Sensor and electronic product

Abstract

Provided in the embodiments of the present disclosure are a sensor and an electronic product. The sensor comprises a substrate, a back electrode, a diaphragm and reinforcing ribs, wherein the substrate is provided with a first through hole; the back electrode is provided with second through holes, the back electrode is connected to the substrate by means of an insulating layer, and an accommodating cavity is formed between the back electrode and the substrate; the diaphragm is provided in the accommodating cavity and can separate the accommodating cavity into a first chamber that communicates with the first through hole and a second chamber that communicates with the second through holes; the diaphragm comprises a fixed area and a vibration area, the fixed area being connected to the insulating layer; and each reinforcing rib comprises a first end and a second end, the first end being fixed between the fixed area and the insulating layer, and the second end being fixed to the vibration area. By means of the provision of the reinforcing ribs, the stress concentration of the diaphragm is effectively reduced, and the reliability of the sensor is improved.

Description

Sensors and electronic products

[0001] This disclosure claims priority to Chinese patent application number 202410396142.8, filed with the Patent Office of China on April 2, 2024, entitled “Sensors and Electronic Products,” the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present disclosure relates to the field of sensor technology, and more particularly, to a sensor and an electronic product. Background Art

[0003] To improve sensor sensitivity, conventional techniques typically employ thinner diaphragms fixed to a substrate. However, once the diaphragm is fixed to the substrate, stress concentration can easily occur at the junction between the diaphragm and the substrate, leading to diaphragm fracture and failure, seriously compromising sensor reliability.

[0004] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. Summary of the Invention

[0005] One purpose of the present disclosure is to provide a new technical solution for sensors and electronic products.

[0006] According to a first aspect of the present disclosure, a sensor is provided, wherein the sensor comprises:

[0007] a substrate, wherein the substrate is provided with a first through hole;

[0008] a back electrode, wherein the back electrode is provided with a second through hole, the back electrode is connected to the substrate through an insulating layer, and an accommodating cavity is formed between the back electrode and the substrate;

[0009] a diaphragm disposed in the accommodating cavity, the diaphragm being capable of dividing the accommodating cavity into a first chamber communicating with the first through hole and a second chamber communicating with the second through hole; the diaphragm comprising a fixed region and a vibrating region, the fixed region being connected to the insulating layer;

[0010] The reinforcing rib includes a first end and a second end, the first end is fixed between the fixing area and the insulating layer, and the second end is fixed to the vibration area.

[0011] Optionally, the reinforcing rib is in the shape of at least one of a strip, a ring, a triangle, a rounded rectangle and a serpentine.

[0012] Optionally, the diaphragm and the reinforcing rib are an integrated structure;

[0013] Alternatively, the diaphragm includes a groove, and the reinforcing rib is arranged in the groove.

[0014] Optionally, the diaphragm is made of Si, and the reinforcing ribs are made of Si, SiO2, and SiN. X At least one of .

[0015] Optionally, the width of the reinforcing rib ranges from 0.1 μm to 10 μm.

[0016] Optionally, a plurality of reinforcing ribs are included, and the plurality of reinforcing ribs are arranged at intervals along the first direction on the diaphragm, or the plurality of reinforcing ribs are arranged at intervals along the second direction on the diaphragm;

[0017] The first direction and the second direction are two intersecting directions.

[0018] Optionally, the thickness of the diaphragm ranges from 0.1 μm to 20 μm.

[0019] Optionally, the vibration region includes a protrusion, and the protrusion is provided on a side of the vibration region facing the substrate.

[0020] Optionally, the insulating layer is made of SiO2.

[0021] According to a second aspect of the present disclosure, an electronic product is provided, comprising the sensor as described in any one of the first aspects.

