Electrodeposition tool and method for manufacturing electrodeposition tool
The electroplated tool with spherical superabrasive grains addresses the accuracy and clogging issues in rotary dressers by embedding grains with specific aspect and roundness ratios, improving machining precision and reducing manufacturing complexity and costs.
Patent Information
- Application Number
- PCT/JP2025/001020
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-01-16
- Filing Date
- 2025-01-15
- Publication Date
- 2025-07-24
AI Technical Summary
Conventional rotary dressers face challenges in achieving high shape accuracy due to variations in super abrasive grain height caused by size and crystal shape, leading to decreased machining accuracy and chip clogging.
The electroplated tool incorporates spherical superabrasive grains with an aspect ratio of 0.90 or more and roundness of 0.95 or more, embedded in a plating layer on a base metal, which reduces variations in grain height and facilitates easy manufacturing without the need for a mold.
This approach enhances machining accuracy and suppresses chip clogging, simplifies the manufacturing process, reduces material costs, and minimizes environmental impact by eliminating the use of a master mold and electroforming.
Smart Images

Figure JP2025001020_24072025_PF_FP_ABST
Abstract
Description
Electroplated tool and method for manufacturing the same
[0001] FIELD OF THE DISCLOSURE The present disclosure relates to electroplated tools and methods of manufacturing electroplated tools.
[0002] Conventionally, rotary dressers have been known in which multiple superabrasive grains are embedded in the cylindrical outer peripheral surface (see, for example, Patent Document 1). Such rotary dressers require high shape precision. However, when conventional superabrasive grains are directly attached to a base metal (iron core), variations in the size and crystal shape of the superabrasive grains result in variations in the height of the superabrasive grains relative to the base metal, making it difficult to manufacture high-precision rotary dressers. For this reason, rotary dressers have traditionally been manufactured using an inversion method similar to the manufacturing method for single-layer abrasive grain wheels described in Patent Document 2. In this inversion method, superabrasive grains are electroformed onto the inner peripheral surface of a cylindrical matrix, the matrix is fixed to the center of the matrix to which the superabrasive grains are attached, a low-melting-point metal is poured between the matrix and the base metal, and the matrix is removed after the low-melting-point metal has solidified. This produces a rotary dresser with uniform superabrasive grain height. Subsequently, a flat surface is formed at the tips of the superabrasive grains by lapping, resulting in the manufacture of a high-precision formed rotary dresser.
[0003] JP 2016-078158 A Japanese Patent No. 6193645 A
[0004] The conventional inversion method requires the use of a matrix, and the matrix must be removed at the end, resulting in high material costs and many manufacturing steps. Moreover, the electroforming process for adhering the superabrasive grains to the inner peripheral surface of the matrix takes a long time, so a large amount of material and time is required to manufacture a high-precision rotary dresser.
[0005] Some electroplated tools, such as rotary dressers and electroplated reamers, have flat surfaces formed on the tips of multiple superabrasive grains by lapping. In these electroplated tools, variations in the size and crystal shape of the superabrasive grains can cause variations in the height of the superabrasive grains relative to the base metal, resulting in variations in the size of the flat surfaces of the multiple superabrasive grains. As a result, the accuracy of grinding and other processes can be reduced, and chip flow can be impaired, making the tool more susceptible to clogging.
[0006] Therefore, an object of the present disclosure is to provide an electroplated tool and a method for manufacturing the electroplated tool that can improve machining accuracy and suppress clogging of chips.
[0007] [1] An electroplated tool according to the present disclosure comprises a base metal, a plurality of spherical superabrasive grains fixed to the base metal, and a plating layer formed on the base metal and having the plurality of spherical superabrasive grains embedded therein, wherein the plurality of spherical superabrasive grains have lapped flat surfaces, the aspect ratio of the portions of the plurality of spherical superabrasive grains excluding the flat surfaces is 0.90 or more, and the circularity of the portions of the plurality of spherical superabrasive grains excluding the flat surfaces is 0.95 or more.
