Electronic device of a motor vehicle

Abstract

The invention relates to an electronic device (2) of a motor vehicle, comprising a device housing (4), at least one electrical or electronic component (6) that is completely or partly positioned in the device housing (4) and, during operation, has its maximum temperature in a heating region (8), and at least one heat-conducting element (10) that is provided on the face of the device housing (4) facing away from the electrical or electronic component (6) so as to lie opposite the heating region (8) of the electrical or electronic component (6) with respect to the device housing (4) such that a coupling portion (12) of the heat-conducting element directly or indirectly contacts the device housing (4), heat from the device housing (4) being introducible into the heat-conducting element (10) via the coupling portion (12). The heat-conducting element also has at least one heat dissipation portion (14), which is thermally conductively connected to the coupling portion (12) and by means of which heat introduced into the heat dissipation portion (14) at least via the coupling portion (12) can be dissipated.

Description

[0001] Electronic device of a motor vehicle

[0002] The invention relates to an electronic device of a motor vehicle.

[0003] Electronic devices for motor vehicles are known in various embodiments. These can, for example, comprise an electrical or electronic component that is arranged, for example, in the footwell of a motor vehicle. Depending on the arrangement of the electrical or electronic component, it can be installed in such a way that heat generated during operation of the electrical or electronic component cannot be dissipated or can only be dissipated inadequately.

[0004] This can cause a heat build-up, causing the electrical or electronic component to become excessively hot, making it difficult to guarantee operational reliability and a long service life of the electrical or electronic component.

[0005] An object of an embodiment of the invention is to propose an electronic device of a motor vehicle in which the risk of overheating of an electrical or electronic component of the electronic device is reduced.

[0006] This object is achieved by an electronic device of a motor vehicle with a device housing, with at least one electrical or electronic component which is arranged in the device housing in whole or in section and which has its maximum temperature during operation in a hot zone, with at least one heat-conducting heat-conducting element which is arranged on a side of the device housing facing away from the electrical or electronic component, opposite the heat zone of the electrical or electronic component with respect to the device housing, with a coupling section directly or indirectly touching the device housing, wherein heat can be introduced from the device housing into the heat-conducting element via the coupling section, and which has at least one heat-dissipation section which is connected to the coupling section in a heat-conducting manner and through which heat introduced into the heat-dissipation section at least via the coupling section can be dissipated.

[0007] Because the electronic device comprises at least one heat-conducting heat-conducting element arranged on the device housing at the level of the heat-generating area of ​​the electrical or electronic component, the heat generated by the electrical or electronic component can be at least partially absorbed by the heat-conducting heat-conducting element, conducted within the heat-conducting element from the coupling section to the heat-dissipating section, and dissipated there. This cools the electrical or electronic component, reducing the risk of overheating.

[0008] The dissipation of heat through the heat dissipation section of the heat-conducting element can be further improved if the dissipation of heat through the heat dissipation section of the heat-conducting element comprises heat conduction to an adjacent component that is in direct or indirect contact with the heat dissipation section, heat radiation to the environment, and / or convection, in particular forced convection, and / or if the heat-conducting element is arranged on a side of the device housing facing toward or away from the vehicle interior. If the heat-conducting element, with the heat dissipation section, is in direct or indirect contact with a component, heat can be dissipated by means of heat conduction. The amount of heat that can be dissipated through heat conduction can be maximized compared to other heat transfer mechanisms.

[0009] If the heat conducting element with the heat dissipation section is in direct or indirect contact with an adjacent component, it may prove advantageous if the heat conducting element is arranged on a side of the device housing facing away from the vehicle interior, i.e. on the body side.

[0010] The component to which the heat-conducting element is directly or indirectly attached can comprise any component of the motor vehicle. This can, for example, comprise a supporting structure of a vehicle body, such as the vehicle frame, A-pillar, B-pillar, or C-pillar. As a result, the heat-conducting element is connected to the heat-dissipating section of a component of the motor vehicle that has a large volume and thus a high storage capacity for absorbing heat.

