Electronic device comprising ground structure of conductive layer

Abstract

This electronic device may comprise: a bracket; printed circuit board; integrated circuitry (IC) electrically connected to at least another component of the electronic device through the printed circuit board; a shield member which is disposed on the IC and the printed circuit board, and which includes a conductive layer for shielding the IC from electromagnetic interference (EMI); a first conductive gasket, which is disposed between the conductive layer and the printed circuit board, is in contact with a part of the conductive layer and electrically connects the conductive layer to a ground of the printed circuit board; and a second conductive gasket which is disposed between the conductive layer and the bracket, and which is at least partially disposed on the part of the conductive layer in contact with the first conductive gasket.

Description

Electronic device comprising a ground structure of a conductive layer

[0001] The descriptions below relate to electronic devices including electronic devices that include a ground structure of a conductive layer.

[0002] An electronic device may include a display driving integrated circuit (DDIC) for driving a display and a plurality of pixels included in the display. The electronic device may also include a conductive layer covering the DDIC to prevent noise generated by the DDIC from being transmitted to other components of the electronic device, such as an antenna radiator.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] In one embodiment, an electronic device may include: a bracket; a printed circuit board; an integrated circuit (IC) electrically connected to at least another component of the electronic device via the printed circuit board; a shielding member disposed on the IC and the printed circuit board, the shielding member including a conductive layer configured to shield electromagnetic interference (EMI) with the IC; a first conductive gasket disposed between the conductive layer and the printed circuit board, the first conductive gasket being in contact with a portion of the conductive layer, the first conductive gasket electrically connecting the conductive layer to a ground of the printed circuit board; and a second conductive gasket disposed between the conductive layer and the bracket, the second conductive gasket being at least partially disposed on the portion of the conductive layer that is in contact with the first conductive gasket.

[0005] An electronic device according to one embodiment may include a bracket, a display, a shielding member, a first conductive gasket, and a second conductive gasket. The display may include a display panel, a display driving integrated circuitry (DDIC), and a flexible printed circuit board. The display panel may include a flexible substrate including a portion below the bracket. The DDIC may be mounted on the portion of the flexible substrate, positioned between the bracket and the portion of the flexible substrate, and electrically connected to the display panel. The flexible printed circuit board may be disposed between the flexible substrate and the bracket, and coupled to the portion of the flexible substrate. The shielding member may be disposed on the DDIC and the flexible printed circuit board, and spaced apart from the bracket. The shielding member may include a conductive layer configured to shield electromagnetic interference (EMI) with the DDIC. The first conductive gasket may be disposed between the flexible printed circuit board and the conductive layer, in contact with a portion of the conductive layer, and electrically connect the conductive layer to a ground of the flexible printed circuit board. The second conductive gasket may be disposed between the conductive layer and the bracket, and at least partially disposed on the portion of the conductive layer that is in contact with the first conductive gasket. In one embodiment, an electronic device may include a bracket, a printed circuit board, an integrated circuit (IC), a shielding member, a first conductive gasket, and a second conductive gasket. The IC may be electrically connected to at least another component of the electronic device via the printed circuit board.The shielding member may include a conductive layer disposed on the IC and the printed circuit board and configured to shield electromagnetic interference (EMI) with the IC. The first conductive gasket may be disposed between the conductive layer and the printed circuit board, may be in contact with a portion of the conductive layer, and may electrically connect the conductive layer to a ground of the printed circuit board. The second conductive gasket may be disposed between the conductive layer and the bracket, and may be at least partially disposed on the portion of the conductive layer that is in contact with the first conductive gasket.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2A is a diagram illustrating an exemplary electronic device according to one embodiment.

[0008] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0009] FIG. 3 is an exemplary cross-sectional view of an electronic device according to one embodiment.

[0010] FIG. 4 is an exemplary cross-sectional view of an electronic device according to one embodiment.

[0011] FIG. 5 is an exemplary cross-sectional view of an electronic device according to one embodiment.

[0012] FIG. 6 is an exemplary cross-sectional view of an electronic device according to one embodiment.

[0013] FIG. 7 is an exemplary cross-sectional view of an electronic device according to one embodiment.

[0014] FIG. 8 is an exemplary cross-sectional view of an electronic device according to one embodiment.

[0015] FIG. 9 is an exemplary diagram for explaining the flow of a noise signal of an electronic device according to one embodiment.

[0016] FIG. 10 is an exemplary drawing showing an electronic device according to one embodiment.

[0017] FIG. 11 is an exemplary drawing showing an electronic device according to one embodiment.

[0018] FIG. 12 is an exemplary drawing showing an electronic device according to one embodiment.

[0019] FIG. 13 is an exemplary drawing showing an electronic device according to one embodiment.

[0020] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0021] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0022] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0023] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0024] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0025] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0026] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0027] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0028] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0029] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0030] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0031] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0032] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0033] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0034] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0035] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0036] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0037] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0038] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0039] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0040] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0041] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0042] FIG. 2A is a diagram illustrating an exemplary electronic device according to an embodiment. Referring to FIG. 2A, an electronic device (200) according to an embodiment may include a housing (210) forming an exterior of the electronic device (200). For example, the housing (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side surface) (200C) surrounding a space between the first side (200A) and the second side (200B). In an embodiment, the housing (210) may also refer to a structure forming at least a portion of the first side (200A), the second side (200B), and / or the third side (200C).

[0043] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). In one embodiment, the front plate (202) may form at least a portion of the first surface (200A). In one embodiment, the front plate (202) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0044] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). In one embodiment, the back plate (211) may form at least a portion of the second surface (200B). In one embodiment, the back plate (211) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0045] An electronic device (200) according to one embodiment may include a side bezel structure (e.g., a side member or bracket) (218). In one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a third side (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire third side (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the third side (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0046] Unlike the illustrated embodiment, when the third side (200C) of the electronic device (200) is partially formed by the front plate (202) and / or the rear plate (211), the front plate (202) and / or the rear plate (211) may include a portion extending from its edge and curved toward the rear plate (211) and / or the front plate (202). The extending portion of the front plate (202) and / or the rear plate (211) may be positioned at both ends of a long edge of the electronic device (200), for example, but is not limited to the above-described example.

[0047] In one embodiment, the side bezel structure (218) may include a metal and / or a polymer. In one embodiment, the back plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (211) and the side bezel structure (218) may be formed as separate components and / or may include different materials.

[0048] In one embodiment, the electronic device (200) may include a display (201) (e.g., the display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., the camera module (180) of FIG. 1), a key input device (217) (e.g., the input module (150) of FIG. 1), a light-emitting element (not shown), and a connector hole (208). In one embodiment, the electronic device (200) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element (not shown)), or may additionally include other components.

[0049] In one embodiment, the display (201) may be visually exposed through a substantial portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the first side (200A). The display (201) may be disposed on the back surface of the front plate (202).

[0050] In one embodiment, in order to expand the area to which the display (201) is visually exposed, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the front plate (202) adjacent to the display (201). In one embodiment, the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially the same.

[0051] In one embodiment, the display (201) (or the first surface (200A) of the electronic device (200)) may include a screen display area (201A). In one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. For example, when the first surface (200A) is viewed from the front, at least a portion of an edge of the screen display area (201A) may substantially coincide with an edge of the first surface (200A) (or the front plate (202)).

[0052] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire a user's biometric information. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may refer to an area that, like other areas of the screen display area (201A), can display visual information by the display (201) and additionally acquire the user's biometric information (e.g., a fingerprint). Although the sensing area (201B) is illustrated as being formed within the screen display area (201A), it is not limited thereto. For example, the sensing area (201B) may also be formed in the key input device (217).

[0053] In one embodiment, the display (201) may include an area where a first camera module (205) is positioned. For example, an opening may be formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera module (205) may acquire an image corresponding to a direction facing the first surface (200A) through the area of ​​the display (201).

[0054] In one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0055] In one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0056] In one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the third surface (200C) and a second microphone hole (204) formed in a portion of the second surface (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones to detect the direction of the sound, but is not limited thereto.

[0057] In one embodiment, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to a camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0058] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (200). In one embodiment, the external speaker hole (207) may be integrated into the microphone hole (203), and the speaker hole (207) and the microphone hole (203) may be implemented as a single hole. Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the city of FIG. 2A, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (200), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (200). However, this is not limited thereto, and in other embodiments, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by a spaced space between the front plate (202) (or, display (201)) and the side bezel structure (218).

[0059] In one embodiment, the electronic device (200) may include at least one speaker (not shown) (e.g., an audio output module (155) of FIG. 1) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a call receiver hole (not shown).

[0060] In one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0061] In one embodiment, the camera modules (205, 212, 213) may include a first camera module (205) arranged to face a first side (200A) of the electronic device (200), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0062] In one embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include one camera.

[0063] In one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0064] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (200).

[0065] In one embodiment, the key input device (217) may be arranged on the third side (200C) of the electronic device (200). In one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0066] In one embodiment, a connector hole (208) may be formed on the third side (200C) of the electronic device (200) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0067] In one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0068] FIG. 2B is an exploded perspective view of an exemplary electronic device according to an embodiment. Referring to FIG. 2B, an electronic device (200) according to an embodiment may include a frame structure (240) (e.g., the side bezel structure (218) of FIG. 2A), a first printed circuit board (250), a second printed circuit board (252), a cover plate (260), and a battery (270) (e.g., the battery (189) of FIG. 1).

[0069] In one embodiment, the frame structure (240) may be positioned between the display (201) and the back plate (211). In one embodiment, the frame structure (240) may support or accommodate components included in the electronic device (200). For example, the display (201) may be disposed on one side of the frame structure (240) facing one direction (e.g., +Z direction). A first printed circuit board (250), a second printed circuit board (252), a battery (270), and a second camera module (212) may be disposed on the other side of the frame structure (240) facing the opposite direction (e.g., -Z direction). The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera module (212) may be disposed within recesses formed in the frame structure (240).

[0070] In one embodiment, the frame structure (240) may include a first part (241) and a second part (243) surrounding the first part (241). The first part (241) may be positioned below the display (201) (e.g., in the -Z direction) to support the display (201). Alternatively, the first part (241) may support the display (201) together with the second part (243). The second part (243) may surround a space between the back plate (211) and the front plate (202) (and / or the display (201)). The second part (243) surrounding the space may form a side surface of the electronic device (200) (e.g., the third surface (200C) of FIG. 2A), and the first part (241) positioned within the space may extend inwardly from the second part (243). The side surface may extend from the front surface of the electronic device (200) (e.g., the first surface (200A) of FIG. 2A) or the perimeter of the front plate (202). In one embodiment, the first part (241) and the second part (243) may be formed of a metal and / or a polymer. For example, the first part (241) and the second part (243) may include a conductive part formed of a conductive material such as the metal and / or a non-conductive part formed of the polymer. The surface of the conductive part may include a first region in which an oxide layer (or oxide film) of the conductive material is formed to prevent corrosion, and a second region in which the conductive material is open (or exposed) (e.g., by removing the oxide film). The conductive gasket described below (e.g., conductive gaskets (410, 710, 810, or 1310)) can be electrically connected to the second region of the conductive part. In one embodiment, the conductive portion of the second part (243) can be used as an antenna radiator for transmitting and receiving wireless signals.

