Liquid cooling plate based on finned vapor chamber

Abstract

Disclosed in the present invention is a liquid cooling plate based on a finned vapor chamber. The liquid cooling plate is characterized by comprising a frame, a bottom plate connected to the lower end of the frame, and a vapor chamber connected to the upper end of the frame, wherein a plurality of fins are provided on the surface of the vapor chamber facing toward the bottom plate, a flow channel allowing a cooling liquid to flow therethrough is formed between the fins, and the frame is provided with a liquid inlet allowing the cooling liquid to flow into the flow channel and a liquid outlet allowing the cooling liquid to flow out of the flow channel. By means of the design of the finned vapor chamber, direct contact between the cooling liquid and the vapor chamber is increased, thereby significantly improving the cooling efficiency. By means of the rational design and the assembly method of the frame, the bottom plate and the vapor chamber, the assembly complexity of a system is reduced.

Description

A liquid cooling plate based on finned heat sink Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a liquid cooling plate based on a finned heat spreader. Background Art

[0002] Traditional liquid cooling plates are typically made of materials such as aluminum alloy or copper, which generally meet the heat dissipation requirements of liquid cooling systems. However, in high heat flux scenarios, the thermal conductivity of these traditional materials limits their use for effective heat dissipation. High heat flux leads to heat concentration, and the limited thermal conductivity of traditional liquid cooling plate materials makes it difficult to quickly and efficiently transfer and distribute heat, thus limiting the heat dissipation performance of the entire liquid cooling system. To address the limitations of traditional liquid cooling plate materials in high heat flux scenarios, vapor chambers have been introduced as auxiliary components. While vapor chambers are designed to improve heat distribution uniformity, they also introduce several issues: 1. Contact thermal resistance: The contact thermal resistance between the vapor chamber and the liquid cooling plate is limited, meaning the heat transfer efficiency between the vapor chamber and the liquid cooling plate is limited. This limits the effective transfer of heat from the vapor chamber to the liquid cooling plate, reducing the overall heat dissipation efficiency of the system. 2. Reduced assembly processability: The addition of a vapor chamber as an additional component increases system complexity and complicates the assembly process. This not only increases manufacturing costs but can also lead to assembly inaccuracies, compromising system stability and performance. Overall, the thermal conductivity limitations of traditional liquid cooling plate materials, the contact thermal resistance introduced by the vapor chamber, and reduced assembly processability all pose challenges to liquid cooling systems in high heat flux scenarios. Therefore, improvements are needed.

[0003] Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a liquid cooling plate based on a finned heat sink that improves cooling efficiency.

[0005] The technical solution of the present invention provides a liquid cooling plate based on a finned heat spreader, comprising a frame, a base plate connected to the lower end of the frame, and a heat spreader connected to the upper end of the frame. A plurality of fins are provided on the surface of the heat spreader facing the base plate, and a flow channel for the circulation of the cooling liquid is formed between the plurality of fins. The frame is provided with a liquid inlet for the cooling liquid to flow into the flow channel and a liquid outlet for the cooling liquid to flow out of the flow channel.

[0006] Furthermore, the plurality of fins are arranged in an array.

[0007] Furthermore, the plurality of fins are arranged in a straight line; or the plurality of fins are arranged crosswise; or the plurality of fins are arranged spirally; or the plurality of fins are arranged in a ring; or the plurality of fins are arranged in a grid.

[0008] Furthermore, the frame includes a first side wall provided with the liquid inlet and the liquid outlet and a second side wall arranged opposite thereto, and among any two adjacent fins, one end of one of the fins abuts against the first side wall, and a gap is formed between the other end and the second side wall, and one end of the other fin abuts against the second side wall, and a gap is formed between the other end and the first side wall.

[0009] Furthermore, one end of the two fins close to the liquid inlet and the liquid outlet abuts against the first side wall, and the other end forms a gap with the second side wall.

[0010] Furthermore, the height of the heat spreader is consistent with the height of the frame.

[0011] Furthermore, the fin is a solid structure; or the heat spreader is a shell structure with a cavity provided inside, and the fin is a cavity structure connected to the cavity of the heat spreader.