[0011] Furthermore, it proves to be advantageous if heat is released to the environment through the heat dissipation section by means of thermal radiation and / or convection.

[0012] In particular, if the heat-conducting element dissipates heat via the heat-dissipating section by thermal radiation to the environment and / or by convection, in particular forced convection, it proves advantageous if the heat-conducting element is arranged on a side facing the vehicle interior. In this case, the available fluid ambient volume is maximum. The absorption of heat via the coupling section and the dissipation of heat via the heat-dissipating section can be increased if the coupling section and / or the heat-dissipating section are flat, if the heat-dissipating section of the heat-conducting element is spaced from the device housing by a free space between the heat-dissipating section and the device housing, and / or if a transition section is arranged between the coupling section and the heat-dissipating section, which transition section runs transversely or obliquely to the coupling section and in a direction away from the device housing.

[0013] If the coupling section is designed as a flat surface, it is directly or indirectly in contact with the device housing in the heat area. The flat design increases the amount of heat absorbed by the coupling section.

[0014] The same applies if the heat dissipation section is designed as a flat surface. The larger the surface area over which the heat can be dissipated by the heat dissipation section, the better the cooling effect of the heat-conducting element.

[0015] The heat dissipation area of ​​the heat dissipation section can be increased by separating the heat dissipation section of the heat-conducting element from the device housing by a gap. This allows the heat dissipation section to dissipate heat over an enlarged free area.

[0016] Because a transition section is arranged between the coupling section and the heat dissipation section, the heat conducting element can be easily spaced from the coupling section directly or indirectly adjacent to the device housing to the surface of the device housing.

[0017] In addition to its spacing function, the heat-dissipating section can also dissipate heat. The heat-conducting element can, in principle, be designed in any desired manner. To ensure compact and simplified use in the electronic device, it is advantageous if the at least one heat-conducting element is rod- or strip-shaped and / or if at least one of the at least one heat-conducting element has a square, in particular triangular, square, hexagonal, or octagonal, or a rounded, in particular circular, oval, or elliptical, cross-section.

[0018] The heat-conducting element can have an extension that is less than the extension of the surface of the device housing on which the heat-conducting element is directly or indirectly arranged. This prevents the heat-conducting element from projecting in the direction of an extension of the surface of the device housing, i.e., from projecting beyond the device housing along a surface vector forming the surface of the device housing.

[0019] The electronic device can be designed to reduce installation space if the heat dissipation section and the coupling section run parallel or obliquely to one another and / or if the heat dissipation section and / or the coupling section each run parallel or obliquely to the surface of the device housing facing away from the electrical or electronic component.

[0020] If the heat dissipation section and the coupling section run parallel to each other and if the heat dissipation section and the coupling section run parallel to the surface of the device housing facing away from the electrical or electronic component, a space-saving design of the electronic device can be ensured. In this case, the transition section arranged between the heat dissipation section and the coupling section can run obliquely or transversely with respect to the surface of the device housing.

[0021] In order to arrange the electrical or electronic component arranged in the device housing in a simple manner in the motor vehicle, the electronic device can comprise at least one planar holder which can be fixed or secured to a vehicle structure and to which the device housing can be fixed or secured detachably, in particular in a force-fitting or form-fitting manner, or non-detachably, in particular in a material force-fitting or form-fitting manner.

[0022] If the device housing can be detachably attached to the holder, the device housing can be easily replaced or repositioned. In this case, the device housing can be clipped or screwed onto the holder.

[0023] The holder can be designed in such a way that it only covers the side of the device housing facing away from the component in one section.

[0024] In such a case, the flat holder can, for example, be designed in the shape of a bracket.

[0025] Furthermore, the planar holder can comprise a plurality of continuous recesses and, in such a case, can be designed in a grid-like manner, particularly on a contact surface extending parallel to the surface of the device housing. In this case, heat from the device housing can be easily dissipated through the holder via the recesses.

