Chiplet system and method for a chiplet system

Abstract

Chiplet system, for example for a vehicle, for example a motor vehicle, having a first connection device which is designed to enable data communication between first components of the chiplet system, and a second connection device which is designed to enable data communication between second components of the chiplet system, wherein, for example, the second connection device is different from the first connection device.

Description

[0001] Description

[0002] title

[0003] State of the art

[0004] The disclosure relates to a chiplet system.

[0005] The disclosure further relates to a method for a chiplet system.

[0006] Disclosure of the invention

[0007] Some examples relate to a chiplet system, for example, for a vehicle, for example a motor vehicle, comprising a first connection device configured to enable data communication between first components of the chiplet system, and a second connection device configured to enable data communication between second components of the chiplet system, wherein, for example, the second connection device is different from the first connection device. In some examples, this enables increased flexibility while simultaneously ensuring secure data communication.

[0008] In some examples, the data communication between the first components comprises, for example, data communication between a plurality of components of the first components, for example via the first connection device.

[0009] In some examples, the data communication between the first components comprises, for example, data communication from a component of the first components to at least one other component which, for example, does not belong to the first components but, for example, to the second components (or at least one other component), for example via the first connection device.

[0010] In some examples, the data communication between the first components comprises, for example, data communication from another component, which for example does not belong to the first components but for example to the second components, to at least one component of the first components, for example via the first connection device.

[0011] In some examples, the data communication between the second components comprises, for example, data communication between a plurality of components of the second components, for example via the second connection device.

[0012] In some examples, the data communication between the second components comprises, for example, data communication from a component of the second components to at least one other component which, for example, does not belong to the second components but, for example, to the first components (or at least one other component), for example via the second connection device.

[0013] In some examples, the data communication between the second components comprises, for example, data communication from another component, which for example does not belong to the second components but for example to the first components, to at least one component of the second components, for example via the second connection device.

[0014] In some examples, it is provided that the chiplet system comprises a carrier, wherein at least one of the following elements is arranged on the carrier: a) the first components, or b) the second components, or c) the first connecting device, or d) the second connecting device, wherein, for example, the carrier is a substrate or interposer.

[0015] In some examples, it is provided that a) at least one component of the first components is a chiplet, and / or that b) at least one component of the second components is a chiplet. In some examples, it is provided that the first components are designed to implement first functions, wherein the second components are designed to implement second functions that are, for example, different from the first functions, wherein, for example, the first functions are associated with in-vehicle entertainment, for example in-vehicle infotainment, I VI, wherein, for example, the second functions are associated with at least one assistance function for a driver, for example for advanced driver assistance systems, ADAS, wherein, for example, the second functions are associated with an Automotive Safety Integrity Level, ASIL, of B or higher.

[0016] In some examples, it is provided that the first connection device and the second connection device are arranged on a same chiplet.

[0017] In some examples, it is provided that the first connection device is designed as a crossbar or crossbar switch, for example as a non-coherent crossbar, wherein, for example, the first connection device is of the consumer grade type.

[0018] In some examples, it is provided that the second connection device is designed as a connection network, for example a packet-oriented connection network, for example a network-on-chip, for example a coherent network-on-chip, wherein, for example, the second connection device is of the automotive grade type.

[0019] In some examples, it is provided that the second connecting device has a mesh topology, for example a fully meshed mesh topology.

[0020] In some examples, a data connection device is provided that is designed to at least temporarily establish an information exchange, for example, data communication, between the first connection device and the second connection device. For example, the data connection device is arranged on the same chiplet as the first connection device and / or the second connection device. In some examples, the data connection device is designed to establish a high-performance and / or protected data connection between the first connection device and the second connection device.

[0021] In some examples, it is provided that the second connecting device is designed to enable a guarantee with regard to, for example, functional safety.

[0022] In some examples, it is provided that the first connection device has at least one PCIe type data interface or a proprietary data interface.

[0023] In some examples, it is provided that the second connection device has at least one data interface of the UCIe type.

[0024] In some examples, it is provided that there is freedom from interference between the first connecting device and the second connecting device.

[0025] Some examples relate to a product, for example a control unit or vehicle computer or vehicle, comprising at least one chiplet system according to the disclosure.

