Network switching device

Abstract

Provided in the present disclosure is a network switching device. The present disclosure relates to the technical field of network devices, and is used for solving the problem of network switching devices failing to satisfy application requirements of different scenarios. The network switching device comprises a chassis assembly and an opto-electric connection unit, wherein the chassis assembly comprises a chassis and a control baseboard, one end of the chassis is provided with an opening, and the control baseboard is arranged in the chassis; the opto-electric connection unit is configured to be detachably inserted into the chassis through the opening, so that the chassis can be selectively adapted to different opto-electric connection units. The opto-electric connection unit comprises a support, a board body and a connector, the board body being provided on the support, the connector being arranged on the surface of the board body and being electrically connected to the board body, the connector being provided with a port, the plugging direction of the port being matched with the extending direction of the board body, and the port being configured such that an optical module is in detachable plug-in connection with same. When the opto-electric connection unit is inserted into to the chassis, the board body is electrically connected to the control baseboard. The present disclosure can satisfy application requirements of different scenarios, thus reducing the hardware development cost.

Description

[0001] This disclosure claims priority to a Chinese patent application filed with the Patent Office of the People's Republic of China on February 4, 2024, with application number 202410160494. 3. "NETWORK SWITCHING DEVICE," the entire contents of which are incorporated herein by reference. TECHNICAL FIELD This disclosure relates to the field of network device technology, and more particularly to a network switching device. BACKGROUND A network switching device (referred to as a switch) is a network hardware device that receives and forwards data to a target device through message exchange, enabling the connection of different devices on a computer network. In related art, switches have multi-port bridges that forward data using MAC addresses at the data link layer. Furthermore, routing functionality can be incorporated, allowing some switches to forward data at the network layer. Such switches are generally referred to as Layer 3 switches or multilayer switches. However, with the continuous increase in computing power and communication speeds in data centers, switches used in related art data centers have difficulty meeting the application requirements of diverse scenarios. SUMMARY OF THE INVENTION This disclosure provides a network switching device that can meet the application requirements of diverse scenarios, expand its scope of application, and reduce hardware development costs. The present disclosure provides a network switching device, comprising: a chassis assembly and an optoelectronic connection unit, wherein the chassis assembly comprises a chassis and a control substrate, one end of the chassis has an opening, the control substrate is disposed in the chassis, the optoelectronic connection unit is configured to be detachably plugged into the chassis through the opening, so that the chassis can selectively adapt to different optoelectronic connection units; the optoelectronic connection unit comprises a bracket, a board, and a connector, the board is disposed on the bracket, the connector is disposed on a surface of the board and electrically connected to the board, the connector has a port, the plugging direction of the port is adapted to an extension direction of the board, and the port is configured to be detachably plugged into an optical module; when the optoelectronic connection unit is plugged into the chassis, the board is electrically connected to the control substrate.The network switching device provided herein utilizes a modular design comprising a chassis assembly and an optoelectronic connection unit. The chassis has an opening at one end, a control substrate is disposed within the chassis, and the optoelectronic connection unit comprises a bracket, a board, and a connector. The board is disposed on the bracket, and the connector is disposed on a surface of the board and electrically connected to the board. The connector has a port whose insertion direction matches the extension direction of the board. The port is configured to removably connect to an optical module. Furthermore, by designing the hardware structure specifications of the optoelectronic connection unit to be compatible with the chassis, the optoelectronic connection unit can be removably connected to the chassis through the opening. When the optoelectronic connection unit is connected to the chassis, the board is electrically connected to the control substrate. This allows the network switching device to adapt optoelectronic connection units with different parameters, such as transmission power, to the chassis based on the application requirements of different scenarios. This improves the versatility of the network switching device, expands its applicability, and reduces the costs of chassis hardware development, design, manufacturing, and testing. In one possible embodiment, the board is provided with a first connector, and the control substrate has a second connector. When the optoelectronic connection unit is plugged into the chassis assembly, the first connector and the second connector plug into and electrically connect, thereby electrically connecting the board and the control substrate. By providing the first connector on the boards of different optoelectronic connection units and providing the second connector on the control substrate to mate with the first connector, when the optoelectronic connection unit is plugged into the chassis, the first connector and the second connector plug into and electrically connect, thereby achieving signal interconnection between the connectors in the optoelectronic connection unit and the control substrate. This allows different optoelectronic connection units to be compatible with the chassis, improves ease of assembly and disassembly, and reduces costs. In one possible embodiment, the first connector is provided at the end of the board facing away from the port and is electrically connected to the board. By positioning the first connector at the end of the board body facing away from the port, the first connector and the second connector are easily plugged together, and the plugging path between the first and second connectors is shortened, resulting in a simple structure and easy implementation. In one possible embodiment, one of the first and second connectors includes a plug interface, and the other includes a plug connector that can be inserted into the plug interface. In this way, the plug connector plugs into the plug interface to connect the first and second connectors, thereby achieving signal interconnection between the connector and the control board. This connection method is simple and easy to implement.In one possible embodiment, the optoelectronic connection unit includes at least two plates, spaced apart on the bracket along a first direction. A mounting area is provided on at least one side of each plate, and the connectors are mounted in the mounting area. The first direction is perpendicular to the plate surfaces. By providing at least two plates and mounting areas on at least one side of each plate, the optoelectronic connection unit can be adapted for use with a large number of connectors. In one possible embodiment, the optoelectronic connection unit includes a first plate and a second plate. The first plate is positioned above the second plate, with mounting areas on opposite sides of the