Substrate transport system

Abstract

Provided are technical features for a substrate transport system that are simple in structure and yet capable of suppressing contamination of a substrate due to dust emission from a mechanical contact part. The substrate transport system comprises first and second substrate transport mechanisms and a buffer unit. The first substrate transport mechanism includes a first pipe rail, a first inner magnet structure, a first drive unit, and a first substrate support unit. In the first substrate support unit, a first outer magnet structure moves so as to follow movement of the first inner magnet structure, and a first end effector moves in a first direction. The second substrate transport mechanism includes a second pipe rail, a second inner magnet structure, a second drive unit, and a second substrate support unit. In the second substrate support unit, a second outer magnet structure moves so as to follow movement of the second inner magnet structure, and a second end effector moves in a second direction. The buffer unit transports the substrate between the first end effector and the second end effector.

Description

Substrate Transfer System

[0001] SUMMARY OF THE INVENTION An exemplary embodiment of the present disclosure relates to a substrate transport system.

[0002] Techniques for magnetically levitating and moving a transport unit include those described in Patent Documents 1 and 2.

[0003] JP 2022-133867 A U.S. Patent Publication No. 2023 / 0085667 A

[0004] The present disclosure provides a technique for a substrate transfer system that has a simple structure while suppressing contamination of substrates due to particles generated from mechanical contact portions.

[0005] A substrate transport system in one exemplary embodiment of the present disclosure includes a chamber, a first substrate transport mechanism, a second substrate transport mechanism, and a buffer unit, wherein the first substrate transport mechanism includes two first pipe rails extending along a first direction at a first height within the chamber, a first inner magnet structure disposed within one of the two first pipe rails, a first drive unit configured to move the first inner magnet structure along the first direction within the one first pipe rail, and a first substrate support unit, wherein the first substrate support unit includes a first end effector and a first outer magnet structure disposed to surround the one first pipe rail, wherein movement of the first inner magnet structure causes the first outer magnet structure to move in a following manner, and the first end effector is configured to move in the first direction along the two first pipe rails, and the second substrate transport mechanism includes two first pipe rails extending along a first direction at a first height different from the first height within the chamber. the second substrate support unit has a second end effector and a second outer magnetic structure disposed so as to surround one of the second pipe rails, and is configured so that the second outer magnetic structure moves in response to movement of the second inner magnetic structure, and the second end effector moves in the second direction along the two second pipe rails; and the buffer unit is disposed in an intersection region surrounded by the two first pipe rails and the two second pipe rails in a plan view within the chamber, and is configured to transport substrates between the first end effector and the second end effector.

[0006] According to one exemplary embodiment of the present disclosure, there is provided a technique for suppressing contamination of substrates due to particles generated from mechanical contact portions in a substrate transfer system while having a simple structure.

[0007] 1 is a diagram for explaining an example of the configuration of a substrate processing system. FIG. 2 is a diagram for explaining an example of the configuration of a substrate transport system. FIG. 3 is a diagram for explaining an example of the configuration of the interior of a first pipe rail and an example of the configuration of a first substrate support unit. FIG. 4 is a diagram for explaining an example of the configuration of the interior of a second pipe rail and an example of the configuration of a second substrate support unit. FIG. 5 is a diagram for explaining an example of the first end effector moving up to above the substrate support part of the buffer unit. FIG. 6 is a diagram for explaining an example of the substrate support part rising and receiving the substrate from the first end effector. FIG. 7 is a diagram for explaining an example of the first end effector moving in the X direction and retracting from under the substrate. FIG. 8 is a diagram for explaining an example of the substrate support part lowering and the substrate being handed over to the second end effector. FIG. 9 is a diagram for explaining an example of the stop position of the first end effector in the X direction being corrected. FIG. 10 is a diagram for explaining an example of the stop position of the second end effector in the Y direction being corrected.

[0008] Hereinafter, each embodiment of the present disclosure will be described.

[0009] In one exemplary embodiment, the apparatus includes a chamber, a first substrate transport mechanism, a second substrate transport mechanism, and a buffer unit. The first substrate transport mechanism includes two first pipe rails extending along a first direction at a first height within the chamber, a first inner magnet structure disposed within one of the two first pipe rails, a first drive unit configured to move the first inner magnet structure along the first direction within the one first pipe rail, and a first substrate support unit. The first substrate support unit includes a first end effector and a first outer magnet structure disposed to surround the one first pipe rail, and the first end effector is configured to move in the first direction along the two first pipe rails. The second substrate transport mechanism is configured to move the first inner magnet structure along the first direction within the chamber at a second height different from the first height, and intersect the first direction. a second drive unit configured to move the second inner magnet structure in the second direction within one of the two second pipe rails; and a second substrate support unit, wherein the second substrate support unit has a second end effector and a second outer magnet structure arranged to surround one of the second pipe rails, and wherein the second outer magnet structure moves in response to movement of the second inner magnet structure, and the second end effector moves in the second direction along the two second pipe rails; and a buffer unit arranged in a crossing region surrounded by the two first pipe rails and the two second pipe rails within the chamber in a plan view, and configured to transport substrates between the first end effector and the second end effector.

[0010] In one exemplary embodiment, the first end effector is configured to transport the substrate at a third height and the second end effector is configured to transport the substrate at a fourth height different from the third height.

[0011] In one exemplary embodiment, the fourth height is greater than the second height, the third height is greater than the fourth height, and the first height is greater than the third height.

[0012] In one exemplary embodiment, the buffer unit includes a substrate support and a third drive unit configured to vertically move the substrate support to vertically move the substrate on the substrate support between a third height and a fourth height.

[0013] In one exemplary embodiment, the first substrate support unit has an additional first end effector integrated with the first end effector, and the tip of the additional first end effector is opposite to the tip of the first end effector.

[0014] In one exemplary embodiment, the second substrate support unit has an additional second end effector integrated with the second end effector, and the tip of the additional second end effector is opposite the tip of the second end effector.

[0015] In one exemplary embodiment, the first substrate transport mechanism includes an additional first inner magnet structure arranged within the other of the two first pipe rails, an additional first drive unit configured to move the additional first inner magnet structure along a first direction within the other first pipe rail, and an additional first substrate support unit, the additional first substrate support unit including an additional first end effector and an additional first outer magnet structure arranged to surround the other first pipe rail, wherein movement of the additional first inner magnet structure causes the additional first outer magnet structure to move in a following manner, and the additional first end effector is configured to move in the first direction along the two first pipe rails.

[0016] In one exemplary embodiment, the tip of the additional first end effector is opposite the tip of the first end effector.

[0017] In one exemplary embodiment, the second substrate transport mechanism includes an additional second inner magnet structure arranged within the other of the two second pipe rails, an additional second drive unit configured to move the additional second inner magnet structure along a second direction within the other second pipe rail, and an additional second substrate support unit, the additional second substrate support unit including an additional second end effector and an additional second outer magnet structure arranged to surround the other second pipe rail, wherein movement of the additional second inner magnet structure causes the additional second outer magnet structure to move in a following manner, and the additional second end effector is configured to move in the second direction along the two second pipe rails.

[0018] In one exemplary embodiment, the tip of the additional second end effector is opposite the tip of the second end effector.

[0019] In one exemplary embodiment, the apparatus further includes a control unit configured to control the movement of the first end effector so that the center of the substrate in the first direction coincides with the center of the substrate support when transferring the substrate from the first end effector to the substrate support of the buffer unit.