[0026] Some examples relate to a method for a chiplet system, for example for a vehicle, for example a motor vehicle, wherein the chiplet system has a first connection device which is designed to enable data communication between first components of the chiplet system, and a second connection device which is designed to enable data communication between second components of the chiplet system, wherein for example the second connection device is different from the first connection device, wherein the method comprises: enabling a first data communication between the first components of the chiplet system, enabling a second data communication between the second components of the chiplet system.In some examples, the method comprises ensuring freedom from interference between the first connecting device and the second connecting device.

[0027] Some examples relate to a use of the chiplet system according to the disclosure and / or the product according to the disclosure and / or the method according to the disclosure for at least one of the following elements: a) enabling data communication between at least some chiplets of the chiplet system, or b) providing data connections by means of connection devices of different types, or c) enabling a guarantee with regard to, for example, functional, safety, or d) ensuring scalability of the chiplet system, for example for adding at least one further chiplet, or e) enabling data connections between components of the chiplet system that can be used to fulfill safety requirements, for example with regard to freedom from interference.

[0028] Further features, possible applications, and advantages of the invention will become apparent from the following description of examples of the invention, which are illustrated in the figures of the drawing. All described or illustrated features, individually or in any combination, constitute the subject matter of the invention, regardless of their summary in the claims or their references, as well as regardless of their wording or representation in the description or drawing.

[0029] The drawing shows:

[0030] Fig. 1 schematically shows a simplified block diagram,

[0031] Fig. 2 schematically shows a simplified block diagram,

[0032] Fig. 3 schematically shows a simplified block diagram,

[0033] Fig. 4 schematically shows a simplified block diagram, Fig. 5 schematically shows a simplified block diagram,

[0034] Fig. 6 schematically shows a simplified flow diagram,

[0035] Fig. 7 schematic examples of uses.

[0036] Some examples, Fig. 1 , relate to a chiplet system 100, for example for a vehicle 20 (see Fig. 5), for example a motor vehicle, comprising a first connection device 110, which is designed to enable data communication between first components K1 of the chiplet system 100, and a second connection device 120, which is designed to enable data communication between second components K2 of the chiplet system 100, wherein, for example, the second connection device 120 is different from the first connection device 110, for example has a different type than the first connection device 110. In some examples, this enables increased flexibility and, at the same time, secure data communication.

[0037] In some examples, Fig. 1 , the data communication between the first components K1 comprises, for example, data communication between a plurality of components K1 -1 , ... of the first components K1, for example via the first connection device 110.

[0038] In some examples, Fig. 1 , the data communication between the first components K1 comprises, for example, data communication from a component K1 -1 of the first components K1 to at least one other component which, for example, does not belong to the first components K1, but for example to the second components K2 (or at least one other component), for example via the first connection device 110.

[0039] In some examples, Fig. 1 , the data communication between the first components K1 comprises, for example, data communication from another component, which for example does not belong to the first components K1, but for example to the second components K2, to at least one component K1-1 of the first components K1, for example via the first connection device 110. In some examples, Fig. 1 , the data communication between the second components K2 comprises, for example, data communication between a plurality of components K2-1, ... of the second components K2 among themselves, for example via the second connection device 120.

[0040] In some examples, Fig. 1 , the data communication between the second components K2 comprises, for example, data communication from a component K2-1 of the second components K2 to at least one other component which, for example, does not belong to the second components K2, but for example to the first components K1 (or at least one other component), for example via the second connection device 120.

[0041] In some examples, Fig. 1 , the data communication between the second components K2 comprises, for example, data communication from another component, which for example does not belong to the second components K2, but for example to the first components K1, to at least one component K2-1 of the second components K2, for example via the second connection device 120.

[0042] In some examples, Fig. 1 , it is provided that the chiplet system 100 has a carrier 102, wherein at least one of the following elements is arranged on the carrier: a) the first components K1, or b) the second components K2, or c) the first connection device 110, or d) the second connection device 120, wherein, for example, the carrier 102 is a substrate or interposer.

[0043] In some examples, Fig. 1 , it is provided that a) at least one component K1 -1 of the first components K1 is a chiplet, and / or that b) at least one component K2-1 of the second components K2 is a chiplet.

[0044] In some examples, Fig. 1 , it is provided that the first components K1 are designed to implement first functions F-1, wherein the second components K2 are designed to implement second functions F-2, which are for example different from the first functions F-1, wherein for example the first functions F-1 are associated with in-vehicle entertainment, for example in-vehicle infotainment, IVI, wherein for example the second functions F-2 are associated with at least one assistance function for a driver, for example for advanced driver assistance systems, ADAS, wherein for example the second functions F-2 are associated with an Automotive Safety Integrity Level, ASIL, of B or higher.