first plate. The second plate has mounting areas on a side facing away from the first plate, with at least two connectors arranged in each mounting area along a second direction. The first and second directions are perpendicular to each other. Providing mounting areas on opposite sides of the first plate improves the compactness of the optoelectronic connection unit and increases space utilization. In one possible embodiment, the optoelectronic connection unit includes a third board and a fourth board. Both the third and fourth boards have mounting areas on one side, and each mounting area has at least two connectors arranged along the second direction. By providing mounting areas only on one side of the third and fourth boards and arranging connectors on each mounting area, heat from the boards can be dissipated through the board surfaces without mounting areas, thereby improving the boards' heat dissipation performance. In one possible embodiment, the optoelectronic connection unit also includes a fifth board, spaced apart from one side of the third and fourth boards. One side of the fifth board has mounting areas, and at least two connectors are arranged along the second direction. This provides support for a larger number of connectors, enabling network switching devices to provide more ports. In one possible embodiment, the optoelectronic connection unit includes 128 ports, and the connector includes at least one QSFP112 port. In another possible embodiment, the optoelectronic connection unit includes 64 ports, and the connector includes at least one OSPF port. In one possible embodiment, a first heat dissipation structure is provided on at least one of the at least two plates, and the first heat dissipation structure is configured to dissipate heat from the plate. Providing the first heat dissipation structure on the plate reduces the temperature of the plate, thereby improving the operational reliability and performance stability of the plate.In one possible embodiment, the first heat dissipation structure includes a first radiator comprising a plurality of heat dissipation fins connected to the plate body. Providing multiple heat dissipation fins in the first radiator increases the heat dissipation area, thereby improving heat dissipation efficiency. In another possible embodiment, the first heat dissipation structure includes a cooling liquid plate disposed on the plate body and having cooling channels disposed therein. A first cooling pipeline is disposed in the chassis, one end of the first cooling pipeline being configured to communicate with the cooling channels and the other end of the first cooling pipeline being configured to connect to a cooling source. By providing the cooling liquid plate on the plate body, when the optoelectronic connection unit is plugged into the chassis, the cooling liquid plate connects to the first cooling pipeline, thereby communicating with the cooling channels in the cooling liquid plate. This allows the cooling liquid plate and the plate body to reduce the temperature of the plate body through heat exchange, improving heat dissipation efficiency and reliability, thereby enhancing the operational reliability and performance stability of the plate body. In one possible embodiment, the connector has at least two ports spaced apart along a second direction, with a second heat dissipation structure disposed between the two ports. The second heat dissipation structure is configured to dissipate heat from the connector. By disposing the second heat dissipation structure between the two ports of the connector spaced apart along the second direction, heat is dissipated from the network switching device via the second heat dissipation structure, thereby improving heat dissipation efficiency. In one possible embodiment, the second heat dissipation structure includes a heat sink connected between the two ports of the connector and having a plurality of heat dissipation holes disposed thereon. By disposing the heat sink between the two ports of the connector and providing the plurality of heat dissipation holes thereon, heat from the network switching device can be partially discharged through the heat dissipation holes, thereby improving heat dissipation efficiency while simplifying the structure and reducing costs. In one possible embodiment, the second heat dissipation structure includes a second cooling pipeline, at least a portion of which is located between the two ports of the connector and is configured to be connected to a cooling source. By disposing the second cooling pipeline between the two ports of the connector, the heat dissipation efficiency of the network switching device can be improved through heat exchange, achieving effective heat dissipation. In a possible implementation, the optoelectronic connection unit further includes a cover plate, the cover plate being disposed at an end of the connector away from the chassis, the contour of the cover plate matching the opening, and the cover plate being provided with a plurality of avoidance openings, one avoidance opening being provided corresponding to one of the ports.By providing a cover plate at the end of the optoelectronic connection unit away from the chassis and providing multiple escape openings on the cover plate, with one escape opening corresponding to each port, the cover plate can isolate external dust particles and protect the connectors, thereby extending the service life of the network switching device. In one possible embodiment, the cover plate is provided with at least one handle. This handle allows users to operate the optoelectronic connection unit when removing or assembling it, thereby improving user comfort and user experience. In addition to the technical problems solved by the embodiments of the present disclosure, the technical features that constitute the technical solutions, and the beneficial effects brought about by these technical features, as described above, other technical problems solved by the network switching device provided by the embodiments of the present disclosure, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific embodiments. To more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or prior art descriptions. Obviously, the drawings described below represent some embodiments of the present disclosure. Persons skilled in the art can also derive other drawings based on these drawings without inventive effort. Figure 1 is a schematic structural diagram of a network switching device according to an embodiment of the present disclosure; Figure 2 is a schematic diagram of a chassis and an optical / electrical connection unit in a network switching device according to an embodiment of the present disclosure during assembly and disassembly; Figure 3 is a schematic diagram of a first structural embodiment of the optical / electrical connection unit in a network switching device according to an embodiment of the present disclosure; Figure 4 is a schematic diagram of the first structural embodiment of the optical / electrical connection unit in a network switching device according to an embodiment of the present disclosure from another perspective; Figure 5 is an exploded schematic diagram of a second structural embodiment of the optical / electrical connection unit in a network switching device according to an embodiment of the present disclosure; Figure 6 is a schematic diagram of a third structural embodiment of the optical / electrical connection unit in a network switching device according to an embodiment of the present disclosure; Figure 7 is a schematic diagram of another structural embodiment of the network switching device according to an embodiment of the present disclosure; and Figure 8 is a schematic diagram of the structural embodiment of the optical / electrical connection unit in Figure 7. Explanation of Figure Symbols:

