Method and device for removing a workpiece part from the remainder of the workpiece

Abstract

The invention relates to a method and a device (1) for removing a workpiece part (2) from the remainder of the workpiece (3). The workpiece part (2) left behind in a cut-away opening (10) formed by a cutting operation is supported in a support plane (W) by a support surface (12) of a support element (13). A counter-bearing element (22) is positioned above the workpiece part (2) such that a counter-bearing surface (23) of the counter-bearing element (22) and a top side (24) of the workpiece part (2) touch one another in a planar manner, as a result of which the workpiece part (2) is clamped between the support surface (12) and the counter-bearing surface (23). The support surface (12) and the counter-bearing surface (23) and consequently the workpiece part (2) are moved up and / or down multiple times in a first removal vibration process (E1), while the workpiece part (2) is clamped between the support surface (12) and the counter-bearing surface (23).

Description

[0001] Method and device for removing a workpiece part from a remaining workpiece

[0002] The present invention relates to a method for removing a workpiece part from a remaining workpiece. Furthermore, the invention relates to a device configured to carry out such a method.

[0003] In conventional laser cutting processes, in which a piece of material, a so-called slug, is cut out of a plate or sheet, the successful removal of the slug is crucial for the process reliability of the laser cutting machine used. This is because the machine design means that the plate from which the slug is cut out is moved on a machine table. However, it can happen that the slug does not fall out completely from the plate if the cut-out slug becomes wedged in the cut-out opening as it falls out. Furthermore, it can happen - especially with plate thicknesses of 3 mm and more - that an incomplete material separation between the slug and plate does not completely release the slug from falling out. For example, tilting the slug against an inner wall of the cut-out opening can undesirably create a new material bond between the plate and the slug.This is because both the slug and the inner wall of the cutout opening are extremely hot due to the laser cutting process, so that when they touch each other, they form a material bond; the slug and the inner wall of the cutout opening are essentially welded together again. An unwanted slug sitting in or protruding from the cutout opening hinders the reliable movement of the panel on the machine table.

[0004] Even if the slug remains in the plate without protruding, reworking is required to remove the slug from the plate, which makes the manufacturing time for producing a corresponding workpiece particularly long. There is therefore a need to remove the slug from the sheet metal reliably and as quickly as possible. For this purpose, WO 2014 / 023 323 A1 discloses a method for removing a workpiece part from a residual workpiece using a gripper device. When hooking of the workpiece part with the residual workpiece is detected, a release strategy is initiated in which a travel movement of the workpiece holding device and / or the gripper device is carried out in the workpiece plane (XY plane) along a predefined path. A further movement component along a travel direction in the Z direction can be superimposed on this travel movement.WO 2020 / 057852 A1 proposes a method for removing a workpiece part from a remaining workpiece, wherein the workpiece part is clamped between an ejection element and a counter-holding element. The workpiece part is moved along a removal direction, after which it is checked whether the workpiece part has been completely separated from the remaining workpiece. The clamping of the workpiece part between the ejection element and the counter-holding element is reduced or removed and then restored if the workpiece part has not been completely separated from the remaining workpiece.

[0005] If the slug cannot be successfully removed from the sheet using conventional methods, it must be reworked manually. An undesirable bond between the slug and the sheet metal must be severed after the actual manufacturing or cutting process, which means the cut contour must be recut. This, however, leads to reduced edge quality.

[0006] The object of the invention is to reliably remove a workpiece part cut from a residual workpiece by means of separating machining as efficiently as possible.

[0007] This problem is solved by the subject matter of the independent claims. Further possible embodiments of the invention are disclosed in the subclaims, the description, and the figures. Features, advantages, and possible embodiments presented in the description for one of the subject matter of the independent claims are to be regarded, across categories and embodiments, at least analogously as features, advantages, and possible embodiments of the respective subject matter of the other independent claims, as well as any possible combination of the subject matter of the independent claims, optionally in conjunction with one or more of the subclaims.

[0008] According to the invention, a method for removing a workpiece part from a residual workpiece is proposed. The workpiece part is or was formed by means of separating processing, in particular by means of a thermal separation process, preferably by laser cutting, of a workpiece plate, for example a sheet metal (i.e., a plate-shaped, metallic workpiece). The workpiece part can be a waste product, a so-called slug, which arises during the separating processing of the workpiece plate, so that the remaining residual workpiece is the product to be manufactured. Furthermore, the workpiece part can be the product to be manufactured, which means that the remaining residual workpiece, which in this case is also called the residual skeleton, is the waste product.In addition, the invention proposes a device which is configured to carry out the method for removing the workpiece part from the remaining workpiece.

[0009] The device has a support surface on which the workpiece plate can be supported, as well as a counter-bearing element that can be positioned over the workpiece part such that a counter-bearing surface of the counter-bearing element and an upper side of the workpiece part contact one another flatly, whereby the workpiece part can be clamped between the support surface and the counter-bearing surface. Furthermore, the device has an oscillating actuator by means of which the support surface and the counter-bearing surface can be moved upwards and / or downwards several times in a first removal oscillation process, while the workpiece part is clamped between the support surface and the counter-bearing surface. In particular, the device has a control unit by means of which components of the device can be controlled for carrying out the method, in particular the support element, the counter-bearing element and the oscillating actuator.According to a possible refinement, the device comprises a cutting head, in particular a laser cutting head, for separating the workpiece plate, from which the workpiece part and the remaining workpiece are formed during a cutting operation of the device. Accordingly, the device is in particular a laser cutting machine, which is, for example, part of a laser production combination machine. This means that the device is configured both to separate the workpiece plate or sheet and to remove the workpiece part from the remaining workpiece.

[0010] In the method, the workpiece part is supported in the support plane by the support surface of the support element during and after the workpiece part has been formed by separating machining. The counter-bearing element is then positioned over the workpiece part such that the counter-bearing surface of the counter-bearing element and the upper surface of the workpiece part are in contact with each other, thereby clamping the workpiece part between the support surface and the counter-bearing surface. A first removal oscillation process is then carried out, in which the support surface and the counter-bearing surface are moved upwards and / or downwards several times in a first removal oscillation process while the workpiece part is clamped between the support surface and the counter-bearing surface.The workpiece part can be moved several times above the support plane up and back into the support plane, i.e. it can be moved back and forth between the support plane and an upper reversing plane arranged above the support plane. Furthermore, the workpiece part can be moved several times below the support plane down and back into the support plane, i.e. between the support plane and a lower reversing plane arranged below the support plane. It is also conceivable that the workpiece part is moved several times back and forth between the upper reversing plane arranged above the support plane and the lower reversing plane arranged below the support plane. The repeated movement of the support surface and the counter-bearing surface, and consequently of the workpiece part, takes place in the first removal oscillation process, for example, purely translationally, i.e. purely vertically.

