Packaging structure with inductor integrated in packaging substrate, and preparation method therefor

Abstract

Provided in the present disclosure are a packaging structure with an inductor integrated in a packaging substrate, and a preparation method therefor. The packaging structure comprises: an inductor, which comprises a magnetic core and a winding arranged around the magnetic core, wherein the winding comprises a plurality of winding segments which are electrically connected in sequence; and a packaging substrate, wherein the magnetic core and at least some of the plurality of winding segments are embedded in the packaging substrate.

Description

Package structure with inductor integrated in package substrate and preparation method

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese Patent Application No. 202410375852.2 filed with the China Patent Office on March 27, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to, but is not limited to, the field of semiconductor technology. Background Art

[0004] Inductors are commonly used electronic components in chip power supplies. In chip packaging, inductors are placed on the surface of the package substrate, occupying separate space within the chip package and hindering chip packaging integration. With the advancement of electronic technology, higher demands are being placed on high-performance and highly integrated chips. Improving chip package integration and reducing the space occupied by electronic components have become pressing challenges. Summary of the Invention

[0005] The present disclosure provides a packaging structure with an inductor integrated in a packaging substrate and a preparation method thereof.

[0006] In a first aspect, the present disclosure provides a packaging structure in which an inductor is integrated in a packaging substrate, comprising: an inductor, the inductor comprising a magnetic core and a winding arranged around the magnetic core, the winding comprising a plurality of winding segments electrically connected in sequence; and a packaging substrate, the magnetic core and at least some of the winding segments among the plurality of winding segments being embedded in the packaging substrate.

[0007] In a second aspect, the present disclosure provides a method for preparing a packaging structure in which an inductor is integrated in a packaging substrate, comprising: obtaining a substrate core; forming a magnetic core in the substrate core, and forming a plurality of winding segments surrounding the magnetic core around the magnetic core, and at least some of the plurality of winding segments are embedded in the packaging substrate; and electrically connecting the plurality of winding segments in sequence to obtain a winding surrounding the magnetic core.

[0008] In a third aspect, the present disclosure provides an electronic device, comprising: a packaging structure, wherein the packaging structure adopts the packaging structure provided herein in which an inductor is integrated in a packaging substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] FIG1 is a cross-sectional view of a packaging structure with an inductor integrated in a packaging substrate provided by the present disclosure;

[0010] FIG2 is a cross-sectional view of a package structure including multiple unit structures according to an embodiment of the present disclosure;

[0011] FIG3 is a cross-sectional view (top view) along line AA in FIG1( a );

[0012] FIG4 is a cross-sectional view of another packaging structure provided by the present disclosure, in which an inductor is integrated in a packaging substrate;

[0013] FIG5 is a cross-sectional view (top view) along line BB in FIG4( a );

[0014] FIG6 is a cross-sectional view of another packaging structure with an inductor integrated in a packaging substrate provided by an embodiment of the present disclosure;

[0015] FIG7 is a schematic diagram of an inductor provided in an embodiment of the present disclosure;

[0016] FIG8 is a flow chart of a method for preparing a packaging structure provided by an embodiment of the present disclosure;

[0017] FIG9 is a process diagram of a method for preparing a packaging structure provided by an embodiment of the present disclosure;

[0018] FIG10 is a process diagram of a method for preparing a packaging structure provided by an embodiment of the present disclosure;

[0019] FIG11 is a process diagram of a method for preparing another packaging structure provided by an embodiment of the present disclosure;

[0020] FIG12 is a process diagram of a method for preparing another packaging structure provided by an embodiment of the present disclosure;

[0021] FIG13 is a process diagram of a method for preparing another packaging structure provided by an embodiment of the present disclosure. DETAILED DESCRIPTION

[0022] To enable those skilled in the art to better understand the technical solution of the present disclosure, the packaging structure with an inductor integrated in a packaging substrate and the preparation method provided by the present disclosure are described in detail below with reference to the accompanying drawings.

[0023] Example embodiments will be described more fully hereinafter with reference to the accompanying drawings, but the example embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of this disclosure to those skilled in the art.

[0024] In the absence of conflict, the various embodiments of the present disclosure and the various features therein may be combined with each other.

[0025] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0026] The terms used herein are used only to describe specific embodiments and are not intended to limit the present disclosure. As used herein, the singular forms "a," "an," and "the" are also intended to include the plural forms, unless the context clearly indicates otherwise. It will also be understood that when the terms "comprising" and / or "made of" are used in this specification, the presence of the features, wholes, steps, operations, elements, and / or components is specified, but the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or groups thereof is not excluded.

[0027] The embodiments described herein may be described with reference to plan views and / or cross-sectional views, with the aid of idealized schematic diagrams of the present disclosure. Thus, the example illustrations may be modified based on manufacturing techniques and / or tolerances. Therefore, the embodiments are not limited to the embodiments shown in the accompanying drawings, but include modifications of the configurations formed based on the manufacturing process. Therefore, the regions illustrated in the accompanying drawings are schematic in nature, and the shapes of the regions shown in the drawings illustrate specific shapes of the regions of the elements, but are not intended to be limiting.

[0028] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted as having an idealized or overly formal meaning unless expressly defined as such herein.

[0029] The present disclosure provides a package structure with an inductor integrated within a package substrate. The package structure includes an inductor and a package substrate. The inductor includes a magnetic core and a winding disposed around the magnetic core. The winding includes multiple winding segments electrically connected in sequence. The magnetic core and at least some of the multiple winding segments are embedded within the package substrate. The magnetic core can improve the quality factor of the inductor, enabling lower power loss and higher inductance values.

[0030] Figure 1 is a cross-sectional view of a package structure with an inductor integrated within a package substrate, as provided by the present disclosure. As shown in Figure 1 , the package structure with an inductor integrated within a package substrate includes a package substrate 10 and an inductor 20. The package substrate 10 includes a substrate core 1 and a receiving cavity 3 disposed within the substrate core 1. A magnetic core 4 and a winding are disposed within the receiving cavity 3. The winding includes multiple winding segments 21. The magnetic core 4 and the winding segments 21 are both embedded within the package substrate 10.

