Power conversion apparatus

Abstract

The present application provides a power conversion apparatus. The power conversion apparatus comprises a shell, a heat dissipation substrate, a circuit board, power modules, and a vapor chamber; the shell comprises an accommodating cavity; a mounting hole is formed in the accommodating cavity, and the mounting hole is communicated with the accommodating cavity; the heat dissipation substrate is accommodated in the mounting hole and seals the accommodating cavity, and in a first direction, the side of the heat dissipation substrate facing away from the accommodating cavity is provided with a plurality of cooling fins; the circuit board is accommodated in the accommodating cavity; the power modules are arranged between the circuit board and the heat dissipation substrate; each power module comprises mounting portions and a matching portion; in the first direction, the mounting portions are arranged on one side of the matching portion, the mounting portions are arranged on the circuit board, and the matching portion is in contact with the heat dissipation substrate; in the first direction, the vapor chamber is in heat conduction connection with the plurality of cooling fins, and the vapor chamber is arranged on one side of the plurality of cooling fins and faces away from the heat dissipation substrate. The vapor chamber can enable the temperature of the plurality of cooling fins to be equal and reduce the temperature difference between the plurality of cooling fins, thereby improving the overall heat dissipation efficiency of the plurality of cooling fins.

Description

Power conversion equipment

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on March 19, 2024, with application number 202420558858.9 and application name “Power Conversion Device,” the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of electronic technology, and in particular to a power conversion device. Background Art

[0003] In existing power conversion devices, heat generated by the power module during operation is transferred via a heat sink substrate to the heat sink fins. The heat sink fins then transfer the heat to the external environment through natural convection, dissipating heat from the power module. However, the efficiency of the heat sink fins in transferring heat to the external environment through natural convection is low, resulting in low heat dissipation efficiency for the power module. Summary of the Invention

[0004] The present application provides a power conversion device. In the power conversion device provided by the present application, the overall heat dissipation efficiency of multiple heat dissipation fins is effectively improved, and the heat dissipation efficiency of the power module is greatly improved.

[0005] An embodiment of the present application provides a power conversion device. The power conversion device includes a housing, a heat dissipation substrate, a circuit board, a power module and a heat spreader. The housing includes a receiving cavity, the receiving cavity is provided with a mounting hole, and the mounting hole is connected to the receiving cavity. The heat dissipation substrate is received in the mounting hole and closes the receiving cavity. In a first direction, a plurality of heat dissipation fins are provided on the side of the heat dissipation substrate facing away from the receiving cavity. The circuit board is received in the receiving cavity. The power module is arranged between the circuit board and the heat dissipation substrate. The power module includes a mounting portion and a mating portion. In the first direction, the mounting portion is arranged on one side of the mating portion, the mounting portion is arranged on the circuit board, and the mating portion is in contact with the heat dissipation substrate. In the first direction, the heat spreader is thermally connected to the plurality of heat dissipation fins. The heat spreader is arranged on one side of the plurality of heat dissipation fins and facing away from the heat dissipation substrate. The first direction is the thickness direction of the heat spreader.

[0006] In the power conversion device provided in the present application, most of the heat generated by the power module during operation is transferred to the temperature equalizer through a part of the heat dissipation fins. Part of the heat transferred to the temperature equalizer is transferred to the external environment, and the other part is transferred back to another part of the heat dissipation fins and then transferred to the external environment, thereby achieving rapid heat dissipation of the power module.

[0007] Compared to existing solutions in which heat transferred from a power module to the heat sink is transferred to the external environment via air convection, the heat generated by the power module of the power conversion device provided in this application is largely dissipated through a portion of the heat sink fins via a heat spreader, and then transferred back to another portion of the heat sink fins via the heat spreader. The heat spreader can evenly distribute the temperature of multiple heat sink fins and reduce the temperature difference between the multiple heat sink fins. Without changing the size of the heat sink fins, the overall heat dissipation efficiency of the multiple heat sink fins is effectively improved, significantly enhancing the ability to naturally dissipate heat from the power module. Furthermore, the heat generated by the power module can also be transferred to the external environment via the heat spreader through the multiple heat sink fins, greatly improving the heat dissipation efficiency of the power module.

[0008] In a possible embodiment, a closed channel is provided in the temperature homogenizing plate, and the closed channel is used for allowing fluid to flow, so as to equalize the temperature of the plurality of heat dissipating fins and reduce the temperature difference between the plurality of heat dissipating fins.

[0009] Most of the heat generated by the power module during operation is transferred to the temperature equalizer through a portion of the heat sink fins, and then transferred from the temperature equalizer to the closed channel. The fluid in the closed channel absorbs heat and evaporates on the side close to the heat sink fins, and releases heat and condenses on the side away from the heat sink fins. The fluid undergoes a gas-liquid phase change in the closed channel. The heat released by the condensation of the gaseous fluid in the closed channel is transferred from the temperature equalizer to the external environment. In this process, the fluid circulates along the extension direction of the closed channel through the capillary force of the flow channel or the change of the pressure difference in the flow channel. A small temperature difference is achieved at various parts of the temperature equalizer to achieve a uniform temperature state. The heat released by the condensation of the gaseous fluid in the closed channel can also be quickly transferred in the temperature equalizer, and then transferred from the temperature equalizer back to another part of the heat sink and then to the external environment.

[0010] Through the circulation of fluid in the closed channel and the gas-liquid phase change of the fluid in the closed channel, most of the heat generated by the power module of the power conversion device provided by the present application during operation is quickly dissipated through the heat of a part of the heat dissipating fins through the temperature equalizer, and then transferred back to the other part of the heat dissipating fins through the temperature equalizer. Without changing the size of the heat dissipating fins, the overall heat dissipation efficiency of multiple heat dissipating fins is effectively improved, and the ability to naturally dissipate heat for the power module is greatly improved; moreover, the heat generated by the power module can also be transferred to the external environment through the temperature equalizer via multiple heat dissipating fins, greatly improving the heat dissipation efficiency of the power module.

[0011] In one possible embodiment, multiple heat sinks are located between a heat sink substrate and a heat spreader to evenly distribute the temperature of the multiple heat sinks in a second direction, where the second direction is perpendicular to the first direction. Multiple air flow channels are formed between the heat sink substrate, the multiple heat sinks, and the heat spreader, and the multiple air flow channels are arranged at intervals.

[0012] Most of the heat generated by the power module during operation is transferred to the vapor chamber through a portion of the heat sink fins. This heat is then transferred through the vapor chamber in a second direction to another portion of the heat sink fins surrounding this portion, thereby achieving uniform temperature distribution across all the heat sinks. The airflow channel allows cool air to flow through. This cool air removes heat from the heat sink fins, thereby dissipating heat from the power module.

[0013] In one possible embodiment, the multiple heat sinks include a first heat sink and a second heat sink, the second heat sink is spaced apart from the first heat sink, the projection of the first heat sink in the first direction overlaps with the projection of the power module in the first direction, and the projection of the second heat sink in the first direction is spaced apart from the projection of the power module in the first direction.

[0014] Because the projection of the first heat sink in the first direction overlaps with the projection of the power module in the first direction, and the projection of the second heat sink in the first direction is spaced apart from the projection of the power module in the first direction, the majority of the heat generated by the power module during operation is transferred to the vapor chamber via the first heat sink, with a smaller portion being transferred to the external environment via the second heat sink. Through the circulation of the fluid within the closed channel and the gas-liquid phase transition of the fluid within the closed channel, the heat transferred from the first heat sink to the vapor chamber can be transferred back to the second heat sink through the vapor chamber, thereby improving the heat dissipation efficiency of the second heat sink, and thus the overall heat dissipation efficiency of the multiple heat sinks, significantly enhancing the ability to naturally dissipate heat from the power module.

[0015] In a possible implementation manner, a projection of the closed channel in the first direction is spaced apart from a projection of the plurality of heat dissipating fins in the first direction.

[0016] Since the strength of the temperature equalizing plate in the portion corresponding to the closed channel is relatively low, the design in which the projection of the closed channel in the first direction and the projection of the plurality of heat fins in the first direction are spaced apart is conducive to improving the connection strength between the temperature equalizing plate and the heat fins, and is conducive to improving the structural stability of the power conversion equipment; moreover, on the basis of ensuring the connection strength between the temperature equalizing plate and the heat fins, it is conducive to reducing the size of the temperature equalizing plate in the first direction (i.e., the thickness of the temperature equalizing plate), which is conducive to the miniaturization and lightweight design of the temperature equalizing plate.

[0017] In a possible implementation manner, a projection of the closed channel in the first direction surrounds projections of the plurality of heat dissipating fins in the first direction.

[0018] The design in which the projection of the enclosed channel in the first direction encompasses the projections of the plurality of heat sinks in the first direction ensures that heat transferred from the power module to the vapor chamber via a portion of the heat sink fins can be transferred to the enclosed channel in all directions. This improves the efficiency of heat generated by the power module during operation being transferred to the enclosed channel via a portion of the heat sink fins, improves the efficiency of heat dissipation from the fluid in the enclosed channel to the portion of the heat sink fins, and improves the heat dissipation efficiency of the power module. Furthermore, this improves the efficiency of heat released by condensation of the gaseous fluid in the enclosed channel being transferred from the vapor chamber back to the remaining portion of the heat sink fins, thereby improving the overall heat dissipation efficiency of the plurality of heat sinks and the heat dissipation efficiency of the power module.

[0019] In one possible embodiment, the closed channel includes a bending section and a connecting section, the bending section includes a plurality of receiving openings, and the plurality of receiving openings are arranged at intervals along the second direction. In the third direction, the connecting section is located on one side of the bending section and is connected to the bending section. The connecting section closes the plurality of receiving openings, and the first direction, the second direction and the third direction are perpendicular to each other; the projections of the plurality of heat dissipating fins in the first direction are located one by one within the projections of the plurality of receiving openings in the first direction.

[0020] The design, in which the projections of the multiple heat sinks in the first direction correspond one-to-one within the projections of the multiple receiving openings in the first direction, ensures that the heat transferred from the power module to the temperature vapor chamber via a portion of the heat sink fins can be transferred to the enclosed channel in all directions. This improves the efficiency of heat generated by the power module during operation being transferred to the enclosed channel via a portion of the heat sink fins, improves the efficiency of heat dissipation from the fluid in the enclosed channel to the portion of the heat sink fins, and improves the heat dissipation efficiency of the power module. Furthermore, it improves the efficiency of heat released by condensation of the gaseous fluid in the enclosed channel being transferred from the temperature vapor chamber back to the other portion of the heat sink fins, improves the overall heat dissipation efficiency of the multiple heat sinks, and improves the heat dissipation efficiency of the power module. Furthermore, the design is simple and low-cost, which helps reduce processing costs.

[0021] In a possible implementation, a guide section is provided in the temperature homogenizing plate, the guide section is connected to the closed channel, and the guide section is used to limit the unidirectional flow of the fluid.

[0022] The design of the guide section ensures that the fluid in the closed channel circulates in one direction along the closed channel, which is beneficial to improving the efficiency of the fluid circulation, and is beneficial to improving the efficiency of the heat transferred from the power module to the temperature equalizing plate through a part of the heat dissipation fins and transferred back to another part of the heat dissipation fins through the fluid in the closed channel, which is beneficial to improving the overall heat dissipation efficiency of multiple heat dissipation fins and the heat dissipation efficiency of the power module.

[0023] In one possible embodiment, the guide section includes a first guide sub-segment and a second guide sub-segment, one end of the second guide sub-segment is connected to one end of the first guide sub-segment, the second guide sub-segment is bent relative to the first guide sub-segment, one end of the first guide sub-segment facing away from the second guide sub-segment is connected to the closed channel, the first guide sub-segment is inclined relative to the extension direction of the closed channel, and the end of the second guide sub-segment facing away from the first guide sub-segment is connected to the closed channel.

[0024] Part of the fluid in the closed channel flows along the extension direction of the closed channel, and the other part flows from the closed channel into the guide section and then flows back from the guide section to the closed channel. When the fluid in the closed channel flows back from the closed channel through the second guide sub-segment and the first guide sub-segment in sequence to the closed channel, the fluid flowing back from the first guide sub-segment to the closed channel will not hinder the fluid flowing in the closed channel. However, when the fluid in the closed channel flows back from the closed channel through the first guide sub-segment and the second guide sub-segment in sequence to the closed channel, the fluid flowing back from the second guide sub-segment to the closed channel will hinder the fluid flowing in the closed channel. Therefore, the design of the first guide sub-segment and the second guide sub-segment can limit the one-way flow of the fluid in the closed channel. In this way, not only is the structure simple and easy to design, but the processing cost is also low, which is conducive to reducing the processing cost of the temperature dispersion plate and the processing cost of the power conversion equipment.

[0025] In a possible implementation, a protrusion is provided on the surface of the temperature homogenizing plate, a projection of the protrusion in the first direction overlaps with a projection of the closed channel in the first direction, and the protrusion is spaced apart from the heat dissipation fins.

[0026] The raised design helps improve the strength of the vapor chamber in the area corresponding to the enclosed channel, thereby improving the structural stability of the vapor chamber and, consequently, the power conversion device. Furthermore, the raised design serves as a guide to the enclosed channel, facilitating the positioning of the heat sink fins within the enclosed channel, thereby facilitating assembly of the vapor chamber and the heat sink fins. This reduces the difficulty of assembly and reduces the processing cost of the power conversion device.

