Electronic component and method for manufacturing same

Abstract

[Problem] To provide an electronic component in which the insulation between both ends of a coil is enhanced. [Solution] This electronic component 100 comprises: an element body 110 having a mounting surface 111; a coil C1 embedded in the element body 110; a terminal electrode E1 connected to one end of the coil C1 and having a surface S1 exposed from the mounting surface 111 and a surface S3 covered by the element body 110; a terminal electrode E2 connected to the other end of the coil C1 and having a surface S2 exposed from the mounting surface 111 and a surface S4 covered by the element body 110; and an insulating film 122 including a first portion 1221 provided between the surface S3 of the terminal electrode E1 and the element body 110, a second portion 1222 provided between the surface S4 of the terminal electrode E2 and the element body, and a third portion 1223 provided on the mounting surface 111 and positioned between the terminal electrodes E1, E2. The insulating film 122 is a continuous film that does not have an interface between the first portion 1221 and the third portion 1223 or an interface between the second portion 1222 and the third portion 1223.

Description

Electronic components and their manufacturing method

[0001] The present disclosure relates to electronic components and methods for manufacturing the same.

[0002] Patent Document 1 discloses a coil component having a structure in which a coil pattern is embedded in a magnetic resin layer, and in Patent Document 1, the mounting surface of the magnetic resin layer is covered with a resin film.

[0003] Japanese Patent Application Laid-Open No. 2017-123406

[0004] In the coil component disclosed in Patent Document 1, the internal electrodes are in contact with the magnetic resin layer.

[0005] This disclosure describes an electronic component with enhanced insulation between the ends of a coil and a method for manufacturing the same.

[0006] An electronic component according to one aspect of the present disclosure comprises: a base body having a mounting surface; a coil embedded in the base body; a first terminal electrode electrically connected to one end of the coil and having a first surface exposed from the mounting surface and a third surface covered by the base body; a second terminal electrode electrically connected to the other end of the coil and having a second surface exposed from the mounting surface and a fourth surface covered by the base body; and an insulating film including a first portion provided between the third surface of the first terminal electrode and the base body, a second portion provided between the fourth surface of the second terminal electrode and the base body, and a third portion provided on the mounting surface and located between the first terminal electrode and the second terminal electrode, wherein the insulating film is a continuous film with no interface between the first portion and the third portion and no interface between the second portion and the third portion.

[0007] A method for manufacturing an electronic component according to one aspect of the present disclosure includes a first step of forming a first insulating film on a support; a second step of forming, on the first insulating film, a first terminal electrode having a first surface covered with the first insulating film and a third surface exposed from the first insulating film, and a second terminal electrode having a second surface covered with the first insulating film and a fourth surface exposed from the first insulating film; a third step of forming a second insulating film covering the first insulating film, the third surface of the first terminal electrode, and the fourth surface of the second terminal electrode; The method includes a fourth step of forming a coil connected to the terminal electrode, a fifth step of embedding the coil in the element body so that the third surface of the first terminal electrode is covered with the element body via the second insulating film and the fourth surface of the second terminal electrode is covered with the element body via the second insulating film, a sixth step of exposing the first insulating film by peeling off the support, and a seventh step of removing the first insulating film to expose the first surface of the first terminal electrode, the second surface of the second terminal electrode, and the second insulating film located between the first terminal electrode and the second terminal electrode.

[0008] According to the present disclosure, an electronic component with improved insulation between both ends of a coil and a method for manufacturing the same are provided.

[0009] FIG. 1 is a schematic see-through perspective view showing the appearance of an electronic component (coil component) 100 according to an embodiment of the technology disclosed herein. FIG. 2 is a schematic see-through top view of the coil component 100. FIG. 3 is a schematic cross-sectional view of the coil component 100 taken along imaginary line L1 shown in FIG. 2. FIG. 4 is a schematic bottom view of the coil component 100. FIG. 5(a) is an enlarged cross-sectional view for explaining the structure of connection portion V1 in more detail. FIG. 5(b) is an enlarged cross-sectional view for explaining the structure of connection portion V4 in more detail. FIG. 6(a) is an enlarged cross-sectional view for explaining the structure of connection portion V2 in more detail. FIG. 6(b) is an enlarged cross-sectional view for explaining the structure of connection portion V3 in more detail. FIG. 7 is a schematic exploded perspective view of a circuit module 200 including the coil component 100. FIGS. 8(a) to 8(c) are process diagrams for explaining an example of a method for manufacturing the coil component 100. FIGS. 9(a) to 9(c) are process diagrams for explaining an example of a method for manufacturing the coil component 100. FIG. 10 is a process diagram for explaining an example of a method for manufacturing the coil component 100. 11(a) to 11(c) are process diagrams for explaining another example of a method for manufacturing the coil component 100. FIG.

[0010] Hereinafter, embodiments of the technology according to the present disclosure will be described in detail with reference to the accompanying drawings.

[0011] Fig. 1 is a schematic perspective view showing the appearance of an electronic component (coil component) 100 according to an embodiment of the technology disclosed herein. Fig. 2 is a schematic perspective top view of the coil component 100, Fig. 3 is a schematic cross-sectional view of the coil component 100 taken along imaginary line L1 shown in Fig. 2, and Fig. 4 is a schematic bottom view of the coil component 100.

[0012] As shown in FIGS. 1 to 4 , the coil component 100 according to this embodiment includes an element body 110, four coils C1 to C4 embedded in the element body 110, and terminal electrodes E1 to E8 exposed on the surface of the element body 110. The element body 110 may be made of a composite magnetic material in which magnetic particles made of a high-permeability material such as ferrite or permalloy are bound by a resin binder. As shown in FIG. 3 , the element body 110 defines an XY plane and has a mounting surface 111 and a top surface 112 located on opposite sides. Eight terminal electrodes E1 to E8 are exposed from the mounting surface 111. The mounting surface 111 is covered with an insulating film 122 made of resin or the like. The surfaces of the terminal electrodes E1 to E8 exposed from the mounting surface 111 may be flush with the insulating film 122 covering the mounting surface 111.

[0013] Terminal electrode E1 has a surface S1 exposed from mounting surface 111 and a surface S3 covered by element body 110 with insulating film 122 interposed therebetween. Terminal electrode E2 has a surface S2 exposed from mounting surface 111 and a surface S4 covered by element body 110 with insulating film 122 interposed therebetween. Surface S1 constitutes the XY plane, which is the lower surface of terminal electrode E1. Surface S2 constitutes the XY plane, which is the lower surface of terminal electrode E2. In contrast, surface S3 includes an upper surface located opposite surface S1 and a side surface connecting the upper and lower surfaces. Similarly, surface S4 includes an upper surface located opposite surface S2 and a side surface connecting the upper and lower surfaces. The above configuration is similar for the other terminal electrodes E3 to E8.

[0014] 3 , the insulating film 122 includes a first portion 1221 provided between the surface S3 of the terminal electrode E1 and the element body 110, a second portion 1222 provided between the surface S4 of the terminal electrode E2 and the element body 110, and a third portion 1223 provided on the mounting surface 111 and located between the terminal electrodes E1 and E2. The first portion 1221 of the insulating film 122 mainly serves to prevent contact between the terminal electrode E1 and the element body 110. The second portion 1222 of the insulating film 122 mainly serves to prevent contact between the terminal electrode E2 and the element body 110. The third portion 1223 of the insulating film 122 mainly serves to increase the withstand voltage between the terminal electrodes E1 and E2.