[0071] In one embodiment, the frame structure (240) or the first part (241) of the frame structure (240) may be referred to as a support member. The frame structure (240) may be referred to as a bracket or a support bracket (e.g., the support bracket (340) of FIG. 3). The first part (241) of the frame structure (240) may be referred to as a support or a support portion of the frame structure (240). The second part (243) of the frame structure (240) may be referred to as a sidewall or a sidewall portion of the frame structure (240).

[0072] In one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly disposed to the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly disposed to the frame structure (240) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0073] In one embodiment, the display (201) may be positioned between a frame structure (240) and a front plate (202). For example, the front plate (202) may be positioned on one side (e.g., in the +Z direction) of the display (201), and the frame structure (240) may be positioned on the other side (e.g., in the -Z direction).

[0074] In one embodiment, the front plate (202) can be coupled with the display (201). For example, the display (201) can be attached to the back surface of the front plate (202) via an optically clear adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)).

[0075] In one embodiment, the front plate (202) may be coupled to a frame structure (240). For example, the front plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction. The frame structure (240) (e.g., the second part (243)) may be attached to the outer portion, but is not limited thereto.

[0076] In one embodiment, a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (250) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0077] In one embodiment, the cover plate (260) may be disposed between the first printed circuit board (250) and the back plate (211). In one embodiment, the cover plate (260) may be disposed on the first printed circuit board (250). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (250) facing the -Z direction.

[0078] In one embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (250) with respect to the z-axis. In one embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (250). In this way, the cover plate (260) may protect the first printed circuit board (250) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (250).

[0079] In one embodiment, the cover plate (260) may be fixedly positioned on the first printed circuit board (250) via a joining member (e.g., a screw), or may be joined to the frame structure (240) together with the first printed circuit board (250) via the joining member.

[0080] In one embodiment, the cover plate (260) may include a conductive portion. Additionally, the cover plate (260) may include a non-conductive portion. The conductive portion of the cover plate (260) may be formed of a conductive metal, such as stainless steel, and the non-conductive portion may be formed of a non-conductive material, such as plastic.

[0081] In one embodiment, the battery (270) may power at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell.

[0082] In one embodiment, a first camera module (205) (e.g., a front camera) may be disposed in at least a portion of a frame structure (240) (e.g., a first part (241)) such that the lens can receive external light through a portion of the front plate (202) (e.g., the camera area (237)) (e.g., the front (200A) of FIG. 2A).

[0083] In one embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the frame structure (240) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (250) via a connecting member (e.g., a connector). In one embodiment, the second camera module (212) may be disposed such that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0084] In one embodiment, the camera area (284) may be formed on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 2A). In one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). In one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (284) may form a substantially same plane as the surface of the rear plate (211).

[0085] In one embodiment, the housing (210) of the electronic device (200) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (200). In this respect, at least a portion of the front plate (202), the frame structure (240), and / or the rear plate (211) that form the exterior of the electronic device (200) may be referred to as the housing (210) of the electronic device (200).

[0086] In one embodiment, the electronic device (200) (or display (201)) may include a flexible printed circuit board (230). The flexible printed circuit board (230) may extend from a panel (or a substrate of the panel) of the display (201). For example, the flexible printed circuit board (230) may be bent and extended from the panel of the display (201) so as to be covered by the display (201). The flexible printed circuit board (230) may electrically connect a printed circuit board (e.g., a first printed circuit board (250) or a second printed circuit board (252)) of the display (201) and the electronic device (200). For example, the flexible printed circuit board (230) may be connected to the first printed circuit board (250) through another flexible printed circuit board that extends from the first printed circuit board (250) through the opening (245) to the flexible printed circuit board (230). It can be connected to the substrate (250). For another example, the flexible printed circuit board (230) can face the second printed circuit board (252) through an opening (245) formed in the second part (243) of the frame structure (240). The connector of the flexible printed circuit board (230) and the corresponding connector of the second printed circuit board (252) can be connected through the opening (245). Signals for driving the display (201) can be transmitted through the flexible printed circuit board (230).

[0087] An electronic device (200) according to one embodiment may include an antenna module (not shown). In one embodiment, the antenna module may be disposed between the rear plate (211) and the cover plate (260). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0088] In this disclosure, descriptions of components having the same reference numerals may be applied in the same or corresponding manner, even when referring to different drawings, unless otherwise specified. Furthermore, overlapping descriptions of components having the same reference numerals may be omitted.

[0089] In this disclosure, "overlapping" means that at least a portion of a component is positioned within the boundary of another component when projected from a particular point of view, and unless otherwise specified, it is not construed that they are physically in contact or spaced apart.

[0090] FIG. 3 is an exemplary cross-sectional view of an electronic device according to one embodiment.

[0091] The electronic device (300) of FIG. 3 may be an example of the electronic device (101) of FIG. 1 or the electronic device (200) of FIGS. 2A and 2B. Referring to FIG. 3, the electronic device (300) according to one embodiment may include a window (302), a display (360), a display driving circuit (368), a flexible printed circuit board (330), and a support bracket (340). The window (302) may be an example of the front plate (202) of FIGS. 2A and 2B. The display (360) may be an example of the display module (160) of FIG. 1 or the display (201) of FIGS. 2A and 2B. The flexible printed circuit board (330) may be an example of the flexible printed circuit board (230) of FIG. 2B. The support bracket (340) may be an example of the side bezel structure (218) of FIG. 2a or the frame structure (240) of FIG. 2b.

[0092] In one embodiment, the window (302) can be positioned below the display (360) (e.g., in the +Z direction). The window (302) can be positioned on the front surface of the display (360). For example, the window (302) can be attached to the front surface of the display (360). For example, the window (302) can be attached to the display (360) through an optical adhesive such as an optically clear adhesive (OCA) or an optically clear resin (OCR). In one embodiment, the window (302) can protect the display (360) from external impact and transmit light output from the display (360) to the outside.

[0093] In one embodiment, the display (360) may include a display panel (362) and a conductive sheet (364). In one embodiment, the display panel (362) may be configured to emit light. For example, the display panel (362) may include a liquid crystal display panel or an organic light emitting diode panel. In one embodiment, the display panel (362) may be disposed between the window (302) and the conductive sheet (364). A flexible printed circuit board (330) may be connected to the display panel (362). For example, the flexible printed circuit board (330) may be connected to a base substrate of the display panel (362) (e.g., substrate (1270) of FIG. 12). The base substrate of the display panel (362) may be formed of, but is not limited to, a plastic such as polyimide or glass. In one embodiment, the conductive sheet (364) may be disposed on the back surface (e.g., in the -Z direction) of the display panel (362). The conductive sheet (364) may include an electrically conductive material. For example, the conductive sheet (364) may include a conductive metal. For example, the conductive sheet (364) may include, but is not limited to, copper, iron, nickel, or stainless steel, alloys thereof, or combinations thereof. The conductive sheet (364) may shield electromagnetic waves that may be emitted from or introduced into the display (360). The conductive sheet (364) may be referred to as a metal plate (if formed of metal), a conductive plate, or a conductive layer.

[0094] Although not shown, the display (360) may include a support layer (or cover layer) disposed between the display panel (362) and the conductive sheet (364). The support layer may include, for example, a cushion layer including an elastic porous structure (e.g., foam) to absorb shocks that may be applied to the display panel (362).

[0095] Although not shown, the electronic device (300) may include a touch panel disposed on or integrated into the display panel (362) to detect touch input from the outside (e.g., through a window (302)).

[0096] In one embodiment, the flexible printed circuit board (330) can be connected to a display panel (362) of the display (360). The flexible printed circuit board (330) can be electrically connected to the display panel (362) of the display (360). In one embodiment, the flexible printed circuit board (330) can include a first portion (332), a second portion (334) extending from the first portion (332), and a third portion (336) extending from the second portion (334) to the display panel (362). The first portion (332) can be formed to be at least partially rigid. The second portion (334) and the third portion (336) can be formed to be substantially flexible. In this respect, the first portion (332) may be referred to as a rigid portion of the flexible printed circuit board (330), and the second portion (334) and / or the third portion (336) may be referred to as a flexible portion of the flexible printed circuit board (330).

[0097] In one embodiment, the third portion (336) can be bent or folded. For example, the third portion (336) can be bent or folded to connect the display panel (362) and the second portion (334) positioned over the display panel (362). For example, by bending or folding the third portion (336), the flexible printed circuit board (330) can be overlapped with the conductive sheet (364). In one embodiment, the flexible printed circuit board (330) can at least partially include the base substrate of the display panel (362) (e.g., the second portion (1272) and the third portion (1273) of the substrate (1270) of FIG. 12). In one embodiment, the second portion (334) and the third portion (336) of the flexible printed circuit board (330) may be replaced, at least partially, with the base substrate of the display panel (362) (e.g., the second portion (1272) and the third portion (1273) of the substrate (1270) of FIG. 12). This will be described later with reference to FIG. 12.

[0098] In one embodiment, the flexible printed circuit board (330) may be disposed between the display (360) (or the conductive sheet (364)) and the support bracket (340), and may include a section spaced apart from the support bracket (340). For example, the first portion (332) and the second portion (334) of the flexible printed circuit board (330) may be disposed between the conductive sheet (364) and the support bracket (340). The first portion (332) and the second portion (334) may be spaced apart from the support bracket (340).

[0099] In one embodiment, the display driver circuit (368) may be disposed or mounted on the flexible printed circuit board (330). For example, the display driver circuit (368) may be disposed on the second portion (334) of the flexible printed circuit board (330) (e.g., in the -Z direction) so as to face the support bracket (340). The display driver circuit (368) may generate a signal for driving the display panel (362) (e.g., a voltage signal for controlling activation of pixels of the display panel (362)) based on a signal transmitted from a processor of the electronic device (300) (e.g., the processor (120) of FIG. 1). In one embodiment, the display driver circuit (368) may be referred to as a display driver chip (or package).

[0100] In one embodiment, the display (360) may be understood to include, or may be referred to as a display assembly including, at least one of a window (302), a display panel (362), a conductive sheet (364), a display drive circuit (368), and / or a flexible printed circuit board (330).

[0101] In one embodiment, the support bracket (340) can be positioned on the display (360) (e.g., in the -Z direction). In one embodiment, the support bracket (340) can support the display (360). Although the support bracket (340) and the display (360) are shown as being spaced apart in FIG. 3 , the support bracket (340) can physically support the display (360) directly (e.g., through another portion of the support bracket (340) that is not shown) or indirectly (e.g., through another member distinct from the support bracket (340). For example, the support bracket (340) can indirectly support the display (360) by directly supporting the window (302) to which the display (360) is attached. In one embodiment, the support bracket (340) can include a conductive portion formed of a conductive metal such as aluminum, magnesium, or titanium.

