Vapor chamber and electronic device

Abstract

The present application provides a vapor chamber and an electronic device. The vapor chamber comprises a first cover plate, a second cover plate, a capillary structure, a cooling medium, and a first conductive member. The first cover plate comprises a first conductive layer, a first insulating layer, and a second conductive layer; the first insulating layer is connected between the first conductive layer and the second conductive layer; and the second conductive layer is located on the side of the first insulating layer close to the second cover plate. A part of the first conductive member is connected to the first conductive layer; the other part of the first conductive member is connected to the second cover plate; and the first conductive layer is electrically connected to the surface of the second cover plate distant from an accommodating cavity by means of the first conductive member. When the vapor chamber is applied to an electronic device, regardless of whether an electrical connector of the electronic device is electrically connected to the top surface or the bottom surface of the vapor chamber, the other electrical connector can be electrically connected to the grounding position on the vapor chamber by means of the first conductive member, so as to guarantee good grounding reliability of the top surface and the bottom surface of the vapor chamber, thereby achieving low risk of RSE in the electronic device.

Description

Vapor chamber and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on April 3, 2024, with application number: 202410405001.8, and priority to the Chinese patent application entitled “Heat Diffusion Plate and Electronic Device”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of heat dissipation technology, and in particular to a temperature vapor chamber and an electronic device. Background Art

[0003] As electronic devices such as mobile phones, tablets, and computers become increasingly miniaturized, the integration of electronic components continues to increase, leading to a sharp increase in the heat generated by these devices. To prevent excessive heat generation from affecting the performance of electronic devices, vapor chambers are often used in electronic devices to dissipate heat from electronic components.

[0004] Driven by the demand for lightweight electronic devices, the cover of the temperature vapor chamber adopts a laminated structure of metal layer-organic insulating layer-metal layer, replacing part of the metal material with organic insulating material to reduce the mass of the temperature vapor chamber. The addition of the organic insulating layer results in insulation between the upper and lower surfaces of the temperature vapor chamber. The upper and lower surfaces of the temperature vapor chamber are both made of metal materials. During the use of electronic devices, the screen or other charged structures inside the electronic device may cause unstable electrical conduction between the upper and / or lower surfaces of the temperature vapor chamber due to external forces, thereby generating radiated spurious emission (RSE) signals at the contact point, affecting the wireless communication signals of the electronic device. Summary of the Invention

[0005] The present application provides a temperature vapor chamber and an electronic device.

[0006] In the first aspect, an embodiment of the present application provides a temperature equalizing plate. The temperature equalizing plate includes a first cover plate, a second cover plate, a capillary structure, a cooling medium and a first conductive member. The second cover plate includes an effective area and a sealing area. The sealing area connects the periphery of the effective area. A portion of the first cover plate is fixed to the sealing area of ​​the second cover plate, and a portion is spaced apart from the effective area of ​​the second cover plate to enclose a receiving cavity. The capillary structure and the cooling medium are located in the receiving cavity. The first cover plate includes a first conductive layer, a first insulating layer and a second conductive layer. The first insulating layer is connected between the first conductive layer and the second conductive layer, and the second conductive layer is located on the side of the first insulating layer close to the second cover plate. A portion of the first conductive member is connected to the first conductive layer, and a portion is connected to the second cover plate. The first conductive layer is electrically connected to the surface of the second cover plate away from the receiving cavity through the first conductive member.

[0007] It is understood that the temperature vapor chamber may include a top surface and a bottom surface disposed opposite each other. The surface of the first conductive layer facing away from the accommodating cavity may be the top surface of the temperature vapor chamber, and the surface of the second cover plate facing away from the accommodating cavity may be the bottom surface of the temperature vapor chamber. Alternatively, the surface of the first conductive layer facing away from the accommodating cavity may be the bottom surface of the temperature vapor chamber, and the surface of the second cover plate facing away from the accommodating cavity may be the top surface of the temperature vapor chamber.

[0008] The first conductive layer is electrically connected to the surface of the second cover plate away from the accommodating cavity through the first conductive member, thereby achieving electrical conduction between the top and bottom surfaces of the temperature vapor chamber. When the temperature vapor chamber is used to dissipate heat within an electronic device, if unstable electrical conduction occurs between the screen of the electronic device or other electrically charged structures within the electronic device and the top and / or bottom surfaces of the temperature vapor chamber, the other electrical connector of the electronic device, whether electrically connected to the top or bottom surface of the temperature vapor chamber, can be electrically connected to a grounding position on the temperature vapor chamber through the first conductive member to ensure better grounding reliability of the top and bottom surfaces of the temperature vapor chamber.

[0009] In some possible embodiments, the second cover plate includes a stacked third conductive layer and a second insulating layer, with the second insulating layer located on a side of the third conductive layer proximal to the second conductive layer. A portion of the first conductive member is secured to the first conductive layer, and a portion is secured to the third conductive layer, with the first conductive layer being electrically connected to the third conductive layer via the first conductive member.

[0010] It is understood that the second insulating layer can be made of an organic polymer material. Compared to the solution where the second cover is made entirely of a metal conductive material, using a polymer insulating material to make the first insulating layer instead of a portion of the metal layer can reduce the average density of the second cover, which is beneficial for reducing the overall mass of the temperature equalizer.

[0011] In some possible embodiments, the first conductive member and the first conductive layer are integrally formed structural members. The two components being formed into an integrated structural member by an integral molding process means that during the process of forming one of the two components, the component is immediately connected to the other component, without requiring further processing (such as bonding, welding, snap-fit ​​connection, or screw connection) to connect the two components together.

[0012] It is understandable that, compared with providing an external independent conductive member, the connection strength between the first conductive member and the first conductive layer is better, which can simplify the preparation steps of the temperature vapor chamber.

[0013] In some possible implementations, a portion of the first conductive member is fixed to a side surface of the first conductive layer, and a portion is fixed to a side surface of the third conductive layer. Alternatively, a portion of the first conductive member is fixed to a side surface of the first conductive layer, and a portion is fixed to a surface of the third conductive layer away from the accommodating cavity.

[0014] It is understandable that the first conductive member is fixed to the side surfaces of the first conductive layer and the third conductive layer, which does not increase the thickness of the temperature vapor chamber, is conducive to thinning the temperature vapor chamber, and can be applied to electronic devices with smaller thickness.

[0015] A portion of the first conductive member is fixed to the side of the first conductive layer, and a portion is fixed to the surface of the third conductive layer away from the accommodating cavity. The connection area between the first conductive member and the second cover plate can be larger, the connection difficulty is reduced, and the electrical connection reliability is better.

[0016] In some possible implementations, the temperature vapor chamber further includes a second conductive member, a portion of the second conductive member is fixed to the third conductive layer, and a portion of the second conductive member is fixed to the first conductive member, and the first conductive layer is electrically connected to the third conductive layer via the first conductive member and the second conductive member.

[0017] It is understandable that the first conductive layer can be electrically connected to the third conductive layer of the second cover plate through the first conductive member and the second conductive member, thereby achieving electrical conduction between the top surface and the bottom surface of the temperature homogenizing plate.

[0018] In some possible implementations, the second conductive member and the third conductive layer are integrally formed structural members.

[0019] In this way, the connection strength between the second conductive member and the third conductive layer is better, which can simplify the preparation steps of the temperature vapor chamber.

[0020] In some possible implementations, the first conductive member and the second conductive member are arranged along a first direction, where the first direction is the direction from the second cover plate to the first cover plate. Alternatively, a portion of the second conductive member is fixed to a side of the first conductive member away from the accommodating cavity. Alternatively, a portion of the first conductive member is fixed to a side of the second conductive member away from the accommodating cavity.

[0021] It can be understood that the first conductive member and the second conductive member are arranged along the first direction, which is consistent with the stacking direction of the first conductive layer and the third conductive layer. When the first conductive member and the second conductive member are prepared by an integrated molding process, the plate materials for preparing the first cover plate and the second cover plate can be directly processed by pressing or cutting to remove the insulating layer therein, so as to achieve the fixation and electrical conduction of the first conductive member and the second conductive member, and the process is relatively simple.

[0022] A portion of the second conductive member is connected to the outer side surface of the first conductive member, or a portion of the first conductive member is connected to the outer side surface of the second conductive member. There is no need to align the end faces of the two parts. The process is simple, the preparation difficulty is low, and the product yield is high. In addition, the upper limit of the connection area between the second conductive member and the first conductive member can be set larger. For example, in the Z-axis direction, the maximum length of the connection area between the second conductive member and the first conductive member can reach the sum of the thickness of the first conductive layer, the thickness of the second conductive layer, the thickness of the first insulating layer, the thickness of the fourth conductive layer, and the thickness of the second insulating layer. The outer side surface of the first conductive member refers to the surface of the first conductive member away from the accommodating cavity. The outer side surface of the second conductive member refers to the surface of the second conductive member away from the accommodating cavity.

[0023] In some possible implementations, the second cover plate further includes a fourth conductive layer, which is stacked on the second insulating layer and is located on a side of the second insulating layer close to the accommodating cavity.

[0024] It is understood that the second cover plate adopts a three-layer structure with two conductive layers and an insulating layer sandwiched between them, and the fourth conductive layer contacts the cooling medium. This prevents the second insulating layer from directly contacting the cooling medium and generating gas, and improves the sealing reliability between the first and second cover plates.

[0025] In some possible implementations, the temperature vapor chamber further includes a third conductive member fixed between the first conductive member and the second conductive member, and the first conductive layer is electrically connected to the third conductive layer through the first conductive member, the third conductive member, and the second conductive member.

[0026] Alternatively, the temperature vapor chamber further includes a fourth conductive member fixed between the first conductive member and the second conductive member, and the first conductive layer is electrically connected to the third conductive layer through the first conductive member, the fourth conductive member, and the second conductive member.

[0027] Alternatively, the temperature equilibrium plate also includes a third conductive member and a fourth conductive member, the first conductive member, the third conductive member, the fourth conductive member and the second conductive member are arranged along the first direction, the third conductive member is fixed between the fourth conductive member and the first conductive layer, the fourth conductive member is fixed between the third conductive member and the second conductive member, the first conductive layer is electrically connected to the third conductive layer through the first conductive member, the third conductive member, the fourth conductive member and the second conductive member, and the first direction is the direction in which the second cover plate points to the first cover plate.

[0028] It is understandable that the temperature equalizing plate may further include a third conductive member and / or a fourth conductive member. By adding more conductive members, the conductive structure becomes stronger, and the stacking of multiple layers of conductive members can further seal the accommodating cavity of the temperature equalizing plate.

[0029] In some possible implementations, the third conductive member and the second conductive layer are an integrally formed structural member, and / or the fourth conductive member and the fourth conductive layer are an integrally formed structural member.

[0030] It is understandable that the connection strength between the third conductive element and the second conductive layer is better, and / or the connection strength between the fourth conductive element and the fourth conductive layer is better.

[0031] In some possible implementations, a portion of the first conductive element is fixed to the first conductive layer and a portion is fixed to the second conductive layer; a portion of the second conductive element is fixed to the third conductive layer and a portion is fixed to the fourth conductive layer.

[0032] The second conductive layer is electrically connected to the fourth conductive layer, and the first conductive layer is electrically connected to the third conductive layer through the first conductive member, the second conductive layer, the fourth conductive layer, and the second conductive member.

[0033] It is understandable that the first conductive member and the second conductive member may not be directly connected, but may be indirectly connected via some conductive layers in the first cover plate and the second cover plate. This can omit the step of fixing the first conductive member and the second conductive member, simplifying the assembly process.

[0034] In some possible embodiments, the projection of the first conductive member along the first direction on the reference plane and the projection of the second conductive member along the first direction on the reference plane are at least partially offset, the reference plane is the plane where the first conductive layer is located, and the first direction is the direction from the second cover plate to the first cover plate.

[0035] Alternatively, the first conductive member and the second conductive member are spaced apart from each other.

[0036] It is understood that the first and second conductive members may not be directly connected, but rather indirectly electrically connected via conductive layers within the first and second cover plates. During assembly of the first and second cover plates, the first and second conductive members do not require precise alignment to achieve a secure and electrical connection, resulting in lower assembly precision requirements and reduced difficulty.

[0037] In some possible implementations, the first conductive component is an independent structural component.

[0038] It is understood that the independent structural member means that the process of preparing the first conductive member is a separate process. The process of connecting the first conductive member to the second cover plate or the first conductive layer is simple and has a lower process cost.

[0039] In some possible implementations, a portion of the first conductive element is fixed to a side surface of the first conductive layer, and a portion of the first conductive element is fixed to a side surface of the third conductive layer.

[0040] It is understandable that the first conductive member is fixed to the side surface of the first conductive layer and the side surface of the third conductive layer, which does not increase the thickness of the temperature vapor chamber, and is conducive to thinning the temperature vapor chamber.

[0041] In some possible implementations, a portion of the first conductive member is fixed to the surface of the first conductive layer away from the accommodation cavity, and a portion is fixed to the side surface of the third conductive layer. Alternatively, a portion of the first conductive member is fixed to the side surface of the first conductive layer, and a portion is fixed to the surface of the third conductive layer away from the accommodation cavity. Alternatively, a portion of the first conductive member is fixed to the surface of the first conductive layer away from the accommodation cavity, and a portion is fixed to the surface of the third conductive layer away from the accommodation cavity.

[0042] It is understandable that the surface of the first conductive layer away from the accommodating cavity can be the top surface of the temperature equalizing plate. The surface of the third conductive layer away from the accommodating cavity can be the bottom surface of the temperature equalizing plate. At least a portion of the first conductive member is fixed to the top surface of the temperature equalizing plate, and / or fixed to the bottom surface of the temperature equalizing plate. In this embodiment, the electrical connection area between the first conductive member and the first conductive layer, or the first conductive member and the second cover plate is less limited. The connection area between the first conductive member and the first conductive layer and the second cover plate can be set larger, the process is simpler, and the electrical connection reliability is better.

[0043] In some possible embodiments, the first conductive member includes a first sub-section and a second sub-section. A portion of the first sub-section is fixed to a surface of the first conductive layer away from the first insulating layer, and a portion of the first sub-section is fixed to the second sub-section. A portion of the second sub-section is fixed to a surface of the third conductive layer away from the second insulating layer. The first sub-section and the second sub-section are two independent structural members, or the first sub-section and the second sub-section are integrally formed structural members.

[0044] It is understood that the first conductive member may have a protruding free end (i.e., the portion where the first and second portions are connected). When the vapor chamber is installed in an electronic device, this free end can be made longer to directly connect to the midframe or screen to achieve an electrical connection. In other words, if the free end of the first conductive member is long enough, the vapor chamber can be electrically connected to the screen or the midframe at a distance from the vapor chamber.

[0045] In some possible embodiments, the first cover plate has a first through-hole extending through the first conductive layer, the first insulating layer, and the second conductive layer. The second cover plate has a second through-hole in the edge-sealed area extending through the second insulating layer and the third conductive layer. The first through-hole and the accommodating cavity are spaced apart, and the first through-hole communicates with the second through-hole. A first conductive member is partially located within the first through-hole and partially located within the second through-hole. One end of the first conductive member is fixed to the first conductive layer, and the other end is fixed to the third conductive layer. The first conductive layer is electrically connected to the third conductive layer via the first conductive member.

[0046] It can be understood that by setting the through holes, the first conductive member is located in the first through hole and the second through hole, the first conductive member is not easy to fall out of the first through hole and the second through hole, and the electrical connection reliability between the first conductive layer and the second cover plate is better.

[0047] In some possible embodiments, the first cover plate is provided with a first through hole, which passes through the first conductive layer and the first insulating layer, and the second cover plate is provided with a second through hole in the edge sealing area, which passes through the second insulating layer and the third conductive layer. The projection of the first through hole along the first direction on the reference plane and the projection of the second through hole along the first direction on the reference plane are staggered, and the second conductive layer is exposed in the second through hole. The reference plane is the plane where the first conductive layer is located, and the first direction is the direction from the second cover plate to the first cover plate. The temperature equalizing plate also includes a fifth conductive member, the first conductive member is located in the first through hole, one end of the first conductive member is fixed to the first conductive layer, and the other end is fixed to the second conductive layer, the fifth conductive member is located in the second through hole, one end of the fifth conductive member is fixed to the second conductive layer, and the other end is fixed to the third conductive layer. The first conductive layer is electrically connected to the third conductive layer via the first conductive member, the second conductive layer, and the fifth conductive member.

[0048] It can be understood that when the positions of the first through hole and the second through hole are selectively set, the electrical conduction between the first conductive layer 1 and the third conductive layer 1 can be achieved with the help of the conductive layer of the first cover plate 1 and / or the second cover plate itself, and the layers that the first through hole and the second through hole respectively penetrate can be selected according to actual conditions.

[0049] The projection of the first through hole along the first direction on the reference plane is staggered with the projection of the second through hole along the first direction on the reference plane. When the first cover plate 1 and the second cover plate are assembled, the assembly precision requirement is relatively low.

[0050] In some possible implementations, the second cover plate is made of conductive material.

[0051] It is understood that the second cover plate may be made of a conductive material, including: the second cover plate may be entirely made of a single conductive material, or the second cover plate may include multiple layers of conductive material. When the first conductive member needs to be electrically connected to the surface of the receiving cavity of the second cover plate, the first conductive member can be fixed to any position on the second cover plate to achieve electrical connection with the second cover plate.

[0052] In some possible embodiments, the first cover plate has a first through hole extending through the first conductive layer, the first insulating layer, and the second conductive layer. The first through hole and the accommodating cavity are spaced apart, and the second cover plate is exposed within the first through hole. A first conductive member is positioned within the first through hole, with one end of the first conductive member fixed to the first conductive layer and the other end fixed to the second cover plate.

[0053] It is understandable that the second cover plate may not be provided with the second through hole. The first conductive layer may be electrically connected to the second cover plate via the first conductive member and the second conductive layer.

[0054] In some possible embodiments, the first cover plate has a first through hole extending through the first conductive layer and the first insulating layer, the first through hole and the accommodating cavity being spaced apart, and the second conductive layer being exposed within the first through hole. A first conductive member is positioned within the first through hole, one end of the first conductive member being fixed to and electrically connected to the first conductive layer, and the other end of the first conductive member being fixed to and electrically connected to the second conductive layer, which is then electrically connected to the second cover plate.

[0055] In this way, the first conductive layer can be electrically connected to the second cover plate via the first conductive member and the second conductive layer.

[0056] In some possible implementations, the first conductive member is a solid structure, so that the first conductive member has better strength and the electrical connection between the first conductive layer and the second cover plate is more stable.

[0057] In some possible implementations, the first conductive member is a hollow structure, which reduces the material cost and weight of the first conductive member, thereby facilitating lightweighting of the vapor chamber.

[0058] In some possible embodiments, the second cover includes a top surface, a bottom surface, and side surfaces, the bottom surface and the top surface are arranged opposite to each other, the side surfaces are connected between the top surface and the bottom surface, and the top surface faces the accommodating cavity. The first conductive layer includes a first portion, a second portion, and a third portion, and the first insulating layer includes a first portion, a second portion, and a third portion. The first portion of the first insulating layer is arranged opposite to the top surface, the first portion of the first conductive layer is located on a side of the first portion of the first insulating layer away from the top surface, the second portion of the first insulating layer is arranged opposite to the side surface, the second portion of the first conductive layer is located on a side of the second portion of the first insulating layer away from the side surface, the third portion of the first insulating layer is arranged opposite to the bottom surface, and the third portion of the first conductive layer is located on a side of the third portion of the first insulating layer away from the bottom surface. A portion of the first conductive member is fixed to the third portion of the first conductive layer, and a portion is fixed to the bottom surface of the second cover, and the first conductive layer is electrically connected to the bottom surface of the second cover via the first conductive member.

[0059] It can be understood that when the temperature equilibrium plate is installed on an electronic device, the side surface of the second cover plate away from the second conductive layer can be fixed to the middle frame. At this time, the first conductive part can be located between the middle frame and the second cover plate. During the use of the electronic device, the first conductive part is not easy to fall off due to the electronic device being dropped, bumped, squeezed, etc., and has better electrical connection reliability.

