Optical packaging device and electronic apparatus

Abstract

An optical packaging device and an electronic apparatus. The optical packaging device comprises a photosensitive die, a packaging substrate and a packaging layer, wherein the photosensitive die is arranged on the packaging substrate and is electrically connected to the packaging substrate by means of an electrical connection structure; the surface of the photosensitive die that faces away from the packaging substrate has a photosensitive area and a non-photosensitive area, and a detector of the photosensitive die is located in the photosensitive area; and the packaging layer comprises a light-transmitting packaging layer and a light-shielding packaging layer, wherein the light-transmitting packaging layer is attached to the photosensitive area of the photosensitive die, the light-shielding packaging layer is attached to the non-photosensitive area of the photosensitive die and a side portion of the photosensitive die, and the electrical connection structure is embedded in the light-shielding packaging layer. With this configuration, a detection function of a photosensitive die is achieved on the basis of the arrangement of a light-transmitting packaging layer; and a light-shielding packaging layer wrapping around the periphery of the light-transmitting packaging layer, the photosensitive die and an electrical connection structure is used, such that stray light outside of a photosensitive area can be effectively isolated, and the size of the device can be effectively reduced.

Description

Optical packaging device and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on February 5, 2024, with application number 202420281761.8 and invention name “An Optical Packaging Device and Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The embodiments of the present application relate to the technical field of electronic device packaging, and in particular to an optical packaging device and an electronic device. Background Art

[0003] With the development and evolution of mobile phones, full-screen design has become a development trend of mobile phones, resulting in smaller and smaller ink areas on the screen, which limits the configurable position of proximity light devices. When the proximity light device is set below the screen module, due to the low transmittance of the screen module, there is a large energy loss in both the emission and reception of the proximity light. After transmitting and receiving through the screen twice, the signal attenuation is large, and the signal reaching the proximity light receiving end is very weak. At the same time, based on the light-guiding characteristics of each layer of the screen module, part of the energy emitted by the proximity light will crosstalk to the receiving end. The greater the crosstalk, the greater the noise of the crosstalk signal. And as the screen transmittance becomes lower and lower, the actual signal amount becomes lower and lower. In addition to improving the signal-to-noise ratio performance of the device itself, the suppression of crosstalk light has become an important processing direction for improving the proximity light signal-to-noise ratio. Summary of the Invention

[0004] The embodiments of the present application provide an optical packaging device and an electronic device, which can reasonably control the height of the device through structural optimization.

[0005] A first aspect of an embodiment of the present application provides an optical packaging device, which includes a photosensitive core, a packaging substrate and a packaging layer, wherein the photosensitive core is arranged on the packaging substrate and is electrically connected to the packaging substrate through an electrical connection structure; the surface of the photosensitive core facing away from the packaging substrate has a photosensitive area and a non-photosensitive area, and the detector of the photosensitive core is located in the photosensitive area; the packaging layer includes a light-transmitting packaging layer and a light-isolating packaging layer, wherein the light-transmitting packaging layer is attached to the photosensitive area of ​​the photosensitive core, the light-isolating packaging layer is attached to the non-photosensitive area of ​​the photosensitive core and the side of the photosensitive core, and the electrical connection structure connected between the photosensitive core and the packaging substrate is embedded in the light-isolating packaging layer.

[0006] With this arrangement, the photosensitive core particle detection function is realized based on the setting of the light-transmitting packaging layer, and the light-isolating packaging layer coated on the light-transmitting packaging layer, the photosensitive core particle and the periphery of the electrical connection structure is used to effectively isolate the interference light outside the photosensitive area. The packaging layer formed by the light-transmitting packaging layer and the light-isolating packaging layer is coated on the periphery of the photosensitive core particle and its electrical connection structure, and the photosensitive core particle is seamlessly encapsulated on the packaging substrate to form a gapless packaging body; that is, the packaging layer and the photosensitive core particle and the electrical connection structure are fully fitted. On the one hand, the light-isolating packaging layer is arranged on the surface of the photosensitive core particle, and the device packaging height is effectively reduced. Compared with the implementation scheme of using a black plastic cover to cover the barrier, for photosensitive core particles of the same size, the device height size can be controlled to the maximum extent; on the other hand, the light-isolating packaging layer is coated on the side of the photosensitive core particle and the periphery of the electrical connection structure, which can further reasonably control the size of the device within the packaging width. Overall, the device size can be effectively reduced.

