Temperature sensor

Abstract

Provided is a temperature sensor which is inserted into an object to be measured and is reliably prevented from falling out. A temperature sensor 1 according to the present invention is inserted into a sensor hole of a socket section provided in an object to be measured. The temperature sensor 1 comprises: a belt-shaped insulating substrate 3; a heat-sensitive element 4 which is provided on one end side of the insulating substrate; a pair of pattern wires 5 which are formed on the insulating substrate and one end of which is connected to the heat-sensitive element; and a leaf spring member 6 which is attached to one end side of the insulating substrate. The leaf spring member comprises: a bottom plate part 6a to the upper surface of which one end side of the insulating substrate is fixed; and an upper plate part 6b which is connected to one end of the bottom plate part, extends gradually away from the bottom plate part toward the other end side of the bottom plate part, and has a biasing force in a direction away from the bottom plate part. The socket section has a through-hole penetrating from the inside of the sensor hole to the upper surface. The upper plate part comprises a locking part 6c that protrudes upward and is fitted into the through-hole when inserted into the sensor hole.

Description

Temperature Sensor

[0001] The present invention relates to a temperature sensor that can be easily attached to an object to be measured.

[0002] Conventionally, when assembling a temperature sensor to a measurement object such as a module component, the temperature sensor is attached by inserting the temperature sensor into a socket provided in the measurement object. For example, Patent Document 1 describes a temperature sensor that is attached by inserting it into a socket of a module component. This temperature sensor has a retaining piece that fits into a hole in the socket and an arm that elastically deforms to press the temperature sensor against the socket.

[0003] Japanese Patent Application Laid-Open No. 2014-173927

[0004] The above-mentioned conventional technology has the following remaining problems. Specifically, in the temperature sensor of Patent Document 1, in order to fit the fixed, protruding retaining piece into the hole, the part that becomes the socket of the module component also needs to be elastic and deform, which has the disadvantage of imposing limitations on the material and structure of the socket side. Furthermore, because the socket side also has elasticity and deforms, there is a risk that pulling the inserted temperature sensor against the elasticity will deform the socket, causing the retaining piece to come out of the hole and causing the temperature sensor to come out.

[0005] The present invention has been made in view of the above-mentioned problems, and has an object to provide a temperature sensor that can be inserted into an object to be measured and can be reliably prevented from coming out.

[0006] The present invention employs the following configuration to solve the above problems. That is, a temperature sensor according to a first aspect of the present invention is a temperature sensor to be inserted into a sensor hole of a socket provided in an object to be measured, the temperature sensor comprising: a strip-shaped insulating substrate; a heat-sensitive element provided on one end of the insulating substrate; a pair of pattern wirings formed on the insulating substrate and connected at one end to the heat-sensitive element; and a leaf spring member attached to the one end of the insulating substrate, the leaf spring member comprising: a bottom plate portion having one end of the insulating substrate fixed to an upper surface thereof; and an upper plate portion connected to one end of the bottom plate portion, extending gradually away from the bottom plate portion toward the other end of the bottom plate portion and exerting a biasing force in a direction away from the bottom plate portion; the socket portion having a through hole penetrating from within the sensor hole to its upper surface; and the upper plate portion having an upwardly protruding locking portion that fits into the through hole when inserted into the sensor hole.

[0007] In this temperature sensor, the upper plate portion protrudes upward and includes a locking portion that fits into the through-hole when inserted into the sensor hole. Therefore, when the leaf spring member is inserted into the sensor hole of the socket portion and the locking portion is inserted up to the position of the through-hole, the biasing force of the upper plate portion causes the leaf spring member to expand into the sensor hole, and the locking portion fits into the through-hole. In other words, the biasing force of the leaf spring member constantly presses the locking portion into the through-hole and locks it into the inner wall of the through-hole, so the locking portion functions as a stopper and prevents the temperature sensor from slipping out of the sensor hole of the socket portion. Therefore, even without elastic deformation of the socket portion, the temperature sensor can be easily inserted and fitted, and reliably prevented from slipping out. Furthermore, when it is desired to remove the temperature sensor from the socket portion, the locking portion in the through-hole is pushed downward against the biasing force toward the sensor hole, and the leaf spring member is pulled out of the sensor hole, allowing for easy removal of the temperature sensor. Furthermore, since the top plate portion extends from one end to the other end while gradually moving away from the bottom plate portion, it has a tapered shape and can be easily inserted into the sensor hole.