[0060] In a second aspect, an embodiment of the present application provides an electronic device, which includes a support member and a temperature vapor chamber, wherein the temperature vapor chamber is mounted on the support member.

[0061] It is understandable that when an electronic device is in use and unstable electrical conduction occurs between the screen or other electrically charged structures inside the electronic device and the top and / or bottom surfaces of the temperature vapor chamber, the electrical connector of the electronic device, whether electrically connected to the top or bottom surfaces of the temperature vapor chamber, can have the other one electrically connected to the ground position on the temperature vapor chamber through the first conductive member to ensure that both the top and bottom surfaces of the temperature vapor chamber can be stably grounded, thereby reducing the risk of radiated spurious emission (RSE) signals, and the wireless communication signal of the electronic device is better.

[0062] In some possible implementations, the electronic device further includes a screen and a housing, the screen is mounted on the housing and forms a receiving space with the housing, and the temperature vapor chamber is mounted in the receiving space. The support member is the screen or the housing.

[0063] It is understandable that the position of the temperature vapor chamber inside the electronic device can be set according to the arrangement requirements of the components.

[0064] In some possible implementations, the shell includes a middle frame and a back cover, the middle frame is connected between the screen and the back cover, the screen, the middle frame and the back cover enclose a receiving space, and the supporting member is the middle frame or the back cover.

[0065] It is understood that the location of the vapor chamber inside the electronic device can be set according to the layout requirements of the components. The ground terminal of the electronic device is generally the middle frame. When the vapor chamber is installed in the middle frame or the back cover, the vapor chamber is conveniently grounded.

[0066] In some possible implementations, the first conductive member of the temperature vapor chamber is fixed to the middle frame and electrically connected to the middle frame.

[0067] It is understandable that, by electrically connecting the middle frame via the first conductive member, there is no need to provide an additional electrical connection structure between the temperature vapor chamber and the middle frame. In addition, the first conductive member of the temperature vapor chamber can also be used to strengthen the connection between the temperature vapor chamber and the middle frame.

[0068] In some possible implementations, the electronic device further includes a first electrical connector, a portion of which is fixed to the temperature vapor chamber and electrically connected to the first conductive layer of the temperature vapor chamber, and a portion of which is fixed to the middle frame and electrically connected to the middle frame.

[0069] It is understandable that when the backing adhesive is an insulating material, a first electrical connector can be provided so that the second cover plate and the first conductive layer of the temperature equalizer can be electrically connected to the middle frame through the first electrical connector. For example, the first electrical connector is electrically connected to the first conductive layer of the temperature equalizer. The bottom surface of the temperature equalizer can be electrically connected to the first conductive layer through the first conductive member, and further grounded through the first electrical connector. The first conductive layer can be directly grounded through the first electrical connector. Therefore, when the top or bottom surface of the temperature equalizer makes unstable electrical contact with the charged device inside the electronic device, the current can be grounded along the first electrical connector.

[0070] In some possible implementations, the temperature vapor chamber has an extended area, a gap is defined between a bottom surface of the extended area and the middle frame, and the first electrical connector is at least partially located within the gap.

[0071] It is understandable that the first electrical connector is not easy to fall off from the middle frame or the temperature homogenizing plate.

[0072] In some possible implementations, the first electrical connector is a conductive paste, a conductive adhesive, a conductive foam, or a metal sheet.

[0073] In a third aspect, embodiments of the present application provide an electronic device. The electronic device includes a housing, a screen, a temperature vapor chamber, and an electrical connection structure. The screen is connected to the housing and encloses a storage space. The temperature vapor chamber and the electrical connection structure are both installed in the storage space. One end of the electrical connection structure is connected to the temperature vapor chamber, and the other end is connected to the housing or the screen.

[0074] The temperature equalizing plate includes a first cover plate, a second cover plate, a capillary structure and a cooling medium. The second cover plate includes an effective area and a sealing edge area. The sealing edge area is connected to the periphery of the effective area. A portion of the first cover plate is fixed to the sealing edge area of ​​the second cover plate, and a portion is spaced apart from the effective area of ​​the second cover plate to enclose a receiving cavity. The capillary structure and the cooling medium are located in the receiving cavity.

[0075] The first cover plate includes a first conductive layer, a first insulating layer and a second conductive layer. The first insulating layer is connected between the first conductive layer and the second conductive layer. The second conductive layer is located on a side of the first insulating layer close to the second cover plate.

[0076] The second cover plate is made of conductive material, a portion of the electrical connection structure is electrically connected to the first conductive layer and the second cover plate, and a portion is electrically connected to the ground terminal of the electronic device.

[0077] Alternatively, the second cover plate includes a third conductive layer and a second insulating layer stacked together, the second insulating layer is located on a side of the third conductive layer close to the second conductive layer, a portion of the electrical connection structure electrically connects the first conductive layer and the third conductive layer, and a portion electrically connects the ground terminal of the electronic device.

[0078] It can be understood that by setting up an electrical connection structure, when unstable electrical conduction occurs between the screen or other charged structures inside the electronic device and the top and / or bottom surfaces of the temperature vapor chamber during use of the electronic device, the top and bottom surfaces of the temperature vapor chamber can be grounded through the electrical connection structure, thereby reducing the risk of radiated spurious emission (RSE) signals, and the wireless communication signal of the electronic device is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0079] In order to illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0080] FIG1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0081] FIG2 is a partially exploded view of one embodiment of the electronic device shown in FIG1 ;

[0082] FIG3 is a partial structural diagram of an embodiment of the electronic device shown in FIG1 on line AA;

[0083] FIG4 is a partial cross-sectional view of an embodiment of the temperature vapor chamber shown in FIG3 at another angle;

[0084] FIG5 is an enlarged schematic diagram of an embodiment of the structure shown in FIG4 at position B;

[0085] FIG6 a is a schematic diagram of an embodiment of the vapor chamber shown in FIG4 at another angle;

[0086] FIG6 b is a schematic diagram of another embodiment of the vapor chamber shown in FIG4 at another angle;

[0087] FIG7 a is a schematic structural diagram of another embodiment of the structure shown in FIG4 ;

[0088] FIG7b is a schematic structural diagram of an embodiment of the structure shown in FIG7a at another angle;

[0089] FIG8 is a partial cross-sectional view of an embodiment of the vapor chamber shown in FIG3 ;

[0090] FIG9 is a schematic structural diagram of another embodiment of the structure shown in FIG4 at position B;

[0091] FIG10 is a schematic structural diagram of another embodiment of the structure shown in FIG4 at position B;

[0092] FIG11 is a schematic structural diagram of another embodiment of the structure shown in FIG4 at position B;

[0093] FIG12 is a schematic structural diagram of another embodiment of the structure shown in FIG4 at position B;

[0094] FIG13 is a schematic structural diagram of another embodiment of the structure shown in FIG12 ;

[0095] FIG14 is a schematic structural diagram of another embodiment of the structure shown in FIG4 at position B;

[0096] FIG15 is a schematic structural diagram of another embodiment of the structure shown in FIG14 ;

[0097] FIG16 is a schematic structural diagram of another embodiment of the structure shown in FIG14 ;

[0098] FIG17 is a schematic structural diagram of another embodiment of the structure shown in FIG16 ;

[0099] FIG18 is a schematic structural diagram of another embodiment of the structure shown in FIG14 ;

[0100] FIG19 is a schematic structural diagram of yet another embodiment of the structure shown in FIG18 ;

[0101] FIG20 is a schematic structural diagram of yet another embodiment of the structure shown in FIG18 ;

[0102] FIG21 is a schematic structural diagram of another embodiment of the structure shown in FIG19 ;

[0103] FIG22 is a schematic structural diagram of yet another embodiment of the structure shown in FIG14;

[0104] FIG23a is a schematic structural diagram of the temperature vapor chamber shown in FIG14 to FIG22 at another angle;

[0105] FIG23 b is a schematic structural diagram of another embodiment of the structure shown in FIG23 a ;

[0106] FIG24a is a schematic structural diagram of yet another embodiment of the structure shown in FIG4 ;

[0107] FIG24b is a schematic structural diagram of an embodiment of the structure shown in FIG24a at another angle;

[0108] FIG25 is a schematic structural diagram of another embodiment of the structure shown in FIG4 at position B;

[0109] FIG26 is a schematic diagram of an assembly of the middle frame and the vapor chamber shown in FIG2 according to an embodiment;

[0110] FIG27 a is a partial cross-sectional view of an embodiment of the structure shown in FIG26 at section line CC;

[0111] FIG27 b is an enlarged schematic diagram of an embodiment of the structure shown in FIG27 a at position D;

[0112] FIG28 is a schematic diagram of electrical connections between the middle frame and the vapor chamber shown in FIG2 according to another embodiment;

[0113] FIG29 is a schematic diagram of electrical connections between the middle frame and the vapor chamber shown in FIG2 in another embodiment;

[0114] FIG30 is a schematic diagram of electrical connections between the middle frame and the vapor chamber shown in FIG2 according to another embodiment;

[0115] FIG31 is a partial structural diagram of another embodiment of the electronic device shown in FIG1 taken along line AA;

[0116] FIG32 is an enlarged schematic diagram of an embodiment of the structure shown in FIG31 at position E;

[0117] FIG33 is an enlarged schematic diagram of another embodiment of the structure shown in FIG31 at position E;

[0118] FIG34 is an enlarged schematic diagram of yet another embodiment of the structure shown in FIG31 at position E. FIG34 is a schematic diagram of an enlarged schematic diagram of yet another embodiment of the structure shown in FIG31 at position E. DETAILED DESCRIPTION

[0119] The embodiments of the present application are described below in conjunction with the accompanying drawings. The embodiments described herein with reference to the accompanying drawings are exemplary and intended to be used to explain the present application, and should not be understood as limiting the present application.

[0120] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. It should be understood that in the present application, "electrical connection" can be understood as the physical contact and electrical conduction of components; it can also be understood as the form in which different components in the circuit structure are connected through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals. "Connection" and "connected" can both refer to a mechanical connection relationship or a physical connection relationship. For example, A and B are connected or A and B are connected, which means that there is a fastening component (such as glue, welding layer, screws, bolts, rivets, etc.) between A and B, or A and B are in contact with each other and A and B are difficult to separate.

[0121] Furthermore, the word "fixed" in this article should also be understood in a broad sense. For example, "fixed" can be directly fixed or indirectly fixed through an intermediate medium. Among them, "fixed" means connected to each other and the relative position relationship after connection remains unchanged. The directional terms mentioned in the embodiments of the present application, such as "upper", "lower", etc., are only reference to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. "Multiple" refers to two or more than two.

[0122] In the description of the embodiments of the present application, unless otherwise specified, “ / ” means or, for example, A / B can mean A or B; “and / or” in the text is merely a description of the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, “multiple” refers to two or more than two.

[0123] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first," "second," "third," or "fourth" may explicitly or implicitly include one or more of the features.

[0124] In addition, in the embodiments of the present application, the limitations of the relative position relationship mentioned, such as parallel, perpendicular, aligned, etc., are all for the current state of the art, rather than absolutely strict limitations, and a small amount of deviation is allowed, and it is possible to be approximately parallel, approximately perpendicular, approximately aligned, etc. For example, A and B are parallel, which means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 degrees and 10 degrees. For example, A and B are perpendicular, which means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 degrees and 100 degrees.

[0125] Figure 1 is a schematic diagram of the structure of an embodiment of an electronic device 1000 provided in an embodiment of the present application. Figure 2 is a partial exploded view of an embodiment of the electronic device 1000 shown in Figure 1. Figure 3 is a partial structural diagram of an embodiment of the electronic device 1000 shown in Figure 1 taken along line AA.

[0126] The electronic device 1000 may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, an in-vehicle device, a video surveillance device, a wearable device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, or a VR helmet. It is understood that the electronic device 1000 may be any electronic device 1000 that has heat dissipation requirements. The electronic device 1000 of the embodiment shown in FIG1 is described using a mobile phone as an example.

[0127] Exemplarily, the electronic device 1000 may include a temperature vapor chamber 100, a heating device 200, a housing 300 and a screen 400. The screen 400 is mounted on the housing 300. The housing 300 and the screen 400 together enclose a storage space 1001 inside the electronic device 1000. The temperature vapor chamber 100 and the heating device 200 are both mounted in the storage space 1001 of the electronic device 1000. It should be noted that Figures 1, 2, 3 and related figures below only schematically illustrate some components included in the electronic device 1000, and the actual shape, actual size, actual position and actual structure of these components are not limited to Figures 1, 2, 3 and the figures below. In other embodiments, when the electronic device 1000 is a device of some other form, the electronic device 1000 may also not include the screen 400.

[0128] Screen 400 can be used to display images, videos, etc., and the touch sensing function of screen 400 is used to sense the user's touch actions to achieve human-computer interaction. Exemplarily, screen 400 can be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode or active-matrix organic light-emitting diode (AMOLED) display, a flexible light-emitting diode (FLED) screen 400, a Mini-LED display, a Micro-LED display, a Micro-OLED display, a quantum dot light-emitting diode (QLED) display, etc. Screen 400 can be a flat screen or a curved screen. Screen 400 can also be a flexible screen.

[0129] The housing 300 can be used to protect the internal components (e.g., the heating component 200) of the electronic device 1000. For example, the housing 300 can include a middle frame 310 and a back cover 320. The back cover 320 is fixedly connected to the middle frame 310. For example, the back cover 320 can be fixedly connected to the middle frame 310 by adhesive. The back cover 320 can also be integrally molded with the middle frame 310, that is, the back cover 320 and the middle frame 310 are a single integral structure.

[0130] The back cover 320 can be made of metal, glass, plastic, or ceramic. The back cover 320 and the middle frame 310 can also be connected by bonding, welding, snap connection, screw connection, etc.

[0131] The screen 400 can be located on the side of the middle frame 310 away from the back cover 320. In this case, the screen 400 and the back cover 320 are located on either side of the middle frame 310. The screen 400, the frame, and the back cover 320 together enclose the storage space 1001 of the electronic device 1000. For example, the middle frame 310 divides the storage space 1001 of the electronic device 1000 into a first space 1002 and a second space 1003. The middle frame 310 and the screen 400 enclose the first space 1002. The middle frame 310 and the back cover 320 enclose the second space 1003.

[0132] In some embodiments, the housing space 1001 of the electronic device 1000 may also accommodate components such as a camera module 800, a circuit board 500, a battery 700, a speaker, or a microphone. The circuit board 500 may be a flexible or rigid circuit board. Power components such as a chip 600, resistors, and capacitors may be mounted on the circuit board 500. The circuit board 500, battery 700, and speaker or microphone components may be installed in the first space 1002 and the second space 1003, respectively, as needed.

[0133] Exemplarily, the heating device 200 can be a chip 600 on the circuit board 500. The chip 600 can be a processing chip 600, a memory chip 600, etc. Of course, in some other embodiments, the heating device 200 can also be other power devices in the electronic device 1000. For example, a power amplifier, a power management unit (PMU), a power management unit, and a thermal management unit. It can be understood that any device that generates heat when the electronic device 1000 is running can be a heating device 200. In addition, the number of heating devices 200 in the electronic device 1000 can be one, or two or more. When the number of heating devices 200 is two or more, at least some of the heating devices 200 can be of the same type, for example, there can be two processing chips 600, or two memory chips 600.

[0134] When the heating device 200 is working, heat is generated. The temperature at the location of the heating device 200 in the electronic device 1000 is high, resulting in a serious problem of local heating in the electronic device 1000. The temperature plate 100 is used to transfer the heat generated by the heating device 200 when it is working to other locations in the electronic device 1000 with lower temperatures. In some embodiments, after the temperature plate 100 transfers the heat to other locations with lower temperatures, the heat can be dissipated to the external space of the electronic device 1000 along the housing 300 and / or the screen 400. In other embodiments, the temperature plate 100 can also be called a vapor chamber (VC), a heat spreader, a heat conducting plate, etc.

[0135] In order to enable the temperature vapor chamber 100 to transfer the heat at the location of the heating device 200 to other locations with lower temperatures more quickly, the heating device 200 should be arranged around the temperature vapor chamber 100. For example, the heating device 200 can be directly connected to the temperature vapor chamber 100, or a heat-conducting structure can be provided between the heating device 200 and the temperature vapor chamber 100 to conduct the heat generated by the heating device 200 to the temperature vapor chamber 100. It can be understood that the heating device 200 can be located in the first space 1002 or in the second space 1003. When the electronic device 1000 includes multiple heating devices 200, some of the heating devices 200 can be located in the first space 1002, and other heating devices 200 can be located in the second space 1003.

[0136] Exemplarily, the heating device 200 is a chip 600, and the chip 600 is mounted on the circuit board 500. At this time, the electronic device 1000 may also include a battery 700. The chip 600, the circuit board 500 and the battery 700 can all be installed in the second space 1003. The chip 600 is fixed to the side of the middle frame 310 facing the back cover 320. The battery 700 can be fixed to the side of the middle frame 310 facing the back cover 320, and is spaced apart from the chip 600. The temperature equalizer 100 can be installed in the first space 1002. The temperature equalizer 100 can be fixed to the side of the middle frame 310 facing the screen 400. It can be understood that the middle frame 310 can serve as a heat-conducting structure. The heat generated by the chip 600 during operation can be conducted to the temperature equalizer 100 through the middle frame 310. The middle frame 310 can also serve as a support member for the temperature equalizer 100.

[0137] In some embodiments, the middle frame 310 can be made of a material with a high thermal conductivity coefficient, such as a high thermal conductivity metal alloy such as aluminum, magnesium, titanium, copper, or stainless steel. This allows the middle frame 310 to better conduct heat generated by the heating element 200 to the vapor chamber 100, resulting in a higher thermal conductivity efficiency.

[0138] For example, the temperature vapor chamber 100 and the middle frame 310 may be fixed together by bonding, lap welding, screw locking, or the like.

[0139] For ease of description, the width direction of the temperature vapor chamber 100 is defined as the X-axis. The length direction of the temperature vapor chamber 100 is defined as the Y-axis. The thickness direction of the temperature vapor chamber 100 is defined as the Z-axis. It is understood that the coordinate system setting can be flexibly set according to specific actual needs.

[0140] FIG4 is a partial cross-sectional view of the vapor chamber 100 shown in FIG3 at another angle according to an embodiment of the present invention.

[0141] As shown in Figure 4, the temperature distribution plate 100 may include a first cover plate 10, a second cover plate 20, a capillary structure 30, a cooling medium 40, and a first conductive member 51. The first cover plate 10 may be fixedly connected to the second cover plate 20 and enclose a receiving cavity 101. The capillary structure 30 and the cooling medium 40 are located in the receiving cavity 101.

[0142] As shown in FIG4 , the first cover plate 10 may include a stacked first conductive layer 1, a first insulating layer 2, and a second conductive layer 3. The first insulating layer 2 is connected between the first conductive layer 1 and the second conductive layer 3. The second conductive layer 3 is located on a side of the first insulating layer 2 close to the second cover plate 20.

[0143] In some embodiments, the first conductive layer 1 can be made of a conductive material. For example, the first conductive layer 1 can be made of a pure metal or an alloy material. The first conductive layer 1 can be made of a conductive metal such as gold, nickel, copper, iron, aluminum, titanium, magnesium, silver, or zinc. The first conductive layer 1 can also be made of a conductive ceramic material.

[0144] In some embodiments, the resistivity of the material used in the first conductive layer 1 may be less than 10 9 In this way, the first conductive layer 1 has better conductivity.

[0145] In some embodiments, the second conductive layer 3 may also be made of a conductive material. For example, the second conductive layer 3 may be made of a pure metal or alloy material, and the first conductive layer 1 may be made of a conductive metal such as gold, nickel, copper, iron, aluminum, titanium, magnesium, silver, or zinc. The second conductive layer 3 may also be made of a conductive ceramic material. It is understood that the materials used for the first conductive layer 1 and the second conductive layer 3 may be the same or different, and this application does not impose any limitations thereon.