[0102] In order to transmit various signals to the display (360), numerous wires may be formed on the flexible printed circuit board (330). Accordingly, noise (e.g., electromagnetic interference (EMI)) may be generated from the flexible printed circuit board (330), particularly from the display driving circuit (368) mounted on the flexible printed circuit board (330). The generated noise may have a negative impact on the peripheral configuration of the flexible printed circuit board (330). For example, noise generated from the flexible printed circuit board (330) may affect the performance of an antenna that utilizes the conductive portion of the support bracket (340) (e.g., the second part (243) of FIG. 2B). With reference to the drawings below, examples of electronic devices (300) for effectively shielding such noise will be described.

[0103] FIG. 4 is an exemplary cross-sectional view of an electronic device according to one embodiment.

[0104] Referring to FIG. 4, a flexible printed circuit board (330) of an electronic device (300) may be placed between a display (360) and a support bracket (340). For example, the flexible printed circuit board (330) may be placed between the support bracket (340) and the display (360) so as to be spaced apart from the support bracket (340).

[0105] In one embodiment, the flexible printed circuit board (330) may include a front surface (e.g., a surface facing the +Z direction) and a back surface opposite the front surface (e.g., a surface facing the -Z direction). The front surface and the back surface of the first portion (332) may include conductive regions formed of a conductive material, such as copper or gold, and non-conductive regions formed of a non-conductive material, such as solder resist, to allow electrical contact to the flexible printed circuit board (330).

[0106] An electronic device (300) (or the display assembly) according to one embodiment may include a shielding layer (or shielding member) (480). The shielding layer (480) may be spaced apart from the support bracket (340). For example, a gap (g) may be formed between the shielding layer (480) and the support bracket (340). The gap (g) may reduce or prevent damage to the flexible printed circuit board (330) and the display (360) due to external impact, such as pressing. In one embodiment, the shielding layer (480) may include a conductive layer (485). The conductive layer (485) may be formed of, for example, an electrically conductive material. For example, the conductive layer (485) may be formed of, but is not limited to, a metal such as copper, a conductive fabric, or a combination thereof. The conductive layer (485) may be referred to as a shielding sheet or shielding layer.

[0107] In one embodiment, a shielding layer (480) (or conductive layer (485)) may be disposed on the flexible printed circuit board (330) to cover the display driving circuit (368). For example, the shielding layer (480) may be disposed on the rear surface of the flexible printed circuit board (330) to cover the display driving circuit (368). For example, the shielding layer (480) may be attached to the rear surface of the flexible printed circuit board (330) via an adhesive material such as a pressure-sensitive adhesive. The shielding layer (480) may shield noise that may be generated from or introduced into the display driving circuit (368). For example, the shielding layer (480) may reduce or block radio frequency mixing noise that may be generated by the operation of the display (360). For example, the shielding layer (480) can reduce or block noise generated by the operation of the display (360) from being re-radiated to the antenna of the electronic device (300) (e.g., the antenna using the second part (243) of FIG. 2b).

[0108] In one embodiment, the shielding layer (480) may further include a first non-conductive layer (481) and / or a second non-conductive layer (482). The conductive layer (485) may be disposed between the first non-conductive layer (481) and the second non-conductive layer (482). For example, the first non-conductive layer (481) may be disposed on the front surface (e.g., the side facing the +Z direction) of the conductive layer (485), and the second non-conductive layer (482) may be disposed on the back surface (e.g., the side facing the -Z direction) of the conductive layer (485). In one embodiment, each of the first non-conductive layer (481) and the second non-conductive layer (482) may be attached to the conductive layer (485) via an adhesive material (or a member), such as a pressure-sensitive adhesive or a conductive pressure-sensitive adhesive. The first non-conductive layer (481) and the second non-conductive layer (482) may be formed of an electrically non-conductive material. For example, the first non-conductive layer (481) and the second non-conductive layer (482) may be formed of a resin such as polyethylene terephthalate (PET), but are not limited thereto. The first non-conductive layer (481) and the second non-conductive layer (482) may be referred to as a first insulating layer and a second insulating layer, respectively.

[0109] In one embodiment, the electronic device (300) (or flexible printed circuit board (330)) may include a first shielding tape (442) and a second shielding tape (443). The first shielding tape (442) may be attached on the front surface of the first portion (332) of the flexible printed circuit board (330). The first shielding tape (442) may at least partially cover the front surface of the first portion (332) of the flexible printed circuit board (330). In one embodiment, the first shielding tape (442) may be disposed on a conductive sheet (364). The first shielding tape (442) may be attached to the conductive sheet (364) using a conductive adhesive or an insulating adhesive. Optionally, the first shielding tape (442) may be further formed on the front surface of the second portion (334) of the flexible printed circuit board (330). In one embodiment, a second shielding tape (443) may be attached on the back surface of the first portion (332) of the flexible printed circuit board (330). The second shielding tape (443) may at least partially cover the back surface of the first portion (332) of the flexible printed circuit board (330). A portion of the shielding layer (480) may be disposed (e.g., attached) on the second shielding tape (443). The first shielding tape (442) and the second shielding tape (443) may each be referred to as an electromagnetic interference (EMI) shielding sheet. Although not shown, the electronic device (300) may include a conductive tape disposed between the second shielding tape (443) and the flexible printed circuit board (330) to electrically connect the second shielding tape (443) to the flexible printed circuit board (330).

[0110] An electronic device (300) according to one embodiment may include a first conductive gasket (410). In one embodiment, the first conductive gasket (410) may be disposed between a support bracket (340) and a shielding layer (480). For example, the first conductive gasket (410) may be disposed (or interposed) between the conductive portion of the support bracket (340) and the conductive layer (485) of the shielding layer (480). For example, the first conductive gasket (410) may extend from the conductive portion of the support bracket (340) to the conductive layer (485) of the shielding layer (480).

[0111] In one embodiment, the first conductive gasket (410) can electrically connect the shielding layer (480) (or the conductive layer (485)) and the support bracket (340). For example, the first conductive gasket (410) can be in direct or indirect contact (e.g., via another component not shown) with the conductive portion of the support bracket (340) and / or the conductive layer (485) of the shielding layer (480). For example, the first conductive gasket (410) can be welded to the conductive portion of the support bracket (340). Additionally or alternatively, a metal sheet can be disposed (or interposed) between the first conductive gasket (410) and the support bracket (340). The metal sheet can include a weldable metal or metal alloy. The metal sheet may be provided for welding the first conductive gasket (410) and the support bracket (340), but is not limited thereto. For example, the metal sheet may be attached to the first conductive gasket (410) and / or the support bracket (340) via a conductive adhesive. In another example, the first conductive gasket (410) may be attached to the support bracket (340) via a conductive adhesive. For example, the first conductive gasket (410) may form surface contact or point contact with the conductive layer (485). In another example, the first conductive gasket (410) may be attached to the conductive layer (485) via a conductive adhesive.

[0112] In one embodiment, an opening (487) may be formed in the second non-conductive layer (482) to allow the first conductive gasket (410) to contact the conductive layer (485). The opening (487) may be a hole penetrating the second non-conductive layer (482). Alternatively, the opening (487) may be formed by notching or chamfering an edge of the second non-conductive layer (482), or may be a slot formed thereby.

[0113] In one embodiment, the first conductive gasket (410) may be formed with a thickness greater than the gap (g). For example, the length of the first conductive gasket (410) in a direction perpendicular to the display (360) (e.g., the Z-axis direction) may be greater than the length of the gap.

[0114] In one embodiment, the first conductive gasket (410) may include an electrically conductive material to provide an electrical path. Additionally, the first conductive gasket (410) may be configured to have elasticity. For example, the first conductive gasket (410) may include an elastic material (e.g., foam) and a conductive material (e.g., conductive fabric) surrounding the elastic material. For example, the first conductive gasket (410) may include a UFN (urethane fabric nickel) gasket. For example, the first conductive gasket (410) may include a conductive foam, a conductive fabric, a conductive tape, or a step compensation tape. For example, the first conductive gasket (410) may include a foam or conductive foam surrounded or coated with a conductive material, such as a conductive fabric-over-foam gasket. In one embodiment, the first conductive gasket (410) may be referred to as an electrical connecting member, a conductive resilient member, a conductive interface, or an electrical interface.

[0115] In one embodiment, the shielding performance of the shielding layer (480) may be improved by electrically connecting the shielding layer (480) to the support bracket (340) by the first conductive gasket (410). This may be because the support bracket (340) acts as a ground for noise induced in the shielding layer (480). Accordingly, performance degradation of peripheral components, such as an antenna using the support bracket (340), due to noise may be reduced. In addition, since the first conductive gasket (410) is positioned between the support bracket (340) and the display (360) to provide elasticity, the reliability of the electrical connection between the shielding layer (480) and the support bracket (340) may be improved. Accordingly, performance deviation of peripheral components, such as an antenna using the support bracket (340), due to performance deviation of the shielding layer (480) may be reduced. In addition, the first conductive gasket (410) is disposed on the first portion (332) of the relatively rigid flexible printed circuit board (330) to provide elasticity between the display (360) and the support bracket (340), thereby reducing or preventing the back surface (e.g., the surface facing the -Z direction) of the display (360) from being pressed or cracked by external impact.

[0116] In one embodiment, the electrical connection structure between the conductive layer (485), the first conductive gasket (410), and the support bracket (340), as described with reference to FIG. 4, may be referred to as the first ground connection structure of the electronic device (300).

[0117] FIG. 5 is an exemplary cross-sectional view of an electronic device according to one embodiment.

[0118] Referring to FIG. 5, an electronic device (300) according to one embodiment may include a second conductive gasket (420). In one embodiment, the second conductive gasket (420) may be disposed between a shielding layer (480) and a flexible printed circuit board (330). For example, the second conductive gasket (420) may be disposed (or interposed) between a conductive layer (485) of the shielding layer (480) and a first portion (332) of the flexible printed circuit board (330).

[0119] In one embodiment, the second conductive gasket (420) can electrically connect the shielding layer (480) and the flexible printed circuit board (330). For example, the second conductive gasket (420) can directly or indirectly (e.g., through another component not shown) contact the conductive layer (485) of the shielding layer (480) and / or the conductive region formed on the rear surface of the first portion (332) of the flexible printed circuit board (330). For example, the second conductive gasket (420) can be soldered to the conductive region of the flexible printed circuit board (330) (e.g., surface mount technology (SMT)). As another example, the second conductive gasket (420) can be attached to the conductive region of the flexible printed circuit board (330) via a conductive adhesive. For example, the second conductive gasket (420) may form surface contact or point contact with the conductive layer (485). In another example, the second conductive gasket (420) may be attached to the conductive layer (485) via a conductive adhesive. In one embodiment, the shielding layer (480) may be electrically connected to the ground of the flexible printed circuit board (330) via the second conductive gasket (420).

[0120] In one embodiment, an opening (486) may be formed in the first non-conductive layer (481) to allow the second conductive gasket (420) to contact the conductive layer (485). The second conductive gasket (420) may be positioned within the opening (486). The opening (486) may be a hole penetrating the first non-conductive layer (481). Alternatively, the opening (486) may be formed by notching or chamfering an edge of the first non-conductive layer (481), or may be a slot formed thereby.