[0020] In one exemplary embodiment, the control unit is configured to control the movement of the second end effector so that the center of the substrate in the second direction coincides with the center of the substrate support when transferring the substrate from the second end effector to the substrate support of the buffer unit.

[0021] In one exemplary embodiment, a vacuum transfer chamber is provided, a plurality of first substrate transport mechanisms, a plurality of second substrate transport mechanisms, and a plurality of buffer units, each of the plurality of first substrate transport mechanisms having a plurality of first pipe rails extending along a first direction at a first height within the vacuum transfer chamber, a plurality of first inner magnet structures respectively disposed within the plurality of first pipe rails, a plurality of first drive units configured to move each of the plurality of first inner magnet structures along the first direction, and a first substrate support unit, each of the first substrate support units having a first end effector and a plurality of first outer magnet structures respectively disposed to surround the plurality of first pipe rails, wherein movement of the plurality of first inner magnet structures causes the plurality of first outer magnet structures to move in response, and the first end effector is configured to move in the first direction, and each of the plurality of second substrate transport mechanisms is arranged along a second direction intersecting the first direction at a second height different from the first height within the vacuum transfer chamber. a plurality of second pipe rails extending along a plurality of second pipe rails, a plurality of second inner magnet structures respectively disposed within the plurality of second pipe rails, a plurality of second drive units configured to move the plurality of second inner magnet structures along a second direction, and a second substrate support unit, wherein the second substrate support unit has a second end effector and a plurality of second outer magnet structures respectively disposed to surround the plurality of second pipe rails, wherein movement of the plurality of second inner magnet structures causes the plurality of second outer magnet structures to move in the second direction, and the plurality of buffer units are respectively disposed in a plurality of intersection regions where the plurality of first pipe rails included in each of the plurality of first substrate transport mechanisms and the plurality of second pipe rails included in each of the plurality of second substrate transport mechanisms intersect within the vacuum transport chamber in a plan view, and are configured to transport substrates between the first end effector and the second end effector.

[0022] In one exemplary embodiment, the first end effector is configured to transport the substrate at a third height and the second end effector is configured to transport the substrate at a fourth height different from the third height.

[0023] In one exemplary embodiment, the fourth height is greater than the second height, the third height is greater than the fourth height, and the first height is greater than the third height.

[0024] In one exemplary embodiment, each of the plurality of buffer units includes a substrate support and a third drive unit configured to vertically move the substrate support to vertically move a substrate on the substrate support between a third height and a fourth height.

[0025] In one exemplary embodiment, the first substrate support unit has an additional first end effector integrated with the first end effector, and the tip of the additional first end effector is opposite the tip of the first end effector.

[0026] In one exemplary embodiment, the second substrate support unit has an additional second end effector integrated with the second end effector, and the tip of the additional second end effector is opposite the tip of the second end effector.

[0027] Hereinafter, each embodiment of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same or similar elements are designated by the same reference numerals, and redundant explanations will be omitted. Unless otherwise specified, the positional relationships, such as up, down, left, and right, will be described based on the positional relationships shown in the drawings. The dimensional ratios in the drawings do not represent actual ratios, and the actual ratios are not limited to the ratios shown in the drawings.

[0028] <Configuration Example of Substrate Processing System> A substrate processing system (hereinafter also referred to as "substrate processing system PS") according to one embodiment will be described with reference to Fig. 1. Fig. 1 is a diagram for explaining a configuration example of the substrate processing system PS.

[0029] The substrate processing system PS includes a vacuum transfer module TM, process modules PM1 to PM8, load lock modules LL1 and LL2, an atmospheric transfer module LM, load ports LP1 to LP4, an aligner AN, a storage SR, and the like.

[0030] The vacuum transfer module TM has a substantially rectangular shape in a plan view. Process modules PM1 to PM8 are connected to multiple side surfaces of the vacuum transfer module TM. Load lock modules LL1 and LL2 are connected to some side surfaces of the vacuum transfer module TM. In one embodiment, the vacuum transfer module TM may be part of a substrate transfer system 200. The substrate transfer system 200 can transfer substrates between the load lock modules LL1 and LL2 and the process modules PM1 to PM8. The substrate transfer system 200 can transfer substrates based on operation instructions output by a control unit CU, which will be described later. The substrate transfer system 200 may also be capable of transferring objects other than substrates. A detailed configuration example of the substrate transfer system 200 will be described later.

[0031] The substrate as the object to be transferred may be, for example, a semiconductor wafer, a dummy wafer, a sensor wafer, etc. The object to be transferred may include a consumable part. The consumable part may be a part that is replaceably attached in the process modules PM1 to PM8 and that is consumed by various processes such as plasma processing performed in the process modules PM1 to PM8. The consumable part may include, for example, a part that constitutes a ring assembly disposed around a substrate support part of the plasma processing apparatus and a part that constitutes a shower head that supplies processing gas to the plasma processing space.

[0032] Each of the process modules PM1 to PM8 has a processing chamber and a substrate support disposed therein. At least one of the process modules PM1 to PM8 may be a plasma processing module. In one embodiment, at least one of the process modules PM1 to PM8 may be configured to reduce the pressure inside the module after a substrate is placed on the substrate support, introduce a processing gas, and supply RF power to generate plasma, thereby performing plasma processing on the substrate using the plasma. The vacuum transfer module TM and the process modules PM1 to PM8 may be separated by a gate valve that can be opened and closed.

[0033] The load lock modules LL1 and LL2 are disposed between the vacuum transfer module TM and the atmospheric transfer module LM. The load lock modules LL1 and LL2 have internal pressure variable chambers whose interiors can be switched between vacuum and atmospheric pressure. The load lock modules LL1 and LL2 have stages (mounting tables) disposed therein. When transferring a substrate from the atmospheric transfer module LM to the vacuum transfer module TM, the load lock modules LL1 and LL2 can set the interior to atmospheric pressure, receive the substrate from the atmospheric transfer robot TR3 of the atmospheric transfer module LM, and then vacuum the interior to transfer the substrate to the first substrate support unit 303 (described below) of the vacuum transfer module TM. When transferring a substrate from the vacuum transfer module TM to the atmospheric transfer module LM, the load lock modules LL1 and LL2 can set the interior to vacuum, receive the substrate from the first substrate support unit 303 of the vacuum transfer module TM, and then vacuum the interior to transfer the substrate to the atmospheric transfer robot TR3 of the atmospheric transfer module LM. The load lock modules LL1 and LL2 and the vacuum transfer module TM may be separated by gate valves that can be opened and closed. The load lock modules LL1 and LL2 and the atmospheric transfer module LM may be separated by gate valves that can be opened and closed.

[0034] The atmospheric transfer module LM is disposed opposite the vacuum transfer module TM, sandwiching the load lock modules LL1 and LL2 therebetween. The atmospheric transfer module LM may be, for example, an Equipment Front End Module (EFEM). The atmospheric transfer module LM is rectangular, equipped with a Fan Filter Unit (FFU), and has an atmospheric transfer chamber maintained at atmospheric pressure. Two load lock modules LL1 and LL2 and a storage SR are connected to one side of the atmospheric transfer module LM along its longitudinal direction (Y direction). Load ports LP1 to LP4 are connected to the other side of the atmospheric transfer module LM along its longitudinal direction (Y direction). An aligner AN is connected to one side of the atmospheric transfer module LM along its lateral direction (X direction). Note that the connection positions of the storage SR and aligner AN relative to the atmospheric transfer module LM are not limited to this and can be selected arbitrarily. An atmospheric transfer robot TR3 that transfers objects including substrates is disposed in the atmospheric transfer module LM.

