Patterning inorganic substrates using sacrificial mold

Abstract

A method (100) of patterning an inorganic substrate (22) includes depositing a sacrificial material (202, 202a, 202b) on a separable carrier (201). The sacrificial material (202, 202a, 202b) may include a first surface (210, 30) and a second surface (212, 40) opposite the first surface (210, 30) and a patterning feature (205) including an aspect ratio greater than or equal to 0.1. The method (100) may further include depositing a slurry (203, 203a, 203b) such that the slurry (203, 203a, 203b) is positioned on the sacrificial material (202, 202a, 202b) or the sacrificial material (202, 202a, 202b) is positioned on the slurry (203, 203a, 203b). The slurry (203, 203a, 203b) includes an inorganic powder, a binder, and a solvent. The method (100) further includes curing the slurry (203, 203a, 203b) to evaporate the solvent, thereby forming a green body.

Description

PATTERNING INORGANIC SUBSTRATES USING SACRIFICIAL MOLDCross Reference to Related Application

[0001] This application claims the benefit of priority under 35 U.S. C. §119 of U.S. Provisional Application Serial No. 63 / 568187 filed on March 21, 2024, the content of which is relied upon and incorporated herein by reference in its entirety.Field

[0002] The present specification generally relates to inorganic substrates and, in particular, to inorganic substrates and methods of patterning the same using a sacrificial mold.Technical Background

[0003] Inorganic substrates, such as ceramic substrates for solid oxide electrolysis cells (SOEC), solid oxide fuel cells (SOFC), batteries, and other applications, often benefit from precise patterning, such as features with high aspect ratios, to enhance their performance and efficiency. However, conventional processes may not be able to form inorganic substrates having high aspect ratios (e.g., greater than or equal to 0.1).

[0004] Accordingly, a need exists for inorganic substrates with high aspect ratios and methods of making the same.SUMMARY

[0005] According to a first aspect Al, a method for patterning an inorganic substrate may comprise: depositing a sacrificial material on a separable carrier, the sacrificial material comprising: a first surface and a second surface opposite the first surface; and a patterning feature comprising an aspect ratio greater than or equal to 0.1; depositing a slurry such that the slurry is positioned on the sacrificial material or the sacrificial material is positioned on the slurry, whereinthe slurry comprises an inorganic powder, a binder, and a solvent; and curing the slurry to evaporate the solvent, thereby forming a green body.

[0006] A second aspect A2 includes the method according to the first aspect Al , wherein the slurry is deposited prior to depositing the sacrificial material.

[0007] A third aspect A3 includes the method according to either the first or second aspects Al- A2, wherein the method further comprises: heating the green body above a first temperature to remove at least a portion of the binder, thereby forming a brown body; and heating the brown body above a second temperature to sinter the inorganic powder, thereby forming the inorganic substrate.

[0008] A fourth aspect A4 includes the method according to the third aspect A3, wherein the separable carrier is removed prior to heating the green body.

[0009] A fifth aspect A5 includes the method according to any of the first through fourth aspects A1-A4, wherein the inorganic powder comprises glass, ceramic, or a combination thereof.

[0010] According to a sixth aspect, A6, a ceramic substrate may comprise: a first surface and a second surface opposite the first surface; a thickness extending from the first surface to the second surface; and a plurality of features extending across the thickness, wherein at least one of the plurality of features comprises an aspect ratio greater than or equal to 0.1.

[0011] A seventh aspect A7 includes the ceramic substrate according to the sixth aspect A6, wherein at least one of the features extends across greater than or equal to 10% of the thickness.

[0012] An eighth aspect A8 includes the ceramic substrate according to either the sixth or seventh aspects A6-A7, wherein at least one of the features comprises an enclosed channel.

[0013] A ninth aspect A9 includes the ceramic substrate according to any of the sixth through eighth aspects A6-A8, wherein at least one of the first surface and the second surface comprises a patterned surface such that at least one of the plurality of features extends from the first surface or the second surface towards the other of the first surface or the second surface.

[0014] A tenth aspect A10 includes the ceramic substrate according to any of the sixth through ninth aspects A6-A9, wherein the aspect ratio is greater than or equal to 1.

[0015] According to an eleventh aspect Al 1, a battery may comprise: an electrode comprising the ceramic substrate of according to any of the sixth through tenth aspects A6-A10; and an electrolyte region penetrating a porous region of a cathode.

[0016] According to a twelfth aspect A12, a mold may comprise: a separable carrier; and a sacrificial material disposed adjacent to the separable carrier, wherein the sacrificial material comprises: a first surface and a second surface opposite the first surface; and a patterning feature comprising an aspect ratio greater than or equal to 0.1.

[0017] A thirteenth aspect Al 3 includes the mold according to the twelfth aspect Al 2, wherein the sacrificial material has a boiling point greater than or equal to 350 °C and less than or equal to 1000 °C.

[0018] A fourteenth aspect Al 4 includes the mold according to either the twelfth or thirteenth aspects A12-A13, wherein the sacrificial material comprises acrylate, wax, or a combination thereof.

[0019] A fifteenth aspect Al 5 includes the mold according to any of the twelfth through fourteenth aspects A12-A14, wherein at least one of the first surface and the second surface comprises a patterned surface such that the patterning feature extends from the first surface or the second surface towards the other of the first surface or the second surface.

[0020] A sixteenth aspect Al 6 includes the mold according to any of the twelfth through fifteenth aspects A12-A15, further comprising a slurry, wherein: the slurry is positioned on the sacrificial material; the sacrificial material is positioned on the slurry; or a combination thereof.

[0021] A seventeenth aspect Al 7 includes the mold according to the sixteenth aspect Al 6, wherein the slurry comprises an inorganic powder, a binder, and a solvent.

[0022] An eighteenth aspect Al 8 includes the mold according to the seventeenth aspect Al 7, wherein the inorganic powder comprises glass, ceramic, metal, or a combination thereof.

[0023] A nineteenth aspect Al 9 includes the mold according to any of the twelfth through eighteenth aspects A12-A18, wherein the separable carrier comprises polymer, metal, glass, ceramic, glass ceramic, or a combination thereof.

[0024] A twentieth aspect A20 includes the mold according to any of the twelfth through nineteenth aspects A12-A19, further comprising a green body, wherein the green body is formed from the slurry.

[0025] According to a twenty-first aspect A21, a green body may comprise: a green ceramic; and a sacrificial material disposed adjacent to the green ceramic, wherein the sacrificial material comprises: a first surface and a second surface opposite the first surface; and a patterning feature comprising an aspect ratio greater than or equal to 0.1.

[0026] Additional features and advantages of the inorganic substrates and methods of patterning the same described herein will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the embodiments described herein, including the detailed description which follows, the claims, as well as the appended drawings.

[0027] It is to be understood that both the foregoing general description and the following detailed description describe various embodiments and are intended to provide an overview or framework for understanding the nature and character of the claimed subject matter. The accompanying drawings are included to provide a further understanding of the various embodiments, and are incorporated into and constitute a part of this specification. The drawings illustrate the various embodiments described herein, and together with the description serve to explain the principles and operations of the claimed subject matter.BRIEF DESCRIPTION OF THE DRAWINGS

[0028] FIG. 1 is a schematic view of an inorganic substrate of the prior art;

[0029] FIG. 2 is a flow diagram of a method of patterning an inorganic substrate, according to one or more embodiments described herein;

[0030] FIG. 3 is a schematic, cross-sectional view of an embodiment of a mold for preparing a patterned inorganic substrate, according to the method of FIG. 2;

[0031] FIG. 4 is a schematic, cross-sectional view of another embodiment of a mold for preparing a patterned inorganic substrate, according to the method of FIG. 2;

[0032] FIG. 5 is a schematic, cross-sectional view of another embodiment of a mold for preparing a patterned inorganic substrate, according to the method of FIG. 2;

[0033] FIG. 6 is a schematic, cross-sectional view of another embodiment of a mold for preparing a patterned inorganic substrate, according to the method of FIG. 2;

[0034] FIG. 7 is a schematic, cross-sectional view of another embodiment of a mold for preparing a patterned inorganic substrate, according to the method of FIG. 2;

[0035] FIG. 8 is a schematic, cross-sectional view of a solid fuel oxide cell, according to one or more embodiments shown and described herein;

[0036] FIG. 9 is an interferometer image and a plot of features (in pm) of a patterned sacrificial material, according to one or more embodiments described herein;

[0037] FIG. 10 is a plot of height of surface features across the width of the patterned sacrificial material (y-axis: height (in pm) vs. x-axis: width (in mm)) of FIG. 9;

[0038] FIG. 11 is an interferometer image and a plot of features (in pm) of a sintered ceramic substrate with patterning features, according to one or more embodiments described herein;

[0039] FIG. 12 is a plot of height of surface features across the width of the sintered ceramic substrate (y-axis: height (in pm) vs. x-axis: width (in mm)) of FIG. 11; and

[0040] FIG. 13 is a scanning electron microscope (SEM) image of a ceramic substrate, according to one or more embodiments described herein.DETAILED DESCRIPTION

[0041] Reference will now be made in detail to various embodiments of methods of forming patterned inorganic substrates with high aspect ratios. According to some embodiments, a method of patterning inorganic substrates includes depositing a sacrificial material on a separable carrier, the sacrificial material including a first surface and a second surface opposite the first surface and a patterning feature comprising an aspect ratio greater than or equal to 0.1. The method further includes depositing a slurry such that the slurry is positioned on the sacrificial material or the sacrificial material is positioned on the slurry, wherein the slurry comprises an inorganic powder, a binder, and a solvent. The method further includes curing the slurry to evaporate the solvent, thereby forming a green body.

