Lamp panel, light source module and manufacturing method therefor

Abstract

A lamp panel, a light source module and a manufacturing method therefor. The lamp panel comprises a first circuit board (10) and a second circuit board (20). The first circuit board (10) comprises a first connection part (11) and a plurality of first light-emitting parts (12) connected to the first connection part (11), the plurality of first light-emitting parts (12) being connected to one side of the first connection part (11). The second circuit board (20) comprises a second connection part (21) and a plurality of second light-emitting parts (22) connected to the second connection part (21), the second connection part (21) being arranged opposite to the first connection part (11), and the plurality of second light-emitting parts (22) being connected to the side of the second connection part (21) facing the first connection part (11). The first light-emitting parts (12) and the second light-emitting parts (22) are alternately interdigitated on the same plane. The light source module comprises the lamp panel.

Description

Light board, light source module and preparation method thereof

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on March 29, 2024, with application number 202410383789.7 and application name “A lamp board, light source module and preparation method thereof”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of optical technology, and in particular to a light board, a light source module and a preparation method thereof. Background Art

[0003] Mini LED TVs utilize a matrix of hundreds to tens of thousands of LED light sources, combined with localized light control technology, to enhance contrast and highlight details and depth in the image. For mid-range and high-end Mini LED TVs, printed circuit boards (PCBs) account for 30%-50% of backlight costs, limiting the widespread adoption of Mini LED technology in lower-tier markets. Technical issues

[0004] For mid- to high-end Mini LED TVs, printed circuit boards (PCBs) account for 30%-50% of backlight costs, limiting the widespread adoption of Mini LED technology in lower-tier markets. Consequently, reducing PCB usage is crucial to lowering costs. Technical Solutions

[0005] The present application provides a light board, a light source module and a preparation method thereof, which can reduce the amount of circuit boards used and thus reduce costs.

[0006] The present application provides a light board, including a first circuit board and a second circuit board, the first circuit board including a first connecting part and a plurality of first light-emitting parts connected to the first connecting part, and the plurality of first light-emitting parts are connected to one side of the first connecting part; the second circuit board including a second connecting part and a plurality of second light-emitting parts connected to the second connecting part, and the plurality of second light-emitting parts are connected to the side of the second connecting part facing the first connecting part; wherein the first light-emitting parts and the second light-emitting parts are located in the same plane and are arranged alternately and interspersed.

[0007] In some embodiments of the light board, one end of the first light-emitting portion is connected to the first connecting portion, and the other end of the first light-emitting portion is close to the second connecting portion.

[0008] In some embodiments of the light board, one end of the second light-emitting portion is connected to the second connecting portion, and the other end of the second light-emitting portion is close to the first connecting portion.

[0009] In some embodiments of the light board, the first light-emitting portion is provided with a plurality of first light-emitting positions at intervals, and each first light-emitting position is provided with two soldering pads; the second light-emitting portion is provided with a plurality of second light-emitting positions at intervals, and each second light-emitting position is provided with two soldering pads; wherein the soldering pads are used to solder the light-emitting chips.

[0010] In some embodiments of the light board, a groove is provided between or around the two soldering pads.

[0011] In some embodiments of the light board, the first light-emitting position and the second light-emitting position between adjacent first light-emitting portions and second light-emitting portions are arranged side by side.

[0012] In some embodiments of the light board, the first light-emitting positions and the second light-emitting positions between adjacent first light-emitting portions and second light-emitting portions are staggered.

[0013] In some embodiments of the light board, the edge of the first light-emitting portion and the edge of the second light-emitting portion are both straight lines.

[0014] In some embodiments of the light board, the edge of the first light-emitting portion is curved, and the edge of the second light-emitting portion is curved; wherein the edge of the first light-emitting portion faces the adjacent second light-emitting portion, and the edge of the second light-emitting portion faces the adjacent first light-emitting portion.

[0015] In some embodiments of the light board, the edge of the first light-emitting portion is adapted to the edge of the second light-emitting portion.