[0146] In some embodiments, the resistivity of the material used in the second conductive layer 3 may be less than 10 9 In this way, the second conductive layer 3 has better conductivity.

[0147] In some embodiments, the first insulating layer 2 may be made of an insulating material. For example, the first insulating layer 2 may be made of an organic polymer material, such as polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyviny chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc. It can be understood that compared with metal materials, organic polymer materials have the ability to resist elastic-plastic deformation when subjected to stress, have higher elongation, and their ability to resist deformation and fracture makes the first cover plate 10 easier to use shaping processes such as stamping or hot pressing.

[0148] In some embodiments, the resistivity of the material used for the first insulating layer 2 may be greater than or equal to 10 9 Ohm-meter (Ωm).

[0149] In some embodiments, the first conductive layer 1 and the second conductive layer 3 can both be made of metal. It is understood that metal materials have a large elastic modulus, high hardness, and are not easily deformed. By making the first conductive layer 1 and the second conductive layer 3 of metal, the first cover plate 10 can have high hardness and be less prone to deformation, thereby better protecting the capillary structure 30 within the accommodating cavity 101.

[0150] In some embodiments, the density of the first insulating layer 2 can be lower than the density of the first conductive layer 1, and lower than the density of the second conductive layer 3. It is understood that, compared to a solution in which the first cover plate 10 is entirely made of a metallic conductive material, using a polymer insulating material to make the first insulating layer 2 and replacing a portion of the metal layer can reduce the average density of the first cover plate 10, thereby reducing the overall mass of the vapor chamber 100 and contributing to a lighter electronic device 1000.

[0151] It is understandable that the first insulating layer 2 is made of organic polymer material, and since the organic polymer material itself has large pores. The first cover plate 10 made directly of organic polymer material cannot guarantee long-term airtightness, and there will be problems with steam leakage. In addition, the organic polymer material is in direct contact with the cooling medium 40 inside the accommodating cavity 101, and it is easy to undergo chemical reactions to produce non-condensable gases. Non-condensable gases may accumulate in the accommodating cavity 101, causing its uniform temperature and heat dissipation performance to decrease. The first cover plate 10 of the present application adopts a three-layer structure with two conductive layers and an insulating layer sandwiched between them, and the second conductive layer 3 is in contact with the cooling medium 40. On the one hand, compared with the first cover plate 10 being made of metal material as a whole, the technical solution of the present application can effectively reduce the total weight of the first cover plate 10 and realize a lightweight, flexible and bendable design; on the other hand, compared with the solution in which the first cover plate 10 is only provided with the first conductive layer 1 and the first insulating layer 2, or the solution in which the first cover plate 10 is made of polymer material as a whole, in the solution of the present application, the first conductive layer 1 and the second conductive layer 3 can also play a sealing and protective role for the first insulating layer 2, preventing the first insulating layer 2 from directly contacting the cooling medium 40 to generate gas, and the sealing reliability between the first cover plate 10 and the second cover plate 20 is better.

[0152] In some embodiments, the second cover plate 20 may include a stacked third conductive layer 21, a second insulating layer 22, and a fourth conductive layer 23. The second insulating layer 22 is connected between the third conductive layer 21 and the fourth conductive layer 23. The fourth conductive layer 23 is connected between the second conductive layer 3 and the second insulating layer 22.

[0153] It is understood that the second cover plate 20 has a three-layer structure with two conductive layers and an insulating layer sandwiched between them, and the fourth conductive layer 23 contacts the cooling medium 40. This prevents the second insulating layer 22 from directly contacting the cooling medium 40 and generating gas, thereby improving the sealing reliability between the first cover plate 10 and the second cover plate 20.

[0154] In some embodiments, the third conductive layer 21 can be made of a conductive material. For example, the third conductive layer 21 can be made of a pure metal or alloy material. The first conductive layer 1 can be made of a conductive metal such as gold, nickel, copper, iron, aluminum, titanium, magnesium, silver, or zinc. The third conductive layer 21 can also be made of a conductive ceramic material.

[0155] In some embodiments, the resistivity of the material used for the third conductive layer 21 may be less than 10 9 In this way, the third conductive layer 21 has a better conductive performance.

[0156] In some embodiments, the fourth conductive layer 23 may also be made of a conductive material. For example, the fourth conductive layer 23 may be a pure metal or alloy material. The first conductive layer 1 may be composed of conductive metals such as gold, nickel, copper, iron, aluminum, titanium, magnesium, silver, and zinc. The fourth conductive layer 23 may also be made of a conductive ceramic material. It is understood that the materials used for the third conductive layer 21 and the fourth conductive layer 23 may be the same or different, and this application does not impose any limitations thereon.

[0157] In some embodiments, the resistivity of the material used for the fourth conductive layer 23 may be less than 10 9 In this way, the fourth conductive layer 23 has a better conductive performance.

[0158] Exemplarily, the second insulating layer 22 may be made of an insulating material. For example, the second insulating layer 22 may be made of an organic polymer material, such as polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyviny chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc. It is understood that, compared to the second cover plate 20 entirely made of metal, organic polymer materials have the ability to resist elastic-plastic deformation when subjected to stress, resulting in higher elongation. These resistances to deformation and fracture make the second cover plate 20 easier to use in shaping processes such as stamping or hot pressing. It is understood that the material of the second insulating layer 22 can be the same as or different from that of the first insulating layer 2.

[0159] In some embodiments, the resistivity of the material used for the second insulating layer 22 may be greater than or equal to 10 9 Ohm-meter (Ωm).

[0160] In some embodiments, the density of the second insulating layer 22 can be less than the density of the third conductive layer 21, and less than the density of the fourth conductive layer 23. It is understood that, compared to a solution in which the second cover plate 20 is entirely made of a metallic conductive material, using a polymer insulating material to make the first insulating layer 2 instead of a portion of the metal layer can reduce the average density of the second cover plate 20, thereby reducing the overall mass of the vapor chamber 100 and contributing to a lighter electronic device 1000.

[0161] In some embodiments, the material used for the first conductive layer 1, the material used for the second conductive layer 3, the material used for the third conductive layer 21, and the material used for the fourth conductive layer 23 can be the same. The material used for the first insulating layer 2 and the material used for the second insulating layer 22 can be the same. For example, the material used for the first conductive layer 1, the material used for the second conductive layer 3, the material used for the third conductive layer 21, and the material used for the fourth conductive layer 23 can all be copper, and the material used for the first insulating layer 2 and the material used for the second insulating layer 22 can both be polyimide.

[0162] In other embodiments, the second cover plate 20 may not be provided with the fourth conductive layer 23, and may only be provided with the third conductive layer 21 and the second insulating layer 22. When the first cover plate 10 is fixedly connected to the second cover plate 20, the second insulating layer 22 may be fixed between the third conductive layer 21 and the second conductive layer 3.

[0163] In other embodiments, the second cover plate 20 may be made of a conductive material. It is understood that the second cover plate 20 may be made of a conductive material, or may include multiple conductive material layers.

[0164] For example, the second cover plate 20 can be entirely made of a conductive material, such as pure copper, copper alloy, stainless steel, titanium alloy, aluminum alloy, steel-copper composite, titanium-copper alloy, or a conductive ceramic material.

[0165] Exemplarily, the second cover plate 20 may include multiple layers of different conductive materials. For example, the second cover plate 20 may include a third conductive layer 21 and a fourth conductive layer 23. The third conductive layer 21 and the fourth conductive layer 23 may be stacked along the first direction. The fourth conductive layer 23 is connected between the third conductive layer 21 and the second conductive layer 3. It is understood that the material of the third conductive layer 21 and the material of the fourth conductive layer 23 may be the same or different.

[0166] In some embodiments, the third conductive layer 21 may be made of a material with a harder hardness than the fourth conductive layer 23. In this way, the second cover plate 20 has a better strength.

[0167] In other embodiments, the second cover plate 20 may also include a third conductive layer 21 , a fourth conductive layer 23 and a fifth conductive layer (not shown). The fifth conductive layer may be connected between the third conductive layer 21 and the fourth conductive layer 23 .

[0168] For example, the fifth conductive layer may be made of a material with a harder hardness than the third conductive layer 21 and the fourth conductive layer 23. In this way, the second cover plate 20 has a better strength.

[0169] For example, the third conductive layer 21 and the fourth conductive layer 23 may be made of pure copper, and the fifth conductive layer may be made of steel, titanium, aluminum, or other materials.

[0170] It is understandable that, in the following embodiments, unless otherwise specified, the second cover plate 20 including the third conductive layer 21 , the fourth conductive layer 23 and the second insulating layer 22 is taken as an example for description.

[0171] In other embodiments, the second cover plate 20 may include multiple conductive layers and multiple insulating layers, wherein the conductive layer farthest from the receiving cavity 101 is the third conductive layer 21 .

[0172] In some embodiments, the second cover plate 20 includes a top surface 25, a bottom surface 26, and side surfaces 27. The bottom surface 26 of the second cover plate 20 is disposed opposite the top surface 25 of the second cover plate 20, and the side surfaces 27 of the second cover plate 20 are connected between the top surface 25 of the second cover plate 20 and the bottom surface 26 of the second cover plate 20. The top surface 25 of the second cover plate 20 faces the accommodating cavity 101. The bottom surface 26 of the second cover plate 20 is the surface of the second cover plate 20 that is away from the accommodating cavity 101.

[0173] Illustratively, when the second cover plate 20 includes a third conductive layer 21, a fourth conductive layer 23, and a second insulating layer 22, the side surface 212 of the third conductive layer 21, the side surface 222 of the second insulating layer 22, and the side surface 232 of the fourth conductive layer 23 constitute the side surface 27 of the second cover plate 20. The surface of the third conductive layer 21 away from the accommodating cavity 101 constitutes the bottom surface 26 of the second cover plate 20. The surface of the fourth conductive layer 23 facing the accommodating cavity 101 constitutes the top surface 25 of the second cover plate 20.

[0174] As shown in Figure 4, the first cover plate 10 can be fixed to the second cover plate 20 and enclose the accommodating cavity 101. Exemplarily, the second cover plate 20 may include an effective area 201 and a sealing edge area 202. The sealing edge area 202 may connect the periphery of the effective area 201. A portion of the first cover plate 10 is fixed to the sealing edge area 202 of the second cover plate 20, and a portion is spaced apart from the effective area 201 of the second cover plate 20 to enclose the accommodating cavity 101. It is understood that the effective area 201 can be used to cooperate with the first cover plate 10 to enclose the accommodating cavity 101. The sealing edge area 202 can be used to cooperate with the first cover plate 10 to form a seal for the accommodating cavity 101.

[0175] For example, when the first cover plate 10 is fixed to the second cover plate 20, the second conductive layer 3 may be located on a side of the first insulating layer 2 close to the second cover plate 20. The fourth conductive layer 23 may be located on a side of the second insulating layer 22 close to the second conductive layer 3 of the first cover plate 10.

[0176] For example, a portion of the second conductive layer 3 can be spaced apart from the fourth conductive layer 23 of the active area 201 to enclose the accommodating cavity 101. A portion of the second conductive layer 3 of the first cover plate 10 can be fixed to the fourth conductive layer 23 of the edge sealing area 202 to achieve sealing of the accommodating cavity 101. In other embodiments, the entire second conductive layer 3 can also be spaced apart from the fourth conductive layer 23 of the active area 201 to enclose the accommodating cavity 101. That is, the second conductive layer 3 does not participate in the sealing of the accommodating cavity 101. In this case, a portion of the first insulating layer 2 can be fixed to the fourth conductive layer 23 of the edge sealing area 202 to achieve sealing of the accommodating cavity 101.

[0177] In other embodiments, when the second cover plate 20 is not provided with the fourth conductive layer 23, a portion of the second conductive layer 3 of the first cover plate 10 can be spaced apart from the second insulating layer 22 of the active area 201 to enclose the accommodating cavity 101. The second conductive layer 3 of the first cover plate 10 can be fixed to the second insulating layer 22 of the edge sealing area 202 to achieve sealing of the accommodating cavity 101.

[0178] For example, the edge-sealed areas 202 of the first cover plate 10 and the second cover plate 20 can be fixedly connected by welding. For example, the welding method can use a welding process that does not require the addition of solder, such as laser welding, diffusion welding, or ultrasonic welding. Alternatively, a welding process that requires the addition of solder can be used. The solder can be a brazing paste containing ingredients such as tin, silver, or copper, or a material such as hot melt adhesive. In other embodiments, the edge-sealed areas 202 of the first cover plate 10 and the second cover plate 20 can also be fixedly connected by gluing.

[0179] In some embodiments, when the first cover plate 10 is fixed to the second cover plate 20 , electrical conduction can be achieved between the second conductive layer 3 and the fourth conductive layer 23 by solderless welding, welding with conductive solder, or bonding with conductive adhesive.

[0180] As shown in Figures 3 and 4 , when the temperature vapor chamber 100 is fixed to the middle frame 310, the first cover plate 10 can be fixed to the middle frame 310 with the second cover plate 20 facing the screen 400, or the second cover plate 20 can be fixed to the middle frame 310 with the first cover plate 10 facing the screen 400. This application does not limit this. The following description uses the installation method in which the second cover plate 20 is fixed to the middle frame 310 and the first cover plate 10 faces the screen 400 as an example.

[0181] In some embodiments, the temperature vapor chamber 100 may include a top surface 102 and a bottom surface 103 disposed opposite to each other. The top surface 102 is the surface of the temperature vapor chamber 100 facing the screen 400. The top surface 102 and the bottom surface 103 may be spaced apart along the thickness direction of the temperature vapor chamber 100. For example, when the second cover plate 20 is fixed to the middle frame 310, the surface of the first conductive layer 1 facing the screen 400 is the top surface 102 of the temperature vapor chamber 100, and the surface of the second cover plate 20 facing the middle frame 310 is the bottom surface 103 of the temperature vapor chamber 100. In other embodiments, when the first conductive layer is fixed to the middle frame 310, the surface of the second cover plate 20 facing the screen 400 is the top surface 102 of the temperature vapor chamber 100, and the surface of the first conductive layer 1 facing the middle frame 310 is the bottom surface 103 of the temperature vapor chamber 100.

[0182] FIG5 is an enlarged schematic diagram of an embodiment of the structure shown in FIG4 at position B. To facilitate understanding, FIG5 schematically distinguishes the first conductive layer 1 and the first conductive member 51, the second conductive layer 3 and the third conductive member 52, the fourth conductive layer 23 and the fourth conductive member 54, and the third conductive layer 21 and the second conductive member 53 by dotted lines.

[0183] As shown in Figures 4 and 5, a portion of the first conductive member 51 is connected to the first conductive layer 1, and a portion is connected to the second cover plate 20. It is understood that the first conductive member 51 can be connected to the second cover plate 20 by direct contact or indirectly through other connection structures. The connection between the first conductive member 51 and the first conductive layer 1 can be direct contact or indirectly through other connection structures.

[0184] For example, the vapor chamber 100 may include a first conductive member 51, a third conductive member 52, a fourth conductive member 54, and a second conductive member 53. A portion of the first conductive member 51 may be fixed to the first conductive layer 1, and a portion may be fixed to the third conductive member 52. The third conductive member 52 may be fixed between the first conductive member 51 and the fourth conductive member 54. The fourth conductive member 54 may be fixed between the third conductive member 52 and the second conductive member 53. In this way, the first conductive member 51 may be indirectly fixed to the third conductive layer 21 of the second cover plate 20 via the third conductive member 52, the fourth conductive member 54, and the second conductive member 53.

[0185] In some embodiments, the first conductive member 51 can be an integrally formed structural member with the first conductive layer 1. It is understood that the two components are formed into an integrated structural member by an integral molding process, which means that during the process of forming one of the two components, the component is connected to the other component, and there is no need to connect the two components through further processing (such as bonding, welding, snap connection, screw connection).

[0186] It is understood that the connection strength between the first conductive member 51 and the first conductive layer 1 is better than that of an external independent conductive member. An independent conductive member refers to a conductive member prepared through a separate process. External connection refers to a connection method such as welding or gluing that secures the conductive member to the first cover plate 10 and the second cover plate 20.

[0187] For example, the first conductive layer 1 and the first conductive member 51 can be integrally formed by metal pressing or other processes. In this way, the first conductive layer 1 and the first conductive member 51 can be directly electrically connected without the need for an additional electrical connection structure.

[0188] In other embodiments, the first conductive member 51 may be an independent structural member. An independent structural member is one that is prepared in a separate process and is not formed in the same process as other structural members. For example, the first conductive member 51 may be fixedly connected to the first conductive layer 1 and the third conductive member 52 by gluing, welding, or other processes.

[0189] In some embodiments, the third conductive member 52 may be an integrally formed structure with the second conductive layer 3. In this way, the connection strength between the third conductive member 52 and the second conductive layer 3 is better.

[0190] For example, the third conductive member 52 can be integrally formed with the second conductive layer 3 by metal pressing or other processes. In this way, the third conductive member 52 can be directly electrically connected to the second conductive layer 3 without the need for additional electrical connection structures.

[0191] In some embodiments, the fourth conductive member 54 and the fourth conductive layer 23 may be integrally formed as a structural member, so that the connection strength between the fourth conductive member 54 and the fourth conductive layer 23 is better.

[0192] For example, the fourth conductive member 54 can be integrally formed with the fourth conductive layer 23 by metal pressing or other processes. In this way, the fourth conductive member 54 can be directly electrically connected to the fourth conductive layer 23 without the need for an additional electrical connection structure.

[0193] In some embodiments, the second conductive member 53 and the third conductive layer 21 may be integrally formed as a structural member. The connection strength between the second conductive member 53 and the third conductive layer 21 is good.

[0194] For example, the second conductive member 53 and the third conductive layer 21 can be integrally formed by metal pressing or other processes. In this way, the second conductive member 53 can be directly electrically connected to the third conductive layer 21 without the need for additional electrical connection structures.

[0195] For example, the first conductive member 51, the third conductive member 52, the fourth conductive member 54, and the second conductive member 53 can be fixedly connected to each other by welding. For example, the welding method can use a welding process such as brazing, cold welding, pressure welding, diffusion welding, ultrasonic welding, and electromagnetic pulse welding. In other embodiments, the first conductive member 51, the third conductive member 52, the fourth conductive member 54, and the second conductive member 53 can also be fixedly connected by gluing.

[0196] In some embodiments, the first conductive member 51, the third conductive member 52, the fourth conductive member 54, and the second conductive member 53 can be arranged along a first direction. The first direction is the direction from the second cover plate 20 to the first cover plate 10. For example, the drawings illustrate the first direction as being parallel to the Z-axis.

[0197] It can be understood that the stacking direction of the first conductive member 51, the third conductive member 52, the fourth conductive member 54 and the second conductive member 53 is consistent with the stacking direction of the first conductive layer 1, the second conductive layer 3, the third conductive layer 21 and the fourth conductive layer 23. When the first conductive member 51, the third conductive member 52, the fourth conductive member 54 and the second conductive layer 53 are prepared by an integrated molding process, the plate materials for preparing the first cover plate 10 and the second cover plate 20 can be directly processed by pressing or cutting to remove the insulating layer therein, so as to achieve the fixation and electrical conduction of the first conductive member 51, the third conductive member 52, the fourth conductive member 54 and the second conductive member 53, and the process is relatively simple.

[0198] In some embodiments, the first conductive layer 1 can be electrically connected to the surface of the second cover plate 20 away from the accommodating cavity 101 through the first conductive member 51, that is, the first conductive layer 1 can be electrically connected to the bottom surface 26 of the second cover plate 20 through the first conductive member 51. It is understood that the first conductive member 51 can directly contact and electrically connect to the bottom surface 26 of the second cover plate 20, or can be indirectly electrically connected to the bottom surface 26 of the second cover plate 20 through other conductive members.