[0121] In one embodiment, an opening (447) may be formed in the second shielding tape (443) to allow the second conductive gasket (420) to contact the flexible printed circuit board (330). The opening (447) of the second shielding tape (443) may be at least partially aligned with or overlap the opening (486) of the first non-conductive layer (481). The opening (447) may be a hole penetrating the second shielding tape (443). Alternatively, the opening (447) may be formed by notching or chamfering an edge of the second shielding tape (443), or may be a slot formed thereby.

[0122] In one embodiment, the second conductive gasket (420) can be positioned within the opening (486) and the opening (447). The second conductive gasket (420) can extend from the conductive layer (485) through the first non-conductive layer (481) and the second shielding tape (443) to the first portion (332) of the flexible printed circuit board (330).

[0123] In one embodiment, the second conductive gasket (420) may include an electrically conductive material to provide an electrical path. Additionally, or alternatively, the second conductive gasket (420) may be configured to be resilient. In one embodiment, the second conductive gasket (420) may include, but is not limited to, a step compensation tape, a conductive foam, a conductive tape, or a conductive fabric. For example, the second conductive gasket (420) may include a foam or a conductive foam surrounded or coated with a conductive material, such as a conductive fabric-over-foam gasket. In one embodiment, the second conductive gasket (420) may be referred to as a conductive adhesive member, an electrical connection member, a conductive resilient member (e.g., if resilient), a conductive interface, or an electrical interface.

[0124] In one embodiment, the shielding performance of the shielding layer (480) can be improved by electrically connecting the shielding layer (480) to the ground of the flexible printed circuit board (330) by the second conductive gasket (420). Accordingly, the performance degradation of peripheral components, such as an antenna using the support bracket (340) due to noise, can be reduced.

[0125] In one embodiment, the electrical connection structure between the conductive layer (485), the second conductive gasket (420), and the flexible printed circuit board (330), as described with reference to FIG. 5, may be referred to as the second ground connection structure of the electronic device (300).

[0126] FIG. 6 is an exemplary cross-sectional view of an electronic device according to one embodiment.

[0127] Referring to FIG. 6, an electronic device (300) according to one embodiment may include a third conductive gasket (430). In one embodiment, the third conductive gasket (430) may be disposed between a flexible printed circuit board (330) and a display (360). For example, the third conductive gasket (430) may be disposed (or interposed) between a first portion (332) of the flexible printed circuit board (330) and a conductive sheet (364) of the display (360). For example, the third conductive gasket (430) may extend from the first portion (332) of the flexible printed circuit board (330) to the conductive sheet (364) of the display (360).

[0128] In one embodiment, the third conductive gasket (430) can electrically connect the flexible printed circuit board (330) and the conductive sheet (364). For example, the third conductive gasket (430) can be in direct or indirect contact (e.g., through another member not shown) with a conductive area formed on the front surface of the first portion (332) of the flexible printed circuit board (330) and / or the conductive sheet (364) of the display (360). For example, the third conductive gasket (430) can be soldered (e.g., SMT) to the conductive area of ​​the front surface of the flexible printed circuit board (330). In another example, the third conductive gasket (430) can be attached to the conductive area of ​​the flexible printed circuit board (330) via a conductive adhesive. For example, the third conductive gasket (430) may be in direct contact with the conductive sheet (364) or may be attached to the conductive sheet (364) via a conductive adhesive.

[0129] In one embodiment, the conductive sheet (364) may be electrically connected to the ground of the flexible printed circuit board (330) via the third conductive gasket (430). Accordingly, the ground area of ​​the electronic device (300) may be expanded.

[0130] In one embodiment, an opening (446) may be formed in the first shielding tape (442) to allow the third conductive gasket (430) to contact the flexible printed circuit board (330). The opening (446) may be a hole penetrating the first shielding tape (442). Alternatively, the opening (446) may be formed by notching or chamfering an edge of the first shielding tape (442), or may be a slot formed thereby. In one embodiment, the third conductive gasket (430) may be positioned within the opening (446). The third conductive gasket (430) may penetrate the first shielding tape (442).

[0131] In one embodiment, the third conductive gasket (430) may include an electrically conductive material to provide an electrical path. Additionally, or alternatively, the third conductive gasket (430) may be configured to be resilient. In one embodiment, the third conductive gasket (430) may include, but is not limited to, a step compensation tape, a conductive foam, a conductive tape, or a conductive fabric. For example, the third conductive gasket (430) may include a foam or a conductive foam surrounded or coated with a conductive material, such as a conductive fabric-over-foam gasket. In one embodiment, the third conductive gasket (430) may be referred to as a conductive adhesive member, an electrical connection member, a conductive resilient member (e.g., if resilient), a conductive interface, or an electrical interface.

[0132] In one embodiment, the electrical connection structure between the flexible printed circuit board (330), the third conductive gasket (430), and the conductive sheet (364), as described with reference to FIG. 6, may be referred to as the third ground connection structure of the electronic device (300).

[0133] FIG. 7 is an exemplary cross-sectional view of an electronic device according to one embodiment.

[0134] Referring to FIG. 7, an electronic device (300) according to one embodiment may include a first conductive gasket (710) and a second conductive gasket (720).

[0135] In one embodiment, for the first conductive gasket (710), the description provided with reference to the first conductive gasket (410) of FIG. 4 may be applied in a substantially identical or corresponding manner. For example, the first conductive gasket (710) may be positioned (or interposed) between the conductive portion of the support bracket (340) and the conductive layer (485) of the shielding layer (480). For example, the first conductive gasket (710) may electrically connect the conductive layer (485) of the shielding layer (480) and the support bracket (340). For example, the first conductive gasket (710) may be formed with a thickness greater than the gap (g). For example, the first conductive gasket (710) may extend from the conductive portion of the support bracket (340) to the conductive layer (485) of the shielding layer (480) through an opening (787) formed in the second non-conductive layer (482). For example, the first conductive gasket (710) may be configured to be electrically conductive and resilient. For example, the first conductive gasket (710) may include a UFN (urethane fabric nickel) gasket. For example, the first conductive gasket (710) may include a conductive fabric over foam gasket, a conductive foam, a conductive fabric, a conductive tape, or a step compensation tape. In one embodiment, the first conductive gasket (710) may be referred to as an electrical connecting member, a conductive resilient member, a conductive interface, or an electrical interface.

[0136] In one embodiment, for the opening (787) of the second non-conductive layer (482), the description provided with reference to the opening (487) of the second non-conductive layer (482) of FIG. 4 may be applied in a substantially identical or corresponding manner. For example, the opening (787) of the second non-conductive layer (482) may allow the conductive layer (485) to be exposed outside the shielding layer (480), thereby allowing the first conductive gasket (710) to access the conductive layer (485). For example, the opening (787) may be a hole penetrating the second non-conductive layer (482), or, for another example, unlike the illustration, the opening (787) may be formed by notching or chamfering an edge of the second non-conductive layer (482), or may be a slot formed thereby.

[0137] In one embodiment, for the second conductive gasket (720), the description provided with reference to the second conductive gasket (420) of FIG. 5 may be applied in a substantially identical or corresponding manner. For example, the second conductive gasket (720) may be positioned (or interposed) between the conductive layer (485) of the shielding layer (480) and the first portion (332) of the flexible printed circuit board (330), thereby electrically connecting them. For example, the second conductive gasket (720) may be in direct or indirect contact with the conductive layer (485) of the shielding layer (480) and / or a conductive region formed on the rear surface of the first portion (332) of the flexible printed circuit board (330). The shielding layer (480) may be electrically connected to the ground of the flexible printed circuit board (330) via the second conductive gasket (720). For example, the second conductive gasket (720) may be configured to be electrically conductive. Additionally or alternatively, the second conductive gasket (720) may be configured to be resilient. For example, the second conductive gasket (720) may include, but is not limited to, a conductive fabric-over-foam gasket, a step compensation tape, a conductive foam, a conductive tape, or a conductive fabric. In one embodiment, the second conductive gasket (720) may be referred to as a conductive adhesive member, an electrical connection member, a conductive resilient member (e.g., if resilient), a conductive interface, or an electrical interface.

[0138] In one embodiment, the second conductive gasket (720) may be positioned within an opening (786) formed in the first non-conductive layer (481) and an opening (747) formed in the second shielding tape (443).

[0139] In one embodiment, the materials and / or sizes of the first conductive gasket (710) and the second conductive gasket (720) may be different. For example, the first conductive gasket (710) may include a conductive foam coated with a conductive material, and the second conductive gasket (720) may include a conductive fabric. For example, the thickness (e.g., the length in the Z-axis direction) of the first conductive gasket (710) may be greater than the thickness of the second conductive gasket (720). However, the present invention is not limited to the above-described examples.

[0140] In one embodiment, for the opening (786), the description provided with reference to FIG. 5 for the opening (486) may be applied in a substantially identical or corresponding manner. For example, the opening (786) of the first non-conductive layer (481) may expose the conductive layer (485) to the outside of the shielding layer (480), thereby allowing the second conductive gasket (720) to contact the conductive layer (485). For example, the opening (786) may be a hole penetrating the first non-conductive layer (481). In another example, unlike the illustration, the opening (786) may be a slot formed by or resulting from an edge of the first non-conductive layer (481) being notched or chamfered.

[0141] In one embodiment, for the opening (747), the description provided with reference to FIG. 5 for the opening (447) may be applied in a substantially identical or corresponding manner. For example, the opening (747) of the second shielding tape (443) may expose a conductive area of ​​the flexible printed circuit board (330) to the outside of the second shielding tape (443), thereby allowing the second conductive gasket (720) to contact the conductive area of ​​the flexible printed circuit board (330). For example, the opening (747) of the second shielding tape (443) may be at least partially aligned with or overlap with the opening (786) of the first non-conductive layer (481). For example, the opening (747) may be a hole penetrating the second shielding tape (443). For another example, unlike the city, the opening (747) may be formed by notching or chamfering the edge of the second shielding tape (443), or may be a slot formed thereby.

[0142] In one embodiment, the first conductive gasket (710) can at least partially overlap the second conductive gasket (720). For example, the first conductive gasket (710) can at least partially overlap the second conductive gasket (720) relative to a direction perpendicular to the support bracket (340) (e.g., the Z-axis direction). The openings (747, 786, and 787) that accommodate the first conductive gasket (710) and the second conductive gasket (720) can also at least partially overlap each other.

[0143] In one embodiment, the first conductive gasket (710) can provide a force (e.g., an elastic force) in a vertical direction (e.g., a Z-axis direction). For example, the first conductive gasket (710) can provide a force in a direction toward a second conductive gasket (720) overlapping the first conductive gasket (710). For example, the conductive layer (485) can include a section (790) disposed (or interposed) between the first conductive gasket (710) and the second conductive gasket (720). The first conductive gasket (710) can provide an elastic force to the section (790) of the conductive layer (485) with which the second conductive gasket (720) is directly or indirectly in contact. The elastic force from the first conductive gasket (710) can be transferred to the second conductive gasket (720) through the section (790). Accordingly, the stability of the electrical connection through the first conductive gasket (710) and the second conductive gasket (720) can be improved. In addition, since the conductive layer (485) is electrically connected to the ground of the support bracket (340) and the flexible printed circuit board (330) through the electrical connection structure having orthogonality provided by the first conductive gasket (710) and the second conductive gasket (720), the shielding performance of the conductive layer (485) can be improved. Accordingly, the performance deviation and degradation of peripheral components, such as an antenna using the support bracket (340), due to noise of components, such as the flexible printed circuit board (330) and the display driving circuit (368) disposed thereon, can be reduced.