[0015] The surface S1 of the terminal electrode E1, the surface S2 of the terminal electrode E2, and the surface of the third portion 1223 of the insulating film 122 provided on the mounting surface 111 may be flush with each other. This allows the coil component 100 to be thin in the Z direction. The surface S1 of the terminal electrode E1 and the surface S2 of the terminal electrode E2 may be covered with conductive surface treatment layers 131 and 132, respectively. The surface treatment layers 131 and 132 may be made of a Ni / Sn laminate film, a Ni / Pt / Au laminate film, a Ni / Au laminate film, or the like. Providing such surface treatment layers 131 and 132 improves the wettability of solder during mounting. The surfaces of the other terminal electrodes E3 to E8 exposed from the mounting surface 111 may also be covered with a surface treatment layer.

[0016] 3, four conductor layers 71 to 74 are embedded in the element body 110. Terminal electrodes E1 to E8 are all located in the conductor layer 71. An insulating film 90 made of resin or the like is provided between the conductor layers 72 to 74 so that none of them come into contact with the element body 110. The insulating film 90 may be divided into an insulating film covering the conductor layer 72, an insulating film covering the conductor layer 73, and an insulating film covering the conductor layer 74. The insulating film 90 may be made of the same material as the insulating film 122.

[0017] Hereinafter, the direction from terminal electrode E1 to terminal electrode E2 may be referred to as the X direction (or +X direction), and the opposite direction may be referred to as the −X direction. Similarly, the direction from terminal electrode E1 to terminal electrode E7 may be referred to as the Y direction (or +Y direction), and the opposite direction may be referred to as the −Y direction. Similarly, the direction from mounting surface 111 to upper surface 112 may be referred to as the Z direction (or +Z direction), and the opposite direction may be referred to as the −Z direction. In the specific example shown in FIGS. 1 to 4 , the X direction, Y direction, and Z direction are orthogonal to each other. Note that the present disclosure also includes cases where the angles formed by the X direction, Y direction, and Z direction differ from a right angle due to manufacturing errors or the like of coil component 100 (for example, when the angles differ by about 5° from a right angle).

[0018] As shown in FIG. 4 , not only terminal electrodes E1 to E8 but also conductor patterns 11, 24, 37, and 40 are exposed on the mounting surface 111. Terminal electrodes E1 to E8 and conductor patterns 11, 24, 37, and 40 are located on the same conductor layer 71. The surfaces of conductor patterns 11, 24, 37, and 40 exposed from the element body 110 may be flush with the surface of third portion 1223 of insulating film 122 covering mounting surface 111 of element body 110. As shown in FIG. 4 , terminal electrodes E1 and E2 are arranged in the X direction, with conductor pattern 11 extending in the X direction located between them. Terminal electrodes E3 and E4 are arranged in the X direction, with conductor pattern 24 extending in the X direction located between them. Terminal electrodes E5 and E6 are arranged in the X direction, with conductor pattern 37 extending in the X direction located between them. The terminal electrodes E7 and E8 are arranged in the X direction, and the conductor pattern 40 extending in the X direction is located between them.

[0019] 3, the conductor pattern 11 has a surface S5 exposed from the mounting surface 111 and a surface S6 covered by the element body 110 with the insulating film 122 interposed therebetween. Surface S5 constitutes the XY plane, which is the lower surface of the conductor pattern 11. Surface S6 includes an upper surface located opposite surface S5 and a side surface connecting the upper and lower surfaces. Surface S6 of the conductor pattern 11 is covered by the element body 110 with the insulating film 122 interposed therebetween.

[0020] 3, the insulating film 122 further includes a fourth portion 1224 provided between the surface S6 of the conductive pattern 11 and the element body 110. The fourth portion 1224 of the insulating film 122 mainly serves to prevent contact between the conductive pattern 11 and the element body 110.

[0021] The insulating film 122 is a continuous film. That is, the above-mentioned portions 1221 to 1224 are integral, and no interface exists between them. For example, the first portion 1221 of the insulating film 122 that covers the surface S3 of the terminal electrode E1 and the third portion 1223 of the insulating film 122 that covers the mounting surface 111 of the element body 110 are continuous, and no interface exists between them. That is, at the position where the side of the surface S3 and the surface S1 contact, the first portion 1221 and the third portion 1223 of the insulating film 122 are continuously formed without an interface. The top and side surfaces of the surface S3 of the terminal electrode E1 are also continuously covered by the first portion 1221 of the insulating film 122 without an interface. Similarly, the second portion 1222 of the insulating film 122 that covers the surface S4 of the terminal electrode E2 and the third portion 1223 of the insulating film 122 that covers the mounting surface 111 of the element body 110 are continuous, and no interface exists between them. That is, at the position where the side surface of surface S4 and surface S2 meet, the second portion 1222 and the third portion 1223 of the insulating film 122 are formed continuously without an interface. The upper surface and side surface of surface S4 of the terminal electrode E2 are also covered continuously without an interface by the second portion 1222 of the insulating film 122. The fourth portion 1224 of the insulating film 122 that covers surface S6 of the conductor pattern 11 and the third portion 1223 of the insulating film 122 that covers the mounting surface 111 of the element body 110 are also continuous, with no interface between them.

[0022] The surface S5 of the conductor pattern 11 and the surface of the third portion 1223 of the insulating film 122 provided on the mounting surface 111 may be flush with each other. The surface S5 of the conductor pattern 11 may be covered with a conductive material similar to the surface treatment layers 131 and 132, or may be exposed as is. The above configuration also applies to the other conductor patterns 24, 37, and 40 exposed from the element body 110.

[0023] 1 to 4, the terminal electrodes E1, E3, E5, and E7 are arranged in the Y direction, and the terminal electrodes E2, E4, E6, and E8 are arranged in the Y direction, which allows the size of the element body 110 to be reduced in the X direction.

[0024] 1 to 4, the positions of the conductor patterns 11 and 37 in the X direction may be the same, and the positions of the conductor patterns 24 and 40 in the X direction may be the same. In contrast, the positions of the conductor patterns 11 and 37 in the X direction are different from the positions of the conductor patterns 24 and 40 in the X direction. In the example shown in FIG. 4, the positions of the conductor patterns 11 and 37 in the X direction do not overlap with the positions of the conductor patterns 24 and 40 in the X direction. The edge positions of the conductor patterns 11 and 37 in the −X direction (the side on which the terminal electrodes E1, E3, E5, and E7 are formed in FIG. 4) and the edge positions of the conductor patterns 24 and 40 in the +X direction (the side on which the terminal electrodes E2, E4, E6, and E8 are formed in FIG. 4) may be substantially the same. However, the present invention is not limited to this, and the positions of the conductor patterns 11 and 37 in the X direction and the positions of the conductor patterns 24 and 40 in the X direction may partially overlap in the X direction.