[0199] For example, the first conductive member 51 is electrically connected between the first conductive layer 1 and the third conductive member 52. The third conductive member 52 is electrically connected between the first conductive member 51 and the fourth conductive member 54. The fourth conductive member 54 is electrically connected between the second conductive member 53 and the third conductive member 52. The second conductive member 53 is electrically connected to the third conductive layer 21. In this way, the surface of the third conductive layer 21 facing away from the accommodating cavity 101 constitutes the bottom surface 26 of the second cover plate 20. The first conductive layer 1 of the first cover plate 10 can be electrically connected to the bottom surface 26 of the second cover plate 20 via the first conductive member 51, the third conductive member 52, the fourth conductive member 54, and the second conductive member 53.

[0200] In other embodiments, the first conductive member 51 may also directly contact and electrically connect to the third conductive layer 21 , which will be described in detail below through other embodiments and will not be repeated here.

[0201] In some embodiments, the electronic device 1000 may be provided with an electrical connector to ground the first conductive layer 1 or the third conductive layer 21 of the temperature vapor chamber 100 .

[0202] It is understood that by providing the first conductive member 51, stable electrical conduction is achieved between the top surface 102 and the bottom surface 103 of the vapor chamber 100. When the electronic device 1000 is in use, if unstable electrical conduction occurs between the screen 400 or other electrically charged structures within the electronic device 1000 and the top surface 102 and / or bottom surface 103 of the vapor chamber 100, the other electrical connector of the electronic device 1000, whether electrically connected to the top surface 102 or the bottom surface 103 of the vapor chamber 100, can be electrically connected to a ground position on the vapor chamber 100 through the first conductive member 51 to ensure that both the top surface 102 and the bottom surface 103 of the vapor chamber 100 are stably grounded, thereby reducing the risk of radiated spurious emission (RSE) signals, and improving the wireless communication signal of the electronic device 1000.

[0203] In some embodiments, the minimum resistance between any point on the top surface 102 and any point on the bottom surface 103 of the temperature vapor chamber 100 may be less than 10 15 Ohm (Ω). For example, the resistance between any point on the top surface 102 and any point on the bottom surface 103 of the vapor chamber 100 can be less than 1000Ω. The resistance between any point on the top surface 102 and any point on the bottom surface 103 can be 0.05Ω, 0.5Ω, 1Ω, 3Ω, 5Ω, 20Ω, 200Ω, 500Ω, 700Ω, or 999Ω. In this way, the resistance between the top surface 102 and the bottom surface 103 is relatively low when they are electrically connected.

[0204] For example, the resistance value between any point on the top surface 102 and any point on the bottom surface 103 may vary according to the selected points on the top surface 102 and the bottom surface 103, and the minimum resistance value may be less than 10 15 Ω to ensure electrical conduction between the top surface 102 and the bottom surface 103.

[0205] Exemplarily, a method for measuring the resistance value between any point on the top surface 102 and any point on the bottom surface 103 may include: using a multimeter to measure the resistance value, contacting one of the two probes of the multimeter to any point on the top surface 102, and contacting the other probe to any point on the bottom surface 103 to achieve the resistance value measurement.

[0206] In some embodiments, the first conductive member 51 can be made of a metallic conductive material. For example, the first conductive member 51 can be made of pure copper, copper alloys, stainless steel, titanium alloys, aluminum alloys, steel-copper composites, titanium-copper alloys, and the like. It is understood that the materials for the second conductive member 53, the third conductive member 52, and the fourth conductive member 54 can be selected similarly to those for the first conductive member 51 and will not be further described here.

[0207] In some embodiments, the forming process of the heat spreader 100 may include: forming a plate with a three-layer structure (conductive layer-insulating layer-conductive layer) through a lamination process, forming the two plates into a specific shape through the lamination process so as to enclose the accommodating cavity 101, and then fixing the periphery of the two plates together to form the heat spreader 100 to be processed. Since the first insulating layer 2 and the second insulating layer 22 are made of organic polymer materials, which are less hard than metal materials or conductive ceramics, the cutting angle direction of the cutter can be set during the machining process so that the cutter cuts the periphery of the heat spreader 100 along the direction at an angle with the second cover plate 20, so that a portion of the two layers of polymer material can be squeezed and cut, forming the first conductive member 51, the first cover plate 10, and the second cover plate 20. It can be understood that removing a portion of the organic polymer material of the insulating layer through the cutting process is a simpler and less costly machining process than chemical etching or laser ablation. The conductive layers where the insulating layer has been removed are in contact and connected with each other under the extrusion of the cutter, forming a relatively stable contact and electrical conduction. No subsequent connection process such as welding is required, which simplifies the process steps.

[0208] It is understandable that the stacking direction of the first conductive element 51 , the third conductive element 52 , the fourth conductive element 54 and the second conductive element 53 may also be arranged at an angle with the first direction, such as 3°, 10° or 20°.

[0209] In some embodiments, the forming process of the first conductive member 51, the third conductive member 52, the fourth conductive member 54, and the second conductive member 53 may include: forming a three-layer structure (conductive layer-insulating layer-conductive layer) of a plate through a lamination process, laminating the two plates into a specific shape to enclose the accommodating cavity 101, and then securely connecting the peripheries of the two plates to form the heat spreader 100 to be processed. Chemical etching or laser ablation is then performed on the side of the heat spreader 100 to remove a portion of the insulating layer. The four conductive layers in the area where the insulating layer has been removed are then laminated together to achieve electrical connection, thereby forming the first conductive member 51, the third conductive member 52, the fourth conductive member 54, and the second conductive member 53.

[0210] In other embodiments, after chemical etching or laser ablation, the locations where the insulating layer was removed may be filled with a conductive material (e.g., conductive glue, coating, slurry, etc.) to achieve electrical connection between the layers. Alternatively, after chemical etching or laser ablation, the locations where the insulating layer was removed may be filled with solder and soldering may be performed to achieve fixation and electrical continuity between the first conductive member 51 and the third conductive member 52, and between the fourth conductive member 54 and the second conductive member 53.

[0211] In other embodiments, when the second conductive layer 3 can be electrically connected to the fourth conductive layer 23 , the third conductive member 52 and the fourth conductive member 54 may not be in direct contact, but may be indirectly fixedly connected and electrically connected through the second conductive layer 3 and the fourth conductive layer 23 .

[0212] In other embodiments, the fourth conductive member 54 may not be provided on the vapor chamber 100. The vapor chamber 100 may include a first conductive member 51, a third conductive member 52, and a second conductive member 53. The second conductive member 53 is connected to a side of the third conductive member 52 away from the first conductive member 51. The first conductive layer 1 may be electrically connected to the third conductive layer 21 via the first conductive member 51, the third conductive member 52, and the second conductive member 53.

[0213] In other embodiments, the vapor chamber 100 may not include the third conductive member 52. Instead, the vapor chamber 100 may include a first conductive member 51, a fourth conductive member 54, and a second conductive member 53, with the fourth conductive member 54 connected between the first conductive member 51 and the second conductive member 53. The first conductive layer 1 may be electrically connected to the third conductive layer 21 via the first conductive member 51, the fourth conductive member 54, and the second conductive member 53.

[0214] In other embodiments, the vapor chamber 100 may not include the third conductive member 52 and the fourth conductive member 54. The first conductive layer 1 may be electrically connected to the third conductive layer 21 via the first conductive member 51 and the second conductive member 53. For example, the first conductive member 51 may be directly in contact with and electrically connected to the second conductive member 53. Alternatively, when the second conductive layer 3 and the fourth conductive layer 23 are electrically conductive, the first conductive member 51 may be fixed to the second conductive layer 3 and the first conductive layer 1, and the second conductive member 53 may be fixed to the third conductive layer 21 and the fourth conductive layer 23. The first conductive layer 1 may be electrically connected to the third conductive layer 21 via the first conductive member 51, the second conductive layer 3, the fourth conductive layer 23, and the second conductive member 53.

[0215] In other embodiments, when the second cover plate 20 is not provided with the fourth conductive layer 23 , the temperature homogenizing plate 100 may also not be provided with the fourth conductive member 54 .

[0216] In other embodiments, when the second cover plate 20 is entirely made of a conductive material, the fourth conductive member 54 may not be provided on the temperature homogenizing plate 100, and the second conductive member 53 may be a structural member integrally formed with at least a portion of the second cover plate 20. For example, when the second cover plate 20 includes multiple conductive layers, the second conductive member 53 may be a structural member integrally formed with any one of the multiple conductive layers. For example, when the second cover plate 20 includes a third conductive layer 21 and a fourth conductive layer 23, and the second insulating layer 22 is not provided, the fourth conductive member 54 may not be provided on the temperature homogenizing plate 100. In this case, the third conductive layer 21 and the fourth conductive layer 23 can be electrically conductive, and the second conductive member 53 may be provided on the same layer as the third conductive layer 21 or the fourth conductive layer 23.

[0217] In other embodiments, the second conductive member 53 may be an independent structural member, and the second conductive member 53 and the third conductive layer 21 may be fixedly connected by welding or gluing.

[0218] In other embodiments, the third conductive member 52 may be an independent structural member, and the third conductive member 52 and the second conductive layer 3 may be fixedly connected by welding or gluing.

[0219] In other embodiments, the fourth conductive member 54 may be an independent structural member, and the fourth conductive member 54 and the fourth conductive layer 23 may be fixedly connected by welding or gluing.

[0220] In some embodiments, projections of the first conductive element 51 , the third conductive element 52 , the fourth conductive element 54 , and the second conductive element 53 along the first direction on a reference plane overlap. The reference plane is the plane where the first conductive layer 1 is located.

[0221] Figure 6a is a schematic diagram of another embodiment of the vapor chamber 100 shown in Figure 4. To facilitate reading and understanding, Figure 6a uses dotted lines and different filling patterns to distinguish the active area 201, the edge sealing area 202 and the first conductive member 51.

[0222] As shown in Figures 4 and 6a, the first conductive member 51 can be located on the side of the edge sealing area 202 away from the active area 201. It is understood that the first conductive member 51 is located on the side of the edge sealing area 202 away from the active area 201. This does not increase the thickness of the vapor chamber 100, thus contributing to a thinner electronic device 1000.

[0223] For example, the first conductive member 51 can be annular in shape. The first conductive member 51 surrounds the edge sealing area 202 of the second cover plate 20. It is understood that, compared to the embodiment in which the first conductive member 51 is located on one side of the edge sealing area 202 of the second cover plate 20, the embodiment shown in FIG6a shows that the first conductive member 51 can be annular in shape. The first conductive member 51 surrounds the edge sealing area 202 of the second cover plate 20. This allows for a larger connection area between the first conductive member 51 and the first conductive layer 1, and also a larger connection area between the first conductive member 51 and the second cover plate 20. This provides for better connection strength and electrical stability between the first conductive member 51 and the first conductive layer 1 and the second cover plate 20.

[0224] Figure 6b is a schematic diagram of another embodiment of the vapor chamber 100 shown in Figure 4 at another angle. To facilitate reading and understanding, Figure 6b uses dotted lines and different filling patterns to distinguish the active area 201, the edge sealing area 202 and the first conductive member 51.

[0225] As shown in Figures 4 and 6b, the first conductive member 51 may also be located on the side of the edge sealing area 202 of the second cover plate 20 away from the active area 201. In this way, the area occupied by the temperature vapor chamber 100 on the XY plane is relatively small.

[0226] In some embodiments, there may be multiple first conductive members 51. Multiple first conductive members 51 are arranged at intervals. As shown in FIG6b , there are two first conductive members 51, one of which is located above the active area 201 and the other is located to the right of the active area 201. In other embodiments, there may be only one first conductive member 51.

[0227] Figure 7a is a schematic structural diagram of another embodiment of the structure shown in Figure 4. Figure 7b is a schematic structural diagram of another embodiment of the structure shown in Figure 7a at another angle.

[0228] 7a and 7b, the projection of the first conductive member 51 on the reference plane along the first direction and the projection of the second conductive member 53 on the reference plane along the first direction may be at least partially offset.

[0229] It is understood that when a portion of the second conductive layer 3 is fixed to the fourth conductive layer 23, the second conductive layer 3 can be electrically conductive with the fourth conductive layer 23. The first conductive member 51 can be electrically connected between the first conductive layer 1 and the second conductive layer 3 at a first position. The second conductive member 53 can be electrically connected between the third conductive layer 21 and the fourth conductive layer 23 at a second position. In this case, the first conductive layer 1 can be electrically connected to the third conductive layer 21 through the first conductive member 51, the second conductive layer 3, the fourth conductive layer 23, and the second conductive member 53. As shown in Figure 7b, the first position can be located on the right side of the active area 201, and the second position can be located on the left side of the active area 201.

[0230] For example, the projection of the first conductive member 51 along the first direction onto the reference plane and the projection of the third conductive member 52 along the first direction onto the reference plane may overlap. A portion of the first conductive member 51 may be fixed to the first conductive layer 1, and a portion may be fixed to the third conductive member 52. A portion of the third conductive member 52 may be fixed to the second conductive layer 3. The projection of the second conductive member 53 along the first direction onto the reference plane and the projection of the fourth conductive member 54 along the first direction onto the reference plane may overlap. A portion of the second conductive member 53 may be fixed to the third conductive layer 21, and a portion may be fixed to the fourth conductive member 54. A portion of the fourth conductive member 54 may be fixed to the fourth conductive layer 23.

[0231] In this way, the first conductive layer 1 can be electrically connected to the second conductive layer 3 through the first conductive member 51 and the third conductive member 52. The second conductive layer 3 and the fourth conductive layer 23 can be electrically conductive. The fourth conductive layer 23 can be electrically connected to the third conductive layer 21 through the fourth conductive member 54 and the second conductive member 53. The first conductive layer 1 can be electrically connected to the third conductive layer 21 through the first conductive member 51, the third conductive member 52, the second conductive layer 3, the fourth conductive layer 23, the fourth conductive member 54, and the second conductive member 53.

[0232] It can be understood that the first conductive member 51 and the second conductive member 53 can be in different positions. When the first cover plate 10 and the second cover plate 20 are assembled, there is no need to accurately position the first conductive member 51 and the second conductive member 53. The first conductive member 51 can be electrically connected to the second conductive member 53 through the second conductive layer 3 and the fourth conductive layer 23. The assembly accuracy requirements are relatively low and the assembly difficulty is relatively low.

[0233] In some embodiments, the first conductive member 51 may be spaced apart from the second conductive member 53. In this way, when the first cover plate 10 and the second cover plate 20 are assembled, the assembly precision requirement is lower and the assembly difficulty is lower.

[0234] As shown in Figures 3 and 4, the capillary structure 30 can be located in the accommodating cavity 101. For example, the capillary structure 30 can be located between the first cover plate 10 and the second cover plate 20, and fixed to the first cover plate 10 or the second cover plate 20. It is understandable that in order to enable the cooling medium 40 to absorb heat faster, the capillary structure 30 can be provided on a side of the accommodating cavity 101 close to the heating device 200. For example, when the first cover plate 10 is closer to the heating device 200 than the second cover plate 20, the capillary structure 30 can be fixed to the first cover plate 10. When the second cover plate 20 is closer to the heating device 200 than the first cover plate 10, the capillary structure 30 can be fixed to the second cover plate 20. For example, as shown in Figures 3 and 4, when the vapor chamber 100 is installed in the first space 1002, the second cover 20 is fixed to the middle frame 310, and the heating device 200 is installed in the second space 1003 and fixed on the side of the middle frame 310 away from the vapor chamber 100, the capillary structure 30 can be installed on the second cover 20. The capillary structure 30 is closer to the heating device 200, and the cooling medium 40 in the capillary structure 30 can better absorb heat.

[0235] The capillary structure 30 refers to the concave surface of the liquid in the capillary pores due to surface tension. This exerts a pulling force on the liquid below, causing it to move upward along the walls of the capillary pores. This triggers a capillary phenomenon. The capillary structure 30 can include multiple capillary pores or structures similar to capillary pores, such as fine grooves. Once the cooling medium 40 enters the capillary pores or fine grooves in the capillary structure 30, it flows to the other end of the capillary pores through capillary action, completing the transfer and return of the cooling medium 40.

[0236] For example, the capillary structure 30 may include one or more of a mesh structure, a linear structure, a porous structure, a groove structure, or a channel structure.

[0237] The cooling medium 40 may be located in the accommodating cavity 101. The cooling medium 40 may be used to conduct heat. For example, the cooling medium 40 may be pure water or alcohol.

[0238] Fig. 8 is a partial cross-sectional view of an embodiment of the vapor chamber 100 shown in Fig. 3. To facilitate understanding, arrows are used in Fig. 3 and Fig. 8 to indicate the path of heat transfer and the path of movement of the cooling medium 40.

[0239] As shown in Figures 3 and 8, the volume of the accommodating chamber 101 is larger than the volume of the capillary structure 30. The accommodating chamber 101 may include a steam passage 1013. It is understood that when the capillary structure 30 is located in the accommodating chamber 101, the remaining space in the accommodating chamber 101, excluding the space for mounting the capillary structure 30, can serve as the steam passage 1013.

[0240] For example, when the vapor chamber 100 is working, a portion of the cooling medium 40 may be in a liquid state and located in the capillary structure 30 , and the other half of the cooling medium 40 may be in a gaseous state and located in the steam channel 1013 .

[0241] For example, the accommodating chamber 101 may include a first region 1011 and a second region 1012. The first region 1011 is closer to the heating device 200 and has a higher temperature, while the second region 1012 is farther from the heating device 200 and has a lower temperature. The capillary structure 30 may extend from the first region 1011 to the second region 1012. The steam channel 1013 may also extend from the first region 1011 to the second region 1012.

[0242] It is understandable that when the temperature equalizing plate 100 is working, the cooling medium 40 in the capillary structure 30 in the first area 1011 vaporizes, changes from liquid to gas, and absorbs heat. The gaseous cooling medium 40 moves in the steam channel 1013 in a direction away from the heating device 200 and moves to the second area 1012. The cooling medium 40 in the second area 1012 liquefies, changes from gas to liquid, and releases heat. The cooling medium 40 (liquid) generated by liquefaction enters the capillary structure 30 and flows back from the second area 1012 to the first area 1011 through the capillary structure 30. In this way, the cooling medium 40 can conduct the heat generated by the heating device 200 to other locations with lower temperatures through the cycle of physical state transformation.

[0243] In some embodiments, the accommodating chamber 101 can be in a vacuum environment. In a vacuum environment, the boiling point of the cooling medium 40 can be lower than that in a normal pressure environment. When the temperature near the heating device 200 reaches the boiling point of the cooling medium 40, the cooling medium 40 vaporizes and the temperature equalizer 100 can start working. It can be understood that by setting the accommodating chamber 101 to a vacuum environment, the starting temperature of the temperature equalizer 100 can be lowered, avoiding the temperature accumulation at the location of the heating device 200 that cannot be dissipated, resulting in excessively high temperatures at the local location, affecting the operation of other surrounding devices.

[0244] In some embodiments, the first cover plate 10 and / or the second cover plate 20 may be provided with multiple support columns 109. For example, in the embodiment of FIG4 , the designer has provided multiple support columns 109 on the inner wall surface of the first cover plate 10. The support columns can be used to prevent the temperature distribution plate 100 from collapsing. The steam channel 1013 can be located between the support columns. The inner wall surface of the first cover plate 10 refers to the surface of the first cover plate 10 that is used to enclose the accommodating cavity 101.

[0245] The following specifically introduces an implementation of the temperature vapor chamber 100 operating inside the electronic device 1000 .

[0246] As shown in Figures 3 and 8, taking the heat-generating device 200 as a chip 600 as an example, when the chip 600 is working, the chip 600 generates a large amount of heat, and the temperature at the chip 600 position is higher than the heat at the battery 700 position. The heat generated by the chip 600 is conducted to the first area 1011 of the accommodating cavity 101 through the middle frame 310 and the second cover plate 20 of the temperature equalizer 100. The cooling medium in the capillary structure 30 at this position will quickly vaporize after absorbing heat, while absorbing a large amount of heat (latent heat of vaporization). The cooling medium 40 in the form of steam diffuses from the high-pressure area (such as the first area 1011) to the low-pressure area (such as the second area 1012) along the steam channel 1013. The temperature of the second area 1012 is lower. When the cooling medium 40 in the form of steam contacts the first cover plate 10 with a lower temperature, it will quickly liquefy and emit a large amount of heat. The liquid cooling medium 40 formed after liquefaction in the second area 1012 passes through the capillary structure 30 and returns to the first area 1011 under the action of capillary force, thereby completing a heat conduction cycle. When the vapor chamber 100 is operating, a continuous heat conduction cycle occurs within the housing chamber 101 until the temperature of the first region 1011 approaches that of the second region 1012. This reduces the risk of high temperatures in the electronic device 1000, which could lead to performance degradation and shortened lifespan of other components in that region, as well as burn-in on the screen 400 and affect the display quality.