[0011] The first removal oscillation process significantly increases the chance that the workpiece part will be removed from the remaining workpiece as desired. This is because the removal oscillation vibrates the workpiece part remaining in the remaining workpiece, supporting it downwards by the support surface and upwards by the counter-bearing surface. If any material-to-material bonds remain between the remaining workpiece and the workpiece part, or have formed again after the actual separating machining process, these are broken due to the highly dynamic oscillation or shaking. If, alternatively or additionally, the workpiece part has become jammed in the free cut opening, the workpiece part is advantageously supported using the support element orby means of the counterbearing element, the workpiece is aligned parallel to the remaining workpiece, whereby the shaking / vibration of the first removal oscillation process has a particularly effective effect on the workpiece part. This further promotes the removal of the workpiece part from the remaining workpiece. Furthermore, this clamping prevents the workpiece part from being ejected from the remaining workpiece in an uncontrolled manner due to the removal oscillation. Although recutting an edge contour specified for the production of the workpiece part would likely also lead to successful removal of the workpiece part, this can be particularly advantageously avoided, since such recutting would impair the edge quality.Thanks to the process, it is possible to use recutting only as a last resort, for example if the process or one of the possible further developments of the process described below has not led to the successful removal of the workpiece part.

[0012] In general, it is conceivable that the first removal swing process is only performed if, after the workpiece part has been formed, it is determined that the workpiece part has not been undesirably removed from the cut-out opening. Therefore, if it is determined that the workpiece part has not been removed from the cut-out opening, the first removal swing process is performed as described above. Conversely, if it is determined that the workpiece part has been successfully removed from the cut-out opening after laser cutting, the formation of another / next workpiece part can be started without performing a removal swing.

[0013] The method according to the invention can be a computer-implemented method. In this case, the invention further proposes a computer program having program instructions which, when executed by the control unit of the device, cause the method or a development thereof to be executed by the device or a development thereof. This means that the control unit in this case is designed for electronic data processing or for processing the program instructions. Furthermore, the control unit is configured to deliver corresponding control signals to the components of the device for executing the method based on processed program instructions. The invention then also includes a computer-readable storage medium on which the computer program is stored.

[0014] In another possible embodiment, the upper stroke distance, by which the clamped workpiece part is moved upwards from the support plane, is 5 mm or less. Alternatively or additionally, the lower stroke distance, by which the clamped workpiece part is moved downwards from the support plane, is 5 mm or less. This prevents excessive deformation of the remaining workpiece, from which at least one additional workpiece part may be cut.

[0015] According to a further possible embodiment, a first upper stroke (Aw o i) by which the workpiece part is moved upwards from the support plane in the first removal oscillation process, based on a workpiece part thickness (t) using the formula

[0016] . (-0.5 mm + 0.5 ■ t, t < 4 mm

[0017] Aw o

[0018] 011 = < . r ' F1 ( 1.5 mm, t > 4 mm is calculated. Alternatively or additionally, a first lower stroke distance (Aw u i) by which the workpiece part is moved downwards from the support plane in the first removal oscillation process, based on the workpiece part thickness (t) using the formula

[0019] . (—0.5 mm — 0.5 • t, ​​t < 4 mm

[0020] Aw ul = F2

[0021] ( —2.5 mm, t > 4 mm. For example, for a workpiece thickness t = 2 mm, the following stroke lengths result: Awoi = 0.5 mm and Aw ui= -1.5 mm. For small workpiece thicknesses (t < 4 mm), the force required to detach or break the workpiece part is smaller than for large workpiece thicknesses (t > 4 mm). The higher the remaining workpiece is lifted, the greater the force applied to the workpiece part, since a larger proportion of the remaining workpiece is deflected from the support plane. With small workpiece thicknesses, it is therefore not necessary to deflect the remaining workpiece particularly far from the support plane, for example, to avoid unnecessary deformation of the remaining workpiece.

[0022] According to a possible further development, a second removal oscillation process, different from the first removal oscillation process, is carried out if it is determined that the workpiece part was not successfully removed from the remaining workpiece by the first removal oscillation process. Therefore, if it is determined that the workpiece part is still sitting in the free-cut opening after the first removal oscillation process, the support surface and the counter-bearing surface are moved up and / or down several times in the second removal oscillation process while the workpiece part is clamped between the support surface and the counter-bearing surface. In doing so, the support surface and the counter-bearing surface, and thus the workpiece part, are moved further up and / or down in the second removal oscillation process than in the first removal oscillation process.In simple terms, the workpiece is subjected to more intense vibration during the second removal oscillation than during the first. The repeated movement of the support surface and the counter-bearing surface, and consequently of the workpiece, occurs purely translationally, i.e., purely vertically, during the second removal oscillation.

[0023] Before detecting whether the workpiece part is still in the free-cut opening after the first removal oscillation process, the clamping of the workpiece part can be released; the clamping is then restored at the latest when the second removal oscillation process is carried out. To detect the workpiece part, the device has, for example, a sensor unit configured to detect the workpiece part that has remained in a free-cut opening formed in the remaining workpiece by the separating machining of the workpiece plate. For example, a laser test pulse is emitted into the free-cut opening by means of the laser cutting head, wherein the sensor unit, which has, for example, a camera and / or an infrared sensor, is configured to detect an illumination in the free-cut opening. If no illumination is detected, the laser test pulse has passed through the free-cut opening without striking any material.This means that there is no material in the cutout opening, which means that the workpiece part has been removed from the remaining workpiece or the cutout opening. If the laser inspection pulse hits material in the cutout opening, it is heated by the laser energy and then illuminates, which is detected by the sensor unit. This means that there is material in the cutout opening, for example, the workpiece part that was not properly removed from the cutout opening. Furthermore, it is conceivable that electronic image processing could be used to determine whether or not the workpiece part is in the cutout opening. Other / further methods of detecting the workpiece part remaining in the remaining workpiece are conceivable as alternatives or in addition, such as using a laser sensor, an ultrasonic sensor, a tactile contact test, etc.

