Lighting arrangement

Abstract

A lighting arrangement comprises a carrier and a plurality of M-LEDs and one or more N-LEDs arranged on a carrier. The N-LEDs and the M-LEDs have different surface areas according to a ratio that is equal to or larger than 10. A phosphor layer covers the plurality of M-LEDs and the one or more N-LEDs. The M-LEDs are configured to emit blue first LED light and the one or more N-LEDs are configured to emit second blue LED light. The phosphor layer is configured to at least partly convert first and second LED light into first and second converted light, respectively. The carrier comprises elevations extending from a carrier base level, on which elevations the M-LEDs are arranged, whereas the N- LEDs are not arranged on the elevations. The phosphor layer above the M-LEDs and the N- LEDs have different thickness.

Description

[0001] Lighting arrangement

[0002] FIELD OF THE INVENTION

[0003] The present invention generally relates to lighting arrangements configured to provide white light. More specifically, the present invention is related to a lighting arrangement comprising a plurality of light emitting diodes (LEDs).

[0004] BACKGROUND OF THE INVENTION

[0005] A trend in the development of LED lighting is the development of lighting arrangements capable of providing white light having any desired color temperature. For this purpose, the lighting arrangements are configured with a combination of LED’s. While it is possible to configure a lighting arrangement with an appropriate combination of LEDs in order to obtain a desired luminous flux and / or a desired light source contour, a remaining issue is to optimize the way in which the LED’s are combined in the lighting arrangement to achieve such desired light characteristics.

[0006] SUMMARY OF THE INVENTION

[0007] It is of interest to provide a lighting arrangement that overcomes drawbacks of the prior art as discussed above.

[0008] This and other objects are achieved in a first aspect by providing a lighting arrangement having the features of the appended independent claim. Preferred embodiments are defined in the appended dependent claims.

[0009] Hence, according to the present invention, there is provided a lighting arrangement configured to provide arrangement light. The lighting arrangement comprises a carrier and a plurality of first light emitting diodes (M-LEDs), having a first LED thickness (LEDT1), arranged on the carrier. Each of the plurality of M-LEDs comprises a die having a first surface area (SAI) wherein SAI has a largest spatial extent (SEI) that is less than or equal to 100 micrometers. One or more second light emitting diodes (N-LEDs), having a second LED thickness (LEDT2), are arranged on the carrier. Each of the one or more N- LEDs comprises a die having a second surface area (SA2), wherein SA2 has a largest spatial extent (SE2) that is greater than or equal to 300 micrometers. The surface area of the dies may also be defined as the surface area of a (major) light output surface of the respective die.

[0010] A phosphor layer covers the plurality of M-LEDs and the one or more N- LEDs.

[0011] The plurality of M-LEDs are configured to emit first LED light (LG1) having a first emission peak wavelength (XI) in a wavelength range of blue light (B) and the one or more N-LEDs are configured to emit second LED light (LG2) having a second emission peak wavelength (X2) in a wavelength range of blue light. In this context, blue light is light in a wavelength range from 430nm to 490nm. The phosphor layer is configured to at least partly (e.g. partly) convert first LED light into first converted light and at least partly (e.g. partly) convert second LED light into second converted light. A ratio (Rl), defined by SA2 / SA1, is equal to or larger than 10. The carrier comprises one or more elevations having a first height (Hl) (with respect to and) extending from a carrier base level, on which elevations the M- LEDs are arranged, whereas the N-LEDs are not arranged on the elevations. The phosphor layer above the plurality of M-LEDs has a first thickness (Tl) and the phosphor layer above the one or more N-LEDs has a second thickness (T2), wherein 0.85<Tl / T2<1.15, preferably O.9<T1 / T2<1.1, more preferably 0.95<Tl / T2<1.05, most preferably 0.97<Tl / T2<1.03.

