High-precision polishing pad conditioning tool

The high-precision polishing pad dressing tool with a multi-ring layout and double-taper design solves the problems of insufficient dressing accuracy and service life in the existing technology, achieves higher dressing accuracy and stability, and reduces costs.

WO2025201039A1PCT designated stage Publication Date: 2025-10-02JIAXING WORLDIA DIAMOND TOOLS CO LTD
View PDF 6 Cites 0 Cited by

Patent Information

Application Number
PCT/CN2025/081908
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-03-27
Filing Date
2025-03-11
Publication Date
2025-10-02

AI Technical Summary

Technical Problem

Existing polishing pad dressing tools have shortcomings in dressing accuracy and service life, especially the problems of uncontrollable diamond exposure height, easy falling off and high cost.

Method used

A high-precision polishing pad dressing tool is designed. It adopts a multi-ring layout of diamond pieces, including main drill, auxiliary drill and center drill. The surface has uniform double-tapered multi-faceted frustum protrusions and is protected by a diamond holder. The installation method of the diamond piece is optimized to improve stability and dressing efficiency.

Benefits of technology

The dressing accuracy and stability are improved, the dressing range is expanded, the durability and dressing efficiency of the diamond sheet are enhanced, and the use of CVD diamonds is saved.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN2025081908_02102025_PF_FP_ABST
    Figure CN2025081908_02102025_PF_FP_ABST
Patent Text Reader

Abstract

A high-precision polishing pad conditioning tool, comprising a circular disk (1) and a diamond sheet (2), wherein the diamond sheet (2) is connected to the circular disk (1); protrusions (3) having uniform heights are formed on the surface of the diamond sheet (2); the diamond sheet (2) comprises main diamonds (21), auxiliary diamonds (22), and a central diamond (23); one central diamond (23) is provided and the central diamond (23) is located at the center of the circular disk (1); a plurality of main diamonds (21) and a plurality of auxiliary diamonds (22) are provided, the main diamonds (21) are annularly arranged, and the auxiliary diamonds (22) are annularly arranged; the main diamonds (21), the auxiliary diamonds (22), and the central diamond (23) are each arranged in a multi-ring structure; each main diamond (21), each auxiliary diamond (22), and the central diamond (23) have the same thickness.
Need to check novelty before this filing date? Find Prior Art

Description

A high-precision polishing pad dressing tool Technical Field

[0001] The present application relates to the field of CMP chemical mechanical polishing technology, and in particular to a high-precision polishing pad dressing tool. Background Art

[0002] Chemical mechanical processing (CMP) has become a widely used technique for polishing certain workpieces. In particular, the computer manufacturing industry has become heavily reliant on the CMP process. This polishing process typically places a wafer against a rotating pad made of a durable organic material, such as polyurethane, to which a chemical slurry is applied. The slurry consists of a chemical solution that breaks down the wafer's material and a large number of abrasive particles that physically erode the wafer's surface. This slurry is continuously applied to the rotating CMP pad, and the dual chemical and mechanical forces applied to the wafer cause it to be polished in the desired manner.

[0003] With the widespread adoption of semiconductor CMP processes, the market has placed higher demands on the dressing accuracy, service life, and reliability of polishing pad dressing tools. Existing technologies fall into two main categories: electroplated or brazed diamond-like polishing pad dressers, in which diamond particles are electroplated or brazed onto the polishing pad dresser base, leaving the exposed diamond crystals for polishing. However, these devices suffer from uncontrollable exposed diamond height, significantly impacting dressing accuracy. Electroplated or brazed diamond-like polishing pad dressers are subject to lateral forces during operation, creating a risk of small diamond particles falling off. If these particles fall into the wafer polishing area, the wafer may be scrapped. Furthermore, the lifespan of these products is also affected by the sharpness of the exposed diamond particles.

