Method for manufacturing disk-shaped substrate and apparatus for manufacturing disk-shaped substrate

Abstract

This method for manufacturing a disk-shaped substrate comprises: a step for disposing, between a lower lapping plate and an upper lapping plate, a carrier that accommodates a disk-shaped substrate; a step for holding the disk-shaped substrate between the lower lapping plate and the upper lapping plate and polishing the disk-shaped substrate while supplying a processing liquid between the lower lapping plate and the upper lapping plate; a step for supplying, between the upper lapping plate and the disk-shaped substrate, a first detachment fluid for detaching the disk-shaped substrate from the upper lapping plate by using a first supply system; and a step for supplying, between the upper lapping plate and the carrier, a second detachment fluid for detaching the carrier from the upper lapping plate by using a second supply system independent of the first supply system.

Description

Disk-shaped substrate manufacturing method and disk-shaped substrate manufacturing device

[0001] The present disclosure relates to a method and an apparatus for manufacturing a disk-shaped substrate.

[0002] In the manufacturing process of a disk-shaped substrate used as a substrate for a magnetic recording medium, it is known to polish the surface of the disk-shaped substrate using a polishing device in order to improve the flatness of the surface of the disk-shaped substrate. For example, in the polishing device disclosed in Japanese Patent Laid-Open No. 2005-230978, a lower surface plate and an upper surface plate are arranged opposite each other, and the disk-shaped substrate is arranged between the lower surface plate and the upper surface plate in a state where it is housed inside a carrier.

[0003] In Japanese Patent Laid-Open No. 2005-230978, the surface of a disk-shaped substrate is polished by rotating the disk-shaped substrate while supplying a polishing liquid between a lower surface plate and an upper surface plate in a state where the lower surface plate and the upper surface plate are in contact with the disk-shaped substrate. However, in the polishing apparatus, after the disk-shaped substrate is polished, the polished disk-shaped substrate and the carrier are adsorbed to the upper surface plate via the polishing liquid, and the disk-shaped substrate may not be separated from the upper surface plate even when the upper surface plate is raised.

[0004] To solve this problem, Japanese Patent Laid-Open No. 2005-230978 discloses that a separation gas serving as a separation fluid is supplied from the outside to the gap between the upper surface plate and the disk-shaped substrate and between the upper surface plate and the carrier through nozzle holes provided in the upper surface plate, thereby separating the disk-shaped substrate from the upper surface plate. Japanese Patent Laid-Open No. 2005-230978 discloses that the polishing liquid is discharged from the gap between the upper surface plate and the disk-shaped substrate and from the gap between the upper surface plate and the carrier by supplying the separation gas. After the disk-shaped substrate and the carrier are separated from the upper surface plate, the disk-shaped substrate is transferred from the polishing apparatus to an apparatus for carrying out the next process.

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2005-230978

[0006] Here, the thickness of the carrier located around the disk-shaped substrate is usually thinner than the disk-shaped substrate. Therefore, when the carrier containing the disk-shaped substrate is placed on the lower surface plate, the height of the disk-shaped substrate becomes higher than the height of the carrier. In other words, between the lower surface plate and the upper surface plate, the spatial volume per unit area of ​​the carrier in the upper part of the carrier is larger than the spatial volume per unit area of ​​the disk-shaped substrate in the upper part of the disk-shaped substrate.

[0007] In JP 2005-230978 A, a supply system for a separation gas as a separation fluid supplied to the upper side of the disk-shaped substrate and a supply system for a separation gas as a separation fluid supplied to the upper side of the carrier share a common supply source, and one common pipe extending from the common supply source is used as part of the supply path. In JP 2005-230978 A, one supply system is used in common as the supply system for the separation gas on the disk-shaped substrate side and the supply system for the separation gas on the carrier side.

[0008] Therefore, when the release fluid is supplied to the upper side of the disk-shaped substrate, the release fluid is likely to be deflected to the upper side of the carrier, which has a larger spatial volume per unit area. In other words, the release fluid flows to the upper side of the carrier, where the pressure loss is smaller than that of the disk-shaped substrate. As a result, the pressure of the release fluid supplied to the upper side of the disk-shaped substrate decreases. As a result, the polishing liquid accumulated in the upper part of the disk-shaped substrate may not be sufficiently discharged, and as a result, the disk-shaped substrate may not be released from the upper platen.

[0009] The present disclosure has been made in light of the above-mentioned problems, and provides a method and an apparatus for manufacturing a disk-shaped substrate, which allows the disk-shaped substrate to be easily separated from the upper surface plate after polishing.

[0010] Specific means for achieving the above object are as follows: <1> A method for manufacturing a disk-shaped substrate, including the steps of: placing a carrier that stores a disk-shaped substrate between a lower surface plate and an upper surface plate; sandwiching the disk-shaped substrate between the lower surface plate and the upper surface plate and grinding or polishing the disk-shaped substrate while supplying a processing liquid between the lower surface plate and the upper surface plate; supplying a first release fluid that releases the disk-shaped substrate from the upper surface plate between the upper surface plate and the disk-shaped substrate using a first supply system; and supplying a second release fluid that releases the carrier from the upper surface plate between the upper surface plate and the carrier using a second supply system independent of the first supply system.