[0024] The upper stroke distance by which the clamped workpiece part is moved upwards from the support plane in the second removal oscillation process can be 5 mm or less, as in the first removal oscillation process. Alternatively or additionally, a lower stroke distance by which the clamped workpiece part is moved downwards from the support plane in the second removal oscillation process is 5 mm or less, as in the first removal oscillation process. Furthermore, a possible embodiment provides that a second upper stroke distance (Äw02), by which the workpiece part is moved upwards from the support plane in the second removal oscillation process, is determined based on the workpiece part thickness (t) using the formula mm + 1, t < 4 mm O r 4- / I F3 3.5 mm, t > 4 mm is calculated. Alternatively or additionally, a second lower stroke length (Aw U2) by which the workpiece is moved downwards from the support plane in the second removal oscillation process, based on the workpiece thickness (t) using the formula 0.5 mm — t, t < 4 mm — . r 4 F4 4.5 mm, t > 4 mm. For example, for a workpiece thickness t = 2 mm, the following stroke lengths result: AW02 = 1.5 mm and Aw U 2 = -2.5 mm.

[0025] In a further possible embodiment, it is provided that before the first removal oscillation process and / or before the second removal oscillation process, an attempt is made to deflect the workpiece part once by the full stroke distance from the support plane, wherein a triggering state of an overload protection device is monitored, and if the overload protection device is triggered during this deflection, the associated stroke distance is reduced such that the overload protection device is not triggered during the corresponding removal oscillation process. In other words, a corrected stroke distance is used for the repeated movement of the support surface and the counter-bearing surface upwards and / or downwards if the overload protection device was triggered during the preceding deflection attempt. This ensures that the device is not damaged during the corresponding removal oscillation process.The overload protection device is a component of the device or laser cutting machine and is implemented, for example, as a spring-loaded plate with dynamic pressure sensing. If the force applied to the support element is too great, the plate tilts and the pressure drops sharply. The vertical position of the support element at which this pressure drop is detected is stored as a trigger position of the overload protection device and used to recalculate the corresponding stroke distance.

[0026] Another possible embodiment provides for the repeated movement of the workpiece part in the first removal oscillation process and / or in the second removal oscillation process to be carried out in an oscillating manner at a frequency of 5 Hz to 15 Hz. Furthermore, it can be provided that the movement of the workpiece part in the first removal oscillation process and / or in the second removal oscillation process occurs ten times or more.

[0027] The removal of the workpiece part in the first and / or second removal oscillation process by means of the device is particularly reliable if—as according to another possible embodiment—the removal oscillation acceleration with which the workpiece part is repeatedly moved upwards and / or downwards is a maximum acceleration that can be reliably achieved using the oscillation actuator. Alternatively or additionally, the removal oscillation speed with which the workpiece part is repeatedly moved upwards and / or downwards is a maximum feed rate that can be reliably achieved using the oscillation actuator.

[0028] The detachment or removal of the workpiece part from the remaining workpiece is further assisted if - as is provided in a further possible embodiment - a horizontal movement, in particular a horizontal oscillation process, is carried out simultaneously with, before and / or after one or both of the removal oscillation processes by means of the support element which lies flat against an underside of the remaining workpiece. For this purpose, the device or laser cutting machine has in particular horizontal oscillation actuators which are configured to move the support element along the support plane. As a result, the workpiece part to be removed from the remaining workpiece is moved horizontally, in particular swung, perpendicular to the first and / or second removal oscillation process, whereby the workpiece part is released even more reliably. In particular, the horizontal oscillation actuators are used to move orOscillation of the counter bearing element is controlled with a technically reliably achievable maximum acceleration and with a technically reliably achievable maximum feed speed.

[0029] Furthermore, according to a possible refinement, the support element has a support carriage movable along the support plane beneath the workpiece part, and the support surface is at least partially formed by positioning a support carriage surface of the support carriage beneath the workpiece part and placing it flat against the underside of the workpiece part. To this extent, the device has the support carriage, which functions as the support element within the scope of the method. A carriage vertical center axis of the support carriage and a cutting axis of a cutting head, by means of which the free-cut opening was formed, can coincide in a first carriage operating mode. Furthermore, it is conceivable that the carriage vertical center axis and the cutting axis are coupled to one another in a movement-synchronous manner—in particular by software or control technology, preferably not mechanically.During the process, a support carriage surface of the support carriage is positioned beneath the remaining workpiece part in such a way that the support carriage surface and the underside of the workpiece part are in surface contact with one another. The support carriage is particularly constructed in two parts, i.e., it has two support carriage elements, each with a support carriage partial surface, so that the support carriage surface is formed by the two support carriage partial surfaces. A central support carriage gap is formed between the support carriage elements and consequently between the support carriage partial surfaces, through which the vertical center axis of the carriage runs. In particular, it is provided that the support carriage elements are movable and controllable in opposite directions and synchronously to enlarge and reduce the support carriage gap. Within the scope of the process, for example, one of the support carriage elements is positioned beneath the workpiece part as described above.A decision routine stored in the control unit can be used to determine which of the two support slide elements is positioned under the workpiece part, for example by determining which of the support slide elements needs to be moved less far in order to move it into the corresponding position.

[0030] Especially in conjunction with a small size of the workpiece part to be removed, a particularly short positioning time for positioning the support carriage or the support carriage surface can be achieved if the support carriage or the corresponding support carriage element is moved just far enough below the workpiece part that its center of gravity lies within an outer contour of the support carriage surface or support carriage part surface. For particularly reliable support of the workpiece part on the support carriage surface, it is equally conceivable to move the support carriage or the support carriage element so far below the workpiece part that a center of gravity of the support carriage or support carriage element, in particular a center of gravity of the support carriage surface or support carriage part surface, and the center of gravity of the workpiece part to be removed fall on a common vertical.After the corresponding removal oscillation process, the support carriage acting as the support element is moved away from the free-cut opening under the remaining workpiece so that the workpiece part can fall downwards out of the remaining workpiece. For this purpose, the support carriage can be moved along the support plane. If two support carriage elements are used to support the workpiece part, the two support carriage elements can be moved apart in opposite directions to one another, in particular synchronously in a mirror image, to eject the workpiece part. The workpiece part, which initially rests on one or both of the support carriage elements and is released by means of the first and / or second removal oscillation process, then falls between the support carriage elements, i.e. through the support carriage gap, which increases due to the opposing movement of the support carriage elements, for example into a collecting device.

[0031] To prevent the support element, in particular the support carriage, from colliding with the workpiece part during its movement to position it beneath it, for example because the workpiece part protrudes downwards from the remaining workpiece, a further possible embodiment provides for the support element to be lowered downwards by a safety offset before the start of the movement to position the support surface beneath the workpiece part. This means that the support element is moved beneath the workpiece part in a lowered state. To then establish surface contact between the support surface and the workpiece part, the support element can be raised until the support surface touches the underside of the workpiece part.

