Alignment solder, and laser soldering apparatus and soldering method using same

Abstract

According to one embodiment of the present invention, a soldering apparatus and a soldering method may be provided, the soldering apparatus comprising: a solder unit which supplies an alignment solder included to be insertable into fixing pins of a fixing block respectively inserted into a plurality of insertion holes formed in a circuit board, and inserts the alignment solder into the fixing pins; and a laser generation unit which generates laser beams of one or more wavelengths, wherein the soldering apparatus solders by irradiating the alignment solder and the fixing pins with laser beams of the same wavelength or different wavelengths.

Description

Align solder, laser soldering device using the same, and soldering method

[0001] The present invention relates to an align solder, a laser soldering device using the same, and a soldering method.

[0002] Electronic devices are rapidly becoming smaller and thinner. Furthermore, the electronic components embedded in these devices, such as semiconductor devices, are also increasingly demanded to be smaller and thinner. Furthermore, electronic components are becoming more dense, increasing the number of connection terminals.

[0003] To meet these needs, a method of mounting electronic components on the surface of a printed circuit board, such as a printed circuit board, has recently been applied as an external connection terminal, through methods such as flip chip mounting. This mounting method is a method of mounting a solder ball or solder wire on an electrode installed on the substrate of an electronic component and then directly bonding the solder ball or solder wire to the electrode of the mounting substrate. When a surface mounting method utilizing a solder ball or solder wire is applied, a method is generally used in which the solder ball or solder wire is positioned on the electrode of the substrate on which the solder ball or solder wire is mounted on the substrate of the electronic component and then the solder ball or solder wire is heated and melted to bond it to the electrode.

[0004] Here, the parts where solder balls or solder wires must be applied for the size of the electronic component, connection stability, etc. are diverse, and the area and volume of those parts also vary.

[0005] However, surface-mounting methods utilizing solder balls or solder wires present challenges in controlling the amount and location of solder applied, as well as its uniformity. With the growing need for high-precision, high-quality soldering, research is being conducted on methods utilizing various solders to achieve this control.

[0006]

[0007] [Prior Art Literature]

[0008] [Patent Document]

[0009] (Patent Document 0001) Republic of Korea Patent Publication No. 10-1306303 (Registration Date: September 3, 2013)

[0010] The present invention has been devised to solve the above-mentioned technical problem, and its purpose is to provide an alignment solder capable of improving the reliability of a soldering process by providing solder in a specific shape at a soldering position to fix an image module on a circuit board by soldering, a laser soldering device using the same, and a soldering method.

[0011] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the description below.

[0012] Another laser soldering device according to one embodiment of the present invention,

[0013] A solder part that supplies an alignment solder that can be inserted into the fixing pins of the fixing blocks that are each inserted into a plurality of insertion holes formed on the circuit board and is inserted into the fixing pins; and

[0014] A laser generating unit that generates a laser of one or more wavelengths; soldering can be performed by irradiating the alignment solder and the fixing pin with lasers of the same or different wavelengths.

[0015] According to one embodiment of the present invention,

[0016] The above laser generating unit,

[0017] The laser can be sequentially irradiated to the alignment solder inserted into the plurality of insertion holes.

[0018] According to one embodiment of the present invention, a plurality of laser generating units are provided,

[0019] The laser can be simultaneously irradiated to each of the alignment solders inserted into the plurality of insertion holes.

[0020] According to one embodiment of the present invention, the laser generating unit,

[0021] The above-mentioned aligned solder can be reworked by irradiating the laser on it.

[0022] According to one embodiment of the present invention, the alignment solder may include a bushing solder formed in a ring shape.

[0023] According to one embodiment of the present invention, the alignment solder may include a sleeve solder formed in a sleeve shape.

[0024] According to one embodiment of the present invention, the laser generating unit may include a first generating unit that irradiates a laser to the pin; and a second generating unit that irradiates a laser to the alignment solder.

[0025] According to one embodiment of the present invention, the second generating unit can generate and irradiate a ring-shaped laser beam to the alignment solder.

[0026] According to one embodiment of the present invention, the control unit can control the output of the laser generated from the first generation unit and the second generation unit according to the material of the fixing pin and the alignment solder.

[0027] According to one embodiment of the present invention, the laser beam can be transmitted through an optical fiber.

[0028] According to one embodiment of the present invention, a beam conversion device for controlling the shape of the laser beam may be included.

[0029] According to one embodiment of the present invention, the device further includes a beam control unit for controlling the irradiation position of the laser beam, wherein the beam control unit comprises: a beam focusing unit for controlling the focal position of the laser beam; and information on the position and alignment state at which the laser is to be irradiated, which is controlled by the beam focusing unit, can be obtained to irradiate the laser beam to a processing target.

[0030] According to one embodiment of the present invention, the amount of solder can be adjusted according to at least one condition among the thickness of the circuit board, the diameter of the insertion hole, the diameter of the fixing pin, the position of the fixing pin inserted into the insertion hole, and the height of the fixing pin inserted into the insertion hole.