[0042] According to some embodiments, a ceramic substrate includes a first surface and a second surface opposite the first surface. The ceramic substrate further includes a thickness extending from the first surface to the second surface. The ceramic substrate further includes a plurality of features extending across the thickness, wherein at least one of the plurality of features comprises an aspect ratio greater than or equal to 0.1.

[0043] According to other embodiments, a mold includes a separable carrier and a sacrificial material disposed adjacent to the separable carrier. The sacrificial material includes a first surface and a second surface opposite the first surface and a patterning feature including an aspect ratio greater than or equal to 0.1.

[0044] Various embodiments of inorganic substrates and methods of forming same will be described herein with specific reference to the appended drawings.

[0045] Ranges may be expressed herein as from “about” one particular value, and / or to “about” another particular value. When such a range is expressed, another embodiment includes from the one particular value and / or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent “about,” it will be understood that the particular value forms another embodiment. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.

[0046] Directional terms as used herein - for example up, down, right, left, front, back, top, bottom - are made only with reference to the figures as drawn and are not intended to imply absolute orientation.

[0047] Unless otherwise expressly stated, it is in no way intended that any method set forth herein be construed as requiring that its steps be performed in a specific order, nor that with any apparatus specific orientations be required. Accordingly, where a method claim does not actually recite an order to be followed by its steps, or that any apparatus claim does not actually recite an order or orientation to individual components, or it is not otherwise specifically stated in the claims or description that the steps are to be limited to a specific order, or that a specific order or orientation to components of an apparatus is not recited, it is in no way intended that an order or orientation be inferred, in any respect. This holds for any possible non-express basis for interpretation, including: matters of logic with respect to arrangement of steps, operational flow, order of components, or orientation of components; plain meaning derived from grammatical organization or punctuation, and; the number or type of embodiments described in the specification.

[0048] As used herein, the singular forms “a,” “an” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a” component includes aspects having two or more such components, unless the context clearly indicates otherwise.

[0049] As used herein, a “slurry” refers to a mixture of an inorganic powder, a binder, and a solvent. A slurry may be used in casting or shaping processes, where the slurry is cast onto or poured into a mold and heat treated to create an inorganic substrate with patterns or shapes therein.

[0050] As used herein, a "green body" refers to a cast body that has not undergone heat treatment to remove the binder.

[0051] As used herein, a “brown body” refers to a cast body that has undergone a debind heat treatment to remove at least a portion of the binder.

[0052] As used herein, an “inorganic substrate” refers to a cast body that has undergone a sintering heat treatment to remove any remaining portion of the binder and to consolidate the particles of the inorganic powder.

[0053] As used herein, “curing” refers to drying of a cast slurry to remove solvent therefrom.

[0054] As used herein, “debinding” refers to heating the green body above a first temperature to remove at least a portion of the binder, thereby forming a brown body.

[0055] As used herein, “sintering” refers to heating the brown body above a second temperature to remove a remaining portion of the binder and consolidate the particles of the powder later, thereby forming an inorganic substrate.

[0056] As used herein, “sacrificial layer” refers to a material designed to impart desired features and that is vaporized (i.e., removed) during debinding or sintering. For example, a sacrificial layer may comprise a wax mold that may be formed and then coated with a ceramic. When the ceramic is debinded or sintered, the sacrificial material is vaporized. In some examples, the removal of the sacrificial material may leave behind a cavity that matches a desired shape.

[0057] As used herein, “aspect ratio” refers to the ratio from the height to width of features of an inorganic substrate or a sacrificial material. As features protrude deeper into the thickness of an inorganic substrate or a sacrificial material, the aspect ratio increases.

[0058] A conventional inorganic substrate 10 is depicted in FIG. 1. A ceramic layer 12 is disposed between an anode 11 and a cathode 13. As seen in FIG. 1, the inorganic substrate 10 is substantially flat and planar. The inorganic substrate 10 enables a baseline performance level, but the inorganic substrate 10 may benefit from precise patterning, such as features with high aspect ratios, to enhance their performance and efficiency.

[0059] In some applications, the aspect ratio may refer to the dimensions of pores or channels within an inorganic material or the height of etched features (such as channels or trenches) on the inorganic substrate compared to their width. In conventional applications, the patterning may be performed by screen printing, inkjet printing, spray coating, chemical vapor deposition (CVD), photolithography, and other processes. However, these processes may not be able to form inorganic substrates having high aspect ratios (e.g., greater than or equal to 0.1).

[0060] Disclosed herein are inorganic substrates and methods of making the same which mitigate the aforementioned problems. Specifically, the methods of patterning inorganic substratesdisclosed herein utilize a sacrificial material and slurry casting on a separable carrier. The sacrificial material may act as a mold for the slurry - creating featural depths and the like. The burnout and sintering steps allow for removal of the sacrificial material. The sacrificial material can be applied by any applicable deposition or patterning process known in the art. As a result of using the sacrificial material as a mold, high aspect ratios (e.g., greater than or equal to 0.1) are achieved, which result in inorganic substrates having: (1) increased surface area for increased device efficiency, (2) increased surface area for improved electrode adhesion, and / or (3) reduced average thickness for reduced resistance.

[0061] Referring now to FIGS. 2 and 3, a method of patterning an inorganic substrate is shown at 100. The method 100 begins at block 102 with depositing a sacrificial material 202 on a separable carrier 201. The separable carrier 201 and the sacrificial material 202 disposed thereon may form a mold 200a. The sacrificial material 202 comprises a first surface 210 and a second surface 212 opposite the first surface 210. At least one of the first surface 210 and the second surface 212 comprises at least one patterning feature 205. The patterning feature 205 comprises an aspect ratio greater than or equal to 0.1 and less than or equal to 100 to ensure that the inorganic substrate formed using the sacrificial material 202 has the desired aspect ratio. In embodiments, the aspect ratio of the at least one patterning feature 205 may be greater than or equal to 0.1 , greater than or equal to 1, greater than or equal to 5, greater than or equal to 10, greater than or equal to 20, or even greater than or equal to 30. In embodiments, the aspect ratio of the at least one patterning feature 205 may be less than or equal to 100, less than or equal to 90, less than or equal to 80, less than or equal to 70, less than or equal to 60, less than or equal to 50, or even less than or equal to 40. In embodiments, the aspect ratio of the at least one patterning feature 205 may be greater than or equal to 0.1 and less than or equal to 100, greater than or equal to 0.1 and less than or equal to 90, greater than or equal to 0.1 and less than or equal to 80, greater than or equal 0.1 and less than or equal to 70, greater than or equal to 0.1 and less than or equal to 60, greater than or equal to 0.1 and less than or equal to 50, greater than or equal to 0.1 and less than or equal to 40, greater than or equal to 0.1 and less than or equal to 30, greater than or equal to 0.1 and less than or equal to 20, greater than or equal to 0.1 and less than or equal to 10, greater than or equal to 0.1 and less than or equal to 5, greater than or equal to 0.1 and less than or equal to 1, greater than or equal to1 and less than or equal to 100, greater than or equal to 1 and less than or equal to 90, greater than or equal to 1 and less than or equal to 80, greater than or equal to 1 and less than or equal to 70, greater than or equal to 1 and less than or equal to 60, greater than or equal to 1 and less than or equal to 50, greater than or equal to 1 and less than or equal to 40, greater than or equal to 1 and less than or equal to 30, greater than or equal to 1 and less than or equal to 20, greater than or equal to 1 and less than or equal to 10, greater than or equal to 1 and less than or equal to 5, greater than or equal to 5 and less than or equal to 100, greater than or equal to 5 and less than or equal to 90, greater than or equal to 5 and less than or equal to 80, greater than or equal to 5 and less than or equal to 70, greater than or equal to 5 and less than or equal to 60, greater than or equal to 5 and less than or equal to 50, greater than or equal to 5 and less than or equal to 40, greater than or equal to 5 and less than or equal to 30, greater than or equal to 5 and less than or equal to 20, greater than or equal to 5 and less than or equal to 10, greater than or equal to 10 and less than or equal to 100, greater than or equal to 10 and less than or equal to 90, greater than or equal to 10 and less than or equal to 80, greater than or equal to 10 and less than or equal to 70, greater than or equal to 10 and less than or equal to 60, greater than or equal to 10 and less than or equal to 50, greater than or equal to 10 and less than or equal to 40, greater than or equal to 10 and less than or equal to 30, greater than or equal to 10 and less than or equal to 20, greater than or equal to 20 and less than or equal to 100, greater than or equal to 20 and less than or equal to 90, greater than or equal to 20 and less than or equal to 80, greater than or equal to 20 and less than or equal to 70, greater than or equal to 20 and less than or equal to 60, greater than or equal to 20 and less than or equal to 50, greater than or equal to 20 and less than or equal to 40, greater than or equal to 20 and less than or equal to 30, greater than or equal to 30 and less than or equal to 100, greater than or equal to 100 and less than or equal to 90, greater than or equal to 30 and less than or equal to 80, greater than or equal to 30 and less than or equal to 70, greater than or equal to 30 and less than or equal to 60, greater than or equal to 30 and less than or equal to 50, greater than or equal to 30 and less than or equal to 40, greater than or equal to 40 and less than or equal to 100, greater than or equal to 40 and less than or equal to 90, greater than or equal to 40 and less than or equal to 80, greater than or equal to 40 and less than or equal to 70, greater than or equal to 40 and less than or equal to 60, greater than or equal to 40 and less than or equal to 50, greater than orequal to 50 and less than or equal to 100, greater than or equal to 50 and less than or equal to 90, greater than or equal to 50 and less than or equal to 80, greater than or equal to 50 and less than or equal to 70, greater than or equal to 50 and less than or equal to 60, greater than or equal to 60 and less than or equal to 100, greater than or equal to 60 and less than or equal to 90, greater than or equal to 60 and less than or equal to 80, greater than or equal to 60 and less than or equal to 70, greater than or equal to 70 and less than or equal to 100, greater than or equal to 70 and less than or equal to 90, greater than or equal to 70 and less than or equal to 80, greater than or equal to 80 and less than or equal to 100, greater than or equal to 80 and less than or equal to 90, or even greater than or equal to 90 and less than or equal to 100, or any and all sub-ranges formed by these endpoints.

