Additive manufacturing method, method for designing a component, and component

Abstract

The present application relates to an additive manufacturing method in which a first material and a second material different therefrom are used to produce a component.

Description

[0001] Additive manufacturing process, process for designing a component and component

[0002] The current application generally concerns additive manufacturing processes and components manufactured thereby, which can, among other things, be designed holistically and / or manufactured using multi-material approaches.

[0003] In traditional manufacturing, and especially in ceramics manufacturing, prefabricated components are combined in a modular system. For example, prefabricated electronic components are assembled or connected to one another, such as via circuit boards or other connecting elements. The individually prefabricated electronic components assembled in such a modular system do not fulfill any structural functions. Rather, they often need to be protected from external influences by additional structural functions.However, existing construction methods do not allow components to be designed holistically or to use multiple materials in an additive manufacturing process in a common process step or to have individual parts of the component fulfil multiple functions, such as electrical functions and structural functions, simultaneously.

[0004] Some of the above-mentioned problems are at least partially overcome by the methods provided by the invention and by the components disclosed herein.

[0005] According to a first embodiment, an additive

[0006] A manufacturing method is provided in which a first material and a second material different from the first material are used to produce a component. In the manufacturing method, a first material and a second material different from the first material can be introduced into a component to be manufactured at the same time or in a different location.

[0007] Accordingly, additional materials, such as a third or fourth material, can also be introduced.

[0008] Unlike previous laminating processes, in which, for example, films were stacked along a stacking direction and the external shape was determined by the resulting stacking of materials, an additive manufacturing process when processing two different materials makes it possible to choose the shape not according to the specifications of the process, but based on the functionality and tasks of the component to be produced. Unlike previous laminating processes, there is no need for individually adapted shaping tools for the respective designs, punches and cutters for creating holes and separating the components, nor for other shaping processes on either a green component or the sintered component. Such or similar shaping processes can typically include complex or material-wasting subtractive process steps.In contrast to previous laminating processes, additional and separate process steps that are typically required here, such as (screen) printing processes for applying electrode materials and (hot) pressing of the laminated stacks to produce a green component, can be dispensed with.

[0009] According to one embodiment of the method, a functional or structural unit of a component can be formed using a first material or a second material. For example, a first functional unit can be formed using the first material, which unit introduces a functionality into a finished component. Likewise, the unit formed using the first material can also have a structural function as an alternative or in addition to the functionality. The same applies to the second material or to a functional or structural unit formed using the second material. Further materials can be introduced into a functional or structural unit. The respective above-mentioned first or second material, however, introduces at least some of the functional or structural properties into the unit formed in this way.

[0010] According to one embodiment of the method, the component is formed from layers applied successively to one another. In general, this can be referred to as increments. In this embodiment, both the first material and the second material are introduced into at least one layer. The first material and the second material can also be introduced into several layers. Regions of the layers can form parts of the above-mentioned functional or structural units. By successively stacking layers, in at least some of which the first material and the second material are introduced, a first functional or structural unit and a second functional or structural unit can be formed.

[0011] According to one embodiment of the method, which can particularly preferably be a modification of the previously mentioned embodiment, a functionality of the first functional or structural unit is achieved from the interaction of the material properties of the first material and its three-dimensional shape across layers. In particular, the additive manufacturing process can be used to fill a three-dimensional grid layer by layer. For example, a three-dimensional grid can correspond to a three-dimensional planning grid of a component to be manufactured, created in a planning step, and a planned three-dimensional shape of the component can be physically formed by filling the three-dimensional planning grid layer by layer. The first material can be arranged as desired within a layer.By stacking these complex layers, a functional or structural unit can be formed in three dimensions within the component. "Within the component" can refer to any volume within the component's outer dimensions.

[0012] According to a preferred embodiment of the additive manufacturing process, the component can be manufactured in one piece. The component can be manufactured free of internal joints. Thus, with the classic modular approach, according to the prior art, it is necessary to have components connected to one another. In the additive manufacturing process according to the invention, it is possible to produce one-piece components in which, for example, different materials, such as the first material and the second material, are applied or introduced together and these are connected to one another without joints, for example by a common debinding, decarburization and / or sintering process.

[0013] For example, "joint-free" can mean the deliberate absence of most or preferably all conceivable joints within the component. Consequently, a component can be obtained within a layer, but also across adjacent layers, in which there are no perceptible joints, even though such joints would have been conceivable or expected in a classic structure or classic manufacturing process using identical or similarly selected materials. In this way, each increment of a first material introduced during the manufacturing process within the component can be maintained joint-free relative to a subsequent further increment of a first material in the final component.Likewise, an increment of a first material introduced within the component during the manufacturing process can be maintained in a joint-free manner relative to a subsequent increment of a second material introduced during the manufacturing process in the final component. Likewise, any increment of any first or second material can be formed in a joint-free manner relative to an adjacent increment of any first or second material in the final component.

[0014] This applies accordingly to any combination of first and second materials. Additional materials, such as third or fourth materials, or any technically reasonable number of materials, may also be included. The above description applies accordingly to these. The above statement regarding layers applies accordingly to the increments.

[0015] According to one embodiment of the method, the first material contains a ceramic material or is a ceramic material. Accordingly, the second material can also contain a different ceramic material. The first material and / or the second material can each also be a different material, such as a material that can be completely removed by heat treatment, such as decarburization. Alternatively, the first and / or the second material can also be an electrical material, such as a material that forms metal structures, such as a metal paste that can be applied by additive manufacturing.

[0016] The ceramic materials or the electrical materials are preferably used as a suspension. For this purpose, the materials are used in the process, for example, together with a polymer-forming component. For this purpose, the first or second material preferably contains a polymerization initiator. The polymerization initiator can be, for example, a photoinitiator. Alternatively, the polymerization can also be initiated using other means, e.g. thermally, catalytically, anionically, cationically, or radically. In addition, fillers, solvents, thinners, thickeners, dyes, absorbers, and agents for kinetic reaction control, such as promoters, inhibitors, or carriers, can also be contained in the suspension.

[0017] Additionally, ceramic or glass additives, such as copper oxide or lead glasses, may be present, particularly in metal suspensions. These enable improved bonding of a metal layer to a ceramic layer. Such materials can also be incorporated as an intermediate layer between a functional or structural ceramic and a metal layer.

[0018] Furthermore, sintering aids can be included in the suspension, particularly for ceramics. These can help prevent component disintegration in materials that are debindered at a comparatively low temperature compared to the sintering temperature. For example, with aluminum oxides, complete debinding is achieved at 550 °C. However, sintering is carried out at approximately 1700 °C. In this case, yttrium oxide, for example, can be added as a sintering aid.

[0019] In an additive manufacturing process, one or more layers of the respective material can be applied using the suspension. During or shortly after application, the polymer-forming component can be polymerized, thus building up and / or stabilizing a ceramic component that is still green. The ceramic component, also called a green compact, can then be sintered using any process, such as a conventional sintering process. Any organic components can be removed from the component to be formed beforehand, for example by debinding and / or decarburization.

[0020] Through the targeted selection of the composition of the suspension, the process parameters of the polymerization in an additive manufacturing process and / or the process parameters of the sintering process, the tightness of the component to be formed can be specifically adjusted. "Tightness" can mean the absence of voids within a defined, macroscopic volume increment within the component or the absence of porosities or cavities within a defined, macroscopic surface increment at a

[0021] component surface . In this way, a nearly or preferably completely dense component can be obtained . This can mean, for example, that less than 1% or preferably less than 0.1% or particularly preferably less than 0.01% of any macroscopic area or volume increment is a hollow space, a pore or a cavity . Alternatively, a lower level of density can be deliberately set and thus a component with a certain porosity can be obtained . For example, more than 1% of any macroscopic area or volume increment can be taken up by one or more hollow spaces, one or more pores or one or more cavities .

[0022] Depending on the desired functionality, all possible electroceramic materials can be considered. For example, piezoelectric materials can be used in both lead-free and lead-containing form. For example, barium titanate-based or calcium zirconate-based ceramic materials can be used as ferroelectric or piezoelectric materials. Dielectric materials can also be used. PTC or NTC materials can also be used. Ferrite materials can also be introduced in this way. HTCC or LTCC materials of all kinds can also be introduced accordingly as electroceramic materials. The aforementioned materials can in particular be used to form a functional unit in a component. The aforementioned materials can also be used to form a structural unit in a component.In particular, a unit formed with the aforementioned materials can form both functional and structural properties in a component. In addition, or in addition, structural materials can be used, which can, for example, form structural units. Structural materials can be selected, for example, from HTCC ceramics, LTCC ceramics, aluminum oxide, aluminum suboxide (Al0). x ), silicon carbide, silicon nitride, boron nitride, cordierite, magnesium oxide, hard metals, glass-ceramic-based materials, zirconium oxide-based materials, aluminum nitride-based materials, or the like. In the general case of the invention, these materials can be combined as desired, both within a first or second material and by using a first material alongside a second material. In this way, electroceramic components with optimal properties for the overall system can be formed.

[0023] In an additive manufacturing process, one or more layers of the respective materials can be applied relative to one another. However, it is also possible to produce layers that are completely or at least partially not directly bonded to a material of a previous layer. This makes it possible in particular to produce components that have, for example, overhangs, cavities, hollow spaces, bevels, curves and other physical shapes that are atypical for classic electro-ceramic components or inaccessible without complex additional process steps. Furthermore, connecting pieces, threaded pieces, locking pieces or similar additional connectors can also be formed in this way. All of this can contribute to optimising the overall system to be constructed in this way. Such ceramic materials can be used with any suitable additive manufacturing process.3D printing processes such as DLP-based processes are generally preferred. The latter, in particular, are very well suited for multi-material printing and the targeted, even geometric, finely structured arrangement of individual components, both within a single production layer and along a layer direction or height direction during the construction and / or stabilization of a green compact of a component or part. This also applies when green compacts of a component or parts are manufactured with thin walls or a high aspect ratio or a large number of cavities or smooth surfaces.

[0024] Alternatively, filament-based, extrusion-based, inkjet-based or screen-printing-based additive manufacturing processes can be used. Furthermore, DIW-based additive manufacturing processes can also be used, in which a polymer-containing suspension is applied from one or more nozzles and hardened by the action of radiation (IR, VIS, UV, X-ray, gamma radiation, electron beams) or a change in temperature, solubility, atmosphere or similar in the production room, and in this way a green compact of a component or a component is formed or stabilized. DIW-based additive manufacturing processes in particular are particularly well suited to additively applying several different materials next to one another in parallel in a single layer plane.

[0025] According to a further embodiment, it is possible to incorporate increments that have been manufactured elsewhere, at least in part, into an additive manufacturing process. Such an increment can be manufactured separately, i.e., for example, prefabricated. Such an increment can be incorporated as a prefabricated part into the resulting green compact of a component or the component during the additive manufacturing process, whereby said increment is not additively applied or built up by the additive manufacturing process itself. For example, a part of a sensor, e.g., an NTC sensor, can be incorporated into the additive manufacturing process as a separately preformed increment, e.g., as a preformed disc. This makes it possible to further optimize the production of a green compact or component through at least partial integration of increments that can be obtained independently and separately from the additive manufacturing process.Such an introduced, separately preformed, increment can be integrated into the finished green body or component in such a way that it is indistinguishable from a similar or identical increment that would have been built up by the additive 3D printing process itself.

[0026] In principle, any materials that have the appropriate properties, particularly conductivity, can be used as electrical materials. These are essentially metals that are introduced into the process as materials that form the metal structure or are introduced into the component as such to build it up. Other inorganic materials or carbon-based materials can also be used. Examples of metals that can be used include aluminum, copper, gold, platinum, palladium, nickel, silver, tungsten, tantalum, or alloys of these, such as AgPd. For example, graphite, graphene, or other conductive carbon derivatives can be used as inorganic or carbon-based materials. The selection of these depends fundamentally on the purpose to be achieved.

[0027] According to a preferred embodiment of the manufacturing process, this is a 3D printing process. In particular, 3D printing processes have the advantage that they can be used to produce free-form components that are not subject to the structure or shape conventions, particularly of ceramic manufacturing. For example, in a 3D printing process, a first material can be applied from a first nozzle and a second material from a second nozzle. Alternatively, the first material and the second material can also be applied through one nozzle. This can be the case, for example, in a filament-based additive process such as an inkjet or DIW process. According to one embodiment, for example, first and second materials can be applied from different dispensers to a movable surface, e.g. a transport film. By suitable treatment of the materials on the movable surface, e.g.Through targeted irradiation with light, first and second materials can be arranged on a build platform, thus creating a component. This can be the case, for example, in a DLP process.