[0031] According to one embodiment of the present invention, the output of the laser can be controlled according to at least one condition among the thickness of the circuit board, the diameter of the insertion hole, the diameter of the fixing pin, the position of the fixing pin inserted into the insertion hole, and the height of the fixing pin inserted into the insertion hole.

[0032] According to one embodiment of the present invention, the shape of the laser beam can be adjusted according to at least one condition among the thickness of the circuit board, the diameter of the insertion hole, the diameter of the fixing pin, the position of the fixing pin inserted into the insertion hole, and the height of the fixing pin inserted into the insertion hole.

[0033] An align solder according to one embodiment of the present invention is included so as to be insertable into a fixing pin inserted into an insertion hole of a circuit board, and is included so as to surround an outer circumference of the fixing pin, and can be soldered by laser irradiation.

[0034] According to one embodiment of the present invention, the alignment solder may include a bushing solder formed in a ring shape.

[0035] According to one embodiment of the present invention, the alignment solder may include a sleeve solder formed in a sleeve shape.

[0036] A soldering method according to one embodiment of the present invention may include a step of placing a circuit board; a fixing step of placing a fixing pin in an insertion hole of a fixing block; an insertion step of inserting solder into the fixing pin; and a soldering step of melting and soldering the alignment solder.

[0037] According to one embodiment of the present invention, the soldering step may include a laser irradiation step of irradiating a laser beam to the fixed pin; and a melting step of melting the alignment solder by heat transferred from the fixed pin heated by the laser beam.

[0038] According to one embodiment of the present invention, the soldering step includes a first laser irradiation step of irradiating a laser beam to the fixing pin; and a second laser irradiation step of irradiating a laser beam to the alignment solder; and laser beams of the same or different wavelengths may be irradiated depending on the materials of the fixing pin and the alignment solder.

[0039] According to one embodiment of the present invention, in the second laser irradiation step, the laser beam irradiated to the alignment solder may be irradiated in a ring shape.

[0040] According to one embodiment of the present invention, the alignment solder may include a bushing solder formed in a ring shape.

[0041] According to one embodiment of the present invention, the alignment solder may include a sleeve solder formed in a sleeve shape.

[0042] According to one embodiment of the present invention, a rework step may be included in which the alignment of the image sensor and the image module of the circuit board is corrected and reworked by setting offsets in the x-axis direction, the y-axis direction, the z-axis direction, the x-axis Theta direction, the y-axis Theta direction, and the z-axis Theta direction according to the shrinkage amount of the alignment solder by laser soldering.

[0043] According to embodiments of the present invention, in order to fix a processing target on a circuit board by soldering, the solder provided at the soldering location can be provided in a specific shape to improve the reliability of the soldering process.

[0044] According to embodiments of the present invention, uniformity and stability of soldering can be secured.

[0045] According to embodiments of the present invention, soldering defects that may occur in a soldering process, such as the occurrence of non-solderable cavities, can be reduced.

[0046] According to embodiments of the present invention, uniform and reliable soldering can be achieved regardless of the size (width or volume) and shape of the soldering area.

[0047] According to embodiments of the present invention, even when the soldering area (width or volume) is large and the existing soldering process cannot be applied or the existing soldering process must be performed multiple times, uniform and reliable soldering can be achieved with only one or two soldering processes.

[0048] According to embodiments of the present invention, even when the soldering area is non-planar or the solder must spread to the opposite surface of the mounting surface, uniform and reliable soldering can be achieved with only one or two soldering processes.

[0049] According to embodiments of the present invention, soldering is performed while the alignment solder is fixed, thereby improving the positional accuracy of soldering.

[0050] Figure 1 is a schematic diagram of an alignment solder according to one embodiment of the present invention.

[0051] Figure 2 is a schematic diagram of a laser soldering device according to one embodiment of the present invention.

[0052] Figure 3 is an exemplary diagram showing a soldering shape of a laser soldering device according to one embodiment of the present invention.

[0053] FIG. 4 is a cross-sectional view of a fixing pin with an alignment solder inserted into an insertion hole of a circuit board according to one embodiment of the present invention.

[0054] FIG. 5 is a drawing showing a state in which solder is inserted into a fixed pin and solder is soldered by a laser according to one embodiment of the present invention.

[0055] Figures 6 and 7 are drawings showing the shape of a laser beam according to another embodiment of the present invention.

[0056] FIG. 8 is a drawing showing a graph showing heat distribution according to the shape of a laser beam according to one embodiment of the present invention.

[0057] FIG. 9 is a drawing showing a state of preheating and heating using a laser according to one embodiment of the present invention.

[0058] Figures 10 to 12 are drawings showing the configuration of an optical fiber that transmits a laser according to one embodiment of the present invention.

[0059] Figures 13 and 14 are flowcharts of a laser soldering method according to one embodiment of the present invention.

[0060] Hereinafter, an embodiment of an alignment solder according to the present invention, a laser soldering device using the same, and a soldering method will be described in detail with reference to the attached drawings.