[0011] <2> The method for manufacturing the disk-shaped substrate according to <1>, wherein the step of supplying at least one of the first release fluid and the second release fluid includes a process of bringing the liquid into contact with the treatment liquid by supplying a liquid, and a process of applying pressure to the liquid in contact with the treatment liquid by subsequently supplying a gas into the liquid.

[0012] <3> An apparatus for manufacturing a disk-shaped substrate, comprising: a lower surface plate on which a carrier that stores a disk-shaped substrate is placed; an upper surface plate that is arranged above the lower surface plate so that it can be moved toward or away from the lower surface plate, the upper surface plate having a first nozzle hole formed in a portion facing the disk-shaped substrate and a second nozzle hole formed in a portion facing the carrier; a processing liquid supply unit that supplies a processing liquid between the lower surface plate and the upper surface plate; a first supply system that has a first supply source that stores a first release fluid that peels the disk-shaped substrate from the upper surface plate and a first piping connected between the first supply source and the first nozzle hole; and a second supply system that is provided independently of the first supply system and has a second supply source that stores a second release fluid that peels the carrier from the upper surface plate and a second piping connected between the second supply source and the second nozzle hole.

[0013] <4> The disk-shaped substrate manufacturing apparatus described in <3>, further comprising a control device that executes a process of supplying the first release fluid between the upper platen and the disk-shaped substrate by the first supply system, and a process of supplying the second release fluid between the upper platen and the carrier by the second supply system.

[0014] <5> The disk-shaped substrate manufacturing apparatus described in <4>, wherein the control device controls at least one of the first supply system and the second supply system so that, as a process of supplying at least one of the first release fluid and the second release fluid, the control device brings the liquid into contact with the processing liquid by supplying a liquid, and applies pressure to the liquid in contact with the processing liquid by supplying a gas following the liquid.

[0015] According to the present disclosure, it is possible to provide a method and an apparatus for manufacturing a disk-shaped substrate, which allows the disk-shaped substrate to be easily separated from the upper surface plate after polishing.

[0016] Fig. 1 is a plan view illustrating a disk-shaped substrate manufacturing apparatus according to an embodiment of the present disclosure; Fig. 2 is a cross-sectional view taken along line 2-2 in Fig. 1; Fig. 3 is a cross-sectional view illustrating a method for manufacturing a disk-shaped substrate according to the present embodiment (part 1); Fig. 4 is a cross-sectional view illustrating a method for manufacturing a disk-shaped substrate according to the present embodiment (part 2); Fig. 5 is a cross-sectional view illustrating a method for manufacturing a disk-shaped substrate according to a comparative example;

[0017] Embodiments of the present disclosure will be described below. However, the present disclosure is not limited to the following embodiments. When embodiments are described with reference to drawings in the present disclosure, the configuration of the embodiment is not limited to the configuration shown in the drawings. Furthermore, the sizes of components in each drawing are conceptual, and the relative size relationships between components are not limited to these.

[0018] In the following description of the drawings, like parts are designated by like reference numerals. However, the drawings are schematic, and the relationship between thickness and planar dimensions, and the thickness ratio of each device and each component, differ from the actual ones. Therefore, specific thicknesses and dimensions should be determined by taking into consideration the following explanation. Furthermore, there are parts in which the dimensional relationships and ratios differ between the drawings. Furthermore, unless otherwise specified in the specification, the number of each component element of the present disclosure is not limited to one, and multiple elements may be present.

[0019] In the following embodiments, components (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values ​​and their ranges, and do not limit the present disclosure. In the present disclosure, numerical ranges indicated using "to" include the numerical values ​​before and after "to" as the minimum and maximum values, respectively. In the numerical ranges described in stages in the present disclosure, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another numerical range described in stages. Furthermore, in the numerical ranges described in the present disclosure, the upper or lower limit value of that numerical range may be replaced with the value shown in the examples.

[0020] In the present disclosure, when a component is contained, each component may contain multiple types of corresponding substance. When multiple types of substances corresponding to each component are present in a composition, the content or amount of each component means the total content or amount of the multiple types of substances present in the composition, unless otherwise specified. In the present disclosure, particles corresponding to each component may contain multiple types of particles. When multiple types of particles corresponding to each component are present in a composition, the particle size of each component means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified. In the present disclosure, the terms "layer" and "film" include cases where the layer or film is formed over the entire area when the area where the layer or film is present is observed, as well as cases where the layer or film is formed only in a part of the area.

[0021] <Disk-shaped substrate manufacturing apparatus> First, a disk-shaped substrate manufacturing apparatus 10 according to this embodiment will be described with reference to Figures 1 and 2. As shown in Figures 1 and 2, the disk-shaped substrate manufacturing apparatus 10 includes a lower surface plate 12, an upper surface plate 14, a polishing liquid supply unit 30, a first supply system 41, and a second supply system 42.

[0022] In this embodiment, the disk-shaped substrate manufacturing apparatus 10 is a polishing apparatus. In the present disclosure, the disk-shaped substrate manufacturing apparatus 10 may be configured to include one or more other devices necessary for manufacturing a disk-shaped substrate.

[0023] Specifically, it may include a grinding device that grinds the disk-shaped substrate 50 in the upstream stage of the polishing device, a bulk transfer device for unprocessed or processed disk-shaped substrates 50, a standby device for waiting unprocessed or processed disk-shaped substrates 50, etc. In addition, it may also include, independently of or in combination with these, a storage rack that stores unprocessed or processed disk-shaped substrates, a cleaning device that cleans the disk-shaped substrates 50, a drying device that dries the disk-shaped substrates 50, etc.