[0032] According to a further possible embodiment, the support element has an ejection pin arranged beneath the workpiece part and extendable upwards, wherein the support surface is at least partially formed by an end face of the ejection pin being placed flat against an underside of the workpiece part. The support element can have two or more such ejection pins, which are in particular part of an ejection pin unit, wherein two or more of the ejection pins are extended and placed against the underside of the workpiece part depending on the geometry of the workpiece part. In particular, when the workpiece part is ejected upwards from the remaining workpiece - for example with the aid of the ejection pin orof the ejection pins, it can generally be provided, i.e. across all embodiments, that the signs of the formulas F1, F2, F3, F4 are reversed, which then results in the reversed stroke distances for the respective removal oscillation process, for example for workpiece thickness t = 2 mm: Aw. oi = -0.5 mm and Awui = 1.5 mm or Aw O 2 = -1 .5 mm and Aw U 2 = 2.5 mm.

[0033] According to a possible further development, the counter-bearing element comprises an ejection punch arranged above the workpiece part and extendable downwards. The counter-bearing surface is formed at least partially by a pressing face of the ejection punch against an upper side of the workpiece part. In particular, the ejection punch is fixed to the cutting head of the laser cutting machine.

[0034] Further advantages, features, and details of the invention can be derived from the following description of possible embodiments and from the drawings. The features and combinations of features mentioned above in the description, as well as the features and combinations of features shown below in the description of the figures and / or in the figures alone, can be used not only in the respective specified combination, but also in other combinations or on their own, without departing from the scope of the invention.

[0035] The drawing shows

[0036] Fig. 1 is a schematic view of a device, here a laser cutting machine, during the separating processing of a workpiece plate, whereby a residual workpiece and a workpiece part to be removed from it are formed,

[0037] Fig. 2 is a schematic view of the laser cutting machine, wherein the workpiece part is clamped by means of an ejection punch and a counter bearing element,

[0038] Fig. 3 is a schematic view of the laser cutting machine, wherein a first removal oscillation process is carried out to remove the workpiece part from the remaining workpiece,

[0039] Fig. 4 is a schematic view of the laser cutting machine, wherein a second removal oscillation process is carried out to remove the workpiece part from the remaining workpiece, and Fig. 5 is a flowchart illustrating an example of a control program provided for the laser cutting machine and comprising a method for removing the workpiece from the remaining workpiece, wherein Figure 5 comprises Figures 5a to 5d.

[0040] In the following, a method and a device 1, each for removing a workpiece part 2 from a remaining workpiece 3, are explained in a joint description. Identical and functionally equivalent elements in the figures are provided with the same reference numerals.

[0041] Fig. 1 shows a schematic view of the device 1, which here is designed as a laser cutting machine 4 or has the laser cutting machine 4. By means of the device 1 or laser cutting machine 4, a workpiece plate 5 is machined in a separating manner during its cutting operation, whereby the remaining workpiece 3 and the workpiece part 2 to be removed from it are formed. Accordingly, the device 1 or laser cutting machine 4 has a cutting head 6 designed as a laser cutting head. By means of the cutting head 6, a cutting laser beam 8 is emitted along a cutting axis 7 of the cutting head 6 during the cutting operation of the device 1, by means of which cutting gap 9 is generated in the workpiece plate 5, which cutting gap 9 completely surrounds the workpiece part 2 in order to form the workpiece part 2 and the remaining workpiece 3 from the workpiece plate 5.After completion of the laser cutting process, the workpiece part 2 and the remaining workpiece 3 are spaced apart from each other via the cutting gap 9, wherein the workpiece part 2 is arranged in a free-cut opening 10 of the remaining workpiece 3.

[0042] The device 1 further has a device surface 11 (for example, a machine table surface or a brush support surface), which forms a support plane W (W or UV plane of the coordinate system u|v|w shown in the figures). The workpiece plate 5 or the remaining workpiece 3 rests on the device surface 11 and consequently on the support plane W, wherein the workpiece plate 5 or the remaining workpiece 3 can be clamped onto the device surface 11. A support surface 12 of a support element 13 of the device 1 initially also lies in the support plane W, wherein the workpiece part 2 is supported by means of the support element 13 in that the workpiece part 2 rests on the support surface 12 via its underside 14.The support surface 12 is deflectable along the W axis of the coordinate system u|v|w relative to the support plane W; if the support surface 12 and the support plane W coincide, the support surface 12 is not deflected from the support plane W.

[0043] The support element 13 has, for example, an ejection pin (not shown) arranged beneath the workpiece part 2 and extendable upwards, wherein the support surface W is at least partially formed by a front surface of the ejection pin being placed flat against the underside 14 of the workpiece part 2. The support element 13 can have two or more such ejection pins, which are in particular part of an ejection pin unit, wherein two or more of the ejection pins are extended and placed against the underside 14 of the workpiece part 2 depending on a geometry of the workpiece part 2.

[0044] In this example, the support element 13 has a support carriage 15 movable along the support plane W beneath the workpiece part 2. A carriage vertical center axis 16 of the support carriage 15 and the cutting axis 7 of the cutting head 6 coincide in a first carriage operating mode, in this example the cutting operating mode of the device 1, and are coupled to one another in a synchronous manner—in this case by software or control technology. For example, the support carriage 15 has two support carriage elements 17 that are spaced from one another by a support carriage gap 18, as can be seen from the detailed illustration D in Fig. 1. In the cutting operating mode of the device 1, the cutting laser beam 8 runs centrally between the support carriage elements 17, i.e., centrally through the support carriage gap 18.The support surface 12 of the support element 13 (here the support carriage 15) is formed in this example by a support carriage surface 19 of the support carriage 15, wherein the support carriage surface 19 comprises a respective support carriage partial surface 20 of the respective support carriage element 17. The support carriage elements 17 are movable and controllable in opposite directions to enlarge or reduce the support carriage gap 18 and are synchronously movable and controllable.It is particularly provided that after the laser cutting process, the support carriage elements 17 are moved apart synchronously in a mirror image, so that the workpiece part 2 initially resting on one or both of the support carriage elements 17 - when it is completely detached from the remaining workpiece 3 after the laser cutting process - falls between the support carriage elements 17, i.e. through the support carriage gap 18 which increases due to the counter-symmetrical movement of the support carriage elements 17, for example into a collecting device of the device 1.

[0045] In the present case, the device 1 has a sensor unit 21 configured to detect the workpiece part 2 remaining in the free-cut opening 10 after the laser cutting process. The sensor unit 21 here has a camera and / or an infrared sensor for detecting material flashing. In the method, the sensor unit 21 detects the workpiece part 2 remaining in the free-cut opening 10. For example, a laser test pulse is emitted into the free-cut opening 10 by the cutting head 6. When the laser test pulse strikes material in the free-cut opening 10, the material flashes, and this material flashing is detected by the sensor unit 21. Thus, there is material in the free-cut opening 10, for example, the workpiece part 2 that was not properly removed from the free-cut opening 10.If no material flash is detected, the laser inspection pulse has passed through the cut-out opening 10 without hitting any material. Therefore, there is no material in the cut-out opening 10, which means that the workpiece part 2 was properly removed from the remaining workpiece 3.