[0028] According to one embodiment of the invention, the second material can be a material that can be removed by heat treatment. In this case, a second volume region of the component can be formed from this. In this case, the first material can contain a material that is resistant to the heat treatment, such as a ceramic material. A first volume region can then be formed from this, which at least partially encloses the second volume region. The heat treatment can, for example, be a decarburization process step. The first material does not have to consist entirely of material that is resistant to the heat treatment. In particular, it can be the above-mentioned organic components, such as a polymer-forming component or the polymer formed from the polymer-forming component. This can also be removed from the first volume region during the heat treatment.The first volume region preferably contains so much material that is resistant to the heat treatment that no macroscopic cavities are created. The second volume region preferably has a size that is significantly larger than a pore in the ceramic material that is created by decarburization of the green ceramic material. For example, a material that can be largely or completely removed by heat treatment or decarburization can be a starch powder that can be introduced into a component by the additive manufacturing process or a 3D printing process. A second volume region filled with this material can support or stabilize other volume regions arranged around it, such as the first volume region in the green state.

[0029] In particular, according to one embodiment, the heat treatment or a decarburization step can then be carried out. The material that can be removed by decarburization can be largely or completely expelled from the body being formed. In this way, cavities or recesses that are completely or partially enclosed by the first volume region can be pre-formed by the second material that can be removed by heat treatment. Volume regions that have a material that is resistant to the heat treatment can largely retain their structure. To solidify these structures, in the case of a ceramic material, they can be sintered in a further process step, for example, to obtain a component with cavities or recesses. Alternatively, the shapes described above can be formed. Support structures can also be formed, for example for overhanging regions.

[0030] Alternatively or additionally, such an approach to cavity formation can also be used to adjust porosity. Thus, catalytically active materials can be adsorbed in appropriately porous ceramics. For many catalytic materials, a suitably porous or rough surface can promote adsorption. Dyes, photosensitizers, reagents, indicators, or sensor materials can also be adsorbed accordingly.

[0031] Using the approach outlined above, even very fine capillaries or channels can be formed that are otherwise difficult to access. Capillary diameters can, for example, be between 150 pm and 1500 pm, and preferably between 300 pm and 700 pm. For example, heating tubes can have diameters of 0.5 to 15 mm, or preferably 1 to 9 mm. The diameters outlined above are readily accessible using additive manufacturing technology.

[0032] The formation of gyroid structures or other similarly complex structural elements is also possible.

[0033] Measures can be taken to mechanically stabilize and / or strengthen an additively manufactured component. This can improve mechanical properties. To achieve this, for example: during the planning process, the structure can be designed to be "oversized" in certain places in order to at least partially compensate for shrinkage during the thermal processes at particularly mechanically critical points. In other words, the material thickness of the printed material can be chosen to be greater or stronger in one area than would be necessary for the stability of the section in the finished component. This means that this area can be sufficiently mechanically stabilized before a sintering step. Alternatively or additionally, the printed component can be subjected to "post-curing", i.e. additional post-hardening. For this purpose, for example:the polymer contain additional crosslinkers that slowly harden over time after the component has been printed. It can additionally or alternatively also contain additional thermal initiators that also polymerize any residual monomers still present after printing by heating the component. Additionally or alternatively, targeted intensive irradiation can be carried out after printing in order to polymerize residual monomers. The latter "post-curing" methods each assume that an initial curing has already taken place during additive manufacturing. This can, for example, be an initial or main polymerization or an initial or main crosslinking that takes place during production. Alternatively or additionally, the printed component can also be subjected to mechanical pressing before a decarburization and / or sintering step. It can, for example,isostatic (hot) pressing can be carried out. The previously described solidification variants or their examples can also be combined. According to a further embodiment, an external coating can be realized during the production of a component or green body. This can be realized separately from the additive manufacturing process, in a step connected to the additive manufacturing process, or as part of the additive manufacturing process. This can be, for example, a glass coating or glazing, which can be similar to an enamel layer.

[0034] According to a further embodiment, the additive manufacturing process can be combined with conventional manufacturing methods. For example, additive manufacturing techniques or subtractive manufacturing techniques can be used after additive manufacturing. These can be applied to a green component or to the finished or sintered component. Examples of additive manufacturing techniques include electroplating, sputtering, bonding, soldering, welding, or similar. Examples of subtractive manufacturing techniques include drilling, lapping, cutting, milling, etching, polishing, punching, cutting, or similar.

[0035] According to a further embodiment, a method for the holistic design of a component is also provided. Here, the component is designed in an arrangement of its components or units according to their function or the intended application of the component. This differs from the modular system of the aforementioned prior art. According to this method or this design method, modular-specific limitations inherent in the prior art can be overcome. In a metaphor, the method according to the invention can be described as "functional modeling clay," in which the shape of a functional unit can be designed with regard to the intended function within an application.

[0036] Components designed in this way overcome disadvantages of the prior art which are expressed in the fact that there are additional joining steps, the components are not functionally optimized, the components are not spatially optimized, the components are not design-optimized, and the components sometimes have problems with the choice of materials which are not optimal for the desired purpose because these are fixed "according to a catalog" or "according to a kit". On the basis of the inventive approach such problems can be considered in an initial design phase and taken into account in production in such a way that in the end an overall system can be obtained which is optimal for the specific purpose. Although in some cases this can have the same functionalities as a conventionally manufactured component, components designed in this way inventively have advantages.A component designed according to the invention can be more compact, it can be more highly integrated, it can be made with a more targeted selection of materials, it can be optimized for specific application purposes, etc. By means of the method, several usually separate functionalities can be combined into a complete compact component.

[0037] The design aspect can be supported by appropriate planning software. Artificial intelligence, algorithms, or similar methods can also be used.

[0038] The process for the holistic design of a component can comprise an additive manufacturing process as described above. In particular, a corresponding process for holistic design can be implemented using an additive manufacturing process or a 3D printing process. Alternatively or additionally, the design process can also take into account aspects of the additive manufacturing process to be selected, such as production speed, production costs, parallelizability, installation space capacity, etc. The design process can also take into account aspects of the materials to be selected, such as mechanical properties, electrical properties, optical properties, etc.During the planning phase, the design process can also take into account aspects of the thermal processes to be selected, such as temperatures, durations, atmospheres, component shrinkage in different spatial directions, component compaction, surface influences, etc. during the debinding, decarburization or sintering process. During the planning phase, the design process can also take into account aspects of any subsequent processing of a green compact or of a finished or sintered component. In other words, the process for the holistic design of a component can take into account all conceivable aspects, influencing factors and process steps in such a way that an overall system which is optimized with regard to several or preferably all aspects can be constructed and manufactured using a manufacturing process which is optimized in several or preferably all aspects.

[0039] According to one embodiment of the method for the holistic design of a component, the component can have a first unit and a second unit, wherein the first unit and the second unit can each contribute functionally and / or structurally to the function or structure of the component. For example, the first unit can be a functional unit and the second unit a structural unit. Likewise, both the first and the second unit can be a structural unit. The first unit and the second unit can each be a functional unit, i.e. contribute functionally to the functionality of the component. The positioning of the first unit and the second unit is chosen mainly or exclusively with a view to application specifications.

[0040] In particular, the targeted combination and arrangement of different materials can interact to form a functional unit.

[0041] According to one embodiment, the first unit may be made of the first material and the second unit may be made of the second material.

[0042] According to one embodiment, third, fourth and further units may be made of third, fourth and further materials.

[0043] According to a further embodiment of the method for the holistic design of a component, a connecting means between two units in a component can have the geometrically shortest possible section. In particular, a connecting means can be a cable or generally a line. All units and the connecting means can be additively manufactured or, for example, 3D printed. Because the first unit can be arranged next to or around the second unit in this way, an electrical connection between them can be reduced to the shortest necessary length for the final function of the

[0044] component is necessary. This way, unnecessary cable runs can be avoided.

[0045] Alternatively or additionally, cable runs can also be routed within the component for optimal performance. For example, ESR or ESL can be optimized. For example, electromagnetic compatibility (EMC) or electromagnetic resistance (EMV) can also be optimized during the design of the cable runs.

[0046] Alternatively or additionally, thermal conduction sections or paths can also be implemented. These can also be taken into account during the design phase. This allows targeted paths to be designed for the conduction of incoming or waste heat. In many cases, electrical lines can act as thermal conduction paths. For example, the targeted design of electrical lines can also optimize the thermal conduction paths. This makes it easier to achieve targeted heating or cooling of a component or a volume area.

[0047] Alternatively or additionally, specific functions such as shielding, cooling channels, heat sinks and radiating surfaces can be designed or built into the process in an application-efficient manner.

[0048] According to a further embodiment of the method for the holistic design of a component, the second unit can be arranged around the first unit in such a way that passive spaces that do not serve a function or are necessary for the production of the structural component specifications are reduced or avoided. For example, using a manufacturing process such as the classic lamination of ceramic layers, only a first component and a second component can be manufactured separately from one another, which are then assembled. This creates functionally dead spaces, which can, however, be avoided by means of the invention.

[0049] Component units or their functions can also be designed in such a way that subtractive processes can be partially or, preferably, completely avoided. This way, unnecessary material loss can be reduced or avoided.

[0050] According to a further embodiment of the method for the holistic design of a component, the first unit and / or the second unit is / or is not designed as a separately prefabricated component which is designed for a modular system, but is selected within the method in terms of shape and arrangement mainly or exclusively according to functional aspects. This can be designed relative to other functional and / or structural elements in its dimensions or in the arrangement within the component. In other words, the shape of one of the units can be chosen completely freely and does not have to have a flat shape or a shape that is formed from flat components, as is the case, for example, in a classic ceramic manufacturing process, but can have any shape within the accuracy of the additive manufacturing process.In particular, the shapes of the first unit and the second unit can be interlocked as described above. According to a further embodiment of the method for the holistic design of a component, the first unit and / or the second unit can be formed with or from 3D-printed ceramics. The above statements regarding ceramics and / or 3D-printed ceramics apply here.

[0051] According to a further embodiment of the method for the holistic design of a component, a partial area of ​​the component or the first unit can be designed such that it defines a first plane. Another partial area or the second unit can define a second plane which is arranged at a tilt to the first plane. In particular, a flat area can be formed by the first unit. The second unit can have a different shape which also has an area with a flat shape. These surfaces can be tilted to one another. Tilted can mean that the planes are at least not oriented parallel to one another. The planes are preferably also not arranged perpendicular to one another. With conventional ceramic manufacturing techniques, only parallel or perpendicular planes can generally be achieved.In conventional manufacturing, for example, inclined planes or planes tilted relative to the stacking direction require a material removal step. This removal step can be avoided with the preferred embodiment described above.

[0052] Below, various components are presented which, in and of themselves, exhibit advantageous aspects. These components can, in particular, be 3D-printed or additively manufactured components and can, in particular, be manufactured using the aforementioned processes or design methods. They can exhibit the aforementioned properties and advantages. However, they also serve as advantageous embodiments in their own right.

[0053] According to a first preferred embodiment, a component for microfluidics, i.e. a type of

[0054] A microfluidic component is provided. This has an inlet suitable for supplying a fluid to a functional unit. The functional unit is directly or indirectly adjacent to the inlet. Furthermore, an outlet suitable for carrying the fluid away from the functional unit is directly or indirectly adjacent to the functional unit. The fluid can be a liquid or a gas. For example, the fluid can be an aqueous solution or another solution.

[0055] More than one inlet or more than one outlet may also be formed. In particular, a second inlet may be formed if the component is designed to supply two reactants separately to the functional unit.

[0056] The structures of the microfluidic component—i.e., the inflow, functional unit, and outflow—can be spaces or volume regions within a ceramic body. The microfluidic component can be constructed using one or more ceramics, for example, using additive manufacturing or 3D printing. In particular, cavities can be formed using a material that can be removed by heat treatment, as described above.

[0057] A microfluidic component can, for example, comprise a ceramic with or made of the following materials: silicon dioxide, barium carbonate, and / or aluminum oxide. Additives such as boric acid, calcium carbonate, and / or chromium (III) oxide can be incorporated. Electrically conductive elements can be formed using metals such as copper. The ceramic and metallic conductive elements can be additively manufactured using a material that can be removed by heat treatment. This material can be removed by decarburization. Light-curing acrylate resin mixtures, for example, can be used as such a material that can be removed by heat treatment.

