A waveguide component having a plurality of layers

Abstract

A waveguide component having a plurality of layers comprises a first spacer layer with a through hole, a first protrusion layer with a through hole and a first vane projecting structure, and a second spacer layer with a through hole. The first spacer layer, first protrusion layer, and second spacer layer are configured to be stacked such that the through holes align to form a folded waveguide, and the first vane projecting structure is configured to project into the folded waveguide.

Description

[0001] A WAVEGUIDE COMPONENT HAVING A PLURALITY OF LAYERS

[0002] Field

[0003] The technology relates to the field of high-frequency waveguide components, specifically waveguide components having a plurality of layers used in various applications such as radar systems, telecommunications, satellites, automotive radar, microwave devices, wireless communication, and Internet of Things (loT) devices. These components are designed to transmit and guide high-frequency signals efficiently and with minimal loss, while maintaining a compact footprint and offering design flexibility.

[0004] Folded waveguides have emerged as an attractive alternative to conventional rectangular waveguides due to their compact footprint and volume, offering nearly equivalent performance in a smaller form factor. This makes them particularly appealing for applications in compact system design, such as radar systems, telecommunications, satellite communications, automotive radar, microwave devices, wireless communication, and Internet of Things (loT) devices. A folded waveguide consists of a contiguous volume, either dielectric-filled or hollow, with a thin vane embedded within it, formed by folding a rectangular waveguide along one of its axes.

[0005] However, implementing folded waveguides at high frequencies (greater than 20 GHz) presents significant challenges due to mechanical, manufacturing, and electrical limitations. At high frequencies, the dimensions of folded waveguides, such as width and height, become extremely small, making accurate manufacturing difficult using conventional machining methods. Additionally, the tolerances required at high frequencies are significantly lower (typically less than 20 micrometers), adding further complexity to the manufacturing process.

[0006] The loss of hollow waveguide devices made using conventional machining techniques increases at high frequencies due to the large surface roughness created by the machining process. This affects the impedance of the device and may create impedance mismatch, leading to challenges in manufacturing thin vanes. Furthermore, manufacturing high-frequency folded waveguides requires the combination of multiple parts, which must be aligned with high precision (less than 50 micrometers). This adds complexity to the manufacturing process and makes it difficult to achieve the necessary precision in implementing high-frequency folded waveguides.

[0007] Existing solutions for implementing hollow folded waveguides typically involve one of the following approaches: (1) a pair of CNC milled metallic blocks, each comprising part of the waveguide, with a thin metallic vane inserted between them; (2) a pair of metallic blocks as before, but with an electronic circuit board as the vane; (3) embedding thin metal layers and dielectrics in integrated circuit back-end technologies; or (4) stacking multiple dielectrics with thin metallic layers between them. However, all of these existing solutions rely on the use of large, bulky metallic blocks or include lossy dielectric materials within the waveguide, which prevent such designs from being scaled to higher frequencies.

[0008] In summary, the prior art presents several challenges in implementing high-frequency folded waveguides, including difficulties in manufacturing thin vanes, achieving precise alignment of multiple parts, and maintaining low loss and impedance control. These challenges limit the applicability of folded waveguides in high-frequency applications and create a need for a new solution that enables the creation of folded waveguide structures at very high frequencies while overcoming the limitations of the prior art.

[0009] Summary

[0010] According to a first aspect of the disclosure, a waveguide component having a plurality of layers is provided. This component includes a first spacer layer having a first spacer layer through hole, a first protrusion layer having a first protrusion layer through hole and a first vane, and a second spacer layer having a second spacer layer through hole. The first spacer layer, first protrusion layer, and second spacer layer are configured to be stacked such that the first spacer layer through hole, the first protrusion layer through hole, and the second spacer layer through hole align to form a folded waveguide. The first vane is configured to project into the folded waveguide. This configuration allows for the creation of a compact, high-frequency waveguide with improved performance and reduced loss.

[0011] Optionally, the first vane is configured act as a reactive element within the folded waveguide.

[0012] Optionally in some examples, the waveguide component further includes a first boundary layer adjacent to the first spacer layer and a second boundary layer adjacent to the second spacer layer. The first boundary layer and the second boundary layer are configured to enclose the folded waveguide. This arrangement provides additional structural integrity and helps to prevent electromagnetic leakage from the waveguide.

[0013] Optionally in some examples, the first vane is self-supporting and mechanically rigid. This feature ensures the structural integrity of the waveguide and allows for the creation of high-frequency waveguides using industrial-grade processes.

[0014] Optionally in some examples, the first spacer layer, the first protrusion layer, and the second spacer layer extend in a plane parallel with a component layer plane. This arrangement allows for the creation of waveguides with a compact footprint and volume, making them suitable for compact system design.

[0015] Optionally in some examples, the first vane is parallel to or perpendicular to the component layer plane. This configuration provides additional design freedom, allowing for complex electromagnetic structures to be implemented.

[0016] Optionally in some examples, the component layer plane is perpendicular to or parallel with the waveguide's E field plane. This arrangement allows for the creation of impedance matching structures, filters, and antennas within the waveguide, providing additional functionality and control over the performance of the waveguide.

[0017] Optionally in some examples, the waveguide component further includes at least one second protrusion layer having at least one second protrusion layer through hole and at least one second vane configured to act as a reactive element within the folded waveguide. This feature allows for the creation of structures with an arbitrary number of vanes, providing complete control of the waveguide's operation.

[0018] Optionally in some examples, the second protrusion layer is adjacent to the first protrusion layer and the first vane and the second vane together form a single vane structure. This arrangement allows for the creation of high-frequency waveguides with reduced loss and lower impedance mismatch compared to conventional machining techniques.

[0019] Optionally in some examples, the second protrusion layer is separated from the first protrusion layer and the second vane forms a separate vane structure. This configuration provides additional design flexibility, allowing for the creation of complex electromagnetic structures within the waveguide.

[0020] Optionally in some examples, the waveguide component further includes alignment features configured to facilitate the precise alignment of the first spacer layer, the first protrusion layer, and the second spacer layer during the manufacturing process. These alignment features can include alignment holes configured to receive an alignment dowel for aligning the layers, or alignment holes configured for optical alignment by microscopy or a computer vision system for aligning the layers. This feature ensures the precise alignment of the multiple parts required for manufacturing high-frequency waveguides, improving the performance and reliability of the waveguide.

[0021] Optionally in some examples, the first vane comprises one or more vane holes configured to impose the required boundary conditions and operational mode within the folded waveguide or create additional reactive elements. This feature allows for the creation of impedance matching structures, filters, and antennas within the waveguide, providing additional functionality and control over the performance of the waveguide.

[0022] Optionally in some examples, the folded waveguide is configured to transmit and guide high-frequency signals along a waveguide component axis. This feature allows for the transmission and guiding of high-frequency signals, making the waveguide suitable for use in a variety of applications, including radar systems, telecommunications systems, satellite communication systems, automotive radar systems, microwave devices, wireless communication systems, and Internet of Things (loT) devices.

[0023] Optionally in some examples, the waveguide component further includes a second folded waveguide formed by a plurality of first spacer layer through holes, second spacer layer through holes, and first protrusion layer through holes in the first spacer layer, the second spacer layer, and the first protrusion layer. This feature allows for the creation of multiple waveguides within a single component, providing additional functionality and design flexibility.

[0024] Optionally in some examples, one or more of the first spacer layer, the first protrusion layer, the second spacer layer, the first boundary layer and the second boundary layer comprises an E-plane slot for radiating an electromagnetic signal. This feature allows for the realisation of radiating elements within the waveguide, providing additional functionality and control over the performance of the waveguide.

[0025] Optionally in some examples, one or more of the first spacer layer, the first protrusion layer, the second spacer layer, the first boundary layer and the second boundary layer comprises an H-plane slot for radiating an electromagnetic signal. This feature allows for the realisation of radiating elements within the waveguide, providing additional functionality and control over the performance of the waveguide.

[0026] Optionally in some examples, one or more of the first spacer layer, the first protrusion layer, the second spacer layer, the first boundary layer and the second boundary layer comprises a plurality of corrugations, holes or a periodic patterned structure configured to prevent signal leakage from the waveguide component. This feature ensures efficient transmission and reduces impedance mismatch, improving the performance and reliability of the waveguide.

[0027] According to a second aspect of the disclosure, a method of manufacturing a waveguide component having a plurality of layers is provided. This method includes processing individual layers including a first spacer layer having a first spacer layer through hole, a first protrusion layer having a first protrusion layer through hole and a first vane, and a second spacer layer having a second spacer layer through hole. The first spacer layer, the first protrusion layer, and the second spacer layer are aligned using alignment features such that the first spacer layer through hole, the first protrusion layer through hole, and the second spacer layer through hole form a folded waveguide and the first vane is configured to project into the folded waveguide. The first spacer layer, the first protrusion layer, and the second spacer layer are then joined together to form the waveguide component. This method simplifies the manufacturing process and allows for the creation of high-frequency waveguides using industrialgrade processes.

[0028] Optionally in some examples, the method further includes processing a first boundary layer and a second boundary layer and aligning and joining the first boundary layer and the second boundary layer adjacent to the first spacer layer and the second spacer layer, respectively, to enclose the folded waveguide. This step provides additional structural integrity and helps to prevent electromagnetic leakage from the waveguide.