[0008] In this electroplated tool, a plurality of spherical superabrasive grains are embedded in a plating layer formed on a base metal, and the aspect ratio of the portions of the plurality of spherical superabrasive grains excluding the flat surfaces is 0.90 or greater, and the circularity of the portions of the plurality of spherical superabrasive grains excluding the flat surfaces is 0.95 or greater, thereby minimizing variation in the size of the flat surfaces of the plurality of spherical superabrasive grains, thereby improving machining accuracy and suppressing clogging with cutting chips.
[0009] [2] An electroplated tool according to the present disclosure comprises a base metal, a plurality of spherical superabrasive grains fixed to the base metal, and a plating layer formed on the base metal and having the plurality of spherical superabrasive grains embedded therein, wherein the aspect ratio of the plurality of spherical superabrasive grains is 0.90 or more, and the circularity of the plurality of spherical superabrasive grains is 0.95 or more.
[0010] In this electroplated tool, a plurality of spherical superabrasive grains are embedded in a plating layer formed on a base metal, and the aspect ratio of the plurality of spherical superabrasive grains is 0.90 or more, and the circularity of the plurality of spherical superabrasive grains is 0.95 or more. Therefore, when the plurality of spherical superabrasive grains are subjected to lapping to form flat surfaces on the plurality of spherical superabrasive grains, the variation in size of the flat surfaces among the plurality of spherical superabrasive grains can be reduced, thereby improving processing accuracy and suppressing clogging with chips.
[0011] [3] In the electroplated tool according to [1] or [2], the plurality of spherical superabrasive grains may have crystal faces that do not lie flat. In this electroplated tool, since the plurality of spherical superabrasive grains do not have crystal faces that lie flat, it is possible to further reduce variations in the height of the plurality of spherical superabrasive grains relative to the base metal when the plurality of spherical superabrasive grains are arranged on the base metal during manufacturing.
[0012] [4] In the electroplated tool according to any one of [1] to [3], the plurality of spherical superabrasive grains may be bonded to the base metal with an adhesive. In this electroplated tool, the plurality of spherical superabrasive grains are bonded to the base metal with an adhesive, so that during manufacturing, the plurality of spherical superabrasive grains can be temporarily fixed to the base metal with the adhesive before forming a plating layer on the base metal. This makes it easy to manufacture the electroplated tool.
[0013] [5] In the electroplated tool according to any one of [1] to [4], the plurality of spherical superabrasive grains may be regularly arranged. In this electroplated tool, the plurality of spherical superabrasive grains are regularly arranged, which can improve cutting quality and processing accuracy.
[0014] [6] The electrodeposited tool according to any one of [1] to [5] may be a rotary dresser. Even when the electrodeposited tool is a rotary dresser, the same effects as those described above can be obtained.
[0015] [7] The electroplated tool according to any one of [1] to [5] may be an electroplated reamer. Even when the electroplated tool is an electroplated reamer, the same effects as those described above can be obtained.
[0016] [8] A method for manufacturing an electroplated tool according to the present disclosure includes an arrangement step of arranging a plurality of spherical superabrasive grains having an aspect ratio of 0.90 or more and a circularity of 0.95 or more on a base metal, and a fixing step of forming a plating layer on the base metal and embedding the plurality of spherical superabrasive grains in the plating layer.
[0017] In this method of manufacturing an electroplated tool, a plurality of spherical superabrasive grains having an aspect ratio of 0.90 or more and a circularity of 0.95 or more are arranged on a base metal, a plating layer is formed on the base metal, and the spherical superabrasive grains are embedded in the plating layer. This allows the spherical superabrasive grains to be fixed to the base metal and reduces variation in height of the plurality of spherical superabrasive grains relative to the base metal. Therefore, when the plurality of spherical superabrasive grains are lapped to form flat surfaces on the plurality of spherical superabrasive grains, variation in size of the flat surfaces on the plurality of spherical superabrasive grains can be reduced. This improves machining accuracy and suppresses clogging with chips.
[0018] [9] In the method for manufacturing an electroplated tool described in [8], the plurality of spherical superabrasive grains may have crystal faces that do not lie flat. In this method for manufacturing an electroplated tool, since the plurality of spherical superabrasive grains do not have crystal faces that lie flat, it is possible to further reduce variation in the height of the plurality of spherical superabrasive grains relative to the base metal when the plurality of spherical superabrasive grains are arranged on the base metal.