[0012] Such a lighting arrangement provides an optimized desired luminous flux. The reason is that the optimized total die area can be selected based on using a particular combination of the N and M-LEDs. Furthermore, such a lighting arrangement provides improved homogeneous light. The reason is that the phosphor thickness above the different sized LEDs is (substantially) the same such that the amount of light conversion (and transmitted blue light) is also the same. Furthermore, such a lighting arrangement may provide a light source having an improved contour. The reason is that by using the M-LEDs the contour of the N-LEDs can be softened.

[0013] In embodiments, SA2 / SA1 may be at least 15, preferably at least 18, more preferably at least 20.

[0014] In embodiments, SA2 has a largest spatial extent (SE2) that may be greater than or equal to 400 micrometers, preferably at least 500 micrometers, more preferably at least 600 micrometers, most preferably at least 700 micrometers.

[0015] In embodiments, SAI has a largest spatial extent, SEI, that may be less than or equal to 80 micrometers, preferably at most 70 micrometers, more preferably at most 60 micrometers, most preferably at most 50 micrometers. In various embodiments, a combination of the plurality of M-LEDs and the phosphor layer provides first device light, wherein the first device light comprises i: the first converted light or ii: the first converted light and part of the first LED light. The first device light may be first white light having a first correlated color temperature (CCT1) in a range from 1700K to 6500K and / or a color rendering index of at least 80.

[0016] In various embodiments, a combination of the one or more N-LEDs and the phosphor layer provides second device light. The second device light comprises i: the second converted light or ii: the second converted light and part of the second LED light. The second device light may be second white light having a second correlated color temperature (CCT2) in a range from 1700K to 6500K and / or a color rendering index of at least 80. In a preferred embodiment, the difference between the first and second correlated color temperature may be at most 300K i.e. I CCT2-CCT1 I <300K, more preferably I CCT2-CCT1 I <200K.

[0017] That is, such a lighting device provides a homogeneous correlated color temperature (i.e. above the M-LEDs and the N-LEDs).

[0018] The carrier may comprise further elevations having a second height (H2) (with respect to and) extending from the carrier base level. One or more third light emitting diodes (I-LEDs) are arranged on these further elevations, whereas the N-LEDs are not arranged on these further elevations. The one or more I-LEDs have a third surface area (SA3) wherein the SA3 has a largest spatial extent (SE3) that is greater than or equal to 120 micrometers and equal to or smaller than 280 micrometers, and preferably H2<O.8*H1 or H2<O.5*H1. In various embodiments, a ratio, R4, defined by SA3 / SA1, is greater than or equal to 2. In various embodiments, a ratio, R5, defined by SA2 / SA3, is greater than or equal to 2.

[0019] Such a lighting arrangement provides a further optimized desired luminous flux. The reason is that the optimized total die area can be selected based on using a particular combination of the I-, N- and M-LEDs. Furthermore, such a lighting arrangement provides further improved homogeneous light. The reason is that the phosphor thickness above the different sized LEDs is (substantially) the same such that the amount of light conversion (and transmitted blue light) is also the same. Furthermore, such a lighting arrangement may provide a light source having a further improved contour. The reason is that by using the I- and M-LEDs the contour of the N-LEDs can be further softened.

[0020] Regarding the thickness of the LEDs, in various embodiments LEDT2>2*LEDT1.

[0021] That is, with such a difference in thickness between the thickness of the N- LEDs and the M-LEDs, the lighting arrangement is very needed especially with respect to improved homogenous lighting. In various embodiments, the sum of a height of the one or more elevations above the carrier base level and a thickness of the plurality of M-LEDs is between 0.9 and 1.1 times a thickness of the one or more N-LEDs, or the sum of a height of the further elevations above the carrier base level and a thickness of the plurality of I-LEDs is between 0.9 and 1.1 times a thickness of the one or more N-LEDs.

[0022] Such a lighting arrangement provides improved homogeneous light. The reason is that the phosphor thickness above the different sized LEDs is (substantially) the same such that the amount of light conversion (and transmitted blue light) is also the same.