[0022] According to an embodiment of the present disclosure, a sensor is provided, which includes a substrate, a back pole, a diaphragm and a reinforcing rib, wherein the substrate is provided with a first through hole; the back pole is provided with a second through hole, the back pole is connected to the substrate through an insulating layer, and a accommodating cavity is formed between the back pole and the substrate; the diaphragm is provided in the accommodating cavity, and the diaphragm can separate the accommodating cavity into a first chamber connected to the first through hole and a second chamber connected to the second through hole; the diaphragm includes a fixed area and a vibration area, and the fixed area is connected to the insulating layer; the reinforcing rib includes a first end and a second end, the first end is fixed between the fixed area and the insulating layer, and the second end is fixed to the vibration area; through the provision of the reinforcing rib, the stress concentration of the diaphragm is effectively reduced, and the reliability of the sensor is improved.

[0023] Other features and advantages of the present disclosure will become apparent from the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0025] FIG1 is a schematic diagram of the structure of a sensor in one embodiment of the present disclosure.

[0026] FIG2 is a schematic diagram of a partial structure of a sensor in one embodiment of the present disclosure.

[0027] FIG3 is a cross-sectional view of a diaphragm according to an embodiment of the present disclosure.

[0028] FIG4 is a cross-sectional view of a diaphragm and reinforcing ribs in one embodiment of the present disclosure.

[0029] FIG5 is a cross-sectional view of a diaphragm and reinforcing ribs in one embodiment of the present disclosure.

[0030] FIG6 is a cross-sectional view of a diaphragm and reinforcing ribs in one embodiment of the present disclosure.

[0031] FIG7 is a cross-sectional view of a diaphragm and reinforcing ribs in one embodiment of the present disclosure.

[0032] FIG8 is a cross-sectional view of a diaphragm and reinforcing ribs in one embodiment of the present disclosure.

[0033] FIG9 is a cross-sectional view of a diaphragm and reinforcing ribs in one embodiment of the present disclosure.

[0034] FIG10 is a schematic structural diagram of a reinforcing rib in one embodiment of the present disclosure.

[0035] FIG11 is a schematic structural diagram of a reinforcing rib in one embodiment of the present disclosure.

[0036] FIG12 is a schematic structural diagram of a reinforcing rib in one embodiment of the present disclosure.

[0037] FIG13 is a schematic structural diagram of a reinforcing rib in one embodiment of the present disclosure.

[0038] FIG14 is a schematic structural diagram of a reinforcing rib in one embodiment of the present disclosure.

[0039] FIG15 is a diagram showing stress distribution of a diaphragm without reinforcing ribs in an embodiment of the present disclosure.

[0040] FIG16 is a diagram showing stress distribution of a diaphragm with reinforcing ribs in an embodiment of the present disclosure.

[0041] FIG. 17 is a line graph showing stress distribution of a diaphragm in an embodiment of the present disclosure.

[0042] FIG18 is a schematic structural diagram of a reinforcing rib in one embodiment of the present disclosure.

[0043] FIG. 19 is a line graph showing the warping height of the diaphragm in one embodiment of the present disclosure.

[0044] Explanation of the accompanying drawings: 1. Base; 11. First through hole; 2. Back pole; 21. Second through hole; 3. Insulating layer; 4. Diaphragm; 41. Fixed area; 42. Vibrating area; 421. Protrusion; 43. Groove; 5. Reinforcing rib; 51. First end; 52. Second end; 6. Accommodating cavity; 61. First chamber; 62. Second chamber. DETAILED DESCRIPTION

[0045] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present disclosure.

[0046] The following describes in detail embodiments of the present disclosure, with examples of the embodiments illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present disclosure and are not to be construed as limiting the present disclosure. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present disclosure without inventive effort are intended to fall within the scope of protection of the present disclosure.

[0047] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0048] According to one embodiment of the present disclosure, a sensor is provided, as shown in Figures 1 to 19, the sensor includes a substrate 1, a back pole 2, a diaphragm 4 and a reinforcing rib 5, the substrate 1 is provided with a first through hole 11; the back pole 2 is provided with a second through hole 21, the back pole 2 is connected to the substrate 1 through an insulating layer 3, and a accommodating cavity 6 is formed between the back pole 2 and the substrate 1; the diaphragm 4 is provided in the accommodating cavity 6, and the diaphragm 4 can separate the accommodating cavity 6 into a first chamber 61 connected to the first through hole 11 and a second chamber 62 connected to the second through hole 21; the diaphragm 4 includes a fixed area 41 and a vibration area 42, and the fixed area 41 is connected to the insulating layer 3; the reinforcing rib 5 includes a first end 51 and a second end 52, the first end 51 is fixed between the fixed area 41 and the insulating layer 3, and the second end 52 is fixed to the vibration area 42.