[0144] In one embodiment, the electrical connection structure between the support bracket (340), the first conductive gasket (710), the conductive layer (485), the second conductive gasket (720), and the flexible printed circuit board (330), as described with reference to FIG. 7, may be referred to as a fourth ground connection structure of the electronic device (300). The fourth ground connection structure may include the first ground connection structure (e.g., FIG. 4) and the second ground connection structure (e.g., FIG. 5).

[0145] FIG. 8 is an exemplary cross-sectional view of an electronic device according to one embodiment.

[0146] Referring to FIG. 8, an electronic device (300) according to one embodiment may include a first conductive gasket (810), a second conductive gasket (820), and a third conductive gasket (830).

[0147] In one embodiment, for the first conductive gasket (810), the description provided with reference to the first conductive gasket (410) of FIG. 4 and / or the first conductive gasket (710) of FIG. 7 may be applied in a substantially identical or corresponding manner. For example, the first conductive gasket (810) may be positioned (or interposed) between the conductive portion of the support bracket (340) and the conductive layer (485), thereby electrically connecting them. The first conductive gasket (810) may be positioned within an opening (887) formed in the second non-conductive layer (482). For the opening (887), the description provided with reference to the opening (487) of FIG. 4 and / or the opening (787) of FIG. 7 may be applied in a substantially identical or corresponding manner.

[0148] In one embodiment, for the second conductive gasket (820), the description provided with reference to the second conductive gasket (420) of FIG. 4 and / or the second conductive gasket (720) of FIG. 7 may be applied in a substantially identical or corresponding manner. For example, the second conductive gasket (820) may be positioned (or interposed) between the conductive layer (485) and the first portion (332) of the flexible printed circuit board (330) (or the conductive area of ​​the first portion (332)), thereby electrically connecting them. The second conductive gasket (820) may be positioned within an opening (886) formed in the first non-conductive layer (481) and an opening (847) formed in the second shielding tape (443). For the opening (886), the description provided with reference to the opening (486) of FIG. 4 and / or the opening (786) of FIG. 7 may be applied in a substantially identical or corresponding manner, and for the opening (847), the description provided with reference to the opening (447) of FIG. 5 and / or the opening (747) of FIG. 7 may be applied in a substantially identical or corresponding manner.

[0149] In one embodiment, for the third conductive gasket (830), the description provided with reference to the third conductive gasket (430) of FIG. 6 may be applied in a substantially identical or corresponding manner. For example, the third conductive gasket (830) may be positioned (or interposed) between the first portion (332) of the flexible printed circuit board (330) and the conductive sheet (364) of the display (360) to electrically connect them. In one embodiment, the third conductive gasket (830) may include an electrically conductive material to provide an electrical path. Additionally, or alternatively, the third conductive gasket (830) may be configured to be elastic. In one embodiment, the third conductive gasket (830) may include, but is not limited to, a conductive fabric-over-foam gasket, a step compensation tape, a conductive foam, a conductive tape, or a conductive fabric. In one embodiment, the third conductive gasket (830) may be referred to as a conductive adhesive member, an electrical connection member, a conductive elastic member (e.g., having elasticity), a conductive interface, or an electrical interface. In one embodiment, the third conductive gasket (830) may be positioned within an opening (846) formed in the first shielding tape (442). The description provided with reference to the opening (446) of FIG. 6 may apply substantially the same or in a corresponding manner to the opening (846). For example, the opening (846) may be a hole penetrating the first shielding tape (442). Alternatively, the opening (846) may be formed by notching or chamfering an edge of the first shielding tape (442), or may be a slot formed thereby.

[0150] In one embodiment, the first conductive gasket (810) can at least partially overlap the second conductive gasket (820) and the third conductive gasket (830). For example, the first conductive gasket (810) can at least partially overlap the second conductive gasket (820) and the third conductive gasket (830) with respect to a direction perpendicular to the support bracket (340) (e.g., the Z-axis direction). The openings (846, 847, 886, and 887) that accommodate the first conductive gasket (810), the second conductive gasket (820), and the third conductive gasket (830) can also at least partially overlap each other.

[0151] In one embodiment, the first conductive gasket (810) can provide elasticity to the second conductive gasket (820) and the third conductive gasket (830). Accordingly, the stability of the electrical connection through the second conductive gasket (820) and the third conductive gasket (830) can be improved.

[0152] An electronic device (300) according to one embodiment may include a fourth conductive gasket (840). Additionally, the electronic device (300) may include a fifth conductive gasket (850). In one embodiment, the fourth conductive gasket (840) may be spaced apart from the first conductive gasket (810). The fourth conductive gasket (840) may be positioned outside the shielding layer (480). The fourth conductive gasket (840) may extend from the support bracket (340) to the first portion (332) of the flexible printed circuit board (330).

[0153] In one embodiment, the fourth conductive gasket (840) may be disposed between the support bracket (340) and the flexible printed circuit board (330). For example, the fourth conductive gasket (840) may be disposed between the conductive portion of the support bracket (340) and the first portion (332) of the flexible printed circuit board (330). For example, the fourth conductive gasket (840) may be disposed (or interposed) between the conductive portion of the support bracket (340) and a conductive area formed on the rear surface of the first portion (332) of the flexible printed circuit board (330).

[0154] In one embodiment, the fourth conductive gasket (840) can electrically connect the conductive portion of the support bracket (340) and the conductive area of ​​the first portion (332) of the flexible printed circuit board (330). To provide this electrical connection, the fourth conductive gasket (840) can be in direct or indirect contact (e.g., through another member not shown) with the conductive portion of the support bracket (340) and / or the conductive area of ​​the first portion (332) of the flexible printed circuit board (330). For example, the fourth conductive gasket (840) can be welded to the conductive portion of the support bracket (340). Additionally or alternatively, a metal sheet can be disposed (or interposed) between the fourth conductive gasket (840) and the support bracket (340). The metal sheet can include a weldable metal or metal alloy. The metal sheet may be provided for welding the fourth conductive gasket (840) and the support bracket (340), but is not limited thereto. For example, the metal sheet may be attached to the fourth conductive gasket (840) and / or the support bracket (340) via a conductive adhesive. As another example, the fourth conductive gasket (840) may be attached to the support bracket (340) via a conductive adhesive. For example, the fourth conductive gasket (840) may be soldered (e.g., SMT) onto a first portion (332) of a flexible printed circuit board (330). As another example, the fourth conductive gasket (840) may be attached to a first portion (332) of a flexible printed circuit board (330) via a conductive adhesive.

[0155] In one embodiment, the fourth conductive gasket (840) can include an electrically conductive material. Additionally, or alternatively, the fourth conductive gasket (840) can be configured to be resilient. For example, the fourth conductive gasket (840) can include, but is not limited to, an resilient material (e.g., foam) and a conductive material (e.g., conductive fabric) surrounding the resilient material. For example, the fourth conductive gasket (840) can include a UFN gasket, a conductive fabric-over-foam gasket, a step compensation tape, a conductive foam, a conductive fabric, or a conductive tape. In one embodiment, the fourth conductive gasket (840) can be referred to as a conductive adhesive member, an electrical connection member, a conductive resilient member (e.g., if resilient), a conductive interface, or an electrical interface.

[0156] In one embodiment, for the fifth conductive gasket (850), the description provided with reference to the third conductive gasket (430) of FIG. 6 may be applied in a substantially identical or corresponding manner. For example, the fifth conductive gasket (850) may be positioned (or interposed) between the first portion (332) of the flexible printed circuit board (330) and the conductive sheet (364) of the display (360) to electrically connect them. In one embodiment, the fifth conductive gasket (850) may include an electrically conductive material to provide an electrical path. Additionally, or alternatively, the fifth conductive gasket (850) may be configured to be elastic. In one embodiment, the fifth conductive gasket (850) may include, but is not limited to, a conductive fabric-over-foam gasket, a step compensation tape, a conductive foam, a conductive tape, or a conductive fabric. In one embodiment, the fifth conductive gasket (850) may be referred to as a conductive adhesive member, an electrical connection member, a conductive elastic member (e.g., having elasticity), a conductive interface, or an electrical interface. In one embodiment, the fifth conductive gasket (850) may be positioned within an opening (848) formed in the first shielding tape (442). The description provided with reference to the opening (446) of FIG. 6 may apply substantially the same or in a corresponding manner to the opening (848). For example, the opening (848) may be a hole penetrating the first shielding tape (442). Alternatively, the opening (848) may be formed by notching or chamfering an edge of the first shielding tape (442), or may be a slot formed thereby.

[0157] In one embodiment, the fourth conductive gasket (840) can at least partially overlap the fifth conductive gasket (850). For example, the fourth conductive gasket (840) can at least partially overlap the fifth conductive gasket (850) in a direction perpendicular to the support bracket (340) (e.g., the Z-axis direction). In one embodiment, the fourth conductive gasket (840) can provide elasticity to the fifth conductive gasket (850) by being pressed by the support bracket (340). Accordingly, the stability of the electrical connection through the fourth conductive gasket (840) and the fifth conductive gasket (850) can be improved.

[0158] In one embodiment, the electrical connection structure between the support bracket (340), the first conductive gasket (810), the conductive layer (485), the second conductive gasket (820), the flexible printed circuit board (330), the third conductive gasket (830), and the conductive sheet (364), as described with reference to FIG. 8, may be referred to as a fifth ground connection structure of the electronic device (300). The fifth ground connection structure may include the first ground connection structure (e.g., FIG. 4), the second ground connection structure (e.g., FIG. 5), and the third ground connection structure (e.g., FIG. 6).

[0159] Alternatively or optionally, the fifth ground connection structure may not include the first conductive gasket (810). The fifth ground connection structure not including the first conductive gasket (810) may be referred to as the sixth ground connection structure.

[0160] In one embodiment, the electrical connection structure between the support bracket (340), the fourth conductive gasket (840), and the flexible printed circuit board (330), described with reference to FIG. 8, may be referred to as the seventh ground connection structure of the electronic device (300).

[0161] The electrical connection structure between the support bracket (340), the fourth conductive gasket (840), the flexible printed circuit board (330), the fifth conductive gasket (850), and the conductive sheet (364), described with reference to FIG. 8, may be referred to as the eighth ground connection structure of the electronic device (300). The eighth ground connection structure may, in addition to the seventh ground connection structure, include an electrical path provided by the fifth conductive gasket (850).

[0162] FIG. 9 is an exemplary diagram for explaining the flow of a noise signal of an electronic device according to one embodiment.