[0019]
[10] In the method for manufacturing an electroplated tool according to [8] or [9], the disposing step may involve bonding a plurality of spherical superabrasive grains to the base metal with an adhesive. In this method for manufacturing an electroplated tool, the plurality of spherical superabrasive grains are bonded to the base metal with an adhesive, and therefore the plurality of spherical superabrasive grains can be temporarily fixed to the base metal with the adhesive before forming a plating layer on the base metal. This facilitates the manufacturing of an electroplated tool.
[0020]
[11] The method for manufacturing an electroplated tool according to any one of [8] to
[10] may further include a lapping step of lapping the plurality of spherical superabrasive grains to form flat surfaces at the tips of the plurality of spherical superabrasive grains. In this method for manufacturing an electroplated tool, the plurality of spherical superabrasive grains are lapped to form flat surfaces at the tips of the plurality of spherical superabrasive grains, thereby making it possible to manufacture an electroplated tool in which the height of the plurality of spherical superabrasive grains relative to the base metal is uniform with high precision.
[0021] According to the present disclosure, it is possible to improve machining accuracy and suppress clogging of chips.
[0022] FIG. 1 is a schematic cross-sectional view showing an electrodeposited tool of this embodiment. FIG. 2 is a schematic cross-sectional view showing an enlarged portion of the electrodeposited tool shown in FIG. 1. FIG. 3 is a schematic view showing an example of a regular arrangement of a plurality of spherical abrasive grains. FIG. 4 is a schematic cross-sectional view showing a method for manufacturing the electrodeposited tool of this embodiment. FIG. 5 is a schematic cross-sectional view showing a method for manufacturing the electrodeposited tool of this embodiment. FIG. 6 is a schematic cross-sectional view showing a method for manufacturing the electrodeposited tool of this embodiment. FIG. 7 is a schematic cross-sectional view showing a method for manufacturing the electrodeposited tool of this embodiment. FIG. 8 is a schematic cross-sectional view showing the flow of chips. FIG. 9 is a schematic cross-sectional view showing an electrodeposited tool of a modified example. FIG. 10 is a schematic cross-sectional view showing an enlarged portion of the electrodeposited tool shown in FIG. 9. FIG. 11 is a graph showing the measurement results of thrust load. FIG. 12 is a graph showing the measurement results of the roundness of a hole in a workpiece. FIG. 13 is a graph showing the measurement results of the inner diameter of a hole in a workpiece.
[0023] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the following description, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted.
[0024] In this embodiment, the electrodeposited tool of the present disclosure is applied to a rotary dresser. FIG. 1 is a schematic cross-sectional view showing the electrodeposited tool of this embodiment. FIG. 2 is a schematic cross-sectional view showing an enlarged portion of the electrodeposited tool shown in FIG. 1. As shown in FIGS. 1 and 2, the electrodeposited tool 1 of this embodiment is a rotary dresser. The electrodeposited tool 1 is called a formed rotary dresser and is formed in a substantially cylindrical shape. The electrodeposited tool 1 includes a base metal 2, a plurality of spherical superabrasive grains 3 fixed to the base metal 2, an adhesive 4 that bonds the plurality of spherical superabrasive grains 3 to the base metal 2, and a plating layer 5 formed on the base metal 2 and in which the plurality of spherical superabrasive grains 3 are embedded.
[0025] The base metal 2 is formed in a substantially cylindrical shape. The base metal 2 has a surface 21 to which a plurality of spherical superabrasive grains 3 are fixed. The surface 21 is at least a part of the outer circumferential surface of the base metal 2. An annular recess extending over the entire circumferential direction of the base metal 2 is formed on the surface 21.
[0026] A plurality of spherical superabrasive grains 3 are fixed to the surface 21 of the base metal 2. Each of the plurality of spherical superabrasive grains 3 (hereinafter simply referred to as "spherical superabrasive grains 3") is a spherical superabrasive grain. Examples of superabrasive grains include diamond abrasive grains and CBN abrasive grains. Spherical superabrasive grains are superabrasive grains that do not have planar crystal faces. The spherical superabrasive grains 3 may be spherical or non-spherical, such as oval spheres. Note that superabrasive grains coated with metal or the like may also be used as the spherical superabrasive grains 3.