[0061] When assigning reference numerals to components in each drawing, it should be noted that identical components are assigned the same numerals whenever possible, even if they appear on different drawings. Furthermore, when describing embodiments of the present invention, if a detailed description of a related known configuration or function is deemed to hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0062] In describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by the terms. In addition, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this application.

[0063]

[0064] According to an embodiment of the present invention, the alignment solder, the soldering device using the same, and the soldering method can be used to perform laser processing processes such as joining, welding, bonding, and soldering of image modules on a circuit board. Hereinafter, the laser soldering device and method of the present invention will be described as an example of performing soldering. That is, the laser processing device can be employed as a soldering device to perform only the soldering process. In this case, the laser processing device can be described as a soldering device.

[0065] Furthermore, the soldering device using the align solder according to the embodiment of the present invention can be included in various processes such as welding, soldering, bonding, joining, etc., and the material on which each process is performed can also be applied to various materials such as polymers, metals, dielectrics, semiconductors, and glass.

[0066]

[0067] In the present invention, as described below, in order to fix a processing target on a circuit board by soldering, solder formed in a specific shape is injected into a soldering position of the processing target to allow the soldering process to proceed, thereby improving the reliability of the solder.

[0068]

[0069] Fig. 1 is a schematic diagram of an alignment solder according to one embodiment of the present invention. Specifically, Fig. 1(a) is a diagram of the alignment solder, and Fig. 1(b) is a front view of various alignment solders including a bent portion.

[0070] Referring to FIG. 1, the alignment solder (S) may be included so as to be insertable into a fixing pin inserted into an insertion hole of a circuit board and may be included so as to surround an outer surface of the fixing pin.

[0071] Here, the part where the alignment solder is positioned before soldering may be a fixing pin or an insertion hole of a circuit board. That is, the fixing pin may enter the insertion hole of a circuit board while the alignment solder is positioned on the fixing pin, or the fixing pin may enter the insertion hole of a circuit board while passing through the alignment solder while the alignment solder is positioned on the inner surface of the insertion hole of the circuit board.

[0072] In addition, the alignment solder may be formed to a length that ensures the engagement between the fixing pin and the insertion hole of the circuit board. That is, it may be formed to a length identical to the length of the insertion hole of the circuit board, or it may be formed to a length that can extend beyond one or more of the upper and lower portions of the insertion hole. Furthermore, the thickness of the alignment solder may be determined according to the distance between the fixing pin and the insertion hole, and may be determined to a thickness that allows the alignment solder to be positioned between the fixing pin and the circuit board in the insertion hole of the circuit board. The length and thickness of the alignment solder may be determined to match the weight or volume of solder required for the soldering portion.

[0073] The align solder (S) can be formed as a bushing solder formed in a ring shape or a sleeve solder formed in a sleeve shape, and can be inserted into a fixing pin inserted into an insertion hole of a circuit board and soldered so that the circuit board and the fixing pin are joined by melting with a laser beam.

[0074] The alignment solder (S) may be formed into a ring shape and provided in a form inserted into a fixing pin or an insertion hole of a circuit board before soldering. When provided in a form inserted into a fixing pin before soldering, in order to secure stable positioning of the alignment solder, the upper portion of the alignment solder may be bent inward and the bent portion may be provided in a state where it is caught on the upper surface of the fixing pin. In addition, the lower portion of the alignment solder may be bent outward and the bent portion may be provided in a state where it is positioned on the lower side of the fixing pin. Alternatively, when provided in a form inserted into an insertion hole of a circuit board before soldering, at least one of the upper and lower portions of the alignment solder may be bent outward and the bent portion may be provided in a state where it is caught on at least one of the upper and lower surfaces of the circuit board.

[0075] Meanwhile, the "ring shape" may be a shape in which the horizontal cross-section forms a sealed ring as illustrated in Fig. 1, or, although not illustrated in the drawing, may be a shape in which one side is open without being sealed. In the case in which one side is open, the alignment solder (S) may be positioned on the fixed pin by elastic expansion and return of the side through the open side.

[0076] It can be formed in a ring shape and included to surround a fixing pin inserted into an insertion hole of a circuit board, and can be inserted into the fixing pin and inserted into the insertion hole of the circuit board together with the fixing pin and melted and soldered by a laser beam.

[0077]

[0078] In another embodiment, the alignment solder (S) may be formed in a sleeve shape. It may be formed in a sleeve shape to surround a fixing pin inserted into an insertion hole of a circuit board, and may be bent on one or both sides to be soldered and joined to the fixing pin and the circuit board. The term "sleeve shape" may refer to a shape that is longer than a "ring shape."