[0046] Fig. 2 shows that the support element 13, in this case the support carriage 15, is positioned beneath the remaining workpiece part 2 during the process, particularly when it has been detected that the workpiece part 2 is still located in the free-cut opening 10 after the laser cutting process, such that the support surface 12 of the support element 13, in this case the support carriage surface 19 of the support carriage 15, and the underside 14 of the workpiece part 2 are in contact with one another. Fig. 2 shows that one of the support carriage elements 17 has been moved beneath the workpiece part 2 to support the workpiece part 2. In order to move the support element 13 or support carriage 15, it is provided that a support element actuator, which is designed to move the support element 13, is switched into a decoupling operating mode in which the support element 13 and the cutting head 6 can be moved independently of one another.The support surface 12 is then positioned beneath the workpiece part 2 by moving the support element 13 in decoupling mode. To prevent the support element 13 or the support carriage 15 from colliding with the workpiece part 2 when positioned beneath it, for example because the workpiece part 2 protrudes from the remaining workpiece 3 counter to the W direction, the support element 13 is lowered counter to the W direction by a safety offset before beginning the movement to position the support surface 12 beneath the workpiece part 2. The support element 13 is moved beneath the workpiece part 2 in the lowered state and, in order to establish surface contact between the support surface 12 and the workpiece part 2, is raised in the W direction until the support surface 12 touches the underside 14 of the workpiece part 2.

[0047] During the process, a counter-bearing element 22 is further positioned over the workpiece part 2 in such a way that a counter-bearing surface 23 of the counter-bearing element 22 and an upper side 24 of the workpiece part 2 touch each other flatly, whereby the workpiece part 2 is clamped between the support surface 12 and the counter-bearing surface 23. According to the figures, the device 1 has for this purpose an ejection punch 25 forming the counter-bearing element 22, which is fixed to the cutting head 6 and is adjustable or movable along the W-axis of the device 1 between a retracted position (see Fig. 1) and an extended position (see Fig. 2 and Fig. 3).By means of the ejection punch 25, whose end face facing opposite the W direction forms the counter-bearing surface 23, and the support element 13 (here the support carriage 15), the workpiece part 2 is clamped during travel along the W direction by, on the one hand, moving the counter-bearing element 22 under the workpiece part 2 as described and resting against it, and, on the other hand, adjusting the ejection punch 25 into its extended position until its end face or the counter-bearing surface 23 rests against the top side 24 of the workpiece part 2. In particular, the ejection punch 25 is clamped onto the top side 24 of the workpiece part 2.

[0048] A first removal oscillation process Ei is then carried out, in which the support surface 12 and the counter-bearing surface 23 are moved upwards and / or downwards several times, while the workpiece part 2 is clamped between the support surface 12 and the counter-bearing surface 23. Fig. 3 shows the device 1 by means of which the first removal oscillation process Ei is carried out. The workpiece part 2 is moved - in each case with reference to its underside 14 - for example several times above the support plane W upwards and back again into the support plane W, i.e. between the support plane W and an upper reversing plane W arranged above the support plane W. o . Furthermore, the workpiece part 2 can be moved several times below the support plane W downwards and back again into the support plane W, i.e. between the support plane W and a lower reversal plane W arranged below the support plane W u. In addition, it is conceivable that the workpiece part 2 is repeatedly moved between the upper reversal plane Wo arranged above the support plane W and the lower reversal plane W arranged below the support plane W u The repeated movement of the support surface 12 and the counter-bearing surface 23, and consequently of the workpiece part 2, occurs in the first removal oscillation process Ei, for example, purely translationally, i.e. purely vertically.

[0049] In the present case, an upper stroke distance Aw0, by which the clamped workpiece part 2 is moved upwards from the support plane W, for example into the upper reversal plane W o , maximum 5 mm. Furthermore, the lower stroke distance Aw u , by which the clamped workpiece part 2 is moved downwards from the support plane W, for example into the lower reversal plane W u, maximum 5 mm. In this example, a first upper stroke distance Awoi is determined, by which the workpiece part 2 is moved in the first removal oscillation process Ei from the support plane W into a first upper reversal plane W oi - that is, upwards - is calculated based on a thickness t of the workpiece part 2, using the formula F1 :

[0050] . (-0.5 mm + 0.5 ■ t, t < 4 mm

[0051] Aw o

[0052] 0 11 = < . r'F1. ( 1.5 mm, t > 4 mm

[0053] Furthermore, in this example a first lower stroke distance Aw u i, by which the workpiece part 2 is deflected in the first distance oscillation process Ei from the support plane W into a first lower reversal plane Wui - that is, downwards - is calculated based on the workpiece part thickness t, using the formula F2:

[0054] . (—0.5 mm — 0.5 • t, ​​t < 4 mm

[0055] Aw ul = F2.

[0056] ( —2.5 mm, t > 4 mm

[0057] During the process, after the first removal oscillation process Ei, the sensor unit 21 detects, as described above, whether the workpiece part 2 to be removed from the remaining workpiece 3 is still located in the free-cut opening 10 or has been expelled from the remaining workpiece 3 as desired using the first removal oscillation process Ei. If it is detected that the workpiece part 2 is still located in the free-cut opening 10, a second removal oscillation process E2 is carried out. In the second removal oscillation process E2, the support surface 12 and the counter-bearing surface 23 are moved upwards and / or downwards several times while the workpiece part 2 is clamped between the support surface 12 and the counter-bearing surface 23, wherein the workpiece part 2 is moved further upwards and / or further downwards than in the first removal oscillation process Ei.

[0058] Fig. 4 shows the device 1 by means of which the second removal oscillation process E2 is carried out. In the second removal oscillation process E2, the workpiece part 2 is moved, for example, several times over the support plane W upwards into the upper reversal plane W - in each case with reference to its underside 14. o and moved back to the support plane W. Furthermore, the workpiece part 2 can be moved several times below the support plane W into the lower reversal plane W u In addition, it is conceivable that the workpiece part 2 is moved several times between the upper reversal plane W o and the lower reversal level W u In any case, the upper reversal plane W o , into which the underside 14 of the workpiece part 2 is moved upwards in the second removal oscillation process E2, and the lower reversal plane W u, into which the underside 14 of the workpiece part 2 is moved downwards in the second removal oscillation process E2, further away from the support plane W than in the first removal oscillation process Ei. The repeated movement of the support surface 12 and the counter-bearing surface 23, and consequently of the workpiece part 2, takes place in the second removal oscillation process E2, for example, purely translationally, i.e. purely vertically.