[0012] Furthermore, the heat spreader and the frame are connected by bolts; or the heat spreader and the frame are connected by low-temperature brazing.

[0013] Furthermore, a sealing ring is provided between the heat spreader and the frame, and a sealing groove cooperating with the sealing ring is provided on the frame. The heat spreader, the sealing ring and the sealing groove are all provided with a plurality of threaded holes for the bolt connection.

[0014] Furthermore, the frame is provided with a solder paste tank for soldering.

[0015] The above technical solution has the following beneficial effects:

[0016] The present invention increases direct contact between the coolant and the vapor chamber through the finned vapor chamber design, significantly improving cooling efficiency. The rational design and assembly of the frame, base plate and vapor chamber reduces the assembly complexity of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The disclosure of the present invention will become more easily understood with reference to the accompanying drawings. It should be understood that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of the present invention. In the drawings:

[0018] FIG1 is an exploded structural diagram of a frame and a base plate in one embodiment of the present invention;

[0019] FIG2 is a schematic structural diagram of a vapor chamber according to an embodiment of the present invention;

[0020] FIG3 is a cross-sectional view of a vapor chamber with solid fins according to an embodiment of the present invention;

[0021] FIG4 is a cross-sectional view of a vapor chamber with cavity fins according to an embodiment of the present invention;

[0022] FIG5 is a schematic structural diagram of a frame with a solder paste tank in one embodiment of the present invention;

[0023] FIG6 is a schematic diagram of an assembly of a liquid cooling plate based on a finned vapor chamber according to an embodiment of the present invention;

[0024] FIG7 is an exploded structural diagram of a liquid cooling plate based on a finned vapor chamber connected by a bolt structure in one embodiment of the present invention;

[0025] FIG8 is a schematic diagram of the flow of coolant in a liquid cooling plate based on a finned vapor chamber in one embodiment of the present invention.

[0026] Reference table of accompanying symbols:

[0027] 1. Frame; 11. Liquid inlet; 12. Liquid outlet; 13. Sealing groove; 14. Solder paste groove; 2. Base plate; 3. Heat spreader; 31. Fin; 4. Flow channel; 5. Sealing ring; 6. Bolt; 7. Threaded hole. DETAILED DESCRIPTION

[0028] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0029] It is easy to understand that according to the technical solution of the present invention, a variety of structural modes and implementation modes can be replaced with each other by those skilled in the art without changing the essential spirit of the present invention. Therefore, the following specific embodiments and drawings are only exemplary descriptions of the technical solution of the present invention and should not be regarded as the entire invention or as a limitation or restriction of the technical solution of the invention.

[0030] In this specification, directional terms such as "up," "down," "left," "right," "front," "back," "front," "back," "top," and "bottom" are defined relative to the configurations shown in the accompanying drawings. These terms are relative and may vary depending on the device's location or usage. Therefore, these and other directional terms should not be construed as restrictive. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0031] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0032] In some embodiments of the present invention, a frame 1 is included, a base plate 2 connected to the lower end of the frame 1, and a heat spreader 3 connected to the upper end of the frame 1. A plurality of fins 31 are provided on the surface of the heat spreader 3 facing the base plate 2. A flow channel 4 for the circulation of the coolant is formed between the plurality of fins 31. The frame 1 is provided with a liquid inlet 11 for the coolant to flow into the flow channel 4 and a liquid outlet 12 for the coolant to flow out of the flow channel 4.

[0033] Specifically, the frame 1 is connected to the base plate 2 at its lower end and to the vapor chamber 3 at its upper end, forming the structural foundation of the entire liquid cold plate. The base plate 2 is connected to the lower end of the frame 1, providing bottom support and structural stability for the entire liquid cold plate. The vapor chamber 3 is connected to the upper end of the frame 1, and together with the base plate 2 and frame 1, it forms the complete liquid cold plate structure.