[0008] A temperature sensor according to a second aspect of the present invention is the same as that of the first aspect, but further characterized in that the other end of the upper plate portion includes a protrusion that abuts against the surface of the sensor hole of the socket portion when the upper plate portion is inserted into the sensor hole and the locking portion fits into the through-hole. This temperature sensor includes a protrusion that abuts against the surface of the sensor hole of the socket portion when the upper plate portion is inserted into the sensor hole and the locking portion fits into the through-hole. The abutment of the protrusion with the surface of the sensor hole prevents the leaf spring from being inserted further into the sensor hole and also positions the leaf spring. Furthermore, when removing the temperature sensor, the protrusion can be pushed down to push the locking portion down from the through-hole to the sensor hole, and the protrusion can then be used as a handle to pull the leaf spring, making it easy to remove the leaf spring from the sensor hole.

[0009] A temperature sensor according to a third aspect of the present invention is the temperature sensor according to the first or second aspect of the present invention, characterized in that the insulating substrate is formed of an insulating film. That is, in this temperature sensor, the insulating substrate is formed of an insulating film, which reduces the heat capacity, improves thermal conductivity, and allows for a thinner sensor.

[0010] The present invention has the following advantages. Specifically, in the temperature sensor according to the present invention, the upper plate portion is provided with a locking portion that protrudes upward and fits into the through-hole when inserted into the sensor hole. The locking portion is constantly pressed into the through-hole by the biasing force and is locked onto the inner wall of the through-hole, so that the locking portion functions as a stopper and prevents the temperature sensor from slipping out of the sensor hole in the socket portion. Therefore, the temperature sensor according to the present invention can be easily inserted without the socket portion itself being elastically deformed, and the locking portion is biased to fit securely regardless of whether the socket portion is elastically deformed, thereby reliably preventing the temperature sensor from slipping out.

[0011] FIG. 1 is a perspective view showing a first embodiment of a temperature sensor according to the present invention. FIG. 2 is a side view showing a temperature sensor in the first embodiment. FIG. 3 is a perspective view showing one end side of an insulating substrate on which a thermal element is installed in the first embodiment. FIG. 4 is a perspective view showing a temperature sensor before insertion into a socket portion in the first embodiment. FIG. 5 is a perspective view showing a temperature sensor after insertion into a socket portion in the first embodiment. FIG. 6 is a perspective view showing a state in which a cable is connected to an insulating substrate in the second embodiment of a temperature sensor according to the present invention. FIG. 7 is a perspective view showing a state in which a cable connection portion is protected by a shrink tube in the second embodiment of a temperature sensor according to the present invention. FIG. 8 is a perspective view showing the entire temperature sensor in the second embodiment of a temperature sensor according to the present invention.

[0012] A first embodiment of a temperature sensor according to the present invention will be described below with reference to FIGS. 1 to 4B.

[0013] As shown in Figures 1 to 4B, the temperature sensor 1 of this embodiment is a temperature sensor 1 that is inserted into a sensor hole 2a of a socket portion 2 provided in an object to be measured, and includes a strip-shaped insulating substrate 3, a heat-sensitive element 4 provided on one end of the insulating substrate 3, a pair of pattern wirings 5 ​​formed on the insulating substrate 3 and one end of which is connected to the heat-sensitive element 4, and a leaf spring member 6 attached to one end of the insulating substrate 3.