[0004] The second type is the CVD diamond polishing dresser, which carves uniform protrusions on the surface of a CVD single-crystal diamond. The single-crystal CVD sheet is then attached to the polishing pad dresser base, with 6-8 CVD single-crystal diamonds typically arranged in a ring. The advantages are controllable diamond protrusion height, high dressing accuracy, and a longer service life than electroplated or brazed polishing pad dressers. The disadvantages are higher cost. If the diamond spacing is too large, working gaps may be created when the CVD single-crystal diamonds alternately dress during the operation of the polishing pad dresser, thus affecting the dressing effect. Currently, common protrusions on the surface of CVD single-crystal diamonds include hexagonal, pyramidal, or tetrahedral structures. Sharp corners are prone to breakage during processing, and the dressing accuracy of the polishing dresser is affected by the flatness of the diamond sheet and the protrusions.

[0005] Therefore, designing a dresser with high dressing accuracy and convenient precision control of products during processing is an urgent problem to be solved. Summary of the Invention

[0006] In order to improve the dressing accuracy of the dresser and facilitate the precision control of the product during the processing, the present application provides a high-precision polishing pad dressing tool.

[0007] The high-precision polishing pad dressing tool provided in this application adopts the following technical solution.

[0008] A high-precision polishing pad dressing tool comprises a circular disc and a diamond sheet, wherein the diamond sheet is connected to the circular disc and has highly uniform protrusions formed on the surface of the diamond sheet;

[0009] The diamond plate includes a main drill, a secondary drill and a center drill. The center drill is provided with one and is located at the center of the disc. The main drill and the secondary drill are both provided in plurality. The main drills are arranged in a ring, and the secondary drills are arranged in a ring. The main drill, the secondary drill and the center drill are arranged in multiple rings. The thickness of the main drill, the secondary drill and the center drill are the same.

[0010] By adopting the above technical solution, the center drill, each main drill, and each auxiliary drill are installed in the corresponding position of the disc during installation, ensuring that the main drill, auxiliary drill, and center drill are distributed in a multi-ring arrangement. The multi-ring layout of the main drill, auxiliary drill, and center drill provides multi-point support during the ultra-fine grinding process, thereby improving the stability of the processing process. This has a positive impact on improving the finishing accuracy and also facilitates the precision control of the product during the processing. Furthermore, the multi-ring layout design of the main drill, auxiliary drill, and center drill can effectively increase the finishing range of the polishing pad. Compared with the existing traditional single-ring layout, the multi-ring layout design of the main drill, auxiliary drill, and center drill has a larger effective working area per swing of the dressing disc, thereby improving the finishing efficiency.

[0011] Optionally, the protrusion is a double-tapered polygonal frustum protrusion.

[0012] By adopting the above technical solution, the double-taper design makes it easier for the protrusion to penetrate into the polishing pad. At the same time, the double-taper protrusion structure is more stable than the single-taper structure. When the polishing pad dresser is working, the double-taper multi-faceted frustum protrusion has a stronger scraping ability.

[0013] Optionally, the protrusions are provided in multiple groups, each group of protrusions is provided with multiple protrusions, each group of protrusions is arranged in an equidistant circular pattern or in an angular pattern with equal divisions, and the height of the protrusions at the edge is smaller than the height of the protrusions in the middle.

[0014] By adopting the above technical solution, it is possible to effectively avoid damage to the protrusions due to impact when the protrusions come into contact with the polishing pad. By setting the transition height, the service life can be effectively improved while ensuring the finishing accuracy.

[0015] Optionally, the protrusion height of the outermost circle is the lowest, the protrusion of the second circle is higher than the protrusion of the outermost circle, the protrusion of the third circle is higher than the protrusion of the second circle, and the protrusion height from the fourth circle to the center is the same as the protrusion height of the third circle.

[0016] By adopting the above technical solution, a contoured protrusion design is achieved, which can meet different polishing pad and dressing requirements.

[0017] Optionally, the protrusion height of the outermost circle is the lowest, the protrusion of the second circle is higher than the protrusion of the outermost circle, the protrusion of the third circle is higher than the protrusion of the second circle, the protrusion height of the fourth circle is consistent with the protrusion height of the second circle, and the protrusion height of the third circle is consistent with the protrusion height of the fifth circle.

[0018] By adopting the above technical solution, a high and low convex design is achieved, which can meet different polishing pad and dressing requirements.