[0027] In a possible implementation, a plurality of grooves are provided on the surface of the temperature homogenizing plate, the plurality of grooves are spaced apart from the closed channels, and the heat dissipating fins are snapped into the plurality of grooves in a one-to-one correspondence.

[0028] The groove design improves the installation accuracy and strength of the vapor chamber and heat sink fins, thereby enhancing the structural stability of the power conversion device. Furthermore, the groove serves as a positioning mechanism, facilitating assembly of the vapor chamber and heat sink fins, reducing the assembly difficulty and the processing cost of the power conversion device.

[0029] In a possible implementation, the temperature homogenizing plate is provided with a first through hole, the first through hole passes through the temperature homogenizing plate along a first direction, and the first through hole is spaced apart from the closed channel.

[0030] The design of the first through hole ensures that cold air from the external environment can flow from the side of the temperature homogenizer facing away from the heat sink through the first through hole to the heat sink, which is beneficial to improving the heat dissipation efficiency of the heat sink and further to improving the heat dissipation efficiency of the power module.

[0031] In a possible implementation, the temperature homogenizing plate is provided with a first heat conducting fin, which is arranged on a hole wall of the first through hole, and the first heat conducting fin is arranged obliquely relative to a cross section of the first through hole.

[0032] The design of the first heat-conducting fin is beneficial to increasing the contact area between the temperature vapor chamber and the cold air, which is beneficial to increasing the amount of heat transferred from the power module to the external environment through the heat dissipation fins and the temperature vapor chamber, which is beneficial to improving the efficiency of heat dissipation of the power module through the heat dissipation fins and the temperature vapor chamber, and which is beneficial to improving the heat dissipation efficiency of the power module.

[0033] In one possible embodiment, the power conversion device includes a fan, which is arranged in the shell and located outside the receiving cavity. In the third direction, the fan is located on one side of the multiple heat dissipation fins and is spaced apart from the multiple heat dissipation fins. The projection of the fan in the third direction overlaps with the projection of the multiple heat dissipation fins in the third direction, and the third direction is perpendicular to the first direction.

[0034] The fan can blow out cooling air, which can pass through multiple heat sinks and remove heat from the multiple heat sinks, thereby dissipating heat for the multiple heat sinks. The fan design is conducive to improving the heat dissipation efficiency of the multiple heat sinks, and thus helps improve the heat dissipation efficiency of the power module.

[0035] In one possible embodiment, the temperature vapor chamber includes a main body and a heat-conducting part. In a first direction, the heat-conducting part is arranged on one side of the main body, and the main body is arranged on one side of the multiple heat dissipating fins and faces away from the heat dissipating substrate, and the heat-conducting part faces the heat dissipating substrate. In a second direction, the heat-conducting part is located on one side of the multiple heat dissipating fins and is spaced apart from the multiple heat dissipating fins. The second direction is perpendicular to the first direction, and closed channels are arranged in the main body and the heat-conducting part.

[0036] The heat conducting part is arranged on one side of the main body, the main body is arranged on one side of the multiple heat dissipating fins and faces away from the heat dissipation substrate, the heat conducting part faces the heat dissipation substrate, and the closed channel is arranged in the main body and the heat conducting part. This design ensures that the temperature averaging plate has a large contact area with the cold air of the external environment, is conducive to improving the space utilization of the temperature averaging plate, is conducive to the miniaturized design of the temperature averaging plate, and is conducive to the miniaturized design of the power conversion equipment.

[0037] In a possible implementation, the heat conducting portion is provided with a second through hole, the second through hole passes through the heat conducting portion along the second direction, and the second through hole is spaced apart from the closed channel.

[0038] The design of the second through hole ensures that cold air from the external environment can flow from the side of the heat conducting portion facing away from the heat dissipating fins through the second through hole to the heat dissipating fins, which is beneficial to improving the heat dissipation efficiency of the heat dissipating fins and further beneficial to improving the heat dissipation efficiency of the power module.

[0039] In a possible implementation, the heat conducting portion is provided with a second heat conducting fin, the second heat conducting fin is arranged on the hole wall of the second through hole, and the second heat conducting fin is arranged obliquely relative to the cross section of the second through hole.

[0040] The design of the second heat-conducting fin is beneficial to increasing the contact area between the heat-conducting part and the cold air, which is beneficial to increasing the amount of heat transferred from the power module to the external environment through the heat-dissipating fins and the temperature vapor chamber, which is beneficial to improving the efficiency of heat dissipation of the power module through the heat-dissipating fins and the temperature vapor chamber, and which is beneficial to improving the heat dissipation efficiency of the power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0042] FIG1 is a block diagram of the structure of the power conversion device provided by an embodiment of the present application in cooperation with a photovoltaic module and a power grid;

[0043] FIG2 is a schematic diagram of the three-dimensional structure of the power conversion device shown in FIG1 ;

[0044] FIG3 is a schematic diagram of an exploded perspective view of the power conversion device shown in FIG2 ;

[0045] FIG4 is a schematic structural diagram of the power conversion device shown in FIG2 taken along line AA;

[0046] FIG5 is a schematic exploded perspective view of the three-dimensional structure of the heating element of the power conversion device shown in FIG2 ;

[0047] FIG6 is a schematic structural diagram of the power conversion device shown in FIG4 from another angle;

[0048] FIG7 is a schematic diagram of a portion of the structure of the power conversion device shown in FIG6 taken along line BB;

[0049] FIG8 is a schematic structural diagram of the temperature distribution board of the power conversion device shown in FIG6 at another angle;

[0050] FIG9 is an enlarged view of a portion IX of the power conversion device shown in FIG6;

[0051] 10 is a schematic diagram of a partial structure of the power conversion device shown in FIG6 taken along line BB under another embodiment;

[0052] 11 is a schematic diagram of a partial structure of the power conversion device shown in FIG6 taken along line BB under another embodiment;

[0053] FIG12 is a schematic diagram of a partial structure of the power conversion device shown in FIG6 taken along line BB under another embodiment;

[0054] 13 is a schematic diagram of a partial structure of the power conversion device shown in FIG6 taken along line BB under another embodiment;

[0055] FIG14 is a schematic diagram of a partial structure of the power conversion device shown in FIG6 taken along line BB in another embodiment;

[0056] FIG15 is a schematic structural diagram of the power conversion device shown in FIG6 under another embodiment;

[0057] FIG16 is an enlarged view of a portion XVI of the power conversion device shown in FIG15 ;

[0058] FIG17 is a schematic diagram of the three-dimensional structure of the power conversion device shown in FIG2 under another embodiment;

[0059] FIG18 is an enlarged view of a portion XVIII of the power conversion device shown in FIG17;

[0060] FIG19 is a schematic diagram of the three-dimensional structure of the power conversion device shown in FIG17 under another embodiment;

[0061] FIG20 is an enlarged view of the XX portion of the power conversion device shown in FIG19;

[0062] FIG21 is a schematic structural diagram of the power conversion device shown in FIG2 cut along line AA in another embodiment. DETAILED DESCRIPTION

[0063] The embodiments of the present application provide a power conversion device. In the power conversion device provided by the present application, through the circulation of the fluid in the closed channel of the temperature equalizer plate and the gas-liquid two-phase change of the fluid in the closed channel, most of the heat generated by the heating element can be quickly dispersed through the temperature equalizer plate through a portion of the heat dissipation fins, and then transferred back to the other portion of the heat dissipation fins through the temperature equalizer plate. Without changing the size of the heat dissipation fins, the overall heat dissipation efficiency of the multiple heat dissipation fins is effectively improved, and the ability to naturally dissipate heat from the heating element is greatly improved. Moreover, the heat generated by the heating element can also be transferred to the external environment through the temperature equalizer plate, greatly improving the heat dissipation efficiency of the heating element.

[0064] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0065] Please refer to Figures 1, 2, and 3. Figure 1 is a block diagram of the structure of a power conversion device 100, a photovoltaic module 200, and a power grid 300 according to an embodiment of the present application. Figure 2 is a schematic diagram of the three-dimensional structure of the power conversion device 100 shown in Figure 1. Figure 3 is a schematic diagram of the three-dimensional structure of the power conversion device 100 shown in Figure 2. It should be noted that the features indicated by the dashed lines in Figures 2 and 3 indicate closed channels 25.

[0066] Exemplarily, the power conversion device 100 is a photovoltaic inverter. In some other embodiments, the power conversion device 100 may also be an electronic device for power conversion, such as a rectifier, transformer, converter, or other inverter. The power conversion device 100 is used to convert the direct current output by the photovoltaic module 200 into alternating current and supply it to the power grid 300. In some other embodiments, the power conversion device 100 may also be used to convert the direct current output by the photovoltaic module 200 into alternating current and supply it to a load device. The load device may be an electronic device that uses alternating current, including but not limited to a motor, a fan, or an air conditioner. In some other embodiments, the power conversion device 100 may also be applied to an electric drive controller. For example, the power conversion device 100 may convert the direct current output by the battery into alternating current to supply the motor.

[0067] The power conversion device 100 includes a heating element 10 and a temperature-vaporizing plate 20. The temperature-vaporizing plate 20 is disposed on one side of the heating element 10 in the Z-axis direction. The heating element 10 is used to convert the direct current output by the photovoltaic module 200 into alternating current and supply it to the power grid 300. The temperature-vaporizing plate 20 is used to dissipate heat from the heating element 10. In this application, the Z-axis direction shown in the figure is defined as the first direction, the X-axis direction shown in the figure is defined as the second direction, and the Y-axis direction shown in the figure is defined as the third direction. The first direction, the second direction, and the third direction are perpendicular to each other.

[0068] Exemplarily, the temperature averaging plate 20 is a rectangular plate. In some other embodiments, the temperature averaging plate 20 may also be a circular plate, a triangular plate, or other special-shaped plates. In this embodiment, the Z-axis direction (i.e., the first direction) shown in the figure is the thickness direction of the temperature averaging plate 20, the X-axis direction (i.e., the second direction) shown in the figure is the length direction of the temperature averaging plate 20, and the Y-axis direction (i.e., the third direction) shown in the figure is the width direction of the temperature averaging plate 20. In some other embodiments, the X-axis direction (i.e., the second direction) shown in the figure may also be the width direction of the temperature averaging plate 20, and the Y-axis direction (i.e., the third direction) shown in the figure may also be the length direction of the temperature averaging plate 20.

[0069] 4 and 5 , in conjunction with FIG1 , FIG4 is a schematic structural diagram of the power conversion device 100 shown in FIG2 taken along line AA. FIG5 is a schematic exploded perspective view of the heating element 10 of the power conversion device 100 shown in FIG2 .

[0070] As shown in Figures 1, 4, and 5, in some embodiments, the heating element 10 includes a housing 11, a heat sink 12, a circuit board 13, and a power module 14. In other words, the power conversion device 100 includes the housing 11, the heat sink 12, the circuit board 13, and the power module 14. The heat sink 12 is partially disposed within the housing 11 and partially located outside the housing 11. In the Z-axis direction (i.e., the first direction), the circuit board 13 is disposed on one side of the heat sink 12, and the power module 14 is disposed between the circuit board 13 and the heat sink 12. The circuit board 13 and the power module 14 are housed in the housing 11. The direct current output by the photovoltaic module 200 is transmitted to the power module 14 via the circuit board 13. The power module 14 is configured to convert the direct current output by the photovoltaic module 200 into alternating current. The alternating current output by the power module 14 is transmitted to the power grid 300 via the circuit board 13 for supply to the power grid 300. During operation, the heat generated by the power module 14 is transferred to the exterior of the heating element 10 via the circuit board 13 and the heat sink 12. The design of the housing 11 can protect the power module 14 and the circuit board 13, preventing the power module 14 and the circuit board 13 from being damaged by the external environment, thereby improving the safety of the power module 14 and the circuit board 13 and extending the service life of the power module 14 and the circuit board 13.

[0071] As shown in Figures 4 and 5, the shell 11 is illustratively a rectangular box. In other embodiments, the shell 11 may also be a triangular box, a sphere, or other special-shaped body. The shell 11 includes a receiving cavity 111. Specifically, the shell 11 includes a first shell wall 112, a second shell wall 113, a third shell wall 114, and a fourth shell wall 115. In the Z-axis direction, the first shell wall 112 and the second shell wall 113 are opposite and spaced apart. There are two third shell walls 114. In the Y-axis direction, the two third shell walls 114 are opposite and spaced apart. The two third shell walls 114 are both connected to the first shell wall 112 and the second shell wall 113. There are two fourth shell walls 115. In the X-axis direction, the two fourth shell walls 115 are opposite and spaced apart. The two fourth shell walls 115 are both connected to the first shell wall 112, the second shell wall 113, and the two third shell walls 114. The first shell wall 112 , the second shell wall 113 , the two third shell walls 114 and the two fourth shell walls 115 together form the receiving chamber 111 .

[0072] The receiving cavity 111 is provided with a mounting hole 116, and the mounting hole 116 is connected to the receiving cavity 111. Specifically, the mounting hole 116 passes through the first shell wall 112 along the Z-axis direction and is connected to the receiving cavity 111. Exemplarily, the mounting hole 116 is a rectangular hole. In some other embodiments, the mounting hole 116 may also be a circular hole, a triangular hole or other special-shaped holes. Among them, the mounting hole 116 includes a first wall surface 1161 and a second wall surface 1162. The number of the first wall surfaces 1161 is two. In the X-axis direction, the two first wall surfaces 1161 are opposite and spaced apart. The number of the second wall surfaces 1162 is two. In the Y-axis direction, the two second wall surfaces 1162 are opposite and spaced apart. The two second wall surfaces 1162 are both connected between the two first wall surfaces 1161.