[0002] 10-Network switching equipment;

[0003] 100 - chassis; 110 - opening; 120 - first cooling pipe;

[0004] 140 - water inlet interface; 150 - water outlet interface;

[0005] 200 - optoelectronic connection unit; 210 - bracket; 220 - board; 221 - first board; 222 - second board;

[0006] 223 - third plate; 224 - fourth plate; 225 - fifth plate;

[0007] 230 - first connector; 240 - connector; 241 - port;

[0008] 250 - first radiator; 260 - coolant plate; 270 - second heat dissipation structure; 280 - second cooling pipeline;

[0009] 290 - Cover; 291 - Escape; 292 - Handle. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The terms used in the embodiments of this disclosure are intended only to explain the specific embodiments of this disclosure and are not intended to limit this disclosure. A network switching device (referred to as a switch) is a network hardware device that receives and forwards data to a target device through message exchange, enabling the connection of different devices on a computer network. In related art, switches have multi-port bridges that forward data using MAC addresses at the data link layer. Routing functionality can also be introduced, allowing some switches to forward data at the network layer. Such switches are generally referred to as Layer 3 switches or multilayer switches. However, with the continuous improvement of data center computing power and communication speeds, different application scenarios require different switches for data center switches. The switches used in related art for data centers struggle to meet the application requirements of different scenarios. In view of this, embodiments of the present disclosure provide a network switching device that utilizes a modular design for a chassis assembly and an optoelectronic connection unit. The chassis has an opening at one end, a control substrate is disposed within the chassis, and the optoelectronic connection unit includes a bracket, a board, and a connector. The board is disposed on the bracket, and the connector is disposed on a surface of the board and electrically connected to the board. The connector has a port whose insertion direction matches the extension direction of the board. The port is configured to removably connect with an optical module. Furthermore, the hardware structure specifications of the optoelectronic connection unit are designed to be compatible with the chassis, allowing the optoelectronic connection unit to be removably connected to the chassis through the opening. When the optoelectronic connection unit is connected to the chassis, the board is electrically connected to the control substrate. In this way, the network switching device can adapt optoelectronic connection units with different parameters, such as transmission power, to the chassis based on the application requirements of different scenarios, thereby improving the versatility of the network switching device, expanding the scope of application of the network switching device, and reducing the costs of chassis hardware development, design, manufacturing, and testing. The following describes in detail a network switching device provided by an embodiment of the present disclosure. This embodiment provides a network switching device 10. This network switching device 10 can be any type of switch, for example, an access layer switch, an aggregation layer switch, or a core layer switch. For example, the network switch can be a 4U switch, where U represents a unit of external dimension, with 1 U equal to 4.445 centimeters and 4U equal to 17.78 centimeters. Furthermore, the network switching device 10 provided by an embodiment of the present disclosure can be applied to any scenario requiring a network system, for example, in a data center. The following description of this disclosure uses an aggregation layer switch in a data center as an example.1 to 3 , a network switching device 10 provided in an embodiment of the present disclosure includes a chassis assembly and an optoelectronic connection unit 200. The optoelectronic connection unit 200 is, for example, a removable switch module (RSM), and the chassis assembly is, for example, a removable switch chassis (RSC). The chassis assembly includes a chassis 100 and a control substrate. One end of the chassis 100 has an opening 110. The chassis 100 has an accommodating cavity. The control substrate is disposed in the accommodating cavity of the chassis 100, and the opening 110 is in communication with the accommodating cavity. The control substrate includes, for example, a baseboard management controller (BMC). The optoelectronic connection unit 200 includes a bracket 210, a board 220, and a connector 240. Exemplarily, the board 220 is horizontally disposed on the bracket 210. Connector 240 is disposed on the surface of board 220 and electrically connected to board 220. Connector 240 has a port 241, the insertion direction of which aligns with the extension direction of board 220. Port 241 is configured to removably connect with the optical module. Optoelectronic connection unit 200 is configured to removably connect with chassis 100 through opening 110. When optoelectronic connection unit 200 is connected to chassis 100, board 220 is electrically connected to the control substrate. This allows chassis components to be adapted to different types of RSMs depending on the application scenario, eliminating the need for additional chassis development and reducing chassis development, design, manufacturing, and testing costs. It will be understood that an optical module, including optoelectronic components, functional circuits, and optical interfaces, is a device that performs optical-to-electrical and electrical-to-optical conversion. Optical modules come in two types: transmitting and receiving. The transmitting end converts electrical signals into optical signals, which are then transmitted via optical fiber. The receiving end then converts the optical signals into electrical signals. The board 220 is provided with a