[0062] Different arrangements of the patterning feature are contemplated to achieve an inorganic substrate having desired features, as discussed hereinbelow. In embodiments, the patterning feature 205 may be a unitary feature (FIG. 3) or in discrete parts (FIG. 6). The substrate may include different regions of patterning - including areas of the substrate that is not patterned. As seen in FIG. 3, the patterned features 207 formed as part of the eventual substrate are connected to each other through the slurry 203. In contrast, as seen in FIG. 6, the slurry 203 is poured over the sacrificial material 202a and 202b such that the patterned features to be formed are individually separate and distinct from each other. In embodiments, the patterning feature may be curved (FIG. 7). The patterning feature may range in lateral dimension from 100 nm to over 100 mm. The patterning feature may be depressions into the sacrificial material such as wells or features that protrude from the surface such as posts (FIG. 3). The patterning feature may have regular or irregular geometric shapes. The patterning feature may have cross-sectional shapes that are square, rounded, or undercut. In general, the patterning features impart patterned features onto the slurry and eventual substrate formed therefrom to form a patterned surface.

[0063] An initial layer of sacrificial material 202 may be applied that optimizes wetting to the separable carrier 201 surface, and a subsequent layer(s) may be applied that includes a specified patterning 205. In this way, the sacrificial material 202 may include multiple layers of the same or different compositions. The sacrificial material 202 may be deposited by any applicable deposition or patterning process. By way of example and not limitation, these methods mayencompass printing techniques such as inkjet, electrohydrodynamic printing, screen printing, aerosol jet printing, gravure, offset gravure, flexography, dispensing, micro-replication, nanoimprint lithography, or other applicable methods. Additionally, solution coating methods like slot die, reverse gravure, doctor blade, tape casting, or alternative techniques, as well as deposition techniques involving thermal or sublimation processes, may be employed.

[0064] Furthermore, various post-application treatments are feasible, offering flexibility in the sacrificial material's processing. The material may undergo drying, UV curing, thermal curing, embossing, laser processing, etching, patterning, or other suitable procedures subsequent to deposition.

[0065] The sacrificial material 202 may have a minimum boiling point (e.g., greater than or equal to 100 °C) to ensure that the sacrificial material 202 survives deposition and curing of the slurry 203 to impart a pattern 207 thereon. The boiling point of the sacrificial material 202 may be limited (e.g., less than or equal to 1000 °C) to ensure that the sacrificial material 202 may be removed during debinding or sintering. Accordingly, in embodiments, the sacrificial material 202 may have a boiling point greater than or equal to 100 °C and less than or equal to 1000 °C. In embodiments, the sacrificial material 202 may have a boiling point greater than or equal to 100 °C, greater than or equal to 200 °C, greater than or equal to 300 °C, greater than or equal to 400 °C, greater than or equal to 500 °C, or even greater than or equal to 600 °C. In embodiments, the sacrificial material 202 may have a boiling point less than or equal to 1000 °C, less than or equal to 900 °C, less than or equal to 800 °C, or even less than or equal to 700 °C. In embodiments, the sacrificial material 202 may have a boiling point greater than or equal to 100 °C and less than or equal to 1000 °C, greater than or equal to 100 °C and less than or equal to 1000 °C, greater than or equal to 100 °C and less than or equal to 900 °C, greater than or equal to 100 °C and less than or equal to 800 °C, greater than or equal to 100 °C and less than or equal to 700 °C, greater than or equal to 100 °C and less than or equal to 600 °C, greater than or equal to 100 °C and less than or equal to 500 °C, greater than or equal to 100 °C and less than or equal to 400 °C, greater than or equal to 100 °C and less than or equal to 300 °C, greater than or equal to 100 °C and less than or equal to 200 °C, greater than or equal to 200 °C and less than or equal to 1000 °C, greater than or equal to 200 °C and less than or equal to 900 °C, greater than or equal to 200 °C and less thanor equal to 800 °C, greater than or equal to 200 °C and less than or equal to 700 °C, greater than or equal to 200 °C and less than or equal to 600 °C, greater than or equal to 200 °C and less than or equal to 500 °C, greater than or equal to 200 °C and less than or equal to 400 °C, greater than or equal to 200 °C and less than or equal to 300 °C, greater than or equal to 300 °C and less than or equal to 1000 °C, greater than or equal to 300 °C and less than or equal to 900 °C, greater than or equal to 300 °C and less than or equal to 800 °C, greater than or equal to 300 °C and less than or equal to 700 °C, greater than or equal to 300 °C and less than or equal to 600 °C, greater than or equal to 300 °C and less than or equal to 500 °C , greater than or equal to 300 °C and less than or equal to 400 °C, greater than or equal to 400 °C and less than or equal to 1000 °C, greater than or equal to 400 °C and less than or equal to 900 °C, greater than or equal to 400 °C and less than or equal to 800 °C, greater than or equal to 400 °C and less than or equal to 700 °C, greater than or equal to 400 °C and less than or equal to 600 °C, greater than or equal to 400 °C and less than or equal to 500 °C, greater than or equal to 500 °C and less than or equal to 1000 °C, greater than or equal to 500 °C and less than or equal to 900 °C, greater than or equal to 500 °C and less than or equal to 800 °C, greater than or equal to 500 °C and less than or equal to 700 °C, greater than or equal to 500 °C and less than or equal to 600 °C, greater than or equal to 600 °C and less than or equal to 1000 °C, greater than or equal to 600 °C and less than or equal to 900 °C, greater than or equal to 600 °C and less than or equal to 800 °C, greater than or equal to 600 °C and less than or equal to 700 °C, greater than or equal to 700 °C and less than or equal to 1000 °C, greater than or equal to 700 °C and less than or equal to 900 °C, greater than or equal to 700 °C and less than or equal to 800 °C, greater than or equal to 800 °C and less than or equal to 1000 °C, greater than or equal to 800 °C and less than or equal to 900 °C, or even greater than or equal to 900 °C and less than or equal to 1000 °C, or any and all sub-ranges formed by these end points.

[0066] Examples of sacrificial materials include acrylate (e.g., UV-curable inks), wax (e.g., solid wax, ceresin, paraffin, or beeswax), or a combination thereof. An example of a commercially available embodiment of the UV-curable ink may be Mimaki LH100. These sacrificial materials may exhibit versatility, being either water-soluble, organic solvent-soluble, or entirely curable. It is possible to employ different sacrificial materials concurrently, either as mixtures or in distinct layered or patterned regions. In relation to the binder utilized in the green inorganic, the sacrificialmaterial may possess a burn-out onset temperature that is substantially the same, higher, or lower. The separable carrier may comprise polymer, metal, glass, ceramic, glass ceramic material, or a combination thereof.

[0067] Referring back to FIG. 2, the method 100 continues at block 104 with depositing the slurry 203 on the sacrificial material 202. As exemplified in the embodiments discussed herein, it is contemplated that blocks 102 and 104 may be reversed in embodiments. That is, the slurry may be deposited such that the slurry is positioned on the sacrificial material or the sacrificial material is positioned on the slurry. Alternatively, the sacrificial material may be applied in the middle of the slurry casting steps, and an over coating slurry may then be applied. The inorganic layers may be the same or different, and this process may repeat.