[0034] A plurality of fins 31 are provided on the side of the surface of the heat spreader 3 facing the base plate 2. The design of the fins 31 increases the surface area, which is beneficial to the conduction and heat dissipation of heat. A flow channel 4 for the circulation of the coolant is formed between the multiple fins 31, and these flow channels 4 constitute the cooling channel inside the liquid cold plate. The liquid inlet 11 is located on the frame 1, and is used to introduce the coolant into the flow channel 4, while the liquid outlet 12 is located on the frame 1, and is used to discharge the cooled coolant. The liquid inlet 11 and the liquid outlet 12 can be processed by integral molding, or they can be connected by means of threads, welding or interference fit after being processed separately. The materials of the frame 1, the base plate 2 and the heat spreader 3 include but are not limited to copper-based, aluminum-based or stainless steel-based pure metal materials or alloy materials. The manufacturing process includes assembling the frame 1, the base plate 2 and the heat spreader 3 together in a prescribed assembly method to ensure a firm connection. The preparation of a plurality of fins 31 on the surface of the heat spreader 3 can be achieved by machining, stamping or other appropriate manufacturing processes.

[0035] Working Principle: Coolant enters flow channel 4 from liquid inlet 11, flows along fins 31, and absorbs heat from vapor chamber 3. Fins 31 improve the efficiency of coolant absorbing heat from vapor chamber 3. After flowing through flow channel 4, coolant is discharged through liquid outlet 12, completing the cooling process of vapor chamber 3. This design has the following technical effects:

[0036] 1. Improve cooling efficiency: The design of fins 31 and heat spreader 3 increases direct contact between the coolant and the heat spreader 3, significantly improving cooling efficiency.

[0037] 2. Reduce assembly complexity: The reasonable design and assembly of the frame 1, base plate 2 and heat spreader 3 reduce the assembly complexity of the system.

[0038] In some embodiments of the present invention, the plurality of fins 31 are arranged in an array.

[0039] Specifically, the array arrangement of multiple fins 31 means that the fins 31 on the heat spreader 3 are designed to be arranged in an orderly manner. This can be a matrix, grid, or other regular arrangement. Each fin 31 is arranged at a specific position relative to the other fins 31 to form an overall array structure. The array-arranged fin 31 design helps increase the effective heat dissipation area of ​​the liquid cold plate surface. When the coolant flows through these fins 31, the coolant can more effectively absorb the heat generated by the heat spreader 3. The arrangement structure of the fins 31 helps guide the coolant to flow along a prescribed path, maximize contact with the surface of the fins 31, and improve the convective heat transfer efficiency. The array arrangement of the fins 31 increases the surface area in direct contact with the coolant, thereby improving the overall heat dissipation efficiency of the liquid cold plate. More fins 31 means more heat can be transferred to the coolant, accelerating the conduction and dispersion of heat. The orderly arrangement of the fins 31 can improve the guidance of the coolant during the flow process, avoid the chaos of the coolant flow, and ensure that the coolant can effectively flow through each fin 31 and take away more heat. The array arrangement of the fins 31 helps to improve the heat distribution effect of the heat spreader 3 through a larger surface area and more efficient coolant flow, ensuring a more uniform temperature distribution over the entire surface of the heat spreader 3 .

[0040] In some embodiments of the present invention, the plurality of fins 31 are arranged in a straight line; or the plurality of fins 31 are arranged crosswise; or the plurality of fins 31 are arranged spirally; or the plurality of fins 31 are arranged annularly; or the plurality of fins 31 are arranged in a grid.

[0041] Specifically, the fins 31 are arranged along a straight line, which can be horizontal, vertical or oblique. This arrangement is simple, intuitive and easy to manufacture. The fins 31 are arranged crosswise to form a cross pattern. This arrangement can increase the contact area between the fins 31 and improve the heat transfer efficiency; the fins 31 are arranged in a spiral shape. This design can increase the spiral flow path of the coolant on the plate and improve the heat transfer effect; the fins 31 are arranged in a ring shape with a hollow part in the center. This arrangement can form an annular flow path, which helps the coolant to flow evenly; the fins 31 are arranged in a grid shape, similar to a two-dimensional matrix. This arrangement can provide a uniform distribution of fins 31 and is suitable for some situations that require highly uniform heat transfer; multiple layers of fins 31 are stacked together to form a multi-layer structure. Such a design can increase the heat transfer surface area and improve the overall heat transfer efficiency; the fins 31 are arranged in various special shapes and can be designed according to specific heat transfer requirements to optimize the heat transfer effect.