[0035] The atmospheric transfer robot TR3 is configured to be movable along the longitudinal direction of the atmospheric transfer module LM, and is also configured to be freely swiveling, extending and retracting, and moving up and down. The atmospheric transfer robot TR3 can transfer objects based on operation instructions output by a control unit CU (described later). For example, the atmospheric transfer robot TR3 can place and hold the object on an end effector EE3 located at its tip, and transfer the object between the load ports LP1 to LP4, the load lock modules LL1 and LL2, the aligner AN, and the storage SR.

[0036] The load ports LP1 to LP4 are configured to accommodate multiple containers C. The containers C may accommodate multiple substrates (e.g., 25 substrates). The containers C may be, for example, front-opening unified pods (FOUPs).

[0037] The aligner AN may be a device that detects the position (orientation and center) of the substrate. The aligner AN may include a rotating support table, an optical sensor (neither of which are shown), etc. In one embodiment, the support table supports the substrate thereon and is configured to rotate around a central axis extending in the vertical direction. The support table can be rotated by a drive unit (not shown). The drive unit may be controlled by the control unit CU. When the support table rotates due to the power from the drive unit, the substrate placed on the support table also rotates.

[0038] In one embodiment, the optical sensor is configured to detect the edge of the substrate while the substrate is rotating. From the edge detection result, the optical sensor can detect the amount of deviation of the center position of the substrate relative to a reference position and the amount of deviation of the angular position of a notch (or another marker) on the substrate relative to a reference angular position. The optical sensor can output the amount of deviation of the center position of the substrate and the amount of deviation of the angular position of the notch to the control unit CU.

[0039] The storage SR may be a storage device that accommodates and stores transport objects including consumable parts.

[0040] The substrate processing system PS is connected to the control unit CU via a communication interface. In one embodiment, part or all of the control unit CU may be included in the substrate processing system PS. The control unit CU may be, for example, a computer. The control unit CU includes a central processing unit (CPU), random access memory (RAM), read-only memory (ROM), an auxiliary storage device, etc. The CPU operates based on a program stored in the ROM or the auxiliary storage device, and can control each part of the substrate processing system PS.

[0041] <Configuration Example of Substrate Transfer System> In one embodiment, the substrate transfer system 200 includes a chamber 250, a plurality of first substrate transfer mechanisms 251, a plurality of second substrate transfer mechanisms 252, and a plurality of buffer units 253. In the example shown in Figure 1, the substrate transfer system 200 includes the chamber 250, two first substrate transfer mechanisms 251a and 251b, three second substrate transfer mechanisms 252a, 252b, and 252c, and six buffer units 253a, 253b, 253c, 253d, 253e, and 253f.

[0042] The chamber 250 has a vacuum chamber with a vacuum atmosphere. The vacuum transfer module TM may be an example of the chamber 250. In one embodiment, load lock modules LL1 and LL2 are connected to one side of the chamber 250 in a first direction (X direction in FIG. 1 ). In one embodiment, process modules PM7 and PM8 are connected to the other side of the chamber 250 in the first direction (X direction in FIG. 1 ). The load lock modules LL1 and LL2 and the process modules PM7 and PM8 are arranged to face each other in the X direction with the chamber 250 in between.

[0043] In one embodiment, process modules PM1 to PM3 are connected to one side surface of chamber 250 in the second direction (Y direction in FIG. 1). In one embodiment, process modules PM4 to PM6 are connected to the other side surface of chamber 250 in the second direction (Y direction in FIG. 1). The process modules PM1 to PM3 and the process modules PM4 to PM6 are arranged to face each other in the Y direction with the chamber 250 in between.

[0044] In one embodiment, two first substrate transport mechanisms 251 (251 a, 251 b) are disposed within the chamber 250. The first substrate transport mechanisms 251 (251 a, 251 b) move substrates in the X direction and can transport substrates between the chamber 250 and the load lock modules LL1, LL2, and between the chamber 250 and the process modules PM7, PM8.

[0045] As shown in Figures 1 and 2, each of the first substrate transport mechanisms 251 (251a, 251b) has two first pipe rails 300, a first inner magnet structure 301 arranged in each first pipe rail 300, a first drive unit 302 arranged in each first pipe rail 300, and a first substrate support unit 303 that moves along the two first pipe rails 300.

[0046] The two first pipe rails 300 extend in a first direction (the X direction in FIGS. 1 and 2 ) at a first height within the chamber 250. The two first pipe rails 300 are arranged parallel to each other in the horizontal direction. As shown in FIG. 1 , the two first pipe rails 300 extend from one side wall of the chamber 250 to which the load lock modules LL1 and LL2 are connected to the other side wall to which the process modules PM7 and PM8 are connected.

[0047] FIG. 3 is a diagram illustrating an example of the internal configuration of the first pipe rail 300 and an example of the configuration of the first substrate support unit 303. The first inner magnetic structure 301 and the first driving unit 302 are disposed in the first pipe rail 300. The first driving unit 302 has a screw shaft 350 extending along the X direction and a motor 351 that rotates the screw shaft 350 around its axis. The first inner magnetic structure 301 is attached to the screw shaft 350. The screw shaft 350 is rotated by the motor 351, and the rotation of the screw shaft 350 moves the first inner magnetic structure 301 in the X direction. In one embodiment, the first inner magnetic structure 301 has a cylindrical shape whose central axis coincides with that of the screw shaft 350. A permanent magnet (first inner magnet) 360 is attached to the cylindrical outer peripheral surface of the first inner magnetic structure 301. The permanent magnet 360 may have an annular shape that extends along the circumferential direction of the cylindrical outer peripheral surface. The permanent magnet 360 may be composed of a plurality of arc portions and may be uniformly arranged in the circumferential direction of the cylindrical outer peripheral surface. The first pipe rail 300 has an atmospheric chamber therein isolated from the external vacuum chamber, and the screw shaft 350, the motor 351 and the first inner magnet structure 301 are arranged in the atmospheric chamber.

[0048] As shown in Figures 1 to 3, the first substrate support unit 303 has two first end effectors 370, two first outer magnet structures 371 arranged to surround each of the two first pipe rails 300, and a first connecting body 372 connecting the first end effectors 370 and the first outer magnet structure 371.

[0049] The first end effector 370 is also referred to as a pick, a fork, or a transport arm. In one embodiment, the first end effector 370 extends in the horizontal X direction and has a U-shaped, bifurcated tip. The first end effector 370 can hold a substrate on its tip. The two first end effectors 370 are integrated and arranged so that their tips face in opposite directions. That is, one first end effector 370 faces the load lock modules LL1 and LL2 in the X direction, and the other first end effector 370 faces the process modules PM7 and PM8 in the X direction.

[0050] The first outer magnetic structure 371 is disposed at the center of the two first end effectors 370 in the X direction. The first outer magnetic structure 371 is disposed to surround the first pipe rail 300. As shown in FIG. 3 , the first outer magnetic structure 371 has a cylindrical shape, and the first pipe rail 300 passes through its hollow cylindrical portion. The inner diameter of the cylindrical inner circumferential surface of the first outer magnetic structure 371 is larger than the outer diameter of the cylindrical outer circumferential surface of the first pipe rail 300. A permanent magnet (first outer magnet) 380 is attached to the cylindrical inner circumferential surface of the first outer magnetic structure 371. The permanent magnet 380 may have an annular shape that extends along the circumferential direction of the cylindrical inner circumferential surface. Alternatively, the permanent magnet 380 may be composed of a plurality of arc portions and may be evenly arranged in the circumferential direction of the cylindrical inner circumferential surface. In one embodiment, the polarity of the permanent magnet 380 is different from the polarity of the permanent magnet 360. The first outer magnetic structure 371 can move following the movement of the first inner magnetic structure 301 .

