Diamond grinding tool

Abstract

The present invention relates to the field of grinding machining, and to a diamond grinding tool. The diamond grinding tool comprises a plurality of grinding elements and a base body; the plurality of grinding elements are arranged around the base body; a gap between every two adjacent grinding elements is a chip removal water channel; the plurality of grinding elements and the plurality of chip removal water channels form an annular structure; each grinding element consists of a grinding element base body and a working layer; the working layer comprises a binder coating layer and a plurality of diamond particles; the diamond particles are fixedly connected to the grinding element base body by means of the binder coating layer; the diamond particles are arranged in a single layer in the circumferential direction of the working layer. According to the present invention, detached diamond particles can directly fall into the chip removal water channels, and are discharged from the grinding tool under the action of centrifugal force and cooling water without passing through the grinding area, thereby achieving a scratch-free effect on workpieces; instant grinding, instant cooling, and instant discharge of diamond particles can be achieved, chip clogging is eliminated, the grinding effect is good, and the cost is low.

Description

A diamond grinding tool Technical Field

[0001] The present invention relates to the field of grinding, in particular to a diamond grinding tool. Background Art

[0002] In the existing diamond grinding tools, diamond particles are consolidated by a binder. When the grinding tool is working, the diamond particles are higher than the binder, forming a certain exposed height. The existence of this height can realize the chip holding and water carrying functions, thereby ensuring that the grinding tool can perform normal grinding processing on the workpiece.

[0003] During operation, diamond abrasive tools experience increased forces due to wear and tear of the diamond edge corners, and reduced grip on the diamond particles due to wear of the bond. These diamond particles can become lodged, roll, or slip between the tool's bond surface and the workpiece, ultimately detaching from the tool. During this process, the detached diamond particles scratch the workpiece's grinding surface, increasing surface roughness and leading to reduced or even substandard grinding quality. While reducing the diamond particle size can alleviate this issue, it will compromise the tool's sharpness, hindering high-speed, high-precision, and high-efficiency grinding processes and placing higher demands on the grinding equipment. Reducing the bond's hardness or creating denser pores within the bond can also alleviate this problem, but this will compromise the tool's strength, lifespan, and shape retention.

[0004] The thin-flaked tooth spliced ​​cup-shaped grinding wheel used for edge grinding in the prior art adopts powder metallurgy technology and is used for coarse and fine grinding processes. Compared with the integral grinding wheel, it has the characteristics of good cooling and chip removal, high sharpness, long service life and good processing quality. However, the manufacturing process of thin-flaked teeth requires many steps, the mold is complex and expensive, the equipment investment is large, and the energy consumption is high. If thin-flaked teeth with structures are manufactured, due to the interference of the loose density factor and the powder metallurgy process's inhibition of the fluidity of the powder, it is difficult to ensure the sintering density of each part of the thin-flaked tooth is balanced and meets the design standards, resulting in the inability to fully exert the structural function. The strength of the force required by the thin-flaked teeth is constrained by the powder formula, which in turn affects the circumferential thickness of the thin-flaked teeth. It is generally difficult to have less than or equal to one diamond in the circumferential direction at any radial point on each thin-flaked tooth working surface, so the powder chips easily produce diamond pile-like obstructions and form blockages.

[0005] Clogging, particularly in grinding wheels with finer diamond grit, can have difficult-to-overcome negative effects, manifesting as high grinding and frictional heat, which can easily cause burns and chipping on the workpiece surface. Diamond grit requires a high exposed height to accommodate chip storage, removal, and cooling, necessitating a strong binding agent. This can lead to a decrease in self-sharpening properties, limiting the sharpness of the grinding wheel. Manufacturing flake teeth with two or more composite grit sizes in the same radial direction is highly complex and costly. Similar issues exist with flaked, spliced ​​peripheral grinding wheels used for edge grinding. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a diamond grinding tool to solve the above problems.

[0007] The technical solution of the present invention for solving the above-mentioned technical problems is as follows: A diamond grinding tool comprises: a plurality of grinding members and a base, wherein the plurality of grinding members are wound around the base, the gap between two adjacent grinding members is a chip removal water channel, and the plurality of grinding members and the plurality of chip removal water channels form an annular structure; the grinding members are composed of a grinding member base and a working layer, the working layer is composed of a binder coating layer and a plurality of diamond particles, the diamond particles are consolidated on the grinding member base through the binder coating layer, and the diamond particles are arranged in a single layer in the circumferential direction of the working layer.