[0068] The inorganic layer(s) formed by slurry casting may have a thickness that is less than the sacrificial layer thickness, the same thickness, or greater than the sacrificial layer thickness. Accordingly, in embodiments, the inorganic layer(s) may have a thickness less than or equal to 0.1 times, less than or equal to 0.2 times, less than or equal to 0.3 times, less than or equal to 0.4 times, or even less than or equal to 0.5 times the thickness of the sacrificial layer. In embodiments, the inorganic layer(s) may have a thickness equal to the sacrificial layer thickness. In embodiments, the inorganic layer(s) may have a thickness greater than or equal to 2 times, greater than or equal to 5 times, greater than or equal to 10 times, greater than or equal to 50 times, or even greater than or equal to 100 times the thickness of the sacrificial layer.

[0069] Exemplary wet-coating processes may comprise tape-casting, slot die coating, printing methods, or alternative approaches. The final structure may incorporate multiple materials arranged in layered, adjacent, or mixed configurations. Following the completion of all coating procedures, the comprehensive layered stack may undergo a drying process.

[0070] The slurry may comprise an inorganic powder, a binder, and a solvent. Doped zirconia (Y2O3, SC2O3, and CeCE), doped ceria (Gd2Ch, SrmCh), alumina, LLZO, LATP, Y2O3, glass, ceramics, glass ceramics, metals, semiconductors, dielectrics, and various other materials or combinations thereof can be employed as the inorganic powder. In embodiments, the resulting inorganic substrate may be a ceramic substrate. In embodiments, the slurry may compriseinorganic powder in an amount greater than or equal to 30 wt.% and less than or equal to 80 wt.%, based on the total weight of the slurry. In embodiments, the slurry may comprise inorganic powder in an amount, based on the total weight of the slurry, greater than or equal to 30 wt.%, greater than or equal to 35 wt.%, greater than or equal to 40 wt.%, greater than or equal to 45 wt.%, greater than or equal to 50 wt.%, or even greater than or equal to 55 wt.%. In embodiments, the slurry may comprise inorganic powder in an amount, based on the total weight of the slurry, less than or equal to 80 wt.%, less than or equal to 75 wt.%, less than or equal to 70 wt.%, less than or equal to 65 wt.%, or even less than or equal to 60 wt.%. In embodiments, the slurry may comprise inorganic powder in an amount, based on the total weight of the slurry, greater than or equal to 30 wt.% and less than or equal to 80 wt.%, greater than or equal to 30 wt.% and less than or equal to 70 wt.%, greater than or equal to 30 wt.% and less than or equal to 60 wt.%, greater than or equal to 30 wt.% and less than or equal to 50 wt.%, greater than or equal to 30 wt.% or less than or equal to 40 wt.%, greater than or equal to 40 wt.% and less than or equal to 80 wt.%, greater than or equal to 40 wt.% and less than or equal to 70 wt.%, greater than or equal to 40 wt.% and less than or equal to 60 wt.%, greater than or equal to 40 wt.% and less than or equal to 50 wt.%, greater than or equal to 50 wt.% and less than or equal to 80 wt.%, greater than or equal to 50 wt.% and less than or equal to 70 wt.%, greater than or equal to 50 wt.% and less than or equal to 60 wt.%, greater than or equal to 60 wt.% and less than or equal to 80 wt.%, greater than or equal to 60 wt.% and less than or equal to 70 wt.%, or even greater than or equal to 70 wt.% and less than or equal to 80 wt.%, or any and all sub-ranges formed from any of these endpoints.

[0071] Various binders may be employed to provide cohesion and shape to the inorganic material before it undergoes sintering. The binder may comprise poly (vinyl alcohol) (PVA), ethyl cellulose, hydroxypropyl cellulose, poly (acrylic acid) (PAA), poly (ethylene glycol) (PEG), carboxymethyl cellulose (CMC), acrylic resins, and the like. In embodiments, the slurry may comprise binder in an amount greater than or equal to 1 wt.% and less than or equal to 10 wt.%, based on the total weight of the slurry. In embodiments, the slurry may comprise binder in an amount, based on the total weight of the slurry, greater than or equal to 1 wt.%, greater than or equal to 2 wt.%, greater than or equal to 3 wt.%, greater than or equal to 4 wt.%, or even greater than or equal to 5 wt.%. In embodiments, the slurry may comprise binder in an amount, based onthe total weight of the slurry, less than or equal to 10 wt.%, less than or equal to 9 wt.%, less than or equal to 8 wt.%, less than or equal to 7 wt.%, or even less than or equal to 6 wt.%. In embodiments, the slurry may comprise binder in an amount, based on the total weight of the slurry, greater than or equal to 1 wt.% and less than or equal to 10 wt.%, greater than or equal to 1 wt.% and less than or equal to 9 wt.%, greater than or equal to 1 wt.% and less than or equal 8 wt.%, greater than or equal to 1 wt.% and less than or equal to 7 wt.%, greater than or equal to 1 wt.% and less than or equal to 6 wt.%, greater than or equal to 1 wt.% and less than or equal to 5 wt.%, greater than or equal to 1 wt.% and less than or equal to 4 wt.%, greater than or equal to 1 wt.% and less than or equal to 3 wt.%, greater than or equal to 1 wt.% and less than or equal to 2 wt.%, greater than or equal to 2 wt.% and less than or equal to 10 wt.%, greater than or equal to 2 wt.% and less than or equal to 9 wt.%, greater than or equal to 2 wt.% and less than or equal to 8 wt.%, greater than or equal to 2 wt.% and less than or equal to 7 wt.%, greater than or equal to 2 wt.% and less than or equal to 6 wt.%, greater than or equal to 2 wt.% and less than or equal to 5 wt.%, greater than or equal to 2 wt.% and less than or equal to 4 wt.%, greater than or equal to 2 wt.% and less than or equal to 3 wt.%, greater than or equal to 3 wt.% and less than or equal to 10 wt.%, greater than or equal to 3 wt.% and less than or equal to 9 wt.%, greater than or equal to 3 wt.% and less than or equal to 8 wt.%, greater than or equal to 3 wt.% and less than or equal to 7 wt.%, greater than or equal to 3 wt.% and less than or equal to 6 wt.%, greater than or equal to 3 wt.% and less than or equal to 5 wt.%, greater than or equal to 3 wt.% and less than or equal to 4 wt.%, greater than or equal to 4 wt.% and less than or equal to 10 wt.%, greater than or equal to 4 wt.% and less than or equal to 9 wt.%, greater than or equal to 4 wt.% and less than or equal to 8 wt.%, greater than or equal to 4 wt.% and less than or equal to 7 wt.%, greater than or equal to 4 wt.% and less than or equal to 6 wt.%, greater than or equal to 4 wt.% and less than or equal to 5 wt.%, greater than or equal to 5 wt.% and less than or equal to 10 wt.%, greater than or equal to 5 wt.% and less than or equal to 9 wt.%, greater than or equal to 5 wt.% and less than or equal 8 wt.%, greater than or equal to 5 wt.% and less than or equal to 7 wt.%, greater than or equal to 5 wt.% and less than or equal to 6 wt.%, greater than or equal to 6 wt.% and less than or equal to 10 wt.%, greater than or equal to 6 wt.% and less than or equal to 9 wt.%, greater than or equal to 6 wt.% and less than or equal to 8 wt.%, greater than or equal to 6 wt.% and less than or equal to 7 wt.%,greater than or equal to 7 wt.% and less than or equal to 10 wt.%, greater than or equal to 7 wt.% and less than or equal to 9 wt.%, greater than or equal to 7 wt.% and less than or equal to 8 wt.%, greater than or equal to 8 wt.% and less than or equal to 10 wt.%, greater than or equal to 8 wt.% and less than or equal to 9 wt.%, or even greater than or equal to 9 wt.% and less than or equal to 10 wt.%, or any and all sub-ranges formed from any of these endpoints.

[0072] Solvents create a workable slurry or paste, facilitating the shaping and casting of the green body before firing. The choice of solvent may depend on the type of inorganic material, the binder used, and the desired processing method. The solvent may comprise water, alcohols, ethylene glycol, organic solvents (toluene, acetone, xylene), and others. In embodiments, the slurry may comprise solvent in an amount, based on the total weight of the slurry, of greater than or equal to 20 wt.% and less than or equal to 70 wt.%, based on the total weight of the slurry. In embodiments, the slurry may comprise solvent in an amount, based on the total weight of the slurry, of greater than or equal to 20 wt.%, greater than or equal to 25 wt.%, greater than or equal to 35 wt.%, greater than or equal to 40 wt.%, or even greater than or equal to 45 wt.%. In embodiments, the slurry may comprise solvent in an amount, based on the total weight of the slurry, of less than or equal to 70 wt.%, less than or equal to 65 wt.%, less than or equal to 60 wt.%, less than or equal to 55 wt.%, or even less than or equal to 50 wt.%. In embodiments, the slurry may comprise solvent in an amount, based on the total weight of the slurry, of greater than or equal to 20 wt.% and less than or equal to 70 wt.%, greater than or equal to 20 wt.% and less than or equal to 60 wt.%, greater than or equal to 20 wt.% and less than or equal to 50 wt.%, greater than or equal to 20 wt.% and less than or equal to 40 wt.%, greater than or equal to 20 wt.% and less than or equal to 30 wt.%, greater than or equal to 30 wt.% and less than or equal to 70 wt.%, greater than or equal to 30 wt.% and less than or equal to 60 wt.%, greater than or equal to 30 wt.% and less than or equal to 50 wt.%, greater than or equal to 30 wt.% and less than or equal to 40 wt.%, greater than or equal to 40 wt.% and less than or equal to 70 wt.%, greater than or equal to 40 wt.% and less than or equal to 60 wt.%, greater than or equal to 40 wt.% and less than or equal to 50 wt.%, greater than or equal to 50 wt.% and less than or equal to 70 wt.%, greater than or equal to 50 wt.% and less than or equal to 60 wt.%, or even greater than or equal to 60 wt.% and less than or equal to 70 wt.%, or any and all sub-ranges formed from any of these endpoints.