[0023] The carrier may comprise carrier elevations extending from the carrier base level, the carrier elevations having a height (H) above the carrier base level. H may be between 0.9 and 1.1 times, preferably between 0.9 and 1.05 times, a height of the phosphor layer above the carrier base level.

[0024] That is, such configuration provides further improvement of the homogeneity of the light.

[0025] In various embodiments, the number of M-LEDs is X, the number of N-LEDs (102) is Y, wherein X is greater than or equal to 3 times Y, preferably at least 5 times Y. In embodiments, X is at least 20, preferably at least 30, more preferably at least 40, most preferably at least 50.

[0026] Such a ratio provides a lighting arrangement that provides a further optimized luminous flux.

[0027] TSAI may be defined as total surface area of all M-LEDs and TSA2 may be defined as a total surface area of all one or more N-LEDs. In various embodiments, a ratio (R2) defined by TSA2 / TSA1 is equal or greater than 2.

[0028] TSA3 may be defined as total surface area of all I-LEDs. In various embodiments, a ratio (R3) defined by TSA3 / TSA1 is equal or greater than 2.

[0029] By having such a ratio between the total surface areas of the N-LEDs and the M-LEDs, the cost of manufacturing the lighting arrangement is reduced. The reason is the cost per epi area is lower for the N-LEDs compared to the M-LEDs.

[0030] Each N-LED may comprise 4 sides, wherein at least two sides of the four sides is neighbored by at least 1 M-LED, preferably wherein each side is neighbored by at least 1 M-LED.

[0031] Such configurations provide an improved thermal management, i.e., such a configuration is easy to maintain at a desired temperature. The lighting arrangement may comprise a plurality of N elevations and / or further elevations. N may be at least 4, each elevation and / or further elevation may have at least 1 M-LED.

[0032] Such configurations provide an improved thermal management in terms of cooling.

[0033] Each elevation and / or further elevation may have a top surface having a surface area (ESAI) on which at least one M-LED is arranged, and ESA1 / SA1>3.

[0034] Such configurations provide an improved reliability of the lighting arrangement.

[0035] The elevations and / or the further elevations may comprise elevated circuits and bridging electrical connections of the M-LEDs and electrical connections (on a main part of the carrier below the elevations and / or the further elevations.

[0036] Such configurations provide an improved reliability of the connections.

[0037] The elevations and / or the further elevations may comprise thermally conductive material having a thermal conductivity of at least 100 W nti1K1and configured to transfer heat generated by the N-LEDs to a thermally conductive main part of the carrier below the elevations and / or the further elevations.

[0038] Such configurations provide an improved cooling of the lighting arrangement.

[0039] The carrier may be a printed circuit board (PCB) comprising electrical connections configured to provide electric connections between the plurality of M-LEDs and a driver and provide electric connections between the one or more N-LEDs and the driver. The elevations may comprise elevated circuits and bridging connectors configured to provide electric connections between the plurality of M-LEDs and the driver via the circuits of the carrier.

[0040] Such configurations provide improved reliability of the connections.

[0041] In a second aspect there is provided a LED lamp or a luminaire comprising the lighting arrangement as summarized above. Said LED lamp may comprise a base for electrically and mechanically connecting said lamp to a socket of a luminaire. Said LED lamp may comprise an envelope at least partly enclosing the lighting arrangement. Said luminaire may comprise an light exit window covering said lighting arrangement.

[0042] The LED lamp or luminaire of this further aspect provide effects and advantages that correspond to those summarized above in connection with the first aspect.

[0043] In embodiments, the LED lamp may comprises a connector configured to mechanically and electrically connect the LED lamp to a socket of a luminaire. In embodiments, the LED lamp may comprise a envelope at least partly enclosing the lighting arrangement.

[0044] In embodiments, the luminaire may comprise a light exit window to exit the arrangement light.

[0045] Further objectives of, features of, and advantages with, the present invention will become apparent when studying the following detailed disclosure, the drawings and the appended claims. Those skilled in the art will realize that different features of the present invention can be combined to create embodiments other than those described in the following.