chip and an electrical channel (not shown). The chip is electrically connected to the electrical channel, and a connector 240 provided on the board 220 is electrically connected to the electrical channel. Thus, the chip can transmit signals to the connector 240 via the electrical channel. When the optoelectronic connection unit 200 is plugged into the chassis 100, the board 220 is electrically connected to the control substrate, thereby interconnecting the connector 240 with the control substrate through the board 220. The chip is not limited in type or manufacturer.For example, the board 220 may be a printed circuit board (PCB) having a metal conductive layer disposed therein. The metal conductive layer may form an electrical path connecting the connector 240 and the chip in the optoelectronic connection unit 200. For example, the metal conductive layer may be formed of, but is not limited to, conductive materials such as copper, aluminum, copper alloys, and aluminum alloys, which are not limited herein. In some embodiments, the connector 240 may include an insulating housing and a port 241 located on the insulating housing. The port 241 may be provided with a first conductor (not shown) that connects the first conductor to the board 220. For example, the first conductor may be connected to the board 220 by welding. The board 220 may be provided with solder pads, and the first conductor and the solder pads on the board 220 may be soldered together using structures such as solder balls. It is understood that the optical module is provided with a second conductor (not shown). When the optical module is plugged into the port 241, electrical conduction is established between the first conductor and the second conductor. The first conductor and the second conductor include, but are not limited to, materials with good electrical conductivity, such as copper, copper alloys, gold, and silver. Furthermore, in the disclosed embodiment, the appearance and structure of the optoelectronic connection unit 200 match the opening 110 of the chassis 100, enabling a removable connection between the optoelectronic connection unit 200 and the chassis 100 through the opening 110 by plugging and unplugging. When the optoelectronic connection unit 200 is plugged into the chassis 100, the connector 240 in the optoelectronic connection unit 200 establishes signal interconnection with the control substrate via the chip. That is, in the embodiment of the present disclosure, as long as the optical / electrical connection units 200 with different functional parameters such as power are formed into an RSM structure that is compatible and adaptable to the chassis assembly, it is possible to replace only the corresponding optical / electrical connection units 200 in the network switching device 10 according to different application scenarios. That is, different types of optical / electrical connection units 200 can be adapted to the same chassis assembly without the need to develop additional chassis assembly. From the perspective of the design and manufacturing costs of the network switching device 10, this can maximize the savings in the development, design, production, testing, and launch costs of the chassis assembly.To improve the reliability of signal interconnection between the connector 240 and the control substrate when the optoelectronic connection unit 200 is plugged into the chassis 100, in an embodiment of the present disclosure, as shown in FIG. 4 , the board 220 is provided with a first connector 230. For example, the first connector 230 is provided at an end facing away from the port 241. The first connector 230 is electrically connected to the board 220. Specifically, the first connector 230 is electrically connected to an electrical channel of the board 220. The control substrate has a second connector. The first connector 230 and the second connector can be plugged and unplugged to connect or disconnect signals. In this way, the first connector 230 and the second connector can be plugged in as the optoelectronic connection unit 200 is plugged into the chassis 100, and can be separated and removed from each other as the optoelectronic connection unit 200 is unplugged and removed from the chassis 100. This allows different optoelectronic connection units 200 to be adapted to the chassis 100 according to specific needs, thereby reducing the development cost of the chassis 100. The first connector 230 can be a universal connector. Thus, optoelectronic connection units 200 with different modular structures can all be equipped with the first connector 230 to form optoelectronic connection units 200 compatible with the chassis assembly. When the optoelectronic connection unit 200 is plugged into the chassis 100, signal interconnection can be achieved through the first connector 230 plugging into the second connector on the control substrate, thereby realizing switch functionality without requiring additional chassis assembly development. In some embodiments, one of the first connector 230 and the second connector includes a plug interface, and the other includes a plug connector that can be inserted into the plug interface. For example, the first connector 230 includes the plug interface, and the second connector includes a plug connector that can be inserted into the plug interface. In this way, the plug connectors can be removably plugged into the plug interface to electrically connect the board 220 and the control substrate. The first connector 230 may include multiple plug interfaces, and the second connector may include multiple plug connectors. Thus, when the first connector 230 and the second connector are plugged in, the plugging reliability of the first connector 230 and the second connector can be improved, thereby improving the stability of the interconnection signal between the optoelectronic connection unit 200 and the control substrate.Thus, in the embodiment of the present disclosure, the chassis assembly and the optoelectronic connection unit 200 are