[0051] 2 , in one embodiment, the first connecting body 372 has two vertical portions 390 extending downward from the two first outer magnetic structures 371 and a horizontal portion 391 extending inward from the two vertical portions 390. A base of the first end effector 370 is connected to the horizontal portion 391. As a result, a third height at which the first end effector 370 transports substrates is lower than the first height of the first pipe rail 300.

[0052] As described above, the first substrate support unit 303 is configured such that the first outer magnetic structure 371 moves following the movement of the first inner magnetic structure 301, and the first end effector 370 moves in the X direction.

[0053] 1 , the two first substrate transport mechanisms 251 (251a, 251b) are arranged side by side in the Y direction within the chamber 250. That is, two pairs of first pipe rails 300 are arranged within the chamber 250, and two first substrate support units 303 move in the X direction. In one embodiment, the first substrate support unit 303 of one first substrate transport mechanism 251a may be able to transport substrates to the load lock module LL1 and the process module PM7, and the first substrate support unit 303 of the other first substrate transport mechanism 251b may be able to transport substrates to the load lock module LL2 and the process module PM8.

[0054] In one embodiment, three second substrate transport mechanisms 252 (252, 252b, 252c) are disposed within the chamber 250. The second substrate transport mechanisms 252 (252, 252b, 252c) can move substrates in a Y direction perpendicular to the X direction and transport substrates between the chamber 250 and the process modules PM1 to PM6.

[0055] As shown in Figures 1 and 2, each of the second substrate transport mechanisms 252 (252, 252b, 252c) has two second pipe rails 400, a second inner magnet structure 401 arranged in each second pipe rail 400, a second drive unit 402 arranged in each second pipe rail 400, and a second substrate support unit 403 that moves along the two second pipe rails 400.

[0056] The two second pipe rails 400 extend within the chamber 250 at a second height different from the first height of the first pipe rail 300 along a second direction (the Y direction in FIGS. 1 and 2 ) perpendicular to the first direction (the X direction). The second pipe rails 400 extend at a position lower than the first pipe rail 300. The second pipe rails 400 are perpendicular to the first pipe rail 300 in a plan view. The two second pipe rails 400 are arranged parallel to each other in the horizontal direction. As shown in FIG. 1 , the two second pipe rails 400 extend from one side wall of the chamber 250 to which the process modules PM1 to PM3 are connected to the other side wall to which the process modules PM4 to PM6 are connected.

[0057] FIG. 4 is a diagram illustrating an example of the internal configuration of the second pipe rail 400 and an example of the configuration of the second substrate support unit 403. The second inner magnetic structure 401 and the second driving unit 402 are disposed in the second pipe rail 400. The second driving unit 402 has a screw shaft 450 extending along the Y direction and a motor 451 that rotates the screw shaft 450 around its axis. The second inner magnetic structure 401 is attached to the screw shaft 450. The screw shaft 450 is rotated by the motor 451, and the rotation of the screw shaft 450 moves the second inner magnetic structure 401 in the Y direction. In one embodiment, the second inner magnetic structure 401 has a cylindrical shape whose central axis coincides with that of the screw shaft 450. A permanent magnet (second inner magnet) 460 is attached to the cylindrical outer peripheral surface of the second inner magnetic structure 401. The permanent magnet 460 may have an annular shape that extends in the circumferential direction of the cylindrical outer peripheral surface. The permanent magnet 460 may be composed of a plurality of arc portions and may be uniformly arranged in the circumferential direction of the cylindrical outer peripheral surface. The second pipe rail 400 has an atmospheric chamber therein isolated from the external vacuum chamber, and the screw shaft 450, the motor 451 and the second inner magnet structure 401 are arranged in the atmospheric chamber.

[0058] As shown in Figures 1, 2 and 4, the second substrate support unit 403 has two second end effectors 470, two second outer magnet structures 471 arranged to surround each of the two second pipe rails 400, and a second connecting body 472 connecting the second end effectors 470 and the second outer magnet structure 471.

[0059] The second end effector 470 is also referred to as a pick, a fork, or a transfer arm. In one embodiment, the second end effector 470 extends horizontally in the Y direction and has a U-shaped, bifurcated tip. The second end effector 470 can hold a substrate on its tip. The two second end effectors 470 are integrated and arranged so that their tips face in opposite directions. That is, one second end effector 470 faces the process modules PM1 to PM3 in the Y direction, and the other second end effector 470 faces the process modules PM4 to PM6 in the Y direction.

[0060] The second outer magnetic structure 471 is disposed at the center of the two second end effectors 470 in the Y direction. The second outer magnetic structure 471 is disposed so as to surround the second pipe rail 400. As shown in FIG. 4 , the second outer magnetic structure 471 has a cylindrical shape, and the second pipe rail 400 passes through the hollow portion of the cylinder. The inner diameter of the cylindrical inner circumferential surface of the second outer magnetic structure 471 is larger than the outer diameter of the cylindrical outer circumferential surface of the second pipe rail 400. A permanent magnet (second outer magnet) 480 is attached to the cylindrical inner circumferential surface of the second outer magnetic structure 471. The permanent magnet 480 may have an annular shape that extends along the circumferential direction of the cylindrical inner circumferential surface. Alternatively, the permanent magnet 480 may be composed of a plurality of arc portions and may be evenly arranged in the circumferential direction of the cylindrical inner circumferential surface. The polarity of the permanent magnet 480 is different from the polarity of the permanent magnet 460. The second outer magnetic structure 471 can move following the movement of the second inner magnetic structure 401 .

[0061] 2 , in one embodiment, the second connecting body 472 has two vertical portions 490 extending upward from the two second outer magnetic structures 471 and a horizontal portion 491 extending inward from the two vertical portions 490. The base of the second end effector 470 is connected to the horizontal portion 491. As a result, the fourth height at which the second end effector 470 transports substrates is higher than the second height of the second pipe rail 400.

[0062] As described above, the second substrate support unit 403 is configured such that the second outer magnetic structure 471 moves following the movement of the second inner magnetic structure 401, and the second end effector 470 moves in the Y direction.

[0063] 1 , three second substrate transport mechanisms 252 (252, 252b, 252c) are arranged side by side in the X direction within the chamber 250. That is, three pairs of second pipe rails 400 are arranged within the chamber 250, and three second substrate support units 403 move in the Y direction. In one embodiment, the second substrate support unit 403 of one second substrate transport mechanism 252a can transport substrates to the opposing process modules PM1 and PM4, the second substrate support unit 403 of one second substrate transport mechanism 252b can transport substrates to the opposing process modules PM2 and PM5, and the second substrate support unit 403 of one second substrate transport mechanism 252c can transport substrates to the opposing process modules PM3 and PM6.