[0031] In some embodiments, the material of the substrate core includes one or more of glass, ceramic, and organic material.

[0032] In some embodiments, the accommodating cavity 3 includes a groove arranged on the substrate core 1, the winding includes multiple winding segments 21, the magnetic core 4 and the multiple winding segments 21 are arranged in the groove, and at least part of the multiple winding segments 21 are arranged close to the magnetic core 4, that is, the magnetic core 4 and the winding segment 21 are arranged in close contact.

[0033] For example, all of the winding segments 21 can be arranged close to the magnetic core 4, as shown in Figure 1 (a). In some embodiments, some of the winding segments 21 are arranged close to the magnetic core 4, as shown in Figures 1 (b) and (c).

[0034] In some embodiments, the material of the multi-segment winding segment 21 includes one or more of titanium, molybdenum, gold, platinum, aluminum, nickel, copper, chromium, hafnium, and indium; or a material composed of an alloy of titanium, molybdenum, gold, platinum, aluminum, nickel, copper, chromium, hafnium, or indium.

[0035] In some embodiments, the material of the magnetic core 4 includes one or more of diamagnetic material, paramagnetic material, ferromagnetic material, ferrimagnetic material or antiferromagnetic material.

[0036] In some embodiments, a dielectric layer 15 is provided above the magnetic core 4 to protect the inductor and improve its anti-interference capability. The dielectric layer 15 can be made of an insulating material, such as a resin material or an epoxy polymer material containing silicon dioxide particles or filler particles.

[0037] Interconnects 16 are provided within dielectric layer 15 to electrically connect multiple winding segments 21. To form interconnects 16, holes can be drilled through the thickness of dielectric layer 15, and then a conductive metal material is deposited within the holes through electroplating or other methods, thereby forming interconnects 16 within the holes. The depth of the drilled holes can be set as needed. For example, the depth of the drilled holes can be the thickness of dielectric layer 15, as shown in Figure 1(b); alternatively, the depth of the drilled holes can be the combined thickness of dielectric layer 15, magnetic core 4, and a portion of substrate core 1, as shown in Figure 1(c).

[0038] The above package structure takes one inductor as an example. In actual applications, the package structure includes one or more inductors. When the package structure includes multiple inductors, the multiple inductors can be electrically connected in sequence.

[0039] The following is an introduction using an example in which the packaging structure includes two inductors. Figure 2 is a cross-sectional view of a packaging structure including multiple inductors in an embodiment of the present disclosure. As shown in Figure 2, two grooves are provided on the substrate core 1, and each groove corresponds to an inductor 20, that is, there is a one-to-one correspondence between the grooves and the inductor 20. Figure a in Figure 2 is a schematic diagram of two inductors being respectively arranged in a groove, taking the packaging structure shown in Figure a in Figure 1 as an example. Figure b in Figure 2 is a schematic diagram of two inductors being respectively arranged in a groove, taking the packaging structure shown in Figure b in Figure 1 as an example. Figure c in Figure 2 includes two packaging structures shown in Figure c in Figure 1 as an example, and two inductors being respectively arranged in a groove.

[0040] In the package structure provided in this embodiment, the shape of the magnetic core 4 can be set as needed. For example, the shape of the magnetic core 4 in a cross section parallel to the surface of the package substrate 10 includes a bar shape, a U shape, and an L shape. As shown in Figure 3a, the cross-sectional shape of the magnetic core 4 is a U shape. As shown in Figure 3b, the cross-sectional shape of the magnetic core 4 is a bar shape. As shown in Figure 3c, the cross-sectional shape of the magnetic core 4 is an L shape.

[0041] It should be noted that the shape of the magnetic core 4 provided in FIG. 3 is exemplary, but the shape of the magnetic core 4 in the present disclosure is not limited thereto.

[0042] This embodiment also provides another packaging structure with an inductor integrated in a packaging substrate. Figure 4 is a cross-sectional view of another packaging structure with an inductor integrated in a packaging substrate provided by the present disclosure. As shown in Figure 4, the packaging structure with an inductor integrated in a packaging substrate includes an inductor 20 and a packaging substrate 10. The inductor 20 includes a magnetic core 4 and a winding arranged around the magnetic core 4. The winding includes multiple winding segments electrically connected in sequence. The packaging substrate 10 includes a substrate core 1 and a groove provided on the substrate core 1. The magnetic core 4 and at least part of the winding segments in the multiple winding segments are embedded in the groove. The multiple winding segments include a first winding segment 6 and a second winding segment 7. The first winding segment 6 and the magnetic core 4 are arranged in the groove, and the second winding segment 7 is arranged outside the groove.

[0043] In this embodiment, the magnetic core 4 includes a first magnetic film 8 and a second magnetic film 9 , and the first magnetic film 8 and the second magnetic film 9 wrap the first winding segment 6 .

[0044] For example, as shown in Figure a in Figure 4, the first magnetic film 8, the first winding segment 6 and the second magnetic film 9 are stacked in sequence on the inner wall (bottom wall and side wall) of the groove, that is, the first winding segment 6 is stacked between the first magnetic film 8 and the second magnetic film 9, so that the first magnetic film 8 and the second magnetic film 9 wrap the first winding segment 6.

[0045] As shown in Figure 4b, the first magnetic film 8, the first winding segment 6 and the second magnetic film 9 are stacked in sequence on the bottom wall and side wall of the groove, that is, the first winding segment 6 is stacked between a magnetic film and a second magnetic film 9, so that the first magnetic film 8 and the second magnetic film 9 wrap the first winding segment 6.

[0046] As shown in Figure 4 c, the first magnetic film 8, the first winding segment 6 and the second magnetic film 9 are stacked in sequence on the bottom wall of the groove, but only the first winding segment 6 is set on the side wall of the groove, and the first magnetic film 8 and the second magnetic film 9 are not set, that is, the first winding segment 6 located on the side wall is not wrapped by the first magnetic film 8 and the second magnetic film 9.