[0024] (Disc-shaped substrate) The disc-shaped substrate 50 is stored inside the storage hole 52A of the carrier 52. The disc-shaped substrate 50 in this embodiment is, for example, an aluminum substrate or an aluminum alloy substrate, but the present disclosure is not limited thereto and a glass substrate or the like may also be used. Hereinafter, aluminum substrates, aluminum alloy substrates, and glass substrates are also collectively referred to as "substrates." Furthermore, aluminum substrates and aluminum alloy substrates are also collectively referred to as "aluminum substrates." A plating layer may be formed on the surface of the aluminum substrate. In this case, the surface to be polished can be the plating layer. Aluminum substrates are advantageous in that they are easy to process and can reduce manufacturing costs.

[0025] On the other hand, a glass reinforced layer may be formed on the surface of the glass substrate. In this case, the surface to be polished may be the glass reinforced layer. Formation of the glass reinforced layer is not essential for the glass substrate. The present disclosure is also applicable to polishing the surface of a pure glass substrate on which no glass reinforced layer is formed. Glass substrates are superior to aluminum substrates in strength, surface flatness, heat resistance, etc., and therefore, it is easy to achieve miniaturization and high density of disk-shaped substrates.

[0026] 1 , the present embodiment exemplifies a case in which three disk-shaped substrates 50 are stored in one carrier 52, but the present disclosure is not limited to this, and the number of stored disk-shaped substrates may be one or any multiple number. Similarly, the present embodiment exemplifies a case in which four carriers 52 are placed on the lower surface plate 12, but the present disclosure is not limited to this, and the number of placed carriers may be one or any multiple number.

[0027] The disk-shaped substrate 50 of this embodiment is for a magnetic recording medium, but the present disclosure is not limited to this. The disk-shaped substrate of the present disclosure may also be for other information recording disks, such as optical disks.

[0028] In the polishing apparatus, the disk-shaped substrate 50 rotates around its own axis, i.e., spins, via the carrier 52, and also rotates around the sun gear 16 around its axis, i.e., revolves.

[0029] (Lower Surface Plate) As shown in FIG. 2 , the lower surface plate 12 has a disk-shaped lower base 12A and a disk-shaped lower polishing pad 12B provided on the lower base 12A in FIG. 2 . A known polishing material, such as a polishing cloth, can be used as the lower polishing pad 12B. In this disclosure, the term "lower surface plate" may be used as a general term including the lower polishing pad. A carrier 52 that stores a disk-shaped substrate 50 is placed above the lower polishing pad 12B of the lower surface plate 12. As shown in FIG. 1 , a sun gear 16 that meshes with the gears on the peripheries of the four carriers 52 is disposed in the center of the lower surface plate 12. An external gear 18 that meshes with the gears on the peripheries of the four carriers 52 is disposed around the lower surface plate 12. As shown in FIG. 2 , a discharge path D for discharging the polishing liquid 60 is formed between the lower surface plate 12 and the external gear 18. (Upper surface plate) As shown in FIG. 2 , the upper surface plate 14 has a disc-shaped upper base 14A and a disc-shaped upper polishing pad 14B disposed below the upper base 14A in FIG. 2 . Like the lower polishing pad 12B, a known polishing material such as a polishing cloth can be used for the upper polishing pad 14B. In this disclosure, the term "upper surface plate" may be used as a general term including the upper polishing pad. The upper surface plate 14 is disposed above the lower surface plate 12, facing the lower surface plate 12. In this embodiment, both the lower surface plate 12 and the upper surface plate 14 are connected to a hydraulic drive unit, an electric drive unit, or the like, so that they can be raised and lowered. Therefore, the upper surface plate 14 can be moved toward or away from the lower surface plate 12. In this disclosure, at least one of the lower surface plate 12 and the upper surface plate 14 can be raised and lowered, so that the upper surface plate 14 can be positioned toward or away from the lower surface plate 12.

[0030] The upper surface plate 14 has a first nozzle hole 21 and a second nozzle hole 22. The first nozzle hole 21 is formed in a portion facing the disk-shaped substrate 50, penetrating the upper base 14A and the upper polishing pad 14B. The second nozzle hole 22 is formed in a portion facing the carrier 52, penetrating the upper base 14A and the upper polishing pad 14B. In the present embodiment, FIG. 1 illustrates a state in which two first nozzle holes 21 are formed in a portion facing one disk-shaped substrate 50 and six second nozzle holes 22 are formed in a portion facing the carrier 52, but this is not limited to this. In the present disclosure, the number of first nozzle holes 21 and second nozzle holes 22 can be changed as appropriate. In the present embodiment, as can be seen from line 2-2 in FIG. 1, a state in which two first nozzle holes 21 and two second nozzle holes 22 are arranged on a single straight line in a plan view is illustrated, but this is not limited to this. The arrangement pattern of the first nozzle holes 21 and the second nozzle holes 22 can be changed as appropriate.