[0073] In some embodiments, the heat sink 12 is received in the mounting hole 116 and partially exposed outside the housing 11. The heat sink 12 is made of a thermally conductive material, including but not limited to copper or aluminum. The heat sink 12 includes a heat sink substrate 121 and a plurality of heat sink fins 122. In other words, the power conversion device 100 includes a heat sink substrate 121 and a plurality of heat sink fins 122. In the Z-axis direction, the plurality of heat sink fins 122 are disposed on one side of the heat sink substrate 121. Specifically, the plurality of heat sink fins 122 are fixedly stacked on one side of the heat sink substrate 121, and the plurality of heat sink fins 122 are fixedly stacked on the surface of the heat sink substrate 121. In other words, in the Z-axis direction (i.e., the first direction), the plurality of heat sink fins 122 are disposed on one side of the heat sink substrate 121. In the X-axis direction, the plurality of heat sink fins 122 are spaced apart. In other embodiments, the plurality of heat sink fins 122 may also be spaced apart along the Y-axis direction. The heat sink substrate 121 is received in the mounting hole 116 and encloses the receiving cavity 111. The surface of the heat dissipation substrate 121 facing away from the receiving cavity 111 is exposed to the outside of the shell 11. That is, the heat dissipation substrate 121 is received in the mounting hole 116 and is partially exposed to the outside of the shell 11. A plurality of heat dissipation fins 122 are located outside the receiving cavity 111. A plurality of heat dissipation fins 122 are located outside the shell 11. That is to say, in the Z-axis direction (i.e., the first direction), a plurality of heat dissipation fins 122 are provided on the side of the heat dissipation substrate 121 facing away from the receiving cavity 111. In some other embodiments, the heat dissipation substrate 121 may also be fixedly stacked on the side of the first shell wall 112 facing away from the second shell wall 113, and the heat dissipation substrate 121 covers the mounting hole 116 and closes the receiving cavity 111.

[0074] Exemplarily, the heat dissipation substrate 121 is a rectangular plate. In other embodiments, the heat dissipation substrate 121 may also be a circular plate, a triangular plate, or other special-shaped plate. The heat dissipation substrate 121 includes a first plate surface 1211, a second plate surface 1212, a third plate surface 1213, and a fourth plate surface 1214. In the Z-axis direction, the first plate surface 1211 and the second plate surface 1212 are spaced apart from each other. There are two third plate surfaces 1213. In the X-axis direction, the two third plate surfaces 1213 are spaced apart from each other. Both third plate surfaces 1213 are connected to the first plate surface 1211 and the second plate surface 1212. There are two fourth plate surfaces 1214. In the Y-axis direction, the two fourth plate surfaces 1214 are spaced apart from each other. Both fourth plate surfaces 1214 are connected to the first plate surface 1211, the second plate surface 1212, and the two third plate surfaces 1213. The two third plate surfaces 1213 are fixedly stacked opposite the two first wall surfaces 1161, respectively, and the two fourth plate surfaces 1214 are fixedly stacked opposite the two second wall surfaces 1162, respectively, by methods including but not limited to welding or gluing. The first plate surface 1211 faces away from the receiving cavity 111. The first plate surface 1211 is exposed outside the housing 11. The second plate surface 1212 faces the receiving cavity 111.

[0075] Exemplarily, the number of heat dissipating fins 122 is five. In other embodiments, the number of heat dissipating fins 122 may be one, two, or more. The multiple heat dissipating fins 122 include a first heat dissipating fin 122a and a second heat dissipating fin 122b. The number of first heat dissipating fins 122a is one. The number of second heat dissipating fins 122b is four. In the X-axis direction, two second heat dissipating fins 122b, the first heat dissipating fin 122a, and the other two second heat dissipating fins 122b are spaced apart in sequence. That is, the second heat dissipating fins 122b are spaced apart from the first heat dissipating fins 122a. In other embodiments, the number of first heat dissipating fins 122a and second heat dissipating fins 122b may be one, two, or more. The first heat dissipating fins 122a and second heat dissipating fins 122b may be arranged arbitrarily in the X-axis direction.

[0076] Exemplarily, the heat sink 122 is a rectangular plate. In other embodiments, the heat sink 122 may also be a circular plate, a triangular plate, or another special-shaped plate. The heat sink 122 is fixedly stacked on the first surface 1211 of the heat sink substrate 121 and faces away from the second surface 1212. The heat sink 122 includes a first fixing surface 1221, a second fixing surface 1222, a third fixing surface 1223, and a fourth fixing surface 1224. In the Z-axis direction, the first fixing surface 1221 and the second fixing surface 1222 are spaced apart from each other. There are two third fixing surfaces 1223. In the X-axis direction, the two third fixing surfaces 1223 are spaced apart from each other. Both third fixing surfaces 1223 are connected to the first fixing surface 1221 and the second fixing surface 1222. There are two fourth fixing surfaces 1224. In the Y-axis direction, the two fourth fixing surfaces 1224 are spaced apart from each other. The two fourth fixing surfaces 1224 are connected to the first fixing surface 1221, the second fixing surface 1222 and the two third fixing surfaces 1223. The first fixing surface 1221 faces away from the first plate surface 1211. The second fixing surface 1222 faces the first plate surface 1211 and is fixedly stacked.

[0077] Exemplarily, the circuit board 13 is a rectangular circuit board. In some other embodiments, the circuit board 13 may also be a circular circuit board, a triangular circuit board or other special-shaped circuit boards. The circuit board 13 is accommodated in the accommodating cavity 111. Specifically, the circuit board 13 is fixedly connected to the two fourth shell walls 115 by means including but not limited to welding, gluing or clamping. In the Z-axis direction, the circuit board 13 is located on one side of the heat dissipation substrate 121 and faces away from the multiple heat dissipation fins 122. The circuit board 13 is located on the second board surface 1212 and faces away from the first board surface 1211. The circuit board 13 is spaced apart from the heat dissipation substrate 121.

[0078] Exemplarily, the power module 14 may be an electronic device including but not limited to an IGBT (Insulated Gate Bipolar Transistor) chip, an FRD (Fast Recovery Diode) chip or a MOSFET (Metal oxide semiconductor field-effect transistor) chip. The power module 14 is arranged between the circuit board 13 and the heat sink 12. Specifically, the power module 14 is mounted on the side of the circuit board 13 facing the heat dissipation substrate 121 and is located between the circuit board 13 and the heat dissipation substrate 121. The power module 14 is accommodated in the accommodation cavity 111. Exemplarily, the number of power modules 14 is multiple. Specifically, the number of power modules 14 is 2. In some other embodiments, the number of power modules 14 may also be 1, 3 or more. In the Y-axis direction, the multiple power modules 14 are arranged in sequence at intervals. Among them, the projections of the multiple power modules 14 in the Z-axis direction overlap with the projection of the first heat dissipation fin 122a in the Z-axis direction. In other words, the projection of the first heat dissipating fin 122a in the Z-axis direction (i.e., the first direction) overlaps with the projection of the power module 14 in the Z-axis direction (i.e., the first direction). The projections of the multiple power modules 14 in the Z-axis direction are spaced apart from the projections of the multiple second heat dissipating fins 122b in the Z-axis direction (i.e., the first direction). In other words, the projections of the second heat dissipating fin 122b in the Z-axis direction (i.e., the first direction) are spaced apart from the projections of the power modules 14 in the Z-axis direction (i.e., the first direction).

[0079] Each power module 14 includes a mounting portion 141 and a mating portion 142. That is, the power module 14 includes a mounting portion 141 and a mating portion 142. In the Z-axis direction (i.e., the first direction), the mounting portion 141 is arranged on one side of the mating portion 142. Specifically, the mounting portion 141 is fixedly stacked on one side of the mating portion 142. The mounting portion 141 is fixed to the circuit board 13 by means including but not limited to welding or gluing. The mounting portion 141 and the circuit board 13 are fixedly stacked. The mating portion 142 is in thermal contact with the heat dissipation substrate 121. In some other embodiments, the mating portion 142 may also be fixedly connected to the heat dissipation substrate 121 by means including but not limited to welding or gluing, and the mating portion 142 and the heat dissipation substrate 121 are fixedly stacked. Since the power module 14 is in contact with the heat dissipation substrate 121, the heat generated by the power module 14 during operation is transferred from the mating portion 142 to the heat dissipation substrate 121, and then transferred to the multiple heat dissipation fins 122, so as to be transferred to the external environment, thereby achieving heat dissipation of the power module 14. This helps shorten the heat dissipation path of the power module 14 and improves the heat dissipation efficiency of the power module 14 .

[0080] Please refer to Figures 6, 7, 8 and 9, and in combination with Figures 2, 3, 4 and 5, Figure 6 is a structural schematic diagram of the power conversion device 100 shown in Figure 4 at another angle. Figure 7 is a partial structural schematic diagram of the power conversion device 100 shown in Figure 6 along the BB line. Figure 8 is a structural schematic diagram of the temperature distribution plate 20 of the power conversion device 100 shown in Figure 6 at another angle. Figure 9 is an enlarged view of the IX portion of the power conversion device 100 shown in Figure 6. It should be noted that the features indicated by the dotted lines in Figures 6, 8 and 9 indicate obscured features.

[0081] As shown in Figures 2, 3, and 4, in some embodiments, in the Z-axis direction (i.e., the first direction), the temperature vaporizer 20 is thermally connected to the multiple heat sinks 122. The temperature vaporizer 20 is disposed on one side of the multiple heat sinks 122 and faces away from the heat sink substrate 121. The multiple heat sinks 122 are disposed between the temperature vaporizer 20 and the heat sink substrate 121. Specifically, in the Z-axis direction, the temperature vaporizer 20 is fixedly connected to the surface of each heat sink 122 and faces away from the heat sink substrate 121. In the Z-axis direction, the temperature vaporizer 20 is fixedly connected to the first fixing surface 1221 of each heat sink 122 and faces away from the heat sink substrate 121. Multiple airflow channels 20a that are interconnected are formed between the heat sink substrate 121, the multiple heat sink fins 122, and the temperature vaporizer 20, and the multiple airflow channels 20a are arranged at intervals. Specifically, the heat dissipation substrate 121, the plurality of heat dissipation fins 122 and the temperature equalizing plate 20 together form a plurality of air flow channels 20a, and the plurality of air flow channels 20a are arranged at intervals along the X-axis direction (i.e., the second direction). Each air flow channel 20a extends along the Y-axis direction (i.e., the third direction) and is connected to the external environment. The heat of the heat dissipation fins 122 can be quickly transferred to the temperature equalizing plate 20. The temperature equalizing plate 20 is used to dissipate heat for the plurality of heat dissipation fins 122 and to equalize the temperatures of the plurality of heat dissipation fins 122. Specifically, the temperature equalizing plate 20 is used to equalize the temperatures of the plurality of heat dissipation fins 122 in the X-axis direction. That is, the plurality of heat dissipation fins 122 are located between the heat dissipation substrate 121 and the temperature equalizing plate 20 to equalize the temperatures of the plurality of heat dissipation fins 122 in the X-axis direction (i.e., the second direction).

[0082] The heat generated by the power module 14 during operation is transferred via the heat dissipation substrate 121 to the multiple heat dissipation fins 122, and then from the multiple heat dissipation fins 122 to the vapor chamber 20. The heat generated by the power module 14 during operation is partially transferred to the external environment via the multiple heat dissipation fins 122, and partially transferred to the external environment via the vapor chamber 20. The heat dissipation substrate 121, the multiple heat dissipation fins 122, and the vapor chamber 20 enable rapid heat dissipation from the power module 14, thereby improving the safety of the power module 14 and extending its service life. The airflow channel 20a is used to allow cool air to pass through. The cool air passing through the airflow channel 20a removes heat from the heat dissipation fins 122, thereby dissipating heat from the power module 14.

[0083] As shown in Figures 3, 4 and 6, in some embodiments, the temperature vapor chamber 20 includes a first heat conducting surface 21, a second heat conducting surface 22 and a third heat conducting surface 23. In the Z-axis direction, the first heat conducting surface 21 and the second heat conducting surface 22 are opposite to each other and spaced apart. The third heat conducting surface 23 is connected between the first heat conducting surface 21 and the second heat conducting surface 22. Specifically, the third heat conducting surface 23 includes two first heat conducting sub-surfaces 231 and two second heat conducting sub-surfaces 232. In the X-axis direction, the two first heat conducting sub-surfaces 231 are opposite to each other and spaced apart. In the Y-axis direction, the two second heat conducting sub-surfaces 232 are opposite to each other and spaced apart. The two second heat conducting sub-surfaces 232 are both connected to the two first heat conducting sub-surfaces 231. Among them, the first heat conducting surface 21 faces the heat dissipation fins 122. The second heat conducting surface 22 faces away from the heat dissipation fins 122.