[0047] In some embodiments, after the first magnetic film 8, the first winding segment 6, and the second magnetic film 9 are disposed within the groove, the remaining space within the groove is filled with a dielectric material to form a first dielectric layer 17, as shown in Figures a and b of Figure 4. In the disclosed embodiments, the first dielectric layer 17 can improve the insulation performance and anti-interference capability of the inductor.

[0048] In some embodiments, after the first magnetic film 8, the first winding segment 6, and the second magnetic film 9 are arranged in the groove, the remaining space is filled with the first dielectric layer 17, and the first dielectric layer 17 is flush with the surface of the substrate core 1, as shown in Figure c in Figure 4.

[0049] This embodiment utilizes the first magnetic film and the second magnetic film to wrap at least a portion of the first winding segment, so that the inductor has a higher quality factor (Q value), can achieve lower power loss and higher inductance value, thereby improving the energy conversion capability of the circuit containing the inductor.

[0050] As shown in FIG4 , a second winding segment 7 is provided on the surface of the substrate core 1 and on the side where the groove opening is provided. The second winding segment 7 is electrically connected to the first winding segment 6 provided in the groove to form a complete winding.

[0051] A second dielectric layer 18 is also provided on the surface of the substrate core 1 where the second winding segment 7 is provided, that is, the second dielectric layer 18 is provided on the outermost layer of the inductor to protect and improve the insulation performance and anti-interference ability of the inductor, thereby improving the stability and reliability of the circuit including the inductor.

[0052] In some embodiments, an interconnection line 16 is further provided in the second dielectric layer 18 for connecting the first winding segment 6 and the second winding segment 7 .

[0053] In this embodiment, the shape of the groove can be set as needed. As shown in Figure 5 a, the shape of the groove can be a long strip. As shown in Figure 5 b, the shape of the groove can be U-shaped.

[0054] The present disclosure also provides another package structure with an inductor integrated within a package substrate. Figure 6 is a cross-sectional view of another package structure with an inductor integrated within a package substrate provided by the present disclosure. As shown in Figure 6, the package structure with an inductor integrated within a package substrate includes an inductor 20 and a package substrate 10. The inductor 20 includes a magnetic core 4 and a winding disposed around the magnetic core 4. The winding includes multiple winding segments 21 electrically connected in sequence. The magnetic core 4 and at least some of the multiple winding segments 21 are embedded within the package substrate 10.

[0055] An accommodating cavity 3 is provided on the substrate core 1 , and the accommodating cavity 3 includes a first through hole 11 and a plurality of second through holes 12 . The plurality of second through holes 12 are arranged around the first through hole 11 , such as the plurality of second through holes 12 are arranged on both sides of the first through hole 11 .

[0056] In some embodiments, the plurality of winding segments 21 includes a plurality of third winding segments 13 and a plurality of fourth winding segments 14. The third winding segment 13 is disposed on the first and second surfaces of the substrate core 1, the fourth winding segment 14 is disposed within the second through-hole 12, and the magnetic core 4 is disposed within the first through-hole 11. In some embodiments, a first dielectric layer 17 is disposed between the third winding segment 13 and the first and second surfaces of the substrate core 1.

[0057] It should be noted that the first surface and the second surface refer to two opposite surfaces of an object, and the present disclosure does not limit the specific positions of the first surface and the second surface. For ease of description, the present disclosure defines the upper surface of an object as the first surface, and the lower surface as the second surface. For example, the first surface of the substrate core 1 is the upper surface of the substrate core 1, and the second surface of the substrate core 1 is the lower surface of the substrate core 1.

[0058] A dielectric material is filled in the second through hole 12 where the fourth winding segment 14 is provided, and a second dielectric layer 18 is provided on the surface of the substrate core 1 where the third winding segment 13 and the fourth winding segment 14 are provided. The second dielectric layer 18 can improve the insulation performance and anti-interference ability of the inductor 20, thereby improving the stability and reliability of the inductor.

[0059] It should be noted that the number of turns of the winding arranged around the magnetic core 4 can be set as needed. As shown in Figure 7a, the number of turns of the winding can be 1 turn, or, as shown in Figure 7b, the number of turns of the winding can also be 2.5 turns.

[0060] The embodiments of the present disclosure provide a packaging structure and a preparation method in which an inductor is integrated in a packaging substrate. A magnetic core is embedded in the packaging substrate, so that the magnetic core no longer occupies the space of the packaging substrate alone, and the stability and reliability of the inductor can be improved. At least some of the winding segments of the multiple winding segments are embedded in the packaging substrate, which reduces the space occupied by the windings on the packaging substrate and further improves the integration of the inductor and the packaging structure. This is not only beneficial to reducing the volume of the circuit containing the inductor and improving the flexibility of the circuit layout, but also beneficial to improving performance such as power density.

[0061] The embodiments of the present disclosure further provide a method for preparing a packaging structure, which is used to prepare the packaging structure mentioned in the above embodiments, in which an inductor is integrated in a packaging substrate.

[0062] FIG8 is a flow chart of a method for preparing a package structure according to an embodiment of the present disclosure. As shown in FIG8 , the method for preparing a package structure may include steps S801 to S803 .

[0063] In step S801, a substrate core is obtained.

[0064] In some embodiments, the material of the substrate core includes one or more of glass, ceramic, and organic material.

[0065] In step S802 , a magnetic core is formed in the substrate core, and a plurality of winding segments are formed around the magnetic core, with at least some of the winding segments being embedded in the substrate core.

[0066] In some embodiments, the material of the magnetic core includes one or more of a diamagnetic material, a paramagnetic material, a ferromagnetic material, a ferrimagnetic material, or an antiferromagnetic material. The material of the multiple winding segments 21 includes one or more of titanium, molybdenum, gold, platinum, aluminum, nickel, copper, chromium, hafnium, and indium; or an alloy of titanium, molybdenum, gold, platinum, aluminum, nickel, copper, chromium, hafnium, or indium.