[0064] In one embodiment, the first pipe rail 300 extends in the X direction within the chamber 250 so that the first substrate support unit 303 can wait in an area that does not overlap with the second pipe rail 400 in a plan view. In one embodiment, the chamber 250 has a waiting area 250a on the side of the process modules PM7 and PM8, to which no process modules are connected in the Y direction. The waiting area 250a is an area where the second pipe rail 400 does not exist in a plan view, and the first pipe rail 300 extends to the waiting area 250a. This allows the first substrate support unit 303 to wait in the waiting area 250a.

[0065] In one embodiment, six buffer units 253 (253a, 253b, 253c, 253d, 253e, 253f) are disposed in the chamber 250. The buffer units 253 are disposed in an intersection region 600 where two first pipe rails 300 and two second pipe rails 400 intersect in the chamber 250 in a plan view. The intersection region 600 is an area surrounded by the two first pipe rails 300 and the two second pipe rails 400 in a plan view. In one embodiment, the buffer units 253 are disposed at positions where the center lines between the two first pipe rails 300 and the two second pipe rails 400 intersect. The buffer units 253 are configured to transport substrates between the first end effector 370 and the second end effector 470. Therefore, the buffer unit 253 is arranged in a plurality of intersection regions 600 where the plurality of first pipe rails 300 and the plurality of second pipe rails 400 intersect within the chamber 250 in a plan view. That is, the plurality of buffer units 253a, 253b, 253c, 253d, 253e, and 253f are respectively arranged in a plurality of intersection regions 600 where the plurality of first pipe rails 300 included in each of the plurality of first substrate transport mechanisms 251a and 251b intersect with the plurality of second pipe rails 400 included in each of the plurality of second substrate transport mechanisms 252a, 252b, and 252c within the vacuum transport chamber 250. Specifically, the first buffer unit 253a is arranged in a portion (intersection region) surrounded by the two first pipe rails 300 included in the first substrate transport mechanism 251a and the two second pipe rails 400 included in the second substrate transport mechanism 252a. The second buffer unit 253b is disposed in a region surrounded by the two first pipe rails 300 included in the first substrate transport mechanism 251a and the two second pipe rails 400 included in the second substrate transport mechanism 252b (intersection region). The third buffer unit 253c is disposed in a region surrounded by the two first pipe rails 300 included in the first substrate transport mechanism 251a and the two second pipe rails 400 included in the second substrate transport mechanism 252c (intersection region).The fourth buffer unit 253d is disposed in a region surrounded by the two first pipe rails 300 included in the first substrate transport mechanism 251b and the two second pipe rails 400 included in the second substrate transport mechanism 252a (intersection region). The fifth buffer unit 253e is disposed in a region surrounded by the two first pipe rails 300 included in the first substrate transport mechanism 251b and the two second pipe rails 400 included in the second substrate transport mechanism 252b (intersection region). The sixth buffer unit 253f is disposed in a region surrounded by the two first pipe rails 300 included in the first substrate transport mechanism 251b and the two second pipe rails 400 included in the second substrate transport mechanism 252c (intersection region).

[0066] 2 , the buffer unit 253 includes a substrate support portion 500 and a drive portion 501. The drive portion 501 is an example of a third drive unit. The drive portion 501 can move the substrate support portion 500 in the vertical direction, thereby allowing the substrate on the substrate support portion 500 to move in the vertical direction between a third height and a fourth height. Therefore, it can also be said that the substrate support portion 500 can move in the vertical direction between a position higher than the third height at which the first end effector 370 transports the substrate and a position lower than the fourth height at which the second end effector 470 transports the substrate. The substrate support portion 500 has a horizontal upper surface that supports the substrate and may be able to suction-hold the substrate onto the horizontal upper surface.

[0067] <Example of Substrate Processing> An example of substrate processing performed in the substrate processing system PS will be described. In one embodiment, the substrate processing is executed by the control unit CU. Substrates accommodated in containers C of load ports LP1 to LP4 shown in FIG. 1 are transferred to load lock modules LL1 and LL2 by the atmospheric transfer robot TR3 of the atmospheric transfer module LM. At this time, the interiors of the load lock modules LL1 and LL2 are maintained at atmospheric pressure. Next, the interiors of the load lock modules LL1 and LL2 are evacuated. The substrates may be transferred to the aligner AN, where the center positions of the substrates are detected, before being transferred to the load lock modules LL1 and LL2.

[0068] Next, the first substrate support unit 303 in the vacuum transfer module TM (chamber 250) moves in the X direction, and the first end effector 370 enters the load lock modules LL1 and LL2. The first end effector 370 receives the substrate, and then, as shown in FIG. 5, the first end effector 370 moves to above the substrate support portion 500 of the buffer unit 253 in the chamber 250. Next, as shown in FIG. 6, the substrate support portion 500 rises to receive and support the substrate W from the first end effector 370. Next, as shown in FIG. 7, the first end effector 370 moves in the X direction and retracts from under the substrate W. Next, as shown in FIG. 8, the substrate support portion 500 descends, and the substrate W is handed over to the second end effector 470 of the second substrate support unit 403 waiting below. Then, the second substrate supporting unit 403 moves in the Y direction, and the second end effector 470 enters the process modules PM1 to PM6 and transfers the substrate W. After transferring the substrate W, the second end effector 470 retreats from the process modules PM1 to PM6 and returns to the chamber 250.

[0069] In the process modules PM1 to PM6, plasma processing such as etching is performed on the substrate.

[0070] When the processing of the substrate is completed in the process modules PM1 to PM6, the second end effector 470 enters the process modules PM1 to PM6. The second end effector 470 receives the substrate W, and then, as shown in FIG. 8, the second end effector 470 moves to above the substrate support part 500 in the chamber 250. Next, as shown in FIG. 7, the substrate support part 500 moves up to receive and support the substrate W from the second end effector 470. Next, as shown in FIG. 6, the first end effector 370 moves in the X direction to enter below the substrate W. Next, as shown in FIG. 5, the substrate support part 500 moves down, and the substrate W is transferred to the first end effector 370. Then, the first substrate supporting unit 303 shown in FIG. 1 moves in the X direction, and the substrate W is transported to the load lock modules LL1 and LL2. Alternatively, the substrate W is transported to other process modules PM1 to M8 by the first substrate support unit 303, the second substrate support unit 403 and the buffer unit 253, and after processing in the process modules PM1 to M8, it is transported to the load lock modules LL1 and LL2.

[0071] When the substrates are transferred to the load lock modules LL1 and LL2, the interiors of the load lock modules LL1 and LL2 are maintained at a vacuum. Next, the interiors of the load lock modules LL1 and LL2 are brought to atmospheric pressure. The substrates are then returned from the load lock modules LL1 and LL2 to the containers C of the load ports LP1 to LP4 by the atmospheric transfer robot TR3 of the atmospheric transfer module LM.

[0072] In the above-described substrate processing, when the substrate is transferred from the first end effector 370 to the substrate support part 500, the movement of the first end effector 370 may be controlled so that the center of the substrate in the X direction coincides with the center of the substrate support part 500. Furthermore, the movement of the second end effector 470 may be controlled so that the center of the substrate in the Y direction coincides with the center of the substrate support part 500.

[0073] For example, if the center of the substrate W is displaced by L1 mm in the X direction from the correct position (reference position), the stop position of the first end effector 370 when transferring the substrate W to the substrate support part 500 may be corrected by L1 mm in the X direction from the set position, as shown in Fig. 9. Furthermore, if the center of the substrate W is displaced by L2 mm in the Y direction from the correct position (reference position), the stop position of the second end effector 470 when transferring the substrate W to the substrate support part 500 may be corrected by L2 mm in the Y direction from the set position, as shown in Fig. 10. As a result, the substrate W is supported by the substrate support part 500 so that the center P1 of the substrate support part 500 and the center P2 of the substrate W coincide with each other.