[0084] As shown in Figures 3, 6, and 7, the temperature vapor chamber 20 is provided with a plurality of grooves 24. Specifically, the first heat conducting surface 21 of the temperature vapor chamber 20 is provided with a plurality of grooves 24, each groove 24 extending from the first heat conducting surface 21 along the Z-axis direction. In other words, the surface of the temperature vapor chamber 20 is provided with a plurality of grooves 24. Exemplarily, the number of grooves 24 is 5. In other embodiments, the number of grooves 24 may be 1, 2, or more. In the X-axis direction, the plurality of grooves 24 are arranged in sequence and spaced apart. Among them, the plurality of heat dissipating fins 122 are arranged in a one-to-one correspondence in the plurality of grooves 24. Specifically, the plurality of heat dissipating fins 122 are snap-fitted into the plurality of grooves 24 in a one-to-one correspondence. In other embodiments, the plurality of heat dissipating fins 122 may also be fixedly connected to the plurality of grooves 24 in a one-to-one correspondence by means including but not limited to welding or gluing, and the plurality of heat dissipating fins 122 may also be arranged in a one-to-one correspondence in the plurality of grooves 24. In other embodiments, the plurality of heat sinks 122 may also be fixedly stacked with the first heat conducting surface 21 of the temperature vapor chamber 20 by methods including but not limited to welding or gluing to achieve thermal connection between the plurality of heat sinks 122 and the temperature vapor chamber 20 .

[0085] The design of the grooves 24 helps improve the installation accuracy and strength of the vapor chamber 20 and the heat sink fins 122, thereby improving the structural stability of the power conversion device 100. Furthermore, the grooves 24 serve as a positioning mechanism, facilitating assembly of the vapor chamber 20 and the heat sink fins 122, reducing the difficulty of assembly and the manufacturing cost of the power conversion device 100.

[0086] As shown in Figure 8, illustratively, the groove 24 is a rectangular groove. In some other embodiments, the groove 24 may also be a circular groove or a triangular groove or other special-shaped groove. The groove 24 includes a first groove wall 241, a second groove wall 242 and a third groove wall 243. The first groove wall 241 faces away from the second heat conducting surface 22. There are two second groove walls 242. In the X-axis direction, the two second groove walls 242 are connected to both sides of the first groove wall 241, and the two second groove walls 242 are opposite and spaced apart. There are two third groove walls 243. In the Y-axis direction, the two third groove walls 243 are opposite and spaced apart. The two third groove walls 243 are both connected to the first groove wall 241 and the two second groove walls 242.

[0087] As shown in Figures 3, 7, and 9, the first groove wall 241 opposes and abuts the first fixing surface 1221 of the heat sink 122. The two second groove walls 242 oppose and abut the two third fixing surfaces 1223 of the heat sink 122, respectively. The two third groove walls 243 oppose and abut the two fourth fixing surfaces 1224 of the heat sink 122, respectively. The heat sink 122 is secured within the groove 24 by the two second groove walls 242 and the two third groove walls 243.

[0088] As shown in Figures 5, 6 and 7, a closed channel 25 is provided in the temperature equalizing plate 20. Specifically, in the Z-axis direction, the closed channel 25 is located between the first heat-conducting surface 21 and the second heat-conducting surface 22, and is spaced apart from the first heat-conducting surface 21 and the second heat-conducting surface 22. The closed channel 25 is used for fluid flow to equalize the temperature of the multiple heat-conducting fins 122 and reduce the temperature difference between the multiple heat-conducting fins 122. The fluid can be a refrigerant including but not limited to water, fluorinated liquid or acetone. The cross-sectional shape of the closed channel 25 is circular. It should be noted that the channel cross-sectional shape of the closed channel 25 refers to the shape of the closed channel 25 after being cut in a direction perpendicular to the extension direction L1 of the closed channel 25.

[0089] Among them, the projection of the closed channel 25 in the Z-axis direction is spaced apart from the projections of the multiple grooves 24 in the Z-axis direction. It can be understood that the multiple grooves 24 are spaced apart from the closed channel 25. The projection of the closed channel 25 in the Z-axis direction (i.e., the first direction) is spaced apart from the projections of the multiple heat dissipating fins 122 in the Z-axis direction (i.e., the first direction). The projection of the closed channel 25 in the Z-axis direction (i.e., the first direction) surrounds the projections of the multiple heat dissipating fins 122 in the Z-axis direction (i.e., the first direction). In some other embodiments, the projection of the closed channel 25 in the Z-axis direction may also at least partially overlap with the projections of the multiple heat dissipating fins 122 in the Z-axis direction. The projection of the closed channel 25 in the Z-axis direction may also be located on one side of the projections of the multiple heat dissipating fins 122 in the Z-axis direction.

[0090] Because the projection of the first heat sink fin 122a in the Z-axis direction (i.e., the first direction) overlaps with the projection of the power module 14 in the Z-axis direction (i.e., the first direction), and the projection of the second heat sink fin 122b in the Z-axis direction (i.e., the first direction) is spaced apart from the projection of the power module 14 in the Z-axis direction (i.e., the first direction), most of the heat generated by the power module 14 during operation is transferred to the vapor chamber 20 via the first heat sink fin 122a, and a small amount is transferred to the external environment via the second heat sink fin 122b. When the heating element 10 is in operation, most of the heat generated is transferred to the vapor chamber 20 via the first heat sink fin 122a, and a small amount is transferred to the external environment via the second heat sink fin 122b.

[0091] Most of the heat generated by the power module 14 during operation is transferred to the vapor chamber 20 via the first heat dissipation fins 122a, and then transferred from the first heat conduction surface 21 of the vapor chamber 20 to the closed channel 25. That is, most of the heat generated by the power module 14 during operation is transferred to the vapor chamber 20 via a portion of the heat dissipation fins 122 (i.e., the first heat dissipation fins 122a), and then transferred from the vapor chamber 20 to the closed channel 25. The fluid in the closed channel 25 absorbs heat and evaporates on the side close to the first heat conduction surface 21, and releases heat and condenses on the side away from the first heat conduction surface 21 due to contact with the cold air in the external environment. The fluid undergoes a gas-liquid phase transition within the closed channel 25. The heat released by the condensation of the gaseous fluid in the closed channel 25 is transferred to the external environment via the second heat conduction surface 22 and the third heat conduction surface 23 of the vapor chamber 20. In other words, the fluid in the closed channel 25 absorbs heat and evaporates on the side close to the heat sink fins 122, and releases heat and condenses on the side away from the heat sink fins 122, with the fluid undergoing a gas-liquid phase transition within the closed channel 25. The heat released by the condensation of the gaseous fluid in the closed channel 25 is transferred to the external environment through the vapor chamber 20.

[0092] During this process, the fluid circulates along the extension direction of the closed channel 25 due to capillary forces or changes in pressure differentials within the channel, achieving a uniform temperature across the vapor chamber 20 with small temperature differences. Heat released by condensation of the gaseous fluid within the closed channel 25 can also be rapidly dissipated within the vapor chamber 20 and transferred from the vapor chamber 20 back to the plurality of second heat sink fins 122b (i.e., another portion of the heat sink 122) and then to the external environment. In other words, the majority of the heat generated by the power module 14 during operation is transferred to the vapor chamber 20 via a portion of the heat sink 122 (i.e., the first heat sink 122a), and then transferred through the vapor chamber 20 along the X-axis (i.e., the second direction) to the other portion of the heat sink 122 (i.e., the second heat sink 122b) surrounding this portion of the heat sink 122 (i.e., the first heat sink 122a), achieving uniform temperature across the plurality of heat sink fins 122 in the X-axis (i.e., the second direction), and ultimately, uniform temperature across all of the heat sink fins 122.

[0093] That is to say, through the circulation of the fluid in the closed channel 25 and the gas-liquid phase change of the fluid in the closed channel 25, the heat transferred from the first heat sink 122a to the temperature equalizer 20 can be transferred back to the second heat sink 122b through the temperature equalizer 20, thereby improving the heat dissipation efficiency of the second heat sink 122b, and then improving the overall heat dissipation efficiency of the multiple heat sinks 122, greatly improving the ability to naturally dissipate heat for the power module 14.

[0094] Through the circulation of the fluid in the closed channel 25 and the gas-liquid phase change of the fluid in the closed channel 25, most of the heat generated by the power module 14 of the power conversion device 100 provided in the present application during operation is quickly dissipated through the heat of a part of the heat dissipation fins 122 (i.e., the first heat dissipation fins 122a) through the temperature equalizer 20, and then transferred back to the other part of the heat dissipation fins 122 (i.e., the second heat dissipation fins 122b) through the temperature equalizer 20. Without changing the size of the heat dissipation fins 122, the overall heat dissipation efficiency of the multiple heat dissipation fins 122 is effectively improved, and the ability to naturally dissipate heat for the power module 14 is greatly improved; moreover, the heat generated by the power module 14 can also be transferred to the external environment through the multiple heat dissipation fins 122 through the temperature equalizer 20, which greatly improves the heat dissipation efficiency of the power module 14.

[0095] It can be understood that in the power conversion device 100 provided in the present application, most of the heat generated by the power module 14 during operation is transferred to the temperature equalizing plate 20 through a part of the heat dissipation fins 122 (i.e., the first heat dissipation fins 122a), and part of the heat transferred to the temperature equalizing plate 20 is transferred to the external environment, and the other part is transferred back to another part of the heat dissipation fins 122 (i.e., the second heat dissipation fins 122b) and then transferred to the external environment, thereby realizing rapid heat dissipation of the power module 14.

[0096] Compared to the existing scheme in which the heat transferred from the power module 14 to the heat sink 122 is transferred to the external environment through air convection, the heat generated by the power module 14 of the power conversion device 100 provided in this application is mostly dissipated quickly through the heat of a portion of the heat sink 122 (i.e., the first heat sink 122a) through the heat spreader 20, and then transferred back to the other portion of the heat sink 122 (i.e., the second heat sink 122b) through the heat spreader 20. The heat spreader 20 can evenly distribute the temperature of multiple heat sinks 122 and reduce the temperature difference between the multiple heat sinks 122. Without changing the size of the heat sink 122, the overall heat dissipation efficiency of the multiple heat sinks 122 is effectively improved, greatly improving the ability to naturally dissipate heat from the power module 14. Moreover, the heat generated by the power module 14 can also be transferred to the external environment through the heat spreader 20 through the multiple heat sinks 122, greatly improving the heat dissipation efficiency of the power module 14.

[0097] It can be understood that since the strength of the portion of the temperature equalizing plate 20 corresponding to the closed channel 25 is relatively low, the design of spacing the projection of the closed channel 25 in the Z-axis direction (i.e., the first direction) and the projection of the multiple heat dissipating fins 122 in the Z-axis direction (i.e., the first direction) is beneficial to improving the connection strength between the temperature equalizing plate 20 and the multiple heat dissipating fins 122, and is beneficial to improving the structural stability of the power conversion device 100; moreover, on the basis of ensuring the connection strength between the temperature equalizing plate 20 and the multiple heat dissipating fins 122, it is beneficial to reduce the size of the temperature equalizing plate 20 in the Z-axis direction (i.e., the first direction) (i.e., the thickness of the temperature equalizing plate 20), which is beneficial to the miniaturization and lightweight design of the temperature equalizing plate 20.

[0098] The design of the closed channel 25, with its projection in the Z-axis direction (i.e., the first direction) surrounding the projections of the plurality of heat sinks 122 in the Z-axis direction (i.e., the first direction), ensures that the heat transferred from the power module 14 to the vapor chamber 20 through a portion of the heat sinks 122 (i.e., the first heat sink 122a) can be transferred in all directions to the closed channel 25. This improves the efficiency of heat generated by the power module 14 during operation being transferred to the closed channel 25 through the portion of the heat sinks 122 (i.e., the first heat sink 122a), thereby improving the efficiency of heat dissipation from the fluid within the closed channel 25 to the portion of the heat sinks 122 (i.e., the first heat sink 122a), and thereby improving the heat dissipation efficiency of the power module 14. Furthermore, this improves the efficiency of heat released by condensation of the gaseous fluid within the closed channel 25 being transferred from the vapor chamber 20 back to the other portion of the heat sinks 122 (i.e., the second heat sink 122b), thereby improving the overall heat dissipation efficiency of the plurality of heat sinks 122 and thereby improving the heat dissipation efficiency of the power module 14.

[0099] As shown in Figures 7, 8, and 9, in some embodiments, the enclosed channel 25 includes a bent segment 26 and a connecting segment 27. In the Y-axis direction (i.e., the third direction), the connecting segment 27 is located on one side of the bent segment 26 and communicates with the bent segment 26. The bent segment 26 includes a plurality of bent sub-segments 261 and a plurality of mating sub-segments 262. In the Y-axis direction, the plurality of mating sub-segments 262 are located on one side of the plurality of bent sub-segments 261. In the X-axis direction, the plurality of bent sub-segments 261 and the plurality of mating sub-segments 262 are alternately connected.

[0100] The plurality of bending sub-segments 261 include a first bending sub-segment 261a, a second bending sub-segment 261b, and a plurality of third bending sub-segments 261c. In the X-axis direction, the first bending sub-segment 261a, the plurality of third bending sub-segments 261c, and the second bending sub-segment 261b are sequentially arranged and spaced apart. For example, the number of third bending sub-segments 261c is three. In other embodiments, the number of third bending sub-segments 261c may be one, two, or more.