[0046] BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The aspects of the present invention will now be described in more detail, with reference to the appended drawings showing embodiment(s) of the invention.

[0048] Fig. la schematically illustrates a top view of a lighting arrangement,

[0049] Fig. lb schematically illustrates a cross-sectional view A-A of the lighting arrangement illustrated in figure la,

[0050] Fig. 2 schematically illustrates a cross-sectional view of a lighting arrangement,

[0051] Fig. 3 schematically illustrates a cross-sectional view of a lighting arrangement,

[0052] Fig. 4 schematically illustrates a top view of an N-LED and four M-LEDs, Fig. 5 schematically illustrates a lighting arrangement connected to a driver via circuitry,

[0053] Fig. 6 schematically illustrates a cross-sectional view of a lighting arrangement connected to a driver via circuitry,

[0054] Fig. 7 schematically illustrates a lamp, and

[0055] Fig. 8 schematically illustrates a luminaire.

[0056] DETAILED DESCRIPTION

[0057] As illustrated in figures la, lb and 2, a lighting arrangement 100 configured to provide arrangement light comprises a carrier 151. A plurality of first M-LEDs 101 having a first LED thickness (LEDT1) are arranged on the carrier 151. Each of the plurality of M- LEDs 101 comprise a die 111 having a first surface area (SAI). SAI has a largest spatial extent (SEI) that is less than or equal to 100 micrometers. One or more N-LEDs 102 having a second LED thickness (LEDT2) 113 are arranged on the carrier 151. Preferably, LEDT2>2*LEDT1. Each of the N-LEDs 102 comprise a die 112 having a second surface area (SA2). SA2 has a largest spatial extent (SE2) that is greater than or equal to 300 micrometers. A ratio (Rl) defined by SA2 / SA1 is equal to or larger than 10. The surface areas SAI and SA2 of the dies 111, 112 are defined by planes parallel to an xy plane as indicated by xyz coordinate systems illustrated in figures la, lb and figure 2. It is however to be noted that the surface area of the dies 111, 112 may also be defined as the surface area of a (major) light output surface of the respective die 111, 112.

[0058] A total surface area of all M-LEDs 101 may be defined asTSAl and TSA2 defined as a total surface area of all N-LEDs 102. In some embodiments, a ratio R2 defined by TSA2 / TSA1 is equal or greater than 2.

[0059] A phosphor layer 160 covers the plurality of M-LEDs 101 and the one or more N-LEDs 102. The plurality of M-LEDs 101 are configured to emit first LED light (LG1) having a first emission peak wavelength ( I ) in a wavelength range of blue light (B), noting that blue light is light in a wavelength range from 430nm to 490nm. The one or more N- LEDs 102 are configured to emit second LED light (LG2) having a second emission peak wavelength (X2) in a wavelength range of blue light. The phosphor layer 160 is configured to at least partly convert first LED light into first converted light and at least partly convert second LED light into second converted light.

[0060] The carrier 151 comprises one or more elevations 152 having a first height (Hl) 154 extending from a carrier base level 153. The M-LEDs 101 are arranged on the elevations 152. As illustrated in figure la, the N-LEDs 102 are not arranged on the elevations.

[0061] The phosphor layer 160 above the plurality of M-LEDs 101 has a first thickness (Tl) 163 and the phosphor layer 160 above the N-LEDs 102 has a second thickness (T2) 163. A ratio between Tl and T2 is O.9<T1 / T2<1.1, preferably 0.95<Tl / T2<1.05, more preferably 0.97<Tl / T2<1.03.

[0062] Whereas figures la and lb illustrate a lighting arrangement 100 where one M- LED 101 is arranged on each elevation 152, figure 2 illustrates a lighting arrangement 100 where a plurality of M-LEDs 101 are arranged on each elevation 152.

