Inductor member and method for manufacturing inductor member

Abstract

An inductor member according to one embodiment of the present invention comprises: a magnetic layer having a first surface, a second surface on the opposite side of the first surface, and a first hole recessed from the first surface to the second surface side; wiring embedded in the magnetic layer and intersecting the first hole; a resin film disposed inside the first hole and including a protruding region protruding from the first surface side to the wiring; and a metal wire having one end exposed from the first surface side and the other end facing the wiring, and electrically connected to the wiring through the protruding region of the resin film.

Description

Inductor element and method for manufacturing the same

[0001] The present invention relates to an inductor element and a method for manufacturing an inductor element.

[0002] Patent Document 1 discloses a sheet-shaped inductor including wiring and a magnetic layer containing magnetic particles, in which the wiring is embedded. Patent Document 1 also discloses that the amount of molten solidified material is small, and that conductive members can be stably formed in vias.

[0003] Japanese Patent Application Laid-Open No. 2022-023413

[0004] Even when a metal member is provided in a via with a high aspect ratio to ensure electrical conduction between the wiring and the outside, it is necessary to prevent short circuits between the metal member and members other than the wiring and to reduce the electrical resistance of the metal member.

[0005] An object of the present invention is to provide an inductor component including a metal component that has reduced electrical resistance while preventing short circuits with components other than wiring, and a method for manufacturing an inductor component.

[0006] An inductor element according to one embodiment of the present invention comprises a magnetic layer having a first surface, a second surface opposite the first surface, and a first hole recessed from the first surface toward the second surface; a wiring embedded in the magnetic layer and intersecting the first hole; a resin film disposed inside the first hole and including a protruding region protruding from the first surface toward the wiring; and a metal wire having one end exposed from the first surface and the other end opposite the wiring, passing through the protruding region of the resin film and electrically connected to the wiring.

[0007] According to the present invention, it is possible to provide an inductor component including a metal component that has reduced electrical resistance while preventing short circuits with components other than wiring, and a method for manufacturing an inductor component.

[0008] 1. A plan view of an inductor element according to a first embodiment. A cross-sectional view of the inductor element according to the first embodiment taken along line II-II in FIG. 1. A cross-sectional view of the magnetic structure taken along the XZ plane. A cross-sectional view of the magnetic structure after first holes have been formed therein, taken along the XZ plane. A cross-sectional view of a mold supporting a plurality of metal wires taken along the XZ plane. A cross-sectional view of a mold and a magnetic structure facing each other taken along the XZ plane. A cross-sectional view of the magnetic structure after metal wires have been arranged taken along the XZ plane. A cross-sectional view of the inductor element according to the first embodiment after a resin film has been formed therein, taken along the XZ plane. A cross-sectional view of an inductor element according to a modified example of the first embodiment taken along the XZ plane. A cross-sectional view of an inductor element according to a second embodiment taken along the XZ plane. A partial plan view of region XI shown in FIG. 10. A cross-sectional view of a mold supporting a plurality of metal wires taken along the XZ plane. A cross-sectional view of an intermediate body including metal wires supported by the mold and a second resin film taken along the XZ plane. A cross-sectional view of an intermediate body including metal wires and a second resin film taken along the XZ plane after separation from the mold. 1 is a cross-sectional view taken along the XZ plane of an intermediate body after a first resin film has been formed; FIG. 1 is a cross-sectional view taken along the XZ plane of an intermediate body after a second hole has been formed; FIG. 2 is a cross-sectional view taken along the XZ plane of an intermediate body with a metal wire disposed inside the second hole; FIG. 3 is a cross-sectional view taken along the XZ plane of an inductor member including a second resin film filled between the sidewall of the second hole and the metal wire; FIG. 4 is a cross-sectional view taken along the XZ plane of an inductor member according to a modified example of the second embodiment; FIG. 5 is a cross-sectional view taken along the XZ plane of an inductor member according to a third embodiment; FIG. 6 is a cross-sectional view taken along the XZ plane of an intermediate body after a resin film has been formed; FIG. 7 is a cross-sectional view taken along the XZ plane of an intermediate body after a metal wire insertion hole has been formed; FIG. 8 is a cross-sectional view taken along the XZ plane of an intermediate body after a metal wire has been disposed in the metal wire insertion hole; FIG. 9 is a cross-sectional view taken along the XZ plane of an intermediate body after a metal paste has been filled; FIG. 10 is a cross-sectional view taken along the XZ plane of an inductor member after a metal member has been formed;

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same components are given the same reference numerals, and duplicated descriptions will be omitted as appropriate.

[0010] The embodiments described below exemplify an inductor element and a method for manufacturing an inductor element to embody the technical ideas of the present disclosure, and are not intended to limit the present disclosure to the embodiments described below. The dimensions, materials, shapes, relative positions, and other details of the components described below are intended for illustrative purposes only, unless otherwise specified. Furthermore, the sizes and positional relationships of elements shown in the drawings may be exaggerated for clarity.

[0011] In the figures shown below, directions may be indicated by the mutually orthogonal X-axis, Y-axis, and Z-axis. The X-axis direction corresponds to the width direction of the inductor element according to the embodiment. The Y-axis direction corresponds to the depth direction of the inductor element according to the embodiment. The Z-axis direction corresponds to the thickness direction of the inductor element according to the embodiment. Directions parallel to the X-axis direction and the Y-axis direction may be referred to as in-plane directions. The Z-axis direction may be referred to as the perpendicular-to-plane direction. The direction in which an arrow points in the X-axis direction is referred to as the +X direction or +X side, and the direction opposite to the +X direction is referred to as the -X direction or -X side. The direction in which an arrow points in the Y-axis direction is referred to as the +Y direction or +Y side, and the direction opposite to the +Y direction is referred to as the -Y direction or -Y side. The direction in which an arrow points in the Z-axis direction is referred to as the +Z direction or +Z side, and the direction opposite to the +Z direction is referred to as the -Z direction or -Z side.

[0012] 1 and 2, an example of the overall configuration of an inductor member 1 according to a first embodiment will be described. Fig. 1 is a plan view of the inductor member 1. Fig. 2 is a cross-sectional view of the inductor member 1 taken along line II-II in Fig. 1.

[0013] 1 and 2, the inductor member 1 has a rectangular sheet shape and includes a magnetic layer 10, wiring 20, a resin film 30, and a metal wire 40. The inductor member 1 may further include a joining member 50 that joins the wiring 20 and the metal wire 40.

[0014] Although the number of wirings 20 shown in FIGS. 1 and 2 is two, it may be one, or three or more. While the figures emphasize key parts, the sheet-shaped inductor component 1 of the present application may be, for example, substantially square or rectangular in plan view. In the case of a square, the length of one side may be, for example, 5 mm or more and 1000 mm or less. The lower limit of the spacing between adjacent wirings 20 may be, for example, 10 μm, preferably 50 μm, and more preferably 100 μm. The upper limit of the spacing between adjacent wirings 20 may be, for example, 5,000 μm, preferably 3,000 μm, and more preferably 1,000 μm. At least a pair of metal wires 40 is connected to each wiring 20. For example, one of the pair of metal wires 40 functions as a terminal electrically connected to an external power supply or the like. The other of the pair of metal wires 40 is electrically connected to a circuit component such as a power supply circuit. When a voltage is applied from an external power supply, a current flows to the circuit member through one metal wire 40, the wiring 20, and the other metal wire 40. Below, each component of the inductor member 1 will be described using an example in which two wirings 20 are aligned in the X-axis direction.

[0015] <Magnetic Layer 10> As shown in Figure 2, the magnetic layer 10 is a sheet-shaped magnetic member having a rectangular planar shape, and has the same outer shape as the inductor member 1 in a planar view. The magnetic layer 10 also has a front surface 10S, a back surface 10B opposite the front surface 10S, and first holes 110. In the illustrated example, the front surface 10S is located on the +Z side. The back surface 10B is located on the -Z side. The front surface 10S is an example of a "first surface." The back surface 10B is an example of a "second surface."

[0016] 2, the first hole 110 is recessed from the front surface 10S of the magnetic layer 10 toward the back surface 10B. The first hole 110 extends from the front surface 10S of the magnetic layer 10 to the wiring 20. More specifically, the first hole 110 has a sidewall 110S extending from the front surface 10S of the magnetic layer 10 toward the −Z side, and a bottom wall 110B extending substantially horizontally from the bottom end of the sidewall 110S. The bottom wall 110B of the first hole 110 is continuous with the conductive wire 21 of the wiring 20. The width of the bottom wall 110B of the first hole 110 may be greater than the diameter of the wiring 20.

[0017] By forming the sidewalls 110S of the first holes 110 along the Z-axis direction, even if the spacing between adjacent first holes 110 in the X-axis direction is narrowed, it is possible to prevent adjacent first holes 110 from connecting with each other. In other words, even if the spacing between adjacent first holes 110 in the X-axis direction is narrowed, it is possible to prevent the metal wires 40 housed in the first holes 110 from coming into contact with each other. This makes it possible to reduce the size of the inductor member 1. However, the shape of the first holes 110 is not limited to this.

[0018] The magnetic layer 10 improves the inductance of the inductor member 1 while also improving the DC bias characteristics of the inductor member 1. The magnetic layer 10 preferably covers the entire outer peripheral surface of the wiring 20, thereby burying the wiring 20 in the magnetic layer 10. The magnetic layer 10 forms the outer shape of the inductor member 1. Specifically, the magnetic layer 10 has a rectangular sheet structure extending in the in-plane directions (X-axis direction and Y-axis direction).

[0019] From the viewpoint of improving inductance and DC bias characteristics, the magnetic layer 10 preferably has a plurality of magnetic layers made of different magnetic materials. More specifically, the magnetic layer 10 has a first magnetic layer 11, a second magnetic layer 12 disposed on the +Z side of the first magnetic layer 11, and a third magnetic layer 13 disposed on the −Z side of the first magnetic layer 11.