[0074] The aligner AN may detect the amount of deviation of the center position of the substrate W. The controller CU may control the movements of the first end effector 370 and the second end effector 470 based on the amount of deviation of the center position of the substrate W detected by the aligner AN.

[0075] According to this exemplary embodiment, the substrate transport system 200 includes a chamber 250, a first substrate transport mechanism 251 (251, 251b), a second substrate transport mechanism 252 (252, 252b, 252c), and a buffer unit 253 (253a, 253b, 253c, 253d, 253e, 253f). The first substrate transport mechanism 251 (251, 251b) is connected to a first pipe rail 300 and a second pipe rail 302. The substrate supporting device includes a first inner magnetic structure 301, a first driving unit 302, and a first substrate supporting unit 303. The first substrate supporting unit 303 includes a first end effector 370 and a first outer magnetic structure 371. The first outer magnetic structure 371 moves in accordance with the movement of the first inner magnetic structure 301, and the first end effector 370 moves in the X direction. The transport mechanism 252 (252, 252b, 252c) has a second pipe rail 400, a second inner magnetic structure 401, a second drive unit 402, and a second substrate support unit 403, and the second substrate support unit 403 has a second end effector 470 and a second outer magnetic structure 471, and is configured so that the second outer magnetic structure 471 moves in response to the movement of the second inner magnetic structure 401, and the second end effector 470 moves in the Y direction. The buffer units 253 (253a, 253b, 253c, 253d, 253e, 253f) are arranged in the intersection region 600 of the first pipe rail 300 and the second pipe rail 400 within the chamber 250, and are configured to transport substrates between the first end effector 370 and the second end effector 470.

[0076] According to this exemplary embodiment, in the first substrate transport mechanism 251, the first inner magnetic structure 301 and the first driving unit 302 are disposed inside the first pipe rail 300, which prevents contaminant-causing substances from leaking out of the first pipe rail 300 from the first inner magnetic structure 301 and the first driving unit 302. As the first inner magnetic structure 301 moves inside the first pipe rail 300, the first outer magnetic structure 371 of the first substrate support unit 303 moves accordingly, and the first end effector 370 of the first substrate support unit 303 moves in the X direction, so that the first substrate support unit 303 can move without contacting the first pipe rail 300. Similarly, in the second substrate transport mechanism 252, the second inner magnetic structure 401 and the second drive unit 402 are disposed within the second pipe rail 400, thereby preventing contamination-causing substances from leaking out of the second pipe rail 400 from the second inner magnetic structure 401 and the second drive unit 402. As the second inner magnetic structure 401 moves within the second pipe rail 400, the second outer magnetic structure 471 of the second substrate support unit 403 moves accordingly, and the second end effector 470 of the second substrate support unit 403 moves in the Y direction, allowing the second substrate support unit 403 to move without contacting the second pipe rail 400. Furthermore, the buffer unit 253 allows substrates to be transported between the first end effector 370 and the second end effector 470. Therefore, in the substrate transport system 200, contamination of substrates due to dust generation from mechanical contact portions can be prevented. Furthermore, since the number and area of ​​magnets required for installation are small, an inexpensive substrate transfer system 200 having a simple structure can be realized.

[0077] In the above embodiment, the first substrate transport mechanism 251 has the first inner magnetic structure 301, the first drive unit 302, and the first outer magnetic structure 371 on both of the two first pipe rails 300, but the first inner magnetic structure 301, the first drive unit 302, and the first outer magnetic structure 371 may be provided on only one of the two first pipe rails 300. The other first pipe rail 300 may be a guide for the first end effector 370. Similarly, the second substrate transport mechanism 252 had the second inner magnet structure 401, the second drive unit 402, and the second outer magnet structure 471 on both of the two second pipe rails 400, but may have the second inner magnet structure 401, the second drive unit 402, and the second outer magnet structure 471 on only one of the two second pipe rails 400. The other second pipe rail 400 may be a guide for the second end effector 470.

[0078] In the above embodiment, the two first end effectors 370 may be separated so as to be independently controllable. In this case, one of the two first end effectors may be referred to as the "first end effector" and the other as the "additional first end effector." In this case, the first substrate transport mechanism includes a first inner magnet structure disposed within one of the two first pipe rails, and a first drive unit configured to move the first inner magnet structure along a first direction within one of the first pipe rails. In addition, the first substrate support unit includes a first end effector and a first outer magnet structure disposed to surround one of the first pipe rails. The first substrate transport mechanism further includes an additional first inner magnet structure disposed within the other of the two first pipe rails, an additional first drive unit configured to move the additional first inner magnet structure along a first direction within the other first pipe rail, and an additional first substrate support unit. The additional first substrate support unit also includes an additional first end effector and an additional first outer magnet structure disposed to surround the other first pipe rail. The additional first outer magnet structure is moved in response to movement of the additional first inner magnet structure, and the additional first end effector is configured to move in the first direction along the two first pipe rails. In one embodiment, the first end effector is configured to be guided by the other first pipe rail without a magnet structure, and the additional first end effector is configured to be guided by one of the first pipe rails without a magnet structure. That is, the first end effector and the additional first end effector may be driven by magnetic structures disposed on different first pipe rails, and in one embodiment, the tip of the additional first end effector is opposite the tip of the first end effector.

[0079] In the above embodiment, the two second end effectors 470 may be separated so as to be independently controllable. In this case, one of the two second end effectors may be referred to as the "second end effector" and the other as the "additional second end effector." In this case, the second substrate transport mechanism includes a second inner magnet structure disposed within one of the two second pipe rails, and a second drive unit configured to move the second inner magnet structure along a second direction within the one second pipe rail. In addition, the second substrate support unit includes a second end effector and a second outer magnet structure disposed to surround the one second pipe rail. The second substrate transport mechanism further includes an additional second inner magnet structure disposed within the other of the two second pipe rails, an additional second drive unit configured to move the additional second inner magnet structure along a second direction within the other second pipe rail, and an additional second substrate support unit. The additional second substrate support unit also includes an additional second end effector and an additional second outer magnet structure disposed to surround the other second pipe rail. The additional second outer magnet structure is moved in response to movement of the additional second inner magnet structure, and the additional second end effector is configured to move in the second direction along the two second pipe rails. In one embodiment, the second end effector is configured to be guided by the other second pipe rail without a magnet structure, and the additional second end effector is configured to be guided by one of the second pipe rails without a magnet structure. That is, the second end effector and the additional second end effector may be driven by magnetic structures disposed on different second pipe rails. In one embodiment, the tip of the additional second end effector is opposite the tip of the second end effector.

[0080] Embodiments of the present disclosure further include the following aspects.