[0079] FIG. 2 is a schematic diagram of a laser soldering device according to an embodiment of the present invention, FIG. 3 is an exemplary diagram showing a soldering shape of a laser soldering device according to an embodiment of the present invention, FIG. 4 is a diagram showing a cross-section of a fixing pin into which an align solder is inserted into an insertion hole of a circuit board according to an embodiment of the present invention, FIG. 5 is a diagram showing a state in which soldering is performed on solder inserted into a fixing pin by a laser according to an embodiment of the present invention, FIGS. 6 to 7 are diagrams showing a shape of a laser beam according to another embodiment of the present invention, FIG. 8 is a diagram showing a graph showing a heat distribution according to a shape of a laser beam according to an embodiment of the present invention, FIG. 9 is a diagram showing a state of preheating and heating using a laser according to an embodiment of the present invention, and FIGS. 10 to 12 are diagrams showing a configuration of an optical fiber for transmitting a laser according to an embodiment of the present invention.

[0080]

[0081] Referring to FIGS. 2 to 12, the laser soldering device (100) may be configured to supply alignment solder (S) that can be inserted into the fixing pins (221) of the fixing blocks (220) that are each inserted into a plurality of insertion holes (211) formed in the circuit board (210) and include a soldering unit (not shown) that inserts the alignment solder (S) into the fixing pins (221) and a laser generating unit (20) that generates a laser of one or more wavelengths, so that soldering can be performed by irradiating the alignment solder (S) and the fixing pins (2210) with lasers of the same or different wavelengths.

[0082] A fixing pin (221) inserted into an insertion hole (211) by a laser soldering device (100) can be soldered by a laser beam applied to an alignment solder (S), and a circuit board (210) in which a plurality of insertion holes (211) are formed by soldering and a fixing block (220) inserted into the insertion hole (211) can be mutually connected to a plurality of fixing pins (221) extending in one direction.

[0083]

[0084] The laser generating unit (20) may include a first generating unit (not shown) that irradiates a laser to the fixing pin (221) and a second generating unit (not shown) that irradiates a laser to the alignment solder (S). The first generating unit may irradiate a laser beam to the fixing pin (221), and by heating the fixing pin (221), the alignment solder (S) melted by the second laser may be easily bonded, and the mutual bonding strength may be further improved. The second generating unit may irradiate a laser beam to the alignment solder (S) inserted into the fixing pin (221), and the laser generated from the second generating unit may be preferably irradiated in a ring shape to melt the alignment solder (S) included in the ring or sleeve shape, thereby performing soldering. The wavelength of the laser generated from the first generator and the wavelength of the laser generated from the second generator can be irradiated with the same or different wavelengths, and of course, the irradiated wavelength can be determined depending on the material of the fixing pin (221) and the alignment solder (S).

[0085]

[0086] The laser generating unit (20) may include a beam converter (30) and a beam adjusting unit (50). The cross-sectional area of ​​the laser beam generated from the laser generating unit (20) may be adjusted while passing through the beam converter (30). At this time, the cross-sectional area of ​​the adjusted beam may be the cross-sectional area of ​​the laser to be irradiated toward the soldering position. At this time, the cross-sectional area of ​​the adjusted beam may be the cross-sectional area of ​​the laser to be irradiated toward the soldering position. In addition, the shape of the laser beam, such as a circular beam, a ring-shaped beam, an inner circular beam, and an outer ring-shaped beam, may be adjusted by the beam converting unit (30).

[0087] The beam control unit (50) may be configured to include a beam focusing unit (not shown) that controls the focal position of the laser beam, and a laser irradiation unit (not shown) that obtains information on the position and alignment status at which the laser adjusted by the beam focusing unit is to be irradiated and irradiates the laser beam. In addition, depending on the case, it may be configured to include a heat distribution measurement unit (not shown) that measures the surface temperature or melting temperature of the soldering processing point. The monitoring unit (not shown) may be, for example, a dynamic focusing module or a camera module, but is not limited thereto.

[0088]

[0089] The laser soldering device may include a control unit (10), and the control unit (10) is included to control the output of the laser generated from the first generation unit and the second generation unit according to the material of the fixing pin (221) and the alignment solder (S), so that the output of the laser can be controlled according to the material of the fixing pin (221) and the alignment solder (S).

[0090]

[0091] The control unit (10) can control laser irradiation to perform a soldering process at the soldering point. The transport unit (not shown) can transport the circuit board and position it at the soldering location, i.e., the fixing pin (221) and insertion hole (211) area.

[0092] The laser soldering device (100) can be adjusted to irradiate the laser to the alignment solder (S) that is melted by the irradiation of the laser beam. The laser irradiation position of the laser generating unit can be controlled through the control unit (10), and the laser irradiation coordinate can be determined through a detection value input or measured from the monitoring unit (not shown), and the laser can be irradiated to the soldering position through the beam conversion device. In some cases, the focus coordinate can be adjusted using a precision stage composed of at least three axes, and a tilt stage can be included to adjust the angle at which the laser beam is irradiated. Here, the tilt stage can include one or more of X theta, Y theta, and Z theta.

[0093]

[0094] The fixed block (220) may be provided in a configuration in which the circuit board (210) is coupled, or the circuit board (210) may be provided in a form in which it is secured to one side of the fixed block (220).