[0101] Each curved sub-segment 261 includes a first segment 2611, a second segment 2612, and a third segment 2613. Exemplarily, the first segment 2611 and the second segment 2612 are both straight segments. In other embodiments, the first segment 2611 and the second segment 2612 may be wavy segments, zigzag segments, or other shaped segments. The first segment 2611 and the second segment 2612 extend along the Y-axis. In the X-axis, the first segment 2611 and the second segment 2612 are opposite and spaced apart. In the Y-axis, the third segment 2613 is located on one side of the first segment 2611 and on one side of the second segment 2612. The third segment 2613 is located between the first segment 2611 and the second segment 2612 and is connected to the first segment 2611 and the second segment 2612. Exemplarily, the third segment 2613 is an arc segment. In other embodiments, the third segment 2613 may be a straight segment, wavy segments, or other shaped segments.

[0102] In each bent sub-segment 261, the first segment 2611, the second segment 2612, and the third segment 2613 together form a receiving opening 263. In other words, each bent sub-segment 261 includes a receiving opening 263. The bent segment 26 includes a plurality of receiving openings 263. The number of receiving openings 263 is equal to the number of bent sub-segments 261. The number of receiving openings 263 is five. In other embodiments, the number of receiving openings 263 may be two, three, or more. The plurality of receiving openings 263 are spaced apart along the X-axis direction (i.e., the second direction).

[0103] The plurality of mating sub-segments 262 include a first mating sub-segment 262a, a second mating sub-segment 262b, and a plurality of third mating sub-segments 262c. Exemplarily, the number of third mating sub-segments 262c is two. In other embodiments, the number of third mating sub-segments 262c may be one, three, or more. In the X-axis direction, the first mating sub-segment 262a, the plurality of third mating sub-segments 262c, and the second mating sub-segment 262b are sequentially arranged and spaced apart. The first mating sub-segment 262a is located between the first bending sub-segment 261a and the third bending sub-segment 261c adjacent to the first bending sub-segment 261a, and is in communication with the first bending sub-segment 261a and the third bending sub-segment 261c. Specifically, in the first bending sub-segment 261a and the third bending sub-segment 261c adjacent to the first bending sub-segment 261a, the first matching sub-segment 262a is connected to the second segment 2612 of the first bending sub-segment 261a and the first segment 2611 of the third bending sub-segment 261c.

[0104] The second mating sub-segment 262b is located between the second bent sub-segment 261b and the third bent sub-segment 261c adjacent to the second bent sub-segment 261b, and is in communication with both the second bent sub-segment 261b and the third bent sub-segment 261c. Specifically, in the second bent sub-segment 261b and the third bent sub-segment 261c adjacent to the second bent sub-segment 261b, the second mating sub-segment 262b is in communication with the first segment 2611 of the second bent sub-segment 261b and the first segment 2611 of the third bent sub-segment 261c. Multiple third mating sub-segments 262c are located one-to-one between the multiple third bent sub-segments 261c. Each third mating sub-segment 262c is in communication with two adjacent third bent sub-segments 261c.

[0105] In other embodiments, the third bent sub-segment 261c may be omitted, and the number of mating sub-segments 262 may be one. The mating sub-segment 262 is located between and connected to the first mating sub-segment 262a and the second mating sub-segment 262b. For example, the mating sub-segment 262 is an arc segment. In other embodiments, the mating sub-segment 262 may be a straight segment, a wavy segment, or another irregularly shaped segment.

[0106] In some embodiments, in the Y-axis direction (i.e., the third direction), the connecting segment 27 is located on one side of the bent segment 26 and communicates with the bent segment 26. Specifically, in the Y-axis direction, the connecting segment 27 is located on one side of the first segment 2611 of the first bent sub-segment 261a and faces away from the third segment 2613, communicating with the first segment 2611 of the first bent sub-segment 261a. Furthermore, in the Y-axis direction, the connecting segment 27 is located on one side of the second segment 2612 of the second bent sub-segment 261b and faces away from the third segment 2613, communicating with the second segment 2612 of the second bent sub-segment 261b. The connecting segment 27 encloses the plurality of receiving openings 263.

[0107] The connecting segment 27 includes a first connecting subsegment 271, a second connecting subsegment 272, and a third connecting subsegment 273. In an exemplary embodiment, the first connecting subsegment 271, the second connecting subsegment 272, and the third connecting subsegment 273 are all straight segments. In other embodiments, the first connecting subsegment 271, the second connecting subsegment 272, and the third connecting subsegment 273 may be wavy segments, zigzag segments, or other irregularly shaped segments. The first connecting subsegment 271 extends along the X-axis. The second connecting subsegment 272 and the third connecting subsegment 273 extend along the Y-axis. In the X-axis direction, the second connecting subsegment 272 and the third connecting subsegment 273 are located on opposite sides of the first connecting subsegment 271 and are both connected to the first connecting subsegment 271.

[0108] In the Y-axis direction, the first connecting sub-segment 271 is located on one side of the bent section 26, such that the multiple receiving openings 263 face the first connecting sub-segment 271. The first connecting sub-segment 271 is spaced apart from the bent section 26. In the Y-axis direction, the second connecting sub-segment 272 is located on one side of the first section 2611 of the first bent sub-segment 261a and faces away from the third section 2613. The second connecting sub-segment 272 is connected to the first section 2611 of the first bent sub-segment 261a. In the Y-axis direction, the third connecting sub-segment 273 is located on one side of the second section 2612 of the second bent sub-segment 261b and faces away from the third section 2613. The third connecting sub-segment 273 is connected to the second section 2612 of the second bent sub-segment 261b. The first connecting sub-segment 271, the second connecting sub-segment 272, and the third connecting sub-segment 273 can seal the multiple receiving openings 263 of the bent section 26. In other embodiments, the closed channel 25 can also be annular, triangular, or other shapes.

[0109] As shown in Figures 2, 6, and 9, the projections of the multiple grooves 24 in the Z-axis direction are correspondingly located within the projections of the multiple receiving openings 263 in the Z-axis direction. The projections of the multiple heat dissipating fins 122 in the Z-axis direction (i.e., the first direction) are correspondingly located within the projections of the multiple receiving openings 263 in the Z-axis direction (i.e., the first direction). That is, the projections of the heat dissipating fins 122 in the Z-axis direction are correspondingly located within the projections of the receiving openings 263 in the Z-axis direction. Furthermore, the projections of the heat dissipating fins 122 in the Z-axis direction are spaced apart from the projections of the bent sections 26 and the connecting sections 27 in the Z-axis direction. The projection of each heat dissipating fin 122 in the Z-axis direction is surrounded by the projection of the enclosed channel 25 in the Z-axis direction. That is, the projection of the enclosed channel 25 in the Z-axis direction surrounds the projections of the multiple heat dissipating fins 122 in the Z-axis direction. In other embodiments, the projection of the heat dissipating fins 122 in the Z-axis direction may also be located between the projections of two adjacent bent sub-segments 261 in the Z-axis direction. For example, in the adjacent first bending sub-segment 261a and the third bending sub-segment 261c, the projection of the heat dissipating fin 122 in the Z-axis direction may also be located between the projection of the first bending sub-segment 261a in the Z-axis direction and the projection of the third bending sub-segment 261c in the Z-axis direction.

[0110] The design in which the projections of the plurality of heat sinks 122 in the Z-axis direction (i.e., the first direction) are located one-to-one within the projections of the plurality of receiving openings 263 in the Z-axis direction (i.e., the first direction) ensures that the projections of the plurality of heat sinks 122 in the Z-axis direction are surrounded by the projections of the closed channel 25 in the Z-axis direction, and ensures that the heat transferred from the power module 14 to the temperature equalizing plate 20 through a portion of the heat sinks 122 (i.e., the first heat sinks 122a) can be transferred to the closed channel 25 in all directions, which is beneficial to improving the efficiency of the heat generated by the power module 14 during operation being transferred to the closed channel 25 through a portion of the heat sinks 122 (i.e., the first heat sinks 122a), and is beneficial to improving the heat dissipation efficiency of the fluid in the closed channel 25 to the portion of the heat sinks 122 (i.e., the first heat sinks 122a), which is beneficial to improving the heat dissipation efficiency of the power module 14. Furthermore, this helps improve the efficiency of transferring heat released by condensation of the gaseous fluid in the closed channel 25 back from the temperature equalizer 20 to the other portion of the heat dissipation fins 122 (i.e., the second heat dissipation fins 122b), thereby improving the overall heat dissipation efficiency of the plurality of heat dissipation fins 122 and the heat dissipation efficiency of the power module 14. Furthermore, the design is simple and the design cost is low, which helps reduce processing costs.

[0111] Please refer to Figures 10, 11, 12, 13 and 14, and in combination with Figures 2 and 7. Figure 10 is a schematic diagram of the partial structure of the power conversion device 100 shown in Figure 6, cut along line BB, under another embodiment. Figure 11 is a schematic diagram of the partial structure of the power conversion device 100 shown in Figure 6, cut along line BB, under another embodiment. Figure 12 is a schematic diagram of the partial structure of the power conversion device 100 shown in Figure 6, cut along line BB, under another embodiment. Figure 13 is a schematic diagram of the partial structure of the power conversion device 100 shown in Figure 6, cut along line BB, under another embodiment. Figure 14 is a schematic diagram of the partial structure of the power conversion device 100 shown in Figure 6, cut along line BB, under another embodiment.

[0112] As shown in Figures 2, 7, and 10, in some other embodiments, a protrusion 28 is provided on the surface of the temperature vapor chamber 20. The projection of the protrusion 28 in the Z-axis direction (i.e., the first direction) overlaps with the projection of the closed channel 25 in the Z-axis direction (i.e., the first direction), and the protrusion 28 is spaced apart from the plurality of heat sinks 122. The design of the protrusion 28 is conducive to improving the strength of the portion of the temperature vapor chamber 20 corresponding to the closed channel 25, and is conducive to improving the structural stability of the temperature vapor chamber 20, and is conducive to improving the structural stability of the power conversion device 100. Moreover, the protrusion 28 can serve as an indicator for the closed channel 25, making it easier to position the heat sink 122 and the closed channel 25, thereby facilitating the assembly of the temperature vapor chamber 20 and the heat sink 122, thereby reducing the difficulty of assembling the temperature vapor chamber 20 and the heat sink 122, and reducing the processing cost of the power conversion device 100.

[0113] Specifically, the protrusion 28 includes a first protrusion 281 and a second protrusion 282. The first protrusion 281 is arranged on the first heat-conducting surface 21 of the temperature-vaporizing plate 20 and faces away from the second heat-conducting surface 22. The first protrusion 281 extends along the extension direction of the closed channel 25. The second protrusion 282 is arranged on the second heat-conducting surface 22 of the temperature-vaporizing plate 20 and faces away from the first heat-conducting surface 21. The second protrusion 282 extends along the extension direction of the closed channel 25. The projection of the first protrusion 281 in the Z-axis direction overlaps with the projection of the second protrusion 282 in the Z-axis direction, and both cover the projection of the closed channel 25 in the Z-axis direction. It can be understood that in the Z-axis direction, the protrusions 28 are provided on the two opposite surfaces of the temperature-vaporizing plate 20. Among them, in the X-axis direction, the first protrusion 281 is spaced apart from the heat-dissipating fins 122, and the protrusion 28 is spaced apart from the heat-dissipating fins 122. The design of protrusions 28 on the two opposite surfaces of the temperature equalizing plate 20 further improves the strength of the portion of the temperature equalizing plate 20 corresponding to the closed channel 25, which is beneficial to improving the structural stability of the temperature equalizing plate 20 and the structural stability of the power conversion device 100.

[0114] As shown in Figures 2, 9, and 10, in some other embodiments, the cross-sectional shape of the closed channel 25 may also be semicircular, with the semicircular shape facing away from the first heat-conducting surface 21. The second protrusion 282 may be provided only on the second heat-conducting surface 22 of the heat spreader 20, that is, the first protrusion 281 may be omitted. In this way, the protrusion 28 can also improve the strength of the portion of the heat spreader 20 corresponding to the closed channel 25, thereby improving the structural stability of the heat spreader 20 and the structural stability of the power conversion device 100. Moreover, the protrusion 28 can also serve as an indicator of the closed channel 25, facilitating the positioning of the heat dissipating fins 122 and the closed channel 25, thereby facilitating the assembly of the heat spreader 20 and the heat dissipating fins 122, thereby reducing the difficulty of assembling the heat spreader 20 and the heat dissipating fins 122, and reducing the processing cost of the power conversion device 100.

[0115] As shown in Figures 12, 13, and 14, in other embodiments, the cross-sectional shape of the closed channel 25 may also include, but is not limited to, a rectangle (as shown in Figure 12), a triangle (as shown in Figure 13), or an ellipse (as shown in Figure 14), among other shapes. The design of the closed channel 25 is diverse and can be tailored to meet specific needs. The design requirements and cost of the closed channel 25 are low, which helps reduce the manufacturing cost of the vapor chamber 20 and the power conversion device 100 (as shown in Figure 2).

[0116] Referring to Figures 15 and 16 , in conjunction with Figures 2 , 5 , and 6 , Figure 15 is a schematic structural diagram of the power conversion device 100 shown in Figure 6 under another embodiment. Figure 16 is an enlarged view of section XVI of the power conversion device 100 shown in Figure 15 . It should be noted that the features indicated by dashed lines in Figures 15 and 16 are obscured features.