[0031] (Polishing Liquid Supply Unit) The polishing liquid supply unit 30 includes a polishing liquid tank 30A storing a polishing liquid 60 and a polishing liquid pipe 30B connected between the polishing liquid tank 30A and the upper surface plate 14. The polishing liquid supply unit 30 supplies the polishing liquid 60 between the lower surface plate 12 and the upper surface plate 14. Specifically, for example, the polishing liquid 60 may be dropped onto the upper surface of the upper base 14A of the upper surface plate 14 in FIG. 2 and moved along the surface from the upper surface side toward the lower side of the upper surface plate 14, thereby being supplied between the lower surface plate 12 and the upper surface plate 14. A through-hole penetrating the upper base 14A and the upper polishing pad 14B may be formed as a path for the polishing liquid 60 to flow. The polishing liquid 60 of this embodiment corresponds to the processing liquid of the present disclosure. The polishing liquid supply unit 30 of this embodiment corresponds to the processing liquid supply unit of the present disclosure.

[0032] (First Supply System) As shown in FIG. 2, the first supply system 41 includes a first supply source 41A and a first pipe 41B. The first supply source 41A stores a first release fluid (see first release fluid 71 in FIG. 4) that releases the disk-shaped substrate 50 from the upper surface plate 14. The first pipe 41B is connected between the first supply source 41A and the first nozzle hole 21. The first supply source 41A includes a storage device, such as a tank, that can store the first release fluid. When the first release fluid is a combination of multiple release fluids with different supply start timings, the release fluids are stored in the storage device so that they can be selectively used without mixing with each other. (Second Supply System) The second supply system 42 includes a second supply source 42A and a second pipe 42B. The second supply source 42A stores a second release fluid (see second release fluid 72 in FIG. 4) that releases the carrier 52 from the upper surface plate 14. The second pipe 42B is connected between the second supply source 42A and the second nozzle hole 22. The other configuration of the second supply source 42A is the same as that of the first supply source 41A, so a duplicated description will be omitted. The second supply system 42 is provided independently of the first supply system 41.

[0033] (Release Fluid) The first release fluid or the second release fluid may be a known liquid such as pure water or a known gas such as air. In this embodiment, the first release fluid and the second release fluid are of the same type, but the present disclosure is not limited thereto, and the first release fluid and the second release fluid may be of different types.

[0034] (Independent Arrangement of Supply Systems) In this embodiment, the first supply system 41 and the second supply system 42 are independent supply systems. Specifically, the first supply source 41A of the first supply system 41 and the second supply source 42A of the second supply system 42 are separate supply sources. The first pipe 41B of the first supply system 41 and the second pipe 42B of the second supply system 42 are not connected to each other.

[0035] Here, "the supply systems being independent of one another" includes both the supply paths not being connected to one another and the supply sources being different from one another. In other words, "the supply systems of a plurality of release fluid supply systems being independent of one another" includes at least one of the following: the release fluids share a common supply source and the release fluid supply paths are connected to one another.

[0036] 2, in this embodiment, a control device 44 that causes the polishing apparatus to execute one or more processes included in the polishing process is connected to the first supply system 41 and the second supply system 42. In the present disclosure, the one or more processes included in the polishing process may be provided to the control device 44 in the form of, for example, a program.

[0037] In the present embodiment, a case has been exemplified in which one control device 44 is connected to both the first supply system 41 and the second supply system 42, but in the present disclosure, the number of control devices can be set arbitrarily to one or more, and for example, one control device may be connected to each of the first supply system 41 and the second supply system 42. Regardless of the number of control devices provided in the disk-shaped substrate manufacturing apparatus 10, the first supply system 41 and the second supply system 42 may be configured independently of each other.

[0038] <Method for Manufacturing Disk-Shaped Substrate> Next, a method for manufacturing a disk-shaped substrate using the disk-shaped substrate manufacturing apparatus 10 according to this embodiment will be described with reference to Figures 3 and 4. The method for manufacturing a disk-shaped substrate according to this embodiment includes the steps of: (A) placing a carrier 52 that stores a disk-shaped substrate 50 between the lower surface plate 12 and the upper surface plate 14; (B) sandwiching the disk-shaped substrate 50 between the lower surface plate 12 and the upper surface plate 14 and polishing the disk-shaped substrate 50 while supplying a polishing liquid 60 between the lower surface plate 12 and the upper surface plate 14; (C) supplying a first release fluid that releases the disk-shaped substrate 50 from the upper surface plate 14 between the upper surface plate 14 and the disk-shaped substrate 50 using a first supply system 41; and (D) supplying a second release fluid that releases the carrier 52 from the upper surface plate 14 between the upper surface plate 14 and the carrier 52 using a second supply system 42 independent of the first supply system 41. In the present embodiment, a case will be described as an example in which the method for manufacturing a disk-shaped substrate, including steps (A) to (D), is implemented by operating the control device 44 using a program for implementing the method for manufacturing a disk-shaped substrate. In the present disclosure, the method for manufacturing a disk-shaped substrate may be implemented by an operator of the disk-shaped substrate manufacturing apparatus 10 operating the control device 44.

[0039] In this embodiment, the method for manufacturing a disk-shaped substrate includes a process for removing the disk-shaped substrate 50 from the upper surface plate 14 in the polishing process. In the present disclosure, the method for manufacturing a disk-shaped substrate may include one or more other commonly known processes required for manufacturing the disk-shaped substrate 50, depending on the type of disk-shaped substrate.