[0049] Specifically, as shown in Figures 1 and 2, the sensor according to the embodiment of the present disclosure includes a substrate 1, which is provided with a first through-hole 11 extending through the substrate 1. A back electrode 2 is provided on one side of the substrate 1, and the back electrode 2 is provided with a second through-hole 21. The back electrode 2 is connected to the substrate 1 through the insulating layer 3.

[0050] After the back electrode 2 is disposed on one side of the substrate 1, the first through hole 11 communicates with the second through hole 21, and a receiving cavity 6 is formed between the back electrode 2 and the substrate 1. The diaphragm 4 can be fixed to the receiving cavity 6 via the fixing region 41, thereby dividing the receiving cavity 6 into a first chamber 61 communicating with the first through hole 11 and a second chamber 62 communicating with the second through hole 21, and ensuring that the vibration region 42 of the diaphragm 4 is located between the first through hole 11 and the second through hole 21.

[0051] Among them, the reinforcing rib 5 is fixed on the side of the diaphragm 4 facing the substrate 1, or the reinforcing rib 5 is fixed on the side of the diaphragm 4 facing the back pole 2, or the reinforcing rib 5 is fixed on both the side of the diaphragm 4 facing the substrate 1 and the side of the diaphragm 4 facing the back pole 2.

[0052] The reinforcing rib 5 includes a first end 51 and a second end 52, the first end 51 is fixed between the fixed area 41 and the insulating layer 3, and the second end 52 is fixed to the vibration area 42, that is, by setting one side of the first end 51 to be connected to the fixed area 41, the other side of the first end 51 to be connected to the insulating layer 3, one side of the second end 52 to be connected to the vibration area 42, and the other side of the second end 52 to be located in the first cavity 61 or the second cavity 62, so that the reinforcing rib 5 can be located in the fixed area 41 and the vibration area 42 of the diaphragm 4 at the same time.

[0053] Furthermore, after the fixed area 41 of the diaphragm 4 is connected to the insulating layer 3, the reinforcing rib 5 can be located at the connection between the diaphragm 4 and the substrate 1, thereby strengthening the structure of the diaphragm 4 through the reinforcing rib 5, significantly reducing the stress concentration at the connection between the diaphragm 4 and the substrate 1.

[0054] For example, as shown in Figures 3 and 15, when the diaphragm 4 is not provided with the reinforcing ribs 5, under a pressure load of 0.6 MPa, the maximum stress of the diaphragm 4 is located at the connection between the diaphragm 4 and the substrate 1, and the maximum stress is 2.8 GPa; and as shown in Figures 4 and 16, when the diaphragm 4 is provided with the reinforcing ribs 5, under a pressure load of 0.6 MPa, the maximum stress of the diaphragm 4 is transferred to the reinforcing ribs 5, and the maximum stress at this time is 2.4 GPa.

[0055] Thus, by performing a pressure test on the diaphragm 4 , a stress distribution diagram of the diaphragm 4 with and without the reinforcing ribs 5 is obtained.

[0056] As shown in Figure 17, the reinforcing ribs 5 described in the embodiment of the present disclosure effectively reduce the peak stress at the connection between the diaphragm 4 and the substrate 1, so that the stress distribution at the connection between the diaphragm 4 and the substrate 1 is flatter, thereby significantly reducing the stress concentration at the connection between the diaphragm 4 and the substrate 1, effectively avoiding the diaphragm 4 from breaking and failing, and greatly improving the reliability of the sensor.

[0057] In addition, the embodiment of the present disclosure significantly suppresses the excessive warping of the diaphragm 4 caused by the residual stress of the process through the provision of the reinforcing ribs 5, greatly improves the flatness of the diaphragm 4, and also makes the diaphragm 4 have a higher load-bearing capacity, so that the various parts of the sensor have higher consistency.