[0026] In one embodiment of the electronic device, it can be provided that the holder overlaps the device housing on the side facing away from the component at least at the level of the heat zone, wherein the holder comprises at least one through-opening through which, in the arrangement of the device housing fixed to the holder, at least one of the at least one heat-conducting element passes, in particular in the region of the transition section, wherein the coupling section is arranged between the holder and the device housing and the heat-dissipating section is arranged running on the side of the holder facing away from the device housing and / or wherein the holder comprises at least one through-recess arranged at the level of the side of the device housing opposite the heat zone of the electrical or electronic component, through which the heat-conducting element projects with the coupling section and in its entirety, in particular with the coupling section,Transition section and heat dissipation section, arranged on the side of the holder facing away from the device housing.

[0027] In such a case, the holder can comprise a substantially closed contact surface with which it is arranged on the device housing. By providing a continuous opening through which at least one of the at least one heating elements passes with the transition section, it can be ensured that the heat-conducting heat-conducting element, with its heat-dissipating section, is arranged outside the holder. This can prevent the holder from causing a heat buildup.

[0028] The same applies if the holder includes the continuous recess at the level of the side opposite the heat area of ​​the electrical or electronic component.

[0029] The at least one heat-conducting element can, in principle, be arranged in any desired manner on the side of the device housing opposite the heat zone. Embodiments are conceivable in which at least one of the at least one heat-conducting element is releasably secured to the holder, in particular by force or form-fitting, or non-releasably, in particular by material, force or form-fitting, and / or in which at least one of the at least one heat-conducting element is releasably secured to the device housing, in particular by force or form-fitting, or non-releasably, in particular by material, force or form-fitting.

[0030] If at least one of the at least one heat-conducting element is attached to the holder, it rests against the device housing by arranging the device housing on the holder. This makes it easy to retrofit the electronic device, for example, by re-equipping existing electronic devices with a heat-conducting element and / or a holder.

[0031] If at least one of the at least one heat-conducting element is secured to the device housing, improved cooling can be ensured even when the electronic device is not mounted on a holder. The releasable securing of the heat-conducting element can involve clipping, screwing, or the like.

[0032] If the heat-conducting element is permanently attached to the holder or the device housing, it can, for example, be cast into the holder if the holder comprises, for example, a plastic injection-molded part or it can be glued, welded or soldered to the holder or the device housing.

[0033] In principle, it is conceivable that the heat conducting element lies directly with the coupling section on the device housing and with the heat dissipation section on a component.

[0034] If the heat-conducting element is in direct contact with the device housing via the coupling section and / or with a component via the heat-dissipating section, it is advantageous if the electronic device comprises at least one first filler, such as thermal interface material, in particular gap filler; gap pad and / or PCM film, which is arranged between the coupling section of the heat-conducting element and the device housing and via which the heat-conducting element is indirectly fixed to the device housing and / or if the electronic device comprises at least one second filler, such as thermal interface material I, in particular gap filler; gap pad and / or PCM film, which is arranged between the heat-dissipating section of the heat-conducting element and the component against which the heat-dissipating section is in direct contact.

[0035] The provision of a first filler proves particularly advantageous when the heat-conducting element is attached to the holder. This allows tolerances arising during manufacturing to be easily compensated for by the filler. The same applies to the second filler.

[0036] Furthermore, the first filler and / or the second filler can reduce the risk of acoustic noise. This acoustically dampens acoustic excitations caused by the first filler and / or the second filler.

[0037] In order to ensure that the heat-conducting element is always arranged directly or indirectly on the surface of the device housing when the device housing is arranged on the holder, it proves to be advantageous if the holder comprises at least one clamping means by which at least the coupling section of the heat-conducting element can be clamped in the direction of the device housing.