[0058] In general, the aforementioned materials or similar, or even AlN-based or aluminum oxide-based ceramic materials can be used to form a structural element. These can be combined with electrochemically reactive materials such as copper and / or with functional ceramics, such as NTC or others, to form a functionality, such as electrochemical functionality or porosity or other properties mentioned above or below. The chemically inert properties of ceramics can also introduce corresponding functionalities into microfluidic components.

[0059] The functional unit can incorporate one or more functionalities, depending on how the microfluidic component is used. Examples of these are listed below.

[0060] According to a preferred embodiment of the component for microfluidics, the inflow and / or outflow can have a rounded or rounded cross-section. Such a cross-section is preferably formed perpendicular to the intended flow direction of the fluid. These rounded or rounded shapes can promote laminar flow. A round or rounded cross-section can, for example, be an oval or circular cross-section. It is advantageous in this case to use additive manufacturing techniques or 3D printing because, unlike conventional manufacturing techniques, these easily enable round cavities to be formed in a ceramic body. The ceramic body can be completely enclosed by the material except for a single access for inflow and a single access for outflow from the outside.Furthermore, these areas can also be formed without joints between two halves that are to be subsequently joined. Consequently, no half-molds need to be assembled, thus avoiding additional process steps. Susceptibility to defects in the mold, such as sharp edges or leaks, which can arise from slight misalignment of halves, can also be avoided. In addition, the thermal or mechanical load-bearing capacity of the joint-free part can be increased.

[0061] Microfluidic component may be increased since there are no bonded surfaces.

[0062] With the aforementioned embodiment, it is possible and preferred to create bends or turns in the inflow or outflow. Additive manufacturing techniques or 3D printing are particularly advantageous for this purpose. Sharp kinks, such as those created by two converging drill holes, can be avoided. This makes it easier to achieve laminar flow.

[0063] According to one embodiment, the inlet and outlet can be designed and manufactured using an appropriate additive manufacturing process or 3D printing process so that conventional connection points are created. In this way, a connection to peripheral systems can be achieved using a conventional connecting means that is complementary to the conventional connection point, without the need for further process steps such as joining, pressing in or the like. For example, a thread or a press-fit conical connector can be created using the additive manufacturing process. This makes it possible to connect to peripheral systems such as a pump, an analysis device or the like.

[0064] According to one embodiment of the component for microfluidics, the functional unit can comprise a space having at least two mutually parallel boundary surfaces. For example, it can be cylindrical in shape with two mutually parallel top surfaces. In principle, it can also be cuboid or cube-shaped. The orientation of these parallel surfaces within the volume can, in principle, be arbitrary and is not limited to a stacking direction or the like.

[0065] According to one embodiment, which is preferably combined with the one mentioned above, a first electrode and a second electrode can be introduced or arranged in the space or in the functional unit such that they are arranged parallel to one another. Both can preferably be formed parallel to the boundary surfaces. The electrodes are not limited by the fact that they are formed by 3D printing processes, but this can preferably be the case. For example, the electrodes can be formed on the surfaces. The electrodes can be designed for the electrochemical conversion of components of the fluid. However, they can also be used or designed to detect fluid properties, such as conductivity.

[0066] According to one embodiment, for example, a temporal course of a reaction or the residence time of a fluid or of the reactants can be determined by an appropriate arrangement of electrodes at several specifically selected locations in the component along the fluid channels and a corresponding measurement of the conductivity.

[0067] The electrodes and / or any contacts for the electrodes can be additively manufactured as part of a green body, similar to the process described above, or produced by 3D printing. For example, a first material can be a ceramic material. The cavities of the inflow, the outflow or the functional unit can be pre-formed with a material that can be removed by heat treatment. Two flat precursor structures for the electrodes can be formed from a metal paste at the interface of the first material. Two precursor structures for contact lines of the electrodes can be introduced into the first material and can lead away from it in any direction. The arrangement of the components or their course does not need to be limited by a stacking direction.

[0068] According to a further embodiment of the microfluidic component, the functional unit can have a space which has a shape designed to promote the formation of a turbulent flow in the microfluid. In comparison, the shape of the inflow or outflow can be designed to promote a laminar flow. For example, the shape of the space which the functional unit has can have a plurality of edges or flow-deflecting or flow-swirling structural components. This can, for example, promote mixing of two reactants or the like. The preferred formation of the inflow and / or outflow as promoting laminar flow can be achieved, for example, by the round shape outlined above.Alternatively, an inlet and / or an outlet can have a specially designed shape, for example to create a Venturi effect or to serve as a receptacle for standardized contact elements of inlets and / or outlets for the fluid.

[0069] According to a further preferred embodiment of the microfluidic component, the functional unit can have an area or a wall or boundary area with a porous or rough surface. A porous or rough surface can already have a catalytic effect due to this surface property. In addition to or instead of the material from which the boundary of the functional unit is made, chemical substances can also be introduced. For example, metal catalyst particles or copper catalyst particles can be introduced into the wall. Furthermore, dyes, photosensitizers, reagents, indicators or sensor materials can be adsorbed or introduced accordingly. Additive manufacturing techniques or 3D printing allow either a mixed material, e.g.one comprising a ceramic material and a catalyst particle-forming material, or alternatively, a ceramic material and a catalytic material can be applied side by side in a small space, e.g. in a grid. With regard to roughening or structuring, for example, a microfluidic channel can be formed with longitudinal grooves along the side surfaces delimiting the channel. Such a functional unit can also be designed or configured to be suitable for chromatographic separations or analyses. This can easily be realized within the framework of additive manufacturing.

[0070] According to a further aspect, an ultrasonic generating device can be formed either as part of or in the vicinity of the functional unit. The ultrasonic generating device can be designed to generate an ultrasonic vibration in the fluid in the functional unit. Such an ultrasonic vibration can, for example, trigger a chemical reaction or mix a reaction mixture or distribute particles in the fluid.

[0071] The ultrasonic generating device may comprise a piezoelectric ceramic. In other words, it may be formed using a piezoelectric ceramic. Furthermore, contact lines and electrode structures for exciting the piezoelectric ceramic may be formed in the component to form the ultrasonic generating device. A manufacturing method may be fundamentally similar to that described above.

[0072] According to a further aspect, a pressure measuring device can be formed either as part of or in the vicinity of the functional unit. The pressure measuring device can be designed to enable a pressure measurement in the fluid in the functional unit. Such a pressure measuring device can be formed, for example, using a piezoelectric ceramic, which converts a pressure or a pressure change into an electrical voltage or a voltage change and thereby makes it measurable. The electrical voltage can be tapped via electrical contacts that are also introduced within the microfluidic component.

[0073] Alternatively or additionally, a pressure measuring device based on a piezoelectric ceramic can also be designed or configured to detect or measure parameters that can be derived directly or indirectly from a pressure measurement or obtained via other types of output signals from the piezoelectric ceramic. For example, a density, a viscosity, a particle load, a particle velocity, a fluid impact load, a speed of sound, a fluid velocity, etc. can be detected.

[0074] According to a further preferred embodiment, the component can have a pump. This can be arranged in or at the inlet, in or at the outlet, or in or at the functional unit in such a way that it can pump a fluid through the system. The pump can either be directly integrated into the component or be designed as a separate component. The pump can be formed from a piezoelectric ceramic. This can also have electrical contacts or controls.

[0075] Examples of piezoelectric materials that can be used are lead zirconate titanate ceramics (PZT) or lead-free piezoceramics based on bismuth ferrate barium titanate (BF-BT). According to a further preferred embodiment, a heating element can be formed in or on the functional unit as a functional unit, as an alternative to such a unit, or in addition to such a unit. The heating element can be formed as a heating coil. The heating coil can, for example, wrap around a cylindrical region of the functional unit, e.g. embedded accordingly in a structural ceramic. In contrast to conventionally manufactured ceramics, such a round wrapping cannot be produced using a stacking or lamination technique. The cylindrical region is preferably aligned with the longitudinal axis in the intended flow direction.Accordingly, a differently shaped area of ​​the functional unit can also be wrapped.

[0076] Alternatively or additionally, a heating element can also be formed from or with a PTC ceramic. The shape of the heating element is fundamentally arbitrary and can, for example, be cylindrical. In the case of a PTC ceramic or a cylinder formed from it, this or that cylinder can be in direct contact with a fluid. The PTC ceramic can be embedded in a structural ceramic. Such PTC heating elements also cannot be manufactured using a stacking or lamination technique.

[0077] Alternatively or additionally, a heating element can also be formed from one or more Peltier elements. These can be semiconductor-based Peltier elements. However, they are preferably Peltier elements based on ceramic materials. A Peltier element can, for example, comprise a calcium manganese oxide that is partially doped with Fe atoms at the sites of Mn atoms. Such a thermoelectric ceramic material can comprise a material characterized by the general formula Ca- X - yTSOxDONyMni-zEezOn, where ISO denotes a divalent element containing Ca 2+ in the crystal lattice, DON denotes an element that can replace Ca 2+in the crystal lattice and provides electrons for electrical conductivity, and where 0 < x < 0 , 5 ; 0 < y < 0 , 5 ; 0 , 0001 < z < 0 , 2 ; n > 2 . Such a thermoelectric ceramic material can, for example, be a material based on calcium cobalt oxide of the composition ( Ca3-xNa x) CO4O9-0, with 0, 1 < x < 2, 9 and 0 < 5 d 2 . The Peltier element can also be in direct contact with a fluid or be embedded in a structuring ceramic. Peltier elements of this type cannot be manufactured using stacking or lamination technology either. Peltier elements can heat or cool a defined surface by suitably selecting the flow direction of the electrical current required for their operation. It is therefore possible to use a Peltier element to specifically heat or cool a fluid within the microfluidic component, or to keep its temperature constant. By measuring the electrical power required for this purpose, a reaction heat within a fluid within the microfluidic component can be measured.

[0078] Furthermore, a temperature sensor element, such as an NTC sensor element or a PTC sensor element or an electrical resistance thermometer or a thermocouple, can be formed in the microfluidic component near the inflow, the outflow or the functional unit or even as part of the functional unit. This allows the temperature measurement near or directly at the functional unit. For example, in the case of a microreactor in which a catalyst or a catalytically active

[0079] If a certain surface area is available, a temperature measurement of the fluid is possible. The positioning or orientation of such a sensor can be freely selected using additive manufacturing techniques or 3D printing and is not limited by a stacking direction.

[0080] According to a further embodiment, a

[0081] Microfluidic components can have additional inflows, outflows, and / or volume elements arranged between them that are not in direct fluid contact with other inflows, outflows, or volume elements arranged between them. This allows, for example, two or more fluidically separated fluids to be guided alongside one another in a microfluidic component. These fluids can be in thermal contact. It is possible to form heat exchangers within the microfluidic component, which can be used to heat or cool another fluid.

[0082] Alternatively or additionally, it is possible for the aforementioned fluids to be in a material connection. "Material" is to be understood here as meaning that a material exchange is possible between two or more fluids without these fluids being in direct fluid contact with one another. For this purpose, the fluids are separated, for example, by a membrane. This membrane can allow certain substances to pass through without bringing the respective fluids carrying these substances into direct contact with one another. The membrane can be semipermeable. The membrane can, for example, comprise a material from the microfluidic component, but other materials are also possible. Alternatively or additionally, the membrane can have or be provided with catalytic or filtering properties.It is possible to incorporate ion exchangers, reverse osmosis, sterile filters, fuel cells, catalytic afterburners, membrane oxygenators, lambda probes, pH probes, etc. within the microfluidic component.

[0083] According to a further embodiment, a microheater is described. This has an electrical resistance heating function embedded in a ceramic body. The resistance heating function can be realized, for example, by conductive and, in particular, metallic structures in the ceramic. Particularly in the case of additive manufacturing techniques or 3D printing, the positioning or orientation of corresponding structures in the ceramic can be freely selected.

[0084] According to one embodiment, a conductive structure for implementing the heating function can be at least partially encased in ceramic material and thus at least partially protected from external influences. The structures can also be completely encased or embedded.

[0085] According to one embodiment, the structures can also be placed as close as desired to a preformed cavity, for example, to implement a heating function at a defined distance. This design allows for a very defined local heating of an inert material, such as a ceramic.