[0007] In practical applications, the photosensitive core particle can be electrically connected to the solder balls or pads of the packaging substrate by wire bonding, flip chip or tape automated bonding.

[0008] Exemplarily, the electrical connection structure may be a bonding wire.

[0009] Based on the first aspect, the present application also provides a first implementation of the first aspect: the light-transmitting encapsulation layer and the light-blocking encapsulation layer are formed using an injection molding process. For example, but not limited to, a two-color injection molding process can be used. This process provides excellent manufacturability and a high encapsulation yield.

[0010] Based on the first aspect, or the first embodiment of the first aspect, the present application also provides a second embodiment of the first aspect: the light-transmitting encapsulation layer is formed by injection molding a light-transmitting material, and the light-isolating encapsulation layer is formed by injection molding a light-isolating material. In practical applications, the light-transmitting encapsulation layer can be formed by injection molding a transparent epoxy resin, or a transparent silicone resin; the light-isolating encapsulation layer can be formed by injection molding a black epoxy resin, or a black silicone resin.

[0011] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, the embodiment of the present application further provides a third embodiment of the first aspect: in the longitudinal section of the optical packaging device, the thickness B of the light-isolating packaging layer and the distance L between the boundary position of the photosensitive area and the boundary position of the detector satisfy the following condition: B = L / tanθ, where θ is the optical field angle formed by the detector, and 40° < θ < 65°. In this way, the height dimension of the device can be reasonably controlled on the basis of obtaining better detection accuracy, meeting the design requirements of the trend of product miniaturization.

[0012] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, the embodiment of the present application also provides a fourth embodiment of the first aspect: the detector of the photosensitive core particle is a proximity light detector.

[0013] Based on the fourth embodiment of the first aspect, the present application also provides a fifth embodiment of the first aspect: the light-transmitting encapsulation layer is a convex lens structure. The lens-shaped light-transmitting encapsulation layer better converges received light onto the detector surface, increasing the overall amount of light entering, thereby improving the sensitivity of the device.

[0014] Based on the fourth embodiment of the first aspect, the present application also provides a sixth embodiment of the first aspect, further comprising a bandpass filter film, which is applied to at least the surface of the transparent encapsulation layer. This further isolates the proximity light detector from interference light of non-signal wavelengths, such as, but not limited to, the influence of external ambient light. Furthermore, compared to implementations using glass filters, applying the bandpass filter film directly to the surface of the encapsulation layer does not increase the overall height of the device, and its cost is manageable.

[0015] In practical applications, the bandpass filter film can be only covered on the light-transmitting packaging layer, and the bandpass filter film can also be extended to cover the light-isolating packaging layer, which has good processing properties and consistent appearance.

[0016] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, the embodiments of the present application further provide a seventh embodiment of the first aspect: the detector of the light-sensing core comprises a first detector and a second detector, and the first detector and the second detector are spaced apart and arranged in the light-sensing region. Exemplarily, the first detector is a proximity light detector, and the second detector is an ambient light detector.

[0017] Based on the seventh embodiment of the first aspect, the present application also provides an eighth embodiment of the first aspect, further comprising an antireflection film, the antireflection film being applied to at least a surface of the light-transmitting encapsulation layer. This further reduces reflection loss of received light at the encapsulation interface, thereby reducing effective signal attenuation and enhancing the effective optical signal.

[0018] In practical applications, the anti-reflection film can be only covered on the light-transmitting packaging layer, and the anti-reflection film can also be extended to cover the light-isolating packaging layer, which has good processing performance and consistent appearance.

[0019] A second aspect of an embodiment of the present application provides an electronic device, which includes an optical packaging device. The optical packaging device adopts the optical packaging device described above.