[0027] The spherical superabrasive grains 3 have lapped flat surfaces 31. The flat surfaces 31 are formed at the tips of the spherical superabrasive grains 3. The height of the plurality of spherical superabrasive grains 3 relative to the base metal 2 is aligned with high precision by the respective flat surfaces 31. The flat surfaces 31 are flat surfaces that follow the surface 21 of the base metal 2 and do not necessarily have to be planar.
[0028] The aspect ratio of the spherical superabrasive grain 3 excluding the flat surface 31 is 0.90 or more, preferably 0.91 or more, and more preferably 0.92 or more. The circularity of the spherical superabrasive grain 3 excluding the flat surface 31 is 0.95 or more, preferably 0.96 or more, and more preferably 0.97 or more. In other words, the spherical superabrasive grain 3 is formed by lapping spherical superabrasive grains having an aspect ratio of 0.90 or more, preferably 0.91 or more, and more preferably 0.92 or more, and a circularity of 0.95 or more, preferably 0.96 or more, and more preferably 0.97 or more, to form the flat surface 31 at the tip. The aspect ratio is the ratio of the length of the major axis to the length of the minor axis. The circularity is the ratio of the circumference having the same area as the spherical superabrasive grain divided by the perimeter of an image of the actual spherical superabrasive grain, and refers to the circularity measured, for example, by a fully automatic image-based particle size distribution analyzer, Morphologi G3S, manufactured by Malvern Instruments, using an image-based particle size distribution measurement method (image analysis-based particle diameter (particle size)-shape analysis) in accordance with JIS Z 8827.
[0029] Spherical superabrasive grains 3 having such aspect ratios and circularity can be selected, for example, by sieving using a plurality of sieves with different mesh sizes (hole diameters). The particle size distribution of the plurality of spherical superabrasive grains 3 is not particularly limited, but can be, for example, 70 μm or less, preferably 60 μm or less, and more preferably 50 μm or less, in terms of the D90-D10 value.
[0030] The spherical superabrasive grains 3 are adhered (temporarily fixed) to the surface 21 of the base metal 2 with an adhesive 4, and are embedded in a plating layer 5 formed on the surface 21 of the base metal 2, thereby being fixed to the surface 21 of the base metal 2. The tip portions of the spherical superabrasive grains 3, including the flat surfaces 31, protrude from the plating layer 5.
[0031] The adhesive 4 may be applied in a dot pattern on the base metal 2. Since the spherical superabrasive grains 3 are positioned at the positions of the adhesive 4, it is possible to arrange a plurality of spherical superabrasive grains 3 at predetermined positions by applying the adhesive 4 in a dot pattern at predetermined positions on the base metal 2. The dot pattern refers to a small area, for example, an area corresponding to one or two spherical superabrasive grains 3.
[0032] The plurality of spherical superabrasive grains 3 may be arranged irregularly, but are preferably arranged regularly. The plurality of spherical superabrasive grains 3 can be arranged regularly by applying adhesive 4 in dot form at regular positions on the base metal 2. The regular arrangement is not particularly limited, and may be, for example, an arrangement in multiple rows inclined with respect to the rotation direction D of the electroplated tool 1, as shown in Figure 3. Figure 3 is a schematic diagram showing an example of a regular arrangement of a plurality of spherical abrasive grains.
[0033] The adhesive 4 is not particularly limited, but may be, for example, epoxy or acrylic resin.
[0034] The plating layer 5 is not particularly limited, but may be, for example, nickel plating.
[0035] Next, a method for manufacturing an electrodeposited tool will be described with reference to Figures 4 to 7. Figures 4 to 7 are schematic cross-sectional views showing the method for manufacturing an electrodeposited tool according to this embodiment.