[0029] Optionally in some examples, the method further includes processing a second protrusion layer having a second protrusion layer through hole and a second vane configured to act as a reactive element within the folded waveguide, and aligning and joining the second protrusion layer with the first protrusion layer. This step allows for the creation of structures with an arbitrary number of vanes, providing complete control of the waveguide's operation.

[0030] Optionally in some examples the method further comprising singulating individual waveguide components from a larger multilayer structure using one or more singulation methods such as cutting, dicing, or drilling.

[0031] Optionally at least one of the first spacer layer, the first protrusion layer, and the second spacer layer comprises a semiconductor-grade silicon or glass wafer.

[0032] Optionally at least one of the first spacer layer, the first protrusion layer, and the second spacer layer has a surface roughness of 50-250 nm on mating faces.

[0033] Optionally the folded waveguide has dimensional tolerances of 0.1-2 pm. Optionally the first vane has a thickness of 0.1-100 pm and a tolerance of 0.1-2 pm.

[0034] Optionally the first spacer layer, the first protrusion layer, and the second spacer layer are patterned using a combination of lithography and etching.

[0035] Optionally the first spacer layer, the first protrusion layer, and the second spacer layer are joined using a wafer bonding technique selected from the group consisting of thermocompression bonding, anodic bonding, adhesive bonding, and hybrid bonding.

[0036] Optionally inner surfaces of the folded waveguide are coated with a conductive material selected from the group consisting of gold, silver, copper, aluminium, nickel, titanium, palladium, platinum, tungsten and iridium, the coating being applied either pre- or post-bonding.

[0037] Optionally at least one of the first spacer layer, the first protrusion layer, and the second spacer layer is a pre-assembled wafer comprising at least two bonded wafers that are subsequently patterned.

[0038] Optionally the pre-assembled wafer comprises a silicon-on-insulator wafer having a second silicon layer with a thickness of 0.1-100 pm.

[0039] Optionally the first spacer layer, the first protrusion layer, and the second spacer layer are aligned with an accuracy of less than 10 pm using precision wafer bonding tools and processes.

[0040] Optionally the etching comprises deep reactive ion etching, cryogenic etching, laser cutting, and wet chemical etching or a combination thereof.

[0041] Optionally the sidewalls formed from etching the layers have a roughness of 10 nm to 100 nm.

[0042] Optionally the component comprises multiple pre-assembled wafers in combination with at least one standard wafer. Optionally the multiple vane structures are formed using at least one pre-assembled wafer.

[0043] Optionally, the first spacer layer or the second spacer layer is assembled to the second protrusion layer before the second protrusion layer is assembled the other of the second spacer layer and the first spacer layer.

[0044] Optionally the first spacer layer, the first protrusion layer and the second spacer layer comprise a conductive coating.

[0045] Optionally the first spacer layer or the second spacer layer is assembled to the first protrusion layer before the first protrusion layer is assembled the other of the second spacer layer and the first spacer layer.

[0046] Brief Description of the Drawings

[0047] Examples are described in more detail below with reference to the appended drawings. Figure 1 is a cross-section diagram of an example of a waveguide component having a plurality of layers with a folded waveguide in an H-plane configuration.

[0048] Figure 2 is a perspective view of a waveguide component according to an example.

[0049] Figure 3a-3h are cross-section diagrams of various examples of waveguide components with folded waveguides in H-plane configurations.

[0050] Figure 4a-4e are cross-section diagrams of various examples of waveguide components with folded waveguides in E-plane configurations.

[0051] Figure 5a and 5b are plan views of vanes in layers of waveguide components with folded waveguides according to examples.

[0052] Figure 6 is a cross-section diagram of an example of a waveguide component with a plurality of folded waveguides in an H-plane configuration.

[0053] Figure 7 is a cross-section diagram of an example of a waveguide component with a folded waveguide and an alignment feature.

[0054] Detailed Description The detailed description set forth below provides information and examples of the disclosed technology with sufficient detail to enable those skilled in the art to practise the disclosure.

[0055] Figure 1 illustrates a cross-section of exemplary embodiment of a waveguide component 100 having a plurality of layers. Hereinafter the term waveguide component 100 will be used for conciseness, but all the waveguide components 100 discussed herein comprises a multilayered structure e.g. the waveguide components have a plurality of layers. Figure 2 illustrates another exemplary embodiment of the waveguide component 100 as shown in Figure 1 extending along a waveguide component axis 126. The waveguide component 100 is designed to guide high- frequency signals along a waveguide component axis 126. The waveguide component 100 is composed of multiple layers, including a first spacer layer 110, a first protrusion layer 108, and a second spacer layer 112. These layers are stacked in a direction perpendicular to a component layer plane 130. Each of these layers extends in a plane parallel to the component layer plane 130. The waveguide component 100 can be formed from a variety of materials, including conductive materials or materials coated with conductive materials. The specific materials used can be selected based on their desired electrical and mechanical properties. Examples of materials are discussed in more detail below.

[0056] In the context of waveguides, the term electric field plane (also known as E Plane) refers to one of the two principal planes in the waveguide component 100 where the electric field is oriented perpendicular to the direction of wave propagation. Figure 2 shows the electric field plane 122 of the waveguide component 100 and an example of the direction of propagation is shown as along the waveguide component axis 126. The orientation of the electric field plane 122 of the waveguide component 100 is significant in the design and operation of waveguide component 100, as it influences the propagation characteristics of the electromagnetic waves within the waveguide component 100. For instance, in the waveguide component 100, the electric field plane 122 of the waveguide component 100 can be parallel or perpendicular to the component layer plane 130, depending on the configuration of the waveguide component 100. This flexibility in the orientation of the electric field plane 122 of the waveguide component 100 allows for the realisation of a diverse range of waveguide designs and functionalities, contributing to the versatility and adaptability of the waveguide component 100.

[0057] Similarly, the term magnetic field plane (also known as H Plane) "H field plane" refers to one of the two principal planes in the waveguide component 100 where the magnetic field is oriented parallel to the direction of wave propagation. Figure 2 shows the magnetic field plane 124 of the waveguide component 100 and an example of the direction of propagation is shown as along the waveguide component axis 126. The orientation of the magnetic field plane 124 of the waveguide component 100 can significantly influence the performance of the waveguide component 100, including its impedance, bandwidth, and power handling capabilities. Therefore, the orientation of the H field plane is a design consideration in the manufacturing process of the waveguide component 100.

[0058] In one implementation as shown in e.g. Figure 1 , the waveguide component 100 having a plurality of layers includes a first spacer layer 110 that has a first spacer layer through hole 116. The first spacer layer 110 is configured to be stacked with the first protrusion layer 108 and the second spacer layer 112. The first spacer layer 110, the first protrusion layer 108, and the second spacer layer 112 are aligned such that the first spacer layer through hole 116, a first protrusion layer through hole 120 in the first protrusion layer 108, and a second spacer layer through hole 118 in the second spacer layer 112 align to form a folded waveguide 106.

[0059] The folded waveguide 106 is a volume within the waveguide component 100 that is used for transmitting and guiding high-frequency signals.

[0060] Turning back to Figure 1 , the waveguide component 100 will be discussed in more detail. In some implementations, the waveguide component 100 includes a first boundary layer 102. The first boundary layer 102 is one of the outer layers of the waveguide component 100 and the first boundary layer 102 is adjacent to the first spacer layer 110. The first boundary layer 102 is configured to enclose the folded waveguide 106. The first boundary layer 102 can be formed from a variety of materials, including conductive materials or materials coated with conductive materials, discussed in more detail below. The specific materials used for the first boundary layer 102 can be selected based on their desired electrical and mechanical properties. The first boundary layer 102 can also include a first boundary layer H plane slot 154 (best shown in Figure 3f). The first boundary layer H plane slot 154 is a slot in the perimeter of the folded waveguide 106 that is configured to allow radiating elements to be realised.

[0061] In some implementations, the waveguide component 100 includes a second boundary layer 104. The second boundary layer 104 is one of the outer layers of the waveguide component 100. The second boundary layer 104 is adjacent to the second spacer layer 112. The second boundary layer 104 is configured to enclose the folded waveguide 106. The second boundary layer 104 can be formed from a variety of materials, including conductive materials or materials coated with conductive materials, discussed in more detail below. The specific materials used for the second boundary layer 104 can be selected based on their desired electrical and mechanical properties. The second boundary layer 104 can also include a second boundary layer H plane slot 156 (best shown in Figure 3f). The second boundary layer H plane slot 156 is a slot in the perimeter of the folded waveguide 106 that is configured to allow radiating elements to be realised.

[0062] The waveguide component 100 includes a folded waveguide 106. The folded waveguide 106 is a volume within the waveguide component 100 that is used for transmitting and guiding high-frequency signals. The folded waveguide 106 is formed when the first spacer layer 110, the first protrusion layer 108, and the second spacer layer 112 are stacked together such that the first spacer layer through hole 116, the first protrusion layer through hole 120, and the second spacer layer through hole 118 align. The folded waveguide 106 can be generally parallel to the component layer plane 130 or generally perpendicular to the component layer plane 130. The folded waveguide 106 can also have a thin first vane 114 embedded within it. The first vane 114 is configured to project into the folded waveguide 106. The folded waveguide 106 comprises at least a first part and a second part and at least a portion of the first part and the second part of the folded waveguide 106 overlap. For example, as shown in Figure 1 , the first part of the folded waveguide 106 is located in the first spacer layer 110 and the second part of the folded waveguide 106 is located in the second spacer layer 112. The first part and the second part of the folded waveguide 106 are located either side of the first vane 114. The first vane 114 separates the folded waveguide 106 and allows for the compact arrangement of the folded waveguide 106.