[0040] For example, in the case of an aluminum substrate, a method for manufacturing a disk-shaped substrate includes the following steps: Blank substrate preparation step: An aluminum alloy ingot is rolled to obtain an aluminum alloy plate material with a thickness of approximately 2 mm or less. The obtained aluminum alloy plate material is punched into a disk shape to prepare an aluminum alloy substrate of the desired dimensions. Cutting step: The prepared aluminum alloy substrate is subjected to chamfering of the inner and outer diameters and cutting of both main surfaces. Grinding step: In order to reduce the surface roughness, waviness, etc. of the aluminum alloy substrate after cutting, both main surfaces of the aluminum alloy substrate are ground using a grinding wheel. Plating step: The surface of the ground substrate is plated with electroless nickel plating (NiP) or the like to impart surface hardness and suppress surface defects. Polishing step: Both main surfaces of the aluminum alloy substrate on which the plating film has been formed are polished.

[0041] In the case of a glass substrate, a method for manufacturing a disk-shaped substrate includes, for example, the following steps: Blank substrate preparation step: A glass blank, which serves as the material for a plate-shaped glass substrate for a magnetic recording medium and has a pair of main surfaces, is produced by press molding. A circular hole is formed in the center of the produced glass blank to form the glass blank into an annular shape. Next, a shape processing is performed to obtain a glass substrate having a chamfered surface. A grinding step and a polishing step are performed on the inner and outer peripheral end surfaces of the shaped glass substrate. Grinding step: The main surfaces of the glass substrate after the end surface polishing are ground using fixed abrasive grains. Polishing step: The main surfaces of the glass substrate after the grinding step are polished using a predetermined abrasive. During the polishing step, the glass substrate may be subjected to a chemical strengthening treatment.

[0042] The polishing step according to this embodiment will be described in detail below. [Polishing Step] In the polishing step, the lower surface plate 12 and the upper surface plate 14 are in contact with the disk-shaped substrate 50, and the disk-shaped substrate 50 is rotated while a polishing liquid 60 is supplied between the lower surface plate 12 and the upper surface plate 14, so that the surface of the disk-shaped substrate 50 is polished by the lower surface plate 12 and the upper surface plate 14. There are no particular limitations on the polishing liquid used when polishing an aluminum substrate, as long as it is a commonly used liquid, and examples of such liquid include slurries containing aluminum oxide, colloidal silica, etc. There are no particular limitations on the polishing liquid used when polishing a glass substrate, as long as it is a commonly used liquid, and examples of such liquid include slurries containing cerium oxide, zirconia, colloidal silica, etc.

[0043] 3 , after the disk-shaped substrate 50 is polished, the polished disk-shaped substrate 50 and the carrier 52 may be adsorbed to the upper surface plate 14 via the polishing liquid 60, which may prevent the disk-shaped substrate 50 from being separated from the upper surface plate 14 even when the upper surface plate 14 is raised. For this reason, a first separation fluid 71 is supplied by a first supply system 41 to between the upper surface plate 14 and the disk-shaped substrate 50 from the outside via a first nozzle hole 21 provided in the upper surface plate 14, independently of the second supply system 42. Furthermore, a second separation fluid 72 is supplied by a second supply system 42 to between the upper surface plate 14 and the carrier 52 from the outside via a second nozzle hole 22 provided in the upper surface plate 14, independently of the first supply system 41.

[0044] In the present disclosure, "supply" means to eventually reach a target location. For example, supplying the first release fluid 71 means that the first release fluid 71 reaches between the upper platen 14 and the disk-shaped substrate 50. Supplying the second release fluid 72 means that the second release fluid 72 reaches between the upper platen 14 and the carrier 52.

[0045] The timing at which the first supply system 41 starts applying a driving force to the first separation fluid 71 in order to supply the first separation fluid 71 may be before or after the upper platen 14 starts to rise. The timing at which the application of the driving force to the first separation fluid 71 is stopped may be before or after the upper platen 14 has completed rising to a preset height.

[0046] The timing at which the second supply system 42 starts applying a driving force to the second separation fluid 72 to supply the second separation fluid 72 may be before or after the upper platen 14 starts to rise. The timing at which the application of the driving force to the second separation fluid 72 is stopped may be before or after the upper platen 14 has completely risen to a predetermined height. The present disclosure does not exclude the supply of the first separation fluid 71 and the second separation fluid 72 without the process of raising the upper platen 14.

[0047] (Combination of Two-Phase Release Fluids) In this embodiment, the first release fluid 71 and the second release fluid 72 each contain both a liquid that is first introduced and a gas that is subsequently introduced after the liquid. In the present disclosure, it is not necessary for both the first release fluid 71 and the second release fluid 72 to contain both a liquid that is first introduced and a gas that is subsequently introduced after the liquid. It is sufficient for at least one of the first release fluid 71 and the second release fluid 72 to contain both a liquid that is first introduced and a gas that is subsequently introduced after the liquid. In the present disclosure, the "liquid that is first introduced" refers to the liquid that is introduced before the gas that applies pressure to the liquid is introduced in a two-phase release fluid combination consisting of a liquid in contact with the polishing liquid 60 and a gas that applies pressure to the liquid. Therefore, the "liquid that is first introduced" is not limited to the liquid that is first introduced after the start of a polishing process. For example, even if, after the start of a polishing process, one or more injections of release fluid are carried out, followed by the injection of a liquid to bring it into contact with the polishing liquid 60 and the injection of a gas to apply pressure to the liquid, the liquid that is injected is the ``first liquid to be injected'' as defined in the present disclosure.