[0036] First, a base metal 2 and a plurality of spherical superabrasive grains 32 are prepared. Each of the plurality of spherical superabrasive grains 32 (hereinafter simply referred to as "spherical superabrasive grains 32") is a spherical superabrasive grain before lapping of the spherical superabrasive grains 3. Therefore, the spherical superabrasive grains 32 do not have the flat surfaces 31 of the spherical superabrasive grains 3. Like the spherical superabrasive grains 3, the spherical superabrasive grains 32 do not have planar crystal faces. The aspect ratio of the spherical superabrasive grains 32 is 0.90 or more, preferably 0.91 or more, and more preferably 0.92 or more. The circularity of the spherical superabrasive grains 32 is 0.95 or more, preferably 0.96 or more, and more preferably 0.97 or more.
[0037] Next, as shown in Fig. 4, adhesive 4 is applied to surface 21 of base metal 2. Next, as shown in Fig. 5, a plurality of spherical superabrasive grains 32 are arranged on surface 21 of base metal 2 (arrangement process). Then, the plurality of spherical superabrasive grains 32 are bonded to surface 21 of base metal 2 by adhesive 4 applied to surface 21 of base metal 2. As a result, the plurality of spherical superabrasive grains 32 are arranged in a state where they are temporarily fixed to surface 21 of base metal 2.
[0038] Here, the aspect ratio of the spherical superabrasive grains 32 is 0.90 or more, preferably 0.91 or more, and more preferably 0.92 or more, and the circularity of the spherical superabrasive grains 32 is 0.95 or more, preferably 0.96 or more, and more preferably 0.97 or more. Therefore, by arranging multiple spherical superabrasive grains 32 on the surface 21 of the base metal 2, the variation in height of the multiple spherical superabrasive grains 32 relative to the surface 21 of the base metal 2 is reduced, regardless of the attitude (orientation) of the multiple spherical superabrasive grains 32 relative to the surface 21 of the base metal 2.
[0039] 6, a plating layer 5 is formed on the surface 21 of the base metal 2, and a plurality of spherical superabrasive grains 32 are embedded in the plating layer 5 (adhesion step). The plating layer 5 can be formed by, for example, electrolytic plating.
[0040] Next, as shown in Fig. 7, the spherical superabrasive grains 32 are lapped to form flat surfaces 31 at the tips of the spherical superabrasive grains 32 (lapping process). The plurality of spherical superabrasive grains 32 can be lapped, for example, by grinding with a diamond wheel. As a result, the spherical superabrasive grains 32 become spherical superabrasive grains 3 having flat surfaces 31 formed at their tips, and an electroplated tool 1 is produced in which a plurality of spherical superabrasive grains 3 are fixed to the surface 21 of the base metal 2.
[0041] Here, the flow of chips will be described with reference to Fig. 8. Fig. 8 is a schematic cross-sectional view showing the flow of chips. As shown in Fig. 8, when machining is performed using the electrodeposited tool 1 of this embodiment, chips are generated, but these chips flow along the outer circumferential surfaces of the spherical superabrasive grains 3 in the direction opposite to the rotation direction D of the electrodeposited tool 1. At this time, since the aspect ratio and circularity of the portions excluding the flat surfaces 31 of the plurality of spherical superabrasive grains 3 are within the above-mentioned ranges, the chips are less likely to accumulate on the outer circumferential surfaces of the spherical superabrasive grains 3.
[0042] As described above, in the electroplated tool 1 according to this embodiment, a plurality of spherical superabrasive grains 3 are embedded in the plating layer 5 formed on the base metal 2. The aspect ratio of the portions of the plurality of spherical superabrasive grains 3 excluding the flat surfaces 31 is 0.90 or more, preferably 0.91 or more, and more preferably 0.92 or more, and the circularity of the portions of the plurality of spherical superabrasive grains 3 excluding the flat surfaces 31 is 0.95 or more, preferably 0.96 or more, and more preferably 0.97 or more. This reduces the variation in size of the flat surfaces 31 of the plurality of spherical superabrasive grains 3. This improves machining accuracy and suppresses chip clogging. Because chip clogging is suppressed, sharpness and machining accuracy can be maintained over a long period of time.