[0247] For example, within the second region 1012, the heat released by the cooling medium 40 can be dissipated from the display surface of the electronic device 1000 to the external space where the electronic device 1000 is located via the heat dissipation path of the first cover plate 10 - first space 1002 - screen 400. Simultaneously, the heat released by the cooling medium 40 can also be dissipated from the back of the electronic device 1000 to the external space where the electronic device 1000 is located via the heat dissipation path of the second cover plate 20 - middle frame 310 - second space 1003 - back cover 320. Furthermore, the heat released by the cooling medium 40 can also be dissipated from the side of the electronic device 1000 to the external space where the electronic device 1000 is located via the heat dissipation path of the second cover plate 20 - side of the middle frame 310.

[0248] In some embodiments, the equivalent thermal conductivity of the vapor chamber 100 can be greater than or equal to 2000 W / (m·°C). This provides good thermal conductivity for the vapor chamber 100. For example, the equivalent thermal conductivity of the vapor chamber 100 can be 2000 W / (m·°C), 3000 W / (m·°C), 4000 W / (m·°C), 5000 W / (m·°C), or 6000 W / (m·°C).

[0249] In some embodiments, the same technical details as those of the vapor chamber 100 described above are not further described. FIG9 is a schematic diagram of another embodiment of the structure shown in FIG4 at position B. For ease of understanding, FIG9 uses dashed lines to schematically distinguish between the first conductive member 51 and the first conductive layer 1, and between the second conductive member 53 and the third conductive layer 21.

[0250] As shown in Figures 4 and 9, the vapor chamber 100 may include a first conductive member 51 and a second conductive member 53. The first conductive member 51 is fixed to the second conductive member 53 and electrically connected to the second conductive member 53. For example, the first conductive member 51 may be fixed to the side 11 of the first conductive layer 1 and the side 2001 of the first insulating layer 2. A portion of the second conductive member 53 may be fixed to the side 212 of the third conductive layer 21, and a portion may be fixed to the side of the first conductive member 51 away from the accommodating cavity 101 (shown in Figure 4).

[0251] The first conductive member 51 can be electrically connected to the first conductive layer 1. A portion of the second conductive member 53 can be electrically connected to the third conductive layer 21, and a portion can be electrically connected to the first conductive member 51. In this way, the first conductive layer 1 can be electrically connected to the third conductive layer 21 of the second cover plate 20 through the first conductive member 51 and the second conductive member 53, thereby achieving electrical conduction between the top surface 102 and the bottom surface 103 of the vapor chamber 100.

[0252] It is understood that in the technical solution in which the second conductive member 53 and the first conductive member 51 are arranged relative to each other along the Z-axis direction and the end face of the second conductive member 53 is connected to the end face of the first conductive member 51, the connection area between the second conductive member 53 and the first conductive member 51 is limited by the thickness of the smaller layer of the first conductive layer 1 and the third conductive layer 21. In this embodiment, a portion of the second conductive member 53 is connected to the outer side surface of the first conductive member 51, and there is no need to align the end faces of the two parts. The process is simple, the preparation difficulty is low, and the product yield is high. In addition, the upper limit of the connection area between the second conductive member 53 and the first conductive member 51 can be set larger. For example, in the Z-axis direction, the maximum length of the connection area between the second conductive member 53 and the first conductive member 51 can reach the sum of the thickness of the first conductive layer 1, the thickness of the second conductive layer 3, the thickness of the first insulating layer 2, the thickness of the fourth conductive layer 23, and the thickness of the second insulating layer 22. The outer side surface of the first conductive member 51 refers to the surface of the first conductive member 51 away from the accommodating cavity 101.

[0253] In addition, compared with the first conductive member 51 shown in FIG. 5 , the conductive member in this embodiment can increase a larger electrical connection area while increasing the width of the temperature vapor chamber 100 to the same value.

[0254] In some embodiments, the first conductive member 51 may also be fixed to the side surface 31 of the second conductive layer 3 , the side surface 232 of the fourth conductive layer 23 , and the side surface 222 of the second insulating layer 22 .

[0255] In some embodiments, the first conductive member 51 can be integrally formed with the first conductive layer 1. The second conductive member 53 can be integrally formed with the third conductive layer 21. This improves the electrical connection reliability between the first conductive member 51 and the first conductive layer 1. The electrical connection reliability between the second conductive member 53 and the third conductive layer 21 is also improved.

[0256] In some embodiments, the forming process of the first conductive member 51 may include: forming a three-layer structure (conductive layer-insulating layer-conductive layer) of a plate through a lamination process, laminating two plates into a specific shape to enclose the accommodating cavity 101, and then securely connecting the two plates at their peripheries to form the heat spreader 100 to be processed. Chemical etching or laser ablation is performed on the side of the heat spreader 100 to remove a portion of the insulating layer and the conductive layer. The remaining two conductive layers in the area where the insulating layer has been removed are then laminated together to achieve electrical connection, thereby forming the first conductive member 51.

[0257] For example, electrical conduction can be achieved between the first conductive member 51 and the second conductive member 53 by welding or gluing with conductive adhesive.

[0258] In other embodiments, the second conductive member 53 may be fixed to the side surface 212 of the third conductive layer 21 and the side surface 222 of the second insulating layer 22. A portion of the first conductive member 51 may be fixed to the side surface 11 of the first conductive layer 1, and a portion may be fixed to a side of the second conductive member 53 away from the accommodating cavity 101 (as shown in FIG. 4 ).

[0259] In other embodiments, when the second cover plate 20 is entirely made of a conductive material, the second conductive member 53 can be fixed to any position on the side of the second cover plate 20 and electrically connected to the second cover plate. For example, the second conductive member 53 can be an integrally formed structural member with at least a portion of the second cover plate 20.

[0260] In some embodiments, the same technical contents as those of the vapor chamber 100 in the above embodiments are not described in detail. Fig. 10 is a schematic structural diagram of another embodiment of the structure shown in Fig. 4 at position B.

[0261] 4 and 10 , a portion of the first conductive member 51 may be fixed to the side 11 of the first conductive layer 1 and a portion may be fixed to the side 212 of the third conductive layer 21. The first conductive layer 1 may be electrically connected to the third conductive layer 21 through the first conductive member 51.

[0262] It can be understood that the first conductive member 51 is fixed to the side 11 of the first conductive layer 1 and the side 212 of the third conductive layer 21, which does not increase the thickness of the temperature equalizing plate 100, is conducive to the thinning of the temperature equalizing plate 100, and can be used in electronic devices 1000 with smaller thickness.

[0263] In some embodiments, the first conductive member 51 can be fixed to the side 11 of the first conductive layer 1, the side 2001 of the first insulating layer 2, the side 31 of the second conductive layer 3, and the side 27 of the second cover plate 20. For example, the side 212 of the third conductive layer 21, the side 222 of the second insulating layer 22, and the side 232 of the fourth conductive layer 23 constitute the side of the second cover plate 20. The first conductive layer 1 can be fixed to the side 11 of the first conductive layer 1, the side 2001 of the first insulating layer 2, the side 31 of the second conductive layer 3, the side 212 of the third conductive layer 21, the side 222 of the second insulating layer 22, and the side 232 of the fourth conductive layer 23.

[0264] For example, the first conductive member 51 may be a conductive adhesive. It is understood that the conductive adhesive itself has both electrical conductivity and adhesive properties. Using the conductive adhesive as the first conductive member 51 eliminates the need for additional fixing structures to secure the first conductive member 51 to the side surfaces of the first cover plate 10 and the second cover plate 20, simplifying the process.

[0265] Exemplarily, the first conductive member 51 may also be a conductive metal layer formed by electroplating or deposition process.

[0266] In other embodiments, the first conductive member 51 may also be a structure made of a conductive material. For example, the first conductive member 51 may be a conductive metal structure or conductive foam. The first conductive member 51 may be fixed to the side surface of the first cover plate 10 and the side surface of the second cover plate 20 by welding. The solder is made of a conductive material so that the first conductive member 51 can electrically connect the first conductive layer 1 and the second cover plate 20. Alternatively, the first conductive member 51 may be fixed to the side surface of the first cover plate 10 and the side surface of the second cover plate 20 by gluing with a conductive adhesive.

[0267] In other embodiments, the first conductive member 51 and the first conductive layer 1 may be an integrally formed structural member.

[0268] In other embodiments, when the second cover plate 20 is entirely made of a conductive material, a portion of the first conductive member 51 can be fixed to the side surface 11 of the first conductive layer 1, and a portion can be fixed to any position on the side surface 27 of the second cover plate 20. The first conductive layer 1 can be electrically connected to the second cover plate 20 via the first conductive member 51.

[0269] In some embodiments, the same technical contents as those of the vapor chamber 100 in the above embodiments are not described in detail. Fig. 11 is a schematic structural diagram of another embodiment of the structure shown in Fig. 4 at position B.

[0270] As shown in Figures 4 and 11, a portion of the first conductive member 51 can be fixed to the side surface 11 of the first conductive layer 1, and a portion can be fixed to the surface of the second cover plate 20 away from the accommodating cavity 101 (i.e., the bottom surface 103 of the vapor chamber 100). The first conductive member 51 can be L-shaped. For example, a portion of the first conductive member 51 can be fixed to the surface of the third conductive layer 21 away from the accommodating cavity 101.

[0271] In this way, the first conductive layer 1 can be electrically connected to the bottom surface 103 of the temperature vapor chamber 100 through the first conductive member 51 , thereby achieving electrical conduction between the top surface 102 and the bottom surface 103 of the temperature vapor chamber 100 .

[0272] It is understood that, compared to the solution in which a portion of the first conductive member 51 can be fixed to the side surface 11 of the first conductive layer 1 and a portion can be fixed to the side surface 212 of the third conductive layer 21, in the solution of this embodiment, a portion of the first conductive member 51 is fixed to a side surface of the second cover plate 20 away from the accommodating cavity 101 (i.e., the bottom surface 103) and is electrically connected to the second cover plate 20. The area of ​​the bottom surface 103 is much larger than the area of ​​the side surface 27 of the second cover plate 20, so the connection area between the first conductive member 51 and the second cover plate 20 can be larger, the connection difficulty is reduced, and the electrical connection reliability is better.

[0273] In some embodiments, the first conductive member 51 can be an integrally formed structure with the first conductive layer 1. In this way, the connection strength between the first conductive member 51 and the first conductive layer 1 is better.

[0274] In some embodiments, the preparation process of the temperature vapor chamber 100 may include: when cutting the three-layer structure plate material used to form the first cover plate 10, a reserved length is used to prepare the first conductive member 51. The first conductive member 51 can be formed by removing excess second conductive layer 3 and first insulating layer 2 between the first cover plate 10 and the second cover plate 20 through etching or CNC cutting, thereby increasing the length of the layer used to form the first conductive layer 1. After the excess length is fixed to the second cover plate 20 to enclose the accommodating cavity 101, it is formed into the shape of the first conductive member 51 through a process such as lamination.

[0275] For example, electrical conduction can be achieved between the first conductive member 51 and the third conductive layer 21 by solderless welding, conductive solder welding, or conductive adhesive bonding.

[0276] In some embodiments, when the second insulating layer 22 is not provided on the second cover plate 20 , the side surface 212 of the third conductive layer 21 and the side surface 232 of the fourth conductive layer 23 constitute the side surface of the second cover plate 20 .

[0277] In other embodiments, a portion of the first conductive member 51 may be fixed to the surface of the first conductive layer 1 away from the accommodating cavity 101 (i.e., the top surface 102 of the temperature vapor chamber 100), and a portion may be fixed to the side surface 212 of the third conductive layer 21. For example, the first conductive member 51 and the third conductive layer 21 may be integrally formed structural members.

[0278] In other embodiments, the first conductive member 51 may be an independent structural member. For example, the first conductive member 51 may be fixed to the first conductive layer 1 by welding with conductive solder or gluing with conductive adhesive, and may be electrically connected to the first conductive layer 1 .

[0279] In some embodiments, the same technical contents as those of the vapor chamber 100 in the above embodiments are not described in detail. Fig. 12 is a schematic structural diagram of another embodiment of the structure shown in Fig. 4 at position B.

[0280] As shown in Figures 4 and 12, the first conductive member 51 can be an independent structural member. A portion of the first conductive member 51 can be fixed to the first conductive layer 1, and a portion can be fixed to the third conductive layer 21. For example, a portion of the first conductive member 51 can be fixed to the surface of the first conductive layer 1 away from the accommodating cavity 101 (i.e., the top surface 102 of the vapor chamber 100), and a portion can be fixed to the surface of the third conductive layer 21 away from the accommodating cavity 101 (i.e., the bottom surface 103 of the vapor chamber 100).

[0281] It can be understood that a portion of the first conductive member 51 is fixed to the top surface 102 of the temperature equalizing plate 100, and a portion is fixed to the bottom surface 103 of the temperature equalizing plate 100. In this embodiment, the electrical connection area between the first conductive member 51 and the first conductive layer 1 and the second cover plate 20 is less limited, and the connection area between the first conductive member 51 and the first conductive layer 1 and the second cover plate 20 can be set larger, the process is simpler, and the electrical connection reliability is better.

[0282] For example, the first conductive member 51 can be fixed to the first conductive layer 1 and the third conductive layer 21 by solderless welding or conductive solder welding, and can be electrically conductive with the first conductive layer 1 and the third conductive layer 21. In other embodiments, the first conductive member 51 can be fixed to the first conductive layer 1 and the second cover plate 20 by bonding with a conductive adhesive. It will be appreciated that, compared to an integrated molding solution, the external connection of the first conductive member 51 in this embodiment provides a simpler process and lowers process costs.

[0283] In some embodiments, the preparation process of the temperature vapor chamber 100 may include: first preparing the first conductive member 51 , and then fixing the first conductive member 51 to the first conductive layer 1 and the third conductive layer 21 by welding or gluing.

[0284] In some embodiments, the first conductive member 51 may be spaced apart from the side surface 11 of the first conductive layer 1, the side surface 31 of the second conductive layer 3, the side surface 2001 of the first insulating layer 2, the side surface 212 of the third conductive layer 21, the side surface 222 of the second insulating layer 22, and the side surface 232 of the fourth conductive layer 23 (as shown in FIG12 ). In other embodiments, the first conductive member 51 may be in direct contact with and fixed to one or more of the side surface 11 of the first conductive layer 1, the side surface 31 of the second conductive layer 3, the side surface 2001 of the first insulating layer 2, the side surface 212 of the third conductive layer 21, the side surface 222 of the second insulating layer 22, and the side surface 232 of the fourth conductive layer 23. In this way, the fixed connection area between the first conductive member 51 and the first cover plate 10 and the second cover plate 20 is larger, and the connection stability is better.

[0285] FIG13 is a schematic structural diagram of yet another embodiment of the structure shown in FIG12 .

[0286] As shown in FIG13 , the first conductive member 51 may include a first sub-portion 591 and a second sub-portion 592. A portion of the first sub-portion 591 may be fixed to the top surface 102 of the vapor chamber 100, and a portion thereof may be fixed to the second sub-portion 592. A portion of the second sub-portion 592 may be fixed to the bottom surface 103 of the vapor chamber 100. For example, a portion of the first sub-portion 591 may be fixed to a surface of the first conductive layer 1 away from the accommodating cavity 101, a portion thereof may be fixed to the second sub-portion 592, and a portion of the second sub-portion 592 may be fixed to a surface of the third conductive layer 21 away from the accommodating cavity 101. The first conductive layer 1 may be electrically connected to the bottom surface 103 of the vapor chamber 100 via the first sub-portion 591 and the second sub-portion 592.

[0287] It is understood that in this embodiment, the first conductive member 51 may have a protruding free end (i.e., the portion connecting the first sub-portion 591 and the second sub-portion 592). When the vapor chamber 100 is installed in the electronic device 1000, this free end can be made longer so that it can be directly connected to the middle frame 310 or the screen 400 to achieve electrical connection. In other words, when the free end of the first conductive member 51 is long enough, the vapor chamber 100 can be electrically connected to the screen 400 or the vapor chamber 100 can be electrically connected to the middle frame 310 at a distance from the vapor chamber 100.

[0288] In some embodiments, the length of the first sub-portion 591 outside the side surface 11 of the first conductive layer 1 along the X-axis direction is greater than the thickness of the first sub-portion 591 along the Z-axis direction. The outside of the side surface 11 of the first conductive layer 1 refers to the side of the side surface 11 away from the receiving cavity 101.

[0289] In some embodiments, the length of the portion of the second sub-portion 592 outside the side surface 212 of the third conductive layer 21 along the X-axis direction is greater than the thickness of the second sub-portion 592 along the Z-axis direction. The outside of the side surface 212 refers to the side of the side surface 212 away from the receiving cavity 101 (as shown in FIG4 ).

[0290] In some embodiments, the first sub-section 591 and the second sub-section 592 may be two independent structural members, that is, the first sub-section 591 and the second sub-section 592 may be manufactured through different processes.

[0291] In some embodiments, the manufacturing process of the vapor chamber 100 may include: separately preparing a first sub-portion 591 and a second sub-portion 592, then securing a portion of the first sub-portion 591 to a side of the first conductive layer 1 away from the first insulating layer 2. Securing a portion of the second sub-portion 592 to a side of the second cover plate 20 away from the second conductive layer 3, and then connecting the first sub-portion 591 and the second sub-portion 592. Alternatively, the first sub-portion 591 and the second sub-portion 592 may be first connected to form the first conductive member 51, and then the first sub-portion 591 and the second sub-portion 592 may be secured to the first conductive layer 1 and the second cover plate 20, respectively.

[0292] For example, the first sub-section 591 and the second sub-section 592 can be fixedly connected and electrically connected by a pressing or welding process.

[0293] In other embodiments, the first sub-section 591 and the second sub-section 592 may also be integrally formed structural members. It is understood that when the first sub-section 591 and the second sub-section 592 are integrally formed structural members, the free ends may be formed by folding or cutting.

[0294] 12 and 13 are not affected by the layer structure of the second cover plate 20, and the first conductive layer 1 can be electrically connected through the first conductive member 51 and the bottom surface 103 of the temperature homogenizing plate 100. The second cover plate 20 can also be made entirely of conductive material.

[0295] In some embodiments, the same technical contents as those of the vapor chamber 100 in the above embodiments are not described in detail. Fig. 14 is a schematic structural diagram of another embodiment of the structure shown in Fig. 4 at position B.

[0296] As shown in FIG14 , the first cover plate 10 may be provided with a first through-hole 4, which may penetrate the first conductive layer 1, the first insulating layer 2, and the second conductive layer 3. The edge sealing area 202 of the second cover plate 20 may be provided with a second through-hole 24 (for ease of understanding, the first through-hole 4 and the second through-hole 24 are schematically distinguished by a dotted line in FIG14 ). The second through-hole 24 may penetrate the second cover plate 20. The first through-hole 4 communicates with the second through-hole 24. For example, when the second cover plate 20 includes a third conductive layer 21, a fourth conductive layer 23, and a second insulating layer 22, the second through-hole 24 penetrates the third conductive layer 21, the fourth conductive layer 23, and the second insulating layer 22.