[0067] In step S803 , multiple winding segments are electrically connected in sequence to obtain a winding surrounding the magnetic core.

[0068] In some embodiments, before forming the magnetic core in the substrate core, a receiving cavity is formed on the substrate core. The receiving cavity can be a groove or a through hole. In order to better understand the preparation method provided by the present disclosure, the following describes the preparation process in combination with multiple embodiments.

[0069] Taking the packaging structure with an inductor integrated in the packaging substrate shown in Figure 1 as an example, the steps of preparing the packaging structure with an inductor integrated in the packaging substrate include: forming a groove on the substrate core; forming a first magnetic film in the groove; forming multiple winding segments on the surface of the groove where the first magnetic film is formed; and forming a second magnetic film on the surface of the multiple winding segments.

[0070] Illustratively, the step of preparing a package structure with an inductor integrated in a package substrate includes the following steps S901 to S909 .

[0071] In step S901 , a receiving cavity 3 is formed on the substrate core 1 , as shown in FIG. 9 a .

[0072] The substrate core 1 may be made of one or more materials selected from glass, ceramics, and organic materials. The accommodating cavity 3 is a groove, and its shape, depth, size, and number may be arbitrarily set as needed.

[0073] In step S902 , a first seed layer 31 is prepared in the receiving cavity 3 .

[0074] A first seed layer 31 is formed on the bottom wall and side walls of the accommodating cavity 3 by ion implantation or sputtering, as shown in FIG9 b. The first seed layer 31 facilitates the subsequent electroplating process and can be made of a conductive metal such as copper.

[0075] In step S903 , a first conductive layer is formed on the surface of the first seed layer 31 , and a first winding segment 6 is formed, as shown in FIG. 9 c .

[0076] Copper is plated on the surface of the first seed layer 31 by electroplating or coating to form a first conductive layer, on which the first winding segment 6 is formed. The thickness of the first conductive layer can be set as needed to meet the current conduction performance required by the inductor.

[0077] It should be noted that the material of the first conductive layer includes one or more of titanium, molybdenum, gold, platinum, aluminum, nickel, copper, chromium, hafnium, and indium; or a material composed of an alloy of titanium, molybdenum, gold, platinum, aluminum, nickel, copper, chromium, hafnium, or indium. When copper is plated on the surface of the first seed layer 31, a copper layer of the desired thickness can be directly electroplated, or a thick copper layer can be electroplated first and then thinned to achieve the desired copper layer thickness.

[0078] In step S904 , magnetic material is filled into the groove where the first winding segment 6 is formed to form a magnetic core 4 , as shown in FIG. 9 d .

[0079] The groove where the first winding segment 6 is formed is filled with a magnetic material, which covers the first winding segment 6. The magnetic material forms a magnetic core 4. The magnetic material includes one or more of diamagnetic, paramagnetic, ferromagnetic, ferrimagnetic, or antiferromagnetic materials. The magnetic core 4 can increase the magnetic induction strength and stability of the inductor.

[0080] In step S905 , a second seed layer 32 is formed on the surface of the substrate core 1 where the groove opening is located, as shown in FIG. 9 e .

[0081] A second seed layer 32 is formed on the surface of the substrate core 1 by a coating or other process. The second seed layer 32 covers the substrate core 1, the exposed magnetic core 4, and the exposed surface of the first winding segment 6. The material of the second seed layer 32 can be a conductive metal such as copper, or one or more of titanium, molybdenum, gold, platinum, aluminum, nickel, chromium, hafnium, and indium; or an alloy of titanium, molybdenum, gold, platinum, aluminum, nickel, copper, chromium, hafnium, or indium.

[0082] In step S906 , a second conductive layer 34 is formed on the surface of the second seed layer 32 , as shown in FIG. 9 f .

[0083] Conductive metal such as copper is plated on the surface of the second seed layer 32 by electroplating or other processes to form a second conductive layer 34 .

[0084] In step S907 , the second conductive layer 34 is processed to form a second winding segment 7 , as shown in FIG. 9 g .

[0085] The second conductive layer is processed by etching to retain the conductive traces required for the second winding segment 7 and remove copper from other areas. The first winding segment 6 in the first conductive layer and the second winding segment 7 in the second conductive layer form an inductor 20.

[0086] In step S908 , a dielectric layer 15 is formed on the surface of the substrate core 1 on which the second winding segment 7 is formed, as shown in FIG. 9 h.

[0087] An insulating material is applied to the surface of substrate core 1, where second winding segment 7 is formed, by a coating process, to form dielectric layer 15. The insulating material can be a resin material or an epoxy polymer material containing silica particles or filler particles. The thickness of dielectric layer 15 can be set as needed, as long as it covers the inductor.

[0088] In step S909 , an interconnection line 16 electrically connecting the first winding segment 6 and the second winding segment 7 is formed on the dielectric layer 15 , as shown in FIG. 9 i .

[0089] According to the positions of the first winding segment 6 and the second winding segment 7, holes are drilled at the required positions and copper is electroplated in the holes so that the first winding segment 6 and the second winding segment 7 are interconnected in sequence with wires 16 to form a winding.

[0090] Through steps S901 to S909, the magnetic core is embedded in the groove of the substrate core, and the first winding segment and the second winding segment form a winding surrounding the magnetic core. Moreover, the above steps form a stacked structure of conductive metal, magnetic core, and conductive metal. This method is simple and highly controllable, with high preparation efficiency and strong stability of the formed inductor.

[0091] Taking the packaging structure with inductor shown in Figure 4 as an example, the steps of preparing a packaging structure with an inductor integrated in a packaging substrate include: forming a groove on the substrate core; forming a first magnetic film in the groove; forming a first winding segment on the surface of the groove formed with the first magnetic film; and forming a second magnetic film on the surface of the first winding segment.