[0063] The folded waveguide 106 as mentioned above is distinct from merely folding a substrate to create a cavity. In particular, a separate and distinct first vane 114 structure within the folded waveguide 106 is provided. This first vane 114 is not formed by bending the substrate, but is a separate element, positioned between and structurally distinct from the first spacer layer 110 and the second spacer layer 112, which define the waveguide walls. The first vane 114 is arranged to set the boundary condition for the electric field within the device. Proper selection of the waveguide width / height and vane width / thickness along with this boundary condition create a TE10 operational mode similar to that of a standard rectangular waveguide but with a reduce device width. In some examples, the waveguide component 100 comprises the standard rectangular waveguide dimensions: a x b wherein nominal folded waveguide dimensions are a / 2 x 2b.

[0064] Optionally, the first vane 114 is configured to act as a reactive element within the folded waveguide 106. In some other examples, the first vane 114 is not configured to act as a reactive element. Instead, the first vane 114 is configured to project into the folded waveguide 106 and separate the folded waveguide 106 into two parts. In this case, the first vane 114 may be configured to enforce the required boundary conditions for the folded waveguide 106 without being a reactive element within the folded waveguide 106.

[0065] The first vane 114 (and other vanes mentioned below) is configured to function as a reactive element within the folded waveguide 106. This reactive element provides precise impedance control and ensures the waveguide operates in the desired mode, such as the TE10 mode, over the specified frequency range. Specifically, the vane 114, by virtue of its dimensions and placement, presents a capacitive or inductive impedance and I or creates boundary conditions that suppress unwanted modes, etc. The first vane 114 provides an impact on impedance matching, showing a return loss improvement compared to a similar structure without the vane. Furthermore, the first vane 114 may selectively suppress higher-order modes, ensuring single-mode operation within a desired bandwidth of e.g. 30GHz - 60GHz. In some implementations, the waveguide component 100 includes a first protrusion layer 108. The first protrusion layer 108 includes a first protrusion layer through hole 120 and a first vane 114. The first protrusion layer 108 is configured to be stacked with the first spacer layer 110 and the second spacer layer 112. The first protrusion layer through hole 120 aligns with the first spacer layer through hole 116 and the second spacer layer through hole 118 to form the folded waveguide 106. The first vane 114 is configured to act as a reactive element within the folded waveguide 106. The first vane 114 can be parallel to the component layer plane 130 or perpendicular to the component layer plane 130. The first vane 114 is self-supporting and mechanically rigid, ensuring the structural integrity of the folded waveguide 106.

[0066] In some examples, the waveguide component 100 includes optional non-through- going holes. These optional non-through-going holes can be provided in the first spacer layer 110, the first protrusion layer 108, and the second spacer layer 112. The optional non-through going holes allow for the creation of impedance matching structures, filters, and antennas with great flexibility. The optional non-through-going holes can be patterned arbitrarily to form series and shunt reactive elements within the waveguide, allowing a diverse range of frequency responses to be realised. The optional non-through-going holes can be formed using a variety of manufacturing techniques, such as drilling, etching, or laser cutting, depending on the chosen materials and desired features for each hole.

[0067] In one implementation, the waveguide component 100 includes a first spacer layer 110. The first spacer layer 110 includes a first spacer layer through hole 116. The first spacer layer 110 is configured to be stacked with the first protrusion layer 108 and the second spacer layer 112. The first spacer layer through hole 116 aligns with the first protrusion layer through hole 120 and the second spacer layer through hole 118 to form the folded waveguide 106. The first spacer layer 110 can also include optional non-through going holes, a first spacer layer E plane slot 132 (best shown in Figure 3e), first spacer layer stubs 158 (best shown in Figure 3g), first spacer layer corrugations 162 (best shown in Figure 3h), and a first spacer layer H plane slot 168 (best shown in Figure 4d). These features can be provided in the first spacer layer 110 to allow for the realisation of radiating elements within the waveguide, to form series and shunt reactive elements within the waveguide, to prevent EM leakage from the folded waveguide 106, and to allow for the creation of impedance matching structures, filters, and antennas with great flexibility.

[0068] In one implementation, the waveguide component 100 includes a second spacer layer 112. The second spacer layer 112 is one of the layers that make up the waveguide component 100. The second spacer layer 112 includes a second spacer layer through hole 118. The second spacer layer 112 is configured to be stacked with the first spacer layer 110 and the first protrusion layer 108. The second spacer layer through hole 118 aligns with the first spacer layer through hole 116 and the first protrusion layer through hole 120 to form the folded waveguide 106. The second spacer layer 112 can also include optional non-through-going holes, second spacer layer stubs 160, and second spacer layer corrugations 164. These features can be provided in the second spacer layer 112 to allow for the realisation of radiating elements within the waveguide, to form series and shunt reactive elements within the waveguide, to prevent EM leakage from the folded waveguide 106, and to allow for the creation of impedance matching structures, filters, and antennas with great flexibility.

[0069] In some implementations, the waveguide component 100 includes a first vane 114. The first vane 114 is a structure that is embedded within the folded waveguide 106. The first vane 114 is configured to act as a reactive element within the folded waveguide 106. The first vane 114 can be parallel to the component layer plane 130 or perpendicular to the component layer plane 130. The first vane 114 is self- supporting and mechanically rigid, ensuring the structural integrity of the folded waveguide 106. The first vane 114 can be formed from a variety of materials, including conductive materials or materials coated with conductive materials, discussed in more detail below. The specific materials used for the first vane 114 can be selected based on their desired electrical and mechanical properties. The first vane 114 can also include vane holes 128. These vane holes 128 are configured to impose the required boundary conditions and operational mode within the folded waveguide 106 or create additional reactive elements.

[0070] In one example, the first spacer layer 110 of the waveguide component 100 includes a first spacer layer through hole 116. The first spacer layer through hole 116 is a hole that is formed in the first spacer layer 110. The first spacer layer through hole 116 aligns with the first protrusion layer through hole 120 and the second spacer layer through hole 118 to form the folded waveguide 106.

[0071] Similarly, the second spacer layer 112 of the waveguide component 100 includes a second spacer layer through hole 118. The second spacer layer through hole 118 is a hole that is formed in the second spacer layer 112. The second spacer layer through hole 118 aligns with the first spacer layer through hole 116 and the first protrusion layer through hole 120 to form the folded waveguide 106.

[0072] Likewise, the first protrusion layer 108 of the waveguide component 100 includes a first protrusion layer through hole 120. The first protrusion layer through hole 120 is a hole that is formed in the first protrusion layer 108. The first protrusion layer through hole 120 aligns with the first spacer layer through hole 116 and the second spacer layer through hole 118 to form the folded waveguide 106.

[0073] The first spacer layer through hole 116, the second spacer layer through hole 118, and the first protrusion layer through hole 120 can be formed using a variety of manufacturing techniques, such as drilling, etching, or laser cutting, depending on the chosen materials and desired features for the first spacer layer through hole 116, the second spacer layer through hole 118, and the first protrusion layer through hole 120. The first spacer layer through hole 116, the second spacer layer through hole 118, and the first protrusion layer through hole 120 can be of any arbitrary shape and size, depending on the desired characteristics of the folded waveguide 106.

[0074] In some examples, the waveguide component 100 optionally includes alignment holes. The alignment holes are holes that are formed in the layers of the waveguide component 100. The alignment holes are used to facilitate the precise alignment of the first spacer layer 110, the first protrusion layer 108, and the second spacer layer 112 during the manufacturing process. The alignment holes can be formed using a variety of manufacturing techniques, such as drilling, etching, or laser cutting, depending on the chosen materials and desired features for the holes. The alignment holes can be of any arbitrary shape and size, depending on the desired precision of the alignment. The dimensions of the waveguide component 100 can vary depending on the specific application. For example, in some non-limiting examples the thickness of the waveguide component 100 can range from 0.1 mm to 0.5 mm, the width can range from 1 mm to 10 mm, and the length can range from 10 mm to 100 mm. The number of layers in the waveguide component 100 can vary in number. For example, as shown in Figure 1 , there is shown the first spacer layer 110, the first protrusion layer 108 and the second spacer layer 112 range. However, there can be any suitable number of first and second spacer layers 110, 112 and any number of first protrusion layers 108. This means that the folded waveguide 106 can be formed from any number of stacked layers.

[0075] For example, in some non-limiting examples the diameter of the holes in the layers, such as the first spacer layer through hole 116, the first protrusion layer through hole 120, and the second spacer layer through hole 118, can range from 0.1 mm to 1 mm. The width of any slots in the layers can also range from 0.1 mm to 1 mm. The thickness of the first vane 114 can be less than 0.5 mm. The precision of the alignment of the layers can be less than 50 urn, and the surface roughness can be less than 20 urn. The waveguide component 100 can be designed to operate at frequencies greater than 20 GHz.