[0014] The leaf spring member 6 includes a bottom plate portion 6a, one end of which is fixed to the upper surface of the insulating substrate 3, and an upper plate portion 6b, which is connected to one end of the bottom plate portion 6a, extends gradually away from the bottom plate portion 6a toward the other end of the bottom plate portion 6a, and exerts a biasing force in the direction away from the bottom plate portion 6a. The bottom plate portion 6a extends in a strip shape along the insulating substrate 3. As shown in Figures 4A and 4B, the socket portion 2 has a through hole 2b that penetrates from the sensor hole 2a to the upper surface.

[0015] The upper plate portion 6b has locking portions 6c that protrude upward and fit into the through-hole 2b when inserted into the sensor hole 2a. In this embodiment, a pair of locking portions 6c protrude upward from both sides of the upper plate portion 6b. The locking portions 6c have a triangular shape in side view, with their height gradually increasing from one end to the other.

[0016] The other end of the top plate 6b is provided with a protrusion 6d that abuts against the surface of the socket 2 where the sensor hole 2a is open, as shown in Fig. 4B, when the top plate 6b is inserted into the sensor hole 2a and the locking portion 6c fits into the through-hole 2b. In this embodiment, protrusions 6d are also provided at both other ends of the bottom plate 6a. That is, the other end of the top plate 6b is provided with a protrusion 6d bent upward at a right angle, and the other end of the bottom plate 6a is provided with a protrusion 6d bent downward at a right angle.

[0017] The upper plate portion 6b has a stepped portion 6e that is slightly lower than one end, and a locking portion 6c is formed on the other end side of the stepped portion 6e. The bottom plate portion 6a and the upper plate portion 6b are connected at one end in a U-shape when viewed from the side, and the entire leaf spring member 6 has a tapered shape when viewed from the side. The leaf spring member 6 is formed by sheet metal processing a metal plate such as a copper alloy.

[0018] The insulating substrate 3 is formed of an insulating film such as a polyimide resin sheet. The insulating substrate 3 extends long, protruding from the bottom plate portion 6a toward the other end. The pattern wiring 5 is formed on the insulating substrate 3 using copper foil or the like, and extends from the thermal element 4 to the other end. In other words, the insulating substrate 3 on which the pattern wiring 5 is formed is a so-called FPC. A reinforcing plate 9, such as a metal plate or a resin plate, is adhered to the back surface of the other end of the insulating substrate 3 for mating with an external connector.

[0019] The insulating substrate 3 is adhered to the bottom plate 6a with epoxy adhesive, double-sided tape, or a thermal interface material (TIM), etc. The thermal element 4 is, for example, a chip thermistor, and is sealed in a dome shape with sealing resin 4a made of epoxy resin, etc., as shown in Figure 3. Note that a flake thermistor, thin film thermistor, etc. may also be used as the thermal element 4.

[0020] In this way, in the temperature sensor 1 of this embodiment, the upper plate portion 6b protrudes upward and has a locking portion 6c that fits into the through hole 2b when inserted into the sensor hole 2a.Therefore, when the leaf spring member 6 is inserted into the sensor hole 2a of the socket portion 2 and the locking portion 6c is inserted up to the position of the through hole 2b, the spring force of the upper plate portion 6b causes the leaf spring member 6 to expand into the sensor hole 2a, and the locking portion 6c fits into the through hole 2b.

[0021] That is, the locking portion 6c is constantly pressed into the through-hole 2b by the biasing force of the leaf spring member 6, and the locking portion 6c is locked to the inner wall of the through-hole 2b, so that the locking portion 6c functions as a stopper and prevents the temperature sensor 1 from coming out of the sensor hole 2a of the socket portion 2. Therefore, even if the socket portion 2 does not elastically deform, the temperature sensor 1 can be easily inserted and fitted, and can be reliably prevented from coming out.

[0022] Furthermore, when it is desired to remove the temperature sensor 1 from the socket portion 2, the locking portion 6c in the through hole 2b is pushed downward against the biasing force to the sensor hole 2a, and the leaf spring member 6 is pulled out from the sensor hole 2a, thereby easily removing the temperature sensor 1. Furthermore, since the top plate portion 6b extends gradually away from the bottom plate portion 6a from one end to the other end, it has a tapered shape and is easy to insert into the sensor hole 2a.