[0059] In this case, the upper stroke distance Aw0, by which the workpiece part 2 is moved upwards from the support plane W in the second removal oscillation process E2, and the lower stroke distance Aw uby which the workpiece part 2 is moved downwards from the support plane W in the second removal oscillation process E2, a maximum of 5 mm in each case. In this example, a second upper stroke distance Aw02, by which the workpiece part 2 is deflected in the second removal oscillation process E2 from the support plane W into a second upper reversal plane W02 - i.e. upwards - is calculated based on the workpiece part thickness t, using the formula F3: mm + 1, t < 4 mm O 3.5 r mm, 4- / I F3. t > 4 mm

[0060] Furthermore, in this example a second lower stroke length Aw U 2, by which the workpiece part 2 in the second removal oscillation process E2 from the support plane W into a second lower reversal plane W U 2 - that is, downwards - is calculated based on the workpiece thickness t, using the formula F4: 0.5 mm - t, t < 4 mm -4.5 r mm, 4 F4. t > 4 mm

[0061] Furthermore, in the process in this example, before the first removal oscillation process Ei and / or before the second removal oscillation process E2, an attempt is made to move the workpiece part 2 once by the complete stroke distance Aw0, Aw u , Aw o i, Aw u i, Aw02, Aw U 2 from the support plane W, whereby a triggering condition of an overload protection device of the device 1 is monitored. If the overload protection device is triggered during this deflection attempt, the corresponding stroke distance Aw0, Aw u , Aw o i, Aw u i, Aw02, Aw U 2 is reduced such that the overload protection device is not triggered during the corresponding distance oscillation process Ei and / or E2. In other words, corrected stroke distances are used for the distance oscillation process Ei and / or E2 if the overload protection device was triggered during the preceding deflection test.

[0062] In particular, when the workpiece part 2 is ejected upwards from the remaining workpiece 3 - for example with the aid of the ejection pin(s) - it can be provided that the signs of the formulas F1, F2, F3, F4 are reversed, which then results in reversed stroke distances for the respective removal oscillation process.

[0063] According to the example, the repeated movement of the workpiece part 2 is carried out in an oscillating manner at a frequency of 5 Hz to 15 Hz in the first removal oscillation process Ei and / or in the second removal oscillation process E2. Furthermore, the movement of the workpiece part 2 in the first removal oscillation process Ei and / or in the second removal oscillation process E2 occurs, for example, ten times.

[0064] In this example, a technically reliably achievable maximum acceleration of a corresponding actuator designed to move the support surface 12 and the counter-bearing surface 23 is used as a distance oscillation acceleration with which the workpiece part 2 is moved in the respective distance oscillation process E1 / E2. A technically reliably achievable maximum feed rate of the corresponding actuator is used as a distance oscillation velocity with which the workpiece part 2 is moved in the respective distance oscillation process E1 / E2.

[0065] A frequency of the distance oscillation results from the stroke distances Awoi, Awui, AWO2, AW shown above U2 in conjunction with an axis dynamics of the device 1 or laser cutting machine 4. With a technically reliably achievable maximum acceleration and a technically reliably achievable maximum feed rate, for the first removal oscillation process Ei, for example, a frequency of 12.0 Hz is achieved with a workpiece thickness t = 1 mm and a frequency of 7.7 Hz with a workpiece thickness t = 4 mm. For the second removal oscillation process E2, a frequency of 9.9 Hz is achieved with a workpiece thickness t = 1 mm and a frequency of 6.2 Hz with a workpiece thickness t = 4 mm.

[0066] The detachment or removal of the workpiece part 2 from the remaining workpiece 3 is further assisted by a horizontal movement, in this example a horizontal oscillation process, being carried out simultaneously with, before and / or after the first removal oscillation process Ei and / or second removal oscillation process E2 by means of the support element 13 or support carriage 15 which rests flat against the underside 14 of the workpiece part 2 and / or against an underside of the remaining workpiece 3. For this purpose, the support element 13 is moved along the W plane or support plane W, in this case oscillated horizontally two or more times. Fig. 5 shows in Figs. 5a-5d a flow chart to illustrate an example of a control program provided for the laser cutting machine 4, which program comprises the method for removing the workpiece part 2 from the remaining workpiece 3. In the program shown in Fig.In step S1 of the control program shown in Figure 5a, the sensor unit 21 detects whether the workpiece part 2 is still located in the cut-out opening 10 after the laser cutting process L, in which the workpiece part 2 was cut free from the workpiece plate 5 or from the remaining workpiece 3, and after the workpiece part 2 was released from falling out of the remaining workpiece 3 by moving the support element 13 away. If this is not the case, a production program P is continued with a next laser cutting process L.

[0067] If, however, the workpiece part 2 is still undesirably in the free-cut opening 10, an attempt is made in a step S2 to remove the workpiece part 2 from the free-cut opening 10 by blowing it out with protective gas. In a step S3, a check is then made again to determine whether the workpiece part 2 is still in the free-cut opening 10. If this is not the case, the production program P is continued.

[0068] If, however, the workpiece part 2 is still in the free-cut opening 10, a check is carried out in a step S4 to determine whether the use of the ejection punch 25 is possible. If the use of the ejection punch 25 is not possible because an outer contour of the workpiece part 2 to be ejected and consequently a contour of the free-cut opening 10 is smaller than an outer contour of the ejection punch 25, the support carriage 15, i.e., the bearing element 13, is moved under the workpiece part 2 in a step S5. This is then directly followed by a step S13, which is explained further below, i.e., omitting steps S6 to S12 (in Fig. 5 via reference b1).

[0069] If, however, it is determined in step S4 that the free-cut opening 10 is larger than the outer contour of the ejection punch 25, the support element actuator is switched to the decoupling operating mode in a step S6. Furthermore, in a step S7, a cutting head actuator is switched to a decoupling operating mode in order to be able to move or control the cutting head 6 independently of the remaining workpiece 3 or the workpiece plate 5. This allows the ejection punch 25 fixed to the cutting head 6 to be moved or controlled independently of the remaining workpiece 3 or the workpiece plate 5. In a step S8, the ejection punch 25 is then moved to a location specified in a cutting plan of the production program P, at which location the ejection punch 25 can protrude collision-free through the free-cut opening 10 by extending into its extended position.In a step S9, which can occur simultaneously with step S8, the support element 13, in this case the support carriage 15, is lowered by the safety offset, in this case by 10 mm against the W direction. After step S8 and / or S9, step S10 is executed, in which the ejection punch 25 is moved towards the upper side 24 of the workpiece part 2 until the ejection punch 25 rests directly on the upper side 24 of the workpiece part 2. In this case, it is provided in particular that end position monitoring of the ejection punch 25 is deactivated. Before, simultaneously, or after this, in a step S11, the support element 13 is moved under the workpiece part 2 and, if necessary, raised as described above.