[0048] The step of supplying the first release fluid 71 includes a process of bringing the liquid into contact with the polishing liquid 60 by supplying the liquid, and a process of applying pressure to the liquid in contact with the polishing liquid 60 by supplying a gas subsequently to the liquid. That is, the two-phase fluid constituting the first release fluid 71 is supplied in two stages, in the order of liquid and gas. Similarly, a two-phase fluid of liquid and gas is used in combination as the second release fluid 72. Furthermore, the step of supplying the second release fluid 72 includes a process of bringing the liquid into contact with the polishing liquid 60 by supplying the liquid, and a process of applying pressure to the liquid in contact with the polishing liquid 60 by supplying a gas subsequently to the liquid. The two-phase fluid constituting the second release fluid 72 is also supplied in two stages, in the order of liquid and gas. In the present disclosure, the step of supplying at least one of the first release fluid 71 and the second release fluid 72 may include a process of bringing the liquid into contact with the polishing liquid 60 by pumping the liquid, and a process of applying pressure to the liquid in contact with the polishing liquid 60 by subsequently pumping gas into the liquid.

[0049] The liquid in this embodiment can be appropriately selected depending on the type of processing before and after, the recycling of the processing liquid used, etc., and examples thereof include pure water, coolant, etc. The gas in this embodiment is, for example, air, but the present disclosure is not limited to this, and other gases can be appropriately used.

[0050] When the control device 44 is used, the control device 44 executes a process of supplying a first release fluid 71 between the upper surface plate 14 and the disk-shaped substrate 50 by the first supply system 41, and a process of supplying a second release fluid 72 between the upper surface plate 14 and the carrier 52 by the second supply system 42. The control device 44 also controls at least one of the first supply system 41 and the second supply system 42 so as to execute a process of bringing the liquid into contact with the polishing liquid 60 by supplying the liquid, and a process of applying pressure to the liquid in contact with the polishing liquid 60 by subsequently supplying a gas into the liquid.

[0051] In the present embodiment, when the disk-shaped substrate 50 and the carrier 52 are separated from the upper surface plate 14, the first separation fluid 71 and the second separation fluid 72 reach the corresponding first nozzle hole 21 or the second nozzle hole 22 with a reduced time difference. In the present disclosure, it is not excluded that a time gap is formed between the timing at which the first separation fluid 71 reaches the first nozzle hole 21 and the timing at which the second separation fluid 72 reaches the second nozzle hole 22.

[0052] 4, the first separation fluid 71 and the second separation fluid 72 are supplied independently of each other, and the polishing liquid 60 that adsorbs the polished disk-shaped substrate 50 and the carrier 52 to the upper surface plate 14 is discharged through the discharge path D between the lower surface plate 12 and the external gear 18. As a result, both the disk-shaped substrate 50 and the carrier 52 are separated from the upper surface plate 14. Thereafter, the disk-shaped substrate 50 is removed from the inside of the carrier 52 by a collective transfer device (not shown) and transferred to a subsequent process.

[0053] In the present disclosure, the polishing process may be performed multiple times. When the polishing process is performed multiple times, the type of polishing liquid 60 used in each polishing process may be different. Furthermore, for example, a chemical strengthening process may be performed on the disk-shaped substrate 50 between multiple polishing processes to improve the impact resistance of the disk-shaped substrate 50. Then, the transported disk-shaped substrate 50 is subjected to predetermined processes such as cleaning, magnetic film formation, and cooling, thereby manufacturing a magnetic recording medium having the desired specifications.

[0054] Comparative Example FIG. 5 shows a disk-shaped substrate manufacturing apparatus 10Z according to a comparative example. Components in the manufacturing apparatus 10Z that are similar to those in the disk-shaped substrate manufacturing apparatus 10 according to the present embodiment are designated by the same reference numerals, and their description will be omitted. The manufacturing apparatus 10Z includes a common supply source 43A and a common piping 43B, and a common supply system 43 that supplies a release fluid 73 to the first nozzle holes 21 facing the disk-shaped substrate 50 and the second nozzle holes 22 facing the carrier 52. In this manner, in the manufacturing apparatus 10Z, the release gas supply system on the disk-shaped substrate 50 side and the release gas supply system on the carrier 52 side are shared by a single supply system and are not independent of each other. Therefore, in the comparative example, even if a release fluid is supplied to the disk-shaped substrate 50 after polishing when the disk-shaped substrate 50 is not separated from the upper surface plate 14, the release fluid supplied to the upper side of the disk-shaped substrate 50 is likely to be deflected to the upper side of the carrier 52, which has a larger spatial volume per unit area. As a result, the pressure of the separation fluid supplied to the upper side of the disk-shaped substrate 50 decreases, and therefore the polishing liquid 60 accumulated in the upper part of the disk-shaped substrate 50 is not sufficiently discharged, and as a result, the disk-shaped substrate 50 may not be separated from the upper surface plate 14.