[0095] In one example according to the present invention, a fixing block (220) may be formed on one side of a processing target (300) and may be formed with a fixing pin (221) protruding upward. A circuit board (210) may be formed and configured to include an insertion hole (211) into which a fixing pin (221) is inserted so as to come into surface contact with the fixing block (220) of the processing target (300) to fix the processing target (300) on the circuit board. According to the present invention, the fixing pin (221) of the fixing block (220) is formed to protrude from the uppermost end of the insertion hole (211) by a predetermined length, thereby allowing the space between the fixing pin (221) and the insertion hole (211) to be filled, thereby further improving the mutual bonding force by soldering.

[0096]

[0097] A plurality of insertion holes (211) may be provided, and a fixing pin (221) may be inserted into each of the plurality of insertion holes (211). The alignment solder (S) may be inserted into the fixing pin (221) inserted into each of the insertion holes (211), and the laser may be sequentially irradiated onto each of the alignment solders (S). By sequentially irradiating the laser onto the alignment solders (S) inserted into the plurality of insertion holes (211), alignment may be performed before the alignment solder (S) melted by the laser hardens, thereby facilitating the alignment of the processing target (300), and accordingly, the alignment may be performed correctly.

[0098] According to another embodiment, the laser generating unit may be included in a plurality of pieces, and the alignment solder (S) may be inserted into the fixing pin (221) inserted into each of the insertion holes (211), and the laser may be simultaneously irradiated from the plurality of laser generating units onto each of the alignment solders (S) to perform soldering. By simultaneously irradiating the laser onto the alignment solders (S) inserted into the plurality of insertion holes (211), alignment may be performed before the alignment solder (S) melted by the laser hardens, so that the processing target (300) may be easily aligned, and accordingly, the alignment may be performed correctly.

[0099] A laser soldering device (100) according to one embodiment of the present invention can perform rework. By irradiating the laser to the alignment solder (S) that has been solidified through soldering, the processing target (300) can be properly aligned.

[0100] A laser soldering device (100) according to one embodiment of the present invention can perform rework by aligning and correcting an image sensor and an image module of a circuit board by setting offsets in the x-axis direction, y-axis direction, z-axis direction, x-axis Theta direction, y-axis Theta direction, and z-axis Theta direction according to the amount of solder shrinkage due to laser soldering obtained through a previous experiment.

[0101]

[0102] Figures 13 and 14 are flowcharts of a laser soldering method according to another embodiment of the present invention.

[0103] Specifically, referring to FIGS. 13 and 14, first, the processing target (300) can be placed in the relevant portion for processing in order to be combined with the circuit board (S10). At this time, the processing target (300) can be combined with the circuit board with the fixing block (220) formed thereon, or the circuit board can be provided in an integral form in which it is secured to the processing target. Next, the processing target (300) is placed in such a way that the fixing pins (221) of the fixing block (220) are inserted into the insertion holes (211) of the circuit board (210). At this time, the circuit board (210) has a plurality of insertion holes (211) formed radially in the circuit board (210), and a plurality of fixing pins (221) formed in the fixing block (220) can be inserted into the insertion holes (211) respectively to be stably fixed.

[0104] After this, with the insertion hole (211) and the fixing pin (221) inserted, the alignment solder (S) can be inserted into the fixing pin (221) (S30). When the alignment solder (S) is inserted into the fixing pin, the soldering position can be monitored. Here, the soldering position can be determined according to the distance between the center point of the insertion hole (211) and the alignment solder (S) inserted into the fixing pin (221) based on the center point of the fixing pin (221) inserted into the insertion hole (211) of the fixing block (210) on a plane. That is, the position where the inner surface of the insertion hole (211) of the fixing block (210) and the outer surface of the alignment solder (S) are closest to each other is preferentially set as the soldering position, and the area where at least a portion overlaps can be set as an additional soldering position.

[0105] Once the soldering position is set, soldering can be performed by melting the alignment solder (S) and soldering (S40). The soldering can be performed by irradiating the alignment solder (S) and the fixing pin (221) with laser beams of the same or different wavelengths, depending on the materials of the alignment solder (S) and the fixing pin (221).

[0106] In the soldering step (S40), a first laser irradiation step (S41) of irradiating a laser beam to the fixing pin (221) may be performed, and a second laser irradiation step (S42) of irradiating a laser beam to the alignment solder may be performed. Depending on the materials of the fixing pin (221) and the alignment solder (S), laser beams of the same or different wavelengths may be generated and irradiated.

[0107] Another embodiment of the soldering step may include a laser irradiation step of irradiating a laser beam to the fixing pin (221) and a melting step of melting the alignment solder (S) by heat transferred from the fixing pin (221) heated by the laser beam. Soldering may be performed by including a laser irradiation step of irradiating the fixing pin (221) with a laser beam and a melting step of melting the alignment solder (S) by heat transferred from the fixing pin (221) heated by the laser beam.

[0108] Here, depending on the shape and size of the fixing pin (221) and the alignment solder (S), the laser beam can be irradiated to the fixing pin (221), the alignment solder (S), or the fixing pin (221) and the alignment solder (S). In addition, the irradiated laser beam can be in one of the shapes of a circular beam, a ring-shaped beam, an inner circular beam, and an outer ring-shaped beam.