[0086] According to one embodiment, a micro heater can be designed and configured to be used in human and / or veterinary medicine. For example, a micro heater can be designed such that it can be attached to the tip of catheters. Such a heater can generate a very concentrated high heat effect at a point-like tip. This can be done, for example, for sclerotherapy during minimally invasive operations inside the body. Such micro heaters can preferably comprise an AlN-containing material with tungsten-containing electrodes or can be formed from such a material. AlN materials are well suited because they have particularly high thermal conductivities. Tungsten electrodes are well suited for resistance heating and, due to their high melting point, are suitable for processing together with AlN.This allows the creation of a particularly efficient, localized heat source with high energy density, which can be used advantageously in surgical applications.

[0087] According to one embodiment of the microheater, 3D-printed internal electrodes or metallic structures can be arranged within the 3D-printed ceramic body. These can form a heating coil as a resistance heating function in a region of the ceramic body. According to one embodiment of this microheater, a reservoir for heating or evaporating a liquid can be formed in the region of the ceramic body or on a surface of the region of the ceramic body.

[0088] According to one embodiment, a temperature sensor can be formed on or in the microheater. For example, the temperature sensor can be designed as an electrical resistance sensor, thermocouple, NTC sensor, or PTC sensor. According to one embodiment, such a temperature sensor can be used to control the temperature of a microheater. For this purpose, a temperature control device attached to the microheater or separate from it can be used.

[0089] According to one embodiment of the microheater, it can be designed as a flow-through heater. It can have a flow-through region designed to conduct a fluid through it. A first conductor, acting as an electrical resistance heating function, can at least partially enclose the flow-through region in a plane perpendicular to the flow direction. Using additive manufacturing techniques, it is easily possible to manufacture complex flow-through structures, e.g., from ceramic, and to freely incorporate the shape of the conductor and any external contacts into them.

[0090] According to one embodiment of the flow-through heater, a second conductor can be configured as a second resistance heating function, offset from the first conductor in the flow direction, so that two successive heating levels are formed in the flow direction. This can improve the heating of the fluid.

[0091] According to one embodiment of the flow heater, a PTC heater can form the heating element. The PTC heater can be formed from a ceramic comprising a PTC material.

[0092] According to one embodiment of the flow-through heater, flow-guiding or flow-modifying components can be formed adjacent to the flow-through area in addition to the outer walls of the flow-through area. Using the described techniques, it is possible to realize flow-guiding or flow-modifying structures or components in addition to outer walls, e.g., of a tubular flow-through area.

[0093] According to one embodiment of the flow-through heater, a PTC heater can be designed through free-form shaping such that a ceramic comprising a PTC material is formed in the fluid channel, for example, as a gyroid structure, and the fluid to be tempered flows around it accordingly. The term "gyroid" is understood here according to the general technical understanding. In particular, "gyroid" can be understood as a three-fold periodic minimal surface (TPMS). Consequently, such a structure has an internal periodicity and locally assumes the smallest possible surface area at a specified boundary curve.

[0094] According to one embodiment of the flow-through heater, the resistance heating function can be embodied as a conductor. A section of the conductor can follow the fluid path such that this section extends along the intended flow direction of the fluid. The conductor or a spiral formed from it can, for example, form a loop that extends along the intended flow direction of the fluid.

[0095] According to one embodiment of the flow-through heater, which is particularly preferably a modification of the aforementioned embodiment, the fluid guide can have a bend which is suitable for changing the intended flow direction of the fluid between a region before the bend and a region after the bend. A tubular section of the flow-through heater can, for example, have a bend. A section of the conductor can extend along the flow direction changed in this region of the fluid guide. Preferably, a first section of the conductor can extend along the intended flow direction of the fluid, as described above. This first section can, for example, extend along the flow direction of the fluid before the bend. A second section of the conductor can extend along the flow direction changed in this region of the fluid guide.For example, a first loop of the conductor can extend along the flow direction before the bend, and a second loop can extend along the flow direction after the bend. This allows the area heated to be increased.

[0096] According to one embodiment of the flow-through heater, which is particularly preferably a modification of the penultimate embodiment, the fluid guide can have a first bend. This first bend can define a first plane, just as an angle defines a plane in space. A second bend, which follows the first bend in the flow direction, can be oriented in a plane perpendicular to the first plane. The fluid guide can have a third bend in the flow direction after the second bend. This third bend can define a second plane which extends parallel to but offset from the first plane. One section or more sections of the conductor are arranged in an intermediate plane parallel to the first plane, which intermediate plane is located between the first and second planes.This arrangement allows the flow to be guided around the conductor arranged in the intermediate plane, maximizing the contact area for heat transfer. Such intertwined structures consisting of multiple materials can be formed particularly advantageously using additive manufacturing or 3D printing.

[0097] According to one embodiment, such a twisted fluid guide can also allow operation with several different fluids, so that the fluid guide can also be used as a micro-mixer or as a micro-reactor.

[0098] According to a further embodiment, a transformer, or in particular a 3D-printed transformer, is described. This transformer can have at least two electrically conductive layers separated from each other by a dielectric ceramic layer. The aforementioned advantages arise from 3D printing.

[0099] According to one embodiment of the transformer, it can comprise a ferrite ceramic and a second ceramic. The second ceramic can be arranged above a surface of the ferrite ceramic. Electrical structures, which can form a coil, for example, can be embedded in the second ceramic such that a portion of this second ceramic is arranged between two electrical layers of the electrical structures such that this portion can serve as a dielectric. Using additive manufacturing techniques or 3D printing, a shape can be realized that is not limited by a stacking process.

[0100] According to one embodiment of the transformer, a ferrite core can be arranged within the coil formed by one or more electrical layers. The ferrite core can be a separate component or formed together with the other components by 3D printing. According to a further embodiment, a thermal sensor is described. The thermal sensor can comprise a thermistor ceramic, in particular it can comprise an NTC ceramic or a PTC ceramic. The thermal sensor can comprise a carrier, for example a ceramic carrier. The thermal sensor can comprise one or more electrical contacts or electrodes. The thermal sensor can be a stand-alone element, but it can also be combined as desired with other embodiments mentioned above or below.For example, such a thermal sensor can be contained in a microfluidic component, a microheater, an RF component, a transformer, or a package. Such a thermal sensor can be integrated within such components or applied to such components.

[0101] Furthermore, a package is described. This can have a recess for accommodating an external component or a component printed in one piece. The package can be a self-contained, fully 3D-printed package. The package can be formed by additive manufacturing or 3D printing. As described abstractly above for conceptual design, this can have a flat unit that forms a main plane. A further structural or functional unit can be realized within the package. This can in principle be manufactured separately, but is preferably realized by 3D printing and printed together with the package or as part of it. The further structural or functional unit can have a surface that defines a plane that is tilted to the main plane. If these components are manufactured by 3D printing, the tilted plane can be easily realized.The package can be monolithic and self-contained or formed in one piece. The package can comprise shielding elements. Examples of such shielding elements are suitable for providing Faraday shielding, particle radiation shielding or high-energy radiation shielding. The Faraday shielding can be formed, for example, via Faraday electrodes. The particle radiation shielding can be formed as a particle shield. Due to its properties, tungsten is also very well suited to providing shielding against high-energy electromagnetic radiation or particle radiation; these can be combined with the Faraday shielding. Alternatively or additionally, shielding electrodes against electromagnetic radiation in the radio frequency range can be formed. The package can comprise electrical contacts. The package can comprise metallizations.

[0102] According to one embodiment, the package can comprise a sensor element, for example designed with an NTC ceramic, a PTC ceramic, an electrical resistance thermometer or a thermocouple. Alternatively or additionally, the package can also have a sensor element comprising a piezoceramic for measuring a pressure. Alternatively or additionally, the package can also comprise one or more channels for fluids. A fluid can be guided in these channels and thus heating and / or cooling of the package and / or the components arranged within the package can be provided. Alternatively or additionally, heating and / or cooling can also be made possible via Peltier elements integrated in the package.Alternatively or additionally, the package can also be designed in an external form to maximize heat dissipation, for example, by having a cooling fin structure and / or being coated with metal surfaces. Several such elements can advantageously be realized in one package using additive manufacturing.

[0103] Furthermore, an RF module is described. This can preferably be obtained by 3D printing, but is not initially limited to this in its generality. It is preferably completely 3D printed. The RF module has a ceramic body. It can also have an electrically functional component. This can be embedded in the ceramic body.

[0104] The ceramic body of the RF module can comprise an LTCC ceramic or an HTCC ceramic. The ceramic body can therefore be manufactured from an LTCC ceramic material that forms an LTCC ceramic body. Alternatively, the ceramic body can be manufactured from an HTCC ceramic material that forms an HTCC ceramic body.

[0105] The RF module can be designed as a ceramic printed circuit board (cPCB for short). Such a circuit board can advantageously be used as a carrier in power electronics applications or as a carrier for high-power LEDs. In this case, it is preferable to use an AIN material as the HTCC ceramic body. AIN has high thermal conductivity and advantageous dielectric strength. It can therefore advantageously be used as an insulating, highly heat-dissipating carrier. In combination with electrodes made of a tungsten material, internal thermal and / or electrical conductive structures can be integrated. Faraday shields, cooling channels or cooling fin structures can also be formed.Due to its properties, tungsten is also very well suited to provide shielding against high-energy electromagnetic radiation or particle radiation, which can be combined with Faraday shielding.

[0106] The functional component can be made of a different ceramic material than the ceramic material, i.e., in the case of the examples, a different ceramic material than LTCC ceramic or HTCC ceramic. The described advantages for additive manufacturing arise particularly in the case of 3D printing.

[0107] According to one embodiment of the RF module, the electrically functional component can be an inductor coil with a ferrite ceramic material. Alternatively or additionally, the functional component can be a capacitor. This can have a dielectric that is different from the ceramic material of the ceramic body. The dielectric can be a dielectric ceramic material. Alternatively or additionally, the functional component can be an ESD protection component. This can have a varistor ceramic. Alternatively or additionally, the functional component can be a thermistor. This can be, for example, an NTC sensor that has an NTC ceramic, or a PTC sensor that has a PTC ceramic.

[0108] The following explains component properties that apply to all of the aforementioned components and can also be applied to the exemplary embodiments described later. Generally speaking, components according to the invention can be free of internal joints, which has the advantages mentioned above.

[0109] It can also be generalized that a component according to the invention can have two material regions. These can be interlaced three-dimensionally.

[0110] Third, fourth and further material regions can also be present in a component. These can be, at least partially, three-dimensionally interlocked. Two or more material regions can therefore be formed. The above formulation "two material regions" is to be understood within the application as the same as "two or more material regions" and means that at least two different material regions can be identified. The formulation "two or more material regions" only further emphasizes that there is no limitation to exactly two materials, even if this is not absolutely necessary due to this clarification.

[0111] 3D-printed ceramics and / or 3D-printed metal areas can be formed in the component.

[0112] The components themselves described above may contain structural properties.

[0113] Components can contain sensors, such as NTC sensors or PTC sensors. NTC sensors can be introduced into a component using an NTC ceramic, which has another ceramic as its main component. Accordingly, PTC sensors can be introduced into the component using PTC ceramics. With the inventive concept, NTC ceramics can be introduced within other electro-ceramic components in a targeted manner at those locations where temperature measurement is advantageous, such as as close as possible to the location of a heat source within the component. This can generally be achieved using additive manufacturing. This is even better because 3D printing can produce very thin layers in the lower micrometer range. In this way, the techniques mentioned can be used to realize not only usual NTC dimensions, but also significantly smaller components.These can be created at the relevant locations preferred for the functionality of the respective application and the rest of the component can be built around them without its dimensions having to be adapted significantly.

[0114] Protective or filtering properties can be developed.

[0115] Shielding properties can also be incorporated. For example, Faraday shields, EM shields, high-energy radiation shields, or particle beam shields.

[0116] Active components can also be incorporated, such as piezoelectric components. These can be incorporated using piezoelectric materials. For example, they can serve to implement an actuator function. These can also additionally or alternatively implement a sensor function.

[0117] Heaters can be formed, for example via corresponding conductors or heating coils. Heaters can also be formed comprising a PTC material. Protective elements can be formed, for example in the form of capacitors, inductors or varistors. Capacitors can be embedded in another ceramic via capacitor materials and conductor structures. Inductors can be embedded in another ceramic via core materials, e.g. ferrite materials and coil-shaped conductor structures. Likewise, a varistor can be embedded in another ceramic using a varistor material.

[0118] Other functions known from the state of the art can be embedded accordingly.

[0119] Using additive manufacturing, it is possible to integrate one or more of the last-mentioned functions into a single-piece component.