[0008] The beneficial effects of the present invention are as follows: diamond particles detached from the working layer are facilitated to fall into the chip removal water trough and are discharged from the grinding tool under the action of the centrifugal force generated by the rotation of the grinding tool and the cooling water. By shortening the discharge path of the diamond particles, the process of stagnation, rolling, or sliding of the diamond particles between the surface of the grinding tool binder coating layer and the workpiece is eliminated, thereby achieving a scratch-free or low-scratch effect on the workpiece processing surface, and facilitating the grinding of difficult-to-machine materials with high requirements for the microstructure of the workpiece grinding surface.

[0009] The diamond contained in the working layer of the grinding part is a single layer of diamond particles, the manufacturing cycle is short, the plating area of ​​the grinding part is small, it is suitable for mass production, and the cost is reduced. Compared with the powder metallurgy products in the existing technology, it can save a lot of binder powder, greatly reduce the overall diamond particle concentration of the grinding wheel, and reduce the material cost of diamond particles; the chip removal water troughs arranged between the grinding parts can be used for air and liquid cooling media, realizing a dry and wet dual-use and internal cooling mode.

[0010] On the basis of the above technical solution, the present invention can also be improved as follows.

[0011] Furthermore, in the rotation direction of the grinding tool, the grinding element base is arranged in front of the working layer.

[0012] The beneficial effect of adopting the above further scheme is that it is conducive to ensuring that the diamond particles falling off from the working layer are always lower than the exposure height of the working diamond particles, and when the diamond particles fall off from the working layer, they fall directly into the chip removal trough along the rotation direction of the grinding tool for discharge, thereby increasing the speed at which the diamond particles fall off the working layer and reducing the scratches on the workpiece caused by the falling diamond particles.

[0013] Furthermore, the grinding ends of the plurality of grinding members are wound around the end surface or the peripheral surface of the base.

[0014] The beneficial effect of adopting the above further solution is that it is conducive to achieving end face grinding or peripheral surface grinding of the grinding tool and improving applicability.

[0015] Furthermore, the circumferential surface of the working layer is inclined relative to the radial direction of the base body.

[0016] The beneficial effects of adopting the above further solution are: for peripheral and end face grinding tools, on the one hand, it is beneficial for the detached diamond particles to fall into the chip removal trough along the contour line of the working layer under the action of the centrifugal force generated by the rotation, thereby increasing the speed at which the detached diamond particles escape from the working layer; on the other hand, the larger the angle, the higher the holding force of the binder coating layer on the diamond particles, which is more conducive to improving the service life.

[0017] Furthermore, the annular structure formed by the plurality of grinding elements and the plurality of chip removal water channels is a working ring body, and the plurality of grinding elements in the working ring body are evenly spaced and distributed;

[0018] There are multiple binder coating layers, and the multiple binder coating layers are spaced apart on one side surface of the grinding element substrate. The multiple diamond particles are spaced apart in the multiple binder coating layers. The multiple binder coating layers and the multiple diamond particles therein form multiple working layers, and the area between two adjacent working layers is a non-working layer.

[0019] The thickness h of each binder coating layer, the width B of the working layer, the width δ of the non-working layer, and the particle size b of each diamond particle satisfy the following relationship: 0.5×b≤δ<2×b; b≤h<1.5×b; b≤B<3×b;

[0020] Among them, the thickness of each binder coating layer is h (nm), the width of the working layer is B (cmm), the particle size of each diamond particle is b (nm), and the width of the non-working layer is δ (cmm).

[0021] The beneficial effect of adopting the above further solution is that the thickness of the binder coating layer, the width of the working layer and the width of the non-working layer are designed to improve the holding force of the diamond particles.

[0022] Furthermore, the plurality of grinding members are divided into an inner tooth group and an outer tooth group, the plurality of grinding members in the inner tooth group and the plurality of grinding members in the outer tooth group are evenly spaced in the circumferential direction, and the outer tooth group is located outside the inner tooth group.

[0023] The beneficial effects of adopting the above further solution are: the solution has a simple structure, multiple grinding parts are reasonably distributed, and multi-segment multi-grain size seamless transition grinding processing can be achieved, and the processing is convenient.

[0024] Furthermore, the plurality of grinding members extend respectively along the axial direction of the working ring body, and the end surfaces of one ends thereof are combined to form the end working surface of the working ring body.

[0025] The beneficial effects of adopting the above further solution are: simple structure, reasonable design, using the end surface formed at one end of the multiple grinding members as the end surface working surface to facilitate grinding of the workpiece and convenient processing.