[0073] The slurry may further include additives, such as at least one of a plasticizer, at least one dispersant, or both.

[0074] In embodiments, the plasticizer may comprise dibutyl phthalate, bis(2-ethylhexyl) phthalate, benzyl butyl phthalate, diisobutyl phthalate, diethyl phthalate, diisononyl phthalate, polyethylene glycol, propylene carbonate, or combinations thereof. In embodiments, the slurry may comprise plasticizer in an amount, based on the total weight of the slurry, greater than or equal to 0 wt.% and less than or equal to 10 wt.%, based on the total weight of the slurry. In embodiments, the slurry may comprise plasticizer in an amount, based on the total weight of the slurry, greater than or equal to 0 wt.%, greater than or equal to 1 wt.%, greater than or equal to 2 wt.%, greater than or equal to 3 wt.%, greater than or equal to 4 wt.%, or even greater than or equal to 5 wt.%. In embodiments, the slurry may comprise plasticizer in an amount, based on the total weight of the slurry, less than or equal to 10 wt.%, less than or equal to 9 wt.%, less than or equal to 8 wt.%, less than or equal to 7 wt.%, or even less than or equal to 6 wt.%. In embodiments, the slurry may comprise plasticizer in an amount, based on the total weight of the slurry, greater than or equal to 0 wt.% and less than or equal to 10 wt.%, greater than or equal to 0 wt.% and less than or equal to 9 wt.%, greater than or equal to 0 wt.% and less than or equal 8 wt.%, greater than or equal to 0 wt.% and less than or equal to 7 wt.%, greater than or equal to 0 wt.% and less than or equal to 6 wt.%, greater than or equal to 0 wt.% and less than or equal to 5 wt.%, greater than or equal to 0 wt.% and less than or equal to 4 wt.%, greater than or equal to 0 wt.% and less than or equal to 3 wt.%, greater than or equal to 0 wt.% and less than or equal to 2 wt.%, greater than or equal to 0 wt.% and less than or equal to 1 wt.%, greater than or equal to 1 wt.% and less than or equal to 10 wt.%, greater than or equal to 1 wt.% and less than or equal to 9 wt.%, greater than or equal to 1 wt.% and less than or equal 8 wt.%, greater than or equal to 1 wt.% and less than or equal to 7 wt.%, greater than or equal to 1 wt.% and less than or equal to 6 wt.%, greater than or equal to 1 wt.% and less than or equal to 5 wt.%, greater than or equal to 1 wt.% and less than or equal to 4 wt.%, greater than or equal to 1 wt.% and less than or equal to 3 wt.%, greater than or equal to 1 wt.% and less than or equal to 2 wt.%, greater than or equal to 2 wt.% and less than or equal to 10 wt.%, greater than or equal to 2 wt.% and less than or equal to 9 wt.%, greater than or equal to 2 wt.% and less than or equal to 8 wt.%, greater than or equal to 2 wt.% and less than orequal to 7 wt.%, greater than or equal to 2 wt.% and less than or equal to 6 wt.%, greater than or equal to 2 wt.% and less than or equal to 5 wt.%, greater than or equal to 2 wt.% and less than or equal to 4 wt.%, greater than or equal to 2 wt.% and less than or equal to 3 wt.%, greater than or equal to 3 wt.% and less than or equal to 10 wt.%, greater than or equal to 3 wt.% and less than or equal to 9 wt.%, greater than or equal to 3 wt.% and less than or equal to 8 wt.%, greater than or equal to 3 wt.% and less than or equal to 7 wt.%, greater than or equal to 3 wt.% and less than or equal to 6 wt.%, greater than or equal to 3 wt.% and less than or equal to 5 wt.%, greater than or equal to 3 wt.% and less than or equal to 4 wt.%, greater than or equal to 4 wt.% and less than or equal to 10 wt.%, greater than or equal to 4 wt.% and less than or equal to 9 wt.%, greater than or equal to 4 wt.% and less than or equal to 8 wt.%, greater than or equal to 4 wt.% and less than or equal to 7 wt.%, greater than or equal to 4 wt.% and less than or equal to 6 wt.%, greater than or equal to 4 wt.% and less than or equal to 5 wt.%, greater than or equal to 5 wt.% and less than or equal to 10 wt.%, greater than or equal to 5 wt.% and less than or equal to 9 wt.%, greater than or equal to 5 wt.% and less than or equal 8 wt.%, greater than or equal to 5 wt.% and less than or equal to 7 wt.%, greater than or equal to 5 wt.% and less than or equal to 6 wt.%, greater than or equal to 6 wt.% and less than or equal to 10 wt.%, greater than or equal to 6 wt.% and less than or equal to 9 wt.%, greater than or equal to 6 wt.% and less than or equal to 8 wt.%, greater than or equal to 6 wt.% and less than or equal to 7 wt.%, greater than or equal to 7 wt.% and less than or equal to 10 wt.%, greater than or equal to 7 wt.% and less than or equal to 9 wt.%, greater than or equal to 7 wt.% and less than or equal to 8 wt.%, greater than or equal to 8 wt.% and less than or equal to 10 wt.%, greater than or equal to 8 wt.% and less than or equal to 9 wt.%, or even greater than or equal to 9 wt.% and less than or equal to 10 wt.%, or any and all sub-ranges formed from any of these endpoints.

[0075] In embodiments, the dispersant may comprise menhaden fish oil, terpineol, phosphate esters, various proprietary commercial formulations, or combinations thereof. In embodiments, the slurry may comprise dispersant in an amount greater than or equal to 0 wt.% and less than or equal to 10 wt.%, based on the total weight of the slurry. In embodiments, the slurry may comprise dispersant in an amount, based on the total weight of the slurry, greater than or equal to 0 wt.%, greater than or equal to 1 wt.%, greater than or equal to 2 wt.%, greater than or equal to 3 wt.%,greater than or equal to 4 wt.%, or even greater than or equal to 5 wt.%. In embodiments, the slurry may comprise dispersant in an amount, based on the total weight of the slurry, less than or equal to 10 wt.%, less than or equal to 9 wt.%, less than or equal to 8 wt.%, less than or equal to 7 wt.%, or even less than or equal to 6 wt.%. In embodiments, the slurry may comprise dispersant in an amount, based on the total weight of the slurry, greater than or equal to 0 wt.% and less than or equal to 10 wt.%, greater than or equal to 0 wt.% and less than or equal to 9 wt.%, greater than or equal to 0 wt.% and less than or equal 8 wt.%, greater than or equal to 0 wt.% and less than or equal to 7 wt.%, greater than or equal to 0 wt.% and less than or equal to 6 wt.%, greater than or equal to 0 wt.% and less than or equal to 5 wt.%, greater than or equal to 0 wt.% and less than or equal to 4 wt.%, greater than or equal to 0 wt.% and less than or equal to 3 wt.%, greater than or equal to 0 wt.% and less than or equal to 2 wt.%, greater than or equal to 0 wt.% and less than or equal to 1 wt.%, greater than or equal to 1 wt.% and less than or equal to 10 wt.%, greater than or equal to 1 wt.% and less than or equal to 9 wt.%, greater than or equal to 1 wt.% and less than or equal 8 wt.%, greater than or equal to 1 wt.% and less than or equal to 7 wt.%, greater than or equal to 1 wt.% and less than or equal to 6 wt.%, greater than or equal to 1 wt.% and less than or equal to 5 wt.%, greater than or equal to 1 wt.% and less than or equal to 4 wt.%, greater than or equal to 1 wt.% and less than or equal to 3 wt.%, greater than or equal to 1 wt.% and less than or equal to 2 wt.%, greater than or equal to 2 wt.% and less than or equal to 10 wt.%, greater than or equal to 2 wt.% and less than or equal to 9 wt.%, greater than or equal to 2 wt.% and less than or equal to 8 wt.%, greater than or equal to 2 wt.% and less than or equal to 7 wt.%, greater than or equal to 2 wt.% and less than or equal to 6 wt.%, greater than or equal to 2 wt.% and less than or equal to 5 wt.%, greater than or equal to 2 wt.% and less than or equal to 4 wt.%, greater than or equal to 2 wt.% and less than or equal to 3 wt.%, greater than or equal to 3 wt.% and less than or equal to 10 wt.%, greater than or equal to 3 wt.% and less than or equal to 9 wt.%, greater than or equal to 3 wt.% and less than or equal to 8 wt.%, greater than or equal to 3 wt.% and less than or equal to 7 wt.%, greater than or equal to 3 wt.% and less than or equal to 6 wt.%, greater than or equal to 3 wt.% and less than or equal to 5 wt.%, greater than or equal to 3 wt.% and less than or equal to 4 wt.%, greater than or equal to 4 wt.% and less than or equal to 10 wt.%, greater than or equal to 4 wt.% and less than or equal to 9 wt.%, greater than or equal to 4 wt.% and less than orequal to 8 wt.%, greater than or equal to 4 wt.% and less than or equal to 7 wt.%, greater than or equal to 4 wt.% and less than or equal to 6 wt.%, greater than or equal to 4 wt.% and less than or equal to 5 wt.%, greater than or equal to 5 wt.% and less than or equal to 10 wt.%, greater than or equal to 5 wt.% and less than or equal to 9 wt.%, greater than or equal to 5 wt.% and less than or equal 8 wt.%, greater than or equal to 5 wt.% and less than or equal to 7 wt.%, greater than or equal to 5 wt.% and less than or equal to 6 wt.%, greater than or equal to 6 wt.% and less than or equal to 10 wt.%, greater than or equal to 6 wt.% and less than or equal to 9 wt.%, greater than or equal to 6 wt.% and less than or equal to 8 wt.%, greater than or equal to 6 wt.% and less than or equal to 7 wt.%, greater than or equal to 7 wt.% and less than or equal to 10 wt.%, greater than or equal to 7 wt.% and less than or equal to 9 wt.%, greater than or equal to 7 wt.% and less than or equal to 8 wt.%, greater than or equal to 8 wt.% and less than or equal to 10 wt.%, greater than or equal to 8 wt.% and less than or equal to 9 wt.%, or even greater than or equal to 9 wt.% and less than or equal to 10 wt.%, or any and all sub-ranges formed from any of these endpoints.