[0297] For example, the first through hole 4 and the accommodating cavity 101 are spaced apart, and the first through hole 4 is connected to the second through hole 24. A portion of the first conductive member 51 is located within the first through hole 4, and a portion of the first conductive member 51 is located within the second through hole 24. One end of the first conductive member 51 is fixed to the first conductive layer 1, and the other end is fixed to the third conductive layer 21. One end of the first conductive member 51 is electrically connected to the first conductive layer 1, and the other end is electrically connected to the third conductive layer 21. It can be understood that by providing through holes, the first conductive member 51 is located within the first through hole 4 and the second through hole 24, and the first conductive member 51 is not easily removed from the first through hole 4 and the second through hole 24, thereby improving the electrical connection reliability between the first conductive layer 1 and the second cover plate 20.

[0298] In some embodiments, the first conductive member 51 may be a solid structure, filling the first through hole 4 and the second through hole 24. In this way, the strength of the first conductive member 51 is improved, and the electrical connection stability between the first conductive layer 1 and the second cover plate 20 is improved.

[0299] For example, the first through hole 4 can be formed by mechanical drilling, laser drilling or chemical etching.

[0300] For example, the second through hole 24 may also be formed by mechanical drilling, laser drilling, or chemical etching.

[0301] For example, the first conductive member 51 can be a metal conductive layer formed by a deposition process, or filled with a conductive paste. It is understood that the metal conductive layer formed by the deposition process, or the conductive paste, can better adapt to the shape of the through-holes and better cover the walls of the first through-hole 4 and the second through-hole 24. This improves the electrical connection between the first conductive layer 1 and the second cover plate 20, and between the first conductive member 51 and the first conductive layer 1 and the third conductive layer 21, and improves the electrical connection stability between the top surface 102 and the bottom surface 103 of the vapor chamber 100.

[0302] In some embodiments, when the first conductive member 51 is formed by a deposition process, a pad can be placed on the side of the second cover plate 20 away from the second conductive layer 3. The pad can be used to seal the opening of the second through hole 24 on the surface of the side of the second cover plate 20 away from the second conductive layer 3 to prevent leakage of the deposited metal.

[0303] In other embodiments, the second through hole 24 may not penetrate the fourth conductive layer 23 . The first conductive layer 1 may be electrically connected to the third conductive layer 21 through the first conductive member 51 and the fourth conductive layer 23 .

[0304] In other embodiments, the first conductive member 51 may also be made of conductive materials such as conductive foam and conductive rubber.

[0305] Fig. 15 is a schematic structural diagram of another embodiment of the structure shown in Fig. 14. For ease of understanding, the first through hole 4 and the second through hole 24 are schematically distinguished by dotted lines in Fig. 15.

[0306] As shown in Figure 15, the first conductive member 51 can also be a hollow structure. For example, the first conductive member 51 can have a cavity 501, and the cavity 501 and the wall of the first through hole 4 and the wall of the second through hole 24 are spaced apart. It can be understood that compared with the solution in which the first conductive member 51 is a solid structure, the first conductive member 51 in this embodiment is a hollow structure, the material cost is lower, the weight of the first conductive member 51 is smaller, and it is conducive to the lightweighting of the temperature uniform plate 100. It can be understood that the structure of the first through hole 4, the second through hole 24 and the first conductive member 51 shown in Figures 14 and 15 does not limit the layer structure of the second cover plate 20. The second cover plate 20 can be any layer structure. The second cover plate 20 may include the second insulating layer 22 or may not include the second insulating layer 22, and the whole is made of conductive material.

[0307] Fig. 16 is a schematic structural diagram of another embodiment of the structure shown in Fig. 14. For ease of understanding, the first through hole 4 and the second through hole 24 are schematically distinguished by dotted lines in Fig. 16.

[0308] As shown in Figures 4 and 16, the second through hole 24 may not penetrate the third conductive layer 21. In this case, the second through hole 24 only penetrates the fourth conductive layer 23 and the second insulating layer 22. The top surface 211 of the third conductive layer 21 is exposed at the second through hole 24. The top surface 211 of the third conductive layer 21 is the side surface of the third conductive layer 21 facing the receiving cavity 101.

[0309] It can be understood that, compared to the structure shown in FIG14 , in this embodiment, the top surface 211 of the third conductive layer 21 is exposed at the second through hole 24, and the first conductive member 51 can be fixed to the top surface 211 of the third conductive layer 21 and electrically connected to the third conductive layer 21. The connection area between the first conductive member 51 and the third conductive layer 21 is larger, and the electrical connection reliability between the first conductive member 51 and the third conductive layer 21 is better.

[0310] In addition, when the first conductive member 51 is installed into the first through hole 4 and the second through hole 24, the third conductive layer 21 can be used to act as a pad to seal one end of the second through hole 24, and the first conductive member 51 can be installed into the first through hole 4 and the second through hole 24 from the opening of the first through hole 4 on the first conductive layer 1 without the need to set up a separate sealing mold.

[0311] Fig. 17 is a schematic structural diagram of yet another embodiment of the structure shown in Fig. 16. For ease of understanding, the first through hole 4 and the second through hole 24 are schematically distinguished by dotted lines in Fig. 17.

[0312] As shown in FIG17 , the first conductive member 51 can be a hollow structure. For example, the first conductive member 51 can have a cavity 501, and the cavity 501 is spaced apart from the wall of the first through hole 4, the wall of the second through hole 24, and the top surface 211 of the third conductive layer 21. The first conductive member 51 can be fixed to the wall of the first through hole 4, the wall of the second through hole 24, and the top surface 211 of the third conductive layer 21. Thus, the first conductive member 51 electrically connects the first conductive layer 1 and the third conductive layer 21. It can be understood that, compared to the structure of the first conductive member 51 shown in FIG15 , the connection area between the first conductive member 51 and the third conductive layer 21 in this embodiment is larger, and the connection strength between the first conductive member 51 and the second cover plate 20 is better. Compared to the structure of the first conductive member 51 shown in FIG16 , the first conductive member 51 in this embodiment requires less material, has lower material cost, and is lighter in weight than the heat spreader 100, which is conducive to lightweighting of the heat spreader 100.

[0313] In other embodiments, the third conductive layer 21 may also be exposed in the cavity 501 .

[0314] Fig. 18 is a schematic structural diagram of yet another embodiment of the structure shown in Fig. 14. Fig. 19 is a schematic structural diagram of yet another embodiment of the structure shown in Fig. 18.

[0315] As shown in Figures 18 and 19, when the second cover plate 20 is entirely made of a conductive material, the second cover plate 20 may not be provided with the second through hole 24. For example, the first cover plate 10 may be provided with a first through hole 4, which may penetrate the first conductive layer 1, the second conductive layer 3, and the first insulating layer 2. The top surface 25 of the second cover plate 20 is exposed in the first through hole 4. The first conductive member 51 may be located in the first through hole 4, with one end of the first conductive member 51 fixed to the first conductive layer 1 and the other end fixed to the top surface 25 of the second cover plate 20. One end of the first conductive member 51 is electrically connected to the first conductive layer 1, and the other end is electrically connected to the second cover plate 20. In this way, the first conductive layer 1 can be electrically connected to the top surface 25 of the second cover plate 20 via the first conductive member 51.

[0316] In some embodiments, the first conductive member 51 may be a hollow structure. For example, the first conductive member 51 may have a cavity 501 , and the cavity 501 and the wall surface of the first through hole 4 and the top surface 25 of the second cover plate 20 are spaced apart.

[0317] In other embodiments, when the second cover plate 20 is entirely made of conductive material, the second through hole 24 may also pass through the entire or a portion of the second cover plate 20 .

[0318] Fig. 20 is a schematic structural diagram of yet another embodiment of the structure shown in Fig. 18. Fig. 21 is a schematic structural diagram of yet another embodiment of the structure shown in Fig. 19.

[0319] As shown in Figures 20 and 21, the second cover plate 20 is made of a conductive material as a whole. The second cover plate 20 may not be provided with the second through hole 24. The first through hole 4 may not penetrate the second conductive layer 3. For example, the first through hole 4 may penetrate the first conductive layer 1 and the first insulating layer 2. The top surface 32 of the second conductive layer 3 may be exposed in the first through hole 4. The top surface 32 of the second conductive layer 3 is the side surface of the second conductive layer 3 away from the second cover plate 20. The first conductive member 51 may be located in the first through hole 4. One end of the first conductive member 51 is fixed to the first conductive layer 1, and the other end is fixed to the second conductive layer 3. The second conductive layer 3 is electrically connected to the second cover plate 20. One end of the first conductive member 51 is electrically connected to the first conductive layer 1, and the other end is electrically connected to the second conductive layer 3. In this way, the first conductive layer 1 can be electrically connected to the second cover plate 20 via the first conductive member 51 and the second conductive layer 3.

[0320] Exemplarily, the first conductive member 51 may be solid (as shown in FIG. 20 ) or hollow (as shown in FIG. 21 ).

[0321] Illustratively, when the first conductive member 51 is hollow, the first conductive member 51 may have a cavity 501 , the cavity 501 and the wall of the first through hole 4 are spaced apart, and the top surface 32 of the second conductive layer 3 is exposed in the cavity 501 .

[0322] Fig. 22 is a schematic structural diagram of yet another embodiment of the structure shown in Fig. 14. For ease of understanding, the first through hole 4 and the second through hole 24 are schematically distinguished by dotted lines in Fig. 22.

[0323] As shown in Figure 22, the first conductive member 51 can be a screw or bolt. The first cover plate 10 is provided with a first through-hole 4. The first through-hole 4 extends through the first conductive layer 1, the first insulating layer 2, and the second conductive layer 3. The edge sealing area 202 of the second cover plate 20 can be provided with a second through-hole 24. The second through-hole 24 can extend through the second cover plate 20. A portion of the first conductive member 51 is located within the first through-hole 4, and a portion is located within the second through-hole 24. The first conductive member 51 is fixed to the wall of the first through-hole 4 and the wall of the second through-hole 24. A portion of the first conductive member 51 is electrically connected to the first conductive layer 1, and a portion is electrically connected to the second cover plate 20. The first conductive layer 1 can be electrically connected to the second cover plate 20 via the first conductive member 51.

[0324] It is understandable that the first conductive member 51 is a screw or a bolt, which can strengthen the connection between the first cover plate 10 and the second cover plate 20 , and the electrical connection between the first conductive layer 1 and the second cover plate 20 is more stable.

[0325] Illustratively, when the second cover plate 20 includes the third conductive layer 21 , the fourth conductive layer 23 , and the second insulating layer 22 , a portion of the first conductive member 51 may be electrically connected to the third conductive layer 21 .

[0326] Figure 23a is a schematic structural diagram of the vapor chamber 100 shown in Figures 14 to 22 at another angle. For ease of understanding, Figure 23a schematically distinguishes the active area 201, the edge sealing area 202, and the first conductive member 51 by dashed lines and fill patterns.

[0327] As shown in Figure 23a, along the thickness direction of the vapor chamber 100, the projection of the first conductive member 51 on the second cover plate 20 overlaps with the edge sealing area 202. In this way, the area of ​​the vapor chamber 100 on the XY plane is not increased.

[0328] The temperature distribution plate 100 may include one or more first conductive members 51. When there are multiple first conductive members 51, the multiple first conductive members 51 are spaced apart from each other. It is understood that if the width of the edge sealing area 202 of the second cover plate 20 is limited and the electrical connection area of ​​a single first conductive member 51 cannot meet the electrical connection stability requirements between the first conductive layer 1 and the second cover plate 20, multiple first conductive members 51 may be provided to increase the electrical connection area between the first conductive layer 1 and the second cover plate 20 and enhance the electrical connection stability between the two.

[0329] For example, a plurality of first conductive members 51 may be spaced apart and arranged around the active area 201 of the second cover plate 20 .

[0330] For example, FIG23 a shows 18 first conductive members 51. The 18 first conductive members 51 can be arranged at intervals around the active area 201 of the second cover plate 20. Among them, three first conductive members 51 are located above the active area 201, three first conductive members 51 are located below the active area 201, six first conductive members 51 are located on the left side of the active area 201, and six first conductive members 51 are located on the right side of the active area 201.

[0331] Figure 23b is a schematic structural diagram of another embodiment of the structure shown in Figure 23a. For ease of understanding, Figure 23b schematically distinguishes the active area 201, the edge sealing area 202 and the first conductive member 51 through dotted lines and fill patterns.

[0332] As shown in FIG. 23 b , the vapor chamber 100 may include two first conductive members 51 , one first conductive member 51 may be located on the right side of the active area 201 , and one first conductive member 51 may be located above the active area 201 .

[0333] For example, the width of the edge-sealed area 202 provided with the first conductive member 51 can be greater than the width of the other edge-sealed areas 202 not provided with the first conductive member 51. In this way, the area of ​​the edge-sealed area 202 is sufficient to accommodate the first conductive member 51 while still having sufficient area for fixing to the second conductive layer 3, thereby ensuring the sealing stability of the accommodating cavity 101.

[0334] It can be understood that the projection of the first conductive member 51 on the second cover plate 20 along the thickness direction of the temperature homogenizing plate 100 is not limited to a circle as shown in FIG23a or a rectangle as shown in FIG23b, but can also be a triangle, an ellipse, a polygon or other irregular shapes.

[0335] It is understandable that when the temperature homogenizing plate 100 is provided with a plurality of first conductive members 51 , the shapes of the plurality of first conductive members 51 may also be different.

[0336] For example, when there is only one first conductive member 51 , the projection of the first conductive member 51 on the second cover plate 20 can be located at any position of the edge sealing area 202 .

[0337] In the embodiments shown in FIG. 14 to FIG. 17 and FIG. 22 , the first through holes 4 are all connected to the second through holes 24 . Hereinafter, an embodiment in which the first through holes 4 and the second through holes 24 are not connected will be described with reference to the accompanying drawings.

[0338] Figure 24a is a schematic structural diagram of yet another embodiment of the structure shown in Figure 4. Figure 24b is a schematic structural diagram of an embodiment of the structure shown in Figure 24a at another angle.

[0339] As shown in Figures 24a and 24b, the first cover plate 10 is provided with a first through hole 4. The first through hole 4 can penetrate the first conductive layer 1, the first insulating layer 2, and the second conductive layer 3. The edge sealing area 202 of the second cover plate 20 can be provided with a second through hole 24, which penetrates the fourth conductive layer 23, the second insulating layer 22, and the third conductive layer 21. The projection of the first through hole 4 on the reference plane along the first direction and the projection of the second through hole 24 on the reference plane along the first direction are offset. The second conductive layer 3 can be exposed within the second through hole 24. The reference plane is the plane where the first conductive layer 1 is located, and the first direction is the direction from the second cover plate 20 toward the first cover plate 10.

[0340] In some embodiments, the vapor chamber 100 may include a first conductive member 51 and a fifth conductive member 55. For example, the first conductive member 51 may be located within the first through-hole 4, with one end of the first conductive member 51 fixed to the first conductive layer 1 and the other end fixed to the second conductive layer 3. Thus, the first conductive layer 1 may be electrically connected to the second conductive layer 3 via the first conductive member 51.

[0341] For example, the fifth conductive member 55 may be located in the second through hole 24. One end of the fifth conductive member 55 may be fixed to the second conductive layer 3, and the other end may be fixed to the third conductive layer 21. The second conductive layer 3 may be electrically connected to the third conductive layer 21 through the fifth conductive member 55.

[0342] It is understandable that the projection of the first through hole 4 on the reference plane along the first direction is staggered with the projection of the second through hole 24 on the reference plane along the first direction. When the first cover plate 10 and the second cover plate 20 are assembled, the assembly precision requirement is relatively low.

[0343] In other embodiments, the first through hole 4 may not penetrate the second conductive layer 3, and the first conductive member 51 may be fixed at one end to the first conductive layer 1 and at the other end to the second conductive layer 3. The first conductive layer 1 may also be electrically connected to the second conductive layer 3 through the first conductive member 51.

[0344] In other embodiments, the second through hole 24 may not penetrate the fourth conductive layer 23. The second conductive layer 3 is electrically connected to the fourth conductive layer 23. One end of the fifth conductive member 55 may be fixed to the fourth conductive layer 23, that is, one end of the fifth conductive member 55 is fixed through the fourth conductive layer 23 and electrically connected to the second conductive layer 3.

[0345] Exemplarily, the first conductive layer 1 may be electrically connected to the third conductive layer 21 through the first conductive member 51 , the second conductive layer 3 , and the fifth conductive member 55 .

[0346] In some embodiments, the first conductive member 51 and the fifth conductive member 55 may be spaced apart.

[0347] In other embodiments, the second through hole 24 may not penetrate the fourth conductive layer 23, and the fourth conductive layer 23 may be exposed in the second through hole 24. The first conductive layer 1 may be electrically connected to the third conductive layer 21 via the first conductive member 51, the second conductive layer 3, the fourth conductive layer 23, and the fifth conductive member 55.

[0348] In other embodiments, when the second cover plate 20 is not provided with the fourth conductive layer 23, the first conductive layer 1 may also be electrically connected to the third conductive layer 21 via the first conductive member 51, the second conductive layer 3, and the fifth conductive member 55. For example, the second through hole 24 may not penetrate the third conductive layer 21, but only penetrate the second insulating layer 22. The fifth conductive member 55 may also achieve electrical conduction between the second conductive layer 3 and the third conductive layer 21.

[0349] It can be understood that when the positions of the first through hole 4 and the second through hole 24 are selectively set, the electrical conduction between the first conductive layer 1 and the third conductive layer 21 can be achieved with the help of the conductive layer of the first cover plate 10 and / or the second cover plate 20 itself, and the layers through which the first through hole 4 and the second through hole 24 respectively pass can be selected according to actual conditions.

[0350] FIG25 is a schematic structural diagram of another embodiment of the structure shown in FIG4 at position B. FIG.

[0351] As shown in Figures 4 and 25, the first conductive layer 1 may include a first portion 12, a second portion 13, and a third portion 14 (the first portion 12, the second portion 13, and the third portion 14 are schematically distinguished by dashed lines in Figure 25). The first insulating layer 2 includes a first portion 15, a second portion 16, and a third portion 17 (the first portion 15, the second portion 16, and the third portion 17 are schematically distinguished by dashed lines in Figure 25). The first portion 15 of the first insulating layer 2 is disposed opposite the top surface 25 of the second cover plate 20. The first portion 12 of the first conductive layer 1 is located on the side of the first portion 15 of the first insulating layer 2 away from the top surface 25, the second portion 16 of the first insulating layer 2 is arranged opposite to the side 27 of the second cover plate 20, the second portion 13 of the first conductive layer 1 is located on the side of the second portion 16 of the first insulating layer 2 away from the side 27 of the second cover plate 20, the third portion 17 of the first insulating layer 2 is arranged opposite to the bottom surface 26 of the second cover plate 20, and the third portion 14 of the first conductive layer 1 is located on the side of the third portion 17 of the first insulating layer 2 away from the bottom surface 26 of the second cover plate 20.

[0352] The first conductive member 51 may be located on a side of the second cover plate 20 away from the accommodating cavity 101. For example, a portion of the first conductive member 51 may be fixed to the third portion 14 of the first conductive layer 1, and a portion may be fixed to the bottom surface 26 of the second cover plate 20. The first conductive layer 1 is electrically connected to the bottom surface 26 of the second cover plate 20 via the first conductive member 51.

[0353] It can be understood that when the temperature equalizing plate 100 is installed on the electronic device 1000, the side surface of the second cover plate 20 away from the second conductive layer 3 can be fixed to the middle frame 310. At this time, the first conductive component 51 can be located between the middle frame 310 and the second cover plate 20. During the use of the electronic device 1000, the first conductive component 51 is not easy to fall off due to the electronic device 1000 being in a state of falling, bumping, squeezing, etc., and has better electrical connection reliability.

[0354] In some embodiments, the second conductive layer 3 may also include a first portion 33, a second portion 34, and a third portion 35 (the first portion 33, the second portion 34, and the third portion 35 are schematically distinguished by dashed lines in FIG25). The first portion 33 of the second conductive layer 3 may be connected between the top surface 25 of the second cover plate 20 and the first portion 15 of the first insulating layer 2. The second portion 344 of the second conductive layer 3 may be connected between the side surface 27 of the second cover plate 20 and the second portion 16 of the first insulating layer 2. The third portion 35 of the second conductive layer 3 may be connected between the bottom surface 26 of the second cover plate 20 and the third portion 17 of the first insulating layer 2.