[0026] Furthermore, the plurality of grinding members extend radially along the working ring body, and the end surfaces at one end thereof are combined to form a circumferential working surface of the working ring body.

[0027] The beneficial effects of adopting the above further solution are: simple structure, reasonable design, using the end surface formed at one end of the multiple grinding members as the circumferential working surface to facilitate grinding of workpieces and convenient processing.

[0028] Furthermore, a plurality of the non-working layers are respectively provided with micro grooves at one end corresponding to the working surface of the working ring body.

[0029] The beneficial effects of adopting the above-mentioned further scheme are as follows: the single-layer diamond particle design causes micro-grooves between the diamond particles on the working surface of the grinding part to be automatically formed. The micro-grooves between the particles and the chip removal grooves together construct a functional microstructure that is instantly cooled and discharged during grinding (the diamond particles on the working surface are instantly cooled during grinding, and the powder generated by grinding is instantly discharged), which greatly reduces the heat loss of the diamond and eliminates the powder blockage phenomenon. It is suitable for finer diamond abrasives, has good grinding effect, long life and low cost; at the same time, it realizes a functional structure design of a grinding tool with single diamond particles as the design object, which is conducive to expanding the application of diamond grinding tools in high-speed and high-precision processing.

[0030] Furthermore, the binder coating layers on the plurality of grinding parts are respectively in the form of a planar tooth structure or a wavy tooth structure.

[0031] The beneficial effects of adopting the above further scheme are: the wavy-shaped grinding part is beneficial to increasing the rigidity and strength of the grinding part base, thereby reducing the thickness of the grinding part base, which is beneficial to improving the self-sharpening property of the grinding wheel; increasing the circumferential width of the wavy-shaped electroplated grinding part can reduce the number of grinding parts, simplify the assembly structure and reduce the assembly cost; the shape design of the grinding part is reasonable, which is convenient for grinding workpieces and easy to process.

[0032] Furthermore, the lower ends of the inner sides of the plurality of grinding members are respectively fixedly connected with a fixing portion.

[0033] The beneficial effect of adopting the above further solution is that the solidified portion facilitates the assembly of the grinding element. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] FIG1 is a schematic diagram of the overall structure provided by Embodiment 1 of the present invention;

[0035] FIG2 is a schematic top view of the processing according to the first embodiment of the present invention;

[0036] FIG3 is an enlarged schematic diagram of the J region in the structure shown in FIG2 ;

[0037] FIG4 is a schematic diagram of the overall structure provided by Embodiment 2 of the present invention;

[0038] FIG5 is a side view of the overall structure provided by Example 2 of the present invention;

[0039] FIG6 is an enlarged schematic diagram of region A in the structure shown in FIG5 ;

[0040] FIG7 is a cross-sectional view of the overall structure provided by Example 2 of the present invention;

[0041] FIG8 is a processing diagram provided by Example 2 of the present invention;

[0042] FIG9 is an enlarged schematic diagram of region I in the structure shown in FIG8 ;

[0043] FIG10 is a schematic diagram of the three-dimensional structure of the third embodiment of the present invention;

[0044] FIG11 is an enlarged schematic diagram of area E in FIG10 ;

[0045] FIG12 is a top view of a third embodiment of the present invention;

[0046] FIG13 is a schematic diagram taken along the section line KK in FIG12;

[0047] FIG14 is a schematic diagram of the three-dimensional structure of the fourth embodiment of the present invention;

[0048] FIG15 is an enlarged schematic diagram of the F area in FIG14 ;

[0049] FIG16 is a top view of a fourth embodiment of the present invention;

[0050] FIG17 is a schematic diagram taken along the section line BB in FIG16;

[0051] FIG18 is a perspective view of the grinding member in the third and fourth embodiments of the present invention;

[0052] FIG19 is a front view of the grinding member in the third and fourth embodiments of the present invention;

[0053] FIG20 is a partial cross-sectional view of a grinding member according to Embodiment 3 and Embodiment 4 of the present invention;

[0054] FIG21 is a second partial cross-sectional view of the grinding member in the third and fourth embodiments of the present invention;

[0055] FIG22 is a schematic diagram of the three-dimensional structure of Example 5 of the present invention;

[0056] FIG23 is an enlarged schematic diagram of the G area in FIG22 ;

[0057] FIG24 is a top view of Example 5 of the present invention;

[0058] FIG25 is a schematic diagram taken along section line CC in FIG24;

[0059] FIG26 is a schematic structural diagram of a grinding member in an inner tooth group according to a fifth embodiment of the present invention;

[0060] FIG27 is a schematic structural diagram of a grinding member in an outer tooth group in a fifth embodiment of the present invention;

[0061] FIG28 is a schematic diagram of the overall structure of Example 6 of the present invention;

[0062] FIG29 is a partial structural diagram of Example 6 of the present invention;

[0063] FIG30 is an enlarged schematic diagram of the H region in FIG29;

[0064] FIG31 is a top view of Example 6 of the present invention;

[0065] FIG32 is a schematic diagram of FIG31 cut along the section line DD.