[0092] In some embodiments, after forming the second magnetic film on the surface of the first winding segment, the method further includes: forming a first dielectric layer in the groove in which the first magnetic film, the second magnetic film and the first winding segment are formed; forming the second winding segment on the surface of the substrate core; forming a second dielectric layer on the surface of the substrate core in which the second winding segment is formed; and forming interconnection lines in the second dielectric layer, wherein the interconnection lines are used to electrically connect multiple winding segments in sequence.

[0093] Illustratively, the step of preparing a package structure with an inductor integrated in a package substrate may include the following steps S1001 to S1008 .

[0094] In step S1001 , a receiving cavity 3 is formed on a substrate core 1 , as shown in FIG10 a .

[0095] The substrate core 1 may be made of glass, ceramic, organic material, etc. The accommodating cavity 3 is a groove, and the shape, depth, size and number of the groove can be set arbitrarily as needed.

[0096] In step S1002 , a first magnetic film 8 is formed in the accommodation cavity 3 , as shown in FIG. 10 b .

[0097] The first magnetic film 8 is formed on the inner wall of the accommodating cavity 3 by a sputtering process. The first magnetic film 8 is formed not only on the bottom wall of the accommodating cavity 3 but also on the side walls of the accommodating cavity 3 .

[0098] In step S1003 , a first conductive layer is formed on the surface of the first magnetic film 8 , and a first winding segment 6 is formed on the first conductive layer, as shown in FIG. 10 c .

[0099] A conductive material such as copper is electroplated on the surface of the first magnetic film 8 to form a first conductive layer. The thickness of the first conductive layer can be set as needed.

[0100] In step S1004, a second magnetic film 9 is formed on the surface of the first conductive layer, as shown in FIG. 10 d.

[0101] The material and formation method of the second magnetic film 9 are the same as those of the first magnetic film 8, and are not described in detail here. The second magnetic film 9 covers the first conductive layer.

[0102] In step S1005 , an insulating material is filled into the accommodation cavity 3 where the first magnetic film 8 , the first winding segment 6 and the second magnetic film 9 are formed, to form a first dielectric layer 17 , as shown in FIG. 10 e .

[0103] The filled insulating material includes a resin material, or an epoxy polymer material with silicon dioxide particles or filler particles. After the insulating material is filled, the surface of the substrate core 1 is ground flat.

[0104] In step S1006, a second conductive layer is formed on the surface of the substrate core 1 on which the first magnetic film 8, the first winding segment 6 and the second magnetic film 9 are formed, and a second winding segment 7 is formed on the second conductive layer, as shown in FIG. 10(f).

[0105] An electroplated copper layer is formed on the surface of the substrate core 1 on which the first magnetic film 8 , the winding segment and the second magnetic film 9 are formed, and the copper layer is patterned to obtain the second winding segment 7 .

[0106] In step S1007 , a second dielectric layer 18 is formed on the surface of the substrate core 1 on which the second winding segment 7 is formed, as shown in FIG. 10 g .

[0107] An insulating material is applied to the surface of substrate core 1, where second winding segment 7 is formed, by a coating process, to form second dielectric layer 18. The insulating material may be a resin material or an epoxy polymer material containing silica particles or filler particles. The thickness of second dielectric layer 18 can be set as needed, as long as it covers inductor 20.

[0108] In step S1008 , an interconnection line 16 electrically connecting the first winding segment 6 and the second winding segment 7 is formed in the second dielectric layer 18 , as shown in FIG. 10 h.

[0109] According to the positions of the first winding segment 6 and the second winding segment 7, holes are drilled at the required positions and copper is electroplated in the holes so that the first winding segment 6 and the second winding segment 7 are interconnected in sequence with wires 16 to form a winding.

[0110] Through steps S1001 to S1008, the magnetic core 4 is embedded in the accommodating cavity 3 of the substrate core 1, and the first winding segment 6 within the accommodating cavity 3 is surrounded by the first magnetic film 8 and the second magnetic film 9. This results in an inductor 20 having a higher quality factor (Q value), enabling lower power loss and a higher inductance 20 value, thereby improving the energy conversion capability of the circuit containing the inductor 20. The above steps form a laminated structure of the conductive metal, the magnetic core 4, and the conductive metal. This method is simple, highly controllable, and has high production efficiency. The resulting inductor 20 is highly stable.

[0111] Another method for preparing a packaging structure is described below, which may include the following steps S1101 to S1107 .

[0112] In step S1101 , a receiving cavity 3 is formed on the substrate core 1 , as shown in FIG. 11 a .

[0113] The substrate core 1 may be made of glass, ceramic, organic material, etc. The accommodating cavity 3 is a groove, and the shape, depth, size and number of the groove can be set arbitrarily as needed.

[0114] In step S1102 , a first magnetic film 8 is formed in the accommodating cavity 3 , as shown in FIG. 11 b .

[0115] A first magnetic film 8 is formed on the inner wall of the accommodating cavity 3 by a sputtering process. The first magnetic film 8 is formed not only on the bottom wall of the accommodating cavity 3 but also on the side walls of the accommodating cavity 3. The first magnetic film 8 can be formed of a magnetic material such as a ferromagnet.

[0116] In step S1103 , a first conductive layer is formed on the surface of the first magnetic film 8 , and a first winding segment 6 is formed on the first conductive layer, as shown in FIG. 11 c .

[0117] A conductive material such as copper is electroplated on the surface of the first magnetic film 8 to form a first conductive layer, and a first winding segment 6 is formed on the first conductive layer. The thickness of the first conductive layer can be set as needed.

[0118] In step S1104 , a magnetic material is filled in the accommodation cavity 3 where the first magnetic film 8 and the first winding segment 6 are formed. The filled magnetic material can serve as the second magnetic film 9 , as shown in FIG. 11 d .

[0119] The magnetic material includes one or more of magnetic material, paramagnetic material, ferromagnetic material, ferrimagnetic material or antiferromagnetic material. After the magnetic material is filled into the accommodating cavity 3, the surface of the substrate core 1 is ground flat.