[0016] The present application also provides a light source module, comprising a light board, the light board comprising a first circuit board and a second circuit board, the first circuit board comprising a first connecting portion and a plurality of first light-emitting portions connected to the first connecting portion, the plurality of first light-emitting portions being connected to one side of the first connecting portion; the second circuit board comprising a second connecting portion and a plurality of second light-emitting portions connected to the second connecting portion, the second connecting portion being arranged opposite to the first connecting portion, the plurality of second light-emitting portions being connected to a side of the second connecting portion facing the first connecting portion; wherein the first light-emitting portions and the second light-emitting portions are located in the same plane and are arranged alternately and interspersed with each other;

[0017] A plurality of light-emitting chips are arranged in the first light-emitting portion and the second light-emitting portion of the light board, and each light-emitting chip is covered with an adhesive layer.

[0018] In the backlight module of some embodiments, one end of the first light-emitting portion is connected to the first connecting portion, and the other end of the first light-emitting portion is close to the second connecting portion.

[0019] In the backlight module of some embodiments, one end of the second light-emitting portion is connected to the second connecting portion, and the other end of the second light-emitting portion is close to the first connecting portion.

[0020] In some embodiments of the backlight module, the first light-emitting portion is provided with a plurality of first light-emitting positions at intervals, and each first light-emitting position is provided with two solder pads; the second light-emitting portion is provided with a plurality of second light-emitting positions at intervals, and each second light-emitting position is provided with two solder pads;

[0021] Among them, the soldering pad is used for soldering the light-emitting chip.

[0022] In some embodiments of the backlight module, a groove is provided between or around the two pads.

[0023] In some embodiments of the backlight module, the first light-emitting position and the second light-emitting position between adjacent first light-emitting portions and second light-emitting portions are arranged side by side.

[0024] In the backlight module of some embodiments, the first light-emitting positions and the second light-emitting positions between adjacent first light-emitting portions and second light-emitting portions are staggered in distribution.

[0025] An embodiment of the present application also provides a method for preparing a light source module, which comprises preparing a first circuit board and a second circuit board, and interlacing the first circuit board and the second circuit board so that the multiple first light-emitting parts of the first circuit board and the multiple second light-emitting parts of the second circuit board are located on the same plane and arranged alternately and interlaced; arranging multiple groups of solder pads on the first light-emitting part and the second light-emitting part at intervals; arranging a light-emitting chip on each group of solder pads; and arranging a glue layer on the light-emitting chip through a glue dispensing process to cover the light-emitting chip.

[0026] In some embodiments of the method for preparing the light source module, after arranging multiple groups of solder pads on the first light-emitting portion and the second light-emitting portion at intervals, grooves are arranged between or around each group of solder pads.

[0027] In some embodiments of the method for preparing a light source module, a glue layer is provided on the light emitting chip through a glue dispensing process. The glue is dispensed multiple times on each light emitting chip so that the dispensed glue flows along the groove to form glue layers of different shapes. Beneficial effects

[0028] The present application provides a lamp board, a light source module and a preparation method thereof, wherein the present application arranges multiple first light-emitting parts in the first circuit board on the same side of the first connecting part; at the same time, the multiple second light-emitting parts are arranged on the same side of the second connecting part, so that when the first circuit board and the second circuit board are laid out, the first light-emitting parts and the second light-emitting parts are located in the same plane and arranged alternately and interspersed; compared with arranging light-emitting chips on the entire square circuit board, the first circuit board and the second circuit board in the present application can make full use of the intervals between the light-emitting chips and increase the distribution density of the light-emitting chips. Therefore, on the basis of arranging the same number of light-emitting chips, the interspersed first circuit board and the second circuit board in this embodiment can effectively reduce the amount of circuit boards used, thereby reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0030] FIG1 is a schematic structural diagram of a light board provided in an embodiment of the present application.

[0031] FIG2 is a schematic diagram of a first arrangement of the first light-emitting position and the second light-emitting position in the lamp panel provided in an embodiment of the present application.

[0032] FIG3 is a schematic diagram of the structure of the groove in the light board provided in an embodiment of the present application.

[0033] FIG4 is a schematic diagram of the structure of the glue layer in the light board provided in an embodiment of the present application.