[0120] The invention is explained below using exemplary embodiments and figures. These are not drawn to scale and may be distorted in absolute and relative dimensions, which is why dimensions and proportions cannot be determined from the figures. Furthermore, the exemplary embodiments do not limit the invention.

[0121] Figure 1 shows a first three-dimensional component.

[0122] Figure 2 shows a first embodiment of a component for microfluidics

[0123] Figure 3 shows an exploded view of the first embodiment of a component for microfluidics. Figure 4 shows a second embodiment of a component for microfluidics as a transillumination image.

[0124] Figure 5 shows a third embodiment of a component for microfluidics

[0125] Figure 6 shows a fourth embodiment of a component for microfluidics

[0126] Figure 7 shows a fifth embodiment of a component for microfluidics

[0127] Figure 8 shows a sixth embodiment of a component for microfluidics

[0128] Figure 9 shows a seventh embodiment of a component for microfluidics

[0129] Figure 10 shows an eighth embodiment of a component for microfluidics.

[0130] Figure 11 shows a fluoroscopy image of a first

[0131] Example of a micro heater

[0132] Figure 12 shows an infrared thermal image of the first embodiment of a micro heater in operation

[0133] Figure 13 shows a plan view of the first embodiment of a micro heater

[0134] Figure 14 shows a second embodiment of a

[0135] Micro heater Figure 15 shows an exploded view of the second

[0136] Example of a micro heater

[0137] Figure 16 shows an infrared thermal image of the second embodiment of a micro heater in operation

[0138] Figure 17 shows a third embodiment of a micro heater

[0139] Figure 18 shows an exploded view of the third embodiment of a micro heater

[0140] Figure 19 shows an infrared thermal image of the third embodiment of a micro heater in operation

[0141] Figure 20 shows a fourth embodiment of a micro heater in plan view

[0142] Figure 21 shows a cross-section of the fourth embodiment of a micro heater obtained by sawing

[0143] Figure 22 shows an exploded view of the fourth embodiment of a micro heater

[0144] Figure 23 shows a first embodiment of a transformer in plan view

[0145] Figure 24 shows a cross-sectional light microscopy image of the first embodiment of a transformer

[0146] Figure 25 shows a cross-sectional scanning electron microscopy image of the first embodiment of a transformer. Figure 26 shows a second embodiment of a transformer in plan view.

[0147] Figure 27 shows a third embodiment of a transformer in plan view

[0148] Figure 28 shows the third embodiment of a transformer together with a separate ferrite core

[0149] Figure 29 shows the third embodiment of a transformer together with a mounted ferrite core

[0150] Figure 30 shows a first embodiment of a package in an oblique top view

[0151] Figure 31 shows an exploded view of the first embodiment of a package

[0152] Figure 32 shows a first embodiment of an RF module

[0153] Figure 33 shows a top view of the first

[0154] Example of an RF module

[0155] Figure 34 shows a cross-sectional light microscopy image of the first embodiment of an RF module

[0156] Figure 35 shows a cross-sectional scanning electron microscopy image of the first embodiment of an RF module

[0157] Figure 36 shows a plan view of a first

[0158] Example of a capacitor

[0159] Figure 37 shows a cross-sectional light microscopy image of the first embodiment of a capacitor. Figure 38 shows a generalization of the third

[0160] Example of a component for microfluidics

[0161] Figure 39 shows a graphic for conceptual clarification

[0162] Figure 40 shows a section of a ninth embodiment of a component for microfluidics

[0163] Figure 41 shows a cross section of a tenth embodiment of a component for microfluidics.

[0164] Figure 42 shows a photograph of a prepared embodiment of a thermal sensor

[0165] Figure 43 shows a schematic cross-sectional view of the complete embodiment of a thermal sensor of Figure 42

[0166] Figure 44 shows an exploded view of an eleventh embodiment of a component for microfluidics

[0167] Figure 45 shows a photo of the eleventh embodiment of a component for microfluidics

[0168] Figure 46 shows a fourth embodiment of a transformer 30 in a fully assembled state

[0169] Figure 47 shows a second embodiment of a package

[0170] Figure 48 shows a plan view of a twelfth

[0171] From an exemplary embodiment of a component for microfluidics Figure 49 shows a cross-sectional view of the twelfth

[0172] From an example of a component for the microfluidics of

[0173] Figure 48

[0174] Figure 1 shows a first 3D-printed component. It demonstrates that various components are accessible using 3D printing as an additive manufacturing technique.

[0175] Figure 39 shows an illustration which conceptually illustrates possible features and advantages of the inventive idea. In previous approaches, which can be referred to here as the 2.5D approach, layers of largely the same shape and size and often with only one functionality per layer were laminated. The respective designs were then further processed using individually adapted shaping tools. For example, subtractive processes such as punching or cutting were used to create holes or to separate components. Such shaping processes could be carried out on the green body of a component or on the sintered component. As shown in the image on the right, such measures can be dispensed with in a true 3D process.In contrast to previous laminating processes, typically necessary additional and separate process steps such as (screen) printing processes for applying electrode materials and (hot) pressing of the laminated stacks to produce the final green component can be dispensed with. Additive processes according to the invention allow complex functionalities or shapes to be formed through the additive process. Figures 2 and 3 show a first embodiment of a component for microfluidics. This is manufactured using 3D printing. Figure 2 shows a top view of the component. Figure 3 shows an exploded view of the component.

[0176] The component has a ceramic body 12, which is shown in Figure 3 as being made up of two sublayers. A cover layer, which is always present in the finished component to seal off the microfluidic component, is not shown here. Due to the holistic manufacturing process, all layers are connected to one another without any joints. The ceramic body 12 can be made from any ceramic or ceramic composition. For example, in the current example it can be made from the following ceramic. Based on the starting materials, this contains 49% SiO2, 33% BaCO3, 11% Al2O3, 5% H3BO3, 1% CaCO3 and 1% Cr2O3.

[0177] An inlet 1, which is fed by a reservoir 4, is formed in the ceramic body. The inlet 1 connects to a functional unit 2. This unit has a cylindrical cavity. An outlet 3 leads away from this cavity. A reservoir 5 is connected to the outlet 3.

[0178] A first electrode 6 and a second electrode 9 are formed in the functional unit 2. Both are formed on a common side (here the top side) of the cavity of the functional unit 2. The first electrode 6 is connected to a first external contact 8 via a first inner line 7 running in the ceramic body 12. Similarly, the second electrode 9 is connected to the second external contact 11 via a second inner line 10. The electrodes 6 and 9 can be contacted from the outside in an application via the external contacts 8 and 11.

[0179] The inlet 1 and the outlet 3 are not straight but rather curved. Such a shape can be created directly using 3D printing, without an additional step of removing material by cutting, milling, or similar.

[0180] The cavities of the inlet 1, the outlet 3 and the functional unit 2 can be formed by means of a heat treatment as described in the introduction, wherein a previously printed material such as starch powder is burned out by the heat treatment.

[0181] Alternatively, it is also possible to completely or partially exclude the printing at those locations where a cavity is to be created during the printing process and thereby to create a cavity already in a green state of a functional unit 2.

[0182] The electrodes 6 and 9, the inner leads 7 and 10, and the external contacts 8 and 11 can be made of the same material. In the exemplary embodiment, they consist of Cu, for example. In particular, the electrodes 6 and 9, which are in contact with the fluid, can also be made of a different material. For example, they can consist of or comprise an inert material, such as Au, or a catalytically active material, such as Pd or Pt.

[0183] The electrodes 6 and 9 can be configured to perform measurements on the fluid. For example, a resistance, a conductivity, or a redox potential can be measured. The electrodes 6 and 9 can also be configured to enable reactions in the fluid. For example, electrolysis, a redox reaction, or an electrocatalytic reaction can be enabled.

[0184] Figure 4 shows a second exemplary embodiment of a component for microfluidics. This component is primarily of a model nature. It shows an inlet 1 and an outlet 3. The functional unit 2 here is a diagonal channel. Inlet 1, outlet 3 and functional unit 2 are formed in a ceramic body 12, similar to the first exemplary embodiment. Figure 4 shows an x-ray view of a printed component comprising the two sublayers as shown in Figures 2 and 3, respectively, and also comprising the cover layer not shown in Figures 2 and 3. Again, it can be seen that winding courses of fluid lines can be established.

[0185] As an alternative to the functional assignment made here, the overall structure can be used instead of an outflow or an inflow in one of the other components for microfluidics.

[0186] Figure 5 shows a third exemplary embodiment of a component for microfluidics. Again, an inlet 1, an outlet 3 and a functional unit 2 are formed in a ceramic body 12. The functional unit 2 has a largely cylindrical cavity, wherein the cylinder axis is oriented along the intended flow direction of the fluid. The ends of the cavity of the functional unit 2 taper slightly conically at the inlet 1 and the outlet 3. The functional unit also has a heating coil wound around the cavity of the functional unit 2. This can be made of any suitable material. Known metals or alloys can be used for this purpose; the heating coil is shown here without electrical leads and without external contacts. These can be realized as shown for other embodiments.

[0187] Inlet 1 and outlet 3 are both straight, but can also be curved. Furthermore, inlet 1 and outlet 3 have a round cross-section, which promotes laminar flow.

[0188] 3D printing makes it possible to create the complex shape of the heating coil around the cylindrical cavity. This would be virtually impossible with conventional manufacturing techniques, especially for a one-piece component.

[0189] Figure 38 shows a generalized embodiment of a component for microfluidics based on the third embodiment. Again, an inlet 1, an outlet 3 and a functional unit 2 are formed in a ceramic body 12. The functional unit 2 has a largely cylindrical cavity, with the cylinder axis oriented along the intended flow direction of the fluid. The ends of the cavity of the functional unit 2 each taper slightly conically at the inlet 1 and the outlet 3. The structure, which was identified in Figure 5 as a heating coil, is generalized here for any functional unit 2.

[0190] The functional unit 2 has a complex internal

[0191] Structure or a complex internal surface. This can ensure particularly intensive mixing of the fluid. This complex internal structure can also be used to enable catalytic functions in the functional unit 2.

[0192] The catalytic function can be achieved by roughening the surface or by coating it with catalyst particles.

[0193] Inlet 1 and outlet 3 are both straight, but can also be curved. Furthermore, inlet 1 and outlet 3 have a round cross-section, which promotes laminar flow.

[0194] 3D printing makes it possible to create the complex shape of the internal structure around the cylindrical cavity. Furthermore, it facilitates the introduction of catalytically active materials. This would be virtually impossible with conventional manufacturing techniques, especially for a one-piece component.

[0195] Figure 6 shows a fourth exemplary embodiment of a component for microfluidics. This has inlet 1 and outlet 3 similar to the previous examples, and the remarks made regarding Figure 5 apply in particular.

[0196] The functional unit 2 is designed to measure a capacitance. For this purpose, the functional unit 2 has a chamber with at least two parallel oriented surfaces. Here it is designed as a cube. Alternatively, it can have a cylindrical shape or a cuboid shape, for example. A first electrode 6 and a second electrode 9 are formed opposite one another on a top and a bottom surface of the cube. These are oriented parallel to one another. Similar to the first embodiment of a microfluidic component shown in Figure 2, the electrodes 6 and 9 have internal lines 7 and 10 and external contacts 8 and 11. The electrodes can be designed such that they do not have direct contact with the fluid.

[0197] Figure 7 shows a fifth embodiment of a component for microfluidics.

[0198] The drain 3 is designed similarly to the drain shown in Figure 5 or 6.

[0199] Instead of a single inlet, two inlets 1a and 1b are formed, which lead to a spherical functional unit 2. Two different fluids, e.g. two reactant-containing solutions, can be fed to the functional unit 2. There they can be swirled and can react with each other. The curved shape of the inlets 1a and 1b promotes laminar flow in the inlets 1a and 1b compared to conventionally manufactured components. In conventionally manufactured components, often only sharp angles can be used to redirect fluid directions. 3D printing allows the formation of curved lines, such as the inlets here, as well as a spherical chamber that deflects and swirls the inflowing fluid. This allows good mixing and a complete reaction to be achieved.

[0200] In principle, the specific exemplary embodiment also optionally has an electrical resistance heater. This is shown with external contacts 8 and 11, internal lines 7 and 10, and electrodes 6 and 9, these being part of the resistance heating function, which can be implemented, for example, using a PTC ceramic. This heater can in particular be designed such that it has no direct contact with the fluid. Furthermore, an area provided with a catalyst can be realized on an inner surface which can be heated by the heater and which is in contact with the fluid. This area can be located near the areas marked with the reference numerals 6 and 9. The area provided with the catalyst is designed as part of the wall of the cavity of the functional unit 2. This enables a targeted setting of a reaction rate in which the reactants react with one another.a reaction rate on a catalyst, if present, can be made possible by a selective increase in temperature.