[0066] 2 and 8 indicate the rotation direction of the grinding tool, the straight arrow indicates the movement direction of the workpiece, the rectangle in FIG2 and the rectangular plate-like structure in FIG8 both indicate the workpiece, and the arrow in FIG7 indicates the movement direction of the cooling water; h in FIG20 indicates the thickness of the binder coating layer 121, B indicates the width of the working layer 12, δ indicates the width of the non-working layer 13, and b indicates the particle size of the diamond particles 122.

[0067] In the accompanying drawings, the parts represented by each number are listed as follows: 1. Grinding part; 2. Base; 3. Chip removal groove; 4. End working surface; 5. Circumferential working surface; 6. Micro groove; 7. Consolidation part; 8. Grinding wheel base; 9. Pressure plate; 10. Blade; 11. Grinding part base; 12. Working layer; 13. Non-working layer; 121. Binder coating layer; 122. Diamond particles. DETAILED DESCRIPTION

[0068] The principles and features of the present invention are described below. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0069] As shown in Figures 1 to 32, a diamond grinding tool comprises: a plurality of grinding members 1 and a base 2, wherein the plurality of grinding members 1 are wound around the base 2, the gap between two adjacent grinding members 1 is a chip removal water groove 3, and the plurality of grinding members 1 and the plurality of chip removal water grooves 3 form an annular structure; the grinding member 1 is composed of a grinding member base 11 and a working layer 12, the working layer 12 is composed of a binder coating layer 121 and a plurality of diamond particles 122, the diamond particles 122 are consolidated on the grinding member base 11 through the binder coating layer 121, and the diamond particles 122 are arranged in a single layer in the circumferential direction of the working layer 12.

[0070] It should be noted that, in a preferred embodiment of the present invention, the material of the grinding element base 11 and the material of the binder coating layer 121 may be the same or different. The main purpose of the grinding element base 11 is to ensure that the attached working layer 12 has sufficient rigidity and is easy to consolidate and assemble into a diamond grinding tool.

[0071] Along the rotation direction of the grinding tool, the diamond particles 122 are arranged in a single layer in the circumferential direction of the working layer 12. However, as the diamond particles 122 are continuously ground and consumed or fall off, other diamond particles in the binder coating layer 121 are exposed, thereby forming a single layer of diamond particles in the circumferential direction of the working layer 12 again. When the diamond particles are attached or consolidated in a single layer on the grinding member substrate 11, electroplating or chemical plating processes can be used. Electroplating or chemical plating processes are suitable for the attachment of diamond particles of various particle sizes, especially small particle sizes (such as nanometers), and can further achieve consolidation. The present invention is also suitable for various binders and processing processes such as brazing.

[0072] The binder coating layer 121 can be made of a single material or a composite material to adjust the holding force on the diamond particles, ensuring both normal grinding of the diamond particles and ensuring that the diamond particles do not exceed the exposed height during the shedding process, thereby avoiding scratches on the workpiece. The thickness of the binder coating layer 121 can be selected to be greater than, equal to, or less than the particle size of the diamond particles 122 according to actual processing needs to adjust the holding force of the binder coating layer 121 on the diamond particles 122, thereby ensuring that the height of the diamond particles 122 during the shedding process is lower than the exposed height, and can also be used to adjust the self-sharpening property of the grinding tool, thereby avoiding scratches on the workpiece.

[0073] Along the rotation direction of the grinding tool, the bond coating layer 121 and the diamond particles 122 can be divided into inner and outer layers and consolidated separately. The hardness of the outer bond coating layer 121 can be lower than that of the inner bond coating layer 121. In this way, during the shedding process of the diamond particles 122, the diamond particles 122 are easily plastically deformed under the pressure exerted by the relatively soft outer bond coating layer 121, so that the height of the diamond particles 122 during the shedding process is lower than the exposed height, thereby avoiding scratches on the workpiece.