[0025] The coil C1 is connected between the terminal electrode E1 and the terminal electrode E2. One end of the coil C1 is electrically connected to the terminal electrode E1, and the other end of the coil C1 is electrically connected to the terminal electrode E2. The coil C1 has a conductor pattern 11 located on the conductor layer 71, conductor patterns 12 and 13 located on the conductor layer 74, and conductor patterns 81 to 88 located on the conductor layer 72 or conductor layer 73. The conductor patterns 12 and 13 located on the conductor layer 74 are embedded in the element body 110 without being exposed from either the mounting surface 111 or the top surface 112. Conductor patterns that overlap in a plan view seen from the Z direction are connected via via conductors. When viewed from the Z direction, the conductor pattern 11 extends linearly in the X direction, while the conductor patterns 12 and 13 extend in the X direction while meandering in the Y direction.

[0026] 3, conductor layer 72 includes conductor patterns 81 to 84, and conductor layer 73 includes conductor patterns 85 to 88. Conductor patterns 81 and 85 form connection portion V1, conductor patterns 82 and 86 form connection portion V2, conductor patterns 83 and 87 form connection portion V3, and conductor patterns 84 and 88 form connection portion V4. Connection portions V1 to V4 may be arranged in this order in the X direction.

[0027] In addition, in a cross section taken along imaginary line L2 in FIG. 2, connection portions V5 to V8 are formed by conductor patterns located on conductor layers 72 and 73. The connection portions V5 to V8 may be arranged in this order in the X direction. In a cross section taken along imaginary line L3 in FIG. 2, connection portions V9 to V12 are formed by conductor patterns located on conductor layers 72 and 73. The connection portions V9 to V12 may be arranged in this order in the X direction. In a cross section taken along imaginary line L4 in FIG. 2, connection portions V13 to V16 are formed by conductor patterns located on conductor layers 72 and 73. The connection portions V13 to V16 may be arranged in this order in the X direction.

[0028] In the embodiment illustrated in FIG. 2 , in a plan view seen from the Z direction, the conductor pattern 12 has a first linear portion 51 that is linearly formed in the X direction and whose end in the −X direction is connected to the connection portion V1. The conductor pattern 12 further has a second linear portion 52 that extends linearly in the X direction and whose end in the −X direction is connected to the end of the first linear portion 51 in the +X direction via a first bend 61 and whose end in the +X direction is connected to the connection portion V3 via a second bend 62. The first bend 61 illustrated in FIG. 2 may include a bend from the +X direction to the −Y direction and a bend from the −Y direction to the +X direction from the connection portion V1 toward the connection portion V3. The second bend 62 illustrated in FIG. 2 may include a bend from the +X direction to the +Y direction from the connection portion V1 toward the connection portion V3. In the example illustrated in FIG. 2 , the conductor pattern 13 extends linearly in the X direction, and has a third straight portion 53 whose end in the −X direction is connected to the connection portion V2 via a third bend portion 63 and whose end in the +X direction is connected to the connection portion V4 via a fourth bend portion 64.

[0029] One end of conductor pattern 12 in the −X direction is connected to terminal electrode E1 via connection portion V1. One end of conductor pattern 13 in the +X direction is connected to terminal electrode E2 via connection portion V4. One end of conductor pattern 11 located on the terminal electrode E1 side (−X direction side) is connected to the other end of conductor pattern 13 via connection portion V2. The other end of conductor pattern 11 located on the terminal electrode E2 side (+X direction side) is connected to the other end of conductor pattern 12 via connection portion V3.

[0030] As a result, current input from the outside to the terminal electrode E1 flows to the terminal electrode E2 via the connection portion V1, the conductor pattern 12, the connection portion V3, the conductor pattern 11, the connection portion V2, the conductor pattern 13, and the connection portion V4. Here, current flows mainly in the +X direction through the conductor patterns 12 and 13, while current flows in the −X direction through the conductor pattern 11. Furthermore, current flows in the −Z direction through the connection portion V3, while current flows in the +Z direction through the connection portion V2. As a result, the conductor pattern 12, the connection portion V3, the conductor pattern 11, the connection portion V2, and the conductor pattern 13 form a loop with the Y direction as its axial direction. A portion of the element body 110 is embedded in the region surrounded by the loop as viewed from the Y direction. The portion surrounded by this loop is the region (the inductor core) where magnetic flux is generated when current flows through the coil C1. Furthermore, in a plan view as viewed from the Z direction, the region surrounded by the conductor patterns 12 and 13 overlaps with a portion of the conductor pattern 11.

[0031] Coil C2 is disposed adjacent to coils C1 and C3 so as to be sandwiched between them in the Y direction, and is connected between terminal electrodes E3 and E4. One end of coil C2 is electrically connected to terminal electrode E3, and the other end of coil C2 is electrically connected to terminal electrode E4. Coil C2 has a conductor pattern 24 located on conductor layer 71, conductor patterns 25 and 26 located on conductor layer 74, and connection portions V5 to V8 located on conductor layer 72 or conductor layer 73. Connection portions V5 to V8 may be arranged in this order in the X direction. While conductor pattern 24 extends linearly in the X direction, conductor patterns 25 and 26 extend in the X direction while meandering in the Y direction.

[0032] In the embodiment illustrated in FIG. 2 , in a plan view seen from the Z direction, the conductor pattern 26 is formed linearly in the X direction and has a fourth straight portion 54 whose end in the +X direction is connected to the connection portion V8. The conductor pattern 26 further includes a fifth straight portion 55 that extends linearly in the X direction and whose end in the +X direction is connected to the −X direction end of the fourth straight portion 54 via a fifth bend 65 and whose end in the −X direction is connected to the connection portion V6 via a sixth bend 66. The fifth bend 65 illustrated in FIG. 2 may include a bend from the −X direction to the −Y direction and a bend from the −Y direction to the −X direction from the connection portion V8 toward the connection portion V6. The sixth bend 66 illustrated in FIG. 2 may include a bend from the −X direction to the +Y direction from the connection portion V8 toward the connection portion V6. In the example illustrated in FIG. 2 , the conductor pattern 25 also has a sixth straight portion 56 that extends linearly in the X direction, and whose end in the +X direction is connected to the connection portion V7 via a seventh bend 67, and whose end in the −X direction is connected to the connection portion V5 via an eighth bend 68.

[0033] One end of conductor pattern 25 in the −X direction is connected to terminal electrode E3 via connection portion V5. One end of conductor pattern 26 in the +X direction is connected to terminal electrode E4 via connection portion V8. One end of conductor pattern 24 located on the terminal electrode E3 side (−X direction side) is connected to the other end of conductor pattern 26 via connection portion V6. The other end of conductor pattern 24 located on the terminal electrode E4 side (+X direction side) is connected to the other end of conductor pattern 25 via connection portion V7.