[0117] As shown in Figures 2, 6, and 16, in some other embodiments, a guide section 29 is provided within the vapor chamber 20. The guide section 29 is connected to the closed channel 25 and is used to restrict the unidirectional flow of the fluid. The design of the guide section 29 ensures that the fluid within the closed channel 25 circulates unidirectionally along the closed channel 25, thereby improving the efficiency of the fluid circulation flow. This improves the efficiency of heat transfer from the power module 14 (as shown in Figure 5) to the vapor chamber 20 via a portion of the heat dissipating fins 122 (i.e., the first heat dissipating fin 122a) and then transferred back to the other portion of the heat dissipating fins 122 (i.e., the second heat dissipating fin 122b) via the fluid within the closed channel 25. This improves the overall heat dissipation efficiency of the multiple heat dissipating fins 122 and the heat dissipation efficiency of the power module 14.

[0118] As shown in Figures 6, 15, and 16, the guide segment 29 is connected to the bending segment 26. For example, there are multiple guide segments 29, and specifically, there are 12 guide segments 29. In other embodiments, the number of guide segments 29 may be 1, 2, or more. The 12 guide segments 29 are divided into 4 first guide segments 29a, 4 second guide segments 29b, and 4 third guide segments 29c.

[0119] Multiple first guide segments 29a are connected to the first bent sub-segment 261a of the bent section 26. Specifically, in the X-axis direction, the multiple first guide segments 29a are located on one side of the first segment 2611 of the first bent sub-segment 261a and facing away from the second segment 2612, and are connected to the first segment 2611. In the Y-axis direction, the multiple first guide segments 29a are arranged sequentially and spaced apart. The projections of the first guide segments 29a in the Z-axis direction are spaced apart from the projections of the heat sink 122 in the Z-axis direction. In other embodiments, the first guide segments 29a may also be located on one side of the first segment 2611 of the first bent sub-segment 261a and facing the second segment 2612, and are connected to the first segment 2611. The first guide segments 29a may also be located on one side of the second segment 2612 of the first bent sub-segment 261a and facing the first segment 2611, and are connected to the second segment 2612. The first guiding segment 29 a may also be located on one side of the second segment 2612 of the first bending sub-segment 261 a and facing away from the first segment 2611 , and the first guiding segment 29 a is connected to the second segment 2612 .

[0120] In this embodiment, the first guide segment 29a (i.e., guide segment 29) includes a first guide subsegment 291 and a second guide subsegment 292. The second guide subsegment 292 is connected to the first guide subsegment 291. The second guide subsegment 292 is curved relative to the first guide subsegment 291. Specifically, the first guide subsegment 291 includes a first end 2911 and a second end 2912. The first end 2911 and the second end 2912 are disposed opposite each other. The second guide subsegment 292 includes a third end 2921 and a fourth end 2922. The third end 2921 and the fourth end 2922 are disposed opposite each other. The third end 2921 and the fourth end 2922 are connected. That is, one end of the second guide subsegment 292 is connected to one end of the first guide subsegment 291. The first end 2911 faces away from the second guide subsegment 292, and the fourth end 2922 faces away from the first guide subsegment 291.

[0121] The first end 2911 of the first guide segment 291 is connected to the first section 2611 of the first curved sub-segment 261a. That is, the first end 2911 of the first guide segment 291 (i.e., the end of the first guide segment 291 facing away from the second guide segment 292) is connected to the closed passage 25. The first guide segment 291 is arranged at an angle relative to the first section 2611 of the first curved sub-segment 261a. The first guide segment 291 faces away from the third section 2613 relative to the first section 2611 of the first curved sub-segment 261a. In other embodiments, the first guide segment 291 may also be closer to the third section 2613 relative to the first section 2611 of the first curved sub-segment 261a. It is understood that the first guide segment 291 is arranged at an angle relative to the extension direction L1 of the closed passage 25. In the Y-axis direction, the second guide sub-segment 292 is located on one side of the first guide sub-segment 291 and faces away from the third section 2613 of the first curved sub-segment 261a. The fourth end 2922 of the second guide sub-segment 292 is connected to the first section 2611 of the first curved sub-segment 261a. In other words, the fourth end 2922 of the second guide sub-segment 292 (i.e., the end of the second guide sub-segment 292 facing away from the first guide sub-segment 291) is connected to the closed channel 25.

[0122] A portion of the fluid in the closed channel 25 can flow along the extending direction of the first segment 2611 of the first curved sub-segment 261a, while another portion flows from the first segment 2611 into the guide segment 29 and then flows back from the guide segment 29 to the first segment 2611. When the fluid in the closed channel 25 flows from the first segment 2611 of the first curved sub-segment 261a through the second guide sub-segment 292 of the first guide segment 29a and the first guide sub-segment 291 and back to the first segment 2611, the fluid flowing back from the first guide sub-segment 291 to the first segment 2611 does not obstruct the fluid flowing in the first segment 2611. When the fluid in the closed channel 25 flows back to the first section 2611 from the first section 2611 of the first bending sub-segment 261a through the first guide sub-segment 291 and the second guide sub-segment 292 of the first guide section 29a, the fluid flowing back to the first section 2611 from the second guide sub-segment 292 will hinder the fluid flowing in the first section 2611.

[0123] In other words, a portion of the fluid in the closed channel 25 flows along the extension direction L1 of the closed channel 25, while the other portion flows from the closed channel 25 into the guide segment 29 and then flows back from the guide segment 29 into the closed channel 25. When the fluid in the closed channel 25 flows back from the closed channel 25 through the second guide segment 292 and the first guide segment 291, the fluid flowing back from the first guide segment 291 into the closed channel 25 does not obstruct the fluid flowing in the closed channel 25. However, when the fluid in the closed channel 25 flows back from the closed channel 25 through the first guide segment 291 and the second guide segment 292, the fluid flowing back from the second guide segment 292 into the closed channel 25 does obstruct the fluid flowing in the closed channel 25. Therefore, the design of the first guide segment 291 and the second guide segment 292 can restrict the one-way flow of the fluid in the closed channel 25. In this way, not only is the structure simple and easy to design, but the processing cost is also low, which is beneficial to reducing the processing cost of the temperature homogenizing plate 20 and the processing cost of the power conversion device 100.

[0124] The plurality of second guide segments 29b are connected to the third curved sub-segment 261c adjacent to the first curved sub-segment 261a. For details, please refer to the description of the first guide segment 29a and the first curved sub-segment 261a. In the X-axis direction, the plurality of second guide segments 29b are located on one side of the first segment 2611 of the third curved sub-segment 261c and facing away from the second segment 2612. The second guide segments 29b are connected to the first segment 2611. In the Y-axis direction, the plurality of second guide segments 29b are arranged sequentially and spaced apart.

[0125] The plurality of third guide segments 29c are connected to the third curved sub-segment 261c adjacent to the first curved sub-segment 261a. For details, please refer to the description of the first guide segment 29a and the first curved sub-segment 261a. In the X-axis direction, the plurality of third guide segments 29c are located on one side of the first segment 2611 of the third curved sub-segment 261c and face the second segment 2612, and are connected to the first segment 2611. In the Y-axis direction, the plurality of third guide segments 29c are sequentially arranged and spaced apart. In the X-axis direction, the plurality of third guide segments 29c are offset from the plurality of second guide segments 29b, i.e., the third guide segments 29c are offset from the second guide segments 29b. In the X-axis direction, "offset" between feature A and feature B means that the partial projection of feature A in the X-axis direction overlaps the partial projection of feature B in the X-axis direction. In other embodiments, the third guide segments 29c and the second guide segments 29b may also be non-offset in the X-axis direction.

[0126] It will be appreciated that in this embodiment, the guide section 29 communicates with the first curved sub-segment 261a and the third curved sub-segment 261c adjacent to the first curved sub-segment 261a. In other embodiments, the guide section 29 may also communicate with the second curved sub-segment 261b or another third curved sub-segment 261c. In still other embodiments, the guide section 29 may also communicate with the connecting section 27. The guide section 29 can be connected to the closed channel 25 in a variety of ways, resulting in low design costs, which can help reduce the processing costs of the vapor chamber 20 and the power conversion device 100.

[0127] 17 and 18, in conjunction with FIG2 and FIG5, FIG17 is a perspective structural diagram of another embodiment of the power conversion device 100 shown in FIG2. FIG18 is an enlarged view of the XVIII portion of the power conversion device 100 shown in FIG17.

[0128] As shown in Figures 2, 17 and 18, in some other embodiments, the temperature equalizer 20 is provided with a first through hole 30. The first through hole 30 passes through the temperature equalizer 20 along the Z-axis direction (i.e., the first direction). The first through hole 30 is connected to the air flow channel 20a. The first through hole 30 is spaced apart from the closed channel 25. And the first through hole 30 is spaced apart from the plurality of heat sinks 122. Cold air from the external environment can flow into the air flow channel 20a from the first through hole 30 and contact the heat sink 122. After the cold air absorbs the heat from the heat sink 122, its temperature rises to form hot air, and the hot air flows out from the air flow channel 20a along the positive direction of the Z-axis to transfer the heat dissipated from the power module 14 (as shown in Figure 5) to the heat sink 122 to the external environment, thereby achieving heat dissipation of the power module 14. The design of the first through hole 30 ensures that cold air from the external environment can flow from the side of the temperature homogenizing plate 20 facing away from the heat dissipating fins 122 (i.e., the side of the second heat conducting surface 22 facing away from the first heat conducting surface 21) through the first through hole 30 to the heat dissipating fins 122, which is beneficial to improving the heat dissipation efficiency of the heat dissipating fins 122, and further beneficial to improving the heat dissipation efficiency of the power module 14.

[0129] Exemplarily, there are multiple first through holes 30. Specifically, there are 66 first through holes 30. The six first through holes 30 and the multiple bent sub-segments 261 of the closed channel 25 are alternately arranged along the X-axis direction, and these six first through holes 30 are spaced apart along the X-axis direction to form a row of first through holes 30. Eleven rows of first through holes 30 are spaced apart along the Y-axis direction. In other embodiments, the number of first through holes 30 may be one, two, or more. The first through hole 30 is a rectangular hole. In other embodiments, the first through hole 30 may be a circular hole, a triangular hole, or another irregularly shaped hole. The first through hole 30 includes a first hole wall 31, a second hole wall 32, a third hole wall 33, and a fourth hole wall 34. In the X-axis direction, the first hole wall 31 and the second hole wall 32 are opposite and spaced apart. In the Y-axis direction, the third hole wall 33 and the fourth hole wall 34 are opposite and spaced apart. The third hole wall 33 and the fourth hole wall 34 are both connected to the first hole wall 31 and the second hole wall 32 .

[0130] The temperature equalizing plate 20 is provided with a first thermally conductive fin 30a. The first thermally conductive fin 30a is arranged on the hole wall of the first through hole 30, and the first thermally conductive fin 30a is arranged obliquely relative to the cross-section of the first through hole 30. Specifically, in the Z-axis direction, the first thermally conductive fin 30a is located on the side of the second thermally conductive surface 22 facing away from the first thermally conductive surface 21 and is fixedly connected to the second thermally conductive surface 22. In the X-axis direction, the first thermally conductive fin 30a is located on one side of the first hole wall 31 of the first through hole 30 and facing away from the second hole wall 32, and the first thermally conductive fin 30a is fixedly connected to the first hole wall 31. The first thermally conductive fin 30a is arranged on the first hole wall 31 of the first through hole 30. The first thermally conductive fin 30a is arranged obliquely along the X-axis direction relative to the cross-section of the first through hole 30. Specifically, the first thermally conductive fin 30a is close to the second hole wall 32 along the X-axis direction relative to the cross-section of the first through hole 30. The angle between the first thermally conductive fin 30a and the cross section of the first through hole 30 is an acute angle. In other embodiments, the angle between the first thermally conductive fin 30a and the cross section of the first through hole 30 may also be an obtuse angle or a right angle. It should be noted that the cross section of the first through hole 30 refers to a cross section of the first through hole 30 taken along a direction perpendicular to the axial direction of the first through hole 30. The cross section of the first through hole 30 is parallel to the XY plane.

[0131] The design of the first thermal fin 30a is beneficial to increasing the contact area between the temperature vapor chamber 20 and the cold air, which is beneficial to increasing the amount of heat transferred from the power module 14 (as shown in Figure 5) to the external environment through the heat dissipation fins 122 and the temperature vapor chamber 20, and is beneficial to improving the efficiency of heat dissipation of the power module 14 through the heat dissipation fins 122 and the temperature vapor chamber 20, which is beneficial to improving the heat dissipation efficiency of the power module 14.

[0132] In some other embodiments, in the X-axis direction, the first thermally conductive fin 30a may be located on one side of the second hole wall 32 of the first through hole 30 and facing away from the first hole wall 31, the first thermally conductive fin 30a being fixedly connected to the second hole wall 32, and the first thermally conductive fin 30a being tilted relative to the cross-section of the first through hole 30 along the X-axis direction. In the Y-axis direction, the first thermally conductive fin 30a may be located on one side of the third hole wall 33 and facing away from the fourth hole wall 34, the first thermally conductive fin 30a being fixedly connected to the third hole wall 33, and the first thermally conductive fin 30a being tilted relative to the cross-section of the first through hole 30 along the Y-axis direction. In the Y-axis direction, the first thermally conductive fin 30a may be located on one side of the fourth hole wall 34 and facing away from the third hole wall 33, the first thermally conductive fin 30a being fixedly connected to the fourth hole wall 34, and the first thermally conductive fin 30a being tilted relative to the cross-section of the first through hole 30 along the Y-axis direction.