[0201] Figure 8 shows a sixth exemplary embodiment of a component for microfluidics. In particular, a pump is embodied as the functional unit 2. A largely cylindrical cavity contains a piezoelectric element 2a for this purpose. This pump allows the fluid to flow in via the inlet 1 and be pumped out via the outlet 3.

[0202] The pump thus formed can be combined with the other microfluidic components to pump the fluid through them. In particular, the outflow 3 of the component shown here can be connected to the inflow of the other components.

[0203] 3D printing allows the complex shapes of the cavity and the piezoelectric element 2a to be formed integrally with the ceramic body. The pump can also be formed integrally with the functionalities of the other microfluidic components shown. The piezoelectric element 2a can be printed in multi-material 3D printing together with the ceramic of the ceramic body, as well as together with electrical leads and contacts (not shown).

[0204] Figure 9 shows a seventh exemplary embodiment of a component for microfluidics. In this embodiment, the inlet 1 and outlet 3 are designed as a region in which the diameter of the conduit cavity increases toward the functional unit 2. The functional unit can also be a microreactor and can optionally exhibit the functions shown in Figure 10 or, in a generalized manner, serve as a placeholder for another function.

[0205] An NTC thermistor 13 is located in the immediate vicinity of the functional unit 2. This thermistor is connected to external contacts 8 and 11 via internal leads 7 and 10. The NTC thermistor may have a known structure and, for example, comprise a thermistor ceramic with two electrodes on two opposite surfaces of this ceramic.

[0206] Using 3D printing, it is possible to place the thermistor directly next to a functional unit in a one-piece component.

[0207] Figure 10 shows an eighth embodiment of a component for microfluidics.

[0208] For inflow 1 and outflow 3, the same applies as in Figure 5.

[0209] The functional unit 2 has a cylindrical chamber. A piezoelectric element 2a is formed on one side surface of this chamber. Unlike what was explained in relation to Figure 8, the spatial shape and the piezoelectric element 2a are not designed for pumping, but rather to generate an ultrasonic vibration in the fluid in the functional unit. This can, on the one hand, promote mixing of the fluid. On the other hand, chemical reactions can be induced additionally or alternatively by the ultrasound. In this way, even small particles such as nanoparticles or microparticles can be brought into suspension or held.

[0210] The piezoelectric element 2a can be printed in multi-material 3D printing together with the ceramic of the ceramic body as well as together with electrical leads and contacts (not shown).

[0211] Figure 40 shows a section of a ninth exemplary embodiment of a component for microfluidics. Shown is a channel for the fluid, which is an inlet and outlet 1 and 3, respectively. A microfluidic connection point 43 is formed in this end section of the channel. Here, this microfluidic connection point 43 is enlarged accordingly in order to be connected to other elements. A thread can also be cut into it in order to ensure a connection to external or peripheral components. One example could be a UNF 1 / 4" 28G thread. The microfluidic connection point can also be conical, for example to enable a press-fit connection. Such a connection can be implemented accordingly for all of the aforementioned components for microfluidics.

[0212] Figure 41 shows a cross section of a tenth embodiment of a component for microfluidics. Grooves 44 are formed in a channel, which may be, for example, an inlet 1, an outlet 2, or a functional unit 2. These represent a form of structuring or a form of

[0213] Roughening of the channel.

[0214] Figure 44 shows an exploded view of an eleventh embodiment of a component for microfluidics. Figure 45 shows a photo of the eleventh embodiment of a component for microfluidics in the assembled state, as obtained by additive manufacturing. This component has heating devices 49 and 52. The component has an inlet 1 and an outlet 3. In the middle there is a recess 2' which has an enlarged volume compared to the inlet 1 and the outlet 3. This can be achieved, for example, by increasing the diameter. This recess 2' can represent a type of functional unit. Accordingly, the heater described here can also be used for the other described components for microfluidics. A heating coil 50 is arranged near the recess 2' as part of the first heating device 49. This is electrically contacted via heating coil electrodes 51.In addition, a linear heater 53 is arranged as part of the second heating device 52 along the entire length of the fluid channel composed of inlet, outlet, and recess. The linear heater 53 is contacted via the linear heater electrodes 54. Depending on which of the electrode pairs 51 or 54 is energized, only the recess or the entire fluid channel can be heated. The structures can be designed to correspond to the structures of the other components for microfluidics. Figures 48 and 49 show a twelfth exemplary embodiment of a component for microfluidics. Figure 48 shows a plan view of the component. The surface of the ceramic body 12, which consists of the aforementioned ceramic, as well as a first external contact 8 and a second external contact 11 can be seen.In the color representation, the ceramic body 12 is again colored green, and the external contacts 8 and 11 display the orange of the copper they contain. In the present exemplary embodiment, the external contacts 8 and 11 appear to be arranged "centrosymmetrically." However, this is not mandatory. Depending on the application or other constraints, they can be arranged wherever best fits. They also do not have to be located on a surface, but can, of course, be routed out of the component in any desired manner.

[0215] A channel or its course is indicated by a dashed line. The channel can be formed instead of, in addition to, or as a part of a correspondingly designed inlet 1, a functional unit 2, or an outlet 3 of the previously described embodiments. Therefore, the channel is provided here with the combined reference symbol 1 / 2 / 3.

[0216] With such a channel layout, an NTC sensor 13 could be arranged slightly offset from its center and in the ceramic above it (not shown here). Alternatively, an NTC sensor 13 could be arranged over the entire surface of the channel (not shown here). Alternatively, an NTC sensor 13 could be designed as a thinner strip across it compared to the channel, with a longer copper electrode. In this way, an arrangement suitable for the measuring purpose can be selected.

[0217] Figure 49 shows a cross-section through the twelfth exemplary embodiment of a component for microfluidics. The cross-sectional direction shown is, with reference to Figure 48, a section perpendicular to the course of the channel. The cross-sectional view is distorted or shifted here in comparison to Figure 48 in order to show all of the components. At least for the arrangement of the external contacts 8 and 11, a common section perpendicular to the channel 1 / 2 / 3 would of course not be possible. The arrangement shown in Figure 49 not only provides a common representation of all of the components in one image, but also represents a possible alternative arrangement of the components.

[0218] Furthermore, Figure 49 shows that channel 1 / 2 / 3 has a circular cross-section. Alternatively, the cross-section can, of course, vary as described.

[0219] Furthermore, Figure 49 shows the course of a first inner line 7 and a second inner line 10. These connect the external contacts 8 and 11 to a first electrode 6 and a second electrode 9, respectively. The first electrode 6 and the second electrode 9 are designed as internal electrodes. These form the contacts or electrodes for a thermistor. The thermistor function is provided via a thermistor layer 47. The thermistor layer 47 comprises an NTC ceramic. This is how an NTC sensor 13 is realized. This is designed as orange internal electrodes made of copper 7, 10 for contacting the NTC sensor 13. Alternatively, a PTC sensor, a resistance thermometer or a thermocouple could be realized in the same way over a PTC ceramic layer instead of the thermistor layer 47.

[0220] Channel 1 / 2 / 3 is shown here as straight. However, it generally will not be straight, as shown, for example, in the first embodiment of a component for microfluidics. The metallic structures (components with reference numerals 6 to 11) can also be guided and led out of the component. Sensors can be positioned as desired. They can even be implemented as part of the channel itself. The components can be arranged relative to each other in a way that best suits a specific application.

[0221] Figures 11, 12, and 13 show a first embodiment of a microheater. The microheater is designed as a surface heater. Figure 11 shows a transillumination image. This image shows a conductor 14 in the form of a heating coil formed in a ceramic body 12. This provides an electrical resistance heating function. The heating coil can be contacted via internal leads 7 and 10 as well as external contacts 8 and 11. Current can be applied to the heating coil via these.

[0222] The thermal image in Figure 12 shows that, during operation, a bright-appearing area marked by the dark red or solid cross is heated. In comparison, the area near the external contacts 8 and 11 remains cold (marked by the lighter or dashed cross). Figure 13 shows a top view of the first embodiment of the microheater. As can be seen here, it has a reservoir 15. This is formed in the area that can be heated by the heating coil. A liquid can be placed in the reservoir, which is vaporized by heating.

[0223] Figures 14 and 15 show a second embodiment of a microheater. Figure 14 shows a side view. Figure 15 shows an exploded view of the second embodiment of a microheater. The microheater is designed as a flow-through heater.

[0224] In this case, for example, a flow-optimized heating geometry can be realized and at the same time an embedded resistance heater can be used, which serves to heat the liquid as efficiently as possible and yet does not influence the flow of the liquid as much as possible.

[0225] In the present embodiment, a ceramic body 12 forms a flow region 16 by having a tubular interior. The flow region 16 is straight here. The flow direction of a guided fluid runs along the shape defined by the flow region 16.

[0226] A conductor 14 is formed in the ceramic body 12 as a resistance heating function. For example, it can be made of or with copper or tungsten. It almost completely surrounds the flow area 16, except for a small area. The plane in which the conductor surrounds the flow area 16 is oriented perpendicular to the flow direction defined by the flow area 16. This enables uniform heating of the fluid. The conductor has only a single turn here, but can have two or more turns.

[0227] The ceramic body 12 is shown in four parts in the exploded view for clarity. It comprises the three large sections marked with the reference symbol 12 as well as the compensating piece 17. The compensating piece 17 is preferably made of the same ceramic material as the rest of the ceramic body 12. The compensating piece 17 enables the ceramic material to be brought into a flush plane with the conductor 14. The component is 3D-printed in one piece and has no internal joints.

[0228] The conductor 14 can be contacted via the external contacts 8 and 11. These are exposed on a projection for external connection.

[0229] The illustrated design has the advantage that the conductor 14, as a heat source, can be placed close to the fluid. This avoids the need to introduce heat from the outside through the structural material, as is common in conventional systems. Furthermore, no part of the conductor needs to protrude into the fluid for better heat transfer, which could disrupt its flow.

[0230] Here, too, the ceramic body can be made of the following ceramic. Based on the starting materials, this contains 49% SiO2, 33% BaCO3, 11% Al2O3, 5% H3BO3, 1% CaCO3, and 1% Cr2O3. Figure 16 shows an infrared thermal image of the second embodiment of a microheater. The cross indicates that targeted heating occurs during operation.

[0231] Figures 17 and 18 show a third embodiment of a microheater. Figure 19 shows an infrared thermal image of this embodiment. The microheater is designed as a flow-through heater. Figure 17 shows three similar flow-through heaters. Figure 18 shows an exploded view of the flow-through heater. Unless otherwise stated, the statements regarding the second embodiment of a microheater apply.

[0232] This flow-through heater also has a flow region 16 formed by a ceramic body 12, through which a fluid can flow. The flow region 16 ends in a nozzle 18. In addition, external structures 19 are formed by the ceramic body 12. As can be seen in Figure 17, but especially in Figures 18 and 19, the external structures 19 surround the flow region 16, but are only connected to it by webs. Hollow spaces are formed between the external structures 19 and the walls of the flow region 16. These insulate the fluid from the outside. As can be seen in Figure 19, these external structures 19 do not heat up during operation. The hollow space created between the external structures 19 and the walls of the flow region 16 can alternatively be used to conduct and preheat the fluid in countercurrent. This allows the heater to be made more compact and operated more efficiently. Alternatively, an additional fluid can also be heated.

[0233] Similar to the second embodiment of a microheater, a conductor 14 is formed as a resistance heating function in the ceramic body 12 and can be contacted via external contacts 8 and 11. Similarly, a second conductor 14a with external contacts 8a and 11a is formed offset in the flow direction. This improves the heating performance. Otherwise, the advantages described above apply. Alternatively, the second conductor 14a can be used as an electrical resistance thermometer to monitor the heater.

[0234] 3D printing makes it possible to create complex structures from different materials in a single component.

[0235] Figures 20, 21 and 22 show a fourth exemplary embodiment of a micro heater. This is also designed as a flow-through heater, and the statements made regarding the second and third exemplary embodiments of a micro heater apply accordingly, unless stated otherwise. Figure 20 shows a plan view of the flow-through heater. Figure 21 shows a cross-section through the flow-through heater obtained by sawing. Figure 22 shows an exploded view of the flow-through heater.