[0055] In contrast, in the present embodiment, the second separation fluid 72 that separates the carrier 52 is supplied between the upper surface plate 14 and the carrier 52 using a second supply system 42 that is independent of the first supply system 41 that supplies the first separation fluid 71 that separates the disk-shaped substrate 50. This prevents the separation fluid that separates the disk-shaped substrate 50 from diverting toward the upper portion of the carrier 52, i.e., prevents the first separation fluid 71 from flowing to the upper side of the carrier 52, where the pressure loss is smaller than that above the disk-shaped substrate 50. This allows the separation fluid for discharging the polishing liquid 60 that has accumulated between the upper surface plate 14 and the disk-shaped substrate 50 to be supplied while suppressing a drop in pressure. Therefore, in the present embodiment, the disk-shaped substrate 50 is easily separated from the upper surface plate 14. Furthermore, in this embodiment, since the first and second separation fluids 71 ​​and 72 are supplied independently of each other, it is easier to prevent the first separation fluid 71 from flowing back toward the first pipe 41B and the first supply source 41A via the first nozzle holes 21 when the upper platen 14 is raised, than in the comparative example. Similarly, it is easier to prevent the second separation fluid 72 from flowing back toward the second pipe 42B and the second supply source 42A via the second nozzle holes 22, than in the comparative example.

[0056] Additionally, in this embodiment, the disk-shaped substrate manufacturing apparatus 10 alone can peel off the disk-shaped substrate 50. Therefore, this embodiment is particularly effective in an automated manufacturing line that does not require human labor.

[0057] Furthermore, in this embodiment, at least one of the first and second separation fluids 71 ​​and 72 contains both liquid and gas, and therefore the liquid can suppress drying of the polishing liquid 60 around the surface of the disk-shaped substrate 50. This prevents the dried polishing liquid 60 from adhering to the surface and reducing the flatness of the surface. However, the effect of this embodiment is not limited to this reason. Furthermore, the present disclosure is not limited to this embodiment, and the first and second separation fluids may both be liquids or both be gases, as long as the effect of this embodiment is not impaired.

[0058] Additionally, in this embodiment, the discharge of the polishing liquid 60 together with the liquid is further promoted. The reason for this is thought to be that after the liquid is supplied, pressure is further applied by the gas to the liquid that comes into contact with the polishing liquid 60.

[0059] <Other Embodiments> The present disclosure has been described with reference to the above disclosed embodiments, but the descriptions and drawings forming part of this disclosure should not be understood to limit the present disclosure.

[0060] For example, in the present embodiment, a case has been exemplified in which multiple disk-shaped substrates 50 are polished collectively by rotating and revolving the carrier 52 using the external gear 18 and the sun gear 16. However, the present disclosure is not limited to this. In the present disclosure, for example, multiple disk-shaped substrates may be held in a state in which they protrude upward, and a polishing plate may be brought into contact with the surfaces of the disk-shaped substrates from above. Then, multiple disk-shaped substrates may be polished collectively by rotating the upper polishing plate. The polishing plate may also rotate and revolve without rotating the disk-shaped substrates.

[0061] (Grinding Apparatus) In the present embodiment, the manufacturing apparatus 10 for disk-shaped substrates has been described as a polishing apparatus, but the present disclosure is not limited to this, and the manufacturing apparatus 10 may be a grinding apparatus. In the present embodiment, a method for manufacturing a polished disk-shaped substrate using a polishing apparatus as the manufacturing apparatus 10 has been exemplified as the method for manufacturing a disk-shaped substrate, but in the present disclosure, the method for manufacturing a disk-shaped substrate may also be a method for manufacturing a ground disk-shaped substrate using a grinding apparatus as the manufacturing apparatus.

[0062] When the manufacturing apparatus for disk-shaped substrates is a grinding apparatus, grindstones are applied to the lower polishing pad 12B on the lower surface plate 12 and the upper polishing pad 14B on the upper surface plate 14 of the manufacturing apparatus 10 in FIG. 2 . In this case, the terms "upper surface plate" and "lower surface plate" may be used as generic terms including grindstones. Furthermore, in the grinding process in the grinding apparatus, the grinding process is performed by supplying, for example, coolant as a processing liquid instead of the polishing liquid 60. Therefore, the polishing liquid tank 30A, the polishing liquid piping 30B, etc. in this embodiment may be appropriately read as a coolant tank, a coolant piping, etc., respectively. The processing liquid in the grinding process is not limited to coolant, and may be any liquid supplied between the upper and lower surface plates.

[0063] When the manufacturing apparatus is a grinding apparatus, similar to the present embodiment described above, a second release fluid for separating the carrier is supplied between the upper platen and the carrier using a second supply system independent of the first supply system for supplying the first release fluid for separating the disk-shaped substrate. This prevents the release fluid for separating the disk-shaped substrate from diverging toward the upper portion of the carrier. This allows the release fluid for discharging the processing liquid accumulated between the upper platen and the disk-shaped substrate to be supplied while suppressing a drop in pressure. This, similar to the present embodiment described above, offers the advantage of easily separating the disk-shaped substrate from the upper platen. Furthermore, when the manufacturing apparatus is a grinding apparatus, similar to the present embodiment described above, the first release fluid and the second release fluid are supplied independently of each other. This makes it easy to prevent the first release fluid from flowing back toward the first pipe and the first supply source via the first nozzle hole when the upper platen is raised. Similarly, it makes it easy to prevent the second release fluid from flowing back toward the second pipe and the second supply source via the second nozzle hole.