[0120] In step S1105 , a second conductive layer is formed on the surface of the substrate core 1 on which the first magnetic film 8 , the first winding segment 6 and the second magnetic film 9 are formed, and a second winding segment 7 is formed on the second conductive layer, as shown in FIG. 11 e.

[0121] An electroplated copper layer is formed on the surface of the substrate core 1 on which the first magnetic film 8 , the first winding segment 6 and the second magnetic film 9 are formed, and the copper layer is patterned to obtain the second winding segment 7 .

[0122] In step S1106 , a second dielectric layer 18 is formed on the surface of the substrate core 1 on which the second winding segment 7 is formed, as shown in FIG. 11 f .

[0123] An insulating material is applied to the surface of substrate core 1, where second winding segment 7 is formed, by a coating process, to form second dielectric layer 18. The insulating material may be a resin material or an epoxy polymer material containing silica particles or filler particles. The thickness of second dielectric layer 18 can be set as needed, as long as it covers the inductor.

[0124] In step S1107 , an interconnection line 16 electrically connecting the first winding segment 6 and the second winding segment 7 is formed on the second dielectric layer 18 , as shown in FIG. 11 g .

[0125] According to the positions of the first winding segment 6 and the second winding segment 7, holes are drilled at the required positions and copper is electroplated in the holes so that the first winding segment 6 and the second winding segment 7 are interconnected in sequence with wires 16 to form a winding.

[0126] Through steps S1101 to S1107, the magnetic core is embedded in the groove of the substrate core, and the first winding segment in the groove is surrounded by the first magnetic film and the second magnetic film. This results in an inductor with a higher quality factor (Q value), enabling lower power loss and higher inductance, thereby improving the energy conversion capability of the circuit containing the inductor. The above steps form a laminated structure of conductive metal, magnetic core, and conductive metal. This method is simple, highly controllable, and has high production efficiency. The resulting inductor has strong stability.

[0127] The following introduces another step of preparing a packaging structure with an inductor integrated in a packaging substrate, which may include the following steps S1201 to S1208.

[0128] In step S1201 , a receiving cavity 3 is formed on the substrate core 1 , as shown in FIG. 12 a .

[0129] The substrate core 1 may be made of glass, ceramic, organic material, etc. The shape, depth, size and number of the accommodating cavity 3 may be arbitrarily set as needed.

[0130] In step S1202 , a first magnetic film 8 is formed in the accommodation cavity 3 , as shown in FIG. 12 b .

[0131] A first magnetic film 8 is formed on the inner wall of the accommodating cavity 3 by a sputtering process. The first magnetic film 8 is only formed on the bottom wall of the accommodating cavity 3 , and no first magnetic film 8 is formed on the side walls of the accommodating cavity 3 .

[0132] In step S1203 , a first conductive layer is formed on the surface of the first magnetic film 8 and the sidewall of the accommodating cavity 3 , and a plurality of winding segments 6 are formed on the first conductive layer, as shown in FIG. 12 c .

[0133] A conductive material such as copper is electroplated on the surface of the first magnetic film 8 to form a first conductive layer. The thickness of the first conductive layer can be set as needed.

[0134] In step S1204, a second magnetic film 9 is formed on the surface of the first conductive layer, as shown in FIG. 12 d.

[0135] The material and formation method of the second magnetic film 9 are the same as those of the first magnetic film 8 and are not further described here. The second magnetic film 9 covers the first conductive layer at the bottom of the accommodating cavity 3. That is, only the first conductive layer is formed on the sidewalls of the accommodating cavity 3, without the first magnetic film 8 and the second magnetic film 9.

[0136] In step S1205 , the accommodating cavity 3 formed with the first magnetic film 8 , the winding segment, and the second magnetic film 9 is filled with insulating material to form a first dielectric layer 17 , as shown in FIG. 12 e .

[0137] The filled insulating material includes a resin material, or an epoxy polymer material with silicon dioxide particles or filler particles. After the insulating material is filled, the surface of the substrate core 1 is ground flat.

[0138] In step S1206, a second conductive layer is formed on the surface of the substrate core 1 on which the first magnetic film 8, the first winding segment 6 and the second magnetic film 9 are formed, and a second winding segment 7 is formed on the second conductive layer, as shown in FIG. 12(f).

[0139] An electroplated copper layer is formed on the surface of the substrate core 1 on which the first magnetic film 8 , the first winding segment 6 and the second magnetic film 9 are formed, and the copper layer is patterned to obtain the second winding segment 7 .

[0140] In step S1207 , a second dielectric layer 18 is formed on the surface of the substrate core 1 on which the second winding segment 7 is formed, as shown in FIG. 12 g .

[0141] An insulating material is applied to the surface of substrate core 1, where second winding segment 7 is formed, by a coating process, to form second dielectric layer 18. The insulating material may be a resin material or an epoxy polymer material containing silica particles or filler particles. The thickness of second dielectric layer 18 can be set as needed, as long as it covers the inductor.

[0142] In step S1208 , an interconnection line 16 electrically connecting the first winding segment 6 and the second winding segment 7 is formed in the second dielectric layer 18 , as shown in FIG. 12 h.

[0143] According to the positions of the first winding segment 6 and the second winding segment 7, holes are drilled at the required positions and copper is electroplated in the holes so that the first winding segment 6 and the second winding segment 7 are interconnected in sequence with wires 16 to form a winding.

[0144] Through steps S1201 to S1208, the magnetic core is embedded in the groove of the substrate core, and the first winding segment in the groove is surrounded by the first magnetic film and the second magnetic film. This results in an inductor with a higher quality factor (Q value), enabling lower power loss and higher inductance, thereby improving the energy conversion capability of the circuit containing the inductor. The above steps form a laminated structure of conductive metal, magnetic core, and conductive metal. This method is simple, highly controllable, and has high production efficiency, and the resulting inductor has strong stability.