[0034] As a result, current input from the outside to the terminal electrode E3 flows to the terminal electrode E4 via the connection portion V5, the conductor pattern 25, the connection portion V7, the conductor pattern 24, the connection portion V6, the conductor pattern 26, and the connection portion V8. Here, current flows primarily in the +X direction through the conductor patterns 25 and 26, while current flows in the −X direction through the conductor pattern 24. Furthermore, current flows in the −Z direction through the connection portion V7, while current flows in the +Z direction through the connection portion V6. As a result, the conductor pattern 25, the connection portion V7, the conductor pattern 24, the connection portion V6, and the conductor pattern 26 form a loop with the Y direction as its axial direction. The area surrounded by this loop is the region (the inductor core) where magnetic flux is generated when current flows through the coil C2. A portion of the element body 110 is embedded in the region surrounded by the loop when viewed from the Y direction. Furthermore, the region surrounded by the conductor patterns 25 and 26 overlaps with a portion of the conductor pattern 24 in a plan view viewed from the Z direction.

[0035] Coil C3 is disposed adjacent to coils C2 and C4 so as to be sandwiched between them in the Y direction, and is connected between terminal electrodes E5 and E6. One end of coil C3 is electrically connected to terminal electrode E5, and the other end of coil C3 is electrically connected to terminal electrode E6. Coil C3 has a conductor pattern 37 located on conductor layer 71, conductor patterns 38 and 39 located on conductor layer 74, and connection portions V9 to V12 located on conductor layer 72 or conductor layer 73. Connection portions V9 to V12 may be arranged in this order in the X direction. While conductor pattern 37 extends linearly in the X direction, conductor patterns 38 and 39 extend in the X direction while meandering in the Y direction.

[0036] Like conductor pattern 12, conductor pattern 38 has two straight portions and two bends. Like conductor pattern 13, conductor pattern 39 has one straight portion and two bends. One end of conductor pattern 38 in the −X direction is connected to terminal electrode E5 via connection portion V9. One end of conductor pattern 39 in the +X direction is connected to terminal electrode E6 via connection portion V12. One end of conductor pattern 37 located on the terminal electrode E5 side (−X direction side) is connected to the other end of conductor pattern 39 via connection portion V10. The other end of conductor pattern 37 located on the terminal electrode E6 side (+X direction side) is connected to the other end of conductor pattern 38 via connection portion V11.

[0037] As a result, current input from the outside to the terminal electrode E5 flows to the terminal electrode E6 via the connection portion V9, the conductor pattern 38, the connection portion V11, the conductor pattern 37, the connection portion V10, the conductor pattern 39, and the connection portion V12. Here, current flows primarily in the +X direction through the conductor patterns 38 and 39, while current flows in the −X direction through the conductor pattern 37. Furthermore, current flows in the −Z direction through the connection portion V11, while current flows in the +Z direction through the connection portion V10. As a result, the conductor patterns 38, the connection portion V11, the conductor patterns 37, the connection portion V10, and the conductor pattern 39 form a loop with the Y direction as its axial direction. The area surrounded by this loop is the region (the inductor core) where magnetic flux is generated when current flows through the coil C3. A portion of the element body 110 is embedded in the region surrounded by the loop when viewed from the Y direction. Furthermore, the region surrounded by the conductor patterns 38 and 39 overlaps with a portion of the conductor pattern 37 in a plan view viewed from the Z direction.

[0038] Coil C4 is disposed adjacent to coil C3 in the Y direction and is connected between terminal electrodes E7 and E8. One end of coil C4 is electrically connected to terminal electrode E7, and the other end of coil C4 is electrically connected to terminal electrode E8. Coil C4 has a conductor pattern 40 located on conductor layer 71, conductor patterns 41 and 42 located on conductor layer 74, and connection portions V13 to V16 located on conductor layer 72 or conductor layer 73. Connection portions V13 to V16 may be arranged in this order in the X direction. Conductor pattern 40 extends linearly in the X direction, while conductor patterns 41 and 42 extend in the X direction while meandering in the Y direction.

[0039] Like the conductor pattern 25, the conductor pattern 41 has one straight portion and two bend portions. Like the conductor pattern 26, the conductor pattern 42 has two straight portions and two bend portions. One end of the conductor pattern 41 in the −X direction is connected to the terminal electrode E7 via a connection portion V13. One end of the conductor pattern 42 in the +X direction is connected to the terminal electrode E8 via a connection portion V16. One end of the conductor pattern 40 located on the terminal electrode E7 side (−X direction side) is connected to the other end of the conductor pattern 42 via a connection portion V14. The other end of the conductor pattern 40 located on the terminal electrode E8 side (+X direction side) is connected to the other end of the conductor pattern 41 via a connection portion V15.

[0040] As a result, current input from the outside to the terminal electrode E7 flows to the terminal electrode E8 via the connection portion V13, the conductor pattern 41, the connection portion V15, the conductor pattern 40, the connection portion V14, the conductor pattern 42, and the connection portion V16. Here, current flows primarily in the +X direction through the conductor patterns 41 and 42, while current flows in the −X direction through the conductor pattern 40. Furthermore, current flows in the −Z direction through the connection portion V15, while current flows in the +Z direction through the connection portion V14. As a result, the conductor patterns 41, the connection portion V15, the conductor pattern 40, the connection portion V14, and the conductor pattern 42 form a loop with the Y direction as its axial direction. The area surrounded by this loop is the region (the inductor core) where magnetic flux is generated when current flows through the coil C4. A portion of the element body 110 is embedded in the region surrounded by the loop when viewed from the Y direction. Furthermore, in a plan view viewed from the Z direction, the region surrounded by the conductor patterns 41 and 42 overlaps with a portion of the conductor pattern 40.

[0041] FIG. 5A is an enlarged cross-sectional view for explaining the structure of the connection portion V1 in more detail.

[0042] As shown in FIG. 5A , the conductor pattern 81 located on the conductor layer 72 is connected to the upper surface of the terminal electrode E1 located on the conductor layer 71 through a via conductor 81V consisting of a part of the conductor pattern 81. The via conductor 81V penetrates the insulating film 122 and has a shape in which its diameter decreases toward the terminal electrode E1. The conductor pattern 85 located on the conductor layer 73 is connected to the conductor pattern 81 located on the conductor layer 72 through a via conductor 85V consisting of a part of the conductor pattern 85. The via conductor 85V penetrates the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 81. The conductor pattern 12 located on the conductor layer 74 is connected to the conductor pattern 85 located on the conductor layer 73 through a via conductor 12V consisting of a part of the conductor pattern 12. The via conductor 12V penetrates the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 85. The insulating film 90 and the first portion 1221 of the insulating film 122 are connected to each other without any gaps.

[0043] As a result, when external stress is applied to terminal electrode E1 in the +Z direction, the diameter of via conductor 81V is expanded in the direction of stress transmission, thereby dispersing the stress applied to conductor pattern 81. The stress applied to conductor pattern 81 is transmitted to conductor pattern 85 through via conductor 85V, but the expanded diameter of via conductor 85V in the direction of stress transmission disperses the stress applied to conductor pattern 85. Furthermore, the stress applied to conductor pattern 85 is transmitted to conductor pattern 12 through via conductor 12V, but the expanded diameter of via conductor 12V in the direction of stress transmission disperses the stress applied to conductor pattern 12. This mechanism internally disperses stress applied to terminal electrode E1 from the outside, thereby improving product reliability.

[0044] FIG. 5B is an enlarged cross-sectional view for explaining the structure of the connection portion V4 in more detail.