[0045] In some examples, see the configuration of the chiplet system 100a according to Fig. 2, it is provided that the first connection device 110 and the second connection device 120 are arranged on a same chiplet 104. In some examples, the chiplet 104 is, for example, a base chiplet, e.g., a base die, for example, for automotive applications.

[0046] In some examples, it is provided that the first connection device 110 is designed as a crossbar or crossbar switch, for example as a non-coherent crossbar, wherein, for example, the first connection device 110 is of the consumer grade type.

[0047] In some examples, it is provided that the second connection device 120 is designed as a connection network, for example a packet-oriented connection network, for example a network-on-chip, for example a coherent network-on-chip, wherein, for example, the second connection device 120 is of the automotive grade type.

[0048] In some examples, the second connecting device 120 is provided with a mesh topology, for example a fully meshed mesh topology.

[0049] In some examples, Fig. 2, it is provided that a data connection device 130 is provided, which is designed to at least temporarily establish an information exchange lX, for example a data communication, between the first connection device 110 and the second connection device 120 (or between components K1, K2 that can be connected thereto, for example chiplets), wherein, for example, the data connection device 130 is arranged on one or the same chiplet 104 as the first connection device 110 and / or the second connection device 120.

[0050] In some examples, Fig. 2, it is intended that the

[0051] Data connection device 130 is designed to establish a high-performance and / or protected data connection between the first connection device and the second connection device.

[0052] For example, the data connection can be configured as a single- or multi-channel, e.g., bidirectional, LVDS signal connection. In some examples, such a connection can include mechanisms for detecting transmission errors and / or authenticity, e.g., for cybersecurity, as an alternative or in addition to the use of an LVDS signal connection.

[0053] In some examples, it is provided that the second connecting device 120 is designed to enable a guarantee with regard to, for example, functional safety.

[0054] In some examples, Fig. 1 , it is provided that the first connection device 110 has at least one data interface 112 of the PCIe type or a proprietary data interface, for example for a connection of at least one of the first components K1 , for example one or more chiplets K1 -1 , ....

[0055] In some examples, Fig. 1 , it is provided that the second connection device 120 has at least one data interface 122 of the UCIe type, for example for a connection of at least one of the second components K2, for example one or more chiplets K2-1, ....

[0056] In some examples, it is provided that there is freedom from interference between the first connecting device 110 and the second connecting device 120.

[0057] Fig. 3 schematically shows a block diagram of a chiplet system 100b according to further examples. Element E1 symbolizes a first chiplet, e.g., a base die, e.g., an automotive base die. Element E2 collectively symbolizes first components, e.g., comprising and / or representing one or more chiplets.

[0058] Element E3 symbolizes a first connection device, e.g., at least similar to element 110 according to Fig. 1, 2. Element E3a symbolizes a PCIe interface, and element E3b symbolizes a proprietary interface. In some examples, at least one of the interfaces E3a, E3b can be used to connect at least one of the first components E2 to the first connection device E3.

[0059] Element E4 collectively symbolizes second components, for example comprising and / or representing one or more chiplets.

[0060] Element E5 symbolizes a second connection device, e.g., at least similar to element 120 according to Fig. 1, 2. Element E5a symbolizes a UCIe interface, and element E5b symbolizes an optional further interface. In some examples, at least one of the interfaces E5a, E5b can be used to connect at least one of the second components E4 to the second connection device E5.

[0061] Element E6 symbolizes a data connection device, e.g. at least similar to element 130 according to Fig. 2, which is designed to at least temporarily establish an information exchange, e.g. a data communication, between the first connection device E3 and the second connection device E5 (or between components E2, E4, e.g. chiplets, which can be connected thereto).

[0062] Element E7 symbolizes an optional memory controller, for example, for a main memory, e.g., a DRAM controller, through which a main memory E8 can be connected. In some examples, the memory E8 is of the LPDDR or HBM type.

[0063] Element E8 symbolizes an optional first computing device, for example a processor, for example a CPU, which is also arranged on the chiplet E1.

[0064] Element E9 symbolizes an optional second computing device, for example a processor, for example a CPU, which is also arranged on the chiplet E1.

[0065] In some examples, the two connecting devices 110, 120 or E3, E5 enable flexible and secure establishment of data connections within the chiplet system, for example, in particular, non-interference data connections. Some examples, Fig. 4, relate to a product 10, for example, control unit 100 or vehicle computer or vehicle 20 (Fig. 5), comprising at least one chiplet system 100 according to the disclosure.