[0074] The grinding member base 11 can be made of various materials that meet the strength and rigidity requirements, such as steel-based, copper-based, resin, organic engineering materials, etc. Since the hardness of the grinding member base 11 material is lower than the hardness of the diamond particles 122, the wear rate of the grinding member base 11 is higher than the wear rate of the diamond particles during use of the grinding tool, so that the height of the grinding member base 11 is lower than the exposed height of the diamond particles 122, thereby not affecting the grinding process of the diamond particles 122.

[0075] The beneficial effects of the present invention are as follows: diamond particles detached from the working layer are facilitated to fall into the chip removal water trough and are discharged from the grinding tool under the action of the centrifugal force generated by the rotation of the grinding tool and the cooling water. By shortening the discharge path of the diamond particles, the process of stagnation, rolling, or sliding of the diamond particles between the surface of the grinding tool binder coating layer and the workpiece is eliminated, thereby achieving a scratch-free or low-scratch effect on the workpiece processing surface, and facilitating the grinding of difficult-to-machine materials with high requirements for the microstructure of the workpiece grinding surface.

[0076] The diamond contained in the working layer of the grinding part is a single layer of diamond particles, the manufacturing cycle is short, the plating area of ​​the grinding part is small, it is suitable for mass production, and the cost is reduced. Compared with the powder metallurgy products in the existing technology, it can save a lot of binder powder, greatly reduce the overall diamond particle concentration of the grinding wheel, and reduce the material cost of diamond particles; the chip removal water troughs arranged between the grinding parts can be used for air and liquid cooling media, realizing a dry and wet dual-use and internal cooling mode.

[0077] Preferably, as shown in FIG3 and FIG6 , in the rotation direction of the grinding tool, the grinding element base 11 is arranged in front of the working layer 12 .

[0078] The beneficial effects of adopting the above preferred solution are: it is conducive to ensuring that the diamond particles falling off from the working layer are always lower than the exposed height of the working diamond particles, and when the diamond particles fall off from the working layer, they fall directly into the chip removal trough along the rotation direction of the grinding tool for discharge, thereby increasing the speed at which the diamond particles fall off the working layer and reducing the scratches on the workpiece caused by the falling diamond particles.

[0079] Preferably, as shown in FIG. 1 and FIG. 4 , the grinding ends of the plurality of grinding members 1 are wound around the end surface or the peripheral surface of the base 2 .

[0080] It should be noted that, in the technical solution of the present invention, the "grinding end" refers to the end face of the grinding member 1 that contacts the workpiece, that is, the end face involved in grinding.

[0081] The beneficial effects of adopting the above preferred solution are: it is conducive to achieving end face grinding or peripheral surface grinding of the grinding tool and improving applicability.

[0082] Preferably, as shown in FIG. 1 and FIG. 4 , the circumferential surface of the working layer 12 is inclined relative to the radial direction of the base body 2 .

[0083] It should be noted that: in the technical solution of the present invention, the radial inclination angle of the circumferential surface of the working layer 12 relative to the substrate 2 is set based on the principle that it is conducive to the separation of the detached diamond particles from the grinding area (the contact area between the working layer 12 and the workpiece) while satisfying the holding strength of the binder coating layer 121 on the diamond particles.

[0084] The beneficial effects of adopting the above preferred solution are: for peripheral and end face grinding tools, on the one hand, it is conducive to causing the detached diamond particles to fall into the chip removal trough along the contour line of the working layer under the action of the centrifugal force generated by the rotation, thereby increasing the speed at which the detached diamond particles escape from the working layer; on the other hand, the larger the angle, the higher the holding force of the binder coating layer on the diamond particles, which is more conducive to improving the service life.

[0085] Preferably, as shown in FIG10 to FIG32 , the annular structure formed by the plurality of the grinding elements 1 and the plurality of the chip removal water grooves 3 is a working ring body, and the plurality of the grinding elements 1 in the working ring body are evenly spaced;

[0086] There are multiple binder coating layers 121, and the multiple binder coating layers 121 are spaced apart on one side surface of the grinding element substrate 11. The multiple diamond particles 122 are spaced apart in the multiple binder coating layers 121. The multiple binder coating layers 121 and the multiple diamond particles 122 therein respectively form multiple working layers 12, and the area between two adjacent working layers 12 is a non-working layer 13.