[0076] The waveguide component 100 is designed to operate at high frequencies, typically greater than 20 GHz. This makes it suitable for a variety of high-frequency applications, including radar systems, telecommunications, satellite communications, automotive radar, microwave devices, wireless communication, and Internet of Things (loT) devices. The high-frequency operation of the waveguide component 100 is facilitated by the design of the folded waveguide 106, which is configured to guide the transmission of high-frequency signals along the waveguide component axis 126.

[0077] The waveguide component 100 can be designed to operate over a wide frequency range, providing wideband operation. This is achieved through the design of the folded waveguide 106 and the reactive elements within it, such as the first vane 114 and the second vane 144 as discussed below. These reactive elements can be configured to provide the required boundary conditions and operational mode for the folded waveguide 106 over the desired frequency range. In some implementations, the waveguide component 100 may also include impedance matching structures, filters, and antennas that are designed to operate at the same high frequencies. These additional components can be integrated into the waveguide component 100 with great flexibility, allowing for the creation of complex electromagnetic structures with a diverse range of frequency responses.

[0078] The ability to operate at high frequencies and to integrate additional high-frequency components makes the waveguide component 100 a versatile and powerful tool for high-frequency applications. It provides improved performance, reduced loss, and compact design compared to conventional waveguide components, making it an attractive solution for a wide range of high-frequency systems.

[0079] Turning to Figures 3a to 3h, various alternative examples of the waveguide component 100 will now be discussed in more detail. Figures 3a-3h show cross-section diagrams of various examples of waveguide components having a plurality of layers 100 with folded waveguides 106 in H-plane configurations.

[0080] Figure 3a illustrates an exemplary embodiment of a second protrusion layer 136 of the waveguide component 100. In Figure 3a, the second protrusion layer 136 together with the first protrusion layer 108 forms the first vane 114. In this way the second protrusion layer 136 and the first protrusion layer 108 are adjacent layers.

[0081] The second protrusion layer 136 includes a second protrusion layer through hole 146 and a second vane 144. The second protrusion layer 136 is configured to be stacked with the first spacer layer 110, the first protrusion layer 108, and the second spacer layer 112. The second protrusion layer through hole 146 aligns with the first spacer layer through hole 116, the first protrusion layer through hole 120, and the second spacer layer through hole 118 to form the first vane 114 and the folded waveguide 106.

[0082] Figure 3b illustrates an exemplary embodiment of a second spacer layer shoulder 152 of the waveguide component 100. The second spacer layer shoulder 152 is a feature of the second spacer layer 112. The second spacer layer shoulder 152 is offset from the first spacer layer 110 and projects into the folded waveguide 106. The second spacer layer shoulder 152 can be formed using a variety of manufacturing techniques, such as drilling, etching, or laser cutting, depending on the chosen materials and desired features for the shoulder. The second spacer layer shoulder 152 can be of any arbitrary shape and size, depending on the desired characteristics of the folded waveguide 106.

[0083] Figure 3c illustrates an exemplary embodiment of a second protrusion layer through hole 146 and a second vane 144 of the waveguide component 100. The second protrusion layer through hole 146 is a hole that is formed in the second protrusion layer 136. The second protrusion layer through hole 146 aligns with the first spacer layer through hole 116, the first protrusion layer through hole 120, and the second spacer layer through hole 118 to form the folded waveguide 106.

[0084] Alternative, to the arrangement as shown in Figure 3a, the second protrusion layer 136 is spaced from the first protrusion layer 108 by e.g. the third spacer layer 140. Accordingly, the second protrusion layer 136 defines a second vane 144.

[0085] The second vane 144 is configured to act as a reactive element within the folded waveguide 106, similar to the first vane 114. The second vane 144 can be parallel to the component layer plane 130 or perpendicular to the component layer plane 130. The second vane 144 is self-supporting and mechanically rigid, ensuring the structural integrity of the folded waveguide 106. The second vane 144 can be formed from a variety of materials, including conductive materials or materials coated with conductive materials, discussed in more detail below. The specific materials used for the second vane 144 can be selected based on their desired electrical and mechanical properties. The second vane 144 can also include vane holes 128. These vane holes 128 are configured to impose the required boundary conditions and operational mode within the folded waveguide 106 or create additional reactive elements.

[0086] The second protrusion layer through hole 146 can be formed using a variety of manufacturing techniques, such as drilling, etching, or laser cutting, depending on the chosen materials and desired features for the hole. The second protrusion layer through hole 146 can be of any arbitrary shape and size, depending on the desired characteristics of the folded waveguide 106. Figure 3c also illustrates an exemplary embodiment of a third protrusion layer 138 and a third vane 148 of the waveguide component 100. The third protrusion layer 138 is another layer that makes up the waveguide component 100. The third protrusion layer 138 includes a third protrusion layer through hole 150 and a third vane 148.

[0087] The third protrusion layer 138 is configured to be stacked with the first spacer layer 110, the first protrusion layer 108, the second spacer layer 112, and the second protrusion layer 136. The third protrusion layer through hole 150 aligns with the first spacer layer through hole 116, the first protrusion layer through hole 120, the second spacer layer through hole 118, and the second protrusion layer through hole 146 to form the folded waveguide 106. The third vane 148 is configured to act as a reactive element within the folded waveguide 106. The third vane 148 can be parallel to the component layer plane 130 or perpendicular to the component layer plane 130. The third vane 148 is self-supporting and mechanically rigid, ensuring the structural integrity of the folded waveguide 106.

[0088] The third vane 148 can be formed from a variety of materials, discussed in more detail below. The specific materials used for the third vane 148 can be selected based on their desired electrical and mechanical properties. The third vane 148 can also include vane holes 128. These vane holes 128 are configured to impose the required boundary conditions and operational mode within the folded waveguide 106 or create additional reactive elements.

[0089] Figure 3c further illustrates an exemplary embodiment of a third spacer layer 140 and a fourth spacer layer 142 of the waveguide component 100. The third spacer layer 140 is positioned between the second protrusion layer 136 and the first protrusion layer 108. The fourth spacer layer 142 is positioned between the third protrusion layer 138 and the first protrusion layer 108. Both the third spacer layer 140 and the fourth spacer layer 142 are part of the layers that make up the waveguide component 100. They are configured to be stacked with the other layers to form the folded waveguide 106. The third spacer layer 140 and the fourth spacer layer 142 can be formed from a variety of materials, discussed in more detail below. The specific materials used for the third spacer layer 140 and the fourth spacer layer 142 can be selected based on their desired electrical and mechanical properties.

[0090] Figure 3c shows an example of a waveguide component 100 with a folded waveguide 106 with a plurality of vanes 114, 144, 148. In other examples there can be any number of protruding layers, spacer layers and vanes. In some examples there can be e.g. 2 vanes, 4 vanes, 5 vanes or any other number of vanes as required.

[0091] Figure 3d illustrates an exemplary embodiment of a protrusion layer E plane slot 134 of the waveguide component 100. The protrusion layer E plane slot 134 is a slot that is formed in the perimeter of the folded waveguide 106. The protrusion layer E plane slot 134 is configured to allow radiating elements to be realised within the waveguide. The protrusion layer E plane slot 134 can be provided in the first protrusion layer 108 if the first vane 114 is parallel to the component layer plane 130. The protrusion layer E plane slot 134 can be formed using a variety of manufacturing techniques, such as drilling, etching, or laser cutting, depending on the chosen materials and desired features for the slot. The protrusion layer E plane slot 134 can be of any arbitrary shape and size, depending on the desired characteristics of the folded waveguide 106.

[0092] Figure 3e illustrates an exemplary embodiment of a first spacer layer E plane slot 132 of the waveguide component 100. The first spacer layer E plane slot 132 is a slot that is formed in the perimeter of the folded waveguide 106. The first spacer layer E plane slot 132 is configured to allow radiating elements to be realised within the waveguide. The first spacer layer E plane slot 132 can be provided in the first spacer layer 110 if the first vane 114 is parallel to the component layer plane 130. The first spacer layer E plane slot 132 can be formed using a variety of manufacturing techniques similar to those previously discussed in reference to Figure 3d. The first spacer layer E plane slot 132 can be of any arbitrary shape and size, depending on the desired characteristics of the folded waveguide 106.

[0093] Figure 3f illustrates exemplary embodiments of a first boundary layer H plane slot 154 and a second boundary layer H plane slot 156 of the waveguide component 100. The first boundary layer H plane slot 154 and the second boundary layer H plane slot 156 are slots that are formed in the perimeter of the folded waveguide 106. The first boundary layer H plane slot 154 and the second boundary layer H plane slot 156 are configured to allow radiating elements to be realised within the waveguide. The first boundary layer H plane slot 154 can be provided in the first boundary layer 102 if the first vane 114 is parallel to the component layer plane 130. The second boundary layer H plane slot 156 can be provided in the second boundary layer 104 if the first vane 114 is parallel to the component layer plane 130. The first boundary layer H plane slot 154 and the second boundary layer H plane slot 156 can be formed using a variety of manufacturing techniques similar to those previously discussed in reference to Figure 3d. The first boundary layer H plane slot 154 and the second boundary layer H plane slot 156 can be of any arbitrary shape and size, depending on the desired characteristics of the folded waveguide 106.