[0076] Turning now to FIGS. 4-7, other embodiments of molds are shown. It should be understood that embodiments shown therein are embodiments and are not intended to limit the features of inorganic substrates. It should also be understood that a component from one embodiment may be used in a conjunction with another embodiment.

[0077] In embodiments, as seen in FIG. 4, another mold 200b is schematically depicted. A sacrificial material 202 is disposed between two layers of slurry 203a and 203b. The slurry 203a is disposed on a separable carrier 201. The sacrificial material 202 comprises a patterning feature 205 formed of discrete parts such that when the ceramic slurry 203b is cast, a plurality of features 207 may be formed between the slurry layers 203a and 203b.

[0078] In yet another embodiment, as seen in FIG. 5, another mold 200c is schematically depicted. A slurry 203 is disposed between a separable carrier 201 and sacrificial material 202. The sacrificial material 202 comprises a unitary patterning feature 205 comprising posts. When the sacrificial material 202 is disposed on the slurry 203, a plurality of features 207 is formed on the resulting ceramic substrate.

[0079] In yet another embodiment, as seen in FIG. 6, another mold 200d is schematically depicted. A sacrificial material 202a is disposed on a separable carrier 201. A slurry 203 is cast on the sacrificial material 202a and the separable carrier 201. Another sacrificial material 202b is then disposed on the slurry 203, followed by another layer of slurry 203. FIG. 6 illustrates a mold used for formation of undercut features in the sintered inorganic. The sacrificial material 202b may burn-out during sintering and leave the overhanging inorganic structure. In the resulting substrate, the sacrificial material 202a may be burned out to form columns 212 on the substrate between the previously-deposited patterning features formed by the sacrificial material 202a. In the resulting substrate, the sacrificial material 202b may be burned out to form channels through the substrate where the previously-deposited patterning features formed by sacrificial material 202b.

[0080] In yet another embodiment, as seen in FIG. 7, another mold 200e is schematically depicted. A sacrificial material 202 is disposed on a separable carrier 201. In embodiments, the sacrificial material 202 is deposited in a sinusoidal-like shape. However, it should be understood that other shapes and patterns of the sacrificial material are contemplated and possible, including, without limitation, regular contours (e.g., saw-tooth shapes, square-wave shapes, etc.) or irregular contours (e.g., jagged edges). The slurry 203 is cast on the sacrificial material 202 such that the ceramic slurry 203 also has a sinusoidal shape.

[0081] Referring back to FIG. 2, the method 100 continues at optional block 106 with removing the separable carrier 201. The separable carrier 201 may be separated from the slurry 203 and / or sacrificial material 202 by peeling, thermal treatment, electromagnetic radiation exposure, dissolving, combinations of these, or other methods. In embodiments, the separable carrier may be removed after debinding or sintering.

[0082] Referring back to FIG. 2, the method 100 continues at block 108 with curing the slurry 203 to form a green body. The curing of the slurry 203 may remove the solvent. In embodiments, the curing may comprise heating the slurry 203 at a curing temperature greater than or equal to greater than or equal to 50 °C and less than or equal to 300 °C, greater than or equal to 50 °C and less than or equal to 250 °C, greater than or equal to 50 °C and less than or equal to 200 °C, greater than or equal to 50 °C and less than or equal to 150 °C, greater than or equal to 50 °C and less than orequal to 100 °C, greater than or equal to 100 °C and less than or equal to 300 °C, greater than or equal to 100 °C and less than or equal to 250 °C, greater than or equal to 100 °C and less than or equal to 200 °C, greater than or equal to 100 °C and less than or equal to 150 °C, greater than or equal to 150 °C and less than or equal to 300 °C, greater than or equal to 150 °C and less than or equal to 250 °C, or even greater than or equal to 150 °C and less than or equal to 200 °C, or any and all sub-ranges formed from any of these endpoints. The curing step may include maintaining a discrete curing temperature or temperatures for defined durations. The curing step may also include a thermal ramp of a defined increase in addition to or instead of a discrete curing temperature for a defined duration.

[0083] The green body may shrink during debinding and / or sintering when forming the inorganic substrate such that the thickness of the green body is greater than the inorganic substrate formed therefrom. As such, the thickness of the green body may be adjusted to account for this shrinkage in forming an inorganic substrate having a desired thickness. In embodiments, a thickness of the green body may be greater than or equal to 7 pm and less than or equal to 200 pm. In embodiments, the thickness of the green body may be greater than or equal to 7 pm, greater than or equal to 10 pm, greater than or equal to 15 pm, greater than or equal to 20 pm, or even greater than or equal to 25 pm. In embodiments, the thickness of the green body may be less than or equal to 200 pm, less than or equal to 150 pm, less than or equal to 100 pm, or even less than or equal to 50 pm. In embodiments, a thickness of the green body may be greater than or equal to 7 pm and less than or equal to 200 pm, greater than or equal to 7 pm and less than or equal to 150 pm, greater than or equal to 7 pm and less than or equal to 100 pm, greater than or equal to 7 pm and less than or equal to 50 pm, greater than or equal to 10 pm and less than or equal to 200 pm, greater than or equal to 10 pm and less than or equal to 150 pm, greater than or equal to 10 pm and less than or equal to 100 pm, greater than or equal to 10 pm and less than or equal to 50 pm, greater than or equal to 15 pm and less than or equal to 200 pm, greater than or equal to 15 pm and less than or equal to 150 pm, greater than or equal to 15 pm and less than or equal to 100 pm, greater than or equal to 15 pm and less than or equal to 50 pm, greater than or equal to 20 pm and less than or equal to 200 pm, greater than or equal to 20 pm and less than or equal to 150 pm, greater than or equal to 20 pm and less than or equal to 100 pm, greater than or equal to 20 pm and less than orequal to 50 pm, greater than or equal to 25 urn and less than or equal to 200 urn, greater than or equal to 25 pm and less than or equal to 150 pm, greater than or equal to 25 pm and less than or equal to 100 pm, or even greater than or equal to 25 urn and less than or equal to 50 pm, or any and all sub-ranges formed from any of these endpoints.

[0084] Referring back to FIG. 2, the method continues at block 110 with debinding the green body to remove the binder and form a brown body. The debinding process involves subjecting the green body to a controlled heating process, gradually increasing the temperature to thermally decompose and volatilize the organic binders. The debinding temperature may be below the sintering temperature of the inorganic material. The terms “first temperature” and “debinding temperature” may be used interchangeably throughout this disclosure.

[0085] In embodiments, the debinding may comprise heating the green body at a first temperature greater than or equal to 100 °C and less than or equal to 500 °C. The first temperature may be above a certain threshold (e.g., above 100 °C) such that the sacrificial material may be at least partially removed to limit char residue on the final inorganic substrate. In embodiments, the debinding temperature may be greater than or equal to 100 °C or even greater than or equal to 250 °C. In embodiments, the debinding temperature may be less than or equal to 500 °C, less than or equal to 400 °C, or even less than or equal to 300 °C. In embodiments, the debinding temperature may be greater than or equal to 100 °C and less than or equal to 500 °C, greater than or equal to 100 °C and less than or equal to 400 °C, greater than or equal to 100 °C and less than or equal to 300 °C, greater than or equal to 100 °C and less than or equal to 200 °C, greater than or equal to 200 °C and less than or equal to 500 °C, greater than or equal to 200 °C and less than or equal to 400 °C, greater than or equal to 200 °C and less than or equal to 300 °C, greater than or equal to 250 °C and less than or equal to 500 °C, greater than or equal to 250 °C and less than or equal to 400 °C, or even greater than or equal to 250 °C and less than or equal to 300 °C, or any and all sub-ranges formed from any of these endpoints.