[0020] Exemplarily, the electronic device may be a mobile phone, a tablet computer, a laptop computer, or a wearable smart device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0022] FIG2 is a top view of an optical packaging device provided in an embodiment of the present application;

[0023] FIG3 is a cross-sectional view AA in FIG2 ;

[0024] FIG4 is a flow chart of a molding process of an optical packaging device provided in an embodiment of the present application;

[0025] FIG5 is a side cross-sectional view of another optical packaging device provided in an embodiment of the present application;

[0026] FIG6 is a side cross-sectional view of another optical packaging device provided in an embodiment of the present application;

[0027] FIG7 is a side cross-sectional view of another optical packaging device provided in an embodiment of the present application;

[0028] FIG8 is a side cross-sectional view of another optical packaging device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0029] The embodiments of the present application provide a structurally optimized optical packaging device that can reasonably control the height of the device while effectively reducing the impact of crosstalk light.

[0030] Photoelectric sensing chips can achieve corresponding outputs as the illumination changes, and are widely used in different scenarios. In practical applications, they need to have good anti-interference characteristics to ensure signal detection accuracy. Taking the proximity light sensor in a mobile phone as an example, the traditional implementation method is to place the proximity light device under the ink area of ​​the screen module. Based on the lower visible light transmittance and higher proximity light (such as infrared light) transmittance of the screen ink area, it can ensure that the energy loss of transmission and reception is relatively low. In order to adapt to the full-screen design, the ink area at the top of the screen is getting smaller and smaller, squeezing the configurable position of the proximity light device, so that the proximity light device needs to be placed under the screen module.

[0031] Please refer to Figure 1, which is a structural diagram of an electronic device provided in an embodiment of the present application. For example, the electronic device 100 shown in the figure is a mobile phone, and the proximity light sensor 10 of the mobile phone is placed on the main board 30 below the screen module 20, and determines the existence or distance of an object by detecting reflected light. On the one hand, affected by the light-guiding characteristics of each layer of the screen module, part of the energy of the proximity light emission will crosstalk to the receiving end. The greater the crosstalk, the greater the noise of the crosstalk signal; on the other hand, as the screen transmittance tends to be lower and lower, the signal attenuation after transmitting and receiving through the screen twice is large, and the signal amount gradually decreases. Overall, the proximity light signal-to-noise ratio cannot be effectively improved. The above problems also exist in other electronic devices with screen modules.

[0032] In the related art, in order to suppress the influence of crosstalk light, a black plastic cover structure is used for isolation. In the specific implementation, a light-transmitting material is used to encapsulate the photosensitive core and its bonding leads on the packaging substrate to form a light-transmitting plastic package. Here, the photosensitive core (Chip) refers to a bare chip formed by processing and cutting the wafer, and the bare chip is integrated with a photosensitive integrated circuit with corresponding functions. A black plastic cover is made of black light-shielding material, and the black plastic cover is then installed on the outside of the light-transmitting plastic package to form a photosensitive package device. The black plastic cover has a light inlet hole, which can block crosstalk light while realizing the detection function. However, the black plastic cover mounted on the outer peripheral packaging substrate of the light-transmitting plastic package increases the overall packaging height of the device, which cannot meet the design requirements of the trend of product miniaturization.

[0033] Based on this, an embodiment of the present application provides an optical packaging device, including a photosensitive core, a packaging substrate, and a packaging layer. The photosensitive core is arranged on the packaging substrate and is electrically connected to the packaging substrate through an electrical connection structure. The surface of the photosensitive core facing away from the packaging substrate has a photosensitive area and a non-photosensitive area. Here, the "photosensitive area" refers to the position area corresponding to the detector of the photosensitive core, that is, the area for receiving light information signals. The photosensitive area at least includes the detector. In order to meet the requirements of the field of view angle, the photosensitive area may be larger than the area corresponding to the detector. The "non-photosensitive area" refers to the area other than the "photosensitive area" on the surface of the photosensitive core facing away from the packaging substrate. The packaging layer includes a light-transmitting packaging layer and a light-isolating packaging layer. The light-transmitting packaging layer is covered on the photosensitive area of ​​the photosensitive core by an injection molding process. The light-isolating packaging layer is covered on the non-photosensitive area of ​​the photosensitive core, the side of the photosensitive core, and the periphery of the electrical connection structure by an injection molding process to form a packaging body.