[0087] The thickness h of each binder coating layer 121, the width B of the working layer 12, the width δ of the non-working layer 13, and the particle size b of each diamond particle 122 satisfy the following relationship: 0.5×b≤δ<2×b; b≤h<1.5×b; b≤B<3×b;

[0088] Among them, the thickness h of each binder coating layer 121 (unit can reach nm) and the width B of the working layer 12 (unit can reach cm), the particle size b of each diamond particle 122 (unit can reach nm) and the width δ of the non-working layer 13 (unit can reach cm).

[0089] Among them, it should be noted that: in the technical solution of the present invention, the width of the working layer 12 and / or the width of the non-working layer 13 are consistent or inconsistent. This solution can adjust the concentration of the working layer and the orderly arrangement of diamonds by setting the width; the size setting of the working layer 12 and the non-working layer 13 is reasonable, which can achieve better sharpness of the grinding part while also adjusting the wear resistance of different positions to achieve the functions of shape preservation and anti-deformation, and is conducive to chip removal and cooling.

[0090] The beneficial effect of adopting the above preferred solution is that the thickness of the binder coating layer, the width of the working layer and the width of the non-working layer are designed to improve the holding force of the diamond particles.

[0091] Preferably, as shown in Figures 10 to 27, the multiple grinding members 1 are divided into an inner tooth group and an outer tooth group, and the multiple grinding members 1 in the inner tooth group and the multiple grinding members 1 in the outer tooth group are evenly spaced circumferentially, and the outer tooth group is located outside the inner tooth group.

[0092] It should be noted that: in the technical solution of the present invention, the multiple grinding members 1 in the outer tooth group and the multiple grinding members 1 in the inner tooth group can be staggered in sequence or relatively distributed one by one. The latter is preferred. When staggered, the coolant has poor fluidity. The specific solution is designed according to production requirements.

[0093] Based on the above solution, the working ring body can be a single ring structure (see Figures 10 to 13),

[0094] It can be a double ring structure (see Figures 14 to 27), and the formation scheme of the multiple grinding elements 1 in the inner tooth group and the multiple grinding elements 1 in the outer tooth group in the double ring structure is as follows:

[0095] Solution 1: The multiple grinding elements 1 in the working ring body have the same structure and are divided into two groups. The multiple grinding elements 1 in the two groups are staggered in sequence. The outer sides of the multiple grinding elements 1 in one group are partially cut away to form the multiple grinding elements 1 in the inner tooth group, and the inner sides of the multiple grinding elements 1 in the other group are partially cut away to form the multiple grinding elements 1 in the outer tooth group (see Figures 14 to 21).

[0096] Solution 2: The multiple grinding elements 1 in the working ring body are divided into two groups. The structures of the multiple grinding elements 1 in the two groups are different, and the structures of the multiple grinding elements 1 in the same group are consistent. The multiple grinding elements 1 in one group are evenly spaced around the circumference, and the multiple grinding elements 1 in the other group are evenly spaced around the circumference and located outside the grinding elements 1 in one group (see Figures 22 to 27).

[0097] The width of the multiple grinding members 1 in the inner tooth group is greater than, equal to, or smaller than the width of the multiple grinding members 1 in the outer tooth group, which can not only realize multi-segment and multi-grain seamless transition grinding processing of the workpiece, but also save consumables and reduce costs.

[0098] The beneficial effects of adopting the above preferred solution are: the solution has a simple structure, multiple grinding parts are reasonably distributed, and multi-segment multi-granularity seamless transition grinding processing can be achieved, and the processing is convenient.

[0099] Preferably, as shown in FIG. 10 to FIG. 27 , the plurality of grinding members 1 extend respectively along the axial direction of the working ring body, and the end surfaces at one end thereof are combined to form the end working surface 4 of the working ring body.

[0100] The beneficial effects of adopting the above preferred solution are: simple structure, reasonable design, using the end surface formed at one end of the multiple grinding members as the end surface working surface to facilitate grinding the workpiece and convenient processing.

[0101] Preferably, as shown in FIG. 28 to FIG. 32 , the plurality of grinding members 1 extend radially along the working ring body, and the end faces at one end thereof are combined to form the circumferential working surface 5 of the working ring body.

[0102] The beneficial effects of adopting the above preferred solution are: simple structure, reasonable design, using the end surface formed at one end of the multiple grinding members as the circumferential working surface to facilitate grinding the workpiece and convenient processing.

[0103] Preferably, as shown in FIG12 , a plurality of the non-working layers 13 are respectively provided with micro grooves 6 at one end corresponding to the working surface of the working ring body.