[0133] In other embodiments, the first thermal conductive fin 30a can also be fixedly connected to the side of the first hole wall 31 facing the second hole wall 32, and bent along the Z-axis direction relative to the first hole wall 31. The first thermal conductive fin 30a can also be arranged on the first hole wall 31 and inclined along the X-axis direction relative to the cross-section of the first through hole 30.

[0134] In some other embodiments, in the Z-axis direction, the first thermal conductive fin 30a may also be located on the side of the first thermal conductive surface 21 facing away from the second thermal conductive surface 22 and fixedly connected to the first thermal conductive surface 21. The first thermal conductive fin 30a is fixedly connected to the hole wall of the first through hole 30, and the first thermal conductive fin 30a is inclined relative to the cross-section of the first through hole 30.

[0135] Referring to Figures 19 and 20, in conjunction with Figures 5 and 17, Figure 19 is a schematic perspective view of the power conversion device 100 shown in Figure 17 under another embodiment. Figure 20 is an enlarged view of the XX portion of the power conversion device 100 shown in Figure 19.

[0136] As shown in Figures 17, 19, and 20, in some other embodiments, the vapor chamber 20 includes a main body 40 and a heat conducting portion 50. In the Z-axis direction (i.e., the first direction), the heat conducting portion 50 is disposed on one side of the main body 40. The main body 40 is disposed on one side of the plurality of heat dissipating fins 122 and faces away from the heat dissipating substrate 121. The heat conducting portion 50 faces the heat dissipating substrate 121. In the X-axis direction (i.e., the second direction), the heat conducting portion 50 is located on one side of the plurality of heat dissipating fins 122 and is spaced apart from the plurality of heat dissipating fins 122. The closed channel 25 is disposed in the main body 40 and the heat conducting portion 50. The heat dissipating substrate 121, the plurality of heat dissipating fins 122, the vapor chamber 20, the main body 40, and the heat conducting portion 50 together form a plurality of airflow channels 20a. In other words, a plurality of airflow channels 20a are formed between the heat dissipating substrate 121, the plurality of heat dissipating fins 122, and the vapor chamber 20.

[0137] The heat conducting portion 50 is arranged on one side of the main body 40, the main body 40 is arranged on one side of the multiple heat dissipating fins 122 and faces away from the heat dissipation substrate 121, the heat conducting portion 50 faces the heat dissipation substrate 121, and the closed channel 25 is arranged in the main body 40 and the heat conducting portion 50. This design is beneficial to improving the space utilization of the temperature averaging plate 20 on the basis of ensuring that the temperature averaging plate 20 has a large contact area with the cold air of the external environment, is beneficial to the miniaturization design of the temperature averaging plate 20, and is beneficial to the miniaturization design of the power conversion device 100.

[0138] Specifically, the structure of the main body 40 and the connection method between the main body 40 and the multiple heat dissipating fins 122 can refer to the relevant description of the temperature equalizing plate 20 and the multiple heat dissipating fins 122 in the embodiment shown in Figure 17, and will not be repeated here. Among them, the main body 40 includes a first heat-conducting surface 21 and a second heat-conducting surface 22. In the Z-axis direction, the first heat-conducting surface 21 and the second heat-conducting surface 22 are opposite to each other and spaced apart. The first heat-conducting surface 21 faces the multiple heat-dissipating fins 122, and the second heat-conducting surface 22 faces away from the multiple heat-dissipating fins 122. The heat-conducting part 50 is arranged on one side of the first heat-conducting surface 21 of the main body 40 and faces away from the second heat-conducting surface 22. The heat-conducting part 50 is fixedly stacked on the first heat-conducting surface 21 of the main body 40 and faces away from the second heat-conducting surface 22. The heat-conducting part 50 extends along the Z-axis direction. The heat-conducting part 50 is fixedly connected to the shell 11 of the heating element 10. The heat-conducting part 50 is fixedly connected to the heating element 10. In other embodiments, the heat conducting portion 50 may also be in contact with, abut against, or spaced apart from the heating element 10 .

[0139] Exemplarily, there are multiple heat conducting parts 50. Specifically, there are two heat conducting parts 50, namely a first heat conducting part 50a and a second heat conducting part 50b. In other words, the heat conducting part 50 includes a first heat conducting part 50a and a second heat conducting part 50b. In the X-axis direction, the first heat conducting part 50a and the second heat conducting part 50b are located on opposite sides of the plurality of heat dissipating fins 122 and are spaced apart from the plurality of heat dissipating fins 122. In other embodiments, the heat conducting part 50 may include only the first heat conducting part 50a or the second heat conducting part 50b. Each heat conducting part 50 includes a first mating surface 51 and a second mating surface 52. In the X-axis direction, the first mating surface 51 and the second mating surface 52 are disposed opposite to each other. The first mating surface 51 faces the plurality of heat dissipating fins 122, while the second mating surface 52 faces away from the plurality of heat dissipating fins 122. The projection of each heat conducting part 50 in the X-axis direction overlaps with the projection of the plurality of heat dissipating fins 122 in the X-axis direction. Specifically, the projection of each heat conducting portion 50 in the X-axis direction overlaps the projection of the plurality of heat dissipating fins 122 in the X-axis direction. That is, the projection of the heat conducting portion 50 in the X-axis direction overlaps with the entire projection of the plurality of heat dissipating fins 122 in the X-axis direction. In other embodiments, the projection of the heat conducting portion 50 in the X-axis direction may also overlap with a portion of the projection of the plurality of heat dissipating fins 122 in the X-axis direction.

[0140] The closed channel 25 includes a first closed sub-channel 25a, a second closed sub-channel 25b and a third closed sub-channel 25c. The first closed sub-channel 25a is arranged in the main body 40. The second closed sub-channel 25b is arranged in the first heat-conducting part 50a. The third closed sub-channel 25c is arranged in the second heat-conducting part 50b. In the X-axis direction, the second closed sub-channel 25b and the third closed sub-channel 25c are located on opposite sides of the first closed sub-channel 25a and are both connected to the first closed sub-channel 25a. Specifically, the first closed sub-channel 25a includes four first connecting ends. The second closed sub-channel 25b includes two second connecting ends. The third closed sub-channel 25c includes two third connecting ends. Two of the first connecting ends of the first closed sub-channel 25a are connected to the two second connecting ends of the second closed sub-channel 25b; the other two first connecting ends are connected to the two third connecting ends of the third closed sub-channel 25c. The matching relationship between the first closed sub-channel 25a and the plurality of heat dissipating fins 122 can be referred to the related description of the closed channel 25 and the plurality of heat dissipating fins 122 in the embodiment shown in FIG17 , and will not be described in detail.

[0141] The heat conducting portion 50 is provided with a second through hole 53. Specifically, the second through hole 53 extends from the first mating surface 51 to the second mating surface 52 along the X-axis direction. The second through hole 53 penetrates the heat conducting portion 50 along the X-axis direction (i.e., the second direction). The second through hole 53 is connected to the air flow channel 20a. Specifically, the second through hole 53 is connected to the air flow channel 20a formed by the heat dissipation substrate 121, the heat dissipation fins 122, the temperature equalizing plate 20, and the heat conducting portion 50. Exemplarily, there are multiple second through holes 53. Specifically, there are 30 second through holes 53. Three second through holes 53 are spaced apart in sequence along the Z-axis direction and form a row of second through holes 53. Ten rows of second through holes 53 are spaced apart along the Y-axis direction. In other embodiments, the number of second through holes 53 may be one, two, or more. The second through hole 53 is a rectangular hole. In other embodiments, the second through hole 53 may also be a circular hole, a triangular hole, or another special-shaped hole. The second through hole 53 includes a fifth hole wall 531, a sixth hole wall 532, a seventh hole wall 533, and an eighth hole wall 534. In the Z-axis direction, the fifth hole wall 531 and the sixth hole wall 532 are opposite and spaced apart. In the Y-axis direction, the seventh hole wall 533 and the eighth hole wall 534 are opposite and spaced apart. The seventh hole wall 533 and the eighth hole wall 534 are both connected to the fifth hole wall 531 and the sixth hole wall 532.

[0142] The projection of the second through hole 53 of the first heat conducting portion 50a in the Z-axis direction is spaced apart from the projection of the second enclosed sub-channel 25b in the Z-axis direction. That is, the second through hole 53 of the first heat conducting portion 50a is spaced apart from the second enclosed sub-channel 25b. The projection of the second through hole 53 of the second heat conducting portion 50b in the Z-axis direction is spaced apart from the projection of the third enclosed sub-channel 25c in the Z-axis direction. That is, the second through hole 53 of the second heat conducting portion 50b is spaced apart from the third enclosed sub-channel 25c. The second through hole 53 is spaced apart from the enclosed channel 25.

[0143] Cold air from the external environment can flow from the second through-holes 53 into the airflow channel 20a formed by the heat dissipation substrate 121, the heat dissipation fins 122, the temperature equalizer 20, and the heat conducting portion 50, and come into contact with the heat dissipation fins 122. The cold air absorbs heat from the heat dissipation fins 122, and its temperature rises to form hot air. The hot air then flows out of the airflow channel 20a along the positive direction of the Z axis, thereby transferring the heat dissipated from the power module 14 (as shown in FIG. 5 ) to the heat dissipation fins 122 to the external environment, thereby dissipating heat from the power module 14. The design of the second through-holes 53 ensures that cold air from the external environment can flow from the side of the heat conducting portion 50 facing away from the heat dissipation fins 122 (i.e., the side of the second mating surface 52 facing away from the first mating surface 51) through the second through-holes 53 to the heat dissipation fins 122, thereby improving the heat dissipation efficiency of the heat dissipation fins 122, and thereby improving the heat dissipation efficiency of the power module 14.

[0144] The heat conducting portion 50 is provided with a second heat conducting fin 54. The second heat conducting fin 54 is disposed on the wall of the second through hole 53 and is tilted relative to the cross section of the second through hole 53. Specifically, in the first heat conducting portion 50a, in the X-axis direction, the second heat conducting fin 54 is located on the side of the second mating surface 52 facing away from the first mating surface 51 and is fixedly connected to the second mating surface 52. In the Z-axis direction, the second heat conducting fin 54 is located on the side of the fifth wall 531 of the second through hole 53 and facing away from the sixth wall 532, and is fixedly connected to the sixth wall 532. The second heat conducting fin 54 is disposed on the fifth wall 531 of the second through hole 53. The second heat conducting fin 54 is tilted relative to the cross section of the second through hole 53 along the Z-axis direction. Specifically, the second heat conducting fin 54 is close to the sixth wall 532 along the X-axis direction relative to the cross section of the second through hole 53. The angle between the cross-section of the second thermally conductive fin 54 and the second through hole 53 is an acute angle. In other embodiments, the angle between the cross-section of the second thermally conductive fin 54 and the second through hole 53 may also be an obtuse angle or a right angle. It should be noted that the cross-section of the second through hole 53 refers to the cross-section of the second through hole 53 taken along a direction perpendicular to the axial direction of the second through hole 53. The cross-section of the second through hole 53 is parallel to the YZ plane.

[0145] In some other embodiments, in the Z-axis direction, the second thermally conductive fin 54 may also be located on one side of the sixth hole wall 532 of the second through hole 53 and facing away from the fifth hole wall 531, the second thermally conductive fin 54 being fixedly connected to the sixth hole wall 532, and the second thermally conductive fin 54 being tilted relative to the cross section of the second through hole 53 along the Z-axis direction. In the Y-axis direction, the second thermally conductive fin 54 may also be located on one side of the seventh hole wall 533 and facing away from the eighth hole wall 534, the second thermally conductive fin 54 being fixedly connected to the seventh hole wall 533, and the second thermally conductive fin 54 being tilted relative to the cross section of the second through hole 53 along the Y-axis direction. In the Y-axis direction, the second thermally conductive fin 54 may also be located on one side of the eighth hole wall 534 and facing away from the seventh hole wall 533, the second thermally conductive fin 54 being fixedly connected to the eighth hole wall 534, and the second thermally conductive fin 54 being tilted relative to the cross section of the second through hole 53 along the Y-axis direction.

[0146] In other embodiments, the second thermal conductive fin 54 can also be fixedly connected to the side of the fifth hole wall 531 facing the sixth hole wall 532, and bent along the X-axis direction relative to the fifth hole wall 531. The second thermal conductive fin 54 can also be arranged on the fifth hole wall 531 and inclined along the Z-axis direction relative to the cross section of the second through hole 53.

[0147] In some other embodiments, in the X-axis direction, the second thermal fin 54 may also be located on the side of the first mating surface 51 facing away from the second mating surface 52 and fixedly connected to the first mating surface 51, and the second thermal fin 54 is fixedly connected to the hole wall of the second through hole 53, and the second thermal fin 54 is inclined relative to the cross-section of the second through hole 53.