[0058] In addition, the connection between the diaphragm 4 and the insulating layer 3, the connection between the reinforcing ribs 5 and the diaphragm 4, and the connection between the reinforcing ribs 5 and the insulating layer 3 in the embodiment of the present disclosure can be glued, riveted or screwed, etc., and those skilled in the art can make a choice based on actual needs, and the present disclosure does not make any specific restrictions here.

[0059] Optionally, the reinforcing rib 5 is in at least one of a strip shape, a ring shape, a triangle shape, a rounded rectangle shape and a serpentine shape.

[0060] Specifically, as shown in Figures 3 to 9, the reinforcing rib 5 in the embodiment of the present disclosure can be fixed to the side of the diaphragm 4 facing the substrate 1, or the reinforcing rib 5 can be fixed to the side of the diaphragm 4 facing the back pole 2 to reduce the stress concentration at the connection between the diaphragm 4 and the substrate 1.

[0061] In addition, the reinforcing ribs 5 are fixed on the side of the diaphragm 4 facing the substrate 1 and the side of the diaphragm 4 facing the back pole 2 to significantly reduce stress concentration at the connection between the diaphragm 4 and the substrate 1 .

[0062] In addition, as shown in Figure 10, when the reinforcing rib 5 is in the strip shape, the reinforcing rib 5 can be set to be multiple, and the multiple reinforcing ribs 5 are arranged at intervals along the first direction of the diaphragm 4, and the first ends 51 and the second ends 52 of the multiple reinforcing ribs 5 extend along the second direction of the diaphragm 4, so that the strip-shaped reinforcing ribs 5 can better suppress the excessive warping of the diaphragm 4 caused by the residual stress of the process, and further improve the flatness of the diaphragm 4.

[0063] As shown in Figure 11, when the reinforcing rib 5 is a circular ring, the reinforcing rib 5 can be set to multiple, and the multiple reinforcing ribs 5 are arranged at intervals along the second direction of the diaphragm 4, so that the circular reinforcing rib 5 can further reduce the stress concentration at the connection between the diaphragm 4 and the substrate 1, and make the diaphragm 4 have a higher bearing capacity.

[0064] As shown in Figure 12, when the reinforcing rib 5 is triangular, the reinforcing rib 5 can be set to be multiple, and the multiple reinforcing ribs 5 are arranged at intervals along the first direction of the diaphragm 4, and the first ends 51 and the second ends 52 of the multiple reinforcing ribs 5 extend along the second direction of the diaphragm 4, so that the triangular reinforcing ribs 5 can further enhance the bearing capacity of the diaphragm 4 and improve the reliability and stability of the sensor.

[0065] As shown in Figure 13, when the reinforcing rib 5 is a rounded rectangle, the reinforcing rib 5 can be set to multiple, and the multiple reinforcing ribs 5 are arranged at intervals along the first direction of the diaphragm 4, and the first ends 51 and the second ends 52 of the multiple reinforcing ribs 5 extend along the second direction of the diaphragm 4, so that the rounded rectangular reinforcing ribs 5 can further enhance the bearing capacity of the diaphragm 4 and significantly improve the flatness of the diaphragm 4.

[0066] As shown in Figure 14, when the reinforcing rib 5 is serpentine, the reinforcing rib 5 extends along the first direction of the diaphragm 4, so that the serpentine reinforcing rib 5 can further enhance the bearing capacity of the diaphragm 4, improve the flatness of the diaphragm 4, and enhance the reliability and stability of the sensor.

[0067] Of course, the reinforcing ribs 5 described in the present disclosure can also be used in combination of multiple shapes. For example, multiple strip-shaped reinforcing ribs 5 and multiple triangular reinforcing ribs 5 can be arranged at intervals along the first direction of the diaphragm 4, or multiple strip-shaped reinforcing ribs 5 and multiple circular reinforcing ribs 5 can be arranged at intervals along the second direction of the diaphragm 4. Those skilled in the art can make a choice according to actual needs, and the present disclosure does not make any specific restrictions here.