[0034] With this arrangement, the light-transmitting encapsulation layer is used to realize the photosensitive core detection function, and the light-isolating encapsulation layer coated on the light-transmitting encapsulation layer, the photosensitive core, and the outer periphery of the electrical connection structure is used to effectively isolate the crosstalk light outside the photosensitive area. The encapsulation layer formed by the light-transmitting encapsulation layer and the light-isolating encapsulation layer is coated on the outer periphery of the photosensitive core and its electrical connection structure, and the photosensitive core is encapsulated on the encapsulation substrate without a gap to form a gapless encapsulation body; that is, by utilizing the characteristics of the injection molding encapsulation process, the encapsulation layer and the photosensitive core and the electrical connection structure are fully fitted. On the one hand, the light-isolating encapsulation layer is arranged on the surface of the photosensitive core, and the device packaging height is effectively reduced. Compared with the implementation scheme of using a black plastic cover to cover the barrier, for photosensitive cores of the same size, the device height size can be controlled to the maximum extent; on the other hand, the light-isolating encapsulation layer is coated on the side of the photosensitive core and the outer periphery of the electrical connection structure, which can further reasonably control the size of the device within the packaging width. Overall, the device size can be effectively reduced.

[0035] To better understand the technical solutions and technical effects of this application, without loss of generality, specific embodiments will be described in detail below with reference to the accompanying drawings. Please refer to Figures 2 and 3 , where Figure 2 is a top view of an optical packaging device provided in an embodiment of this application, and Figure 3 is a cross-sectional view taken along line AA in Figure 2 .

[0036] The optical package device 10 shown in Figure 2 is a proximity light sensor, and its detector 11 is a proximity light detector used to detect whether an object is approaching the mobile phone. For example, but not limited to, the proximity light detector can be an infrared photodetector or an ultraviolet light detector. As shown in Figure 3, the optical package device 10 includes a photosensitive core 1, a packaging substrate 2, and an encapsulation layer 3. The photosensitive core 1 is electrically bonded to the pads of the packaging substrate 2 via leads 12.

[0037] In a specific implementation, the encapsulation layer 3 includes a light-transmitting encapsulation layer 31 and a light-isolating encapsulation layer 32. The encapsulation layer 3, formed by an injection molding process, can encapsulate the photosensitive core 1 within the encapsulation substrate 2. The external pins (not shown) of the optical package device 10 are located on the encapsulation substrate 2 and can be electrically connected to the motherboard, thereby connecting the photosensitive core 1 to external circuits.

[0038] The encapsulation layer 3 comprises a light-transmitting encapsulation layer 31 and a light-isolating encapsulation layer 32. The light-transmitting encapsulation layer 31 is injection-molded from a light-transmitting material and covers the photosensitive region S1 of the photosensitive core 1. The photosensitive region S1 is larger than the detector 11 to create an optical field of view θ that meets the signal acquisition requirements. The detector 11 of the photosensitive core 1 is located roughly in the center of the photosensitive region S1, receiving reflected light and providing a sealed protection through the light-transmitting encapsulation layer 31.

[0039] In other possible implementations, according to the parameter selection of the light-sensitive core 1 in different scenarios, the size of the light-sensitive area S1 may be substantially the same as the size of the detector 11 (not shown in the figure). This embodiment of the present application is not limited thereto.

[0040] In a specific implementation, the light-transmitting encapsulation layer 31 can be made of a transparent resin material, for example, a resin material with high transmittance (transmittance greater than 90%) at a wavelength of 380 nm to 1200 nm, preferably a resin material with high transmittance at a wavelength of 800 nm to 1200 nm. For example, but not limited to, the resin material can be epoxy resin or silicone resin.

[0041] The light-isolating encapsulation layer 32 is formed by injection molding using a light-isolating material and covers the non-photosensitive region S2 of the photosensitive core 1, the sides of the photosensitive core 1, and the periphery of the leads 12, effectively isolating the light from outside the photosensitive region. In a specific implementation, the light-isolating encapsulation layer 32 can be made of black epoxy or silicone resin, and the non-photosensitive region S2 can be located outside the photosensitive region S1.