[0038] The clamping device can, for example, comprise a spring element. Furthermore, the clamping device can form a single, integral component with the holder and be manufactured during an injection-molding process. In such a case, the clamping device can, for example, comprise a hook or clip-like projection projecting toward the device housing.

[0039] In principle, it is conceivable for the electronic device to comprise only a single heat-conducting element. Furthermore, embodiments in which two heat-conducting elements are arranged are also conceivable.

[0040] The heat-conducting elements can, for example, run parallel to one another in the region of their heat-dissipating sections and / or their coupling sections and / or their transition sections. Furthermore, it is conceivable for one of the at least two heat-conducting elements to run with a transition section at an angle to the transition section of the adjacent heat-conducting element.

[0041] In this embodiment, it is conceivable, for example, that the two coupling sections and the two heat dissipation sections of the heat conducting element run parallel to each other.

[0042] Furthermore, it proves to be advantageous if the device housing comprises a heat-conducting material, such as metal, if the holder comprises a plastic and / or if the heat-conducting element comprises a heat-conducting material, such as metal, in particular copper, and is designed as a heat pipe, in particular as a copper pipe.

[0043] If the heat conducting element is designed as a heat pipe, it can comprise a so-called heat pipe.

[0044] Further features, details, and advantages of the invention will become apparent from the appended claims, the drawings, and the following description of preferred embodiments of the electronic device. The drawing shows:

[0045] Figure 1 A rear view of a first embodiment of the electronic device without holder;

[0046] Figure 2 A rear view of a second embodiment of the electronic device with a holder;

[0047] Figure 3 A rear view of a third embodiment of the electronic device;

[0048] Figure 4 A sectional view along the line AA of the embodiment according to Figure 3.

[0049] The figures show exemplary embodiments of an electronic device of a motor vehicle, generally designated by the reference numeral 2.

[0050] The electronic devices 2 each comprise a device housing 4 in which an electrical or electronic component 6 is arranged.

[0051] The figures show embodiments in which the component 6 is arranged in or on the device housing 4 and is at least partially enclosed by the device housing 4. During operation of the component 6, the electronic component 6 has a heat zone 8 in which the component 6 has its maximum temperature.

[0052] Furthermore, the exemplary embodiments of the electronic devices 2 show two heat-conducting heat-conducting elements 10, which, on the side of the device housing 4 facing away from the electrical or electronic component 6, contact the device housing 4 with a coupling section 12, opposite the heat area 8 of the electrical or electronic component 6 with respect to the device housing 4. Heat can be introduced from the device housing 4 into the heat-conducting element 10 via the coupling section 12.

[0053] The heat conducting element 10 also comprises a heat dissipation section 14 which is connected to the coupling section 12 in a heat-conducting manner and through which heat introduced into the heat dissipation section 14 at least via the coupling section 12 can be dissipated.

[0054] The embodiments of the heat-conducting elements 10 shown in the embodiments of the electronic device 2 comprise a transition section 16 which is arranged between the coupling section 12 and the heat-dissipating section 14.

[0055] In the exemplary embodiments of the electronic device 2 shown in the figures, the coupling section 12 and the heat dissipation section 14 run essentially parallel to one another and parallel to the surface of the device housing 4 facing away from the electrical or electronic component 6. The transition section 16 runs obliquely to the coupling section 12 in the direction away from the device housing 4. This ensures that the heat dissipation section 14 is arranged without contact with the device housing 4 through a free space arranged between the coupling section 12 and the device housing 4.

[0056] In the exemplary embodiments of the electronic device 2 shown in the figures, the heat-conducting elements 10 are rod-shaped. The coupling sections 12 and the heat-dissipating sections 14 of the two heat-conducting elements 10 run essentially parallel. The transition section 16 of one of the two heat-conducting elements 10 runs obliquely with respect to the transition section 16 of the adjacent heat-conducting element 10. Figure 1 shows a first exemplary embodiment of the electronic device 2. In this embodiment, the two heat-conducting elements 10 with their coupling sections 12 are arranged on the side of the device housing 4 opposite the heat region 8. The heating elements 10 extend such that they do not protrude beyond the device housing 4 in the image plane according to Figure 1.