[0109]

[0110] In the laser soldering method, the amount of solder for soldering may vary depending on the height of the insertion hole (211) according to the thickness of the circuit board, the diameter of the fixing pin (221), the diameter of the alignment solder (S), the center deviation of the fixing pin (221) inserted into the insertion hole (211), and the center deviation between the alignment solder (S) inserted into the fixing pin (221) and the insertion hole (211). Soldering may be performed by adjusting the type, shape, or quantity of the alignment solder (S) inserted into the fixing pin (221) according to the above conditions.

[0111] Furthermore, a preheating process may be further included to improve wettability. The preheating process may cause solder spreadability to be reduced by a portion that is maintained at a relatively low temperature, which may lead to soldering defects such as cold soldering, cracking, and poor bonding. Here, “spreadability” refers to the degree to which the solder is distributed so that a wider area can be contacted by settling on the soldering point. Therefore, in order to prevent spreadability from being reduced due to the temperature of the alignment solder (S) portion that is maintained at a relatively low temperature compared to the solder, a preheating process may be additionally performed to preheat the area around the fixing pin (221), the alignment solder (S), or the insertion hole (211) of the circuit board.

[0112] This preheating process, as illustrated in Fig. 9, may be performed by adjusting the height of the head portion (51) to form a distance between the laser focus and the fixing pin or the alignment solder point, in addition to the method of additional laser irradiation of the laser generating portion (20). As a drawing showing a state in which preheating and heating can be performed using a laser, the head portion (51) can selectively adjust the focal distance (F; Focusing) and the non-focal distance (DF; Defocusing) from the fixing pin or the alignment solder point.

[0113] When the fixing pin (221) is positioned at the focal distance (F), the laser output is concentrated, so the fixing pin (221) may melt or be damaged by heat. Therefore, when irradiating the laser by concentrating it at the focal distance (F), the laser output can be adjusted.

[0114] In addition, when the fixing pin (221) is positioned at the non-focal distance (DF), the laser output is dispersed and the laser irradiation area increases, so that damage to the fixing pin (221) can be minimized, and by adjusting the laser irradiation area according to the non-focal distance position, only the fixing pin (221) can be heated or the fixing pin (221) and the alignment solder (S) can be heated simultaneously.

[0115] Therefore, in the case of focusing the laser on the non-focal distance (DF), the temperature difference between the fixed pin (221) and the alignment solder (S) point can be minimized to increase solder wettability and thus increase the bonding area.

[0116] The point located at the aforementioned non-focal distance (DF) may be preheated. To improve soldering quality, one or more of a fixing pin (221), an alignment solder (S), or an insertion hole (211) of a circuit board may be positioned within the area of ​​the preheated portion. Additionally, the periphery of the point to be joined, including the point to be joined, may become a preheating portion (not shown).

[0117] Additionally, a rework step may be further included to rework the solder according to the alignment status of the processing target. Rework may be performed by irradiating the solder on which soldering has been performed with a laser, depending on the alignment status of the processing target. The laser may be irradiated to reheat the solder, thereby ensuring proper alignment.

[0118] The rework step can correct the alignment of the image sensor and the image module on the circuit board by setting the offset in the x-axis direction, y-axis direction, z-axis direction, x-axis Theta direction, y-axis Theta direction, and z-axis Theta direction according to the amount of solder shrinkage due to laser soldering obtained through the experiment.

[0119]

[0120] FIGS. 10 to 12 are drawings showing the configuration of an optical fiber (610) that transmits laser according to one embodiment of the present invention.

[0121] Referring to FIGS. 10 to 12, a head portion (230) of a laser soldering device (100) according to the present invention may be a fiber laser (FL) or a diode laser transmitted through an optical fiber, and the optical fiber (610) may be composed of a core (611) through which the laser beam is transmitted and a covering (612, 613, 614, 615, 616). Specifically, the core (611) is configured to transmit a laser through total reflection, etc., and the covering (612, 613, 614, 615, 616) is configured to protect the core (611) from impact without exposing it to the outside, and may include one or more of them. For example, the plurality of covers (612, 613, 614, 615, 616) may include materials such as polyvinyl chloride for shock absorption, aramid yarn for increased durability, polyimide, silicone, etc.

[0122] In addition, the shape of the core (611) located within the above-described covering (612, 613, 614, 615, 616) can be formed in various ways. The various shapes of the core can be in various shapes such as square, polygonal, circular, etc.

[0123] Additionally, the core may be composed of a center core and a ring core. Depending on the size and shape of these cores, the size and quality of the laser may vary.