[0042] Furthermore, to achieve an effective optical field of view, the distance L between the boundary of the photosensitive region S1 and the boundary of the detector 11, and the thickness B of the light-isolating encapsulation layer 32, must satisfy the detector's optical field of view angle θ, i.e., 40° < θ < 65°. As shown in Figure 3 , within the longitudinal cross-section of the optical packaging device 10, the thickness B of the light-isolating encapsulation layer 32 and the distance L between the boundary of the photosensitive region S1 and the boundary of the detector 11 must satisfy the following equation: B = L / tanθ. This ensures both the performance of the detector 11 and the reasonable control of the device height.

[0043] In this embodiment, the light-transmitting encapsulation layer 31 and the light-isolating encapsulation layer 32 can be formed in one step by a two-color injection molding process.

[0044] S41, first place the photosensitive core particle 1 and the packaging substrate 2 to be injection molded in the first mold cavity. In the first mold cavity, the photosensitive area S1 of the photosensitive core particle 1 is covered, and the non-photosensitive area S2 of the photosensitive core particle 1, the side of the photosensitive core particle 1 and the lead are all exposed in the first injection mold cavity 4A, that is, the area of ​​the light-isolating packaging layer is exposed; then, the light-isolating material is injected into the first injection mold cavity 4A through the first injection hole 4a1 by hot injection molding, and the light-isolating material is coated on the non-photosensitive area of ​​the photosensitive core particle 1, the side of the photosensitive core particle 1 and the periphery of the lead.

[0045] In a specific implementation, the first injection mold cavity 4A can be formed between the photosensitive core 1, the package substrate 2, and the mold. The first injection hole 4a1 can be opened on the upper mold 4a as shown in the figure, or can be opened on the side wall of the mold forming the first injection mold cavity 4A as needed (not shown in the figure).

[0046] In order to ensure that the injection of the light-isolating material does not affect the photosensitive area S1, the injection molding aid 4c used to cover the photosensitive area S1 of the photosensitive core particle 1 can maintain a seal with the photosensitive core particle 1. In a possible implementation scheme, the injection molding aid 4c can be integrally formed with the upper mold 4a, or it can be made independently of the upper mold 4a and then assembled on the upper mold 4a. Furthermore, in order to avoid excessive pressure impact when the injection molding aid 4c is pressed against the photosensitive core particle 1, the buffering function can be further increased. For example, but not limited to, the part where the injection molding aid 4c is pressed against the photosensitive core particle 1 can be made of elastic material. This is not limited to the embodiments of the present application.

[0047] S42, pre-curing to form a light-isolating encapsulation layer 32.

[0048] S43, after the light-isolating encapsulation layer 32 is pre-cured, it is transferred into the second mold cavity. The light-isolating encapsulation layer 32, the photosensitive area S1 of the photosensitive core particle 1 and the mold together form the second injection mold cavity 4B of the light-transmitting encapsulation layer; then, the light-transmitting material is injected into the second injection mold cavity 4B through the second injection hole 4b1 by hot injection molding, and the light-transmitting material is coated on the photosensitive area of ​​the photosensitive core particle 1.

[0049] In a specific implementation, the second injection hole 4b1 can be opened on the upper mold 4b as shown in the figure, and can also be opened on the side wall of the mold forming the second injection cavity 4B as needed (not shown in the figure).

[0050] S44 , pre-curing again; and finally performing thermal curing to form the light-transmitting encapsulation layer 31 and the light-isolating encapsulation layer 32 .

[0051] It is understandable that the process shown in FIG. 4 is illustrated by taking a plurality of devices to be packaged as an example, and after the injection molding is completed, they can be cut to form independent packaging bodies.

[0052] Here, the encapsulation layer 3 formed by the light-transmitting encapsulation layer 31 and the light-isolating encapsulation layer 32 is coated on the periphery of the photosensitive core 1 and its bonding wires, and the photosensitive core 1 is encapsulated seamlessly on the encapsulation substrate 2 to form a gapless encapsulation body, and the encapsulation layer 3 is fully fitted with the photosensitive core 1 and the electrical connection structure.

[0053] In other possible implementations, after placing the light-sensing chip 1 on the packaging substrate 2, flip-chip or automated tape bonding methods can be used to electrically connect the chip's pins to the solder balls or pads of the packaging substrate. In other words, the electrical connection structure encapsulated by the light-isolating packaging layer 32 is not limited to the wires formed using the wire bonding process shown in the figure. In specific implementations, this method can be selected based on the overall device design requirements and is not limited in this embodiment.