[0043] Furthermore, in this electroplated tool 1, the plurality of spherical superabrasive grains 32 can be fixed to the surface 21 of the base metal 2 without using a matrix, as is used in the inversion method, and the variation in height of the plurality of spherical superabrasive grains 32 relative to the surface 21 of the base metal 2 can be reduced. This simplifies the manufacturing process and reduces the material cost of the matrix. Furthermore, since the plurality of spherical superabrasive grains 32 do not need to be fixed by electroforming, the lead time can be shortened. Moreover, because the plurality of spherical superabrasive grains 3 are fixed to the surface 21 of the base metal 2 by being embedded in the plating layer 5, the base metal 2 can be reused by removing the plating layer 5. This also reduces the burden on the environment.
[0044] Furthermore, in this electroplated tool 1, since the multiple spherical superabrasive grains 3 do not have flat crystal faces, the variation in height of the multiple spherical superabrasive grains 32 when they are arranged on the surface 21 of the base metal 2 during manufacturing can be further reduced.
[0045] Furthermore, in this electrodeposited tool 1, the plurality of spherical superabrasive grains 3 are adhered to the surface 21 of the base metal 2 by the adhesive 4, so that during manufacturing, the plurality of spherical superabrasive grains 32 can be temporarily fixed to the surface 21 of the base metal 2 by the adhesive 4 before the plating layer 5 is formed on the surface 21 of the base metal 2. This makes it possible to easily manufacture the electrodeposited tool 1.
[0046] In the method for manufacturing an electroplated tool according to this embodiment, a plurality of spherical superabrasive grains 32 having an aspect ratio of 0.90 or more, preferably 0.91 or more, more preferably 0.92 or more, and a circularity of 0.95 or more, preferably 0.96 or more, more preferably 0.97 or more, are disposed on the surface 21 of the base metal 2. A plating layer 5 is then formed on the surface 21 of the base metal 2, and the plurality of spherical superabrasive grains 3 are embedded in the plating layer 5. This allows the plurality of spherical superabrasive grains 32 to be fixed to the surface 21 of the base metal 2, and reduces variation in the height of the plurality of spherical superabrasive grains 32 relative to the surface 21 of the base metal 2. This reduces variation in the size of the flat surfaces 31 of the plurality of spherical superabrasive grains 3. This improves machining accuracy and suppresses chip clogging. By suppressing chip clogging, sharpness and machining accuracy can be maintained over a long period of time.
[0047] This method of manufacturing an electrodeposited tool also simplifies the manufacturing process and reduces the material costs of the master mold. Furthermore, since it is not necessary to fix the spherical superabrasive grains 32 by electroforming, the lead time can be shortened. Furthermore, since the spherical superabrasive grains 32 are fixed to the surface 21 of the base metal 2 by embedding them in the plating layer 5, the base metal 2 can be reused by removing the plating layer 5. This also reduces the burden on the environment.
[0048] Furthermore, in this method of manufacturing an electroplated tool, since the multiple spherical superabrasive grains 32 do not have planar crystal faces, the variation in height of the multiple spherical superabrasive grains 32 relative to the surface 21 of the base metal 2 when the multiple spherical superabrasive grains 32 are arranged on the surface 21 of the base metal 2 can be further reduced.
[0049] Furthermore, in this method of manufacturing an electrodeposited tool, the plurality of spherical superabrasive grains 32 are adhered to the surface 21 of the base metal 2 with the adhesive 4, so that the plurality of spherical superabrasive grains 32 can be temporarily fixed to the surface 21 of the base metal 2 with the adhesive 4 before the plating layer 5 is formed on the surface 21 of the base metal 2. This makes it possible to easily manufacture the electrodeposited tool 1.
[0050] Furthermore, in this method for manufacturing an electroplated tool, a plurality of spherical superabrasive grains 32 are lapped to form flat surfaces 31 at the tips of the plurality of spherical superabrasive grains 32, so that an electroplated tool 1 can be manufactured in which the height of the plurality of spherical superabrasive grains 3 relative to the surface 21 of the base metal 2 is aligned with high precision.
[0051] The present disclosure is not limited to the above-described embodiments, and modifications can be made as appropriate without departing from the spirit of the present disclosure.