[0045] As shown in FIG. 5B , the conductor pattern 84 located on the conductor layer 72 is connected to the upper surface of the terminal electrode E2 located on the conductor layer 71 through a via conductor 84V consisting of a part of the conductor pattern 84. The via conductor 84V penetrates the insulating film 122 and has a shape in which its diameter decreases toward the terminal electrode E2. The conductor pattern 88 located on the conductor layer 73 is connected to the conductor pattern 84 located on the conductor layer 72 through a via conductor 88V consisting of a part of the conductor pattern 88. The via conductor 88V penetrates the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 84. The conductor pattern 13 located on the conductor layer 74 is connected to the conductor pattern 88 located on the conductor layer 73 through a via conductor 13V consisting of a part of the conductor pattern 13. The via conductor 13V penetrates the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 88. The insulating film 90 and the second portion 1222 of the insulating film 122 are connected to each other without any gaps.

[0046] As a result, when external stress is applied to terminal electrode E2 in the +Z direction, the diameter of via conductor 84V is expanded in the direction of stress transmission, thereby dispersing the stress applied to conductor pattern 84. The stress applied to conductor pattern 84 is transmitted to conductor pattern 88 through via conductor 88V, but the diameter of via conductor 88V is expanded in the direction of stress transmission, thereby dispersing the stress applied to conductor pattern 88. Furthermore, the stress applied to conductor pattern 88 is transmitted to conductor pattern 13 through via conductor 13V, but the diameter of via conductor 13V is expanded in the direction of stress transmission, thereby dispersing the stress applied to conductor pattern 13. This mechanism internally disperses stress applied to terminal electrode E2 from the outside, thereby improving product reliability.

[0047] Although not shown, stress applied to the other terminal electrodes E3 to E8 is also dispersed internally by a similar mechanism. That is, the via conductors included in the connection portions V5, V8, V9, V12, V13, and V16 also have a shape in which the diameter expands in the +Z direction (the diameter contracts in the −Z direction), and even when stress in the +Z direction is applied to the terminal electrodes E3 to E8, the stress is dispersed internally.

[0048] FIG. 6A is an enlarged cross-sectional view for explaining the structure of the connection portion V2 in more detail.

[0049] As shown in FIG. 6A , the conductor pattern 82 located on the conductor layer 72 is connected to the conductor pattern 11 located on the conductor layer 71 through a via conductor 82V consisting of a part of the conductor pattern 82. The via conductor 82V is provided to penetrate the insulating film 122 and has a shape in which its diameter decreases toward the conductor pattern 11. The conductor pattern 86 located on the conductor layer 73 is connected to the conductor pattern 82 located on the conductor layer 72 through a via conductor 86V consisting of a part of the conductor pattern 86. The via conductor 86V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 82. The conductor pattern 13 located on the conductor layer 74 is connected to the conductor pattern 86 located on the conductor layer 73 through a via conductor 13V consisting of a part of the conductor pattern 13. The via conductor 13V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 86.

[0050] As a result, if external stress is applied to conductive pattern 11 in the +Z direction, the stress applied to conductive pattern 82 is dispersed because the diameter of via conductor 82V is enlarged in the direction of stress transmission. The stress applied to conductive pattern 82 is transmitted to conductive pattern 86 through via conductor 86V, but the stress applied to conductive pattern 86 is dispersed because the diameter of via conductor 86V is enlarged in the direction of stress transmission. Furthermore, the stress applied to conductive pattern 86 is transmitted to conductive pattern 13 through via conductor 13V, but the stress applied to conductive pattern 13 is dispersed because the diameter of via conductor 13V is enlarged in the direction of stress transmission. This mechanism allows external stress applied to conductive pattern 11 to be dispersed internally, thereby improving product reliability.

[0051] FIG. 6B is an enlarged cross-sectional view for explaining the structure of the connection portion V3 in more detail.

[0052] As shown in FIG. 6B , the conductor pattern 83 located on the conductor layer 72 is connected to the conductor pattern 11 located on the conductor layer 71 through a via conductor 83V consisting of a part of the conductor pattern 83. The via conductor 83V is provided to penetrate the insulating film 122 and has a shape in which its diameter decreases toward the conductor pattern 11. The conductor pattern 87 located on the conductor layer 73 is connected to the conductor pattern 83 located on the conductor layer 72 through a via conductor 87V consisting of a part of the conductor pattern 87. The via conductor 87V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 83. The conductor pattern 12 located on the conductor layer 74 is connected to the conductor pattern 87 located on the conductor layer 73 through a via conductor 12V consisting of a part of the conductor pattern 12. The via conductor 12V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 87.

[0053] As a result, if external stress is applied to conductive pattern 11 in the +Z direction, the stress applied to conductive pattern 83 is dispersed because the diameter of via conductor 83V is enlarged in the direction of stress transmission. The stress applied to conductive pattern 83 is transmitted to conductive pattern 87 through via conductor 87V, but the stress applied to conductive pattern 87 is dispersed because the diameter of via conductor 87V is enlarged in the direction of stress transmission. Furthermore, the stress applied to conductive pattern 87 is transmitted to conductive pattern 12 through via conductor 12V, but the stress applied to conductive pattern 12 is dispersed because the diameter of via conductor 12V is enlarged in the direction of stress transmission. This mechanism distributes external stress applied to conductive pattern 11 internally, thereby improving product reliability.

[0054] Although not shown, the via conductors included in the connection parts V6, V7, V10, V11, V14, and V15 connected to other conductor patterns 24, 37, and 40 located on the conductor layer 71 also have a shape in which the diameter expands in the +Z direction (the diameter contracts in the -Z direction), and even if stress in the +Z direction is applied to the conductor patterns 24, 37, and 40, the stress is dispersed internally.

[0055] With the above configuration, the coil component 100 according to this embodiment forms an eight-terminal coil array incorporating four coils. The coil component 100 can be mounted in a mounting area 100A on a substrate 130 shown in Fig. 7 to form a circuit module 200. Land patterns P1 to P8 are provided on the surface of the substrate 130, and the coil component 100 is mounted on the substrate 130 so that the terminal electrodes E1 to E8 are connected to the land patterns P1 to P8, respectively.

[0056] In the coil component 100 according to this embodiment, the coils C1 to C4 are arranged in the Y direction, and each has a loop whose axial direction is the Y direction, so the size of the element body 110 in the Y direction can be reduced. In particular, since the positions in the X direction of the conductor patterns provided on the mounting surface 111 of two coils adjacent to each other in the Y direction are different from each other, the sections in which the conductor patterns provided on the conductor layer 74 of each coil overlap in the Y direction can be shifted in the X direction between adjacent coils. For example, the section in which the conductor patterns 12 and 13 of coil C1 overlap in the Y direction and the section in which the conductor patterns 25 and 26 of coil C2 overlap in the Y direction can be shifted in the X direction. This makes it possible to incorporate multiple coils more densely into the element body 110.

[0057] Furthermore, since the stacking direction of the conductor patterns inside element body 110 is the Z direction, even if the number of coils built into element body 110 increases, the number of stacked conductor patterns does not increase, and manufacturing costs are also reduced.