[0034] FIG5 is a schematic diagram of a second arrangement of the first light-emitting position and the second light-emitting position in the lamp panel provided in an embodiment of the present application.

[0035] FIG6 is a schematic diagram of the edges of the first light-emitting portion and the second light-emitting portion in the light board provided in an embodiment of the present application.

[0036] FIG7 is a flow chart of a method for preparing a light source module provided in an embodiment of the present application.

[0037] Reference numerals: 10, first circuit board; 10, second circuit board; 30, light-emitting chip; 40, groove; 50, adhesive layer; 11, first connecting portion; 12, first light-emitting portion; 13, first light-emitting position; 21, second connecting portion; 22, second light-emitting portion; 23, second light-emitting position. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicating the number of technical features indicated. The features specified as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0040] Please refer to Figure 1. This embodiment provides a lamp board, which includes a first circuit board 10 and a second circuit board 20; wherein, the first circuit board 10 includes a first connecting portion 11 and a plurality of first light-emitting portions 12 connected to the first connecting portion 11, and the plurality of first light-emitting portions 12 are connected to one side of the first connecting portion 11; the second circuit board 20 includes a second connecting portion 21 and a plurality of second light-emitting portions 22 connected to the second connecting portion 21, the second connecting portion 21 is arranged opposite to the first connecting portion 11, and the plurality of second light-emitting portions 22 are connected to the side of the second connecting portion 21 facing the first connecting portion 11; the first light-emitting portions 12 and the second light-emitting portions 22 are located in the same plane and are arranged alternately.

[0041] In this embodiment, the plurality of first light-emitting portions 12 in the first circuit board 10 are arranged on the same side of the first connecting portion; at the same time, the plurality of second light-emitting portions 22 are arranged on the same side of the second connecting portion 21, so that when the light board is set up, the first circuit board 10 and the second circuit board 20 are interlaced and arranged, so that the first light-emitting portions 12 and the second light-emitting portions 22 are located on the same plane and alternately interlaced. That is, in this embodiment, the first circuit board 10 and the second circuit board 20 are both arranged to resemble a comb, wherein the plurality of first light-emitting portions 12 and the plurality of second light-emitting portions 22 are similar to the teeth of a comb. Then, when setting up the light board, the first circuit board 10 and the second circuit board 20 can be interlaced, that is, the second light-emitting portion 22 is arranged between the two first light-emitting portions 12, and the first light-emitting portion 12 is located between the two second light-emitting portions 22, so that the first light-emitting portions 12 and the second light-emitting portions 22 are located on the same plane and alternately interlaced; wherein, the first light-emitting portion 12 and the second light-emitting portion 22 are both used to set the light-emitting chip 30. Compared to arranging the light-emitting chips 30 along the X and Y directions on an entire square circuit board, the first circuit board 10 and the second circuit board 20 in this embodiment can fully utilize the spacing between the light-emitting chips 30 in the X direction and increase the distribution density of the light-emitting chips 30 in the X direction. Therefore, on the basis of arranging the same number of light-emitting chips 30, the interlaced arrangement of the first circuit board 10 and the second circuit board 20 in this embodiment can effectively reduce the number of circuit boards used, thereby reducing costs.

[0042] In some embodiments, one end of the first light-emitting portion 12 (such as end A in Figure 1) is connected to the first connecting portion 11, and the other end of the first light-emitting portion 12 (such as end B in Figure 1) is close to the second connecting portion 21, thereby allowing the length of the first light-emitting portion 12 to be adapted to the length of the interval between the two second light-emitting portions 22, so that the interval space between the two second light-emitting portions 22 can be fully utilized.

[0043] In some embodiments, one end of the second light-emitting portion 22 (such as end C in Figure 1) is connected to the second connecting portion 21, and the other end of the second light-emitting portion 22 (such as end D in Figure 1) is close to the first connecting portion 11, so that the length of the second light-emitting portion 22 can be adapted to the length of the interval between the two first light-emitting portions 12, so that the interval space between the two first light-emitting portions 12 can be fully utilized.