[0236] In the present embodiment, the flow region 16 has a tortuous shape with multiple bends that guides the fluid around the conductor 14 and maximizes the contact area.

[0237] For this purpose, the flow area 16 has a first bend 16a in a first section 12a of the ceramic body 12. In this case, this is a 180 degree bend. This bend defines a first plane, similar to an angle, which also defines a plane in space. A second bend 16b is formed in the region in which the first section 12a and the second section 12b of the ceramic body 12 are connected. This is also designed as a 180 degree bend. The plane defined thereby is perpendicular to the first plane. In the second section 12b of the ceramic body 12, a third bend 16c is formed, which defines a second plane. In this case, this is oriented parallel to the first plane, but offset from it.

[0238] The conductor 14 also implements the resistance heating function here. It has a first section 14b and is designed as a loop of the conductor. This is oriented along the flow direction as it prevails before the first bend 16a. A second section 14c of the conductor 14, which is also designed as a loop of the conductor 14, is oriented along the flow direction as it is established after being deflected by the first bend 16a. This has the advantage that the bend 16a creates a compact volume in which heating takes place and the heat can be dissipated over a large area in front of and behind the first bend 16a. This advantage can be established independently of the other advantages.

[0239] A further advantage that can be realized independently of this first advantage results from the arrangement of the second section 14c of the conductor 14 relative to the second bend 16b. The bend 16c encloses the second section 14c from two sides, with the surface formed by the loop of the second section facing the flow areas upstream and downstream of the second bend 16b. Preferably, both advantages are combined, as shown.

[0240] The third bend 16c further repeats these two advantages. Thus, the conductor 14, or one or more sections of the conductor, are arranged in a plane parallel to the first and second planes defined above, with the plane defined by the conductor lying between the first and second planes.

[0241] Similar to the second embodiment of a micro heater, a compensating piece 17 is used here. The external contacts 8 and 11 are also realized on a projection.

[0242] Figures 23, 24, and 25 illustrate a first embodiment of a transformer. Figure 23 shows a top view of the transformer. Figure 24 shows a cross-sectional light microscopy image of a section of the transformer. Figure 25 shows a cross-sectional scanning electron microscopy image of a section of the transformer.

[0243] The transformer has a ferrite layer 21, which is designed here as a base plate. The transformer also has a coil 22. Four external contacts 23, 24, 25, and 26 are provided for electrically contacting the coil. These contacts are made of copper. The transformer, with its ceramic and conductor layers, is 3D printed.

[0244] The transformer can also have a type of cover structure (not shown), which can be manufactured in the same way as the base plate. The transformer also has a ferrite core, which is also printed as a single piece with the transformer. This is difficult to see in the figures. Internal joints, for example, are missing in the transformer manufactured in this way. Joints are only visible in an unsintered green body.

[0245] The exact layer structure can be seen in Figures 24 and 25. Layer 21 is the ferrite ceramic layer 21. An LTCC ceramic layer 28 is arranged on this. A thin adhesion promoter layer 27 is arranged between the layers. It contains another LTCC ceramic, which improves the adhesion of the LTCC ceramic layer 28 to the ferrite ceramic layer 21. The LTCC ceramic layer can in turn be the following ceramic, which, based on starting materials, has 49% SiO2, 33% BaCO3, 11% Al2O3, 5% H3BO3, 1% CaCO3, and 1% Cr2O3. The adhesion promoter layer is similar in composition to the LTCC ceramic layer, but can be optimized for each individual case to allow better bonding to the ferrite ceramic layer 21. In particular, for example, a smaller amount of doping can be introduced. The ferrite ceramic of the ferrite ceramic layer 21 can be any known ferrite ceramic. For example,the inventors assume that Ferrite N87 from TDK Corporation, Ferrite N95 from TDK Corporation, Ferrite N97 from TDK Corporation, Ferrite PC47 from TDK Corporation or Ferrite PC95 from TDK Corporation can also be used.

[0246] The coil leads 29, which form the coil 22, are embedded in the LTCC ceramic layer 28. The coil leads are made of copper. The LTCC ceramic layer 28 acts as a dielectric between the individual coil leads. The adhesion promoter layer 27 allows the LTCC ceramic layer to be selected solely based on its electrical properties.

[0247] The transformer was manufactured using 3D printing. In contrast to conventional techniques, 3D printing generally allows additional functions to be integrated into a component such as a transformer without the need for complex additional processes. For example, an NTC sensor layer or a cooling channel can be inserted into areas of the transformer where particular heat development is to be expected, for example due to unwanted eddy currents. The sensors can then monitor critical regions very specifically and as directly as possible, or a cooling channel can cool them very specifically and as directly as possible, which is not possible with conventional methods.

[0248] Figure 26 shows a second exemplary embodiment of a transformer in plan view. This corresponds to the previous example, except that no adhesion promoter layer is used. This allows for a simpler construction, since fewer different materials need to be processed.

[0249] Figure 27 shows a third embodiment of a transformer 30 in plan view. This can correspond to the first or second embodiment of a transformer. The third embodiment does not have an integrally printed ferrite core. As shown in Figures 28 and 29, it can be combined with a separately printed ferrite core 31.

[0250] Figure 46 shows a fourth embodiment of a

[0251] Transformer 30 in a fully assembled state. The fourth embodiment shown here has a structure largely identical to the third embodiment. However, it has a completely enclosed ferrite core 31.

[0252] Figures 30 and 31 show a first exemplary embodiment of a 3D-printed package. The package has a substrate-like first component 32. Conductor tracks and connection points 33 are arranged on this. Furthermore, first internal connection points 55 are arranged on this first component 32. Mechanical and electrical contact can be made with a component to be installed via these. Four position markers 56 can also be seen. The position markers can facilitate setting (so-called “pick and place”) of the component to be installed. Of the connection points 33, the first internal connection points 55 and the position markers, only one is provided with a reference symbol by way of example. A ring 34 is formed on the first component 32. This ring has a bevelled surface which is oriented at an angle to the surface formed by the first component.This tilted surface can be easily realized with 3D printing. Such shapes are almost impossible to achieve using conventional manufacturing techniques. At least not without mechanical post-processing or in a single, homogeneous component free of internal joints.

[0253] Within the ring 34, a recess 35 is formed, which is suitable for accommodating other components or parts. Such other component or part can be a separate electronic component. For example, it can be a MEMS component or a semiconductor chip component. Alternatively, it can be formed directly within the ring 34 or the recess 35 using 3D printing.

[0254] If another component or part is mounted or printed in the recess, the package can be closed with a lid, for example a glass lid.

[0255] Furthermore, it is possible, for example (not shown here), to form Faraday electrodes or shielding electrodes against electromagnetic radiation in the radio frequency range within the material of the ring 34 or within the cylindrical region of the package. For this purpose, for example, a layer of copper could be introduced within the cylinder axis or within the material of the cylinder. Furthermore, a particle shield can also be implemented or a shield against high-energy radiation in the X-ray or gamma range can be formed. This can serve, for example, to protect a semiconductor chip arranged within the package from cosmic radiation or EMP. For this purpose, for example, a layer of tungsten could be introduced within the cylinder axis or within the material of the cylinder. The different shields can also be combined with one another as desired.

[0256] The division of the first component 32 into subcomponents 32a, 32b, and 32c shown in the exploded view is for illustrative purposes only. The component is a single piece.

[0257] Figure 47 shows a second exemplary embodiment of a package. This essentially has the same components as the first exemplary embodiment of a package, but has a round outer shape. In addition, second inner connection points 57 are provided, only one of which is provided with a reference symbol by way of example. This enables or simplifies the separation of the electrical and mechanical connections. For example, electrical contact with a component to be installed can be established primarily or exclusively via the first inner connection points 55. The mechanical fastening can then be formed primarily or completely by the second inner connection points 57.

[0258] Figure 32 shows a first embodiment of an RF module. Figure 33 shows a top view of the RF module. Figure 34 shows a cross-sectional light microscopy image of the RF module, and Figure 35 shows a cross-sectional scanning electron microscopy image of the RF module.

[0259] Another exemplary embodiment is the RF module shown in Figures 32 to 35. It is highly integrated and miniaturized, and is completely 3D-printed, including all of the components shown in Figure 32. For example, it is printed from an LTCC material or an HTCC material, or it is printed from a material forming an LTCC ceramic or an HTCC ceramic.

[0260] The RF module has external contacts 37a, 37b, 37c, and 37d. Unlike conventional methods, these were also applied using 3D printing prior to sintering, along with the other components. According to the state of the art, such external contacts are applied to the outer surfaces of the sintered component after sintering. Various internal components 38 are integrated into the LTCC or HTCC material 36.

[0261] Only limited functionalities can be integrated into classic RF modules. For example, classic integrated capacitors can only use the LTCC material or HTCC material as a dielectric and inductors can only consist of the coil. In the current exemplary embodiment, inductors that are additionally embedded in a ferrite material can be provided as internal components 38. Alternatively or additionally, capacitors can be formed as internal components 38, for which a specifically selected dielectric can be chosen which is different from the LTCC material or HTCC material. Additionally or alternatively, it is possible, for example, to form an ESD protection component using a varistor ceramic as one of the internal components. Additionally or alternatively, it is possible to integrate sensors, for example using an NTC material or PTC material.

[0262] In the cross-sections of Figures 34 and 35, the LTCC material and HTCC material 36 can be identified, respectively. Furthermore, copper lines 39 can be identified in Figure 34. Conductor layers 40 can be identified in Figure 35.

[0263] Figures 36 and 37 show a first exemplary embodiment of a capacitor. This is a multilayer capacitor with a conventional capacitor ceramic 41. Alternatively or additionally, the ceramic described above can also be used. The internal electrodes 42 are made of copper here. The capacitor is a multilayer capacitor. It is manufactured entirely by 3D printing.

[0264] It is possible to integrate such a component seamlessly into another, more complex component using 3D printing. For example, this could be one of the components shown above.

[0265] Figures 42 and 43 show an exemplary embodiment of a thermal sensor. The thermal sensor shown here has a round shape, although this is not mandatory. A thermal sensor can in principle be designed in any way and its shape can be tailored to an application. The thermal sensor has a carrier 45 made of LTCC ceramic. Arranged above this is a first electrode 46 made of copper. Arranged above this is an NTC ceramic layer 47, which provides the thermistor functionality and is an example of a thermistor component. Arranged on this is a second electrode 48 made of copper. The carrier 45 is not absolutely necessary for thermal sensors according to the invention, but is implemented here for reasons of stability and to improve handling.

[0266] The ring-like structures visible in Figure 42 result from the preparation method used to show the layers in plan view. As can be seen in Figure 43, the layers are each formed over the entire surface and applied one above the other. In the unprepared component, only the uppermost material would be visible in the plan view, since the layers are not removed in stages. In principle, however, other geometric arrangements of electrodes and NTC ceramic layer relative to one another are also possible and are not limited to the stacked structure shown. List of reference symbols

[0267] I , la, 1b tributary

[0268] 2 functional units

[0269] 2 ' recess

[0270] 2a piezoelectric element

[0271] 3 Drain

[0272] 4 Reservoir of the inflow

[0273] 5 Reservoir of the outflow

[0274] 6 first electrode

[0275] 7 first inner line

[0276] 8 , 8a first external contact

[0277] 9 second electrode

[0278] 10 second inner line

[0279] II , 11a second external contact

[0280] 12 ceramic bodies

[0281] 12a first part of the ceramic body

[0282] 12b second part of the ceramic body

[0283] 13 NTC sensor

[0284] 14 , 14a ladder

[0285] 14b first section of the ladder

[0286] 14c second section of the ladder

[0287] 15 Reservoir

[0288] 16 Flow range

[0289] 16a first bend

[0290] 16b second bend

[0291] 16c third bend

[0292] 16e outlet bend

[0293] 16s inlet bend

[0294] 17 Compensating piece

[0295] 18 nozzle

[0296] 19 external structures

[0297] 21 Ferrite layer Coil , 24 , 25 , 26 External contact Adhesive layer LTCC ceramic layer Coil lead Transformer Ferrite core First component Conductive tracks and connection points Ring Recess LTCC material a, 37b, 37c, 37d External contact Copper lead Conductor layer Capacitor ceramic Copper layer Microfluidic connection point Groove Carrier First electrode Thermistor layer Second electrode First heater Heating coil Heating coil electrode Second heater Linear heater electrodes First inner connection points Positioning marker Second inner connection points

Claims

Patent claims 1 . Additive manufacturing process in which a first material and a second material different from the first material are used to produce a component.