[0020] The first magnetic layer 11, the second magnetic layer 12, and the third magnetic layer 13 each have a thickness along the Z-axis direction and extend in the X-axis direction and the Y-axis direction. The first magnetic layer 11, the second magnetic layer 12, and the third magnetic layer 13 may each be made of a magnetic sheet having a different magnetic material. However, the configuration of the first magnetic layer 11, the second magnetic layer 12, and the third magnetic layer 13 is not limited to this.

[0021] 2, the second magnetic layer 12 corresponds to the uppermost layer of the magnetic layer 10. Therefore, the surface 10S of the magnetic layer 10 corresponds to the surface located on the +Z side of the second magnetic layer 12. Furthermore, the third magnetic layer 13 corresponds to the lowermost layer of the magnetic layer 10. Therefore, the back surface 10B of the magnetic layer 10 corresponds to the surface located on the -Z side of the third magnetic layer 13. However, the magnetic layer 10 is not limited to being composed of multiple magnetic layers. The magnetic layer 10 may have a structure having, for example, only the first magnetic layer 11.

[0022] 2, the wiring 20 is embedded inside the first magnetic layer 11. In the example shown in FIGS. 1 and 2, the wiring 20 extends along the Y-axis direction inside the first magnetic layer 11. However, the direction in which the wiring 20 extends is not limited to the Y-axis direction. For example, the direction in which the wiring 20 extends may be an in-plane direction other than the Y-axis direction.

[0023] The first magnetic layer 11 includes magnetic particles and a binder that holds the magnetic particles. The shape of the magnetic particles is not particularly limited, but examples thereof include a substantially spherical shape, a substantially needle shape, and a substantially flat shape.

[0024] The material of the magnetic particles in the first magnetic layer 11 is not particularly limited, but examples thereof include soft magnetic materials and hard magnetic materials. Among these, soft magnetic materials are preferred from the viewpoint of improving the inductance and DC bias characteristics of the inductor member 1.

[0025] Examples of soft magnetic materials include a single metal body containing one type of metal element in a pure substance state, and an alloy body that is a eutectic (mixture) of one or more types of metal elements (first metal elements) and one or more types of metal elements (second metal elements) and / or non-metal elements (carbon, nitrogen, silicon, phosphorus, etc.). These can be used alone or in combination.

[0026] The single metal body may be, for example, a metal element consisting of only one type of metal element (first metal element). The first metal element may be selected from iron (Fe), cobalt (Co), nickel (Ni), and other metal elements that can be contained as the first metal element in a soft magnetic body.

[0027] Examples of the single metal body include a core containing only one type of metal element and a surface layer containing an inorganic and / or organic substance that modifies part or all of the surface of the core, and a form in which an organometallic compound or an inorganic metal compound containing the first metal element has been decomposed (e.g., thermally decomposed). Examples of the decomposed organometallic compound or inorganic metal compound containing the first metal element include iron powder (sometimes referred to as carbonyl iron powder) obtained by thermally decomposing an organoiron compound (specifically, iron pentacarbonyl) containing iron as the first metal element. The location of the layer containing an inorganic and / or organic substance that modifies the part containing only one type of metal element is not limited to the surface as described above. The organometallic compound or inorganic metal compound from which the single metal body can be obtained is not particularly limited and can be appropriately selected from known or commonly used organometallic compounds or inorganic metal compounds that can be used to obtain a single metal body of a soft magnetic material.

[0028] The alloy body is a eutectic of one or more metal elements (first metal elements) and one or more metal elements (second metal elements) and / or non-metal elements (carbon, nitrogen, silicon, phosphorus, etc.), and is not particularly limited as long as it can be used as an alloy body of a soft magnetic material.

[0029] The first metal element is an essential element in the alloy body, and examples thereof include iron (Fe), cobalt (Co), nickel (Ni), etc. If the first metal element is Fe, the alloy body is an Fe-based alloy, if the first metal element is Co, the alloy body is a Co-based alloy, and if the first metal element is Ni, the alloy body is a Ni-based alloy.

[0030] The second metallic element is an element (secondary component) secondarily contained in the alloy body, and is a metallic element that is compatible (eutectic) with the first metallic element, and examples thereof include iron (Fe) (when the first metallic element is other than Fe), cobalt (Co) (when the first metallic element is other than Co), nickel (Ni) (when the first metallic element is other than Ni), chromium (Cr), aluminum (Al), silicon (Si), copper (Cu), silver (Ag), manganese (Mn), calcium (Ca), barium (B), and the like. Examples of the rare earth elements include Ba (Ba), titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), molybdenum (Mo), tungsten (W), ruthenium (Ru), rhodium (Rh), zinc (Zn), gallium (Ga), indium (In), germanium (Ge), tin (Sn), lead (Pb), scandium (Sc), yttrium (Y), strontium (Sr), and various rare earth elements. These may be used alone or in combination of two or more.

[0031] The non-metallic element is an element (secondary component) secondarily contained in the alloy body, and is a non-metallic element that is compatible (eutectic) with the first metallic element, such as boron (B), carbon (C), nitrogen (N), silicon (Si), phosphorus (P), sulfur (S), etc. These may be used alone or in combination of two or more.

[0032] Examples of Fe-based alloys that are examples of alloy bodies include magnetic stainless steel (Fe—Cr—Al—Si alloy) (including electromagnetic stainless steel), sendust (Fe—Si—Al alloy) (including super sendust), permalloy (Fe—Ni alloy), Fe—Ni—Mo alloy, Fe—Ni—Mo—Cu alloy, Fe—Ni—Co alloy, Fe—Cr alloy, Fe—Cr—Al alloy, Fe—Ni—Cr alloy, Fe—Ni—Cr—Si alloy, silicon copper (Fe—Cu—Si alloy), Fe—Si alloy, Fe—Si—B(—Cu—Nb) alloy, Fe—B—Si—Cr alloy, Fe—S Examples of the ferrite include an i-Cr-Ni alloy, an Fe-Si-Cr alloy, an Fe-Si-Al-Ni-Cr alloy, an Fe-Ni-Si-Co alloy, an Fe-N alloy, an Fe-C alloy, an Fe-B alloy, an Fe-P alloy, ferrite (including stainless steel ferrite, and soft ferrites such as Mn-Mg ferrite, Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Cu-Zn ferrite, and Cu-Mg-Zn ferrite), permendur (an Fe-Co alloy), an Fe-Co-V alloy, and an Fe-based amorphous alloy.

[0033] Examples of alloy bodies include Co-based alloys such as Co—Ta—Zr and cobalt (Co)-based amorphous alloys. Examples of Ni-based alloys such as Ni—Cr alloys.

[0034] Examples of binders include thermoplastic components such as acrylic resins and thermosetting components such as epoxy resin compositions. The acrylic resins include, for example, carboxyl-containing acrylic ester copolymers. The epoxy resin compositions include, for example, an epoxy resin (e.g., cresol novolac epoxy resin) as a base component, an epoxy resin curing agent (e.g., phenolic resin), and an epoxy resin curing accelerator (e.g., an imidazole compound).

[0035] As the binder, a thermoplastic component and a thermosetting component can be used alone or in combination, and preferably a thermoplastic component and a thermosetting component are used in combination.

[0036] The thickness of the first magnetic layer 11 is not particularly limited, but is, for example, 100 μm or more, preferably 200 μm or more, and for example, 2000 μm or less, preferably 1500 μm or less, more preferably 1000 μm or less.

[0037] 2, it is preferable that the regions of the first magnetic layer 11 directly above and below each wiring 20 are raised in accordance with the outer circumferential shape of the wiring 20. This allows the first magnetic layer 11 to be provided so as to correspond to the region where a magnetic field is generated around each wiring 20, compared to when the first magnetic layer 11 is flat. Therefore, the inductance can be increased more effectively. However, the shape of the first magnetic layer 11 is not limited to this.

[0038] The second magnetic layer 12 and the third magnetic layer 13 each have magnetic particles and a binder, similar to the first magnetic layer 11. Examples of the magnetic particles of the second magnetic layer 12 and the magnetic particles of the third magnetic layer 13 are the same as the magnetic particles exemplified for the first magnetic layer 11. Examples of the binder of the second magnetic layer 12 and the binder of the third magnetic layer 13 are the same as the binder exemplified for the first magnetic layer 11.

[0039] The second magnetic layer 12 preferably has a higher relative magnetic permeability than the first magnetic layer 11 by appropriately changing the type, shape, etc. of the magnetic particles. This allows the inductance of the inductor member 1 to be increased.

[0040] The third magnetic layer 13 preferably has a higher relative magnetic permeability than the first magnetic layer 11 by appropriately changing the type, shape, etc. of the magnetic particles. This allows the inductance of the inductor member 1 to be increased.

[0041] Furthermore, when the magnetic particles in the first magnetic layer 11 have an isotropic shape, such as a substantially spherical shape, it is preferable that the magnetic particles in the second magnetic layer 12 and the third magnetic layer 13 have an anisotropic shape, such as a substantially flat shape. For example, the first magnetic layer 11 preferably contains iron (Fe) particles whose surfaces are coated with an insulating film. By covering the surfaces of the iron (Fe) particles contained in the first magnetic layer 11 with an insulating film, the electrical resistance of the first magnetic layer 11 can be increased. Therefore, even if a conductive member such as the metal wire 40 comes into contact with the first magnetic layer 11, a short circuit between the conductive member such as the metal wire 40 and the first magnetic layer 11 can be prevented. It is also preferable that at least one of the second magnetic layer 12 and the third magnetic layer 13 contains flat Fe—Si particles. By making the first magnetic layer 11 a layer containing iron (Fe) particles and making at least one of the second magnetic layer 12 and the third magnetic layer 13 a layer containing flat Fe-Si particles, the inductance and DC superposition characteristics of the inductor member 1 can be improved.