[0094] Figure 3g illustrates exemplary embodiments of a first spacer layer stubs 158 and second spacer layer stubs 160 of the waveguide component 100. The first spacer layer stubs 158 and the second spacer layer stubs 160 are structures that project into the folded waveguide 106. These stubs are patterned arbitrarily to form series and shunt reactive elements within the folded waveguide 106, allowing a diverse range of frequency responses to be realised. The first spacer layer stubs 158 and the second spacer layer stubs 160 can be formed using a variety of manufacturing techniques similar to those previously discussed in reference to Figure 3d. The first spacer layer stubs 158 and the second spacer layer stubs 160 can be of any arbitrary shape and size, depending on the desired characteristics of the folded waveguide 106.

[0095] Figure 3h illustrates exemplary embodiments of a first spacer layer corrugations 162 and second spacer layer corrugations 164 of the waveguide component 100. The first spacer layer corrugations 162 and the second spacer layer corrugations 164 are patterns, holes, or ridges that are distributed across the first spacer layer 110 and the second spacer layer 112. These corrugations are configured to prevent electromagnetic (EM) leakage from the folded waveguide 106. The first spacer layer corrugations 162 and the second spacer layer corrugations 164 can be formed using a variety of manufacturing techniques similar to those previously discussed in reference to Figure 3d. The first spacer layer corrugations 162 and the second spacer layer corrugations 164 can be of any arbitrary shape and size, depending on the desired characteristics of the folded waveguide 106. Whilst reference may be made to corrugations 162, 164, alternative structures can be provided. For example additionally, or alternatively, a plurality of holes or a patterned periodic structure can be provided in one or more layers of the waveguide component 100 to provide a similar effect.

[0096] Figure 4a illustrates an exemplary embodiment of the waveguide component 100. In this embodiment, the waveguide component 100 includes a first boundary layer 102, a first spacer layer 110, a first protrusion layer 108, a second spacer layer 112, and a second boundary layer 104 similar to the arrangement previously discussed. However, these layers are stacked in a direction perpendicular to a component layer plane 130. Each of these layers extends in a plane parallel to the component layer plane 130.

[0097] Figure 4b illustrates an exemplary embodiment of a first boundary layer E plane slot 166 of the waveguide component 100. The first boundary layer E plane slot 166 is a slot that is formed in the perimeter of the folded waveguide 106. The first boundary layer E plane slot 166 is configured to allow radiating elements to be realised within the waveguide. The first boundary layer E plane slot 166 can be provided in the first boundary layer 102 if the first vane 114 is perpendicular to the component layer plane 130. The first boundary layer E plane slot 166 can be formed using a variety of manufacturing techniques, similar to those previously discussed in reference to Figure 3d. The first boundary layer E plane slot 166 can be of any arbitrary shape and size, depending on the desired characteristics of the folded waveguide 106.

[0098] Figure 4c illustrates an exemplary embodiment of the waveguide component 100. In this embodiment, the waveguide component 100 includes a first boundary layer 102, a first spacer layer 110, a first protrusion layer 108, a second spacer layer 112, and a second boundary layer 104. These layers are stacked in a direction perpendicular to a component layer plane 130. Each of these layers extends in a plane parallel to the component layer plane 130.

[0099] Figure 4c also shows a plurality of vanes 114, 144, 148. In particular, the first vane 114, the second vane 144, and the third vane 148 extend in a direction perpendicular to the component layer plane 130. This is in contrast to the arrangement as shown in Figure 3c.

[0100] Figure 4d illustrates an exemplary embodiment of a first spacer layer H plane slot 168 of the waveguide component 100. The first spacer layer H plane slot 168 is a slot that is formed in the perimeter of the folded waveguide 106. The first spacer layer H plane slot 168 is configured to allow radiating elements to be realised within the waveguide. The first spacer layer H plane slot 168 can be provided in the first spacer layer 110 if the first vane 114 is perpendicular to the component layer plane 130. The first spacer layer H plane slot 168 can be of any arbitrary shape and size, depending on the desired characteristics of the folded waveguide 106.

[0101] Figure 4e illustrates an exemplary embodiment of the waveguide component 100. In this embodiment, the waveguide component 100 includes a first boundary layer 102, a first spacer layer 110, a first protrusion layer 108, a second spacer layer 112, and a second boundary layer 104. These layers are stacked in a direction perpendicular to a component layer plane 130. Furthermore the first spacer layer 110 comprises first spacer layer corrugations 162 . These are similar to the first spacer layer corrugations 162 as previously discussed in reference to Figure 3h.

[0102] Each of these layers extends in a plane parallel to the component layer plane 130. The waveguide component 100 can be formed from a variety of materials, as discussed below. The specific materials used can be selected based on their desired electrical and mechanical properties. The waveguide component 100 includes a variety of features, such as through holes, vanes, slots, stubs, corrugations, and alignment features 172, that are designed to facilitate the transmission and guiding of high- frequency signals, prevent EM leakage, and ensure the precise alignment of the layers during the manufacturing process.

[0103] Figure 5a illustrates an exemplary embodiment of vane holes 128 in the first vane 114 of the waveguide component 100. The vane holes 128 are holes that are formed in the first vane 114. The vane holes 128 are configured to impose the required boundary conditions and operational mode within the folded waveguide 106 or create additional reactive elements. The vane holes 128 can be formed using a variety of manufacturing techniques, similar to those previously discussed in reference to Figure 3d. The vane holes 128 can be of any arbitrary shape and size, depending on the desired characteristics of the folded waveguide 106. As shown in Figure 5a, the folded waveguide 106 extends along a straight component axis 126.

[0104] Figure 5b illustrates another exemplary embodiment of the waveguide component 100 wherein the first vane 114 has vane holes 128. In contrast to the arrangement as shown in Figure 5a, the folded waveguide 106 optionally extends along a curved waveguide component axis 126. The waveguide component axis 126 and extend along any suitable curved, straight, non-linear path as required.

[0105] Figure 6 illustrates an exemplary embodiment of a second folded waveguide 170 in the waveguide component 100. The second folded waveguide 170 is another waveguide that is formed by folding a rectangular waveguide along one of its axes, allowing the transmission and guiding of high-frequency signals. The second folded waveguide 170 is formed when a plurality of first spacer layer through holes 116, second spacer layer through holes 118, and first protrusion layer through holes 120 in the first spacer layer 110, the second spacer layer 112, and the first protrusion layer 108 align to form the second folded waveguide 170. The second folded waveguide 170 can be generally parallel to the component layer plane 130 or generally perpendicular to the component layer plane 130. The second folded waveguide 170 can be formed from a variety of materials, as discussed below.

[0106] Figure 6 shows the waveguide component 100 with a second folded waveguide 170. In other examples there can be a plurality of folded waveguides 106, 170 in the waveguide component 100. Indeed, there can be any suitable number of folded waveguides 106 e.g. 3, 4, 5 etc folded waveguides 106.

[0107] Figure 7 illustrates an exemplary embodiment of alignment features 172 and an alignment dowel 174 in the waveguide component 100. The alignment features 172 are features that are incorporated into the layers of the waveguide component 100 to facilitate the precise alignment of the layers during the manufacturing process. The alignment features 172 can include alignment holes, markers, grooves, or notches, depending on the desired precision of the alignment. The alignment dowel 174 is a tool that is used to align the layers of the waveguide component 100 during the manufacturing process. The alignment dowel 174 can be inserted into the alignment holes to ensure the precise alignment of the layers.

[0108] In one example, the alignment features 172 of the waveguide component 100 are designed to facilitate the precise alignment of the first spacer layer 110, the first protrusion layer 108, and the second spacer layer 112 during the manufacturing process. The alignment features 172 can include alignment holes, markers, grooves, or notches, depending on the desired precision of the alignment. The alignment features 172 can be formed using a variety of manufacturing techniques, similar to those previously discussed in reference to Figure 3d. The alignment features 172 can be of any arbitrary shape and size, depending on the desired precision of the alignment.

[0109] In some examples, the waveguide component 100 optionally includes interconnects. The interconnects are structures that provide a connection between the folded waveguide 106 and other external transmission lines. The interconnects are designed to provide a wideband, low-loss, and low-reflection connection. This ensures that the high-frequency signals can be efficiently transmitted from the folded waveguide 106 to the external transmission lines. The interconnects can be formed from a variety of materials, including conductive materials or materials coated with conductive materials. The specific materials used for the interconnects can be selected based on their desired electrical properties. Examples of materials are discussed in more detail below.

[0110] The manufacturing process for the waveguide component 100 involves several steps, including processing individual layers, aligning the layers using alignment features 172, and joining the layers together to form the waveguide component 100.

[0111] In one implementation, the manufacturing process for the waveguide component 100 begins with processing individual layers, including a first spacer layer 110, a first protrusion layer 108, and a second spacer layer 112. These layers are processed separately before they are stacked together to form the waveguide component 100. In some examples, the processing of individual layers includes applying a conductive coating to each layer. The conductive coating can be a gold, silver, copper, aluminium, nickel, titanium, palladium, platinum, tungsten, or iridium coating. The conductive coating is applied to the layers to ensure that they have the desired electrical properties. The conductive coating can be applied using a variety of techniques, such as deposition, sputtering, or electroplating, depending on the chosen materials and desired features for the coating.