[0042] In some embodiments of the present invention, the frame 1 includes a first side wall provided with a liquid inlet 11 and a liquid outlet 12 and a second side wall arranged opposite thereto, and among any two adjacent fins 31, one end of one of the fins 31 abuts against the first side wall, and a gap is formed between the other end and the second side wall, wherein one end of the other fin 31 abuts against the second side wall, and the other end forms a gap with the first side wall.

[0043] Specifically, a staggered arrangement is achieved by having one end of one fin 31 abut against the first sidewall and a gap between the other end and the second sidewall, and another end of another fin 31 abut against the second sidewall and a gap between the other end and the first sidewall. This arrangement helps the coolant flow in an orderly manner between adjacent fins 31, rather than randomly flowing through the entire structure.

[0044] Working principle:

[0045] 1. Orderly flow path: By forming a gap between one end of adjacent fins 31 and the first side wall and the other end and the second side wall, and by forming a gap between one end of another fin 31 and the second side wall and the other end and the first side wall, the coolant can change the flow direction in an orderly manner at these inflection points, forming an orderly flow path and also a winding flow path.

[0046] 2. S-shaped splicing structure: The orderly arrangement of these inflection points and flow paths enables the flow channel 4 to form a structure composed of multiple S-shaped splicing. This S-shaped splicing design helps to reduce the velocity variation of the coolant during the flow process, reduce eddy currents and turbulence, and improve cooling efficiency.

[0047] 3. Reduce coolant resistance: Since the coolant can enter and pass through the channels between the fins 31 in an orderly manner, this design helps to reduce the coolant resistance and ensure that the coolant can flow more smoothly through the entire flow channel 4, thereby improving the cooling efficiency.

[0048] 4. More uniform heat distribution: By forming an orderly flow path, the coolant can contact and absorb heat more evenly when flowing through the surface of the fins 31, thereby achieving more uniform heat distribution and improving the heat dissipation effect of the entire liquid cold plate.

[0049] In some embodiments of the present invention, one end of the two fins 31 close to the liquid inlet 11 and the liquid outlet 12 abuts against the first side wall, and the other end forms a gap with the second side wall.

[0050] Specifically, one end of the two fins 31 near the liquid inlet 11 and the liquid outlet 12 abuts the first sidewall, while the other end forms a gap with the second sidewall. This design effectively allows the coolant to enter the channel directly into a straight flow channel 4 without any turns, thus reducing the resistance of the coolant entering the channel and allowing the coolant to enter the cooling system more quickly.

[0051] In some embodiments of the present invention, the height of the vapor chamber 3 is consistent with the height of the frame 1 .

[0052] Specifically, the height of the heat spreader 3 is consistent with the height of the frame 1. This design feature is indeed intended to ensure a tightly fitting structure between the heat spreader 3 and the base plate 2. The frame 1 is the main frame of the liquid cold plate, and the heat spreader 3 is the part installed above the frame 1, and the height of the heat spreader 3 is consistent with the height of the frame 1. This ensures that a flat and fitting structure is formed between the heat spreader 3 and the base plate 2. When the coolant flows through the heat spreader 3 through the flow channel 4, the height of the heat spreader 3 is consistent with the height of the frame 1 or the base plate 2, ensuring that the coolant can evenly contact the entire top surface of the heat spreader 3. This helps to increase the effective contact area between the coolant and the heat spreader 3, thereby promoting heat transfer and uniform distribution. Since a flat joint is formed between the heat spreader 3 and the base plate 2, the coolant can evenly contact the surface of the heat spreader 3 in the process of flowing through the heat spreader 3, achieving a more uniform heat distribution.

[0053] In some embodiments of the present invention, the fins 31 are solid structures; or the vapor chamber 3 is a shell structure with a cavity provided therein, and the fins 31 are cavity structures communicating with the cavity of the vapor chamber 3 .