[0145] Taking the package structure with an inductor integrated in a package substrate as shown in FIG6 as an example, the steps of preparing the package structure with an inductor integrated in a package substrate include: forming a first through-hole on the substrate core that penetrates the thickness of the package substrate; filling the first through-hole with a magnetic material; forming a first dielectric layer on the first and second surfaces of the package substrate; forming a plurality of second through-holes in the thickness direction of the package substrate on which the first dielectric layer is formed, wherein at least one of the plurality of second through-holes is located on a first side of the first through-hole, and at least one of the plurality of second through-holes is located on a second side of the first through-hole, with the first side and the second side being opposite to each other; forming a plurality of third winding segments on the surface of the first dielectric layer, and forming a plurality of fourth winding segments on the inner walls of the plurality of second through-holes; filling the second through-hole with the fourth winding segment formed on the inner wall with a dielectric material; and forming a second dielectric layer on the surface of the package substrate on which the third winding segment is formed.

[0146] Illustratively, the step of preparing a package structure with an inductor integrated in a package substrate may include steps S1301 to S1308 .

[0147] In step S1301 , a first through hole 11 penetrating the thickness of the substrate core 1 is formed on the substrate core 1 , as shown in FIG. 13 a .

[0148] The substrate core 1 may be made of glass, ceramic, organic material, etc. The shape, depth, size and number of the accommodating cavity 3 may be arbitrarily set as needed.

[0149] In some embodiments, a first through hole 11 penetrating the thickness of the substrate core 1 may be formed on the substrate core 1 by drilling.

[0150] In step S1302 , a magnetic material is filled in the first through hole 11 , as shown in FIG. 13 b .

[0151] The magnetic material is filled to form the magnetic core 4 of the inductor 20, and the magnetic core 4 can increase the magnetic induction intensity and stability of the inductor 20. The magnetic material includes magnetic materials such as ferrite.

[0152] In step S1303 , excess magnetic material is removed, and the magnetic core 4 is flush with the surface of the substrate core 1 , as shown in FIG. 13 c .

[0153] The excess magnetic material includes magnetic material that is higher than the basic core plane.

[0154] It should be noted that when there is a conductive metal layer on the surface of the substrate core 1, the conductive metal layer needs to be removed.

[0155] In step S1304 , a first dielectric layer 15 is formed on the first surface and the second surface of the substrate core 1 in which the magnetic core 4 is embedded, as shown in FIG. 13 d .

[0156] The first dielectric layer 15 is made of an insulating material, such as a resin material or an epoxy polymer material containing silica particles or filler particles. The first dielectric layer 15 is laminated to the first and second surfaces of the substrate core 1. For example, a dielectric layer with copper foil can be laminated to form the first dielectric layer 15 on the first and second surfaces. The thickness of the first dielectric layer 15 can be set as needed.

[0157] It should be noted that the first surface and the second surface of the substrate core 1 are only for the convenience of description and do not limit the positions of the surfaces. The first surface and the second surface only represent two opposite surfaces of the substrate core 1.

[0158] In step S1305 , a plurality of second through holes 12 are formed in the thickness direction of the substrate core 1 on which the first dielectric layer 15 is formed, as shown in FIG. 13 e.

[0159] A plurality of second through holes 12 are formed in the thickness direction of the substrate core 1 on which the first dielectric layer 15 is formed by drilling. The second through holes 12 are arranged on both sides of the first through hole 11 .

[0160] In step S1306, a second conductive layer is formed on the surface of the first dielectric layer 15, a fourth winding segment 14 is formed on the wall of the second through hole 12, and the second conductive layer is processed to obtain a third winding segment 13, as shown in Figure 13f.

[0161] A conductive metal such as copper is plated on the walls of the second through-hole 12 and the surface of the first dielectric layer 15 using a process such as electroplating to form a second conductive layer. The second conductive layer on the walls of the second through-hole 12 forms the fourth winding segment 14. The second conductive layer on the surface of the first dielectric layer 15 is patterned to form the third winding segment 13.

[0162] In step S1307 , the second through hole is filled with an insulating material, and the insulating material is flush with the first surface of the third winding segment 13 , as shown in FIG. 13 g .

[0163] The insulating material includes a resin material or an epoxy polymer material with silica particles or filler particles.

[0164] In some embodiments, after step S1307, the method further includes:

[0165] In step S1308 , a second dielectric layer 18 is formed on the surface of the substrate core 1 on which the third winding segment 13 is formed, and interconnection lines 16 are formed on the second dielectric layer 18 , as shown in FIG. 13 h.

[0166] An insulating material is applied to the surface of substrate core 1, where third winding segment 13 is formed, to form second dielectric layer 18. The insulating material can be a resin material or an epoxy polymer material containing silica particles or filler particles. The thickness of the insulating layer can be set as needed, as long as it covers inductor 20.

[0167] Holes are drilled at corresponding positions of the second dielectric layer 18 , and copper is electroplated in the holes to achieve connections between the inductor 20 and other conductive layers on the package substrate 10 .

[0168] Through steps S1301 to S1308, the magnetic core 4 is embedded in the accommodating cavity 3 of the substrate core 1, and the third winding segment 13 and the fourth winding segment 14 form a winding surrounding the magnetic core 4. This method is simple and highly controllable, with high preparation efficiency and strong stability of the formed inductor.

[0169] An embodiment of the present disclosure further provides an electronic device, which includes a packaging structure. The packaging structure adopts the packaging structure provided by the embodiment of the present disclosure, in which an inductor is integrated in a packaging substrate.

[0170] The electronic devices provided by the embodiments of the present disclosure can be applied to electronic equipment, communication equipment, computer systems, automotive electronics, industrial control, smart wearable devices, and other fields. When applied to communication equipment, such as mobile phones, communication base stations, Wi-Fi, fiber-optic communications, and other devices, the electronic devices can be used to optimize and control the power modules therein. This improves the efficiency and stability of battery-powered circuits and extends battery life. When applied to automotive electronics, such as in vehicle-mounted chips, the reliability and stability of automotive electronics can be improved. When applied to smart wearable devices, such as smart watches and smart glasses, the electronic devices can be used in power management modules to provide stable and reliable power support. When applied to industrial control, the electronic devices can be used in power circuits to provide reliable power support and have anti-interference capabilities. When applied to electronic devices, such as frequency converters and inverters, the electronic devices can be used in power module design to provide high-efficiency, stable power supply and improve power conversion efficiency. The electronic devices can also be combined with wireless charging technology to realize the design of wireless chargers. When combined with sensor technology, they can be applied to energy management systems in IoT devices, etc.