[0042] <Wiring 20> The wiring 20 is embedded in the magnetic layer 10. The wiring 20 shown in FIG. 2 is embedded in the first magnetic layer 11 of the magnetic layer 10. However, the position of the wiring 20 is not limited to this. The wiring 20 is electrically connected to the metal wire 40.

[0043] 1, the multiple wirings 20 are arranged at intervals in different positions in the X-axis direction. Each of the multiple wirings 20 extends along the Y-axis direction. Each of the multiple wirings 20 has an inductance according to the length of the wiring 20. When three or more wirings 20 are provided, the intervals between adjacent wirings 20 may be equal or may be different from each other.

[0044] An example of the wiring 20 is an enameled wire. That is, the wiring 20 preferably includes a conductor 21 and an insulating film 22 that covers the conductor 21. The cross-sectional shape of the conductor 21 is circular, but may be other shapes such as an ellipse or a polygon. The radius of the conductor 21 is, for example, 25 μm or more, preferably 50 μm or more, and more preferably 100 μm or more, and for example, 2000 μm or less, preferably 400 μm or less, and more preferably 200 μm or less.

[0045] Examples of materials for the conductor 21 include metal conductors such as copper (Cu), silver (Ag), gold (Au), aluminum (Al), nickel (Ni), and alloys thereof. Copper is preferred. The conductor 21 may have a single-layer structure or a multi-layer structure in which the surface of a core conductor (e.g., copper) is plated with nickel or the like.

[0046] The insulating film 22 protects the conductor 21 from chemicals and water and prevents a short circuit between the conductor 21 and the magnetic layer 10 (first magnetic layer 11). The insulating film 22 covers the outer peripheral surface of the conductor 21. The insulating film 22 has a shape concentric with the conductor 21.

[0047] Examples of materials for the insulating film 22 include insulating resins such as polyvinyl formal, polyester, polyesterimide, polyamide (including nylon), polyimide, polyamideimide, and polyurethane. These may be used alone or in combination of two or more. The insulating film 22 may be composed of a single layer or multiple layers.

[0048] The thickness of the insulating film 22 is generally uniform in the radial direction of the wiring 20 at any position in the circumferential direction, and is, for example, 1 μm or more, preferably 3 μm or more, and for example, 100 μm or less, preferably 50 μm or less. The ratio of the radius of the conductor 21 to the thickness of the insulating film 22 is, for example, 1 or more, preferably 5 or more, and for example, 500 or less, preferably 100 or less.

[0049] The wiring 20 intersects with the first hole 110. As shown in FIG. 2 , the +Z side surface of the wiring 20, from which the conductive wire 21 is exposed, is continuous with the bottom wall 110B of the first hole 110. The other end 40b of the metal wire 40 arranged inside the first hole 110 is electrically connected to the conductive wire 21 through a bonding member 50. Note that if the bonding member 50 is not provided between the wiring 20 and the metal wire 40, the other end 40b of the metal wire 40 is electrically and physically connected to the conductive wire 21.

[0050] <Resin film 30> The resin film 30 is an insulating member that is disposed inside the first hole 110 and includes a protruding region 31 that protrudes from the surface 10S side of the magnetic layer 10 toward the wiring 20. More specifically, as shown in FIG. 2 , the protruding region 31 of the resin film 30 contacts the sidewall 110S of the first hole 110. The protruding region 31 is disposed outside the metal wire 40. In other words, the protruding region 31 of the resin film 30 is disposed between the magnetic layer 10 and the metal wire 40. This prevents a short circuit between the magnetic layer 10 and the metal wire 40.

[0051] 2 is a cylindrical region along the Z-axis direction, with a space formed inside for passing the metal wire 40. However, the shape of the protruding region 31 is not limited to this, as long as it is a region that protrudes from the surface 10S side of the magnetic layer 10 toward the wiring 20.

[0052] The maximum width 31W of the protruding region 31 is preferably 200 μm or more and 1000 μm or less. Furthermore, the maximum width 31W of the protruding region 31 is more preferably 250 μm or more and 800 μm or less, and even more preferably 300 μm or more and 500 μm or less. By adjusting the maximum width 31W of the protruding region 31 within these ranges, the proportion of the space occupied by the protruding region 31 in the inductor component 1 is not too large, and short-circuiting between the magnetic layer 10 and the metal wire 40 can be suppressed. In contrast, if the maximum width 31W of the protruding region 31 is less than 200 μm, for example, the protruding region 31 becomes thin, increasing the possibility of short-circuiting between the magnetic layer 10 and the metal wire 40. Furthermore, if the maximum width 31W of the protruding region 31 exceeds 1000 μm, as the area occupied by the protruding region 31 in the inductor component 1 increases, the space occupied by the magnetic layer 10 decreases, which may affect magnetic properties such as inductance. However, the maximum width 31W of the protruding region 31 is not limited to these ranges.

[0053] The resin film 30 may have a covering region 32 that covers the surface 10S of the magnetic layer 10. By forming the covering region 32, the surface 10S of the magnetic layer 10 can be protected. The covering region 32 is continuous with, for example, the end of the protruding region 31 on the +Z side. The metal wire 40 penetrates the covering region 32 in the Z-axis direction. As a result, one end 40a of the metal wire 40 is exposed from the surface on the +Z side of the covering region 32 and is connected, for example, to an external wiring extending from an external power supply.

[0054] The resin film 30 can be made of any material containing a thermoplastic resin or a thermosetting resin as its main component. For example, resin materials such as epoxy resin and acrylic resin can be used as the material for the resin film 30, but it is preferable to form the resin film 30 by laminating an insulating film containing an epoxy resin as its main component and then thermally curing it. However, the material for the resin film 30 is not limited to these.

[0055] <Metal Wire 40> The metal wire 40 has one end 40a and the other end 40b. The metal wire 40 is a metal member having a linear region between the one end 40a and the other end 40b. The width of the metal wire 40 is arbitrary as long as a space large enough to accommodate the protruding region 31 of the resin film 30 can be secured between the metal wire 40 and the sidewall 110S of the first hole 110. The one end 40a of the metal wire 40 corresponds to the end on the +Z side of the metal wire 40. As shown in FIG. 2, the one end 40a of the metal wire 40 is exposed from the surface 10S of the magnetic layer 10. The other end 40b of the metal wire 40 corresponds to the end on the -Z side of the metal wire 40. The other end 40b of the metal wire 40 faces the wiring 20. The metal wire 40 passes through the protruding region 31 of the resin film 30 and is electrically connected to the conductor 21 of the wiring 20. The linear region and the other end 40 b of the metal wire 40 are surrounded by the protruding region 31 .

[0056] The metal wire 40 is preferably a bulk-shaped metal member, such as a metal pin, before being placed inside the protruding region 31. As shown in FIG. 2 , the metal wire 40 is placed in a high-aspect ratio region with a short diameter formed inside the protruding region 31. Therefore, by using a bulk-shaped metal member, such as a metal pin, as the metal wire 40, it is possible to provide a metal wire 40 with a desired shape and strength, compared to metal members formed inside the protruding region 31, such as a sintered body of metal paste or a metal plating growth. Furthermore, compared to a sintered body of metal paste or a metal plating growth, the occurrence of defects in the metal wire 40 can be suppressed, thereby reducing the electrical resistance of the metal wire 40. As a result, heat generation when current flows through the metal wire 40 can be reduced. Furthermore, by using a bulk-shaped metal member as the metal wire 40, the takt time of the inductor component 1 can be reduced. In other words, the production efficiency of the inductor component 1 can be improved. Furthermore, if the first hole 110 is formed at a position different from the desired position, using a sintered metal paste or a metal plating growth increases the possibility that the metal paste or the plating growth in the process of growth will leak out of the first hole 110. This increases the possibility that the metal paste or the plating growth will come into contact with the magnetic layer 10. On the other hand, using a metal wire 40 that is formed into a bulk shape when placed in the first hole 110 can reduce the possibility that the metal wire 40 will come into contact with the magnetic layer 10. Note that an example of a case in which the first hole 110 is displaced from the desired position is when, in a cross-sectional view such as FIG. 2 , the center position of the first hole 110 in the X-axis direction and the center position of the wiring 20 in the X-axis direction are not on the same straight line extending in the Z-axis direction.

[0057] Examples of materials for the metal wire 40 include copper (Cu), silver (Ag), gold (Au), aluminum (Al), nickel (Ni), tin (Sn), indium (In), bismuth (Bi), and alloys thereof. Among these, copper is preferred because it is relatively inexpensive and has high conductivity. However, the material for the metal wire 40 is not limited to these.

[0058] It is preferable that the width 40W1 of the other end 40b of the metal wire 40 be wider than the width 40W2 of the one end 40a. For example, when the metal wire 40 is placed inside the first hole 110 before the resin film 30 is filled, the metal wire 40 can be easily made upright with the other end 40b of the metal wire 40 in contact with the conductor 21. As a result, the processing accuracy of the inductor component 1 can be improved. Furthermore, when the wiring 20 and the metal wire 40 are joined without the joining member 50, the contact area between the other end 40b and the conductor 21 of the wiring 20 increases, thereby reducing the electrical resistance in the joining region between the wiring 20 and the metal wire 40.

[0059] In the example shown in Fig. 2, the other end 40b has a flange-like shape that protrudes in the in-plane direction. This allows the width 40W1 of the other end 40b to be wider than the width 40W2 of the one end 40a. However, the form in which the width 40W1 of the other end 40b is wider than the width 40W2 of the one end 40a is not limited to this. For example, even if the metal wire 40 has a tapered shape in which the width increases from the one end 40a to the other end 40b, the width 40W1 of the other end 40b can be wider than the width 40W2 of the one end 40a.

[0060] The width 40W1 of the other end 40b may be narrower than the width 40W2 of the one end 40a. Alternatively, the width 40W1 of the other end 40b may be substantially the same as the width 40W2 of the one end 40a. When the width 40W1 of the other end 40b and the width 40W2 of the one end 40a are substantially the same, the entire region of the metal wire 40 has a straight shape.