[0070] Via reference b2, steps S10 and S11 are followed by step S12 shown in Fig. 5b, in which the cutting head 6 together with the ejection punch 25 fixed thereto are lowered by a pre-tensioning amount, whereby the workpiece part 2 is clamped between the support element 13 and the ejection punch 25. Step S12 or directly step S5 (see reference b1) is followed by step S13, in which, based on the workpiece part thickness t, it is decided which of the formulas F1, F2 the first stroke distances Awui, Awoi are to be calculated. If the workpiece part thickness t is equal to or less than 4 mm, the first stroke distances Aw u i, Aw oi calculated in a step S14 according to formula F1, whereas the first stroke distances Aw u i, Aw oi in step 15 according to formula F2 if the workpiece thickness t is greater than 4 mm. In step S14 or S15, the support surface 12 is also moved to the first upper reversal plane Woi moved.

[0071] In a step S16 following step S14 or S15, it is detected whether during the initial movement of the support surface 12 into the first upper reversal plane W oi the overload protection device has been triggered. If so, in a step S17 the support surface 12 is moved to the triggering position. In a step S18 following step S17, the first upper reversing plane W oi or the first upper stroke Aw oi recalculated. If not, in a step S19 the first reversal plane W calculated in step S14 or S15 oi or first stroke distance Aw oi used for the subsequent first distance oscillation process Ei. In steps S20 and S21, the support surface 12 between the support plane W and the first upper reversal plane W oi or between the support plane W and the first lower reversal plane W uior oscillates between the first reversal planes Wui, Woi, as explained above. By means of a counting step S22, the number of times a removal oscillation period of the first removal oscillation process Ei has been carried out is recorded. By means of reference c, step S22 - if the removal oscillation period of the first removal oscillation process Ei has been carried out as often as specified, for example ten times - is followed by step S23 shown in Fig. 5c, in which it is checked again whether the workpiece part 2 is still in the free cut opening 10 after the first removal oscillation process Ei and after the workpiece part 2 has been released from falling out of the remaining workpiece 3 by moving the support element 13 away. If this is not the case, the production program P is continued, whereby an entry can optionally be made in a log file (represented by LOG in Fig. 5c).This entry contains, for example, information about how often the first removal oscillation process Ei had to be started during the execution of the production program or how often the workpiece part 2 undesirably remained behind in the remaining workpiece 3 during the production of a series of workpiece parts 2. If the workpiece part 2 is still sitting in the free-cut opening 10 despite the first removal oscillation process Ei having been carried out, step S24 is executed, in which the cutting head 6 together with the ejection punch 25 fixed to it are lowered by the pretensioning amount, whereby the workpiece part 2 is clamped between the counter-bearing element 22 and the ejection punch 25. Step S24 is followed by step S25, in which a decision is made, based on the workpiece part thickness t, as to which of the formulas F3, F4 the second stroke distances AWU2, ÄWO2 are to be calculated.If the workpiece thickness t is equal to or less than 4 mm, the second stroke lengths Aw. U 2, Aw O 2 is calculated in a step S26 according to formula F3, whereas the second stroke distances Aw U 2, Aw O 2 can be calculated in step S27 according to formula F4 if the workpiece thickness t is greater than 4 mm. In step S26 or S27, the support surface 12 is also moved to the second upper reversal plane W02.

[0072] In a step S28 following steps S26 or S27, it is determined whether the overload protection device was triggered during the initial movement of the support surface 12 to the second upper reversing plane W02. If so, in a step S29, the support surface 12 is moved to the triggering position. In a step S30 following step S29, the second upper reversing plane W02 is then moved to the second upper stroke distance Aw. oirecalculated. If not, in a step S31 the second reversal plane W02 or second stroke distance Aw calculated in step S26 or S27 O 2 is used for the subsequent second removal oscillation process E2. In steps S32 and S33, the support surface 12 is moved between the support plane W and the second upper reversal plane W02 or between the support plane W and the second lower reversal plane W U 2 or between the second reversal levels W U 2, W02 oscillates, as explained above. A counting step S34 records how often the distance oscillation period of the second distance oscillation process E2 has been executed.

[0073] By reference d, step S34 - if the removal oscillation period of the second removal oscillation process E2 has been carried out as often as specified, for example ten times - is followed by step S35 shown in Fig. 5d, in which step a further check is carried out to determine whether the workpiece part 2 is still located in the free-cut opening 10 after the second removal oscillation process E2 and after the support element 13 has been moved away to prevent the workpiece part 2 from falling out of the remaining workpiece 3. If this is not the case, the production program P is continued, and optionally a further entry can be made in the log file (shown in Fig. 5d with LOG). This further entry contains, for example, information about how often the second removal oscillation process E2 had to be started or not during the execution of the production program.how often, during the production of a series of workpiece parts 2, the workpiece part 2 has remained behind in the remaining workpiece 3 despite the first removal oscillation process Ei having been carried out. If the workpiece part 2 is still sitting in the free-cut opening 10 despite the second removal oscillation process E2 having been carried out, step S36 is executed, in which the ejection punch 25 fixed to the cutting head 6 is moved into its fully retracted position, whereby the clamping of the workpiece part 2 between the support element 13 and the counter-bearing element 22 is released. Step S36 is followed by step S37, in which the support element 13 or the support carriage 15 is repositioned under the cutting head 6 such that the carriage vertical center axis 16 and the cutting axis 7 coincide again.Subsequently, in step S38, the support element and cutting head factors are each switched from their decoupling operating modes to a respective coupling operating mode, so that the movement of the support element 13 and the cutting head 6, as well as the movement of the cutting head 6 and the remaining workpiece 3 or the workpiece plate 5, are synchronized in terms of control technology. This creates the prerequisites for the laser cutting process L in / on the device 1, so that in a step S39—as a last resort—the free-cut opening 10 is recut to separate the workpiece part 2 from the remaining workpiece 3. LIST OF REFERENCE SYMBOLS.