[0124]

[0125] Furthermore, the device or method according to an embodiment of the present invention may include the following configuration. The inspection described below may include a first inspection (pre-inspection) and a second inspection (post-inspection) performed by an inspection unit. In the case of the first inspection (pre-inspection), the alignment state and the soldering position are detected before soldering is performed, and in the case of the second inspection (post-inspection), the inspection may be performed to detect one or more of the following types of defects: open, short, crack and void, excessive solder, contamination with bridge, poor solder, cold solder, poor wetting, overheating, corrosion, erosion, misalignment of component positions, gaps between components, and non-soldering of the solder unit (110) after soldering is performed. As described below, an object that does not satisfy the quality standard as a result of the second inspection may be classified into an object that satisfies the quality standard, and an object that does not satisfy the quality standard may be subject to reworking (resoldering, rework).

[0126] First, the laser supplied from the laser supply device can have a wavelength with high laser absorption, depending on the solder material. It can also be a solid-state laser, such as a fiber laser or diode laser. The laser beam generated from the laser generator can be delivered to the laser soldering head via an optical fiber without the use of a separate optical mirror. This allows for a stable laser supply and precise manipulation during soldering using laser irradiation.

[0127] Second, the laser processing device may include a pick and place head or a jet head for positioning the alignment solder in the insertion hole of the circuit board. In addition, the device may include a laser soldering optical head, and the laser soldering optical head may include a beam converter, a beam control unit, a laser beam focusing optical unit, a pyrometer for measuring temperature, and a vision optical unit for recognizing the soldering position. Here, the pick and place head, the jet head, and the laser soldering optical head may be configured as a single head or as a dual head including two heads. In addition, it goes without saying that the device may be configured as a head body including three or more heads. In this way, when two or more of the above-mentioned heads are included, the productivity of the device can be increased.

[0128] Third, it may include a vision inspection module (Vision Inspection Module / unit) or a vision inspection step. By including such a vision inspection module or step, it is possible to inspect the position of the camera module to be soldered, inspect the alignment status, inspect the position to be soldered, etc. (PreInspection), and if necessary, inspect the soldering quality after soldering (PostInspection). Therefore, 1) by mounting a vision inspection module consisting of low-magnification and high-magnification lenses, or 2) by mounting a motorized variable zoom lens (Motorized Variable Zoom Lens, 1X ~ x18: the maximum magnification can be higher depending on the design of the zoom lens), it is possible to automatically inspect from low-magnification to high-magnification, from a wide area to a narrow area. Pre-Inspection and Post-Inspection can be done in one vision inspection module, but for greater productivity, they can be configured as separate vision inspection modules (e.g., one for the Pre-Inspection function and one for the Post-Inspection function).

[0129] When pre-inspection (Pre-Inpsection) and post-inspection (PostInpsection) are provided as a single vision inspection module, an object that has undergone pre-inspection (PreInpsection) can be moved to a position for soldering, soldered, and then returned to its previous position to be post-inspected (PostInpsection). When two vision inspection modules are provided, one for the pre-inspection (Pre-Inpsection) function and one for the post-inspection (PostInpsection) function, the object can be sequentially moved in the order in which the pre-inspection (Pre-Inpsection) module, the laser soldering optical head, and the post-inspection (PostInpsection) module are positioned, and inspected and soldered.

[0130] Furthermore, it may further include an infrared inspection device or a 3D inspection device for post-inspection, such as monitoring soldering quality in real time to control parameters or detecting open, short, crack and void in soldered area, over-soldering, contamination with bridge, soldering, cold soldering, poor wetting, overheating, corrosion, erosion, misalignment of component positions, gaps between components, and non-soldering.

[0131] Fourth, the method may further include a sorting device capable of sorting out objects that do not meet the soldering quality standards required after the post-inspection.

[0132] Fifth, the device may further include a repair device capable of repairing objects that do not meet the required soldering quality standards after post-inspection. Such a repair device can re-irradiate the solder with a laser to remelt the solder joint, improving solder wettability, or remove and rework the solder. When removing solder, a mechanical tool such as a pin can be used to automatically remove the solder, or a laser can be used to remelt and suction the solder for automatic removal.

[0133] Sixth, a cleaning device including a dust collector for removing dust and foreign substances for quality control after soldering may be further included. The cleaning device may further include one or more of a dry air blowing device, a carbon dioxide snow cleaning device, a plasma cleaning device, a laser cleaning device, and an inert gas blowing device.

[0134] Seventh, depending on the type of materials to be soldered, additional soldering pre-deposit sections can be included. Furthermore, a laser soldering optical head can be additionally included to maximize soldering quality and productivity.

[0135]

[0136] It should be understood that the embodiments of the present invention are not necessarily limited to the above-described embodiments, and that those skilled in the art will readily appreciate the possibility of various modifications and implementations within an equivalent scope. Therefore, the true scope of the present invention is defined by the claims set forth below.