[0019] Optionally, the protrusion includes a bottom frustum, a cone top plane, a first working surface and a second working surface, and the first working surface and the second working surface are each formed in plurality, and each first working surface and each second working surface are each formed between the bottom frustum and the cone top plane and alternately arranged along the circumference of the bottom frustum, and the second working surface includes a first grinding surface and a second grinding surface, and the second grinding surface is close to the cone top plane, and the first grinding surface and the second grinding surface constitute a double-taper structure.

[0020] By adopting the above technical solution, the double-tapered design makes it easier to penetrate into the polishing pad and is not likely to cause damage to the polishing pad.

[0021] Optionally, a diamond holder is further included, wherein the diamond holder is mounted on the disc, and the diamond piece is fixed on the diamond holder.

[0022] By adopting the above technical solution, the use of CVD diamonds can be saved while ensuring the effect of dressing the polishing pad.

[0023] Optionally, the diamond holder is designed as a circular shallow groove.

[0024] By adopting the above technical solution, a thinner diamond sheet can be selected for processing, and the bottom of the diamond sheet is protected by the diamond holder, so it is more stable than a directly pasted structure.

[0025] Optionally, the main drill, the auxiliary drill and the center drill are all made of single crystal diamond and are all formed with rounded chamfers.

[0026] By adopting the above technical solution, no sharp corners or right-angled edges come into contact with the polishing pad during the trimming of the single crystal diamond, which can effectively prevent the single crystal diamond from being damaged by external forces.

[0027] Optionally, the diameter of the main drill is larger than the diameter of the center drill, and the diameter of the center drill is larger than the diameter of the auxiliary drill.

[0028] The diamond diameter is related to the trimming area, and the diamond position is related to the trimming trajectory. By adopting the above technical solution, the effect can be optimized.

[0029] In summary, this application includes at least one of the following beneficial technical effects:

[0030] 1. This application provides a high-precision polishing pad dressing tool, which includes a stainless steel disc, a diamond holder, and a diamond plate. The surface of the diamond plate has highly uniform protrusions. The diamond plate includes a main drill, an auxiliary drill, and a center drill. There are 4 to 6 main drills, 4 to 6 auxiliary drills, and 1 center drill. The multi-ring layout design of the main drill, auxiliary drill, and center drill can effectively increase the dressing range of the polishing pad, which is superior to the traditional single-ring layout. At the same time, the polishing pad dressing disc has a larger effective working area per single swing, which improves the dressing efficiency. Furthermore, the multi-ring layout of the main drill, auxiliary drill, and center drill provides multi-point support for ultra-fine grinding during the processing process, making the processing more stable, which has a positive impact on improving the dressing accuracy.

[0031] 2. In this application, the surface of the diamond sheet has multiple sets of double-tapered, multi-faceted frustum-shaped protrusions. When the double-tapered, multi-faceted frustum-shaped protrusions come into contact with the polishing pad, the flat side ridges of the top of the cone contact the polishing pad, first penetrating the polishing pad at a first angle, and then entering the polishing pad at a second angle. The double-tapered design makes it easier for the protrusions to penetrate the polishing pad. At the same time, the double-tapered protrusion structure is more stable than the single-tapered structure. When the polishing pad dresser is working, the double-tapered, multi-faceted frustum-shaped protrusions have stronger scraping ability and are easier to penetrate into the polishing pad. The bottom frustum design makes the groove width and shape of the polishing pad more uniform.

[0032] 3. Existing diamond dressing discs often involve directly welding or gluing diamonds onto a stainless steel disc. To ensure the diamonds protrude from the disc surface and to prevent stress fracture, relatively thick diamond sheets are often used. However, the diamond holders in this application are designed with shallow circular grooves, allowing for thinner diamond sheets to be used for processing. The diamond holders protect the bottom of the diamond sheet, making it more stable than directly gluing the discs. This ensures the best dressing and polishing pad performance while also conserving CVD diamonds. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] FIG1 is a top view of the high-precision polishing pad conditioning tool of the present application;

[0034] FIG2 is a schematic diagram of the installation of the protrusions and diamond sheets in this application;

[0035] FIG3 is a schematic structural diagram of a protrusion in this application;

[0036] FIG4 is a top view of the protrusion in the present application;

[0037] FIG5 is a schematic structural diagram of a diamond setting in the present application;

[0038] FIG6 is a schematic structural diagram of the disc in this application.