[0052] For example, in the above embodiment, a lapping process is performed to form flat surfaces at the tips of the plurality of spherical superabrasive grains, but the lapping process may not be performed. In this case, the electroplated tool will have a plurality of spherical superabrasive grains without flat surfaces at their tips fixed to a base metal, and the aspect ratio and circularity of these plurality of spherical superabrasive grains will be the aspect ratio and circularity of the portion of the plurality of spherical superabrasive grains excluding the flat surfaces in the above embodiment. Note that if an electroplated tool is manufactured without performing the lapping process, the manufactured electroplated tool may be subjected to the lapping process to form flat surfaces at the tips of the plurality of spherical superabrasive grains.
[0053] Furthermore, in the above embodiment, the base metal is described as being formed in an approximately cylindrical shape and having an annular recess formed on the surface 21 of the base metal, but the shape of the base metal is not particularly limited and can be various shapes depending on the application, etc.
[0054] Furthermore, in the above embodiment, the electrodeposited tool is described as being a rotary dresser, but the electrodeposited tool of the present disclosure may be an electrodeposited tool other than a rotary dresser, such as an electrodeposited reamer.
[0055] Fig. 9 is a schematic cross-sectional view showing a modified electrodeposited tool. Fig. 10 is a schematic cross-sectional view showing an enlarged portion of the electrodeposited tool shown in Fig. 9. As shown in Figs. 9 and 10, the modified electrodeposited tool 1A is an electrodeposited reamer. The electrodeposited tool 1A is an electrodeposited reamer for honing and is formed in a cylindrical rod shape. The electrodeposited tool 1A includes a base metal 2A, a plurality of spherical superabrasive grains 3 fixed to the base metal 2A, an adhesive 4 that bonds the plurality of spherical superabrasive grains 3 to the base metal 2A, and a plating layer 5 formed on the base metal 2A and in which the plurality of spherical superabrasive grains 3 are embedded.
[0056] The base metal 2A is formed in the shape of a cylindrical rod. The base metal 2A has a surface 21A to which a plurality of spherical superabrasive grains 3A are fixed. In other words, the plurality of spherical superabrasive grains 3A are fixed to the surface 21A of the base metal 2A. The surface 21A is at least a part of the outer circumferential surface of the base metal 2A.
[0057] Next, examples of the present disclosure will be described, but the present disclosure is not limited to the examples described below.
[0058] (Example 1) A plurality of spherical diamond abrasive grains with a grain size of #60 / 80, an aspect ratio of 0.93, and a circularity of 0.99 are bonded to the surface of a cylindrical rod-shaped base metal. Next, a plating layer is formed on the upper surface of the base metal by electroplating, and a plurality of spherical diamond abrasive grains are embedded in the plating layer. Next, the spherical diamond abrasive grains are lapped by grinding with a diamond wheel to form a flat surface at the tip of the spherical diamond abrasive grains. This results in the electroplated reamer of Example 1.
[0059] Holes formed in a cast iron (FC250) workpiece were finished using the electroplated reamer of Example 1. In the finish process, the rotation speed was 477.5 [rev / min], the peripheral speed was 30 [m / min], the feed was 95.5 [mm / min], the rotation feed was 0.2 [mm / rev], the machining allowance was φ0.030 [mm], and the number of cuts (number of cut holes) was 10 consecutive times.
[0060] Then, the sharpness, roundness of the workpiece hole, and inner diameter of the workpiece hole were measured. Sharpness was evaluated by the maximum thrust load. The roundness of the workpiece hole was taken as the average roundness value at depth positions every 13.5 mm. The inner diameter of the workpiece hole was taken as the average inner diameter value at depth positions every 11 mm. The measurement results of the thrust load are shown in Figure 11, the measurement results of the roundness of the workpiece hole are shown in Figure 12, and the measurement results of the inner diameter of the workpiece hole are shown in Figure 13.
[0061] (Comparative Example 1) Instead of a plurality of spherical diamond abrasive grains, a plurality of polyhedral diamond abrasive grains with a grain size of #60 / 80 were used.Other than that, the same conditions as in Example 1 were used to obtain an electroplated reamer of Comparative Example 1.Then, similar to Example 1, the sharpness, the roundness of the hole in the workpiece, and the inner diameter of the hole in the workpiece were measured.The measurement results of thrust load are shown in Figure 11, the measurement results of the roundness of the hole in the workpiece are shown in Figure 12, and the measurement results of the inner diameter of the hole in the workpiece are shown in Figure 13.