[0061] The maximum width of the metal wire 40 is preferably 50 μm or more and 800 μm or less. The maximum width of the metal wire 40 is more preferably 100 μm or more and 600 μm or less, and even more preferably 150 μm or more and 400 μm or less. In the example shown in FIG. 2 , the maximum width of the metal wire 40 corresponds to the width 40W1 of the other end 40b.

[0062] Adjusting the maximum width of the metal wire 40 to fall within these ranges makes it possible to miniaturize the inductor component 1. On the other hand, if the maximum width of the metal wire 40 is less than 50 μm, the path of the current flowing through the metal wire 40 will be narrowed, which may increase the electrical resistance of the metal wire 40. Furthermore, if the maximum width of the metal wire 40 exceeds 800 μm, the maximum width 31W of the protruding region 31 and the width of the first hole 110 will be widened, which may hinder miniaturization of the inductor component 1. However, the maximum width of the metal wire 40 is not limited to these ranges.

[0063] <Joining member 50> The joining member 50 is made of a conductive material and is disposed between the other end 40b of the metal wire 40 and the wiring 20. By disposing the joining member 50 between the other end 40b of the metal wire 40 and the wiring 20, the bonding strength between the metal wire 40 and the wiring 20 can be improved. The material of the joining member 50 is preferably a conductive cured product, a sintered body, or a solder alloy obtained from a metal paste or the like. However, the material of the joining member 50 is not limited to these.

[0064] 3 to 8, a method for manufacturing the inductor member 1 according to the first embodiment will be described. The method for manufacturing the inductor member according to the first embodiment includes the steps of preparing the magnetic structure 10M, forming the first holes 110, arranging the metal wires 40, and forming the resin film 30. Each step will be described in detail below.

[0065] <Step of Preparing the Magnetic Structure 10M> The step of preparing the magnetic structure 10M will be described with reference to FIG. 3 . FIG. 3 is a cross-sectional view of the magnetic structure 10M cut along the XZ plane. As shown in FIG. 3 , a magnetic structure 10M is prepared, which has a first surface and a second surface opposite to the first surface, and has a plurality of wirings 20 embedded therein. That is, a sheet-shaped magnetic structure 10M including the magnetic layer 10 and the wirings 20 is prepared. The first surface of the magnetic structure 10M corresponds to the front surface 10S of the magnetic layer 10. In the following description, the first surface of the magnetic structure 10M may be referred to as the "front surface 10S." The second surface of the magnetic structure 10M corresponds to the back surface 10B of the magnetic layer 10. In the following description, the second surface of the magnetic structure 10M may be referred to as the "back surface 10B."

[0066] The magnetic structure 10M shown in FIG. 3 includes a magnetic layer 10 including a first magnetic layer 11, a second magnetic layer 12, and a third magnetic layer 13, and wiring 20. In the process of preparing the magnetic structure 10M, the second magnetic layer 12, the first magnetic layer 11 including a plurality of wirings 20 aligned in the X-axis direction, and the third magnetic layer 13 are stacked in this order, and then the stacked magnetic layers are hot-pressed using a pressure means such as an isostatic press. Preferably, the first magnetic layer 11, the second magnetic layer 12, and the third magnetic layer 13 are each formed by stacking multiple magnetic sheets. This allows the magnetic layer 10 to be produced. However, the method of producing the magnetic structure 10M is not limited to this.

[0067] <Step of Forming First Holes 110> Next, the step of forming the first holes 110 will be described with reference to Fig. 4. Fig. 4 is a cross-sectional view of the magnetic structure 10M after the formation of the first holes 110, taken along the XZ plane. The step of forming the first holes 110 is performed after the step of preparing the magnetic structure 10M.

[0068] The first holes 110 are formed so as to recess from the front surface 10S to the back surface 10B of the magnetic structure 10M and intersect with the wirings 20. In this case, the bottom walls 110B of the first holes 110 reach the conductive wires 21 of the wirings 20. Although not particularly limited, it is preferable that the bottom walls 110B of the first holes 110 reach a position close to the center (core) of the conductive wires 21. For example, two first holes 110 are formed for each wiring 20. In the example shown in FIG. 4, two wirings 20 are provided side by side in the X-axis direction. Therefore, four first holes 110 are formed in the magnetic structure 10M. However, the number of first holes 110 intersecting each wiring 20 is not limited to this.

[0069] The method for forming the first hole 110 is preferably a method using a cutting tool such as a router end mill. Hereinafter, a method using a router end mill will be referred to as a "router processing method." Note that a "router end mill" is a cutting tool attached to a machine tool such as a router machine that performs cutting processing on printed wiring boards, film materials, etc. However, the use of a router machine is not limited to this. In addition, a router end mill has a long, rod-shaped cutting part that extends along the rotation axis and has a blade formed on the side of the cutting part.

[0070] The router processing method uses a rod-shaped cutting tool such as a router end mill. Therefore, a hole with a short diameter and a high aspect ratio can be formed as the first hole 110. Furthermore, the router processing method can cut the +Z side surface of the conductor 21 connected to the bottom wall 110B of the first hole 110 flat. Therefore, when placing the metal wire 40 inside the first hole 110, the metal wire 40 can be easily positioned upright. However, the method for forming the first hole 110 is not limited to the router processing method. Furthermore, by using a tapered router end mill instead of a rod-shaped router end mill, a tapered first hole 110 can be formed. Other methods for forming the first hole 110 include a drilling method using a drill as a cutting tool and a laser processing method in which a hole is formed by irradiating a laser beam.

[0071] After forming the first hole 110, the bonding member 50 may be formed in a region that is continuous with the bottom wall 110B of the first hole 110 and overlaps with the conductive wire 21 of the wiring 20. However, the timing for forming the bonding member 50 is not limited to this. For example, a conductive paste or the like that will eventually become the bonding member 50 may be applied in advance to the other end 40b of the metal wire 40 before it is placed inside the first hole 110.

[0072] <Step of Arranging Metal Wires 40> Next, the step of arranging the metal wires 40 will be described with reference to Fig. 5 to Fig. 7. Fig. 5 is a cross-sectional view of a mold 5M supporting a plurality of metal wires 40, taken along the XZ plane. Fig. 6 is a cross-sectional view of the mold 5M and the magnetic structure 10M facing each other, taken along the XZ plane. Fig. 7 is a cross-sectional view of the magnetic structure 10M after the metal wires 40 have been arranged, taken along the XZ plane. The step of arranging the metal wires 40 is performed after the step of forming the first holes 110.

[0073] First, as shown in Fig. 5, a plurality of metal wires 40 are inserted into a plurality of insertion holes 5H formed in a mold 5M using a device such as an alignment machine. At this time, one end 40a of each metal wire 40 is located inside the insertion hole 5H. The other end 40b of each metal wire 40 is exposed from the insertion hole 5H.

[0074] Here, the mold 5M is a metal or resin member having a thickness in the Z-axis direction and extending in the X-axis and Y-axis directions. The mold 5M has a plurality of insertion holes 5H arranged along the X-axis and Y-axis directions for inserting the metal wires 40. Each of the insertion holes 5H penetrates the mold 5M in the Z-axis direction. The positions of the insertion holes 5H correspond to the positions of the plurality of first holes 110 formed in the magnetic structure 10M when the mold 5M and the magnetic structure 10M are placed opposite each other. The mold 5M may also be provided with a first positioning hole (not shown). The first positioning hole provided in the mold 5M is a hole provided in the Z-axis direction of the mold 5M, and is a hole into which a positioning pin provided in an aligner is inserted. The mold 5M is positioned by inserting the positioning pin of the aligner into the first positioning hole. Note that the positioning pin provided in the aligner is also not shown.

[0075] The metal wire 40 is inserted into the insertion hole 5H in a removable state. In the example shown in FIG. 5 , the other end 40b of the metal wire 40 inserted into the insertion hole 5H is on the +Z side, and one end 40a is on the −Z side. The other end 40b of the metal wire 40 protrudes in the X-axis direction and the Y-axis direction. Therefore, the other end 40b of the metal wire 40 contacts the outer periphery of the insertion hole 5H. This supports the metal wire 40 on the mold 5M. Note that if the metal wire 40 has a straight shape, a support piece extending toward the inside of the insertion hole 5H may be provided at the end on the −Z side of the insertion hole 5H to prevent the metal wire 40 from falling out of the insertion hole 5H. The contact of the one end 40a of the metal wire 40 with the support piece prevents the metal wire 40 from falling out of the insertion hole 5H.

[0076] Subsequently, as shown in FIG. 7, the mold 5M and the magnetic structure 10M are inverted to move each of the plurality of metal wires 40 away from the insertion holes 5H and into the corresponding first holes 110.

[0077] According to this method, the plurality of metal wires 40 supported by the mold 5M can be moved all at once to the corresponding first holes 110 by a simple operation such as inverting the mold 5M, thereby reducing the takt time of the inductor member 1 and improving the production efficiency of the inductor member 1.

[0078] <Step of forming resin film 30> Next, the step of forming the resin film 30 will be described with reference to Fig. 8. Fig. 8 is a cross-sectional view of the inductor member 1 cut along the XZ plane after the resin film 30 has been formed. The step of forming the resin film 30 is performed after the step of arranging the metal wires 40.

[0079] 8, the resin film 30 is formed so as to include a protruding region 31 that is disposed inside the first hole 110 and outside the metal wire 40 and protrudes from the surface 10S of the magnetic structure 10M toward the wiring 20. The resin film 30 may also be formed so as to include a covering region 32 that covers the surface 10S of the magnetic structure 10M.

[0080] An example of a method for forming the resin film 30 is as follows. First, the film-like resin film 30 covers the one end 40a of the metal wire 40 and the surface 10S of the magnetic structure 10M. Next, the film-like resin film 30 is heat-pressed toward the -Z side. As a result, for example, the portion of the film-like resin film 30 that overlaps the first hole 110 fills the space between the first hole 110 and the metal wire 40. Note that heat-pressing is an example of a process using "heat and pressure." Next, the resin film 30 is cured to completely harden it. At this time, the resin film 30 covers the one end 40a of the metal wire 40. Therefore, to remove the resin film 30 covering the one end 40a of the metal wire 40, the surface of the resin film 30 on the +Z side is scraped. As a result, the one end 40a of the metal wire 40 is exposed from the resin film 30.