[0081] (Supplementary Note 1) A substrate transporting apparatus comprising: a chamber; a first substrate transporting mechanism; a second substrate transporting mechanism; and a buffer unit, wherein the first substrate transporting mechanism comprises: two first pipe rails extending in a first direction at a first height within the chamber; a first inner magnetic structure disposed within one of the two first pipe rails; a first drive unit configured to move the first inner magnetic structure within the one first pipe rail along the first direction; and a first substrate supporting unit, wherein the first substrate supporting unit comprises a first end effector and a first outer magnetic structure disposed to surround the one first pipe rail, and wherein the first outer magnetic structure moves in response to movement of the first inner magnetic structure, and the first end effector moves in the first direction along the two first pipe rails, and the second substrate transporting mechanism comprises: the substrate support unit includes: two second pipe rails extending within the chamber along a second direction intersecting the first direction at a second height different from the first height; a second inner magnetic structure disposed within one of the two second pipe rails; a second drive unit configured to move the second inner magnetic structure within the one second pipe rail along the second direction; and a second substrate support unit, the second substrate support unit having a second end effector and a second outer magnetic structure disposed to surround the one second pipe rail, the second outer magnetic structure moving in response to movement of the second inner magnetic structure, and the second end effector moving in the second direction along the two second pipe rails, a buffer unit disposed in an intersection area surrounded by the two first pipe rails and the two second pipe rails within the chamber in a plan view, and configured to transport substrates between the first end effector and the second end effector;

[0082] (Supplementary Note 2) The substrate transfer system described in Supplementary Note 1, wherein the first end effector is configured to transfer the substrate at a third height, and the second end effector is configured to transfer the substrate at a fourth height different from the third height.

[0083] (Supplementary Note 3) The substrate transfer system according to Supplementary Note 2, wherein the fourth height is greater than the second height, the third height is greater than the fourth height, and the first height is greater than the third height.

[0084] (Supplementary Note 4) The substrate transport system according to Supplementary Note 2 or 3, wherein the buffer unit includes a substrate support and a third drive unit configured to vertically move the substrate support so as to vertically move the substrate on the substrate support between the third height and the fourth height.

[0085] (Supplementary Note 5) The substrate transport system described in any one of Supplementary Notes 1 to 4, wherein the first substrate support unit has an additional first end effector integrated with the first end effector, and the tip of the additional first end effector is opposite to the tip of the first end effector.

[0086] (Supplementary Note 6) The substrate transport system described in any one of Supplementary Notes 1 to 5, wherein the second substrate support unit has an additional second end effector integrated with the second end effector, and the tip of the additional second end effector is opposite to the tip of the second end effector.

[0087] (Supplementary Note 7) The substrate transport system described in any one of Supplementary Notes 1 to 6, wherein the first substrate transport mechanism comprises: an additional first inner magnet structure arranged in the other of the two first pipe rails; an additional first drive unit configured to move the additional first inner magnet structure along the first direction in the other first pipe rail; and an additional first substrate support unit, wherein the additional first substrate support unit comprises an additional first end effector and an additional first outer magnet structure arranged to surround the other first pipe rail, and wherein the additional first outer magnet structure moves in response to movement of the additional first inner magnet structure, and the additional first end effector is configured to move in the first direction along the two first pipe rails.

[0088] (Supplementary Note 8) The substrate transport system according to Supplementary Note 7, wherein a tip of the additional first end effector is opposite to a tip of the first end effector.

[0089] (Supplementary Note 9) The second substrate transport mechanism comprises: an additional second inner magnet structure arranged in the other of the two second pipe rails; an additional second drive unit configured to move the additional second inner magnet structure along the second direction in the other second pipe rail; and an additional second substrate support unit, wherein the additional second substrate support unit comprises an additional second end effector and an additional second outer magnet structure arranged to surround the other second pipe rail, and wherein the movement of the additional second inner magnet structure causes the additional second outer magnet structure to move in a following manner, and the additional second end effector is configured to move along the two second pipe rails in the second direction. A substrate transport system as described in any one of Supplementary Notes 1 to 8.

[0090] (Supplementary Note 10) The substrate transport system according to Supplementary Note 9, wherein a tip of the additional second end effector is opposite to a tip of the second end effector.

[0091] (Supplementary Note 11) A substrate transport system according to any one of Supplementary Notes 1 to 10, further comprising a control unit, wherein the control unit is configured to control the movement of the first end effector so that the center of the substrate in the first direction coincides with the center of the substrate support unit when transferring the substrate from the first end effector to the substrate support unit of the buffer unit.

[0092] (Supplementary Note 12) The substrate transport system described in Supplementary Note 11, wherein the control unit is configured to control the movement of the second end effector so that the center of the substrate in the second direction coincides with the center of the substrate support portion when transferring the substrate from the second end effector to the substrate support portion of the buffer unit.

[0093] (Supplementary Note 13) A substrate transport system comprising: a vacuum transfer chamber; a plurality of first substrate transport mechanisms; a plurality of second substrate transport mechanisms; and a plurality of buffer units, wherein each of the plurality of first substrate transport mechanisms comprises: a plurality of first pipe rails extending along a first direction at a first height within the vacuum transfer chamber; a plurality of first inner magnetic structures respectively disposed within the plurality of first pipe rails; a plurality of first drive units configured to move the plurality of first inner magnetic structures along the first direction, and a first substrate support unit, wherein the first substrate support unit comprises a first end effector and a plurality of first outer magnetic structures respectively disposed to surround the plurality of first pipe rails, wherein the plurality of first outer magnetic structures move in response to movement of the plurality of first inner magnetic structures, and the first end effector moves in the first direction, and each of the plurality of second substrate transport mechanisms comprises: the second substrate support unit includes: a plurality of second pipe rails extending within the vacuum transfer chamber along a second direction intersecting the first direction at a second height different from the first height; a plurality of second inner magnetic structures respectively disposed within the plurality of second pipe rails; a plurality of second drive units configured to move the plurality of second inner magnetic structures respectively along the second direction; and a second substrate support unit, the second substrate support unit including a second end effector and a plurality of second outer magnetic structures respectively disposed to surround the plurality of second pipe rails, wherein the second end effector is configured to move in the second direction as the plurality of second inner magnetic structures move, a plurality of buffer units arranged in a plan view within the vacuum transport chamber at a plurality of intersection regions where the plurality of first pipe rails included in each of the plurality of first substrate transport mechanisms and the plurality of second pipe rails included in each of the plurality of second substrate transport mechanisms intersect, and configured to transport substrates between the first end effector and the second end effector;

[0094] (Supplementary Note 14) The substrate transfer system described in Supplementary Note 13, wherein the first end effector is configured to transfer the substrate at a third height, and the second end effector is configured to transfer the substrate at a fourth height different from the third height.

[0095] (Supplementary Note 15) The substrate transfer system according to Supplementary Note 14, wherein the fourth height is greater than the second height, the third height is greater than the fourth height, and the first height is greater than the third height.

[0096] (Supplementary Note 16) The substrate transport system described in any one of Supplementary Notes 13 to 15, wherein each of the plurality of buffer units includes a substrate support and a third drive unit configured to vertically move the substrate support so as to vertically move the substrate on the substrate support between the third height and the fourth height.

[0097] (Supplementary Note 17) The substrate transport system described in any one of Supplementary Notes 13 to 16, wherein the first substrate support unit has an additional first end effector integrated with the first end effector, and the tip of the additional first end effector is opposite to the tip of the first end effector.

[0098] (Appendix 18) A substrate transport system described in any one of Appendices 13 to 17, wherein the second substrate support unit has an additional second end effector integrated with the second end effector, and the tip of the additional second end effector is opposite to the tip of the second end effector.

[0099] The above embodiments are described for the purpose of explanation and are not intended to limit the scope of the present disclosure. Various modifications can be made to the above embodiments without departing from the scope and spirit of the present disclosure. For example, some components in one embodiment can be added to other embodiments. Also, some components in one embodiment can be replaced with corresponding components in other embodiments.