[0063] Although figure 1 a illustrates an example of a lighting arrangement 100 having four N-LEDs 102 and 16 M-LEDs 101, lighting arrangements according to other embodiments may comprise other numbers of N-LEDs and M-LEDs. For example, defining the number of M-LEDs 101 by X and defining the number of N-LEDs 102 by Y, a ratio between X and Y may be such that X is greater than or equal to 3 times Y, preferably at least 5 times Y. In embodiments, X is at least 20, preferably at least 30, more preferably at least 40, most preferably at least 50.

[0064] With regard to light output by the lighting arrangement 100, a combination of the plurality of M-LEDs 101 and the phosphor layer 160 provides first device light, wherein the first device light comprises i: the first converted light or ii: the first converted light and part of the first LED light. The first device light is first white light having a first correlated color temperature (CCT1) in a range from 1700K to 6500K.

[0065] A combination of the one or more N-LEDs 102 and the phosphor layer 160 provides second device light. The second device light comprises i: the second converted light or ii: the second converted light and part of the second LED light. The second device light is second white light having a second correlated color temperature (CCT2) in a range from 1700Kto 6500K, and I CCT2-CCT1 I <300K.

[0066] As exemplified in figure 3, a lighting arrangement 100 may be configured such that the carrier 151 comprises further elevations 156 in addition to the elevations 152. These further elevations 156 may have a second height (H2) 157 and extend from the carrier base level 153. On these further elevations 156, one or more third light emitting diodes (I- LEDs) 103 may be are arranged. The one or more I-LEDs 103 may have a third surface area (SA3) wherein the SA3 has a largest spatial extent (SE3) that is greater than or equal to 120 micrometers and equal to or smaller than 280 micrometers. TSA3 may be defined as total surface area of all I-LEDs 103. In various embodiments, a ratio (R3) defined by TSA3 / TSA1 is equal or greater than 2.

[0067] In various embodiments, a ratio, R4, defined by SA3 / SA1, is greater than or equal to 2. In various embodiments, a ratio, R5, defined by SA2 / SA3, is greater than or equal to 2.

[0068] It is to be noted that, as for the embodiments illustrated in figures la and lb, the N-LEDs 102 are not arranged on any elevation but on the carrier 151 extending from the base level 153 of the carrier 151. With regard to the height of the elevations and the further elevations 156, H2<O.5*H1.

[0069] As illustrated in figure la and figures 2 and 3, the sum of a height 154 of the one or more elevations 152 above the carrier base level 153 and a thickness 114 of the plurality of M-LEDs 101 may be between 0.9 and 1.1 times a thickness 113 of the N-LEDs 102. Also or alternatively, the sum of a height 154 of the further elevations 156 above the carrier base level 153 and a thickness 115 of the plurality of I-LEDs 103 may be between 0.9 and 1.1 times a thickness 113 ofthe N-LEDs 102.

[0070] As illustrated in figure la, lb, figure 2 and figure 3, the carrier 151 may comprise carrier elevations 155 extending from the carrier base level 153. Such carrier elevations 155 may have a height (H) 156 above the carrier base level 153 and H may be between 0.9 and 1.1 times, preferably between 0.9 and 1.05 times, a height 164 of the phosphor layer 160 above the carrier base level 153.

[0071] As illustrated in figure 4, each N-LED 102 may comprise 4 sides, wherein at least two sides of the four sides is neighbored by at least 1 M-LED 101, preferably wherein each side is neighbored by at least 1 M-LED 101. Figure 4 illustrates an example where all four sides of the N-LED 102 is neighbored by one M-LED 101.

[0072] With regard to the one or more elevations 152 and, in some embodiments, the further elevations 156, the lighting arrangement 100 may comprise a plurality of N elevations 152 and / or further elevations 156, and wherein N is at least 4, each elevation 152 and / or further elevation 156 having at least 1 M-LED 101. For example, as exemplified in figure 3, the elevation 152 has two M-LEDs 101 and the further elevation 156 also has two M-LEDs 101. Moreover, each elevation 152 and / or further elevation 156 may have a top surface having a surface area (ESAI) on which at least one M-LED 101 is arranged, and ESA1 / SA1>3. Furthermore, the elevations 152 and / or the further elevations 156 may comprise thermally conductive material having a thermal conductivity of at least 100 W m1K1and configured to transfer heat generated by the N-LEDs 102 to a thermally conductive main part of the carrier 151 below the elevations and / or the further elevations 156.