[0148] The arrangement of the second heat conducting fins 54 of the second heat conducting portion 50b can be referred to as the arrangement of the second heat conducting fins 54 of the first heat conducting portion 50a, and will not be further described. The design of the second heat conducting fins 54 helps to increase the contact area between the heat conducting portion 50 and the cold air, which helps to increase the amount of heat transferred from the power module 14 (as shown in Figure 5) to the external environment through the heat dissipation fins 122 and the temperature vapor chamber 20, and helps to improve the efficiency of heat dissipation of the power module 14 through the heat dissipation fins 122 and the temperature vapor chamber 20, thereby improving the heat dissipation efficiency of the power module 14.

[0149] Please refer to FIG. 21 , in combination with FIG. 2 and FIG. 4 . FIG. 21 is a schematic structural diagram of the power conversion device 100 shown in FIG. 2 cut along line AA under another embodiment.

[0150] In some other embodiments, the power conversion device 100 includes a fan 60. The fan 60 is arranged in the shell 11 and is located outside the receiving cavity 111. Specifically, a fixing portion 117 is provided on the side of the first shell wall 112 of the shell 11 facing away from the receiving cavity 111. The fixing portion 117 is arranged perpendicular to the first shell wall 112. In the Y-axis direction, the fixing portion 117 is located on one side of the multiple heat dissipation fins 122 and is spaced apart from the multiple heat dissipation fins 122. The projection of the fixing portion 117 in the Y-axis direction overlaps with the projection of the multiple heat dissipation fins 122 in the Y-axis direction. Among them, the fixing portion 117 is provided with a ventilation hole 1171. The ventilation hole 1171 passes through the fixing portion 117 along the thickness direction of the fixing portion 117 (i.e., the Y-axis direction).

[0151] The fan 60 is fixedly stacked on one side of the fixing portion 117 and faces the plurality of heat dissipating fins 122 by means including but not limited to threaded connection, welding or gluing. The fan 60 is arranged perpendicularly to the first shell wall 112. The fan 60 is arranged perpendicularly to the shell 11. In the Y-axis direction (i.e., the third direction), the fan 60 is located on one side of the plurality of heat dissipating fins 122 and is spaced apart from the plurality of heat dissipating fins 122. The projection of the fan 60 in the Y-axis direction (i.e., the third direction) overlaps with the projection of the plurality of heat dissipating fins 122 in the Y-axis direction (i.e., the third direction). In other embodiments, the fan 60 may also be fixedly stacked on one side of the first shell wall 112 and face away from the accommodating cavity 111 by means including but not limited to threaded connection, welding or gluing.

[0152] The fan 60 can blow out cooling air, which is blown from the ventilation holes 1171 toward the multiple heat sinks 122. The cooling air flows into the multiple air flow channels 20a and contacts the multiple heat sinks 122. The cooling air absorbs heat from the multiple heat sinks 122, and its temperature rises, forming hot air. The hot air then flows out of the multiple air flow channels 20a along the positive direction of the Z axis, transferring the heat from the multiple heat sinks 122 to the external environment. In other words, the cooling air can carry away the heat from the multiple heat sinks 122 through the multiple heat sinks 122, thereby dissipating heat from the multiple heat sinks 122. The design of the fan 60 helps improve the heat dissipation efficiency of the multiple heat sinks 122, and thus helps improve the heat dissipation efficiency of the power module 14.

[0153] In other embodiments, the fixing portion 117 may be tilted relative to the first housing wall 112, and the fan 60 may be tilted relative to the housing 11. The fixing portion 117 may be positioned closer to the plurality of heat dissipating fins 122 relative to the first housing wall 112, and the fan 60 may be positioned closer to the plurality of heat dissipating fins 122 relative to the housing 11. The fixing portion 117 may also be positioned away from the plurality of heat dissipating fins 122 relative to the first housing wall 112, and the fan 60 may be positioned away from the plurality of heat dissipating fins 122 relative to the housing 11. By changing the tilt angle of the fan 60 relative to the housing 11, the direction of the cooling airflow can be adjusted to dissipate heat from the plurality of heat dissipating fins 122, thereby improving the heat dissipation efficiency of the plurality of heat dissipating fins 122 and the power module 14.

[0154] Please refer to Figures 2, 4, 15, 17, 19 and 21 again. An embodiment of the present application provides a power conversion device 100. The power conversion device 100 includes a heat dissipation substrate 121, a power module 14 and a temperature equalizer 20. In the Z-axis direction (i.e., the first direction), a plurality of heat dissipation fins 122 are provided on one side of the heat dissipation substrate 121. In the Z-axis direction (i.e., the first direction), the power module 14 is arranged on one side of the heat dissipation substrate 121 and faces away from the plurality of heat dissipation fins 122. In the Z-axis direction (i.e., the first direction), the temperature equalizer 20 is thermally connected to the plurality of heat dissipation fins 122. The temperature equalizer 20 is arranged on one side of the plurality of heat dissipation fins 122 and faces away from the heat dissipation substrate 121. A closed channel 25 is provided in the temperature equalizer 20, and the closed channel 25 is used for fluid flow.

[0155] An embodiment of the present application provides a power conversion device 100. The power conversion device includes a housing 11, a heat dissipation substrate 121, a circuit board 13, a power module 14, and a temperature distribution plate 20. The housing 11 includes a receiving cavity 111, and the receiving cavity 111 is provided with a mounting hole 116, and the mounting hole 116 is connected to the receiving cavity 111. The heat dissipation substrate 121 is received in the mounting hole 116 and closes the receiving cavity 111. In the Z-axis direction (i.e., the first direction), a plurality of heat dissipation fins 122 are provided on the side of the heat dissipation substrate 121 facing away from the receiving cavity 111. The circuit board 13 is received in the receiving cavity 111. The power module 14 is arranged between the circuit board 13 and the heat dissipation substrate 121. The power module 14 includes a mounting portion 141 and a mating portion 142. In the Z-axis direction (i.e., the first direction), the mounting portion 141 is arranged on one side of the mating portion 142, the mounting portion 141 is arranged on the circuit board 13, and the mating portion 142 is in contact with the heat dissipation substrate 121. In the Z-axis direction (ie, the first direction), the temperature vaporizer 20 is disposed on one side of the plurality of heat dissipating fins 122 and faces away from the heat dissipating substrate 121 . The Z-axis direction (ie, the first direction) is the thickness direction of the temperature vaporizer 20 .

[0156] In the power conversion device 100 provided in the present application, most of the heat generated by the power module 14 during operation is transferred to the temperature equalizing plate 20 through a part of the heat dissipation fins 122 (i.e., the first heat dissipation fins 122a). Part of the heat transferred to the temperature equalizing plate 20 is transferred to the external environment, and the other part is transferred back to another part of the heat dissipation fins 122 (i.e., the second heat dissipation fins 122b) and then transferred to the external environment, thereby achieving rapid heat dissipation of the power module 14.

[0157] Compared to the existing scheme in which the heat transferred from the power module 14 to the heat sink 122 is transferred to the external environment through air convection, the heat generated by the power module 14 of the power conversion device 100 provided in this application is mostly dissipated quickly through a portion of the heat sink 122 (i.e., the first heat sink 122a) through the temperature equalizer 20, and then transferred back to the other portion of the heat sink 122 (i.e., the second heat sink 122b) through the temperature equalizer 20. The temperature equalizer 20 can equalize the temperature of multiple heat sinks 122 and reduce the temperature difference between the multiple heat sinks 122. Without changing the size of the heat sink 122, the overall heat dissipation efficiency of the multiple heat sinks 122 is effectively improved, greatly improving the ability to naturally dissipate heat from the power module 14. Moreover, the heat generated by the power module 14 can also be transferred to the external environment through the multiple heat sinks 122 through the temperature equalizer 20, greatly improving the heat dissipation efficiency of the power module 14.

Claims

1. A power conversion device, characterized in that: The power conversion device comprises: A housing, the housing comprising a receiving cavity, the receiving cavity being provided with a mounting hole, the mounting hole being in communication with the receiving cavity; a heat dissipation substrate, the heat dissipation substrate covering or being received in the mounting hole and enclosing the receiving cavity, the heat dissipation substrate being provided with a plurality of heat dissipation fins on a side facing away from the receiving cavity, the plurality of heat dissipation fins being located outside the receiving cavity of the housing; a circuit board, the circuit board being received in the receiving cavity; a power module located in the receiving cavity and mounted on a side of the circuit board facing the heat dissipation substrate, and located between the circuit board and the heat dissipation substrate, the power module comprising a mounting portion and a mating portion, wherein the mounting portion is fixed to the circuit board, and the mating portion is in thermal contact with the heat dissipation substrate; and A temperature averaging plate is thermally connected to the plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged between the temperature averaging plate and the heat dissipation substrate.

2. The power conversion device according to claim 1, characterized in that A closed channel is provided in the temperature homogenizing plate, and the closed channel is used for allowing fluid to flow, so as to equalize the temperature of the plurality of heat dissipation fins and reduce the temperature difference between the plurality of heat dissipation fins.

3. The power conversion device according to claim 1 or 2, characterized in that: The plurality of heat dissipation fins are located between the heat dissipation substrate and the heat spreader. A plurality of air flow channels communicating with each other are formed between the heat dissipation substrate, the plurality of heat dissipation fins and the heat spreader. The plurality of air flow channels are arranged at intervals.

4. The power conversion device according to claim 2, characterized in that: The multiple heat dissipation fins include a first heat dissipation fin and a second heat dissipation fin, the second heat dissipation fin is spaced apart from the first heat dissipation fin, the projection of the first heat dissipation fin in the first direction overlaps with the projection of the power module in the first direction, the projection of the second heat dissipation fin in the first direction is spaced apart from the projection of the power module in the first direction, and the first direction is the thickness direction of the temperature vapor chamber.

5. The power conversion device according to claim 4, characterized in that: The projection of the closed channel in the first direction is spaced apart from the projection of the plurality of heat dissipating fins in the first direction.

6. The power conversion device according to claim 5, characterized in that: The projection of the closed channel in the first direction surrounds the projections of the plurality of heat dissipating fins in the first direction.

7. The power conversion device according to claim 6, characterized in that: The closed channel includes a bending section and a connecting section, the bending section includes a plurality of receiving openings, and the plurality of receiving openings are arranged at intervals along the second direction. In the third direction, the connecting section is located on one side of the bending section and is connected to the bending section. The connecting section closes the plurality of receiving openings. The first direction, the second direction and the third direction are perpendicular to each other, and the projections of the plurality of heat dissipating fins in the first direction are located one-to-one within the projections of the plurality of receiving openings in the first direction.

8. The power conversion device according to claim 4, characterized in that: A protrusion is provided on the surface of the temperature vapor chamber, a projection of the protrusion in the first direction overlaps with a projection of the closed channel in the first direction, and the protrusion is spaced apart from the plurality of heat dissipation fins; Alternatively, a plurality of grooves are provided on the surface of the temperature vapor chamber, the plurality of grooves are spaced apart from the closed channels, and the plurality of heat dissipation fins are snap-fitted into the plurality of grooves in a one-to-one correspondence; Alternatively, the temperature homogenizing plate is provided with a first through hole, the first through hole passes through the temperature homogenizing plate along the first direction, and the first through hole is spaced apart from the closed channel.

9. The power conversion device according to claim 8, characterized in that: The temperature homogenizing plate is provided with a first heat conducting fin, which is arranged on the hole wall of the first through hole. The first heat conducting fin is arranged obliquely relative to the cross section of the first through hole.

10. The power conversion device according to claim 4, characterized in that: The power conversion device includes a fan, which is arranged in the shell and located outside the accommodating cavity. In the third direction, the fan is located on one side of the multiple heat dissipation fins and is spaced apart from the multiple heat dissipation fins. The projection of the fan in the third direction overlaps with the projection of the multiple heat dissipation fins in the third direction, and the third direction is perpendicular to the first direction.

11. The power conversion device according to claim 2, characterized in that: A guide section is provided in the temperature homogenizing plate, the guide section is communicated with the closed channel, and the guide section is used to limit the unidirectional flow of the fluid.

12. The power conversion device according to claim 11, characterized in that: The guide section includes a first guide sub-segment and a second guide sub-segment, one end of the second guide sub-segment is connected to one end of the first guide sub-segment, the second guide sub-segment is bent relative to the first guide sub-segment, and the end of the first guide sub-segment facing away from the second guide sub-segment is connected to the closed channel. The first guide sub-segment is inclined relative to the extension direction of the closed channel, and the end of the second guide sub-segment facing away from the first guide sub-segment is connected to the closed channel.

13. The power conversion device according to any one of claims 4 to 12, characterized in that: The temperature vapor chamber includes a main body and a heat-conducting part. In the first direction, the heat-conducting part is arranged on one side of the main body. The main body is arranged on one side of the multiple heat dissipating fins and faces away from the heat dissipating substrate. The heat-conducting part faces the heat dissipating substrate. In the second direction, the heat-conducting part is located on one side of the multiple heat dissipating fins and is spaced apart from the multiple heat dissipating fins. The second direction is perpendicular to the first direction. The closed channel is arranged in the main body and the heat-conducting part.

14. The power conversion device according to claim 13, characterized in that: The heat conducting portion is provided with a second through hole, the second through hole penetrates the heat conducting portion along the second direction, and the second through hole is spaced apart from the closed channel.

15. The power conversion device according to claim 14, characterized in that: The heat conducting portion is provided with a second heat conducting fin, which is arranged on the hole wall of the second through hole. The second heat conducting fin is arranged obliquely relative to the cross section of the second through hole.

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