[0100] PS...substrate processing system, CU...controller, TM...vacuum transfer module, 200...substrate transfer system, 250...chamber, 251 (251a, 251b, 251c)...first transfer mechanism, 252 (252a, 252b, 252c)...second substrate transfer mechanism, 253 (253a, 253b, 253c, 253d, 253e, 253f)...buffer unit, 300...first pipe rail, 301...second First inner magnet structure, 302...first drive unit, 303...first substrate support unit, 370...first end effector, 371...first outer magnet structure, 400...second pipe rail, 401...second inner magnet structure, 402...second drive unit, 403...second substrate support unit, 470...second end effector, 471...second outer magnet structure, 600...intersection area, W...substrate

Claims

1. A substrate transport device comprising: a chamber; a first substrate transport mechanism; a second substrate transport mechanism; and a buffer unit, wherein the first substrate transport mechanism comprises: two first pipe rails extending in a first direction at a first height within the chamber; a first inner magnet structure disposed within one of the two first pipe rails; a first drive unit configured to move the first inner magnet structure within the one first pipe rail along the first direction; and a first substrate support unit, wherein the first substrate support unit comprises a first end effector and a first outer magnet structure disposed to surround the one first pipe rail, and wherein the first outer magnet structure moves in response to movement of the first inner magnet structure, and the first end effector moves in the first direction along the two first pipe rails, and the second substrate transport mechanism comprises: the substrate support unit includes: two second pipe rails extending within the chamber along a second direction intersecting the first direction at a second height different from the first height; a second inner magnetic structure disposed within one of the two second pipe rails; a second drive unit configured to move the second inner magnetic structure within the one second pipe rail along the second direction; and a second substrate support unit, the second substrate support unit having a second end effector and a second outer magnetic structure disposed to surround the one second pipe rail, the second outer magnetic structure moving in response to movement of the second inner magnetic structure, and the second end effector moving in the second direction along the two second pipe rails, a buffer unit disposed in an intersection area surrounded by the two first pipe rails and the two second pipe rails within the chamber in a plan view, and configured to transport substrates between the first end effector and the second end effector; 2. The substrate transfer system of claim 1, wherein the first end effector is configured to transfer the substrate at a third height, and the second end effector is configured to transfer the substrate at a fourth height different from the third height.

3. The substrate transfer system of claim 2, wherein the fourth height is greater than the second height, the third height is greater than the fourth height, and the first height is greater than the third height.

4. The substrate transport system of claim 3, wherein the buffer unit includes a substrate support and a third drive unit configured to vertically move the substrate support so as to vertically move the substrate on the substrate support between the third height and the fourth height.

5. The substrate transport system of claim 1, wherein the first substrate support unit has an additional first end effector integrated with the first end effector, and the tip of the additional first end effector is located opposite the tip of the first end effector.

6. The substrate transport system according to claim 5, wherein the second substrate support unit has an additional second end effector integrated with the second end effector, and the tip of the additional second end effector is located opposite the tip of the second end effector.

7. The substrate transport system of claim 1, wherein the first substrate transport mechanism comprises: an additional first inner magnet structure disposed within the other of the two first pipe rails; an additional first drive unit configured to move the additional first inner magnet structure along the first direction within the other first pipe rail; and an additional first substrate support unit, wherein the additional first substrate support unit comprises an additional first end effector and an additional first outer magnet structure disposed to surround the other first pipe rail, wherein movement of the additional first inner magnet structure causes the additional first outer magnet structure to move in a following manner, and the additional first end effector is configured to move along the two first pipe rails in the first direction.

8. The substrate transport system of claim 7, wherein the tip of the additional first end effector is opposite the tip of the first end effector.

9. A substrate transport system as described in claim 7 or 8, wherein the second substrate transport mechanism comprises: an additional second inner magnet structure arranged in the other of the two second pipe rails; an additional second drive unit configured to move the additional second inner magnet structure along the second direction in the other second pipe rail; and an additional second substrate support unit, wherein the additional second substrate support unit comprises an additional second end effector and an additional second outer magnet structure arranged to surround the other second pipe rail, and wherein the movement of the additional second inner magnet structure causes the additional second outer magnet structure to move in a following manner, and the additional second end effector is configured to move along the two second pipe rails in the second direction.

10. The substrate transport system of claim 9, wherein the tip of the additional second end effector is opposite the tip of the second end effector.

11. The substrate transport system of claim 4, further comprising a control unit, wherein the control unit is configured to control the movement of the first end effector so that the center of the substrate in the first direction coincides with the center of the substrate support unit when transferring the substrate from the first end effector to the substrate support unit of the buffer unit.

12. The substrate transfer system according to claim 11, wherein the control unit is configured to control the movement of the second end effector so that the center of the substrate in the second direction coincides with the center of the substrate support unit when transferring the substrate from the second end effector to the substrate support unit of the buffer unit.

13. A substrate transport system comprising: a vacuum transfer chamber; a plurality of first substrate transport mechanisms; a plurality of second substrate transport mechanisms; and a plurality of buffer units, wherein each of the plurality of first substrate transport mechanisms comprises: a plurality of first pipe rails extending along a first direction at a first height within the vacuum transfer chamber; a plurality of first inner magnetic structures respectively disposed within the plurality of first pipe rails; a plurality of first drive units configured to move each of the plurality of first inner magnetic structures along the first direction; and a first substrate support unit, wherein the first substrate support unit comprises a first end effector and a plurality of first outer magnetic structures respectively disposed to surround the plurality of first pipe rails, wherein movement of the plurality of first inner magnetic structures causes subsequent movement of the plurality of first outer magnetic structures, and the first end effector is configured to move in the first direction, and each of the plurality of second substrate transport mechanisms comprises: the second substrate support unit includes: a plurality of second pipe rails extending within the vacuum transfer chamber along a second direction intersecting the first direction at a second height different from the first height; a plurality of second inner magnetic structures respectively disposed within the plurality of second pipe rails; a plurality of second drive units configured to move the plurality of second inner magnetic structures respectively along the second direction; and a second substrate support unit, the second substrate support unit including a second end effector and a plurality of second outer magnetic structures respectively disposed to surround the plurality of second pipe rails, wherein the second end effector is configured to move in the second direction as the plurality of second inner magnetic structures move, a plurality of buffer units arranged in a plan view within the vacuum transport chamber at a plurality of intersection regions where the plurality of first pipe rails included in each of the plurality of first substrate transport mechanisms and the plurality of second pipe rails included in each of the plurality of second substrate transport mechanisms intersect, and configured to transport substrates between the first end effector and the second end effector; 14. The substrate transport system of claim 13, wherein the first end effector is configured to transport the substrate at a third height, and the second end effector is configured to transport the substrate at a fourth height different from the third height.

15. The substrate transfer system of claim 14, wherein the fourth height is greater than the second height, the third height is greater than the fourth height, and the first height is greater than the third height.

16. The substrate transport system according to any one of claims 13 to 15, wherein each of the plurality of buffer units comprises a substrate support and a third drive unit configured to vertically move the substrate support so as to vertically move the substrate on the substrate support between the third height and the fourth height.

17. A substrate transport system according to any one of claims 13 to 15, wherein the first substrate support unit has an additional first end effector integrated with the first end effector, and the tip of the additional first end effector is located opposite the tip of the first end effector.

18. The substrate transport system of claim 17, wherein the second substrate support unit has an additional second end effector integrated with the second end effector, and the tip of the additional second end effector is opposite to the tip of the second end effector.

Images