[0054] To further reduce optical crosstalk, a bandpass filter film can be applied to the transparent encapsulation layer 31. Please refer to Figure 5, which is a side cross-sectional view of another optical packaging device provided in an embodiment of the present application. To clearly illustrate the differences and connections between this embodiment and the embodiments described in Figures 2 and 3, components and structures with the same functions are indicated with the same reference numerals in the figures.

[0055] As shown in Figure 5, the optical packaging device 10 is also a proximity light sensor. A bandpass filter film 4 is applied to the surface of the packaging layer 3 to further isolate the influence of interference light of non-signal wavelengths on the proximity light detector, such as but not limited to the influence of external ambient light. In a specific implementation, the corresponding optical bandpass filter film 4 can be selected based on the wavelength of the emitting light device used; for example, for a 940nm vertical cavity surface emitting laser or light emitting diode, a 940nm bandpass filter film can be selected. No further details will be given here.

[0056] Compared with the implementation method using a glass filter, in this embodiment, the bandpass filter film 4 is directly coated on the surface of the packaging layer 3, which does not increase the overall height of the device and has controllable costs.

[0057] It should be understood that the bandpass filter film 4 can achieve its filtering function simply by covering the transparent encapsulation layer 31. As shown in the figure, the bandpass filter film 4 covers the transparent encapsulation layer 31 and extends over the light-isolating encapsulation layer 32. This provides excellent processability and a consistent appearance.

[0058] In a specific implementation, other structures and molding processes of the optical packaging device 10 may be consistent with those of the aforementioned embodiment, and thus will not be described in detail.

[0059] In order to further improve the sensitivity of the device, the light-transmitting encapsulation layer 31 may adopt a lens structure. To clearly illustrate the differences and connections between this embodiment and the embodiments described in Figures 2 and 3, components and structures with the same functions are indicated in the figures with the same reference numerals.

[0060] As shown in Figure 6 , the optical packaging device 10 is also a proximity light sensor. The light-transmitting packaging layer 31a shown in Figure 6 is a convex lens. This lens-shaped light-transmitting packaging layer 31a better converges the received light onto the surface of the detector 11, increasing the overall amount of light entering and thus improving the sensitivity of the device.

[0061] The aforementioned embodiments describe a single-function photosensitive core 1. In other implementations, the aforementioned structure can also be used to package a photosensitive core with dual detectors. Please refer to Figure 7, which is a side cross-sectional view of another optical package device provided in an embodiment of the present application. To clearly illustrate the differences and connections between this embodiment and the aforementioned embodiments, components and structures with the same functions are indicated with the same reference numerals.

[0062] As shown in Figure 7, the optical packaging device 10 is a proximity light and ambient light sensor. The photosensitive core 1b shown in Figure 7 is integrated with a proximity light detector 111 and an ambient light detector 112, which are spaced apart on the surface of the photosensitive core 1b facing away from the packaging substrate. Similarly, the packaging layer 3 includes a light-transmitting packaging layer 31 and a light-isolating packaging layer 32. The light-transmitting packaging layer 31 covers the photosensitive area S1 of the photosensitive core 1b; the light-isolating packaging layer 32 covers the non-photosensitive area S2 of the photosensitive core 1b, the side of the photosensitive core 1b, and the periphery of the lead 12, effectively isolating the light outside the photosensitive area.

[0063] In a specific implementation, other structures and molding processes of the optical packaging device 10 may be consistent with those of the aforementioned embodiment, and thus will not be described in detail.

[0064] For the photosensitive core 1b, which integrates a first detector (proximity light detector 111) and a second detector (ambient light detector 112), an optical filter film can also be applied over the transparent resin encapsulation layer. Please refer to Figure 8, which is a side cross-sectional view of another optical packaging device provided in an embodiment of the present application. To clearly illustrate the differences and connections between this embodiment and the previous embodiments, components and structures with the same functions are indicated with the same reference numerals.