[0112] In some examples, the processing of individual layers includes patterning the layers to create through-going holes, non-through-going holes, slots, stubs, corrugations, or other features. The patterning of the layers can be performed using a variety of techniques, such as lithography, etching, or laser cutting, depending on the chosen materials and desired features for the patterns. The patterns can be of any arbitrary shape and size, depending on the desired characteristics of the folded waveguide 106.

[0113] In some examples, the processing of individual layers includes forming reactive elements, such as protrusions, vanes, or other structures, within the layer to impose the required boundary conditions and operational mode within the folded waveguide 106. The reactive elements can be formed using a variety of techniques, such as deposition, etching, or laser cutting, depending on the chosen materials and desired features for the elements. The reactive elements can be of any arbitrary shape and size, depending on the desired characteristics of the folded waveguide 106.

[0114] In some examples, the processing of individual layers includes selecting suitable materials for the layers based on their desired electrical and mechanical properties. The layers can be formed from a variety of materials, including silicon, germanium, gallium arsenide, indium phosphide, silicon nitride, silicon carbide, aluminium nitride, zinc selenide, zinc sulphide, glass, or metal (e.g., copper, aluminium). The specific materials used for the layers can be selected based on their desired electrical and mechanical properties, as well as their compatibility with the chosen manufacturing techniques and the desired features for the layers.

[0115] In some examples, the processing of individual layers includes controlling the thickness of each layer to ensure the vane is self-supporting and mechanically rigid. The thickness of the layers can be controlled using a variety of techniques, such as deposition, etching, or laser cutting, depending on the chosen materials and desired features for the layers. The thickness of the layers can be of any arbitrary value, depending on the desired characteristics of the folded waveguide 106.

[0116] In some examples, the processing of individual layers includes incorporating alignment features 172 as discussed above into the layers to facilitate the precise alignment of the parts during the manufacturing process.

[0117] In some examples, the processing of individual layers includes incorporating additional features into the layers to eliminate undesired leakage that may occur due to the presence of gaps between the layers when assembled. These additional features can include corrugations, stubs, or slots, which can be patterned in each layer to eliminate undesired leakage and ensure efficient transmission within the folded waveguide 106. These additional features can be formed using a variety of techniques, such as drilling, etching, or laser cutting, depending on the chosen materials and desired features for the features.

[0118] In some examples, the processing of individual layers is performed using suitable manufacturing techniques. These techniques can include deposition, etching, lithography, laser cutting, or other methods, depending on the chosen materials and desired features for each layer. The specific manufacturing techniques used can be selected based on their compatibility with the chosen materials, the desired features for the layers, and the desired characteristics of the folded waveguide 106.

[0119] In one implementation, the manufacturing process for the waveguide component 100 includes aligning the first spacer layer 110, the first protrusion layer 108, and the second spacer layer 112 using alignment features 172 as discussed above.

[0120] In some examples, the alignment of the layers is facilitated by using optical markers or fiducial markers on the layers. These markers can be used to assist with alignment during the manufacturing process. The markers can be formed using a variety of techniques, such as deposition, etching, or laser cutting, depending on the chosen materials and desired features for the markers. The markers can be of any arbitrary shape and size, depending on the desired precision of the alignment. Alternatively or additionally, in some examples, the alignment of the layers is facilitated by using mechanical fixtures, such as alignment pins or dowels, to ensure precise alignment between the layers. These fixtures can be inserted into the alignment holes in the layers to hold the layers in position during the manufacturing process. The fixtures can be formed from a variety of materials, including conductive materials or materials coated with conductive materials. The specific materials used for the fixtures can be selected based on their desired electrical and mechanical properties.

[0121] The manufacturing process for the waveguide component 100 involves several steps, including processing individual layers, aligning the layers using alignment features 172, and joining the layers together to form the waveguide component 100. The waveguide component 100 is configured to guide high-frequency signals along a waveguide component axis 126. The waveguide component 100 is composed of multiple layers, including a first spacer layer 110, a first protrusion layer 108, and a second spacer layer 112. These layers are stacked in a direction perpendicular to a component layer plane 130. Each of these layers extends in a plane parallel to the component layer plane 130. The waveguide component 100 can be formed from a variety of materials, including conductive materials or materials coated with conductive materials. The specific materials used can be selected based on their desired electrical and mechanical properties. The waveguide component 100 includes a variety of features, such as through holes, vanes, slots, stubs, corrugations, and alignment features 172, that are designed to facilitate the transmission and guiding of high- frequency signals, prevent EM leakage, and ensure the precise alignment of the layers during the manufacturing process.

[0122] In some examples, the alignment of the layers is facilitated by using computer vision tools or automated alignment systems. These tools can accurately align the layers based on predefined markers or patterns on the layers. The use of computer vision tools for alignment can significantly reduce human error and ensure consistent alignment across multiple manufacturing processes. The computer vision tools can be programmed to recognize specific markers or patterns on the layers and align the layers accordingly. This can be particularly useful when dealing with complex patterns or when high precision is required. In some examples, the alignment of the layers is facilitated by incorporating interlocking features into the layers. These interlocking features can include grooves, notches, or other structures that interlock with each other when the layers are stacked together. This can ensure proper alignment and prevent misalignment during the assembly process. The interlocking features can be formed using a variety of manufacturing techniques, such as drilling, etching, or laser cutting, depending on the chosen materials and desired features for the features. The interlocking features can be of any arbitrary shape and size, depending on the desired precision of the alignment.

[0123] In some examples, the alignment of the layers is facilitated by using laser alignment techniques. Laser alignment techniques can provide high precision and accuracy, making them suitable for aligning the layers of the waveguide component 100. Laser alignment techniques can involve projecting a laser beam onto the layers and aligning the layers based on the position of the laser beam. This can ensure that the layers are precisely aligned and that the folded waveguide 106 is formed correctly.

[0124] In some examples, the alignment of the layers is facilitated by using robotic or automated systems. These systems can handle and align the layers with high precision and accuracy, reducing human error and ensuring consistent alignment across multiple manufacturing processes. Robotic or automated systems can be programmed to recognize specific markers or patterns on the layers and align the layers accordingly. This can be particularly useful when dealing with complex patterns or when high precision is required.

[0125] In some examples, the alignment of the layers is facilitated by applying temporary adhesive or tacky materials between the layers. These materials can hold the layers in position during the alignment process and can be removed or cured once the alignment is completed. This can ensure that the layers are precisely aligned and that the folded waveguide 106 is formed correctly. The temporary adhesive or tacky materials can be selected based on their adhesive properties and their compatibility with the chosen materials for the layers. In one implementation, the manufacturing process for the waveguide component 100 includes joining the first spacer layer 110, the first protrusion layer 108, and the second spacer layer 112 together to form the waveguide component 100. The layers can be joined together using a variety of techniques, depending on the chosen materials and the desired characteristics of the waveguide component 100.

[0126] In some examples, the layers are joined together using mechanical fixings, such as bolts, screws, or clamps. These fixings can securely connect the layers and ensure their alignment. The mechanical fixings can be selected based on their mechanical properties and their compatibility with the chosen materials for the layers.

[0127] In some examples, the layers are joined together using adhesives or bonding agents. These materials can bond the layers together and create a strong and secure connection. The adhesives or bonding agents can be selected based on their adhesive properties and their compatibility with the chosen materials for the layers. The adhesives or bonding agents can be applied to the layers in a controlled manner to ensure a uniform and strong bond.

[0128] In some examples, the layers are joined together using fasteners, such as rivets or pins. These fasteners can hold the layers together and maintain their alignment. The fasteners can be selected based on their mechanical properties and their compatibility with the chosen materials for the layers. The fasteners can be inserted into pre-drilled holes in the layers to secure the layers together. The use of fasteners can provide a robust and durable connection between the layers, ensuring the structural integrity of the waveguide component 100.

[0129] In some examples, the layers are joined together using snap-fit or interlocking features. These features can be incorporated into the design of the layers to securely connect them and ensure their alignment. The snap-fit or interlocking features can be formed using a variety of manufacturing techniques, such as drilling, etching, or laser cutting, depending on the chosen materials and desired features for the features. The snap-fit or interlocking features can be of any arbitrary shape and size, depending on the desired characteristics of the waveguide component 100. In some examples, the layers are joined together using a combination of bonding and mechanical fixings. This can provide a robust and stable connection between the layers, ensuring the structural integrity of the waveguide component 100. The bonding can be achieved using adhesives or bonding agents, while the mechanical fixings can include bolts, screws, clamps, rivets, pins, or other types of fasteners. The specific combination of bonding and mechanical fixings used can be selected based on the desired characteristics of the waveguide component 100.

[0130] In one implementation, the manufacturing process for the waveguide component 100 includes singulating individual devices from a larger multilayer structure. The singulation can be performed using a variety of methods, such as cutting, dicing, or drilling, depending on the chosen materials and the desired characteristics of the individual devices. The singulation process can be controlled to ensure that each individual device has the desired characteristics and meets the required specifications.

