.

7. Heat exchanger panel according to one of claims 1 to 6, characterized in that the heat exchanger has at least one straight or meandering tube and / or is a plate heat exchanger.

8. Heat exchanger panel according to one of claims 1 to 7, characterized in that a heat-insulating and / or sound-absorbing layer and / or a layer diffusion-tight against water vapor is provided on a side of the heat exchanger facing away from the building space to be tempered.

9. Heat exchanger panel for tempering building rooms, in particular according to one of claims 1 to 8, comprising - a heat exchanger having a medium line for conducting a heat exchange medium and a heat exchanger wall which is in thermal contact with the medium line, wherein the heat exchanger wall has a boundary surface facing the building space to be tempered, which boundary surface can be brought to a lower temperature than a heat load or a higher temperature than a cold load, - a layer of a polymer material arranged on the interface of the heat exchanger, wherein the layer has gas bubbles or gas chambers so that it is at least partially permeable to thermal radiation, and - a cover layer which is arranged on the layer of polymer material and is at least partially permeable to thermal radiation, wherein the cover layer has a plurality of through holes.

10. Heat exchanger panel according to claim 9, characterized in that the cover layer is a hole support structure which has a plurality of through holes so that it is almost permeable to heat radiation.

11. Heat exchanger panel according to claim 10, characterized in that an edge of each through-hole has a distance from the edges of the respective adjacent through-holes of a maximum of 3 mm, a maximum of 2 mm, a maximum of 1 mm, a maximum of 0.5 mm, or a maximum of 0.2 mm.

12. Heat exchanger panel according to claim 10 or 11, characterized in that the through holes have a center-to-center distance of maximum 10 mm or maximum 8 mm or maximum 6 mm or maximum 4 mm or maximum 2 mm from one another.

13. Heat exchanger panel according to one of claims 10 to 12, characterized in that the through holes each have a round shape or a polygonal, preferably a hexagonal, shape.

14. Heat exchanger panel according to one of claims 10 to 13, characterized in that the through holes in a plan view each have an area of ​​not more than 1.5*10 3 mm 2 or not more than 750 mm 2 or not more than 100 mm 2 or not more than 10 mm 2 or not more than 1 mm 2 or not more than 0.1 mm 2 or not more than 0.01 mm 2 or not more than 1*10 3 pm 2 or not more than 100 pm 2 have.

15. Heat exchanger panel according to one of claims 10 to 14, characterized in that the through holes have a depth running substantially perpendicular to the interface of at least 1 cm or at least 2 cm or at least 4 cm or at least 6 cm or at least 8 cm or at least 10 cm.

16. Heat exchanger panel according to one of claims 10 to 15, characterized in that that surface sections of the hole support structure running essentially perpendicular to the interface have an absorption of at least 50% or at least 60% or at least 70% or at least 80% or at least 90% or an absorption of a maximum of 50% or a maximum of 40% or a maximum of 30% or a maximum of 20% or a maximum of 10% with respect to thermal radiation.

17. Heat exchanger panel according to one of claims 10 to 16, characterized in that the hole support structure is a punched or perforated metal foil or ceramic foil or foil made of a carbon fiber composite material, wherein the holes or perforations form the through holes.

18. Heat exchanger panel according to one of claims 10 to 16, characterized in that the hole support structure is a metal grid with grid openings, the grid openings forming the through holes.

19. Heat exchanger panel according to one of claims 10 to 16, characterized in that the hole support structure is a grid made of a fiber-reinforced polymer composite material or is formed from fibers made of a fiber composite material or from fibers made of an inorganic material, wherein grid openings of the grid form the through-holes.

20. Heat exchanger panel according to claim 9, characterized in that the covering layer is a surface element, in particular a film, which is at least partially permeable to thermal radiation.

21. Heat exchanger panel according to claim 20, characterized in that the surface element has a thickness of at least 2 mm or at least 4 mm or at least 6 mm and a thickness of at most 20 mm or at most 15 mm or at most 10 mm.

22. Heat exchanger panel according to claim 20 or 21, characterized in that the surface element has a transmission of more than about 50% or of more than about 70% or of more than about 90% at a wavelength between about 2 pm and about 20 pm or between about 2 pm and about 100 pm at least in a partial region.

23. A method for producing a heat exchanger panel according to any one of claims 1 to 8, comprising - Providing a layer of a polymer material and a heat exchanger with at least one metal surface, - Heating a polyurethane hot melt adhesive film, - pressing the hot melt adhesive film made of polyurethane onto a surface of the layer made of a polymer material, - Cooling of the polyurethane hot melt adhesive film on the surface of the layer of a polymer material, - applying an adhesive to the cooled polyurethane hot melt adhesive film on the surface of the layer of a polymer material, and - Bonding the layer of a polymer material to the at least one metal surface of the heat exchanger by means of the adhesive.

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