[0086] In embodiments, the debinding may comprise heating the green body for greater than or equal to 5 minutes and less than or equal to 120 minutes. In embodiments, the debinding may comprise heating the green body for greater than or equal to 5 minutes, greater than or equal to 10minutes, greater than or equal to 20 minutes, or even greater than or equal to 30 minutes. In embodiments, the debinding may comprises heating the green body for less than or equal to 120 minutes, less than or equal to 100 minutes, less than or equal to 80 minutes, or even less than or equal to 60 minutes. In embodiments, the debinding may comprise heating the green body for greater than or equal to 5 minutes and less than or equal to 120 minutes, greater than or equal to 5 minutes and less than or equal to 100 minutes, greater than or equal to 5 minutes and less than or equal to 80 minutes, greater than or equal to 5 minutes and less than or equal to 60 minutes, greater than or equal to 10 minutes and less than or equal to 120 minutes, greater than or equal to 10 minutes and less than or equal to 100 minutes, greater than or equal to 10 minutes and less than or equal to 80 minutes, greater than or equal to 10 minutes and less than or equal to 60 minutes, greater than or equal to 20 minutes and less than or equal to 120 minutes, greater than or equal to 20 minutes and less than or equal to 100 minutes, greater than or equal to 20 minutes and less than or equal to 80 minutes, greater than or equal to 20 minutes and less than or equal to 60 minutes, greater than or equal to 30 minutes and less than or equal to 120 minutes, greater than or equal to 30 minutes and less than or equal to 100 minutes, greater than or equal to 30 minutes and less than or equal to 80 minutes, or even greater than or equal to 30 minutes and less than or equal to 60 minutes, or any and all sub-ranges formed from any of these endpoints. The debinding step can include a thermal ramp of a defined increase instead or in addition to a hold at any specific temperatures.

[0087] Referring back to FIG. 2, the method 100 continues at block 112 with sintering the brown body to consolidate the inorganic powder and form an inorganic substrate. In embodiments, the sintering may comprising heating the brown body at a second temperature greater than or equal to 500 °C and less than or equal to 2000 °C. In embodiments, the second temperature may be greater than or equal to 500 °C or even greater than or equal to 1000 °C. In embodiments, the second temperature may be less than or equal to 2000 °C or even less than or equal to 1500 °C. In embodiments, the sintering temperature may be greater than or equal to 500 °C and less than or equal to 2000 °C, greater than or equal to 500 °C and less than or equal to 1500 °C, greater than or equal to 1000 °C and less than or equal to 2000 °C, greater than or equal to 1000 °C and less than or equal to 1500 °C, or any and all sub-ranges formed from any of these endpoints. Thesintering step can also include a thermal ramp of a defined increase instead or in addition to a hold at any specific temperatures.

[0088] In embodiments, the sintering may comprise heating the brown body for greater than or equal to 5 minutes and less than or equal to 600 minutes. In embodiments, the sintering may comprise heating the brown body for greater than or equal to 5 minutes, greater than or equal to 30 minutes, greater than or equal to 60 minutes, greater than or equal to 90 minutes, or even greater than or equal to 120 minutes. In embodiments, the sintering may comprise heating the brown body for less than or equal to 600 minutes, less than or equal to 480 minutes, less than or equal to 360 minutes, or even less than or equal to 240 minutes. In embodiments, the sintering may comprise heating the brown body for greater than or equal to 5 minutes and less than or equal to 600 minutes, greater than or equal to 5 minutes and less than or equal to 480 minutes, greater than or equal to 5 minutes and less than or equal to 360 minutes, greater than or equal to 5 minutes and less than or equal to 240 minutes, greater than or equal to 30 minutes and less than or equal to 600 minutes, greater than or equal to 30 minutes and less than or equal to 480 minutes, greater than or equal to 30 minutes and less than or equal to 360 minutes, greater than or equal to 30 minutes and less than or equal to 240 minutes, greater than or equal to 60 minutes and less than or equal to 600 minutes, greater than or equal to 60 minutes and less than or equal to 480 minutes, greater than or equal to 60 minutes and less than or equal to 360 minutes, greater than or equal to 60 minutes and less than or equal to 240 minutes, greater than or equal to 90 minutes and less than or equal to 600 minutes, greater than or equal to 90 minutes and less than or equal to 480 minutes, greater than or equal to 90 minutes and less than or equal to 360 minutes, greater than or equal to 90 minutes and less than or equal to 240 minutes, greater than or equal to 120 minutes and less than or equal to 600 minutes, greater than or equal to 120 minutes and less than or equal to 480 minutes, greater than or equal to 120 minutes and less than or equal to 360 minutes, or even greater than or equal to 120 minutes and less than or equal to 240 minutes, or any and all sub-ranges formed from any of these endpoints. The sintering profile can include thermal ramps of a defined increase instead of or in addition to discrete hold temperatures.

[0089] Referring now to FIG. 8, a solid oxide electrolysis cell 20 may comprise a ceramic substrate 22. The ceramic substrate 22 may comprise a first surface 30 and a second surface 40 oppositethe first surface 30. There may be a thickness t extending from the first surface 30 to a second surface 40. There may be a plurality of features 25 extending across the thickness t, wherein at least one of the plurality of features 25 comprises an aspect ratio greater than or equal to 0.1. The features 25 may exist on the first surface 30, second surface 40, or both. In embodiments, the ceramic substrate 22 may be disposed between a cathode 21 and an anode 23.

[0090] In embodiments, the height or depth of the plurality of features of the resulting inorganic substrate may be greater than 0% of the overall substrate thickness and less than or equal to 100% of the overall substrate thickness. In embodiments, the height or depth of the features may be less than or equal to 10%, less than or equal to 20%, less than or equal to 50%, less than or equal to 70%, or even less than or equal to 100% of the overall substrate thickness. In embodiments, the height or depth of the features may be greater thano 0%, greater than or equal to 10%, greater than or equal to 20%, greater than or equal to 50%, or even greater than or equal to 70% of the overall substrate thickness. In embodiments, the height or depth of the features may be greater than 0% and less than or equal to 100%, greater than 0% and less than or equal to 70%, greater than 0% and less than or equal to 50%, greater than 0% and less than or equal to 20%, greater than 0% and less than or equal to 10%, greater than or equal to 10% and less than or equal to 100%, greater than or equal to 10% and less than or equal to 70%, greater than or equal to 10% and less than or equal to 50%, greater than or equal to 10% and less than or equal to 20%, greater than or equal to 20% and less than or equal to 100%, greater than or equal to 20% and less than or equal to 70%, greater than or equal to 20% and less than or equal to 50%, greater than or equal to 50% and less than or equal to 100%, greater than or equal to 50% and less than or equal to 70%, or even greater than or equal to 70% and less than or equal to 100% of the overall substrate thickness, or any and all sub-ranges formed from any of these endpoints.