[0039] Explanation of the accompanying reference numerals: 1. disc; 2. diamond piece; 21. main drill; 22. auxiliary drill; 23. center drill; 3. protrusion; 31. bottom cone; 32. cone top plane; 33. first working surface; 331. first plane; 332. second plane; 333. third plane; 334. fourth plane; 34. second working surface; 341. first grinding surface; 3411. first curved surface; 3412. second curved surface; 3413. third curved surface; 3414. fourth curved surface; 342. second grinding surface; 3421. fifth curved surface; 3422. sixth curved surface; 3423. seventh curved surface; 3424. eighth curved surface; 4. diamond holder. DETAILED DESCRIPTION

[0040] The present application is further described in detail below with reference to Figures 1-6.

[0041] This application discloses a high-precision polishing pad conditioning tool, as shown in Figures 1 and 2. The tool comprises a circular disc 1 and a diamond plate 2. The diamond plate 2 is attached to the circular disc 1 and has highly uniform polishing protrusions 3 formed on its surface. The diamond plate 2 comprises a primary drill 21, secondary drills 22, and a center drill 23. The center drill 23 is provided in a single location at the center of the circular disc 1. Multiple primary drills 21 and secondary drills 22 are provided. Each primary drill 21 and each secondary drill 22 are arranged in a circular pattern, with the primary drill 21, secondary drills 22, and center drill 23 arranged in a multi-ring pattern.

[0042] The unique multi-ring layout of the main drill 21, auxiliary drill 22, and center drill 23 provides multi-point support during ultra-fine grinding, thereby improving the stability of the polishing pad dressing process. This has a positive impact on improving dressing accuracy and also facilitates precision control of the product during processing. Furthermore, the multi-ring layout of the main drill 21, auxiliary drill 22, and center drill 23 effectively expands the polishing pad dressing range. Compared to the existing traditional single-ring layout, the multi-ring layout design has a larger effective working area of ​​the dressing disc, which improves dressing efficiency.

[0043] Specifically, referring to Figures 1 and 2, in this embodiment, the number of main drills 21 is preferably 4 to 6, and the number of auxiliary drills 22 is preferably 4 to 6. This maximizes the trimming area while ensuring the trimming effect. Of course, in this embodiment, each of the main drills 21 and auxiliary drills 22 is provided in a ring. Depending on the actual situation, a multiple-ring layout can also be used, and the number of main drills 21 and auxiliary drills 22 can be adjusted accordingly. For example, six main drills 21, four auxiliary drills 22, and one center drill 23 can be provided, so that each main drill 21, each auxiliary drill 22, and the center drill 23 have the same diameter. In this embodiment, the number of main drills 21 and auxiliary drills 22 is four each, so the main drills 21, auxiliary drills 22, and center drill 23 do not have the same diameter. Of course, depending on the actual situation, the main drills 21, auxiliary drills 22, and center drill 23 can be used selectively, that is, only the combination of the main drill 21 and the center drill 23 can be used. These different combinations greatly increase product diversity.

[0044] Referring to Figures 1 and 2, the diameter of the main drill 21 is larger than that of the center drill 23, which in turn is larger than that of the auxiliary drill 22. The diameters of the main drill 21 and the auxiliary drill 22 are related to the trimming area. By leveraging the different diameters of the main drill 21, auxiliary drill 22, and center drill 23, a rational layout of the diamond sheet 2 is achieved, improving the trimming effect. Of course, the position of the diamonds is related to the trimming trajectory. In this embodiment, the distance between the main drill 21 and the center of the circle is 16 mm to 41 mm, and the distance between the auxiliary drill 22 and the center of the circle is 13 mm to 41 mm, which optimizes the trimming effect.