[0054] Specifically, the fins 31 can be fixed to the vapor chamber 3 by welding or other methods, or they can be integrally formed with the vapor chamber 3. When the vapor chamber 3 and the fins 31 are integrally formed, the fins 31 can be made into a solid structure or a cavity structure connected to the cavity of the vapor chamber 3. Case 1: The fins 31 are a solid structure directly protruding from the vapor chamber 3, without a cavity. The coolant flows through the vapor chamber 3 through the flow channel 4 and directly contacts the surface of the fins 31 of the solid structure. The solid structure of the fins 31 helps to transfer heat more efficiently because the coolant is in direct contact with the solid fins 31, reducing the heat transfer resistance. The solid structure of the fins 31 provides a larger surface area, promoting more efficient heat transfer. This is beneficial for improving the heat dissipation performance of the liquid cooling plate. Case 2: The vapor chamber 3 is a shell with a cavity inside, and the fins 31 are a structure connected to the cavity of the vapor chamber 3. The coolant passes through the fin 31 structure connected to the internal cavity of the vapor chamber 3.

[0055] In some embodiments of the present invention, the vapor chamber 3 and the frame 1 are connected by bolts 6; or the vapor chamber 3 and the frame 1 are connected by low-temperature brazing.

[0056] Specifically, the vapor chamber 3 and the frame 1 are connected by bolts 6. This design has the following technical effects: 1. Removability: The bolt 6 connection makes the connection between the vapor chamber 3 and the frame 1 removable, facilitating maintenance, replacement, or upgrading of liquid cooling plate components. This provides convenience for future maintenance and repair. 2. Simple process: The bolt 6 connection is a relatively simple assembly process that does not require complex equipment or technology, making it easy to manufacture and assemble. This helps reduce manufacturing costs and improve production efficiency.

[0057] Optionally, the heat spreader 3 is connected to the frame 1 by low-temperature brazing. Brazing paste is a welding material that can melt and flow under low temperature conditions, and is used to fill the joints and form a seal. Low-temperature brazing is a method of using a brazing material at a relatively low temperature to melt and penetrate into the tiny gaps at the joints, thereby forming a strong connection. Brazing paste is a special welding material that melts at low temperatures and fills the tiny gaps at the joints, which not only plays a connecting role but also forms a sealing effect. Low-temperature brazing provides a stronger connection, ensuring that the heat spreader 3 is firmly and reliably connected to the frame 1. Compared with some high-temperature welding methods, low-temperature brazing and the use of brazing paste have a simpler manufacturing process and will not produce excessive thermal effects on the liquid cooling plate material.

[0058] Optionally, a solder paste groove 14 for soldering is provided on the frame 1. Specifically, the solder paste groove 14 is a groove opened on the frame 1 for accommodating solder paste.

[0059] In some embodiments of the present invention, a sealing ring 5 is provided between the heat spreader 3 and the frame 1, and a sealing groove 13 is provided on the frame 1 to cooperate with the sealing ring 5, and a plurality of threaded holes 7 for connecting bolts 6 are provided on the heat spreader 3, the sealing ring 5 and the sealing groove 13.

[0060] Specifically, a sealing groove 13 for accommodating the sealing ring 5 is provided on the frame 1. The sealing ring 5 is usually made of waterproof materials such as rubber, and the sealing groove 13 is a recessed or groove-shaped structure on the surface of the frame 1, which is used to fix and accommodate the sealing ring 5. The principle of the sealing ring 5 is to use its soft and elastic properties to form an effective sealing layer between the frame 1 and the heat sink 3. The sealing ring 5 is placed in the sealing groove 13. Due to the elasticity of the sealing ring 5, it can fill the gap in the groove to form a seal, and provides compression resistance to ensure that effective airtightness is maintained during the assembly process. The design of the sealing ring 5 and the sealing groove 13 simplifies the installation and maintenance process. During assembly, the sealing ring 5 can be placed in the sealing groove 13 relatively easily, and during maintenance, the sealing ring 5 can be replaced or repaired relatively easily. Due to the elasticity of the sealing ring 5, it can adapt to slight dimensional changes between the liquid cold plate components, improve the sealing performance, and ensure long-term sealing effect.