[0058] 2, if an imaginary line L0 is defined that passes through the centers of coils C1 to C4 in the X direction and extends in the Y direction, conductor patterns 12 and 13 that constitute coil C1 and conductor patterns 25 and 26 that constitute coil C2 have shapes that are line-symmetrical with respect to the imaginary line L0, and conductor patterns 38 and 39 that constitute coil C3 and conductor patterns 41 and 42 that constitute coil C4 have shapes that are line-symmetrical with respect to the imaginary line L0. In other words, when conductor patterns 12 and 13 that constitute coil C1 are flipped around the imaginary line L0, they have the same shape as conductor patterns 25 and 26 that constitute coil C2, and when conductor patterns 38 and 39 that constitute coil C3 are flipped around the imaginary line L0, they have the same shape as conductor patterns 41 and 42 that constitute coil C4.

[0059] Furthermore, when imaginary lines L1 to L4 are defined as passing through the centers of coils C1 to C4 in the Y direction and extending in the X direction, conductor patterns 12 and 13 constituting coil C1 and conductor patterns 38 and 39 constituting coil C3 have shapes that are line-symmetrical with respect to imaginary lines L1 and L3, respectively, and conductor patterns 25 and 26 constituting coil C2 and conductor patterns 41 and 42 constituting coil C4 have shapes that are line-symmetrical with respect to imaginary lines L2 and L4, respectively. In other words, when conductor patterns 12 and 13 constituting coil C1 are flipped around imaginary line L1, they have the same shape as conductor patterns 38 and 39 constituting coil C3, and when conductor patterns 38 and 39 constituting coil C3 are flipped around imaginary line L3, they have the same shape as conductor patterns 12 and 13 constituting coil C1. Similarly, when the conductor patterns 25 and 26 constituting the coil C2 are flipped around the imaginary line L2 as the axis of symmetry, they have the same shape as the conductor patterns 41 and 42 constituting the coil C4, and when the conductor patterns 41 and 42 constituting the coil C4 are flipped around the imaginary line L4 as the axis of symmetry, they have the same shape as the conductor patterns 25 and 26 constituting the coil C2. In other words, the conductor patterns 38 and 39 constituting the coil C3 may be formed in shapes having straight portions and bent portions similar to the conductor patterns 12 and 13 constituting the coil C1, and the conductor patterns 41 and 42 constituting C4 may be formed in shapes having straight portions and bent portions similar to the conductor patterns 25 and 26 constituting the coil C2, respectively.

[0060] Furthermore, if the intersections of virtual line L0 and virtual lines L1 to L4 are designated Q1 to Q4, coils C1 and C4 have shapes that are point-symmetrical with respect to each other, with intersections Q1 and Q4 as the center points, respectively, and coils C2 and C3 have shapes that are point-symmetrical with respect to each other, with intersections Q2 and Q3 as the center points, respectively. In other words, when coil C1 is rotated 180° around intersection Q1, it takes on the same shape as coil C4, and when coil C4 is rotated 180° around intersection Q4, it takes on the same shape as coil C1. Similarly, when coil C2 is rotated 180° around intersection Q2, it takes on the same shape as coil C3, and when coil C3 is rotated 180° around intersection Q3, it takes on the same shape as coil C2.

[0061] In this way, since the coils C1 to C4 have the above-described shapes, the coils C1 to C4 having the same inductance can be arranged at high density, and the pattern design of the conductor pattern becomes easy.

[0062] Furthermore, in the coil component 100 according to this embodiment, the mounting surface 111 of the element body 110 is covered with the insulating film 122, thereby improving the insulation between the terminal electrodes E1 to E8. Moreover, because the insulating film 122 is an integral, continuous film with no interfaces, peeling at the interfaces is unlikely to occur, making it possible to achieve high reliability.

[0063] 8(a) to 8(c), 9(a) to 9(c), and 10 are process diagrams for explaining an example of a method for manufacturing the coil component 100 according to this embodiment. The cross sections shown in FIGS. 8(a) to 8(c), 9(a) to 9(c), and 10 correspond to the cross section shown in FIG.

[0064] First, as shown in FIG. 8( a), a support S is prepared. Next, as shown in FIG. 8( b), an insulating film 121 made of resin or the like is formed on the support S, and then terminal electrodes E1 to E8 and conductor patterns 11, 24, 37, and 40 are formed on the insulating film 121. The cross section shown in FIG. 8( b) shows the terminal electrodes E1 and E2 and the conductor pattern 11. The terminal electrodes E1 and E2 and the conductor pattern 11 are formed so that surfaces S1, S2, and S5 are covered with the insulating film 121 and surfaces S3, S4, and S6 are exposed from the insulating film 121. Next, as shown in FIG. 8( c), the entire surface is covered with an insulating film 122. As a result, the exposed surface of the insulating film 121, surface S3 of the terminal electrode E1, surface S4 of the terminal electrode E2, and surface S6 of the conductor pattern 11 are covered with the insulating film 122.

[0065] Next, as shown in Figure 9(a), conductor layers 71 to 74 are formed in this order. Conductor layer 71 includes a sacrificial pattern 91. Focusing on coil C1, conductor layer 72 includes conductor patterns 81 to 84. Furthermore, conductor layer 72 includes a sacrificial pattern 92. The conductor patterns 81 to 84 and the sacrificial pattern 92 are separated from each other by an insulating film 90. The sacrificial pattern 92 located on conductor layer 72 is connected to the sacrificial pattern 91 located on conductor layer 71.

[0066] Focusing on coil C1, conductor layer 73 includes conductor patterns 85 to 88. Furthermore, conductor layer 73 includes sacrificial pattern 93. Conductive patterns 85 to 88 and sacrificial pattern 93 are separated from each other by insulating film 90. Sacrificial pattern 93 located on conductor layer 73 is connected to sacrificial pattern 92 located on conductor layer 72. Focusing on coil C1, conductor layer 74 includes conductor patterns 12 and 13. Furthermore, conductor layer 74 includes sacrificial pattern 94. Conductive patterns 12 and 13 and sacrificial pattern 94 are separated from each other by insulating film 90. Sacrificial pattern 94 located on conductor layer 74 is connected to sacrificial pattern 93 located on conductor layer 73.

[0067] Next, as shown in Figure 9(b), the sacrificial patterns 91-94 are removed using acid or the like. This forms a space between the conductor patterns 12 and 13 located on the conductor layer 74 and the support S. In other words, both ends of the conductor pattern 12 are supported by the connection portions V1 and V3, and the portion located between the ends is suspended in mid-air. Also, both ends of the conductor pattern 13 are supported by the connection portions V2 and V4, and the portion located between the ends is suspended in mid-air.

[0068] Next, as shown in FIG. 9( c), an element body 110 made of a magnetic material is formed in the region where the sacrificial patterns 91-94 have been removed and in the layer above it, thereby embedding the conductor layers 71-74 in the element body 110. In forming the element body 110, the conductor layers 71-74 are embedded in the uncured element body 110, and then the element body 110 is hardened by applying pressure to the support S. By adjusting the pressure conditions applied to the element body 110, the conductor patterns 12 and 13 can be formed in a linear shape, as exemplified in FIGS. 3, 9( c), and 10. Note that by appropriately adjusting the pressure conditions and heating conditions applied to the element body 110, the conductor patterns 12 and 13 may be formed so as to curve toward the support S.