[0073] As illustrated in figure 6, the elevations 152 and / or the further elevations 156 may comprise elevated circuits 171 and bridging electrical connections 172 of the M-LEDs and electrical connections 170 on a main part of the carrier 151 below the elevations 152 and / or the further elevations 156. Moreover, as illustrated in figure 5 and figure 6, the carrier 151 may be a printed circuit board (PCB) comprising electrical connections 170 configured to provide electric connections between the plurality of M-LEDs 101 and a driver 140 and provide electric connections between the N-LEDs 102 and the driver 140. The elevations 152 may comprise elevated circuits 171 and bridging connectors 172 configured to provide electric connections between the plurality of M-LEDs 101 and the driver 140 via the circuits 170 of the carrier 151. A lamp 200 or a luminaire 300 may comprise the lighting arrangement 100 as described above. This is exemplified in figures 7 and 8. Figure 7 illustrates a lamp 200 comprising one lighting arrangement 100 and a base 202 for electrically and mechanically connecting the lamp 200 to, e.g., a socket 302 of a luminaire 300 (as illustrated in figure 8) and an envelope 201 at least partly enclosing the lighting arrangement 100.

Claims

CLAIMS:

1. A lighting arrangement (100) configured to provide arrangement light, the lighting arrangement (100) comprising: a carrier (151); a plurality of first light emitting diodes, M-LEDs, (101) having a first LED thickness, LEDT1, (114) and arranged on said carrier (151), each of the plurality of M-LEDs(101) comprising a die (111) having a first surface area, SAI, wherein the SAI has a largest spatial extent, SEI, that is less than or equal to 100 micrometers; and one or more second light emitting diodes, N-LEDs (102) having a second LED thickness, LEDT2, (113) and arranged on said carrier (151), each of the one or more N-LEDs(102) comprising a die (112) having a second surface area, SA2, wherein the SA2 has a largest spatial extent, SE2, that is greater than or equal to 300 micrometers; a phosphor layer (160) covering the plurality of M-LEDs (101) and the one or more N-LEDs (102); wherein the plurality of M-LEDs (101) are configured to emit first LED light, LG1, having a first emission peak wavelength, I, in a wavelength range of blue light, B and the one or more N-LEDs (102) are configured to emit second LED light, LG2, having a second emission peak wavelength, X2, in a wavelength range of blue light, B; wherein the phosphor layer (160) is configured to at least partly convert first LED light into first converted light and at least partly convert second LED light into second converted light; wherein a ratio, Rl, defined by SA2 / SA1 is equal to or larger than 10; wherein the carrier (151) comprises one or more elevations (152) having a first height, Hl, (154) and extending from a carrier base level (153), wherein the plurality of M- LEDs (101) are arranged on the one or more elevations (152); and wherein the phosphor layer (160) above the plurality of M-LEDs (101) has a first thickness, Tl, (163) and the phosphor layer (160) above the one or more N-LEDs (102) has a second thickness, T2, (163), and wherein O.9<T1 / T2<1.1.

2. The lighting arrangement (100) according to claim 1, wherein: a combination of the plurality of M-LEDs (101) and the phosphor layer (160) provides first device light, wherein the first device light comprises i: the first converted light or ii: the first converted light and part of the first LED light, the first device light is first white light having a first correlated color temperature, CCT1, in a range from 1700K to 6500K; a combination of the one or more N-LEDs (102) and the phosphor layer (160) provides second device light, wherein the second device light comprises i: the second converted light or ii: the second converted light and part of the second LED light, the second device light is second white light having a second correlated color temperature, CCT2, in a range from3. The lighting arrangement (100) according to claim 1 or 2, wherein: the carrier (151) comprises further elevations (156) having a second height, H2, (157) and extending from the carrier base level (153), on which further elevations (156) one or more third light emitting diodes, I-LEDs (103) are arranged, said one or more I-LEDs (103) having a third surface area, SA3, wherein the SA3 has a largest spatial extent, SE3, that is greater than or equal to 120 micrometers and equal to or smaller than 280 micrometers; and wherein:H2<0.8*HL4. The lighting arrangement (100) according to any one of the preceding claims, wherein:LEDT2>2*LEDT1.