[0045] It should be noted that the primary drill 21, secondary drill 22, and center drill 23 are preferably made of single-crystal diamond with a diameter of 5mm-7mm. The edge surface should be free of cracks, polycrystals, or chipping. The primary drill 21, secondary drill 22, and center drill 23 should all be of the same thickness. In this embodiment, the protrusions 3 are formed by laser engraving. Compared to electroplating or brazing small diamond particles (equivalent to small protrusions), large-scale single-crystal diamond is more durable and less likely to fall off. The protrusions on the surface of the single-crystal diamond are also more stable.

[0046] The main drill 21, the auxiliary drill 22 and the center drill 23 are all formed with rounded chamfers, which makes the structures of the main drill 21, the auxiliary drill 22 and the center drill 23 smoother. During the trimming work of the single crystal diamond, there are no sharp corners or right-angled edges that come into contact with the polishing pad, which can effectively prevent the single crystal diamond from being damaged by external forces.

[0047] In particular, referring to Figures 2 and 3, in this embodiment, protrusion 3 is a double-tapered, multi-sided frustoconical protrusion. When the double-tapered, multi-sided frustoconical protrusion contacts the polishing pad, the side ridges contact the polishing pad. The double-tapered design facilitates the protrusion 3's penetration into the polishing pad. Furthermore, the double-tapered protrusion structure is more stable than a single-tapered structure. During operation of the polishing pad dressing tool, the double-tapered, multi-sided frustoconical protrusion has a stronger scraping ability and is more easily penetrated into the polishing pad, thereby achieving a better dressing effect.

[0048] Specifically, referring to Figures 3 and 4, the protrusion 3 includes a bottom cone 31, a cone top plane 32, a first working surface 33, and a second working surface 34. Multiple first working surfaces 33 and second working surfaces 34 are formed, each of which is formed between the bottom cone 31 and the cone top plane 32 and alternately arranged along the circumference of the bottom cone 31. The second working surface 34 includes a first grinding surface 341 and a second grinding surface 342. The second grinding surface 342 is close to the cone top plane 32. The first grinding surface 341 and the second grinding surface 342 form a double-tapered structure. This double-tapered design makes it easier for the protrusion 3 to penetrate the polishing pad while being less likely to damage the polishing pad.

[0049] Further, referring to Figures 3 and 4, in this embodiment, four first working surfaces 33 are provided, and four second working surfaces 34 are provided, that is, four first grinding surfaces 341 and four second grinding surfaces 342 are provided. The first working surface 33 is a flat surface, while the first grinding surfaces 341 and the second grinding surfaces 342 are curved surfaces. In this embodiment, the four first working surfaces 33 are respectively a first flat surface 331, a second flat surface 332, a third flat surface 333, and a fourth flat surface 334. The four first grinding surfaces 341 are respectively a first curved surface 3411, a second curved surface 3412, a third curved surface 3413, and a fourth curved surface 3414. The four second grinding surfaces 342 are respectively a fifth curved surface 3421, a sixth curved surface 3422, a seventh curved surface 3423, and an eighth curved surface 3424. The first curved surface 3411 and the fifth curved surface 3421 are located between the first plane 331 and the fourth plane 334, the second curved surface 3412 and the sixth curved surface 3422 are located between the first plane 331 and the second plane 332, the third curved surface 3413 and the seventh curved surface 3423 are located between the second plane 332 and the third plane 333, and the fourth curved surface 3414 and the eighth curved surface 3424 are located between the third plane 333 and the fourth plane 334.

[0050] 3 and 4 , the angle formed by the first plane 331 and the third plane 333 is in the range of 90°-130°, the angle formed by the sixth curved surface 3422 and the eighth curved surface 3424 is in the range of 90°-130°, and the angle formed by the second curved surface 3412 and the fourth curved surface 3414 is in the range of 90°-130°. It should be noted that all three angles need to avoid the cleavage angle of diamond, that is, 70 degrees cannot be selected. If the selected angle is too large, it is not conducive to the penetration of the protrusion 3. If the selected angle is too small, it is too sharp and easily damages the polishing pad surface.

[0051] Of course, depending on actual conditions, each of the first grinding surface 341 and the second grinding surface 342 can also be processed into a flat surface. In this embodiment, a curved surface is preferred.