[0137]

[0138] [Explanation of symbols]

[0139] 10: Control unit

[0140] 20: Laser generation unit

[0141] 30: Beam converter

[0142] 50: Beam control unit

[0143] 100: Laser soldering device

[0144] 210: Fixed block

[0145] 211: Insertion hole

[0146] 220: Circuit board

[0147] 221: Fixed pin

[0148] 300: Processing object

[0149] S: Solder

[0150] W: Fiber optic

Claims

1. A solder part that supplies an alignment solder that can be inserted into the fixing pins of the fixing blocks that are each inserted into a plurality of insertion holes formed on the circuit board and is inserted into the fixing pins; and A laser soldering device capable of soldering by irradiating the alignment solder and the fixing pin with lasers of the same or different wavelengths, including at least one laser generating unit capable of generating a laser of one or more wavelengths.

2. In paragraph 1, The above laser generating unit, A laser soldering device that sequentially irradiates the laser to the alignment solder inserted into the plurality of insertion holes.

3. In paragraph 1, The above laser generating unit is provided in multiple numbers, A laser soldering device that simultaneously irradiates the laser to each of the alignment solders inserted into the plurality of insertion holes.

4. In paragraph 1, The above laser generating unit, A laser soldering device that reworks the soldered alignment solder by irradiating the laser.

5. In paragraph 1, The above alignment solder, A laser soldering device comprising: a bushing solder formed in a ring shape; 6. In paragraph 1, The above alignment solder, A laser soldering device comprising a sleeve solder formed in a sleeve shape.

7. In paragraph 1, The above laser generating unit, A first generator for irradiating a laser onto the above pin; and A laser soldering device, comprising a second generator for irradiating a laser onto the above-mentioned alignment solder.

8. In paragraph 7, The above second generating unit, A laser soldering device that generates and irradiates a ring-shaped laser beam onto the above-mentioned alignment solder.

9. In paragraph 8, A laser soldering device that controls the output of a laser generated from the first generating unit and the second generating unit according to the material of the fixed pin and the alignment solder.

10. In paragraph 1, A laser soldering device in which the laser beam is transmitted via an optical fiber.

11. In paragraph 1, A laser soldering device, comprising a beam converter for controlling the shape of the laser beam.

12. In paragraph 1, Further comprising the beam control unit for controlling the irradiation position of the laser beam, The above beam control unit, A beam focusing unit for adjusting the focal position of the laser beam; and A laser soldering device, comprising: a laser irradiation unit that obtains information on a position and alignment status at which the laser is to be irradiated, adjusted from the beam focusing unit, and irradiates the laser beam onto a processing target.

13. In paragraph 1, A laser soldering device that controls the amount of solder according to at least one condition among the thickness of the circuit board, the diameter of the insertion hole, the diameter of the fixing pin, the position of the fixing pin inserted into the insertion hole, and the height of the fixing pin inserted into the insertion hole.

14. In paragraph 1, A laser soldering device that controls the output of a laser according to at least one condition among the thickness of the circuit board, the diameter of the insertion hole, the diameter of the fixing pin, the position of the fixing pin inserted into the insertion hole, and the height of the fixing pin inserted into the insertion hole.

15. In paragraph 1, A laser soldering device that controls the shape of a laser beam according to at least one condition among the thickness of the circuit board, the diameter of the insertion hole, the diameter of the fixing pin, the position of the fixing pin inserted into the insertion hole, and the height of the fixing pin inserted into the insertion hole.

16. An alignment solder that is inserted into a fixing pin inserted into an insertion hole of a circuit board, is included to surround an outer surface of the fixing pin, and is soldered by laser irradiation.

17. In paragraph 16, The above alignment solder, An align solder comprising: a bushing solder formed into a ring shape; 18. In paragraph 16, The above alignment solder, An align solder comprising a sleeve solder formed in a sleeve shape.

19. Step of placing the circuit board; A fixing step of placing a fixing pin into the insertion hole of a fixing block; An insertion step for inserting solder into the above fixed pin; and A laser soldering method comprising a soldering step of melting the above-mentioned alignment solder and soldering.

20. In paragraph 19, The above soldering step is, A laser irradiation step of irradiating a laser beam to the above fixed pin; and A laser soldering method, comprising a melting step in which the alignment solder is melted by heat transferred from the fixed pin heated by the laser beam.

21. In paragraph 19, The above soldering step is, A first laser irradiation step of irradiating a laser beam to the above fixed pin; and A laser soldering method, comprising: a second laser irradiation step of irradiating a laser beam to the alignment solder; and irradiating laser beams of the same or different wavelengths depending on the materials of the fixing pin and the alignment solder.

22. In paragraph 21, The second laser irradiation step is, A laser soldering method in which a laser beam irradiated on the above-mentioned alignment solder is irradiated in a ring shape.

23. In paragraph 19, The above alignment solder, A laser soldering method, comprising: a bushing solder formed in a ring shape; 24. In paragraph 19, The above alignment solder, A laser soldering method, comprising: a sleeve solder formed in a sleeve shape; 25. In paragraph 19, A laser soldering method, comprising: a rework step of correcting the alignment of an image sensor and an image module of a circuit board by setting offsets in the x-axis direction, the y-axis direction, the z-axis direction, the x-axis Theta direction, the y-axis Theta direction, and the z-axis Theta direction according to the shrinkage amount of the alignment solder by laser soldering;

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