[0081] Through these steps, the inductor member 1 according to the first embodiment is manufactured. However, manufacturing the inductor member 1 may include other steps as appropriate.

[0082] <Modification> Next, an inductor member 1A according to a modification of the first embodiment will be described with reference to Fig. 9. Fig. 9 is a cross-sectional view of the inductor member 1A according to the modification of the first embodiment, taken along the XZ plane.

[0083] As shown in FIG. 9 , a first convex portion 26 is formed in the metal wire facing region 25 of the wiring 20 facing the other end 40 b of the metal wire 40. A first recess 45 for accommodating the first convex portion 26 is also formed in the other end 40 b of the metal wire 40. With this configuration, the first convex portion 26 fits into the first recess 45, further improving the uprightness of the metal wire 40 arranged inside the first hole 110. A bonding member 50 may also be provided between the first convex portion 26 and the first recess 45. This prevents the metal wire 40 from moving in the in-plane direction. However, a first convex portion may also be formed in the other end 40 b of the metal wire 40, and a first recess for accommodating the first convex portion may also be formed in the metal wire facing region 25 of the wiring 20. In this case, a bonding member 50 may also be provided between the first convex portion and the first recess.

[0084] [Second Embodiment] An inductor member 1B according to a second embodiment will be described with reference to Fig. 10 and Fig. 11. Fig. 10 is a cross-sectional view of the inductor member 1B according to the second embodiment taken along the XZ plane. Fig. 11 is a partial plan view of a region XI shown in Fig. 10.

[0085] 10 , the inductor member 1B according to the second embodiment includes a magnetic layer 10, wiring 20, a resin film 30B, and a metal wire 47. The inductor member 1B may further include a bonding member 50 that bonds the wiring 20 and the metal wire 47. In the second embodiment, the main differences from the first embodiment are the configurations of the resin film 30B and the metal wire 47. In the second embodiment, components similar to those in the first embodiment are denoted by the same reference numerals, and descriptions thereof will be omitted where appropriate.

[0086] <Resin film 30B> The resin film 30B includes a first resin film 310 and a second resin film 320. The first resin film 310 contacts the sidewall 110S of the first hole 110 provided in the magnetic layer 10. A second hole 330 that intersects with the wiring 20 is formed inside the first resin film 310. The second hole 330 is recessed from a surface 310U on the +Z side of the first resin film 310 toward the −Z side. The surface 310U on the +Z side of the first resin film 310 corresponds to the "surface on the front surface 10S side of the magnetic layer 10." The second resin film 320 contacts the sidewall 330S of the second hole 330. The metal wire 47 passes through the inside of the second resin film 320 and is electrically connected to the wiring 20.

[0087] The first resin film 310 includes a protruding region 311 that protrudes toward the −Z side toward the wiring 20. The protruding region 311 shown in FIG. 10 is a cylindrical region that is located along the Z-axis direction and in the outermost region of the resin film 30B that is arranged inside the first hole 110. The −Z side end of the protruding region 311 of the first resin film 310 reaches the conductive wire 21 of the wiring 20. The first resin film 310 may also include a covering region 312 that continues to the +Z side end of the protruding region 311 and covers the surface 10S of the magnetic layer 10.

[0088] 10 is a cylindrical region disposed between the protruding region 311 of the first resin film 310 and the metal wire 47. The -Z side end of the protruding region 321 of the second resin film 320 reaches the conductive wire 21 of the wiring 20. The second resin film 320 may also include a covering region 322 that is continuous with the +Z side end of the protruding region 321 and covers the covering region 312 of the first resin film 310.

[0089] The metal wire 47 is doubly surrounded by the protruding region 311 of the first resin film 310 and the protruding region 321 of the second resin film 320. This more reliably prevents a short circuit between the metal wire 47 and the magnetic layer 10. Furthermore, because the second hole 330 has a shorter diameter than the first hole 110, even if the metal wire 47 is placed inside the second hole 330 before the second resin film 320 is filled, the metal wire 47 does not collapse and can maintain contact with the conductive wire 21. As a result, the yield of the inductor element 1B can be improved.

[0090] 10 , the second hole 330 preferably has a tapered shape that narrows toward the wiring 20. In addition, in accordance with the tapered shape of the second hole 330, the protruding region 321 of the second resin film 320 preferably has a tapered shape that narrows toward the wiring 20.

[0091] When the second hole 330 has a tapered shape, the width of the end on the +Z side of the second hole 330 is wider than the width of the end on the −Z side. Therefore, for example, the second resin film 320 and the metal wire 47 can be easily disposed inside the second hole 330. This can further improve the production efficiency and yield of the inductor component 1B.

[0092] 11 , the planar shape of the second hole 330 is preferably elliptical. Furthermore, in plan view, it is preferable that the minor axis length 331W1 of the ellipse corresponding to the outline of the second hole 330 and the width 47W2 of one end 47a of the metal wire 47 are substantially the same. In this case, in plan view, both ends 331a, 331b of the minor axis of the ellipse corresponding to the outline of the second hole 330 are in contact with the metal wire 47. This allows the metal wire 47 to be supported by the first resin film 310. As a result, the uprightness of the metal wire 47 can be further improved.

[0093] 11 , in plan view, the major axis length 331W2 of the ellipse corresponding to the outline of the second hole 330 is longer than the width 47W2 of one end 47a of the metal wire 47. In other words, a space to be filled with the second resin film 320 is secured between the second hole 330 and the metal wire 47. However, the planar shape of the second hole 330 may be a shape other than an ellipse, such as a circle or a polygon.

[0094] The first resin film 310 and the second resin film 320 may be made of the same insulating material or different insulating materials. The first resin film 310 and the second resin film 320 may be made of any material primarily containing a thermoplastic resin or a thermosetting resin. Examples of materials for the first resin film 310 and the second resin film 320 include resin materials such as epoxy resin and acrylic resin. However, it is preferable to form the first resin film 310 and the second resin film 320 by laminating an insulating film primarily containing epoxy resin and then thermally curing it. However, the materials for the first resin film 310 and the second resin film 320 are not limited to these.

[0095] 10 , the metal wire 47 passes through the second resin film 320 and is electrically connected to the wiring 20. In the metal wire 47, a width 47W2 of one end 47a is wider than a width 47W1 of the other end 47b. This increases the contact area between the one end 47a of the metal wire 47 and the external wiring extending from the external power supply.

[0096] One end 47a of the metal wire 47 has a flange-like shape that protrudes in the in-plane direction. This allows the width 47W2 of the one end 47a to be wider than the width 47W1 of the other end 47b. However, the form in which the width 47W2 of the one end 47a is wider than the width 47W1 of the other end 47b is not limited to this. For example, even if the width of the metal wire 47 is tapered so that it narrows from the one end 47a to the other end 47b, the width 47W2 of the one end 47a can be wider than the width 47W1 of the other end 47b.

[0097] <Joining Member 50> As shown in FIG. 10 , the joining member 50 is composed of a conductive material disposed between the other end 47b of the metal wire 47 and the wiring 20. The material of the joining member 50 is preferably a conductive cured product, a sintered body, or a solder alloy obtained from a metal paste or the like. However, the material of the joining member 50 is not limited to these. Unlike the example shown in FIG. 10 , the joining member 50 may extend to the +Z side from the other end 47b of the metal wire 47. That is, the joining member 50 may be in close contact with the −Z side region of the side of the metal wire 47. This improves the bonding strength between the metal wire 47 and the wiring 20. It also improves the uprightness of the metal wire 47. Furthermore, since the contact area between the joining member 50 and the metal wire 47 and the contact area between the joining member 50 and the wiring 20 are both increased, the electrical resistance in the bonding region between the metal wire 47 and the wiring 20 can be reduced.

[0098] 12 to 18 , a method of manufacturing the inductor member 1B according to the second embodiment will be described. The method of manufacturing the inductor member 1B according to the second embodiment includes the steps of preparing a magnetic structure 10M, inserting a metal wire 47 into an insertion hole 7H of a mold 7M, forming a second resin film 320 so as to cover one end 47 a of the metal wire 47, separating the metal wire 47 and the second resin film 320 from the mold 7M, forming a first hole 110 in the magnetic structure 10M, forming the first resin film 310 in contact with a sidewall 110S of the first hole 110, forming a second hole 330, arranging the metal wire 47 inside the second hole 330, and filling the space between the sidewall 330S of the second hole 330 and the metal wire 47 with the second resin film 320. The process of preparing the magnetic structure 10M and the process of forming the first holes 110 in the magnetic structure 10M are similar to those in the first embodiment, and therefore, the description thereof will be omitted.

[0099] <Step of Inserting Metal Wires 47 into Insertion Holes 7H of Mold 7M> The step of inserting metal wires 47 into insertion holes 7H of mold 7M will be described with reference to Fig. 12. Fig. 12 is a cross-sectional view of mold 7M cut along the XZ plane in a state in which multiple metal wires 47 are inserted into the insertion holes 7H. The step of inserting metal wires 47 into insertion holes 7H of mold 7M may be performed before or after the step of preparing magnetic structure 10M.

[0100] As shown in FIG. 12 , a device such as an alignment machine is used to insert a plurality of metal wires 47 into a plurality of insertion holes 7H formed in a mold 7M. At this time, one end 47a of the metal wires 47 is exposed from the insertion hole 7H. The other end 47b of the metal wire 47 is located inside the insertion hole 7H. One end 47a of the metal wire 47 shown in FIG. 12 has a flange-like shape that protrudes in the in-plane direction. One end 47a of the metal wire 47 contacts the outer peripheral region of the insertion hole 7H of the mold 7M. This supports the metal wire 47 on the mold 7M. The mold 7M may be the same member as the mold 5M of the first embodiment. The mold 7M may also be provided with a first positioning hole similar to that of the mold 5M of the first embodiment.