modularly designed, wherein one end of the chassis 100 has an opening 110, a control substrate is disposed in the chassis 100, and the optoelectronic connection unit 200 includes a bracket 210, a board 220, and a connector 240. The board 220 is disposed on the bracket 210, and the connector 240 is disposed on a surface of the board 220 and electrically connected to the board 220. The connector 240 has a port 241, the plugging direction of the port 241 is adapted to the extension direction of the board 220, and the port 241 is configured to be detachably plugged into the optical module. In addition, by designing the hardware structure specifications of the optoelectronic connection unit 200 to be compatible with the chassis 100, the optoelectronic connection unit 200 can be detachably plugged into the chassis 100 through the opening 110, so that the chassis can be adapted to different types of optoelectronic connection units 200. When the optoelectronic connection unit 200 is plugged into the chassis 100, the board 220 is electrically connected to the control substrate, thereby realizing the switch function. In this way, the network switching device 10 can adapt to optoelectronic connection units 200 with different parameters such as transmission power according to the application requirements of different scenarios to meet the application requirements of different scenarios. This improves the versatility of the network switching device 10, expands the scope of application of the network switching device 10, and reduces the hardware development, design, manufacturing, and testing costs of the network switching device 10. In some embodiments, the optoelectronic connection unit 200 may include at least two plates 220 based on actual needs. The at least two plates 220 may be spaced apart on the bracket 210 along a first direction, where the first direction is, for example, a direction perpendicular to the surface of the plates 220. For example, connectors may be provided between two adjacent plates 220 to connect the two adjacent plates 220, so that the two adjacent plates 220 are spaced apart in the first direction. It is understood that the connectors may provide support for the two adjacent plates 220, thereby improving the stability of the two adjacent plates 220. It is understood that the number of plates 220 may be related to the number of connectors 240 to be provided in the optoelectronic connection unit 200. The greater the number of connectors 240, the greater the number of plates 220. The plates 220 provide mounting support for the connectors 240. At least one side of each plate 220 is provided with a mounting area, and the connector 240 is installed in the mounting area. By providing at least two plates 220 and providing a mounting area on at least one side of each plate 220, it is applicable to an optoelectronic connection unit 200 with more connectors 240.oTherefore, by providing at least two boards 220, the optoelectronic connection unit 200 can support a large number of optical modules. Specifically, the number of boards 220 can be adjusted based on the number of optical modules. The chip is located on one of the at least two boards 220, enabling signal transmission between the chip and the connector 240. The connector 240 can be plugged into a corresponding mounting area on the board 220. For example, the bottom of the connector 240 is provided with fixing legs, and the mounting area of ​​the board 220 is provided with fixing holes. Thus, the connector 240 can be fixedly connected to the mounting area through the plug-in engagement between the fixing legs and the fixing holes. Furthermore, the mounting area can also be provided with an electrical path electrically connected to the first conductor. When the connector 240 is installed on the mounting area of ​​the board 220, the electrical path between the first conductor and the board 220 is electrically conductive, thereby achieving electrical connection between the connector 240 and the board 220. For example, as shown in FIG3 , the optoelectronic connection unit 200 includes a first plate 221 and a second plate 222. The first plate 221 is disposed above the second plate 222. Mounting areas are provided on opposing sides of the first plate 221. Mounting areas are provided on the side of the second plate 222 facing away from the first plate 221. Each mounting area has at least two connectors 240 arranged along a second direction. The first and second directions are perpendicular to each other. The first direction is, for example, perpendicular to the first and second plates 221, and the second direction is, for example, an extension direction of the plate surface. It will be appreciated that by providing mounting areas on opposing sides of the first plate 221, the optoelectronic connection unit 200 can be made more compact while supporting a larger number of connectors 240, thereby improving space utilization. In some embodiments, the optoelectronic connection unit 200 includes a third plate 223 and a fourth plate 224. The third plate 223 and the fourth plate 224 are spaced apart along a first direction and arranged on the bracket 210. The third plate 223 and the fourth plate 224 each have a mounting area on one side of their surface. Specifically, only one side of the third plate 223 and the fourth plate 224 has a mounting area. This allows heat to be dissipated from the other side, which does not have a mounting area, to prevent heat generation from affecting the performance of the plates. Exemplarily, the mounting area of ​​the third plate 223 and the mounting area of ​​the fourth plate 224 are located on the same side. For example, the mounting area of ​​the third plate 223 is located on the upper side of the third plate 223, and the mounting area of ​​the fourth plate 224 is also located on the upper side of the fourth plate 224. This improves layout rationality and heat dissipation.In some embodiments, the optoelectronic connection unit 200 further includes a fifth plate 225, which