[0066] Some examples, Fig. 6, relate to a method for a chiplet system 100, 100a, 100b, for example for a vehicle, for example a motor vehicle, wherein the chiplet system has a first connection device which is designed to enable data communication between first components of the chiplet system, and a second connection device which is designed to enable data communication between second components of the chiplet system, wherein, for example, the second connection device is different from the first connection device, wherein the method comprises: enabling 200 a first data communication DK1 between the first components K1, E2 of the chiplet system, enabling 202 a second data communication DK2 between the second components K2, E4 of the chiplet system.

[0067] In some examples, Fig. 6, it is provided that the method comprises: ensuring 205 freedom from interference, for example freedom from interference, FFI between the first connecting device 110, E3 and the second connecting device 120, E5.

[0068] Some examples, Fig. 7, relate to a use 300 of the chiplet system according to the disclosure and / or the product according to the disclosure and / or the method according to the disclosure for at least one of the following elements: a) enabling 301 data communication between at least some chiplets K1-1, K2-1 (Fig. 1) of the chiplet system, or b) providing 302 (Fig. 7) data connections by means of connection devices 110, 120 of different types, or c) enabling 303 a guarantee with regard to, for example, functional, safety, or d) ensuring 304 scalability of the chiplet system, for example for adding at least one further chiplet, or e) enabling 305 data connections between components (i.e., e.g.including at least one component) of the chiplet system, which can be used to meet safety requirements, for example with regard to freedom from interference. The principle according to the disclosure enables, in some examples, efficient use of semiconductors in automobiles, wherein, for example, a comparatively high, e.g. also scalable, computing performance can be provided flexibly and efficiently, e.g. for applications in the field of driver assistance and / or modern infotainment systems with multiple high-resolution displays and / or entertainment applications such as in-vehicle gaming.

[0069] The principle according to the disclosure further enables, in some examples, the flexible or scalable provision of computing power and / or other functionalities, e.g. in the form of a control unit or e.g. a vehicle computer, which in some examples consolidates, e.g., various, e.g., conventional, control units.

[0070] The principle according to the disclosure enables, in some examples, the fulfillment of safety requirements such as those that may arise when combining IVI and ADAS functions in one product, e.g., vehicle computer. For example, using the principle according to the disclosure, requirements such as those prescribed by the automotive safety standard ISO26262, e.g., with respect to FFI (Freedom-From-Interference) between different ASIL (Automotive Safety Integrity Levels), can also be fulfilled. In some examples, this thus enables a higher safety objective—e.g., within the meaning of the aforementioned standard—to be protected from the influence of a lower safety objective. In some examples, the principle according to the disclosure enables the achievement of cost targets, e.g., for systems for a basic segment, while simultaneously ensuring efficient scalability, e.g.,for systems for a high-end product segment. For example, in some examples, multiple data connections, e.g., Die2Die interfaces, e.g., with UCIe or proprietary or other means, may be provided and operated, e.g., by at least one of the connecting devices 110, 120.

[0071] The principle according to the disclosure enables, in some examples, an efficient separation, e.g. of safety (e.g. functional safety)-relevant and non-safety-relevant areas, for example with respect to the second connection device 120. In some examples, this enables efficient and high-performance networking, e.g. of consumer chiplets K1 -1, ... and compliance with safety guarantees.

Claims

Claims 1. Chiplet system (100; 100a; 100b), for example for a vehicle, for example a motor vehicle, comprising a first connection device (110) which is designed to enable data communication between first components (K1) of the chiplet system (100; 100a; 100b), and a second connection device (120) which is designed to enable data communication between second components (K2) of the chiplet system (100; 100a; 100b), wherein, for example, the second connection device (120) is different from the first connection device (110).

2. Chiplet system (100; 100a; 100b) according to claim 1, comprising a carrier (102), wherein at least one of the following elements is arranged on the carrier (102): a) the first components (K1), or b) the second components (K2), or c) the first connection device (110), or d) the second connection device (120), wherein, for example, the carrier (102) is a substrate or interposer.

3. Chiplet system (100; 100a; 100b) according to at least one of the preceding claims, wherein a) at least one component (K1-1) of the first components (K1) is a chiplet, and / or wherein b) at least one component (K2-2) of the second components (K2) is a chiplet.