[0101] <Step of forming second resin film 320 so as to cover one end 47a of metal wire 47> The step of forming second resin film 320 so as to cover one end 47a of metal wire 47 will be described with reference to Fig. 13. Fig. 13 is a cross-sectional view of intermediate body 130 including metal wire 47 supported by mold 7M and second resin film 320, cut along the XZ plane.

[0102] 13, a second resin film 320 is formed so as to cover one end 47a of the metal wire 47 exposed from the insertion hole 7H. Specifically, the film-like second resin film 320 is disposed so as to face one end 47a of the metal wire 47. Next, the second resin film 320 is heat-pressed toward the -Z side. As a result, one end 47a of the metal wire 47 is embedded in the second resin film 320. As a result, the second resin film 320 is formed so as to cover one end 47a of the metal wire 47. However, the method for forming the second resin film 320 is not limited to this.

[0103] <Step of Separating Each of the Metal Wires 47 and the Second Resin Film 320 from the Mold 7M> The step of separating each of the metal wires 47 and the second resin film 320 from the mold 7M will be described with reference to Fig. 14. Fig. 14 is a cross-sectional view of the intermediate 130 including the metal wires 47 and the second resin film 320 after being separated from the mold 7M, cut along the XZ plane.

[0104] First, the mold 7M supporting the metal wire 47 and the second resin film 320 is inverted and moved onto the suction stage 8. Next, the mold 7M is moved toward the +Z side. This separates the mold 7M from the metal wire 47 and the second resin film 320. Alternatively, the mold 7M may be separated from the metal wire 47 and the second resin film 320 by moving the suction stage 8 toward the -Z side, for example, without moving the mold 7M.

[0105] <Step of Forming First Resin Film 310 in Contact with Side Wall 110S of First Hole 110> The step of forming first resin film 310 in contact with side wall 110S of first hole 110 will be described with reference to Fig. 15. Fig. 15 is a cross-sectional view of intermediate body 150 after first resin film 310 has been formed, cut along the XZ plane. The step of forming first resin film 310 in contact with side wall 110S of first hole 110 may be performed before or after the step of inserting metal wire 47 into insertion hole 7H of mold 7M and the step of forming second resin film 320.

[0106] 15 , a first resin film 310 is formed so as to fill the first holes 110 of the magnetic structure 10M. As an example of a method for forming the first resin film 310, a film-like first resin film 310 is laid over the surface 10S and the first holes 110 of the magnetic structure 10M, and then heat-pressed toward the −Z side. This forms the first resin film 310, which includes a covering region 312 that covers the surface 10S of the magnetic structure 10M and a protruding region 311 that fills the first holes 110. The protruding region 311 of the first resin film 310 contacts the sidewall 110S of the first holes 110. However, the method for forming the first resin film 310 is not limited to this.

[0107] <Step of Forming Second Hole 330> The step of forming the second hole 330 will be described with reference to FIG. 16 . FIG. 16 is a cross-sectional view of the intermediate body 160 after the second hole 330 has been formed, cut along the XZ plane. As shown in FIG. 16 , the second hole 330 is formed recessed from the +Z side surface 310U of the first resin film 310. The second hole 330 intersects with the wiring 20 embedded in the magnetic layer 10. The second hole 330 preferably has a tapered shape that narrows toward the wiring 20. Examples of methods for forming the second hole 330 include a router process, a drill process, and a laser process. Among these, the laser process is preferred because it can easily form a tapered second hole 330 as shown in FIG. 16 . This improves the production efficiency of the inductor component 1B. However, the method for forming the second hole 330 is not limited to these.

[0108] <Step of Arranging Metal Wire 47 Inside Second Hole 330> The step of arranging metal wire 47 inside second hole 330 will be described with reference to Fig. 17. Fig. 17 is a cross-sectional view of intermediate body 170, in which metal wire 47 is arranged inside second hole 330, cut along the XZ plane. The step of arranging metal wire 47 inside second hole 330 is performed after the step of forming second hole 330.

[0109] 17 , at least one of the suction stage 8 and the intermediate body 160 is moved to position the other end 47b of the metal wire 47 opposite the conductor wire 21 of the wiring 20. Next, the metal wire 47 and the second resin film 320 are separated from the suction stage 8, and the metal wire 47 is placed inside the second hole 330. Because the second hole 330 has a tapered shape with a wider width on the +Z side, the metal wire 47 can be easily placed inside the second hole 330. This can improve the production efficiency of the inductor component 1B.

[0110] <Step of filling second resin film 320 between sidewall 330S of second hole 330 and metal wire 47> The step of filling second resin film 320 between sidewall 330S of second hole 330 and metal wire 47 will be described with reference to Fig. 18. Fig. 18 is a cross-sectional view of inductor member 1B, taken along the XZ plane, including second resin film 320 filled between sidewall 330S of second hole 330 and metal wire 47.

[0111] First, the second resin film 320, which covers one end 47a of the metal wire 47 and extends in the in-plane direction, is heat-pressed toward the -Z side. As a result, the portion of the second resin film 320 that overlaps the second hole 330 is filled between the sidewall 330S of the second hole 330 and the metal wire 47. Next, the second resin film 320 is cured to completely harden the second resin film 320. At this time, the second resin film 320 covers one end 47a of the metal wire 47. Therefore, in order to remove the second resin film 320 that covers the one end 47a of the metal wire 47, the surface of the second resin film 320 on the +Z side is scraped. As a result, one end 47a of the metal wire 47 is exposed from the second resin film 320.

[0112] Through these steps, the inductor member 1B according to the second embodiment is manufactured. However, other steps may be included as appropriate in manufacturing the inductor member 1B.

[0113] <Modification> Next, an inductor member 1C according to a modification of the second embodiment will be described with reference to Fig. 19. Fig. 19 is a cross-sectional view of the inductor member 1C according to the modification of the second embodiment taken along the XZ plane.

[0114] As shown in FIG. 19 , the wiring 20C in the inductor component 1C includes a second recess 28 recessed toward the −Z side. That is, the conductor 21C of the wiring 20C has a recess corresponding to the second recess 28. The second recess 28 accommodates the other end 48b of the metal wire 48. When a bonding member 50C (described separately) is not disposed between the wiring 20C and the metal wire 48, the contact area between the conductor 21C and the metal wire 48 can be increased, thereby reducing the electrical resistance in the bonding region between the conductor 21C and the metal wire 48. The second recess 28 can be formed simultaneously with the process of forming the second hole 330. In this case, the inner wall surfaces of the second recess 28 and the second hole 330 are continuous.

[0115] Furthermore, a bonding member 50C may be disposed between the second recess 28 and the other end 48b of the metal wire 48. This can further improve the bonding strength between the wiring 20C and the metal wire 48. Furthermore, since the second recess 28 is provided in the wiring 20C, the contact area between the wiring 20C and the bonding member 50C can be increased.

[0116] Third Embodiment An inductor member 1D according to a third embodiment will be described with reference to Fig. 20. Fig. 20 is a cross-sectional view of the inductor member 1D according to the third embodiment cut along the XZ plane.

[0117] As shown in FIG. 20 , an inductor member 1D according to the third embodiment includes a magnetic layer 10, a wiring 20, a resin film 30D, a metal wire 49, and a metal member 60. A bonding member 50 may be disposed between the other end 49b of the metal wire 49 and the wiring 20. The third embodiment differs from the previous embodiments mainly in that it includes a metal member 60. The metal wire 49 shown in FIG. 20 is a straight metal pin (i.e., a metal pin primarily composed of linear regions) extending along the Z-axis direction. However, like the metal wire 40 of the first embodiment and the metal wire 47 of the second embodiment, it may have a flange-shaped end or the other end extending in the in-plane direction. The resin film 30D may be similar to the resin film 30 of the first embodiment, except that it is disposed away from the metal wire 49. In the third embodiment, components similar to those in the previous embodiments are designated by the same reference numerals, and descriptions thereof will be omitted where appropriate.

[0118] <Metal Member 60> The metal member 60 is disposed in the region between the protruding region 31D of the resin film 30D and the side surface of the metal wire 49. The metal member 60 is in close contact with the side surface of the metal wire 49. In the example shown in FIG. 20 , one end 49a of the metal wire 49 is located on the +Z side of the +Z surface of the metal member 60. However, the one end 49a of the metal wire 49 may also be located on the -Z side of the +Z surface of the metal member 60. In other words, the metal member 60 may cover the entire side surface of the metal wire 49. The material of the metal member 60 is preferably a conductive cured product, a sintered body, or a solder alloy obtained from a metal paste or the like. However, the material of the metal member 60 is not limited to these. 20, the -Z side surface (the end surface on the other end 49b side) of the metal wire 49 and the conductor 21 of the wiring 20 are in contact with each other, but the metal member 60 may extend to at least a part of the region between the -Z side surface of the metal wire 49 and the conductor 21. Furthermore, a joining member 50 made of the same material as or a different material from the metal member 60 may be disposed in the region between the -Z side surface of the metal wire 49 and the conductor 21.

[0119] By providing the metal member 60 that is in close contact with the side surface of the metal wire 49, it is possible to improve the bonding strength between the metal wire 49 and the wiring 20. In addition, it is possible to reduce the electrical resistance in the bonding region between the metal wire 49 and the wiring 20.

[0120] <Method of Manufacturing Inductor Element 1D> Next, a method of manufacturing an inductor element 1D according to the third embodiment will be described with reference to Figures 21 to 25. The method of manufacturing an inductor element 1D according to the third embodiment includes the steps of preparing a magnetic structure 10M, forming first holes 110 in the magnetic structure 10M, forming a resin film 30D, forming metal wire insertion holes 410 in the resin film 30D, arranging metal wires 49 in the metal wire insertion holes 410, and forming a metal element 60. The steps of preparing the magnetic structure 10M and forming the first holes 110 in the magnetic structure 10M are the same as those in the first embodiment, and therefore will not be described again.