[0044] Referring to FIG. 2 , in some embodiments, the first light-emitting portion 12 is provided with a plurality of first light-emitting positions 13 at intervals, each of which is provided with two soldering pads. The second light-emitting portion 22 is provided with a plurality of second light-emitting positions 23 at intervals, each of which is provided with two soldering pads. The soldering pads are used for soldering the light-emitting chip 30. The two soldering pads on each first light-emitting position 13 are a positive soldering pad and a negative soldering pad, respectively. Similarly, the two soldering pads on each second light-emitting position 23 are a positive soldering pad and a negative soldering pad, respectively. In this embodiment, two soldering pads are provided on each light-emitting position to facilitate the subsequent installation of the light-emitting chip 30.

[0045] Referring to Figures 3 and 4, in some embodiments, a groove 40 is provided between the two soldering pads on each light-emitting position. The groove 40 may be a rectangular groove 40, the length direction of which is consistent with the length of the first light-emitting portion 12 or the second light-emitting portion 22, and the two soldering pads are respectively located on both sides of the width direction of the groove 40. In this embodiment, the groove 40 can be used as a guide groove. After the light-emitting chip 30 is provided on the soldering pad, glue is dispensed on the light-emitting chip 30 through a dispensing process to form a glue layer 50. During the dispensing process, the glue can flow along the direction of the groove 40 to form glue layers 50 of different shapes. For example, for the rectangular groove 40, a glue layer 50 with a cross-section similar to an ellipse can be formed by multiple dispensing. In this embodiment, the groove 40 is provided to assist in forming an irregularly shaped glue layer 50, so that the light-emitting chip 30 emits light asymmetrically. When the light panel is applied to a display device, the display uniformity can be improved.

[0046] In some embodiments, in addition to setting a groove 40 between the two pads, a groove 40 can also be set around the two pads. By setting grooves 40 of different depths, widths and lengths, the grooves 40 can be formed into a variety of different shapes, such as polygons or stars, etc., so as to facilitate subsequent multiple dispensing to form an irregular glue layer 50, thereby improving display uniformity.

[0047] As an embodiment, the bottom of the groove 40 is provided with a step, or the bottom of the groove 40 is provided as a concave or convex curved surface, so as to facilitate the formation of adhesive layers 50 of different shapes. It should be noted that the shape of the groove 40 and the configuration of the bottom of the groove 40 are not specifically shown in this application, and can be configured in accordance with actual circumstances.

[0048] Continuing with FIG2 , as an embodiment, the first light-emitting position 13 and the second light-emitting position 23 between adjacent first light-emitting portions 12 and second light-emitting portions 22 are arranged side by side, and the light-emitting chips 30 on the first circuit board 10 and the second circuit board 20 can be arranged in a matrix. In this embodiment, the edges of the first light-emitting portion 12 and the second light-emitting portion 22 are both straight lines.

[0049] Please refer to FIG5 as another embodiment, in which the first light-emitting position 13 and the second light-emitting position 23 between adjacent first light-emitting portions 12 and second light-emitting portions 22 are staggered. In this embodiment, the edges of the first light-emitting portion 12 and the second light-emitting portion 22 are both straight lines.

[0050] Please refer to Figure 6, as another embodiment, the first light-emitting position 13 and the second light-emitting position 23 between adjacent first light-emitting portions 12 and second light-emitting portions 22 are staggered; wherein, the edge of the first light-emitting portion 12 and the edge of the second light-emitting portion 22 are curved, the edge of the first light-emitting position 13 is toward the adjacent second light-emitting portion 22, and the edge of the second light-emitting position 23 is toward the adjacent first light-emitting portion 12.

[0051] Specifically, the boundary between two adjacent light-emitting positions in the first light-emitting section 12 or the second light-emitting section 22 is contracted inward, while the boundary between adjacent second light-emitting sections 22 or light-emitting positions in the first light-emitting section 12 is protruded, complementing the contracted position. In this embodiment, the edge of the first light-emitting section 12 is aligned with the edge of the second light-emitting section 22. In this embodiment, the edges of the first light-emitting section 12 and the second light-emitting section 22 are configured as complementary curved shapes. This fully utilizes the gaps in the X direction created by the interlacing of the different light-emitting sections, thereby further reducing the number of circuit boards used and lowering costs.