[0052] Referring to Figures 2 and 3, multiple groups of protrusions 3 are provided, each group having multiple protrusions 3. Each group of protrusions 3 is arranged in an equidistant circular pattern or at equal angles, with the height of the protrusions 3 at the edges being smaller than the height of the protrusions 3 in the middle. This effectively prevents damage to the protrusions 3 due to impact when they come into contact with the polishing pad. By setting a transition height, the polishing pad's service life is effectively extended while maintaining finishing accuracy.

[0053] The protrusion 3 of the outermost circle (first circle) is the smallest in height, the protrusion 3 of the second circle is higher than the first circle, the protrusion 3 of the third circle is higher than the second circle, and the height of the protrusion 3 from the fourth circle to the center is the same as the height of the protrusion 3 of the third circle, that is, the height of the protrusion 3 from the fourth circle to the center is the same.

[0054] Of course, a design of undulating protrusions 3 can also be adopted, that is, the protrusions 3 of the outermost circle (first circle) are the smallest in height, the protrusions 3 of the second circle are higher than the outermost circle, the protrusions 3 of the third circle are higher than the second circle, the height of the protrusions 3 of the fourth circle is consistent with the height of the protrusions 3 of the second circle, the height of the protrusions 3 of the third circle is consistent with the height of the protrusions 3 of the fifth circle, and so on.

[0055] It should be noted that, in theory, under the same pressure conditions, the contact area between the contour protrusions 3 and the polishing pad is larger, and the friction force they experience is greater. Of course, the choice of these two solutions can be selected according to different polishing pads and dressing requirements.

[0056] Referring to Figure 1 , this embodiment further includes a diamond holder 4, which is mounted on the disc 1 and onto which the diamond plate 2 is fixed. The diamond holder 4 is preferably made of stainless steel. The use of the diamond holder 4 design can significantly reduce the amount of diamonds used.

[0057] Referring to Figures 1 and 5 , existing diamond dressing discs often utilize a diamond disc 2 directly welded or bonded to a stainless steel disc 1. To ensure the disc 2 protrudes from the disc surface and to prevent stress fracture, a relatively thick disc 2 is often used. However, the diamond holder 4 in this embodiment is designed with a circular, shallow groove structure, allowing for the use of a thinner diamond disc 2. Because the bottom of the disc 2 is protected by the diamond holder 4, it is more stable than a directly bonded disc. This ensures the desired polishing pad performance while conserving CVD diamond.

[0058] 5 and 6, the circular hole on the disc 1 is connected to the diamond holder 4 by gluing or welding. As for the diamond plate 2, the single crystal diamond and the diamond holder 4 can be combined using a corrosion-resistant epoxy resin glue.

[0059] The implementation principle of the high-precision polishing pad dressing tool of the present application is as follows: the high-precision polishing pad dressing tool includes a disc 1, a diamond holder 4, and a diamond plate 2. The diamond holder 4 is embedded in the disc 1, and the diamond plate 2 is connected to the diamond holder 4. The diamond plate 2 includes a main drill 21, an auxiliary drill 22, and a center drill 23. There are multiple main drills 21 and auxiliary drills 22, and only one center drill 23. The main drill 21, auxiliary drill 22, and center drill 23 are arranged in a multi-ring arrangement. The multi-ring arrangement of the main drill 21, auxiliary drill 22, and center drill 23 provides multi-point support, thereby improving the stability of the processing process and thus helping to improve the dressing accuracy. At the same time, the multi-ring layout design can effectively increase the dressing range of the polishing pad, and its single-swing effective working area is larger, thereby improving the dressing efficiency. By using the additional diamond holder 4, the amount of diamond used can be significantly reduced while ensuring the dressing effect of the polishing pad. The surface of the diamond sheet 2 has multiple groups of double-tapered multi-faceted frustum protrusions. When the double-tapered multi-faceted frustum protrusions come into contact with the polishing pad, the side edges of the cone top plane 32 come into contact with the polishing pad, penetrate the polishing pad at a first angle, and then re-enter the polishing pad at a second angle. The double-tapered design makes it easier for the protrusions 3 to penetrate the polishing pad. At the same time, the double-tapered protrusion structure is more stable than the single-tapered structure. In addition, the double-tapered multi-faceted frustum protrusions 3 have stronger scraping ability and are easier to penetrate into the polishing pad.