[0069] 10, the support S is peeled off, thereby exposing the insulating film 121. The insulating film 121 is then removed by a desmear process or the like so as to expose the terminal electrodes E1 to E8 and the conductor patterns 11, 24, 37, and 40 located on the conductor layer 71, thereby completing the coil component 100 according to this embodiment. Thereafter, a conductive surface treatment layer may be formed on the surfaces of the terminal electrodes E1 to E8.

[0070] As described above, according to the method for manufacturing coil component 100 of this embodiment, conductor layers 71 to 74 are formed in this order starting from the conductor layer 71 side where terminal electrodes E1 to E8 are located, and this allows the process of forming element body 110 to be completed in one step, compared to a method in which conductor layers 74 to 71 are formed in this order starting from the conductor layer 74 side. In other words, with a method in which conductor layers 74 to 71 are formed in this order starting from the conductor layer 74 side, it is necessary to form conductor layers 74 to 71 on support S in this order, then form element body 110 in which conductor layers 74 to 71 are embedded, and then peel off support S and form another portion of element body 110 starting from the conductor layer 74 side, requiring two steps to form element body 110. Furthermore, if element body 110 is formed in two steps, an interface is formed in element body 110, and the magnetic properties of this portion are reduced. In contrast, in the manufacturing method of the coil component 100 according to this embodiment, the process of forming the base body 110 is completed in one step, thereby reducing manufacturing costs, and since no interface is formed inside the base body 110, it is possible to ensure high magnetic properties.

[0071] Moreover, according to the above-described manufacturing method, the insulating film 122 remains as a continuous film, eliminating the need for a separate process of covering the mounting surface 111 of the element body 110 with an insulating film, thereby reducing the number of steps. Furthermore, according to the above-described manufacturing method, the surfaces of the terminal electrodes E1 to E8 and the conductor patterns 11, 24, 37, 40 and the third surface 1223 of the insulating film 122 covering the mounting surface 111 of the element body 110 form substantially the same plane, making it possible to reduce the height of the coil component 100 in the Z direction.

[0072] 11(a) to 11(c) are process diagrams for explaining another example of the method for manufacturing the coil component 100 according to this embodiment. The cross sections shown in Fig. 11(a) to 11(c) correspond to the cross section shown in Fig. 3.

[0073] First, as shown in Fig. 11(a), an insulating film 121 made of resin or the like is formed on a support S, and then, as shown in Fig. 11(b), a plurality of recesses are formed in the insulating film 121. The cross section shown in Fig. 11(b) shows recesses 1211 to 1213. Next, as shown in Fig. 11(c), terminal electrodes E1 to E8 and conductor patterns 11, 24, 37, and 40 are formed in the recesses formed in the insulating film 121. The cross section shown in Fig. 11(c) shows the terminal electrode E1 formed in the recess 1211, the terminal electrode E2 formed in the recess 1212, and the conductor pattern 11 formed in the recess 1213.

[0074] The subsequent steps are as described with reference to Figure 8(c), Figure 9(a) to Figure 9(c), and Figure 10. In this way, by forming a plurality of recesses in the insulating film 121 and forming the terminal electrodes E1 to E8 and the conductor patterns 11, 24, 37, and 40 in the recesses, even when the insulating film 121 is removed by polishing, the terminal electrodes E1 to E8 and the conductor patterns 11, 24, 37, and 40 that protrude from the surface of the insulating film 122 are polished away, making it possible to ensure a sufficient remaining thickness of the insulating film 122.

[0075] The above describes embodiments of the technology according to the present disclosure, but the technology according to the present disclosure is not limited to the above embodiments, and various modifications are possible within the scope of the gist of the technology, and it goes without saying that these modifications are also included within the scope of the technology according to the present disclosure.

[0076] For example, in the embodiment illustrated in Figures 1 to 4, a coil component including four coils C1 to C4 is disclosed, but in the technology disclosed herein, the number of coils included in the electronic component (coil component) is not limited.

[0077] In addition, in the embodiment illustrated in FIGS. 1 to 4, four conductor layers 71 to 74 are embedded in element body 110, but in the technology according to the present disclosure, there is no particular limit to the number of conductor layers embedded in the element body.

[0078] Furthermore, there are no particular limitations on the shape, size, etc. of the terminal electrodes E1 to E8. For example, the terminal electrodes E1 to E8 may be cylindrical conductor posts.

[0079] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0080] An electronic component according to one aspect of the present disclosure comprises: an element body having a mounting surface; a coil embedded in the element body; a first terminal electrode electrically connected to one end of the coil and having a first surface exposed from the mounting surface and a third surface covered by the element body; a second terminal electrode electrically connected to the other end of the coil and having a second surface exposed from the mounting surface and a fourth surface covered by the element body; and an insulating film including a first portion provided between the third surface of the first terminal electrode and the element body, a second portion provided between the fourth surface of the second terminal electrode and the element body, and a third portion provided on the mounting surface and located between the first and second terminal electrodes, wherein the insulating film is a continuous film with no interface between the first and third portions and no interface between the second and third portions, thereby increasing the breakdown voltage between the first and second terminal electrodes and suppressing peeling of the insulating film.

[0081] In the electronic component, the first surface of the first terminal electrode, the second surface of the second terminal electrode, and the surface of the third portion of the insulating film may be flush with each other, which allows the height of the electronic component to be reduced.

[0082] In the electronic component, the first surface of the first terminal electrode and the second surface of the second terminal electrode may be covered with a conductive surface treatment layer, which improves the wettability of the solder during mounting.

[0083] The electronic component may further include a first via conductor electrically connecting one end of the coil to a first terminal electrode and a second via conductor electrically connecting the other end of the coil to a second terminal electrode, wherein at least a portion of the first via conductor may have a shape that decreases in diameter toward the first terminal electrode, and at least a portion of the second via conductor may have a shape that decreases in diameter toward the second terminal electrode, thereby enabling stress applied to the first and second terminal electrodes from the outside to be dispersed internally.

[0084] In the electronic component described above, the third surface may have an upper surface facing the first surface in the thickness direction of the first terminal electrode and a side surface connecting the upper surface and the first surface, the fourth surface may have an upper surface facing the second surface in the thickness direction of the second terminal electrode and a side surface connecting the upper surface and the second surface, the upper surface of the third surface and the side surface of the third surface may be continuously covered without an interface with the first portion of the insulating film, the first portion and the third portion may be continuously formed without an interface at a position where the side surface of the third surface contacts the first surface, and the upper surface of the fourth surface and the side surface of the fourth surface may be continuously covered without an interface with the second portion of the insulating film, and the second portion and the third portion may be continuously formed without an interface at a position where the side surface of the fourth surface contacts the second surface. This makes it difficult for peeling to occur at the interface, thereby achieving high reliability.