[0104] The beneficial effects of adopting the above preferred scheme are: the single-layer diamond particle design causes micro-grooves between the diamond particles on the working surface of the grinding part to be automatically formed. The micro-grooves between the particles and the chip removal water grooves together construct a functional microstructure that is instantly cooled and discharged during grinding (the diamond particles on the working surface are instantly cooled during grinding, and the powder generated by grinding is instantly discharged), which greatly reduces the heat loss of the diamond and eliminates the powder blockage phenomenon. It is suitable for finer diamond abrasive grains, has good grinding effect, long service life and low cost; at the same time, it realizes a functional structure design of a grinding tool based on a single diamond particle, which is conducive to expanding the application of diamond grinding tools in high-speed and high-precision processing.

[0105] Preferably, as shown in FIG18 , FIG19 , FIG26 and FIG27 , the binder coating layers 121 on the plurality of grinding members 1 are respectively in the form of a planar tooth structure or a wavy tooth structure.

[0106] The beneficial effects of adopting the above preferred scheme are: the wavy-shaped grinding piece is beneficial to increasing the rigidity and strength of the grinding piece base, thereby reducing the thickness of the grinding piece base, which is beneficial to improving the self-sharpening property of the grinding wheel; increasing the circumferential width of the wavy-shaped electroplated grinding piece can reduce the number of grinding pieces, simplify the assembly structure and reduce the assembly cost; the shape design of the grinding piece is reasonable, which is convenient for grinding workpieces and easy to process.

[0107] Preferably, as shown in FIG18 and FIG19 , the lower ends of the inner sides of the plurality of grinding members 1 are respectively fixedly connected with a fixing portion 7 .

[0108] The beneficial effect of adopting the above preferred solution is that the solidified portion facilitates the assembly of the grinding element.

[0109] As shown in Figures 28 to 32, the present invention also provides a composite grinding wheel, including a grinding wheel base 8 and a pressure plate 9, and also includes a working ring body as described above, wherein the working ring body is installed on one side of the grinding wheel base 8, and the pressure plate 9 is located on the side of the working ring body away from the grinding wheel base 8 and presses the working ring body tightly.

[0110] The pressure plate 9 is preferably a circular plate structure, and a plurality of blades 10 are fixedly installed on its circumference at uniform intervals along its circumference. The plurality of blades 10 rotates with the grinding wheel, which can help the cooling medium to flow through the chip removal water groove 3 to the grinding area (i.e., the area where the grinding wheel and the workpiece are in contact), thereby realizing an internal cooling mode; at the same time, the arrangement of the blades 10 is conducive to improving the fluidity of the cooling medium, increasing the flow rate of the cooling medium through the chip removal water groove 3, and improving the cooling effect; in addition, the grinding wheel base 8, the pressure plate 9 and the positioning parts are all stamping parts or precision die-casting parts, among which the plurality of blades 10 on the pressure plate 9 are completed by stamping or die-casting, with low manufacturing cost, high precision and good interchangeability.

[0111] The present invention provides a composite grinding wheel, in which the diamond particles have good working environment conditions, a functional microstructure of grinding, cooling and discharging immediately, eliminating the phenomenon of powder chip clogging, being suitable for finer diamond abrasive particles, having good grinding effect, long service life and low cost.

[0112] The present invention can be suitable for dry grinding of heat-sensitive workpieces that are difficult to implement liquid cooling conditions under certain conditions, that is, using a copper or copper alloy substrate with high thermal conductivity, and electroplated copper, or a multi-layer composite of electroplated copper and electroplated nickel (using a grinding workpiece substrate with high thermal conductivity and a binder plating layer is conducive to the heat dissipation of grinding heat).

[0113] In addition, the present invention is also applicable to dry grinding of non-metallic brittle and hard materials that are not suitable for liquid cooling, such as ceramics and graphite (dry grinding can eliminate the water circulation system and drying equipment, reducing processing costs).

[0114] The present invention has the following beneficial effects:

[0115] Compared with powder metallurgy products, material costs are greatly reduced;

[0116] The equipment required for the production of electroplated abrasive parts is simple, the area of ​​electroplated abrasive parts is small, suitable for large-scale electroplating production, and requires less fixed asset investment;

[0117] The structure of the present invention eliminates the phenomenon of powder blockage;

[0118] The micro-grooves can achieve large-scale mechanical crushing with low processing load;

[0119] Toothed grinding wheel working ring realizes intermittent grinding and high sharpness;

[0120] The diamond particles have good working environment conditions and have a functional microstructure that can be ground, cooled and discharged immediately;