[0052] The present application also provides a light source module comprising at least one of the aforementioned light boards and a plurality of light-emitting chips 30. The plurality of light-emitting chips 30 are disposed within the first light-emitting portion 12 and the second light-emitting portion 22 of the light board, and each light-emitting chip 30 is covered with an adhesive layer 50. In this embodiment, the adhesive layer 50 is disposed on the light-emitting chips 30 to facilitate adjustment of the light output pattern of the light-emitting chips 30, thereby improving the display effect. Since the light board has been described in detail above, it will not be further elaborated here.

[0053] Referring to FIG. 7 , an embodiment of the present application further provides a method for preparing a light source module, the method comprising:

[0054] 100. Prepare a first circuit board and a second circuit board, and interlace the first circuit board and the second circuit board so that the multiple first light-emitting portions of the first circuit board and the multiple second light-emitting portions of the second circuit board are located on the same plane and are alternately interlaced.

[0055] 200. Multiple groups of solder pads are arranged at intervals on the first light-emitting portion and the second light-emitting portion;

[0056] 300. Arrange a light-emitting chip on each group of pads;

[0057] 400. A glue layer is provided on the light-emitting chip through a glue dispensing process to cover the light-emitting chip.

[0058] In this embodiment, the first circuit board includes a first connecting portion and a plurality of first light-emitting portions connected to the first connecting portion, and the plurality of first light-emitting portions are arranged on the same side of the first connecting portion; the second circuit board includes a second connecting portion and a plurality of second light-emitting portions connected to the second connecting portion, and the plurality of second light-emitting portions are arranged at intervals on the same side of the second connecting portion. Then, when preparing the light source module, the first circuit board and the second circuit board can be interspersed so that the plurality of first light-emitting portions of the first circuit board and the plurality of second light-emitting portions of the second circuit board are arranged alternately in the same plane. In addition, a plurality of groups of solder pads are arranged at intervals on the first light-emitting portion and the second light-emitting portion to form light-emitting positions, and then a light-emitting chip is arranged on each group of solder pads, and then a glue layer is provided on the light-emitting chip through a glue dispensing process to cover the light-emitting chip.

[0059] In this embodiment, by providing a comb-shaped first circuit board and a second circuit board, and then interlacing the first circuit board and the second circuit board, the amount of circuit boards used can be effectively reduced, thereby reducing costs.

[0060] In some embodiments, after arranging the light-emitting chip on each group of pads, the method further includes: arranging grooves between or around each group of pads. Then, when the glue layer is arranged on the light-emitting chip through the glue dispensing process, multiple glue dispensing can be performed on each light-emitting chip so that the glue flows along the grooves to form glue layers of different shapes. In this embodiment, the irregularly shaped glue layer is formed by arranging grooves to facilitate the asymmetric light output of the light-emitting chip. When the light board is applied to a display device, the uniformity of the display can be improved. Since the structure of the light source module has been described in detail above, it will not be repeated here.

[0061] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0062] The above is a detailed introduction to the lamp board provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A light board, wherein: include: a first circuit board, the first circuit board comprising a first connecting portion and a plurality of first light-emitting portions connected to the first connecting portion, the plurality of first light-emitting portions being connected to one side of the first connecting portion; A second circuit board, the second circuit board includes a second connecting portion and a plurality of second light-emitting portions connected to the second connecting portion, the second connecting portion is arranged opposite to the first connecting portion, and the plurality of second light-emitting portions are connected to a side of the second connecting portion facing the first connecting portion; wherein the first light-emitting portions and the second light-emitting portions are located in the same plane and are arranged alternately and interspersed.

2. The light board according to claim 1, wherein: One end of the first light-emitting portion is connected to the first connecting portion, and the other end of the first light-emitting portion is close to the second connecting portion.

3. The light board according to claim 2, wherein: One end of the second light-emitting portion is connected to the second connecting portion, and the other end of the second light-emitting portion is close to the first connecting portion.