[0163] Referring to FIG. 9, noise from the display driving circuit (368) and / or noise to the display driving circuit (368) may flow to the support bracket (340) through the conductive layer (485) of the shielding layer (480) and the flexible printed circuit board (330). For example, noise from the display driving circuit (368) may be induced to the support bracket (340) through a vertical ground path provided by the first conductive gasket (810), the second conductive gasket (820), and the third conductive gasket (830), such as the first path (P1). For example, noise from the display driving circuit (368) may be induced to the support bracket (340) through a vertical ground path provided by the fourth conductive gasket (840) and the fifth conductive gasket (850), such as the second path (P2). Accordingly, noise caused by the display driving circuit (368) (hereinafter, DDIC (display driving integrated circuitry)) can be reduced or blocked from being induced in other components of the electronic device (300) (e.g., an antenna using the second part (243) of FIG. 2b).

[0164] FIGS. 10 and 11 are exemplary drawings illustrating an electronic device according to one embodiment. FIG. 10 is a drawing looking at the back of a display (360), and FIG. 11 is a drawing projecting a first portion (332) of a flexible printed circuit board (330) onto a support bracket (340).

[0165] Referring to FIGS. 10 and 11 , an electronic device (300) according to an embodiment may include one or more ground connection structures. The one or more ground connection structures may include at least one of the first ground connection structure of FIG. 4 , the second ground connection structure of FIG. 5 , the third ground connection structure of FIG. 6 , the fourth ground connection structure of FIG. 7 , the fifth ground connection structure of FIG. 8 , the sixth ground connection structure of FIG. 8 , the seventh ground connection structure of FIG. 8 , and / or the eighth ground connection structure of FIG. 8 . For example, the one or more ground connection structures may include, for example, the first to fifth structures (S1, S2, S3, S4, and S5).

[0166] In one embodiment, each of the first structure (S1) and the second structure (S2) may include the second ground connection structure of FIG. 5 or the sixth ground connection structure of FIG. 8. In one embodiment, the third structure (S3) may include the fourth ground connection structure of FIG. 7 or the fifth ground connection structure of FIG. 8. In one embodiment, each of the fourth structure (S4) and the fifth structure (S5) may include the seventh ground connection structure of FIG. 8 or the eighth ground connection structure.

[0167] In one embodiment, the first structure (S1), the second structure (S2), and the third structure (S3) may be positioned on a first portion (332) of a flexible printed circuit board (330). The first structure (S1), the second structure (S2), and the third structure (S3) may be arranged along a width direction (e.g., an X-axis direction) of the flexible printed circuit board (330). For example, the first structure (S1), the second structure (S2), and the third structure (S3) may be arranged along the X-axis direction within the first portion (332) of the flexible printed circuit board (330). In one embodiment, the first structure (S1), the second structure (S2), and the third structure (S3) may be positioned sequentially along one direction and may be spaced apart from each other. In one embodiment, the fourth structure (S4) and the fifth structure (S5) may be positioned spaced apart from each other on the first portion (332) of the flexible printed circuit board (330). The fourth structure (S4) and the fifth structure (S5) may be positioned further from the second portion (334) of the flexible printed circuit board (330) than the first structure (S1), the second structure (S2), and the third structure (S3). The first to fifth structures (S1, S2, S3, S4, and S5) may be positioned adjacent to the outer edge of the first portion (332). However, the arrangement and / or positional relationships of the first to fifth structures (S1, S2, S3, S4, and S5) are not limited by the above description, and various modifications may be possible.

[0168] Referring to FIG. 11, in one embodiment, the support bracket (340) may include a support portion (1141) (e.g., the first part (241) of FIG. 2b) and a side wall portion (1143) surrounding the periphery of the support portion (1141) (e.g., the second part (243) of FIG. 2b).

[0169] An electronic device (300) according to an embodiment may include a waterproof member (1150) disposed on a support portion (1141). The waterproof member (1150) may include a waterproof adhesive such as a waterproof adhesive or a waterproof tape. The waterproof member (1150) may be formed along the perimeter of the side wall portion (1143) on the inner side of the side wall portion (1143). The waterproof member (1150) may be formed to avoid an area where the flexible printed circuit board (330) or the first portion (332) of the flexible printed circuit board (330) is positioned on the support bracket (340). For example, the waterproof member (1150) may be disposed on an area of ​​the support bracket (340) around the flexible printed circuit board (330). Therefore, it may be difficult to implement a ground connection structure for the flexible printed circuit board (330) on the above-mentioned area of ​​the support bracket (340) where the waterproof member (1150) is placed. According to one embodiment, the electronic device (300) can provide waterproof performance and improved shielding performance while saving the internal space of the electronic device (300) by implementing the first to fifth structures (S1, S2, S3, S4, and S5) on the flexible printed circuit board (330).

[0170] Referring to Table 1 below, the technical effects of improved shielding performance resulting in improved antenna performance and reduced antenna performance deviation are described.

[0171] Table 1 below shows the reception desense in the electronic device (300) and the electronic device according to the comparative example.

[0172] Receiver Desensitization [dB] Comparison Example Electronic Device Electronic Device (300) 1st Example 1.17 0.72 2nd Example 0.64 0.64 3rd Example 2.2 0.58

[0173] The desense of Table 1 above may indicate a decrease in sensitivity of a received signal through an antenna of an electronic device (e.g., a conductive portion of the second part (243) of FIG. 2B) in a specific frequency band (e.g., a low-band band of 1.0 GHz or less). That is, a larger value of the desense in Table 1 may mean a greater degree of decrease in the receiving sensitivity. The electronic device (300) according to one embodiment of Table 1 may include the ground connection structures described above (e.g., the ground connection structures (S1, S2, S3, S4, and S5) of FIG. 11), and the electronic device according to the comparative example may not include the ground connection structures described above.

[0174] Referring to Table 1 above, the deviation of the desense of the first to third examples of the electronic device (300) according to one embodiment may be reduced compared to the deviation of the first to third examples of the electronic device of the comparative example. Referring to the first example, the desense of the electronic device (300) according to one embodiment may be reduced compared to the desense of the electronic device of the comparative example. Referring to the third example, the desense of the electronic device (300) according to one embodiment may be reduced compared to the desense of the electronic device of the comparative example.

[0175] FIG. 12 is an exemplary diagram illustrating an electronic device according to an embodiment. Referring to FIG. 12, an electronic device (300) according to an embodiment may include a display (1260) (e.g., the display (360) of FIG. 3 ). The display (1260) may include a display panel (1262) (e.g., the display panel (362) of FIG. 3 ). The display panel (1262) may include a substrate (1270) on which a pixel layer configured to emit light is formed. The substrate (1270) may include a first portion (1271) on which the pixel layer is formed, a second portion (1272) positioned between the first portion (1271) and the support bracket (340), and a third portion (1273) extending from the first portion (1271) to the second portion (1272). The substrate (1270) may be formed to be at least partially flexible. For example, the third portion (1273) may be bendable from the first portion (1271), and the second portion (1272) extending from the third portion (1273) may be positioned above (e.g., in the -Z-axis direction) the first portion (1271). The substrate (1270) may be referred to as a flexible substrate.

[0176] In one embodiment, the second portion (1272) of the substrate (1270) may be understood to include or replace the second portion (334) of the aforementioned flexible printed circuit board (1230). In one embodiment, the third portion (1273) of the substrate (1270) may be understood to include or replace the third portion (336) of the aforementioned flexible printed circuit board (1230).

[0177] According to one embodiment, the electronic device (300) may include a printed circuit board (1230). For example, the printed circuit board (1230) may include at least a portion of the aforementioned flexible printed circuit board (330) (or the first portion (332) of the flexible printed circuit board (330). The printed circuit board (1230) may be positioned between the substrate (1270) and the support bracket (340). For example, the printed circuit board (1230) may be positioned between the first portion (1271) of the substrate (1270) and the support bracket (340). The printed circuit board (1230) may be coupled to the substrate (1270). For example, the printed circuit board (1230) may be coupled to the second portion (1272) of the substrate (1270). The conductive sheet (364) of the display (1260) can be positioned between the printed circuit board (1230) and the first portion (1271) of the substrate (1270).

[0178] The DDIC (368) may be disposed on the second portion (1272) of the substrate (1270). The DDIC (368) may be positioned between the second portion (1272) of the substrate (1270) and the support bracket (340). The shielding layer (480) may be disposed on the DDIC (368) and the printed circuit board (1230) (e.g., in the -Z-axis direction). For example, the shielding layer (480) may be disposed on the second portion (1272) of the substrate (1270) and the printed circuit board (1230) to cover the DDIC (368). The DDIC (368) may be electrically connected to the display panel (1262). For example, the DDIC (368) may be electrically connected to the display panel (1262) via an electrical path provided by the substrate (1270).

[0179] According to one embodiment, the electronic device (300) may further include another integrated circuit (IC) (1269) distinct from the DDIC (368). The other IC (1269) may include, but is not limited to, a touch control circuit (touch controller IC) for driving a sensor for detecting a touch input on the window (302). The other IC (1269) may be disposed on a printed circuit board (1230). A shielding layer (480) may be disposed on the other IC (1269). The shielding layer (480) may be electrically connected to a ground of the printed circuit board (1230) through a second conductive gasket (820) and may be electrically connected to the support bracket (340) through a first conductive gasket (810). By the shielding layer (480), EMI with other ICs (1269) can be shielded.

[0180] FIG. 13 is an exemplary diagram illustrating an electronic device according to an embodiment. Referring to FIG. 13, an electronic device (300) according to an embodiment may include a conductive member (1340), a shielding member (1380), a first IC (1368), a first substrate (1370), a second substrate (1330), a first conductive gasket (1310), and a second conductive gasket (1320).

[0181] The conductive member (1340) may include a portion formed of an electrically conductive material (e.g., a conductive metal). For example, the conductive member (1340) may include, but is not limited to, the support bracket (340) or the conductive portion of the support bracket (340) described above.

[0182] The first substrate (1370) may include a circuit board, a printed circuit board, a flexible printed circuit, a flexible printed circuit board, or a film circuit board. For example, the first substrate (1370) may include, but is not limited to, the second portion (334) of the aforementioned flexible printed circuit board (330). For example, the first substrate (1370) may include, but is not limited to, the second portion (1272) of the aforementioned substrate (1270).

[0183] The second substrate (1330) may include a circuit board, a printed circuit board, a flexible printed circuit, a flexible printed circuit board, or a film circuit board. For example, the second substrate (1330) may include, but is not limited to, the first portion (332) of the aforementioned flexible printed circuit board (330).

[0184] The first IC (1368) may be disposed on the first substrate (1370). The electronic device (300) according to one embodiment may further include a second IC (1369). The second IC (1369) may be disposed on the second substrate (1330). The first IC (1368) and / or the second IC (1369) may be electrically connected to other components of the electronic device (300) (e.g., the display (1260) of FIG. 12 or the processor (120) of FIG. 1) via the first substrate (1370) and / or the second substrate (1330). The first IC (1368) or the second IC (1369) may include, but is not limited to, the DDIC (368) described above or another IC (1269).