[0171] Example embodiments have been disclosed herein, and although specific terms are employed, they are used and should be interpreted only in a general illustrative sense and not for purposes of limitation. In some instances, it will be apparent to those skilled in the art that, unless otherwise expressly indicated, features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments. Therefore, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the scope of the present disclosure as set forth in the appended claims.

Claims

1. A packaging structure with an inductor integrated in a packaging substrate, comprising: An inductor, the inductor comprising a magnetic core and a winding disposed around the magnetic core, the winding comprising a plurality of winding segments electrically connected in sequence; A packaging substrate, the magnetic core and at least part of the multiple winding segments are embedded in the packaging substrate.

2. The packaging structure with an inductor integrated in a packaging substrate according to claim 1, wherein: The packaging substrate includes a substrate core and a receiving cavity arranged in the substrate core, and the magnetic core and at least part of the winding segments of the multiple winding segments are embedded in the receiving cavity.

3. The packaging structure with an inductor integrated in a packaging substrate according to claim 2, wherein: The accommodating cavity includes a groove provided on the core of the substrate; The multiple winding segments and the magnetic core are arranged in the groove, and at least some of the multiple winding segments are arranged closely to the magnetic core.

4. The packaging structure with an inductor integrated in a packaging substrate according to claim 3, wherein: The shape of the magnetic core in a cross section parallel to the surface of the package substrate includes a bar shape, a U shape, and an L shape.

5. The packaging structure with an inductor integrated in a packaging substrate according to claim 2, wherein: The accommodating cavity includes a groove provided on the core of the substrate, the multiple winding segments include a first winding segment and a second winding segment, the first winding segment and the magnetic core are provided in the groove, and the second winding segment is provided outside the groove; The magnetic core includes a first magnetic film and a second magnetic film, wherein the first magnetic film and the second magnetic film wrap at least a portion of the first winding segment.

6. The packaging structure with an inductor integrated in a packaging substrate according to claim 2, wherein: The accommodating cavity includes a first through hole and a plurality of second through holes that penetrate through the thickness of the substrate core; The magnetic core is disposed in the first through hole; The multiple winding segments include multiple third winding segments and multiple fourth winding segments. The third winding is arranged on the first surface and the second surface of the substrate core, and the fourth winding segment is arranged in the second through hole.

7. A method for preparing a packaging structure having an inductor integrated in a packaging substrate, comprising: Obtaining a substrate core; A magnetic core is formed in the substrate core, and a plurality of winding segments are formed around the magnetic core, wherein at least some of the winding segments are embedded in the substrate core; The multiple winding segments are electrically connected in sequence to obtain a winding surrounding the magnetic core.

8. The preparation method according to claim 7, wherein Before forming the magnetic core in the substrate core, a receiving cavity is formed on the substrate core.

9. The preparation method according to claim 8, wherein The accommodating cavity includes a groove; The method of forming a magnetic core in the substrate core, and forming a plurality of winding segments surrounding the magnetic core, wherein at least some of the plurality of winding segments are embedded in the packaging substrate, comprises: forming the groove on the substrate core; forming a first winding segment on an inner wall of the groove; filling the groove in which the first winding segment is formed with magnetic material; forming a second winding segment on the surface of the substrate core at the opening side of the groove; The first winding segment and the second winding segment are electrically connected.

10. The preparation method according to claim 8, wherein The accommodating cavity includes a groove, the magnetic core includes a first magnetic film and a second magnetic film, and the multiple winding segments include a first winding segment and a second winding segment; The method of forming a magnetic core in the substrate core, and forming a plurality of winding segments surrounding the magnetic core, wherein at least some of the plurality of winding segments are embedded in the packaging substrate, comprises: forming the groove on the substrate core; forming the first magnetic film in the groove; forming the first winding segment on the surface of the groove where the first magnetic film is formed; forming the second magnetic film on the surface of the first winding segment; forming a first dielectric layer in the groove in which the first magnetic film, the second magnetic film, and the first winding segment are formed; A second winding section is formed on the surface of the substrate core.

11. The preparation method according to claim 10, wherein After forming the second winding segment on the surface of the substrate core, the method further includes: forming a second dielectric layer on a surface of the substrate core forming the second winding segment; Interconnection lines are formed in the second dielectric layer, and the interconnection lines are used to electrically connect the multiple winding segments in sequence.

12. The preparation method according to claim 8, wherein The accommodating cavity includes a first through hole and a plurality of second through holes; The method of forming a magnetic core in the substrate core, and forming a plurality of winding segments surrounding the magnetic core, wherein at least some of the plurality of winding segments are embedded in the packaging substrate, comprises: forming a first through hole on the substrate core that extends through the thickness of the substrate core; filling the first through hole with magnetic material; forming a first dielectric layer on the first surface and the second surface of the substrate core; The plurality of second through holes are formed in a thickness direction of the substrate core having the first dielectric layer formed thereon, at least one of the plurality of second through holes being located on a first side of the first through hole, and at least one of the plurality of second through holes being located on a second side of the first through hole, with the first side and the second side being opposite to each other; forming the plurality of third winding segments on the surface of the first dielectric layer, and forming the plurality of fourth winding segments on the inner walls of the plurality of second through holes; The second through hole having the fourth winding segment formed on the inner wall is filled with dielectric material.

13. An electronic device comprising: chip; A packaging structure connected to the chip, wherein the packaging structure adopts the packaging structure with an inductor integrated in the packaging substrate as described in any one of claims 1 to 6.

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