2. Additive manufacturing method according to claim 1, wherein a first functional or structural unit of the component is formed with the first material and a second functional or structural unit of the component is formed with the second material.

3. Additive manufacturing method according to claim 1 or 2, wherein third, fourth and further materials form third, fourth and further functional or structural units of the component.

4. Additive manufacturing method according to claim 2, wherein the component is formed from successively applied layers, wherein both the first material and the second material are introduced into at least one layer.

5. Additive manufacturing method according to claim 4, wherein a functionality of the first functional or structural unit is achieved from the interaction of the material properties and its layer-transcending three-dimensional shape.

6. Additive manufacturing method according to one of claims 1 to 5, wherein a one-piece component is manufactured free of internal joints.

7. Additive manufacturing method according to one of claims 1 to 6, wherein a first increment and a second increment are introduced freely into the component to be built up relative to one another.

8. Additive manufacturing method according to claim 7, wherein the first increment and the second increment both comprise a first material or consist of a first material.

9. Additive manufacturing method according to claim 7, wherein the first increment comprises a first material or consists of a first material and the second increment comprises a second material different from the first material or consists of a second material.

10. Additive manufacturing method according to one of claims 1 to 9, wherein the first material contains a ceramic material.

11. Additive manufacturing process according to claim 10, wherein the ceramic material is introduced into the component to be manufactured as a suspension with a polymer-forming component and a polymerization initiator.

12. Additive manufacturing process according to one of claims 1 to 11, wherein the additive manufacturing process is a 3D printing process.

13. Additive manufacturing method according to one of claims 1 to 12, wherein the second material is a material which can be removed by heat treatment and from this a second volume region of the component is formed, and wherein the first material is a material which is resistant to the heat treatment. material and a first volume region is formed from the first material, which at least partially encloses the second volume region.

14. Additive manufacturing method according to claim 13, wherein a heat treatment is carried out to form an empty space which is completely or partially enclosed by the resistant material of the first volume region. 15 . Method for the holistic design of a component, whereby the component is designed in the arrangement of its components or units according to their functionality or the application of the component.

16. Method according to claim 15, wherein the component has a first unit and a second unit, wherein the first unit and the second unit each contribute functionally and / or structurally to the functionality or structure of the component, wherein the positioning of the first unit and the second unit is selected mainly or exclusively with regard to application specifications.

17. Method according to claim 16, wherein the first unit and the second unit are arranged in the component such that connecting means between the two units have the geometrically shortest possible distance.

18. A method according to claim 16 or 17, wherein the second unit is arranged around the first unit in such a way that passive spaces which do not serve a function or are necessary for the production of the structural component specifications are reduced or completely avoided.

19. Method according to one of claims 16 to 18, wherein the first unit and / or the second unit is / are not designed as a separately prefabricated component which is designed for a modular system, but is / are designed within the method in form and arrangement mainly or exclusively according to functional aspects relative to further functional or structural elements in its dimensions or in the arrangement within the component.

20. Method according to one of claims 16 to 19, wherein the first unit and / or the second unit are formed with or from 3D-printed ceramics.

21. Method according to one of claims 16 to 20, wherein the first unit forms a first plane and the second unit forms a second plane which is arranged tilted to the first plane.

22. Method according to one of claims 16 to 21, wherein the component has third, fourth or further units.

23. Method according to one of claims 1 to 22, wherein the tightness of the component or a macroscopic volume region of the component is adjusted via the selection of the composition of starting materials and / or process parameters during the production of an additively manufactured green body and / or the process parameters of a sintering process. 24 . Component for microfluidics, comprising an inlet which is suitable for supplying a fluid to a functional unit, the functional unit directly or indirectly connected to the inflow , an outflow directly or indirectly connected to the functional unit and suitable for carrying the fluid away from the functional unit .

25. Component according to claim 24, wherein the inflow and / or outflow have a rounded or rounded cross-section perpendicular to the intended flow direction of the fluid.

26. Component according to claim 24 or 25, wherein the functional unit has a space which has at least two mutually parallel boundary surfaces.

27. Component according to claim 26, wherein a first electrode and a second electrode are formed parallel to the parallel boundary surfaces within the functional unit.

28. Component according to claim 24 or 25, wherein the functional unit has a space having a shape designed to promote the formation of a turbulent flow in the microfluid, and wherein, in comparison, the shape of the inflow and / or the outflow is designed to promote a laminar flow.

29. Component according to one of claims 24, 25 or 28, wherein a region with a rough or porous surface is formed in the functional unit and / or a region with catalytic properties, with dyes, with photosensitizers, with reagents, with indicators or with sensor materials is formed.

30. Component according to one of claims 24 to 29, wherein an ultrasonic generating device is formed as part of or in the vicinity of the functional unit in such a way that it is possible to generate ultrasonic vibrations in a fluid in the functional unit by means of the ultrasonic generating device.

31. Component according to one of claims 24 to 30, wherein a pump is arranged in or on the inlet, the outlet or the functional unit such that it can pump a fluid through the system.

32. Component according to one of claims 24 to 31, wherein electrodes for measuring the conductivity are arranged at several points of the fluid channel.

33. Component according to one of claims 24 to 32, wherein a pressure measuring device is formed as part of or in the vicinity of the functional unit and is designed to detect the pressure of the fluid or a variable derivable from the pressure measurement.

34. Component according to one of claims 24 to 33, wherein a heating element is formed as part of or in the vicinity of the fluid channel or a part of the fluid channel.

35. Component according to one of claims 24 to 34, wherein a temperature sensor element is formed as part of or in the vicinity of the functional unit, the inflow or the outflow.

36. Component according to one of claims 24 to 35, wherein a fluid guide and a second fluid guide are formed therein. 37 . Component according to claim 36 , wherein the first fluid guide and a second fluid guide are designed to convey two fluidically separated fluids in a Microfluidic components to be placed next to each other.

38. Component according to claim 36 or 37, wherein the first fluid guide and a second fluid guide extend relative to one another at least in a partial region in the component such that fluids guided in each of them are in thermal contact.

39. Component according to claim 36, wherein the first fluid guide and a second fluid guide are guided to one another at least in a partial region in the component such that a material exchange can take place between the first fluid and the second fluid.

40. Component according to claim 39, wherein a semipermeable membrane is formed in the partial region.

41. Component according to claim 39 or 40, wherein catalytic and / or filtering properties are formed in the partial region. 42 . Component according to one of claims 24 to 41, which has several or further functional units and / or combinations of several or further of the aforementioned functional units.

43. Microheater having an electrical resistance heating function embedded in a ceramic body.

44. Micro heater according to claim 43, wherein 3D-printed internal electrodes are arranged within the 3D-printed ceramic body and the internal electrodes form a heating coil as a resistance heating function in a region of the ceramic body.

45. Microheater according to claim 44, in the region of the ceramic body or on a surface of the region of the ceramic body a reserve for heating or evaporating a liquid is formed.

46. ​​Microheater according to claim 43, which is designed and arranged to be used in the human and / or veterinary medical field.

47. Micro heater according to claim 43, which is designed as a flow-through heater and has a flow area which is designed to have a fluid passed through it, wherein a first conductor as an electrical resistance heating function at least partially encloses the flow area in a plane perpendicular to the flow direction.

48. Microheater according to claim 46, wherein a second conductor is formed as a second resistance heating function offset in the flow direction from the first conductor, so that two successive heating levels are formed in the flow direction.

49. Microheater according to claim 47 or 48, wherein flow-guiding or flow-changing components are formed in or adjacent to the flow-through region in addition to outer walls of the flow-through region.

50. Micro heater according to claim 43, designed as a flow heater and comprising a fluid guide, wherein the resistance heating function is designed as a conductor and a section of the conductor follows the fluid guide such that this section of the conductor extends along the intended flow direction of the fluid.

51. Micro heater according to claim 50, wherein the fluid guide has a bend which is suitable for changing the intended flow direction of the fluid between a region before the bend and a region after the bend, wherein a second section of the conductor extends along the flow direction changed in this region of the fluid guide.

52. Micro heater according to claim 50, wherein the fluid guide has a first bend and this bend defines a first plane, a second bend which is oriented in a plane perpendicular to the first plane, and a third bend which defines a second plane which extends parallel but offset to the first plane, and wherein one or more sections of the conductor are arranged in an intermediate plane parallel to the first plane which is located between the first and second planes.

53. Micro heater according to one of claims 43 to 52, which has a temperature sensor. 54 . Additively manufactured thermal sensor comprising a thermistor component which contains a thermistor material and can be contacted via electrodes or electrical contacts. 55 . 3D-printed transformer comprising at least two electrically conductive layers separated from each other by a dielectric ceramic layer .

56. 3D-printed transformer according to claim 55, comprising a ferrite ceramic and a second ceramic arranged above a surface of the ferrite ceramic, wherein electrical structures are embedded in the second ceramic such that a part of the second ceramic is arranged between two electrical layers of the electrical structures such that this part of the second ceramic serves as a dielectric between the electrical structures.

57. 3D-printed transformer according to claim 56, wherein a third ceramic is arranged as an adhesion promoter between the ferrite ceramic and the second ceramic.

58. 3D-printed transformer according to one of claims 55 to 57, wherein a ferrite core is arranged within the coil formed by one or more electrical layers, wherein the ferrite core is a separate component or can be formed together with the other components by 3D printing. 59 . Monolithic , fully 3D-printed package , which has another structural or functional unit within the package .

60. Package according to claim 59, wherein the further structural or functional unit is realized by 3D printing.

61. A package according to claim 59 or 60, comprising a flat unit forming a main plane.

62. Package according to claim 61, wherein the further structural or functional unit has a surface defining a plane oriented tilted to the main plane.

63. Package according to one of claims 59 to 62, wherein shielding elements are formed therein.

64. A fully 3D-printed RF module comprising a ceramic body and an electrically functional component, wherein the electrically functional component is embedded in the ceramic body of the RF module.

65. The RF module of claim 64, wherein the ceramic body comprises an LTCC or HTCC forming ceramic material.

66. RF module according to claim 64 or 65, wherein an electrically functional component comprises a ceramic that is different from the ceramic of the ceramic body.

67. RF module according to one of claims 64 to 66, wherein the electrically functional component is an inductor coil comprising a ferrite ceramic material, a capacitor comprising a dielectric different from the ceramic material of the ceramic body, an ESD protection component comprising a varistor ceramic, or an NTC sensor comprising an NTC ceramic.

68. RF module according to one of claims 64 to 67, which is designed as a ceramic circuit board. 69 . Additively manufactured or 3D-printed component that is free of internal joints .

70. Additively manufactured or 3D-printed component according to claim 69, which has two or more material regions.

71. Additively manufactured or 3D-printed component according to claim 70, wherein the material regions are three-dimensionally interlocked.

72. Additively manufactured or 3D-printed component according to one of claims 69 to 71, wherein open or closed cavities are realized in the component.

73. Additively manufactured or 3D-printed component according to one of claims 69 to 72, wherein the component is manufactured with 3D-printed ceramics.

74. Additively manufactured or 3D-printed component according to one of claims 69 to 73, wherein the component has 3D-printed metal regions. 75 . Use of an additive manufacturing process to produce a holistically designed component according to one of claims 24 to 74. 76 . Method according to one of claims 1 to 23 , wherein an at least partially non-additively produced or separately strengthened increment is incorporated into the resulting green body of a component or into the component during additive manufacturing process.

77. Method according to one of claims 1 to 23 or 76, during the additive manufacturing measures for the mechanical stabilization and / or solidification of an additively manufactured component or a green compact of the component are carried out.

78. Method according to claim 77, wherein the material thickness of a partial area of ​​the component to be additively manufactured is designed in such a way that it is greater than would be necessary for the stability of the partial section in the finished component.

79. Method according to claim 77 or 78, wherein a component or a portion of a component is subjected to additional post-hardening after additive manufacturing has taken place.

80. Method according to claim 79, wherein the post-curing is carried out in that the first and / or second material contains a polymer and this polymer contains further crosslinkers, and these cure slowly over time compared to additive manufacturing, and / or that the first and / or second material contains additional thermal initiators and wherein residual monomers still present after additive manufacturing are polymerized by heating the component, and / or that the first and / or second material contains additional thermal initiators and wherein residual monomers still present after additive manufacturing are polymerized by heating the component, compared to a temperature during additive manufacturing used irradiation intensive irradiation are polymerized.

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