[0057] Figure 2 shows a second embodiment of the electronic device 2, in which the device housing 4 with the electrical or electronic component 6 arranged therein is arranged on a holder 18. The holder 18 allows the device housing 4 with the component 6 to be secured to a vehicle structure. The vehicle structure can comprise a component 20 against which the heat-conducting element 10 can be in direct or indirect contact with its heat-dissipating section 14.

[0058] In the embodiment according to Figure 2, the holder 18 comprises a continuous recess 22 on the side facing away from the electrical or electronic component 6, at least at the level of the heat area 8. The two heat-conducting heat-conducting elements 10 extend through this recess 22, so that the heat dissipation section 14 is arranged on a side of the holder 18 facing away from the device housing 4.

[0059] Figure 3 shows a third exemplary embodiment of the electronic device 2, in which the device housing 4, together with the electrical or electronic component 6, is also arranged in a holder 18. The holder 18 shown in Figure 3 comprises a continuous opening 24 through which the two heat-conducting elements 10 extend in the region of their transition sections 16. In the exemplary embodiment according to Figure 3, the heat-conducting elements 10 are also arranged such that they are arranged with their heat-dissipating sections 14 on the side of the holder 18 facing away from the device housing 4.

[0060] Figure 4 shows a section along the line AA according to Figure 3. Furthermore, the illustration according to Figure 4 also shows the component 20 with which the heat dissipation section 14 is in direct contact. Furthermore, a first filler 26 and a second filler 28 can be seen in Figure 4. The first filler 26 is arranged between the coupling section 12 of the heat-conducting element 10 and the device housing 4. This proves to be particularly advantageous when the heat-conducting element 10 is fixed to the holder 18. Manufacturing tolerances can be compensated for by the first filler 26. The first filler 26 comprises a thermal interface material through which heat can be transferred from the device housing 4 to the coupling section 12 of the heat-conducting element 10.

[0061] The same applies to the second filler 28. With the second filler 28, the heat-dissipating section 14 of the heat-conducting element 10 is indirectly in contact with the component 20. Through the first filler 26, the heat-conducting element 10, with its coupling section 12, is indirectly in contact with the device housing 4.

[0062] The features of the invention disclosed in the above description, in the claims, and in the drawings may be essential, both individually and in any combination, for the realization of the invention in its various embodiments within the scope of the following claims.

[0063] Electronic device

[0064] Device housing electrical or electronic component

[0065] Heat range

[0066] Heat-conducting element

[0067] coupling section

[0068] Heat dissipation section

[0069] Transition section

[0070] holder

[0071] component

[0072] recess

[0073] Opening first filler second filler

Claims

P a t e n t a n s p r ü c h e 1. An electronic device (2) of a motor vehicle having a device housing (4), with at least one electrical or electronic component (6) arranged entirely or in sections in the device housing (4) and having its maximum temperature during operation in a heat zone (8), with at least one heat-conducting heat-conducting element (10) arranged on a side of the device housing (4) facing away from the electrical or electronic component (6), opposite the heat zone (8) of the electrical or electronic component (6) with respect to the device housing (4), with a coupling section (12) directly or indirectly touching the device housing (4), wherein heat can be introduced from the device housing (4) into the heat-conducting element (10) via the coupling section (12), and which has at least one heat-dissipating section (14) connected to the coupling section (12) in a heat-conducting manner,through which heat introduced into the heat dissipation section (14) at least via the coupling section (12) can be released., 2. Electronic device (2) according to claim 1, characterized in that the release of heat by the heat release section (14) of the heat conducting element (10) comprises heat conduction to an adjacent component (20) which is in direct or indirect contact with the heat release section (14), heat radiation to the environment and / or convection, in particular forced convection, and / or that the heat conducting element (10) is arranged on a side of the device housing (4) facing or facing away from the vehicle interior.