[0061] In addition, the threaded hole 7 can be set as a countersunk hole or a through hole. The countersunk hole means that a depression is formed at the bottom of the threaded hole 7, which is suitable for installing a bolt 6 with a countersunk head. The through hole completely passes through the entire component and is suitable for using an ordinary bolt 6. Countersunk hole structure: A depression is formed at the bottom of the threaded hole 7 to accommodate the countersunk part of the bolt 6, so that the bolt 6 can be flush with the surface of the component. Through hole structure: The threaded hole 7 completely passes through the entire component, allowing the bolt 6 to pass from one side to the other side, which is suitable for using an ordinary bolt 6. Countersunk hole principle: The design of the countersunk hole can ensure that the head of the bolt 6 is embedded in the surface of the component, making the surface of the component smoother. This helps prevent the bolt 6 from protruding from the surface, improves the overall appearance and avoids interference with other components. Through hole principle: The design of the through hole allows the bolt 6 to pass from one side to the other side, providing greater flexibility, making the connection between components more flexible. The through hole is suitable for ordinary bolts 6 and is convenient for installation and disassembly.

[0062] The present invention increases direct contact between the coolant and the vapor chamber 3 through the design of the fins 31, significantly improving the cooling efficiency. The rational design and assembly of the frame 1, base plate 2 and vapor chamber 3 reduces the assembly complexity of the system.

[0063] The above are only the principles and preferred embodiments of the present invention. It should be noted that, for those skilled in the art, several other variations can be made based on the principles of the present invention, which should also be considered as the scope of protection of the present invention.

Claims

1. A liquid cooling plate based on a finned vapor chamber, characterized in that, It includes a frame body, a bottom plate connected to the lower end of the frame body, and a heat sink connected to the upper end of the frame body. A plurality of fins are provided on the surface of the heat sink facing the bottom plate, and a flow channel for the coolant to flow through is formed between the plurality of fins. The frame body is provided with a liquid inlet for the coolant to flow into the flow channel and a liquid outlet for the coolant to flow out of the flow channel.

2. The liquid cooling plate based on the phase change heat transfer device according to claim 1, wherein The plurality of fins are arranged in an array.

3. The liquid cooling plate based on the phase change heat transfer device according to claim 2, wherein, The plurality of fins are arranged in a straight line; or the plurality of fins are arranged in a cross pattern; or the plurality of fins are arranged in a spiral pattern; or the plurality of fins are arranged in a circular pattern; or the plurality of fins are arranged in a grid pattern.

4. The liquid cooling plate based on the phase change heat transfer device according to claim 1, wherein The frame body includes a first side wall provided with the liquid inlet and the liquid outlet and a second side wall oppositely arranged thereto. Among any two adjacent fins, one end of one fin abuts against the first side wall, and a gap is formed between the other end and the second side wall. One end of the other fin abuts against the second side wall, and a gap is formed between the other end and the first side wall.

5. The liquid cooling plate based on the phase change heat transfer device according to claim 1, wherein One ends of the two fins close to the liquid inlet and the liquid outlet both abut against the first side wall, and gaps are both formed between the other ends and the second side wall.

6. The liquid cooling plate based on the phase change heat transfer device according to claim 1, wherein The height of the heat sink is the same as the height of the frame body.

7. The liquid cooling plate based on the phase change heat transfer device according to claim 1, characterized in that, The fin is a solid structure; or the heat sink is a shell structure with a cavity inside, and the fin is a cavity structure communicated with the cavity of the heat sink.

8. The liquid cooling plate based on the phase change heat transfer device according to claim 1, characterized in that, The heat sink is connected to the frame body by bolts; or the heat sink is connected to the frame body by low-temperature soldering.

9. The liquid cooling plate based on the phase change heat transfer device according to claim 8, wherein A sealing ring is provided between the heat sink and the frame body, and a sealing groove matched with the sealing ring is provided on the frame body. A plurality of threaded holes for connecting the bolts are provided on the heat sink, the sealing ring, and the sealing groove.

10. The liquid cooling plate based on the phase change heat transfer device according to claim 8, wherein, The frame body is provided with a solder paste groove for soldering.

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