[0131] In some examples, the singulation of individual devices is performed using a cutting method. The cutting method can involve using a cutting tool, such as a saw or a laser cutter, to cut the larger multilayer structure into individual devices. The cutting method can be controlled to ensure that each individual device has the desired characteristics and meets the required specifications. In some examples, the singulation of individual devices is performed using a dicing method. The dicing method can involve using a dicing saw to cut the larger multilayer structure into individual devices. The dicing method can be controlled to ensure that each individual device has the desired characteristics and meets the required specifications. In some examples, the singulation of individual devices is performed using a drilling method. The drilling method can involve using a drill to create holes in the larger multilayer structure, separating it into individual devices. The drilling method can be controlled to ensure that each individual device has the desired characteristics and meets the required specifications.

[0132] In one implementation, the manufacturing process for the waveguide component 100 includes processing boundary layers, such as a first boundary layer 102 and a second boundary layer 104. These boundary layers are processed separately before they are stacked together with the other layers to form the waveguide component 100. The processing of the boundary layers can involve applying a conductive coating, patterning the layers, forming reactive elements, selecting suitable materials, controlling the layer thickness, incorporating alignment features 172, and incorporating additional features. These steps can be performed using a variety of manufacturing techniques, such as deposition, etching, lithography, laser cutting, or other methods, depending on the chosen materials and desired features for each layer.

[0133] In some implementations, the manufacturing process for the waveguide component 100 includes aligning and joining the first boundary layer 102 and the second boundary layer 104 similar to that discussed above. Once the boundary layers are aligned, they are joined together with the other layers to form the waveguide component 100. The joining of the layers can be facilitated by using mechanical fixings, adhesives or bonding agents, fasteners, snap-fit or interlocking features, or a combination of bonding and mechanical fixings. The specific method used to join the layers together can be selected based on the desired characteristics of the waveguide component 100.

[0134] In one implementation, the manufacturing process for the waveguide component 100 includes processing additional protrusion layers, such as a second protrusion layer 136 and a third protrusion layer 138. These additional protrusion layers are processed separately before they are stacked together with the other layers to form the waveguide component 100.

[0135] The processing of the additional protrusion layers can involve applying a conductive coating, patterning the layers, forming reactive elements, selecting suitable materials, controlling the layer thickness, incorporating alignment features 172, and incorporating additional features. These steps can be performed using a variety of manufacturing techniques, such as deposition, etching, lithography, laser cutting, or other methods, depending on the chosen materials and desired features for each layer.

[0136] The processed additional protrusion layers are then aligned with the other layers using alignment features 172 and joined together to form the waveguide component 100. In some implementations, the manufacturing process for the waveguide component 100 includes aligning and joining the additional protrusion layers, such as the second protrusion layer 136 and the third protrusion layer 138.

[0137] Once the additional protrusion layers are aligned, they are joined together with the other layers to form the waveguide component 100. The joining of the layers can be facilitated by using mechanical fixings, adhesives or bonding agents, fasteners, snap- fit or interlocking features, or a combination of bonding and mechanical fixings. The specific method used to join the layers together can be selected based on the desired characteristics of the waveguide component 100.

[0138] In some examples, pre-assembled wafers are used to create more complex structures. A pre-assembled wafer comprises at least two bonded wafers that are subsequently patterned. In some examples, the first spacer layer 110 or the second spacer layer 112 is assembled to the first protrusion layer 108 before the first protrusion layer 108 is assembled to the other of the second spacer layer 112 and the first spacer layer 110. This means that the protrusion layer 108 is initially bonded to either the first or second spacer layer 110, 112, and then this sub-assembly is bonded to the remaining spacer layer. This staged assembly process can improve alignment accuracy and structural integrity, particularly when dealing with thin and delicate vane structures. Furthermore, in some additional examples the first spacer layer 110 or the second spacer layer 112 is assembled to the second protrusion layer 136 before the second protrusion layer 136 is assembled the other of the second spacer layer 112 and the first spacer layer 110.

[0139] This approach can simplify the fabrication process and enable integration of multiple functionalities within the waveguide component. For example, a silicon-on-insulator (SOI) wafer can be used as a pre-assembled wafer. The SOI wafer's thin second silicon layer, with a thickness ranging from 0.1-100 pm, can be used to form the vane or other delicate structures with high precision. Multiple pre-assembled wafers can also be combined with standard wafers within a single component, offering increased design flexibility and complexity. This allows, for instance, the inclusion of multiple vane structures from pre-assembled wafers, enabling complex reactive elements and functionalities in the folded waveguide. Traditional printed circuit boards (PCBs) face significant performance limitations at high frequencies, typically above 20 GHz. These limitations stem from several factors, including increased dielectric losses in the PCB substrate material, signal distortion caused by conductor roughness and trace geometry, and difficulties in achieving precise impedance control. These issues can lead to significant signal attenuation, unwanted radiation, and impedance mismatches, ultimately degrading the overall performance of high-frequency systems.

[0140] In contrast, the waveguide component, fabricated using semiconductor-grade silicon or glass wafers, offers substantial advantages at high frequencies.. The precise lithographic patterning and etching processes used in wafer fabrication enable the creation of highly smooth conductor surfaces and precisely defined geometries, minimizing signal distortion and ensuring accurate impedance control. This inherent precision and low-loss nature of wafer-based fabrication makes the waveguide component ideally suited for demanding high-frequency applications where PCB technology falls short.

[0141] The layers of the waveguide component 100, namely the first spacer layer 110, the first protrusion layer 108, and the second spacer layer 112, can be fabricated from semiconductor-grade silicon or glass wafers. Utilizing such high-quality materials enables precise control over the waveguide dimensions and minimizes material losses. The mating faces of these wafers can have a surface roughness in the range of 50-250 nm, facilitating improved bonding and minimizing interfacial discontinuities within the folded waveguide 106.

[0142] The folded waveguide 106, as illustrated in Figure 1 or any of the other Figures, can be implemented using multiple wafers for each of the layers 102, 104, 108, 110, 112, 136, 138, 140, 142. The wafers can be e.g. a silicon wafer. The thickness of each wafer, the patterns or openings within the wafer layers 116, 118, 120, 128, 132, 134, 146, 150, 154, 156, 158, 160, 162, 164, 166, 168, and the orientation of the wafer layers within the stack define the dimensions of the folded waveguide 106 and are carefully selected according to the intended frequency of operation. Tight tolerances on each of these parameters are crucial for optimal device performance. Employing high-quality semiconductor-grade wafers, like silicon or glass, in conjunction with precision semiconductor / micromachining processing methods, achieves tolerances suitable for devices operating above 30 GHz (1-2 pm tolerances).

[0143] Each wafer layer 102, 104, 108, 110, 112, 136, 138, 140, 142 is individually patterned using a combination of lithography and etching processes, creating the required pattern features such as through holes 116, 118, 120, 146, 150, slots 132, 134, 154, 156, 166, 168, and corrugations 162, 164. Subsequently, the patterned wafer layers are assembled and joined together using wafer bonding techniques, such as thermocompression bonding, anodic bonding, adhesive bonding, or hybrid bonding to form the completed folded waveguide 106.

[0144] For optimal operation, in some examples all inner surfaces of the folded waveguide 106 require a conductive coating, typically a metal such as gold, silver, copper, aluminum, nickel, titanium, palladium, platinum, tungsten or iridium. This coating can be applied before or after the wafer bonding process. Metal-metal thermocompression bonding is a common method when applying the conductive coating pre-bonding.

[0145] The wafer layers 102, 104, 108, 110, 112, 136, 138, 140, 142 themselves can be fabricated from various materials, typically silicon or glass. Silicon wafers, offering diameters up to 300 mm, enable batch processing of multiple devices. Alternatively, large glass panels exceeding 50 x 50 cm2can be employed for high-volume production. The choice of wafer material is determined by the need for mechanical rigidity, thermal conductivity for temperature control, and environmental stability (low CTE, low Poisson ratio, low outgassing). The material may also be available in thicknesses appropriate for the chosen operating frequency. The material for each individual wafer can be independently selected to optimize device cost and process yield. The thickness and material of the vane structure 114, 144, 148 are carefully chosen to provide sufficient rigidity without compromising device performance, with thinner vanes being preferable.

[0146] Prior to bonding, the wafer layers 102, 104, 108, 110, 112, 136, 138, 140, 142 must be flat and exhibit smooth surfaces to ensure strong adhesion, prevent gaps that could cause electromagnetic leakage, and maintain tight dimensional tolerances. Additional processing steps, such as surface grinding or chemical mechanical polishing (CMP), can be employed either before or after applying the conductive coating to achieve the desired surface roughness. Typical surface roughnesses on the mating faces range from 50-250 nm.

[0147] Several processes, including deep reactive ion etching, cryogenic etching, laser cutting, wet chemical etching, or a combination thereof, can be used for patterning the wafers. The resulting surface roughness on the inner surfaces of the device affects its performance; therefore, tight control over the patterning process parameters is essential, achieving typical roughnesses of 10-100 nm. Furthermore, the pattern dimensions and the angles of the resulting sidewalls are also tightly controlled, allowing for dimensional tolerances of 0.1-2 pm and sidewall angles of 0.1-1 degree.