[0121] The setting of the blades is conducive to improving the fluidity of the cooling medium, increasing the flow of the cooling medium through the chip removal water channel, realizing the internal cooling mode, improving the cooling effect, and also facilitating rapid chip removal;

[0122] Most components of the grinding wheel are processed by stamping or die-casting, which is simple to manufacture, high precision, good interchangeability and low cost;

[0123] Grinding wheel assembly is suitable for automated production lines to achieve low-cost large-scale production of grinding wheels;

[0124] The workpiece processing quality is stable, and it is also suitable for brazing process, chemical plating process of gear pieces, and also suitable for dry grinding of water-sensitive materials (such as graphite, ceramics, etc.);

[0125] The composite grinding wheel can effectively reduce the number of grinding wheels in multi-head continuous grinding equipment, saving energy and reducing consumption.

[0126] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0127] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0128] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0129] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0130] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0131] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A diamond grinding tool, characterized in that: include: A plurality of grinding elements (1) and a base (2), wherein the plurality of grinding elements (1) are wound around the base (2), a gap between two adjacent grinding elements (1) is a chip removal water channel (3), and the plurality of grinding elements (1) and the plurality of chip removal water channels (3) form an annular structure; The grinding piece (1) is composed of a grinding piece base (11) and a working layer (12); the working layer (12) is composed of a binder coating layer (121) and a plurality of diamond particles (122); the diamond particles (122) are fixed to the grinding piece base (11) through the binder coating layer (121); and the diamond particles (122) are arranged in a single layer in the circumferential direction of the working layer (12).

2. A diamond grinding tool according to claim 1, characterized in that: In the rotation direction of the grinding tool, the grinding element base body (11) is arranged in front of the working layer (12).

3. A diamond grinding tool according to claim 1, characterized in that: The grinding ends of the plurality of grinding pieces (1) are wound around the end surface or the peripheral surface of the base (2).

4. A diamond grinding tool according to claim 1, characterized in that: The circumferential surface of the working layer (12) is arranged to be inclined relative to the radial direction of the base body (2).

5. The diamond grinding tool according to claim 1, characterized in that: The annular structure formed by the plurality of grinding elements (1) and the plurality of chip removal water channels (3) is a working ring body, and the plurality of grinding elements (1) in the working ring body are evenly spaced and distributed; There are a plurality of the binder coating layers (121), the plurality of the binder coating layers (121) are arranged at intervals on one side surface of the grinding piece base (11), the plurality of the diamond particles (122) are arranged at intervals in the plurality of the binder coating layers (121), the plurality of the binder coating layers (121) and the plurality of the diamond particles (122) therein respectively form a plurality of the working layers (12), and the area between two adjacent working layers (12) is a non-working layer (13); The thickness h of each binder coating layer (121), the width B of the working layer (12), the width δ of the non-working layer (13), and the particle size b of each diamond particle (122) satisfy the following relationship: 0.5×b≤δ<2×b; b≤h<1.5×b; b≤B<3×b; The thickness of each binder coating layer (121) is h (nm), the width of the working layer (12) is B (cmm), the particle size of each diamond particle (122) is b (nm), and the width of the non-working layer (13) is δ (cmm).

6. A diamond grinding tool according to claim 5, characterized in that: The plurality of grinding members (1) are divided into an inner tooth group and an outer tooth group. The plurality of grinding members (1) in the inner tooth group and the plurality of grinding members (1) in the outer tooth group are evenly spaced in the circumferential direction. The outer tooth group is located outside the inner tooth group.

7. The diamond grinding tool according to claim 5, characterized in that: The plurality of grinding members (1) extend respectively along the axial direction of the working ring body, and the end faces of one end thereof are combined to form an end face working surface (4) of the working ring body.

8. The diamond grinding tool according to claim 5, characterized in that: The plurality of grinding elements (1) extend radially along the working ring body, and the end surfaces at one end thereof are combined to form a circumferential working surface (5) of the working ring body.

9. A diamond grinding tool according to claim 7 or 8, characterized in that: A plurality of the non-working layers (13) are respectively provided with microgrooves (6) at one end corresponding to the working surface of the working ring body.

10. The diamond grinding tool according to any one of claims 5 to 8, characterized in that: The bonding agent coating layers (121) on the plurality of grinding parts (1) are respectively in the form of a planar tooth plate structure or a wavy tooth plate structure.

11. The diamond grinding tool according to any one of claims 5 to 8, characterized in that: The lower ends of the inner sides of the plurality of grinding pieces (1) are respectively fixedly connected with a fixing portion (7).

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