[0355] The above describes several structures of the temperature vapor chamber 100 with reference to the accompanying drawings. The following describes several installation methods of the temperature vapor chamber 100 in the electronic device 1000 and several grounding methods of the temperature vapor chamber 100 with reference to the accompanying drawings.

[0356] Figure 26 is a schematic diagram of the assembly of the middle frame 310 and the vapor chamber 100 shown in Figure 2. Figure 27a is a partial cross-sectional view of the structure shown in Figure 26 at section line CC. Figure 27b is an enlarged schematic diagram of the structure shown in Figure 27a at section D.

[0357] As shown in Figures 26 to 27b, in order to make the internal components of the electronic device 1000 more compact, reduce the thickness of the electronic device 1000, and improve the heat transfer efficiency, an avoidance hole 3101 can be provided on the middle frame 310, and a part of the internal components 800 of the electronic device 1000 can be set in the avoidance hole.

[0358] Exemplarily, the internal device 800 may be a rear-mounted camera module. The camera module may be located in the storage space 1001 of the electronic device 1000. The camera module may be fixed to the middle frame 310. The lighting surface of the camera module may face the back cover 320. The back cover 320 may be provided with a light-transmitting hole 2201. The light-transmitting hole 2201 connects the interior of the electronic device 1000 (i.e., the storage space 1001) to the outside of the electronic device 1000. Light outside the electronic device 1000 may enter the storage space 1001 of the electronic device 1000 through the light-transmitting hole 2201. The camera module may collect ambient light entering the interior of the electronic device 1000.

[0359] In some embodiments, the back cover 320 may include a light-transmitting lens 3202 , which may be mounted on the light-transmitting hole 2201 to allow light to pass through and to be dust-proof and waterproof.

[0360] Exemplarily, the internal device 800 may also be a chip.

[0361] Exemplarily, the number of the avoidance holes 3101 may be one or more.

[0362] In some embodiments, the temperature vapor chamber 100 may include an extension area 104, and the side surface 1041 of the extension area 104 may be spaced apart from the middle frame 310. It is understandable that the temperature vapor chamber 100 may be an irregular shape in the XY plane to match the shape of the middle frame 310 of the electronic device 1000. The shape of the middle frame 310 is related to the installation position of the internal components of the electronic device 1000. For example, the middle frame 310 may be provided with an avoidance hole 3101, which can be used to install the camera module 800. When the temperature vapor chamber 100 is installed on the middle frame 310, an extension area 104 may be provided near the avoidance hole 3101 for overlapping with the middle frame 310.

[0363] For example, the side surface 1041 of the extension region 104 may be a portion of the side surface of the vapor chamber 100 . The extension region 104 may include a portion of the first conductive layer 1 or a portion of the third conductive layer 21 .

[0364] For example, the temperature vapor chamber 100 may be bonded to the middle frame 310 by adhesive 900. The adhesive 900 may be made of an insulating material or a conductive material.

[0365] In some embodiments, in the thickness direction of the electronic device 1000 , a projection of the extended area 104 on the plane where the middle frame 310 is located at least partially overlaps with the middle frame 310 .

[0366] In some embodiments, when the backing glue 900 is an insulating material, the electronic device 1000 may further include a first electrical connector 901, a portion of which may be fixed to the temperature equalizing plate 100 and electrically connected to the temperature equalizing plate 100, and a portion of which may be fixed to the middle frame 310 and electrically connected to the middle frame 310.

[0367] In some embodiments, the first electrical connector 901 can be at least partially fixed between the middle frame 310 and the bottom surface 1042 of the extended region 104. For example, the first electrical connector 901 can be electrically connected to the first conductive layer 1 and / or the third conductive layer 21. Both the top surface 102 and the bottom surface 103 of the vapor chamber 100 can be electrically connected to the middle frame 310 via the first electrical connector 901. The first electrical connector 901 can be at least partially fixed between the middle frame 310 and the bottom surface 1042 of the extended region 104, making it less likely for the first electrical connector 901 to fall off the middle frame or vapor chamber.

[0368] In some embodiments, a portion of the first electrical connector 901 may be connected to the first conductive layer 1, a portion may be connected to the third conductive layer 21, and another portion may be connected to the middle frame 310. The first electrical connector 901 may be made of a conductive material. In this way, both the third conductive layer 21 and the first conductive layer 1 of the vapor chamber 100 can be electrically connected to the middle frame 310 via the first electrical connector 901.

[0369] It is understandable that when the adhesive backing 900 is an insulating material, the first electrical connector 901 can be provided so that the second cover plate 20 and the first conductive layer 1 of the temperature equalizing plate 100 can be electrically connected to the middle frame 310 through the first electrical connector 901. For example, the first electrical connector 901 is electrically connected to the first conductive layer 1 of the temperature equalizing plate 100. The bottom surface 103 of the temperature equalizing plate 100 can be electrically connected to the first conductive layer 1 through the first conductive member 51, and further grounded through the first electrical connector 901. The first conductive layer 1 can be directly grounded through the first electrical connector 901. Therefore, when the top surface 102 or the bottom surface 103 of the temperature equalizing plate 100 makes unstable electrical contact with the charged device inside the electronic device 1000, the current can be grounded along the first electrical connector 901.

[0370] Exemplarily, the first electrical connector 901 may be conductive foam, conductive glue, conductive paste, metal sheet, etc.

[0371] In some embodiments, the first electrical connector 901 may also be partially fixed between the middle frame 310 and the side surface 1041 of the extension region 104. It is understood that when the first electrical connector 901 is a conductive paste or conductive adhesive, the gap between the middle frame 310 and the side surface 1041 of the extension region 104 may be used to accommodate overflow of the first electrical connector 901.

[0372] In some embodiments, the minimum resistance between any point on the top surface 102 of the temperature vapor chamber 100 and any point on the middle frame 310 may be less than 10 15 Ohm (Ω). Exemplarily, the resistance value between any point on the top surface 102 of the temperature vapor chamber 100 and any point on the middle frame 310 can be less than 1000Ω. The resistance value between any point on the top surface 102 and any point on the middle frame 310 can be 0.05Ω, 0.5Ω, 1Ω, 3Ω, 5Ω, 20Ω, 200Ω, 500Ω, 700Ω or 999Ω. In this way, the resistance value between the top surface 102 and the middle frame 310 when they are in an electrically connected state is small. The grounding effect of the top surface 102 and the bottom surface 103 of the temperature vapor chamber 100 is better.

[0373] In some embodiments, the first electrical connector 901 may also be connected to the top surface 102 of the vapor chamber 100 .

[0374] In some embodiments, when the backing adhesive 900 is a conductive material, the temperature equalizing plate 100 can be electrically connected to the middle frame 310 through the backing adhesive 900, and there is no need to reserve space for setting the first electrical connector 901. The internal device arrangement of the electronic device 1000 is simpler, and the space originally reserved for setting the first electrical connector 901 can be used to arrange other devices required by the electronic device 1000, which is conducive to the multifunctionality of the electronic device 1000.

[0375] In some embodiments, the same technical contents as those in the above embodiments are not described in detail. Fig. 28 is a schematic diagram of electrical connections between the middle frame 310 and the vapor chamber 100 shown in Fig. 2 in another embodiment.

[0376] As shown in Figure 28, when the vapor chamber 100 is mounted on the middle frame 310, a portion of the first electrical connector 901 can be fixed to the top surface 102 of the vapor chamber 100, and a portion can be fixed to the middle frame 310. In this way, the top surface 102 of the vapor chamber 100 can be electrically connected to the middle frame 310 via the first electrical connector 901. For example, the surface of the first conductive layer 1 of the vapor chamber 100 that is away from the second cover plate 20 is the top surface 102 of the vapor chamber 100, and the first electrical connector 901 can connect the first conductive layer 1 of the vapor chamber 100 and the middle frame 310.

[0377] It can be understood that compared with the electrical connection scheme shown in Figure 27b, the technical difficulty of fixing the first electrical connector 901 and the temperature spreader 100 in this embodiment, as well as the fixed connection with the middle frame 310 is smaller, and the assembly difficulty of the electronic device 1000 is smaller.

[0378] It is understood that, as shown in Figures 4 and 28 , electrical conduction is achieved between the top surface 102 and the bottom surface 103 of the vapor chamber 100 via the first conductive member 51. Therefore, when unstable electrical contact occurs between the bottom surface 103 of the vapor chamber 100 and internal components of the electronic device 100, current can be grounded by sequentially passing through the bottom surface 103, the first conductive member 51, the top surface 102, the first electrical connector 901, and the middle frame 310.

[0379] In some embodiments, the same technical contents as those in the above embodiments are not described in detail. Fig. 29 is a schematic diagram of electrical connections between the middle frame 310 and the vapor chamber 100 shown in Fig. 2 in another embodiment.

[0380] As shown in Figure 29, when the vapor chamber 100 is mounted on the middle frame 310, the first electrical connector 901 can be partially connected to the first conductive member 51 and partially connected to the middle frame 310. The first electrical connector 901 can be electrically connected to the first conductive member 51. In this way, the top surface 102 or the bottom surface 103 of the vapor chamber 100 can be grounded through the path of the first conductive member 51, the first electrical connector 901, and the middle frame 310.

[0381] It is understood that there can be multiple first electrical connectors 901, and the multiple first electrical connectors 901 are spaced apart. The locations where the multiple first electrical connectors 901 connect to the vapor chamber 100 can be different, that is, the multiple first electrical connectors 901 can adopt one or more of the forms shown in Figures 27a, 28, and 29.

[0382] In some embodiments, there may be multiple extension regions 104 , and the multiple first electrical connectors 901 are respectively connected to the multiple extension regions 104 .

[0383] In some embodiments, the same technical contents as those in the above embodiments are not described in detail. Fig. 30 is a schematic diagram of electrical connections between the middle frame 310 and the vapor chamber 100 shown in Fig. 2 in another embodiment.

[0384] As shown in Figures 3 and 30, the first conductive member 51 of the temperature vapor chamber 100 can also be directly electrically connected to the middle frame 310. For example, when the first conductive member 51 of the temperature vapor chamber 100 is a screw, the middle frame 310 can be provided with a mounting hole 3102. A portion of the first conductive member 51 can be fixed in the first through hole 4, a portion can be fixed in the second through hole 24, and a portion can be fixed in the mounting hole 3102. The first conductive member 51 can contact and electrically connect the temperature vapor chamber 100 and the middle frame 310. It can be understood that the middle frame 310 is generally made of a conductive metal material, and the first conductive member 51 is made of a conductive material. Therefore, the first conductive member 51 can be electrically connected to the middle frame 310.

[0385] It is understood that the electrical connection between the middle frame 310 and the first conductive member 51 is achieved without the need for an additional electrical connection structure between the vapor chamber 100 and the middle frame 310. Furthermore, the first conductive member 51 of the vapor chamber 100 can also be used to strengthen the connection between the vapor chamber 100 and the middle frame 310.

[0386] In some embodiments, when the vapor chamber 100 adopts the structure shown in FIG. 13 , the free end of the first conductive member 51 can be used to electrically connect to the middle frame 310 .

[0387] In some embodiments, the same technical contents as those in the previous embodiments are not described in detail. FIG31 is a partial structural diagram of another embodiment of the electronic device 1000 shown in FIG1 on line AA. FIG32 is an enlarged schematic diagram of an embodiment of the structure shown in FIG31 at position E.

[0388] As shown in Figures 31 and 32 , the vapor chamber 100 can be mounted on the back surface 401 of the screen 400. The back surface 401 of the screen 400 is disposed opposite the display surface of the screen 400. For example, the vapor chamber 100 can be bonded to the back surface 401 of the screen 400 using adhesive 999. It is understood that when the vapor chamber 100 is mounted on the screen 400, the screen 400 serves as a support.

[0389] In some embodiments, the adhesive backing 999 does not completely cover the top surface 102 of the vapor chamber 100. A portion of the top surface 102 of the vapor chamber 100 may face and be spaced apart from the back surface 401 of the screen 400. This allows the vapor chamber 100 to avoid interference with components mounted on the back surface 401 of the screen 400 when mounted on the back surface 401 of the screen 400.

[0390] In some embodiments, when the temperature vapor chamber 100 is mounted on the screen 400, the first conductive layer 1 can be fixed to the back surface 401 of the screen 400, or the second cover 20 can be fixed to the back surface 401 of the screen 400. FIG31 takes the second cover 20 being fixed to the screen 400 as an example for description.

[0391] Exemplarily, the top surface 102 of the vapor chamber 100 faces the screen, and the bottom surface 103 faces the middle frame 310. When the second cover plate 20 is fixed to the screen 400, the surface of the second cover plate 20 facing the screen 400 becomes the top surface 102 of the vapor chamber 100, and the surface of the first conductive layer 1 facing away from the screen 400 becomes the bottom surface 103 of the vapor chamber 100.

[0392] In some embodiments, a portion of the first electrical connector 901 can be connected to the bottom surface 103 of the vapor chamber 100, and a portion can be connected to the middle frame 310. The bottom surface 103 of the vapor chamber 100 can be electrically connected to the middle frame 310 through the first electrical connector 901. The middle frame 310 is grounded. In this way, the bottom surface 103 of the vapor chamber 100 can be grounded through the first electrical connector 901 and the middle frame 310 in sequence. The top surface 102 and the bottom surface 103 of the vapor chamber 100 are electrically conductive through the first conductive member 51. When the screen 400 and the top surface 102 of the vapor chamber 100 are in unstable electrical contact, the current on the top surface 102 of the vapor chamber 100 can be grounded through the top surface 102 of the vapor chamber 100, the first conductive member 51, the bottom surface 103 of the vapor chamber 100, the first electrical connector 901, and the middle frame 310 in sequence.

[0393] It is understandable that the bottom surface 103 of the vapor chamber 100 can be electrically connected to the middle frame 310 via the first electrical connector 901. When the electronic device 1000 is subjected to external force, or the user presses the screen 400, causing unstable electrical contact between the internal charged components of the electronic device 1000 and the top surface 102 and / or bottom surface 103 of the vapor chamber 100, the top surface 102 and bottom surface 103 of the vapor chamber 100 are electrically connected via the first conductive member 51. Therefore, the current on the bottom surface 103 of the vapor chamber 100 can be grounded via the path of bottom surface 103 - first electrical connector 901 - middle frame 310. The current on the top surface 102 of the vapor chamber 100 can be grounded via the path of top surface 102 - first conductive member 51 - bottom surface 103 - first electrical connector 901 - middle frame 310.

[0394] Exemplarily, the first electrical connection member 901 may be a conductive adhesive, a conductive sheet, a conductive foam, or a conductive spring.

[0395] In some embodiments, the screen 400 and the vapor chamber 100 can share a common first electrical connector 901 for grounding. The electronic device 1000 can also include a second electrical connector 904. One end of the second electrical connector 904 is connected to the vapor chamber 100, and the other end is connected to the back surface 401 of the screen 400. One end of the second electrical connector 904 is electrically connected to the top surface 102 and / or bottom surface 103 of the vapor chamber 100, and the other end is electrically connected to the screen 400. The screen 400 can be electrically connected to the middle frame 310 via the second electrical connector 904, the vapor chamber 100, and the first electrical connector 901.

[0396] It is understood that the grounding path of the screen 400 is related to the electrical connection location between the second electrical connector 904 and the vapor chamber 100. For example, one end of the second electrical connector 904 can simultaneously contact and electrically connect the top surface 102 and the bottom surface 103 of the vapor chamber 100. The screen 400 can be grounded via the path of the second electrical connector 904, the top surface 102, the first conductive element 51, the bottom surface 103, the first electrical connector 901, and the middle frame 310. Simultaneously, the screen 400 can also be grounded via the path of the second electrical connector 904, the bottom surface 103, the first electrical connector 901, and the middle frame 310.

[0397] In other embodiments, when one end of the second electrical connector 904 only contacts and is electrically connected to the top surface 102 of the temperature vapor chamber 100, the screen 400 can be grounded through the path of the second electrical connector 904-top surface 102-first conductive component 51-bottom surface 103-first electrical connector 901-middle frame 310.

[0398] Exemplarily, the second electrical connection member 904 may be a conductive adhesive or a conductive sheet.

[0399] In some embodiments, the same technical contents as those in the previous embodiments (the embodiment shown in FIG32 ) are not described in detail. FIG33 is an enlarged schematic diagram of another embodiment of the structure shown in FIG31 at position E.

[0400] As shown in Figures 31 and 33, electronic device 1000 may not include first electrical connector 901. Instead, electronic device 1000 may include second electrical connector 904 and third electrical connector 905. One end of third electrical connector 905 may be fixed to and electrically connected to screen 400, while the other end may be fixed to and electrically connected to middle frame 310. In this way, screen 400 may be electrically connected to middle frame 310 via third electrical connector 905 and then grounded via middle frame 310.

[0401] It can be understood that the grounding paths at two locations on the top surface 102 and the bottom surface 103 of the vapor chamber 100 are related to the electrical connection locations between the second electrical connector 904 and the vapor chamber 100 .

[0402] For example, when one end of the second electrical connector 904 simultaneously contacts and electrically connects the top surface 102 and bottom surface 103 of the vapor chamber 100, the top surface 102 of the vapor chamber 100 can be grounded via the path of top surface 102 - first conductive member 51 - bottom surface 103 - second electrical connector 904 - screen 400 - third electrical connector 905 - middle frame 310. Simultaneously, the top surface 102 of the vapor chamber 100 can also be grounded via the path of top surface 102 - second electrical connector 904 - screen 400 - third electrical connector 905 - middle frame 310. The bottom surface 103 of the vapor chamber 100 can be grounded via the path of bottom surface 103 - second electrical connector 904 - screen 400 - third electrical connector 905 - middle frame 310.

[0403] For example, when one end of the second electrical connector 904 contacts and is electrically connected only to the top surface 102 of the vapor chamber 100, the top surface 102 of the vapor chamber 100 can be grounded via the path of top surface 102 - second electrical connector 904 - screen 400 - third electrical connector 905 - middle frame 310. The bottom surface 103 of the vapor chamber 100 can be grounded via the path of bottom surface 103 - first conductive element 51 - top surface 102 - second electrical connector 904 - screen 400 - third electrical connector 905 - middle frame 310.

[0404] For example, when one end of the second electrical connector 904 only contacts and is electrically connected to the bottom surface 103 of the vapor chamber 100, the top surface 102 of the vapor chamber 100 can be grounded via a path of top surface 102 - first conductive element 51 - bottom surface 103 - second electrical connector 904 - screen 400 - third electrical connector 905 - middle frame 310. The bottom surface 103 of the vapor chamber 100 can be grounded via a path of bottom surface 103 - second electrical connector 904 - screen 400 - third electrical connector 905 - middle frame 310.

[0405] It is understandable that the screen 400 and the temperature vapor chamber 100 can share the third electrical connection 905 for grounding.

[0406] Exemplarily, the third electrical connection member 905 may be a conductive adhesive, a conductive sheet, a conductive foam, or a conductive spring.

[0407] In some embodiments, the same technical contents as those in the previous embodiments (the embodiments shown in FIG32 and FIG33 ) are not described in detail. FIG34 is an enlarged schematic diagram of another embodiment of the structure shown in FIG31 at position E.

[0408] It is understandable that the above-mentioned conductive members can be arranged according to requirements, and the conductive members in different embodiments can also be used in combination according to requirements.

[0409] As shown in Figure 33, the temperature vapor chamber 100 and the screen 400 are electrically connected to the middle frame 310 respectively, and the two do not share a ground path. The electronic device 1000 can be provided with a first electrical connector 901 and a third electrical connector 905. The temperature vapor chamber 100 and the screen 400 are insulated. The top surface 102 of the temperature vapor chamber 100 can be grounded through the path of top surface 102-first conductive member 51-bottom surface 103-first electrical connector 901-middle frame 310. The bottom surface 103 of the temperature vapor chamber 100 can be grounded through the path of bottom surface 103-first electrical connector 901-middle frame 310. The screen 400 can be grounded through the path of screen 400-third electrical connector 905-middle frame 310.