[0121] <Step of Forming Resin Film 30D> The step of forming the resin film 30D will be described with reference to Fig. 21. Fig. 21 is a cross-sectional view of the intermediate body 181 after the resin film 30D has been formed, cut along the XZ plane. The step of forming the resin film 30D is performed after the step of forming the first holes 110 in the magnetic structure 10M.

[0122] 21 , a resin film 30D is formed to fill the first holes 110. As an example of a method for forming the resin film 30D, the surface 10S of the magnetic structure 10M and the first holes 110 are respectively covered with the film-like resin film 30D, and then the film-like resin film 30D is heat-pressed toward the −Z side. As a result, the first holes 110 are filled with the resin film 30D.

[0123] <Step of Forming Metal Wire Insertion Holes 410 in Resin Film 30D> Next, with reference to FIG. 22 , a step of forming the metal wire insertion holes 410 in the resin film 30D will be described. FIG. 22 is a cross-sectional view of the intermediate body 182 after the metal wire insertion holes 410 have been formed, cut along the XZ plane. As shown in FIG. 22 , the metal wire insertion holes 410 are formed recessed from the +Z side surface 30DU of the resin film 30D. The metal wire insertion holes 410 intersect with the wiring 20. Examples of methods for forming the metal wire insertion holes 410 include a router process, a drill process, and a laser process. In the example shown in FIG. 22 , the −Z side end (bottom wall) of the metal wire insertion hole 410 is positioned approximately in the Z-axis direction as the −Z side end (bottom wall) of the first hole 110. However, the −Z side end of the metal wire insertion hole 410 may be positioned closer to the −Z side than the −Z side end of the first hole 110. In addition, as the metal wire insertion hole 410 is formed, a protruding region 31D that protrudes from the surface 10S of the magnetic structure 10M toward the wiring 20 side and a covering region 32D that covers the surface 10S of the magnetic structure 10M are formed in the resin film 30D.

[0124] <Step of Placing Metal Wires 49 in Metal Wire Insertion Holes 410> Next, with reference to FIG. 23 , a step of placing metal wires 49 in the metal wire insertion holes 410 will be described. FIG. 23 is a cross-sectional view of the intermediate body 183 after the metal wires 49 have been placed in the metal wire insertion holes 410, taken along the XZ plane. The method of placing the metal wires 49 in the metal wire insertion holes 410 may be the same as that of the first embodiment. That is, the metal wires 49 are inserted into the insertion holes 5H (see FIG. 5 ) of the mold 5M using a device such as an alignment machine. Next, the mold 5M and the intermediate body 182 (see FIG. 22 ) are brought into opposition to each other, and the mold 5M and the intermediate body 182 are inverted. This moves the metal wires 49 from the insertion holes 5H of the mold 5M to the metal wire insertion holes 410.

[0125] <Step of forming metal member 60> Next, with reference to Figures 24 and 25, a step of forming the metal member 60 will be described. Note that the step of forming the metal member 60 described below involves sintering the metal paste 60B to form the metal member 60, but the metal member 60 may be made from a conductive material other than the metal paste 60B. Figure 24 is a cross-sectional view of the intermediate body 184 after being filled with the metal paste 60B, taken along the XZ plane. Figure 25 is a cross-sectional view of the inductor member 1D after the metal member 60 has been formed, taken along the XZ plane.

[0126] First, as shown in Fig. 24, one end 49a of the metal wire 49, the metal wire insertion hole 410, and the covered region 32D of the resin film 30D are covered with a metal paste 60B for obtaining the metal member 60 and a retaining film 65 that retains the metal paste 60B. Next, the retaining film 65 is pressed toward the -Z side. As a result, as shown in Fig. 24, the metal paste 60B retained by the retaining film 65 fills the space between the protruding region 31D of the resin film 30D and the side surface of the metal wire 49.

[0127] Next, the support film 65 is peeled off from the metal paste 60B. Next, the solvent in the metal paste 60B is volatilized. Next, the metal paste 60B located on the +Z side of the covered region 32D of the resin film 30D is removed. This exposes the covered region 32D of the resin film 30D, as shown in FIG. 25 . Next, the metal paste 60B is sintered using any heating means to form the metal member 60. The +Z side region of the covered region 32D, the +Z side region of the metal wire 49, and the +Z side region of the metal member 60 may be polished. After polishing, the +Z side surface of the covered region 32D, the +Z side surface of the metal wire 49, and the +Z side surface of the metal member 60 may be substantially identical in the Z-axis direction. Through these processes, the inductor component 1D according to the third embodiment is manufactured. However, other processes may be included as appropriate when manufacturing the inductor component 1D.

[0128] Fourth Embodiment An inductor member 1E according to a fourth embodiment will be described with reference to Fig. 26. Fig. 26 is a cross-sectional view of the inductor member 1E according to the fourth embodiment cut along the XZ plane.

[0129] As shown in FIG. 26 , an inductor member 1E according to the fourth embodiment includes a magnetic layer 10, a wiring 20, a resin film 30, a metal wire 40E, and a bonding member 50E. The fourth embodiment differs from the previous embodiments mainly in the configuration of the bonding member 50E. In the example shown in FIG. 26 , the metal wire 40E is a straight metal pin extending along the Z-axis direction. However, as in the previous embodiments, the metal wire 40E may have one or the other flange-shaped end extending in an in-plane direction. In the example shown in FIG. 26 , the diameter of the wiring 20 and the maximum width of the protruding region 31 of the resin film 30 are substantially the same. However, as in the previous embodiments, the maximum width of the protruding region 31 may be longer than the diameter of the wiring 20. In the fourth embodiment, components similar to those in the previous embodiments are designated by the same reference numerals, and descriptions thereof will be omitted where appropriate.

[0130] The bonding member 50E of the inductor member 1E is disposed inside the insulating film 22 of the wiring 20 and is electrically and physically connected to the conductive wire 21. The bonding member 50E also includes a third recess 51 recessed toward the -Z side. The third recess 51 accommodates the other end 40E2 of the metal wire 40E. This increases the contact area between the bonding member 50E and the metal wire 40E, thereby reducing the electrical resistance in the bonding region between the bonding member 50E and the metal wire 40E. The third recess 51 may be formed, for example, using a known method after the first hole 110 is formed.

[0131] The bonding member 50E covers the other end 40E2 of the metal wire 40E and the region of the side surface of the metal wire 40E on the side of the other end 40E2 (the -Z side of the side surface of the metal wire 40E). This reduces the possibility that the metal wire 40E will be tilted with respect to the Z-axis direction after being placed inside the first hole 110. As a result, the processing accuracy of the inductor member 1E can be improved.

[0132] The manufacturing method of the inductor member 1E may be similar to that of the inductor member 1 according to the first embodiment, except that the bonding member 50E is disposed inside the insulating film 22 of the wiring 20, a third recess 51 is formed in the bonding member 50E, and the metal wire 40E is disposed inside the first hole 110 so that the other end 40E2 of the metal wire 40E fits into the third recess 51. In the example shown in FIG. 26 , the metal wire 40E is a straight metal pin. Therefore, in the step of disposing the metal wire 40E, for example, the metal wire 40E may be supported in the insertion hole 5H (see FIG. 5 ) of the mold 5M using a support piece extending inside the insertion hole 5H.