is disposed at intervals on one side of the third plate 223 or the fourth plate 224. One side of the fifth plate 225 has a mounting area for mounting connectors 240. In one example, as shown in FIG5 , the optoelectronic connection unit 200 includes a third plate 223, a fourth plate 224, and a fifth plate 225. Each side of the third plate 223, the fourth plate 224, and the fifth plate 225 has a mounting area, and each mounting area has at least two connectors 240 arranged along the second direction. By providing mounting areas on the sides of the third plate 223, the fourth plate 224, and the fifth plate 225, and arranging connectors 240 in each mounting area, a larger number of connectors 240 can be supported while heat from the plate 220 can be dissipated through the plate surface without the mounting area, thereby improving the heat dissipation performance of the plate 220. Exemplarily, the connector 240 may employ an SFP (Small Form-factor Pluggable, small form-factor hot-swappable optical module). The connector 240 may employ any form of SFP, such as SFP+ or QSFP (Quad Small Form-factor Pluggable, quad-channel SFP port 241). For example, in FIG3 and FIG5 , the optical / electrical connection unit 200 includes 128 ports 241, i.e., the optical / electrical connection unit 200 may provide 128 ports 241. To meet the interconnection requirements of a data center with a 400 Gb / s transmission rate, the connector 240 may include at least one QSFP112 port 241, i.e., the port 241 in the connector 240 employs a QSFP112. It is understood that QSFP112 can simultaneously support four-lane data transmission at a single channel transmission rate of 112 Gb / s, thereby meeting the interconnection requirements of data centers requiring a transmission rate of 400 Gb / s. Furthermore, its small package size makes it suitable for data center applications. For example, the ports 241 of the connector 240 can all be QSFP112 ports 241.In other embodiments, as shown in FIG. 6 , the optoelectronic connection unit 200 includes a third plate 223 and a fourth plate 224. One side surface of the third plate 223 and the fourth plate 224 has a mounting area. Each mounting area has at least two connectors 240 arranged along the second direction. By providing the mounting area on one side surface of the third plate 223 and the fourth plate 224, that is, the third plate 223 and the fourth plate 224 each have a mounting area on one side surface and no mounting area on the other side surface, heat from the plate 220 can be dissipated through the plate surface without the mounting area, thereby improving the heat dissipation performance of the plate 220. For example, in FIG6 , the optoelectronic connection unit 200 includes 64 ports 241, meaning the optoelectronic connection unit 200 can provide 64 ports 241. The connectors 240 can utilize OSFP (Octa I Small Form-factor Pluggable) ports 241. It is understood that OSFP can simultaneously support eight channels of data transmission at a single channel transmission rate of 1.12 Gb / s, thereby meeting interconnect requirements for a transmission rate of 800 Gb / s. The OSFP package is suitable for telecommunications applications. In some embodiments, a first heat dissipation structure is provided on at least one of the at least two boards 220. By providing the first heat dissipation structure on the board 220, the temperature of the board 220 is reduced, thereby improving the operating reliability and performance stability of the board 220. In some embodiments, referring to FIG. 3 to FIG. 6 , the first heat dissipation structure includes a first heat sink 250. The first heat sink 250 includes a plurality of heat dissipation fins. The heat dissipation fins are disposed on the plate 220. The plurality of heat dissipation fins can increase the heat dissipation area and can quickly dissipate the heat from the chip and the plate 220, thereby improving the heat dissipation efficiency.In other embodiments, as shown in FIG. 7 and FIG. 8 , the first heat dissipation structure includes a cooling liquid plate 260 disposed on the plate body 220. The cooling liquid plate 260 is provided with a circulating cooling channel. The chassis 100 is provided with a first cooling pipe 120. One end of the first cooling pipe 120 is configured to communicate with the cooling channel, and the other end of the first cooling pipe 120 is configured to connect to a cooling source. The cooling source may be a cooling tank or a cooling container disposed outside the chassis 100 for holding cooling liquid. Thus, when the optoelectronic connection unit 200 is plugged into the chassis 100, the first cooling pipe 120 communicates with the cooling channel, and the cooling liquid circulates in the first cooling pipe 120 and the cooling channel. This can reduce the temperature of the plate body 220 through heat exchange, thereby improving heat dissipation efficiency and reliability, thereby improving the operating reliability and performance stability of the plate body 220. Furthermore, the structure is simple and the heat dissipation effect is good. The first cooling pipeline 120 may include an inlet pipeline and an outlet pipeline. The inlet pipeline is connected to the liquid inlet of the cooling channel, and the outlet pipeline is connected to the liquid outlet of the cooling channel. Both the inlet pipeline and the outlet pipeline are also connected to a cooling source. This forms a cooling circulation path, allowing the cooling liquid to dissipate heat through heat exchange with the plate body 220 as it flows through the pipeline, resulting in effective heat dissipation. In some embodiments, the connector 240 has at least two ports 241 spaced apart along the second direction, with a second heat dissipation structure 270 disposed between the two ports 241. By disposing the second heat dissipation structure 270 between the two ports 241 spaced apart along the second direction of the connector 240, heat is dissipated from the network switching device 10 via the second heat