3. Electronic device (2) according to claim 1 or 2, characterized in that the coupling section (12) and / or the Heat dissipation section (14) is designed to be planar, that the heat dissipation section (14) of the heat-conducting element (10) is spaced from the device housing (4) by a free space between the heat dissipation section (14) and the device housing (4) and / or that a transition section (16) is arranged between the coupling section (12) and the heat dissipation section (14), which transition section runs transversely or obliquely to the coupling section (12) and in the direction away from the device housing (4).

4. Electronic device (2) according to one of the preceding claims, characterized in that the at least one heat-conducting element (10) is rod-shaped or strip-shaped and / or that at least one of the at least one heat-conducting element (10) comprises an angular, in particular triangular, square, hexagonal or octagonal, or a rounded, in particular circular, oval or elliptical, cross-section.

5. Electronic device (2) according to one of the preceding claims, characterized in that the heat dissipation section (14) and the coupling section (12) run parallel or obliquely to one another and / or that the heat dissipation section (14) and / or the coupling section (12) each run parallel or obliquely to the surface of the device housing (4) facing away from the electrical or electronic component (6).

6. Electronic device (2) according to one of the preceding claims, characterized by at least one planar holder (18) which can be or is fixed to a vehicle structure and to which the device housing (4) can be or is fixed detachably, in particular in a force-fitting or form-fitting manner, or non-detachably, in particular in a material force-fitting or form-fitting manner.

7. Electronic device (2) according to claim 6, characterized in that the holder (18) overlaps the device housing (4) on the side facing away from the component (6) at least at the level of the heat zone (8), wherein the holder (18) comprises at least one through-opening (24) through which, in the arrangement of the device housing (4) fixed to the holder (18), at least one of the at least one heat-conducting element (10) passes, in particular in the region of the transition section (16), wherein the coupling section (12) is arranged between the holder (18) and the device housing (4) and the heat-dissipating section (14) is arranged on the side of the holder (18) facing away from the device housing (4), and / or wherein the holder (18) comprises at least one through-opening (22) arranged at the level of the side of the device housing (4) opposite the heat zone (8) of the electrical or electronic component (6),through which the heat-conducting element (10) with the coupling section (12) extends and is arranged in its entirety, in particular with the coupling section (12), transition section (16) and heat-dissipating section (14), on the side of the holder (18) facing away from the device housing (4).

8. Electronic device (2) according to one of the preceding claims, characterized in that at least one of the at least one heat-conducting element (10) is fixed to the holder (18) in a detachable manner, in particular in a force-fitting or form-fitting manner, or in a non-detachable manner, in particular in a material-fitting manner, force-fitting or form-fitting manner, and / or that at least one of the at least one heat-conducting element (10) is fixed to the device housing (4) in a detachable manner, in particular in a force-fitting or form-fitting manner, or in a non-detachable manner, in particular in a material-fitting manner, force-fitting or form-fitting manner.

9. Electronic device (2) according to one of the preceding claims, characterized by at least one first filler (26), such as thermal interface material, in particular gap filler; gap pad and / or PCM Foil which is arranged between the coupling section (12) of the heat-conducting element (10) and the device housing (4) and via which the heat-conducting element (10) is indirectly fixed to the device housing (4) and / or by at least one second filler (28), such as thermal interface material, in particular gap filler; gap pad and / or PCM Foil which is arranged between the heat-dissipation section (14) of the heat-conducting element (10) and the component (20) against which the heat-dissipation section (14) is in direct contact.

10. Electronic device (2) according to one of claims 6 to 9, characterized in that the holder (18) comprises at least one clamping means by which at least the coupling section (12) of the heat-conducting element (10) can be clamped in the direction of the device housing (4).

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