4. The light board according to claim 3, wherein: The first light-emitting portion is provided with a plurality of first light-emitting positions at intervals, and each first light-emitting position is provided with two solder pads; the second light-emitting portion is provided with a plurality of second light-emitting positions at intervals, and each second light-emitting position is provided with two solder pads; Wherein, the soldering pad is used for soldering the light-emitting chip.

5. The light board according to claim 4, wherein: A groove is provided between or around the two pads.

6. The light board according to claim 4, wherein: The first light-emitting position and the second light-emitting position between the adjacent first light-emitting parts and the second light-emitting parts are arranged side by side.

7. The light board according to claim 4, wherein: The first light-emitting position and the second light-emitting position between adjacent first light-emitting portions and the second light-emitting portions are staggered in distribution.

8. The light board according to claim 6 or 7, wherein: The edge of the first light-emitting portion and the edge of the second light-emitting portion are both straight lines.

9. The light board according to claim 7, wherein: The edge of the first light-emitting portion is curved, and the edge of the second light-emitting portion is curved; wherein the edge of the first light-emitting portion faces the adjacent second light-emitting portion, and the edge of the second light-emitting portion faces the adjacent first light-emitting portion.

10. The light board according to claim 9, wherein: The edge of the first light-emitting portion is matched with the edge of the second light-emitting portion.

11. A light source module, wherein: The light source module includes: At least one light board, the light board comprising a first circuit board and a second circuit board, the first circuit board comprising a first connecting portion and a plurality of first light-emitting portions connected to the first connecting portion, the plurality of first light-emitting portions being connected to one side of the first connecting portion; the second circuit board comprising a second connecting portion and a plurality of second light-emitting portions connected to the second connecting portion, the second connecting portion being arranged opposite to the first connecting portion, the plurality of second light-emitting portions being connected to a side of the second connecting portion facing the first connecting portion; wherein the first light-emitting portions and the second light-emitting portions are located in the same plane and are arranged alternately and interspersed with each other; A plurality of light-emitting chips are arranged in the first light-emitting portion and the second light-emitting portion of the light board, and each of the light-emitting chips is covered with an adhesive layer.

12. The light source module according to claim 11, wherein: One end of the first light-emitting portion is connected to the first connecting portion, and the other end of the first light-emitting portion is close to the second connecting portion.

13. The light source module according to claim 12, wherein: One end of the second light-emitting portion is connected to the second connecting portion, and the other end of the second light-emitting portion is close to the first connecting portion.

14. The light source module according to claim 13, wherein: The first light-emitting portion is provided with a plurality of first light-emitting positions at intervals, and each first light-emitting position is provided with two solder pads; the second light-emitting portion is provided with a plurality of second light-emitting positions at intervals, and each second light-emitting position is provided with two solder pads; Wherein, the soldering pad is used for soldering the light-emitting chip.

15. The light source module according to claim 14, wherein: A groove is provided between or around the two pads.

16. The light source module according to claim 14, wherein: The first light-emitting position and the second light-emitting position between the adjacent first light-emitting parts and the second light-emitting parts are arranged side by side.

17. The light source module according to claim 14, wherein: The first light-emitting position and the second light-emitting position between adjacent first light-emitting portions and the second light-emitting portions are staggered in distribution.

18. A method for preparing a light source module, wherein: The preparation method comprises: Prepare a first circuit board and a second circuit board, and interlace the first circuit board and the second circuit board so that the multiple first light-emitting portions of the first circuit board and the multiple second light-emitting portions of the second circuit board are located in the same plane and arranged alternately and interlaced; A plurality of groups of solder pads are arranged at intervals on the first light-emitting portion and the second light-emitting portion; Arranging a light-emitting chip on each group of the pads; A glue layer is provided on the light emitting chip through a glue dispensing process to cover the light emitting chip.

19. The method for preparing a light source module according to claim 18, wherein: The step of arranging a plurality of groups of solder pads on the first light-emitting portion and the second light-emitting portion at intervals includes: Grooves are arranged between or around each group of pads.

20. The method for preparing a light source module according to claim 19, wherein: The step of providing a glue layer on the light-emitting chip by using a glue dispensing process includes: Glue is dispensed multiple times on each of the light-emitting chips, so that the dispensed glue flows along the grooves to form glue layers of different shapes.

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