[0023] In addition, the other end of the upper plate portion 6b is provided with a protrusion 6d that abuts against the opening surface of the sensor hole 2a of the socket portion 2 when it is inserted into the sensor hole 2a and the locking portion 6c fits into the through hole 2b.By abutting the protrusion 6d against the opening surface of the sensor hole 2a, the leaf spring member 6 is prevented from being inserted further into the sensor hole 2a and can be positioned.

[0024] Furthermore, when removing the temperature sensor 1, the protrusion 6d is pressed down to push the locking portion 6c down from the through hole 2b to the sensor hole 2a, and then the protrusion 6d is used as a handle to pull the leaf spring member 6 out of the sensor hole 2a, making it easy to remove the leaf spring member 6. Furthermore, since the insulating substrate 3 is made of an insulating film, the heat capacity can be reduced, the thermal conductivity is improved, and a thinner design can be achieved.

[0025] Next, a second embodiment of the temperature sensor according to the present invention will be described below with reference to Figures 5A to 5C. In the following description of each embodiment, the same components as those described in the above embodiment are denoted by the same reference numerals, and their description will be omitted.

[0026] The difference between the second embodiment and the first embodiment is that in the first embodiment, the insulating substrate 3 extends a long distance from the bottom plate portion 6a to the outside, and a reinforcing plate 9 for fitting with an external connector is adhered to the other end of the insulating substrate 3, whereas in the temperature sensor 21 of the second embodiment, as shown in Figures 5A to 5C, the insulating substrate 23 does not protrude from the other end of the bottom plate portion 26a of the leaf spring member 26, and a pair of cables 29 which are lead wires are connected to the other end of the insulating substrate 23.

[0027] One end of the pair of cables 29 is connected to the other end of the pattern wiring 5 by solder H. The connection portion of the pair of cables 29 is covered and protected by a shrink tube 29a together with the insulating substrate 23 and the other end of the bottom plate portion 26a. The bottom plate portion 26a of the second embodiment extends longer than that of the first embodiment in order to connect the cables 29. The other end of the bottom plate portion 26a of the second embodiment does not have a protrusion 6d formed thereon.

[0028] Furthermore, a pair of sheet metal portions 26f that are bent to surround and press down on shrink tube 29a are formed at the other end of bottom plate portion 26. Since the other end of insulating substrate 23 is higher by the thickness of shrink tube 29a, an inclined step portion 23a is formed midway.

[0029] The technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

[0030] 1, 21...Temperature sensor, 2...Socket portion, 2a...Sensor hole, 2b...Through hole, 3, 23...Insulating substrate, 4...Thermal element, 5...Patterned wiring, 6, 26...Leaf spring member, 6a, 26a...Bottom plate portion, 6b...Upper plate portion, 6c...Latching portion, 6d...Protrusion portion

Claims

1. A temperature sensor to be inserted into a sensor hole of a socket portion provided in an object to be measured, comprising: a strip-shaped insulating substrate; a heat-sensitive element provided on one end of the insulating substrate; a pair of pattern wirings formed on the insulating substrate and one end connected to the heat-sensitive element; and a leaf spring member attached to one end of the insulating substrate, wherein the leaf spring member comprises: a bottom plate portion having one end of the insulating substrate fixed to an upper surface thereof; and an upper plate portion connected to one end of the bottom plate portion and extending gradually away from the bottom plate portion toward the other end of the bottom plate portion, the upper plate portion having a biasing force in a direction away from the bottom plate portion; the socket portion having a through hole that passes through from within the sensor hole to the upper surface; and the upper plate portion having a locking portion that protrudes upward and fits into the through hole when inserted into the sensor hole.

2. A temperature sensor as described in claim 1, characterized in that the other end of the upper plate portion is provided with a protrusion that abuts against the surface of the socket portion where the sensor hole opens when the protrusion is inserted into the sensor hole and the locking portion fits into the through hole.

3. A temperature sensor according to claim 1 or 2, characterized in that the insulating substrate is formed of an insulating film.

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