[0133] The aspects of the present disclosure are as follows, for example. <1> An inductor component comprising: a magnetic layer having a first surface, a second surface opposite to the first surface, and a first hole recessed from the first surface toward the second surface; a wiring embedded in the magnetic layer and intersecting the first hole; a resin film disposed inside the first hole and including a protruding region protruding from the first surface toward the wiring; and a metal wire having one end exposed from the first surface and the other end facing the wiring, the metal wire passing through the protruding region of the resin film and electrically connected to the wiring. <2> The inductor component according to <1>, wherein the other end of the metal wire has a width wider than the width of the one end. <3> The inductor component according to <1>, wherein the one end of the metal wire has a width wider than the width of the other end. <4> The inductor component according to any one of <1> to <3>, further comprising a bonding member disposed between the other end of the metal wire and the wiring. <5> The inductor component according to any one of <1> to <4>, further comprising a metal member in close contact with a side surface of the metal wire. <6> The inductor component according to any one of <1> to <5>, wherein the resin film comprises: a first resin film in contact with a side wall of the first hole; a second hole recessed from the surface of the first resin film on the first surface side and intersecting with the wiring; and a second resin film in contact with a side wall of the second hole, and the metal wire is electrically connected to the wiring through the second resin film. <7> The inductor component according to <6>, wherein the second resin film has a tapered shape whose width narrows toward the wiring. <8> The inductor component according to <6> or <7>, wherein the second hole has an elliptical planar shape, and two points of the second hole corresponding to both ends of the minor axis of the ellipse in a planar view respectively contact the metal wire. <9> The inductor component according to any one of <1> to <8>, wherein a first convex portion is formed on one side of the other end of the metal wire and a metal wire facing region of the wiring that faces the other end of the metal wire, and a first concave portion that accommodates the first convex portion is formed on the other side of the other end of the metal wire and the metal wire facing region of the wiring.<10> The inductor component according to any one of <1> to <9>, wherein the wiring includes a second recess that accommodates the other end of the metal wire. <11> The inductor component according to <4>, wherein the joining member includes a third recess that accommodates the other end of the metal wire. <12> The inductor component according to any one of <1> to <11>, wherein the magnetic layer includes magnetic particles having surfaces coated with an insulating film. <13> The inductor component according to any one of <1> to <12>, wherein the magnetic layer includes a first magnetic layer that embeds the wiring, and a second magnetic layer that is stacked on the first magnetic layer so as to be located closer to the first surface than the first magnetic layer. <14> The inductor component according to <13>, wherein the first magnetic layer includes iron (Fe) particles having surfaces coated with an insulating film, and the second magnetic layer includes flat Fe—Si particles. <15> The inductor component according to <13> or <14>, wherein the first magnetic layer is made of a magnetic sheet containing a magnetic material, and the second magnetic layer is made of a magnetic sheet containing a magnetic material and separate from the magnetic sheet constituting the first magnetic layer. <16> The inductor component according to any one of <1> to <15>, wherein the wiring comprises a conductor wire and an insulating film covering the conductor wire. <17> The inductor component according to any one of <1> to <16>, wherein the maximum width of the metal wire is 50 μm or more and 800 μm or less. <18> The inductor component according to any one of <1> to <17>, wherein the maximum width of the protruding region of the resin film is 200 μm or more and 1000 μm or less. <19> A method for manufacturing an inductor component, comprising: preparing a magnetic structure having a first surface and a second surface opposite the first surface, and having a plurality of wirings embedded therein; forming a first hole recessed from the first surface toward the second surface and intersecting with the wirings; arranging a metal wire inside the first hole, the metal wire being electrically connected to the wirings; and forming a resin film inside the first hole, wherein the metal wire passes through a protruding region of the resin film protruding from the first surface side toward the wirings.<20> The method for manufacturing an inductor component according to <19>, wherein the step of forming the first hole, the step of arranging the metal wire, and the step of forming the resin film are carried out in this order, and in the step of forming the resin film, the resin film is formed so that the protruding region is arranged inside the first hole and outside the metal wire. <21> The method for manufacturing an inductor element according to <19>, further comprising: a step of forming a metal wire insertion hole in the resin film; and a step of forming a metal member, wherein the steps of forming the first hole, forming the resin film, forming the metal wire insertion hole in the resin film, arranging the metal wire, and forming the metal member are carried out in this order; in the step of forming the metal wire insertion hole in the resin film, the protruding region is formed in the resin film as a result of the formation of the metal wire insertion hole in the resin film; in the step of arranging the metal wire, the metal wire is arranged inside the metal wire insertion hole with the metal wire and the protruding region spaced apart; and in the step of forming the metal member, the metal member is formed between the metal wire insertion hole and the metal wire. <22> The method for manufacturing an inductor component according to any one of <19> to <21>, wherein in the step of arranging the metal wire, the metal wire is removably inserted into an insertion hole formed in a mold so that one end of the metal wire is inside the insertion hole and the other end of the metal wire is exposed from the insertion hole, the mold and the magnetic structure are opposed to each other so that the other end exposed from the insertion hole faces the first hole of the magnetic structure, and the mold and the magnetic structure are inverted to move the metal wire into the first hole.<23> A step of preparing a magnetic structure having a first surface and a second surface opposite to the first surface, and having a plurality of wirings embedded therein; a step of inserting a metal wire into an insertion hole formed in a mold in a removably state so that one end of the metal wire is exposed from the insertion hole; a step of forming a second resin film so as to cover the one end exposed from the insertion hole; a step of separating each of the metal wire and the second resin film from the mold; a step of forming a first hole recessed from the first surface of the magnetic structure toward the second surface; a step of forming a first resin film in contact with a side wall of the first hole; a step of forming a second hole recessed from the surface of the first resin film on the first surface side and intersecting with the wiring; a step of arranging the metal wire separated from the mold inside the second hole so that the other end of the metal wire faces the wiring; a step of heating and pressurizing the second resin film covering the one end of the metal wire, thereby filling the second resin film at least between the side wall of the second hole and the metal wire.

[0134] This international application claims priority based on Japanese Patent Application No. 2024-042594, filed on March 18, 2024, the entire contents of which are incorporated herein by reference.

[0135] REFERENCE SIGNS LIST 1, 1A, 1B, 1C, 1D, 1E Inductor member 10 Magnetic layer 10M Magnetic structure 11 First magnetic layer 12 Second magnetic layer 13 Third magnetic layer 110 First hole 20, 20C Wiring 21 Conductive wire 22 Insulating film 25 Metal wire facing region 26 First convex portion 28 Second concave portion 30, 30B, 30D Resin film 310 First resin film 320 Second resin film 330 Second hole 40, 47, 48, 49, 40E Metal wire 45 First concave portion 50, 50C, 50E Joint member 51 Third concave portion 60 Metal member

Claims

1. An inductor component comprising: a magnetic layer having a first surface, a second surface opposite the first surface, and a first hole recessed from the first surface toward the second surface; a wiring embedded in the magnetic layer and intersecting with the first hole; a resin film disposed inside the first hole and including a protruding region protruding from the first surface toward the wiring; and a metal wire having one end exposed from the first surface and the other end facing the wiring, passing through the protruding region of the resin film and electrically connected to the wiring.

2. The inductor element according to claim 1, wherein the width of the other end of the metal wire is wider than the width of the one end.

3. The inductor element according to claim 1, wherein the width of said one end of said metal wire is wider than the width of said other end.

4. The inductor element according to claim 1, further comprising a joining member disposed between the other end of the metal wire and the wiring.

5. The inductor element according to claim 1, further comprising a metal element in close contact with a side surface of the metal wire.

6. An inductor component as described in claim 1, wherein the resin film comprises: a first resin film in contact with a side wall of the first hole; a second hole recessed from the surface of the first resin film on the first surface side and intersecting with the wiring; and a second resin film in contact with a side wall of the second hole; and the metal wire passes through the second resin film and is electrically connected to the wiring.

7. The inductor component according to claim 6, wherein the second resin film has a tapered shape that narrows toward the wiring.

8. The inductor component according to claim 6, wherein the second hole has an elliptical planar shape, and two points of the second hole corresponding to both ends of the minor axis of the ellipse in plan view are in contact with the metal wire.

9. An inductor component according to claim 1, wherein a first convex portion is formed on one side of the other end of the metal wire and a metal wire facing region of the wiring that faces the other end of the metal wire, and a first concave portion that accommodates the first convex portion is formed on the other side of the other end of the metal wire and the metal wire facing region of the wiring.

10. The inductor element according to claim 1, wherein the wiring has a second recess that accommodates the other end of the metal wire.

11. The inductor element according to claim 4, wherein the joining element has a third recess that receives the other end of the metal wire.

12. The inductor component according to claim 1, wherein the magnetic layer includes magnetic particles whose surfaces are coated with an insulating film.

13. An inductor component according to claim 1, wherein the magnetic layer comprises a first magnetic layer in which the wiring is embedded, and a second magnetic layer stacked on the first magnetic layer so as to be positioned closer to the first surface than the first magnetic layer.

14. The inductor component according to claim 13, wherein the first magnetic layer contains iron (Fe) particles whose surfaces are coated with an insulating film, and the second magnetic layer contains flat Fe-Si particles.

15. An inductor component according to claim 13, wherein the first magnetic layer is made of a magnetic sheet containing a first magnetic material, and the second magnetic layer is made of a magnetic sheet containing a second magnetic material different from the first magnetic material.

16. The inductor component according to claim 1, wherein the wiring comprises a conductor and an insulating film covering the conductor.

17. The inductor component according to claim 1, wherein the maximum width of the metal wire is 50 μm or more and 800 μm or less.

18. The inductor component according to claim 17, wherein the maximum width of the protruding region of the resin film is 200 μm or more and 1000 μm or less.

19. A method for manufacturing an inductor component, comprising the steps of: preparing a magnetic structure having a first surface and a second surface opposite the first surface, and having a plurality of wirings embedded therein; forming a first hole recessed from the first surface toward the second surface and intersecting with the wirings; arranging a metal wire inside the first hole, the metal wire being electrically connected to the wirings; and forming a resin film inside the first hole, wherein the metal wire passes through a protruding region of the resin film that protrudes from the first surface side toward the wirings.

20. A method for manufacturing an inductor component as described in claim 19, wherein the steps of forming the first hole, arranging the metal wire, and forming the resin film are carried out in this order, and in the step of forming the resin film, the resin film is formed so that the protruding region is positioned inside the first hole and outside the metal wire.

21. A method for manufacturing an inductor element as set forth in claim 19, further comprising the steps of: forming a metal wire insertion hole in the resin film; and forming a metal member; wherein the steps of forming the first hole, forming the resin film, forming the metal wire insertion hole in the resin film, arranging the metal wire, and forming the metal member are carried out in this order; in the step of forming the metal wire insertion hole in the resin film, the protruding region is formed in the resin film as a result of the metal wire insertion hole being formed in the resin film; in the step of arranging the metal wire, the metal wire is arranged inside the metal wire insertion hole with the metal wire and the protruding region separated from each other; and in the step of forming the metal member, the metal member is formed between the metal wire insertion hole and the metal wire.

22. A method for manufacturing an inductor component as described in claim 19, wherein in the step of arranging the metal wire, the metal wire is removably inserted into an insertion hole formed in a mold so that one end of the metal wire is inside the insertion hole and the other end of the metal wire is exposed from the insertion hole, the mold and the magnetic structure are opposed to each other so that the other end exposed from the insertion hole faces the first hole of the magnetic structure, and the mold and the magnetic structure are inverted to move the metal wire inside the first hole.

23. A process for preparing a magnetic structure having a first surface and a second surface opposite the first surface, and having a plurality of wirings embedded therein; a process for inserting a metal wire into an insertion hole formed in a mold in a removably manner so that one end of the metal wire is exposed from the insertion hole; a process for forming a second resin film so as to cover the one end exposed from the insertion hole; a process for separating the metal wire and the second resin film from the mold; a process for forming a first hole recessed from the first surface of the magnetic structure toward the second surface; a process for forming a first resin film in contact with a side wall of the first hole; a process for forming a second hole recessed from the surface of the first resin film on the first surface side and intersecting with the wiring; a process for arranging the metal wire separated from the mold inside the second hole so that the other end of the metal wire faces the wiring; a step of heating and pressurizing the second resin film covering the one end of the metal wire, thereby filling the second resin film at least between the side wall of the second hole and the metal wire.

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