[0062] (Evaluation) As shown in FIG. 11, the thrust load of the electroplated reamer of Comparative Example 1 exceeded 40 [N] when machining the third workpiece, whereas the thrust load of the electroplated reamer of Example 1 was less than 35 [N] when machining all the workpieces.
[0063] As shown in FIG. 12, with the electroplated reamer of Comparative Example 1, the roundness of the hole in the workpiece changed significantly after the seventh workpiece, but with the electroplated reamer of Example 1, the roundness of the hole in the workpiece did not change significantly even up to the tenth workpiece.
[0064] As shown in FIG. 13, the inner diameter of the hole in the workpiece varied greatly between workpieces with the electroplated reamer of Comparative Example 1, but the inner diameter of the hole in the workpiece did not vary greatly between workpieces with the electroplated reamer of Example 1.
[0065] From these results, it is presumed that with the electroplated reamer of Example 1, chips are less likely to accumulate on the outer surface of the spherical diamond abrasive grains than with the electroplated reamer of Comparative Example 1, which reduces chip clogging and thereby maintains sharpness and processing accuracy even after 10 machining operations.
[0066] 1...electroplated tool (rotary dresser), 2...base metal, 21...surface, 3...spherical superabrasive grain, 31...flat surface, 32...spherical superabrasive grain, 4...adhesive, 5...plating layer, 1A...electroplated tool (electroplated reamer), 2A...base metal, 21A...surface, D...rotation direction.
Claims
1. An electroplated tool comprising: a base metal; a plurality of spherical superabrasive grains fixed to the base metal; and a plating layer formed on the base metal and embedding the plurality of spherical superabrasive grains, wherein the plurality of spherical superabrasive grains have a lapped flat surface, the aspect ratio of the portion of the plurality of spherical superabrasive grains excluding the flat surface is 0.90 or more, and the roundness of the portion of the plurality of spherical superabrasive grains excluding the flat surface is 0.95 or more.
2. An electroplated tool comprising: a base metal; a plurality of spherical superabrasive grains fixed to the base metal; and a plating layer formed on the base metal and embedding the plurality of spherical superabrasive grains, wherein the aspect ratio of the plurality of spherical superabrasive grains is 0.90 or more, and the roundness of the plurality of spherical superabrasive grains is 0.95 or more.
3. The electroplated tool according to claim 1 or 2, wherein the plurality of spherical superabrasive grains do not have a planar crystal face.
4. The electroplated tool according to claim 1 or 2, wherein the plurality of spherical superabrasive grains are adhered to the base metal by an adhesive.
5. The electroplated tool according to claim 1 or 2, wherein the plurality of spherical superabrasive grains are regularly arranged.
6. The electroplated tool according to claim 1 or 2, wherein the electroplated tool is a rotary dresser.
7. The electroplated tool according to claim 1 or 2, wherein the electroplated tool is an electroplated reamer.
8. A method for manufacturing an electroplated tool, comprising: an arranging step of arranging a plurality of spherical superabrasive grains having an aspect ratio of 0.90 or more and a roundness of 0.95 or more on a base metal; and a fixing step of forming a plating layer on the base metal and embedding the plurality of spherical superabrasive grains in the plating layer.
9. The method for manufacturing an electroplated tool according to claim 8, wherein the plurality of spherical superabrasive grains arranged on the base metal do not have a planar crystal face.
10. The method for manufacturing an electroplated tool according to claim 8 or 9, wherein in the arranging step, the plurality of spherical superabrasive grains are adhered to the base metal by an adhesive.
11. The method for manufacturing an electroplated tool according to claim 8 or 9, further comprising a lapping step of lapping the plurality of spherical superabrasive grains to form a flat surface at the tip of the plurality of spherical superabrasive grains.
Citation Information
Patent Citations
Manufacture of electrodeposition tool
JP2000153463A
Electrodeposition tool for super-abrasives
JP2001310261A
Screw-like electrodeposition tool
JP2011167778A
Electrodeposition superabrasive tool and method of manufacturing the same
JP2013111707A
Production method for diamond tool for grinding and inspection method for diamond abrasive grain for grinding
JP2019025610A