[0185] A shielding member (1380) (e.g., shielding member (480)) may be disposed on the first IC (1368) and the second IC (1369). For example, the shielding member (1380) may be disposed on the first substrate (1370) and the second substrate (1330) to cover the first IC (1368) and the second IC (1369). For example, the shielding member (1380) may be attached to the first IC (1368), the second IC (1369), the first substrate (1370), and / or the second substrate (1330).

[0186] The shielding member (1380) may include a conductive layer (1385) (e.g., conductive layer (485)) configured to shield EMI from the first IC (1368) and / or the second IC (1369). Additionally, the shielding member (1380) may further include a first non-conductive layer (1381) (e.g., first non-conductive layer (481)) and / or a second non-conductive layer (1382) (e.g., second non-conductive layer (482)) disposed on both sides of the conductive layer (1385).

[0187] In one embodiment, a first conductive gasket (1310) (e.g., first conductive gaskets (410, 710, or 810)) can be positioned between a conductive layer (1385) and a conductive member (1340). In one embodiment, a second conductive gasket (1320) (e.g., second conductive gaskets (420, 720, or 820)) can be positioned between the conductive layer (1385) and a second substrate (1330). A portion of the conductive layer (1385) can be positioned between the first conductive gasket (1310) and the second conductive gasket (1320). For example, the second conductive gasket (1320) may be in contact with the portion of the conductive layer (1385), and the first conductive gasket (1310) may be at least partially disposed on the portion of the conductive layer (1385) to which the second conductive gasket (1320) is in contact. The first conductive gasket (1310) may be in contact with the conductive layer (1385) through an opening (1387) formed in the second non-conductive layer (1382) (e.g., opening (887) of FIG. 12). The second conductive gasket (1320) may be in contact with the conductive layer (1385) through an opening (1386) formed in the first non-conductive layer (1381) (e.g., opening (886) of FIG. 12).

[0188] The second conductive gasket (1320) can electrically connect the conductive layer (1385) to the ground of the second substrate (1330). The first conductive gasket (1310) can stably maintain the electrical connection between the second conductive gasket (1320) and the ground of the second substrate (1330) by providing elasticity to the portion of the second conductive gasket (1320) and the conductive layer (1385) in contact with the second conductive gasket (1320). In addition, the first conductive gasket (1310) can electrically connect the conductive layer (1385) to the conductive member (1340). Accordingly, the shielding performance for the first IC (1368) and the second IC (1369) can be improved.

[0189] An electronic device (e.g., an electronic device (300) of FIG. 3) according to one embodiment comprises: a support bracket (e.g., a support bracket (340) of FIG. 3), a display supported by the support bracket (e.g., a display (360) of FIG. 3), a flexible printed circuit board (e.g., a flexible printed circuit board (330) of FIG. 3) electrically connected to the display and disposed between the support bracket and the display so as to be spaced apart from the support bracket; a DDIC (e.g., a display driving circuit (368) of FIG. 3) disposed on the flexible printed circuit board and facing the support bracket; a conductive layer (e.g., a conductive layer (485) of FIG. 4) disposed on the flexible printed circuit board so as to cover the DDIC); a first conductive gasket (e.g., a first conductive gasket (410, 710, or 810)) and a second conductive gasket (e.g., a second conductive gasket (420, 720, or 820)) interposed between the conductive layer and the flexible printed circuit board, at least partially overlapping the first conductive gasket, and electrically connecting the conductive layer and the flexible printed circuit board. The conductive layer can block noise caused by the DDIC. Through a ground connection structure via the first conductive gasket and the second conductive interface, the shielding effect caused by the conductive layer can be improved.

[0190] In one embodiment, the conductive layer may include a section (e.g., section (790) of FIG. 7) interposed between the first conductive gasket and the second conductive gasket. The first conductive gasket may be configured to provide elasticity to the section of the conductive layer to which the second conductive gasket is in contact. This may improve the stability of the electrical contact.

[0191] In one embodiment, the conductive layer may include a first side facing the support bracket and a second side opposite the first side and facing the display. The electronic device may include a first non-conductive layer (e.g., the second non-conductive layer (482) of FIG. 4) disposed on the first side of the conductive layer and having a first opening (e.g., the first opening (487, 787, or 887)) formed therein. The first conductive gasket may be positioned within the first opening of the first non-conductive layer.

[0192] In one embodiment, the second non-conductive layer (e.g., the first non-conductive layer (381) of FIG. 4) may be formed on the second surface of the conductive layer and having a second opening (e.g., a second opening (386, 786, or 886)) at least partially overlapping the first opening. The second conductive gasket may be positioned within the second opening of the second non-conductive layer.

[0193] In one embodiment, the flexible printed circuit board may include a first side on which the first conductive gasket is disposed and a second side of the flexible printed circuit board opposite the first side. The display may include a conductive sheet (e.g., conductive sheet (364) of FIG. 3) facing the second side of the flexible printed circuit board.

[0194] The electronic device may include a third conductive gasket (e.g., a third conductive gasket (430, or 830)) interposed between the conductive sheet of the display and the second surface of the flexible printed circuit board, electrically connecting the conductive sheet and the flexible printed circuit board.

[0195] In one embodiment, the third conductive gasket may at least partially overlap the second conductive gasket.

[0196] In one embodiment, the electronic device may include a fourth conductive gasket (e.g., the fourth conductive gasket (840) of FIG. 8) interposed between the flexible printed circuit board and the support bracket, electrically connecting the flexible printed circuit board and the support bracket. The fourth conductive gasket may be positioned outside the conductive layer.

[0197] In one embodiment, the electronic device may include a fifth conductive gasket interposed between the conductive layer and the flexible printed circuit board and spaced apart from the second conductive gasket. The fifth conductive gasket may electrically connect the conductive layer and the flexible printed circuit board.

[0198] In one embodiment, the flexible printed circuit board may include a flexible portion (e.g., the second portion (334) of FIG. 3) on which the DDIC is disposed, and a rigid portion (e.g., the first portion (332) of FIG. 3) extending from the flexible portion and on which the first conductive gasket and the second conductive gasket are disposed.

[0199] In one embodiment, the first conductive gasket may comprise a urethane fabric nickel gasket.

[0200] In one embodiment, the second conductive gasket may comprise a fabric gasket or a conductive tape.

[0201] In one embodiment, a gap (e.g., gap (g) in FIG. 4) between the support bracket and the flexible printed circuit board may have a first length. The first conductive gasket may have a second length that is greater than the first length, and the first length and the second length may be lengths relative to a direction substantially perpendicular to the display.

[0202] In one embodiment, the display may include a window (e.g., window (302) of FIG. 3) that is disposed on the display and forms the front surface of the electronic device. The support bracket may include a side wall (e.g., side wall (1141) of FIG. 11) that supports an edge portion of the window and forms a side surface of the electronic device and is used as an antenna radiator of the electronic device.

[0203] An electronic device (e.g., the electronic device (300) of FIG. 3) according to one embodiment may include a support bracket including a conductive portion (e.g., the support bracket (340) of FIG. 3), and a display assembly (e.g., the display (360) of FIG. 3) supported by the support bracket. The display assembly may include a panel configured to emit light (e.g., the display panel (362) of FIG. 3), a flexible printed circuit board (e.g., the flexible printed circuit board (330) of FIG. 3) positioned between the panel and the support bracket so as to extend from the panel and be spaced apart from the support bracket, and a DDIC (e.g., the display driving circuit (368) of FIG. 3) disposed on the flexible printed circuit board and electrically connected to the panel. The electronic device may include a conductive layer (e.g., conductive layer (485) of FIG. 4) adhered on the flexible printed circuit board to cover the DDIC, a first conductive interface (e.g., a first conductive gasket (410, 710, or 810)) disposed between the conductive portion of the support bracket and the conductive layer so as to contact the conductive portion of the support bracket and the conductive layer, and a second conductive interface (e.g., a second conductive gasket (420, 720, or 820)) disposed between the conductive layer and the flexible printed circuit board so as to contact the conductive layer and the conductive region of the flexible printed circuit board. The first conductive interface may be configured to provide elasticity to the second conductive interface overlapping the first conductive interface through the conductive layer. The conductive layer may block noise caused by the DDIC. The first conductive gasket and the Through the ground connection structure via the second conductive interface, the stability of the electrical connection and the shielding effect by the conductive layer can be improved.

[0204] In one embodiment, the conductive layer may include a first side facing the support bracket and a second side opposite the first side and facing the panel. The electronic device may include a first non-conductive layer (e.g., the second non-conductive layer (482) of FIG. 4) disposed on the first side of the conductive layer and having a first opening (e.g., the first opening (487, 787, or 887)) formed therein. The first conductive interface may be positioned within the first opening of the first non-conductive layer.

[0205] In one embodiment, the electronic device may include a second non-conductive layer (e.g., the first non-conductive layer (481) of FIG. 4) disposed on the second surface of the conductive layer and having a second opening formed therein at least partially overlapping the first opening. The second conductive interface may be positioned within the second opening of the second non-conductive layer.

[0206] In one embodiment, the flexible printed circuit board may include a first side and a second side. The first conductive interface may be disposed on the first side of the flexible printed circuit board. The display assembly may include a conductive sheet (e.g., conductive sheet (364) of FIG. 3) facing the second side of the flexible printed circuit board. The electronic device may include a third conductive interface (e.g., third conductive gasket (430, or 830)) disposed between the conductive sheet and the flexible printed circuit board so as to contact the conductive sheet of the display assembly and a conductive area of ​​the second side of the flexible printed circuit board.

[0207] In one embodiment, the third conductive interface may at least partially overlap the second conductive interface.

[0208] In one embodiment, the electronic device may include a fourth conductive interface (e.g., the fourth conductive gasket (840) of FIG. 8) disposed between the flexible printed circuit board and the support bracket so as to contact the conductive portion of the support bracket and the conductive area of ​​the flexible printed circuit board, and a fifth conductive interface disposed between the conductive layer and the flexible printed circuit board so as to contact the conductive layer and the conductive area of ​​the flexible printed circuit board, and spaced apart from the second conductive interface. The fourth conductive interface may be located outside the conductive layer.

[0209] In one embodiment, the flexible printed circuit board may include a flexible portion (e.g., the second portion (334) of FIG. 3) on which the DDIC is disposed, and a rigid portion (e.g., the first portion (332) of FIG. 3) extending from the flexible portion and on which the first conductive interface and the second conductive interface are disposed.