[0065] As shown in Figure 8, this optical package device 10 also functions as a proximity and ambient light sensor. An antireflection film 5 is applied to the surface of the packaging layer 3 to further reduce reflection losses of the received light at the packaging interface, thereby reducing effective signal attenuation and enhancing the effective optical signal. For example, the refractive index of the transparent packaging resin material is approximately 1.57, resulting in approximately 5% reflection at the interface. The provision of the optical antireflection film 5 can reduce this reflectivity to below 1%.

[0066] In a specific implementation, the antireflection film 5 can be determined according to the overall design requirements of the product, which will not be described in detail here.

[0067] It should be understood that the antireflection film 5 can achieve its light filtering function simply by covering the light-transmitting encapsulation layer 31. As shown in the figure, the antireflection film 5 covers the light-transmitting encapsulation layer 31 and extends over the light-isolating encapsulation layer 32. This has good processability and a consistent appearance.

[0068] In a specific implementation, other structures and molding processes of the optical packaging device 10 may be consistent with those of the aforementioned embodiment, and thus will not be described in detail.

[0069] It is understandable that in other possible implementations, different types of controller integrated circuits can be integrated on the photosensitive chip, such as but not limited to light intensity detectors, color temperature detectors, etc. to meet the needs of different application scenarios.

[0070] The present application also provides an electronic device comprising the optical packaging device described in the preceding embodiments. In a specific implementation, the electronic device may be a portable or mobile device such as a mobile phone, tablet computer, laptop computer, desktop computer, gaming device, in-vehicle electronic device, or wearable smart device. The wearable smart device may include a smartwatch or smart glasses.

[0071] It should be understood that the implementation of other functional components of the electronic device can be achieved using existing technologies, so they will not be described in detail herein.

[0072] The above are only preferred embodiments of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. An optical packaging device, characterized in that: The optical packaging device includes a photosensitive core, a packaging substrate and a packaging layer, the photosensitive core is arranged on the packaging substrate and is electrically connected to the packaging substrate through an electrical connection structure; the surface of the photosensitive core facing away from the packaging substrate has a photosensitive area and a non-photosensitive area, and the detector of the photosensitive core is located in the photosensitive area; the packaging layer includes a light-transmitting packaging layer and a light-isolating packaging layer, the light-transmitting packaging layer is attached to the photosensitive area of the photosensitive core, the light-isolating packaging layer is attached to the non-photosensitive area of the photosensitive core and the side of the photosensitive core, and the electrical connection structure is embedded in the light-isolating packaging layer.

2. The optical packaging device according to claim 1, wherein: The light-transmitting packaging layer is made of transparent epoxy resin or transparent silicone resin, and the light-isolating packaging layer is made of black epoxy resin or black silicone resin.

3. The optical packaging device according to claim 1 or 2, characterized in that: In the longitudinal section of the optical packaging device, the thickness B of the light-isolating packaging layer and the distance L between the boundary position of the photosensitive area and the boundary position of the detector satisfy the following condition: B=L / tanθ, where θ is the optical field angle formed by the detector, and 40°<θ<65°.

4. The optical packaging device according to claim 3, characterized in that: The detector of the light-sensing core particle is a proximity light detector.

5. The optical packaging device according to claim 4, characterized in that: The light-transmitting packaging layer is a convex lens structure.

6. The optical packaging device according to claim 4, characterized in that: It also includes a bandpass filter film, which is at least covered on the surface of the light-transmitting encapsulation layer.

7. The optical packaging device according to claim 3, characterized in that: The detector of the photosensitive core particle includes a first detector and a second detector, and the first detector and the second detector are spaced apart and arranged in the photosensitive area.

8. The optical packaging device according to claim 7, characterized in that: The first detector is a proximity light detector, and the second detector is an ambient light detector.

9. The optical packaging device according to claim 8, characterized in that: It also includes an anti-reflection film, which at least covers the surface of the light-transmitting packaging layer.

10. The optical packaging device according to claim 1 or 2, characterized in that: The light-transmitting encapsulation layer and the light-isolating encapsulation layer are formed by an injection molding process.

11. An electronic device, characterized in that The electronic device includes an optical packaging device, and the optical packaging device is the optical packaging device according to any one of claims 1 to 10.

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