dissipation structure 270, thereby improving heat dissipation efficiency. For example, referring to FIG. 5 , the second heat dissipation structure 270 includes a heat dissipation plate connected between the two ports 241 of the connector 240 , and having a plurality of heat dissipation holes disposed on the heat dissipation plate. By disposing the heat dissipation plate between the two ports 241 of the connector 240 and providing the plurality of heat dissipation holes on the heat dissipation plate, heat in the network switching device 10 can be discharged through the heat dissipation holes, thereby improving heat dissipation efficiency while simplifying the structure and reducing costs.In other embodiments, as shown in FIG. 8 , the second heat dissipation structure 270 includes a second cooling pipe 280. At least a portion of the second cooling pipe 280 is located between the two ports 241 of the connector 240. The second cooling pipe 280 is connected to the chassis 100 or an external cooling source. In this way, the coolant in the second cooling pipe 280 can reduce the temperature between the two ports 241 of the connector 240 through heat exchange, thereby simplifying the heat dissipation structure and improving the heat dissipation effect. In some embodiments, please refer to Figures 7 and 8. A water inlet interface 140 and a water outlet interface 150 are provided on the chassis 100, which are respectively connected to the liquid inlet pipeline and the liquid outlet pipeline of the first cooling pipeline 120 and the second cooling pipeline 280. The water inlet interface 140 and the water outlet interface 150 are respectively connected to the cooling source, that is, the cooling source is connected to the water inlet interface 140, and the water inlet interface 140 is further connected to the liquid inlet pipelines of the first cooling pipeline 120 and the second cooling pipeline 280. Correspondingly, the liquid outlet pipelines of the first cooling pipeline 120 and the second cooling pipeline 280 are connected to the cooling source via the water outlet interface 150. In some embodiments, as shown in FIG. 4 , the optoelectronic connection unit 200 further includes a cover plate 290. The cover plate 290 is disposed at an end of the connector 240 away from the chassis 100 and connected to the bracket 210. The cover plate 290 is provided with a plurality of avoidance openings 291, with one avoidance opening 291 corresponding to one port 241. The cover plate 290 matches the number of ports 241 that can be provided by the corresponding optoelectronic connection unit 200, i.e., the number of avoidance openings 291 on the cover plate 290 is greater than or equal to the number of ports 241. By disposing the cover plate 290 at the end of the optoelectronic connection unit 200 away from the chassis 100 and providing the cover plate 290 with a plurality of avoidance openings 291, with one avoidance opening 291 corresponding to one port 241, the cover plate 290 can isolate external dust particles and the like and protect the connector 240, thereby extending the service life of the network switching device 10. In addition, multiple heat dissipation holes can be formed at locations on the cover plate 290 where the avoidance openings 291 are not provided, thereby improving the heat dissipation efficiency of the switch. Furthermore, the cover plate 290 can be made of a material with excellent heat dissipation or thermal conductivity, without limitation. In some embodiments, referring again to FIG. 4 , the cover plate 290 is provided with at least one handle 292. It will be appreciated that by providing the handle 292 on the cover plate 290, the user can use the handle 292 to operate the optoelectronic connection unit 200 when removing or assembling it, thereby improving the user's operational comfort and user experience.As can be seen, the network switching device provided by the embodiments of the present disclosure includes, but is not limited to, the four types of optoelectronic connection units listed in the above embodiments. As long as the various optoelectronic connection units are formed into structures compatible with the chassis, there are no specific restrictions on the number of ports, chip type, and manufacturer of the optoelectronic connection units. These units can be adaptively designed based on actual application scenarios, ensuring that each optoelectronic connection unit has a universal connection port interface for signal interconnection with the control substrate in the chassis. In this way, each optoelectronic connection unit can achieve its switch function by being plugged into the chassis, eliminating the need for additional chassis development and reducing chassis development, design, manufacturing, and testing costs. This allows the network switching device to adapt different optoelectronic connection units to the chassis based on different application scenarios, thereby expanding the applicability of the network switching device and reducing development costs. In the description of the embodiments of the present disclosure, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of these terms in the embodiments of the present disclosure based on specific circumstances. The terms "first," "second," "third," "fourth," and so on (if any) in the description and claims of the embodiments of the present disclosure and the accompanying drawings are used to distinguish similar items and are not necessarily used to describe a specific order or precedence. Furthermore, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to the steps or units expressly listed, but may include other steps or units not expressly listed or inherent to such process, method, product, or apparatus. Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present disclosure, rather than to limit them. Although the embodiments of the present disclosure have been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents, and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