[0210] According to one embodiment, an electronic device (e.g., electronic device (300) of FIG. 12) may include a bracket (e.g., support bracket (340) of FIG. 12), a display (e.g., display (1260) of FIG. 12), a shielding member (e.g., shielding layer (480) of FIG. 12), a first conductive gasket (e.g., second conductive gasket (820) of FIG. 12), and a second conductive gasket (e.g., first conductive gasket (810) of FIG. 12). The display may include a display panel (e.g., display panel (1262) of FIG. 12), a display driving integrated circuitry (DDIC) (e.g., DDIC (368) of FIG. 12), and a flexible printed circuit board (e.g., flexible printed circuit board (1230) of FIG. 12). The display panel may include a flexible substrate (e.g., substrate (1270) of FIG. 12) including a portion below the bracket (e.g., second portion (1272) of FIG. 12). The DDIC may be mounted on the portion of the flexible substrate, positioned between the bracket and the portion of the flexible substrate, and electrically connected to the display panel. The flexible printed circuit board may be disposed between the flexible substrate and the bracket, and coupled to the portion of the flexible substrate. The shielding member may be disposed on the DDIC and the flexible printed circuit board, and spaced apart from the bracket. The shielding member may include a conductive layer (e.g., conductive layer (485) of FIG. 12) configured to shield electromagnetic interference (EMI) with the DDIC. The first conductive gasket is disposed between the flexible printed circuit board and the conductive layer, is in contact with a portion of the conductive layer, and can electrically connect the conductive layer to a ground of the flexible printed circuit board.The second conductive gasket may be disposed between the conductive layer and the bracket, and may be at least partially disposed on the portion of the conductive layer that is in contact with the first conductive gasket.

[0211] In one embodiment, the second conductive gasket can press the portion of the conductive layer and the first conductive gasket such that the conductive layer is electrically connected to the ground of the flexible printed circuit board through the first conductive gasket.

[0212] In one embodiment, the portion of the conductive layer may be interposed between the first conductive gasket and the second conductive gasket. The second conductive gasket may be configured to provide elasticity to the portion of the conductive layer that is in contact with the first conductive gasket.

[0213] In one embodiment, the shielding member may include a first non-conductive layer (e.g., the first non-conductive layer (481) of FIG. 12) disposed on a first side of the conductive layer and a second non-conductive layer (e.g., the second non-conductive layer (482) of FIG. 12) disposed on a second side of the conductive layer. A first opening (e.g., the opening (886) of FIG. 12) may be formed in the first non-conductive layer. The first conductive gasket may be brought into contact with the conductive layer through the first opening of the first non-conductive layer. A second opening (e.g., the opening (887) of FIG. 12) may be formed in the second non-conductive layer. The second conductive gasket may be brought into contact with the conductive layer through the second opening of the second non-conductive layer.

[0214] In one embodiment, the display may include a conductive sheet (e.g., conductive sheet (364) of FIG. 12). The electronic device may include a third conductive gasket (e.g., third conductive gasket (830) of FIG. 8) disposed between the flexible printed circuit board and the conductive sheet, electrically connecting the conductive sheet to the ground of the flexible printed circuit board.

[0215] In one embodiment, the first conductive gasket, the second conductive gasket, and the third conductive gasket may be aligned in a direction substantially perpendicular to the display panel.

[0216] In one embodiment, the electronic device may include a fourth conductive gasket (e.g., the fourth conductive gasket (840) of FIG. 8) disposed between the flexible printed circuit board and the bracket, positioned outside the conductive layer, and electrically connecting the ground of the flexible printed circuit board to the bracket.

[0217] In one embodiment, the electronic device may include a fifth conductive gasket disposed between the conductive layer and the flexible printed circuit board, the fifth conductive gasket being spaced apart from the first conductive gasket. The fifth conductive gasket may be in contact with another portion of the conductive layer and electrically connect the conductive layer to the ground of the flexible printed circuit board.

[0218] In one embodiment, the materials and / or sizes of the first conductive gasket and the second conductive gasket may be different.

[0219] In one embodiment, the length of the second conductive gasket may be greater than the length of the first conductive gasket. The lengths of the first conductive gasket and the second conductive gasket may be based on a direction substantially perpendicular to the display panel.

[0220] In one embodiment, the gap between the bracket and the shielding member may have a first length. The second conductive gasket may have a second length greater than the first length. The first length and the second length may be based on a direction substantially perpendicular to the display panel.

[0221] In one embodiment, the first conductive gasket or the second conductive gasket may include a conductive tape, a conductive fabric, a conductive foam, a foam surrounded by a conductive material, or a conductive foam surrounded by a conductive material.

[0222] In one embodiment, the bracket may include a conductive part. The second conductive gasket may be disposed between the conductive part and the conductive layer of the bracket, and may electrically connect the conductive layer to the conductive part of the bracket.

[0223] In one embodiment, the conductive part of the bracket can be used, at least in part, as an antenna radiator of the electronic device.

[0224] According to one embodiment, an electronic device (e.g., an electronic device (300) of FIG. 13) may include a bracket (e.g., a conductive member (1340) of FIG. 13), a printed circuit board (e.g., a second substrate (1330) of FIG. 13), an integrated circuitry (IC) (e.g., a first IC (1368) of FIG. 13), a shielding member (e.g., a shielding member (1380) of FIG. 13), a first conductive gasket (e.g., a second conductive gasket (1320) of FIG. 13), and a second conductive gasket (e.g., a first conductive gasket (1310) of FIG. 13). The IC may be electrically connected to at least other components of the electronic device via the printed circuit board. The shielding member may include a conductive layer (e.g., conductive layer (1385) of FIG. 13) disposed on the IC and the printed circuit board and configured to shield electromagnetic interference (EMI) with the IC. The first conductive gasket may be disposed between the conductive layer and the printed circuit board, may be in contact with a portion of the conductive layer, and may electrically connect the conductive layer to a ground of the printed circuit board. The second conductive gasket may be disposed between the conductive layer and the bracket, and may be at least partially disposed on the portion of the conductive layer that is in contact with the first conductive gasket.

[0225] In one embodiment, the portion of the conductive layer may be interposed between the first conductive gasket and the second conductive gasket. The second conductive gasket may be configured to provide elasticity to the portion of the conductive layer that is in contact with the first conductive gasket.

[0226] In one embodiment, the electronic device may include a display (e.g., display (1260) of FIG. 12). The IC may include display driving integrated circuitry (DDIC) (e.g., DDIC (368) of FIG. 12) electrically connected to the display.

[0227] In one embodiment, the electronic device may include a window (e.g., window (302) of FIG. 12) that at least partially defines the front surface of the electronic device. The window may include an area attached to the display and an area attached to the bracket.

[0228] In one embodiment, the display may include a display panel (e.g., a display panel (1270) of FIG. 12), a flexible substrate (e.g., a substrate (1270) of FIG. 12), and the DDIC. The flexible substrate may include a first portion (e.g., a first portion (1271) of FIG. 12) on which the display panel is formed and positioned between the display panel and the bracket, a second portion (e.g., a second portion (1272) of FIG. 12) positioned between the first portion and the bracket, and a bending portion (e.g., a bending portion (1273) of FIG. 12) extending from the first portion to the second portion. The DDIC may be formed on the second portion of the flexible substrate and positioned between the second portion of the flexible substrate and the bracket. The printed circuit board may be coupled to the second portion of the flexible substrate.

[0229] In one embodiment, the printed circuit board may include a flexible portion and a rigid portion. The IC may be disposed on the flexible portion of the printed circuit board. The first conductive gasket may be disposed on the rigid portion of the printed circuit board.

[0230] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0231] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0232] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0233] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0234] According to one embodiment, the method according to the various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0235] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, bracket; printed circuit board; An integrated circuitry (IC) electrically connected to at least other components of the electronic device via the printed circuit board; A shielding member comprising a conductive layer disposed on the IC and the printed circuit board and configured to shield electromagnetic interference (EMI) with the IC; A first conductive gasket disposed between the conductive layer and the printed circuit board, in contact with a portion of the conductive layer, and electrically connecting the conductive layer to a ground of the printed circuit board; and A second conductive gasket disposed between the conductive layer and the bracket, the second conductive gasket being at least partially disposed on the portion of the conductive layer in contact with the first conductive gasket. Electronic devices.

2. In claim 1, Including a display, The above IC includes a DDIC (display driving integrated circuitry) electrically connected to the display. Electronic devices.

3. In claim 2, A window comprising at least partially defining a front surface of the electronic device, the window comprising: an area attached to the above display; and an area attached to the above bracket; comprising; Electronic devices.

4. In claim 2 or claim 3, The above display: display panel; A flexible substrate, said flexible substrate comprising: A first part, in which the display panel is formed and positioned between the display panel and the bracket; a second part positioned between the first part and the bracket; and comprising a bending portion extending from the first portion to the second portion; and The DDIC is formed on the second portion of the flexible substrate and positioned between the second portion of the flexible substrate and the bracket, The above printed circuit board is bonded to the second portion of the flexible substrate, Electronic devices.

5. In claim 4, The display includes a conductive sheet disposed between the printed circuit board and the first portion of the flexible substrate, The electronic device comprises a third conductive gasket disposed between the printed circuit board and the conductive sheet and electrically connecting the conductive sheet to the ground of the printed circuit board. Electronic devices.

6. In claim 5, The first conductive gasket, the second conductive gasket, and the third conductive gasket are aligned in a direction substantially perpendicular to the display panel. Electronic devices.

7. In any one of claims 1 to 6, The second conductive gasket presses the portion of the conductive layer and the first conductive gasket so that the conductive layer is electrically connected to the ground of the printed circuit board through the first conductive gasket. Electronic devices.

8. In any one of claims 1 to 7, The above portion of the above conductive layer is interposed between the first conductive gasket and the second conductive gasket, The second conductive gasket is configured to provide elasticity to the portion of the conductive layer in contact with the first conductive gasket. Electronic devices.

9. In any one of claims 1 to 8, The shielding member comprises a first non-conductive layer disposed on a first surface of the conductive layer and a second non-conductive layer disposed on a second surface of the conductive layer, A first opening is formed in the first non-conductive layer, The first conductive gasket is in contact with the conductive layer through the first opening of the first non-conductive layer, A second opening is formed in the second non-conductive layer, The second conductive gasket is in contact with the conductive layer through the second opening of the second non-conductive layer. Electronic devices.

10. In any one of claims 1 to 9, The material and / or size of the first conductive gasket and the second conductive gasket are different. Electronic devices.

11. In any one of claims 1 to 10, The length of the second conductive gasket is greater than the length of the first conductive gasket, The lengths of the first conductive gasket and the second conductive gasket are based on a direction substantially perpendicular to the bracket. Electronic devices.

12. In any one of claims 1 to 11, The gap between the above bracket and the shielding member has a first length, The above second challenging gasket has a second length greater than the first length, The first length and the second length are based on a direction substantially perpendicular to the bracket. Electronic devices.

13. In any one of claims 1 to 12, The above first conductive gasket or the above second conductive gasket: challenge tape; challenge fabric; Challenge Form; A foam surrounded by a challenging material; or Comprising a conductive foam surrounded by a conductive material, Electronic devices.

14. In any one of claims 1 to 13, The above bracket includes a challenging part, The second conductive gasket is disposed between the conductive part of the bracket and the conductive layer, and electrically connects the conductive layer to the conductive part of the bracket. Electronic devices.

15. In any one of claims 1 to 7, A fourth conductive gasket disposed between the printed circuit board and the bracket, positioned outside the conductive layer, and electrically connecting the ground of the printed circuit board to the bracket; or A fifth conductive gasket is disposed between the conductive layer and the printed circuit board and is spaced apart from the first conductive gasket; The fifth conductive gasket is in contact with another portion of the conductive layer and electrically connects the conductive layer to the ground of the printed circuit board. Electronic devices.

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