[0068] In addition, it should be noted that the first direction and the second direction in the embodiment of the present disclosure are two intersecting directions. For example, the first direction is the circumferential direction of the diaphragm 4 , and the second direction is the radial direction of the diaphragm 4 .

[0069] Optionally, the diaphragm 4 and the reinforcing rib 5 are an integral structure; or, the diaphragm 4 includes a groove 43 , and the reinforcing rib 5 is disposed in the groove 43 .

[0070] Specifically, as shown in Figures 4, 5 and 7, the reinforcing rib 5 described in the embodiment of the present disclosure can be an integrated structure with the diaphragm 4, and the reinforcing rib 5 protrudes from the diaphragm 4 to significantly improve the load-bearing capacity of the diaphragm 4; or, as shown in Figure 6, the reinforcing rib 5 can be an integrated structure with the diaphragm 4, and the reinforcing rib 5 is connected to the diaphragm 4 to significantly reduce the manufacturing cost of the diaphragm 4 and the reinforcing rib 5; or, as shown in Figures 8 and 9, the diaphragm 4 includes a groove 43, and the reinforcing rib 5 is arranged in the groove 43 to significantly improve the load-bearing capacity of the diaphragm 4, and effectively prevent the reinforcing rib 5 from falling off the diaphragm 4, further improving the reliability and stability of the reinforcing rib 5.

[0071] Optionally, the material of the diaphragm 4 is Si, and the material of the reinforcing rib 5 is Si, SiO2 and SiN X At least one of .

[0072] Specifically, as shown in Figures 4 to 6, the material of the diaphragm 4 and the material of the reinforcing ribs 5 in the embodiment of the present disclosure can be the same. For example, when the diaphragm 4 and the reinforcing ribs 5 are both made of Si, the manufacturing efficiency of the diaphragm 4 and the reinforcing ribs 5 can be effectively improved.

[0073] In addition, as shown in FIG7 to FIG9, the material of the diaphragm 4 and the material of the reinforcing rib 5 can also be different. For example, when the diaphragm 4 is made of Si and the reinforcing rib 5 is made of SiN X When manufactured, the bearing capacity of the diaphragm 4 can be further improved.

[0074] Of course, under the condition that the use requirements of the diaphragm 4 are met, the material of the diaphragm 4 can also be plastic or carbon fiber, etc. Those skilled in the art can make a choice according to actual needs, and this disclosure does not make any specific restrictions here.

[0075] Optionally, the width of the reinforcing rib 5 ranges from 0.1 μm to 10 μm.

[0076] Specifically, as shown in FIG18 , the width direction of the reinforcing rib 5 in the embodiment of the present disclosure is the two ends of the reinforcing rib 5 along the second direction, that is, the width direction of the reinforcing rib 5 is the extension of the reinforcing rib 5 along the radial direction of the diaphragm 4 .

[0077] Among them, as shown in Figure 19, since the warping of the vibration area 42 of the diaphragm 4 is the largest, and when the width of the reinforcing rib 5 is larger, the warping of the diaphragm 4 is smaller, in order to significantly reduce the warping of the diaphragm 4, the width range of the reinforcing rib 5 is preferably 0.1μm to 10μm.

[0078] Optionally, the sensor includes a plurality of reinforcing ribs 5, which are arranged at intervals along a first direction on the diaphragm 4, or a plurality of reinforcing ribs 5 are arranged at intervals along a second direction on the diaphragm 4; wherein the first direction and the second direction are two intersecting directions.

[0079] Specifically, as shown in FIG. 10 to FIG. 14 , the reinforcing rib 5 in the embodiment of the present disclosure may be one, two, three or more, thereby significantly enhancing the bearing capacity of the diaphragm 4 and improving the reliability and stability of the sensor.

[0080] Optionally, the thickness of the diaphragm 4 ranges from 0.1 μm to 20 μm.

[0081] Specifically, since the thinner the diaphragm 4 is, the higher the sensitivity of the sensor is, in order to further improve the sensitivity of the sensor, the thickness of the diaphragm 4 is preferably in the range of 0.1 μm to 20 μm.