5. The lighting arrangement (100) according to any one of the preceding claims, wherein: the sum of a height (154) of the one or more elevations (152) above the carrier base level (153) and a thickness (114) of the plurality of M-LEDs (101) is between 0.9 and 1.1 times a thickness (113) of the one or more N-LEDs (102); and / or the sum of a height (154) of the further elevations (156) above the carrier base level (153) and a thickness (115) of the plurality of I-LEDs (103) is between 0.9 and 1.1 times a thickness (113) of the one or more N-LEDs (102).

6. The lighting arrangement (100) according to any one of the preceding claims, wherein: the carrier (151) comprises carrier elevations (155) extending from the carrier base level (153); the carrier elevations (155) have a height, H, (156) above the carrier base level (153); andH is between 0.9 and 1.1 times aheight (164) of the phosphor layer (160) above the carrier base level (153).

7. The lighting arrangement (100) according to any one of the preceding claims, wherein: the number of M-LEDs (101) is X; the number of N-LEDs (102) is Y; and wherein X is greater than or equal to 3 times Y.

8. The lighting arrangement (100) according to any one of the preceding claims, wherein:TSAI is defined as total surface area of all M-LEDs (101) and TSA2 is defined as a total surface area of all one or more N-LEDs (102), and a ratio, R2, defined by TSA2 / TSA1 is equal or greater than 2.

9. The lighting arrangement (100) according to any one of the preceding claims, wherein each N-LED (102) comprises 4 sides, wherein at least two sides of the four sides is neighbored by at least 1 M-LED (101), preferably wherein each side is neighbored by at least 1 M-LED (101).

10. The lighting arrangement (100) according to any one of the preceding claims, wherein: the lighting arrangement (100) comprises a plurality of N elevations (152) and / or further elevations (156), and wherein N is at least 4, each elevation (152) and / or further elevation (156) having at least 1 M-LED (101).

11. The lighting arrangement (100) according to any one of the preceding claims, wherein:each elevation (152) and / or further elevation (156) has a top surface having a surface area, ESAI, on which at least one M-LED (101) is arranged, andESA1 / SA1>3.

12. The lighting arrangement (100) according to any one of the preceding claims, wherein: the elevations (152) and / or the further elevations (156) comprise elevated circuits (171) and bridging electrical connections (172) of the M-LEDs and electrical connections (170) on a main part of the carrier (151) below the elevations (152) and / or the further elevations (156).

13. The lighting arrangement (100) according to any one of the preceding claims, wherein: the elevations (152) and / or the further elevations (156) comprise thermally conductive material having a thermal conductivity of at least 100 W nti1K1and configured to transfer heat generated by the one or more N-LEDs (102) to a thermally conductive main part of the carrier (151) below the elevations and / or the further elevations (156).

14. The lighting arrangement (100) according to any one of the preceding claims, wherein: the carrier (151) is a printed circuit board, PCB, comprising electrical connections (170) configured to provide electric connections between the plurality of M- LEDs (101) and a driver (140) and provide electric connections between the one or more N- LEDs (102) and the driver (140), and the elevations (152) comprise elevated circuits (171) and bridging connectors (172) configured to provide electric connections between the plurality of M-LEDs (101) and the driver (140) via the circuits (170) of the carrier (151).

15. A LED lamp (200) or a luminaire (300) comprising the lighting arrangement (100) according to any one of the preceding claims.

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