[0085] The electronic component further includes a first conductor pattern that forms one end of the coil and is electrically connected to an upper surface of the third surface of the first terminal electrode through a first via conductor that penetrates a first portion of the insulating film, a second conductor pattern that forms the other end of the coil and is electrically connected to an upper surface of the fourth surface of the second terminal electrode through a second via conductor that penetrates a second portion of the insulating film, and another insulating film that covers the first and second conductor patterns, wherein the first portion of the insulating film and the another insulating film may be connected without any gaps, and the second portion of the insulating film and the another insulating film may be connected without any gaps, thereby improving the reliability of the via conductors.

[0086] A method for manufacturing an electronic component according to one aspect of the present disclosure includes a first step of forming a first insulating film on a support; a second step of forming, on the first insulating film, a first terminal electrode having a first surface covered with the first insulating film and a third surface exposed from the first insulating film, and a second terminal electrode having a second surface covered with the first insulating film and a fourth surface exposed from the first insulating film; a third step of forming a second insulating film covering the first insulating film, the third surface of the first terminal electrode, and the fourth surface of the second terminal electrode; The semiconductor device includes a fourth step of forming a coil connected to the daughter electrode, a fifth step of embedding the coil in the element body so that the third surface of the first terminal electrode is covered with the element body via the second insulating film and the fourth surface of the second terminal electrode is covered with the element body via the second insulating film, a sixth step of exposing the first insulating film by peeling off the support, and a seventh step of removing the first insulating film to expose the first surface of the first terminal electrode, the second surface of the second terminal electrode, and the second insulating film located between the first and second terminal electrodes. This allows the second insulating film to remain as a continuous film.

[0087] The method for manufacturing the electronic component may further include, after the seventh step, a step of forming a conductive surface treatment layer on the first surface of the first terminal electrode and the second surface of the second terminal electrode, which improves the wettability of the solder during mounting.

[0088] The method for manufacturing an electronic component may further include, after the first step and before the second step, a step of forming first and second recesses in the first insulating film, wherein in the second step, the first terminal electrode is formed in the first recess and the second terminal electrode is formed in the second recess. This makes it possible to ensure a sufficient remaining thickness of the second insulating film even when the first insulating film is removed by polishing.

[0089] This application claims the benefit of Japanese Patent Application No. 2024-015299, filed February 3, 2024, the entire disclosure of which is incorporated herein by reference.

[0090] 11 to 13, 24 to 26, 37 to 44, 81 to 88 Conductor patterns 12V, 13V, 81V, 84V, 85V, 88V Via conductors 51 to 56 Straight portions 61 to 68 Bent portions 71 to 74 Conductor layer 90 Insulating film 91 to 94 Sacrificial pattern 95 Coating layer 100 to 103 Coil component (electronic component) 100A Mounting area 110 Body 111 Mounting surface 112 Upper surface 121, 122 Insulating film 1211 to 1213 Recessed portions 1221 to 1224 Parts 130 Substrate 131, 132 Surface treatment layer 200 Circuit module C1 to C4 Coil E1 to E8 Terminal electrodes L0 to L4 Virtual lines P1 to P8 Land patterns Q1 to Q4 Intersection S Support S1 to S6 Surface V1 to V16 Connection

Claims

1. An electronic component comprising: an element body having a mounting surface; a coil embedded in the element body; a first terminal electrode electrically connected to one end of the coil and having a first surface exposed from the mounting surface and a third surface covered by the element body; a second terminal electrode electrically connected to the other end of the coil and having a second surface exposed from the mounting surface and a fourth surface covered by the element body; and an insulating film including a first portion provided between the third surface of the first terminal electrode and the element body, a second portion provided between the fourth surface of the second terminal electrode and the element body, and a third portion provided on the mounting surface and located between the first terminal electrode and the second terminal electrode, wherein the insulating film is a continuous film with no interface between the first portion and the third portion and no interface between the second portion and the third portion.

2. The electronic component according to claim 1, wherein the first surface of the first terminal electrode, the second surface of the second terminal electrode, and the surface of the third portion of the insulating film form the same plane.

3. The electronic component according to claim 1, wherein the first surface of the first terminal electrode and the second surface of the second terminal electrode are covered with a conductive surface treatment layer.

4. An electronic component according to any one of claims 1 to 3, further comprising: a first via conductor electrically connecting the one end of the coil to a first terminal electrode; and a second via conductor electrically connecting the other end of the coil to a second terminal electrode, wherein at least a portion of the first via conductor has a shape in which its diameter decreases toward the first terminal electrode, and at least a portion of the second via conductor has a shape in which its diameter decreases toward the second terminal electrode.

5. The electronic component according to claim 2, wherein the third surface has an upper surface facing the first surface in the thickness direction of the first terminal electrode and a side surface connecting the upper surface and the first surface, the fourth surface has an upper surface facing the second surface in the thickness direction of the second terminal electrode and a side surface connecting the upper surface and the second surface, the upper surface of the third surface and the side surface of the third surface are continuously covered with the first part of the insulating film without an interface, and the first part and the third part are continuously formed without an interface at a position where the side surface of the third surface and the first surface contact, the upper surface of the fourth surface and the side surface of the fourth surface are continuously covered with the second part of the insulating film without an interface, and the second part and the third part are continuously formed without an interface at a position where the side surface of the fourth surface and the second surface contact.

6. The electronic component according to claim 5, further comprising: a first conductor pattern constituting the one end of the coil and electrically connected to the upper surface of the third surface of the first terminal electrode through a first via conductor provided to penetrate the first portion of the insulating film; a second conductor pattern constituting the other end of the coil and electrically connected to the upper surface of the fourth surface of the second terminal electrode through a second via conductor provided to penetrate the second portion of the insulating film; and another insulating film covering the first and second conductor patterns, wherein the first portion of the insulating film and the other insulating film are connected without any gaps, and the second portion of the insulating film and the other insulating film are connected without any gaps.

7. A first step of forming a first insulating film on a support; a second step of forming, on the first insulating film, a first terminal electrode having a first surface covered with the first insulating film and a third surface exposed from the first insulating film, and a second terminal electrode having a second surface covered with the first insulating film and a fourth surface exposed from the first insulating film; a third step of forming a second insulating film covering the first insulating film, the third surface of the first terminal electrode, and the fourth surface of the second terminal electrode; a fourth step of forming a coil having one end connected to the first terminal electrode and the other end connected to the second terminal electrode; a fifth step of embedding the coil in the element body so that the third surface of the first terminal electrode is covered with the element body via the second insulating film, and the fourth surface of the second terminal electrode is covered with the element body via the second insulating film; and a sixth step of exposing the first insulating film by peeling off the support. and a seventh step of removing the first insulating film to expose the first surface of the first terminal electrode, the second surface of the second terminal electrode, and the second insulating film located between the first terminal electrode and the second terminal electrode.

8. The method for manufacturing an electronic component according to claim 7, further comprising, after carrying out the seventh step, a step of forming a conductive surface treatment layer on the first surface of the first terminal electrode and the second surface of the second terminal electrode.

9. A method for manufacturing an electronic component according to claim 7 or 8, further comprising the step of forming first and second recesses in the first insulating film after performing the first step and before performing the second step, wherein in the second step, the first terminal electrode is formed in the first recess and the second terminal electrode is formed in the second recess.

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