[0091] The plurality of features of the inorganic substrate may have aspect ratios of greater than or equal to 0.1, greater than or equal to 1, greater than or equal to 5, greater than or equal to 10, greater than or equal to 20, or even greater than or equal to 30. In embodiments, the features may have aspect ratios less than or equal to 100, less than or equal to 90, less than or equal to 80, less than or equal to 70, less than or equal to 60, less than or equal to 50, or even less than or equal to 40. In embodiments, the features may have aspect ratios greater than or equal to 0.1 and less thanor equal to 100, greater than or equal to 0.1 and less than or equal to 90, greater than or equal to 0.1 and less than or equal to 80, greater than or equal 0.1 and less than or equal to 70, greater than or equal to 0.1 and less than or equal to 60, greater than or equal to 0.1 and less than or equal to 50, greater than or equal to 0.1 and less than or equal to 40, greater than or equal to 0.1 and less than or equal to 30, greater than or equal to 0.1 and less than or equal to 20, greater than or equal to 0.1 and less than or equal to 10, greater than or equal to 0.1 and less than or equal to 5, greater than or equal to 0.1 and less than or equal to 1, greater than or equal to 1 and less than or equal to 100, greater than or equal to 1 and less than or equal to 90, greater than or equal to 1 and less than or equal to 80, greater than or equal to 1 and less than or equal to 70, greater than or equal to 1 and less than or equal to 60, greater than or equal to 1 and less than or equal to 50, greater than or equal to 1 and less than or equal to 40, greater than or equal to 1 and less than or equal to 30, greater than or equal to 1 and less than or equal to 20, greater than or equal to 1 and less than or equal to 10, greater than or equal to 1 and less than or equal to 5, greater than or equal to 5 and less than or equal to 100, greater than or equal to 5 and less than or equal to 90, greater than or equal to 5 and less than or equal to 80, greater than or equal to 5 and less than or equal to 70, greater than or equal to 5 and less than or equal to 60, greater than or equal to 5 and less than or equal to 50, greater than or equal to 5 and less than or equal to 40, greater than or equal to 5 and less than or equal to 30, greater than or equal to 5 and less than or equal to 20, greater than or equal to 5 and less than or equal to 10, greater than or equal to 10 and less than or equal to 100, greater than or equal to 10 and less than or equal to 90, greater than or equal to 10 and less than or equal to 80, greater than or equal to 10 and less than or equal to 70, greater than or equal to 10 and less than or equal to 60, greater than or equal to 10 and less than or equal to 50, greater than or equal to 10 and less than or equal to 40, greater than or equal to 10 and less than or equal to 30, greater than or equal to 10 and less than or equal to 20, greater than or equal to 20 and less than or equal to 100, greater than or equal to 20 and less than or equal to 90, greater than or equal to 20 and less than or equal to 80, greater than or equal to 20 and less than or equal to 70, greater than or equal to 20 and less than or equal to 60, greater than or equal to 20 and less than or equal to 50, greater than or equal to 20 and less than or equal to 40, greater than or equal to 20 and less than or equal to 30, greater than or equal to 30 and less than or equal to 100, greater than or equal to 100 and less than or equal to 90,greater than or equal to 30 and less than or equal to 80, greater than or equal to 30 and less than or equal to 70, greater than or equal to 30 and less than or equal to 60, greater than or equal to 30 and less than or equal to 50, greater than or equal to 30 and less than or equal to 40, greater than or equal to 40 and less than or equal to 100, greater than or equal to 40 and less than or equal to 90, greater than or equal to 40 and less than or equal to 80, greater than or equal to 40 and less than or equal to 70, greater than or equal to 40 and less than or equal to 60, greater than or equal to 40 and less than or equal to 50, greater than or equal to 50 and less than or equal to 100, greater than or equal to 50 and less than or equal to 90, greater than or equal to 50 and less than or equal to 80, greater than or equal to 50 and less than or equal to 70, greater than or equal to 50 and less than or equal to 60, greater than or equal to 60 and less than or equal to 100, greater than or equal to 60 and less than or equal to 90, greater than or equal to 60 and less than or equal to 80, greater than or equal to 60 and less than or equal to 70, greater than or equal to 70 and less than or equal to 100, greater than or equal to 70 and less than or equal to 90, greater than or equal to 70 and less than or equal to 80, greater than or equal to 80 and less than or equal to 100, greater than or equal to 80 and less than or equal to 90, or even greater than or equal to 90 and less than or equal to 100, or any and all sub-ranges formed by these endpoints.

[0092] In embodiments, the use of a sacrificial material in the processing of an inorganic substrate may allow for inorganic substrates with increased surface area to be formed. In embodiments, a surface area of the inorganic substrate comprising a plurality of features may increase by greater than or equal to 1.1 times, greater than or equal to 1.2 times, greater than or equal to 1.5 times, greater than or equal to 2 times, greater than or equal to 5 times, or even greater than or equal to 10 times than a conventional inorganic substrate (FIG. 1).

[0093] In embodiments, the use of a sacrificial material in the process of an inorganic substrate may allow for inorganic substrates to achieve improved electrode adhesion. Without being bound by any theory, it is believed that providing increased surface area of the inorganic substrate may correlate with more contact points which may facilitate a stronger physical bond. Additionally, with a larger surface area, there is more space for the adhesive material to bond with both the inorganic substrate and the electrode. This broader adhesive interface can enhance the overall strength of the bond. Further, larger surface area may ensure more uniform current distributionacross the electrode. This is important for maintaining consistent performance and preventing localized overheating or other electrical issues that could affect adhesion.

[0094] In embodiments, the use of a sacrificial material in the process of an inorganic substrate may allow for inorganic substrates to achieve a reduced resistance. Without being bound by any theory, it is believed that adding the plurality of features to the inorganic substrate, such as those depicted in FIGS. 3-7, may lead to an average reduced thickness of the inorganic substrate, which may reduce the overall resistance. In embodiments, a resistance of the inorganic substrate may be reduced approximately in linear proportion to the thickness reduction.Examples

[0095] In order that various embodiments be more readily understood, reference is made to the following examples, which are intended to illustrate various embodiments of the inorganic ceramic substrates described herein.

[0096] A 3YSZ ceramic substrate was formed by inkjet printing a UV-curable acrylate sacrificial layer onto a separable carrier made of mylar with a silicone coating, forming a pattern as illustrated in FIG. 9. FIG. 9 shows the sacrificial material on the separable carrier with patterning features (peaks) that are about 20 pm in height. The graph of FIG. 10 depicts the distance traveled by the profilometer probe and the height of the features of FIG. 9 at 180°.

[0097] Subsequently, a 3YSZ slurry was blade-cast onto the sacrificial layer, and the resulting composite structure was dried. The multi-layer stack, comprising the sacrificial material and the 3YSZ layer, was peeled off the separable carrier. To eliminate the binder, sacrificial material, and other organic components, the part underwent a thermal debinding process at 500 °C. Finally, the substrate was fully sintered at 1450 °C for two hours.

[0098] FIG. 11 shows the 3YSZ ceramic sintered at 1450 °C that was cast in an aqueous slurry upon the sacrificial material with the patterning features of FIG. 9. The 3YSZ ceramic substrate has 15 pm depth troughs that correspond to the sacrificial material’s patterning features after size reduction that occurs during sintering. The graph of FIG. 12 depicts the valleys in the ceramic surface of FIG. 11, which correspond to the height of the peaks depicted graphically in FIG. 10.FIG. 13 shows a cross-section of 3YSZ ceramic substrate of FIG. 11 with 14 pm deep features in a 58 pm thick 3YSZ film.

[0099] It will be apparent to those skilled in the art that various modifications and variations may be made to the embodiments described herein without departing from the spirit and scope of the claimed subject matter. Thus, it is intended that the specification cover the modifications and variations of the various embodiments described herein provided such modification and variations come within the scope of the appended claims and their equivalents.

Claims

CLAIMS1. A method for patterning an inorganic substrate, the method comprising: depositing a sacrificial material on a separable carrier, the sacrificial material comprising: a first surface and a second surface opposite the first surface; and a patterning feature comprising an aspect ratio greater than or equal to 0.1 ; depositing a slurry such that the slurry is positioned on the sacrificial material or the sacrificial material is positioned on the slurry, wherein the slurry comprises an inorganic powder, a binder, and a solvent; and curing the slurry to evaporate the solvent, thereby forming a green body.

2. The method of claim 1, wherein the slurry is deposited prior to depositing the sacrificial material.

3. The method of claim 1, wherein the method further comprises: heating the green body above a first temperature to remove at least a portion of the binder, thereby forming a brown body; and heating the brown body above a second temperature to sinter the inorganic powder, thereby forming the inorganic substrate.

4. The method of claim 3, wherein the separable carrier is removed prior to heating the green body.

5. The method of claim 1, wherein the inorganic powder comprises glass, ceramic, or a combination thereof.

6. A ceramic substrate comprising: a first surface and a second surface opposite the first surface; a thickness extending from the first surface to the second surface; anda plurality of features extending across the thickness, wherein at least one of the plurality of features comprises an aspect ratio greater than or equal to 0.1.

7. The ceramic substrate of claim 6, wherein at least one of the features extends across greater than or equal to 10% of the thickness.

8. The ceramic substrate of claim 6, wherein at least one of the features comprises an enclosed channel.

9. The ceramic substrate of claim 6, wherein at least one of the first surface and the second surface comprises a patterned surface such that at least one of the plurality of features extends from the first surface or the second surface towards the other of the first surface or the second surface.

10. The ceramic substrate of claim 6, wherein the aspect ratio is greater than or equal to 1.

11. A battery comprising: an electrode comprising the ceramic substrate of claim 6; and an electrolyte region penetrating a porous region of a cathode.

12. A mold comprising: a separable carrier; and a sacrificial material disposed adjacent to the separable carrier, wherein the sacrificial material comprises: a first surface and a second surface opposite the first surface; and a patterning feature comprising an aspect ratio greater than or equal to 0.1.

13. The mold of claim 12, wherein the sacrificial material has a boiling point greater than or equal to 350 °C and less than or equal to 1000 °C.

14. The mold of claim 12, wherein the sacrificial material comprises acrylate, wax, or a combination thereof.

15. The mold of claim 12, wherein at least one of the first surface and the second surface comprises a patterned surface such that the patterning feature extends from the first surface or the second surface towards the other of the first surface or the second surface.

16. The mold of claim 12, further comprising a slurry, wherein: the slurry is positioned on the sacrificial material; the sacrificial material is positioned on the slurry; or a combination thereof.

17. The mold of claim 16, wherein the slurry comprises an inorganic powder, a binder, and a solvent.

18. The mold of claim 17, wherein the inorganic powder comprises glass, ceramic, metal, or a combination thereof.

19. The mold of claim 12, wherein the separable carrier comprises polymer, metal, glass, ceramic, glass ceramic, or a combination thereof.

20. The mold of claim 12, further comprising a green body, wherein the green body is formed from the slurry.

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