[0060] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A polishing pad dressing tool, characterized in that: The invention comprises a circular disc (1) and a diamond sheet (2), wherein the diamond sheet (2) is connected to the circular disc (1), and a highly uniform protrusion (3) is formed on the surface of the diamond sheet (2); The diamond plate (2) comprises a main drill (21), an auxiliary drill (22) and a center drill (23); the center drill (23) is provided with one and is located at the center of the disc (1); the main drill (21) and the auxiliary drill (22) are both provided with a plurality of them; each of the main drills (21) is arranged in a ring shape; each of the auxiliary drills (22) is arranged in a ring shape; the main drill (21), the auxiliary drill (22) and the center drill (23) are arranged in a multi-ring shape; and the thickness of the main drill (21), the auxiliary drill (22) and the center drill (23) is the same.

2. The polishing pad conditioning tool according to claim 1, wherein: The protrusion (3) is a double-tapered multi-faceted frustum protrusion.

3. The polishing pad conditioning tool according to claim 2, wherein: The protrusions (3) are arranged in multiple groups, each group of protrusions (3) is provided with multiple protrusions, and each group of protrusions (3) is arranged in an equidistant annular arrangement or an equally spaced angle arrangement, and the height of the protrusions (3) at the edge is smaller than the height of the protrusions (3) in the middle.

4. The polishing pad conditioning tool according to claim 3, wherein: The protrusions (3) of the outermost circle are the lowest in height, the protrusions (3) of the second circle are higher than the protrusions (3) of the outermost circle, the protrusions (3) of the third circle are higher than the protrusions (3) of the second circle, and the heights of the protrusions (3) from the fourth circle to the center are the same as the heights of the protrusions (3) of the third circle.

5. The polishing pad conditioning tool according to claim 3, wherein: The protrusions (3) of the outermost circle are the lowest in height, the protrusions (3) of the second circle are higher than the protrusions (3) of the outermost circle, the protrusions (3) of the third circle are higher than the protrusions (3) of the second circle, the protrusions (3) of the fourth circle are the same in height as the protrusions (3) of the second circle, and the protrusions (3) of the third circle are the same in height as the protrusions (3) of the fifth circle.

6. The polishing pad conditioning tool according to claim 1, wherein: The protrusion (3) includes a bottom frustum (31), a cone top plane (32), a first working surface (33) and a second working surface (34). The first working surface (33) and the second working surface (34) are each formed in plurality. Each first working surface (33) and each second working surface (34) are formed between the bottom frustum (31) and the cone top plane (32) and are alternately arranged along the circumference of the bottom frustum (31). The second working surface (34) includes a first grinding surface (341) and a second grinding surface (342). The second grinding surface (342) is close to the cone top plane (32). The first grinding surface (341) and the second grinding surface (342) form a double-tapered structure.

7. The polishing pad conditioning tool according to claim 1, wherein: It also comprises a diamond holder (4), wherein the diamond holder (4) is mounted on the disc (1), and the diamond sheet (2) is fixed on the diamond holder (4).

8. The polishing pad conditioning tool according to claim 7, wherein: The diamond holder (4) is designed as a circular shallow groove.

9. The polishing pad conditioning tool according to claim 1, wherein: The main drill (21), the auxiliary drill (22) and the center drill (23) are all made of single crystal diamond and are all formed with circular chamfers.

10. The polishing pad conditioning tool according to claim 1, wherein: The diameter of the main drill (21) is larger than the diameter of the center drill (23), and the diameter of the center drill (23) is larger than the diameter of the auxiliary drill (22).

Citation Information

Patent Citations

  • Polishing pad dresser and chemical mechanical planarization method

    CN110871407A

  • Chemical mechanical polishing dressing disc

    CN115674018A

  • High-precision polishing pad finishing tool

    CN118003249A

  • Finishing device for polishing pad

    CN219337383U

  • Conditioner and conditioning method

    JP2009136926A