[0410] In other embodiments, the electronic device 1000 may be provided with a third electrical connector 905 , a second electrical connector 904 and a third electrical connector 905 .

[0411] In this way, the top surface 102 and the bottom surface 103 of the vapor chamber 100 may have multiple grounding paths. When one of the paths fails, the other paths may still work normally, so that the vapor chamber 100 may be stably grounded.

[0412] In some embodiments, the same technical contents as those in the previous embodiments are not repeated.

[0413] The present application also provides an electronic device. The electronic device may include a temperature averaging plate, a heating device, a housing 300, and a screen 400. The screen 400 is mounted on the housing 300. The housing 300 and the screen 400 together enclose a storage space inside the electronic device. The temperature averaging plate and the heating device are both mounted in the storage space of the electronic device 1000. The installation method of the temperature averaging plate, the heating device, the housing, and the screen can refer to the installation method of the temperature averaging plate 100, the heating device 200, the housing 300, and the screen 400 described above, and will not be repeated here.

[0414] The temperature equalizing plate may include a first cover plate 10, a second cover plate 20, a capillary structure 30, and a cooling medium 40. The arrangement of the first cover plate 10, the second cover plate 20, the capillary structure 30, and the cooling medium 40 may refer to the arrangement of the first cover plate 10, the second cover plate 20, the capillary structure 30, and the cooling medium 40 described above.

[0415] The electronic device may further include an electrical connection structure, a portion of which is secured to the vapor chamber and electrically connects the top and bottom surfaces of the vapor chamber, and a portion of which is secured to the housing / screen and electrically connects the ground terminal of the electronic device. The top and bottom surfaces of the vapor chamber can be grounded via the electrical connection structure.

[0416] Illustratively, the first cover plate 10 includes a first conductive layer 1, a first insulating layer 2, and a second conductive layer 3. The first insulating layer 2 is connected between the first conductive layer 1 and the second conductive layer 3. The second conductive layer 3 is located on the side of the first insulating layer 2 that is close to the second cover plate 20. A portion of the electrical connection structure can be fixed to the first conductive layer 1 and electrically connected to the first conductive layer 1. The surface of the first conductive layer 1 that is away from the first insulating layer 2 serves as the top surface of the temperature vapor chamber.

[0417] In some embodiments, the second cover plate 20 is made of a conductive material. For example, a portion of the electrical connection structure can be fixed to any position of the second cover plate 20 and electrically connected to the second cover plate 20. For example, a portion of the electrical connection structure can also be fixed to the second conductive layer 3, and the electrical connection structure can be electrically connected to the second cover plate 20 through the second conductive layer 3.

[0418] In some embodiments, the second cover plate 20 includes a stacked third conductive layer 21 and a second insulating layer 22. The second insulating layer 22 is located on a side of the third conductive layer 21 that is closer to the second conductive layer 3. The surface of the third conductive layer 21 that is away from the second insulating layer 22 serves as the bottom surface of the temperature distribution plate. A portion of the electrical connection structure can be fixed to and electrically connected to the third conductive layer 21.

[0419] For example, the housing 300 may include a middle frame 310 and a back cover 320. The ground terminal of the electronic device may be the middle frame. A portion of the electrical connection structure may be fixed to the middle frame 310 and electrically connected to the middle frame 310. In other embodiments, the electrical connection structure may also be fixed to the screen 400 and electrically connected to the ground terminal of the electronic device via other electrical connectors to achieve grounding of the top and bottom surfaces of the vapor chamber.

[0420] Illustratively, the electrical connection structure may be conductive paste, metal sheet, conductive foam or conductive glue.

[0421] It can be understood that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other, and any combination of features in different embodiments is also within the scope of protection of the present application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0422] It should be understood that all the above drawings are for illustrative purposes only and do not represent the actual size of the product. Moreover, the dimensional ratios between the components in the drawings are not intended to limit the actual product of the present application.

[0423] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A temperature equalizing plate (100), characterized in that: The invention comprises a first cover plate (10), a second cover plate (20), a capillary structure (30), a cooling medium (40) and a first conductive member (51); the second cover plate (20) comprises an effective area (201) and a sealing edge area (202); the sealing edge area (202) is connected to the periphery of the effective area (201); a portion of the first cover plate (10) is fixed to the sealing edge area (202) of the second cover plate (20); a portion of the first cover plate (10) is spaced apart from the effective area (201) of the second cover plate (20), thereby enclosing an accommodating cavity (101); the capillary structure (30) and the cooling medium (40) are located in the accommodating cavity (101); The first cover plate (10) comprises a first conductive layer (1), a first insulating layer (2) and a second conductive layer (3), wherein the first insulating layer (2) is connected between the first conductive layer (1) and the second conductive layer (3), and the second conductive layer (3) is located on a side of the first insulating layer (2) close to the second cover plate (20); A portion of the first conductive member (51) is connected to the first conductive layer (1), and a portion is connected to the second cover plate (20); the first conductive layer (1) is electrically connected to a surface of the second cover plate (20) away from the accommodating cavity (101) through the first conductive member (51).

2. The temperature homogenizing plate (100) according to claim 1, characterized in that: The second cover plate (20) comprises a third conductive layer (21) and a second insulating layer (22) which are stacked, and the second insulating layer (22) is located on a side of the third conductive layer (21) close to the second conductive layer (3); A portion of the first conductive member (51) is fixed to the first conductive layer (1), and a portion is fixed to the third conductive layer (21); the first conductive layer (1) is electrically connected to the third conductive layer (21) through the first conductive member (51).

3. The temperature homogenizing plate (100) according to claim 2, characterized in that: The first conductive member (51) and the first conductive layer (1) are integrally formed structural members.

4. The temperature homogenizing plate (100) according to claim 2 or 3, characterized in that: A portion of the first conductive member (51) is fixed to the side surface (11) of the first conductive layer (1), and a portion of the first conductive member (51) is fixed to the side surface (212) of the third conductive layer (21); Alternatively, a portion of the first conductive member (51) is fixed to the side surface (11) of the first conductive layer (1), and a portion is fixed to the surface of the third conductive layer (21) away from the accommodating cavity (101).

5. The temperature homogenizing plate (100) according to claim 2 or 3, characterized in that: The temperature equalizing plate (100) further includes a second conductive member (53), a portion of the second conductive member (53) being fixed to the third conductive layer (21), and a portion of the second conductive member (53) being fixed to the first conductive member (51), and the first conductive layer (1) being electrically connected to the third conductive layer (21) via the first conductive member (51) and the second conductive member (53).

6. The temperature homogenizing plate (100) according to claim 5, characterized in that: The second conductive member (53) and the third conductive layer (21) are integrally formed structural members.

7. The temperature homogenizing plate (100) according to claim 5 or 6, characterized in that: The first conductive member and the second conductive member (53) are arranged along a first direction, and the first direction is the direction in which the second cover plate (20) points toward the first cover plate (10); Alternatively, a portion of the second conductive member (53) is fixed to a side of the first conductive member (51) away from the accommodating cavity (101); Alternatively, a portion of the first conductive member (51) is fixed to a side of the second conductive member (53) away from the accommodating cavity (101).

8. The temperature homogenizing plate (100) according to claim 5 or 6, characterized in that: The second cover plate (20) further comprises a fourth conductive layer (23), the fourth conductive layer (23) being stacked on the second insulating layer (22), and the fourth conductive layer (23) being located on a side of the second insulating layer (22) close to the accommodating cavity (101).

9. The temperature homogenizing plate (100) according to claim 8, characterized in that: The temperature homogenizing plate further comprises a third conductive member (52), wherein the third conductive member (52) is fixed between the first conductive member (51) and the second conductive member (53), and the first conductive layer (1) is electrically connected to the third conductive layer (21) via the first conductive member (51), the third conductive member (52), and the second conductive member (53); Alternatively, the temperature homogenizing plate (100) further comprises a fourth conductive member (54), wherein the fourth conductive member (54) is fixed between the first conductive member (51) and the second conductive member (53), and the first conductive layer (1) is electrically connected to the third conductive layer (21) via the first conductive member (51), the fourth conductive member (54), and the second conductive member (53); Alternatively, the temperature uniformity plate (100) further includes a third conductive member (52) and a fourth conductive member (54), wherein the first conductive member (51), the third conductive member (52), the fourth conductive member (54) and the second conductive member (53) are arranged along a first direction, the third conductive member (52) is fixed between the fourth conductive member (54) and the first conductive layer (1), and the fourth conductive member (54) is fixed between the third conductive member (52) and the second conductive member (53), and the first conductive layer (1) is electrically connected to the third conductive layer (21) via the first conductive member (51), the third conductive member (52), the fourth conductive member (54) and the second conductive member (53), and the first direction is the direction in which the second cover plate (20) points toward the first cover plate (10).

10. The temperature homogenizing plate (100) according to claim 9, characterized in that: The third conductive member (52) and the second conductive layer (3) are integrally formed structural members, and / or the fourth conductive member (54) and the fourth conductive layer (23) are integrally formed structural members.

11. The temperature homogenizing plate (100) according to claim 8, characterized in that: A portion of the first conductive member (51) is fixed to the first conductive layer (1), and a portion is fixed to the second conductive layer (3); a portion of the second conductive member (53) is fixed to the third conductive layer (21), and a portion is fixed to the fourth conductive layer (23); The second conductive layer (3) is electrically connected to the fourth conductive layer (23), and the first conductive layer (1) is electrically connected to the third conductive layer (21) via the first conductive member (51), the second conductive layer (3), the fourth conductive layer (23), and the second conductive member (53).

12. The temperature homogenizing plate (100) according to claim 11, characterized in that: The projection of the first conductive member (51) on a reference plane along a first direction and the projection of the second conductive member (53) on the reference plane along the first direction are at least partially offset, the reference plane being the plane where the first conductive layer (1) is located, and the first direction being the direction in which the second cover plate (20) points towards the first cover plate (10); Alternatively, the first conductive member (51) and the second conductive member (53) are arranged at intervals.

13. The temperature homogenizing plate (100) according to claim 2, characterized in that: The first conductive member (51) is an independent structural member.

14. The temperature homogenizing plate (100) according to claim 13, characterized in that: A portion of the first conductive member (51) is fixed to the side surface (11) of the first conductive layer (1), and a portion of the first conductive member (51) is fixed to the side surface (212) of the third conductive layer (21).

15. The temperature homogenizing plate (100) according to claim 13, characterized in that: A portion of the first conductive member (51) is fixed to a surface of the first conductive layer (1) away from the accommodating cavity (101), and a portion is fixed to a side surface (212) of the third conductive layer (21); Alternatively, a portion of the first conductive member (51) is fixed to the side surface (11) of the first conductive layer (1), and a portion is fixed to the surface of the third conductive layer (21) away from the accommodating cavity (101); Alternatively, a portion of the first conductive member (51) is fixed to a surface of the first conductive layer (1) away from the accommodating cavity (101), and a portion is fixed to a surface of the third conductive layer (21) away from the accommodating cavity (101).

16. The temperature homogenizing plate (100) according to claim 14, characterized in that: The first conductive member (51) comprises a first sub-portion (591) and a second sub-portion (592), wherein a portion of the first sub-portion (591) is fixed to a surface of the first conductive layer (1) away from the first insulating layer (2), and a portion of the first sub-portion (591) is fixed to the second sub-portion (592), and a portion of the second sub-portion (592) is fixed to a surface of the third conductive layer (21) away from the second insulating layer (22); The first sub-section (591) and the second sub-section (592) are two independent structural parts, or the first sub-section (591) and the second sub-section (592) are integrally formed structural parts.

17. The temperature homogenizing plate (100) according to claim 2, characterized in that: The first cover plate (10) is provided with a first through hole (4), the first through hole (4) passes through the first conductive layer (1), the first insulating layer (2) and the second conductive layer (3); the edge sealing area (203) of the second cover plate (20) is provided with a second through hole (24), the second through hole (24) passes through the second insulating layer (22) and the third conductive layer (21); the first through hole (4) and the accommodating cavity (101) are arranged at intervals, and the first through hole (4) is connected to the second through hole (24); A portion of the first conductive member (51) is located in the first through hole (4), and a portion is located in the second through hole (24); one end of the first conductive member (51) is fixed to the first conductive layer (1), and the other end is fixed to the third conductive layer (21); the first conductive layer (1) is electrically connected to the third conductive layer (21) through the first conductive member (51).

18. The temperature homogenizing plate (100) according to claim 2, characterized in that: The first cover plate (10) is provided with a first through hole (4), the first through hole (4) passing through the first conductive layer (1) and the first insulating layer (2); the edge sealing area (203) of the second cover plate (20) is provided with a second through hole (24), the second through hole (24) passing through the second insulating layer (22) and the third conductive layer (21); The projection of the first through hole (4) on the reference plane along the first direction and the projection of the second through hole (24) on the reference plane along the first direction are staggered, the second conductive layer (3) is exposed in the second through hole (24), the reference plane is the plane where the first conductive layer (1) is located, and the first direction is the direction in which the second cover plate (20) points to the first cover plate (10); The temperature homogenizing plate (100) further includes a fifth conductive member (55), wherein the first conductive member (51) is located in the first through hole (4), one end of the first conductive member (51) is fixed to the first conductive layer (1), and the other end is fixed to the second conductive layer (3), and the fifth conductive member (55) is located in the second through hole (24), one end of the fifth conductive member (55) is fixed to the second conductive layer (3), and the other end is fixed to the third conductive layer (21); The first conductive layer (1) is electrically connected to the third conductive layer (21) via the first conductive member (51), the second conductive layer (3) and the fifth conductive member (55).

19. The temperature homogenizing plate (100) according to claim 1, characterized in that: The second cover plate (20) is made of conductive material.

20. The temperature homogenizing plate (100) according to claim 19, characterized in that: The first cover plate (10) is provided with a first through hole (4), the first through hole (4) passes through the first conductive layer (1), the first insulating layer (2) and the second conductive layer (3), the first through hole (4) and the accommodating cavity (101) are arranged at intervals, and the second cover plate (20) is exposed in the first through hole (4); The first conductive member (51) is located in the first through hole (4); one end of the first conductive member (51) is fixed to the first conductive layer (1), and the other end is fixed to the second cover plate (20).

21. The temperature homogenizing plate (100) according to claim 19, characterized in that: The first cover plate (10) is provided with a first through hole (4), the first through hole (4) passes through the first conductive layer (1) and the first insulating layer (2), the first through hole (4) and the accommodating cavity (101) are arranged at intervals, and the second conductive layer (3) is exposed in the first through hole (4); The first conductive member (51) is located in the first through hole (4); one end of the first conductive member (51) is fixed to the first conductive layer (1) and electrically connected to the first conductive layer (1); the other end of the first conductive member (51) is fixed to the second conductive layer (3) and electrically connected to the second conductive layer (3); and the second conductive layer (3) is electrically connected to the second cover plate (20).

22. The temperature vapor chamber (100) according to any one of claims 17, 18, 20 and 21, characterized in that: The first conductive member (51) is a solid structure.

23. The temperature vapor chamber (100) according to any one of claims 17, 18, 20 and 21, characterized in that: The first conductive member (51) is a hollow structure.

24. The temperature homogenizing plate (100) according to claim 2 or 19, characterized in that: The second cover plate (20) comprises a top surface (25), a bottom surface (26) and a side surface (27), wherein the bottom surface and the top surface are arranged opposite to each other, the side surface is connected between the top surface and the bottom surface, and the top surface faces the accommodating cavity (101); The first conductive layer (1) comprises a first portion (12), a second portion (13) and a third portion (14); the first insulating layer (2) comprises a first portion (15), a second portion (16) and a third portion (17); the first portion (15) of the first insulating layer (2) and the top surface (25) are arranged relative to each other; the first portion (12) of the first conductive layer (1) is located on a side of the first portion (15) of the first insulating layer (2) away from the top surface (25); the second portion (16) of the first insulating layer (2) and the side surface (27) are arranged relative to each other; the second portion (13) of the first conductive layer (1) is located on a side of the second portion (16) of the first insulating layer (2) away from the side surface (27); the third portion (17) of the first insulating layer (2) and the bottom surface (26) are arranged relative to each other; and the third portion (14) of the first conductive layer (1) is located on a side of the third portion (17) of the first insulating layer (2) away from the bottom surface (26); A portion of the first conductive member (51) is fixed to the third portion (14) of the first conductive layer (1), and a portion is fixed to the bottom surface of the second cover plate (20); the first conductive layer (1) is electrically connected to the bottom surface of the second cover plate (20) through the first conductive member (51).

25. An electronic device (1000), characterized in that The invention comprises a support member and a temperature evaporating plate (100) as claimed in any one of claims 1 to 24, wherein the temperature evaporating plate (100) is mounted on the support member.

26. The electronic device (1000) according to claim 25, characterized in that The electronic device (1000) further comprises a screen (400) and a housing (300), wherein the screen (400) is mounted on the housing (300) and encloses a receiving space (1001) with the housing (300), and the temperature equalizing plate (100) is mounted in the receiving space (1001); The supporting member is the screen (400) or the housing (300).

27. The electronic device (1000) according to claim 26, characterized in that The housing (300) includes a middle frame (310) and a back cover (320), wherein the middle frame (310) is connected between the screen (400) and the back cover (320), and the screen (400), the middle frame (310) and the back cover (320) enclose the accommodating space (1001), and the supporting member is the middle frame (310) or the back cover (320).

28. The electronic device (1000) according to claim 27, characterized in that The first conductive member (51) of the temperature homogenizing plate (100) is fixed to the middle frame (310) and electrically connected to the middle frame (310).

29. The electronic device (1000) according to claim 27, characterized in that The electronic device (1000) further includes a first electrical connector (901), a portion of which is fixed to the temperature averaging plate (100) and electrically connected to the first conductive layer (1) of the temperature averaging plate (100), and a portion of which is fixed to the middle frame (310) and electrically connected to the middle frame (310).

30. The electronic device (1000) according to claim 29, characterized in that The temperature homogenizing plate (100) has an extended area (104), a gap is provided between a bottom surface (1042) of the extended area (104) and the middle frame (310), and the first electrical connector (901) is at least partially located in the gap.

31. The electronic device (1000) according to claim 30, characterized in that The first electrical connector (901) is conductive paste, conductive glue, conductive foam or metal sheet.

32. An electronic device, characterized in that: The device comprises a housing (300), a screen (400), a temperature averaging plate, and an electrical connection structure, wherein the screen (400) is connected to the housing (300) and encloses a receiving space, the temperature averaging plate and the electrical connection structure are both installed in the receiving space, and one end of the electrical connection structure is connected to the temperature averaging plate, and the other end is connected to the housing (300) or the screen (400); The temperature equalizing plate comprises a first cover plate (10), a second cover plate (20), a capillary structure (30) and a cooling medium (40); the second cover plate (20) comprises an effective area (201) and a sealing edge area (202); the sealing edge area (202) is connected to the periphery of the effective area (201); a portion of the first cover plate (10) is fixed to the sealing edge area (202) of the second cover plate (20), and a portion is spaced apart from the effective area (201) of the second cover plate (20) to enclose an accommodating cavity (101); the capillary structure (30) and the cooling medium (40) are located in the accommodating cavity (101); The first cover plate (10) comprises a first conductive layer (1), a first insulating layer (2) and a second conductive layer (3), wherein the first insulating layer (2) is connected between the first conductive layer (1) and the second conductive layer (3), and the second conductive layer (3) is located on a side of the first insulating layer (2) close to the second cover plate (20); The second cover plate (20) is made of conductive material, a portion of the electrical connection structure electrically connects the first conductive layer (1) and the second cover plate (20), and a portion thereof electrically connects the ground terminal of the electronic device; Alternatively, the second cover plate (20) comprises a third conductive layer (21) and a second insulating layer (22) which are stacked, the second insulating layer (22) being located on a side of the third conductive layer (21) close to the second conductive layer (3), a portion of the electrical connection structure electrically connects the first conductive layer (1) and the third conductive layer (21), and a portion thereof electrically connects a ground terminal of the electronic device.

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