Claims 1. A network switching device, comprising: A chassis assembly and a photoelectric connection unit, wherein the chassis assembly includes a chassis and a control substrate, one end of the chassis has an opening, the control substrate is arranged in the chassis, and the photoelectric connection unit is constructed to be detachably plugged into the chassis through the opening, so that the chassis can be selectively adapted to different photoelectric connection units; the photoelectric connection unit includes a bracket, a board and a connector, the board is arranged on the bracket, the connector is arranged on the surface of the board and is electrically connected to the board, the connector has a port, the plugging direction of the port is adapted to the extension direction of the board, and the port is constructed to be detachably plugged into the optical module; when the photoelectric connection unit is plugged into the chassis, the board is electrically connected to the control substrate.

2. The network switching device according to claim 1, wherein the board body is provided with a first connector, and the control substrate has a second connector; when the optoelectronic connection unit is plugged into the chassis, the first connector and the second connector are plugged into and electrically connected to electrically connect the board body and the control substrate.

3. The network switching device according to claim 2, wherein the first connector is disposed at an end of the board away from the port and is electrically connected to the board.

4. The network switching device according to claim 2 or 3, wherein one of the first connector and the second connector comprises a plug interface, and the other comprises a plug connector that can be inserted into the plug interface.

5. The network switching device according to any one of claims 1 to 4, wherein the optoelectronic connection unit comprises at least two plates, the at least two plates being spaced apart along a first direction on the bracket, at least one side of each plate being provided with a mounting area, the connector being mounted in the mounting area, wherein: The first direction is a direction perpendicular to the plate surface of the plate body.

6. The network switching device according to claim 5, wherein the optoelectronic connection unit comprises a first plate and a second plate, the first plate being disposed above the second plate, the first plate having mounting areas on opposite sides thereof; the second plate having mounting areas on a side facing away from the first plate, each mounting area having at least two connectors arranged along the second direction; The second direction and the first direction are perpendicular to each other.

7. The network switching device according to claim 5, wherein the optoelectronic connection unit comprises a third plate and a fourth plate, wherein the third plate and the fourth plate are arranged on the bracket at intervals along the first direction, and one side surface of the third plate and the fourth plate has the mounting area, and each mounting area has at least two connectors arranged along the second direction.

8. The network switching device according to claim 7, wherein the optoelectronic connection unit further comprises a fifth plate, the fifth plate being spaced apart and arranged on one side of one of the third plate and the fourth plate, the mounting area being provided on one side of the fifth plate, and at least two of the connectors being arranged in the mounting area along the second direction.

9. The network switching device according to claim 6, wherein the optical / electrical connection unit comprises 128 ports, and the connector comprises at least one QSFP112 port.

10. The network switching device according to claim 7, wherein the optical / electrical connection unit comprises 64 ports, and the connector comprises at least one OSPF port.

11. The network switching device according to any one of claims 5 to 10, wherein at least one of the at least two plates is provided with a first heat dissipation structure, and the first heat dissipation structure is configured to dissipate heat from the plate.

12. The network switching device according to claim 11, wherein the first heat dissipation structure comprises a first heat sink, the first heat sink comprises a plurality of heat dissipation fins, and the heat dissipation fins are connected to the board.

13. The network switching device according to claim 11, wherein the first heat dissipation structure comprises a cooling liquid plate, the cooling liquid plate is arranged on the plate body, a cooling channel is provided in the cooling liquid plate, a first cooling pipeline is provided in the chassis, one end of the first cooling pipeline is configured to communicate with the cooling channel, and the other end of the first cooling pipeline is configured to be connected to a cooling source.

14. The network switching device according to any one of claims 1 to 13, wherein the connector has at least two ports spaced apart along the second direction, a second heat dissipation structure is provided between the two ports, and the second heat dissipation structure is configured to dissipate heat from the connector.

15. The network switching device according to claim 14, wherein the second heat dissipation structure comprises a heat dissipation plate, the heat dissipation plate is connected between the two ports of the connector, and a plurality of heat dissipation through holes are provided on the heat dissipation plate.

16. The network switching device according to claim 14, wherein the second heat dissipation structure comprises a second cooling pipeline, at least a portion of the second cooling pipeline is located between the two ports of the connector, and the second cooling pipeline is configured to be connected to a cooling source.

17. The network switching device according to any one of claims 1 to 16, wherein the optoelectronic connection unit further comprises a cover plate, the cover plate being disposed at an end of the connector away from the chassis, the contour of the cover plate matching the opening, the cover plate being provided with a plurality of avoidance openings, one avoidance opening being provided corresponding to one of the ports.

18. The network switching device according to claim 17, wherein at least one handle is provided on the cover.

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