[0082] Optionally, the vibration region 42 includes a protrusion 421 , and the protrusion 421 is provided on a side of the vibration region 42 facing the substrate 1 .

[0083] Specifically, as shown in FIG1 , the embodiment of the present disclosure provides the protrusion 421 on the side of the vibration region 42 facing the substrate 1 , so that the air flow rate in the first chamber 61 is smaller than the average flow rate of the air flow in the second chamber 62 , thereby effectively reducing the mechanical noise of the sensor.

[0084] Optionally, the insulating layer 3 is made of SiO 2 .

[0085] Specifically, the embodiment of the present disclosure uses SiO2 to prepare the insulating layer 3, which effectively improves the insulation performance between the substrate 1 and the back electrode 2, and further improves the reliability and stability of the sensor.

[0086] Of course, the insulating layer 3 described in the embodiment of the present disclosure can also be made of other materials. Those skilled in the art can make a choice according to actual needs, and the present disclosure does not make any specific restrictions here.

[0087] According to another embodiment of the present disclosure, an electronic product is provided. The electronic product includes the sensor described in the embodiment of the present disclosure.

[0088] Specifically, the sensor in the embodiment of the present disclosure is disposed in the electronic product body, so that the electronic product has higher sensitivity and reliability.

[0089] The sensor may be a MEMS (Micro-Electro-Mechanical Systems) microphone, a pressure sensing sensor, an airflow sensing sensor, etc. The electronic product may be a mobile phone, a tablet computer, a camera, or a smart toy, etc.

[0090] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0091] Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art will understand that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. Those skilled in the art will understand that the above embodiments may be modified without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. A sensor, characterized in that: include: A substrate (1), wherein the substrate (1) is provided with a first through hole (11); a back electrode (2), the back electrode (2) being provided with a second through hole (21), the back electrode (2) being connected to the substrate (1) via an insulating layer (3), and forming an accommodating cavity (6) between the back electrode (2) and the substrate (1); a diaphragm (4), the diaphragm (4) being arranged in the accommodating cavity (6), the diaphragm (4) being capable of dividing the accommodating cavity (6) into a first chamber (61) communicating with the first through hole (11) and a second chamber (62) communicating with the second through hole (21); the diaphragm (4) comprising a fixed region (41) and a vibrating region (42), the fixed region (41) being connected to the insulating layer (3); A reinforcing rib (5), the reinforcing rib (5) comprising a first end (51) and a second end (52), the first end (51) being fixed between the fixing region (41) and the insulating layer (3), and the second end (52) being fixed to the vibration region (42).

2. The sensor according to claim 1, characterized in that The reinforcing rib (5) is in the shape of at least one of a strip, a ring, a triangle, a rounded rectangle and a serpentine.

3. The sensor according to claim 1, wherein The diaphragm (4) and the reinforcing rib (5) are an integrated structure; Alternatively, the diaphragm (4) includes a groove (43), and the reinforcing rib (5) is arranged in the groove (43).

4. The sensor according to claim 1, characterized in that The material of the diaphragm (4) is Si, and the material of the reinforcing rib (5) is Si, SiO2 and SiN X At least one of .

5. The sensor according to claim 1, wherein The width of the reinforcing rib (5) ranges from 0.1 μm to 10 μm.

6. The sensor according to claim 1, characterized in that It comprises a plurality of reinforcing ribs (5), wherein the plurality of reinforcing ribs (5) are arranged at intervals along a first direction on the diaphragm (4), or the plurality of reinforcing ribs (5) are arranged at intervals along a second direction on the diaphragm (4); The first direction and the second direction are two intersecting directions.

7. The sensor according to claim 1, characterized in that The thickness of the diaphragm (4) ranges from 0.1 μm to 20 μm.

8. The sensor according to claim 1, wherein The vibration region (42) comprises a protrusion (421), and the protrusion (421) is arranged on a side of the vibration region (42) facing the substrate (1).

9. The sensor according to claim 1, characterized in that The material of the insulating layer (3) includes SiO2.

10. An electronic product, characterized in that: The sensor comprises the sensor according to any one of claims 1 to 9.

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