4. Chiplet system (100; 100a; 100b) according to at least one of the preceding claims, wherein the first components (K1) are designed to implement first functions (F-1), and wherein the second components (K2) are designed to implement second functions (F-2), which are, for example, different from the first functions (F-1), wherein, for example, the first functions (F-1) are associated with in-vehicle entertainment, for example in-vehicle infotainment, IVI, wherein, for example, the second functions (F-2) are associated with at least one assistance function for a driver, for example for advanced driver assistance systems, ADAS, wherein, for example, the second functions are associated with an Automotive Safety Integrity Level, ASIL, of B or higher.

5. Chiplet system (100; 100a; 100b) according to at least one of the preceding claims, wherein the first connecting device (110) and the second connecting device (120) are arranged on a same chiplet (104).

6. Chiplet system (100; 100a; 100b) according to at least one of the preceding claims, wherein the first connection device (110) is designed as a crossbar or crossbar switch, for example as a non-coherent crossbar, wherein for example the first connection device (110) is of the consumer grade type.

7. Chiplet system (100; 100a; 100b) according to at least one of the preceding claims, wherein the second connection device (120) is designed as a connection network, for example a packet-oriented connection network, for example a network-on-chip, for example a coherent network-on-chip, wherein, for example, the second connection device (120) is of the automotive grade type.

8. Chiplet system (100; 100a; 100b) according to claim 7, wherein the second connection device (120) has a mesh topology, for example a fully meshed mesh topology.

9. Chiplet system (100; 100a; 100b) according to at least one of the preceding claims, wherein a data connection device (130) is provided which is designed to at least temporarily exchange information (I -X), for example a data communication, between the first connection device (110) and the second connection device (120), wherein, for example, the data connection device (130) is arranged on a same chiplet (104) as the first connection device (110) and / or the second connection device (120).

10. Chiplet system (100; 100a; 100b) according to claim 9, wherein the data connection device (130) is designed to provide a high-performance and / or protected data connection between the first connecting device (110) and the second connecting device (120).

11. Chiplet system (100; 100a; 100b) according to at least one of the preceding claims, wherein the second connection device (120) is designed to enable a guarantee with regard to, for example, functional, safety.

12. Chiplet system (100; 100a; 100b) according to at least one of the preceding claims, wherein the first connection device (110) has at least one data interface (112) of the PCIe type or a proprietary data interface.

13. Chiplet system (100; 100a; 100b) according to at least one of the preceding claims, wherein the second connection device (120) has at least one data interface (122) of the UCIe type.

14. Chiplet system (100; 100a; 100b) according to at least one of the preceding claims, wherein there is freedom from interference between the first connection device (110) and the second connection device (120).

15. Product (10, 20), for example control unit or vehicle computer (10) or vehicle (20), comprising at least one chiplet system (100; 100a; 100b) according to at least one of the preceding claims.

16. Method for a chiplet system (100; 100a; 100b), for example for a vehicle, for example a motor vehicle, wherein the chiplet system (100; 100a; 100b) has a first connection device (110) which is designed to enable data communication between first components (K1) of the chiplet system (100; 100a; 100b), and a second connection device (120) which is designed to enable data communication between second components (K2) of the chiplet system (100; 100a; 100b), wherein, for example, the second connection device (120) is different from the first connection device (110), wherein the method comprises: enabling (200) a first data communication (DK1) between the first components (K1) of the chiplet system (100; 100a; 100b), enabling (202) a second data communication (DK2) between the second components (K2) of the chiplet system (100; 100a; 100b).

17. The method according to claim 16, comprising: ensuring (205) freedom from interference (FFI) between the first connecting device (110) and the second connecting device (120).

18. Use (300) of the chiplet system (100; 100a; 100b) according to at least one of claims 1 to 14 and / or of the product (10, 20) according to claim 15 and / or of the method according to at least one of claims 16 to 17 for at least one of the following elements: a) enabling (301) data communication (DK1, DK2) between at least some chiplets of the chiplet system (100; 100a; 100b), or b) providing (302) data connections by means of connection devices (110, 120) of different types, or c) enabling (303) a guarantee with regard to, for example, functional, safety, or d) ensuring (304) scalability of the chiplet system (100; 100a; 100b), for example for adding at least one further chiplet, or e) enabling (305) data connections between components of the chiplet system (100; 100a;100b) which can be used to meet safety requirements, for example freedom from interference (FFI);

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