[0064] (Manufacturing Method) The method for manufacturing a ground disc-shaped substrate of the present disclosure includes steps similar to the steps (A), (C), and (D) in the method for manufacturing a polished disc-shaped substrate of the present embodiment, and a step corresponding to (B) in the method for manufacturing a disc-shaped substrate of the present embodiment, and specifically may include the following steps in a grinding device: (A1) a step of placing a carrier for storing a disc-shaped substrate between a lower surface plate and an upper surface plate; (B1) a step of sandwiching the disc-shaped substrate between the lower surface plate and the upper surface plate, and grinding the disc-shaped substrate 50 while supplying a processing liquid between the lower surface plate and the upper surface plate; (C1) a step of supplying a first release fluid that releases the disc-shaped substrate from the upper surface plate, between the upper surface plate and the disc-shaped substrate, using a first supply system; and (D1) a step of supplying a second release fluid that releases the carrier from the upper surface plate, between the upper surface plate and the carrier, using a second supply system independent of the first supply system.

[0065] The method for manufacturing a ground disk-shaped substrate of this embodiment may include, as processing steps in a grinding apparatus, the steps (A1), (B1), (C1), and (D1) in the method for manufacturing a ground disk-shaped substrate described above, and, as processing steps in a polishing apparatus, the steps (A), (B), (C), and (D) in this embodiment. This makes it possible to efficiently obtain ground and polished disk-shaped substrates while obtaining over time the advantages of both the method for manufacturing a ground disk-shaped substrate and the method for manufacturing a polished disk-shaped substrate.

[0066] The present disclosure includes various embodiments not described above, and the technical scope of the present disclosure is defined by the invention-specifying matters in the claims that are appropriate from the above description.

[0067] The disclosure of Japanese Patent Application No. 2024-050265, filed on March 26, 2024, is incorporated herein by reference in its entirety.

[0068] Furthermore, all publications, patent applications, and technical standards mentioned in this specification are incorporated by reference herein to the same extent as if each individual publication, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.

[0069] 10, 10Z Manufacturing apparatus for disk-shaped substrate 12 Lower surface plate 12A Lower base 12B Lower polishing pad 14 Upper surface plate 14A Upper base 14B Upper polishing pad 16 Sun gear 18 External gear 21 First nozzle hole 22 Second nozzle hole 30 Polishing liquid supply unit 30A Polishing liquid tank 30B Polishing liquid piping 41 First supply system 41A First supply source 41B First piping 42 Second supply system 42A Second supply source 42B Second piping 43 Common supply system 43A Common supply source 43B Common piping 44 Control device 50 Disk-shaped substrate 52 Carrier 52A Storage hole 60 Polishing liquid 71 First release fluid 72 Second release fluid 73 Release fluid D Discharge path G Gap

Claims

1. A method for manufacturing a disk-shaped substrate, comprising the steps of: placing a carrier that stores a disk-shaped substrate between a lower surface plate and an upper surface plate; sandwiching the disk-shaped substrate between the lower surface plate and the upper surface plate and grinding or polishing the disk-shaped substrate while supplying a processing liquid between the lower surface plate and the upper surface plate; supplying a first release fluid that releases the disk-shaped substrate from the upper surface plate between the upper surface plate and the disk-shaped substrate using a first supply system; and supplying a second release fluid that releases the carrier from the upper surface plate between the upper surface plate and the carrier using a second supply system independent of the first supply system.

2. The method for manufacturing a disk-shaped substrate according to claim 1, wherein the step of supplying at least one of the first release fluid and the second release fluid includes: a process of bringing the liquid into contact with the processing liquid by feeding a liquid; and a process of applying pressure to the liquid in contact with the processing liquid by subsequently feeding a gas into the liquid.

3. An apparatus for manufacturing a disk-shaped substrate, comprising: a lower surface plate on which a carrier for storing disk-shaped substrates is placed; an upper surface plate arranged above the lower surface plate so as to be able to move toward or away from the lower surface plate, the upper surface plate having a first nozzle hole formed in a portion facing the disk-shaped substrate and a second nozzle hole formed in a portion facing the carrier; a processing liquid supply unit for supplying processing liquid between the lower surface plate and the upper surface plate; a first supply system having a first supply source storing a first release fluid for peeling the disk-shaped substrate from the upper surface plate and a first piping connected between the first supply source and the first nozzle hole; and a second supply system provided independently of the first supply system, the second supply source storing a second release fluid for peeling the carrier from the upper surface plate and a second piping connected between the second supply source and the second nozzle hole.

4. The disk-shaped substrate manufacturing apparatus of claim 3, further comprising a control device that executes the process of supplying the first release fluid between the upper platen and the disk-shaped substrate by the first supply system, and the process of supplying the second release fluid between the upper platen and the carrier by the second supply system.

5. The disk-shaped substrate manufacturing apparatus of claim 4, wherein the control device controls at least one of the first supply system and the second supply system so that, as a process of supplying at least one of the first release fluid and the second release fluid, the control device brings the liquid into contact with the processing liquid by feeding a liquid, and applies pressure to the liquid in contact with the processing liquid by feeding a gas following the liquid.

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