[0074] 1 device Awo upper lifting section

[0075] 2 Workpiece part W U 2 second lower reversal level

[0076] 3 Remaining workpiece W02 second upper reversing level

[0077] 4 laser cutting machine AW U 2 second lower lifting section

[0078] 5 Workpiece plate AWO2 second upper stroke

[0079] 6 cutting head

[0080] 7 Cutting axis

[0081] 8 Cutting laser beam

[0082] 9 Cutting gap

[0083] 10 free cut opening

[0084] 11 Device surface

[0085] 12 Support surface

[0086] 13 Support element

[0087] 14 Bottom

[0088] 15 support carriages

[0089] 16 Slide vertical center axis

[0090] 17 Support slide element

[0091] 18 Support carriage gap

[0092] 19 Support carriage surface

[0093] 20 Support slide surface

[0094] 21 Sensor unit

[0095] 22 Counter bearing element

[0096] 23 Counter bearing surface

[0097] 24 Top

[0098] 25 ejection stamps

[0099] W support plane

[0100] W u lower reversal level

[0101] Where upper reversal level

[0102] Wu1 first lower reversal level

[0103] Wo1 first upper reversal level

[0104] Awui first lower lifting section

[0105] Awoi first upper lift section

[0106] Aw u lower stroke

Claims

PATENT CLAIMS 1. A method for removing a workpiece part (2) from a free-cut opening (10) of a residual workpiece (3), wherein the workpiece part (2) was formed by forming the free-cut opening (10) in the residual workpiece (3) by means of separating machining, wherein - the workpiece part (2) is supported in a support plane (W) by a support surface (12) of a support element (13), - a counter-bearing element (22) is positioned over the workpiece part (2) in such a way that a counter-bearing surface (23) of the counter-bearing element (22) and an upper side (24) of the workpiece part (2) touch each other, whereby the workpiece part (2) is clamped between the support surface (12) and the counter-bearing surface (23), - the support surface (12) and the counter bearing surface (23) are moved upwards and / or downwards several times in a first removal oscillation process (Ei), while the workpiece part (2) is clamped between the support surface (12) and the counter bearing surface (23).

2. Method according to claim 1, characterized in that an upper stroke distance (Aw0), by which the clamped workpiece part (2) is moved upwards from the support plane (W), and / or a lower stroke distance (Aw u ) by which the clamped workpiece part (2) is moved downwards from the support plane (W) is 5 mm or less.

3. Method according to one of the preceding claims, characterized in that based on a workpiece part thickness (t) a first upper stroke distance (Aw o i), by which the workpiece part (2) is moved upwards from the support plane (W) in the first removal oscillation process (Ei), using the formula + 0.5 • t, t < 4 mm > _ F 1.5 mm, t > 4 mm is calculated, and / or a first lower stroke length (Aw u i), by which the workpiece part (W) is moved downwards from the support plane (W) in the first removal oscillation process (Ei), by means of the formula . (—0.5 mm — 0.5 • t, t < 4 mm Aw ul = F. ( —2.5 mm, t > 4 mm is calculated.

4. Method according to one of the preceding claims, characterized in that, if it is determined after the first removal oscillation process (Ei) that the workpiece part (2) is still sitting in the free-cut opening (10), the support surface (12) and the counter-bearing surface (23) are moved upwards and / or downwards several times in a second removal oscillation process (E2) while the workpiece part (2) is clamped between the support surface (12) and the counter-bearing surface (23), the workpiece part (2) being moved further upwards and / or further downwards in the second removal oscillation process (E2) than in the first removal oscillation process.

5. The method according to claim 4, characterized in that based on a workpiece part thickness (t) a second upper stroke distance (Äw O 2), by which the workpiece part (2) is moved upwards from the support plane (W) in the second removal oscillation process (E2), using the formula mm + 1, t < 4 mm O 3.5 r mm 4- / I F3 , t > 4 mm is calculated, and / or a second lower stroke length (Aw U 2), by which the workpiece part (2) is moved downwards from the support plane (W) in the second removal oscillation process (E2), using the formula 0.5 mm - t, t < 4 mm -4. r 4 F4 ,5 mm, t > 4 mm is calculated.

6. Method according to one of claims 2 to 5, characterized in that before the first removal oscillation process (Ei) and / or before the second removal oscillation process (E2) an attempt is made to move the workpiece part (2) once by the complete stroke distance (Aw0, Aw u , Aw o i, Aw u i, Aw02, Aw U 2) from the support plane (W), whereby a triggering condition of an overload protection device is monitored, and if the overload protection device is triggered during this deflection attempt, the corresponding stroke distance (Aw0, Aw u , Aw o i, Aw u i, Aw02, Aw U2) is reduced in such a way that the overload protection device is not triggered during the corresponding distance oscillation process (Ei, E2).

7. Method according to one of the preceding claims, characterized in that the repeated movement of the workpiece part (2) in the first removal oscillation process and / or in the second removal oscillation process is carried out in an oscillating manner at a frequency of 5 Hz to 15 Hz.

8. Method according to one of the preceding claims, characterized in that the movement of the workpiece part in the first removal oscillation process (Ei) and / or in the second removal oscillation process (E2) takes place ten times.

9. Method according to one of the preceding claims, characterized in that - a distance vibration acceleration with which the workpiece part (2) is moved upwards and / or downwards several times is a maximum acceleration that can be reliably achieved by means of a vibration actuator, and / or - the removal oscillation speed with which the workpiece part (2) is moved upwards and / or downwards several times is a maximum feed speed that can be reliably achieved by means of the oscillation actuator.

10. Method according to one of the preceding claims, characterized in that a horizontal movement, in particular a horizontal oscillation process, is carried out by means of the support element (13) simultaneously with, before and / or after one or both of the distance oscillation processes (Ei, E2).

11. Method according to one of the preceding claims, characterized in that the support element (13) has a support carriage (15) which is movable along the support plane (W) under the workpiece part (2), and the support surface (12) is at least partially formed by positioning a support carriage surface (19) of the support carriage (15) under the workpiece part (2) and placing it flat against an underside (14) of the workpiece part (2).

12. Method according to one of the preceding claims, characterized in that the support element (13) has an ejection pin which can be extended upwards under the workpiece part (2), and the support surface (12) is at least partially formed by an ejection pin end face of the ejection pin being placed flat against an underside (14) of the workpiece part (2).

13. Method according to one of the preceding claims, characterized in that the counter bearing element (22) has a downwardly extendable support member (21) pressing die (25), and the counter bearing surface (23) is at least partially formed by pressing a pressing die end face of the pressing die (25) against a top side (24) of the workpiece part (2).

14. Device (1) configured to carry out the method according to one of the preceding claims for removing the workpiece part (2) from the remaining workpiece (3).

15. Device (1) according to claim 14, characterized by a cutting head (6) for separating the workpiece plate (5), from which the workpiece part (2) and the remaining workpiece are cut in a cutting operation of the device (1). (3) are formed.

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