[0148] Precise alignment of the wafer layers during assembly is critical, particularly for frequencies above 30 GHz, where alignment accuracy better than 10 pm is required. Precision wafer bonding tools and processes can achieve alignment accuracies better than 2 pm. The alignment of the vane / protrusion 114, 144, 148 relative to the waveguide sidewalls is particularly crucial as this defines the operational frequency band, device impedance, and bandwidth. Utilizing pre-assembled / bonded wafers simplifies the assembly process, reduces costs, and improves performance and process yield. These pre-assembled wafers are created by bonding two or more individual wafers before patterning. The resulting pre-assembled wafer can then be processed from each side, eliminating assembly steps and reducing potential misalignment between layers.

[0149] A combination of silicon / glass and silicon-on-insulator (SOI) wafers offers significant advantages for producing folded waveguide structures, including increased industrial relevance and suitability for high-volume production. SOI wafers, readily available in diameters over 200 mm and commonly used in MEMS manufacturing, are ideal for high-volume applications. Through grinding and polishing, the thickness of the second silicon layer in an SOI wafer can be reduced to 0.1-100 pm with tolerances of 0.1-2 pm, enabling operation in the 30-500 GHz range. The use of multiple pre-assembled wafers, combined with standard wafers of various materials, allows for design flexibility and optimization for both performance and cost. Multiple vane structures, formed using one or more pre-assembled wafers, offer further advantages compared to conventional designs.

[0150] The terminology used herein is for the purpose of describing particular aspects only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It will be further understood that the terms "comprises," "comprising," "includes," and / or "including" when used herein specify the presence of stated features, integers, actions, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, actions, steps, operations, elements, components, and / or groups thereof.

[0151] It will be understood that, although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element without departing from the scope of the present disclosure.

[0152] Relative terms such as "below" or "above" or "upper" or "lower" or "horizontal" or "vertical" may be used herein to describe a relationship of one element to another element as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0153] It is to be understood that the present disclosure is not limited to the aspects described above and illustrated in the drawings; rather, the skilled person will recognize that many changes and modifications may be made within the scope of the present disclosure and appended claims. In the drawings and specification, there have been disclosed aspects for purposes of illustration only and not for purposes of limitation, the scope of the disclosure being set forth in the following claims.

Claims

Claims1 . A waveguide component (100) having a plurality of layers comprising: a first spacer layer (110) having a first spacer layer through hole (116); a first protrusion layer (108) having a first protrusion layer through hole (120) and a first vane projecting structure (114); a second spacer layer (112) having a second spacer layer through hole (118), the first spacer layer (110), first protrusion layer (108), and second spacer layer (112) are configured to be stacked such that the first spacer layer through hole (116), the first protrusion layer through hole (120), and the second spacer layer through hole (118) align to form a folded waveguide (106) and the first vane projecting structure (114) projects in to the folded waveguide (106); and the first spacer layer (110), the first protrusion layer (108) and the second spacer layer (112) comprise a conductive coating; wherein the first spacer layer (110) or the second spacer layer (112) is assembled to the first protrusion layer (108) before the first protrusion layer (108) is assembled the other of the second spacer layer (112) and the first spacer layer (110).

2. The waveguide component (100) according to claim 1 wherein the first vane projecting structure (114) is configured to act as a reactive element within the folded waveguide (106).

3. The waveguide component (100) according to claims 1 or 2, further comprising a first boundary layer (102) adjacent to the first spacer layer (110) and a second boundary layer (104) adjacent to the second spacer layer (112), wherein the first boundary layer (102) and the second boundary layer (104) are configured to enclose the folded waveguide (106).

4. The waveguide component (100) according to claims 1 or 2, wherein the first vane projecting structure (114) is self-supporting and mechanically rigid.

5. The waveguide component (100) according to any one of claims 1 to 4, wherein the first spacer layer (110), the first protrusion layer (108), and the second spacer layer (112) extend in a plane parallel with a component layer plane (130).

6. The waveguide component (100) according to claim 5 wherein the first vane projecting structure (114) is parallel to the or perpendicular to the component layer plane (130).

7. The waveguide component (100) according to claims 5 or 6 wherein the component layer plane (130) is perpendicular with to the waveguide's E field plane (122) or parallel with the waveguide's E field plane (122).

8. The waveguide component (100) according to any one of claims 1 to 7, further comprising at least one second protrusion layer (136) having at least one second protrusion layer through hole (146) and at least one second vane projecting structure (144) configured to act as a reactive element within the folded waveguide (106).

9. The waveguide component (100) according to claim 8, wherein the second protrusion layer (136) is adjacent to the first protrusion layer (108) and the first vane (114) and the second vane projecting structure (144) together form a single vane projecting structure.

10. The waveguide component (100) according to claim 8, wherein the second protrusion layer (136) is separated from the first protrusion layer (108) and the second vane projecting structure (144) forms a separate vane projecting structure.

11. The waveguide component (100) according to any of claims 8 to 10, wherein the first spacer layer (110) or the second spacer layer (112) is assembled to the second protrusion layer (136) before the second protrusion layer (136) is assembled the other of the second spacer layer (112) and the first spacer layer (110).

12. The waveguide component (100) according to any one of claims 1 to 11 , further comprising alignment features (172) configured to facilitate the precise alignment of the first spacer layer (110), the first protrusion layer (108), and the second spacer layer (112) during the manufacturing process.

13. The waveguide component (100) according to claim 12, wherein the alignment features (172) comprise alignment holes configured to receive an alignment dowel (174) for aligning the layers.

14. The waveguide component (100) according to claims 12 or 13, wherein the alignment features (172) comprise alignment holes configured for optical alignment by microscopy or a computer vision system for aligning the layers.

15. The waveguide component (100) according to any one of claims 1 to 14, wherein the first vane projecting structure (114) comprises one or more vane holes (128) configured to impose the required boundary conditions and operational mode within the folded waveguide (106) or create additional reactive elements.

16. The waveguide component (100) according to any one of claims 1 to 15, wherein the folded waveguide (106) is configured to transmit and guide high-frequency signals along a waveguide component axis (126).

17. The waveguide component (100) according to any one of claims 1 to 16, further comprising a second folded waveguide (170) formed by a plurality of first spacer layer through holes (116), second spacer layer through holes (118), and first protrusion layer through holes (120) in the first spacer layer (110), the second spacer layer (112), and the first protrusion layer (108).

18. The waveguide component (100) according to any of the preceding claims wherein the one or more of the first spacer layer (110), the first protrusion layer (108), the second spacer layer (112), the first boundary layer (102) and the second boundary layer (104) comprises an E-plane slot (132, 134, 166) for radiating an electromagnetic signal.

19. The waveguide component (100) according to any of the preceding claims wherein the one or more of the first spacer layer (110), the first protrusion layer (108), the second spacer layer (112), the first boundary layer (102) and the second boundary layer (104) comprises an H-plane slot (154, 156, 168) for radiating an electromagnetic signal.

20. The waveguide component (100) according to any of the preceding claims wherein one or more of the first spacer layer (110), the first protrusion layer (108), the second spacer layer (112), the first boundary layer (102) and the second boundary layer (104) comprises a pluarality of corrugations (162, 164), holes or a periodic patterned structure, configured to prevent signal leakage from the waveguide component (100).

21. The waveguide component (100) according to any of the preceding claims, wherein at least one of the first spacer layer (110), the first protrusion layer (108), and the second spacer layer (112) comprises a silicon wafer, silicon on insulator wafer, or a glass wafer.

22. A method of manufacturing a waveguide component (100) having a plurality of layers comprising the steps of: processing individual layers including a first spacer layer (110) having a first spacer layer through hole (116), a first protrusion layer (108) having a first protrusion layer through hole (120) and a first vane projecting structure (114), and a second spacer layer (112) having a second spacer layer through hole (118); wherein the method comprises aligning the first spacer layer (110), the first protrusion layer (108), and the second spacer layer (112) using alignment features (172) such that the first spacer layer through hole (116), the first protrusion layer through hole (120), and the second spacer layer through hole (118) form a folded waveguide (106) and the first vane projecting structure (114) configured to project into the folded waveguide (106); joining the first spacer layer (110), the first protrusion layer (108), and the second spacer layer (112) together to form the waveguide component (100) wherein the method comprises coating the first spacer layer (110) the first protrusion layer (108), and the second spacer layer (112) with a conducting coating; wherein the first spacer layer (110) or the second spacer layer (112) is assembled to the first protrusion layer (108) before the first protrusion layer (108) is assembled the other of the second spacer layer (112) and the first spacer layer (110).

23. The method according to claim 22, further comprising processing a first boundary layer (102) and a second boundary layer (104) and aligning and joining the first boundary layer (102) and the second boundary layer (104) adjacent to the first spacer layer (110) and the second spacer layer (112), respectively, to enclose the folded waveguide (106).

24. The method according to claims 22 or 23, further comprising processing a second protrusion layer (136) having a second protrusion layer through hole (146) and a second vane projecting structure (144) configured to act as a reactive element within the folded waveguide (106), and aligning and joining the second protrusion layer (136) with the first protrusion layer (108).

25. The method according to any one of claims 22 to 24, further comprising singulating individual waveguide components (100) each having plurality of layers from a larger multilayer structure using one or more singulation methods such as cutting, dicing, or drilling.

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